Semiconductor module

Abstract

To provide a semiconductor module that prevents voids from accumulating in space.SOLUTION: In a semiconductor module 1 according to the present invention, a terminal block 20 is attached to an edge 11 of a substrate 10. The terminal block 20 has a terminal 20a attached via a mounting fixture, and is provided with an insertion hole 21 for inserting the mounting fixture into the terminal block 20. Furthermore, a space 40 is formed between the edge 11 of the substrate 10 and a lower end 20' of the terminal block 20, and the insertion hole 21 communicates with the space 40.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a semiconductor module. [Background technology]

[0002] In the semiconductor module disclosed in Patent Document 1, a stud bolt is adhered (fixed) to a through hole in the terminal block into which a screw (attachment) is inserted, and the screw is screwed into the stud bolt. The lower end of the terminal block (plate-shaped protrusion) is separated from the board, forming a certain space. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-113368 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the semiconductor module of Patent Document 1 mentioned above, although the lower end of the through hole reaches the space, the through hole is closed even before the screw is screwed in because the stud bolt is fixed in the through hole.

[0005] In recent years, copper foil is sometimes provided in the space between the bottom end of the terminal block and the board to improve the cooling efficiency of the semiconductor module, but if the through hole is blocked, voids that are generated during resin sealing can accumulate in the space and cause problems. Also, if there is a through hole as described above, there is a risk that the bottom end of the stud bolt fixed in the through hole will interfere with the sealing resin.

[0006] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor module that can solve the above problems. [Means for solving the problem]

[0007] In order to solve the above problems, the semiconductor module of the present invention is a semiconductor module (1) in which a terminal block (20) is attached to an edge portion (11) of a substrate (10), the terminal block (20) has terminals (20a) attached thereto via a mounting fixture, and has an insertion hole (21) for inserting the mounting fixture into the terminal block (20), and further, a space (40) is formed between the edge portion (11) of the substrate (10) and a lower end (20') of the terminal block (20), and the insertion hole (21) is connected to the space (40).

[0008] According to the present invention, the terminal block (20) has a terminal (20a) attached via a mounting fixture, and has an insertion hole (21) for inserting the mounting fixture into the terminal block (20). Furthermore, a space (40) is formed between the edge (11) of the substrate (10) and the lower end (20') of the terminal block (20). The insertion hole (21) is connected to the space (40). Therefore, even if voids occur in the space (40), they can be released to the outside through the insertion hole (21), thereby preventing the voids from accumulating in the space.

[0009] The insertion hole (21) has a vertical middle portion (21a') on the side surface (21a) that communicates with the space (40) and is closed on the bottom surface (21b) side, so that voids can be released to the outside through the vertical middle portion (21a') on the side surface (21a). Also, because the insertion hole (21) has a closed bottom surface (21b) side, interference between the lower end of the mounting tool to be inserted and the sealing resin (60) can be reduced.

[0010] By providing a passage (30) that connects the vertical middle portion (21a') on the side (21a) of the insertion hole (21) to the space (40), voids can be released to the outside via a passage (22) that connects the vertical middle portion (21a') on the side (21a) of the insertion hole (21) to the space (40).

[0011] The passage (30) is provided so as to bend from the space (40) to the vertical intermediate portion (21a') on the side surface (21a) of the insertion hole (21), thereby preventing the sealing resin (60) from creeping up from the space (40) to the intermediate portion (21a').

[0012] The passage (30) includes a first passage (31) and a second passage (32) that are arranged symmetrically with respect to each other through the insertion hole (21), thereby making it possible to release voids from two symmetrical positions through the first passage (31) and the second passage (32).

[0013] The passages (31, 32) have vertical passages (31A, 32A) and horizontal passages (31B, 32B). The vertical passages (31A, 32A) extend in the vertical direction from the lower end (20') of the terminal block (20) so as to avoid the insertion hole (21). Meanwhile, the horizontal passages (31B, 32B) extend horizontally from the upper ends (31A', 32A') of the vertical passages (31A, 32A) while bending in a crank shape at a predetermined angle to reach the vertical middle portion (21a') on the side surface (21a) of the insertion hole (21). As a result, the crank-shaped passages (31, 32) act to reliably prevent the sealing resin (60) from creeping up from the space (40) to the middle portion (21a').

