Resin molding apparatus and method for manufacturing resin molded product

Abstract

To provide a resin molding apparatus that allows a user to easily identify a cause of inoperability of the resin molding apparatus when the resin molding apparatus becomes inoperable due to an interlock, and a method for manufacturing the resin molded product.SOLUTION: A resin molding apparatus comprises a control object and a controller. The controller controls the control object. The controller includes a memory and a processor. The memory stores a plurality of conditions related to a predetermined operation of the control object and comments associated with each of the plurality of conditions. Each of the plurality of conditions is a condition related to an interlock of the control object. When execution of the predetermined operation is instructed, the processor outputs a command to the control object instructing execution of the predetermined operation if each of the plurality of conditions is satisfied, while outputting a comment associated with an unsatisfied condition among the plurality of conditions if at least some of the plurality of conditions are not satisfied.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Japanese Patent Application Laid-Open No. 2023-48797 (Patent Document 1) discloses a resin sealing apparatus. This resin sealing apparatus includes a workpiece processing unit, which includes a loader. The loader transports the workpiece before resin sealing to a sealing die, and transports the resin-sealed workpiece to a predetermined position outside the sealing die (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-48797 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the resin sealing device disclosed in the above Patent Document 1, if the loader moves with an obstacle placed on the movement path of the loader, the resin sealing device may break down. The above Patent Document 1 does not disclose a means for suppressing the occurrence of such a breakdown.

[0005] In order to prevent such a failure from occurring, it is conceivable to introduce an interlock into the resin sealing device. For example, if the interlock conditions for the loader movement operation include that no obstacle is placed on the loader movement path, the loader movement will not start when an obstacle is placed on the loader movement path. This prevents the resin sealing device from causing a failure. By eliminating the cause of the loader not starting to move, the loader can move again. However, when the interlock conditions for a predetermined operation are composed of multiple conditions, it is not easy for the user to recognize which of the multiple conditions is not satisfied.

[0006] The present invention has been made to solve such problems, and its object is to provide a resin molding apparatus and a method for manufacturing resin molded products that enable a user to relatively easily recognize the cause of the resin molding apparatus not operating when the resin molding apparatus does not operate due to an interlock. [Means for solving the problem]

[0007] A resin molding apparatus according to an aspect of the present invention manufactures resin molded products. The resin molding apparatus includes a control object and a controller. The control object is used for manufacturing the resin molded products. The controller controls the control object. The controller includes a memory and a processor. The memory stores a plurality of conditions and comments associated with each of the plurality of conditions for a predetermined operation of the control object. Each of the plurality of conditions is a condition related to an interlock of the control object. When an instruction to execute the predetermined operation is given, the processor outputs a command to execute the predetermined operation to the control object if each of the plurality of conditions is satisfied, while outputting a comment associated with the unsatisfied condition of the plurality of conditions if at least a portion of the plurality of conditions is not satisfied.

[0008] A method for manufacturing a resin molded product according to another aspect of the present invention is a method for manufacturing a resin molded product using the above-mentioned resin molding apparatus, and includes causing a controlled object to perform a predetermined operation, and manufacturing a resin molded product through the predetermined operation. Effect of the Invention

[0009] According to the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product that enable a user to relatively easily recognize the cause of the resin molding apparatus not operating when the resin molding apparatus does not operate due to an interlock. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a diagram showing a schematic front view of the resin molding apparatus. [Diagram 2] FIG. 2 is a schematic plan view of the inside of the resin molding apparatus; [Diagram 3] FIG. 2 is a diagram showing a cross section of a compression molded part before clamping. [Figure 4] FIG. 4 is a schematic diagram showing a side cross section of a resin material containing section. [Diagram 5] FIG. 2 is a diagram illustrating a schematic configuration of a controller. [Figure 6] FIG. 13 is a diagram showing an example of a message displayed based on an output comment. [Figure 7] 13 is a diagram for explaining a procedure for displaying a message in a comparison target. FIG. [Figure 8] 11A to 11C are diagrams for explaining a procedure for displaying a message in an embodiment. [Figure 9] 13 is a diagram for explaining a procedure for changing a condition relating to an interlock in the embodiment. FIG. [Figure 10] 10 is a flowchart showing an operation procedure related to an interlock in the resin molding apparatus. [Figure 11] 10 is a flowchart showing an operation procedure related to an interlock performed during execution of a predetermined operation. [Figure 12]FIG. 10 is a diagram illustrating another example of a connection format of each sensor. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail with reference to the drawings. Note that the same or corresponding parts in the drawings are given the same reference numerals and their description will not be repeated. Also, each drawing is drawn in a schematic manner with objects appropriately omitted or exaggerated for ease of understanding.

