Substrate processing device and method for placing substrate

Abstract

To provide a technique capable of accurately positioning a placing base relatively rotating to a rotation table.SOLUTION: A substrate processing device includes a processing container, a rotation table, a placing base, an imaging device, and a control part. The rotation table has a rotation table-side marker which can enter an imaging range of the imaging device. The placing base has a placing base-side marker which can enter the imaging range of the imaging device. The control part recognizes a position in a circumferential direction of the rotation table on the basis of the rotation table-side marker included in imaging information, to correct the position of the rotation table, when the rotation table-side marker is shifted and recognizes the position in the circumferential direction of the placing base on the basis of the placing base-side marker included in the imaging information, to correct the position of the placing base, when the placing base-side marker is shifted.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate mounting method. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus that performs substrate processing such as film formation by placing substrates in multiple recesses of a rotating table, which is a susceptor. This substrate processing apparatus has a camera installed in a processing vessel, captures an image of a susceptor mark (a marker on the rotating table) on the rotating table with the camera, corrects the position of the recesses based on the captured image information, and transports the substrate to the recesses whose position has been corrected.

[0003] In recent years, substrate processing apparatuses have been developed in which a recessed stage on which a substrate is placed can rotate (spin) relative to a turntable that rotates (revolves) within a processing vessel. When placing a substrate on each stage in such substrate processing apparatuses, in addition to positioning the turntable, each stage also needs to be positioned. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2014-123673 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique for accurately positioning a mounting table that rotates relatively to a turntable. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, a substrate processing apparatus is provided that includes a processing vessel, a turntable rotatably disposed within the processing vessel, a mounting stage having a center of rotation away from the center of rotation of the turntable and rotatable relative to the turntable, an imaging device disposed in the processing vessel and imaging the turntable and the mounting stage, and a control unit that processes imaging information of the imaging device and controls the rotation of the turntable and the operation of the mounting stage, wherein the turntable has a turntable side marker that can enter the imaging range of the imaging device by the rotation of the turntable, and the mounting stage has a mounting stage side marker that can enter the imaging range of the imaging device by the rotation of the mounting stage, and the control unit recognizes the circumferential position of the turntable based on the turntable side marker included in the imaging information and corrects the position of the turntable if the turntable side marker is misaligned, and recognizes the circumferential position of the mounting stage based on the mounting stage side marker included in the imaging information and corrects the position of the mounting stage if the mounting stage side marker is misaligned. Effect of the Invention

[0007] According to one aspect, the mounting table that rotates relatively to the rotary table can be positioned with high accuracy. [Brief description of the drawings]

[0008] [Figure 1] 1 is a vertical cross-sectional view showing an example of the configuration of a substrate processing apparatus 1 according to an embodiment. [Diagram 2] 2 is a plan view showing a configuration inside a processing container of the substrate processing apparatus of FIG. 1. [Diagram 3] 2 is a perspective view showing the configuration of a turntable and a mounting table of the substrate processing apparatus of FIG. 1. [Figure 4] 11 is a side view illustrating an installation state of an imaging device in a processing vessel. FIG. [Diagram 5] Fig. 5(A) is a plan view showing a first example of imaging information captured by an imaging device, and Fig. 5(B) is a plan view showing a second example of imaging information captured by an imaging device. [Figure 6] Fig. 6(A) is a first explanatory diagram showing an example in which two mounting table side markers are captured by clockwise rotation, and Fig. 6(B) is a second explanatory diagram showing an example in which two mounting table side markers are captured by clockwise and counterclockwise rotation. [Figure 7] 11 is a first flowchart showing correction of the position of the turntable and correction of the position of the mounting table. [Figure 8] 13 is a second flowchart showing correction of the position of the turntable and correction of the position of the mounting table. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0010] [Configuration of substrate processing equipment] A substrate processing apparatus 1 according to an embodiment will be described with reference to Figs. 1 to 3. Fig. 1 is a vertical cross-sectional view showing an example of the configuration of the substrate processing apparatus 1 according to an embodiment. Fig. 2 is a plan view showing the configuration inside a processing container 11 of the substrate processing apparatus 1 of Fig. 1. For ease of explanation, a top plate is not shown in Fig. 2. Fig. 3 is a perspective view showing the configuration of a turntable 21 and a mounting table 211 of the substrate processing apparatus 1 of Fig. 1.

[0011] The substrate processing apparatus 1 is configured as an apparatus that performs a film formation process by atomic layer deposition (ALD) or molecular layer deposition (MLD) to form a film on a surface of a substrate W. The substrate processing apparatus 1 includes a processing section 10, a rotary drive device 20, a lifter section 30, and a control section 90.

[0012] The processing section 10 performs a film formation process to form a film on a substrate W. The processing section 10 has a processing container 11, a gas inlet section 12, a gas exhaust section 13, a transfer port 14, a heating section 15, and a cooling section 16.

