Production method of cable connection structure and cable connection structure

Abstract

To provide a production method of a cable connection structure capable of improving productivity and to provide the cable connection structure.SOLUTION: A production method of a cable connection structure 1 is a production method of a cable connection structure 1 which includes a cable 5 having a plurality of electric wires 500 and which includes an electronic component 2 having a plurality of electrodes 231 electrically connected to the plurality of electric wires 500. The production method of the cable connection structure 1 includes: an insertion step of inserting the tip parts of the plurality of electric wires 500 respectively into a plurality of electric wire arrangement parts 61 of a guide member 6; an arrangement step of arranging a fluid conductive material 70 having fluidity respectively in the plurality of electric wire arrangement parts 61; a fixing step of obtaining a plurality of fixed conductive parts 7 for fixing the plurality of electric wires 500 respectively to the plurality of electric wire arrangement parts 61 by hardening the fluid conductive material 70 after the insertion step and the arrangement step; and a connection step of electrically connecting the plurality of fixed conductive parts 7 respectively to a plurality of electrodes 231.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a cable connection structure and a cable connection structure. [Background technology]

[0002] Patent Document 1 discloses an imaging module including an imaging element having a terminal surface and a plurality of imaging terminals formed on the terminal surface, a support body provided on the terminal surface and having a plurality of grooves formed therein each communicating with the plurality of imaging terminals, a plurality of electric wires respectively arranged in the plurality of grooves, and solder that electrically connects the imaging terminals and the electric wires within the grooves.

[0003] In manufacturing the imaging module described in Patent Document 1, first a support is adhered to the terminal surface of the imaging element, then a plurality of electric wires are placed in a plurality of grooves in the support, and then molten solder is poured into the grooves and hardened, thereby electrically connecting the plurality of electric wires to the plurality of imaging terminals. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-195451 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the imaging module described in Patent Document 1, when connecting multiple electric wires and multiple imaging terminals with solder, it is necessary to insert the solder into the grooves while fixing the electric wires so that they do not come out of the grooves, and there is room for improvement from the perspective of improving productivity.

[0006] The present invention has been made in consideration of the above-mentioned circumstances, and has an object to provide a manufacturing method for a cable connection structure and a cable connection structure that can improve productivity. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, the present invention provides a manufacturing method for a cable connection structure including a cable having a plurality of electric wires and an electronic component having a plurality of electrodes electrically connected to the plurality of electric wires, the manufacturing method comprising: an insertion step of inserting the tip ends of the plurality of electric wires into a plurality of electric wire arrangement sections of a guide member, respectively; an arrangement step of arranging a fluid conductive material having fluidity into each of the plurality of electric wire arrangement sections; a fixing step of hardening the fluid conductive material after the insertion step and after the arrangement step to obtain a plurality of fixed conductive sections that fix the plurality of electric wires to the plurality of electric wire arrangement sections, respectively; and a connection step of electrically connecting the plurality of fixed conductive sections and the plurality of electrodes, respectively, after the fixing step.

[0008] In addition, in order to achieve the above-mentioned object, the present invention provides a cable connection structure comprising: a cable having a plurality of electric wires; a guide member having a plurality of through holes into which the tip ends of the plurality of electric wires are respectively inserted; a plurality of fixed conductive parts fixed respectively to the inside of the plurality of through holes and in which the tip ends of the plurality of electric wires are respectively embedded; and an electronic component having a plurality of electrodes electrically connected respectively to the plurality of fixed conductive parts. Effect of the Invention

[0009] According to the present invention, it is possible to provide a cable connection structure and a manufacturing method thereof that can improve productivity. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic configuration diagram of an endoscope system equipped with a cable connection structure in a first embodiment. [Diagram 2] FIG. 2 is an end view showing a tip surface of the camera head in the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4]1 is a partial cross-sectional view of a cable connection structure according to a first embodiment. [Diagram 5] 1 is a perspective view of a cable connection structure according to a first embodiment. FIG. [Figure 6] 1 is an exploded perspective view of a cable connection structure according to a first embodiment. FIG. [Figure 7] FIG. 2 is an exploded perspective view of a cable and a guide member in the first embodiment. [Figure 8] FIG. 4 is a perspective view of the cable and the guide member after an insertion step in the first embodiment. [Figure 9] 4 is a partial cross-sectional view of the cable, the guide member, and the fluid conductive material after an arrangement process in the first embodiment. FIG. [Figure 10] 4 is a partial cross-sectional view of the cable, the guide member, and the fluid conductive material after a fixing process in the first embodiment. FIG. [Figure 11] 4 is a partial cross-sectional view of the cable assembly, the imaging device, and a plurality of conductive portions on electrodes before a connecting step in the first embodiment. FIG. [Figure 12] 4 is a partial cross-sectional view of the cable assembly, the imaging device, and a plurality of conductive portions on electrodes after a connecting step in the first embodiment. FIG. [Figure 13] 11 is a partial cross-sectional view of a cable connection structure according to a second embodiment. FIG. [Figure 14] 13 is a partial cross-sectional view of a cable connection structure in a first example of a third embodiment. FIG. [Figure 15] 13 is a partial cross-sectional view of a cable connection structure in a second example of the third embodiment. FIG. [Figure 16] 13 is a partial cross-sectional view of a cable connection structure in a third example of the third embodiment. FIG. [Figure 17] 13 is a partial cross-sectional view of a cable connection structure in a fourth example of the third embodiment. FIG. [Figure 18] 13 is a partial cross-sectional view of a cable connection structure in a fifth example of the third embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] [First embodiment] A first embodiment of the present invention will be described with reference to Figures 1 to 12. Note that the embodiment described below is shown as a preferred specific example for carrying out the present invention, and while there are some parts that specifically exemplify various technical matters that are technically preferable, the technical scope of the present invention is not limited to this specific embodiment.

[0012] 1 is a schematic diagram of an endoscope system 10 equipped with a cable connection structure of this embodiment. The endoscope system 10 includes an endoscope 101, an image processing device 102 that processes image information obtained by the endoscope 101, a display device 103 that displays an image processed by the image processing device 102 on a screen 103a, and a liquid supply device 104 that discharges a liquid for cleaning a camera lens or the like in response to the operation of a foot switch 104a.

