Protective member formation device

Abstract

To prevent dust from being attached to a glass table during stopping of a protective member formation device.SOLUTION: A protective member formation device for forming a protective member for protecting a whole surface of one surface of a wafer includes: a glass table (17) on which a sheet (S) is mounted; a sheet conveyance mechanism (31) for conveying the sheet to the glass table; a liquid resin supply part (32) for coating the sheet with a liquid resin (M); a holding table (252) for sucking and holding the wafer by a holding surface (253) above the glass table; a cylindrical body (40) for connecting the outer periphery of the upper surface of the glass table and the outer periphery of the holding surface in a state in which there is a gap between the upper surface of the glass table and the holding surface, and forming a closed chamber (41) when the holding table is brought close to the glass table by a lifting mechanism (27); and a closed chamber formation control part (355) for making the holding surface and an air supply source (30) communicate with each other and jetting air from the holding surface when the closed chamber is formed.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a protective member forming apparatus. [Background technology]

[0002] As disclosed in Patent Documents 1 and 2, in a protective member forming apparatus for forming a protective member to protect the entire surface of one side of a wafer, a sheet is placed on a glass stage, ultraviolet-curing liquid resin supplied onto the sheet is spread over the entire surface of one side of the wafer, and ultraviolet light is irradiated from below the glass stage to cure the liquid resin, thereby forming a protective member consisting of the sheet and resin.

[0003] In this type of protective member forming apparatus, dust floating inside the apparatus may adhere to the upper surface of the glass table when the apparatus is stopped. If dust is present on the upper surface of the glass table when forming the protective member, the surface of the protective member cannot be made flat. Therefore, if the wafer on which the protective member has been formed is transported to a grinding apparatus and the wafer is held on the chuck table via the non-flat protective member and the upper surface of the wafer is ground with a grinding wheel, there is a problem that the ground wafer does not have a uniform thickness.

[0004] To solve this problem, the protective member forming device is provided with a function of blowing air onto the glass table to remove dust before the sheet is conveyed onto the glass table. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2014-078550 A [Patent Document 2] JP 2014-192473 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, when the protective member forming apparatus is stopped for a long period of time, there is a problem that dust on the upper surface of the glass table cannot be removed by air blowing.

[0007] Therefore, the protective member forming apparatus has a problem to be solved, how to prevent dust from adhering to the glass table while the apparatus is stopped. [Means for solving the problem]

[0008] One aspect of the present invention is a protective member forming device that forms a protective member to protect the entirety of one surface of a wafer, the protective member forming device comprising: a glass table on which a sheet is placed, a sheet transport mechanism that transports the sheet to the glass table, a liquid resin supply unit that applies liquid resin onto the sheet, a holding table that suction-holds the wafer using a holding surface above the glass table that is connected to a suction source, a lifting mechanism that raises and lowers the holding table, and a cylinder that is disposed on the holding table and that, when the holding table is brought close to the glass table by the lifting mechanism, connects the outer periphery of the upper surface of the glass table to the outer periphery of the holding surface with a gap between the upper surface of the glass table and the holding surface to form a sealed chamber, and further comprises a sealed chamber formation control unit that, when the holding table is lowered by the lifting mechanism to form the sealed chamber, communicates the holding surface with an air supply source and sprays air from the holding surface.

[0009] Furthermore, it is preferable to provide a closed-chamber opening control section which, when the lifting mechanism raises the holding table and opens the closed chamber, connects the holding surface to an air supply source and jets air from the holding surface. Effect of the Invention

[0010] According to the protective member forming apparatus of the present invention, with a gap provided between the top surface of the glass table and the holding surface of the holding table, the outer periphery of the top surface of the glass table and the outer periphery of the holding surface are connected with a cylinder to form an enclosed chamber, and further, air is sprayed from the holding surface when forming the enclosed chamber, thereby reliably preventing dust from adhering to the glass table while the apparatus is stopped. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a perspective view showing the protective member forming apparatus of the present embodiment. [Diagram 2] 1A to 1C are diagrams illustrating a process of dropping a liquid resin onto a sheet. [Diagram 3] 13A to 13C are diagrams showing a process of hardening the liquid resin that has been spread between the sheet and the wafer. [Figure 4] 11A to 11C are diagrams showing a process of forming a closed chamber between the placement surface of the glass table and the holding surface of the holding table. [Diagram 5] 11 is a diagram showing a state in which a closed chamber is formed between the placement surface of the glass table and the holding surface of the holding table. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, a protective member forming device according to the present embodiment will be described with reference to the accompanying drawings. The X-axis, Y-axis, and Z-axis directions shown in Fig. 1 are perpendicular to each other. The X-axis and Y-axis directions are approximately horizontal directions, and the Z-axis direction is an up-down direction (vertical direction).