[0013] The processing vessel 11 is a vacuum vessel capable of reducing the pressure of its internal space and switching it to a vacuum atmosphere. The processing vessel 11 is formed as a flat housing having a substantially circular planar shape, and can accommodate a plurality of substrates W in its internal space. The substrates W may be, for example, semiconductor wafers. The processing vessel 11 includes a main body 111, a top plate 112, a sidewall 113, and a bottom plate 114 (FIG. 1). The main body 111 has a cylindrical shape. The top plate 112 is detachably attached to the upper surface of the main body 111. The main body 111 and the top plate 112 are airtightly attached to each other by a seal portion 115. The sidewall 113 has a cylindrical shape, and is airtightly connected to the lower surface of the main body 111. The bottom plate 114 is airtightly connected to the bottom surface of the sidewall 113.

[0014] The gas introduction unit 12 includes a source gas nozzle 121, a reaction gas nozzle 122, and separation gas nozzles 123 and 124 (FIG. 2). The source gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 are arranged at intervals from each other along the circumferential direction of the processing vessel 11 (the direction indicated by the arrow A in FIG. 2) above the turntable 21 described later. In the illustrated example, the separation gas nozzle 123, the source gas nozzle 121, the separation gas nozzle 124, and the reaction gas nozzle 122 are arranged in this order clockwise (the rotation direction of the turntable 21) from the transfer port 14. The source gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 each have gas introduction ports 121p, 122p, 123p, and 124p (FIG. 2) at their base ends for introducing various gases. The gas introduction ports 121p, 122p, 123p, and 124p are fixed to a side wall of the main body 111 and protrude to the outside of the main body 111. The source gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 are inserted into the processing vessel 11 from the side wall of the main body 111 and extend radially inward of the main body 111. The source gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 are made of, for example, quartz, and are arranged parallel to the turntable 21.

[0015] The raw material gas nozzle 121 is connected to a raw material gas supply source (not shown) via piping and a flow rate controller (not shown). For example, a silicon-containing gas or a metal-containing gas can be used as the raw material gas. The raw material gas nozzle 121 has a plurality of discharge holes (not shown) that open toward the turntable 21 and are arranged at intervals along the axial direction of the raw material gas nozzle 121. The region below the raw material gas nozzle 121 becomes a raw material gas adsorption region P1 for adsorbing the raw material gas onto the substrate W.

[0016] The reaction gas nozzle 122 is connected to a reaction gas supply source (not shown) via piping and a flow rate controller (not shown). For example, an oxidizing gas or a nitriding gas can be used as the reaction gas. The reaction gas nozzle 122 has a plurality of discharge holes (not shown) that open toward the turntable 21 and are arranged at intervals along the axial direction of the reaction gas nozzle 122. The region below the reaction gas nozzle 122 becomes a reaction gas supply region P2 that oxidizes or nitrides the source gas adsorbed on the substrate W in the source gas adsorption region P1. In this embodiment, the process gas for processing the substrate W corresponds to the above-mentioned source gas and reaction gas.

[0017] Both of the separation gas nozzles 123, 124 are connected to a separation gas supply source (not shown) via piping and a flow control valve, etc. (not shown). As the separation gas, for example, an inert gas such as argon (Ar) gas or nitrogen (N2) gas can be used. In the separation gas nozzles 123, 124, a plurality of discharge holes (not shown) opening toward the rotary table 21 are arranged at intervals along the axial direction of the separation gas nozzles 123, 124.

[0018] 2, two convex portions 17 are provided in the processing vessel 11. The convex portions 17, together with the separation gas nozzles 123 and 124, form a separation region D, and are attached to the rear surface of the top plate 112 so as to protrude toward the rotary table 21. Each convex portion 17 has a sectorial planar shape with its top cut into an arc shape, with the inner arc connected to the protruding portion 18 and the outer arc disposed along the side wall of the processing vessel 11.

[0019] The gas exhaust section 13 includes a first exhaust port 131 and a second exhaust port 132 (FIG. 2). The first exhaust port 131 is formed in the bottom of a first exhaust region E1 that communicates with the source gas adsorption region P1. The second exhaust port 132 is formed in the bottom of a second exhaust region E2 that communicates with the reaction gas supply region P2. The first exhaust port 131 and the second exhaust port 132 are connected to an exhaust device (not shown) via exhaust piping (not shown).

[0020] The transfer port 14 is provided in a side wall of the main body 111 (FIG. 2). Through the transfer port 14, the substrate W is transferred between the turntable 21 in the processing vessel 11 and a transfer device 14a outside the processing vessel 11. The transfer port 14 is opened and closed by a gate valve (not shown).

[0021] The heating unit 15 includes a fixed shaft 151, a heater support unit 152, and a heater 153 (FIG. 1).

[0022] Fixed shaft 151 has a cylindrical shape with its central axis passing through the center of processing vessel 11. Fixed shaft 151 penetrates bottom plate 114 of processing vessel 11 inside rotation shaft 23 of rotation drive device 20, which will be described later.

[0023] The heater support part 152 is fixed to the upper part of the fixed shaft 151 and has a disk shape. The heater support part 152 supports a heater 153.

[0024] The heater 153 is provided on the upper surface of the heater support part 152. The heater 153 may be provided on the main body 111 in addition to the upper surface of the heater support part 152. The heater 153 generates heat when power is supplied from a power source (not shown), and heats the substrate W. The heater 153 may also be provided with a blocking plate on its upper surface (the surface facing the turntable 21) to prevent the heater 153 from being exposed to the processing gas.

