Film deposition apparatus

Abstract

To provide a film deposition apparatus capable of improving film deposition accuracy.SOLUTION: A film deposition apparatus includes a magnet plate 11 provided inside a chamber, and generating magnetic force for attracting a mask to an adsorption plate, a plate unit lifting and lowering unit for lifting and lowering the magnet plate 11, and a connection mechanism 1100 for connecting the magnet plate 11 to the plate unit lifting and lowering unit so that the magnet plate 11 performs at least either of rotation and vertical movement according to external force working on the magnet plate 11.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a film forming apparatus for forming a thin film on a substrate. [Background technology]

[0002] In the manufacture of organic electroluminescence displays and the like, a thin film is formed on a substrate from a film-forming material using a mask. As a pre-treatment for film formation, the mask and the substrate are aligned and then superimposed. Patent Document 1 discloses that alignment is performed by bringing the substrate and the mask close to each other while the substrate is attached to an attachment plate such as an electrostatic chuck. It also discloses that after alignment, the mask is attracted to the substrate by a magnetic plate.

[0003] In the conventional technology, when the mask is attracted to the substrate, the magnet plate is separated from the attraction plate. Therefore, the force attracting the mask is weak, and a gap may occur between the substrate and the mask during film formation. As a result, the film formation accuracy may decrease. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2014-65959 A Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a film forming apparatus capable of improving the film forming accuracy. [Means for solving the problem]

[0006] The present invention employs the following means to solve the above problems.

[0007] That is, the film forming apparatus of the present invention is A chamber that maintains a vacuum inside; an adsorption plate provided inside the chamber for adsorbing a substrate; a mask support means provided within the chamber for supporting a mask that is aligned with the substrate; a magnetic force generating member provided inside the chamber and configured to generate a magnetic force for attracting the mask to the attraction plate; a lifting means for lifting the magnetic force generating member; a connection mechanism that connects the magnetic force generating member to a lifting means so that the magnetic force generating member at least one of pivoting and vertically moving so as to be parallel to the attraction plate in response to an external force acting on the magnetic force generating member; The present invention is characterized by comprising: Effect of the Invention

[0008] As described above, the film formation accuracy can be improved. [Brief description of the drawings]

[0009] [Figure 1] Schematic diagram of a part of a manufacturing line for electronic devices. [Diagram 2] 1 is a schematic diagram of a film forming apparatus according to an embodiment. [Diagram 3] FIG. 4 is an explanatory diagram of a substrate supporting unit and an adsorption plate. [Figure 4] An explanatory diagram of the electrical wiring of the suction plate. [Diagram 5] FIG. [Figure 6] FIG. [Figure 7] 1A to 1C are explanatory diagrams of a process for overlapping a substrate and a mask using an adsorption plate. [Figure 8] FIG. 2 is an explanatory diagram of the mechanism of the connection mechanism according to the first embodiment. [Figure 9] FIG. 11 is a schematic cross-sectional view of a connection mechanism according to a second embodiment. [Figure 10] FIG. 11 is a schematic cross-sectional view of a connection mechanism according to a third embodiment. [Figure 11] FIG. 11 is a schematic cross-sectional view of a connection mechanism according to a fourth embodiment. [Figure 12]FIG. 13 is a schematic cross-sectional view of a connection mechanism according to a fifth embodiment. [Figure 13] FIG. 13 is a schematic cross-sectional view of a connection mechanism according to a sixth embodiment. [Figure 14] FIG. 13 is an explanatory diagram of an application example of a connection mechanism. [Figure 15] FIG. 13 is an explanatory diagram of an application example of the plate unit. [Figure 16] FIG. 1 is an explanatory diagram of an organic EL display device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] (Embodiment) <Electronic device manufacturing line> Fig. 1 is a schematic diagram showing a part of the configuration of a manufacturing line for electronic devices to which the film forming apparatus of the present invention can be applied. The manufacturing line of Fig. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone, in which substrates 100 are sequentially transported to a film forming block 301, and an organic EL film is formed on the substrates 100. Note that, although a cluster-type manufacturing apparatus is used as an example in this embodiment, the manufacturing apparatus to which the film forming apparatus of the present invention is applied can also be applied to an in-line type manufacturing apparatus.

[0012] In the film formation block 301, a plurality of film formation chambers 303a to 303d in which film formation processing is performed on the substrate 100 and a mask storage chamber 305 in which masks before and after use are stored are arranged around a transfer chamber 302 having an octagonal shape in a plan view. A transfer robot 302a for transferring the substrate 100 is arranged in the transfer chamber 302. The transfer robot 302a includes a hand for holding the substrate 100 and an articulated arm for moving the hand in the horizontal direction. In other words, the film formation block 301 is a cluster-type film formation unit in which a plurality of film formation chambers 303a to 303d are arranged so as to surround the transfer robot 302a. When the film formation chambers 303a to 303d are collectively referred to or when they are not distinguished from one another, they are referred to as film formation chambers 303.

[0013] In the transport direction (arrow direction) of the substrate 100, a buffer chamber 306, a swirl chamber 307, and a delivery chamber 308 are disposed on the upstream side and downstream side of the film-forming block 301, respectively. In the manufacturing process, each chamber is maintained in a vacuum state. Although only one film-forming block 301 is illustrated in FIG. 1, the manufacturing line according to this embodiment has a plurality of film-forming blocks 301, and the plurality of film-forming blocks 301 are connected by a connection device composed of the buffer chamber 306, the swirl chamber 307, and the delivery chamber 308. The configuration of the connection device is not limited to this, and may be composed of, for example, only the buffer chamber 306 or the delivery chamber 308.

[0014] The transport robot 302a transports the substrate 100 from the upstream delivery chamber 308 to the transport chamber 302, transports the substrate 100 between the film formation chambers 303, transports the mask between the mask storage chamber 305 and the film formation chamber 303, and transports the substrate 100 from the transport chamber 302 to the downstream buffer chamber 306.

[0015] The buffer chamber 306 is a chamber for temporarily storing the substrates 100 depending on the operating status of the production line. The buffer chamber 306 is provided with a substrate storage shelf also called a cassette, and a lifting mechanism. The substrate storage shelf has a multi-stage structure capable of storing a plurality of substrates 100 while maintaining the substrates 100 in a horizontal state with the surfaces to be processed (surfaces to be film-formed) facing downward in the direction of gravity. The lifting mechanism raises and lowers the substrate storage shelf to match the stage where the substrates 100 are carried in or out with the transport position. This allows the buffer chamber 306 to temporarily store and retain a plurality of substrates 100.

[0016] The swirl chamber 307 is equipped with a device for changing the orientation of the substrate 100. In this embodiment, the swirl chamber 307 rotates the orientation of the substrate 100 by 180 degrees using a transport robot provided in the swirl chamber 307. The transport robot provided in the swirl chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and delivers it to the delivery chamber 308, so that the front end and the rear end of the substrate are swapped between the buffer chamber 306 and the delivery chamber 308. As a result, the orientation of the substrate 100 when it is carried into the film formation chamber 303 is the same in each film formation block 301, so that the scan direction of film formation on the substrate S and the orientation of the mask can be made consistent in each film formation block 301. With this configuration, the orientation of the mask installed in the mask storage chamber 305 in each film formation block 301 can be made consistent, simplifying mask management and improving usability.

[0017] The control system of the manufacturing line includes a host device 300 that controls the entire line as a host computer, and control devices 14a-14d, 309, and 310 that control each component, and these can communicate with each other via a wired or wireless communication line 300a. The control devices 14a-14d are provided corresponding to the film formation chambers 303a-303d, and control the film formation apparatus 1 described below. When the control devices 14a-14d are collectively referred to or when there is no need to distinguish between them, they are referred to as the control device 14.

[0018] The control device 309 controls the transport robot 302a. The control device 310 controls the transport robot provided in the swirl chamber 307. The host device 300 transmits information about the substrate 100 and instructions such as transport timing to each of the control devices 14, 309, and 310, and each of the control devices 14, 309, and 310 controls each component based on the received instructions.

