Capacitor device

Abstract

To provide a capacitor device in which the suppression of the inductance increase in a capacitor bus bar and the improvement of a heat dissipation property of a capacitor are both achieved.SOLUTION: A capacitor device 5 includes a capacitor 30, a capacitor bus bar 29, and a heat dissipation bus bar 26. The capacitor bus bar 29 has one end electrically connected to the capacitor and the other end electrically connected to an electric component, and extends in a direction where the capacitor and the electric component are arranged. The heat dissipation bus bar 26 has an end part provided at the capacitor bus bar so as not to exist on the capacitor bus bar with respect to a direction where the capacitor bus bar extends, and releases heat from the capacitor. Thus, the suppression of the inductance increase in a capacitor bus bar and the improvement of a heat dissipation property of a capacitor are both achieved.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The disclosure provided herein relates to a capacitor device. [Background technology]

[0002] Patent Document 1 describes a busbar having an electrode terminal portion, a connection terminal portion, and a relay terminal portion. The electrode terminal portion covers the end surface electrodes of the capacitor element from above. The electrode terminal portion is composed of a front plate portion, a rear plate portion, and a protruding portion that protrudes upward in a rectangular wave shape between them. Connection pins of the front plate portion and the rear plate portion are in contact with the end surface electrodes. The electrode terminal portion and the connection terminal portion are relayed by the relay terminal portion. The connection terminal portion is connected to an external terminal that is connected to a power supply device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 241145 Summary of the Invention [Problem to be solved by the invention]

[0004] According to the configuration of Patent Document 1, heat from the capacitor element is easily dissipated by the protruding portion. However, since the protruding portion is provided between the front plate portion and the rear plate portion in the direction in which the electrode terminal portion extends, the length of the current path of the electrode terminal portion becomes longer. Accordingly, the inductance of the electrode terminal portion increases. With the configuration of Patent Document 1, it was difficult to improve the heat dissipation of the capacitor element while suppressing the increase in inductance of the electrode terminal portion.

[0005] An object of the present disclosure is to provide a capacitor device that achieves both suppression of an increase in inductance of a capacitor bus bar and improvement of heat dissipation performance of the capacitor. [Means for solving the problem]

[0006] A capacitor device according to one aspect of the present disclosure comprises: A capacitor (30); A capacitor bus bar (19, 29) having one end connected to a capacitor and the other end connected to an electrical component (6), and extending in an arrangement direction (DP) in which the capacitors and the electrical components are arranged; a heat dissipation bus bar (26A, 26B, 316, 326) having an end portion on the condenser bus bar so as not to be interposed between the condenser bus bar in the arrangement direction, and dissipating heat from the condenser; a capacitor case (40) for housing a capacitor, a portion of the condenser bus bar, and a portion of the heat dissipation bus bar in an internal housing space (45); A case (80) for housing the capacitor case; A heat dissipation member (60) having a higher thermal conductivity than air, The case is the capacitor case being provided with a base (81); a wall (82) rising from the base in a thickness direction (TD) of the base in an annular shape; and a heat dissipation wall (86) connected to at least one of the base and the wall and having a hole (87) for accommodating a tip portion (26E, 316E, 326E) of a heat dissipation bus bar and a heat dissipation member; The heat dissipating member is in close contact with the inner wall surface (87A) that defines the hole in the heat dissipating wall and the tip portion.

[0007] Since the ends of the heat dissipation busbars (26A, 26B, 316, 326) are provided so as not to be interposed between the condenser busbars (19, 29) in the extending direction of the condenser busbars (19, 29), the length of the current path of the condenser busbars is prevented from increasing by the heat dissipation busbars. Since the heat dissipation busbars are housed in the holes (87) of the heat dissipation wall (86) via the heat dissipation members (60), the heat of the capacitor is dissipated to the heat dissipation wall (86) via the heat dissipation busbars. This makes it possible to provide a capacitor device that both prevents an increase in the inductance of the condenser busbars and improves the heat dissipation performance of the capacitor.

[0008] It should be noted that the reference numbers in parentheses above merely indicate the corresponding relationship with the configurations described in the embodiments described below, and do not in any way limit the technical scope. [Brief description of the drawings]

[0009] [Figure 1] 2 is a schematic diagram illustrating an electrical connection configuration of a power conversion device in which a capacitor device is mounted. FIG. [Diagram 2] 1 is a schematic diagram illustrating a power conversion device in which a capacitor device is mounted; [Diagram 3] FIG. 1 is a plan view of a capacitor device according to a first embodiment. [Figure 4] 2 is a plan view of the capacitor device of the first embodiment excluding the sealing member. FIG. [Diagram 5] 4 is a cross-sectional view of the capacitor device taken along line VV. [Figure 6] FIG. 6 is a cross-sectional view of the capacitor device taken along line VI-VI. [Figure 7] 7 is a cross-sectional view of the capacitor device taken along line VII-VII. [Figure 8] FIG. 5 is a cross-sectional view of a capacitor device according to a second embodiment. [Figure 9] FIG. 11 is a cross-sectional view of a capacitor device according to a third embodiment. [Figure 10] 13 is a schematic diagram illustrating a connection configuration of a capacitor device according to a fourth embodiment. FIG. [Figure 11] FIG. 13 is a plan view of a capacitor device according to a fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, several embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, the same reference numerals may be used to designate parts corresponding to matters described in the preceding embodiment, and duplicated descriptions may be omitted. In each embodiment, when only a part of the configuration is described, the other embodiment described previously may be applied to the other parts of the configuration.

[0011] In addition to combinations of parts that are explicitly stated as possible in each embodiment, it is also possible to partially combine embodiments, embodiments and variations, and variations even if not explicitly stated, provided that there are no particular problems with the combination.

[0012] (First embodiment) <In-vehicle systems> FIG. 1 is a schematic diagram illustrating an electrical connection configuration of a power conversion device 10 equipped with a capacitor device 5 having a capacitor 30. The power conversion device 10 is mounted on an in-vehicle system 1. The power conversion device 10 includes an input side connection unit 3, a capacitor device 5, and an inverter 6. The inverter 6 will be described first. The inverter 6 includes a plurality of semiconductor modules 7. The inverter 6 performs power conversion of power input from a high-voltage battery 2. The converted power is supplied to a motor generator 9. The inverter 6 may be referred to as an electric component.

