Electronic apparatus

Abstract

To efficiently cool a heat source while suppressing an increase in size of an imaging device.SOLUTION: In an imaging device main body 2, a first open part 108 is formed in a first side surface 104, a second open part 110 is formed in a second side surface 109, and a third open part 113 is formed to a bottom surface 112 that is nearly orthogonal to the first side surface 104 and the second side surface 109. A forced air cooling part 116 contains: a first suction port 124 that is contacted to the first open part 108; a second suction port 125 that is connected to the second open part 110; and an exhaust part 126 that is connected to the third open part 113. The forced air cooling part 116 contains: a duct 150 that is thermally connected to a heat source (a recording part 118 or the like) that is arranged so as to be nearly parallel to a circuit board 107, and is mounted to the circuit board 107; and a centrifugal fan 121. The centrifugal fan 121 generates air flows B and C reached from the first suction port 124, the second suction port 125, and the exhaust part 126, respectively.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] In recent imaging devices, the signal processing load and power consumption increase with the trend toward higher image quality, and the amount of heat generated by heat sources such as the imaging section and data recording section increases, making the cooling structure inside the device important.

[0003] Patent Document 1 discloses a heat dissipation structure for an imaging device. In this device, an exhaust port is provided on the side of the housing, and two intake ports are provided close to each other on the side opposite the exhaust port in the left-right direction. Air drawn in from the two intake ports joins together midway and is guided to the exhaust port by a fan. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-77037 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the device of Patent Document 1, the two flow paths from the two air intakes to the joining position are provided in parallel in the thickness direction of the device, so the thickness of the device body becomes thick to ensure the two flow paths.

[0006] In addition, the flow direction from the two intake ports to the exhaust port is almost the same direction. Since there is not necessarily only one main heat source, the cooling effect may be reduced depending on the arrangement of the heat source. Furthermore, it is expected that the amount of heat generated by the heat source will increase in the future, and even more efficient cooling will be required.

[0007] Thus, there is room for improvement in terms of efficiently cooling the heat source while suppressing an increase in the size of the imaging device.

[0008] An object of the present invention is to efficiently cool a heat source while preventing an image pickup device from becoming large in size. [Means for solving the problem]

[0009] In order to achieve the above-mentioned object, the electronic device of the present invention has an apparatus body including a first side, a second side located opposite the first side, and an orthogonal plane approximately perpendicular to the first side and the second side, a circuit board, at least one heat source mounted on the circuit board, a duct arranged approximately parallel to the circuit board and thermally connected to the heat source, and an air-cooling section including a fan, wherein a first opening is formed on the first side, a second opening is formed on the second side, and a third opening is formed on the orthogonal plane, the air-cooling section includes a first intake port connected to the first opening, a second intake port connected to the second opening, and an exhaust port connected to the third opening, and the fan generates airflows from the first intake port and the second intake port to the exhaust port, respectively. Effect of the Invention

[0010] According to the present invention, it is possible to efficiently cool a heat source while suppressing an increase in size of an imaging device. [Brief description of the drawings]

[0011] [Figure 1] FIG. [Diagram 2] 2A and 2B are exploded front and rear perspective views of an imaging device main body. [Diagram 3] 4A and 4B are front and rear perspective views of the forced air cooling portion. [Figure 4] 1A and 1B are exploded front and rear perspective views of components including a forced air cooling section. [Diagram 5] FIG. 2 is a schematic horizontal cross-sectional view of the imaging device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0013] 1(a) to (c) are perspective views of an imaging device according to one embodiment of the present invention. The imaging device 1 comprises an imaging device main body 2 (device main body) and a lens 3.

[0014] Hereinafter, the directions of each part will be referred to based on the X, Y, and Z coordinate axes shown in Fig. 1(a) and elsewhere. For convenience, the subject side in the direction parallel to the optical axis A of the lens 3 will be referred to as the front. For example, in Fig. 1(a), the +Y direction is upward and the +Z direction is forward. The +X direction is to the right as viewed from the subject side.

[0015] 1(a) is a front perspective view of the imaging device 1. Figures 1(b) and 1(c) are rear perspective views of the imaging device 1.

[0016] The imaging device body 2 includes a front surface 120, a rear surface 111, a first side surface 104 which is the left side surface, and a second side surface 109 which is the right side surface. The second side surface 109 is located opposite the first side surface 104 in the left-right direction. In addition, the bottom surface 112 of the imaging device body 2 is an orthogonal surface which is approximately orthogonal to the first side surface 104 and the second side surface 109.

