Electronic device
By designing a synergistic structure between the first and second optical films in the electronic device, the optical performance problem caused by inaccurate position of the optical film is solved, and the optical effect of the electronic device is improved.
Patent Information
- Application Number
- JP2024110078
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-20
- Filing Date
- 2024-07-09
- Publication Date
- 2025-01-29
AI Technical Summary
In the prior art, the multi-layer optical film of an electronic device is easily exposed to the gap between the optical films when assembled or rotated, affecting the optical performance, and there are errors in the traditional manual positioning method.
By adopting a collaborative structural design between the first and second optical films, by providing a synergistic portion and a joint structure on the optical film, the position of the optical film is fixed by using the first and second portions of the joint portion to reduce rotation and exposure of the optical film.
Effectively fix the position of the optical film, reduce the exposure of the bottom plate, and improve the optical quality of electronic devices.
Smart Images
Figure 2025014113000001_ABST
Abstract
Description
[Technical field]
[0001] The present application relates to an electronic device, and more particularly to an electronic device with a light-emitting function. [Background technology]
[0002] Electronic devices such as direct backlight modules or displays generally include a number of optical films, and when the optical films disposed on the edges of the electronic devices are misaligned or rotated during assembly, the bottom plate of the electronic devices will be exposed in the gaps between the optical films, which will affect the overall optical quality presentation effect of the backlight module or display device, so it is necessary to restrict the positions of these optical films. The current method for restricting the positions of the optical films is to bond these optical films by manual visual methods, which may cause errors, such as inconsistent implementation results when different operators are involved.
[0003] Therefore, there is a need for an electronic device having a new structure to improve the above problems. Summary of the Invention [Means for solving the problem]
[0004] The present application provides an electronic device including a substrate, a first optical film, and a second optical film. The first optical film is disposed on the substrate and includes an engagement portion. The second optical film is disposed on the substrate and interferes with the engagement portion of the first optical film. The engagement portion includes a first portion, a second portion, and an engagement structure, the first portion and the second portion being located on opposite sides of the engagement structure, and the first portion and the second portion being located on opposite surfaces of the second optical film, respectively. [Brief description of the drawings]
[0005] [Figure 1A] 1 is a schematic exploded view of an electronic device according to an embodiment of the present application; [Figure 1B]FIG. 2 is a detailed schematic diagram of an edge portion of an electronic device according to an embodiment of the present application. [Figure 1C] FIG. 2 is a cross-sectional view taken along line AA' in FIG. 1B. [Diagram 2] 4 is a schematic diagram of an engagement portion of a first optical film according to an embodiment of the present application. FIG. [Figure 3A] FIG. 2 is a schematic diagram of a bump and a through hole according to an embodiment of the present application. [Figure 3B] FIG. 2 is a schematic diagram of a bump and a through hole according to an embodiment of the present application. [Figure 3C] FIG. 2 is a schematic diagram of a bump and a through hole according to an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0006] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Exemplary embodiments of the present application will now be described in detail, examples of which are illustrated in the drawings, in which like or similar parts are designated by the same reference numerals throughout the drawings and the description.
[0007] Throughout this specification and the appended claims, certain terms are used to refer to particular components. One of ordinary skill in the art will understand that sensor manufacturers may refer to the same components by different names. This specification is not intended to distinguish between components that have the same function but different names. In the following specification and claims, the terms "containing," "including," and "including" are open-ended conjunctions and should be construed to mean "including, but not limited to."
[0008] The terms "about," "substantially," or "approximately" are generally interpreted as within 10% of a given value or range, or within 5%, 3%, 2%, 1%, or 0.5% of a given value or range.
[0009] Ordinal numbers used in the specification and claims, such as "first," "second," and the like, are used to modify an element, but do not themselves imply or represent that the element (or elements) has a previous element, nor do they represent an order of one element relative to another, or an order in a manufacturing process; the use of these ordinal numbers is only used to clearly distinguish an element having a particular name from another element of the same name. The same terms may not be used in the claims and the specification, and thus a first element in the specification may be a second element in the claims.
[0010] In this application, "the specified range is from a first numerical value to a second numerical value," "the specified range is within the range of the first numerical value to the second numerical value," or "the specified range is between the first numerical value and the second numerical value" indicates that the specified range includes the first value, the second value, and any other values therebetween.
[0011] It will be appreciated that, according to embodiments of the present application, the depth, thickness, width or height of each element, or the spacing or distance between elements, can be measured using an optical microscope (OM), a scanning electron microscope (SEM), a film thickness profile measuring device (α-step), an ellipsometer, or other suitable method. According to some embodiments, a cross-sectional structure image including the element to be measured is obtained using a scanning electron microscope, and the depth, thickness, width or height of each element, or the spacing or distance between elements can be measured.