[0013] The inverter 6 converts DC power supplied from the high-voltage battery 2 into AC power by turning on and off a semiconductor element 8 included in a semiconductor module 7. The high-voltage battery 2 is, for example, a plurality of secondary batteries. The secondary batteries may be lithium-ion secondary batteries, nickel-metal hydride secondary batteries, organic radical batteries, or the like.

[0014] The motor generator 9 includes a three-phase AC rotating electric machine, i.e., a three-phase AC motor. The motor generator 9 functions as an electric motor that is a drive source for running the vehicle. The motor generator 9 functions as a generator during regeneration. The inverter 6 performs power conversion between the high-voltage battery 2 and the motor generator 9.

[0015] A capacitor device 5 is connected to the input side of the inverter 6. An input side connection portion 3 is connected to the input side of the capacitor device 5. The input side connection portion 3 does not have to be connected to the input side of the capacitor device 5. The capacitor device 5 may be connected to the high-voltage battery 2 without the input side connection portion 3. The capacitor device 5 has a capacitor 30. The capacitor 30 mainly smoothes the DC voltage supplied from the high-voltage battery 2. The capacitor 30 is connected between a high-potential side power line 11 connected to the high-potential side electrode of the high-voltage battery 2 and a low-potential side power line 21 connected to the low-potential side electrode of the high-voltage battery 2.

[0016] As an example, two Y capacitors 4 are provided at the input side connection portion 3. The two Y capacitors 4 are connected in series between the high potential side power line 11 and the low potential side power line 21, and the midpoint is connected to the ground. In this manner, the Y capacitor 4 prevents noise from flowing from the capacitor device 5 to the high voltage battery 2.

[0017] A motor generator 9 is connected to the output side of the inverter 6. The semiconductor module 7 described above has, as an example, two IGBTs and two diodes 8A as semiconductor elements 8. The diode 8A is connected in inverse parallel to the semiconductor elements 8. The two semiconductor elements 8 are connected in series between a high potential side power line 11 and a low potential side power line 21.

[0018] Of the two semiconductor elements 8, a collector terminal connected to a high potential side power line 11 is connected to one of the collectors provided on the high potential side. Of the two semiconductor elements 8, an emitter terminal connected to a low potential side power line 21 is connected to one of the emitters provided on the low potential side. A motor terminal connected to a motor generator 9 is connected to the emitter of the semiconductor element 8 on the high potential side and the collector of the semiconductor element 8 on the low potential side.

[0019] <Mechanical configuration of the capacitor device> Next, a description will be given of the mechanical configuration of the capacitor device 5. The capacitor device 5 includes a capacitor component 5A, a fixing member 70, and a case 80.

[0020] FIG. 2 is a schematic diagram illustrating a power conversion device 10 in which a capacitor device 5 is mounted. FIG. 3 is a plan view of the capacitor device 5 of the first embodiment. FIG. 4 is a plan view of the capacitor device 5 of the first embodiment excluding a sealing member 50. FIG. 5 is a cross-sectional view of the capacitor device 5 taken along line VV in FIG. 3. FIG. 6 is a cross-sectional view of the capacitor device 5 taken along line VI-VI in FIG. 3. FIG. 7 is a cross-sectional view of the capacitor device 5 taken along line VII-VII in FIG. 3.

[0021] The capacitor component 5A includes a portion of the high-potential side power line 11, a portion of the low-potential side power line 21, a capacitor 30, a capacitor case 40, a sealing member 50, and a heat dissipation member 60.

[0022] The capacitor case 40 is a box-shaped case that has a storage space 45 for storing the capacitor 30, a portion of the high-potential side power line 11, a portion of the low-potential side power line 21, and a sealing member 50. The capacitor case 40 is made of a resin member, for example. The sealing member 50 is epoxy resin, for example. The capacitor 30, a portion of the high-potential side power line 11, and a portion of the low-potential side power line 21 are fixed to the capacitor case 40 by the sealing member 50.

[0023] The heat dissipation member 60 is a member mainly made of a material having a higher thermal conductivity than air. The heat dissipation member 60 is, for example, a heat dissipation sheet, a gap filler, a heat dissipation grease, an adhesive, etc. In the first embodiment, an adhesive is applied to the heat dissipation member 60.

[0024] The fixing member 70 is a member for fixing the capacitor case 40 to the case 80. An example of the fixing member 70 is a bolt. Note that the fixing member 70 is not limited to a bolt. An adhesive or the like may be used as the fixing member 70.

[0025] The case 80 is a box-shaped case that houses the capacitor component 5A. The case 80 has a base 81 and a wall 82 that rises from the base 81 in an annular shape. With respect to the direction, the thickness direction of the base 81 may be referred to as the thickness direction TD. A direction perpendicular to the thickness direction TD may be referred to as the depth direction DP. A direction perpendicular to the thickness direction TD and the depth direction DP may be referred to as the width direction WD. The width direction WD may be referred to as the orthogonal direction. The depth direction DP corresponds to the arrangement direction in which the input side connection portion 3, the capacitor component 5A, and the inverter 6 are arranged. The direction perpendicular to the thickness direction TD may be referred to as the planar direction. The planar direction is the direction along the width direction WD and the depth direction DP.

[0026] The wall 82 has a first wall portion 82A and a second wall portion 82B spaced apart from each other in the width direction WD, and a third wall portion 82C and a fourth wall portion 82D spaced apart from each other in the depth direction DP. The first wall portion 82A and the second wall portion 82B are connected via the third wall portion 82C and the fourth wall portion 82D. The wall 82 extends in an annular shape along the edge of the base 81 and protrudes away from the base 81. The case 80 is formed of a metal such as aluminum, for example. The base 81 and the wall 82 define a storage space for storing the input side connection portion 3, the capacitor component 5A, and the inverter 6.

[0027] The case 80 has two fixing walls 84 for fixing the capacitor case 40 to the inner surface 82E of the first wall portion 82A. The case 80 has two fixing walls 84 for fixing the capacitor case 40 to the inner surface 82E of the second wall portion 82B. The capacitor case 40 has four flanges 44 extending in a planar direction from the outer shell. The flanges 44 are fixed to the fixing walls 84, thereby fixing the capacitor case 40 to the case 80. The flanges 44 and the fixing walls 84 overlap with each other in the thickness direction TD. The flanges 44 and the fixing walls 84 are fixed via the fixing member 70. Two corresponding flanges 44 are fixed to the two fixing walls 84 provided on the first wall portion 82A. Two corresponding flanges 44 are fixed to the two fixing walls 84 provided on the second wall portion 82B.

