Dynamic vibration absorber, system, lithography device and manufacturing method of article

Abstract

To provide a dynamic vibration absorber capable of preventing a deterioration of a vibration control performance.SOLUTION: A dynamic vibration absorber reduces a vibration of an object, and includes a mass body and an elastic member arranged between the object and the mass body. The mass body includes: a container fixed to the elastic member; a porous body having a plurality of pores and arranged inside the container; and a liquid supplied to the porous body.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a dynamic vibration absorber, a system, a lithographic apparatus, and a method for manufacturing an article. [Background technology]

[0002] In recent years, the line width of patterns formed on a substrate has become very small due to the high integration and miniaturization of semiconductor integrated circuits, which has led to a demand for further miniaturization in the lithography process for forming patterns on the substrate.

[0003] In a lithography apparatus such as an exposure apparatus, a pattern is formed in a predetermined area (pattern area) on a substrate. Therefore, in order to meet the demand for finer patterns, it is important to align the position of the substrate with high precision.

[0004] In a lithography apparatus, in order to prevent deterioration in the alignment accuracy of the substrate, a dynamic vibration absorber for absorbing vibrations is sometimes arranged in a unit that generates vibrations, such as a substrate stage that holds and moves the substrate.

[0005] Patent Document 1 discloses a dynamic vibration absorber in which a weight is connected to a structure to be damped by a spring element, and liquid is sealed in a liquid tank disposed on the weight. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 9-79314 Summary of the Invention [Problem to be solved by the invention]

[0007] In the dynamic vibration absorber disclosed in Patent Document 1, when the weight vibrates and the liquid sealed in the liquid tank rippling (swaying), further vibrations are excited in the weight, which may reduce the vibration damping performance of absorbing the vibrations of the vibration-damped structure.

[0008] Therefore, an object of the present invention is to provide a dynamic vibration absorber, a system, a lithography apparatus, and a method for manufacturing an article, which suppress the deterioration of vibration damping performance. [Means for solving the problem]

[0009] The dynamic vibration absorber of the present invention is a dynamic vibration absorber that reduces vibrations of an object, and comprises a mass body and an elastic member arranged between the object and the mass body, the mass body comprising a container fixed to the elastic member, a porous body having a plurality of holes and arranged inside the container, and a liquid supplied to the porous body. Effect of the Invention

[0010] According to the present invention, it is possible to provide a dynamic vibration absorber, a system, a lithography apparatus, and a method for manufacturing an article, which are capable of suppressing a decrease in vibration damping performance. [Brief description of the drawings]

[0011] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3] FIG. 2 is a cross-sectional view of a mass body, a porous body, and a fixing portion. [Figure 4] FIG. [Diagram 5] FIG. [Figure 6] 11 is a diagram showing the relationship between the vibration frequency of the target 1 and the amount of liquid supplied. [Figure 7] 1 is a flowchart illustrating the manufacture of a device. [Figure 8] 8 is a detailed flowchart of the wafer process in step 4 of the flowchart shown in FIG. 7. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a plurality of features, not all of these features are essential to the invention, and the plurality of features may be combined in any manner. Furthermore, in the accompanying drawings, the same reference numbers are given to the same or similar configurations, and duplicated descriptions are omitted. In addition, in the accompanying drawings, the drawings may be drawn at a scale different from the actual scale in order to make the present embodiment easy to understand.

[0013] In the following, the direction parallel to the optical axis AX of the projection optical system 101 described below is referred to as the Z axis, the direction in which the reticle R and substrate W are scanned during exposure within a plane perpendicular to the Z axis (scanning direction) is referred to as the Y axis, and the direction perpendicular to the Y axis within the same plane (non-scanning direction) is referred to as the X axis.

