Capacitor

The capacitor design with multiple partition walls of varying heights addresses resin injection inefficiencies and maintains insulation, improving work efficiency and positioning in capacitors with multiple elements.

JP2025012632APending Publication Date: 2025-01-24NICHICON CORP
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Patent Information

Application Number
JP2023115609
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-07-14
Publication Date
2025-01-24

AI Technical Summary

Technical Problem

Existing capacitors with multiple elements face inefficiencies in resin injection due to partition walls hindering fluidity and requiring precise resin amounts, leading to decreased work efficiency.

Method used

A capacitor design with multiple partition walls of varying heights, including a first partition wall indicating resin amount and a second partition wall positioned lower than the first, facilitating easier resin injection and reducing resin fluidity deterioration.

Benefits of technology

Improves resin injection efficiency and maintains insulation status by adjusting resin flow and positioning capacitor elements, enhancing overall work efficiency.

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Abstract

To provide a capacitor which can position a capacitor element while suppressing deterioration in flowability of a sealing resin.SOLUTION: A capacitor includes a plurality of two or more kinds of first capacitor elements 10A and 10B having different applications, a second capacitor element 40, a third capacitor element 50, a case 80 storing the capacitor elements, and a sealing resin 90 for sealing the capacitor elements stored in the case 80, wherein the case 80 is provided with ribs 85a to 85c, 86a to 86c and 87a to 87c for partitioning between the different capacitor elements having the different applications at positions matched with arrangement in the storage space of the case of the capacitor elements 10A, 10B, 40 and 50, and the height is higher in the order of the rib (87a) as an index of an injection amount of the sealing resin 90, the ribs (85a, 85c, 86a and 86c), and the ribs (85b, 86b and 87bc) capable of positioning the capacitor element in the storage space of the case 80.SELECTED DRAWING: Figure 9
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Description

[Technical field]

[0001] The present invention relates to a capacitor in which two or more types of capacitor elements having different uses are housed in a case. [Background technology]

[0002] Conventionally, there has been a capacitor that is manufactured by housing a capacitor element, with a first bus bar and a second bus bar connected to a first end surface electrode and a second end surface electrode of the capacitor element, in a storage space of a box-shaped case with one side open, and then injecting a sealing resin into the empty space of the case through the opening of the case. Among such capacitors, there is a capacitor that has at least two indicator parts having lower limit indicator parts and upper limit indicator parts that serve as lower and upper limits for the amount of sealing resin to be injected, sandwiched between the storage space (see Patent Document 1, for example). This makes it possible to confirm that the height of the resin surface of the sealing resin is within a predetermined range. This can be confirmed with a simple configuration, and the efficiency of the process of injecting the sealing resin can be improved.

[0003] There are also capacitors in which multiple types of capacitor elements with different uses are housed in a case (see, for example, Patent Document 2). In such capacitors, a partition wall is provided between the capacitor elements in order to house the multiple types of capacitor elements with different uses in a case while separating them. In this case, the partition wall is provided in the case so as to be located between both capacitor elements (first element and second element) with different uses, and the height of the partition wall is set to be approximately the same as that of the capacitor elements. However, with this configuration, the flow of the sealing resin injected into the case is hindered by the partition wall, deteriorating the fluidity of the sealing resin, leading to a decrease in the work efficiency of injecting the sealing resin. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-100801 [Patent Document 2] JP 2009-188313 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to enable positioning of capacitor elements while improving the work efficiency of injecting sealing resin in a capacitor that houses two or more types of capacitor elements with different uses in a case. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, the capacitor of the present invention comprises a plurality of capacitor elements of two or more different types having different uses, a case that accommodates the plurality of capacitor elements in an accommodation space, a sealing resin that seals the plurality of capacitor elements accommodated in the accommodation space, and a partition portion that protrudes from the inner bottom of the case into the accommodation space and separates the plurality of capacitor elements, the partition portion having a first partition wall that serves as an indicator of the amount of sealing resin injected, and a second partition wall that is shorter in height than the first partition wall and can position the capacitor elements within the accommodation space.

[0007] According to this configuration, a partition having a first partition wall and a second partition wall of two different heights is protruded from the inner bottom of the case. That is, since the first partition wall serving as an indicator of the amount of sealing resin to be injected is provided in the storage space of the case, it is easy to adjust the amount of sealing resin to be injected, and the efficiency of the work of injecting the sealing resin is improved. In addition, since the second partition wall that is lower than the first partition wall is provided when positioning two or more types of capacitor elements with different uses in the storage space, it is possible to suppress deterioration of the fluidity of the sealing resin compared to when the entire partition is composed of the first partition wall, and the efficiency of the work of injecting the sealing resin can be improved.

