Semiconductor module

Abstract

To provide a semiconductor module capable of avoiding breakage of a cooler due to stress in destruction of a semiconductor element without using any stress relaxation member.SOLUTION: A semiconductor module of an embodiment has a semiconductor chip package and a cooler. The cooler has a projection joined to a collector side of the semiconductor chip package on a package mount surface where the semiconductor chip package is mounted. A refrigerant path where a refrigerant flows is formed inside the cooler. The refrigerant path is arranged without overlapping with the projection when viewed from a normal direction of the package mount surface.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] FIELD An embodiment of the present invention relates to a semiconductor module. [Background technology]

[0002] Conventionally, there is a semiconductor module structure that has a stress relief member on the source / emitter side of a semiconductor element to relieve stress. In this structure, coolers are placed above and below the source / emitter electrodes and the drain / collector electrodes, with insulating plates between them. The coolant paths of the coolers are placed directly below the semiconductor elements.

[0003] In the above conventional structure, a stress relaxation member is used as a method of avoiding stress, but since the cost of materials and manufacturing is high, it is desirable to have a structure that does not use a stress relaxation member. However, if the coolant path is located directly under the semiconductor element, there is a risk that the load on the coolant path will increase due to the stress generated on the cooler side when the semiconductor element is broken due to short circuit or the like. In other words, in the conventional technology, if a stress relaxation member is not used, there is a risk that the coolant path of the cooler will be damaged by the stress when the semiconductor element is broken. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-26667 A Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a semiconductor module that can prevent damage to a cooler caused by stress when a semiconductor element breaks, without using a stress relaxation member. [Means for solving the problem]

[0006] The semiconductor module of the embodiment has a semiconductor chip package and a cooler. The cooler has a protrusion on a package mounting surface on which the semiconductor chip package is mounted, the protrusion being joined to a collector side of the semiconductor chip package. A coolant path for flowing a coolant is formed inside the cooler. The coolant path is arranged so as not to overlap the protrusion when viewed from the normal direction of the package mounting surface. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a front view showing a main part of the semiconductor module according to the embodiment. [Diagram 2] 2 is a front view corresponding to FIG. 1, illustrating the operation of the semiconductor module according to the embodiment. [Diagram 3] 4 is a plan view showing an arrangement of a plurality of semiconductor chip packages, protrusions, and water-cooling pipes in the semiconductor module; FIG. [Figure 4] 4 is a plan view corresponding to FIG. 3 and showing a first modified example of the water-cooling pipe. FIG. [Diagram 5] FIG. 2 is a front view corresponding to FIG. 1 and showing a second modified example of the water-cooling pipe. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, a semiconductor module according to an embodiment will be described with reference to the drawings. Note that the same or corresponding components will be denoted by the same reference numerals and the description thereof will be omitted.

[0009] (Semiconductor module 1) Fig. 1 is a front view showing a main part of a semiconductor module 1 according to an embodiment. Fig. 2 is a front view corresponding to Fig. 1 showing the operation of the semiconductor module 1 according to an embodiment. Fig. 3 is a plan view showing the arrangement of a plurality of semiconductor chip packages 10, a protrusion 35, and a water-cooling pipe 7 in the semiconductor module 1. The semiconductor module 1 of the embodiment has a configuration in which a plurality of semiconductor chip packages 10, each including a semiconductor element (semiconductor chip) 2, are housed in a module case 5. The semiconductor module 1 includes the plurality of semiconductor chip packages 10 and a module case 5 that houses the plurality of semiconductor chip packages 10.

[0010] The semiconductor module 1 of the embodiment is a semiconductor device for a large-capacity power converter such as a megawatt-class power converter. The semiconductor module 1 has a plurality of semiconductor chip packages 10, each including a semiconductor element 2 such as an IGBT, arranged in parallel to ensure a sufficient amount of current. The semiconductor module 1 has a plurality of semiconductor chip packages 10 arranged in a lattice pattern in a module case 5. For example, the semiconductor module 1 is installed on a horizontal floor surface (installation location) G within a facility. The semiconductor module 1 is installed with the bottom surface of the module case 5 parallel to the floor surface G.

[0011] The arrow Z in the figure indicates the up-down direction (vertical direction) when the semiconductor module 1 is installed in the installation location G. The direction of the arrow Z is the normal direction of the installation location G, and if the installation location G is inclined, the direction of the arrow Z also inclines. Unless otherwise specified, the directions of up-down, front-back, and left-right in the following explanation are the same as the directions when the semiconductor module 1 is installed in the installation location G. The arrow Y in the figure indicates the front-back direction, and the arrow X in the figure indicates the left-right direction.