[0028] Further, the case 80 has a heat dissipation wall 86 on an inner surface 82E of the first wall portion 82A and an inner surface 82E of the second wall portion 82B. As an example, the heat dissipation wall 86 is integrally connected to an upper surface 81A and an inner surface 82E of the base 81. The heat dissipation wall 86 protrudes from the base 81 in the thickness direction TD. The heat dissipation wall 86 has a hole 87 recessed from its tip toward the base 81. The width of the hole 87 in the planar direction is large enough to accommodate a heat dissipation bus bar 26 described below. The depth of the hole 87 in the thickness direction TD is deep enough to accommodate the tip of the heat dissipation bus bar 26 described below. As an example, the depth of the hole 87 in the thickness direction TD is approximately the same as the length of the annular wall 42 in the thickness direction TD. A heat dissipation member 60 is provided in the hole 87.

[0029] Two fixed walls 84 and one heat dissipation wall 86 are provided on the inner surface 82E of the first wall portion 82A. In the depth direction DP, the heat dissipation wall 86 is provided between the two fixed walls 84. In the depth direction DP, the two fixed walls 84 and the heat dissipation wall 86 are provided at a predetermined distance apart. Two fixed walls 84 and one heat dissipation wall 86 are also provided on the inner surface 82E of the second wall portion 82B. The explanation of the two fixed walls 84 and one heat dissipation wall 86 provided on the inner surface 82E of the second wall portion 82B is omitted because it is the same as the explanation given above.

[0030] Inside the case 80, the input side connection part 3, the capacitor part 5A, and the inverter 6 are arranged in series. The base 81 also has a first cooling path 85A through which a refrigerant flows inside. As an example, the first cooling path 85A extends along the direction in which the input side connection part 3, the capacitor part 5A, and the inverter 6 are arranged. However, the direction in which the first cooling path 85A extends is not limited to this. For example, the first cooling path 85A may extend by folding back in a U-shape. The input side connection part 3, the capacitor part 5A, and the inverter 6 are cooled by the refrigerant flowing through the first cooling path 85A. The case 80 itself is also cooled by the refrigerant.

[0031] The heat dissipation wall 86 also has a second cooling path 85B through which the refrigerant flows. The second cooling path 85B extends in the thickness direction TD along the hole 87. The second cooling path 85B is provided on both sides of the hole 87 so as to sandwich the hole 87. The second cooling path 85B faces the hole 87 in the width direction WD. The second cooling path 85B communicates with the first cooling path 85A inside. Therefore, the refrigerant flows through both the first cooling path 85A and the second cooling path 85B. The second cooling path 85B is not limited to being provided on both sides of the hole 87. The second cooling path 85B may be provided only on one side of the hole 87, or may extend in a ring shape so as to surround the hole 87.

[0032] <Capacitor> As an example, capacitor 30 has two capacitor elements 31. The number of capacitor elements 31 is not limited to two. Any number of capacitor elements 31 may be used. Capacitor element 31 is a film capacitor. A film capacitor is formed by providing metal vapor deposition electrodes on a dielectric film and winding the dielectric film so that the metal vapor deposition electrodes face each other. Metal-con electrodes are formed on both end faces of the film capacitor by spraying metal. One of the metal-con electrodes is electrically connected to the metal vapor deposition electrode. The other metal-con electrode is electrically connected to the metal vapor deposition electrode. In the drawings, capacitor 30 is shown hatched as metal for the sake of convenience.

[0033] The capacitor element 31 has a three-dimensional shape with a certain volume. The capacitor element 31 may be provided in the form of a three-dimensional shape such as a cylinder or an elliptical cylinder. The capacitor element 31 has at least two end faces 32, 34 and a side face 36. One end face of the capacitor element 31 in the thickness direction TD is called a first end face 32. The metallikon electrode provided on the first end face 32 is called a first electrode 33. The other end face of the capacitor element 31 in the thickness direction TD is called a second end face 34. The metallikon electrode provided on the second end face 34 is called a second electrode 35.

[0034] The first electrode 33 and the second electrode 35 are provided apart from each other in the thickness direction TD. The side surface 36 connects the first end face 32 and the second end face 34. The side surface 36 extends along the edges of the first end face 32 and the second end face 34. It can also be said that the side surface 36 extends along the edges of the first end face 32 and the second end face 34 in the circumferential direction about an axis along the thickness direction TD.

[0035] The two capacitor elements 31 are arranged side by side in the depth direction DP in the storage space 45 of the capacitor case 40. The two capacitor elements 31 are connected in parallel by electrical wiring (not shown). The direction in which the electrodes of the two capacitor elements 31 are arranged is the same as the thickness direction TD. First end faces 32 and first electrodes 33 of the two capacitor elements 31 are provided on one side in the thickness direction TD. Second end faces 34 and second electrodes 35 of the two capacitor elements 31 are provided on the other side in the thickness direction TD.

[0036] The capacitor case 40 has a bottom 41 that is thin in the thickness direction TD, and an annular wall 42 that rises from the bottom 41 in an annular shape. The annular wall 42 extends in an annular shape along the edge of the base 81 and protrudes away from the bottom 41. The annular wall 42 can also be called a side wall. A storage space 45 that stores the capacitor 30 is defined by the bottom 41 and the annular wall 42. An opening 43 that opens in the thickness direction TD and communicates with the storage space 45 is defined by an end of the annular wall 42 that is away from the bottom 41. In the first embodiment, the first end surface 32 and the first electrode 33 correspond to the bottom 41 side, and the second end surface 34 and the second electrode 35 correspond to the opening 43 side.

[0037] As described above, the capacitor case 40 has four flanges 44 for fixing to the case 80. The four flanges 44 are provided on the annular wall 42 of the capacitor case 40. Two of the four flanges 44 are provided on each wall of the annular wall 42 that are spaced apart in the width direction WD. The number of flanges 44 is not limited. One of the walls that are spaced apart in the width direction WD faces the first wall portion 82A. Another of the walls that are spaced apart in the width direction WD faces the second wall portion 82B.

[0038] The flange 44 extends in the width direction WD so as to move away from the annular wall 42. The flange 44 has a plate shape with a small thickness in the thickness direction TD. The flange 44 is provided with a through hole penetrating in the thickness direction TD. The through hole is provided with a cylindrical metal member called a collar 73 for passing a shaft portion 71 of a fixing member 70 such as a bolt.