[0008] Moreover, it is preferable that the first partition wall serves as an indicator for the amount of the sealing resin to be injected and is disposed at a position that allows the capacitor element to be positioned within the accommodation space.

[0009] According to this configuration, the first partition wall, which serves as an indicator of the amount of sealing resin injected, also serves to position the capacitor element, making it easy to position the capacitor element and adjust the amount of sealing resin injected while suppressing an increase in the number of partition walls.

[0010] It is also preferable that the partition section further includes a third partition wall that is lower than the first partition wall and higher than the second partition wall.

[0011] According to this configuration, the third partition wall, which is lower than the first partition wall and higher than the second partition wall, can reduce the inclination of the capacitor elements, and ensure insulation between two or more types of capacitor elements with different uses that are separated by the third partition wall. Also, by making the height of the third partition wall lower than the first partition wall, deterioration of the fluidity of the sealing resin can be suppressed, and the efficiency of the work of injecting the sealing resin can be improved.

[0012] The height of the third partition wall may be at least ⅓ of the height of the lower capacitor element which is the lower of the two capacitor elements separated by the third partition wall.

[0013] With this configuration, the inclination of the capacitor elements can be kept small while preventing deterioration of the fluidity of the sealing resin, and the insulation between the capacitor elements with different uses separated by the third partition wall can be more securely maintained.

[0014] The third partition wall may have a height equal to or greater than that of the low-profile capacitor element.

[0015] According to this configuration, it is possible to reliably ensure insulation between the capacitor elements having different uses separated by the third partition wall. Effect of the Invention

[0016] According to the present invention, in a capacitor in which two or more types of capacitor elements having different uses are housed in a case, it is possible to position the capacitor elements while improving the efficiency of the process of injecting a sealing resin. [Brief description of the drawings]

[0017] [Figure 1] 1 is a perspective view of a capacitor according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a perspective view of the capacitor in FIG. 1 excluding the sealing resin. [Diagram 3] FIG. 2 is a top view of the capacitor in FIG. 1 excluding the sealing resin. [Figure 4] FIG. 2 is an exploded perspective view of the capacitor in FIG. 1 excluding the sealing resin. [Diagram 5] 2, and (b) is a view of the cross section of (a) seen obliquely. [Figure 6] FIG. 6(a) is a perspective view of the first bus bar of FIGS. 1 to 5, and (b) is a perspective view of the first bus bar as viewed from a different direction from that of (a). [Figure 7] FIG. 6 is a perspective view of a second bus bar of FIGS. 1 to 5. [Figure 8] FIG. 6(a) is a perspective view of the third bus bar in FIGS. 1 to 5, and FIG. 6(b) is a perspective view of the fourth bus bar in FIGS. [Figure 9] FIG. 6(a) is a perspective view of the case of FIG. 1 to FIG. 5, and FIG. 6(b) is a perspective view of the case as viewed from a different direction from that of FIG. [Figure 10] 2A to 2C are explanatory diagrams for explaining a manufacturing process of the capacitor in FIG. [Figure 11] 11 is an explanatory diagram for explaining the capacitor manufacturing process following FIG. 10. FIG. [Figure 12] 12 is an explanatory diagram for explaining the capacitor manufacturing process following FIG. 11. FIG. [Figure 13] 13 is an explanatory diagram for explaining the capacitor manufacturing process following FIG. 12. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0019] 1. Capacitor structure A structure of a capacitor 1 according to one embodiment of the present invention will be described with reference to Figures 1 to 9. Figures 1 to 9 and 10 to 13 are illustrated so that the x-axis, y-axis, and z-axis are in the same direction. In the following, a planar view of the capacitor 1 seen from the z-axis positive or negative side to the z-axis negative or positive side will be referred to as an "xy planar view", a planar view seen from the x-axis positive or negative side to the x-axis negative or positive side will be referred to as a "yz planar view", and a planar view seen from the y-axis positive or negative side to the y-axis negative or positive side will be referred to as a "zx planar view".

[0020] As shown in Figures 1 to 5, capacitor 1 includes a first metallized film capacitor element (in this embodiment, two metallized film capacitor elements 10A, 10B: hereinafter referred to as the "first capacitor element" as appropriate), a second metallized film capacitor element (in this embodiment, one metallized film capacitor element 40: hereinafter referred to as the "second capacitor element" as appropriate), a third metallized film capacitor element (in this embodiment, one metallized film capacitor element 50: hereinafter referred to as the "third capacitor element"), first to fourth bus bars 20, 30, 60, 70, a case 80, and a sealing resin 90.