[0014] The inlets (31A'', 32A'') at the lower end (20') of the terminal block (20) of the vertical passages (31A, 32A) and their horizontal cross-sectional shapes have corners, which can prevent the sealing resin (60) from creeping up.

[0015] The inlets (31A'', 32A'') of the vertical passages (31A, 32A) and their cross-sectional shapes cut horizontally have four rectangular sides, one of which is an arc shape that protrudes inwardly into the rectangle, two of the four corners of the cross-sectional shape are right-angled, and the other two corners, which are the ends of the arc shape, are pointed, so that the right-angle and pointed shapes act to further restrict the sealing resin (60) from creeping up.

[0016] By setting the predetermined angle to 90°, it is possible to more reliably prevent the sealing resin 60 from creeping up from the space 40 to the intermediate portion 21a'.

[0017] A heat sink (300) is provided on the other surface (10'') of the substrate (10) to allow cooling of the substrate (10).

[0018] That is, in the semiconductor module (1) of the present invention, the substrate (10) can be appropriately cooled by the heat sink (300), but in a semiconductor module (1) having a large electrical capacity such as an in-vehicle semiconductor module (1), even when the substrate (10) is cooled by the heat sink (300), the substrate (10) generates a large amount of heat, and voids generated in the space (40) may reduce the performance of the semiconductor module (1). However, since the insertion hole (21) is connected to the space (40) as described above, the voids can be reliably released to the outside through the insertion hole (21), and reduction in performance can be suppressed even in a semiconductor module (1) having a large electrical capacity.

[0019] The passage (30) is provided so as to curve or meander from the space (40) to the vertical intermediate portion (21a') on the side surface (21a) of the insertion hole (21), thereby preventing the sealing resin (60) from creeping up from the space (40) to the intermediate portion (21a'). Effect of the Invention

[0020] As described above, according to the present invention, it is possible to prevent voids from accumulating in spaces. [Brief description of the drawings]

[0021] [Figure 1] 1 is a perspective view showing an overall configuration of a semiconductor module according to an embodiment of the present invention; [Diagram 2] 2 is a front view showing a terminal block and its surrounding configuration in the semiconductor module. FIG. [Diagram 3] 4 is a bottom view showing the configuration of a terminal block in the semiconductor module. FIG. [Figure 4] 11 is a perspective view showing the configuration of the other surface side of the substrate in the semiconductor module. FIG. [Diagram 5] 13 is a bottom view showing the configuration of the other surface side of the substrate in the semiconductor module. FIG. [Figure 6] 13 is an enlarged bottom view showing a part of the configuration of the other surface side of the substrate in the semiconductor module. FIG. [Figure 7] 13 is another enlarged bottom view showing a part of the configuration on the other surface side of the substrate in the semiconductor module. FIG. [Figure 8] 13 is yet another enlarged bottom view showing a part of the configuration on the other surface side of the substrate in the semiconductor module. FIG. [Figure 9] 13 is a further enlarged bottom view showing a part of the configuration on the other surface side of the substrate in the semiconductor module. FIG. [Figure 10] 11 is a front view for explaining a method of assembling the semiconductor module. FIG. [Figure 11] 10 for explaining the method of assembling the semiconductor module. FIG. [Figure 12] 12 is a front view continuing from FIG. 11 for explaining the method of assembling the semiconductor module. FIG. [Figure 13] 13 is a front view continuing from FIG. 12 for explaining the method of assembling the semiconductor module. FIG. [Figure 14] FIG. 2 is a front view showing a comparative example of the semiconductor module. [Figure 15] FIG. 13 is a front view showing a modified example of the present invention. [Figure 16] FIG. 11 is another front view showing a modified example of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a perspective view showing the overall configuration of a semiconductor module according to an embodiment of the present invention, Fig. 2 is a front view showing the configuration of a terminal block and its surroundings in the semiconductor module, Fig. 3 is a bottom view showing the configuration of the terminal block in the semiconductor module, Fig. 4 is a perspective view showing the configuration of the other side of a substrate in the semiconductor module, Fig. 5 is a bottom view showing the configuration of the other side of a substrate in the semiconductor module, Fig. 6 is an enlarged bottom view showing a part of the configuration of the other side of a substrate in the semiconductor module, Fig. 7 is another enlarged bottom view showing a part of the configuration of the other side of a substrate in the semiconductor module, and Fig. 8 is a bottom view showing a part of the configuration of the other side of a substrate in the semiconductor module. FIG. 9 is yet another enlarged bottom view showing a partial enlargement of the configuration of the other side of the substrate in the semiconductor module; FIG. 10 is a front view for explaining the assembly method of the semiconductor module; FIG. 11 is a front view continuing from FIG. 10 for explaining the assembly method of the semiconductor module; FIG. 12 is a front view continuing from FIG. 11 for explaining the assembly method of the semiconductor module; FIG. 13 is a front view continuing from FIG. 12 for explaining the assembly method of the semiconductor module; and FIG. 14 is a front view showing a comparative example of the semiconductor module.