[0017] An annular mount 101 is provided on the front surface 120 of the imaging device body 2. The lens 3 is attachable to and detachable from the mount 101 of the imaging device body 2 by a known bayonet system. A convex shape 102 is provided on the left side of the imaging device body 2, protruding in the +Z direction. The convex shape 102 serves both as a storage section for storing a battery 103 (see FIG. 5) and as a grip section for a user to grip the imaging device body 2. A part of an operation section 138 that accepts user operations is exposed and disposed on the back surface 111.

[0018] Two insertion / removal openings 106 are provided on the first side surface 104. An openable and closable protective cover 105 is disposed on the first side surface 104. FIGS. 1(b) and 1(c) respectively show the closed and open states of the protective cover 105. As shown in FIG. 1(b), the protective cover 105 covers the two insertion / removal openings 106 in the closed state. As shown in FIG. 1(c), when the protective cover 105 is opened, the two insertion / removal openings 106 are exposed.

[0019] The first side surface 104 is provided with a first opening 108 for intake of air. The second side surface 109 is provided with a second opening 110 for intake of air. The bottom surface 112 is provided with a third opening 113 for exhaust of air.

[0020] 2(a) and 2(b) are respectively an exploded front perspective view and an exploded rear perspective view of the imaging device main body 2. For ease of explanation, some of the components are not shown.

[0021] The imaging device main body 2 mainly includes a base member 114, a circuit board 107, and a forced air cooling section 116. An imaging section 115 is disposed on the rear surface 111 side (-Z side) of the base member 114. The imaging section 115 includes an imaging element 129 (see FIG. 5). The imaging element 129 is disposed approximately perpendicular to the optical axis A and at a predetermined distance from the mount 101 along the optical axis A. Further, on the rear surface 111 side of the imaging section 115, a circuit board 107 and a forced air cooling section 116 (air cooling section) are disposed in this order.

[0022] An image processing unit 117 and a media storage unit 119 which is a part of a recording unit 118 are mounted on the circuit board 107. The media storage unit 119 is mounted in a mounting area 151. The image processing unit 117 is mounted on the surface of the circuit board 107 on the rear surface 111 side (-Z side), and the media storage unit 119 is mounted on the surface of the circuit board 107 on the front surface 120 side (+Z side). As will be described later, the forced air cooling unit 116 has a recess 137 recessed toward the +Z side, and an operation unit 138 is housed and arranged in the recess 137.

[0023] The recording unit 118 includes a media storage unit 119. Portable media 133 such as an SD (registered trademark) memory card or a CFexpress (registered trademark) card is inserted into the media storage unit 119 as a recording medium. The recording unit 118 records and reads data onto the portable media 133 inserted into the media storage unit 119.

[0024] 3(a) and (b) are respectively a front perspective view and a rear perspective view of the forced air cooling unit 116. The forced air cooling unit 116 includes a duct 150 and a centrifugal fan 121. For the sake of explanation, the duct 150 and the centrifugal fan 121 are shown separately in FIGS.

[0025] The duct 150 includes a duct base member 123 and a duct lid member 122. The centrifugal fan 121 and the duct lid member 122 cover the duct base member 123 from the -Z side to form a hollow cylindrical forced air cooling section 116 having a first intake port 124 and a second intake port 125 at both ends in the X direction. The first intake port 124 is connected to the first opening 108 (FIG. 1(c)). The second intake port 125 is connected to the second opening 110 (FIG. 1(a)). The exhaust section 126 (exhaust port) of the centrifugal fan 121 is connected to the third opening 113 (FIG. 1(b)).

[0026] The duct 150 is disposed approximately parallel to the circuit board 107 and is thermally connected to a heat source (a recording unit 118 and an image processing unit 117) as described below. The shape of the forced air cooling unit 116 projected along the optical axis A is approximately rectangular.

[0027] Centrifugal fan 121 has intake section 121a that opens to the +Z side. The surface of duct base member 123 that faces circuit board 107 is opposing surface 139 (FIG. 3(a)). An opening 122a is provided in the approximate center of the surface of duct 150 opposite opposing surface 139, corresponding to intake section 121a (FIG. 3(b)). Opening 122a is formed in duct lid member 122 and is connected to intake section 121a.