[0013] The protective member forming apparatus 10 shown in Fig. 1 is an apparatus that forms a protective member H (Fig. 3) by applying an external stimulus to liquid resin M that has been spread over the entire surface of one surface (lower surface Wb) of a wafer W, causing it to harden. In Fig. 1, an external housing 11 of the protective member forming apparatus 10 is shown by a dashed line, and components inside the external housing 11 are shown in a see-through state. Of the wafer W, the surface that faces upward during processing in the protective member forming apparatus 10 is referred to as an upper surface Wa, and the surface that faces downward is referred to as a lower surface Wb.

[0014] The wafer W is, for example, a disk-shaped as-sliced ​​wafer cut from a cylindrical ingot of silicon, etc. The wafer W is not limited to an as-sliced ​​wafer before devices are formed, and may be a device wafer after devices are formed, etc.

[0015] The protective member forming apparatus 10 is provided with a cassette housing section 12 at one end side (front end) in the Y-axis direction of an external housing 11. Two housing spaces aligned in the X-axis direction are formed in the cassette housing section 12, and a cassette C is placed in each housing space. The cassette C placed in one housing space contains multiple wafers W before the protective member H is formed. The cassette C placed in the other housing space contains multiple wafers W after the protective member H has been formed.

[0016] A temporary placement table 13 and a sheet cutting table 14 are provided at a rear position in the Y-axis direction of the cassette housing section 12. The temporary placement table 13 is located on the upper side, and the sheet cutting table 14 is located on the lower side. The temporary placement table 13 is provided with a wafer detection unit 131 that detects the center position and orientation of the wafer W before the protective member H is formed. The sheet cutting table 14 is provided with a sheet cutter 141 that cuts the excess sheet S (FIG. 3) sticking out from the wafer W after the protective member H has been formed, along the outer shape of the wafer W.

[0017] A first transport mechanism 15 is provided for loading and unloading wafers W into and from a cassette C housed in the cassette housing section 12. The first transport mechanism 15 includes a robot hand 152 supported on a pedestal 151, and the pedestal 151 is supported movably along a pair of guide rails 153 extending in the X-axis direction. The pedestal 151 includes a screw portion (not shown) that screws into a ball screw 154 extending in the X-axis direction. When the ball screw 154 is rotated by the driving force of a motor, the pedestal 151 moves in the X-axis direction.

[0018] The first transport mechanism 15 transports the wafer W between the cassette housing unit 12 and the temporary placement table 13 and the sheet cutting table 14 by moving the pedestal 151 in the X-axis direction and by operating the robot hand 152. More specifically, the first transport mechanism 15 can transport the wafer W before the protective member H is formed from C in the cassette housing unit 12 and place it on the temporary placement table 13. The first transport mechanism 15 can also transport the wafer W after the protective member H has been formed from the sheet cutting table 14 and load it into the cassette C in the cassette housing unit 12.

[0019] The protective member forming apparatus 10 includes a base 16 on the rear side in the Y-axis direction of the sheet cutting table 14. A support frame 18 is provided on the base 16, and a glass table 17 is supported via the support frame 18.

[0020] 2 to 5, the structures of the glass table 17 and the support frame 18 will be described. The glass table 17 is made of a light-transmitting material such as quartz glass and is formed in a disk shape. The upper surface of the glass table 17 is a flat mounting surface 171 on which the sheet S is placed.

[0021] The support frame 18 has a surrounding wall 181 that surrounds the periphery of the glass table 17, and the upper surface of the surrounding wall 181 forms a flat outer support surface 182 that is at the same height as the mounting surface 171 of the glass table 17. In other words, the mounting surface 171 of the glass table 17 and the outer support surface 182 of the support frame 18 are formed to be flush with each other.

[0022] A ring-shaped suction port 172 is formed at the boundary between the outer edge of the glass table 17 and the inner edge of the surrounding wall 181 of the support frame 18. A flow path 173 communicating with the suction port 172 is connected to the suction source 20 via the control valve 19. When the control valve 19 is opened to operate the suction source 20, air is sucked in from the flow path 173 and a suction force acts on the suction port 172.

[0023] An ultraviolet ray irradiation unit 22 is provided inside the support frame 18 and is located below the glass table 17. The ultraviolet ray irradiation unit 22 is disposed in a space surrounded by the surrounding wall 181, and includes a plurality of ultraviolet ray irradiation sections 221 capable of emitting ultraviolet ray UV, and irradiates UV toward the glass table 17 from below. The light source used for the ultraviolet ray irradiation sections 221 may be an LED.

[0024] Returning to Fig. 1, the description of the protective member forming apparatus 10 will continue. The protective member forming apparatus 10 includes a wafer holding unit 25 disposed above the glass table 17 and the support frame 18. A column 26 protruding upward from the base 16 is formed at a position forward in the Y-axis direction relative to the glass table 17 and the support frame 18, and the wafer holding unit 25 is configured to be raised and lowered in the Z-axis direction by an elevation mechanism 27 provided on the column 26.