[0014] First Embodiment An exposure apparatus 1000 as a lithography apparatus will be described with reference to Fig. 1. Fig. 1 is a diagram showing the exposure apparatus 1000. The exposure apparatus 1000 is, for example, a projection type exposure apparatus that projects (transfers) an image of a pattern formed (drawn) on an original R onto a substrate W by a scan-and-repeat method. In other words, the exposure apparatus 1000 exposes the substrate W to light from the original R on which the pattern is formed. The exposure apparatus 1000 includes an illumination optical system 106, an original stage 103, a projection optical system 101, a substrate stage 105, a measurement device (measurement means), and a control unit.

[0015] The illumination optical system 106 adjusts light emitted from a light source that generates pulsed light, such as an excimer laser (not shown), and then guides the light to the original R, thereby illuminating the original R.

[0016] The original stage 103 can move at least parallel to the X-axis and Y-axis while holding an original R made of, for example, quartz glass on which a pattern (for example, a circuit pattern) to be transferred onto a substrate W is formed. During exposure, the original stage 103 performs scanning movement at a constant speed in a direction parallel to the Y-axis within an XY plane perpendicular to the optical axis AX of the projection optical system 101, and performs correction movement in a direction parallel to the X-axis so as to perform scanning while maintaining a target position. The original stage 103 is also provided with a bar mirror 120. A first interferometer 121 emits light toward the bar mirror 120 and measures the distance between the bar mirror 120, thereby making it possible to constantly measure position information of the original stage 103 in directions parallel to each axis.

[0017] The projection optical system 101 guides light that has passed through the original R onto the substrate W so that an image of the pattern formed on the original R is projected onto the substrate W at a predetermined magnification (e.g., 1 / 2). As a result, the image of the pattern formed on the original R is projected onto the substrate W, which is made of, for example, single crystal silicon and has a resist (photosensitive agent) applied on its surface. Here, the image plane of the projection optical system 101 is perpendicular to the Z axis (i.e., a direction parallel to the optical axis AX of the projection optical system 101).

[0018] The substrate stage 105 holds the substrate W via a chuck (not shown) and can move (rotate) in directions parallel to the X-axis, Y-axis, and Z-axis, and further in the θX, θY, and θZ directions, which are rotational directions around each axis. The substrate stage 105 is also provided with a bar mirror 123. A second interferometer 124 emits light toward the bar mirror 123 and measures the distance to the bar mirror 123, thereby making it possible to constantly measure position information of the substrate stage 105 in directions parallel to each axis.

[0019] The measurement device measures the position and inclination (hereinafter, these may be collectively referred to as "surface position") in a direction parallel to the Z axis of the surface of the substrate W held by the substrate stage 105. The measurement device also includes a light projecting system that projects a measurement light beam toward the substrate W, and a light receiving system that receives the light beam reflected from the substrate W.

[0020] The light projection system of the measurement device is composed of a measurement light source 110, a collimator lens 111, a slit member 112, a light projection side optical system 113, and a light projection side mirror 114. The measurement light source 110 is a light source such as a lamp or a light emitting diode, and emits a measurement light beam toward the substrate W. The collimator lens 111 converts the light beam emitted from the measurement light source 110 into a parallel light beam with a substantially uniform intensity distribution in a cross section. The slit member 112 is, for example, a pair of prisms bonded together so that their inclined surfaces face each other, and a light-shielding film having a plurality of openings (for example, nine pinholes) and made of chrome or the like is provided on the bonded surface. The collimator lens 111 splits the parallel light beam into, for example, nine light beams. The light projection side optical system 113 is a bi-telecentric optical system, and guides the nine light beams that have passed through the slit member 112 to nine measurement points on the substrate W via the light projection side mirror 114. Here, the plane having the pinhole of the slit member 112 and the plane including the surface of the substrate W satisfy the Scheimpflug condition with respect to the light projection side optical system 113. Also, in the exposure apparatus 1000, nine light beams from the light projection system of the measurement device are incident on the substrate W so that the angle of incidence Φ (angle with respect to the optical axis AX of the projection optical system 101) is 70° or more. Then, the nine light beams are incident on the substrate W from a direction rotated by θ (for example, 22.5°) with respect to the Y axis in the XY plane so that the light receiving system of the measurement device described next can observe the nine measurement points on the substrate W independently of one another.

