Substrate processing method and substrate processing apparatus

Abstract

To clean not only the center of a substrate but also the outer periphery.SOLUTION: A control unit causes a part of the cleaning surface of a brush 27, which is on the rotation center side CP of a substrate W, to abut against the outer periphery abutment position OP, while preventing the remaining part of the cleaning surface of the brush 27 from abutting against the substrate W. When the brush 27 is moved to the rotation center side CP of the substrate W, the entire horizontal surface of the substrate W is cleaned by the cleaning surface of the brush 27. As a result, dust adhering to the outer periphery OE of the substrate W, including the edge cut region, can also be removed. Therefore, not only the rotation center side CP of the substrate W but also the outer periphery OE can be cleaned.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a substrate processing method and substrate processing apparatus that perform a cleaning process by bringing a brush into contact with substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. [Background technology]

[0002] Conventionally, this type of device includes a chuck, a brush, and an arm (see, for example, Patent Document 1). The chuck abuts and supports the outer peripheral edge of the substrate. The chuck holds the substrate in a horizontal position. The chuck holds the substrate and is rotated around a vertical axis. The brush is attached to the tip of the arm. The brush is rotated around the vertical axis.

[0003] The arm brings the brush into contact with the center of rotation of the substrate, the upper surface of which has been supplied with cleaning liquid, and moves the brush to the outer periphery. The arm then raises the brush and moves it back to the center of rotation of the substrate, before bringing the brush into contact with the center of rotation of the substrate and moving it to the outer periphery, repeating this scanning operation a predetermined number of times. In this way, the entire upper surface of the substrate is cleaned with the brush. The reason for moving the brush from the center of the substrate to the outer periphery is also to sweep away any dirt on the substrate toward the periphery. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-147334 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the conventional example having such a configuration has the following problems. That is, in the conventional apparatus, the upper surface of the substrate is cleaned by the dust that has been attached to the upper surface of the substrate being taken in or attached to the brush. The dust that has been taken in or attached to the brush is removed to some extent by cleaning the brush in the waiting pot, but cannot be completely removed. Therefore, even if the brush has been cleaned in the waiting pot, it may not be possible to clean the next time another substrate is cleaned.

[0006] In other words, the brush is pressed into the substrate and deformed when it comes into contact with the substrate. Therefore, when the brush comes into contact with the center of rotation of the substrate, it deforms, and dirt remaining on the brush is released. The center of rotation of the substrate has an extremely slow peripheral speed compared to the outer periphery. Therefore, the dirt released from the brush is difficult to be discharged from the outer periphery to the surrounding area together with the processing liquid. As a result, there is a problem that the dirt remains at the center of the substrate.

[0007] The outer periphery, including the bevel portion including the side end face which is the outermost periphery of the substrate, and the outer periphery of the horizontal surface portion adjacent to this bevel portion and extending toward the center of the substrate, is easily soiled by handling during transportation. For this reason, device patterns are designed as areas where devices are not formed. Also, a measurement area is set on the horizontal surface portion of the substrate using a particle counter to measure the cleanliness of the substrate. The outside of the measurement area (for example, 2 to 3 mm from the side end face toward the center) is not subject to the evaluation of cleanliness. The area not subject to evaluation is also called the edge cut.

[0008] In order to solve the problem of dust remaining on the center side of the substrate, a substrate processing method has been proposed in which a brush is brought into contact with the substrate on the outer periphery side rather than the center side, and the brush is moved toward the center side. In detail, the brush is brought into contact so that the entire cleaning surface of the brush is brought into contact with the horizontal surface part of the substrate on the outer periphery side rather than the center side. In other words, the brush is brought into contact so that the part of the outer periphery of the cleaning surface of the brush that is located on the outer periphery side of the substrate is the horizontal surface part inside the bevel part of the substrate, and is located on the inner periphery side of the edge cut. However, this method does not allow dust attached to the outer periphery (edge ​​cut area). Even if the dust is attached to the area where devices are not formed, dust that comes off from the substrate during transportation after processing may contaminate the center side of the substrate, or cross contamination may occur, which may contaminate other substrates.

[0009] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate cleaning method and substrate processing apparatus capable of cleaning not only the center side of a substrate but also the outer periphery. [Means for solving the problem]

[0010] In order to achieve the above object, the present invention has the following configuration. That is, the invention described in claim 1 is a substrate processing method for performing a cleaning process by abutting a brush against a substrate, characterized in that, while a processing liquid is supplied to an upper surface of the substrate and the substrate is rotated in a horizontal plane, the method comprises carrying out an outer edge abutment step of abutting a part of the cleaning surface of the brush that is closer to the center of rotation of the substrate against an outer edge abutment position on the outer edge side of the substrate while the substrate is being rotated in a horizontal plane, a first movement step of moving the brush from the outer edge abutment position toward the center of rotation of the substrate while the brush is in contact with the substrate, and a second movement step of moving the brush from the center of rotation of the substrate toward the outer edge while the brush is in contact with the substrate.