[0025] The lifting mechanism 27 includes a pair of guide rails 271 extending in the Z-axis direction, a lifting table 272 supported on the pair of guide rails 271 so as to be movable in the Z-axis direction, a ball screw 274 extending in the Z-axis direction and screwed into a screwing portion 273 (FIGS. 2 to 5) of the lifting table 272, and a motor 275 for rotating the ball screw 274. When the ball screw 274 is rotated by the driving force of the motor 275, the lifting table 272 moves in the Z-axis direction along the pair of guide rails 271. By switching the rotation direction of the ball screw 274, the lifting table 272 can be caused to ascend and descend.

[0026] The wafer holding part 25 is supported by a lift table 272, and moves up and down as the lift table 272 moves in the Z-axis direction. The wafer holding part 25 is provided with a disk-shaped holding table 252 at the lower end of a housing 251 attached to the lift table 272. As shown in Figs. 2 to 5, a downward-facing holding surface 253 is formed on the lower side of the holding table 252, and the holding surface 253 faces the mounting surface 171 of the glass table 17. The holding surface 253 is a surface approximately parallel to the mounting surface 171.

[0027] 2 to 5, holding table 252 has a number of suction ports 254 opening in holding surface 253, and inside holding table 252, flow paths 255 communicating with suction ports 254 are formed, and flow paths 255 are connected to suction source 29 and air supply source 30 via control valve 28. Control valve 28 operates in a suction state in which flow path 255 is connected to suction source 29, an air supply state in which flow path 255 is connected to air supply source 30, and a non-connection state in which flow path 255 is not connected to either suction source 29 or air supply source 30.

[0028] When the control valve 28 is set to the suction state and the suction source 29 is operated, air is sucked into the flow path 255 and a suction force acts on the suction port 254. When a suction force acts on the suction port 254, the holding surface 253 can suck and hold the upper surface Wa of the wafer W. When the control valve 28 is set to the air supply state and the air supply source 30 is operated, air is supplied to the flow path 255 and air is sprayed from the suction port 254. When air is sprayed from the suction port 254, the suction hold of the wafer W by the holding surface 253 is released and the wafer W can be separated from the holding table 252.

[0029] The protective member forming apparatus 10 includes a sheet conveying mechanism 31 that conveys and places the sheet S on the placement surface 171 of the glass table 17. The sheet conveying mechanism 31 includes a sheet supply unit 311 that supports the rolled sheet S, an arm 312 that is movable in the Y-axis direction, and a clamp unit 313 attached to a side of the arm 312. In the sheet conveying mechanism 31, the rolled sheet S supported by the sheet supply unit 311 is gripped by the clamp unit 313, and the arm 312 is moved in the Y-axis direction to pull the sheet S, thereby placing the sheet S on the placement surface 171 of the glass table 17.

[0030] By opening the control valve 19 to operate the suction source 20 and applying a suction force to the suction port 172, the sheet S placed on the placement surface 171 of the glass table 17 can be sucked and held.

[0031] The sheet S is made of a light-transmitting material. For example, a film made of polyethylene terephthalate or the like can be used as the sheet S. Note that a sheet S made of a material other than this may also be used.

[0032] A liquid resin supply unit 32 is provided near the glass table 17 to supply a predetermined amount of liquid resin M (see FIG. 2) to the upper surface of the sheet S on the mounting surface 171. The liquid resin supply unit 32 includes a dispenser 321 connected to a tank 324 provided in the base 16, and a liquid resin supply nozzle 323 to which a connection pipe 322 extending from the dispenser 321 is connected.

[0033] The liquid resin supply nozzle 323 is provided on an arm 312 and is movable in response to the movement of the arm 312 in the Y-axis direction by the sheet conveying mechanism 31. By moving the arm 312, it is possible to set the liquid resin supply nozzle 323 between the glass table 17 and the holding table 252 (FIG. 2) and the liquid resin supply nozzle 323 retracted from between the glass table 17 and the holding table 252 (FIGS. 3 to 5).

[0034] 2, the liquid resin M stored in the tank 324 is sent by the dispenser 321 via the connection pipe 322, and the liquid resin M is supplied from the liquid resin supply nozzle 323. The liquid resin supply nozzle 323 can drip the liquid resin M downward, and the liquid resin M supplied from the liquid resin supply nozzle 323 is dripped onto the center of the upper surface of the sheet S on the placement surface 171 and applied to the sheet S. The liquid resin supply nozzle 323 can also supply the liquid resin M to the upper surface side, and the liquid resin M supplied to the upper surface side of the liquid resin supply nozzle 323 adheres to the center of the lower surface Wb of the wafer W held on the holding table 252. The amount of liquid resin M supplied from the liquid resin supply nozzle 323 can be adjusted by the dispenser 321.

[0035] The liquid resin M has a property of being cured by an external stimulus. In this embodiment, an ultraviolet-curable liquid resin M that is cured by irradiation with ultraviolet rays is used. The liquid resin M may be a thermosetting type.