[0039] <High-voltage power line> The high potential side power line 11 is formed by connecting four power lines (not shown), as an example. The power line connecting the high potential side of the high voltage battery 2 and the input side connection part 3 may be referred to as a first power line. The power line connecting the high potential battery 2 and the capacitor device 5 on the high potential side of the input side connection part 3 may be referred to as a second power line. The power line connecting the input side connection part 3 and the inverter 6 on the high potential side of the capacitor component 5A may be referred to as a third power line. The power line connecting the capacitor component 5A and the semiconductor module 7 on the high potential side of the inverter 6 may be referred to as a fourth power line.

[0040] The high-potential side power line 11 is made up of a first power line, a second power line, a third power line, and a fourth power line. Hereinafter, the third power line is provided by a first power bus bar 12. The first power bus bar 12 is a current path connecting the input side connection unit 3 and the inverter 6. The first power bus bar 12 is a current path through which a current mainly flows between the input side connection unit 3 and the inverter 6.

[0041] The first power supply bus bar 12 is provided so that its main portion faces the first end faces 32 of the two capacitor elements 31. First exposure holes for exposing the first electrodes 33 are formed in the first power supply bus bar 12 at locations where the first power supply bus bar 12 overlaps with the two first electrodes 33.

[0042] A first capacitor connection terminal 13 electrically connected to the first electrode 33 is provided on an edge that defines a portion of the first exposure hole in the first power supply bus bar 12. The first capacitor connection terminal 13 extends from the edge that defines a portion of the first exposure hole toward the first electrode 33. The first capacitor connection terminal 13 and the first electrode 33 are connected by soldering, for example.

[0043] The first power supply bus bar 12 has two ends spaced apart in the depth direction DP. One end of the first power supply bus bar 12 in the depth direction DP has a first inverter connection terminal 15 connected to the inverter 6. The first inverter connection terminal 15 extends in the thickness direction TD along the side surface 36 of the capacitor element 31 until it exceeds the opening 43, and further extends in the depth direction DP so as to move away from the capacitor case 40. The first inverter connection terminal 15 is electrically and mechanically connected to the fourth power line via a bolt or the like (not shown).

[0044] On the other hand, the first power bus bar 12 has a first input connection terminal 14 at the other end in the depth direction DP that is connected to the input side connection portion 3. The first input connection terminal 14 extends in the thickness direction TD along the side surface 36 of the capacitor element 31 until it exceeds the opening 43, and further extends in the depth direction DP so as to move away from the capacitor case 40. The first input connection terminal 14 is electrically and mechanically connected to the second power line via a bolt or the like (not shown).

[0045] Hereinafter, the first power supply bus bar 12 and the first capacitor connection terminal 13 may be collectively referred to as the first bus bar 18. In other words, the first bus bar 18 includes the first power supply bus bar 12 and the first capacitor connection terminal 13. The input side connection portion 3, the inverter 6, and the capacitor 30 are electrically connected via the first bus bar 18.

[0046] <First capacitor bus bar> It can also be said that the first bus bar 18 has a first capacitor connection portion 18A connected to the capacitor 30, a first input connection terminal 14, and a first inverter connection terminal 15. The first capacitor connection portion 18A refers to a portion that has the first capacitor connection terminal 13 and faces the first end faces 32 of the two capacitor elements 31. The first capacitor connection portion 18A is a combination of the first capacitor connection terminal 13 and the main portion of the first power supply bus bar 12. The first capacitor connection portion 18A and the first inverter connection terminal 15 may be collectively referred to as a first capacitor bus bar 19. It can also be said that the first bus bar 18 has the first condenser bus bar 19 and the first input connection terminal 14.

[0047] The first capacitor connection portion 18A extends in the direction in which the capacitor 30 and the inverter 6 are arranged. As an example, the first capacitor connection portion 18A extends in the depth direction DP. The first capacitor bus bar 19 has a first inverter connection terminal 15 at one end of the first capacitor connection portion 18A in the depth direction DP. The first input connection terminal 14 is connected to the other end of the first capacitor bus bar 19 in the depth direction DP. The first capacitor bus bar 19 is a current path through which a current mainly flows between the capacitor 30 and the inverter 6. The first capacitor connection portion 18A includes a path that connects the first capacitor connection terminal 13 and the first inverter connection terminal 15 in the shortest possible direction.

[0048] <Low-potential power line> The low potential side power line 21 is formed by connecting four power lines (not shown), as an example. The power line connecting the low potential side of the high voltage battery 2 and the input side connection part 3 may be referred to as the fifth power line. The power line connecting the high voltage battery 2 and the capacitor device 5 on the low potential side of the input side connection part 3 may be referred to as the sixth power line. The power line connecting the input side connection part 3 and the inverter 6 on the low potential side of the capacitor component 5A may be referred to as the seventh power line. The power line connecting the capacitor component 5A and the semiconductor module 7 on the low potential side of the inverter 6 may be referred to as the eighth power line.

[0049] The low potential side power lines 21 consist of a fifth power line, a sixth power line, a seventh power line, and an eighth power line. Hereinafter, the seventh power line is provided from a second power source bus bar 22. The second power source bus bar 22 is a current path connecting the input side connection unit 3 and the inverter 6. The second power source bus bar 22 is a current path through which a current mainly flows between the input side connection unit 3 and the inverter 6.

[0050] The second power supply bus bar 22 is provided so that its main portion faces the second end faces 34 of the two capacitor elements 31. Second exposure holes 22A for exposing the second electrodes 35 are formed in the second power supply bus bar 22 at locations overlapping with the two second electrodes 35.

[0051] A second capacitor connection terminal 23 electrically connected to the second electrode 35 is provided on an edge that defines a portion of the second exposure hole 22A in the second power supply bus bar 22. The second capacitor connection terminal 23 extends from the edge that defines a portion of the second exposure hole 22A toward the second electrode 35. The second capacitor connection terminal 23 and the second electrode 35 are connected by soldering, for example.

[0052] The second power supply bus bar 22 has two ends spaced apart in the depth direction DP. The second power supply bus bar 22 has a second inverter connection terminal 25 connected to the inverter 6 at one end in the depth direction DP. The second inverter connection terminal 25 extends along the annular wall 42 in the thickness direction TD until it exceeds the opening 43, and further extends in the depth direction DP so as to move away from the capacitor case 40. The second inverter connection terminal 25 is electrically and mechanically connected to the eighth power line via a bolt or the like (not shown).