[0021] Next, the light receiving system of the measurement device is composed of a light receiving side mirror 115, a light receiving side optical system 116, a correction optical system 118, and a photoelectric conversion means 119. The light receiving side optical system 116 is a bi-telecentric optical system, and guides nine light beams from the substrate W reflected by the light receiving side mirror 115 to the photoelectric conversion means 119. The light receiving side optical system 116 is provided with a stopper aperture (not shown), which can cut high-order diffracted light (noise light) generated by a pattern already formed on the substrate W at each of the nine measurement points. The correction optical system 118 includes nine correction lenses, and collects the nine light beams, the optical axes of which are parallel to each other as a result of passing through the light receiving side optical system 116, into spot lights having the same size on the detection surface of the photoelectric conversion means 119. The photoelectric conversion means 119 is composed of, for example, a group of nine one-dimensional CCD line sensors, and detects the intensity of each light beam incident on the detection surface, and then outputs the detection result to the arithmetic circuit 126 .

[0022] The photoelectric conversion means 119 may be one in which a plurality of two-dimensional position measurement elements are arranged. The light receiving optical system 116, the correction optical system 118, and the photoelectric conversion means 119 in the light receiving system of the measurement device are previously subjected to tilt correction so that each measurement point on the substrate W and the detection surface of the photoelectric conversion means 119 are conjugate with each other. This makes it possible to suppress position changes in the pinhole image on the detection surface of the photoelectric conversion means 119 caused by local tilts at each measurement point on the substrate W. This makes it possible to detect changes in height along the optical axis AX at each measurement point on the substrate W from changes in the pinhole image on the detection surface of the photoelectric conversion means 119.

[0023] The control unit is composed of a main control unit 127, an original position control system 122, a substrate position control system 125, and an arithmetic circuit 126. The main control unit 127 is composed of, for example, a computer including a processor and a memory, and is connected to each component of the exposure apparatus 1000 (and the control system that controls them) via a line to centrally control the operation of each component according to a program or the like. At least one of the components of the control unit may be provided integrally with the other components of the exposure apparatus 1000, that is, in the same housing as the housing in which the other components of the exposure apparatus 1000 are provided. At least one of the components of the control unit may be provided separately from the other components of the exposure apparatus 1000, that is, in a housing different from the housing in which the other components of the exposure apparatus 1000 are provided.

[0024] The original position control system 122 controls the operations of the original stage 103 and the first interferometer 121 based on a drive command from the main controller 127. The substrate position control system 125 controls the operations of the substrate stage 105 and the second interferometer 124 based on a drive command from the main controller 127. The arithmetic circuit 126 calculates the intensity values ​​of each of the light beams reflected from the nine measurement points on the substrate W based on the detection results obtained from the photoelectric conversion means 119.

[0025] The main controller 127 can adjust the position of the substrate W in the XY plane and in the direction parallel to the Z axis so that the slit image of the original R is formed in a predetermined area on the substrate W. Here, the position in the XY plane means the position in the direction parallel to the X axis and the Y axis and the rotation angle θZ around the Z axis, and the position in the direction parallel to the Z axis means the height in the direction parallel to the Z axis and the rotation angles θX and θY around the X axis and the Y axis. The main controller 127 transmits drive commands to the original position control system 122 and the substrate position control system 125 to perform scanning exposure for forming the pattern on the original R on the substrate W while synchronously scanning the original stage 103 and the substrate stage 105 with each other. When scanning the original stage 103 in the Y direction, the main controller 127 scans the substrate stage 105 in the Y direction at a speed corrected by the reduction magnification of the projection optical system 101. In addition, the scanning speed of the original stage 103 is determined in advance to be advantageous for productivity, based on the width in the scanning direction of a masking blade (not shown) provided in the illumination optical system 106, the sensitivity of the resist applied to the surface of the substrate W, and the like.