[0012] The electronic device disclosed herein may be, but is not limited to, an in-vehicle device, a sensor, a display device, a backlight device, an antenna device, a splicing device, a touch display, a curved display, or a free shape display. The electronic device may be, but is not limited to, a liquid crystal, a light emitting diode, a fluorescence, a phosphor, or other suitable display medium, or a combination thereof. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensor may be, but is not limited to, a sensor that detects capacitance, light, thermal energy, or ultrasonic waves. The splicing device may be, but is not limited to, a display splicing device or an antenna splicing device. It should be noted that the electronic device may be, but is not limited to, any combination of the above. It should be noted that the electronic device may be, but is not limited to, a foldable or flexible electronic device. It should be noted that the electronic device may be, but is not limited to, any combination of the above. The electronic device may have a rectangular, circular, polygonal, curved edged or other suitable shape. The electronic device may have peripheral systems, such as a driving system, a control system, a light source system, a shelf system, etc., to support a display device, an antenna device, or a splicing device. The electronic device may also include an electronic unit, which may include passive and active components, such as, but not limited to, a capacitor, a resistor, an inductor, an electrode, a liquid crystal cell, a variable capacitor, a filter, a light emitting unit, a diode, a transistor, a sensor, a microelectromechanical system (MEMS), a liquid crystal chip, a controller, etc. The diode may include a light emitting diode or a photodiode.The light emitting diode may be, but is not limited to, an organic light emitting diode (OLED), a submillimeter wave light emitting diode (mini LED), a micro LED, a quantum dot light emitting diode (quantum dot LED), a fluorescence, a phosphorescent, or other suitable material, or a combination of the above. The sensor may be, but is not limited to, a capacitive sensor, an optical sensor, an electromagnetic sensor, a fingerprint sensor (FPS), a touch sensor, an antenna, or a pen sensor. The controller may be, but is not limited to, a timing controller. In the following, a display device is used as an electronic device to describe the contents of the present application, but the present application is not limited thereto.
[0013] It should be noted that the following embodiments can be substituted, rearranged, and mixed with features of several different embodiments to arrive at other embodiments without departing from the spirit of the present application. Features of each embodiment can be used in combination as long as they do not violate the spirit of the present invention or are not mutually inconsistent.
[0014] Unless otherwise specified, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. In addition, terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant art and this application, and should not be interpreted in an idealized or overly formal sense unless expressly defined in the embodiments of this application.
[0015] Additionally, terms such as "adjacent" and "nearby" in the specification and claims are used to describe two objects that are close to each other, and may or may not be in contact with each other.
[0016] In addition, in this application, the description "in the case of" or "when" refers to aspects such as "at the present time, before, or after," and is not limited to a situation occurring at a time. This point will be explained first. In this application, a similar description such as "provided on" indicates the corresponding positional relationship of two elements, and does not limit the presence or absence of contact between the two elements unless otherwise specified. This point will be explained first. In addition, when multiple effects are described in this application, the use of the term "or" between each effect means that these effects may exist independently, but does not exclude the possibility that multiple effects may exist simultaneously.
[0017] Please refer to Fig. 1A to Fig. 2. Fig. 1A is a schematic partial exploded view of an electronic device 1 according to an embodiment of the present application. Fig. 1B is a detailed schematic configuration diagram of one edge portion of the electronic device 1 according to an embodiment of the present application. Fig. 1C is a cross-sectional view taken along line A-A' in Fig. 1B. Fig. 2 is a schematic view of an engagement portion 21 of a first optical film 20 according to an embodiment of the present application.
[0018] As shown in FIG. 1A, the electronic device 1 may include a substrate 10, a first optical film 20, and a second optical film 30. In one embodiment, the electronic device 1 may further include a second substrate 40. In one embodiment, the electronic device 1 may further include a plurality of electronic units 50 arranged in a matrix, but is not limited thereto. The first optical film 20 is provided on the substrate 10 and includes an engagement portion 21. The second optical film 30 is provided on the substrate 10 and interferes with the engagement portion 21 of the first optical film 20. Here, "interfering with each other" may be, for example, "structural interference", and structural interference may mean, for example, that there is contact between the two and that the engagement and / or positional regulation is achieved by abutting against at least a part of the structure of the other, but is not limited thereto.