[0025] The cooling unit 16 includes fluid flow paths 161a-164a, chiller units 161b-164b, inlet pipes 161c-164c, and outlet pipes 161d-164d (FIG. 1). The fluid flow paths 161a-164a are formed inside the main body 111, the top plate 112, the bottom plate 114, and the heater support part 152, respectively. The chiller units 161b-164b output a temperature control fluid. The temperature control fluid output from the chiller units 161b-164b circulates by flowing through the inlet pipes 161c-164c, the fluid flow paths 161a-164a, and the outlet pipes 161d-164d in this order. This adjusts the temperatures of the main body 111, the top plate 112, the bottom plate 114, and the heater support part 152. For example, a fluorine-based fluid such as Galden (registered trademark) or water can be used as the temperature control fluid.

[0026] The rotary drive device 20 includes a rotary table 21 , a housing box 22 , a rotary shaft 23 , a revolution motor 24 , and an outer cylinder 25 .

[0027] The turntable 21 is provided in the processing vessel 11 and has a rotation center at the center of the processing vessel 11. The turntable 21 has, for example, a disk shape and is made of quartz. On the upper surface of the turntable 21, a plurality of (for example, five) mounting tables 211 are provided along the rotation direction (circumferential direction). The turntable 21 is connected to the storage box 22 via a connection part 214 (FIG. 3).

[0028] Each mounting table 211 has a disk shape slightly larger than the substrate W, and is made of, for example, quartz. A mounting surface 211s on which the substrate W is placed is formed on the upper surface of each mounting table 211. Each mounting table 211 is connected to a rotation motor 213 via a rotation shaft 212, and is configured to be rotatable with respect to the turntable 21 (FIG. 1).

[0029] The rotation shaft 212 connects the underside of the mounting table 211 to the rotation motor 213 housed in the storage box 22, and transmits the power of the rotation motor 213 to the mounting table 211. The rotation shaft 212 is configured to be rotatable around the center of the mounting table 211. The rotation shaft 212 is provided penetrating the ceiling 222 of the storage box 22 and the turntable 21. A seal portion 263 is provided near the penetration portion of the ceiling portion 222 of the storage box 22, and maintains an airtight state inside the storage box 22. The seal portion 263 includes, for example, a magnetic fluid seal.

[0030] The rotation motor 213 rotates the mounting table 211 relatively to the turntable 21 via the rotation shaft 212, thereby rotating the substrate W about the center of the substrate W. The rotation motor 213 is preferably a servo motor, for example.

[0031] The connection portion 214 connects the lower surface of the turntable 21 to the upper surface of the storage box 22 (FIG. 3). A plurality of connection portions 214 are provided along the circumferential direction of the turntable 21.

[0032] The storage box 22 is provided below the turntable 21 in the processing vessel 11. The storage box 22 is connected to the turntable 21 via a connection part 214, and rotates integrally with the turntable 21. The storage box 22 may be configured to be movable up and down within the processing vessel 11 by a lifting mechanism (not shown). The storage box 22 has a main body part 221 and a ceiling part 222.

[0033] The main body 221 is formed in a concave shape in a vertical cross-sectional view, and is formed in a ring shape along the rotation direction of the turntable 21 (FIG. 1).

[0034] The ceiling portion 222 is provided on the upper surface of the main body portion 221 so as to cover the opening of the main body portion 221. In this way, the main body portion 221 and the ceiling portion 222 form a rotating container portion 223 that is isolated from the inside of the processing vessel 11.

[0035] The rotating container 223 is formed in a rectangular shape in a vertical cross section, and has a ring shape along the rotation direction of the turntable 21. The rotating container 223 contains a rotation motor 213 (rotation source). The main body 221 is formed with a communication passage 224 that connects the rotating container 223 to the outside of the substrate processing apparatus 1. This allows air to be introduced into the rotating container 223 from the outside of the substrate processing apparatus 1, and the inside of the rotating container 223 is cooled and maintained at atmospheric pressure. In order to rotatably dispose the rotating container 223, the processing vessel 11 has a rotation source housing space 19 surrounded by a side wall body 113, a bottom plate 114, and a heating unit 15.

[0036] The rotating shaft 23 is fixed to the lower part of the storage box 22. The rotating shaft 23 is provided penetrating the bottom plate 114 of the processing vessel 11. The rotating shaft 23 transmits the power of the revolution motor 24 to the rotating table 21 and the storage box 22, and rotates the rotating table 21 and the storage box 22 together. A seal unit 154 is provided between the outer wall of the fixed shaft 151 and the inner wall of the rotating shaft 23 of the rotation drive device 20. As a result, the rotating shaft 23 rotates relative to the fixed shaft 151 while maintaining the airtight state inside the processing vessel 11. For example, a magnetic fluid seal can be used as the seal unit 154.

[0037] An outer cylinder 25 of the rotation drive device 20 is connected to the lower surface of the center side of the bottom plate 114 of the processing vessel 11. The outer cylinder 25 supports the processing vessel 11 together with a fixed shaft 151 of the processing vessel 11. A seal unit 116 is provided between the rotating shaft 23 and the outer cylinder 25 to maintain an airtight state inside the processing vessel 11. For the seal unit 116, for example, a magnetic fluid seal can be used.