[0011] [Function and Effect] According to the invention described in claim 1, in the outer peripheral edge contact step, a part of the cleaning surface of the brush on the rotation center side of the substrate is contacted with the outer peripheral edge contact position, and the remaining part of the cleaning surface of the brush is not contacted with the substrate. In the first moving step, the brush is moved from the outer peripheral edge contact position to the rotation center side of the substrate. In the second moving step, the brush is moved from the rotation center side of the substrate to the outer peripheral edge side. The brush contacts the outer peripheral edge contact position on the substrate, which has a faster peripheral speed than the center side of the substrate. At this time, even if the brush is deformed and dust is discharged, the faster peripheral speed allows the dust to be discharged toward the outer periphery of the substrate, and the substrate can be prevented from being contaminated by the dust. Furthermore, in the outer peripheral edge contact step, the cleaning surface of the brush is contacted with the substrate not entirely, but only a part of the cleaning surface of the brush on the rotation center side of the substrate, and the remaining part of the cleaning surface of the brush is not contacted with the substrate. Therefore, when the brush is moved toward the center side of the substrate, the entire horizontal surface of the substrate is cleaned by the cleaning surface of the brush. As a result, the dust adhering to the outer periphery including the edge cut region of the substrate can also be removed, so that not only the center side of the substrate but also the outer periphery can be cleaned.

[0012] In the present invention, it is preferable to carry out the first moving step and the second moving step in that order a plurality of times (claim 2).

[0013] The brush moves multiple times from the outer periphery contact position to the rotation center of the substrate and from the rotation center to the outer periphery, thereby making it possible to further clean the substrate.

[0014] In the present invention, it is preferable to carry out a separating step of separating the cleaning surface of the brush from the upper surface of the substrate after the second moving step and before the first moving step (claim 3).

[0015] The brush moves from the rotation center side to the outer periphery side, and before moving back to the rotation center side, the cleaning surface of the brush is separated from the top surface of the substrate in a separation process. When the brush changes direction to the rotation center side, the horizontal movement of the brush temporarily stops on the outer periphery side. At that time, the flow of the processing liquid that has flowed over the top surface of the substrate from the rotation center side to the outer periphery of the substrate is impeded. This processing liquid contains the dirt removed from the substrate. Therefore, by separating the brush from the top surface of the substrate, the processing liquid containing the dirt can be smoothly discharged around the substrate. As a result, the outer periphery of the substrate can be further cleaned.

[0016] In the present invention, it is preferable to carry out a preparatory moving step of moving the brush outward from the outer periphery of the substrate before the outer periphery abutting step (claim 4).

[0017] The preparatory movement step moves the brush once outside the outer periphery of the substrate before moving to the outer periphery abutment position. This shortens the distance the brush travels to the outer periphery abutment position. Therefore, when cleaning is performed by manipulating the brush pressure, the positioning accuracy of the brush can be improved.

[0018] Furthermore, in the present invention, it is preferable that the preparatory movement process moves the brush so that the cleaning surface of the brush is lower than the upper surface of the substrate, and moves the brush toward the outer peripheral edge abutment position via the side end surface and bevel portion of the substrate (Claim 5).

[0019] In the preparatory movement step, before moving to the outer peripheral edge contact position, the brush is moved once outside the outer peripheral edge of the substrate so that the cleaning surface of the brush is lower than the upper surface of the substrate. Then, the brush is moved toward the outer peripheral edge contact position via the side end surface and bevel portion of the substrate. Therefore, the side end surface and bevel portion of the substrate can also be cleaned.

[0020] In the present invention, it is preferable that the outer peripheral edge abutment position is a position 1 mm inward from the side end face of the substrate toward the center of rotation of the substrate (claim 6).

[0021] The outer peripheral abutment position is set to a position 1 mm inward from the side end face toward the center of rotation. Therefore, even when cleaning is performed by adjusting the pressure of the brush, the brush can be positioned as far outward as possible on the outer peripheral edge side of the substrate. As a result, almost the entire cleaning surface of the brush can pass over the outer peripheral edge of the substrate. This makes it possible to further clean the outer peripheral edge of the substrate.

[0022] In the present invention, it is preferable that the brush is subjected to a pressing amount control for performing processing by adjusting the pressing amount against the upper surface of the substrate (claim 7).

[0023] This can be suitably carried out in cleaning that is controlled by the amount of brush pressure.

[0024] In the present invention, it is preferable that the substrate is held by a suction chuck that adsorbs the lower surface of the substrate (claim 8).

[0025] The suction chuck does not have any member that abuts against and supports the side end face of the substrate, and therefore can be suitably used since there is no interference with the brush when the brush is positioned at the outer periphery.

[0026] The invention of claim 9 provides a substrate processing apparatus for performing a cleaning process by contacting a brush against a substrate, the apparatus comprising: a rotary holder for rotating the substrate about a vertical axis while holding the substrate in a horizontal position; a brush for cleaning the substrate by contacting the substrate being rotated by the rotary holder; a horizontal drive for moving the brush in the horizontal direction; a lift drive for moving the brush in the vertical direction; a nozzle for supplying a processing liquid to an upper surface of the substrate; and a step of driving the substrate while the processing liquid is supplied from the nozzle to the upper surface of the substrate and the substrate is rotated in a horizontal plane by the rotary holder. and a control unit that operates the horizontal drive unit and the lifting drive unit to perform, in that order, a first operation of moving the brush from the outer peripheral edge abutment position toward the rotation center of the substrate while abutting a portion of the cleaning surface of the brush that is closer to the rotation center of the substrate against the outer peripheral edge abutment position on the outer peripheral edge side of the substrate, and a second operation of moving the brush from the rotation center side of the substrate toward the outer peripheral edge while abutting the brush against the substrate.