[0013] The endoscope 101 includes an operation unit 11, an insertion tube 12, and a camera head 13. The operation unit 11 is a part operated by a doctor. The operation unit 11 is connected to an image processing device 102 by a communication cable 14, and is also connected to a liquid supply device 104 by a hose 15. The insertion tube 12 connects the operation unit 11 and the camera head 13. The length of the insertion tube 12 is, for example, 1 m or more and 4 m or less. The camera head 13 is inserted into the body of a subject together with a part of the insertion tube 12. Hereinafter, the side of the insertion tube 12 where the camera head 13 is located is sometimes referred to as the tip side, and the opposite side is sometimes referred to as the base side.

[0014] Fig. 2 is an end view showing the tip surface of the camera head 13. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2. The camera head 13 has a resin outer cylinder 131 and a cover 132 that closes the tip surface of the outer cylinder 131. A tube 16 for circulating liquid or the like supplied from a liquid supply device 104, an optical fiber (not shown), and a cable 5 (described later) are inserted inside the outer cylinder 131 and the insertion tube 12. An imaging device 2 is disposed inside the outer cylinder 131 as an electronic component.

[0015] The cover body 132 is formed with a fitting hole 132a into which the tip of the imaging device 2 is fitted, and a fitting hole 132b into which the tip of the tube 16 is fitted. The cover body 132 is also provided with an irradiation window 132c that emits irradiation light for irradiating an imaging target site. Light guided by an optical fiber (not shown) is irradiated through the irradiation window 132c.

[0016] 3, the imaging device 2 has a cylindrical body 21, a light-transmitting imaging window 22 fixed to the tip of the cylinder 21, an imaging element 23 fixed to the base end of the cylinder 21, and a plurality of lenses 24 arranged between the imaging window 22 and the imaging element 23. The imaging element 23 can be, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a CCD (Charge-Coupled Device) image sensor, or the like. The imaging device 2 converts information of an optical image formed on the imaging element 23 into an electrical signal and outputs the electrical signal to the image processing device 102 through the cable 5.

[0017] Fig. 4 is a partial cross-sectional view of the cable connection structure 1. Fig. 5 is a perspective view of the cable connection structure. Fig. 6 is an exploded perspective view of the cable connection structure.

[0018] The cable connection structure 1 includes an imaging device 2, a cable assembly 3, and an embedded member 4. The cable assembly 3 includes a cable 5 having four electric wires 500 electrically connected to four electrodes 231 of the imaging device 2, a guide member 6 for aligning the ends of the four electric wires 500 in the four electric wire arrangement sections 61, and four fixed conductive parts 7 fixed to the inner surfaces 611 of the four electric wire arrangement sections 61 and electrically relaying the electrodes 231 and the electric wires 500. The embedded member 4 covers the connection portion between the imaging device 2 and the cable assembly 3. Note that the embedded member (see reference numeral 4 in FIG. 4) is not shown in FIGS. 5 and 6.

[0019] Four electrodes 231 are formed on an electrode forming surface 20, which is the surface on the base end side of the imaging device 2. The electrode forming surface 20 is formed in a rectangular shape, and the length of each side can be set to 1 mm or less, for example. The four electrodes 231 are formed as electrodes of the imaging element 23.

[0020] As shown in FIG. 6, the four electrodes 231 are arranged in a matrix in the vertical and horizontal directions. In this embodiment, the four electrodes 231 are arranged at four positions that are the vertices of a rectangle. In this embodiment, the four electrodes 231 are composed of a power supply electrode for powering the imaging device 2, an information output electrode for outputting an imaging signal converted from information of an optical image coupled to the imaging element 23, a command receiving electrode for receiving a command signal for causing a predetermined operation (e.g., an imaging operation, etc.) in the imaging device 2, and a ground electrode connected to a ground potential. The shortest distance between adjacent electrodes 231 in the vertical and horizontal directions can be, for example, 0.1 mm or more and 0.3 mm or less. The four electrodes 231 are respectively connected to four electric wires 500 of the cable 5.

[0021] 5 and 6, the cable 5 is a multi-core cable including four electric wires 500, a shield conductor 501 collectively covering the four electric wires 500, and an outer sheath 502 covering the shield conductor 501. The four electric wires 500 include three coaxial wires 51 and one drain wire 52. The four electric wires 500 may or may not be twisted together.

[0022] The three coaxial lines 51 are composed of a power supply coaxial line electrically connected to a power supply electrode of the four electrodes 231, an information transmission coaxial line electrically connected to an information output electrode of the four electrodes 231, and a command transmission coaxial line electrically connected to a command receiving electrode of the four electrodes 231. The power supply coaxial line supplies power to the imaging device 2. The information transmission coaxial line transmits an imaging signal output from the information output electrode of the imaging device 2. The command transmission coaxial line transmits a command signal output from the command receiving electrode of the imaging device 2.

[0023] The coaxial wire 51 includes an inner conductor 511 as a core wire, a coating 512 covering the outer periphery of the inner conductor 511, and an outer conductor 513 covering the outer periphery of the coating 512. The inner conductor 511 may be a stranded wire in which a plurality of strands are twisted together, or may be a solid wire. The diameter of the inner conductor 511 is 0.1 mm or less. More specifically, the diameter of the inner conductor 511 may be, for example, 40 to 46 AWG (diameter 0.048 mm or more and 0.093 mm or less). AWG is an abbreviation for American Wire Gauge. When the inner conductor 511 is formed of a stranded wire, the diameter of the inner conductor 511 may be the diameter of a circumscribing circle of the plurality of strands constituting the inner conductor 511.

[0024] Coating 512 surrounding internal conductor 511 is made of an electrically insulating resin. The diameter of coating 512 can be, for example, 0.1 mm or more and 0.25 mm or less.

[0025] The outer conductor 513 is formed by winding a plurality of wires in a spiral shape so as to be in contact with the outer peripheral surface of the coating 512. The outer conductor 513 may be formed by braiding a plurality of wires, or may be formed by a metal foil covering the outer peripheral surface of the coating 512. The outer conductor 513 may also be formed by attaching a conductive tape having a conductive layer formed on one or both sides of a band-shaped body made of resin to the coating 512 vertically or horizontally.

[0026] The drain wire 52 is connected to the ground electrode of the four electrodes 231 of the imaging device 2. The drain wire 52 may be a stranded wire in which a plurality of wires are twisted together, or may be a solid wire. The drain wire 52 does not include an electrically insulating coating 512 (i.e., the entire drain wire 52 is a core wire), and is electrically connected to the outer conductor 513 and the shield conductor 501 of each coaxial line 51, thereby being at ground potential.