[0012] [1. Configuration] <1-1. Overall configuration of resin molding equipment> Fig. 1 is a diagram showing a schematic front view of a resin molding apparatus 100 according to the present embodiment. Fig. 2 is a diagram showing a schematic plan view of the inside of the resin molding apparatus 100 according to the present embodiment. The resin molding apparatus 100 is configured to resin seal a substrate W on which electronic components such as semiconductor chips are mounted, to manufacture a resin molded product. In the resin molding apparatus 100, the component mounting surface of the substrate W on which the electronic components are mounted is resin sealed.

[0013] Examples of the substrate W include a semiconductor substrate such as a silicon wafer, a lead frame, a printed wiring board, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, etc. The substrate W may be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate W may or may not already have wiring.

[0014] As shown in Figures 1 and 2, the resin molding apparatus 100 includes a substrate supply / storage module A (hereinafter also referred to simply as "module A"), two resin molding modules B (hereinafter also referred to simply as "module B"), a resin material supply module C (hereinafter also referred to simply as "module C"), and a controller 200.

[0015] Each of the modules AC is detachable and replaceable with respect to the other modules. Furthermore, in the resin molding apparatus 100, the number of modules AC can be increased or decreased. A display 300 is provided on the front side of the module A, and an operation panel 400 is provided on the front side of each module B. The display 300 is configured with a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor, and has a touch panel function. For example, an operation instruction for the module A is input via the display 300, and an operation instruction for the module B is input via the operation panel 400. Furthermore, a transparent cover (window) CV1 is provided on the front side of each of the modules AC. Each cover CV1 can be opened and closed.

[0016] The module A includes a substrate supply unit 1, a substrate storage unit 2, a substrate placement unit 3, and a substrate transport mechanism 4. The substrate supply unit 1 is configured to supply a substrate W before resin sealing (hereinafter also referred to as a "pre-sealed substrate") onto the substrate placement unit 3. The substrate storage unit 2 is configured to store a substrate W (a resin molded product) that has already been sealed with resin (hereinafter also referred to as a "sealed substrate"). The substrate placement unit 3 is configured to move in the direction of arrow Y between a position corresponding to the substrate supply unit 1 and a position corresponding to the substrate storage unit 2. The substrate transport mechanism 4 is configured to move in the directions of arrow X and arrow Y in the module A and each module B. The substrate transport mechanism 4 holds the pre-sealed substrate W on the substrate placement unit 3, transports it to the module B, and places the sealed substrate W on the substrate placement unit 3, for example.

[0017] Each module B includes a compression molding section 5. The compression molding section 5 is configured to manufacture a sealed substrate W (a resin molded product) by compression molding. In this compression molding, a granular resin material P having thermosetting properties is used. The color of the resin material P is, for example, black.

[0018] Fig. 3 is a schematic diagram showing a cross section of the compression molding unit 5 before clamping. As shown in Fig. 3, the compression molding unit 5 includes an outer frame member 501, a fixed platen 540, a molding die 50, a clamping mechanism 53, and a pump 550. An example of the molding die 50 is a metal mold.

[0019] The outer frame member 501 is composed of tie bars (columns) or hold frames (plate members). When the outer frame member 501 is composed of tie bars, the outer frame member 501 is composed of four tie bars arranged at the four corners. Each of the four tie bars extends in the up-down direction (arrow Z direction). When the outer frame member 501 is composed of hold frames, the outer frame member 501 is composed of two hold frames arranged on the left and right. The wide surface of one of the two hold frames faces the wide surface of the other of the two hold frames in the left-right direction (arrow X direction).

[0020] The fixed platen 540 is a plate-like member having a rectangular shape in a plan view. The fixed platen 540 is fixed to the upper part of the outer frame member 501. The mold clamping mechanism 53 includes a movable platen 530 and a servo motor 531, and the movable platen 530 is disposed below the fixed platen 540 inside the outer frame member 501. The movable platen 530 is configured to move in the vertical direction. The movement of the movable platen 530 is realized by, for example, a combination of the servo motor 531 and a ball screw (not shown).

[0021] The molding die 50 includes an upper die 52 and a lower die 51. The upper die 52 and the lower die 51 are disposed opposite to each other. A cover CV1 (FIG. 1) is disposed in front of (on the near side of) the molding die 50. The molding die 50 is disposed between a fixed platen 540 and a movable platen 530 inside an outer frame member 501. More specifically, the upper die 52 is fixed to the lower surface of the fixed platen 540, and the lower die 51 is fixed to the upper surface of the movable platen 530. As the movable platen 530 moves up and down, the lower die 51 also moves up and down together with the movable platen 530. As the movable platen 530 rises, the molding die 50 is clamped.

[0022] Upper die 52 and lower die 51 are provided with heating parts 520 and 510, respectively, and when molding die 50 is closed, upper die 52 and lower die 51 are heated by heating parts 520 and 510, respectively. Each of heating parts 520 and 510 is constituted by, for example, a heater. In addition, when resin molding is performed in a state where molding die 50 has been closed, the inside of molding die 50 is evacuated.

