Transparent solder mask protective film, method for manufacturing the same, and method for using the same

Abstract

To provide a transparent solder mask protective film, a method for manufacturing the same, and a method for using the same.SOLUTION: A transparent solder mask protective film 100 includes a first film layer 1, a second film layer 2, and a release film material 3. The first film layer is a film layer of a polyester group. The second film layer is a pressure-sensitive adhesive film layer. The release film material contains a release base film 31 and a release coating 32. The release coating is installed between the release base film and the second film layer, and the release coating is directly stuck to the second film layer. The release base film is a polyester release film. The release coating contains a silicon resin material and a plurality of inorganic particles. The surface of the release coating shows appearance having nonuniform unevenness due to the inorganic particles. After the release coating is separated from the second film layer, the surface of the second film layer forms an uneven fine structure.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a protective film, and more particularly to a transparent solder mask protective film, its manufacturing method and its use. [Background technology]

[0002] In the existing technology, the line width of the circuit arrangement on the carrier plate of the integrated circuit (IC) is very fine, the distance between the lines is very narrow, and the resolution is high. Therefore, when the IC carrier plate is used in high-frequency products, the requirements for product reliability are very high, and the quality of the encapsulation process has a significant impact on the product value.

[0003] The solder mask formed on the IC carrier board comes into contact with the encapsulant, and the adhesion between the solder mask and the encapsulant affects the reliability and quality of the IC carrier board.

[0004] By adjusting the appearance of the solder mask surface, the adhesion between the solder mask and the encapsulant can be kept good, ensuring the performance of the IC carrier plate. However, the surface shape of the solder mask is determined during the processing process by the transparent solder mask protection film that is mainly attached to the surface of the solder mask during exposure. With the existing transparent solder mask protection film technology, it is not possible to precisely control the appearance of the solder mask surface, resulting in insufficient reliability and quality of the IC carrier plate (for example, insufficient adhesion or prone to blister problems).

[0005] Therefore, the inventor felt that the above shortcomings could be improved, and after extensive research and application of scientific principles, finally came up with the present invention, which is rational in design and effectively improves the above shortcomings. Summary of the Invention [Problem to be solved by the invention]

[0006] The technical problem to be solved by the present invention is to provide a transparent solder mask protection film for IC carrier board, its manufacturing method and its use method, in order to improve the deficiencies of the existing technology. [Means for solving the problem]

[0007] In order to solve the above technical problems, one of the technical means adopted by the present invention is to provide a transparent solder mask protective film. The transparent solder mask protective film includes a first film layer, a second film layer, a release film material, and a release coating. The first film layer is a polyester base film layer. The second film layer is formed on one surface of the first film layer, and the second film layer is a pressure-sensitive adhesive film layer. The release film material is formed on one surface of the second film layer away from the first film layer. The release film material includes a release base film and a release coating. The release coating is disposed between the release base film and the second film layer. The release coating is directly attached to the surface of the second film layer away from the first film layer. Among them, the release base film is a polyester release film. The release coating includes a silicone resin material and a large number of inorganic particles dispersed in the silicone resin material. The inorganic particles cause the surface of the release coating facing away from the release base film to have an uneven appearance, which can be transferred to the surface of the second film layer that is attached to the release coating. After the release film material separates from the second film layer through the release coating, an uneven microstructure is formed on the surface of the second film layer facing away from the first film layer.

[0008] Preferably, the first film layer has a first thickness of 5 μm to 20 μm, the second film layer has a second thickness of 3 μm to 18 μm, the release base film has a third thickness of 15 μm to 35 μm, and the release coating has a fourth thickness of 0.1 μm to 1.0 μm.

[0009] Preferably, the plurality of inorganic particles has an average particle size of 0.001 μm to 1.0 μm.

[0010] Preferably, the ratio of said fourth thickness of said release coating to said average particle size of said inorganic particles is between 5 and 20.

[0011] Preferably, the inorganic particles are at least partially exposed on the surface of the release coating facing away from the release base film, such that the surface of the release coating facing away from the release base film exhibits the uneven appearance.

[0012] Preferably, the silicone resin material is at least one selected from the group consisting of methyl silicone resin, methylphenyl silicone resin, ethylene silicone resin, methylethylene silicone resin, amino silicone resin, epoxy modified silicone resin, and derivatives of the above materials. The inorganic particles are, for example, at least one selected from the group consisting of silicon dioxide, calcium carbonate, calcium phosphate, barium sulfate, kaolin, talc, glass powder, and derivatives of the above materials.