[0027] The shield conductor 501 is formed by winding a plurality of wires laterally in a spiral shape. The shield conductor 501 may be formed by a braided wire in which a plurality of wires are braided, or by a metal foil placed on the inner peripheral surface of the outer cover 502. The shield conductor 501 may also be formed by attaching a conductive tape, which is a strip of resin and has a conductive layer formed on one or both sides, to the four electric wires 500 either vertically or horizontally.

[0028] The outer cover 502 collectively covers the four electric wires 500 and the shield conductor 501 except for the ends on the electrode formation surface 20 side. The outer cover 502 is formed, for example, from an electrically insulating resin in a cylindrical shape.

[0029] 4, the length L1 between the tip surface of the outer cover 502 and the electrode-forming surface 20 in the opposing direction between the electrode-forming surface 20 and the guide member 6 (hereinafter referred to as the X-direction) is 1 mm or less, and preferably 0.5 mm or less. The area between the electrode-forming surface 20 and the outer cover 502 in the cable connection structure 1 is reinforced by being embedded with the embedding member 4, and this area can be a part where flexibility is likely to decrease, so from the perspective of improving the flexibility of the cable connection structure 1, it is preferable to shorten the length L1.

[0030] 6, the shield conductor 501 and the outer conductors 513 of the three coaxial wires 51 are cut at the tip position of the outer sheath 502, and the inner conductors 511 and the coatings 512 of the three coaxial wires 51 and the drain wire 52 are exposed from the tip of the outer sheath 502. As shown in Fig. 4, the length L2 in the X direction from the tip of the outer sheath 502 to the tips of the four electric wires 500 is less than 1 mm, preferably less than 0.5 mm.

[0031] As shown in FIG. 6, the tip of each of the four electric wires 500 has an exposed core portion 53 where the core is exposed from the cable 5. The tip of each of the three coaxial wires 51 of the four electric wires 500 has an exposed covering portion 54 in addition to the exposed core portion 53. The exposed covering portion 54 is a portion where the covering 512 covering the core is exposed from the cable 5, and is formed on the base end side of the exposed core portion 53. In this embodiment, the length of the exposed covering portion 54 of the coaxial wire 51 is shorter than the length of the exposed core portion 53. The entire portion of the drain wire 52 exposed from the outer sheath 502 to the tip side is the exposed core portion 53. The exposed core portions 53 of the four electric wires 500 are inserted into the four electric wire arrangement portions 61 of the guide member 6, respectively.

[0032] As shown in Figs. 4 to 6, the guide member 6 is formed in a plate shape having a thickness in the X direction. In this embodiment, the guide member 6 has a substantially quadrangular shape (specifically, a square with rounded corners) when viewed from the X direction. The guide member 6 is interposed between the electrode forming surface 20 and the tip surface of the outer cover 502 so that a tip surface 62 faces the electrode forming surface 20 and a base end surface 63 faces the tip surface of the outer cover 502. The length and width H and W of the guide member 6 when viewed from the X direction are each 1 mm or less. Also, as shown in Figs. 4 and 6, the thickness T of the guide member 6 in the X direction is 0.5 mm or less.

[0033] The guide member 6 is made of a material that has electrical insulation properties and is heat resistant enough to withstand the temperature at which the fixed conductive portion 7 described below is melted. For example, the guide member 6 is made of ceramics or a highly heat resistant resin such as polyimide (PI) resin, polyether ether ketone (PEEK) resin, polystyrene sulfonate (PSS) resin, or the like.

[0034] The guide member 6 is formed with four electric wire arrangement sections 61 in which the tip ends of the four electric wires 500 are respectively arranged. The electric wire arrangement sections 61 are formed as through holes that penetrate the guide member 6 in the X direction and are completely surrounded. Hereinafter, the electric wire arrangement sections 61 are also referred to as through holes 61. In this embodiment, the through holes 61 are formed in a tubular shape (specifically, cylindrical shape) along the X direction. No conductive film is formed by metallization or the like on the inner surface 611 of the through holes 61. The four through holes 61 are formed at the same pitch as the four electrodes 231 of the imaging device 2.

[0035] 4, at least the exposed core portions 53 of the four electric wires 500 are inserted into the four through holes 61. In this embodiment, only the exposed core portions 53 of the four electric wires 500 are inserted into the four through holes 61, respectively, and the exposed coating portions 54 are not inserted. The tips of the exposed core portions 53 of the four electric wires 500 are located on the base end side of the tip positions of the through holes 61 in which they are arranged. The positioning of the multiple electric wires 500 in the X direction with respect to the guide member 6 can be achieved, for example, by making the outer diameter of the coating 512 larger than the outer diameter of the through holes 61 and abutting the tip of the coating 512 against the base end surface 63 of the guide member 6.

[0036] The length L3 in the X direction between the guide member 6 and the tip surface of the outer cover 502 can be made smaller than the thickness T of the guide member 6. This makes it easier to shorten the length L1 in the X direction between the tip surface of the outer cover 502 and the electrode forming surface 20. The guide member 6 and the tip surface of the outer cover 502 may be in contact with each other.

[0037] The opposing surfaces of the guide member 6 and the imaging device 2, i.e., the tip surface 62 of the guide member 6 and the electrode forming surface 20 of the imaging device 2, are spaced apart from each other in the X direction. For example, the length L4 in the X direction between the tip surface 62 and the electrode forming surface 20 may be greater than the radius or diameter of each core wire of the multiple electric wires 500. The tip surface 62 and the electrode forming surface 20 are not fixed by an adhesive or the like that is disposed only between the guide member 6 and the electrode forming surface 20. Note that the embedded member 4 is not disposed only between the tip surface 62 and the electrode forming surface 20.

[0038] The fixed conductive portion 7 is disposed in the through hole 61 into which the electric wire 500 is inserted. In this embodiment, the fixed conductive portion 7 fills the through hole 61 into which the electric wire 500 is inserted. The fixed conductive portion 7 is made of a conductive material that can change its state between a fluid state and a hardened state due to a temperature change or the like, and can be, for example, solder, a conductive resin, or the like. In this embodiment, the fixed conductive portion 7 is made by reflowing and hardening a solder paste.