[0023] The lower die 51 includes a base plate 514, a bottom member 511, a spring 513, and a side member 512. The base plate 514 is a plate-like member having a rectangular shape in a plan view. The base plate 514 is fixed to the upper surface of the movable platen 530. The bottom member 511 is a block-like member having a rectangular shape in a plan view. The bottom member 511 is fixed to the upper surface of the base plate 514, and is located approximately in the center of the base plate 514. The side member 512 is a frame-like member that surrounds the periphery of the bottom member 511. The side member 512 is fixed to the base plate 514 via a plurality of springs 513.

[0024] The upper surface of the side member 512 is located higher than the upper surface of the bottom member 511, and a cavity 51C is formed on the upper surface of the lower mold 51. A film (release film) F1 on which the resin material P is placed is placed in the cavity 51C. The pump 550 is configured to perform suction, and the film F1 is adsorbed into the cavity 51C by the pump 550 performing suction. A substrate W is placed on the lower surface of the upper mold 52. The film F1 on which the resin material P is placed is placed in the cavity 51C of the lower mold 51, and the mold 50 is closed in a state in which the substrate W is placed on the lower surface of the upper mold 52, thereby resin-sealing the component mounting surface of the substrate W. The resin material P is heated by the heating unit 510. At first, the viscosity of the resin material P decreases. In this state, the mold 50 is closed, and the mold closing is maintained for a certain period of time. As a result, the temperature of the resin material P increases, and the resin material P hardens. This completes the resin sealing. The resin material P may be a thermoplastic resin material. In this case, the resin material P is hardened by cooling. In the following, an example in which the resin material P has thermosetting properties will be described.

[0025] The compression molding unit 5 further includes sensors S1-S6. The sensor S1 is configured to detect an abnormality in the heating unit 510 based on the temperature of the lower mold 51 and the current value of the heating unit 510, etc. The sensor S2 is configured to detect an abnormality in the heating unit 520 based on the temperature of the upper mold 52 and the current value of the heating unit 520, etc. The sensor S3 is configured to detect, for example, the operating state of the mold clamping mechanism 53 and the mold clamping pressure. The sensor S4 is configured to detect the pressure inside the molding die 50. The lower limit position to which the movable platen 530 can move is determined in advance. The sensor S5 is configured to detect whether the movable platen 530 has reached the lower limit position. The sensor S6 is configured to detect the operating state of the pump 550. The sensor S6 is configured to detect, for example, whether the power supply of the pump 550 is on or not, and whether an error has occurred in the pump 550 or not. An example of the use of the output of each sensor will be described in detail later.

[0026] 2 again, module C includes a moving table 6, a resin material accommodation unit 7, a resin material supply mechanism 8, a release film supply unit (not shown), and a resin material transport mechanism 9. The moving table 6 is configured to move in the directions of arrow X and arrow Y in module C.

[0027] FIG. 4 is a diagram showing a schematic side cross section of the resin material accommodation section 7. As shown in FIG. 4, the resin material accommodation section 7 includes a film F1 and a frame-shaped member 72. A resin material P is supplied to the resin material accommodation section 7. The film F1 forms the bottom surface of the resin material accommodation section 7, and the frame-shaped member 72 forms the side surface of the resin material accommodation section 7. A space (recess 71) corresponding to the size of the cavity 51C of the lower mold 51 is formed in the resin material accommodation section 7. The resin material accommodation section 7 is placed on a moving table 6.

[0028] 2 again, the resin material supply mechanism 8 is configured to supply the resin material P to the resin material housing part 7 from above the resin material housing part 7. The resin material P dropping from the discharge port of the resin material supply mechanism 8 is spread evenly in the recessed part 71 of the resin material housing part 7 by the moving table 6 moving relative to the discharge port of the resin material supply mechanism 8.

[0029] The resin material transport mechanism 9 is configured to move in the directions of the arrows X and Y in the modules C and B. The resin material transport mechanism 9 is configured to transport the resin material accommodation section 7, which accommodates the resin material P, to the lower mold 51 and supply the resin material P to the cavity 51C of the lower mold 51.

[0030] The controller 200 is configured to control each of the modules AC in response to information processing. Examples of the control object O1 (see FIG. 5) of the controller 200 include the substrate placement unit 3, the substrate transport mechanism 4, the compression molding unit 5, the moving table 6, the resin material supply mechanism 8, and the resin material transport mechanism 9. The controller 200 is configured to realize an interlock for some operations of at least some of the control objects O1. The interlock is a control method that does not allow the control object O1 to perform a predetermined operation when an instruction to cause the control object O1 to perform a predetermined operation is given, unless a plurality of predetermined conditions are satisfied. Next, the configuration of the controller 200 will be described in detail.