[0036] A second transport mechanism 33 is provided on the side of the base 16 in the X-axis direction. The second transport mechanism 33 includes a robot hand 332 supported on a pedestal 331, and the pedestal 331 is supported movably along a pair of guide rails 333 extending in the Y-axis direction. The pedestal 331 includes a screw portion (not shown) that screws into a ball screw 334 extending in the Y-axis direction. When the ball screw 334 is rotated by the driving force of a motor, the pedestal 331 moves in the Y-axis direction.

[0037] The second transport mechanism 33 transports the wafer W between the temporary placement table 13 and the sheet cutting table 14 and the wafer holding part 25 by moving the pedestal 331 in the Y-axis direction and operating the robot hand 332. More specifically, the second transport mechanism 33 can transport the wafer W before the protective member H is formed from the temporary placement table 13 to the wafer holding part 25. In addition, the second transport mechanism 33 can transport the wafer W after the protective member H has been formed from the wafer holding part 25 to the sheet cutting table 14.

[0038] The protective member forming apparatus 10 is controlled by a control unit 35. The control unit 35 is composed of a processor that executes various processes and a storage unit (memory) that stores various parameters, programs, and the like. The control unit 35 includes, as functional blocks, a supply control unit 351, an expansion control unit 352, a hardening control unit 353, a sheet conveyance control unit 354, a closed room formation control unit 355, and a closed room opening control unit 356. These functional blocks are realized by executing a program stored in the storage unit in the control unit 35. Note that the functional blocks of the control unit 35 shown in FIG. 1 show only configurations that are mainly related to the present invention, and other configurations are omitted.

[0039] The supply control unit 351 controls the driving of the dispenser 321 in the liquid resin supply unit 32 , and causes the liquid resin supply nozzle 323 to supply a predetermined amount of liquid resin M to the sheet S supported on the placement surface 171 of the glass table 17 .

[0040] The expansion control unit 352 controls the amount and direction of movement of the wafer holding unit 25 by the lifting mechanism 27. By lowering the wafer holding unit 25, the liquid resin M can be spread out (see FIG. 3) as described below.

[0041] The curing control unit 353 controls the irradiation of the ultraviolet rays UV by the ultraviolet irradiation unit 22, and cures the liquid resin M.

[0042] The sheet conveying control unit 354 controls the driving of the arm 312 and the clamp unit 313 in the sheet conveying mechanism 31 to convey the sheet S to the placement surface 171 of the glass table 17. In addition, the sheet conveying control unit 354 controls the driving of the arm 312 to set the position of the liquid resin supply nozzle 323 so that the liquid resin M is dripped onto the center of the sheet S supported on the placement surface 171 of the glass table 17.

[0043] The closed room formation control unit 355 performs control to form a closed room 41 (FIG. 5) between the placement surface 171 of the glass table 17 and the holding surface 253 of the holding table 252. The closed room opening control unit 356 performs control to open the closed room 41. Details of the control by the closed room formation control unit 355 and the closed room opening control unit 356 will be described later.

[0044] The functions of each of the above control units 351 to 356 are realized by the operation of the processor, memory, and other components that make up the control unit 35, and this does not mean that each of the control units 351 to 356 is composed of an independent electronic component.

[0045] Next, the formation of the protective member H by the protective member forming apparatus 10 will be described.

[0046] When forming the protective member H, the sheet conveying control unit 354 controls the sheet conveying mechanism 31, grips the end of the sheet S with the clamp unit 313, moves the arm 312 in the Y-axis direction, and the sheet S is pulled out from the sheet supply unit 311 and conveyed to the glass table 17 side. The pulled out sheet S is cut to a predetermined length by a sheet cutter provided in the sheet conveying mechanism 31, and as shown in FIG. 2, the sheet S is placed on the placement surface 171 of the glass table 17. The area of ​​the sheet S is larger than the area of ​​the placement surface 171, and the outer periphery of the sheet S covers the suction port 172 on the outer edge of the placement surface 171. Under the control of the control unit 35, the control valve 19 is opened to operate the suction source 20, and a suction force is applied to the suction port 172, so that the sheet S is sucked and held and adheres to the placement surface 171. The area of ​​the sheet S at this stage is larger than the area of ​​the lower surface Wb of the wafer W.

[0047] Next, the sheet conveying control unit 354 adjusts the position of the arm 312 of the sheet conveying mechanism 31 in the Y-axis direction, and positions the liquid resin supply nozzle 323 of the liquid resin supply unit 32 above the sheet S placed on the placement surface 171.

[0048] After positioning the liquid resin supply nozzle 323, the supply control unit 351 controls the dispenser 321 of the liquid resin supply unit 32 to send the liquid resin M to the liquid resin supply nozzle 323 and drip the liquid resin M from the liquid resin supply nozzle 323 onto the sheet S. The liquid resin supply nozzle 323 is positioned above the center of the glass table 17, and the liquid resin M dripped from the liquid resin supply nozzle 323 is accumulated near the center of the upper surface of the sheet S in a range narrower than the area of ​​the wafer W. The supply control unit 351 controls the dispenser 321 based on information such as the size of the wafer W, and supplies the sheet S with an amount of liquid resin M that spreads over the entire lower surface Wb of the wafer W. When the supply of a predetermined amount of liquid resin M is completed, the arm 312 is moved to retract the liquid resin supply nozzle 323 from above the glass table 17.