[0023] In the following description, one surface 10' of substrate 10 is referred to as the upper side, the other surface 10'' of substrate 10 is referred to as the lower side, the direction along the short side of substrate 10 is referred to as the lateral side, and the direction along the long side of substrate 10 is referred to as the front-rear direction, and each direction is clearly indicated in the drawings.

[0024] [Configuration corresponding to claim 1] 1 to 9, the semiconductor module 1 of the present invention is a semiconductor module 1 in which a terminal block 20 is attached to an edge 11 on one surface 10' side of a substrate 10, the terminal block 20 has terminals 20a attached thereto via fixtures 50, and is provided with insertion holes 21 for inserting the fixtures 50 into the terminal block 20, and further, a space 40 is formed between the edge 11 of the substrate 10 and a lower end 20' of the terminal block 20, and the insertion holes 21 communicate with the space 40. The substrate 10 is rectangular in shape.

[0025] That is, outside the insertion hole 21, the edge 20" of the lower end 20' of the terminal block 20 protrudes downward beyond the periphery of the insertion hole 21, and when the edge 20" of the terminal block 20 is grounded to the edge 11 of the substrate 10, a space 40 is formed below the insertion hole 21 between it and the edge 11 of the substrate 10. A semiconductor element 200 such as a transistor is mounted on one surface 10' of the substrate 10 via copper foil 100, and the copper foil 100 and the semiconductor element 200 extend to the edge 11 of the one surface 10' of the substrate 10.

[0026] The semiconductor module 1 is, for example, a power module for use in a vehicle, and has a power capacity of 140 kW to 850 kW.

[0027] [Configuration corresponding to claim 2] The insertion hole 21 has a vertical middle portion 21a' on the side surface 21a side that communicates with the space 40, and a bottom surface 21b side that is closed.

[0028] [Configuration corresponding to claim 3] The semiconductor module 1 is provided with a passage 30 that connects the space 40 to a vertical intermediate portion 21a' on the side surface 21a of the insertion hole 21.

[0029] [Configuration corresponding to claim 4] The passage 30 is provided so as to extend from the space 40 to a vertical intermediate portion 21a' on the side surface 21a of the insertion hole 21 while bending.

[0030] [Configuration corresponding to claim 5] The passage 30 includes a first passage 31 and a second passage 32 that are provided symmetrically with respect to each other across the insertion hole 21 .

[0031] [Configuration corresponding to claim 6] The passages 31, 32 have vertical passages 31A, 32A and horizontal passages 31B, 32B, and the vertical passages 31A, 32A extend vertically from the lower end 20' of the terminal block 20 to avoid the insertion hole 21, while the horizontal passages 31B, 32B extend horizontally from the upper ends of the vertical passages 31A, 32A while bending at a predetermined angle in a crank shape to reach the vertical middle portion 21a' on the side 21a of the insertion hole 21.

[0032] [Configuration corresponding to claim 7] The entrances 31A'', 32A'' at the lower end 20' of the terminal block 20 of the vertical passages 31A, 32A and their cross-sectional shapes cut in the horizontal direction have corners.