[0019] <Overview of the deposition equipment> FIG. 2 is a schematic diagram of a film forming apparatus 1 according to an embodiment. The film forming apparatus 1 provided in the film forming chamber 303 is an apparatus for forming a thin film on the substrate 100 by a film forming material, and forms a thin film of a predetermined pattern using a mask 101. The material of the substrate 100 on which the film is formed by the film forming apparatus 1 can be appropriately selected from materials such as glass, resin, and metal, and for example, a resin layer such as polyimide formed on glass is preferably used. As the film forming material, substances such as organic materials and inorganic materials (metals, metal oxides, etc.) are adopted. The film forming apparatus 1 can be applied to manufacturing apparatuses for manufacturing electronic devices such as display devices (flat panel displays, etc.), thin film solar cells, and organic photoelectric conversion elements (organic thin film imaging elements), and optical members, and is particularly preferably used in manufacturing apparatuses for manufacturing organic EL panels. In the following description, an example will be described in which the film forming apparatus 1 forms a film on the substrate 100 by vacuum deposition. However, the present invention is not limited thereto, and can be applied to various film forming apparatuses for performing sputtering, CVD, etc. In each drawing, arrow Z indicates the vertical direction, and arrows X and Y indicate horizontal directions that are perpendicular to each other.

[0020] The film forming apparatus 1 has a box-shaped vacuum chamber 3 (also simply called a chamber) capable of maintaining a vacuum inside. An internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown). In this specification, "vacuum" refers to a state filled with gas at a pressure lower than atmospheric pressure, in other words, a reduced pressure state. The internal space 3a of the vacuum chamber 3 contains a substrate 10. The mask 101 is a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate 100, and is placed on the mask table 5. The mask table 5 can be replaced with other means for fixing the mask 101 at a predetermined position. The mask 101 may be a mask having a structure in which a mask foil having a thickness of several μm to several tens of μm is welded to a frame-shaped mask frame. The material of the mask 101 is not particularly limited, but it is preferable to use a metal having a small thermal expansion coefficient such as an Invar material. The film formation process is performed in a state in which the substrate 100 is placed on the mask 101 and the substrate 100 and the mask 101 are overlapped with each other.

[0021] The plate unit 9 includes a cooling plate 10 and a magnet plate 11 as a magnetic force generating member. The cooling plate 10 is suspended below the magnet plate 11 so as to be displaceable in the Z direction relative to the magnet plate 11. The cooling plate 10 has a function of cooling the substrate 100 attracted to the attraction plate 15 by contacting the attraction plate 15 during film formation. The cooling plate 10 is not limited to a type that is equipped with a water cooling mechanism or the like and actively cools the substrate 100, and may be a plate-like member that does not have a water cooling mechanism or the like but removes heat from the substrate 100 by contacting the attraction plate 15. The magnet plate 11 is a plate that attracts the mask 101 by magnetic force, and is placed on the upper surface of the substrate 100 to exhibit a function of improving the adhesion between the substrate 100 and the mask 101 during film formation.

[0022] It is also possible to adopt a configuration in which the cooling plate 10 is not provided. For example, if the adsorption plate 15 is provided with a cooling mechanism, the cooling plate 10 does not need to be provided.

[0023] The film forming unit 4 is a unit having an evaporation source, and in addition to the evaporation source, includes a heater, a shutter, a driving mechanism for the evaporation source, an evaporation rate monitor, and the like. More specifically, in this embodiment, the film forming unit 4 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in the X direction, and an evaporation material is discharged from each nozzle. For example, the linear evaporation source is moved back and forth in the Y direction (depth direction of the device) by an evaporation source moving mechanism (not shown). In this embodiment, the film forming unit 4 is provided in the same vacuum chamber 3 as the alignment device 2 described later. However, in an embodiment in which the film forming process is performed in a chamber other than the vacuum chamber 3 in which the alignment is performed, the film forming unit 4 is not provided in the vacuum chamber 3.

[0024] <Alignment device> The film forming apparatus 1 includes an alignment device 2 as an alignment means for aligning a substrate 100 and a mask 101. The alignment device 2 includes a substrate support unit 6, an adsorption plate 15, a position adjustment unit 20, a distance adjustment unit 22, a plate unit lifting unit 13, measurement units 7 and 8, an adjustment unit 17, a floating portion 19, and a detection unit 16. Each component of the alignment device will be described below.

[0025] <<Substrate support unit>> The alignment apparatus 2 includes a substrate supporting unit 6 that supports the peripheral portion of the substrate 100. Description will be made with reference to Fig. 3 in addition to Fig. 2. Fig. 3 is an explanatory diagram of the substrate supporting unit 6 and the suction plate 15, as viewed from below.

[0026] The substrate supporting unit 6 includes a plurality of base portions 61a to 61d that form an outer frame thereof, and a plurality of placement portions 62 and 63 that protrude inward from the base portions 61a to 61d. The placement portions 62 and 63 are sometimes also called "receiving claws" or "fingers." The base portions 61a to 61d are each supported by a support shaft R3. The plurality of placement portions 62 are disposed at intervals on the base portions 61a to 61d so as to support the long side of the peripheral portion of the substrate 100. In addition, The multiple placement parts 63 are arranged at intervals on the base parts 61a to 61d so as to receive the short side of the peripheral portion of the substrate 100. The substrate 100 carried into the film forming apparatus 1 by the transfer robot 302a is supported by the multiple placement parts 62 and 63. Hereinafter, the base parts 61a to 61d will be referred to collectively as the base part 61 when there is no need to distinguish between them.

[0027] In this embodiment, the multiple mounting portions 62 and 63 are composed of leaf springs, and when the substrate 100 supported by the multiple mounting portions 62 and 63 is adsorbed onto the suction plate 15, the elastic force of the leaf springs can press the substrate 100 against the suction plate 15.

[0028] 3, the four base parts 61 form a rectangular frame with a partial cutout, but the present invention is not limited to this, and the base parts 61 may be a continuous rectangular frame that surrounds the outer periphery of the rectangular substrate 100. However, by providing the cutouts by the multiple base parts 61, the transport robot 302a can avoid the base parts 61 when transferring the substrate 100 to the placement parts 62 and 63. This can improve the efficiency of transferring and transferring the substrate 100.

[0029] In addition, the substrate support unit 6 may be provided with multiple clamp portions corresponding to the multiple mounting portions 62 and 63, and a configuration may be adopted in which the peripheral portion of the substrate 100 placed on the mounting portions 62 and 63 is clamped and held by the clamp portions.

[0030] <<Adsorption plate>> 2 and 3. The alignment device 2 is provided inside the vacuum chamber 3, and includes a suction plate 15 capable of suctioning the substrate 100. In this embodiment, the suction plate 15 is provided between the substrate support unit 6 and the plate unit 9, and is supported by one or more support shafts R1. In this embodiment, the suction plate 15 is supported by four support shafts R1. In one embodiment, the support shaft R1 is a cylindrical shaft.

[0031] In this embodiment, the chucking plate 15 is an electrostatic chuck that chucking the substrate 100 by electrostatic force. For example, the chucking plate 15 has a structure in which an electric circuit such as a metal electrode is embedded inside a matrix (also called a base) made of a ceramic material. For example, in each electrode arrangement region 151, a pair of electrodes to which positive and negative voltages are applied to generate an electrostatic attraction force are arranged. The positive and negative electrodes are arranged alternately in one electrode arrangement region 151. When a positive (+) and negative (-) voltage is applied to the metal electrodes arranged in the electrode arrangement region 151, a polarization charge is induced in the substrate 100 through the ceramic matrix, and the substrate 100 is chucking and fixed to the chucking surface 150 of the chucking plate 15 by the electrostatic attraction (electrostatic force) between the substrate 100 and the chucking plate 15.

[0032] The attraction plate 15 also includes a voltage control unit (not shown) that controls the magnitude of the voltage applied to the electrodes, the start time of the voltage application, the duration of the voltage application, the order of voltage application, etc. The voltage control unit can control the voltage application to the multiple electrode arrangement regions 151 independently of each other.

[0033] The electrode arrangement area 151 can be appropriately set. For example, in this embodiment, the multiple electrode arrangement areas 151 are provided spaced apart from each other, but one electrode arrangement area 151 may be formed over substantially the entire surface of the adsorption surface 150 of the adsorption plate 15.