[0021] As shown in FIG. 4, the capacitor element (10A, 10B, 40, 50) is configured to include an element body portion (11A, 11B, 41, 51), a first end surface electrode (12A, 12B, 42, 52) formed by spraying a metal such as zinc on one end surface of the element body portion, and a second end surface electrode (13A, 13B, 43, 53) formed by spraying a metal such as zinc on the other end surface of the element body portion.

[0022] The element main body parts 11A, 11B, 41, and 51 are formed by stacking two metallized films in which aluminum is vapor-deposited on a dielectric film, rolling or laminating the stacked metallized films, and pressing them into a flat shape. Note that, although the element main body parts 11A, 11B, 41, and 51 of the present embodiment are formed by a metallized film in which aluminum is vapor-deposited on a dielectric film, the present invention is not limited thereto, and may be formed by a metallized film in which other metals such as zinc and magnesium are vapor-deposited, may be formed by a metallized film in which a plurality of these metals are vapor-deposited, or may be formed by a metallized film in which an alloy of these metals is vapor-deposited.

[0023] In this embodiment, the first end surface electrodes 12A, 12B of the first capacitor elements 10A, 10B are used as the P pole side, and the second end surface electrodes 13A, 13B are used as the N pole side.

[0024] In this embodiment, the first capacitor elements 10A and 10B are used as smoothing capacitor elements. The second capacitor element 40 is used as a P-pole side Y capacitor element (a capacitor element connected between the P-pole side power line and the reference ground, which plays a role in preventing noise from being transmitted toward the P-pole side power line by bypassing common mode noise to the reference ground). The third capacitor element 50 is used as an N-pole side Y capacitor element (a capacitor element connected between the N-pole side power line and the reference ground, which plays a role in preventing noise from being transmitted toward the N-pole side power line by bypassing common mode noise to the reference ground). The first capacitor elements 10A and 10B, the second capacitor element 40, and the third capacitor element 50 correspond to "two or more types of multiple capacitor elements having different uses" of the present invention.

[0025] In this embodiment, when the bottom surface of the storage space of case 80 (the surface on the z-axis positive side of bottom 81a) is used as the standard for height, the first capacitor element 10A and the first capacitor element 10B have the same height, the second capacitor element 40 and the third capacitor element 50 have the same height, and the heights of the first capacitor elements 10A, 10B are higher than the heights of the second and third capacitor elements 40, 50 (height of first capacitor element 10A = height of first capacitor element 10B > height of second capacitor element 40 = height of third capacitor element 50).

[0026] In the assembled state of the capacitor 1, the first capacitor element 10A and the first capacitor element 10B are disposed so that their longitudinal peripheral surface portions face each other (see FIG. 3). The first capacitor element 10A and the second capacitor element 40 are disposed so that their transverse peripheral surface portions face each other with a gap therebetween (see FIG. 3). The first capacitor element 10B and the third capacitor element 50 are disposed so that their transverse peripheral surface portions face each other with a gap therebetween (see FIG. 3). The second capacitor element 40 and the third capacitor element 50 are disposed so that their transverse peripheral surface portions face each other with a gap therebetween (see FIG. 3).

[0027] The first to fourth bus bars 20, 30, 60, and 70 are each formed from a conductive material such as copper.

[0028] The first busbar 20 has a shape shown in Fig. 6(a) and (b), and is used as a P-pole busbar in this embodiment. The first busbar 20 has a flat first element connection electrode planar portion 21 having a substantially rectangular outer shape in the xy plane view, which is close enough to the first end surface electrodes 12A and 12B of the first capacitor elements 10A and 10B when the capacitor 1 is assembled, so that the first busbar 20 can be soldered to the first end surface electrodes 12A and 12B. The first element connection electrode planar portion 21 has a through portion 21aa and a notch portion 21ab formed therein, and protrusions 21ba and 21bb used when soldering the first busbar 20 to the first end surface electrode 12A are formed in the through portion 21aa and the notch portion 21ab. The first element connection electrode planar portion 21 is formed with protrusions 21bc, 21bd that protrude in the x-axis positive direction from the end portion on the x-axis positive side in the xy-plane view and are used when soldering the first busbar 20 to the first end surface electrode 12B. The first busbar 20 also has a flat second element connection electrode planar portion 22 that has a substantially rectangular outer shape in the xy-plane view and is close enough to the second end surface electrode 43 of the second capacitor element 40 when the capacitor 1 is assembled. The second element connection electrode planar portion 22 is formed with a protrusion 22a that protrudes in the x-axis positive direction from the end portion on the x-axis positive side in the xy-plane view and is used when soldering the first busbar 20 to the second end surface electrode 43. In addition, the first busbar 20 has a connection portion 23 between the first element connection electrode planar portion 21 and the second element connection electrode planar portion 22, which extends in the positive y-axis direction from the end of the first element connection electrode planar portion 21 on the positive y-axis side, and then bends and extends in the negative z-axis direction to the end of the second element connection electrode planar portion 22 on the negative y-axis side.