[0027] [Function and Effect] According to the invention described in claim 9, when the processing liquid is supplied from the nozzle to the upper surface of the substrate and the substrate is rotated in a horizontal plane by the rotating holder, the control unit causes a part of the cleaning surface of the brush on the rotation center side of the substrate to contact the outer peripheral edge contact position, and causes the remaining part of the cleaning surface of the brush not to contact the substrate. The control unit operates the horizontal drive unit and the lift drive unit to perform a first operation of moving the brush from the outer peripheral edge contact position to the rotation center side of the substrate, and a second operation of moving the brush from the rotation center side to the outer peripheral edge side in that order. The brush contacts the outer peripheral edge contact position on the substrate, which has a faster peripheral speed than the center side of the substrate. At this time, even if the brush deforms and releases dust, the faster peripheral speed allows the dust to be discharged toward the outer periphery of the substrate, and the substrate can be prevented from being contaminated by the dust. Furthermore, at the outer peripheral edge contact position, not the entire cleaning surface of the brush, but only a part on the rotation center side of the substrate is contacted with the substrate, and the remaining part of the cleaning surface of the brush is not contacted with the substrate. Therefore, when the brush is moved toward the center of the substrate, the entire horizontal surface of the substrate is cleaned by the cleaning surface of the brush. As a result, the dust adhering to the outer periphery, including the edge cut area of ​​the substrate, can also be removed. Therefore, not only the center of the substrate but also the outer periphery can be cleaned. Effect of the Invention

[0028] According to the substrate processing method of the present invention, in the outer periphery abutting step, a part of the cleaning surface of the brush on the rotation center side of the substrate is abutted against the outer periphery abutting position, and the remaining part of the cleaning surface of the brush is not abutted against the substrate. In the first moving step, the brush is moved from the outer periphery abutting position toward the rotation center side of the substrate. In the second moving step, the brush is moved from the rotation center side of the substrate to the outer periphery side. The brush abuts against the outer periphery abutting position on the substrate, which has a faster circumferential speed than the center side of the substrate. At this time, even if the brush is deformed and dust is released, the dust is discharged toward the outer periphery of the substrate due to the faster circumferential speed, and the substrate can be prevented from being contaminated by the dust. Furthermore, in the outer periphery abutting step, the cleaning surface of the brush is abutted against the substrate not entirely, but only a part of the cleaning surface of the brush on the rotation center side of the substrate, and the remaining part of the cleaning surface of the brush is not abutted against the substrate. Therefore, when the brush is moved toward the center side of the substrate, the entire horizontal surface of the substrate is cleaned by the cleaning surface of the brush. As a result, dust attached to the outer periphery including the edge cut region of the substrate can also be removed. Therefore, not only the center side of the substrate but also the outer periphery can be cleaned. [Brief description of the drawings]

[0029] [Figure 1] 1 is an overall configuration diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment; [Diagram 2] FIG. 2 is a vertical cross-sectional view of the substrate, illustrating each portion of the substrate. [Diagram 3] 13(a) to 13(e) are schematic diagrams illustrating the movement of the brush in cleaning process example 1. [Figure 4] 13(a) to 13(d) are schematic diagrams illustrating the movement of the brush in cleaning process example 2. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] An embodiment of the present invention will now be described with reference to the drawings.

[0031] FIG. 1 is a schematic diagram showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention.

[0032] The substrate processing apparatus 1 is an apparatus for processing substrates W. The substrate processing apparatus 1 processes substrates W one by one. The substrate processing apparatus 1 is a so-called single-wafer type apparatus. The substrate W has, for example, a circular shape in a plan view. The substrate processing apparatus 1 performs, for example, a process on the surface of the substrate W. The surface of the substrate W is, for example, a surface on which a device is formed. The substrate processing apparatus 1 performs, as a process, a cleaning process for cleaning the surface of the substrate W. The cleaning process is a process for removing dust such as particles attached to the substrate W using the physical cleaning force of a brush.

[0033] <1. Overall composition>

[0034] The substrate processing apparatus 1 includes a base unit 3, a chuck unit 5, a guard 7, a brush cleaning unit 9, a nozzle 11, and a control unit 13.

[0035] <2. Base unit>

[0036] The base unit 3 includes a chuck unit 5. The base unit 3 rotates the chuck unit 5. The chuck unit 5 holds the substrate W in a horizontal position. The chuck unit 5 rotates the substrate W within a horizontal plane.

[0037] The base unit 3 includes an electric motor 15. The electric motor 15 includes a rotating shaft 17. The rotating shaft 17 extends in the vertical direction. The rotating shaft 17 is rotated by the electric motor 15 about an axis AX1 in the vertical direction. The chuck unit 5 is attached to the upper portion of the rotating shaft 17.