[0012] In addition, in the figure, reference numeral 6 indicates a cooler that forms the bottom of the module case 5, reference numeral 7 indicates a water-cooling pipe (coolant path) arranged inside the cooler 6, reference numeral 18 indicates an insulating sealing material that seals the semiconductor chip package 10, reference numeral 11 indicates the metal case 11 of the semiconductor chip package 10, reference numeral 19 indicates mounting screws (bolts) for fixing the semiconductor chip package 10 to the cooler 6, reference numeral 8 indicates a top plate of the module case 5, reference numeral 9 indicates supports (side walls) of the module case 5, reference numeral 20 indicates an emitter conductor that is joined to the emitter electrode 3 of the semiconductor chip 2 via a spacer 20a, reference numeral 30 indicates a collector conductor 30 that is joined to the collector electrode 4 of the semiconductor chip 2, and reference numeral 35 indicates a convex portion that protrudes from the cooler 6 and is joined to the collector conductor 30 of the semiconductor chip package 10 via a heat conductive sheet 35a.

[0013] (Semiconductor chip package 10) As shown in FIG. 1, a semiconductor chip package 10 includes, for example, a single semiconductor element 2, a metal case 11 that houses and covers the semiconductor element 2, an emitter conductor (metal electrode) 20 that is connected at one end to an emitter electrode 3 on the front surface (top surface) of the semiconductor element 2 inside the metal case 11, extends from the one end to the other end, and has the other end protruding to the outside of the metal case 11, and a collector conductor (metal electrode) 30 that is connected to a collector electrode 4 on the back surface (bottom surface) of the semiconductor element 2.

[0014] The semiconductor element 2 is disposed horizontally with the emitter electrode 3 facing upward and the collector electrode 4 facing downward. An emitter conductor 20 is disposed on the emitter electrode 3 side of the semiconductor element 2. The emitter conductor 20 is connected to the emitter electrode 3 via a spacer 20a. The spacer 20a is joined to the emitter electrode 3 and the emitter conductor 20 by soldering. The spacer 20a may be integrally formed as a part of the emitter conductor 20. The emitter conductor 20 protrudes to the outside of the metal case 11 and is electrically connected to the lower surface of the top plate 15 of the module case 5. The top plate 15 of the module case 5 serves as the emitter electrode of the semiconductor module 1.

[0015] A collector conductor 30 is disposed on the collector electrode 4 side of the semiconductor element 2. A convex portion 35 of the cooler 6 is electrically connected to the collector conductor 30 via a heat conductive sheet 35a (an intermediate member 35 such as copper or aluminum) having high thermal conductivity and electrical conductivity. The collector conductor 30, the heat conductive sheet 35a, and the convex portion 35 are connected by fastening using a plurality of bolts 19 (for example, a pair of bolts on the left and right) along the vertical direction. The bolts 19 are inserted from below into insertion holes that penetrate the cooler 6 along the vertical direction. The bolts 19 penetrate the heat conductive sheet 35a and are fastened into bottomed nut holes formed in the collector conductor 30. The cooler 6 is disposed on the collector side of the semiconductor chip package 10 and constitutes the bottom of the module case 5. The cooler 6 serves as a collector electrode of the semiconductor module 1.

[0016] The semiconductor chip 2 is housed in a metal case 11. The components arranged inside the metal case 11 are sealed by an insulating sealant 18 filled inside the metal case 11. The insulating sealant 18 also covers the outside of the metal case 11. The metal case 11 has upper and lower walls 12, 13 arranged parallel to the semiconductor chip 2, and a side wall 14 extending between the ends of the upper and lower walls 12, 13, for example, on one side in the left-right direction (the left side in the figure). The metal case 11 is arranged with the upper and lower walls 12, 13 horizontal. The metal case 11 is arranged with the side wall 14 aligned, for example, in the front-rear direction. The metal case 11 is made of a metal such as an aluminum alloy.

[0017] The metal case 11 has a side opening 15 at a portion facing the side wall 9, and an emitter conductor 20 can be drawn from the inside to the outside of the metal case 11 through an opening formed in the side opening 15. The emitter conductor 20 integrally includes a base 21 extending linearly from the inside to the outside (to the right in the figure) of the metal case 11 in the left-right direction, a vertical extension 22 bending upward from the tip of the base 21 outside the metal case 11 and extending linearly in the up-down direction, and a horizontal extension 23 bending rightward from the tip of the vertical extension 22 (opposite the metal case 11 in the left-right direction) and extending linearly in the left-right direction. The horizontal extension 23 is located above the main body of the semiconductor chip package 10. The horizontal extension 23 is connected to the top plate 8 of the module case 5 by, for example, fastening using a bolt along the up-down direction.

[0018] The metal case 11 has a lower opening (second opening) 16 in the bottom wall 13, and the lower surface of the collector conductor 30 can be exposed to the outside of the metal case 11 through the opening formed in the lower opening 16. No insulating sealant 18 is provided in the area where the lower opening 16 is formed. The collector conductor 30 is disposed inside the metal case 11, but can be connected to a protrusion 35 of the cooler 6 through the lower opening 16.

[0019] That is, the semiconductor chip package 10 has a package opening 10b at a lower portion facing the package mounting surface 6b of the cooler 6 in the up-down direction, into which the protrusion 35 of the cooler 6 can be inserted. The package opening 10b enables the protrusion 35 of the cooler 6 to be joined to the collector side (collector conductor 30) of the semiconductor chip 2 located inside the semiconductor chip package 10.