[0039] The fixed conductive portion 7 is joined to the inner surface 611 of the through hole 61, and the exposed core portion 53 is embedded inside the fixed conductive portion 7. The fixed conductive portion 7 melts and hardens while in contact with the inner surface 611 of the through hole 61, thereby being joined to the inner surface 611 of the through hole 61 and embedding the exposed core portion 53. The four fixed conductive portions 7 are electrically connected to the four electrodes 231 of the imaging device 2 via on-electrode conductive portions 8 formed on the four electrodes 231, respectively.

[0040] The conductive portion 8 on the electrode is made of a conductive material that can change between a fluid state and a hardened state in response to a temperature change or the like, and may be, for example, solder, a conductive resin, etc. In this embodiment, the conductive portion 8 on the electrode is solder.

[0041] The embedded member 4 covers and reinforces the connection portion between the imaging device 2 and the cable assembly 3. The embedded member 4 is embedded and reinforces the portion of the cable connection structure 1 between the electrode-forming surface 20 and the tip surface of the outer cover 502. In this embodiment, the embedded member 4 embeds at least the entire guide member 6. The embedded member 4 is preferably formed so as not to protrude or not to protrude significantly beyond the electrode-forming surface 20 when viewed from the X direction.

[0042] The embedding member 4 is made of an insulating material, for example, an adhesive such as acrylate, a resin such as epoxy resin, etc. In this embodiment, the embedding member 4 has a viscosity of 900 mPa·s or more and 2000 mPa·s or less in a molten state before curing.

[0043] (Method of manufacturing cable connection structure 1) Next, an example of a method for manufacturing the cable connection structure 1 of this embodiment will be described with reference to Figures 7 to 12. The method for manufacturing the cable connection structure 1 of this embodiment includes a cable preparation step, an insertion step, an arrangement step, a fixing step, a connection step, and an embedding step.

[0044] The cable preparation step is a step of preparing a cable 5 in which the tips of the four electric wires 500 are exposed from the tip surface of the outer sheath 502 as shown in FIG. 7. Such a cable 5 can be obtained, for example, by removing the tips of the outer sheath 502, the outer conductor 513 of the three coaxial wires 51, and the shield conductor 501 of a cable in a state in which the tips of the four electric wires 500 are not exposed from the outer sheath 502, to expose the tips of the four electric wires 500, and further removing the tips of the coatings 512 of the three coaxial wires 51. At this time, the length of the exposed core wire parts 53 of the three coaxial wires 51 is set to be shorter than the length of the through hole 61 of the guide member 6. In addition, the length from the tip of the outer sheath 502 to the tips of the four electric wires 500 (see symbol L2 in FIG. 4) is set to be less than 1 mm, preferably less than 0.5 mm. After the cable preparation step, an insertion step is performed.

[0045] 7 and 8, the insertion step is a step of inserting the tip portions of the four electric wires 500 into the four through holes 61 of the guide member 6, respectively. In this embodiment, in the insertion step, only the four exposed core portions 53 are inserted into the four through holes, respectively. At this time, for example, by abutting the coverings 512 of the three coaxial wires 51 against the base end side surface of the guide member 6, the cable 5 and the guide member 6 can be positioned in the penetrating direction of the through holes 61.

[0046] As shown in FIG. 9, the placement process is a process of placing a fluid conductive material 70 having fluidity into each of the four through holes 61. The fluid conductive material 70 becomes the fixed conductive part 7 after melting and hardening. In this embodiment, the fluid conductive material 70 is a solder paste. The fluid conductive material 70 is filled into the space within the through hole 61 so that the end opposite the cable 5 is at the same position as the surface of the guide member 6 opposite the cable 5. The placement process may be performed before or after the insertion process. After the insertion process and placement process, the fixing process is carried out.

[0047] As shown in FIG. 10, the fixing process is a process of obtaining the fixed conductive parts 7 that fix the four electric wires 500 to the four through holes 61, respectively, by melting and hardening the fluid conductive material 70 after the insertion process and the arrangement process. When a solder paste is used as the fluid conductive material 70 as in this embodiment, the fixed conductive parts 7 are joined to the inner surface 611 of the through holes 61 by reflow. If the fixed conductive parts 7 protrude from the tip surface 62 of the guide member 6 after the fixing process, the protruding part may be cut off to make the tip surface of the fixed conductive parts 7 flush with the tip surface 62 of the guide member 6. Note that, as long as the fixed conductive parts 7 and the electrodes 231 can be electrically connected to each other, the tip surface of the fixed conductive parts 7 may protrude from the tip surface 62 of the guide member 6 or may be located in a position recessed from the tip surface 62 toward the base end surface 63. After the fixing process, the connection process is performed. The cable assembly 3 in which the cable 5, the guide member 6, and the four fixed conductive parts 7 are integrated is obtained by the fixing process.

[0048] As shown in Figs. 11 and 12, the connecting step is a step of electrically connecting the four fixed conductive parts 7 and the four electrodes 231, respectively, after the fixing step. In the connecting step, first, an imaging device 2 is prepared in which a semispherical on-electrode conductive part 8 is formed on each of the four electrodes 231, and the tip surfaces of the four fixed conductive parts 7 are made to face the four on-electrode conductive parts 8, respectively. Then, in this state, the on-electrode conductive parts 8 are melted and hardened to connect the on-electrode conductive parts 8 and the fixed conductive parts 7. When the on-electrode conductive parts 8 are made of solder as in this embodiment, the on-electrode conductive parts 8 and the fixed conductive parts 7 are connected by reflow. After the connecting step, an embedding step is performed.

[0049] In the embedding process, although not shown in the figure, for example, a molten embedding material is injected from a syringe with a pointed tip from the electrode forming surface 20 to the tip surface of the outer skin 502, and then hardened, thereby forming the embedded material 4 as shown in Figure 4. In this manner, the cable connection structure 1 in this embodiment can be manufactured.

[0050] (Functions and Effects of the First Embodiment) The manufacturing method of the cable connection structure 1 in this embodiment includes an insertion step of inserting the tip portions of the multiple electric wires 500 into the multiple electric wire arrangement portions 61 of the guide member 6, respectively, an arrangement step of arranging the fluid conductive material 70 into the multiple electric wire arrangement portions 61, a fixing step of obtaining multiple fixed conductive portions 7 that fix the multiple electric wires 500 to the multiple electric wire arrangement portions 61, respectively, by hardening the fluid conductive material 70 after the insertion step and after the arrangement step, and a connection step of electrically connecting the multiple fixed conductive portions 7 and the multiple electrodes 231, respectively, after the fixing step. That is, in the manufacturing method of the cable connection structure 1 in this embodiment, the positions of the tip portions of the multiple electric wires 500 are fixed by the guide member 6 and the multiple fixed conductive portions 7 at a stage prior to the connection step. Therefore, in the connection step, it is not necessary to connect the multiple electric wires 500 and the multiple electrodes 231 while fixing the positions of the multiple electric wires 500 with a jig or the like, and the productivity of the cable connection structure 1 is improved.