[0038] A passage 231 is formed inside the rotating shaft 23. The passage 231 is connected to the communication passage 224 of the housing box 22, and functions as a fluid flow path for introducing air into the housing box 22. The passage 231 also functions as a wiring duct for introducing power lines and signal lines for driving the rotation motor 213 into the housing box 22. The passages 231 are provided in the same number as the rotation motors 213, for example.

[0039] 1, when the transport device 14a (FIG. 2) loads and unloads the substrate W onto and from the mounting table 211, the lifter unit 30 raises and lowers a plurality of (three in this embodiment) lift pins 31 to receive and deliver the substrate W between the transport device 14a and the mounting table 211. In the substrate processing apparatus 1, the lifter unit 30 is installed vertically below the mounting table facing position adjacent to the transfer port 14. The lifter unit 30 includes, in the processing vessel 11, a plurality of (three) upper structure units 40 each having a plurality of lift pins 31, and one lower operating unit 50 for simultaneously lifting and lowering the plurality of lift pins 31. In addition, the substrate processing apparatus 1 includes an imaging device 60 for imaging the substrate W transported to the mounting table 211, vertically above the mounting table facing position.

[0040] Each upper structure 40 is installed to penetrate the heater support 152 and the heater 153, and displaceably houses the lift pins 31. The lower operating unit 50 is attached to the lower surface of the bottom plate 114 of the processing vessel 11. The lower operating unit 50 has a plurality of (three) plungers 51 that displace along the vertical direction to press the lower ends 32 of the lift pins 31, respectively. That is, the lifter unit 30 has a two-stage structure including, as movable members, a plurality of lift pins 31 that directly contact the substrate W and a plurality of plungers 51 that indirectly raise and lower the substrate W via the lift pins 31, separated in the vertical direction.

[0041] In addition to the plungers 51, the lower operating unit 50 includes a case 52 and a plunger driving unit 53. The plunger driving unit 53 includes a driving source 54, a drive transmission unit 55 that transmits the operating force of the driving source 54, and a movable body 56 that supports the plungers 51 and is displaced within the case 52 by the drive transmission unit 55.

[0042] The case 52 is fixed to the bottom plate 114 at the side of the outer cylinder 25, and is formed in an appropriate shape capable of accommodating each component of the lower operating unit 50. The driving source 54 is provided at the bottom of the case 52, and operates under the control of the control unit 90 to transmit its operating force to the drive transmission unit 55. The drive transmission unit 55 appropriately reduces or converts the operating force of the driving source 54 to raise and lower the movable body 56 in the vertical direction. The movable body 56 extends radially outward (horizontally) from the drive transmission unit 55, and supports the lower end portions of the plungers 51. The movable body 56 is raised and lowered in the vertical direction by the drive transmission unit 55, and accordingly displaces each plunger 51 as a unit.

[0043] Further, the drive transmission unit 55 includes an encoder (not shown) that measures the rotation angle of the drive source 54 (or the position of the plunger 51) and detects the height position of the plunger 51, in other words, the height position of the lift pins 31. This allows the control unit 90 to recognize the height position of the lift pins 31.

[0044] Each plunger 51 is formed in a long, thin solid rod shape, and extends parallel to the vertical direction by being fixed to the movable body 56. A bottom plate-side through hole 114a through which each plunger 51 passes is formed in the bottom plate 114 at a location facing each plunger 51. In addition, a box-side through hole 225 that passes through the storage box 22 and allows each plunger 51 to pass is formed in a location facing each plunger 51 near the rotation shaft 23 of the storage box 22.

[0045] Each plunger 51 waits with its upper end portion slightly protruding from the bottom plate side through hole 114a when the lift pins 31 are in a non-operating state. When the substrate W is received or transferred, each plunger 51 rises together with the movable body 56 and moves within the rotation source accommodating space 19. Each plunger 51 passes through the side of the accommodation box 22 or the box side through hole 225, and comes into contact with the lift pins 31 of each upper structure portion 40, thereby pushing up the lift pins 31.

[0046] The multiple (three) upper structural parts 40 are provided at positions spaced apart in the radial direction from the rotation axis 212 and along the circumferential direction of the mounting table 211. The upper structural part 40 has a housing part 41 that houses the lift pin 31, and this housing part 41 supports the lift pin 31 vertically downward so that it cannot fall off. The mounting table 211 has multiple (three) through holes 211a through which each lift pin 31 can pass, corresponding to the arrangement positions of each upper structural part 40 (see also FIG. 2).

[0047] The lift pin 31 is a cylindrical member extending linearly, and its lower end is located below the lower surface of the heater support part 152. The plunger 51 raised by the lower operating part 50 comes into contact with the lower end of the lift pin 31 and pushes up the lower end 32, thereby lifting the entire lift pin 31. When the upper end of the lift pin 31 is pressed by the plunger 51, it moves vertically above the heater 153 and further protrudes through the through hole 211a of the mounting table 211 to the upper surface of the mounting table 211.

[0048] Fig. 4 is a side view that shows a schematic installation state of the imaging device 60 in the processing vessel 11. As shown in Fig. 4, the imaging device 60 is installed so as to overlap a window 112w formed in the top plate 112 of the processing vessel 11. The window 112w is made of a transparent material, and is provided at a position adjacent to the transfer port 14 and at a position vertically overlapping with a part of the outer edge of the turntable 21. The window 112w has a sealing member (not shown) on its periphery, and air-tightly closes the hole in the top plate 112.