[0020] (Module Case 5) As shown in FIG. 1, the module case 5 includes a cooler 6, a side wall 9, and a top plate 8. The cooler 6 has horizontal upper and lower surfaces, and includes a coolant passage (water-cooled pipe 7) through which a coolant (cooling water) flows. The upper surface of the cooler 6 constitutes a package mounting surface 6b on which a plurality of semiconductor chip packages 10 are mounted. A side wall 9 is provided along the vertical direction on the outer periphery of the package mounting surface 6b. The side wall 9 is formed of, for example, an insulating material. The side wall 9 is provided continuously so as to surround the outer periphery of the package mounting surface 6b when viewed from the vertical direction. The side wall 9 is provided over the entire periphery of the package mounting surface 6b when viewed from the vertical direction. The cooler 6 and the side wall 9 form a case main body 5a that opens upward. The upper end of the side wall 9 forms an upper end opening 5b of the case main body 5a. The opening formed in the upper end opening 5b is closed by a horizontal top plate 8. The top plate 8 is provided so as to overlap the cooler 6 when viewed from the vertical direction. The outer periphery of the top plate 8 when viewed from the vertical direction is supported by the side wall 9. The cooler 6, the side wall 9 and the top plate 8 are joined together by fastening using bolts that extend in the vertical direction, for example.

[0021] (Cooler 6) 1, the cooler 6 has a cooler body 6a formed of a metal material such as an aluminum alloy having high thermal conductivity (thermal conductivity rate) and electrical conductivity (electrical conductivity). The cooler body 6a forms a horizontal upper surface 6b, which serves as a package mounting surface 6b. The cooler body 6a has a plurality of protrusions 35 that partially protrude upward from the package mounting surface 6b. The plurality of protrusions 35 are provided in the same number as the plurality of semiconductor chip packages 10 accommodated in the module case 5. Each protrusion 35 is provided at a position where the corresponding semiconductor chip package 10 is arranged.

[0022] Each protrusion 35 is integrally formed with the cooler body 6a and made of the same material. Each protrusion 35 protrudes upward from the horizontal plane portion of the package mounting surface 6b with a constant cross section. Each protrusion 35 also serves as a collector conductor 30. Each protrusion 35 is inserted from below into a package opening 10b formed on the collector side of the corresponding semiconductor chip package 10. Each protrusion 35 is connected to the collector side of the corresponding semiconductor chip package 10.

[0023] FIG. 3 is a plan view of the cooler 6 as viewed from the top-bottom direction (the normal direction of the package mounting surface 6b). In the cooler 6, the water-cooling pipe 7 through which the cooling water flows has a straight portion 7t extending along one direction of the cooler 6 (front-rear direction in this embodiment). A pair of straight portions 7t of the water-cooling pipe 7 is disposed below each of the protrusions 35. The pair of straight portions 7t constitutes a water-cooling pipe pair 7a corresponding to each of the protrusions 35 and therefore to each of the semiconductor chip packages 10. The water-cooling pipes 7 of the water-cooling pipe pair 7a extend parallel to each other across both ends of the cooler 6 in one direction (front-rear direction).

[0024] Each water-cooling pipe 7 of the pair of water-cooling pipes 7 is arranged so as not to overlap with the corresponding protrusion 35 when viewed from the top-bottom direction (the normal direction of the package mounting surface 6b). Specifically, each water-cooling pipe 7 of the pair of water-cooling pipes 7 is arranged to avoid the corresponding protrusion 35 on both the left and right sides when viewed from the top-bottom direction. The water-cooling pipes 7 are arranged so as not to be located directly below the semiconductor chip package 10.

[0025] A plurality of protrusions 35 are arranged in the front-rear and left-right directions on the package mounting surface 6b. The plurality of protrusions 35 are arranged at intervals in the front-rear and left-right directions. A semiconductor chip package 10 is arranged on each protrusion 35. When viewed from the top-bottom direction, the straight portion 7t of the water-cooling pipe 7 is arranged outside each protrusion 35 in the left-right direction. Of the plurality of semiconductor chip packages 10, the plurality of semiconductor chip packages 10 arranged in a first direction (in the embodiment, the front-rear direction) along the package mounting surface 6b are referred to as a package row 10a.

[0026] The package rows 10a are lined up in a second direction (a direction perpendicular to the first direction, the left-right direction in this embodiment) along the package mounting surface 6b. A water-cooling pipe 7 (straight portion 7t) is disposed in the center between each pair of package rows 10a lined up in the second direction. The water-cooling pipe 7 (straight portion 7t) disposed in the center between the pair of package rows 10a is referred to as the inter-row water-cooling pipe 7b. The water-cooling pipe 7 (straight portion 7t) located on the outermost left-right direction of the package mounting surface 6b is referred to as the outer water-cooling pipe 7c.