[0026] The dynamic vibration absorber 100 is disposed on an object that may generate vibration, such as an original stage 103 that holds an original R and moves, and a substrate stage 105 that holds a substrate W and moves, to reduce vibration of the object. In the example of FIG. 1, the dynamic vibration absorber 100 is disposed on the original stage 103 and the substrate stage 105, but it may be disposed on either the original stage 103 or the substrate stage 105. The dynamic vibration absorber 100 may also be disposed on an object, such as a transport hand (not shown) that moves while holding an original R or a substrate W in a transport mechanism that transports the original R or the substrate W. In this way, the dynamic vibration absorber 100 is disposed on an object that may generate vibration due to movement, etc., to reduce vibration of the object.

[0027] Next, the dynamic vibration absorber 100 according to this embodiment will be described. FIG. 2 is a diagram showing the dynamic vibration absorber 100. The dynamic vibration absorber 100 reduces the vibration of the object 1 by utilizing the inertial force of a mass body arranged on the object 1 via an elastic member 3. The dynamic vibration absorber 100 is composed of an elastic member 3, a container 4, a liquid 8, a porous body 5, a fixing part 9, and a lid 6, and the container 4, the liquid 8, the porous body 5, the fixing part 9, and the lid 6 can be configured as a mass body. In other words, the mass body of the dynamic vibration absorber 100 can include the container 4, the liquid 8, the porous body 5, the fixing part 9, and the lid 6. Here, the lid 6 is not an essential component, and the dynamic vibration absorber 100 according to this embodiment can also include a form in which the lid 6 is not configured.

[0028] The elastic member 3 is disposed between the target object 1 and a mass body (container 4), and is adhered and fixed to the target object 1 with an adhesive 2. The elastic member 3 may be, for example, an elastic body such as rubber or silicone. The elastic member 3 may be, for example, a damping member such as a damper, a spring member such as a coil spring or a leaf spring, or a damping member and a spring member. Instead of being adhered and fixed with the adhesive 2, the elastic member 3 may be fixed to the target object 1 by a fastening member such as a bolt or a screw.

[0029] Next, the container 4, the porous body 5, and the fixing part 9 will be described. Fig. 3 is a diagram showing the container 4, the porous body 5, and the fixing part 9. The container 4 is adhered and fixed with an adhesive 2 to the side of the elastic member 3 opposite to the side to which the object 1 is attached. Instead of being adhered and fixed with the adhesive 2, the container 4 may be fixed to the elastic member 3 with a fastening member such as a bolt or a screw.

[0030] The container 4 may be fixed to the elastic member 3 by fastening parts such as bolts and screws. The container 4 has a hollow structure with a space formed inside, the porous body 5 is disposed inside the container 4, and a liquid 8 for adjusting the mass of the mass body is supplied to the porous body disposed inside the container 4. An opening 10 is formed in the upper part of the container 4. The liquid 8 is supplied from the opening 10 to the inside of the container 4. A screw portion 4a may be provided on the inner side surface of the container 4 to fix a lid 6 described later. In the examples of FIG. 2 and FIG. 3, the opening 10 is formed in the upper part of the container 4, but it may be formed in the lower part or the side surface of the container 4.

[0031] The porous body 5 is an object having a plurality of holes, and the liquid 8 is supplied to the plurality of holes of the porous body 5. The porous body 5 may be, for example, a sintered body obtained by sintering stainless steel or ceramic particles (powder). The porous body 5 may be fixed inside the container 4 by a fixing part 9. That is, since the container 4 may move due to vibration from the target object 1, a fixing part 9 may be provided to fix the porous body 5 to the container 4 so that the porous body 5 does not move relative to the container 4. The fixing part 9 may fix the porous body 5 in a releasable manner so that the porous body 5 can be removed.

[0032] The fixing parts 9 are fastening parts such as bolts or screws, and can release the fixation of the porous body 5. The opening 10 formed in the container 4 is larger than the porous body 5 so that the porous body 5 can be put in and taken out, and there is a gap between the porous body 5 and the container 4. Therefore, by releasing the fixation of the porous body 5 by the fixing parts 9, the porous body 5 can be taken out from the opening 10 of the container 4. In other words, the porous body 5 is releasably fixed by the fixing parts 9, and is arranged so as to be removable from the container 4.