[0013] Preferably, the release coating is formed by applying a release coating material to the release base film and drying the solvent in the coating material. The release coating material includes the silicone resin material, the inorganic particles, an additive, and the solvent. The silicone resin material, the inorganic particles, and the additive are solid components in the release coating material. In the release coating, the total weight of the silicone resin material and the inorganic particles accounts for at least 80% of the weight of the solid components. Here, the weight ratio of the silicone resin material and the inorganic particles is 0.3 to 1.1.

[0014] Preferably, the second film layer has a glass transition temperature of -50°C to 50°C.

[0015] In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a method for manufacturing a transparent solder mask protective film. The method for manufacturing a transparent solder mask protective film includes the following processes: Provide a first film layer and a second film layer formed on one surface of the first film layer. Here, the first film layer is a polyester base film layer, and the second film layer is a pressure-sensitive adhesive film layer. Provide a release film material. The release film material includes a release base film and a release coating formed on one surface of the release base film. Here, the release coating faces the second film layer. In addition, the release base film is a polyester release film, and the release coating is a silicone resin coating, in which a plurality of inorganic particles are dispersed. Due to the plurality of inorganic particles, the surface of the release coating away from the release base film has an uneven appearance. The release coating of the release film material is attached to a surface of the second film layer away from the first film layer to complete the manufacture of the transparent solder mask protection film, in particular, after the release film material is separated from the second film layer via the release coating, a textured microstructure is formed on the surface of the second film layer away from the first film layer.

[0016] In order to solve the above technical problem, another technical solution adopted by the present invention provides a method for using a transparent solder mask protective film. The method for using a transparent solder mask protective film is as follows: Provide a transparent solder mask protective film as described above. The release film material is separated from the second film layer via the release coating, thereby forming the uneven microstructure on the surface of the second film layer away from the first film layer. Provide a circuit carrier board. The circuit carrier board includes a circuit board and a solder mask formed on the circuit board. The uneven microstructure on the surface of the second film layer is closely attached to the solder mask, so that the uneven microstructure is transferred to the surface of the one side away from the circuit board. The hardness of the material of the second film layer is higher than that of the solder mask. The first film layer and the second film layer are removed from the solder mask of the circuit carrier board, so that a transferred rough surface is formed on the surface of the solder mask away from the circuit board. The arithmetic mean roughness (Ra) of the rough surface is 0.01 to 0.5 nanometers. Effect of the Invention

[0017] The beneficial effects of the present invention are that through the transparent solder mask protective film provided by the present invention, the surface appearance of the solder mask on the circuit carrier board can be effectively controlled by the material design of the release coating and pressure-sensitive adhesive film layer, so that the reliability and quality of the circuit carrier board can be greatly improved, and the adhesion between the solder mask and the encapsulant can be effectively improved, and the blister problem can be effectively prevented.

[0018] In order to make the features and technical contents of the present invention more readily apparent, reference is made to the following detailed description of the present invention and the accompanying drawings, which are provided for reference and explanation only and are not intended to limit the scope of the present invention. [Brief description of the drawings]

[0019] [Figure 1]1 is a schematic diagram of a laminated structure of a transparent solder mask protection film according to an embodiment of the present invention. [Figure 2A] 13 is a configuration example of step S110 in the manufacturing method of the transparent solder mask protection film according to the embodiment of the present invention. [Figure 2B] 13 is a configuration example of step S120 in the manufacturing method of the transparent solder mask protection film according to the embodiment of the present invention. [Figure 3A] 13 is a configuration example of step S210 of a method for using a transparent solder mask protection film according to an embodiment of the present invention. [Figure 3B] 13 is a configuration example of step S220 of a method for using a transparent solder mask protection film according to an embodiment of the present invention. [Figure 3C] 13 is a configuration example of step S230 of a method for using a transparent solder mask protection film according to an embodiment of the present invention. [Figure 3D] 13 is a configuration example of step S240 of a method for using a transparent solder mask protection film according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The following describes the embodiments disclosed in the present invention through specific specific examples, so that those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification.

[0021] The present invention can be implemented or applied by other different specific embodiments, and each detail in this specification can be modified and changed in various ways based on different perspectives and applications without departing from the concept of the present invention.