[0034] Furthermore, a plurality of touch sensors 1621 for detecting contact between the suction plate 15 and the substrate 100 are embedded in the suction plate 15. In this embodiment, a total of nine touch sensors 1621 are provided. Four touch sensors 1621 are provided along each of the long sides of the periphery of the suction plate 15, and one touch sensor 1621 is provided in the center of the suction plate 15. In this manner, by providing the touch sensors 1621 at a plurality of locations on the suction plate 15, the entire surface of the substrate 100 is suctioned to the suction surface 150. It should be noted that the number and arrangement of the touch sensors 1621 can be changed as appropriate.

[0035] In addition, in this embodiment, the touch sensor 1621 mechanically detects contact between itself and the object. As an example, the tip of the touch sensor 1621 is biased by a spring or the like, and is provided so that the tip protrudes from the adsorption surface 150 when the tip is not in contact with the substrate 100 or the like. When the substrate 100 contacts the tip of the touch sensor 1621, the tip is pushed by the substrate 100 and retracts toward the adsorption plate 15 side, and contacts an internal contact to output a predetermined electric signal. The shape of the tip is not particularly limited, and may be a button shape or a rod shape. By appropriately setting the length by which the tip protrudes from the adsorption surface 150 when not in contact with the object, the touch sensor 1621 can substantially detect contact between the adsorption plate 15 and the substrate 100. In addition, the plurality of touch sensors 1621 constitute a detection unit 16 that detects the parallelism between the adsorption plate 15 and the mask table 5, as described later.

[0036] In this embodiment, the suction plate 15 is provided with a fiber sensor 1622 that detects the state of suction of the substrate 100 to the suction plate 15. The fiber sensor 1622 includes a light emitting portion 1622a and a light receiving portion 1622b. The light emitting portion 1622a and the light receiving portion 1622b are provided below the suction plate 15, for example, several mm to several tens of mm below the suction plate 15, so as to form an optical path 1622c. When a part of the substrate 100 is not suctioned to the suction plate 15, the part is bent downward by gravity. When the substrate 100 is bent after the substrate 100 is suctioned to the suction plate 15, the bent portion blocks the optical path 1622c, and the bending of the substrate 100 is detected. That is, it is possible to detect that the substrate 100 is not properly suctioned. It is also possible to adopt a configuration in which the fiber sensor 1622 is not provided.

[0037] Further, a plurality of openings 152 are formed in the attraction plate 15, and measurement units (first measurement unit 7 and second measurement unit 8) described later capture images of a mask mark described later through the plurality of openings 152.

[0038] Please also refer to FIG. 4. FIG. 4 shows a schematic structure from the suction plate 15 to the support shaft R1. FIG. 4 is an explanatory diagram of the electrical wiring of the suction plate, and shows the wiring for supplying electricity to the electrodes arranged in the electrode arrangement area 151 of the suction plate 15. In the present embodiment, a plurality of support shafts R1 supporting the suction plate 15 are formed in a hollow tubular shape. Then, the electric wires 153 for applying positive (+) and negative (-) voltages are wired so as to pass through the inside of the support shafts R1. In the example of FIG. 4, a total of two electric wires 153 for applying positive (+) and negative (-) voltages are shown. Also, the electric wires 153 extending from the lower part of the support shaft R1 to the vacuum chamber 3 extend along the short side of the suction plate 15 and are connected to an electric connection part 154 provided at approximately the center of the short side. That is, the electric wires 153 are led from the outside to the inside of the vacuum chamber 3 via the support shaft R1 and are connected to the electric connection part 154. Furthermore, power supplied from the electric wire 153 to the electrical connection portion 154 is supplied to each electrode arranged in the electrode arrangement region 151 .

[0039] In this embodiment, four support shafts R1 are provided, and various electric wires (cables) are led through these support shafts R1 into the vacuum chamber 3. In one embodiment, electric wires 153 that supply electricity to the suction plate 15 pass through the insides of two support shafts R1 provided diagonally, and cables such as a touch sensor 1621 and a fiber sensor 1622 (described later) pass in a bundled state through the insides of the remaining two support shafts R1.

[0040] <<Position adjustment unit>> The alignment device 2 includes a position adjustment unit 20 that adjusts the relative position of the substrate 100, the peripheral portion of which is supported by the substrate support unit 6, or the substrate 100, which is adsorbed by the adsorption plate 15, and the mask 101. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 or the adsorption plate 15 on the XY plane. That is, the position adjustment unit 20 can be said to be a unit that adjusts the horizontal positions of the mask 101 and the substrate 100. For example, the position adjustment unit 20 can displace the substrate support unit 6 in the X and Y directions, and in the rotation direction around the axis in the Z direction. In this embodiment, the position of the mask 101 is fixed, and the substrate 100 is displaced to adjust their relative positions, but the mask 101 may be displaced to adjust them, or both the substrate 100 and the mask 101 may be displaced.

[0041] In this embodiment, the position adjustment unit 20 includes a fixed plate 20a, a movable plate 20b, and a plurality of actuators 201 arranged between these plates. The fixed plate 20a is fixed onto the upper wall portion 30 of the vacuum chamber 3. A frame-shaped base 21 is mounted on the movable plate 20b, and a distance adjustment unit 22 and a plate unit lifting unit 13 are supported on the base 21. When the actuator 201 displaces the movable plate 20b in the horizontal direction relative to the fixed plate 20a, the base 21, the distance adjustment unit 22, and the plate unit lifting unit 13 are displaced together.

[0042] The multiple actuators 201 include, for example, an actuator capable of displacing the movable plate 20b in the X direction and an actuator capable of displacing the movable plate 20b in the Y direction. By controlling the amount of movement of these actuators, the movable plate 20b can be displaced in the X and Y directions and in the rotational direction around the axis in the Z direction. For example, the multiple actuators 201 can include a motor as a drive source and a mechanism such as a ball screw mechanism that converts the drive force of the motor into linear motion.

[0043] <<Distance adjustment unit>> Distance adjustment unit 22 raises and lowers suction plate 15 and substrate support unit 6 to adjust the distance between them and mask stage 5, and moves substrate 100 and mask 101 closer to or farther apart in the thickness direction (Z direction) of substrate 100. In other words, distance adjustment unit 22 moves substrate 100 and mask 101 closer to each other in the direction in which they are superimposed, and moves them apart in the opposite direction. Note that the "distance" adjusted by distance adjustment unit 22 is the so-called vertical distance, and the distance adjustment unit can also be said to be a unit that adjusts the vertical positions of mask 101 and substrate 100.

[0044] 2, the distance adjustment unit 22 includes a first lifting plate 220. A guide rail 21a extending in the Z direction is formed on the side of the stand 21, and the first lifting plate 220 is capable of freely moving up and down in the Z direction along the guide rail 21a.

[0045] The first lift plate 220 supports the suction plate 15 by a plurality of support shafts R1. When the first lift plate 220 moves up and down, the suction plate 15 moves up and down accordingly. In other words, the first lift plate 220 supports a plurality of support shafts R1 that support the suction plate 15, and the plurality of support shafts R1 move up and down synchronously as the first lift plate 220 moves up and down, and the suction plate 15 moves up and down while maintaining its parallelism. The first lift plate 220 also supports the substrate support unit 6 via a plurality of actuators 65 and a plurality of support shafts R3. When the first lift plate 220 moves up and down, the substrate support unit 6 moves up and down accordingly. The plurality of actuators 65 can move a plurality of support shafts R3 connected to these actuators 65 in the vertical direction. The substrate support unit 6 moves vertically relative to the suction plate 15 by the plurality of actuators 65. The plurality of actuators 65 are, for example, configured by a motor and a ball screw mechanism, and can move the support shafts R3 in the vertical direction. It can be done.

[0046] The lifting and lowering of the first lifting plate 220 will be described in more detail. The distance adjustment unit 22 is supported by the base 21 and includes a drive unit 221 as an actuator for lifting and lowering the first lifting plate 220. The drive unit 221 is a mechanism for transmitting the driving force of a motor 221a, which is a driving source, to the first lifting plate 220. In this embodiment, a ball screw mechanism having a ball screw shaft 221b and a ball nut 221c is used as the transmission mechanism of the drive unit 221. The ball screw shaft 221b extends in the Z direction and rotates around an axis in the Z direction by the driving force of the motor 221a. The ball nut 221c is fixed to the first lifting plate 220 and engages with the ball screw shaft 221b. The first lifting plate 220 is lifted and lowered in the Z direction by the rotation of the ball screw shaft 221b and the switching of the rotation direction. The amount of lifting of the first lifting plate 220 can be controlled based on the detection result of a sensor such as a rotary encoder that detects the amount of rotation of the motor 221a. This allows the position in the Z direction of the adsorption plate 15 that adsorbs and supports the substrate 100 to be controlled, thereby controlling the contact and separation between the substrate 100 and the mask 101. In addition, an adjustment unit 17, which will be described later, is provided above the first lifting plate 220.