[0049] 2, the wafer W is suction-held on the holding table 252 of the wafer holding unit 25. When the wafer W is held on the holding table 252, the wafer W before the protective member H is formed is taken out of the cassette C in the accommodation space of the cassette accommodation unit 12 by the robot hand 152 of the first transport mechanism 15 and placed on the temporary placement table 13. The wafer W on the temporary placement table 13 is handed over to the robot hand 332 of the second transport mechanism 33, and the wafer W is transported to the holding table 252. At the holding table 252, the control valve 28 is set to the suction state to operate the suction source 29, and the upper surface Wa of the wafer W is suction-held on the holding surface 253 by the suction force acting on the suction port 254.

[0050] At least a part of the process of holding the wafer W on the holding table 252 may be performed in parallel with the carrying of the sheet S onto the glass table 17 and the supply of the liquid resin M onto the sheet S.

[0051] When the wafer W held by the holding table 252 is positioned above and facing the liquid resin M on the sheet S, the motor 275 of the lifting mechanism 27 is driven under the control of the expansion control unit 352 to lower the lifting table 272 and the holding table 252 at a predetermined feed speed. As the holding table 252 lowers, the lower surface Wb of the wafer W approaches the glass table 17 and comes into contact with the liquid resin M. Then, the liquid resin M is pressed by the lower surface Wb of the wafer W as it descends, and the liquid resin M is spread out in the radial direction of the wafer W. Before the lower surface Wb of the wafer W comes into contact with the sheet S, the liquid resin M is concentrated near the center of the sheet S, and as it is pressed by the wafer W, the liquid resin M spreads out toward the outer edge of the wafer W (see FIG. 3).

[0052] When the liquid resin M is completely spread by the lowering of the holding table 252 and the entire lower surface Wb of the wafer W is covered with the liquid resin M, the process proceeds to the curing process. As shown in FIG. 3, in the curing process, the ultraviolet irradiation section 221 of the ultraviolet irradiation unit 22 irradiates ultraviolet rays UV having an intensity sufficient to cure the liquid resin M from below toward the mounting surface 171 of the glass table 17 under the control of the curing control section 353. The ultraviolet rays UV emitted from the ultraviolet irradiation section 221 penetrate the glass table 17 and the sheet S to reach the liquid resin M and cure the liquid resin M, which is an ultraviolet curable resin. When the liquid resin M is sufficiently cured, the irradiation of the ultraviolet rays UV from the ultraviolet irradiation unit 22 is terminated. The cured liquid resin M and the sheet S form a protective member H that covers the entire lower surface Wb of the wafer W, and the protective member H protects the lower surface Wb of the wafer W.

[0053] When the formation of the protective member H is completed, the wafer W on which the protective member H has been formed is unloaded. When unloading the wafer W, the control valve 19 is closed to release the suction force to the suction port 172, and the suction and holding of the sheet S on the placement surface 171 is terminated. Next, the motor 275 of the lifting mechanism 27 is driven to lift the lifting table 272 and the holding table 252. As the holding table 252 is lifted, the wafer W, which is suction-held on the holding surface 253, is pulled upward from the glass table 17 together with the protective member H.

[0054] Next, the wafer W on which the protective member H has been formed is transferred from the holding table 252 to the robot hand 332 of the second transfer mechanism 33. When transferring the wafer W, the control valve 28 is set to an air supply state to operate the air supply source 30 and spray air from the suction port 254, thereby releasing the suction hold of the wafer W by the holding surface 253 and separating the wafer W from the holding table 252.

[0055] The second transport mechanism 33 is driven to move the robot hand 332 that has received the wafer W, and place the wafer W on the sheet cutting table 14. Using the sheet cutter 141, excess sheet S is cut along the outer shape of the wafer W placed on the sheet cutting table 14. Then, the wafer W after the protective member H has been formed is taken out of the sheet cutting table 14 by the robot hand 152 of the first transport mechanism 15, and is carried into the cassette C in the storage space of the cassette storage unit 12.

[0056] In this manner, formation of the protective member H on the wafer W is completed in the protective member forming apparatus 10. The wafer W on which the protective member H has been formed is transferred to a processing apparatus other than the protective member forming apparatus 10 and processed therein.

[0057] For example, the wafer W is transferred to a grinding device, and the upper surface Wa opposite to the lower surface Wb covered with the protective member H is ground. During grinding in the grinding device, the protective member H is pressed against a chuck table of the grinding device. The protective member H, which has a predetermined thickness and is hardened, is able to withstand the pressure and allow the wafer W to be ground stably.