[0022] In addition, it is hereby expressly stated that the drawings of the present invention are merely illustrative and are not drawn to scale. The following embodiments will further describe the technical content related to the present invention, but the disclosure does not limit the scope of the present invention.

[0023] It should be understood that although terms such as "first," "second," and "third" may be used in the text to describe various materials or parameters, these materials and parameters should not be constrained by these terms, and these terms are primarily used to distinguish one material from another material or one parameter from another parameter.

[0024] Furthermore, the term "or" as used herein should be construed as including any one or more combination of the relevant listed items, depending on the actual circumstances.

[0025] [Transparent solder mask protection film] Please refer to Fig. 1. An embodiment of the present invention provides a transparent solder mask protection film 100. The transparent solder mask protection film 100 can be used as a transparent solder mask protection film in the manufacturing process of an integrated circuit (IC) carrier board, for example.

[0026] For example, after the solder mask is applied to the circuit carrier board, a transparent solder mask protection film can be further applied on the solder mask. The transparent solder mask protection film applied to the solder mask does not need to be peeled off, and can be directly exposed. By removing the transparent solder mask protection film before the solder mask is developed, the process time can be greatly shortened and the oxidation resistance of the solder mask can be realized. However, the use method of the transparent solder mask protection film 100 of the present invention is not limited thereto.

[0027] It is worth noting that the transparent solder mask protection film provided by the embodiment of the present invention can effectively adjust the appearance of the solder mask surface, and can greatly improve the reliability and quality of the circuit carrier board.

[0028] The transparent solder mask protection film 100 includes a first film layer 1, a second film layer 2, and a release film material 3, which are laminated in this order from top to bottom.

[0029] The first film layer 1 is a polyester-based film layer. In a more preferred example, the first film layer 1 is a polyester-based film layer formed from polyethylene terephthalate (PET).

[0030] The first film layer 1 has a first thickness T1, which is 5 μm to 20 μm, preferably 10 μm to 15 μm. For example, the first thickness T1 of the first film layer 1 can be 10 μm, 12 μm, or 14 μm, but the present invention is not limited thereto.

[0031] The second film layer 2 is formed on one surface of the first film layer 1. The second film layer 2 is a pressure-sensitive adhesive film layer (also called an optical adhesive film layer). The second film layer 2 is preferably a pressure-sensitive adhesive film layer formed from an OCA pressure-sensitive adhesive (optical clear adhesive). In one embodiment of the present invention, the OCA pressure-sensitive adhesive can be, for example, an acrylic pressure-sensitive adhesive (also called an acrylic ester pressure-sensitive adhesive).

[0032] The second film layer 2 has a second thickness T2, which is between 3 μm and 18 μm, preferably between 8 μm and 13 μm, and can be, but is not limited to, 8 μm or 10 μm.

[0033] The release film material 3 is formed on one surface of the second film layer 2 that faces away from the first film layer 1. The release film material 3 includes a release base film 31 and a release coating 32 formed on one surface of the release base film 31. The release coating 32 is disposed between the release base film 31 and the second film layer 2, and the release coating 32 is directly attached to one surface of the second film layer 2 that faces away from the first film layer 1.

[0034] The release base film 31 is a polyester release film. More preferably, the release base film 31 is a polyester release film made of polyethylene terephthalate (PET).

[0035] The release base film 31 has a third thickness T3, which is 15 μm to 35 μm, and preferably 20 μm to 30 μm. For example, the third thickness T3 of the release base film 31 can be 21 μm, 25 μm, 29 μm, etc., but the present invention is not limited thereto.

[0036] More preferably, the release coating 32 is formed on the one surface of the release base film 31 by a wet coating method.

[0037] The release coating 32 is a silicone resin coating having a plurality of inorganic particles 321 dispersed therein. Specifically, the release coating 32 includes a silicone resin material and a plurality of inorganic particles 321 dispersed in the silicone resin material.

[0038] The inorganic particles 321 are arranged such that the surface of the release coating 32 facing away from the release base film 31 has an uneven appearance, and the uneven appearance can be transferred to the surface of the second film layer 2 to which the release coating 32 is attached. After the release film material 3 is separated from the second film layer 2 via the release coating 32 (see FIG. 3A), a transferred uneven microstructure 21 is formed on the surface of the second film layer 2 facing away from the first film layer 1 (see FIG. 3B).