[0038] <3. Chuck unit>

[0039] The chuck unit 5 has a circular shape in a plan view. The chuck unit 5 includes a plate 5a and a suction passage 5b. The plate 5a has a diameter smaller than the diameter of the substrate W. The suction passage 5b opens at multiple points on the upper surface of the plate 5a. The suction passage 5b is connected to a suction source (not shown) via a rotating shaft 17. The suction passage 5b is set to negative pressure or atmospheric pressure by the operation of the control unit 13. When the suction passage 5b is set to negative pressure, the plate 5a sucks the lower surface of the substrate W. As a result, the substrate W is held by the chuck unit 5.

[0040] <4. Guard>

[0041] The guard 7 is disposed on the side of the electric motor 15. The guard 7 surrounds the entire lateral circumference of the electric motor 15. The guard 7 prevents the processing liquid supplied from the nozzle 11 to the substrate W from scattering around during cleaning processing by the brush cleaning unit 9. The guard 7 is raised and lowered between a processing height indicated by a solid line in FIG. 1 and a transfer height indicated by a two-dot chain line in FIG. 1. The transfer height is lower than the treatment height in the vertical direction. The processing height is higher than the transfer height in the vertical direction. At the processing height, the guard 7 guides downward the processing liquid that has scattered around from the outer periphery of the substrate W. The horizontal distance between the upper edge of the guard 7 and the side end surface of the substrate W held by the chuck unit 5 is larger than the horizontal dimension of a brush 27 of the brush cleaning unit 9 described later.

[0042] <5. Brush cleaning unit>

[0043] The brush cleaning unit 9 includes a drive mechanism 19, an arm 21, and a brush head 23.

[0044] The drive mechanism 19 moves the arm 21. Specifically, the drive mechanism 19 drives the arm 21 to move up and down in the vertical direction. The drive mechanism 19 moves the arm 21 within a horizontal plane. Specifically, the drive mechanism 19 drives the tip of the arm 21 to swing around a vertical axis AX2. The drive mechanism 19 includes a rotation mechanism made up of an electric motor with a vertical rotation shaft, and an elevation mechanism that moves the electric motor up and down in the vertical direction.

[0045] A brush head 23 is attached to the tip of the arm 21. The brush head 23 is driven by a drive mechanism 19 in the horizontal and vertical directions.

[0046] The above-mentioned driving mechanism 19 may employ a mechanism that uses a horizontally disposed ball screw or the like to move the base end and the tip end of the arm 21 in the horizontal direction at the same time. In other words, the driving mechanism 19 may be configured to move the arm 21 linearly rather than to swing the arm 21.

[0047] The brush head 23 includes a head body 25 and a brush 27. The head body 25 is attached to the tip of the arm 21. The head body 25 includes an electric motor 29. The electric motor 29 includes a rotating shaft 29a. The rotating shaft 29a extends in the vertical direction. The electric motor 29 drives the rotating shaft 29a to rotate around a vertical axis AX3. The electric motor 29 rotates the brush 29 around the axis AX3. The brush 27 is disposed at the bottom of the head body 25. The brush 27 is attached to the lower end of the rotating shaft 29a. The brush 27 is rotated around the axis AX3 by the electric motor 29. The brush 27 is detachable from the rotating shaft 29a.

[0048] The brush 27 includes a bracket 27a and a brush body 27b. The brush 27 is detachably attached to the rotating shaft 29a by the bracket 27a. The brush body 27b is made of, for example, a synthetic resin. Specifically, the brush body 27b is made of PVA (polyvinyl alcohol). PVA is highly hydrophilic and has fine pores circulating vertically and horizontally. Therefore, the brush body 27b exhibits high water absorption and water retention due to capillary action. The brush body 27b takes in and retains moisture together with dirt. The PVA has flexibility and elasticity. Therefore, the brush body 27b does not damage the substrate W that is the target of the cleaning process.

[0049] The drive mechanism 19 moves the brush 27 between a contact position and a spaced position. The contact position is a position where the brush 27 acts on the upper surface of the substrate W. The contact position includes a height position where the lower surface of the brush body 27b directly contacts the upper surface of the substrate W, and a height position where the lower surface of the brush body 27b indirectly acts on the upper surface of the substrate W with the processing liquid interposed therebetween. The spaced position is a position where the brush 27 is away from the outer periphery of the substrate W. The spaced position is a position where the brush 27 does not act on the substrate W.

[0050] The brush head 23 controls the force with which the brush 27 acts on the substrate W. For example, the brush head 23 moves the brush body 27b downward from a state in which the lower surface of the brush body 27b abuts against the upper surface of the substrate W. At this time, the pressing force of the brush body 27b pressed against the substrate W is determined by the pressing force detected by the brush head 23. That is, in this embodiment, the force with which the brush 27 acts on the substrate W during cleaning is controlled by the pressing force. In other words, pressing force control is performed on the brush 27. The pressure applied to the brush 27 by the brush head 23 during processing is defined as the pressing force during processing.