[0058] In the existing protective member forming apparatus, when the apparatus is stopped, dust floating in the apparatus may adhere to the mounting surface of the glass table on which the sheet is placed. In the case of a porous plate made of a porous material, foreign matter such as dust can be removed by blowing air from the entire holding surface, but in the case of a glass table, holes for blowing air are not formed on the entire mounting surface, so there is a restriction that dust attached to the mounting surface cannot be removed by blowing air from the mounting surface itself. If foreign matter such as dust is present on the mounting surface of the glass table when forming the protective member, the foreign matter will cause unevenness in the sheet, making it impossible to make the surface of the protective member flat. If the protective member is held on the chuck table of the grinding apparatus and the wafer is ground with a grinding wheel when the surface of the protective member is not flat, a problem occurs in that the wafer does not have a uniform thickness.

[0059] In order to prevent such problems, the protective member forming apparatus 10 of this embodiment takes measures to prevent dust from adhering to the glass table 17 while the apparatus is stopped, and the details of these measures will be described below.

[0060] 2 to 5, a cylindrical body 40 is provided on the outer periphery of the holding surface 253 of the holding table 252. The cylindrical body 40 has a bellows-like cylindrical shape that is expandable and contractable in the Z-axis direction, and is made of a non-breathable material (such as rubber).

[0061] When the lifting mechanism 27 lowers the holding table 252 and brings it close to the glass table 17, the lower end of the cylindrical body 40 comes into contact with the outer support surface 182 of the support frame 18, and the cylindrical body 40 connects the outer periphery of the upper surface of the glass table 17 to the outer periphery of the holding surface 253 with a gap between the placement surface 171 (upper surface) of the glass table 17 and the holding surface 253, forming an enclosed chamber 41 (Figure 5).

[0062] 2 to 5, a ring-shaped suction port 183 that is continuous in the circumferential direction of the surrounding wall 181 is formed on the outer support surface 182 of the support frame 18. The suction port 183 has a larger diameter than the suction port 172 formed on the outer edge of the mounting surface 171 of the glass table 17, and is disposed so as to surround the outside of the suction port 172. A flow path 184 that communicates with the suction port 183 is formed inside the support frame 18, and the flow path 184 is connected to the suction source 43 and the air supply source 44 via the control valve 42.

[0063] The control valve 42 operates in a suction state in which the flow path 184 is connected to the suction source 43, an air supply state in which the flow path 184 is connected to the air supply source 44, and a non-connection state in which the flow path 184 is not connected to either the suction source 43 or the air supply source 44. When the control valve 42 is in the suction state and the suction source 43 is operated, air is sucked in from the flow path 184 and a suction force acts on the suction port 183. When the control valve 42 is in the air supply state and the air supply source 44 is operated, air is supplied to the flow path 184 and air is sprayed from the suction port 183.

[0064] 2 and 3, in the process of forming the protective member H, when the holding table 252 descends and approaches the glass table 17, the lower end of the cylinder 40 comes into contact with the outer support surface 182 of the support frame 18, and a closed chamber 41 is formed inside the cylinder 40. Then, the protective member H is formed inside the closed chamber 41. The diameter of the cylinder 40 is larger than the diameter of the wafer W, and when the liquid resin M is pressed and spread between the wafer W and the sheet S, the liquid resin M does not spread to the position where the cylinder 40 is connected. Therefore, the formation of the protective member H is not hindered by the cylinder 40.

[0065] In the apparatus stop processing for stopping the protective member forming apparatus 10, the closed-chamber formation control unit 355 of the control unit 35 controls the operation of the protective member forming apparatus 10 as follows to prevent dust from adhering to the mounting surface 171 of the glass table 17.

[0066] When the closed-chamber formation control unit 355 of the control unit 35 receives the device stop signal, it causes the lifting mechanism 27 to lower the holding table 252, and as shown in Fig. 5, connects the outer periphery of the upper surface of the glass table 17 to the outer periphery of the holding surface 253 with a gap provided between the placement surface 171 (upper surface) of the glass table 17 and the holding surface 253 to form the closed chamber 41. Since the cylinder 40 is bellows-shaped and expandable in the Z-axis direction, even if there is some error in the amount of descent of the holding table 252, the error can be absorbed by the deformation of the cylinder 40 without compromising the airtightness inside the closed chamber 41.

[0067] As shown in FIG. 4, when forming the closed chamber 41, the closed chamber formation control unit 355 operates the air supply source 30 by putting the control valve 28 into an air supply state, and communicates the holding surface 253 with the air supply source 30 to jet air from the holding surface 253 (suction port 254). As the holding table 252 approaches the glass table 17, air is jetted from the holding surface 253 toward the placement surface 171, so that dust is blown off from the placement surface 171. The blown off dust scatters to the outside of the glass table 17. Since the space between the holding surface 253 and the placement surface 171 is open to the outside air until the lower end of the cylindrical body 40 contacts the outer support surface 182 of the support frame 18, dust can be discharged toward the outside of the glass table 17 without being blocked by the cylindrical body 40. The closer the holding table 252 is to the glass table 17, the higher the effect of removing dust from the placement surface 171 using the jet of air from the holding surface 253.