[0039] In one embodiment of the present invention, a plurality of the inorganic particles 321 are at least partially exposed on the surface of the release coating 32 facing away from the release base film 31, thereby causing the surface of the release coating 32 facing away from the release base film 31 to exhibit the appearance of unevenness.

[0040] The release coating 32 has a fourth thickness T4, which is 0.1 μm to 1.0 μm, preferably 0.3 μm to 0.8 μm, and can be, for example, but not limited to, 0.3 μm or 0.5 μm.

[0041] Furthermore, the inorganic particles 321 have an average particle diameter D, which may be 0.001 μm to 1.0 μm, preferably 0.03 μm to 0.1 μm, and particularly preferably 0.03 μm to 0.07 μm, for example, 0.03 μm, 0.04 μm, or 0.05 μm, but is not limited thereto.

[0042] It should be particularly noted that the average particle size D of the inorganic particles 321 in the embodiment of the present invention is defined by D50, that is, the particle size when the cumulative fine particle distribution percentage of the inorganic particles reaches 50%. The physical meaning of D50 is that 50% of the particles have a particle size larger than this average particle size value, and 50% of the particles have a particle size smaller than this average particle size value.

[0043] It is particularly noteworthy that in some embodiments of the present invention, the ratio of the fourth thickness T4 of the release coating 32 to the average particle size D of the inorganic particles 321 is preferably 5 to 20, and particularly preferably 8 to 18. For example, the ratio may be 10, 12.5, or 16.6, but the present invention is not limited thereto.

[0044] Regarding the type of material, the silicone resin material may be, for example, polysiloxane. More specifically, the silicone resin material is at least one selected from the group consisting of methyl silicone resin, methyl phenyl silicone resin, ethylene silicone resin, methyl ethylene silicone resin, amino silicone resin, epoxy modified silicone resin, and derivatives of the above materials.

[0045] In one embodiment of the present invention, the silicone resin material is, for example, polydimethylsiloxane (PDMS), but the present invention is not limited thereto.

[0046] The inorganic particles may be, for example, at least one selected from the group consisting of silicon dioxide (SiO2), calcium carbonate (CaCO3), calcium phosphate (Ca3(PO4)2), barium sulfate (BaSO4), kaolinite (Al2Si2O5(OH)4), talc (Mg3Si4O10(OH)2), glass powder, and derivatives of the above materials. In one embodiment of the present invention, the inorganic particles are, for example, silicon dioxide, but the present invention is not limited thereto.

[0047] The material hardness of the inorganic particles 321 is greater than that of the silicone resin material and is also greater than that of the second film layer 2 (pressure-sensitive adhesive film layer).

[0048] Therefore, the uneven appearance formed on the surface of the release coating 32 by the multiple inorganic particles 321 can be transferred to the surface of the second film layer 2 (pressure-sensitive adhesive film layer) facing away from the first film layer 1 (polyester base film layer).

[0049] As described above, the release coating 32 is preferably formed by a wet coating method on one surface of the release base film 31. In this embodiment, the release coating 32 is formed by applying a release paint to the release base film 31 and drying the solvent in the paint. That is, the release paint is in a fluid state, and the release coating 32 is formed after the solvent dries.

[0050] Specifically, the release paint contains the silicone resin material, the inorganic particles, an additive, and a solvent.

[0051] In terms of the range of content, when the total weight of the release coating is 100 parts by weight, the amount of the silicone resin material used is 1 to 15 parts by weight, preferably 3 to 8 parts by weight, and particularly preferably 4.5 to 6.5 parts by weight. The amount of the inorganic particles used is 1 to 15 parts by weight, preferably 5 to 11 parts by weight, and particularly preferably 7 to 9 parts by weight.

[0052] The amount of the additive used is 0.5 to 5 parts by weight, preferably 1 to 5 parts by weight, and more preferably 1 to 3 parts by weight, and the amount of the solvent used is 65 to 97.5 parts by weight, preferably 75 to 95 parts by weight, and more preferably 80 to 90 parts by weight.

[0053] Here, the silicone resin material, inorganic particles, and additives are solid components in the release coating, and the solvent is a liquid component in the release coating. After the release coating dries, most of the solvent is removed, and the solid components are mainly left to form the release coating 32.