[0019] In one embodiment, the second substrate 40 may be provided on the substrate 10 and may overlap a part of the substrate 10 in the top view direction (i.e., the third direction Z) of the electronic device 1. For example, the second substrate 40 may be closely attached to the substrate 10, or a spacer (not shown) may be provided between the second substrate 40 and the substrate 10, but is not limited thereto. In one embodiment, the first optical film 20 and the second optical film 30 may be located between the substrate 10 and the second substrate 40. The second substrate 40 may or may not at least partially overlap the first optical film 20 or the second optical film 30 in the third direction Z. In addition, since the electronic unit 50 may be provided on the second substrate 40, the first optical film 20 and the second optical film 30 may be considered to be located between the substrate 10 and the electronic unit 50. In one embodiment, the electronic device 1 may include a third optical film 60 provided on the second substrate 40. The third optical film 60 may have a plurality of openings, each of which may correspond to the position of each electronic unit 50 provided on the second substrate 40, so that the electronic units 50 may be exposed.
[0020] 2, the engagement portion 21 includes a first portion 211, a second portion 212, and an engagement structure 213. The first portion 211 and the second portion 212 are located on opposite sides of the engagement structure 213, for example, on both sides of the engagement structure 213 along the first direction Y. In one embodiment, the first portion 211 and the second portion 212 can be separated along the first direction Y, that is, there is a gap between the first portion 211 and the second portion 212 in the first direction Y, and the gap can form the engagement structure 213, and the length of the gap along the first direction Y can be, but is not limited to, 0 or more. The first portion 211 and the second portion 212 can be connected to the body portion 20a of the first optical film 20. In addition, when the first optical film 20 and the second optical film 30 are engaged with each other and interfere with each other, one of the first portion 211 and the second portion 212 may be located above the upper surface 30t of the second optical film 30, and the other may be located below the lower surface 30b. For example, the first portion 211 is closer to the upper surface 30t of the second optical film 30 and located above the upper surface 30t, and the second portion 212 is closer to the lower surface 30b of the second optical film 30 and located below the lower surface 30b. In another embodiment, the first portion 211 may be located below the lower surface 30b of the second optical film 30, and the second portion 212 may be located above the upper surface 30t. In one embodiment, the second portion 212 is closer to the edge portion 10a of the substrate 10 than the first portion 211, but is not limited thereto. Also, in one embodiment, the engagement structure 213 may be, for example, but is not limited to, a groove (i.e., the gap is greater than 0) or a slit (i.e., the gap is equal to 0, in other words, when the first part 211 and the second part 212 are located on the same plane, at least a portion of the first part 211 can contact the second part 212).
[0021] 1A and 2, in one embodiment, the second portion 212 and the second optical film 30 have an overlap length L3 along the first direction Y. In one embodiment, the overlap length L3 may be in the range of 5 mm to 15 mm (5 mm≦L3≦15 mm). In one embodiment, the overlap length L3 may be in the range of 7.5 mm to 12 mm (7.5 mm≦L3≦12 mm). The above values are merely examples.
[0022] In one embodiment, the electronic device 1 may be, for example, but is not limited to, a backlight module. In one embodiment, the electronic device 1 may be, for example, but is not limited to, a direct-type backlight module. In one embodiment, the electronic device 1 may be, for example, but is not limited to, a sub-millimeter-wave light-emitting diode (MINI LED) backlight module. In one embodiment, the substrate 10 may be, for example, but is not limited to, a backplane of the electronic device 1. In one embodiment, the first optical film 20, the second optical film 30, or the third optical film 60 may be, for example, a reflective film, but may also be other types of optical films, for example, but is not limited to, a filter, a brightness enhancement film, a light-guiding film, etc. It should be noted that in one embodiment, the electronic unit 50 may be, for example, a light-emitting unit, and the light-emitting unit may be, for example, but is not limited to, a light-emitting diode, in which case the second substrate 40 may be a backlight panel, and the electronic device 1 may further include a display panel (not shown), and the second substrate 40 may be disposed between the substrate 10 and the display panel, so that the first optical film 20 and the second optical film 30 may be disposed between the substrate 10 and the plurality of electronic units 50.
[0023] Next, the arrangement of the substrate 10, the first optical film 20, and the second optical film 30 will be described with reference to Fig. 1B. The electronic device 1 shown in Fig. 1B has the second substrate 40 removed.