[0033] [Configuration corresponding to claim 8] The inlets 31A'', 32A'' of the vertical passages 31A, 32A and their cross-sectional shapes cut horizontally have four rectangular sides, one of which is an arc shape that protrudes inward toward the inside of the rectangle, two of the four corners of the cross-sectional shape are right-angled, and the other two corners, which are the ends of the arc shape, are pointed.

[0034] [Configuration corresponding to claim 9] The predetermined angle is set to 90°.

[0035] [Configuration corresponding to claim 10] A heat sink 300 is provided on the other surface 10'' of the substrate 10. The heat sink 300 has a plurality of protrusions 310, 320 that protrude downward, and can cool the substrate 10 by bringing air or water into contact with the protrusions 310, 320.

[0036] The protrusions 310, 320 include a triangular prism-shaped protrusion 310 provided on three of the four edges 10a", 10b", 10c", 10d" on the other surface 10" of the substrate 10, and a square prism-shaped protrusion 320 provided on the central portion 10"" and one edge 10d" on the other surface 10" of the substrate 10, and these triangular prism-shaped protrusions 310 and square prism-shaped protrusions 320 work together to achieve high cooling efficiency. The triangular prism-shaped protrusion 310 has a flat surface 310a on the outward surface side and a triangle apex on the inward surface side.

[0037] [Method of forming semiconductor module 1] The semiconductor module 1 configured as above can be assembled as follows.

[0038] That is, as shown in FIG. 10, a substrate 10 on which a semiconductor element 200 such as a transistor is mounted via a copper foil 100 is prepared.

[0039] Next, as shown in FIG. 11, a terminal block 20 is attached to the edge portion 11 on the one surface 10' side of the substrate 10. As shown in FIG.

[0040] 12, one surface 10' side of the substrate 10 is sealed with resin 60. The sealing with resin 60 is performed so as to enter the space 40. Moreover, the sealing with resin 60 is performed before the mounting tool 50 such as a bolt is inserted into the insertion hole 21.

[0041] When sealing with resin 60, voids may occur in space 40, but the voids are released to the outside through passage 30 and insertion hole 21.

[0042] 13, after the voids have been sufficiently released, the terminal 20a is attached to the terminal block 20. The terminal 20a is attached by inserting a mounting tool 50 such as a bolt into the insertion hole 21.

[0043] [Effect corresponding to claim 1] As described above, according to the present invention, the terminal block 20 has the terminal 20a attached via the mounting fixture 50, and is provided with an insertion hole 21 for inserting the mounting fixture 50 into the terminal block 20. Furthermore, a space 40 is formed between the edge 11 of the substrate 10 and the lower end 20' of the terminal block 20, and the insertion hole 21 is connected to the space 40. Therefore, even if a void occurs in the space 40, the void can be released to the outside through the insertion hole 21, thereby preventing the void from accumulating in the space 40.

[0044] That is, when the insertion hole 21 and the space 40 are not connected, as in the conventional semiconductor module 400 shown in FIG. 14, that is, when the passage 30 is not provided, voids are generated during sealing with resin 60, and the voids may expand due to heat generation from the substrate 10, etc., thereby reducing the performance of the semiconductor module 400. However, in the semiconductor module 1 of the present invention, the insertion hole 21 is connected to the space 40, so that even if a void is generated in the space 40, the void can be released to the outside through the insertion hole 21, thereby preventing the voids from accumulating in the space 40.

[0045] [Effect corresponding to claim 2] Moreover, since the insertion hole 21 has the vertical middle portion 21a' on the side surface 21a side communicating with the space 40 and the bottom surface 21b side being closed, voids can be released to the outside via the vertical middle portion 21a' on the side surface 21a side. Furthermore, since the insertion hole 21 has the bottom surface 21b side being closed, interference between the lower end of the mounting tool 50 to be inserted and the sealing resin 60 can be reduced.

[0046] [Effect corresponding to claim 3] Furthermore, by providing a passage 30 that connects the vertical middle portion 21a' on the side 21a of the insertion hole 21 to the space 40, voids can be released to the outside via a passage 22 that connects the vertical middle portion 21a' on the side 21a of the insertion hole 21 to the space 40.