[0051] Moreover, the electric wire placement portion 61 is a through hole 61 that penetrates the guide member 6. Therefore, the electric wire 500 is prevented from falling off the electric wire placement portion 61 during manufacturing of the cable connection structure 1.

[0052] Moreover, the manufacturing method of the cable connection structure 1 of this embodiment further includes, after the connecting step, an embedding step of forming an embedding member 4 that embeds a portion of the cable connection structure 1 between the imaging device 2 and the outer sheath 502. Therefore, the portion of the cable connection structure 1 between the imaging device 2 and the outer sheath 502 can be reinforced. Here, since the portion of the cable connection structure 1 reinforced by the embedding member 4 is relatively difficult to bend, it is preferable that the length of the embedding member 4 is short. In this embodiment, as described above, it is not necessary to connect the plurality of electric wires 500 and the plurality of electrodes 231 while fixing the positions of the plurality of electric wires 500 with a jig or the like in the connecting step, so there is no need to secure space for arranging the jig, and it is easy to shorten the length between the imaging device 2 and the outer sheath 502. As a result, it is easy to improve the flexibility of the cable connection structure 1 by shortening the length of the embedding member 4.

[0053] Furthermore, in the opposing direction between the imaging device 2 and the guide member 6 (i.e., the X direction), the length L1 between the electrode forming surface 20 and the outer cover 502 is 1 mm or less. If the length L1 is long, the portion reinforced by the embedded member 4 becomes long, resulting in a decrease in the flexibility of the cable connection structure 1. However, according to this embodiment, it is easy to improve the flexibility of the cable connection structure 1.

[0054] Here, when the length L1 between the electrode forming surface 20 and the outer cover 502 is 1 mm or less, it is difficult to connect the multiple electric wires 500 to the multiple electrodes 231 while fixing the positions of the multiple electric wires 500 with a jig or the like. This is because the amount of protrusion of the multiple electric wires 500 from the cable 5 becomes small, making it difficult to ensure both the arrangement space of a jig that holds the four electric wires 500 and the working space for connecting the multiple electric wires 500 to the multiple electrodes 231. However, according to the manufacturing method of the cable connection structure 1 of this embodiment, it is not necessary to connect the multiple electric wires 500 to the multiple electrodes 231 while fixing the positions of the multiple electric wires 500 with a jig or the like as described above, and the productivity of the cable connection structure 1 is improved.

[0055] Furthermore, the thickness T of the guide member 6 in the X direction is 0.5 mm or less. The region reinforced by the embedded member 4, where the guide member 6 is present, is particularly prone to reducing flexibility, so by setting the thickness T of the guide member 6 in the X direction to 0.5 mm or less, the flexibility of the cable connection structure 1 is easily improved.

[0056] In addition, in the X direction, the length L3 between the guide member 6 and the outer cover 502 is equal to or less than the thickness T of the guide member 6. This also makes it possible to shorten the area reinforced by the embedded member 4, making it easier to improve the flexibility of the cable connection structure 1.

[0057] In the insertion step, only the exposed core portions 53 of the electric wires 500 are inserted into the electric wire placement portions 61, respectively. This makes it easy to make the electric wire placement portions 61 of the guide member 6 small in size, and to increase the rigidity of the guide member 6.

[0058] Moreover, the electronic component to which the cable 5 is connected is the imaging device 2 for the endoscope 101, and the diameter of each core wire in the multiple electric wires 500 is 0.1 mm or less. That is, the core wires of the multiple electric wires 500 are extremely fine conductors, and the imaging device 2 of the endoscope 101 as the electronic component to which the cable 5 is connected is configured to be very small so as to be insertable into the human body. Under such a premise, it is difficult to connect the multiple electric wires 500 and the multiple electrodes 231 while fixing the positions of the multiple electric wires 500 with a jig or the like. On the other hand, according to the manufacturing method of the cable connection structure 1 of this embodiment as described above, it is not necessary to connect the multiple electric wires 500 and the multiple electrodes 231 while fixing the positions of the multiple electric wires 500 with a jig or the like, and the productivity of the cable connection structure 1 is improved.

[0059] Moreover, the cable connection structure 1 in this embodiment includes a guide member 6 in which a plurality of through holes 61 are formed, into which the tip portions of the plurality of electric wires 500 are respectively inserted, a plurality of fixed conductive parts 7 that are respectively fixed inside the plurality of through holes 61 and in which the exposed core portions 53 of the plurality of electric wires 500 are respectively embedded, and an imaging device 2 having a plurality of electrodes 231 that are respectively electrically connected to the plurality of fixed conductive parts 7. In this manner, by configuring the tip portions of the plurality of electric wires 500 to be inserted inside the plurality of through holes 61 of the guide member 6, the tip portions of the plurality of electric wires 500 are less likely to fall out of the plurality of through holes 61 of the guide member 6, thereby improving the productivity of the cable connection structure 1.

[0060] Furthermore, the opposing surfaces of the guide member 6 and the imaging device 2, i.e., the tip surface 62 of the guide member 6 and the electrode formation surface 20 of the imaging device 2, are spaced apart from each other. This prevents stress from being generated between the guide member 6 and the imaging device 2, improving the connection reliability between the multiple electrodes 231 and the multiple electric wires 500.

[0061] As described above, according to the present embodiment, it is possible to provide a manufacturing method for a cable connection structure and a cable connection structure that can improve productivity.

[0062] [Second embodiment] A second embodiment of the present invention will be described with reference to Fig. 13. Fig. 13 is a partial cross-sectional view of a cable connection structure 1 in this embodiment.

[0063] This embodiment has the same basic configuration as the first embodiment, but both the exposed coating portion 54 and the exposed core portion 53 of the electric wire 500 are embedded inside at least one of the fixed conductive portions 7. In this embodiment, three coaxial wires 51 out of the four electric wires 500 have both the exposed coating portion 54 and the exposed core portion 53 embedded in the fixed conductive portion 7. In the coaxial wires 51, the length of the exposed coating portion 54 located in the through hole 61 is shorter than the length of the exposed core portion 53 located in the through hole 61.