[0047] In the distance adjustment unit 22 of this embodiment, a configuration is adopted in which the position of the mask table 5 is fixed, and the substrate support unit 6 and the suction plate 15 are moved to adjust the distance therebetween in the Z direction. However, the distance adjustment unit is not limited to this configuration. The positions of the substrate support unit 6 or the suction plate 15 may be fixed, and the mask table 5 may be moved to perform adjustment, or a configuration may be adopted in which the substrate support unit 6, the suction plate 15, and the mask table 5 are each moved to adjust the distance therebetween.

[0048] <<Plate unit lifting unit (lifting means)>> The plate unit lifting unit 13 as a lifting means lifts and lowers the second lifting plate 12 arranged outside the vacuum chamber 3, thereby lifting and lowering the plate unit 9 connected to the second lifting plate 12 and arranged inside the vacuum chamber 3. One or more support shafts R2 are fixed to the second lifting plate 12. The magnet plate 11 provided on the plate unit 9 and the support shaft R2 are connected by a connection mechanism 1100. In this embodiment, the plate unit 9 is supported by two support shafts R2. The support shaft R2 extends upward from the magnet plate 11 via the connection mechanism 1100, and is connected to the second lifting plate 12 through the opening of the upper wall portion 30, each opening of the fixed plate 20a and the movable plate 20b, and the opening of the first lifting plate 220.

[0049] The second lift plate 12 can be raised and lowered in the Z direction along the guide shaft 12a. The plate unit lift unit 13 is supported by the stand 21 and includes a drive mechanism for lifting and lowering the second lift plate 12. This drive mechanism transmits the driving force of the motor 13a, which is a driving source, to the second lift plate 12. In this embodiment, a ball screw mechanism having a ball screw shaft 13b and a ball nut 13c is used as the transmission mechanism of the plate unit lift unit 13. The ball screw shaft 13b extends in the Z direction and rotates around an axis in the Z direction by the driving force of the motor 13a. The ball nut 13c is fixed to the second lift plate 12 and meshes with the ball screw shaft 13b. The second lift plate 12 is raised and lowered in the Z direction by the rotation of the ball screw shaft 13b and the switching of the rotation direction. The amount of lift of the second lift plate 12 can be controlled, for example, from the detection result of a sensor such as a rotary encoder that detects the rotation amount of the motor 13a. This makes it possible to control the position of the plate unit 9 in the Z direction and to control the contact and separation between the plate unit 9 and the substrate 100. Note that, although the present embodiment shows a case in which a ball screw mechanism is used as the drive mechanism, various known techniques such as a rack and pinion mechanism may also be used as the drive mechanism.

[0050] The openings in the upper wall 30 of the vacuum chamber 3 through which the above-mentioned support shafts R1 to R3 pass have a size that allows the support shafts R1 to R3 to be displaced in the X and Y directions. To maintain the airtightness of the vacuum chamber 3, bellows or the like are provided in the openings in the upper wall 30 through which the support shafts R1 to R3 pass. For example, the support shaft R1 that supports the first lifting plate 220 is covered with bellows 31 (see FIG. 4, etc.).

[0051] <<Measurement unit>> The alignment apparatus 2 includes measurement units (first measurement unit 7 and second measurement unit 8) that measure the positional deviation between the substrate 100, the peripheral portion of which is supported by the substrate support unit 6, and the mask 101. A description will be given with reference to FIG. 5 in addition to FIG. 2. FIG. 5 is an explanatory diagram of the first measurement unit 7 and the second measurement unit 8, and shows a state in which the positional deviation between the substrate 100 and the mask 101 is measured. The first measurement unit 7 and the second measurement unit 8 in this embodiment are both imaging devices (cameras) that capture images. The first measurement unit 7 and the second measurement unit 8 are disposed above the upper wall portion 30, and are capable of capturing an image of the inside of the vacuum chamber 3 through a window portion (not shown) formed in the upper wall portion 30.

[0052] Substrate rough alignment mark 100a and substrate fine alignment mark 100b are formed on substrate 100, and mask rough alignment mark 101a and mask fine mark 101b are formed on mask 101. Hereinafter, substrate rough alignment mark 100a will be referred to as substrate rough mark 100a, substrate fine alignment mark 100b will be referred to as substrate fine mark 100b, and both will be collectively referred to as substrate marks. Further, mask rough alignment mark 101a will be referred to as mask rough mark 101a, mask fine alignment mark 101b will be referred to as mask fine mark 101b, and both will be collectively referred to as mask marks.

[0053] Substrate rough mark 100a is formed in the center of a short side of substrate 100. Substrate fine marks 100b are formed at the four corners of substrate 100. Mask rough mark 101a is formed in the center of a short side of mask 101 in correspondence with substrate rough mark 100a. Furthermore, mask fine mark 101b is formed in the four corners of mask 101 in correspondence with substrate fine mark 100b.

[0054] Four second measurement units 8 are provided to capture images of corresponding pairs (four pairs in this embodiment) of substrate fine marks 100b and mask fine marks 101b. The second measurement units 8 are high-magnification CCD cameras (fine cameras) with a relatively narrow field of view but high resolution (for example, on the order of several μm), and measure the positional deviation between the substrate 100 and the mask 101 with high accuracy. One first measurement unit 7 is provided to capture images of corresponding pairs (two pairs in this embodiment) of substrate rough marks 100a and mask rough marks 101a.

[0055] The first measurement unit 7 is a low-magnification CCD camera (rough camera) having a relatively wide field of view but low resolution, and measures a rough positional deviation between the substrate 100 and the mask 101. In the example of Fig. 5, a configuration is shown in which two sets of substrate rough marks 100a and mask rough marks 101a are collectively imaged by one first measurement unit 7, but this is not limiting. As with the second measurement unit 8, two first measurement units 7 may be provided at positions corresponding to each set so as to image each set of the substrate rough marks 100a and the mask rough marks 101a.

[0056] In this embodiment, a rough position adjustment between the substrate 100 and the mask 101 is performed based on the measurement results of the first measurement unit 7, and then a precise position adjustment between the substrate 100 and the mask 101 is performed based on the measurement results of the second measurement unit 8.

[0057] <<Adjustment unit>> The alignment device 2 includes an adjustment unit 17. Fig. 6 is an explanatory diagram of the adjustment unit 17 (adjustment device). The adjustment unit 17 is a unit that adjusts the relative inclination between the suction plate 15 and the mask table 5. In this embodiment, the adjustment unit 17 adjusts the relative inclination between the suction plate 15 and the mask table 5 by moving the suction plate 15. More specifically, the adjustment unit 17 adjusts the relative inclination between the suction plate 15 and the mask table 5 by adjusting the axial positions of at least some of the support axes R1 among the multiple support axes R1.

[0058] The adjustment unit 17 has a plurality of operation parts 171 operated by an operator. In this embodiment, a plurality of operation parts 171 are provided corresponding to each of a plurality of support shafts R1. When the operation part 171 is operated, the corresponding support shaft R1 moves in the vertical direction, which is the axial direction of the support shaft R1, independently of the other support shafts R1. That is, the plurality of operation parts 171 can independently adjust the vertical position at which the corresponding support shaft R1 supports the suction plate 15. Therefore, the operator operates the operation part 171 to adjust the relative inclination between the suction plate 15 and the mask table 5. In order to increase the degree of freedom of adjustment, it is preferable that the operation part 171 is provided for each of the plurality of support shafts R1, but if the operation part 171 is provided for at least one support shaft R1, the relative inclination between the suction plate 15 and the mask table 5 can be adjusted within a certain range.

[0059] In this embodiment, the operation unit 171 is an adjustment nut that moves the support shaft R1 in the vertical direction, which is its axial direction. The adjustment nut and the thread 172 formed on the support shaft R1 are provided to screw together, and when the adjustment nut is turned by an operator, the support shaft R1 moves.