[0049] The imaging device 60 has a rectangular cylindrical housing 61 that is fixed to the top surface of the tabletop 112 and is open downward. The housing 61 darkens the internal space to create an environment suitable for imaging. The imaging device 60 also has a light source 62, a reflector 63, and a camera 64 inside the housing 61.

[0050] The light source 62 is disposed between the window 112w and the reflector 63, and irradiates light onto the reflector 63 located vertically above. The light source 62 is not particularly limited as long as it can irradiate light with appropriate brightness, and for example, an LED (Light Emitting Diode) can be used.

[0051] The reflecting plate 63 reflects the light emitted by the light source 62 and causes the reflected light to enter the processing vessel 11 through the window 112w. The reflecting plate 63 also has an opening 63o (aperture) therein that defines an imaging range of the camera 64.

[0052] The camera 64 is installed in the housing 61 vertically above the reflector 63 so as to face the lower window 112w. The type of the camera 64 is not particularly limited, and for example, a CCD (Charge Coupled Device) camera can be applied. The camera 64 is communicably connected to the control unit 90, captures an image of the inside of the processing vessel 11 under the control of the control unit 90, and transmits the image information. The imaging device 60 may include a processing unit (not shown) that processes the image information of the camera 64, and transmits the processed image information to the control unit 90.

[0053] Returning to FIG. 1, the control unit 90 controls each unit of the substrate processing apparatus 1. The control unit 90 has a control main body 91 and a user interface 95. The control main body 91 is a computer having one or more processors 92, a memory 93, and an input / output interface and a communication interface (not shown). The one or more processors 92 are a combination of one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), a circuit made of a plurality of discrete semiconductors, and executes and processes a program stored in a memory 93. The memory 93 includes a main storage device made of a semiconductor memory or the like, and an auxiliary storage device made of a disk, a semiconductor memory (flash memory), or the like.

[0054] Moreover, the user interface 95 is connected to an input / output interface of the control body 91. This user interface 95 is not particularly limited, but examples thereof include a touch panel, a monitor, a keyboard, and a mouse.

[0055] The control unit 90 controls each component of the substrate processing apparatus 1, thereby controlling the receipt of the substrate W from the transport device 14a (FIG. 2) to each mounting table 211, the substrate processing of each substrate W, and the delivery of the substrate W from each mounting table 211 to the transport device 14a. For example, when receiving the substrate W, the control unit 90 places the mounting table 211 on which the substrate W is to be placed at a position adjacent to the transport opening 14 of the processing vessel 11. Then, the control unit 90 advances the transport device 14a from the transport opening 14, and then operates the lifter unit 30 to raise each lift pin 31 from the mounting table 211, and receives the substrate W from the transport device 14a. The control unit 90 retracts the transport device 14a, and then lowers each lift pin 31 to place the substrate W on the mounting table 211. Moreover, the control unit 90 rotates the turntable 21 to sequentially change the mounting tables 211 adjacent to the transfer opening 14 and repeats the above operation, thereby placing the substrates W on each mounting table 211.

[0056] When performing substrate processing, the control unit 90 reduces the pressure in the processing container 11 to a predetermined internal pressure and heats each substrate W by the heating unit 15. Furthermore, the control unit 90 rotates each mounting table 211 about its axis of rotation 212 while rotating the turntable 21 about its axis of rotation 23. In this state, a source gas is supplied by the source gas nozzle 121 of the gas introduction unit 12, a reaction gas is supplied by the reaction gas nozzle 122, and a separation gas is supplied by the separation gas nozzles 123 and 124, thereby forming a desired film on the surface of each substrate W.

[0057] In transferring the substrate W after the substrate processing, the control unit 90 positions the mounting table 211 for transferring the substrate W at a position adjacent to the transfer opening 14 of the processing vessel 11, and raises the lift pins 31 of the lifter unit 30 to lift the substrate W from the mounting table 211. Then, after the transfer device 14a enters, the control unit 90 lowers the lift pins 31 to transfer the substrate W to the transfer device 14a. As a result, the transfer device 14a transfers the substrate W out of the processing vessel 11. The control unit 90 also rotates the turntable 21 to sequentially change the mounting table 211 adjacent to the transfer opening 14, and repeats the above operation to transfer each substrate W out of each mounting table 211.

[0058] When the substrate W is carried in and out, the control unit 90 uses the imaging information of the camera 64 to recognize the positions of the turntable 21, each mounting table 211, and the substrate W held by the transport device 14a, and performs each positioning.

[0059] 4, the processing vessel 11 is provided with a plurality of processing vessel side markers 11m at positions included in the imaging range of the imaging device 60. The turntable 21 is provided with a plurality of turntable side markers 21m at appropriate positions on the outer periphery. Furthermore, each mounting table 211 is also provided with a plurality of mounting table side markers 211m at appropriate positions on the outer periphery.

[0060] Fig. 5(A) is a plan view showing a first example of the imaging information PI captured by the imaging device 60. Fig. 5(B) is a plan view showing a second example of the imaging information PI captured by the imaging device 60. As shown in Fig. 5(A), each of the processing vessel side markers 11m, each of the turntable side markers 21m, and each of the mounting table side markers 211m is formed in a circular shape. As described above, the imaging range of the imaging information PI is determined by the reflector 63 of the imaging device 60, and is set to a size that allows each marker to be captured.