[0064] When manufacturing the cable connection structure 1 of this embodiment, in an insertion process, the four electric wires 500 are inserted into the four through holes 61 until the tip end of the exposed coating portion 54 of the coaxial wire 51 is inserted, and in an arrangement process and a fixing process, the guide member 6 and the tip end portions of the multiple electric wires 500 are fixed.

[0065] The rest is similar to the first embodiment. In addition, among the symbols used in the second and subsequent embodiments, the same symbols as those used in the previously described embodiments represent the same components, etc. as those in the previously described embodiments, unless otherwise specified.

[0066] (Functions and Effects of the Second Embodiment) In the cable connection structure 1 of this embodiment, both the exposed coating portion 54 and the exposed core portion 53 of the electric wire 500 are embedded inside at least one of the multiple fixed conductive portions 7. This makes it easier to fill the gap between the guide member 6 and the outer sheath 502 and shorten the length of the portion reinforced by the embedding member 4, thereby improving the flexibility of the cable connection structure 1. In addition, the second embodiment has the same functions and effects as the first embodiment.

[0067] [Third embodiment] A third embodiment of the present invention will be described with reference to Figs. 14 to 18. Fig. 14 is a partial cross-sectional view of a cable connection structure 1 in a first example of this embodiment. Fig. 15 is a partial cross-sectional view of a cable connection structure 1 in a second example of this embodiment. Fig. 16 is a partial cross-sectional view of a cable connection structure 1 in a third example of this embodiment. Fig. 17 is a partial cross-sectional view of a cable connection structure 1 in a fourth example of this embodiment. Fig. 18 is a partial cross-sectional view of a cable connection structure 1 in a fifth example of this embodiment.

[0068] This embodiment has the same basic configuration as the first embodiment, but has an anti-slip shape formed on at least one inner surface 611 of the plurality of through holes 61 to prevent the electric wire 500 and the fixed conductive portion 7 arranged inside the through hole 61 from slipping out to the opposite side to the imaging device 2. In this embodiment, an anti-slip shape is formed on each inner surface 611 of the plurality of through holes 61. Hereinafter, first to fifth examples of the anti-slip shape will be described.

[0069] As shown in FIG. 14, the first example of the anti-slip shape is an example in which an inner surface 611 of a through hole 61 has a large diameter portion 611a located on the tip side and a small diameter portion 611b located on the base end side and having an inner diameter smaller than that of the large diameter portion 611a, and is formed in a stepped shape overall.

[0070] The second example of the retaining shape is an example in which an inner surface 611 of the through hole 61 has a first large diameter portion 611c located on the tip side, a second large diameter portion 611d located on the base end side, and a small diameter portion 611e located between the first large diameter portion 611c and the second large diameter portion 611d and having an inner diameter smaller than both the first large diameter portion 611c and the second large diameter portion 611d. The inner surface 611 of the through hole 61 in this example is formed symmetrically in the X direction.

[0071] The third example of the retaining shape is an example in which the inner surface 611 of the through hole 61 is formed in a tapered shape that becomes smaller in diameter toward the base end side.

[0072] The fourth example of the retaining shape is an example in which an inner surface 611 of the through hole 61 has a first inclined surface portion 611f that increases in diameter toward the tip side, and a second inclined surface portion 611g that is formed on the base end side of the first inclined surface portion 611f and increases in diameter toward the base end side. The inner surface 611 of the through hole 61 in this example is formed symmetrically in the X direction.

[0073] The fifth example of the retaining shape is an example in which the inner surface 611 of the through hole 61 has a bottleneck shape. The inner surface 611 of the through hole 61 in this example is formed symmetrically in the X direction. The rest of the first to fifth examples are similar to the first embodiment.

[0074] (Functions and Effects of the Third Embodiment) In this embodiment, a retaining shape is formed on at least one inner surface 611 of the multiple through holes 61 to prevent the electric wire 500 and the fixed conductive portion 7 arranged inside the through hole 61 from slipping out to the opposite side from the imaging device 2. Therefore, the cable 5 is prevented from slipping out of the guide member 6 during the manufacture of the cable connection structure 1 and in the completed cable connection structure 1.

[0075] In the first to fifth examples of the retaining shape, the tip portion of the inner surface 611 of the through hole 61 has a larger inner diameter than at least a part other than the tip portion of the inner surface 611. This makes it possible to ensure the area of ​​the tip surface of the fixed conductive portion 7 in the through hole 61, and makes it easier to ensure a reliable electrical connection between the fixed conductive portion 7 and the electrode 231.

[0076] In the second, fourth, and fifth examples of the retaining shape, the base end of the inner surface 611 of the through hole 61 has an inner diameter larger than at least a part of the inner surface 611 other than the base end. Therefore, when the electric wire 500 is inserted into the through hole 61, the electric wire 500 is easily guided into the through hole 61.

[0077] In the second, fourth, and fifth examples of the retaining shape, the inner surface 611 of the through hole 61 is formed symmetrically in the X direction. Therefore, there is no need to particularly identify the orientation of the guide member 6 in the X direction, and the productivity of the cable connection structure 1 is improved. In addition, the second embodiment has the same functions and effects as the first embodiment.

[0078] As a modification of the third embodiment, in the above-described first to fifth examples, not only the exposed core portion 53 but also the exposed coating portion 54 may be inserted into the through hole 61 as in the second embodiment. In particular, in the second, fourth and fifth examples, the base end portion of the inner surface 611 of the through hole 61 has a larger inner diameter than at least a part of the inner surface 611 other than the base end portion, so that it is easy to insert the insulating coating 512 portion into the base end portion of the inner surface 611 of the through hole 61.

[0079] (Summary of the embodiment) Next, the technical ideas grasped from the above-described embodiment will be described by using the reference numerals and the like in the embodiment. However, the reference numerals and the like in the following description do not limit the components in the claims to the members and the like specifically shown in the embodiment.

[0080] [1] A method for manufacturing a cable connection structure 1 including a cable 5 having a plurality of electric wires 500 and an electronic component 2 having a plurality of electrodes 231 electrically connected to the plurality of electric wires 500, the method comprising the steps of: an insertion step of inserting the tip ends of the plurality of electric wires 500 into a plurality of electric wire arrangement portions 61 of a guide member 6, respectively; an arrangement step of arranging a fluid conductive material 70 having fluidity in each of the plurality of electric wire arrangement portions 61; a fixing step of hardening the fluid conductive material 70 after the insertion step and after the arrangement step to obtain a plurality of fixed conductive portions 7 that fix the plurality of electric wires 500 to the plurality of electric wire arrangement portions 61, respectively; and a connection step of electrically connecting the plurality of fixed conductive portions 7 and the plurality of electrodes 231, respectively, after the fixing step.