[0033] Here, when the liquid 8 is stored inside the container 4, the liquid 8 clings to the particles that make up the porous body 5 due to the capillary phenomenon, and the liquid 8 is retained inside the porous body 5. By retaining the liquid 8 inside the porous body 5, the liquid 8 is prevented from moving freely inside the container 4, and even if the container 4 vibrates, the liquid 8 inside the container 4 is prevented from rippling (swaying).

[0034] Furthermore, when the porous body 5 is removed while the liquid 8 is stored inside the container 4, the porous body 5 is removed with the liquid 8 held inside the porous body 5. In other words, by removing the porous body 5, a part of the liquid 8 stored inside the container 4 can be removed.

[0035] Next, the lid 6 will be described. FIG. 4 is a diagram showing a cross section of the lid 6. The lid 6 is attached to the opening 10 of the container 4 in a state in which the porous body 5 is fixed inside the container 4 and the liquid 8 is stored therein, and seals the inside of the container 4. That is, the container 4 moves in response to vibration from the object 1, and the liquid 8 inside the container 4 evaporates, so the lid 6 seals the inside of the container 4 so that the liquid 8 does not leak from inside the container 4 to the outside. A ring member 7 made of an elastic body such as rubber or silicon may be disposed between the lid 6 and the container 4 to further increase the degree of sealing inside the container 4. In addition, when a screw portion 4a (first screw portion) is provided on the inner side surface of the container 4, a screw portion 4b (second screw portion) that engages with the screw portion 4a is provided on the lid 6.

[0036] In the dynamic vibration absorber 100 according to this embodiment, when the liquid 8 is supplied into the container 4, the liquid 8 is stored inside the pores of the porous body 5. Therefore, even if the container 4 moves due to vibrations from the target object 1, the liquid 8 rippling can reduce vibrations excited in the container 4.

[0037] As described above, according to the dynamic vibration absorber of this embodiment, the excitation of vibrations in the mass body due to rippling of the internal liquid 8 is reduced, thereby suppressing a decrease in the vibration damping performance of the dynamic vibration absorber.

[0038] <Second embodiment> Next, a system for reducing vibration of an object 1 according to a second embodiment will be described. Matters not mentioned as the second embodiment may follow the first embodiment. FIG. 5 is a diagram showing a system for reducing vibration of an object 1. The system according to this embodiment has a dynamic vibration reducer 100 and a supply device 200 that supplies liquid 8 to the dynamic vibration reducer 100. The supply device 200 includes a tank 11, a supply unit 20, and a control unit 14. The supply unit 20 is composed of a pump 12, an opening / closing unit 13, and a discharge unit 16. The tank 11 stores the liquid 8 to be supplied to the inside of the container 4 of the dynamic vibration reducer 100. The pump 12 sends out the liquid 8 from the tank 11, and the opening / closing unit 13 switches between supplying and stopping the liquid 8 by opening and closing the flow path of the liquid 8 sent out from the tank 11. The opening / closing unit 13 may include, for example, an electromagnetic valve that opens and closes the flow path of the liquid 8 by switching the current flowing through an electromagnet. The discharge part 16 supplies the liquid 8 supplied from the opening / closing part 13 to the inside of the container 4 of the dynamic vibration absorber 100. The discharge part 16 can include, for example, a nozzle having a discharge port for discharging the liquid 8.

[0039] The system according to this embodiment may have a measurement unit 17 which is a sensor for measuring data related to vibration of the object 1. The measurement unit 17 is, for example, an acceleration sensor that measures the acceleration of the object 1, and the data related to the vibration of the object 1 can be data on the acceleration of the object 1. The measurement unit 17 is, for example, a speed sensor that measures the speed of the object 1, and the data related to the vibration of the object 1 can be data on the speed of the object 1. The measurement unit 17 is, for example, a position sensor that measures the position of the object 1, and the data related to the vibration of the object 1 can be data on the position of the object 1. In other words, the measurement unit 17 measures any one of the acceleration, speed, and position of the object 1.