[0061] Specifically, the imaging range of the imaging device 60 is set so that the imaging information PI includes a plurality of processing vessel side markers 11m of the processing vessel 11 (two in FIG. 5(A)). As an example, the two processing vessel side markers 11m are disposed just on either side in the width direction (left and right direction in FIG. 5(A)) of the imaging range, and are disposed at the same distance from the left and right edges of the imaging range. The processing vessel side markers 11m may adopt an appropriate configuration provided on the processing vessel 11, and may utilize, for example, a fastening portion for fastening the main body 111 and the side wall body 113.

[0062] On the other hand, the multiple turntable side markers 21m are provided at positions adjacent to the outer edge of the turntable 21. Each of these turntable side markers 21m is disposed at a position corresponding to each mounting base 211. For example, the turntable side markers 21m are provided in pairs (two) on a corresponding one of the mounting bases 211, radially outward from the mounting base 211. The pair of turntable side markers 21m are disposed at symmetrical positions at the same distance from the outer edge position 211e of each mounting base 211, which is the greatest distance from the center of the turntable 21, as a base point.

[0063] As shown in FIG. 5(A), when the outer edge position 211e of the mounting table 211 is imaged so as to be located at the center in the width direction of the image information PI, the pair of turntable side markers 21m are disposed at positions at the same distance from the left and right edges of the image capture range. In this case, each of the pair of turntable side markers 21m is disposed at the same distance from each of the adjacent processing vessel side markers 11m. In other words, the substrate processing apparatus 1 can calculate the relative positions of each of the pair of turntable side markers 21m with respect to each of the pair of processing vessel side markers 11m by using the image information PI. Then, based on the relative positions of the processing vessel side markers 11m and the turntable side marker 21m, the substrate processing apparatus 1 can recognize the amount of deviation of the circumferential position of the turntable 21 when the turntable 21 is rotated and the mounting table 211 is disposed at the transfer port 14.

[0064] As an example, it is assumed that the control unit 90 has acquired the imaging information PI shown in Fig. 5(B). In this case, the control unit 90 can recognize that each turntable side marker 21m has moved clockwise with respect to each processing vessel side marker 11m by a deviation amount MC by extracting each turntable side marker 21m and each processing vessel side marker 11m from the imaging information PI. Then, the control unit 90 can rotate the turntable 21 counterclockwise based on the calculated deviation amount MC and adjust the rotation angle (correction amount) to place each turntable side marker 21m at a position as shown in Fig. 5(A).

[0065] Each mounting table 211 is provided with multiple mounting table side markers 211m (two in FIG. 5(A)) on the outer periphery, which is adjacent to the outer edge of the mounting table 211. The two mounting table side markers 211m are set at positions where, when an imaginary line is drawn connecting each mounting table side marker 211m and the center of the mounting table 211, the angle between the intersecting imaginary lines is 60°. The mounting table 211 is configured to have two mounting table side markers 211m spaced 60° apart along the circumferential direction of the outer periphery, while having none on the remaining circumferential direction (300°) of the outer periphery.

[0066] Here, the imaging device 60 adjusts its imaging range so that when the outer edge position 211e of the mounting table 211 is located at the widthwise center of the imaging information PI, the imaging device 60 images the outer periphery of the mounting table 211 in a range of about 61° to 70°. Therefore, when the outer edge position 211e of the mounting table 211 is located at the widthwise center of the imaging information PI, both mounting table markers 211m can be captured in the imaging information PI. However, since the outer periphery of the mounting table 211 has two mounting table markers 211m spaced 60° apart, each mounting table marker 211m may not be captured depending on the rotational position of the mounting table 211.

[0067] The control unit 90 is configured to rotate the mounting table 211 facing the imaging device 60 by 60° at a maximum, and capture the image of the imaging device 60, and repeat this process six times. As a result, the mounting table side marker 211m is surely included in the imaging information PI while the mounting table 211 is rotated by 60° six times. The substrate processing apparatus 1 is set so that each lift pin 31 faces each through hole 211a of the mounting table 211 exactly at a position where the two mounting table side markers 211m are reflected in the imaging information PI. By each lift pin 31 facing each through hole 211a, each lift pin 31 can be raised above the mounting surface 211s of the mounting table 211.

[0068] Therefore, the control unit 90 is configured to control the rotation angle and rotation direction of the placement table 211 so that the two placement table markers 211m are captured in the imaging information PI. The control for capturing the two placement table markers 211m in the imaging information PI will be described below with reference to Figs. 6(A) and 6(B). Fig. 6(A) is a first explanatory diagram showing an example in which the two placement table markers 211m are captured by clockwise rotation. Fig. 6(B) is a second explanatory diagram showing an example in which the two placement table markers 211m are captured by clockwise and counterclockwise rotation.

[0069] In the following, a pattern is assumed in which one platform side marker 211m is captured in the imaging information PI as shown in Fig. 6(A) and Fig. 6(B). If there is no platform side marker 211m in the imaging information PI, the above-mentioned control is performed to rotate the platform 211 by 60°.