[0081] [2] The method for manufacturing the cable connection structure 1 described in [1], wherein the electric wire placement portion 61 is a through hole 61 that penetrates the guide member 6.

[0082] [3] The manufacturing method of the cable connection structure 1 described in [2], wherein an anti-slip shape is formed on the inner surface 611 of the electric wire placement portion 61 to prevent the electric wire 500 and the fixed conductive portion 7 arranged inside the electric wire placement portion 61 from slipping out to the opposite side of the electronic component 2.

[0083] [4] The method for manufacturing a cable connection structure 1 described in any one of [1] to [3], wherein the cable 5 has an outer sheath 502 that covers the multiple electric wires 500, and further includes, after the connection step, an embedding step of forming an embedding member 4 that embeds a portion between the electronic component 2 and the outer sheath 502 in the cable connection structure 1.

[0084] [5] The method for manufacturing a cable connection structure 1 described in [4], wherein in the opposing direction X between the electronic component 2 and the guide member 6, a length L1 between the electrode forming surface 20 of the electronic component 2 on which the multiple electrodes 231 are formed and the outer skin 502 is 1 mm or less.

[0085] [6] The method for manufacturing a cable connection structure 1 according to [4] or [5], wherein a thickness T of the guide member 6 in the opposing direction X between the electronic component 2 and the guide member 6 is 0.5 mm or less.

[0086] [7] The method for manufacturing a cable connection structure 1 described in any one of [4] to [6], wherein a length L3 between the guide member 6 and the outer cover 502 in the opposing direction X between the electronic component 2 and the guide member 6 is less than or equal to a thickness T of the guide member 6.

[0087] [8] The method for manufacturing a cable connection structure 1 described in any one of [4] to [7], wherein at least one of the tip ends of the plurality of electric wires 500 has an exposed coating portion 54 where the coating 512 covering the core wire is exposed from the cable 5, and a core exposed portion 53 located on the tip side of the exposed coating portion 54 and where the core wire is exposed from the cable 5, and in the insertion process, both the exposed coating portion 54 and the exposed core portion 53 of at least one of the plurality of electric wires 500 are inserted into the electric wire arrangement portion 61.

[0088] [9] The cable 5 has an outer sheath 502 covering the multiple electric wires 500, and the end portions of each of the multiple electric wires 500 have a core exposed portion 53 in which a core wire is exposed from the cable 5, and in the insertion process, only the core exposed portions 53 of the multiple electric wires 500 are inserted into the multiple electric wire arrangement portions 61. The method for manufacturing a cable connection structure 1 described in any one of [1] to [8].

[0089]

[10] The method for manufacturing a cable connection structure 1 described in any one of [1] to [9], wherein the electronic component 2 is an imaging device 2 equipped with an imaging element 23 of an endoscope 101, and the diameter of each core wire in the multiple electric wires 500 is 0.1 mm or less.

[0090]

[11] A cable connection structure 1 comprising: a cable 5 having a plurality of electric wires 500; a guide member 6 having a plurality of through holes 61 into which the tip ends of the plurality of electric wires 500 are respectively inserted; a plurality of fixed conductive parts 7 fixed respectively to the inside of the plurality of through holes 61 and in which the tip ends of the plurality of electric wires 500 are respectively embedded; and an electronic component 2 having a plurality of electrodes 231 electrically connected respectively to the plurality of fixed conductive parts 7.

[0091]

[12] The cable connection structure 1 described in

[11] , further comprising a plurality of on-electrode conductive portions 8 formed on the plurality of electrodes 231, respectively, and connecting the plurality of fixed conductive portions 7 and the plurality of electrodes 231, respectively.

[0092]

[13] The cable connection structure 1 according to

[11] or

[12] , wherein the opposing surfaces of the guide member 6 and the electronic component 2 are spaced apart from each other.

[0093]

[14] A cable connection structure 1 described in any one of

[11] to

[13] , in which an anti-slip shape is formed on at least one inner surface 611 of the multiple through holes 61 to prevent the electric wire 500 and the fixed conductive portion 7 arranged inside the through hole 61 from slipping out to the opposite side of the electronic component 2.

[0094]

[15] The cable 5 has an outer sheath 502 covering the multiple electric wires 500, and further has a embedding member 4 that embeds a portion between the electronic component 2 and the outer sheath 502 in the cable connection structure 1. The cable connection structure 1 is described in any one of

[11] to

[14] .

[0095]

[16] The cable connection structure 1 described in

[15] , wherein in the opposing direction X between the electronic component 2 and the guide member 6, the length L1 between the electrode forming surface 20 of the electronic component 2 on which the multiple electrodes 231 are formed and the outer cover 502 is 1 mm or less.

[0096]

[17] The cable connection structure 1 according to

[15] or

[16] , wherein a thickness T of the guide member 6 in the opposing direction X between the electronic component 2 and the guide member 6 is 0.5 mm or less.

[0097]

[18] The method for manufacturing a cable connection structure 1 described in any one of

[15] to

[17] , wherein a length L3 between the guide member 6 and the outer cover 502 in the opposing direction X between the electronic component 2 and the guide member 6 is less than or equal to a thickness T of the guide member 6.

[0098]

[19] A cable connection structure 1 described in any one of

[15] to

[18] , wherein at least one of the tip ends of the plurality of electric wires 500 has an exposed coating portion 54 in which the coating 512 covering the core wire is exposed from the cable 5, and a core wire exposed portion 53 located on the tip side of the exposed coating portion 54 and in which the core wire is exposed from the cable 5, and both the exposed coating portion 54 and the exposed core wire portion 53 of the electric wire 500 are buried inside at least one of the plurality of fixed conductive portions 7.

[0099]

[20] A cable connection structure 1 described in any one of

[11] to

[19] , wherein the tip of each of the plurality of electric wires 500 has an exposed core portion 53 in which the core wire is exposed from the cable 5, and only the exposed core portions 53 of the plurality of electric wires 500 are buried inside each of the plurality of fixed conductive portions 7.