[0031] <1-2. Controller configuration> Fig. 5 is a diagram showing a schematic configuration of the controller 200. As shown in Fig. 5, the controller 200 includes a processor 211, a memory 212, and an input / output interface 213. Each component is electrically connected via, for example, a bus (not shown).

[0032] The processor 211 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), etc. The processor 211 is configured to control each component (control target O1) in the resin molding apparatus 100 in accordance with information processing.

[0033] The memory 212 is configured with, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The memory 212 stores, for example, a program PR1 and interlock-related information D1. The interlock-related information D1 will be explained in detail later. The program PR1 is executed by the processor 211 to realize various operations in the resin molding apparatus 100. When the processor 211 executes the program PR1, the program PR1 is loaded into a RAM in the processor 211. The processor 211 then controls each component by interpreting and executing the program PR1 loaded into the RAM by a CPU in the processor 211.

[0034] The input / output interface 213 is configured to communicate with each component included in the resin molding apparatus 100 via a signal line. The input / output interface 213 is used to transmit data, commands, etc. from the controller 200 to each component in the resin molding apparatus 100, and to receive data, commands, etc. transmitted from each component in the resin molding apparatus 100 to the controller 200.

[0035] The input / output interface 213 is connected to the sensors S1-S6 via terminals TE1-TE6, for example, and receives data from each of the sensors S1-S6. The input / output interface 213 also receives a first command indicating an instruction to cause each control object O1 to execute a predetermined operation, and outputs a second command to each control object O1 to execute the predetermined operation. The first command is received, for example, via the display 300 or the operation panel 400. The first command may also be received via a communication device external to the resin molding apparatus 100. The input / output interface 213 also outputs, for example, data indicating an image to be displayed on the display 300 to the display control unit 310. The display control unit 310 includes, for example, a CPU, a RAM, a ROM, and the like, and is configured to control the display 300.

[0036] [2. Notification of interlock conditions] As described above, in the resin molding apparatus 100 according to the present embodiment, the controller 200 is configured to realize an interlock for some operations of at least some of the control objects O1. That is, the controller 200 stores a plurality of conditions related to the interlock for some operations of at least some of the control objects O1.

[0037] In the resin molding apparatus 100, for example, an interlock is realized with respect to the upward movement (mold clamping operation) of the movable platen 530 in the mold clamping mechanism 53. The multiple conditions for the interlock of the upward movement of the movable platen 530 include, for example, a) that the servo motor 531 is in a drivable state, b) that the cover CV1 of the module B is closed, and c) that the mold clamping pressure by the mold clamping mechanism 53 is less than a predetermined pressure. Note that the multiple conditions for the interlock of the upward movement of the movable platen 530 do not necessarily include all of a) to c), but may include at least two of a) to c). In addition, the open / closed state of each cover CV1 is detected by a sensor (not shown), and data output by the sensor is transmitted to the controller 200.

[0038] Furthermore, in the resin molding apparatus 100, for example, an interlock is realized with respect to the lowering operation (mold opening operation) of the movable platen 530 in the mold clamping mechanism 53. A plurality of conditions related to the interlock of the lowering operation of the movable platen 530 include, for example, a) that the lower mold 51 is not at the lowest position, and b) that the inside of the molding mold 50 is not evacuated.

[0039] In the resin molding apparatus 100, for example, an interlock is realized regarding the heating start operation of the heating parts 510, 520 in the molding die 50. A plurality of conditions regarding the interlock of the heating start operation of the heating parts 510, 520 include a) that no abnormality occurs in the heating part 510, and b) that no abnormality occurs in the heating part 520.

[0040] Furthermore, in the resin molding apparatus 100, for example, an interlock is implemented regarding the suction start operation of the pump 550. A plurality of conditions regarding the interlock of the suction start operation of the pump 550 include a) that no abnormality occurs in the pump 550, and b) that power is being supplied to the pump 550.

[0041] When an instruction (first command) for a predetermined operation (hereinafter simply referred to as the "predetermined operation") that is the subject of interlock is received, the controller 200 determines whether each of a plurality of conditions related to the predetermined operation is satisfied based on the output of the sensors S1-S6, etc. If all of the plurality of conditions are satisfied, the controller 200 outputs a second command to the control object O1. As a result, the predetermined operation is executed. On the other hand, if at least a portion of the plurality of conditions is not satisfied, the controller 200 does not output the second command to the control object O1. As a result, the predetermined operation is not executed. This suppresses the occurrence of a malfunction of the resin molding apparatus 100.

[0042] In addition, in a case where the state of each component is stored, the controller 200 may determine whether or not each of a plurality of conditions related to a predetermined operation is satisfied based on the stored state, not only on the output of the sensors S1-S6, etc. In a similar case, the controller 200 may determine whether or not each of a plurality of conditions related to a predetermined operation is satisfied based on the stored state, not on the output of the sensors S1-S6, etc.