[0029] The first busbar 20 also has a lead-out portion 24 extending in the positive direction of the z-axis from an end of the first element connection electrode planar portion 21 on the negative x-axis side in the xy-plane view. The first busbar 20 also has an external connection terminal portion 25 extending in the negative direction of the x-axis from an end of the lead-out portion 24 opposite the first element connection electrode planar portion 21. The external connection terminal portion 25 has through-holes 25a and 25b that are substantially circular in the xy-plane view, and the first busbar 20 and external wiring are fastened to each other using the through-holes 25a and 25b.

[0030] The second busbar 30 has a shape shown in Fig. 7 and is used as an N-pole busbar in this embodiment. The second busbar 30 has a first element connection electrode planar portion 31 that is a plate-like portion having a substantially rectangular outer shape in an xy-plane view and is close enough to the second end surface electrodes 13A, 13B of the first capacitor elements 10A, 10B when the capacitor 1 is assembled so that the second busbar 30 can be soldered to the second end surface electrodes 13A, 13B. The first element connection electrode planar portion 31 has a through portion 31aa and a notch 31ab formed therein, and protrusions 31ba, 31bb that are used when soldering the second busbar 30 to the second end surface electrode 13B are formed in the portions of the through portion 31aa and the notch 31ab. The first element connection electrode planar portion 31 is provided with protrusions 31bc, 31bd that protrude in the negative x-axis direction from the end portion on the negative x-axis side in the xy-plane view and are used when soldering the second busbar 30 to the second end surface electrode 13A. The second busbar 30 also has a flat second element connection electrode planar portion 32 that is approximately rectangular in outer shape in the xy-plane view and is close enough to the second end surface electrode 53 of the third capacitor element 50 when the capacitor 1 is assembled. The second element connection electrode planar portion 32 is provided with a protrusion 32a that protrudes in the negative x-axis direction from the end portion on the negative x-axis side in the xy-plane view and is used when soldering the second busbar 30 to the second end surface electrode 53. In addition, the second busbar 30 has a connection portion 33 between the first element connection electrode planar portion 31 and the second element connection electrode planar portion 32, extending in the y-axis positive direction from the end of the first element connection electrode planar portion 31 on the y-axis positive side to the end of the second element connection electrode planar portion 32 on the y-axis negative side.

[0031] The second busbar 30 has a lead-out portion 34 extending in the positive direction of the z-axis from an end of the first element connection electrode planar portion 31 on the x-axis positive side in the xy-plane view. The second busbar 30 has an external connection terminal portion 35 extending in the positive direction of the x-axis from an end of the lead-out portion 34 opposite the first element connection electrode planar portion 31. The external connection terminal portion 35 has through-portions 35a and 35b that are substantially circular in the xy-plane view, and the second busbar 30 and external wiring are fastened to each other using the through-portions 35a and 35b.

[0032] The third busbar 60 and the fourth busbar 70 have shapes shown in Fig. 8(a) and Fig. 8(b), respectively, and are used as busbars for ground connection. The third and fourth busbars 60, 70 have flat element connection electrode planar portions 61, 71 having a substantially rectangular outer shape in the xy plane view. When the capacitor 1 is assembled, the element connection electrode planar portion 61 is close enough to the first end surface electrode 42 of the second capacitor element 40 for soldering, and the element connection electrode planar portion 71 is close enough to the first end surface electrode 52 of the third capacitor element 50 for soldering. The element connection electrode planar portions 61, 71 are formed with protrusions 61a, 71a, and the protrusions 61a are used when soldering the third busbar 60 to the first end surface electrode 42, and the protrusions 71a are used when soldering the fourth busbar 70 to the first end surface electrode 52.

[0033] The third and fourth busbars 60, 70 have lead-out portions 62, 72 that extend in the positive direction of the z-axis from an end of the element connection electrode flat portion 61, bend further to extend in a predetermined direction of the x-axis, and bend further to extend in the negative direction of the z-axis. The third and fourth busbars 60, 70 have external connection terminal portions 63, 73 that extend in a predetermined direction of the x-axis from the end of the lead-out portions 62, 72 opposite the element connection electrode flat portion 61, 71. The external connection terminal portions 63, 73 have through-portions 63a, 73a that are substantially circular in the xy-plane view, and the third busbar 60 and external wiring are fastened to each other using the through-portions 63a, and the fourth busbar 70 and external wiring are fastened to each other using the through-portions 73a.