[0047] [Effect corresponding to claim 4] Furthermore, the passage 30 is arranged so as to curve from the space 40 to the vertical middle portion 21a' on the side surface 21a of the insertion hole 21, thereby preventing the sealing resin 60 from creeping up from the space 40 to the middle portion 21a'.

[0048] [Effect corresponding to claim 5] Furthermore, since the passage 30 includes a first passage 31 and a second passage 32 that are arranged symmetrically with respect to each other through the insertion hole 21, voids can be released from two symmetrical positions through the first passage 31 and the second passage 32.

[0049] [Effect corresponding to claim 6] In addition, the passages 31, 32 have vertical passages 31A, 32A and horizontal passages 31B, 32B, and the vertical passages 31A, 32A extend in the vertical direction from the lower end 20' of the terminal block 20 to avoid the insertion hole 21, while the horizontal passages 31B, 32B extend horizontally from the upper ends 31A', 32A' of the vertical passages 31A, 32A while bending in a crank shape at a predetermined angle to reach the vertical middle portion 21a' on the side surface 21a of the insertion hole 21. As a result, the crank-shaped passages 31, 32 act to reliably prevent the sealed resin 60 from creeping up from the space 40 to the middle portion 21a'.

[0050] [Effect corresponding to claim 7] Furthermore, the entrances 31A'', 32A'' at the lower end 20' of the terminal block 20 of the vertical passages 31A, 32A and their horizontal cross-sectional shapes have corners, thereby preventing the sealing resin 60 from creeping up.

[0051] [Effect corresponding to claim 8] Furthermore, the inlets 31A'', 32A'' of the vertical passages 31A, 32A and the cross-sectional shape cut horizontally have four rectangular sides A1 to D1, A2 to D2, of which one side D1, D2 is an arc shape protruding inwardly of the rectangle, and two of the four corners a1 to d1, a2 to d2 of the cross-sectional shape, namely a1, b1, a2, b2, are right-angled, and the other two corners c1, d1, c2, d2, which are the ends of the arc shape, are pointed, so that the right-angle shape and pointed shape act to further restrict the creeping up of the sealed resin 60.

[0052] [Effect corresponding to claim 9] Furthermore, by setting the predetermined angle to 90°, it is possible to more reliably prevent the sealing resin 60 from creeping up from the space 40 to the intermediate portion 21a'.

[0053] [Effect corresponding to claim 10] Furthermore, a heat sink 300 is provided on the other surface 10'' of the substrate 10, thereby enabling the substrate 10 to be cooled.

[0054] That is, in the semiconductor module 1 of the present invention, the substrate 10 can be appropriately cooled by the heat sink 300, but in a semiconductor module 1 having a large electrical capacity, such as an in-vehicle semiconductor module 1, even when the substrate 10 is cooled by the heat sink 300, the substrate 10 generates a large amount of heat, and voids generated in the space 40 may reduce the performance of the semiconductor module 1. However, since the insertion hole 21 is connected to the space 40 as described above, the voids can be reliably released to the outside via the insertion hole 21, and reduction in performance can be suppressed even in a semiconductor module 1 having a large electrical capacity.

[0055] [Modifications and applications] Of course, the present invention is not limited to the above-described embodiment, and various modifications and applications are possible without departing from the scope of the claims.

[0056] That is, in the above-described embodiment, the passage 30 is arranged so as to bend from the space 40 to the vertical intermediate portion 21a' on the side surface 21a of the insertion hole 21, but as shown in Figures 15 and 16, the required effect can also be achieved even if the passage 30 is arranged so as to curve or meander from the space 40 to the vertical intermediate portion 21a' on the side surface 21a of the insertion hole 21.

[0057] In other words, the passage 30 is arranged to curve or meander from the space 40 to the vertical middle portion 21a' on the side surface 21a of the insertion hole 21, thereby preventing the sealing resin 60 from creeping up from the space 40 to the middle portion 21a'.

[0058] Even in this case, the entrances 31A'', 32A'' at the lower end 20' of the terminal block 20 of the vertical passages 31A, 32A and their cross-sectional shapes cut in the horizontal direction may have corners.