[0054] From another perspective, in the release coating 32, the total weight of the silicone resin material and the inorganic particles accounts for at least 80% by weight of all solid components, and preferably at least 88%.

[0055] The weight ratio of the silicone resin material to the inorganic particles is, for example, in the range of 0.3 to 1.1, preferably in the range of 0.4 to 1.0, and more preferably in the range of 0.5 to 0.95.

[0056] Furthermore, the types of materials of the silicon resin material and inorganic particles are as described above and will not be described in detail here. The additive can be, for example, a metal catalyst, such as a bismuth catalyst, a platinum catalyst or a tin catalyst. Or, the additive can be a modified silica. The solvent can be, for example, at least one selected from a group of materials consisting of toluene, xylene, acetone, methyl ethyl ketone and isopropyl alcohol.

[0057] It is worth noting that the second film layer 2 (pressure-sensitive adhesive film layer) is made of acrylic resin. The second film layer 2 is completely adhered to the release coating 32. The hardness and softness of the second film layer 2 directly affect the shape and appearance of the appearance transferred to its surface.

[0058] In some embodiments of the present invention, the glass transition temperature (Tg) of the second film layer 2 (pressure-sensitive adhesive film layer) is −50° C. to 50° C., preferably −5° C. to 20° C., and particularly preferably 0° C. to 10° C., so that the second film layer 2 can have appropriate hardness and softness and can achieve a better transfer effect.

[0059] It is also worth noting that in the transparent solder mask protection film 100 of the embodiment of the present invention, the elements that have the greatest impact on the appearance of the subsequent solder mask on the IC circuit carrier board are the silicone resin release coating and the pressure-sensitive adhesive film layer, where the average particle size of the inorganic particles, the amount added, the ratio of the coating thickness to the average particle size, and the hardness and softness of the pressure-sensitive adhesive film layer are the main elements that affect the appearance of the above-mentioned solder mask.

[0060] The present invention adjusts the appearance of the surface of the solder mask on the IC circuit carrier board through the transparent solder mask protection film 100, and ensures the adhesion between the solder mask and the encapsulant to ensure the performance of the IC carrier board. The surface shape of the solder mask is mainly determined by the transparent solder mask protection film 100.

[0061] In addition, in the present invention, the appearance of the silicone resin release coating is controlled by a wet coating process, and the silicone resin release coating is then adhered closely to the pressure-sensitive adhesive film layer, so that the pattern transferred by the pressure-sensitive adhesive film layer can also be consistent.

[0062] Based on the above-mentioned configuration, the transparent solder mask protective film provided by the embodiment of the present invention can effectively adjust the shape and appearance of the surface of the solder mask, so as to improve the reliability and quality of the circuit carrier board, improve the adhesion between the solder mask and the packaging adhesive, and effectively avoid the blister problem.

[0063] [Manufacturing method of transparent solder mask protection film] The above is a description of the structural and material characteristics of the transparent solder mask protection film according to the embodiment of the present invention. Below, a method for manufacturing the transparent solder mask protection film according to the embodiment of the present invention will be described.

[0064] Please refer to Figures 2A and 2B. The embodiment of the present invention also provides a method for manufacturing a transparent solder mask protection film, which includes steps S110 and S120. It should be noted that the order of each step and the actual operation method described in this embodiment can be adjusted as needed and are not limited to this embodiment. Furthermore, the transparent solder mask protection film in the embodiment of the present invention can be completed through the above manufacturing method, but is not limited thereto.

[0065] 2A, the step S110 includes providing a first film layer 1 and a second film layer 2 formed on one surface (e.g., the lower surface) of the first film layer 1. The first film layer 1 is a polyester base film layer, and the second film layer 2 is a pressure-sensitive adhesive film layer.

[0066] Step S110 also includes providing a release film material 3, which includes a release base film 31 and a release coating 32 formed on one surface (e.g., upper surface) of the release base film 31. The release coating 32 faces the second film layer 2 (pressure-sensitive adhesive film layer).

[0067] The release base film 31 is a polyester release film. The release coating 32 is formed on the side surface of the release base film 31 by a wet coating method. The release coating 32 is a silicone resin coating having a plurality of inorganic particles 321 dispersed therein. In particular, the inorganic particles 321 are arranged such that the surface of the release coating 32 facing away from the release base film 31 has an uneven appearance.