[0060] Moreover, in this embodiment, the operation unit 171 is provided outside the vacuum chamber 3. Specifically, the support shaft R1 is supported by the first lifting plate 220 via a slide bush 173, and the operation unit 171 is provided above the slide bush 173. By providing the operation unit 171 outside the vacuum chamber 3, an operator can perform adjustments using the adjustment unit 17 while the inside of the vacuum chamber 3 is maintained at a vacuum.

[0061] In addition, a joint portion 18 is provided between the support shaft R1 and the suction plate 15 to connect the support shaft R1 and the suction plate 15 in such a way that the angle of the suction plate 15 relative to the support shaft R1 can be varied. In this embodiment, the joint portion 18 is a spherical bearing, and includes a spherical portion 181 and a bearing portion 182 that slidably receives the spherical portion 181.

[0062] In this embodiment, the multiple support shafts R1 are configured to be movable only in the vertical direction (axial direction). Therefore, the angle of the suction plate 15 with respect to the support shaft R1 is different between a state in which the suction plate 15 is kept horizontal as in state ST1 shown on the left side of Fig. 6 and a state in which the suction plate 15 is tilted as in state ST2 shown on the right side of Fig. 6. In this embodiment, the suction plate 15 rotates with respect to the support shaft R1 at the joint portion 18, so that the support shaft R1 can support the suction plate 15 even when the suction plate 15 is tilted. Note that the joint portion 18 can appropriately adopt a structure that connects two members in a manner that allows the connection angle to be changed, such as a universal joint.

[0063] Here, the configuration of the adjustment unit 17 will be described in comparison with the distance adjustment unit 22. When the first lift plate 220 of the distance adjustment unit 22 moves up and down, all of the multiple support shafts R1 supported by the first lift plate 220 move up and down by the same amount, that is, the multiple support shafts R1 move up and down synchronously. Therefore, the suction plate 15 moves up and down while maintaining the parallelism or relative inclination of the suction plate 15 to the mask stage 5. On the other hand, the adjustment unit 17 can move any one of the multiple support shafts R1 in the vertical direction (axial direction) relative to the first lift plate 220 independently of the other support shafts R1. For example, the adjustment unit 17 can adjust the axial position of the remaining one support shaft R1 without changing the positions of the three support shafts R1. This This allows the adjustment unit 17 to adjust the inclination of the attraction plate 15 supported by the multiple support shafts R1.

[0064] <<Floating section>> The alignment device 2 includes a floating part 19. The floating part 19 is provided between the joint part 18 and the suction plate 15. The floating part 19 includes an elastic member 191, a bush 192, a shaft member 193, a suction plate support part 194, and a flange 195. The shaft member 193 is provided so as to extend downward from the joint part 18. The bush 192 is provided so as to be interposed in an annular gap between the shaft member 193 and the suction plate support part 194, and reduces friction therebetween and reduces wobbling. For example, the bush 192 is formed of a metal sintered material having good sliding properties. The suction plate support part 194 supports the suction plate 15. The elastic member 191 is provided between the suction plate support part 194 and a flange 195 provided on the shaft member 193, and is configured to receive the load of the suction plate 15. That is, the floating part 19 is connected to the support shaft R1 via the joint part 18, and the elastic member 191 of the floating part 19 supports the suction plate 15. In this way, the support shaft R1 supports the suction plate 15 via the elastic member 191 of the floating part 19, thereby reducing the load applied to the mask 101 when the suction plate 15 comes into contact with the mask 101, and ensuring the escape of the suction plate 15 when the suction plate 15 comes into contact with the mask 101.

[0065] <<Detection unit>> The alignment device 2 includes a detection unit 16. Please refer to FIGS. 2 and 3 again. The detection unit 16 detects the parallelism between the suction plate 15 and the mask table 5. In this embodiment, the parallelism is a degree indicating the degree of relative inclination between the suction plate 15 and the mask table 5. In this embodiment, the detection unit 16 is composed of the above-mentioned multiple touch sensors 1621 provided on the side of the suction plate 15. The multiple touch sensors 1621 are attached to the suction plate 15 so that the lengths of the tips protruding from the suction surface 150 are approximately equal to each other. By attaching the touch sensor 1621 to the suction plate 15, even if the vacuum chamber 3 is deformed by atmospheric pressure, the change occurring in the relative position between the suction plate 15 and the touch sensor 1621 can be reduced. In other words, even in a vacuum state, the protruding lengths of the tips of the touch sensors 1621 hardly change and are maintained approximately equal to each other. Therefore, if all of the touch sensors 1621 react almost simultaneously when the suction plate 15 moves, it can be determined that the parallelism is high, in other words, that the relative inclination between the suction plate 15 and the mask table 5 is small. By appropriately changing the length of the tip protruding from the suction surface 150, a predetermined inclination that is not parallel can also be set as a target value. The operation of detecting the parallelism of the suction plate 15 using the detection unit 16 will be described later. In this embodiment, the touch sensor 1621 serves to detect both the contact between the suction plate 15 and the substrate 100 and the parallelism between the suction plate 15 and the mask table 5. This allows the number of sensors to be reduced compared to the case where sensors for detecting these are provided separately.

[0066] <Control device> The control device 14 controls the entire film forming apparatus 1. The control device 14 includes a processing unit 141, a storage unit 142, an input / output interface (I / O) 143, a communication unit 144, a display unit 145, and an input unit 146. The processing unit 141 is a processor such as a CPU, and controls the film forming apparatus 1 by executing a program stored in the storage unit 142. The storage unit 142 is a storage device such as a ROM, a RAM, or a HDD, and stores various control information in addition to the program executed by the processing unit 141. The I / O 143 is an interface for transmitting and receiving signals between the processing unit 141 and an external device. The communication unit 144 is a communication device that communicates with the upper device 300 or other control devices 14, 309, 310, etc. via a communication line 300a, and the processing unit 141 receives information from the upper device 300 or transmits information to the upper device 300 via the communication unit 144. The display unit 145 is, for example, a liquid crystal display, and displays various information. The input unit 146 is, for example, a keyboard or a pointing device, and receives various inputs from a user. Note that all or part of the control devices 14, 309, 310 and the higher-level device 300 may be configured with a PLC, ASIC, or FPGA.

[0067] <Substrate and mask overlay process> 7 is an explanatory diagram of the process of overlapping the substrate 100 and the mask 101 using the chucking plate 15. FIG 7 shows each state of the process.

[0068] In state ST100, the substrate 100 is carried into the film forming apparatus 1 by the transfer robot 302a, and then the transfer robot 302a is retreated. At this time, the substrate 100 is supported by the substrate supporting unit 6.

[0069] State ST101 shows a state in which the substrate supporting unit 6 has risen as a preparatory stage for the suction plate 15 to suction the substrate 100. The substrate supporting unit 6 is raised from state ST100 by the actuator 65 so as to approach the suction plate 15. In state ST101, the peripheral portion of the substrate 100 supported by the substrate supporting unit 6 is in contact with the suction plate 15 or is slightly spaced apart from it. On the other hand, the central portion of the substrate 100 is bent by its own weight and is therefore spaced apart from the suction plate 15 compared to the peripheral portion.

[0070] State ST102 shows a state in which the substrate 100 is attracted to the attraction plate 15. When a voltage is applied to an electrode arranged in the electrode arrangement region 151 of the attraction plate 15, the substrate 100 is attracted to the attraction plate 15 by electrostatic force.

[0071] State ST103 shows a state when detecting whether or not the substrate 100 is normally adsorbed to the suction plate 15. When the substrate support unit 6 is lowered and separated from the substrate 100, whether or not the substrate 100 is adsorbed to the suction plate 15 is detected based on the detection value of the touch sensor 1621. For example, when all the touch sensors 1621 embedded in the suction plate 15 detect contact with the substrate 100, the control device 14 determines that the substrate 100 is normally adsorbed to the suction plate 15. In addition, when the fiber sensor 1622 is provided, it is also possible to determine whether or not the substrate 100 is normally adsorbed based on the output from the fiber sensor 1622.

[0072] State ST104 shows a state during the alignment operation between the substrate 100 and the mask 101. The control device 14 causes the distance adjustment unit 22 to lower the chucking plate 15 to bring the substrate 100 and the mask 101 close to each other, and then causes the position adjustment unit 20 to perform the alignment operation.