[0034] Case 80 can be made of various materials, such as organic materials, such as resins and plastics, including polyphenylene sulfide (PPS) and polybutylene terephthalate (PBT), and inorganic materials, including ceramics, and has a shape as shown in Figures 9(a) and (b). Case 80 corresponds to the "case" of the present invention.

[0035] Case 80 has case main body 81. Case main body 81 has bottom 81a and side 81b, and is box-shaped with an opening on the z-axis positive side, and the bottom surface of the storage space of case 80 (the z-axis positive side surface of bottom 81a: hereinafter, appropriately referred to as the "bottom surface") is a flat surface parallel to the xy plane. Case 80 has protrusions 82a-82d and 83a-83b with through-holes. When the capacitor unit 5, which will be described later, is accommodated in the accommodation space of the case 80, in the z-axis direction, the through-hole 63a of the third busbar 60 and the through-hole of the protrusion 82a overlap, the through-hole 73a of the fourth busbar 70 and the through-hole of the protrusion 82b overlap, the through-hole 25a of the first busbar 20 and the through-hole of the protrusion 83a overlap, and the through-hole 35b of the second busbar 30 and the through-hole of the protrusion 83b overlap.

[0036] Case 80 is provided with ribs 85a-85c, 86a-86c, and 87a-87b extending from the bottom surface in the positive direction of the z-axis at positions corresponding to the arrangement of first capacitor elements 10A, 10B, second capacitor element 40, and third capacitor element 50 in the storage space.

[0037] The ribs 85a-85c are intended to separate the first capacitor element 10A used as a smoothing capacitor element from the second capacitor element 40 used as a P-pole Y capacitor element, and are located between the circumferential surface portion in the short direction of the first capacitor element 10A and the circumferential surface portion in the long direction of the second capacitor element 40 when the capacitor 1 is assembled (see FIG. 3). The ribs 85a-85c are formed so that the rib 85a is spaced from the side portion 81b, and the ribs 85a-85c are arranged at equal intervals or at different intervals in the x-axis direction (see FIGS. 3, 5, and 9).

[0038] The ribs 86a-86c are intended to separate the first capacitor element 10B used as a smoothing capacitor element from the third capacitor element 50 used as a Y capacitor element on the N-pole side, and are located between the circumferential surface portion in the short direction of the first capacitor element 10B and the circumferential surface portion in the long direction of the third capacitor element B0 when the capacitor 1 is assembled (see FIG. 3). The ribs 86a are spaced from the side portion 81b, and the ribs 86a-86c are formed so that they are arranged at equal intervals or at different intervals in the x-axis direction (see FIGS. 3, 5, and 9).

[0039] The ribs 87a-87b are for separating the second capacitor element 40, which is a Y capacitor element used as a P-pole side, from the third capacitor element 50, which is a Y capacitor element used as an N-pole side, and are located between the circumferential surface portion in the short-side direction of the second capacitor element 40 and the circumferential surface portion in the short-side direction of the third capacitor element 50 when the capacitor 1 is assembled (see FIG. 3). The ribs 87a-87b are formed to be aligned with gaps in the y-axis direction (see FIGS. 3, 5, and 9). There are gaps between the ribs 85c and 86c, between the ribs 85c and 87a, and between the ribs 86c and 87a.

[0040] In this embodiment, when the bottom surface of bottom portion 81a is used as a reference for height (height in the z-axis direction), the heights of ribs 85a-85c, 86a-86c, 87a-87b have the following relationship. Ribs 85a, 85c, 86a, 86c have the same height. Ribs 85b, 86b, 87b have the same height. Rib 87a is the tallest, followed by ribs 85a, 85c, 86a, 86c, and ribs 85b, 86b, 87b, the shortest (height of rib 87a > height of ribs 85a, 85c, 86a, 86c > height of ribs 85b, 86b, 87b) (see FIGS. 5 and 9).

[0041] The ribs 85b, 86b, and 87b are used for (1) positioning the first capacitor elements 10A and 10B, the second capacitor element 40, and the third capacitor element 50 in the accommodation space of the case 80. The ribs 85b, 86b, and 87b position the capacitor elements, thereby preventing a shortage of insulation distance caused by misalignment of adjacent capacitor elements on the xy plane. Specifically, the rib 85b serves to ensure an insulating state between the first capacitor element 10A and the second capacitor element 40, the rib 86b serves to ensure an insulating state between the first capacitor element 10B and the third capacitor element 50, and the rib 87b serves to ensure an insulating state between the second capacitor element 40 and the third capacitor element 50.