[0053] Meanwhile, the second power bus bar 22 has a second input connection terminal 24 at the other end in the depth direction DP that is connected to the input side connection portion 3. The second input connection terminal 24 extends along the annular wall 42 in the thickness direction TD until it exceeds the opening 43, and further extends in the depth direction DP so as to move away from the capacitor case 40. The second input connection terminal 24 is electrically and mechanically connected to the sixth power line via a bolt or the like (not shown).

[0054] Furthermore, the second power supply bus bar 22 has two ends that are separated in the width direction WD. Heat dissipation bus bars 26A, 26B for dissipating heat from the capacitor 30 are provided at one end and the other end of the second power supply bus bar 22 in the width direction WD. The heat dissipation bus bars 26A, 26B are integrally connected to the second power supply bus bar 22. The heat dissipation bus bars 26A, 26B are continuous with the second power supply bus bar 22 and made of the same material. The heat dissipation bus bars 26A, 26B will be described in detail later.

[0055] Hereinafter, the second power supply bus bar 22, the second capacitor connection terminal 23, and the heat dissipation bus bars 26A and 26B may be collectively referred to as the second bus bar 28. In other words, the second bus bar 28 includes the second power supply bus bar 22, the second capacitor connection terminal 23, and the heat dissipation bus bars 26A and 26B. The input side connection portion 3, the inverter 6, and the capacitor 30 are electrically connected via the second bus bar 28.

[0056] <Second capacitor bus bar> The second busbar 28 can also be said to have the second capacitor connection portion 28A connected to the capacitor 30, the second input connection terminal 24, the second inverter connection terminal 25, and the heat dissipation busbars 26A and 26B. The second capacitor connection portion 28A indicates a portion having the second capacitor connection terminal 23 and facing the second end faces 34 of the two capacitor elements 31. The second capacitor connection portion 28A is a combination of the second capacitor connection terminal 23 and the main portion of the second power supply busbar 22. The second capacitor connection portion 28A and the second inverter connection terminal 25 may be collectively referred to as the second capacitor busbar 29. The second busbar 28 can also be said to have the second condenser busbar 29, the second input connection terminal 24, and the heat dissipation busbars 26A and 26B. The heat dissipation busbars 26A and 26B have the first heat dissipation busbar 26A and the second heat dissipation busbar 26B.

[0057] The second capacitor connection portion 28A extends in the direction in which the capacitor 30 and the inverter 6 are arranged. As an example, the second capacitor connection portion 28A extends in the depth direction DP. The second condenser bus bar 29 has a second inverter connection terminal 25 at one end of the second capacitor connection portion 28A in the depth direction DP. The second input connection terminal 24 is connected to the other end of the second capacitor connection portion 28A in the depth direction DP of the second condenser bus bar 29. The first heat dissipation bus bar 26A is provided at an end of the second condenser bus bar 29 on the first wall portion 82A side. The second heat dissipation bus bar 26B is provided at an end of the second condenser bus bar 29 on the second wall portion 82B side.

[0058] Second capacitor bus bar 29 is a current path through which current mainly flows between capacitor 30 and inverter 6. Second capacitor connection portion 28A includes a path that connects second capacitor connection terminal 23 and second inverter connection terminal 25 in the shortest possible manner.

[0059] <Heat dissipation busbar> Hereinafter, when describing a configuration common to the first heat dissipation bus bar 26A and the second heat dissipation bus bar 26B, they may be simply referred to as heat dissipation bus bars 26A, 26B. The heat dissipation bus bars 26A, 26B are portions for dissipating heat from the capacitor 30. The heat dissipation bus bars 26A, 26B are cantilevered by the second condenser bus bar 29. The ends of the heat dissipation bus bars 26A, 26B away from the second condenser bus bar 29 are open ends. The heat dissipation bus bars 26A, 26B are provided at positions overlapping the heat dissipation wall 86 in the thickness direction TD.

[0060] Heat dissipation bus bars 26A, 26B have a first extension portion 26C, a second extension portion 26D, and a third extension portion 26E. One end of first extension portion 26C is connected to second capacitor bus bar 29. The other end of first extension portion 26C is connected to one end of second extension portion 26D. The other end of second extension portion 26D is connected to one end of third extension portion 26E.

[0061] The first extension portion 26C extends in the thickness direction TD beyond the opening 43 so as to move away from the capacitor element 31. The second extension portion 26D extends in the width direction WD toward the heat dissipation wall 86. The tip of the second extension portion 26D overlaps the heat dissipation wall 86 in the thickness direction TD. The third extension portion 26E extends in the thickness direction TD from the opening 43 toward the bottom 41. The third extension portion 26E is housed in a hole 87.

[0062] The third extension 26E is in close contact with the heat dissipation member 60 inside the hole 87. The heat dissipation member 60 is in close contact with the inner wall surface 87A that defines the hole 87 and the third extension 26E. The third extension 26E overlaps with the second cooling passage 85B in the width direction WD. The length of the thickness direction TD of the third extension 26E is, for example, equal to the length of the annular wall 42. The length L2 of the thickness direction TD of the third extension 26E is longer than the length L1 of the depth direction DP of the second extension 26D. In other words, the length L1 of the depth direction DP of the second extension 26D is shorter than the length L2 of the thickness direction TD of the third extension 26E. The length L1 of the depth direction DP of the second extension 26D does not have to be shorter than the length L2 of the thickness direction TD of the third extension 26E. The length L1 of the depth direction DP of the second extension 26D may be longer than the length L2 of the thickness direction TD of the third extension 26E.

[0063] Heat dissipation busbars 26A, 26B are current paths branching out from second condenser busbar 29. Heat dissipation busbars 26A, 26B extend in a direction different from the extension direction of second condenser busbar 29. Heat dissipation busbars 26A, 26B are provided on second condenser busbar 29 so as not to be interposed in the extension direction of second condenser busbar 29. The current flowing through heat dissipation busbars 26A, 26B is smaller than the current flowing through second condenser busbar 29.

[0064] <Sealing resin and busbar> Capacitor 30, which has a part of first bus bar 18 and a part of second bus bar 28, is stored in storage space 45 of capacitor case 40. Storage space 45 is filled with sealing member 50. As an example, sealing member 50 is filled in thickness direction TD up to opening 43. Capacitor 30, a part of first bus bar 18, and a part of second bus bar 28 are sealed by sealing member 50.