[0043] When the cause of the failure to execute the predetermined operation is eliminated, the predetermined operation can be executed again. However, since the interlock conditions for the predetermined operation are made up of multiple conditions, it is not easy for the user to recognize which of the multiple conditions is not satisfied.

[0044] In the resin molding apparatus 100 according to the present embodiment, if at least some of the interlock-related conditions are not satisfied when a command to execute a predetermined operation is issued, a comment associated with the unsatisfied condition is output. The comment is composed of, for example, text data indicating information related to the associated condition.

[0045] Fig. 6 is a diagram showing an example of a message displayed based on an output comment. Referring to Fig. 6, a message M1 is displayed on the display 300. In this example, when an instruction to raise the movable platen 530 is given, the clamping pressure by the clamping mechanism 53 is equal to or higher than a predetermined pressure. By referring to the message M1, the user can easily recognize that there is a problem with the clamping pressure by the clamping mechanism 53. Note that the message M1 may be the same as the comment output by the controller 200, or may be generated separately based on the comment.

[0046] There are several possible patterns for the procedure of displaying a message regarding a condition that is not satisfied among a plurality of conditions. Below, a comparison pattern will be described first, and then a pattern in this embodiment will be described.

[0047] FIG. 7 is a diagram for explaining a procedure for displaying a message in a comparison target. Referring to FIG. 7, in this example, a plurality of tables T1 are stored in a memory in a controller 200X. Each of the plurality of tables T1 is associated with any of the predetermined operations that are the subject of an interlock. Each table T1 includes a plurality of conditions related to the interlock. In each table T1, each of the plurality of conditions is associated with an address. Each address indicates the address of a terminal provided in the controller 200X. For example, a sensor is connected to each terminal.

[0048] A plurality of tables T2 are stored in a memory in the display control unit 310 outside the controller 200X. Each of the plurality of tables T2 is associated with any of the predetermined actions that are the subject of an interlock. Each table T2 includes a plurality of comments. Each of the plurality of comments corresponds to one of a plurality of conditions related to the interlock. In each table T2, each of the plurality of comments is associated with an address.

[0049] When an instruction to execute a predetermined action is given, if the controller 200X determines that any one of a plurality of conditions corresponding to the predetermined action is not satisfied, address information associated with the unsatisfied condition is output to the display control unit 310. In the display control unit 310, a comment associated with the input address information is extracted, and a message or comment generated based on the comment is output to the display 300.

[0050] In the resin molding apparatus, the conditions related to the interlock are added and changed relatively frequently. In this comparison target, for example, when the condition associated with the address "1001" is changed from "X1" to "XA1" and the comment associated with the address "1001" is changed from "Y1" to "YA1", the table T1 and the table T2 need to be updated. That is, the controller 200X and the display control unit 310 need to be updated. It is cumbersome to perform the update work in the controller 200X and the display control unit 310 each time the conditions related to the interlock are added and changed.

[0051] FIG. 8 is a diagram for explaining a procedure for displaying a message in the present embodiment. Referring to FIG. 8, as described above, in the present embodiment, interlock-related information D1 is stored in memory 212 in controller 200. Interlock-related information D1 includes table T3 and a plurality of tables T4. Table T3 stores a condition group. Each condition related to each predetermined operation that is the target of interlock in resin molding apparatus 100 is included in this condition group. Each of the plurality of tables T4 is associated with any of the predetermined operations that are the target of interlock. Each table T4 includes a plurality of conditions. Each condition included in each table T4 is included in table T3. In each table T4, each of the plurality of conditions is associated with an address.

[0052] When an instruction to execute a predetermined action is given, if the controller 200 determines that any one of a plurality of conditions corresponding to the predetermined action is not satisfied, the controller 200 extracts a comment associated with the unsatisfied condition by referring to tables T3 and T4. A message or comment generated based on the extracted comment is output from the controller 200 to the display control unit 310. The display control unit 310 outputs the message or comment generated based on the comment to the display 300.

[0053] FIG. 9 is a diagram for explaining a procedure for changing a condition related to an interlock in this embodiment. As shown in FIG. 9, when the condition associated with the address "1003" is changed from "X3" to "XA3" and the comment associated with the address "1003" is changed from "Y3" to "YA3", it is necessary to update the table T3 and the table T4. Each of the tables T3 and T4 is stored in the memory 212 of the controller 200. That is, only the update of the controller 200 is required. In this way, in the resin molding apparatus 100, a plurality of conditions and comments are stored in the common controller 200. Therefore, according to the resin molding apparatus 100, even if a condition is added or changed, the conditions and comments are updated in the controller 200, so that an appropriate comment can be output.