[0042] The ribs 85a, 85c, 86a, and 86c are used (1) to position the first capacitor elements 10A and 10B, the second capacitor element 40, and the third capacitor element 50 in the accommodation space of the case 80, and (2) the ribs 85a and 85c are used to ensure an insulating state between the first capacitor element 10A and the second capacitor element 40, and the ribs 86a and 86c are used to ensure an insulating state between the first capacitor element 10B and the third capacitor element 50. In addition to ensuring the insulating state by positioning, the ribs 85a, 85c, 86a, and 86c are useful for ensuring the insulating state by suppressing tilt of the capacitor elements. When the bottom surface is used as a reference for height, the height of the ribs 85a, 85c is set to be ⅓ or more of the height of the second capacitor element (low-side capacitor element) 40, which is the shorter of the first capacitor element 10A and the second capacitor element 40 separated by the ribs 85a, 85c, and is set to be equal to or greater than the height of the second capacitor element 40 in this embodiment (see FIG. 5). The height of the ribs 86a, 86c is set to be ⅓ or more of the height of the third capacitor element (low-side capacitor element) 50, which is the shorter of the first capacitor element 10B and the third capacitor element 50 separated by the ribs 86a, 86c, and is set to be equal to or greater than the height of the third capacitor element 50 in this embodiment (see FIG. 5).

[0043] The rib 87a is used (1) to position the second capacitor element 40 and the third capacitor element 50 in the housing space of the case 80, (2) to ensure an insulating state between the second capacitor element 40 and the third capacitor element 50, and (3) as an indicator of the injection amount of the sealing resin 90. In this embodiment, the surface (upper surface) of the rib 87a opposite to the bottom 81a serves as an indicator of the lower limit of the injection amount of the sealing resin 90. In addition to ensuring the insulating state by positioning, the rib 87a helps to ensure the insulating state by suppressing tilt of the capacitor elements.

[0044] The ribs 85a-85c, 86a-86c, and 87a-87b correspond to the "partition portion" of the present invention, the rib 87a corresponds to the "first partition wall" of the present invention, the ribs 85b, 86b, and 87b correspond to the "second partition wall" of the present invention, and the ribs 85a, 85c, 86a, and 86c correspond to the "third partition wall" of the present invention.

[0045] The sealing resin 90 seals the first capacitor elements 10A and 10B, the second capacitor element 40, the third capacitor element 50, and parts of the first to fourth bus bars 20, 30, 60, and 70 (see FIG. 1), and may be made of, for example, epoxy resin. Note that the sealing resin 90 is not limited to epoxy resin, and various insulating materials that are used as sealing resins for electronic components may be used. Note that the sealing resin 90 is formed by being injected in a liquid state into the case 80 through the opening 81c of the case 80 and then cured. Note that the sealing resin 90 corresponds to the "sealing resin" of the present invention.

[0046] 2. Capacitor manufacturing process A manufacturing process for the capacitor 1 having the above-described structure will be described below with reference to Figures 10 to 13. Note that the manufacturing process for the capacitor 1 described below is only one example, and any assembly order that can ultimately assemble the capacitor 1 into the state shown in Figure 1 may be used.

[0047] As shown in FIG. 10(a), the first end surface electrodes 12A, 12B of the first capacitor elements 10A, 10B are arranged close to the first element connection electrode flat portion 21 of the first bus bar 20 as close as possible to soldering. In this state, the first bus bar 20 is electrically connected to the first end surface electrodes 12A, 12B by soldering the protruding portions 21ba, 21bb and the protruding portions 21bc, 21bd. In addition, the second end surface electrodes 13A, 13B of the first capacitor elements 10A, 10B are arranged close to the first element connection electrode flat portion 31 of the second bus bar 30 as close as possible to soldering. In this state, the second bus bar 30 is electrically connected to the second end surface electrodes 13B, 13A by soldering the protruding portions 31ba, 31bb and the protruding portions 31bc, 31bd. This results in the state shown in FIG.