[0027] A single inter-row water-cooling pipe 7b is disposed between a pair of package rows 10a adjacent to each other in the second direction. The inter-row water-cooling pipes 7b are water-cooling pipes 7 corresponding to each of a pair of package rows 10a located on both left and right sides of the row. The inter-row water-cooling pipes 7b are used to cool the pair of package rows 10a located on both left and right sides of the row. The inter-row water-cooling pipes 7b also serve as one of the pair of water-cooling pipes 7 located on both left and right sides of the row.

[0028] The inter-row water-cooling pipes 7b and the outer water-cooling pipes 7c have their front-rear ends reaching an area (outer area) 6c that is outboard of the front-rear ends of the package rows 10a. The inter-row water-cooling pipes 7b and the outer water-cooling pipes 7c turn back in the front-rear direction in the outer area and connect to the front-rear ends of the inter-row water-cooling pipes 7b or the outer water-cooling pipes 7c that are adjacent in the left-right direction. In the example of FIG. 3, the inter-row water-cooling pipes 7b and the outer water-cooling pipes 7c are connected in series to each other to form one serpentine water-cooling pipe 7d. The serpentine water-cooling pipe 7d is arranged to weave between the multiple package rows 10a while serpentinely moving back and forth in the front-rear direction. Cooling water is introduced from one end of the serpentine water-cooling pipe 7d and discharged from the other end, thereby making it possible to cool the entire package mounting surface 6b.

[0029] Note that the configuration is not limited to connecting all of the inter-row water-cooling pipes 7b and the outer water-cooling pipes 7c to form a single serpentine water-cooling pipe 7d. For example, a plurality of connected water-cooling pipes may be formed by connecting some of all of the inter-row water-cooling pipes 7b and the outer water-cooling pipes 7c. In this case, the length of each water-cooling pipe 7 is shortened compared to the case where a single serpentine water-cooling pipe 7d is formed, and the temperature difference between the inlet side (upstream side) and the outlet side (downstream side) of each water-cooling pipe 7 is suppressed.

[0030] (action) As shown in FIG. 2, when the semiconductor chip 2 is short-circuited, a downward load F1 is input to the convex portion 35 via the collector conductor 30, which generates stress in the cooler 6. The state of each part at this time was analyzed with the allowable value set as "the stretch of the water-cooling pipe 7 is 4% or less", and the following results were obtained. That is, when at least a part of the water-cooling pipe 7 is in the area 35b directly below the convex portion 35 (the area overlapping with the convex portion 35 in a plan view), the stretch of the water-cooling pipe 7 greatly exceeds the allowable value, and it is judged as NG. On the other hand, when the entire water-cooling pipe 7 is outside the area 35b directly below the convex portion 35, it was found that the stretch of the water-cooling pipe 7 is significantly reduced. This is because the area 35b directly below the convex portion 35, which is easily subjected to the downward load F1, was avoided.

[0031] In addition, when the entire water-cooling pipe 7 was simply placed outside the area 35b directly below the protrusion 35, the extension of the water-cooling pipe 7 slightly exceeded the allowable value. Therefore, the vertical position of the water-cooling pipe 7 was changed and the analysis was performed again. Specifically, the distance L1 from the bottom surface of the cooler 6 to the center of the water-cooling pipe 7 was changed from the initial 17.5 mm to 12.5 mm and the analysis was performed. As a result, the water-cooling pipe 7 was separated from the top surface of the cooler 6, resulting in a value below the allowable value, and the result was judged as OK. In this case, the vertical thickness of the cooler 6 was 25 mm, and in this example in which the water-cooling pipe 7 was placed at the vertical center, it was found that the cooler 6 could withstand the stress caused by short-circuit destruction of the semiconductor chip 2.

[0032] Another result of the above analysis is that when the water-cooling pipes 7 are arranged on both sides below the protrusions 35 and the semiconductor chip package 10, rather than directly below the protrusions 35 and the semiconductor chip package 10, the thermal conduction resistance between the semiconductor chip 2 and the water-cooling pipes 7 deteriorates by 30%. In this case, the thermal conduction resistance of the cooler 6 is 43%, the water temperature rise resistance is 11%, the pipe interface resistance is 45%, and the pipe thermal conduction is 1%.

[0033] On the other hand, when a pair of water-cooling pipes 7 were arranged on both sides below the protrusion 35 and the semiconductor chip package 10 (hereinafter referred to as the latter), the pipe interface thermal resistance improved by 28% compared to when a single water-cooling pipe 7 was arranged directly below the protrusion 35 and the semiconductor chip package 10 (hereinafter referred to as the former). As a result, the deterioration of the thermal conduction resistance of the latter was offset, and the thermal resistance became the same level between the former and the latter.

[0034] According to the semiconductor module 1 of the embodiment, the water-cooling pipes 7 of the cooler 6 are not placed directly below the protrusions 35 that support the semiconductor chip package 10, so that excessive stress is avoided from being generated in the water-cooling pipes 7 when the semiconductor chip 2 is broken, and damage to the cooler 6 can be prevented. Although the thermal conduction resistance deteriorates when the pipe position is shifted from directly below the protrusions 35 to the outside of the protrusions 35, the pipe interface thermal resistance is improved by pairing the water-cooling pipes 7 with one protrusion 35, and the thermal resistance can be maintained at the same level.