[0024] As shown in FIG. 1B, the first optical film 20 and the second optical film 30 may be disposed near the edge of the electronic device 1, respectively. The engagement portion 21 of the first optical film 20 may be near or located at a corner 10c of the substrate 10. The first optical film 20 and the second optical film 30 may have, for example, a strip-like structure, and the body portion 30a of the second optical film 30 may extend, for example, in a first direction Y, and the body portion 20a of the first optical film 20 may extend, for example, in a second direction X, where the first direction Y and the second direction X are substantially perpendicular to each other. The engagement portion 21 may be near one end of the body portion 20a of the first optical film 20. In addition, the first optical film 20 and the second optical film 30 may have sidewall portions 20s and 30s extending from the main body portion 20a and the main body portion 30a along the third direction Z (or extending in a direction slightly offset from the third direction Z, for example, offset by 60 degrees from the third direction Z, but not limited thereto), respectively, and the third direction Z is substantially perpendicular to the first direction Y and the second direction X, respectively. The sidewall portion 20s of the first optical film 20 and the sidewall portion 30s of the second optical film 30 may be used to abut against the edge portion 10a of the substrate 10. Referring also to FIG. 2, the sidewall portion 20s of the first optical film 20 may be connected to the main body portion 20a and the second portion 212 of the first optical film 20, but is not limited thereto.
[0025] In addition, the substrate 10 may have a bump 11 extending along the third direction Z, and the body portion 30a of the second optical film 30 may have a through hole 31. The size of the through hole 31 may be equal to or slightly larger than the size of the bump 11 ("slightly larger" here means that the size of the through hole 31 is such that the bump 11 can pass through it and the inner wall of the through hole 31 must at least partially contact the bump 11 so that the bump 11 does not easily fall out of the through hole 31), and the position of the through hole 31 may correspond to the position of the bump 11, so that the bump 11 can pass through the through hole 31. The second optical film 30 can be positioned on the substrate 20 through the design of the bump 11 and the through hole 31. In one embodiment, the substrate 10 may have another bump (not shown), and the main body 20a of the first optical film 20 may also have a through hole (not shown) similar to the through hole 31, so that the first optical film 20 can be positioned on the substrate 10 via its own through hole and the other bump. Note that, in another embodiment, the edge of the substrate 10 may have a plurality of bumps (not shown), and the first optical film 20 and / or the second optical film 30 may have a plurality of through holes (not shown) corresponding to the bumps. In other words, the number of bumps and through holes may be one or more, and is not particularly limited in the present application.
[0026] Next, the mutual interference between the engagement portion 21 of the first optical film 20 and the second optical film 30 will be described in detail with reference to FIG. 1C, and also with reference to FIGS. 1A and 1B.
[0027] As shown in FIG. 1C, when viewed from the cross-sectional direction, the engagement structure 213 is located between the first portion 211 and the second portion 212, and at least a part of the main body portion 30a of the second optical film 30 is inserted into the engagement structure 213 and may be sandwiched between the first portion 211 and the second portion 212. Also, as shown in FIG. 1A and FIG. 1B, a part of the surface 30t of the second optical film 30 contacts the first portion 211, and a part 30b of the other surface of the second optical film 30 contacts the second portion 212. As can be seen from this, in one embodiment, the first portion 211 and the second portion 212 are arranged separately in the first direction Y, and the engagement direction between the first portion 211 or the second portion 212 and the second optical film 30 (i.e., the normal direction of the contact surface between the first portion 211 or the second portion 212 and the second optical film 30) may be perpendicular to the first direction Y, and may be parallel to the third direction Z, for example, but is not limited to this. Thereby, the first optical film 20 and the second optical film 30 can be engaged with each other and interfere with each other.
[0028] In one embodiment, the first portion 211 has a first maximum length L1 in the second direction X, and the second portion 212 has a second maximum length L2 in the second direction X, the first maximum length L1 and the second maximum length L2 can be measured along the second direction X from the engagement structure 213 (i.e., the intersection of the engagement structure 213 and the body portion 20a), and the first maximum length L1 is not equal to the second maximum length L2. In one embodiment, the first maximum length L1 may be smaller than the second maximum length L2, but is not limited thereto.
[0029] As a result, the first optical film 20 and the second optical film 30 can be fixed by interfering with each other, which reduces the situation where the first optical film 20 or the second optical film 30 pivots and / or rotates with respect to the substrate 10, thereby reducing the possibility that the substrate 10 is exposed. Therefore, the optical quality of the electronic device 1 of the present application can be improved.
[0030] The bumps 11 of the substrate 10 and the through-holes 31 of the second optical film 30 of the present application may have different embodiments. Figures 3A to 3C are schematic diagrams of the bumps 11 and the through-holes 31 of different embodiments of the present application, and should be referred to in conjunction with Figures 1A to 2.