[0051] A standby pot 31 is disposed on the side of the base unit 3. The standby pot 31 is disposed on the outer side of the guard 7. The standby pot 31 is disposed on the side of the drive mechanism 19. The standby pot 31 keeps the brush 27 on standby. The standby pot 31 can accommodate the brush 27 inside. The standby pot 31 performs a process for removing contaminants such as particles adhering to the brush 27. The standby pot 31 has a function of cleaning the brush 27. Specifically, the standby pot 31 sprays a cleaning liquid onto the brush 27 to clean the brush 27. The standby pot 31 is disposed at the spaced position described above.

[0052] The nozzle 11 supplies the processing liquid so that the liquid lands on the upper surface of the substrate W near the axis AX1 when the substrate W is rotated around the axis AX1. The nozzle 11 supplies the processing liquid to the substrate W beyond the upper edge of the guard 7. The nozzle 11 in this embodiment is not movable. That is, the position of the nozzle 11 in this embodiment is fixed. However, a movable type in which the nozzle 11 moves to the position shown in FIG. 1 only during the cleaning process may be adopted. The processing liquid supplied from the nozzle 11 may be, for example, pure water or a chemical solution. The chemical solution may be, for example, a chemical solution containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, ammonia water, and hydrogen peroxide water. The chemical solution most often used in the surface cleaning process of the substrate W is a mixture (also called SC1) consisting of ammonia water, hydrogen peroxide water, and pure water.

[0053] <6. Control unit>

[0054] The control unit 13 comprehensively controls the above-mentioned units and includes a CPU and a memory.

[0055] The control unit 13 controls the lifting and lowering operation of the guard 7, the supplying operation of the treatment liquid from the nozzle 11, the rotation operation of the electric motor 15, the rotating and lifting operation of the drive mechanism 19, the rotation operation of the electric motor 29, the pushing operation of the brush 27 by the brush head 23, etc. The control unit 13 operates the drive mechanism 19 so as to perform a first operation and a second operation in that order, particularly with respect to the brush 27. The first operation and the second operation will be described later.

[0056] Here, each part of the substrate W will be described with reference to Fig. 2. Fig. 2 is a vertical cross-sectional view of the substrate, and is a diagram for explaining each part of the substrate.

[0057] In this embodiment, the various parts of the substrate W are defined as follows, for example.

[0058] The rotation center side CP is a central region of the substrate W including the axis AX1 and its periphery. The side end surface SE is a side surface formed on the outermost periphery of the substrate W. The side end surface SE is thinner than the rotation center side CP of the substrate W. The bevel portion BV is an inclined surface formed from the upper edge of the side end surface SE toward the front surface of the substrate W and from the lower edge of the side end surface SE toward the back surface of the substrate W. The outer peripheral edge OE is a portion that is a predetermined distance in from the side end surface SE of the substrate W toward the rotation center side CP. The horizontal surface portion FS is a surface formed horizontally from the rotation center side CP to the bevel portion BV. The horizontal surface portion FS is a surface that extends from the bevel portion BV toward the rotation center side CP. The edge cut EC is a portion that is a predetermined distance in from the side end surface SE to the horizontal surface portion FS. For example, the inner circumference of the edge cut EC is closer to the side end surface SE than the inner circumference of the outer peripheral edge OE. The edge cut EC is outside the measurement area of ​​a particle counter that measures the cleanliness of the substrate W. In other words, this is a region that is not subject to evaluation of the cleanliness level. The edge cut EC has a distance of, for example, 2 to 3 mm from the side end surface SE to the rotation center side CP.

[0059] Incidentally, a conventional state in which the entire cleaning surface of the brush 27 is in contact with the horizontal surface FS on the outer periphery OE side of the rotation center CP of the substrate W is, for example, as follows: In Fig. 2, the outer periphery of the brush 27 is located on the inner periphery of the edge cut EC. Furthermore, the inner periphery of the brush 27 is located on the inner periphery of the outer periphery OE.

[0060] <7. Cleaning process>

[0061] Next, a specific cleaning process operation by the above-mentioned substrate processing apparatus 1 will be described with reference to Fig. 3. Figs. 3(a) to (e) are schematic diagrams for explaining the movement of the brush in cleaning process example 1. In the following description, it is assumed that the substrate W to be processed is held by the chuck unit 5, the substrate W is rotated by the electric motor 15, and a processing liquid is supplied to the upper surface of the substrate W from the nozzle 11. The brush 27 is rotated by the electric motor 29.

[0062] <7-1. Cleaning treatment example 1>

[0063] The control unit 13 operates the drive mechanism 19 to move the brush 27 from the waiting pot 31 toward the substrate W. Specifically, as shown in FIG. 3(a), the control unit 13 moves the brush 27 to an outer peripheral edge abutment position OP. The outer peripheral edge abutment position OP is closer to the outer peripheral edge OE than the rotation center side CP. The outer peripheral edge of the cleaning surface of the brush 27 on the rotation center side CP is located at the outer peripheral edge abutment position OP. In detail, a part of the cleaning surface of the brush 27 on the rotation center side CP of the substrate W abuts against the substrate W, and the remaining part of the cleaning surface of the brush 27 does not abut against the substrate W. The remaining part of the cleaning surface of the brush 27 is located above the bevel portion BV and the side end face SE of the substrate W and does not abut against the substrate W.