[0035] (Modification 1 of the arrangement of the water-cooling pipes 7) FIG. 4 shows a first modified example of the water-cooling pipe 7. The water-cooling pipes 7 (inter-row water-cooling pipes 7b and outer water-cooling pipes 7c) of this modified example are arranged in the same manner with respect to the package rows 10a, but the configuration of the front-rear end is different. That is, the front-rear end of the water-cooling pipe 7 is not connected to other water-cooling pipes 7 adjacent in the left-right direction, but opens to the outside at the outer surface (front-rear surface) of the cooler main body 6a. Each water-cooling pipe 7 is not connected to each other and constitutes an independent parallel water-cooling pipe 7e. A cooling water introduction device (not shown) is connected to one front-rear end of each water-cooling pipe 7, and a cooling water discharge device (not shown) is connected to the other front-rear end of each water-cooling pipe 7.

[0036] In this modification, the length of each water-cooling pipe 7 is shortened, and the temperature difference between the inlet side (upstream side) and outlet side (downstream side) of each water-cooling pipe 7 is suppressed, compared to the configuration using a long serpentine water-cooling pipe 7d as shown in Fig. 3. As a result, the temperature variation of the semiconductor chip package 10 can be reduced, compared to the configuration using a long serial water-cooling pipe. Specifically, it was found that the temperature of the semiconductor chip package 10 when the serial water-cooling pipe was used was ±6.3°C, whereas the temperature of the semiconductor chip package 10 when the parallel water-cooling pipe 7e was used was reduced to ±4.6°C.

[0037] (Modification 2 of the arrangement of the water-cooling pipes 7) FIG. 5 shows a second modified example of the water-cooling pipe 7. The water-cooling pipes 7 (inter-row water-cooling pipes 7b and outer water-cooling pipes 7c) of this modified example are arranged in the same manner with respect to the package rows 10a, but are different in that they each have two tiers of water-cooling pipes 7, one above the other. That is, the inter-row water-cooling pipes 7b and the outer water-cooling pipes 7c are each composed of two tiers of water-cooling pipes 7 (hereinafter referred to as two-tier water-cooling pipes 7f) that overlap in the vertical direction (the normal direction of the package mounting surface 6b). As a result, the amount of cooling water can be increased without increasing the arrangement space for the water-cooling pipes 7 in a plan view.

[0038] The adoption of the two-stage water-cooling pipe 7f can effectively cool the corresponding semiconductor chip package 10. Specifically, it was found that the use of the two-stage water-cooling pipe 7f reduces the pipe interface resistance by 50% and the overall thermal resistance by 23%. At this time, the thermal conduction resistance of the cooler 6 is 43%, the water temperature rise resistance is 11%, the pipe interface resistance is 45%, and the pipe thermal conduction is 1%.

[0039] By employing two-stage water-cooling pipes 7f that overlap in the normal direction of the package mounting surface 6b, it is possible to arrange multiple water-cooling pipes 7 while minimizing the space required for arranging the water-cooling pipes 7 when viewed from above and below. Therefore, the arrangement of the water-cooling pipes 7 prevents the spacing between the multiple protrusions 35 from widening, and the multiple protrusions 35 and the semiconductor chip package 10 can be arranged compactly.

[0040] As explained above, A semiconductor module 1 of one embodiment comprises a semiconductor chip package 10 having metal electrodes 20, 30 bonded to the collector side and emitter side, respectively, of a semiconductor chip 2, and a cooler 6 arranged on the collector side of the semiconductor chip package 10, and the cooler 6 has a convex portion 35 bonded to the collector side of the semiconductor chip package 10 on a package mounting surface 6b on which the semiconductor chip package 10 is mounted, and a cooler path 7 for flowing a coolant is formed inside the cooler 6, and the coolant path 7 is arranged so as not to overlap with the convex portion 35 when viewed from the normal direction of the package mounting surface 6b.

[0041] According to this configuration, when viewed from the normal direction of the package mounting surface 6b of the cooler 6, the coolant path 7 of the cooler 6 is arranged at a position that avoids the convex portion 35 that is joined to the collector side of the semiconductor chip package 10 (a position outside the convex portion 35 and a position that avoids the area directly below the convex portion 35). This makes it possible to prevent excessive stress from being generated in the coolant path 7 even when the semiconductor element 2 is broken due to short-circuiting or the like. That is, the load input to the cooler 6 side through the convex portion 35 when the semiconductor element 2 is broken becomes maximum in the area (directly below area 35b) that overlaps with the convex portion 35 in the normal direction of the package mounting surface 6b. By arranging the coolant path 7 so as to avoid this directly below area 35b, it is possible to prevent stress generated in the coolant path 7 without using a stress relaxation member.