[0054] [3. Operation] 10 is a flowchart showing an operational procedure related to an interlock in the resin molding apparatus 100. The process shown in this flowchart is executed by the processor 211 of the controller 200.

[0055] 10, processor 211 determines whether or not an instruction to execute a predetermined operation has been given via display 300, operation panel 400, or the like (whether or not a signal indicating a first command has been received) (step S100). If it is determined that an instruction to execute a predetermined operation has not been given (NO in step S100), processor 211 executes the process of step S100 again.

[0056] On the other hand, when it is determined that an instruction to execute the predetermined operation has been given (YES in step S100), processor 211 determines whether or not all of the conditions corresponding to the predetermined operation are satisfied (step S110). When it is determined that all of the conditions are satisfied (YES in step S110), processor 211 controls input / output interface 213 to output a command (second command) to execute the predetermined operation to control object O1 (step S120).

[0057] On the other hand, if it is determined in step S110 that at least some of the multiple conditions corresponding to the specified action are not satisfied (NO in step S110), processor 211 extracts comments associated with the unsatisfied conditions by referring to tables T3 and T4, and controls input / output interface 213 to output a message or comment generated based on the extracted comments (step S130).

[0058] [4. Features] As described above, in the resin molding apparatus 100 according to the present embodiment, if at least some of the interlock-related conditions are not satisfied when a command to execute a predetermined operation is issued, a comment corresponding to the unsatisfied condition is output. Therefore, the resin molding apparatus 100 allows the user to relatively easily recognize which of the multiple conditions is not satisfied through the comment.

[0059] In addition, in the resin molding apparatus 100, a group of conditions and a comment associated with each condition included in the group of conditions are stored in the memory 212. Therefore, according to the resin molding apparatus 100, a comment is output regarding interlocks of various operations, so that the user can relatively easily recognize through the comment which of the multiple conditions for each operation is not satisfied.

[0060] The resin molding apparatus 100 is an example of a "resin molding apparatus" in the present invention. The controlled object O1 is an example of a "controlled object" in the present invention. The controller 200 is an example of a "controller" in the present invention. The processor 211 is an example of a "processor" in the present invention. The memory 212 is an example of a "memory" in the present invention. The display 300 or the operation panel 400 is an example of an "input interface" in the present invention. The molding die 50 is an example of a "molding die" in the present invention. The cover CV1 is an example of a "cover" in the present invention. The mold clamping mechanism 53 is an example of a "mold clamping mechanism" in the present invention. The servo motor 531 is an example of a "motor" in the present invention.

[0061] 5. Other embodiments The concept of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of another embodiment to which the concept of the above embodiment can be applied will be described.

[0062] <5-1> In the above embodiment, it is determined whether or not each interlock condition is satisfied at the start of the predetermined operation. However, the timing at which it is determined whether or not each interlock condition is satisfied is not limited to this. It may be determined whether or not each interlock condition is satisfied, for example, both at the start of the predetermined operation and during the execution of the predetermined operation.

[0063] 11 is a flowchart showing an operation procedure related to an interlock performed during execution of a predetermined operation. The process shown in this flowchart is executed by, for example, the processor 211 of the controller 200 during execution of the predetermined operation.

[0064] 11, processor 211 determines whether or not all of the conditions among the plurality of conditions corresponding to the predetermined operation are satisfied (step S200). If it is determined that all of the conditions among the plurality of conditions are satisfied (YES in step S200), processor 211 executes the process of step S200 again. On the other hand, if it is determined that at least some of the conditions among the plurality of conditions are not satisfied (NO in step S200), processor 211 controls input / output interface 213 to output a stop command of the predetermined operation to control object O1 (step S210).

[0065] In this resin molding apparatus 100, when at least some of the multiple conditions are no longer satisfied during a predetermined operation, a command to stop the predetermined operation is output to the control object O1. Therefore, according to this resin molding apparatus 100, since the predetermined operation is not continued when at least some of the multiple conditions are no longer satisfied, it is possible to suppress the occurrence of a breakdown in the resin molding apparatus 100 caused by the predetermined operation being continued in a state where some of the conditions are not satisfied.

[0066] <5-2> In the above embodiment, the sensors are individually connected to the terminals of the controller 200. However, the connection format of each sensor is not limited to this.

[0067] Fig. 12 is a diagram showing another example of a connection format of each sensor. As shown in Fig. 12, each of the sensors S1A-S6A is connected to the controller 200A via a network. Each sensor may be connected to the controller 200A in this manner. In this case, for example, an individual IP address may be assigned to each of the sensors S1A-S6A.

[0068] <5-3> In the above embodiment, the message or comment generated based on the comment is displayed on the display 300. However, the output format of the message or comment is not limited to this. For example, the resin molding apparatus 100 may further include a speaker, and the message or comment may be output by voice.