[0064] The outer peripheral edge abutment position OP is, for example, a position about 1 mm away from the side end surface SE toward the rotation center CP.

[0065] However, even if the brush 27 is positioned at the outer periphery abutment position OP, the following attitude is excluded: That is, a part of the cleaning surface of the brush 27 on the rotation center side CP is brought into contact with the substrate W, and the brush 27 is brought into contact in an inclined attitude so that the cleaning surface of the brush 27 in the direction of the side end surface SE is separated from the substrate W. In other words, in the present invention, the brush 27 is brought into contact with the substrate W in an attitude in which the cleaning surface of the brush 27 is substantially parallel to the horizontal surface portion FS of the substrate W.

[0066] The control unit 13 brings the brush 27 into contact with the substrate W as described above, and applies a predetermined pressing pressure. Specifically, the control unit 13 operates the brush head 23 to apply a pressing pressure from the brush 27 to the substrate W during processing. In other words, the control unit 13 controls the pressing pressure of the brush 27.

[0067] 3(b), the control unit 13 performs a first operation. That is, the control unit 13 operates the drive mechanism 19 to move the brush 27 from the outer periphery abutment position OP to the rotation center side CP. By moving the brush 27 over the radius of the substrate W that is being rotated, the brush 27 acts on the entire surface of the substrate W.

[0068] As shown in Fig. 3(c), the control unit 13 performs a second operation. That is, the control unit 13 operates the drive mechanism 19 to move the brush 27 from the rotation center side CP to the outer periphery OE side. Specifically, the brush 27 is moved so that the outer periphery at a position farther from the rotation center side CP on the cleaning surface of the brush 27 is positioned outward from the side end surface SE of the substrate W. Alternatively, as shown in Fig. 3(a), the brush 27 is positioned at the outer periphery abutment position OP.

[0069] 3(d), the control unit 13 operates the drive mechanism 19 to move the brush 27 upward from the upper surface of the substrate W. In other words, the cleaning surface of the brush 27 is moved away from the upper surface of the substrate W.

[0070] When the brush 27 changes direction from the outer periphery OE side to the rotation center side CP, the horizontal movement of the brush 27 temporarily stops at the outer periphery OE side. At that time, the flow of the processing liquid that has flowed from the rotation center side CP of the substrate W toward the outer periphery is impeded. This processing liquid contains dust removed from the substrate W. Therefore, by moving the brush 27 away from the upper surface of the substrate W, the processing liquid containing dust can be smoothly discharged to the periphery of the substrate W. As a result, the outer periphery OE of the substrate W can be further cleaned.

[0071] The degree of separation of the brush 27 is preferably such that the cleaning surface of the brush 27 is separated from the upper surface of the processing liquid flowing over the upper surface of the substrate W from the rotation center side CP to the outer periphery OE side. However, by slightly separating the brush 27 from the upper surface of the substrate W, it is sufficient if the processing liquid discharged to the periphery flows more smoothly than in a state in which the cleaning surface of the brush 27 is in contact with the upper surface of the substrate W. Therefore, the cleaning surface of the brush 27 may be located above the upper surface of the substrate W but below the upper surface of the processing liquid.

[0072] As shown in Fig. 3(e), the control unit 13 operates the drive mechanism 19 to bring the brush 27 into contact with the upper surface of the substrate W. The control unit 13 repeatedly executes the above-mentioned Figs. 3(a) to (c) a plurality of times. That is, the control unit 13 causes the brush 27 to move between the outer periphery OE of the substrate W and the rotation center side CP a plurality of times. That is, the first operation and the second operation are performed a plurality of times in that order.

[0073] According to this embodiment, in a state where the processing liquid is supplied from the nozzle 11 to the upper surface of the substrate W and the substrate W is rotated in a horizontal plane, the control unit 13 causes a part of the cleaning surface of the brush 27 on the rotation center side CP of the substrate W to abut against the outer peripheral edge abutment position OP, and causes the remaining part of the cleaning surface of the brush 27 not to abut against the substrate W. The control unit 13 operates the drive mechanism 19 to perform a first operation of moving the brush 27 from the outer peripheral edge abutment position OP to the rotation center side CP of the substrate W, and a second operation of moving the brush from the rotation center side CP to the outer peripheral edge side OE of the substrate W in that order. The brush 27 abuts against the outer peripheral edge abutment position OP on the substrate W, which has a faster circumferential speed than the rotation center side CP of the substrate W. At this time, even if the brush 27 is deformed and dust is released, the dust is discharged toward the outer periphery of the substrate W due to the fast circumferential speed, and the substrate W can be prevented from being contaminated by the dust. Furthermore, at the outer periphery abutment position OP, not the entire cleaning surface of the brush 27 but only a part of the rotation center side CP of the substrate W abuts against the substrate W, and the remaining part of the cleaning surface of the brush 27 does not abut against the substrate W. Therefore, when the brush 27 is moved to the rotation center side CP of the substrate W, the entire horizontal surface portion FS of the substrate W is cleaned by the cleaning surface of the brush 27. As a result, dust adhering to the outer periphery OE including the area of ​​the edge cut EC of the substrate W can also be removed. Therefore, not only the rotation center side CP of the substrate W but also the outer periphery OE can be cleaned.