[0068] 5, the closed-chamber formation control unit 355 lowers the holding table 252 to a position where the lower end of the cylindrical body 40 contacts the holding surface 253, and the cylindrical body 40 connects the outer periphery of the placement surface 171 of the glass table 17 to the outer periphery of the holding surface 253 to form a closed chamber 41. At the stage where the closed chamber 41 is formed, the closed-chamber formation control unit 355 disconnects the control valve 28 to stop the injection of air from the holding surface 253.

[0069] Furthermore, when the closed chamber 41 is formed, the closed chamber formation control unit 355 puts the control valve 42 into the suction state to operate the suction source 43, communicates the placement surface 171 with the suction source 43, and sucks air from the suction port 183. As a result, the air in the closed chamber 41 is sucked toward the suction source 43, and dust remaining and floating in the closed chamber 41 is sucked out from the suction port 183, preventing the dust from adhering to the placement surface 171 in the closed chamber 41. Furthermore, by sucking the air in the closed chamber 41 from the suction port 183, the pressure in the closed chamber 41 becomes negative relative to atmospheric pressure, the lower end of the cylinder 40 comes into close contact with the outer support surface 182, and the state in which the closed chamber 41 is formed is maintained.

[0070] After the closed chamber 41 is formed, the closed chamber formation control unit 355 disconnects the control valve 42 and stops the suction operation by the suction source 43. Even after the suction operation inside the closed chamber 41 by the suction source 43 is stopped, the state in which the lower end of the cylindrical body 40 is in close contact with the outer support surface 182 and the closed chamber 41 is formed is maintained. Therefore, while the protective member forming apparatus 10 is stopped for a long period of time, the inside of the closed chamber 41 is isolated from the outside air, and dust does not adhere to the mounting surface 171 inside the closed chamber 41.

[0071] After the closed chamber 41 is formed, the injection of air from the holding surface 253 and the suction of air from the suction port 183 may be continued for a predetermined time. This allows the air supplied into the closed chamber 41 and the air exhausted from the closed chamber 41 to circulate, thereby keeping the inside of the closed chamber 41 clean.

[0072] As described above, while the protective member forming apparatus 10 is stopped, the outer support surface 182 located on the outer periphery of the upper surface of the glass table 17 and the outer periphery of the holding surface 253 are connected by the cylinder 40 to form the closed chamber 41, and the mounting surface 171 of the glass table 17 is located inside the closed chamber 41. Therefore, dust floating inside the apparatus does not adhere to the mounting surface 171, and the mounting surface 171 is kept clean.

[0073] In a startup process for starting up the protective member forming apparatus 10 that has been stopped, the closed chamber 41 is opened under the control of the closed chamber opening control unit 356 of the control unit 35. When the closed chamber opening control unit 356 receives an apparatus startup signal, it causes the lifting mechanism 27 to lift the holding table 252. When the holding table 252 is lifted, the lower end of the cylinder 40 separates from the outer support surface 182 of the support frame 18, and the closed chamber 41 is opened.

[0074] When opening the closed room 41, the closed room opening control section 356 sets the control valve 28 to an air supply state to operate the air supply source 30, communicates the holding surface 253 with the air supply source 30, and jets air from the holding surface 253 (suction port 254). Jetting air from the holding surface 253 prevents dust from adhering to the mounting surface 171 opposite the holding surface 253, and the forming process of the protective member H can be started with the mounting surface 171 in a clean state.

[0075] Furthermore, when the lifting mechanism 27 raises the holding table 252, the closed-room opening control section 356 of the control section 35 may set the control valve 42 to the air supply state, operate the air supply source 44, and inject air from the outer support surface 182 (suction port 183) of the support frame 18. This air injection makes it easier for the lower end of the cylindrical body 40 to separate from the outer support surface 182, and the closed room 41 can be opened smoothly.

[0076] The operation control by the closed-room formation control unit 355 and the closed-room opening control unit 356 is not limited to the case of stopping and starting the protective member forming apparatus 10, and may be performed during operation of the protective member forming apparatus 10. For example, when the placement surface 171 is left empty for a relatively long time while the wafer W is being transported by the first transport mechanism 15 or the second transport mechanism 33, the operation control by the closed-room formation control unit 355 and the closed-room opening control unit 356 may be performed during that waiting time to form and open the closed chamber 41, thereby preventing dust from adhering to the placement surface 171.

[0077] As described above, the protective member forming device 10 of this embodiment forms the closed chamber 41 surrounded by the cylinder 40 between the outer periphery of the upper surface of the glass table 17 and the outer periphery of the holding surface 253, and by injecting air from the holding surface 253 when forming the closed chamber 41, it is possible to prevent dust from adhering to the mounting surface 171 of the glass table 17 when the device is stopped for a long time. There is a problem that dust cannot be blown off from the mounting surface 171 by air blowing when the device is stopped for a long time, but the protective member forming device 10 prevents dust from adhering to the mounting surface 171 itself by forming the closed chamber 41, so that such a problem can be solved. In addition, dust that has adhered to the mounting surface 171 while the device is stopped for a long time may adhere to the mounting surface 171 due to absorption of moisture in the air, etc., and may become difficult to blow off from the mounting surface 171 by air blowing, but the protective member forming device 10 of this embodiment does not cause such a problem because dust is not allowed to adhere to the mounting surface 171 during a long stoppage.