[0068] As shown in FIG. 2B, step S120 includes bonding the release coating 32 (silicone resin coating) of the release film material 3 with the surface of one side of the second film layer 2 (pressure-sensitive adhesive film layer) facing away from the first film layer 1 (polyester base film layer), thereby completing the manufacture of a transparent solder mask protective film, and the uneven appearance on the surface of the release coating 32 is transferred to the bonding surface between the second film layer 2 and the release coating 32.

[0069] After the release coating 32 and the second film layer 2 are separated (see Figure 3A), a transferred uneven microstructure 21 is formed on the surface of the second film layer 2 facing away from the first film layer 1 (see Figure 3B).

[0070] [How to use transparent solder mask protection film] Please refer to Figures 3A to 3D. The embodiment of the present invention also provides a method for using the transparent solder mask protection film, which includes steps S210 to S240. It should be noted that the order of each step and the actual operation method described in this embodiment can be adjusted as needed and are not limited to this embodiment. Furthermore, the transparent solder mask protection film of the embodiment of the present invention can be used through the above-mentioned method, but is not limited thereto.

[0071] As shown in Fig. 3A, the step S210 includes the following process: providing the transparent solder mask protective film 100, which includes the first film layer 1 (polyester base film layer), the second film layer 2 (pressure-sensitive adhesive film layer), and the release film material 3 (including polyester release film 31 and release coating 32) stacked from top to bottom; and separating the release film material 3 from the second film layer 2 through the release coating 32, so that the transferred uneven microstructure 21 is formed on the surface of the second film layer 2 away from the first film layer 1.

[0072] As shown in Fig. 3B, step S220 includes the following process: provide a circuit carrier board B, which includes a circuit board B1 and a solder mask B2 formed on one surface (e.g., upper surface) of the circuit board B1; and place the concave-convex microstructure 21 on the surface of the second film layer 2 facing the solder mask B2. The circuit board B1 is, for example, a copper layer circuit board, and the solder mask B2 can be formed on the one surface of the circuit board B1 by, for example, coating.

[0073] As shown in Fig. 3C, the step S230 includes the following process: the concave-convex microstructure 21 on the surface of the second film layer 2 is closely attached to the solder mask B2, so that the concave-convex microstructure 21 is transferred to the surface of the solder mask B2 away from the circuit board B1. The hardness of the material of the second film layer is higher than that of the solder mask. The step S230 also includes performing an exposure process on the solder mask B2 without removing the first film layer 1 (polyester base film layer) and the second film layer 2 (pressure-sensitive adhesive film layer).

[0074] 3D, the step S240 includes, after completing the exposure process, removing the first film layer 1 and the second film layer 2 from the solder mask B2 of the circuit carrier board B. Thus, a rough surface Ra formed by transfer is obtained on one surface of the solder mask B2 facing away from the circuit board B1, and its arithmetic mean roughness (Ra) is 0.01-0.5 nm, preferably 0.05-0.1 nm.

[0075] [Experimental data and test results] The present invention will be described in detail below with reference to Examples 1 to 3 and Comparative Examples 1 and 2. However, the following examples are provided to aid in understanding the present invention, and the scope of the present invention is not limited to these examples. Here, Examples 1 to 3 are combinations that support the technical effects of the present invention, and Comparative Examples 1 to 2 are combinations that have inferior technical effects.

[0076] Example 1: A transparent solder mask protective film was prepared according to the conditions in Table 1 below. The transparent solder mask protective film included a first film layer (PET base film layer), a second film layer (OCA adhesive film layer), and a release film material (silicon resin coating and PET release base film) stacked in order. The thickness conditions of each layer were as shown in Table 1. The OCA glass transition temperature of the second film layer was 0°C. The silicone resin release coating was applied onto the PET release base film by a wet coating method. The formulation of the release paint was as shown in Table 1, which included 6.5 parts by weight of silicone resin (polydimethylsiloxane), 7 parts by weight of inorganic particles (silicon dioxide), 1.5 parts by weight of additive (fluoro-modified siloxane), and 85 parts by weight of solvent (toluene / acetone, volume ratio 1:1). Here, the particle size of the inorganic particles was 0.03 μm. The weight ratio of silicone resin / inorganic particles was 6.5 / 7.0=0.93. The ratio of coating thickness to inorganic particle diameter was 0.5 / 0.03=16.6.