[0073] State ST105 shows a state in which the substrate 100 and the mask 101 are brought into closer contact with each other by the magnetic plate 11. After the alignment operation is completed, the control device 14 lowers the plate unit 9 by the plate unit lifting unit 13. As the magnetic plate 11 approaches the substrate 100 and the mask 101, the mask 101 is attracted toward the substrate 100, improving the contact between the substrate 100 and the mask 101.

[0074] The above-described operations complete the process of overlapping the substrate 100 and the mask 101. For example, after this process is completed, a deposition process is performed by the film formation unit 4.

[0075] Incidentally, when aligning the substrate 100 and the mask 101 in the above-described process, the inclination between the chucking plate 15 and the mask table 5 may affect the accuracy of the alignment. By shortening the distance between the substrate 100 and the mask 101 and performing the alignment, the accuracy of the alignment can be improved. However, if the chucking plate 15 and the mask table 5 are inclined, the accuracy of the alignment may be improved. If there is a relative inclination between them, a part of the substrate 100 may come into contact with the mask 101, which may cause scratches on the substrate 100. If the distance between the substrate 100 and the mask 101 is increased to protect the substrate 100, the accuracy of the alignment may decrease. Therefore, generally, the parallel adjustment between the suction plate 15 and the mask table 5 is performed in an environment in which the internal space 3a of the vacuum chamber 3 is at atmospheric pressure. The parallel adjustment in an atmospheric pressure environment is performed, for example, by inserting a shim into the connecting portion of the substrate support unit 6.

[0076] Next, some more specific examples of the connection mechanism 1100 that connects the magnet plate 11 as a magnetic force generating member and the plate unit lifting unit 13 as a lifting means will be described. The magnet plate 11 may be configured to include a permanent magnet or an electromagnet.

[0077] Example 1 A detailed configuration and mechanism of the connection mechanism 1100 according to the first embodiment will be described with reference to Fig. 8. Fig. 8 is a diagram for explaining the mechanism of the connection mechanism 1100 according to the first embodiment of the present invention, and shows various states in schematic cross-sectional views.

[0078] The connection mechanism 1100 according to this embodiment has a universal joint consisting of a spherical portion 1110 provided at the tip of the support shaft R2 and a bearing member 1120 having a spherical bearing portion that slidably receives the spherical portion 1110. This allows the magnet plate 11 to rotate in response to an external force acting on the magnet plate 11. Note that, although this embodiment shows a configuration in which a universal joint consisting of the spherical portion 1110 and the bearing member 1120 having a spherical bearing portion is used, the universal joint in the present invention can employ various known techniques, such as a universal joint having two intersecting shaft portions.

[0079] The connection mechanism 1100 according to the present embodiment includes a shaft portion 1130 provided on the bearing member 1120 on the lifting means side, and a support portion 1141 provided on the magnet plate 11 and having an insertion hole through which the shaft portion 1130 is inserted. A bush 1142 functioning as a bearing is provided in the insertion hole of the support portion 1141. A flange portion 1131 is provided on the shaft portion 1130. A spring 1150 as a biasing member is attached to the shaft portion 1130 so that one end side contacts the flange portion 1131 and the other end side contacts the support portion 1141 or the bush 1142. As a result, the support portion 1141 is biased toward the plate unit lifting unit 13 along the shaft portion 1130 by the spring 1150. With the above configuration, the magnet plate 11 (the plate unit 9 having the magnet plate 11) is connected to and supported by the plate unit lifting unit 13 via the spring 1150. Therefore, the magnet plate 11 can move up and down in response to an external force acting on the magnet plate 11.

[0080] Fig. 8(a) shows a state in which only the load of the plate unit 9 acts on the magnet plate 11, and no other external force acts on it. Fig. 8(b) shows the magnet plate 11 and the connection mechanism 1100 when the magnet plate 11 is inclined (not parallel) to the attraction plate 15 and the cooling plate 10 in the plate unit 9 comes into contact with the attraction plate 15.

[0081] When the cooling plate 10 and the attraction plate 15 come into contact with each other, the plate unit 9 receives a force in the vertical upward direction. As a result, the magnet plate 11 moves along the shaft 1130 toward the plate unit lifting unit 13. Furthermore, when the magnet plate 11 is inclined relative to the attraction plate 15, the universal joint in the connection mechanism 1100 causes the plate unit 9 to rotate so as to become parallel to the attraction plate 15. In other words, the magnet plate 11 rotates so as to become parallel to the attraction plate 15.

[0082] As described above, according to the connection mechanism 1100 of this embodiment, the magnet plate 11 and the attraction plate 15 can be made parallel to each other, so that it is possible to prevent the distance between the magnet plate 11 and the mask 101 from becoming locally long. Therefore, it is possible to prevent a gap from being generated between the substrate 100 and the mask 101 during film formation, and it is possible to improve the film formation accuracy. In addition, it is possible to prevent stress concentration on the attraction plate 15 during the process in which the cooling plate 10 contacts the attraction plate 15, so that it is possible to prevent the position of the attraction plate 15 from being shifted, and it is possible to improve the durability of the attraction plate 15.

[0083] Furthermore, in this embodiment, the support portion 1141 that supports the plate unit 9 having the magnet plate 11 is biased by the spring 1150 along the shaft portion 1130 toward the plate unit lifting unit 13. Therefore, when the cooling plate 10 and the attraction plate 15 in the plate unit 9 are in contact with each other, the attraction plate 15 does not directly receive the load of the plate unit 9, which has the effect of suppressing the load received by the attraction plate 15.

[0084] Example 2 With reference to FIG. 9, the detailed configuration and mechanism of the connection mechanism 1100X according to the second embodiment will be described. FIG. 9 is a schematic cross-sectional view of the connection mechanism 1100X according to the second embodiment of the present invention. In the connection mechanism 1100 according to the first embodiment described above, a configuration is shown in which the magnet plate 11 and the plate unit lifting unit 13 are connected so that the magnet plate 11 rotates and moves up and down in response to an external force acting on the magnet plate 11. However, depending on the arrangement position of the connection mechanism, there are cases in which it is sufficient for the magnet plate 11 to be configured to be rotatable in order to make the magnet plate 11 and the attraction plate 15 parallel. In this embodiment, the configuration of the connection mechanism 1100X in such a case is shown.

[0085] The connection mechanism 1100X according to this embodiment has a universal joint consisting of a spherical portion 1110 provided at the tip of the support shaft R2 and a bearing member 1120 having a spherical bearing portion that slidably receives the spherical portion 1110. In this embodiment, the bearing member 1120 is directly fixed to the magnet plate 11 and plays a role of supporting the plate unit 9 having the magnet plate 11. With this configuration, the magnet plate 11 can rotate in response to an external force acting on the magnet plate 11. As with the first embodiment, the universal joint can employ various known techniques, such as a universal joint having two intersecting shaft portions.

[0086] According to the moving mechanism 1100X configured as described above, when the magnet plate 11 is inclined with respect to the attraction plate 15, the universal joint in the connection mechanism 1100X rotates the plate unit 9 so as to become parallel to the attraction plate 15. In other words, the magnet plate 11 rotates so as to become parallel to the attraction plate 15.

[0087] As described above, the connection mechanism 1100X according to this embodiment can also provide the same effects as those of the first embodiment.

[0088] Example 3 The detailed configuration and mechanism of the connection mechanism 1100Y according to the third embodiment will be described with reference to FIG. 10. FIG. 10 is a schematic cross-sectional view of the connection mechanism 1100Y according to the third embodiment of the present invention. In the connection mechanism 1100 according to the first embodiment described above, a configuration is adopted in which the magnet plate 11 and the plate unit lifting unit 13 are connected so that the magnet plate 11 rotates and moves up and down in response to an external force acting on the magnet plate 11. However, depending on the arrangement position of the connection mechanism, it may be sufficient for the magnet plate 11 to be configured to be able to move up and down in order to make the magnet plate 11 and the attraction plate 15 parallel to each other. In this embodiment, Here, the configuration of a connection mechanism 1100Y in such a case is shown.