[0078] The closed chamber 41 is formed by utilizing the action of lowering the holding table 252 by the lifting mechanism 27, and since the closed chamber 41 can be formed without requiring the addition of a complex driving mechanism, the protective member forming apparatus 10 of this embodiment has the advantage that it can be introduced at low cost.

[0079] In the protective member forming apparatus 10 of the above embodiment, the suction port 183 is formed on the outer support surface 182 of the support frame 18, and when the closed chamber 41 is formed, the suction port 183 is connected to the suction source 43 to suck air from the closed chamber 41, but it is also possible to suck air from the closed chamber 41 by using the suction port 172 on the outer edge of the glass table 17. That is, in the state of Fig. 5, the control valve 19 may be opened to operate the suction source 20 and suck air from the suction port 172. In this case, the suction port 183 and the flow path 184 of the support frame 18, and the control valve 42, the suction source 43, and the air supply source 44 connected thereto may be omitted.

[0080] Although the cylinder 40 in the above embodiment is formed in a bellows-like cylindrical shape, the configuration of the cylinder is not limited thereto. For example, the cylinder may be a polygonal cylinder. Also, the cylinder may be a truncated cone shape instead of a bellows shape. A truncated cone-shaped cylinder can absorb errors in the amount of descent of the holding table 252 without compromising airtightness by changing the angle of the inclined surface according to the change in the amount of descent of the holding table 252, and can obtain the same effect as the bellows-shaped cylinder 40 in the above embodiment.

[0081] Furthermore, the cylindrical body 40 in the above embodiment is connected to the holding surface 253 of the holding table 252, and the lower end of the cylindrical body 40 comes into contact with or moves away from the outer support surface 182 as the holding table 252 rises and falls, but the cylindrical body may be configured to be connected to the outer support surface 182 side. In this case, the upper end of the cylindrical body comes into contact with or moves away from the holding surface 253 as the holding table 252 rises and falls.

[0082] The embodiments of the present invention are not limited to the above-mentioned embodiments and modifications, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological progress or a derived technology, the present invention may be implemented using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0083] As described above, the protective member forming apparatus of the present invention has the effect of preventing dust from adhering to the glass table while the apparatus is stopped by connecting the outer periphery of the top surface of the glass table and the outer periphery of the holding surface with a cylinder to form an airtight chamber and spraying air from the holding surface when forming the airtight chamber, and is particularly useful in manufacturing fields such as semiconductors which include a process of forming a protective member on one side of a wafer. [Explanation of symbols]

[0084] 10: Protective member forming device 12: Cassette storage section 13: Temporary table 14: Sheet cutting table 15: First conveying mechanism 16: Foundation 17: Glass table 171: Placement surface 172: Suction port 173: Flow path 18: Support frame 181: Enclosure wall 182 :Outer support surface 183: Suction port 184: Flow path 19: Control valve 20: Suction source 22: Ultraviolet irradiation unit 221: Ultraviolet irradiation unit 25: Wafer holder 252: Holding table 253: Holding surface 254: Suction port 255: Flow path 27: Lifting mechanism 272: Lift table 28: Control valve 29: Suction source 30: Air supply source 31: Sheet transport mechanism 311: Sheet supply unit 312: Arm 313: Clamp section 32: Liquid resin supply section 321: Dispenser 322: Connecting pipe 323: Liquid resin supply nozzle 324: Tank 33: Second conveying mechanism 35: Control section 355: Closed room formation control unit 356: Closed room opening control unit 40:Cylinder 41: Closed room 42: Control valve 43: Suction source 44: Air supply source C: Cassette H: Protective material M: Liquid resin S: Seat UV: Ultraviolet light W: Wafer

Claims

1. A protective member forming apparatus for forming a protective member for protecting an entire surface of one side of a wafer, comprising: A glass table on which the sheet is placed; a sheet conveying mechanism that conveys a sheet to the glass table; a liquid resin supplying section for applying liquid resin onto the sheet; a holding table that holds the wafer by suction using a holding surface that is connected to a suction source above the glass table; a lifting mechanism for lifting the holding table; a cylinder disposed on the holding table, which, when the holding table is brought close to the glass table by the lifting mechanism, connects an outer periphery of the upper surface of the glass table to an outer periphery of the holding surface with a gap provided between the upper surface of the glass table and the holding surface to form a closed chamber; The protective member forming device further includes a closed chamber formation control unit that lowers the holding table by the lifting mechanism and connects the holding surface to an air supply source to spray air from the holding surface when forming the closed chamber.

2. The protective member forming apparatus according to claim 1 , further comprising a chamber opening control unit which, when the lifting mechanism raises the holding table and opens the chamber, connects the holding surface to an air supply source and sprays air from the holding surface.

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