[0077] Then, the solvent component of the release coating was removed to form the silicone resin release coating. The silicone resin release coating was directly laminated to the second film layer (OCA adhesive film layer). Next, the release film material of the transparent solder mask protection film was separated from the second film layer (OCA adhesive film layer) via the silicone resin release coating, so that the second film layer (OCA adhesive film layer) was formed with a concave-convex microstructure. Next, according to the method of use based on the above-mentioned embodiment, a rough surface with the concave-convex microstructure transferred to the surface of the solder mask of the circuit carrier board was formed. Finally, the physical properties of the solder mask were tested, including the surface gloss (GU) of the solder mask, the surface roughness (nanometers) of the solder mask, and whether the surface of the solder mask had a grainy feel.

[0078] The manufacturing methods of Examples 2-3 and Comparative Examples 1-2 are the same as those of Example 1, and the differences are the transition temperature of OCA glass, the thickness of silicone resin release coating, and / or the formulation of silicone resin coating. The detailed parameter differences are shown in Table 1 and will not be described here.

[0079] [Table 1]

[0080] The surface glossiness (GU) of the solder mask is measured according to the ASTM D523 standard analysis method, using a gloss meter (manufacturer: BYK, model: mirco-TRI-gloss) to measure the glossiness at 60 degrees, recording three sets of readings in a measurement area of ​​75mm x 150mm, and taking the average value. The results are recorded in Table 1, and the unit is glossiness (Gloss Unit, GU).

[0081] The surface roughness (nanometers) of the solder mask is measured using a surface roughness meter in accordance with the JIS-B-0601 (2001) standard analysis method to determine the arithmetic mean roughness (Ra) of the solder mask surface.

[0082] Based on the measurement results in Table 1, it can be seen that the surface gloss of the solder masks of Examples 1 to 3 is at least 75GU or more, specifically between 78 to 82GU. In addition, the surface roughness (Ra) of the solder masks of Examples 1 to 3 is 0.05 to 0.1 nanometers, specifically 0.07 to 0.09 nanometers, and has a surface roughness in an appropriate numerical range. That is, the transparent solder mask protective film of Examples 1 to 3 can effectively adjust the shape and appearance of the surface of the solder mask, effectively improve the reliability and quality of the circuit carrier board, effectively improve the adhesion with the encapsulant in the subsequent encapsulation process, and further, can effectively avoid the blister problem.

[0083] Comparative Example 1 used a thinner silicone resin coating (only 0.1 μm thick), and the ratio of coating thickness / average particle size of inorganic particles was 3.33, which is smaller than the ideal range (5-20).

[0084] Comparative Example 2 used larger inorganic particles (particle size 0.12 μm), and the ratio of coating thickness / average particle size of inorganic particles was 4.16, which is smaller than the ideal range (5-20).

[0085] The surface gloss of the solder masks of Comparative Examples 1 and 2 is less than 75GU, specifically 70GU. The surface roughness of the solder masks of Comparative Examples 1 and 2 is greater than the range of 0.05-0.1 nanometers, specifically 0.12-0.15 nanometers. The test results of the surface physical properties of the solder masks of Comparative Examples 1 and 2 are somewhat inferior, so there is a possibility that some problems will occur in reliability and quality in the subsequent sealing process.

[0086] [Beneficial Effects of the Examples] The beneficial effect of the present invention is that the transparent solder mask protective film provided by the present invention can effectively adjust the uneven appearance of the solder mask surface, so as to improve the reliability and quality of the circuit carrier board, effectively improve the adhesion between the solder mask and the encapsulant, and effectively avoid the blister problem.

[0087] The contents disclosed above are merely preferred possible embodiments of the present invention, and do not limit the claims of the present invention. Therefore, all equivalent technical modifications made based on the contents of the specification and accompanying drawings of the present invention are intended to be included in the claims of the present invention. [Explanation of symbols]

[0088] 100: Transparent solder mask protection film 1: First film layer 2: Second film layer 21: Uneven microstructure 3: Release film material 31: Release base film 32: Release coating 321: Inorganic particles B: Circuit carrier board B1: Circuit board B2: Solder mask Ra: Rough surface T1: First thickness T2: Second thickness T3: Third thickness T4: The fourth thickness D: Average particle diameter