[0028] Outside air supplied from first intake port 124 through first opening 108 (FIG. 1(c)) becomes airflow B. Outside air supplied from second intake port 125 through second opening 110 (FIG. 1(a)) becomes airflow C. These airflows B and C are taken into centrifugal fan 121 through opening 122a and intake section 121a, and exhausted from third opening 113 (FIG. 1(b)) through exhaust section 126. That is, centrifugal fan 121 generates airflows that reach exhaust section 126 from first intake port 124 and second intake port 125, respectively.

[0029] 4(a) and 4(b) are respectively a front exploded perspective view and a rear exploded perspective view of components including the forced air cooling unit 116. FIG. 5 is a schematic horizontal cross-sectional view of the imaging device 1. In FIG. 4 and FIG. 5, a configuration for cooling the image processing unit 117 and the recording unit 118 will be mainly described. For ease of description, the exhaust unit 126 is shown on the rear surface 111. Hereinafter, the thickness direction of the circuit board 107, the Z direction, and the optical axis A direction are used synonymously.

[0030] The image sensor 129 shown in Fig. 5 is an optical element that converts an optical image that has passed through an optical system into an electrical signal. Light rays incident on the lens 3 form an image at the image sensor 129. The image sensor 129 converts optical information obtained by the image formation into an electrical signal and transfers it to the circuit board 107 via the flexible substrate 132. The image processor 117 mounted on the circuit board 107 performs necessary processing on the electrical signal sent from the image sensor 129, and then sends it to the recording unit 118 to record it as image data, and performs other operations.

[0031] The battery 103 supplies power for the imaging device 1 to execute various operations. The power consumed by the image processing unit 117 in executing the various operations is converted into heat by the image processing unit 117. The power consumed by the recording unit 118 is converted into heat by the recording unit 118. Therefore, the image processing unit 117 and the recording unit 118 are the main heat sources.

[0032] 5, the back surface 140, which is the -Z side surface of the duct base member 123, faces the duct lid member 122. A first flow path 134 leading from the first air intake 124 to the centrifugal fan 121, and a second flow path 135 leading from the second air intake 125 to the centrifugal fan 121 are mainly formed by the back surface 140 of the duct base member 123 and the +Z side surface of the duct lid member 122.

[0033] A part of the opposing surface 139 (FIGS. 4(a) and 5) of the duct base member 123 serves as a heat exchange portion that exchanges heat with the image processing portion 117. The opposing surface 139 is in close contact with the image processing portion 117 via an elastic heat conductive member 128 (FIGS. 4(a) and 4(b)), and transfers heat from the image processing portion 117 to the duct base member 123. Therefore, the image processing portion 117 is thermally connected to the second flow path 135.

[0034] Of the areas on the -Z side surface of the circuit board 107, an area that overlaps with at least a part of the mounting area 151 of the media storage unit 119 when viewed from the Z direction (optical axis A direction) is defined as a storage unit corresponding area 141 (FIG. 4(b)). A rectangular opening 130 (board side opening) is formed in the duct base member 123. The rectangular opening 130 is formed in an area that includes the storage unit corresponding area 141 when viewed from the Z direction.

[0035] A rectangular elastic sealing member 131 (sealing member) is disposed between the duct base member 123 and the circuit board 107 in the Z direction so as to surround the periphery of the rectangular opening 130. Therefore, the storage section corresponding area 141 is exposed to the inside of the forced air cooling section 116 and directly exchanges heat with the airflow. That is, the storage section corresponding area 141 forms a part of the first flow path 134 via the rectangular opening 130 (FIG. 5). In this way, the recording section 118 is thermally connected to the first flow path 134.

[0036] An elastic sealing member 131 is tightly interposed between the circuit board 107 and the duct base member 123 around the rectangular opening 130, thereby sealing the space between the first flow path 134 and the outside of the duct 150, thereby ensuring cooling performance.

[0037] The duct base member 123 (first wall portion) and the duct lid member 122 (second wall portion) can be defined as two walls that constitute the duct 150. The duct base member 123 is a wall portion that faces the circuit board 107, and the duct lid member 122 is a wall portion that does not face the circuit board 107.

[0038] A convex portion 136 is formed on the duct lid member 122, protruding toward the circuit board 107 side (+Z side) in the Z direction (FIGS. 4(a) and 5). At least a part of the convex portion 136 fits into the rectangular opening 130. Furthermore, by forming the convex portion 136 on the duct lid member 122, a concave portion 137 is formed on the surface of the duct lid member 122 opposite the circuit board 107 in the Z direction (the surface on the -Z side). That is, a concave portion 137 is generated on the outside of the duct 150 in response to the formation of the convex portion 136. At least a part of the operating unit 138 is disposed in this concave portion 137. This makes it possible to suppress the expansion of the device in the thickness direction of the circuit board 107.