[0042] The semiconductor module 1 of the embodiment includes a plurality of semiconductor chip packages 10, and the cooler 6 includes a plurality of protrusions 35 corresponding to the plurality of semiconductor chip packages 10, and a single coolant path 7 is arranged between a pair of adjacent protrusions 35 when viewed from the normal direction of the package mounting surface 6b. According to this configuration, by disposing a single coolant path 7 between a pair of adjacent protrusions 35, the semiconductor chip packages 10 disposed on each of the pair of protrusions 35 can be cooled using the single coolant path 7. This allows the coolant path 7 of the cooler 6 to be simplified.

[0043] In the semiconductor module 1 of the embodiment, the multiple semiconductor chip packages 10 form package rows 10a in which the multiple semiconductor chip packages 10 are lined up in a first direction (front-to-back direction) when viewed from the normal direction of the package mounting surface 6b, and the multiple package rows 10a are arranged side by side in a second direction (left-to-right direction) intersecting the first direction, and a single coolant path 7 (inter-row water-cooling pipe 7b) is arranged between a pair of adjacent package rows 10a when viewed from the normal direction of the package mounting surface 6b. According to this configuration, by arranging a single coolant path 7 between a pair of adjacent package rows 10a, each of the semiconductor chip packages 10 in the pair of package rows 10a can be cooled using the single coolant path 7. This simplifies the coolant path 7 of the cooler 6. By using the single coolant path 7 to cool the multiple semiconductor chip packages 10 in each of the pair of package rows 10a, the large number of semiconductor chip packages 10 arranged on the package mounting surface 6b can be efficiently cooled with a small number of coolant paths 7.

[0044] In the semiconductor module 1 of the embodiment, the coolant path 7 extends in a first direction (front-to-back direction) along the package row 10a, with its end reaching an outer region (outer region 6c) in the first direction than the end of the package row 10a in the first direction, and the end of the coolant path 7 changes so as to fold back in the first direction in the outer region and is connected to an end of another adjacent coolant path 7 in the second direction. According to this configuration, the coolant path 7 extending in the first direction turns back in the region 6c outside the package row 10a and connects to another coolant path 7 adjacent in the second direction, so that the multiple coolant paths 7 extending in the first direction can be connected in series with each other. This makes it possible to cool a large number of semiconductor chip packages 10 with a simple configuration in which the coolant flows from one end to the other end of the continuous coolant paths 7.

[0045] In the semiconductor module 1 of the embodiment, the coolant path 7 extends in a first direction along the package row 10a, and reaches the outer surface of the cooler 6 without being connected to other coolant paths 7 adjacent thereto in the second direction. According to this configuration, the coolant path 7 extending in the first direction is provided independently without being connected to other coolant paths 7 adjacent thereto in the second direction, so that it is possible to provide a plurality of coolant paths 7 in parallel for use in cooling a plurality of package rows 10a. This shortens the pipe length of the coolant path 7 compared to a configuration in which a coolant flows through a long coolant path 7, so that the temperature difference between the inlet side and the outlet side of the coolant path 7 can be suppressed, and a large number of semiconductor chip packages 10 can be evenly cooled.

[0046] The semiconductor module 1 of the embodiment includes a plurality of semiconductor chip packages 10, and the cooler 6 includes a plurality of protrusions 35 corresponding to the plurality of semiconductor chip packages 10, and when viewed from the normal direction of the package mounting surface 6b, a plurality of refrigerant paths 7 overlapping in the normal direction are arranged between a pair of adjacent protrusions 35. According to this configuration, by arranging the multiple coolant paths 7 overlapping in the normal direction between a pair of adjacent protrusions 35, the multiple coolant paths 7 can effectively cool the semiconductor chip packages 10 arranged on each of the pair of protrusions 35. By overlapping the multiple coolant paths 7 in the normal direction of the package mounting surface 6b, the arrangement space for the coolant paths 7 as viewed from the normal direction can be reduced while arranging the multiple coolant paths 7. Therefore, while arranging the coolant paths 7 so as not to overlap the protrusions 35, the gap between the adjacent protrusions 35 can be prevented from widening, and the multiple protrusions 35 and the semiconductor chip packages 10 can be arranged compactly.

[0047] In the semiconductor module 1 of the embodiment, the semiconductor chip package 10 comprises a semiconductor chip 2 and a metal case 11 that houses the semiconductor chip 2, and an insulating sealing material 18 for insulating the semiconductor chip 2 is enclosed within the metal case 11. According to this configuration, the semiconductor chip 2 is housed in the metal case 11, which reduces the impact on the outside in the event of damage to the semiconductor chip 2, and by sealing the metal case 11 with insulating sealing material 18, the semiconductor chip 2 can be reliably insulated.