[0070] 6(A), it is assumed that one (left) of the two platform side markers 211m is captured in the imaging information PI. In this case, the control unit 90 cannot determine where the other platform side marker 211m is located based on the imaging information PI alone. For this reason, the control unit 90 specifies that when one platform side marker 211m is captured, the platform 211 is rotated in a first direction (e.g., clockwise). In addition, the amount of movement (rotation angle) of the platform 211 at this time is set to a value that causes the captured platform side marker 211m to be adjacent to the left edge of the imaging information PI, based on the position of the platform side marker 211m in the imaging information PI.

[0071] Then, the control unit 90 rotates the mounting table 211 clockwise by the set movement amount. As a result, if the other mounting table side marker 211m is on the right side, it will move to a position within the imaging range of the imaging device 60. Therefore, the control unit 90 can obtain an image in which the two mounting table side markers 211m are captured in the imaging information PI by performing a second imaging operation with the imaging device 60.

[0072] 6B, it is assumed that the right-side platform marker 211m of the two platform markers 211m is captured in the imaging information PI. In this case, the control unit 90 also rotates the platform 211 in the first direction (e.g., clockwise). The amount of movement (rotation angle) of the platform 211 at this time is also set to a value that causes the captured platform marker 211m to be adjacent to the left edge of the imaging information PI, as described above.

[0073] Then, the control unit 90 rotates the mounting table 211 clockwise by the set movement amount. Here, if the right mounting table side marker 211m is captured in the imaging information PI, only one mounting table side marker 211m will be captured in the second imaging information PI even if the imaging information PI is rotated by the set movement amount. However, based on this result, the control unit 90 can recognize that the mounting table side marker 211m captured in the imaging information PI is the right one.

[0074] Therefore, next, the control unit 90 rotates the mounting table 211 in a second direction (for example, counterclockwise) opposite to the first direction. The amount of movement of the mounting table 211 at this time is set to a value that causes the captured mounting table side marker 211m to be adjacent to the right edge of the imaging information PI. Then, the control unit 90 rotates the mounting table 211 counterclockwise by the set amount of movement. As a result, the left mounting table side marker 211m moves to a position that enters the imaging range of the imaging device 60. The control unit 90 captures an image a third time using the imaging device 60, thereby obtaining a state in which the two mounting table side markers 211m are captured in the imaging information PI.

[0075] When there are two mount table side markers 211m in the imaging information PI, it can be considered that the displacement of each mount table side marker 211m with respect to the imaging information PI is slight (or not displaced). When there is a slight displacement between the two mount table side markers 211m in the imaging information PI, the correction amount for correcting the position of the mount table 211 can be calculated based on the position of each mount table side marker 211m in the imaging information PI. For example, the control unit 90 may obtain the correction amount of the mount table 211 based on the distance from the left and right edges of the imaging information PI to each mount table side marker 211m. Alternatively, the control unit 90 may obtain the correction amount of the mount table 211 based on the relative position of the mount table side marker 211m with respect to the turntable side marker 21m included in the imaging information PI. This makes it possible to accurately align the position of the mount table 211 with respect to the turntable side marker 21m.

[0076] [Method of placing the substrate W] The substrate processing apparatus 1 according to the embodiment is basically configured as described above, and a method for placing the substrate W when the substrate W is carried in will be described below with reference to Fig. 7 and Fig. 8. Fig. 7 is a first flowchart showing the correction of the position of the turntable 21 and the position of the mounting table 211. Fig. 8 is a second flowchart showing the correction of the position of the turntable 21 and the position of the mounting table 211.

[0077] When the substrate W is carried in, the substrate processing apparatus 1 performs the process flow of steps S101 to S120 in FIG.

[0078] Specifically, when the control unit 90 starts the method for placing the substrate W, it rotates the turntable 21 and moves the mounting table 211 on which the substrate W is to be placed to a position adjacent to the transfer opening 14 (step S101). At this time, the control unit 90 rotates the turntable 21 by a rotation angle stored in advance. For example, in a configuration having five mounting tables 211 as shown in FIG. 2, when the mounting table 211 adjacent to the transfer opening 14 is to be replaced with the adjacent mounting table 211, the control unit 90 rotates the turntable 21 by a rotation angle of 72°. As a result, the mounting table 211 on which the substrate W is to be placed is moved to a position adjacent to the transfer opening 14.

[0079] Next, the control unit 90 causes the imaging device 60 to capture images of the turntable 21 and the mounting base 211 (step S102).

[0080] Then, when the control unit 90 acquires the imaging information PI from the imaging device 60, the control unit 90 performs image processing on the imaging information PI (step S103). In addition to the image processing of the imaging information PI, the control unit 90 also acquires (extracts or calculates) information on the amount of misalignment of the turntable 21 and information on the amount of misalignment of the mounting table 211 based on the imaging information PI.

[0081] Here, in the substrate processing apparatus 1, disturbances such as eccentricity and thermal effects may occur due to substrate processing, etc. on the turntable 21 and each mounting stage 211. For example, if the turntable 21 or each mounting stage 211 is displaced due to thermal effects, the substrate W cannot be placed in a normal position, and in some cases the substrate W may be rubbed, generating particles.