[0059] More specifically, the inlets 31A'', 32A'' of the vertical passages 31A, 32A and the cross-sectional shape cut horizontally may have four rectangular sides A1 to D1, A2 to D2, of which one side D1, D2 is an arc shape protruding inwardly of the rectangle, and two of the four corners A1 to D1, A2 to D2 of the cross-sectional shape, a1, b1, a2, b2, may be right-angled, and the other two corners c1, d1, c2, d2, which are the ends of the arc shape, may be pointed. [Explanation of symbols]

[0060] A1, B1, C1, D1, A2, B2, C2, D2: Side a1,b1,c1,d1,a2,b2,c2,d2: Corner 1: Semiconductor module 10: Substrate 10´:First Face 10´´:Other Sides 10a´´,10b´´,10c´´,10d´´:Edge 10´´´: Central part 11: Edge 20:Terminal block 20a: Terminal 20´: Bottom end 20´´:Edge 21: Insertion hole 21a: Side 21a´:Middle section 21b: Bottom 30: Passage 31,32: Corridor 31A, 32A: Vertical passage 31A´´,32A´´:Entrance 31B, 32B: Horizontal passage 40: Space 50: Mounting fixture 60: Resin 100: Copper foil 200: Semiconductor elements 300: Heat sink 310,320: Projection body 310a: flat surface 400: Semiconductor module

Claims

1. A semiconductor module (1) in which a terminal block (20) is attached to an edge portion (11) on one surface (10') of a substrate (10), The terminal block (20) is provided with an insertion hole (21) for inserting the attachment tool into the terminal block (20), and a space (40) is formed between the edge (11) of the substrate (10) and the lower end (20') of the terminal block (20). The semiconductor module (1) is characterized in that the insertion hole (21) communicates with the space (40).

2. The semiconductor module (1) according to claim 1, characterized in that the insertion hole (21) has a vertical middle portion (21a') on the side (21a) side which is connected to the space (40) and a bottom surface (21b) side which is closed.

3. 3. The semiconductor module (1) according to claim 2, further comprising a passage (30) for communicating a vertical intermediate portion (21a') of the side surface (21a) of the insertion hole (21) with the space (40).

4. The semiconductor module (1) according to claim 3, characterized in that the passage (30) is arranged to bend and reach the vertical middle portion (21a') of the side (21a) of the insertion hole (21) from the space (40).

5. 2. The semiconductor module (1) according to claim 1, wherein the passage (30) includes a first passage (31) and a second passage (32) that are provided symmetrically with respect to each other through the insertion hole (21).

6. The semiconductor module (1) according to claim 4, characterized in that the passages (31, 32) have vertical passages (31A, 32A) and horizontal passages (31B, 32B), the vertical passages (31A, 32A) extending in the vertical direction from the lower end (20') of the terminal block (20) so as to avoid the insertion hole (21), and the horizontal passages (31B, 32B) extending horizontally from the upper ends (31A', 32A') of the vertical passages (31A, 32A) while bending in a crank shape at a predetermined angle to reach a vertical intermediate portion (21a') on the side surface (21a) of the insertion hole (21).

7. The semiconductor module (1) according to claim 1, characterized in that the inlets (31A'', 32A'') of the vertical passages (31A, 32A) at the lower ends (20') of the terminal block (20) and their cross-sectional shapes cut in the horizontal direction have corners.

8. The semiconductor module (1) according to claim 1, characterized in that the inlet (31A'', 32A'') of the vertical passage (31A, 32A) and the cross-sectional shape cut in the horizontal direction have one of four rectangular sides formed as an arc protruding inward of the rectangular shape, two of four corners of the cross-sectional shape are right-angled, and the other two corners that are ends of the arc shape are pointed.

9. 6. The semiconductor module (1) according to claim 5, characterized in that the predetermined angle is 90 degrees.

10. 2. The semiconductor module (1) according to claim 1, characterized in that the other side (10'') of the substrate (10) is provided with a heat sink.

11. The semiconductor module (1) according to claim 3, characterized in that the passage (30) is arranged to extend from the space (40) to a vertical middle portion (21a') of the side (21a) of the insertion hole (21) in a curved or serpentine manner.

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