[0100]

[21] The cable connection structure 1 described in any one of

[11] to

[20] , wherein the electronic component 2 is an imaging device 2 equipped with an imaging element 23 of an endoscope 101, and the diameter of each core wire in the multiple electric wires 500 is 0.1 mm or less.

[0101] (Additional Note) Although the embodiment of the present invention has been described above, the invention according to the claims is not limited to the above embodiment. It should be noted that not all of the combinations of features described in the embodiment are essential to the means for solving the problems of the invention. The present invention can be modified appropriately without departing from the spirit of the invention. [Explanation of symbols]

[0102] 1... cable connection structure 101... endoscope 2...Electronic component (imaging device) 20...Electrode formation surface 23...imaging element 231...electrode 4...Buried material 5...Cable 500…Electric wire 502…Outer sheath 512: Covering 53: Exposed core 54...Exposed coating part 6...Guide member 61...Electric wire arrangement part (through hole) 611...Inner surface 7...Fixed conductive part 70...Fluid conductive material 8: Conductive part on electrode T: Thickness of guide member X: Facing direction of electronic component and guide member

Claims

1. A method for manufacturing a cable connection structure including a cable having a plurality of electric wires and an electronic component having a plurality of electrodes electrically connected to the plurality of electric wires, comprising: an inserting step of inserting tip ends of the plurality of electric wires into a plurality of electric wire placement portions of a guide member, respectively; a placement step of placing a fluid conductive material having fluidity in each of the plurality of electric wire placement sections; a fixing step of hardening the fluid conductive material after the inserting step and the arranging step to obtain a plurality of fixed conductive portions for fixing the plurality of electric wires to the plurality of electric wire arrangement portions, respectively; and a connecting step of electrically connecting the plurality of fixed conductive parts and the plurality of electrodes, respectively, after the fixing step. A method for manufacturing a cable connection structure.

2. The electric wire placement portion is a through hole penetrating the guide member. A method for manufacturing the cable connection structure according to claim 1 .

3. an inner surface of the electric wire placement portion is formed with a slip-out prevention shape for preventing the electric wire and the fixed conductive portion arranged inside the electric wire placement portion from slipping out to the opposite side to the electronic component; A method for manufacturing the cable connection structure according to claim 2.

4. The cable has an outer sheath covering the plurality of electric wires, The method further includes, after the connecting step, a embedding step of forming an embedding member that embeds a portion between the electronic component and the outer cover in the cable connection structure. A method for manufacturing the cable connection structure according to claim 1 .

5. a length between the outer cover and an electrode forming surface of the electronic component on which the plurality of electrodes are formed is 1 mm or less in a direction in which the electronic component and the guide member face each other; A method for producing the cable connection structure according to claim 4.

6. The thickness of the guide member in the opposing direction between the electronic component and the guide member is 0.5 mm or less. A method for producing the cable connection structure according to claim 4.

7. a length between the guide member and the outer cover in a direction in which the electronic component and the guide member face each other is equal to or smaller than a thickness of the guide member; A method for producing the cable connection structure according to claim 4.

8. At least one of the tip ends of the plurality of electric wires has a coating exposed portion in which a coating covering a core wire is exposed from the cable, and a core wire exposed portion located on a tip side of the coating exposed portion and in which the core wire is exposed from the cable, In the inserting step, at least one of the plurality of electric wires is inserted into the electric wire placement portion such that both the exposed coating portion and the exposed core portion are inserted into the electric wire placement portion. A method for producing the cable connection structure according to claim 4.

9. The cable has an outer sheath covering the plurality of electric wires, a tip end portion of each of the plurality of electric wires has a core wire exposed portion in which a core wire is exposed from the cable, In the inserting step, only the exposed core portions of the electric wires are inserted into the electric wire arrangement portions. A method for manufacturing the cable connection structure according to claim 1 .

10. the electronic component is an imaging device including an imaging element of an endoscope, The diameter of each of the core wires in the plurality of electric wires is 0.1 mm or less. A method for manufacturing the cable connection structure according to claim 1 .

11. A cable having a plurality of electric wires; a guide member having a plurality of through holes into which the tip portions of the plurality of electric wires are respectively inserted; a plurality of fixed conductive parts each fixed to the inside of the plurality of through holes and having a tip end of each of the plurality of electric wires embedded therein; an electronic component having a plurality of electrodes electrically connected to the plurality of fixed conductive parts, Cable connection structure.

12. The semiconductor device further includes a plurality of on-electrode conductive portions that are formed on the plurality of electrodes and connect the plurality of fixed conductive portions to the plurality of electrodes, respectively. The cable connection structure according to claim 11.

13. The opposing surfaces of the guide member and the electronic component are spaced apart from each other. The cable connection structure according to claim 11.

14. a retaining shape is formed on an inner surface of at least one of the plurality of through holes to prevent the electric wire and the fixed conductive portion arranged inside the through hole from slipping out to an opposite side to the electronic component; The cable connection structure according to claim 11.

15. The cable has an outer sheath covering the plurality of electric wires, The cable connection structure further includes an embedding member that embeds a portion between the electronic component and the outer cover. The cable connection structure according to claim 11.

16. a length between the outer cover and an electrode forming surface of the electronic component on which the plurality of electrodes are formed is 1 mm or less in a direction in which the electronic component and the guide member face each other; The cable connection structure according to claim 15.

17. The thickness of the guide member in the opposing direction between the electronic component and the guide member is 0.5 mm or less. The cable connection structure according to claim 15.

18. a length between the guide member and the outer cover in a direction in which the electronic component and the guide member face each other is equal to or smaller than a thickness of the guide member; A method for manufacturing the cable connection structure according to claim 15.

19. At least one of the tip ends of the plurality of electric wires has a coating exposed portion in which a coating covering a core wire is exposed from the cable, and a core wire exposed portion located on a tip side of the coating exposed portion and in which the core wire is exposed from the cable, Both the exposed coating portion and the exposed core portion of the electric wire are embedded inside at least one of the plurality of fixed conductive parts. The cable connection structure according to claim 15.

20. a tip end portion of each of the plurality of electric wires has a core wire exposed portion in which a core wire is exposed from the cable, Only the exposed core portions of the electric wires are embedded inside the fixed conductive parts, The cable connection structure according to claim 11.

21. the electronic component is an imaging device including an imaging element of an endoscope, The diameter of each of the core wires in the plurality of electric wires is 0.1 mm or less. The cable connection structure according to claim 11.

Images