[0065] The first capacitor connection portion 18A, a portion of the first input connection terminal 14, and a portion of the first inverter connection terminal 15 are sealed in the sealing member 50. The remainder of the first input connection terminal 14 and the remainder of the first inverter connection terminal 15 are exposed from the sealing member 50. The second capacitor connection portion 28A, a portion of the second input connection terminal 24, a portion of the second inverter connection terminal 25, and portions of the two heat dissipation bus bars 26 are sealed in the sealing member 50. The remainder of the second input connection terminal 24, the remainder of the second inverter connection terminal 25, and the remainder of the two heat dissipation bus bars 26A and 26B are exposed from the sealing member 50. The remainder of the heat dissipation bus bars 26A and 26B are exposed from the sealing member 50.

[0066] A portion of first extension portion 26C is housed in capacitor case 40. The remainder of first extension portion 26C is exposed from capacitor case 40. Second extension portion 26D is exposed from capacitor case 40. Third extension portion 26E is exposed from capacitor case 40 and is housed in hole 87. Third extension portion 26E is a portion provided at the tips of heat dissipation bus bars 26A, 26B, and may be referred to as a tip portion.

[0067] The portions of heat dissipation busbars 26A, 26B that are housed in capacitor case 40 may be referred to as the housing portion. The portion of first extension portion 26C that is housed in capacitor case 40 corresponds to the housing portion. The portion of heat dissipation busbar 26 that relays between third extension portion 26E and the housing portion may be referred to as the relay portion. The portion of first extension portion 26C that is exposed from capacitor case 40 and second extension portion 26D combined corresponds to the relay portion.

[0068] <Fixing parts and heat dissipation parts> The fixing member 70 includes a shaft portion 71 and a head portion 72 provided at the tip of the shaft portion 71. The shaft portion 71 is equal to the thickness direction TD. A portion of the shaft portion 71 on the head portion 72 side is passed through a collar 73 provided on the flange 44. A portion of the shaft portion 71 away from the head portion 72 is passed through the fastening hole 46. During manufacturing, the fixing member 70 advances through the hole of the collar 73 and the fastening hole 46 in the thickness direction TD toward the base 81. A first thread shape is formed in the shaft portion 71. A second thread shape corresponding to the first thread shape is formed in the fastening hole 46. The first thread shape and the second thread shape are fitted together to fix the shaft portion 71 to the fastening hole 46.

[0069] <Action and effect> The capacitor device 5 includes a capacitor 30, a second condenser bus bar 29, and heat dissipation bus bars 26A and 26B. The second condenser bus bar 29 is a current path through which a current mainly flows between the capacitor 30 and the inverter 6. The second condenser bus bar 29 extends in a direction in which the capacitor 30 and the inverter 6 are arranged side by side. The heat dissipation bus bars 26A and 26B extend in a direction different from the direction in which the second condenser bus bar 29 extends. The heat dissipation bus bars 26A and 26B are provided on the second condenser bus bar 29 so as not to be interposed between the second condenser bus bar 29 in the direction in which the second condenser bus bar 29 extends.

[0070] This prevents the current path length of second condenser bus bar 29 from becoming longer. This prevents an increase in inductance of second condenser bus bar 29. Also, a portion of heat dissipation bus bars 26A, 26B is housed in hole 87 of heat dissipation wall 86. Heat dissipation member 60 is provided in hole 87. Heat from capacitor 30 is transferred from heat dissipation bus bars 26A, 26B to heat dissipation wall 86 via heat dissipation member 60. This improves the heat dissipation performance of capacitor 30. In this way, it is possible to provide a capacitor device 5 in which both an increase in inductance of second condenser bus bar 29 is prevented and the heat dissipation performance of capacitor 30 is improved.

[0071] Furthermore, the current flowing through the heat dissipation busbars 26A, 26B is smaller than the current flowing through the second condenser busbar 29. Accordingly, the temperature of the heat dissipation busbars 26A, 26B is lower than the temperature of the second condenser busbar 29. By deliberately providing the heat dissipation busbars 26A, 26B through which a smaller current flows than the second condenser busbar 29 and actively cooling the heat dissipation busbars 26A, 26B, the temperature of the second busbar 28 can be efficiently lowered. Accordingly, the heat of the capacitor 30 is more easily dissipated to the second busbar 28. The capacitor 30 is more easily cooled efficiently.

[0072] Unlike this embodiment, in another embodiment in which heat dissipation busbars 26A, 26B are interposed in the direction in which second condenser busbar 29 extends, there are concerns that the amount of current flowing between multiple capacitor elements 31 connected in parallel may become uneven and that inductance components may increase. For this reason, in the embodiment in which heat dissipation busbars 26A, 26B are interposed in second condenser busbar 29, a design that takes these concerns into consideration is required. The structure of capacitor device 5 becomes limited.

[0073] In the present embodiment, since the heat dissipation busbars 26A, 26B are provided on the second condenser busbar 29 so as not to be interposed in the direction in which the second condenser busbar 29 extends, it is not necessary to take these concerns into consideration. This improves the degree of freedom in the structure of the capacitor device 5. As one variation of the capacitor device 5, the heat dissipation area of ​​the heat dissipation busbars 26A, 26B, etc., can be easily changed.

[0074] Furthermore, by increasing the heat dissipation area of ​​heat dissipation busbars 26A, 26B, it is possible to adjust the heat dissipation performance of heat dissipation busbars 26A, 26B. Particularly in this embodiment, heat from condenser 30 can be dissipated to heat dissipation wall 86 from both sides of heat dissipation busbars 26A, 26B. In this embodiment, it is possible to provide a condenser device 5 with improved cooling efficiency.

[0075] As described above, the heat dissipation member 60 is an adhesive that fixes the third extension portion 26E to the inner wall surface 87A that defines the hole 87 in the heat dissipation wall 86. This allows the third extension portion 26E to be firmly fixed to the inner wall surface 87A. This improves the vibration resistance of the capacitor component 5A. Therefore, even when vibration occurs, the position of the third extension portion 26E is maintained. The heat dissipation properties of the heat dissipation bus bars 26A, 26B are maintained.

[0076] As described above, the second cooling paths 85B are formed in the heat dissipation wall 86. The second cooling paths 85B extend in the thickness direction TD along the holes 87. The heat dissipation wall 86 is cooled by the coolant flowing in the second cooling paths 85B. The second cooling paths 85B face the holes 87 in the width direction WD. Therefore, heat from the condenser 30 is efficiently dissipated from the third extension portion 26E to the heat dissipation wall 86.