[0069] <5-4> In the above embodiment, each compression molding unit 5 includes one molding die 50. However, the configuration of the compression molding unit 5 is not limited to this. For example, each compression molding unit 5 may include a plurality of molding dies 50 arranged in the height direction, and may be configured to perform resin molding of a plurality of substrates W in parallel.

[0070] The above describes the embodiments of the present invention by way of example. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative description. Therefore, some components described in the detailed description and the accompanying drawings may be non-essential components for solving the problem. Therefore, just because the non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately determined that the non-essential components are essential.

[0071] Moreover, the above-described embodiments are merely examples of the present invention in every respect. Various improvements and modifications of the above-described embodiments are possible within the scope of the present invention. For example, at least a part of the configuration of any of the embodiments may be combined with at least a part of the configuration of any of the other embodiments. In other words, in implementing the present invention, specific configurations can be appropriately adopted according to the embodiment.

[0072] [6. Notes] <Technology 1> (composition) A resin molding apparatus for manufacturing a resin molded product, comprising: A control object used in the manufacturing process; A controller for controlling the control target, The controller includes a memory and a processor. the memory stores a plurality of conditions and a comment associated with each of the plurality of conditions with respect to a predetermined operation of the control target; each of the plurality of conditions is a condition related to an interlock of the control object; The processor, When the execution of the predetermined operation is instructed, When each of the plurality of conditions is satisfied, a command to execute the predetermined operation is output to the control target, When at least a portion of the plurality of conditions is not satisfied, the resin molding device outputs the comment associated with the unsatisfied condition among the plurality of conditions.

[0073] (Effects, etc.) In this resin molding device, when a command to execute a predetermined operation is issued and at least some of the multiple conditions are not satisfied, a comment corresponding to the unsatisfied condition among the multiple conditions is output. Therefore, according to this resin molding device, it is possible to relatively easily allow a user to recognize which of the multiple conditions is not satisfied through the comment.

[0074] <Technology 2> (composition) the memory stores a condition group and a comment associated with each condition included in the condition group; Each condition included in the group of conditions is a condition related to the interlock, The resin molding apparatus according to Technology 1, wherein each of the plurality of conditions is included in the group of conditions.

[0075] (Effects, etc.) In this resin molding device, a condition group and a comment corresponding to each condition included in the condition group are stored in a memory. Therefore, according to this resin molding device, a comment is output regarding interlocks of various operations, so that the user can relatively easily recognize which of the multiple conditions for each operation is not satisfied through the comment.

[0076] <Technology 3> (composition) The resin molding device described in Technology 1 or Technology 2, wherein the processor outputs a command to the controlled object to stop the specified operation when at least some of the multiple conditions are no longer satisfied during the specified operation.

[0077] (Effects, etc.) In this resin molding device, when at least some of the multiple conditions are no longer satisfied during a predetermined operation, a command to stop the predetermined operation is output to the controlled object. Therefore, according to this resin molding device, the predetermined operation is not continued when at least some of the multiple conditions are no longer satisfied, so that it is possible to suppress the occurrence of a failure of the resin molding device caused by the predetermined operation being continued in a state where some of the conditions are not satisfied.

[0078] <Technology 4> (composition) further comprising an input interface for receiving an instruction input from a user; The resin molding device according to any one of Technology 1 to Technology 3, wherein the input interface accepts at least one of an instruction to add a new condition to the plurality of conditions and an instruction to change at least some of the conditions included in the plurality of conditions.

[0079] (Effects, etc.) In this resin molding apparatus, a plurality of conditions and comments are stored in a common controller, so that even if a condition is added or changed, the conditions and comments are updated in the controller, and appropriate comments can be output.

[0080] <Technology 5> (composition) A molding die including a first die and a second die arranged opposite to each other; A cover is further provided in front of the mold and can be opened and closed. the control target includes a mold clamping mechanism that clamps the molding die, The mold clamping mechanism includes a motor, the predetermined operation is a mold clamping operation by the mold clamping mechanism, The resin molding apparatus according to any one of Technology 1 to Technology 4, wherein the plurality of conditions include at least two of the following: the motor is in a drivable state; the cover is closed; and a clamping pressure of the first mold and the second mold is less than a predetermined pressure.

[0081] (Effects, etc.) In this resin molding device, when execution of the mold clamping operation is instructed and at least some of the multiple conditions are not satisfied, a comment corresponding to the unsatisfied condition among the multiple conditions is output. Therefore, according to this resin molding device, it is possible to relatively easily allow the user to recognize through the comment which of the multiple conditions regarding the mold clamping operation is not satisfied.