[0040] The control unit 14 is composed of, for example, a computer including a processor and a memory, and controls the pump 12 and the opening / closing unit 13 to control the amount of liquid 8 supplied. The control unit 14 may also include a display unit 15 that displays the amount of liquid 8 supplied.

[0041] The control unit 14 acquires the supply amount of the liquid 8 based on the vibration frequency of the object 1. The vibration frequency of the object 1 may be, for example, the natural vibration frequency of the object 1. The vibration frequency of the object 1 may be acquired, for example, from data relating to the vibration of the object 1 measured by a measuring unit 17 arranged on the object 1, or may be acquired from data relating to the vibration of the object 1 acquired in advance by an experiment or simulation. The vibration frequency of the object 1 may be stored in a storage unit (not shown) of the control unit 14.

[0042] 6 is a diagram showing the relationship between the vibration frequency of the object 1 and the supply amount of the liquid 8. The relationship between the vibration frequency of the object 1 and the supply amount of the liquid 8 is obtained in advance by experiments or simulations. For example, the mass of the mass body of the dynamic vibration absorber 100 for reducing the vibration of the object 1 is obtained at a plurality of vibration frequencies of the object 1, and the relationship between the vibration frequency of the object 1 and the supply amount of the liquid 8 is obtained by approximate calculation or the like. At this time, the masses of the container 4, the porous body 5, etc. included in the mass body are known data, and the supply amount of the liquid 8 is obtained by subtracting the masses of the container 4, the porous body 5, etc. from the mass of the mass body.

[0043] Information relating to the relationship between the vibration frequency of the object 1 and the supply amount of the liquid 8 is stored in a storage unit (not shown) such as a memory of the control unit 14. The control unit 14 determines the supply amount of the liquid 8 to be supplied into the container 4 of the dynamic vibration absorber 100 based on the relationship between the vibration frequency of the object 1 and the supply amount of the liquid 8 and the acquired vibration frequency of the object 1. Then, the control unit 14 determines the flow rate per unit time of the liquid 8 supplied from the pump 12 and the opening and closing time of the opening and closing unit 13 based on the determined supply amount of the liquid 8, and controls the pump 12 and the opening and closing unit 13.

[0044] As described above, according to the system of this embodiment, the liquid 8 required to reduce the vibration of the object can be supplied to the dynamic vibration absorber, thereby suppressing the deterioration of the vibration damping performance of the dynamic vibration absorber.

[0045] <Production method> As an example of an article, a method for manufacturing a device (semiconductor device, magnetic storage medium, liquid crystal display element, etc.), a color filter, or a hard disk will be described. The manufacturing method includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate, etc.) by irradiating light from a light source unit to the substrate using a lithography apparatus (for example, an exposure apparatus, a drawing apparatus, etc.) having a light source unit. The manufacturing method further includes a step (processing step) of processing the substrate on which the pattern is formed. The processing step may include a step of removing a residual film of the pattern. The processing step may also include a step of etching the substrate using the pattern as a mask. The processing step may also include other well-known steps such as dicing, bonding, and packaging. The manufacturing method of the article in this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to the conventional method.

[0046] Next, as an example of a method for manufacturing an article, an embodiment of a device manufacturing method using the above-mentioned exposure apparatus will be described with reference to Figures 8 and 9. Figure 7 is a flow chart for explaining the manufacture of devices (semiconductor chips such as ICs and LSIs, LCDs, CCDs, etc.). Here, a method for manufacturing semiconductor chips will be described as an example.