[0048] In the semiconductor module 1 of the embodiment, the metal case 11 has an opening 10b at a portion facing the package mounting surface 6b of the cooler 6, which allows the convex portion 35 to pass through and be joined to the collector side of the semiconductor chip 2, and a side opening 15 at a side portion along the normal direction of the package mounting surface 6b, which allows the output terminal 20 extending from the emitter side of the semiconductor chip 2 to pass through. The cooler 6, together with a side wall 9 standing in the normal direction on the outer periphery side of the package mounting surface 6b, forms a case main body 5a of the module case 5 that houses the semiconductor chip package 10. The case opening 5b on the opposite side of the cooler 6 in the normal direction in the case main body 5a is closed by a top plate 8. The output terminal 20 protrudes outside the metal case 11, extends to the opposite side of the cooler 6 in the normal direction, and is joined to the top plate 8. According to this configuration, the protrusion 35 of the cooler 6 can be joined to the collector side of the semiconductor chip 2 through the opening 10b facing the package mounting surface 6b in the metal case 11. The emitter-side output terminal 20 of the semiconductor chip package 10 can be joined to the top plate 8 of the module case 5 through a side opening 15 in the metal case 11 that is approximately perpendicular to the opening 10b.

[0049] In the semiconductor module 1 of the embodiment, an intermediate member 35 having thermal conductivity and electrical conductivity is arranged between the semiconductor chip package 10 and the convex portion 35 in the normal direction of the package mounting surface 6b, and the semiconductor chip package 10 and the cooler 6 are fastened with a bolt 19 along the normal direction of the package mounting surface 6b. According to this configuration, by interposing the intermediate member 35 having thermal conductivity and electrical conductivity between the semiconductor chip package 10 and the protruding portion 35, the thermal conductivity and electrical conductivity between the semiconductor chip package 10 and the protruding portion 35 are ensured. This improves the cooling performance of the semiconductor chip package 10 and allows the cooler 6 to be used as a collector terminal of the semiconductor module 1. Even if the intermediate member 35 is interposed between the semiconductor chip package 10 and the protruding portion 35, the semiconductor chip package 10 and the protruding portion 35 can be reliably joined by fastening the bolts 19 along the normal direction.

[0050] According to at least one of the embodiments described above, by having the semiconductor chip package 10 and the cooler 6, it is possible to suppress the occurrence of excessive stress in the coolant path 7 even when the semiconductor element 2 is broken due to short circuit or the like. When the semiconductor element 2 is broken, the load input to the cooler side via the protrusion 35 is maximum in the region (directly below region) that overlaps with the protrusion 35 in the normal direction of the package mounting surface 6b. By arranging the coolant path 7 so as to avoid this direct below region, it is possible to suppress the occurrence of stress in the coolant path 7.

[0051] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope of the invention and its equivalents described in the claims, as well as in the scope and spirit of the invention.

[0052] (Appendix 1) a semiconductor chip package in which metal electrodes are bonded to each of a collector side and an emitter side of a semiconductor chip; a cooler disposed on the collector side of the semiconductor chip package, the cooler includes a protrusion on a package mounting surface on which the semiconductor chip package is mounted, the protrusion being joined to the collector side of the semiconductor chip package; A coolant passage through which a coolant flows is formed inside the cooler, the cooling passage is disposed so as not to overlap the protrusion when viewed from a normal direction of the package mounting surface.

[0053] (Appendix 2) A plurality of the semiconductor chip packages are provided, the cooler includes a plurality of the protrusions corresponding to the plurality of semiconductor chip packages; 2. The semiconductor module according to claim 1, wherein a single cooling path is disposed between a pair of adjacent protrusions when viewed from the normal direction of the package mounting surface.

[0054] (Appendix 3) The plurality of semiconductor chip packages form a package row in which the plurality of semiconductor chip packages are aligned in a first direction when viewed from a normal direction of the package mounting surface, and the package rows are arranged side by side in a second direction intersecting the first direction, 3. The semiconductor module according to claim 2, wherein a single cooling path is disposed between a pair of adjacent package rows when viewed from the normal direction of the package mounting surface.

[0055] (Appendix 4) the coolant passage extends in the first direction along the row of packages and has an end portion reaching an area on the outer side in the first direction than an end portion of the row of packages in the first direction; 4. The semiconductor module of claim 3, wherein the end of the coolant path is bent in the first direction in the outer region and connected to an end of another adjacent coolant path in the second direction.

[0056] (Appendix 5) 4. The semiconductor module of claim 3, wherein the coolant path extends in the first direction along the package row and reaches an outer surface of the cooler without connecting to other adjacent coolant paths in the second direction.

[0057] (Appendix 6) A plurality of the semiconductor chip packages are provided, the cooler includes a plurality of protrusions corresponding to the plurality of semiconductor chip packages; A semiconductor module described in any one of appendix 1 to 5, wherein, when viewed from the normal direction of the package mounting surface, a plurality of coolant paths overlapping in the normal direction are arranged between a pair of adjacent protrusions.

[0058] (Appendix 7) the semiconductor chip package includes the semiconductor chip and a metal case that houses the semiconductor chip; 7. The semiconductor module according to claim 1, wherein an insulating sealant for insulating the semiconductor chip is enclosed within the metal case.