[0074] Since the outer periphery abutment position OP is set to about 1 mm from the side end face SE toward the rotation center CP, cleaning can be performed by manipulating the pressing pressure of the brush 27. Also, the brush 27 can be positioned as far outward as possible on the outer periphery OE side of the substrate W. As a result, almost the entire cleaning surface of the brush 27 can pass over the outer periphery OE of the substrate W. This makes it possible to further clean the outer periphery OE of the substrate W.

[0075] <7-2. Cleaning treatment example 2>

[0076] Another cleaning process performed by the above-described substrate processing apparatus 1 will be described with reference to Fig. 4. Figs. 4(a) to (d) are schematic views for explaining the movement of a brush in cleaning process example 2.

[0077] This cleaning process example 2 is a process carried out prior to the above-mentioned cleaning process example 1. However, this cleaning process example 2 is limited to the case where the brush 27 is controlled by the pressing amount. In other words, the brush head 23 presses the brush 27 a predetermined distance toward the upper surface of the substrate W. The brush head 23 does not control the pressing pressure of the brush 27. This cleaning process example 2 is an example suitable for the case where cleaning is performed by manipulating the pressing amount of the brush.

[0078] 4(a), the control unit 13 moves the brush 27 outward from the outer periphery OE of the substrate W. In detail, the control unit 13 moves the brush 27 outward from the side end face SE of the substrate W. At this time, the cleaning surface of the brush 27 does not contact the substrate W. The outer periphery of the brush 27 also does not contact the side end face SE of the substrate W. At this position, the height of the cleaning surface of the brush 27 is lower than the upper surface of the substrate W.

[0079] 4(b), the control unit 13 moves the brush 27 toward the rotation center side CP of the substrate W. The movement is performed until the outer circumferential surface of the brush 27 abuts against the side end surface SE of the substrate W. As a result, the side end surface SE of the substrate W is cleaned by the brush 27.

[0080] 4(c), the control unit 13 moves the brush 27 obliquely upward toward the rotation center side CP of the substrate W. The control unit 13 moves the brush 27 upward while moving it toward the rotation center side CP of the substrate W so that the brush 27 comes into contact with the bevel portion BV.

[0081] As shown in Fig. 4(d), the control unit 13 positions the brush 27 at the outer periphery abutting position OP. Next, as shown in Figs. 3(b) to (e) above, the brush 27 is moved.

[0082] By moving the brush 27 in this manner, the brush 27 is once moved outside the outer periphery OE of the substrate W before moving to the outer periphery abutment position OP. This allows the distance the brush 27 moves to the outer periphery abutment position OP to be shorter than the distance it moves from the waiting pot 31 to the outer periphery abutment position OP. Therefore, when cleaning is performed by manipulating the amount of pressure applied to the brush 27, the positioning accuracy of the brush 27 can be improved. In addition, the brush 27 is moved so that the cleaning surface of the brush 27 is lower than the upper surface of the substrate W. Then, the brush 27 is moved toward the outer periphery abutment position OP via the side end surface SE and bevel portion BV of the substrate W. Therefore, the side end surface SE and bevel portion BV of the substrate W can also be cleaned.

[0083] The correspondence between the above-described embodiment and the present invention is as follows.

[0084] The above-mentioned Fig. 3(a) corresponds to the "outer peripheral edge abutting step" in the present invention. The above-mentioned Fig. 3(b) corresponds to the "first moving step" in the present invention. The above-mentioned Fig. 3(e) corresponds to the "first moving step" in the present invention. The above-mentioned Fig. 3(d) corresponds to the "separating step" in the present invention. The above-mentioned electric motor 15 and suction chuck unit 5 correspond to the "rotating holding section" in the present invention. The above-mentioned drive mechanism 19 corresponds to the "horizontal drive section" and "lifting drive section" in the present invention.

[0085] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0086] (1) In the above-described embodiment, the brush 27 is moved from the rotation center side CP to the outer periphery OE side, and then the brush 27 is raised on the outer periphery OE side to separate it from the substrate W. However, the present invention does not require that the brush 27 be separated in this manner.

[0087] (2) In the above-described embodiment, the brush 27 is moved back and forth in the radial direction of the substrate W, and this is performed multiple times. However, the present invention is not limited to this embodiment. In other words, the cleaning process may be completed by moving the brush 27 back and forth in the radial direction of the substrate W only once.

[0088] (3) In the above-described embodiment, in cleaning processing example 2, the brush 27 is once moved outward from the side end surface SE of the substrate W. At that time, the height of the cleaning surface of the brush 27 is set lower than the upper surface of the substrate W. However, the present invention is not limited to such an embodiment. That is, when the brush 27 is first moved toward the substrate W, the position of the brush 27 may be determined so that it is closer to the substrate W than the waiting pot 31 and the cleaning surface is higher than the upper surface of the substrate W. With such a position, it is possible to increase the accuracy of alignment with the outer periphery abutment position OP.