[0039] The cross-sectional area (flow path area) of each flow path in the forced air cooling section 116 will be described.

[0040] As shown in FIG. 5, the widths in the Z direction (width in the short side direction) of the cross section of the first flow path 134, the cross section of the second flow path 135, and the exhaust section 126 are defined as widths H1, H2, and H3, respectively. The width of the first intake port 124 in the Z direction is the same as the cross section of the first flow path 134, and is width H1. The width of the second intake port 125 in the Z direction is the same as the cross section of the second flow path 135, and is width H2. Also, as shown in FIGS. 3(a) and (b), the widths in the longitudinal direction approximately perpendicular to the short side direction of the first intake port 124, the second intake port 125, and the exhaust section 126 are defined as widths W1, W2, and W3. The cross sections of the first flow path 134 and the second flow path 135 in the longitudinal direction are the same as the first intake port 124 and the second intake port 125, and are widths W1 and W2, respectively.

[0041] Width W1, width W2, and width W3 are approximately equal to each other (W1=W2=W3). The sum of width H1 and width H2 is approximately equal to width H3 (H1+H2=H3). Therefore, the sum of the opening area of ​​first intake port 124 and the opening area of ​​second intake port 125 is approximately equal to the opening area of ​​exhaust section 126.

[0042] Airflow B and airflow C generated by centrifugal fan 121 pass through first flow path 134 and second flow path 135, respectively. Since the sum of the opening area of ​​first air intake port 124 and the opening area of ​​second air intake port 125 is approximately equal to the opening area of ​​exhaust section 126, the intake amount and exhaust amount in forced air cooling section 116 are balanced.

[0043] In addition, since the image processing unit 117 generates a larger amount of heat than the recording unit 118, the image processing unit 117 requires a larger amount of airflow to dissipate heat than the recording unit 118. Here, the width H2 is equal to or larger than the width H1 (H2≧H1), and preferably H2>H1. Since W1=W2, the opening area of ​​the second intake port 125 is larger than the opening area of ​​the first intake port 124. Therefore, the cross-sectional area of ​​the second flow path 135 is larger than the cross-sectional area of ​​the first flow path 134.

[0044] Since the recording unit 118 is thermally connected to the first flow path 134 and the image processing unit 117 is thermally connected to the second flow path 135, the multiple heat sources can be effectively cooled by air flowing in from separate air intakes. Moreover, since the cross-sectional area of ​​the second flow path 135 is larger than the cross-sectional area of ​​the first flow path 134, the cooling effect of the image processing unit 117, which generates a large amount of heat, can be improved, and the two heat sources can be efficiently cooled. In addition, by providing multiple air intakes, the widths H1 and H2 are prevented from becoming too long. Furthermore, the image processing unit 117, which is a heat source that consumes a large amount of power, is arranged on the side closer to the convex shape 102 that serves as the gripping unit in the left-right direction, which also contributes to improving the cooling effect of the image processing unit 117.

[0045] According to this embodiment, in the imaging device body 2, a first opening 108 is formed on the first side surface 104, a second opening 110 is formed on the second side surface 109, and a third opening 113 is formed on the bottom surface 112. The forced air cooling section 116 includes a first intake port 124 connected to the first opening 108, a second intake port 125 connected to the second opening 110, and an exhaust section 126 connected to the third opening 113. The forced air cooling section 116 includes a duct 150 disposed approximately parallel to the circuit board 107 and thermally connected to a heat source mounted on the circuit board 107, and a centrifugal fan 121. The centrifugal fan 121 generates air flows B and C that reach the exhaust section 126 from the first intake port 124 and the second intake port 125, respectively.

[0046] As a result, air flows from two separate air intakes (124, 125) on the left and right sides and joins the centrifugal fan 121 through separate paths (first flow path 134, second flow path 135), so that the heat sources corresponding to the respective air flows can be effectively cooled. For example, the first flow path 134 mainly cools the recording unit 118, and the second flow path 135 mainly cools the image processing unit 117.

[0047] Moreover, the first flow path 134 and the second flow path 135, which are separate paths, can be easily configured so as not to overlap when viewed in the Z direction, so that expansion in the thickness direction of the device is suppressed.