[0059] (Appendix 8) the metal case has an opening at a portion of the cooler facing the package mounting surface through which the protrusion can pass to be joined to the collector side of the semiconductor chip, and a side opening at a side portion along a normal direction to the package mounting surface through which an output terminal extending from the emitter side of the semiconductor chip can pass; the cooler, together with a side wall rising in the normal direction on the outer periphery side of the package mounting surface, forms a case body of a module case that houses the semiconductor chip package, a case opening portion on a side opposite to the cooler in the normal direction in the case body is closed by a top plate; 8. The semiconductor module according to claim 7, wherein the output terminal protrudes outside the metal case, extends opposite the cooler in the normal direction, and is joined to the top plate.

[0060] (Appendix 9) an intermediate member having thermal conductivity and electrical conductivity is disposed between the semiconductor chip package and the protruding portion in a normal direction of the package mounting surface; 9. The semiconductor module according to claim 1, wherein the semiconductor chip package and the cooler are fastened with a bolt along the normal direction of the package mounting surface. [Explanation of symbols]

[0061] 1...semiconductor module, 2...semiconductor element, 5...module case, 5a...case body, 5b...upper opening (case opening), 6...cooler, 6b...package mounting surface, 6c...outer area (outer area), 7...water-cooled pipe (coolant path), 7b...inter-row water-cooled pipe (single coolant path), 7d...serpentine water-cooled pipe (series water-cooled pipe), 7e...parallel water-cooled pipe, 7f...two-stage water-cooled pipe, 8...top plate, 9...side wall, 10...semiconductor chip package, 11...metal case, 15...side opening, 16...lower opening, 19...mounting screw (bolt), 20...emitter conductor (metal electrode, output terminal), 30...collector conductor (metal electrode), 35...projection, 35a...thermal conductive sheet (intermediate member)

Claims

1. a semiconductor chip package in which metal electrodes are bonded to each of a collector side and an emitter side of a semiconductor chip; a cooler disposed on the collector side of the semiconductor chip package, the cooler includes a protrusion on a package mounting surface on which the semiconductor chip package is mounted, the protrusion being joined to the collector side of the semiconductor chip package; A coolant passage through which a coolant flows is formed inside the cooler, the cooling passage is disposed so as not to overlap the protrusion when viewed from a normal direction of the package mounting surface.

2. A plurality of the semiconductor chip packages are provided, the cooler includes a plurality of the protrusions corresponding to the plurality of semiconductor chip packages; 2. The semiconductor module according to claim 1, wherein a single cooling path is disposed between a pair of adjacent protrusions when viewed from a normal direction of the package mounting surface.

3. The plurality of semiconductor chip packages form a package row in which the plurality of semiconductor chip packages are aligned in a first direction when viewed from a normal direction of the package mounting surface, and the plurality of package rows are arranged side by side in a second direction intersecting the first direction, 3. The semiconductor module according to claim 2, wherein a single cooling path is disposed between a pair of adjacent package rows when viewed from a normal direction of the package mounting surface.

4. the coolant passage extends in the first direction along the row of packages and has an end portion reaching an area on the outside in the first direction relative to an end portion of the row of packages; 4. The semiconductor module according to claim 3, wherein the end of the coolant path changes so as to turn back in the first direction in the outer region and is connected to an end of another coolant path adjacent in the second direction.

5. 4. The semiconductor module according to claim 3, wherein the coolant path extends in the first direction along the row of packages and reaches an outer surface of the cooler without connecting to other coolant paths adjacent thereto in the second direction.

6. A plurality of the semiconductor chip packages are provided, the cooler includes a plurality of protrusions corresponding to the plurality of semiconductor chip packages; 2. The semiconductor module according to claim 1, wherein a plurality of cooling paths overlapping in the normal direction are arranged between a pair of adjacent protrusions when viewed in the normal direction of the package mounting surface.

7. the semiconductor chip package includes the semiconductor chip and a metal case that houses the semiconductor chip; 7. The semiconductor module according to claim 1, wherein an insulating sealant for insulating the semiconductor chip is filled in the metal case.

8. the metal case has an opening at a portion of the cooler facing the package mounting surface through which the protrusion can pass to be joined to the collector side of the semiconductor chip, and a side opening at a side portion along a normal direction to the package mounting surface through which an output terminal extending from the emitter side of the semiconductor chip can pass; the cooler, together with a side wall rising in the normal direction on the outer periphery side of the package mounting surface, forms a case body of a module case that houses the semiconductor chip package, a case opening portion on a side opposite to the cooler in the normal direction in the case body is closed by a top plate; The semiconductor module according to claim 7 , wherein the output terminal protrudes outside the metal case, extends to a side opposite the cooler in the normal direction, and is joined to the top plate.

9. an intermediate member having thermal conductivity and electrical conductivity is disposed between the semiconductor chip package and the protruding portion in a normal direction of the package mounting surface; 2. The semiconductor module according to claim 1, wherein the semiconductor chip package and the cooler are fastened together by bolts extending along the normal direction of the package mounting surface.

Images