[0089] The connection mechanism 1100Y according to this embodiment includes a support shaft R2 as a shaft portion on the lifting means side, and a support portion 1141 provided on the magnet plate 11 and having an insertion hole through which the support shaft R2 is inserted. A bush 1142 functioning as a bearing is provided in the insertion hole of the support portion 1141. A flange portion 1131 is provided on the support shaft R2. A spring 1150 as a biasing member is attached to the support shaft R2 so that one end side contacts the flange portion 1131 and the other end side contacts the support portion 1141 or the bush 1142. In this way, the support portion 1141 is biased toward the plate unit lifting unit 13 along the support shaft R2 by the spring 1150. With the above configuration, the magnet plate 11 (plate unit 9 having the magnet plate 11) is connected to and supported by the plate unit lifting unit 13 via the spring 1150. Therefore, the magnet plate 11 can move up and down in response to an external force acting on the magnet plate 11.

[0090] According to the connection mechanism 1100Y configured as above, the cooling plate 10 and the attraction plate 15 come into contact with each other, and thus the plate unit 9 receives a force in the vertical upward direction. This causes the magnet plate 11 to move along the support axis R2 toward the plate unit lifting unit 13. When the magnet plate 11 is tilted with respect to the attraction plate 15, the movement amount of the plate unit 9 differs depending on the arrangement position of the connection mechanisms 1100Y provided in a plurality of connection mechanisms 1100Y, and thus the plate unit 9 rotates to become parallel to the attraction plate 15. In other words, the magnet plate 11 rotates to become parallel to the attraction plate 15.

[0091] As described above, the connection mechanism 1100Y according to this embodiment can also provide the same effects as those of the first embodiment.

[0092] Example 4 A detailed configuration and mechanism of a connection mechanism 1100Z according to a fourth embodiment will be described with reference to Fig. 11. Fig. 11 is a schematic cross-sectional view of a connection mechanism 1100Z according to a fourth embodiment of the present invention. In the connection mechanism 1100 according to the first embodiment described above, a universal joint or the like is used to connect the magnet plate 11 and the plate unit lifting unit 13 so that the magnet plate 11 rotates and moves up and down in response to an external force acting on the magnet plate 11. In contrast, the connection mechanism 1100Z according to this embodiment employs a configuration including an elastic member 1170 that is elastically deformable in both the direction in which the magnet plate 11 rotates and the direction in which it moves up and down.

[0093] In the connection mechanism 1100Z according to this embodiment, an elastic member 1170 is provided between the support shaft R2 and a support portion 1160 provided on the magnet plate 11. This elastic member 1170 is made of an elastomer material such as rubber.

[0094] According to the connection mechanism 1100Z configured as above, the cooling plate 10 and the attraction plate 15 come into contact with each other, and thus the plate unit 9 receives a force in the vertical upward direction. This causes the elastic member 1170 to be compressed, and the magnet plate 11 to move toward the plate unit lifting unit 13. Furthermore, when the magnet plate 11 is inclined with respect to the attraction plate 15, the amount of compression in the elastic member 1170 differs depending on the location, and thus the plate unit 9 rotates so as to become parallel to the attraction plate 15. In other words, the magnet plate 11 rotates so as to become parallel to the attraction plate 15.

[0095] As described above, the connection mechanism 1100Z according to this embodiment can also provide the same effects as those of the first embodiment.

[0096] Example 5 A detailed configuration and mechanism of a connection mechanism 1100S according to a fifth embodiment will be described with reference to Fig. 12. Fig. 12 is a schematic cross-sectional view of a connection mechanism 1100S according to a fifth embodiment of the present invention. In the connection mechanism 1100 according to the first embodiment described above, a configuration including a biasing member that biases the support portion along the shaft toward the lifting / lowering means is shown, but in the connection mechanism 1100S according to the present embodiment, a configuration including a biasing member that biases the support portion along the shaft toward the opposite side to the lifting / lowering means is shown.

[0097] Similarly to the first embodiment, the connection mechanism 1100S according to the present embodiment also has a universal joint including a spherical portion 1110 provided at the tip of the support shaft R2 and a bearing member 1120 having a spherical bearing portion that slidably receives the spherical portion 1110. As with the first embodiment, the universal joint can employ various known techniques, such as a universal joint having two intersecting shaft portions.

[0098] Also, the connection mechanism 1100S according to this embodiment includes a shaft portion 1130 provided with a flange portion 1131, a support portion 1141, and a bush 1142, as in the first embodiment. In this embodiment, the support portion 1141 is configured to contact the flange portion 1131. In this embodiment, a spring 1150 as a biasing member is attached to the shaft portion 1130 so that one end side contacts the support portion 1141 or the bush 1142 and the other end side contacts the bearing member 1120. In this manner, the support portion 1141 is biased by the spring 1150 along the shaft portion 1130 toward the opposite side to the plate unit lifting unit 13.

[0099] According to the connection mechanism 1100S configured as above, the cooling plate 10 and the attraction plate 15 come into contact with each other, and thus the plate unit 9 receives a force in the vertical upward direction. As a result, the magnet plate 11 moves toward the plate unit lifting unit 13 along the shaft portion 1130 against the biasing force of the spring 1150. Furthermore, when the magnet plate 11 is inclined with respect to the attraction plate 15, the universal joint in the connection mechanism 1100S rotates the plate unit 9 so as to be parallel to the attraction plate 15. In other words, the magnet plate 11 rotates so as to be parallel to the attraction plate 15.

[0100] As described above, the connection mechanism 1100S according to this embodiment can also provide the same effects as those of the above-described embodiment 1. Note that, even if the spring 1150 is not provided, if the magnet plate 11 can smoothly descend along the shaft portion 1130 by its own weight, a configuration without providing the spring 1150 can be adopted.

[0101] Example 6 A detailed configuration and mechanism of a connection mechanism 1100YS according to the sixth embodiment will be described with reference to Fig. 13. Fig. 13 is a schematic cross-sectional view of a connection mechanism 1100YS according to the sixth embodiment of the present invention. The connection mechanism 1100Y according to the third embodiment described above has a configuration including a biasing member that biases the support portion along the shaft toward the lifting / lowering means, but the connection mechanism 1100YS according to the sixth embodiment has a configuration including a biasing member that biases the support portion along the shaft toward the opposite side to the lifting / lowering means.

[0102] The connection mechanism 1100YS according to this embodiment is provided with a support shaft R2 provided with a first flange portion 1131, a support portion 1141, and a bush 1142, similarly to the third embodiment. The support shaft R2 is also provided with a second flange portion 1132. In this embodiment, the support portion 1141 is configured to contact the first flange portion 1131. In this embodiment, one end side is in contact with the support portion 1141 or the bush 1142, and the other end side is in contact with the support portion 1141 or the bush 1142. A spring 1150 as a biasing member is attached to the support shaft R2 so that the end side contacts the second flange portion 1132. In this manner, the support portion 1141 is biased by the spring 1150 along the shaft portion 1130 toward the opposite side to the plate unit lifting unit 13.

[0103] The connection mechanism 1100YS configured as above can also provide the same effects as those of the above-described Example 3. Note that, if the magnet plate 11 can smoothly descend along the shaft portion 1130 by its own weight without providing the spring 1150, a configuration without providing the spring 1150 can also be adopted.

[0104] (Example of application of connection mechanism) An application example of the connection mechanism shown in the above-mentioned Examples 1 to 6 will be described with reference to FIG. 14. As shown by the arrow in FIG. 14(a), when there is a possibility that the attraction plate 15 is significantly tilted in the longitudinal direction with respect to the magnet plate 11, the tilt angle and the amount of vertical displacement may be large near both ends. Therefore, it is preferable that the connection mechanism 11 provided at both ends in the longitudinal direction of the magnet plate 11 adopt a configuration that connects the magnet plate 11 so that it can rotate and move up and down, as in Examples 1, 4, and 5. However, when the tilt angle is relatively small, it is sufficient that the connection mechanism 11 connects the magnet plate 11 so that it can move up and down, as in Examples 3 and 6.

[0105] 14(b), even if there is a possibility that the attraction plate 15 may tilt with respect to the magnet plate 11, the amount of displacement in the vertical direction is small near the center in the longitudinal direction. Therefore, as for the connection mechanism provided near the center in the longitudinal direction of the magnet plate 11, it is sufficient to rotatably connect the magnet plate 11 as in the second embodiment.

[0106] The above application examples are merely examples, and the connection mechanisms shown in the various embodiments above can be appropriately adopted depending on the arrangement position of the connection mechanism.