[0082] <Technology 6> (composition) Further comprising a molding die including a first die and a second die arranged opposite to each other, During resin molding using the molding die, a vacuum is drawn inside the molding die, the control target includes a mold clamping mechanism that clamps the molding die, the predetermined operation is a mold opening operation by the mold clamping mechanism, The resin molding apparatus according to any one of Technology 1 to Technology 4, wherein the plurality of conditions include that a lower one of the first mold and the second mold is not present at a lower limit position, and that a vacuum is not drawn inside the molding mold.

[0083] (Effects, etc.) In this resin molding device, when a command to execute a mold opening operation is issued and at least some of the multiple conditions are not satisfied, a comment corresponding to the unsatisfied condition among the multiple conditions is output. Therefore, according to this resin molding device, it is relatively easy for the user to recognize through the comment which of the multiple conditions for the mold opening operation is not satisfied.

[0084] <Technology 7> (composition) A method for producing a resin molded product using the resin molding apparatus according to any one of techniques 1 to 6, causing the controlled object to execute the predetermined operation; manufacturing the resin molded product through the predetermined operation.

[0085] (Effects, etc.) In this method for manufacturing a resin molded product, when a command is issued to execute a predetermined operation and at least some of the multiple conditions are not satisfied, a comment corresponding to the unsatisfied condition is output. Therefore, according to this method for manufacturing a resin molded product, it is possible to manufacture a resin molded product while allowing a user to relatively easily recognize which of the multiple conditions is not satisfied through the comment. [Explanation of symbols]

[0086] 1 substrate supply section, 2 substrate storage section, 3 substrate placement section, 4 substrate transport mechanism, 5 compression molding section, 6 moving table, 7 resin material storage section, 8 resin material supply mechanism, 9 resin material transport mechanism, 50 molding die, 51 lower die, 51C cavity, 52 upper die, 53 mold clamping mechanism, 71 recess, 72 frame-shaped member, 100 resin molding device, 200, 200A, 200X controller, 211 processor, 212 memory, 213, 213A input / output interface, 300 display, 310 display control section, 400 operation panel, 501 outer frame member, 510, 520 heating section, 511 bottom member, 512 side member, 513 spring, 514 base plate, 530 movable platen, 531 servo motor, 540 fixed platen, 550 Pump, A board supply / storage module, B resin molding module, C resin material supply module, CV1 cover, D1 interlock related information, F1 film, M1 message, O1 control object, P resin material, PR1 program, S1-S6, S1A-S6A sensors, T1-T4 tables, TE1-TE6 terminals, W board.

Claims

1. A resin molding apparatus for manufacturing a resin molded product, comprising: A control object used in the manufacturing process; A controller for controlling the control target, The controller includes a memory and a processor. the memory stores a plurality of conditions and a comment associated with each of the plurality of conditions with respect to a predetermined operation of the control target; each of the plurality of conditions is a condition related to an interlock of the control object; The processor, When the execution of the predetermined operation is instructed, When each of the plurality of conditions is satisfied, a command to execute the predetermined operation is output to the control target, When at least a portion of the plurality of conditions is not satisfied, the resin molding device outputs the comment associated with the unsatisfied condition among the plurality of conditions.

2. the memory stores a condition group and a comment associated with each condition included in the condition group; Each condition included in the group of conditions is a condition related to the interlock, The resin molding apparatus according to claim 1 , wherein each of the plurality of conditions is included in the group of conditions.

3. 3 . The resin molding apparatus according to claim 1 , wherein the processor outputs a command to the controlled object to stop the predetermined operation when at least a part of the plurality of conditions is no longer satisfied during the predetermined operation.

4. further comprising an input interface for receiving an instruction input from a user; The resin molding apparatus according to claim 1 , wherein the input interface accepts at least one of an instruction to add a new condition to the plurality of conditions and an instruction to change at least some of the conditions included in the plurality of conditions.

5. A molding die including a first die and a second die arranged opposite to each other; A cover is further provided in front of the mold and can be opened and closed. the control target includes a mold clamping mechanism that clamps the molding die, The mold clamping mechanism includes a motor, the predetermined operation is a mold clamping operation by the mold clamping mechanism, The resin molding apparatus according to any one of claims 1 to 4, wherein the plurality of conditions include at least two of the following: the motor is in a drivable state, the cover is closed, and the clamping pressure of the first mold and the second mold is less than a predetermined pressure.

6. The mold further includes a first mold and a second mold disposed opposite to each other, During resin molding using the molding die, a vacuum is drawn inside the molding die, the control target includes a mold clamping mechanism that clamps the molding die, the predetermined operation is a mold opening operation by the mold clamping mechanism, The resin molding apparatus according to claim 1 , wherein the plurality of conditions include a condition in which a lower one of the first mold and the second mold is not in a lower limit position and a condition in which a vacuum is not drawn inside the molding mold.

7. A method for producing a resin molded product using the resin molding apparatus according to any one of claims 1 to 6, causing the controlled object to execute the predetermined operation; manufacturing the resin molded product through the predetermined operation.

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