[0077] As described above, the length L1 in the depth direction DP of the second extension portion 26D is shorter than the length L2 in the thickness direction TD of the third extension portion 26E. This reduces the size of the heat dissipation busbars 26A, 26B in the depth direction DP. The range of the third extension portion 26E facing the second cooling path 85B is increased. Heat from the condenser 30 can be efficiently transferred to the heat dissipation wall 86 while reducing the size of the heat dissipation busbar 26 in the depth direction DP.

[0078] The capacitor case 40 has a thin bottom 41 in the thickness direction TD and an annular wall 42 that rises annularly from the bottom 41. A storage space 45 is defined by the bottom 41 and the annular wall 42. The capacitor case 40 also has four flanges 44 for fixing to the case 80.

[0079] Two fixed walls 84 and one heat dissipation wall 86 are provided on the first wall portion 82A. Two fixed walls 84 and one heat dissipation wall 86 are provided on the second wall portion 82B. The length L1 in the depth direction DP of the second extension portion 26D of the heat dissipation busbars 26A and 26B is shorter than the length L2 in the thickness direction TD of the third extension portion 26E. Since the length in the depth direction DP of the second extension portion 26D of the heat dissipation busbars 26A and 26B is reduced, two fixed walls 84 can be provided on both sides of the heat dissipation wall 86 in the depth direction DP. The capacitor case 40 is fixed to the two fixed walls 84 provided on the first wall portion 82A via two flanges 44. The capacitor case 40 is fixed to the case 80 via two flanges 44 on the two fixed walls 84 provided on the second wall portion 82B. Since the capacitor case 40 is fixed to the case 80 at the four corners, the earthquake resistance of the capacitor component 5A is improved.

[0080] Second embodiment The second embodiment will be described with reference to Fig. 8. Fig. 8 is a cross-sectional view of a capacitor device 5 according to the second embodiment. In the following description of the second embodiment, changes from the first embodiment will be mainly described. In the second embodiment, each of the two heat dissipation bus bars 26A, 26B has an uneven surface 227 that is uneven in the width direction WD.

[0081] Therefore, the surface area of ​​the third extension 26E is increased compared to the first embodiment. The contact area of ​​the third extension 26E with the heat dissipation member 60 is increased compared to the first embodiment. In the second embodiment, the capacitor 30 can be efficiently cooled. In addition, in the second embodiment, the heat dissipation member 60 is inserted into the uneven shape 227. Therefore, even if the capacitor device 5 vibrates, the uneven shape 227 and the heat dissipation member 60 are unlikely to separate. The third extension 26E is firmly fixed to the inner wall surface 87A. Accordingly, the vibration resistance of the capacitor component 5A is improved. Therefore, the position of the third extension 26E is maintained even when vibration occurs.

[0082] Third embodiment The third embodiment will be described with reference to Fig. 9. Fig. 9 is a cross-sectional view of a capacitor device 5 according to the third embodiment. In the following description of the third embodiment, changes from the first embodiment will be mainly described. In the third embodiment, the first bus bar 18 has a heat dissipation bus bar 316 in addition to the first condenser bus bar 19 and the first input connection terminal 14.

[0083] In the third embodiment, the heat dissipation bus bar included in first bus bar 18 may be referred to as first heat dissipation bus bar 316. The heat dissipation bus bar included in second bus bar 28 may be referred to as second heat dissipation bus bar 326. That is, in the third embodiment, capacitor device 5 includes first heat dissipation bus bar 316 and second heat dissipation bus bar 326.

[0084] The first condenser bus bar 19 has two ends spaced apart in the width direction WD. A first heat dissipation bus bar 316 is provided on the first wall portion 82A side of the two ends spaced apart in the width direction WD. The first heat dissipation bus bar 316 is integrally connected to the first condenser bus bar 19.

[0085] The first heat dissipation busbar 316 is cantilevered by the first capacitor busbar 19. The end of the first heat dissipation busbar 316 away from the first capacitor busbar 19 is an open end. The first heat dissipation busbar 316 has a first extension 316C, a second extension 316D, and a third extension 316E. The first extension 316C extends in the thickness direction TD along the side surface 36 of the capacitor element 31 until it exceeds the opening 43. The second extension 316D extends in the width direction WD toward the heat dissipation wall 86. The tip of the second extension 316D overlaps with the heat dissipation wall 86 in the thickness direction TD. The third extension 316E extends in the thickness direction TD from the opening 43 toward the bottom 41. The third extension 316E is housed in the hole 87.

[0086] The second heat dissipation bus bar 326 is cantilevered by the second condenser bus bar 29. The end of the second heat dissipation bus bar 326 away from the second condenser bus bar 29 is an open end. The second heat dissipation bus bar 326 has a first extension portion 326C, a second extension portion 326D, and a third extension portion 326E. The second extension portion 326D has a similar shape to the first extension portion 26C provided on the second wall side of the first embodiment. The second extension portion 326D has a similar shape to the second extension portion 26D provided on the second wall side of the first embodiment. The third extension portion 326E has a similar shape to the third extension portion 26E provided on the second wall side of the first embodiment.

[0087] The third extensions 316E, 326E are housed in the holes 87 of the heat dissipation wall 86. The heat dissipation member 60 is in close contact with the third extensions 316E, 326E and the inner wall surface 87A. Heat from the condenser 30 is dissipated from the third extensions 316E, 326E to the heat dissipation wall 86. In this way, the third embodiment also provides the same effects as the first embodiment.

[0088] (Fourth embodiment) The fourth embodiment will be described with reference to Fig. 10. Fig. 10 is a schematic diagram illustrating a connection form of a capacitor device 5 according to the fourth embodiment. In the embodiments described so far, the second power source bus bar 22 and the second condenser bus bar 29 are partially common to each other. However, the second power source bus bar 22 and the second condenser bus bar 29 do not necessarily have to be partially common to each other.

[0089] In the fourth embodiment, the second power supply bus bar 422 and the second condenser bus bar 429 are separate. In the fourth embodiment, the second power supply bus bar 422 and the second condenser bus bar 429 are electrically and mechanically connected by the second inverter connection terminal 425. In the fourth embodiment as well, the heat dissipation bus bars 26A, 26B are cantilevered by the second condenser bus bar 429. The heat dissipation bus bars 26A, 26B are provided so as not to be interposed in the extension direction of the second condenser bus bar 29. This also produces the same effects as in the past.

[0090] Fifth embodiment So far, the configuration in which the input side connection part 3, the capacitor component 5A, and the inverter 6 are arranged in the depth direction DP has been described, but the arrangement direction is not limited to this. For example, as shown in Fig. 11, in the fifth embodiment, the input side connection part 3 and the capacitor component 5A are arranged in the depth direction DP. The capacitor component 5A and the inverter 6 are arranged in the width direction WD. In this case, the input side connection part 3, the capacitor component 5A, and the inverter 6 are arranged in a substantially L-shape.