[0089] (4) In the cleaning processing example 1 in the embodiment described above, the outer peripheral edge abutment position OP is set to 1 mm, but the present invention is not limited to this position. For example, the outer peripheral edge abutment position OP may be set to be greater than 0 mm and less than 1 mm. In other words, the outer periphery of the cleaning surface of the brush 27 on the rotation center side CP may be located on the bevel portion BV of the substrate W. The outer peripheral edge abutment position OP may be located outward from the inner periphery of the edge cut EC and inward from the side end surface SE. However, in order to accurately apply the pressing pressure to the horizontal surface portion FS of the substrate W during processing, it is preferable that the outer peripheral edge abutment position OP is located on the horizontal surface portion FS.

[0090] (5) In the above-described embodiment, the substrate W is held by a suction-type chuck unit 5. However, the present invention is not limited to this type of chuck unit 5. In other words, a chuck unit 5 having pins that hold the side end surface SE of the substrate W may be used. However, it is preferable that the pins are configured to minimize interference with the brush 27. For example, the pins are very thin pins or low height pins.

[0091] (6) In the above-described embodiment, an example was described in which a substrate W had a bevel portion BV formed on the front and back surfaces of the substrate W. However, the present invention can be applied to a substrate W that has a bevel portion BV only on the back surface, or a substrate W in which the bevel portion BV and the side end surface SE are integrally formed in a semicircular shape. [Explanation of symbols]

[0092] W: Substrate 1 ... Substrate processing equipment 3 … Base unit 5 … Chuck unit 5a ... Plate 5b … Suction passage 7. Guard 9 … Brush cleaning unit 11 ... Nozzle 13 ... Control section 15 … Electric motor AX1, AX3, AX3 … Axis core 19 ... Drive mechanism 21 ... Arm 23 … Brush head 29 … Electric motor 31 ... Waiting pot CP: Center of rotation SE … Side end surface BV: Bevel OE: Outer edge FS…Horizontal part OP … Outer edge contact position

Claims

1. 1. A substrate processing method for performing a cleaning process by contacting a brush with a substrate, comprising: a peripheral edge contacting step of contacting a part of the cleaning surface of the brush on the rotation center side of the substrate with a peripheral edge contact position on the peripheral edge side of the substrate while a processing liquid is supplied to the upper surface of the substrate and the substrate is rotated in a horizontal plane, and keeping the remaining part of the cleaning surface of the brush from contacting the substrate; a first moving step of moving the brush from the outer circumferential edge abutment position toward a rotation center of the substrate while the brush is in contact with the substrate; a second moving step of moving the brush from a rotation center side to an outer periphery side of the substrate while the brush is in contact with the substrate; A substrate processing method comprising the steps of:

2. 2. The substrate processing method according to claim 1, A substrate processing method comprising the steps of: performing the first moving step and the second moving step in that order a plurality of times.

3. 3. The substrate processing method according to claim 2, a separating step of separating the cleaning surface of the brush from the upper surface of the substrate after the second moving step and before the first moving step,

4. 2. The substrate processing method according to claim 1, a preparatory movement step of moving the brush outward from the outer periphery of the substrate before the outer periphery abutting step;

5. 5. The substrate processing method according to claim 4, The preparation movement step includes moving the brush so that a cleaning surface of the brush is positioned lower than an upper surface of the substrate; A substrate processing method comprising: moving the brush toward the outer periphery abutment position via a side end face and a bevel portion of the substrate.

6. 6. The substrate processing method according to claim 1, The substrate processing method according to claim 1, wherein the outer peripheral edge abutment position is a position 1 mm inward from a side end face of the substrate toward a rotation center of the substrate.

7. 5. The substrate processing method according to claim 4, The substrate processing apparatus is characterized in that a pressing amount control is performed for the brush to perform processing according to an amount of pressing against the upper surface of the substrate.

8. 6. The substrate processing method according to claim 1, A substrate processing method, comprising: holding the substrate by a suction chuck that suctions a lower surface of the substrate.

9. In a substrate processing apparatus for performing a cleaning process by contacting a brush against a substrate, a rotation holder that holds the substrate in a horizontal position and rotates the substrate around a vertical axis; a brush that comes into contact with and cleans the substrate being rotated by the rotating holder; A horizontal drive unit that moves the brush in a horizontal direction; A lifting drive unit that moves the brush in a vertical direction; a nozzle for supplying a processing liquid to an upper surface of the substrate; a control unit that operates the horizontal drive unit and the elevation drive unit to perform, in a state in which, while a processing liquid is supplied from the nozzle to the upper surface of the substrate and the substrate is rotated within a horizontal plane by the rotating holder, a first operation of moving the brush from the outer peripheral edge abutment position toward the rotation center of the substrate while a part of the cleaning surface of the brush that is closer to the rotation center of the substrate is abutted against the outer peripheral edge abutment position on the outer peripheral edge side of the substrate and a remaining part of the cleaning surface of the brush is not abutted against the substrate, and a second operation of moving the brush from the rotation center side to the outer peripheral edge of the substrate while the brush is abutted against the substrate; A substrate processing apparatus comprising:

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