[0048] 11(a), the circumferential surface portion in the short direction of the first capacitor element 10A and the circumferential surface portion in the long direction of the second capacitor element 40 face each other with a gap therebetween, and the second end surface electrode 43 of the second capacitor element 40 and the second element connection electrode flat portion 22 (see FIG. 6(b)) of the first bus bar 20 are arranged close enough to each other so that soldering is possible. In this state, the first bus bar 20 is electrically connected by soldering the second end surface electrode 43 to the protruding portion 22a. Also, the circumferential surface portion in the short side direction of the first capacitor element 10B and the circumferential surface portion in the long side direction of the third capacitor element 50 face each other with a gap therebetween, and the circumferential surface portion in the short side direction of the second capacitor element 10B and the circumferential surface portion in the short side direction of the third capacitor element 50 face each other with a gap therebetween, and the second end surface electrode 53 of the third capacitor element 50 and the second element connection electrode flat portion 32 (see FIG. 7) of the second bus bar 30 are arranged close enough to be soldered. In this state, the second bus bar 30 is electrically connected by soldering the second end surface electrode 53 at the protruding portion 32a. Also, the first end surface electrode 42 of the second capacitor element 40 and the element connection electrode flat portion 61 of the third bus bar 60 are arranged close enough to be soldered. In this state, the third bus bar 60 is electrically connected to the first end surface electrode 42 by soldering the protruding portion 61a. The first end surface electrode 52 of the third capacitor element 50 and the element connection electrode flat portion 71 of the fourth bus bar 70 are arranged close enough to each other so that soldering is possible. In this state, the fourth bus bar 70 is electrically connected to the first end surface electrode 52 by soldering the protruding portion 71a. This results in the state shown in FIG. 11(b). In the following, a unit in which the first capacitor elements 10A and 10B, the second capacitor element 40, the third capacitor element 50, and the first to fourth bus bars 20, 30, 60, 70 are assembled in the state shown in FIG. 11(b) will be referred to as a capacitor unit 5 as appropriate.

[0049] As shown in Fig. 12(a), a portion of the capacitor unit 5 is accommodated in the accommodation space of the case 80. The portion of the capacitor unit 5 is accommodated in the case 80 so that the ribs 85a to 85c are positioned between the circumferential surface portion in the short side direction of the first capacitor element 10A and the circumferential surface portion in the long side direction of the second capacitor element 40, the ribs 86a to 86c are positioned between the circumferential surface portion in the short side direction of the first capacitor element 10B and the circumferential surface portion in the long side direction of the third capacitor element 50, and the ribs 87a to 87b are positioned in the space between the circumferential surface portion in the short side direction of the second capacitor element 40 and the circumferential surface portion in the short side direction of the third capacitor element 50 (see Fig. 3). This results in the state shown in Fig. 12(b).

[0050] With a portion of the capacitor unit 5 housed in the housing space of the case 80, as shown in Fig. 13(a), sealing resin 90 such as liquid epoxy resin is injected from the opening 81c of the case 80 (at this time, since the upper surface of the rib 87a is the lower limit indicator of the amount of sealing resin to be injected, the sealing resin 90 is injected until it exceeds the upper surface of the rib 87a), and cured at a predetermined curing temperature to complete the capacitor 1 shown in Fig. 13(b). The injected sealing resin 90 passes between the ribs 85a to 85c, 86a to 86c, and 87a to 87b, between the rib 85a and the frame portion 81b of the case main body 81, between the rib 86a and the frame portion 81b, and over the ribs 85a to 85c, 86a to 86c, and 87a to 87b, and fills the housing space of the case 80.

[0051] 3.Effects According to the above embodiment, the ribs 85a-85c, 86a-86c, 87a-87c are provided at positions corresponding to the arrangement of the first capacitor elements 10A, 10B, the second capacitor element 40 and the third capacitor element 50 in the storage space of the case 80, making it easy to position the first capacitor elements 10A, 10B, the second capacitor element 40 and the third capacitor element 50 in the storage space of the case 80.

[0052] Furthermore, by using the rib 87a both as an indicator for the amount of sealing resin 90 to be injected and for positioning the second capacitor element 40 and the third capacitor element 50, it is possible to easily adjust the positioning of the capacitor elements and the amount of sealing resin 90 to be injected while suppressing an increase in the number of ribs.

[0053] Furthermore, by configuring the multiple ribs from a first rib (87a), a second rib (85b, 86b, 87b) that is shorter than the first rib, and a third rib (85a, 85c, 86a, 86c) that is shorter than the first rib and taller than the second rib, deterioration of the fluidity of the sealing resin 90 can be suppressed compared to when all of the multiple ribs are configured from the first ribs, and the work efficiency of injecting the sealing resin 90 can be improved.