[0091] The input side connection portion 3 and the capacitor component 5A are electrically connected via a first input connection terminal 14 and a second input connection terminal 24. The first input connection terminal 14 and the second input connection terminal 24 extend in the depth direction DP. The capacitor component 5A and the inverter 6 are electrically connected via a first inverter connection terminal 15 and a second inverter connection terminal 25. The first inverter connection terminal 15 and the second inverter connection terminal 25 extend in the width direction WD.

[0092] Heat dissipation walls 586 are provided on both sides of first inverter connection terminal 15 and second inverter connection terminal 25. Heat dissipation walls 586 are provided near the center of an end portion of capacitor component 5A opposite to an end portion where first inverter connection terminal 15 and second inverter connection terminal 25 are provided. The three heat dissipation walls 586 house the tip of either first heat dissipation bus bar 526A or second heat dissipation bus bar 526B.

[0093] Furthermore, fixed walls 584 are provided on both sides of the heat dissipation wall 586 on the side of the first inverter connection terminal 15 and the second inverter connection terminal 25, and on both sides of 86 on the side away from the first inverter connection terminal 15 and the second inverter connection terminal 25. The capacitor component 5A is fixed to the case 80 at four points by fixing the flange 544 to the fixed walls 584. The number of fixing points is not limited to four. The number of fixing points may be more than four or less than four.

[0094] Although the present disclosure has been described based on the embodiment, it is understood that the present disclosure is not limited to the embodiment or structure. The present disclosure also includes various modifications and modifications within the equivalent range. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more than one, or less than one element are also within the scope and concept of the present disclosure. [Explanation of symbols]

[0095] 19 first capacitor bus bar, 227 uneven shape, 26A, 26B heat dissipation bus bar, 26C storage section, 26D relay section, 26E tip section, 29 second capacitor bus bar, 30 capacitor, 316 heat dissipation bus bar, 316C storage section, 316D relay section, 316E tip section, 326 heat dissipation bus bar, 326C storage section, 326D relay section, 326E tip section, 33 first electrode, 35 second electrode, 40 capacitor case, 41 bottom, 42 annular wall, 43 opening, 44 flange, 45 storage space, 6 electrical component, 60 heat dissipation member, 80 case, 81 base, 82 wall, 82A first wall section, 82B Second wall portion, 84 fixed wall, 85B cooling passage, 86 heat dissipation wall, 87 hole, 87A inner wall surface, DP arrangement direction, TD thickness direction, WD perpendicular direction, L1 length of relay portion in arrangement direction, L2 length of tip portion in thickness direction

Claims

1. A capacitor (30); a capacitor bus bar (19, 29) having one end connected to the capacitor and the other end connected to an electrical component (6) and extending in an arrangement direction (DP) in which the capacitors and the electrical component are arranged; a heat dissipation bus bar (26A, 26B, 316, 326) having an end portion on the condenser bus bar so as not to be interposed between the condenser bus bar in the arrangement direction and configured to dissipate heat from the condenser; a capacitor case (40) for housing the capacitor, a portion of the capacitor bus bar, and a portion of the heat dissipation bus bar in an internal housing space (45); A case (80) for housing the capacitor case; A heat dissipation member (60) having a higher thermal conductivity than air, The case is the heat dissipation wall (86) is connected to at least one of the base and the wall and has a hole (87) for accommodating a tip portion (26E, 316E, 326E) of the heat dissipation bus bar and the heat dissipation member, The heat dissipation member is in close contact with an inner wall surface (87A) that defines the hole in the heat dissipation wall and the tip portion.

2. 2. The capacitor device according to claim 1, wherein the heat dissipation member is an adhesive that fixes the inner wall surface and the tip portion.

3. The heat dissipation wall is provided with a cooling passage (85B) through which a refrigerant flows, The capacitor device according to claim 2 , wherein the tip portion overlaps at least a portion of the cooling path in a direction perpendicular to the arrangement direction and the thickness direction.

4. The heat dissipation bus bar is In addition to the tip portion, a storage portion (26C, 316C, 326C) is stored in the capacitor case, and a relay portion (26D, 316D, 326D) connects the tip portion and the storage portion, the end of the heat dissipation bus bar is provided at an end of the capacitor bus bar in the orthogonal direction, The relay portion extends in the perpendicular direction, The tip portion extends in the thickness direction, The capacitor device according to claim 3 , wherein a length (L1) of the relay portion in the arrangement direction is shorter than a length (L2) of the tip portion in the thickness direction.

5. The capacitor case includes a bottom (41), an annular wall (42) rising from the bottom in an annular shape, and four flanges (44) connected to the annular wall. The wall includes a first wall portion (82A) and a second wall portion (82B) arranged in the perpendicular direction and spaced apart from each other via the capacitor case, a fixed wall (84) to which the two flanges are fixed, and a heat dissipation wall in which a portion of the heat dissipation bus bar is housed are connected to the first wall portion and the second wall portion; The capacitor device according to claim 4 , wherein the two fixed walls are arranged side by side in the arrangement direction and spaced apart from each other via the heat dissipation wall.

6. the capacitor bus bar includes a first capacitor bus bar (19) connected to a first electrode (33) of the capacitor provided on the bottom side, and a second capacitor bus bar (29) connected to a second electrode (35) of the capacitor provided on an opening (43) side away from the bottom in the thickness direction; the heat dissipation bus bar is cantilevered between one end of the second condenser bus bar in the orthogonal direction and the other end of the second condenser bus bar in the orthogonal direction, the first capacitor bus bar is thermally connected to the base through the bottom; The capacitor device according to claim 5 , wherein the second condenser bus bar is thermally connected to the heat dissipation wall.

7. The capacitor bus bar includes: a first capacitor busbar (19) connected to a first electrode (33) of the capacitor, and a second capacitor busbar (29) connected to a second electrode (35) of the capacitor; the heat dissipation bus bar is cantilevered by one end of the first condenser bus bar in the orthogonal direction and the other end of the second condenser bus bar in the orthogonal direction, The capacitor device according to claim 5 , wherein the first condenser bus bar and the second condenser bus bar are thermally connected to the heat dissipation wall.

8. The capacitor device according to any one of claims 1 to 7, wherein the tip portion further comprises an uneven surface (227).

Images