[0107] (Application example of plate unit) An application example of the plate unit 9 will be described with reference to FIG. 15. As shown in FIG. 15(a), a configuration can be adopted in which a plurality of touch sensors 10X are provided as detection means for detecting the presence or absence of contact with the adsorption plate 15 on the cooling plate 10 as a moving member that moves in synchronization with the magnet plate 11. The configuration of the touch sensors 10X can be the same as that of the touch sensor 1621 provided on the adsorption plate 15 described above. In this way, by providing a plurality of touch sensors 10X on the cooling plate 10, the parallelism between the magnet plate 11 and the cooling plate 10 constituting the plate unit 9 and the adsorption plate 15 can be detected according to the number and arrangement positions of the touch sensors 10X that contact the adsorption plate 15. The method of detecting the parallelism is the same as the method of detecting the parallelism between the adsorption plate 15 and the mask table 5 by the plurality of touch sensors 1621 provided on the adsorption plate 15.

[0108] In this way, by adopting a configuration for detecting the parallelism between the magnet plate 11 and the cooling plate 10 constituting the plate unit 9 and the attraction plate 15, the entire cooling plate 10 can be brought into contact with the attraction plate 15 after adjusting the inclination of the attraction plate 15. By adopting such a configuration, the angle at which the magnet plate 11 can be rotated can be narrowed and the distance over which it can be moved up and down can be shortened in the connection mechanism. In addition, stress concentration on the attraction plate 15 can be further suppressed.

[0109] In addition, when a configuration in which the cooling plate 10 is not provided in the plate unit 9 is adopted, as shown in FIG. 15(b), a configuration in which a plurality of touch sensors 11X are provided on the magnet plate 11 as detection means for detecting the presence or absence of contact with the attraction plate 15 can be adopted. This provides the same function as when a plurality of touch sensors 10X are provided on the cooling plate 10.

[0110] <Electronic device manufacturing method> Next, a description will be given of an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment. Below, the configuration of an organic EL display device will be shown as an example of the electronic device, and a method for manufacturing the organic EL display device will be illustrated.

[0111] First, the organic EL display device to be manufactured will be described. Fig. 16(a) is an overall view of an organic EL display device 60, and Fig. 16(b) shows the cross-sectional structure of one pixel.

[0112] As shown in FIG. 16(a), a plurality of pixels 52 each including a plurality of light-emitting elements are arranged in a matrix in a display area 51 of an organic EL display device 50. Although details will be described later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to the smallest unit that allows a desired color to be displayed in the display area 51. In the case of the organic EL display device according to this embodiment, the pixel 52 is configured by a combination of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B that emit light different from each other. The pixel 52 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

[0113] Fig. 16(b) is a schematic partial cross-sectional view taken along line AB in Fig. 16(a). The pixel 52 is made up of a plurality of light-emitting elements, and each light-emitting element has a first electrode (anode) 54, a hole transport layer 55, any one of light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 63. Among these, the hole transport layer 55, the light-emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to organic layers. In this embodiment, the light-emitting layer 56R is an organic EL layer that emits red light, the light-emitting layer 56G is an organic EL layer that emits green light, and the light-emitting layer 56B is an organic EL layer that emits blue light. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The first electrode 64 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common to the light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. In order to prevent the first electrode 54 and the second electrode 58 from being shorted by foreign matter, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 40 is provided to protect the organic EL element from moisture and oxygen.

[0114] 16(b), the hole transport layer 55 and the electron transport layer 57 are shown as single layers, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 54 to the hole transport layer 55 can be formed between the first electrode 54 and the hole transport layer 55. Similarly, an electron injection layer can be formed between the second electrode 58 and the electron transport layer 57.

[0115] Next, an example of a method for manufacturing an organic EL display device will be specifically described.

[0116] First, a substrate 53 on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed is prepared.

[0117] An acrylic resin is formed by spin coating on the substrate 53 on which the first electrode 54 is formed, and the acrylic resin is lithographically patterned so that an opening is formed in the portion where the first electrode 54 is formed. The insulating layer 59 is formed by patterning as shown in FIG.

[0118] The substrate 53 on which the insulating layer 59 has been patterned is carried into a first organic material film forming apparatus, and the substrate is held by a substrate support table and an electrostatic chuck, and a hole transport layer 55 is formed as a common layer on the first electrodes 54 in the display region. The hole transport layer 55 is formed by vacuum deposition. In practice, the hole transport layer 55 is formed to be larger than the display region 51, so that a high-definition mask is not required.

[0119] Next, the substrate 53 on which the hole transport layer 55 has been formed is carried into a second organic material film forming apparatus and held by a substrate support table and an electrostatic chuck. The substrate and a mask are aligned, and the substrate is placed on the mask. A red light emitting layer 56R is formed on the portion of the substrate 53 where the red light emitting element is to be disposed.

[0120] Similar to the formation of the light-emitting layer 56R, a green light-emitting layer 56G is formed by a third organic material film formation apparatus, and a blue light-emitting layer 56B is formed by a fourth organic material film formation apparatus. After the formation of the light-emitting layers 56R, 56G, and 56B is completed, an electron transport layer 57 is formed over the entire display area 51 by a fifth film formation apparatus. The electron transport layer 57 is formed as a layer common to the three light-emitting layers 56R, 56G, and 56B.

[0121] The substrate on which the electron transport layer 57 has been formed is moved in a metallic evaporation material deposition device, and a second electrode 58 is deposited.

[0122] Thereafter, the substrate is transferred to a plasma CVD apparatus, where a protective layer 40 is formed, and the organic EL display device 50 is completed.

[0123] If the substrate 53 on which the insulating layer 59 is patterned is exposed to an atmosphere containing moisture or oxygen from the time when it is carried into the film forming apparatus until the film formation of the protective layer 50 is completed, the light emitting layer made of an organic EL material may be deteriorated by moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0124] The above embodiment shows one example of the present invention, but the present invention is not limited to the configuration of the above embodiment, and may be modified appropriately within the scope of the technical concept. [Explanation of symbols]

[0125] 1 film forming device, 2 alignment device, 5 mask table, 6 substrate support unit, 141 Processing unit, 16 detection unit, 17 adjustment unit, 22 distance adjustment unit, 100 Substrate, 101 mask

Claims

1. A chamber that maintains a vacuum inside; an adsorption plate provided inside the chamber for adsorbing a substrate; a mask support means provided within the chamber for supporting a mask that is aligned with the substrate; a magnetic force generating member provided inside the chamber and configured to generate a magnetic force for attracting the mask to the attraction plate; a lifting means for lifting the magnetic force generating member; a connection mechanism that connects the magnetic force generating member to a lifting means so that the magnetic force generating member at least one of pivoting and vertically moving so as to be parallel to the attraction plate in response to an external force acting on the magnetic force generating member. A film forming apparatus comprising:

2. an adjustment unit for adjusting a relative inclination between the suction plate and the mask table; 2. The film forming apparatus according to claim 1, wherein the connection mechanism causes the magnetic force generating member to at least one of rotate and move up and down so that the suction plate, the relative inclination of which with respect to the mask table is adjusted by the adjustment means, and the magnetic force generating member are parallel to each other.

3. The connection mechanism has a universal joint for connecting the magnetic force generating member and the lifting means.

3. The film forming apparatus according to claim 1 or 2.

4. The connection mechanism includes: A shaft portion provided on the lifting means side; a support portion provided on the magnetic force generating member and having an insertion hole through which the shaft portion is inserted.

3. The film forming apparatus according to claim 1 or 2.

5. A biasing member is provided to bias the support portion along the shaft portion toward the lifting means.

5. The film forming apparatus according to claim 4.

6. a biasing member that biases the support portion along the shaft portion toward an opposite side to the lifting means; 5. The film forming apparatus according to claim 4.

7. The connection mechanism includes: The magnetic force generating member is provided with an elastic member that is elastically deformed in both the direction of rotation and the direction of vertical movement.

3. The film forming apparatus according to claim 1 or 2.

8. the magnetic force generating member or the moving member that moves in synchronization with the magnetic force generating member is provided with a plurality of detection means for detecting whether or not the magnetic force generating member is in contact with the attraction plate; The parallelism between the magnetic force generating member and the attraction plate is detected based on the number and arrangement positions of the detection means that are in contact with the attraction plate.

8. The film forming apparatus according to claim 1, wherein the film forming apparatus is a film forming apparatus having a film forming function.

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