[0031] In the embodiment of FIG. 3A, bump 11 may be, for example, a circular bump, and through-hole 31 may be a circular through-hole that is the same size as or slightly larger than bump 11 .
[0032] 3B, the bump 11 can be, for example, an elliptical bump, and the through hole 31 can be an elliptical through hole that is the same as or slightly larger than the size of the bump 11. Through the design of the elliptical bump and the elliptical through hole, the possibility that the second optical film 30 will rotate relative to the substrate 10 can be reduced, but is not limited thereto.
[0033] 3C , the bump 11 can be, for example, a rectangular bump, and the through hole 31 can be a rectangular through hole that is the same as or slightly larger than the size of the bump 11. Through the design of the rectangular bump and the rectangular through hole, the possibility that the second optical film 30 will rotate relative to the substrate 10 can be reduced, but is not limited thereto.
[0034] In addition, the bumps 11 and the through holes 31 may have different shapes as long as their shapes and sizes correspond to each other and can achieve the above-mentioned effects of positioning and / or reducing rotation. In addition, the first optical film 20 may also have a through hole 31 similar to that of the second optical film 30 so that the first optical film 20 can be positioned on the substrate 10 through the above mechanism and / or the possibility of the first optical film 20 rotating relative to the substrate 10 can be reduced, but is not limited thereto.
[0035] In one embodiment, the present disclosure can compare the presence or absence or compositional relationship of an object through at least a mechanical observation method, for example, but not limited to, using the presence or absence or compositional relationship of an object as proof of whether the operation of the object falls within the scope of protection of the present application.
[0036] Details or features among the embodiments of the present application may be used in any combination without departing from or contradicting the spirit of the present invention.
[0037] Therefore, the first optical film 20 and the second optical film 30 of the electronic device 1 of the present application have specially designed structural features, which can solve the problems of the prior art.
[0038] The above-described embodiment is merely an example for the convenience of explanation, and the scope of the rights claimed by this application is naturally based on what is described in the claims, and is not limited to the above-described embodiment. [Explanation of symbols]
[0039] 10 Substrate 10c Corner 1 Electronic equipment 10a Edge section 11. Bump 20 First Optical Film 20a, 30a Main body 20s, 30s side wall part 21 Engagement part 30 2nd Optical Film 31 Through Hole 40 Second board 50 Electronic Unit 60 3rd Optical Film 211 Part 1 212 Part 2 213 Engagement structure 30t top surface 30b Bottom side L1 First maximum length L2 Second maximum length L3 overlap length
Claims
1. 1. An electronic device comprising: A substrate; a first optical film provided on the substrate and including an engagement portion; a second optical film provided on the substrate, having upper and lower surfaces facing each other, and interfering with the engagement portion of the first optical film; The engagement portion includes a first portion, a second portion, and an engagement structure, the first portion and the second portion being located on opposite sides of the engagement structure, and one of the first portion and the second portion being located above the upper surface of the second optical film, and the other being located below the lower surface of the second optical film. An electronic device comprising:
2. The electronic device according to claim 1 , wherein the engagement structure is a groove.
3. The electronic device according to claim 1 , wherein the engagement structure is a slit.
4. 2. The electronic device of claim 1, wherein the first portion and the second portion are separated along a first direction, the first portion has a first maximum length in a second direction perpendicular to the first direction, and the second portion has a second maximum length in the second direction, the first maximum length not equal to the second maximum length.
5. 5. The electronic device of claim 4, wherein the first maximum length is less than the second maximum length.
6. The electronic device of claim 1 , wherein the second portion is closer to an edge of the substrate than the first portion.
7. 7. The electronic device according to claim 6, wherein an overlap length between the second portion and the second optical film in the first direction is in the range of 5 mm to 15 mm.
8. 8. The electronic device according to claim 7, wherein an overlap length between the second portion and the second optical film in the first direction is in the range of 7.5 mm to 12 mm.
9. The electronic device according to claim 1 , wherein the substrate has a bump, the second optical film has a through hole, and the bump penetrates the through hole.
10. The electronic device according to claim 9 , wherein the bump has a circular shape.
11. 10. The electronic device according to claim 9, wherein the bump has an elliptical shape.
12. 10. The electronic device according to claim 9, wherein the bump has a rectangular shape.
13. The electronic device of claim 1 , further comprising a plurality of electronic units disposed on the substrate, the first optical film and the second optical film being disposed between the substrate and the plurality of electronic units.
14. The electronic device according to claim 1 , wherein the engagement portion is near a corner of the substrate.