[0048] Therefore, the heat source can be efficiently cooled while preventing the image pickup device 1 from becoming large.

[0049] In addition, since the amount of heat generated by the image processing unit 117 is greater than that of the recording unit 118, and the cross-sectional area of ​​the second flow path 135 is greater than that of the first flow path 134, the two heat sources can be effectively cooled.

[0050] A storage unit corresponding area 141, which is a partial area of ​​the circuit board 107, is an area that overlaps at least a part of the mounting area 151 of the media storage unit 119 when viewed from the Z direction. The storage unit corresponding area 141 forms a part of the first flow path 134 via the rectangular opening 130 of the duct base member 123. This can enhance the cooling effect of the recording unit 118.

[0051] In addition, the elastic sealing member 131 is tightly interposed between the circuit board 107 and the duct base member 123 around the rectangular opening 130, thereby sealing the space between the first flow path 134 and the outside of the duct 150, ensuring cooling performance.

[0052] Furthermore, at least a part of the protrusion 136 formed on the duct lid member 122 fits into the rectangular opening 130, and at least a part of the operation unit 138 is disposed in a recess 137 formed in response to the formation of the protrusion 136. This makes it possible to suppress the expansion of the device in the thickness direction of the circuit board 107.

[0053] In this embodiment, the recording unit 118 is composed of the portable medium 133 and the media storage unit 119, but the present invention is also applicable to a configuration in which a non-volatile memory as a recording medium is mounted on the circuit board 107. That is, the recording medium used is not limited to a portable type. Also, the recording unit 118 as a heat source mainly refers to the media storage unit 119, regardless of whether the portable medium 133 is inserted. Therefore, the recording unit to which the present invention is applied does not necessarily include a recording medium.

[0054] Although the imaging device 1 is of an interchangeable lens type, when the present invention is applied to an imaging device, the device may be of an integrated lens type.

[0055] The present invention is not limited to imaging devices, but can be applied to various electronic devices having a device body including two side surfaces and an orthogonal surface that is approximately orthogonal to the side surfaces.

[0056] In this embodiment, the term "approximately" does not mean to exclude completeness. For example, "approximately parallel," "approximately perpendicular," "approximately equal," "approximately rectangular," and "approximately central" are intended to include completely parallel, perpendicular, equal, rectangular, and central, respectively.

[0057] The present invention has been described above in detail based on preferred embodiments thereof, but the present invention is not limited to these specific embodiments, and various forms that do not deviate from the gist of the present invention are also included in the present invention.

[0058] The disclosure of this embodiment includes the following configuration. (Configuration 1) a device body including a first side surface, a second side surface located on an opposite side to the first side surface, and an orthogonal surface that is substantially orthogonal to the first side surface and the second side surface; A circuit board; at least one heat source mounted on the circuit board; an air-cooling unit including a duct arranged substantially parallel to the circuit board and thermally connected to the heat source, and a fan; A first opening is formed in the first side surface, A second opening is formed in the second side surface, A third opening is formed in the orthogonal surface; the air-cooling unit includes a first intake port connected to the first opening, a second intake port connected to the second opening, and an exhaust port connected to the third opening, The electronic device, wherein the fan generates air currents from the first air intake and the second air intake to the exhaust outlet. (Configuration 2) The exhaust port is formed in the fan, 2. The electronic device according to configuration 1, wherein air flowing in from the first air intake and the second air intake is taken in by the fan and exhausted from the exhaust port. (Configuration 3) a first heat source and a second heat source are mounted on the circuit board; the first heat source is thermally connected to a first flow path extending from the first intake port to the fan; 3. The electronic device according to configuration 2, wherein the second heat source is thermally connected to a second flow path extending from the second intake port to the fan. (Configuration 4) The amount of heat generated by the second heat source is greater than the amount of heat generated by the first heat source, 4. The electronic device according to configuration 3, wherein a cross-sectional area of ​​the second flow path is equal to or greater than a cross-sectional area of ​​the first flow path. (Configuration 5) 5. The electronic device according to any one of configurations 1 to 4, wherein a sum of an opening area of ​​the first intake port and an opening area of ​​the second intake port is substantially equal to an opening area of ​​the exhaust port. (Configuration 6) Of the two walls constituting the duct, a first wall facing the circuit board is formed with a board-side opening, a partial area of ​​the circuit board forms a part of a flow path from the first air intake port to the fan via the board-side opening, 3. The electronic device according to configuration 1 or 2, wherein the partial area of ​​the circuit board is an area that overlaps with at least a part of an area where the heat source is mounted, when viewed in a thickness direction of the circuit board. (Configuration 7) 7. The electronic device according to configuration 6, further comprising a sealing member disposed in close contact between the circuit board and the first wall around the board-side opening. (Configuration 8) a second wall portion, which does not face the circuit board, of the two wall portions has a protrusion formed thereon, the protrusion protruding toward the circuit board in a thickness direction of the circuit board; 8. The electronic device according to configuration 6 or 7, wherein a part of the protrusion is recessed into the board-side opening. (Configuration 9) By forming the convex portion on the second wall portion, a concave portion is formed on a surface of the second wall portion opposite to the circuit board in a thickness direction of the circuit board, 9. The electronic device according to configuration 8, wherein at least a part of an operation unit that accepts user operations is disposed in the recess. (Configuration 10) 10. The electronic device according to any one of configurations 1 to 9, wherein the heat source includes a recording unit that records data on a recording medium. (Configuration 11) 11. The electronic device according to any one of configurations 1 to 10, wherein the electronic device is an imaging device having an imaging element that converts an optical image that has passed through an optical system into an electrical signal. [Explanation of symbols]