[0047] In step S1 (circuit design), the circuit of the semiconductor device is designed. In step S2 (mask production), a mask (master) is produced based on the designed circuit pattern. In step S3 (wafer production), a wafer (substrate) is produced using a material such as silicon. Step S4 (wafer process) is called the pre-process, in which the mask and wafer are used to form an actual circuit on the wafer using lithography technology with the exposure device described above. Here, the exposure device forms a circuit pattern on the wafer by illuminating the master on which the circuit pattern is formed and projecting an image of the circuit pattern of the master onto the wafer. Step S5 (assembly) is called the post-process, in which the wafer produced in step S4 is used to make a semiconductor chip, and includes assembly processes such as assembly processes (dicing, bonding) and packaging processes (chip encapsulation). In step S6 (inspection), the semiconductor device produced in step S5 is inspected, such as an operation confirmation test and a durability test. After going through these processes, the semiconductor device is completed and shipped (step S7).

[0048] FIG. 8 is a detailed flowchart of the wafer process in step S4. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the surface of the wafer. In step S13 (electrode formation), electrodes are formed on the wafer by deposition. In step S14 (ion implantation), ions are implanted into the wafer. In step S15 (resist processing), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is exposed onto the wafer by an exposure device. In step S17 (development), the exposed wafer is developed. In step S18 (etching), the parts other than the developed resist image are scraped off. In step S19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

[0049] Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

[0050] In addition, an exposure apparatus has been described as an example of a lithography apparatus, but the present invention is not limited thereto. An example of a lithography apparatus may be an imprint apparatus that forms a pattern of an imprint material on a substrate using a mold (template) having a concave-convex pattern. An example of a lithography apparatus may be a planarization apparatus that uses a mold (flat template) having a flat portion without a concave-convex pattern to mold a composition on a substrate so as to flatten it. An example of a lithography apparatus may be a drawing apparatus that draws on a substrate with a charged particle beam (such as an electron beam or an ion beam) via a charged particle optical system to form a pattern on the substrate.

[0051] <Other embodiments> The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.

[0052] <Summary of the embodiment> The disclosure herein includes the following dynamic vibration absorbers, systems, lithographic apparatus, and methods of manufacturing articles.

[0053] (Item 1) A dynamic vibration absorber for reducing vibration of an object, comprising: A mass body; an elastic member disposed between the object and the mass; The mass is A container fixed to the elastic member; A porous body having a plurality of holes and disposed inside the container; A liquid supplied to the porous body. A dynamic vibration absorber characterized by:

[0054] (Item 2) The mass body has a fixing portion that fixes the porous body inside the container. 2. The dynamic vibration absorber according to item 1,

[0055] (Item 3) The container has an opening formed therein, The mass has a lid attached to the opening. 3. The dynamic vibration absorber according to item 1 or 2,

[0056] (Item 4) The opening is larger than the porous body. 4. The dynamic vibration absorber according to item 3,

[0057] (Item 5) The lid has a ring member for sealing the inside of the container. 5. The dynamic vibration absorber according to item 3 or 4,

[0058] (Item 6) A first screw portion is provided on an inner side surface of the container, The lid is provided with a second screw portion that engages with the first screw portion. 6. The dynamic vibration absorber according to any one of items 3 to 5,

[0059] (Item 7) The porous body is a sintered body obtained by sintering particles. 7. The dynamic vibration absorber according to any one of items 1 to 6,

[0060] (Item 8) The porous body is a sintered body obtained by sintering stainless steel or ceramic particles. 7. The dynamic vibration absorber according to any one of items 1 to 6,

[0061] (Item 9) 1. A system for reducing vibration of an object, comprising: A dynamic vibration absorber according to any one of items 1 to 8, which is disposed on the target object; a supply device for supplying liquid to the dynamic vibration absorber, The supply device comprises: A tank for storing the liquid; a supply unit that supplies the liquid stored in the tank to the dynamic vibration absorber; and a control unit that controls the supply unit so as to supply the dynamic vibration absorber with the liquid required to reduce the vibration of the object based on data related to the vibration of the object on which the dynamic vibration absorber is disposed and a relationship between the vibration frequency of the object and the supply amount of the liquid. A system characterized by:

[0062] (Item 10) A measurement unit that measures data related to the vibration of the object. 10. The system according to item 9, characterized in that

[0063] (Item 11) The measurement unit measures any one of the acceleration, the velocity, and the position of the object. 11. The system according to item 10, characterized in that

[0064] (Item 12) The control unit has a display unit that displays the supply amount of the liquid supplied to the inside of the mass body. 12. The system according to any one of items 9 to 11,

[0065] (Item 13) 1. A lithographic apparatus for forming a pattern on a substrate, comprising: a substrate stage that holds and moves the substrate; The dynamic vibration absorber according to any one of items 1 to 8 is disposed on the substrate stage, forming the pattern on the substrate held by the substrate stage; 13. A lithography apparatus comprising:

[0066] (Item 14) 1. A lithographic apparatus for forming a pattern on a substrate, comprising: an original stage which holds and moves an original; The dynamic vibration absorber according to any one of items 1 to 8 is disposed on the master stage, transferring a pattern formed on the original held by the original stage onto the substrate; 13. A lithography apparatus comprising:

[0067] (Item 15) Forming a pattern on a substrate using a lithographic apparatus according to item 13 or 14; and manufacturing an article from the patterned substrate. A method for producing an article.

Claims

1. A dynamic vibration absorber for reducing vibration of an object, comprising: A mass body; an elastic member disposed between the object and the mass; The mass is A container fixed to the elastic member; A porous body having a plurality of holes and disposed inside the container; A liquid supplied to the porous body. A dynamic vibration absorber characterized by:

2. The mass body has a fixing portion that fixes the porous body inside the container.

2. The dynamic vibration absorber according to claim 1.

3. The container has an opening formed therein, The mass has a lid attached to the opening.

2. The dynamic vibration absorber according to claim 1.

4. The opening is larger than the porous body.

4. The dynamic vibration absorber according to claim 3.

5. The lid has a ring member for sealing the inside of the container.

4. The dynamic vibration absorber according to claim 3.

6. A first screw portion is provided on an inner side surface of the container, The lid is provided with a second threaded portion that engages with the first threaded portion.

4. The dynamic vibration absorber according to claim 3.

7. The porous body is a sintered body obtained by sintering particles.

2. The dynamic vibration absorber according to claim 1.

8. The porous body is a sintered body obtained by sintering stainless steel or ceramic particles.

2. The dynamic vibration absorber according to claim 1.

9. 1. A system for reducing vibration of an object, comprising: The dynamic vibration absorber according to claim 1 , disposed on the object; a supply device for supplying liquid to the dynamic vibration absorber, The supply device comprises: A tank for storing the liquid; a supply unit that supplies the liquid stored in the tank to the dynamic vibration absorber; and a control unit that controls the supply unit so as to supply the dynamic vibration absorber with the liquid required to reduce the vibration of the object based on data related to the vibration of the object on which the dynamic vibration absorber is disposed and a relationship between the vibration frequency of the object and the supply amount of the liquid. A system characterized by:

10. A measurement unit that measures data related to the vibration of the object.

10. The system of claim 9.

11. The measurement unit measures any one of the acceleration, the velocity, and the position of the object. The system of claim 10.

12. The control unit has a display unit that displays the supply amount of the liquid supplied to the inside of the mass body.

10. The system of claim 9.

13. 1. A lithographic apparatus for forming a pattern on a substrate, comprising: a substrate stage that holds and moves the substrate; the dynamic vibration reducer according to claim 1 disposed on the substrate stage; forming the pattern on the substrate held by the substrate stage; 13. A lithography apparatus comprising:

14. 1. A lithographic apparatus for forming a pattern on a substrate, comprising: an original stage which holds and moves an original; the dynamic vibration absorber according to claim 1 disposed on the master stage; transferring a pattern formed on the original held by the original stage onto the substrate; 13. A lithography apparatus comprising:

15. forming a pattern on a substrate using a lithographic apparatus according to claim 13 or 14; and manufacturing an article from the patterned substrate. A method for producing an article comprising the steps of:

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