[0054] Furthermore, if the capacitor elements among the first capacitor elements 10A, 10B, the second capacitor element 40, and the third capacitor element 50 are inclined toward a capacitor element with a different application, there is a risk that the necessary insulation distance cannot be secured. However, according to this embodiment, the inclination of the first capacitor element 10A is kept small by the third ribs 85a, 85c, the inclination of the first capacitor element 10B is kept small by the third ribs 86a, 86c, the inclination of the second capacitor element 40 is kept small by the third ribs 85a, 85c or the first rib 87a, and the inclination of the third capacitor element 50 is kept small by the third ribs 86a, 86c or the first rib 87a. This ensures an insulating state between first capacitor element 10A and second capacitor element 40, an insulating state between first capacitor element 10B and third capacitor element 50, and an insulating state between second capacitor element 40 and third capacitor element 50. Furthermore, by using both the first ribs and the third ribs rather than using only the first ribs for the ribs that suppress the inclination of the capacitor elements to be small, deterioration of the fluidity of the sealing resin can be suppressed.

[0055] Furthermore, by making the height of the third ribs (85a, 85c, 86a, 86c) at least 1 / 3 of the height of the lower low-profile capacitor element (second capacitor element 40, third capacitor element 50) separated by the third rib, the insulation between the capacitor elements with different uses separated by the third rib can be more reliably ensured. In particular, by making the height of the third rib equal to or greater than the height of the lower-profile capacitor element (second capacitor element 40, third capacitor element 50), the insulation between the capacitor elements with different uses separated by the third rib can be more reliably ensured.

[0056] In addition, various design modifications can be made to the above-described configuration within the scope of the claims.

[0057] For example, in the above embodiment, the ribs separating the capacitor elements having different uses include a first rib (rib 87a) which is the tallest, a second rib (ribs 85b, 86b, 87b) which is the shortest, and a third rib (ribs 85a, 85c, 86a, 86c) which is shorter than the first rib and taller than the second rib; however, this is not limited to this, and it may be only the first rib and the second rib (for example, the third rib (ribs 85a, 85c, 86a, 86c) may be replaced with the second rib), or it may be only the first rib and the third rib (for example, the second rib (ribs 85b, 86b, 87b) may be replaced with the third rib). By separating two or more types of capacitor elements with different uses using the second or third rib, which is lower than the first rib, the deterioration of the fluidity of the sealing resin can be suppressed compared to when the entire partition is constructed of the first rib, and the work efficiency of injecting the sealing resin can be improved.

[0058] In addition, in the above embodiment, there is one first rib (rib 87a) which is the tallest, three second ribs (ribs 85b, 86b, 87b) which are the shortest, and four third ribs (ribs 85a, 85c, 86a, 86c) which are shorter than the first rib and taller than the second rib, but this is not limited to this and other numbers of first ribs, second ribs and third ribs may be used.

[0059] In the above embodiment, the first to third ribs each protrude from the bottom surface of the case and are separate from each other, but at least two of the first to third ribs may be connected in the horizontal direction to integrally protrude from the bottom surface of the case. For example, the first rib (rib 87a), the second rib (ribs 85b, 86b, 87b) and the third rib (ribs 85a, 85c, 86a, 86c) may be connected in the horizontal direction at the height of the second rib to form a single rib that integrally protrudes from the bottom surface of the case. In this case, partitions corresponding to the first to third partition walls are present in the single integrally formed rib.

[0060] Furthermore, the contents described in the above embodiment and the contents described in the above modified examples may be combined as appropriate.

[0061] The present invention is widely applicable to capacitors in which two or more types of capacitor elements having different uses are housed in a case. [Explanation of symbols]

[0062] 1: Capacitor 10A, 10B, 40, 50: Capacitor element 20,30,60,70: Busbar 80: Case 81: Case body 85a~85c, 86a~86c, 87a~87b: Ribs 90: Sealing resin

Claims

1. Two or more types of capacitor elements having different uses; a case that houses the plurality of capacitor elements in a housing space; a sealing resin that seals the plurality of capacitor elements accommodated in the accommodation space; a partition portion that protrudes from an inner bottom portion of the case into the storage space and separates the plurality of capacitor elements; Equipped with The partition portion has a first partition wall that serves as an indicator of the injection amount of the sealing resin, and a second partition wall that is lower in height than the first partition wall and can position the capacitor element within the accommodation space. A capacitor characterized by:

2. 2. The capacitor according to claim 1, wherein the first partition wall serves as an indicator for an injection amount of the sealing resin and is disposed at a position that allows the capacitor element to be positioned within the accommodation space.

3. 3. The capacitor according to claim 1, wherein the partition further comprises a third partition wall that is lower than the first partition wall and higher than the second partition wall.

4. The capacitor according to claim 3, wherein the height of the third partition wall is at least 1 / 3 of the height of the lower-back capacitor element which is the lower of the two capacitor elements separated by the third partition wall.

5. 5. The capacitor according to claim 4, wherein the third partition wall has a height equal to or greater than that of the lower-profile capacitor element.

Citation Information

Patent Citations

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