[0059] 104, 109 Side 112 Bottom 108, 110, 113 Openings 116 Forced air cooling section 124, 125 Air intake 126 Exhaust section 107 Circuit Board 118 Recording Department 150 Duct 121 Centrifugal Fan

Claims

1. a device body including a first side surface, a second side surface located on an opposite side to the first side surface, and an orthogonal surface that is substantially orthogonal to the first side surface and the second side surface; A circuit board; at least one heat source mounted to the circuit board; an air-cooling unit including a duct arranged substantially parallel to the circuit board and thermally connected to the heat source, and a fan; A first opening is formed in the first side surface, A second opening is formed in the second side surface, a third opening is formed in the orthogonal surface; the air-cooling unit includes a first intake port connected to the first opening, a second intake port connected to the second opening, and an exhaust port connected to the third opening, The electronic device, wherein the fan generates air currents from the first air intake and the second air intake to the exhaust outlet.

2. The exhaust port is formed in the fan, 2. The electronic device according to claim 1, wherein air flowing in through the first air intake and the second air intake is taken in by the fan and discharged from the exhaust port.

3. a first heat source and a second heat source are mounted on the circuit board; the first heat source is thermally connected to a first flow path extending from the first intake port to the fan; 3. The electronic device according to claim 2, wherein the second heat source is thermally connected to a second flow path extending from the second intake port to the fan.

4. The amount of heat generated by the second heat source is greater than the amount of heat generated by the first heat source, 4. The electronic device according to claim 3, wherein a cross-sectional area of ​​the second flow path is equal to or greater than a cross-sectional area of ​​the first flow path.

5. 2. The electronic device according to claim 1, wherein a sum of an opening area of ​​the first intake port and an opening area of ​​the second intake port is substantially equal to an opening area of ​​the exhaust port.

6. a first wall portion of the two walls constituting the duct facing the circuit board is formed with a board-side opening, a partial area of ​​the circuit board forms a part of a flow path extending from the first air intake port to the fan via the board-side opening, 2 . The electronic device according to claim 1 , wherein the partial region of the circuit board overlaps with at least a part of a mounting region of the heat source when viewed in a thickness direction of the circuit board.

7. 7. The electronic device according to claim 6, further comprising a sealing member disposed in close contact between the circuit board and the first wall around the board-side opening.

8. a second wall portion, which does not face the circuit board, of the two wall portions has a protrusion formed thereon, the protrusion protruding toward the circuit board in a thickness direction of the circuit board; 7. The electronic device according to claim 6, wherein a part of the protrusion is recessed in the substrate-side opening.

9. a recess is formed on a surface of the second wall portion opposite to the circuit board in a thickness direction of the circuit board by forming the protrusion on the second wall portion, The electronic device according to claim 8 , wherein at least a part of an operation unit that accepts user operations is disposed in the recess.

10. 2. The electronic device according to claim 1, wherein the heat source includes a recording unit that records data on a recording medium.

11. 2. The electronic device according to claim 1, wherein the electronic device is an image pickup device having an image pickup element that converts an optical image that has passed through an optical system into an electrical signal.

Images