Claims

1. a first film layer which is a polyester base film layer; a second film layer formed on one surface of the first film layer, the second film layer being a pressure-sensitive adhesive film layer; a release film material formed on one surface of the second film layer away from the first film layer, the release film material including a release base film and a release coating disposed between the release base film and the second film layer, the release film material being directly bonded to the surface of the second film layer away from the first film layer; Equipped with The release base film is a polyester release film, the release coating comprises a silicone resin material and a plurality of inorganic particles dispersed in the silicone resin material, the plurality of inorganic particles cause the surface of the release coating away from the release base film to have an uneven appearance, and the uneven appearance can be transferred to the surface of the second film layer bonded to the release coating, and after the release film material is separated from the second film layer through the release coating, the surface of the second film layer away from the first film layer forms an uneven microstructure. A transparent solder mask protection film.

2. 2. The transparent solder mask protection film of claim 1, wherein the first film layer has a first thickness of 5 μm to 20 μm, the second film layer has a second thickness of 3 μm to 18 μm, the release base film has a third thickness of 15 μm to 35 μm, and the release coating has a fourth thickness of 0.1 μm to 1.0 μm.

3. 3. The transparent solder mask protection film of claim 2, wherein the inorganic particles have an average particle size of 0.001 μm to 1.0 μm.

4. 4. The transparent solder mask protection film of claim 3, wherein a ratio of said fourth thickness of said release coating to said average particle size of said inorganic particles is from 5 to 20.

5. 5. The transparent solder mask protection film of claim 4, wherein a plurality of said inorganic particles are at least partially exposed from said surface of said release coating facing away from said release base film, thereby causing said surface of said release coating facing away from said release base film to exhibit said uneven appearance.

6. 2. The transparent solder mask protective film of claim 1, wherein the silicone resin material is at least one selected from the group of materials consisting of methyl silicone resin, methylphenyl silicone resin, ethylene silicone resin, methylethylene silicone resin, amino silicone resin, epoxy modified silicone resin, and derivatives of the above materials, and the inorganic particles are at least one selected from the group of materials consisting of silicon oxide, calcium carbonate, calcium phosphate, barium sulfate, kaolin, talc, glass powder, and derivatives of the above materials.

7. 2. The transparent solder mask protective film of claim 1, wherein the release coating is formed by applying a release paint to the release base film and drying the solvent in the paint, the release paint includes the silicone resin material, the inorganic particles, an additive, and the solvent, the silicone resin material, the inorganic particles, and the additive are solid components in the release paint, the total weight of the silicone resin material and the inorganic particles in the release coating accounts for at least 80% of the solid components, and the weight ratio of the silicone resin material to the inorganic particles is 0.3 to 1.

1.

8. 2. The transparent solder mask protection film of claim 1, wherein the second film layer has a glass transition temperature of -50°C to 50°C.

9. providing a first film layer and a second film layer formed on one surface of the first film layer, the first film layer being a polyester base film layer and the second film layer being a pressure sensitive adhesive film layer; A release film material is provided, the release film material including the release base film and a release coating formed on one surface of the release base film, the release coating facing the second film layer, the release base film being a polyester release film, the release coating being a silicone resin coating, a plurality of inorganic particles being dispersed in the release coating, and the plurality of inorganic particles cause a surface of the release coating away from the release base film to have an uneven appearance, laminating the release coating of the release film material to a surface of the second film layer facing away from the first film layer to complete preparation of a transparent solder mask protection film; After the release film material is separated from the second film layer through the release coating, the uneven microstructure is formed on the surface of the second film layer that faces away from the first film layer. A method for producing a transparent solder mask protection film.

10. A transparent solder mask protection film according to claim 1 is provided, Separating the release film material from the second film layer through the release coating, and forming the uneven microstructure on the surface of the second film layer that faces away from the first film layer; providing a circuit carrier board including a circuit board and a solder mask formed on the circuit board; The uneven microstructure on the surface of the second film layer is brought into close contact with the solder mask, and the uneven microstructure is transferred to a surface of the solder mask on one side away from the circuit board, and the material hardness of the second film layer is greater than that of the solder mask; removing the first film layer and the second film layer from the solder mask of the circuit carrier board to form a transferred rough surface on the surface of the solder mask facing away from the circuit board, the rough surface having an arithmetic mean roughness (Ra) of 0.01 to 0.5 nanometers; A method for using a transparent solder mask protection film, comprising:

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