[0082] The information on the amount of deviation of the turntable 21 obtained from the imaging information PI includes the amount of deviation in the rotational direction and the amount of deviation in the horizontal direction (X-axis and Y-axis directions) of the turntable 21. The information on the amount of deviation of the mounting table 211 includes the number of mounting table side markers 211m and the amount of deviation in the horizontal direction (X-axis and Y-axis directions) of one or two mounting table side markers 211m.

[0083] When the image processing is completed, the control unit 90 first determines whether or not the positioning of the turntable 21 needs to be corrected according to the amount of deviation of the turntable 21. In this case, the control unit 90 first determines whether or not the amount of deviation of each turntable side marker 21m captured in the imaging information PI is outside the allowable range (step S104). If the amount of deviation of the turntable side marker 21m is within the allowable range (step S104: NO), it can be said that the rotation of the turntable 21 has been completed almost accurately, and the mounting table 211 is adjacent to the transfer entrance 14. Therefore, the positioning of the turntable 21 can be ended as it is, and the process proceeds to step S109.

[0084] On the other hand, if the deviation of the turntable side marker 21m is outside the allowable range (step S104: YES), the process proceeds to step S105. In step S105, the control unit 90 judges whether the number of retries to correct the rotation angle of the turntable 21 is within the upper limit. If the number of retries exceeds the upper limit (step S105: NO), the turntable 21 cannot be positioned correctly even if the correction of the position of the turntable 21 is retried. In this case, it can be assumed that an abnormality such as a breakdown or large distortion has occurred in the turntable 21, so the control unit 90 proceeds to step S106 and notifies the user of the abnormality of the turntable 21 via the user interface 95.

[0085] Also, when the number of retries is within the upper limit (step S105: YES), the control unit 90 proceeds to step S107. In step S107, the control unit 90 judges whether the amount of deviation of the turntable 21 acquired in step S103 is equal to or less than the set threshold value (maximum angle). When the amount of deviation of the turntable 21 exceeds the threshold value (step S107: NO), this refers to a state in which the turntable 21 is greatly deviated to an extent that would not normally occur when the turntable 21 is rotated in step S101. In this case, it is also assumed that an abnormality such as a breakdown or large distortion has occurred in the turntable 21, so the control unit 90 proceeds to step S106 and notifies the user of the abnormality of the turntable 21 via the user interface 95.

[0086] On the other hand, if the amount of deviation of the turntable 21 is equal to or less than the threshold (step S107), the control unit 90 proceeds to step S108. In step S108, the control unit 90 stores the amount of deviation of the turntable 21 acquired in step S103 in the memory 93 as a correction amount for the next rotation of the turntable 21. At this time, the control unit 90 also stores the number of retries for the turntable 21 incremented by one.

[0087] The above process flow determines whether correction is necessary for the positioning of the turntable 21 and prepares for the correction. However, at this timing, the control unit 90 does not perform an operation to correct the position of the turntable 21. Next, the control unit 90 sets whether correction is necessary and the correction content if correction is performed for the mounting table 211 captured in the imaging information PI, and subsequently performs correction of the turntable 21 and the mounting table 211 simultaneously.

[0088] For the mounting table 211, first, the control unit 90 determines whether the number of retries to correct the rotation angle of the mounting table 211 is within an upper limit value (step S109). If the number of retries exceeds the upper limit value (step S109: NO), the mounting table 211 cannot be positioned correctly even if the correction of the rotation angle of the mounting table 211 is retried. In this case, it can be assumed that some abnormality such as a breakdown or distortion has occurred in the mounting table 211. Therefore, the control unit 90 proceeds to step S110 and notifies the user of the abnormality of the mounting table 211 via the user interface 95.

[0089] Next, the control unit 90 determines the number of the mount table side markers 211m captured in the imaging information PI (step S111). As described above, this is because the rotation angle of the mount table 211 differs depending on the number of the mount table side markers 211m in the imaging information PI.

[0090] If it is determined in step S111 that the number of mounting table side markers 211m is 0, the control unit 90 sets 60° as the correction value for rotating the mounting table 211, and stores the number obtained by incrementing the retry count by 1 (step S112). On the other hand, if it is determined in step S111 that the number of mounting table side markers 211m is 1, the process proceeds to step S113, and if it is determined in step S111 that the number of mounting table side markers 211m is 2, the process proceeds to step S114.

[0091] Then, in step S113, the control unit 90 determines the number of the platform side markers 211m in the previous imaging information PI. If there are two platform side markers 211m in the previous imaging information PI, this means that the number of platform side markers 211m has decreased due to the retry rotation. Therefore, the control unit 90 sets the rotation direction of the platform 211 to the opposite direction to that during the retry, and stores the amount of deviation of the platform 211 acquired in step S103 in the memory 93 as a correction value (step S115). At this time, the number of retries for the platform 211 is also incremented by one and stored.

[0092] Also, in step S113, if the number of the platform side markers 211m in the previous imaging information PI is one, the number of the platform side markers 211m has not increased even by the retry rotation. This pattern corresponds to the result of the first movement in FIG. 6(B). Therefore, the control unit 90 sets the rotation direction of the platform 211 to the opposite direction to that at the time of the retry, and stores the deviation amount by which the platform side marker 211m moves to the opposite edge of the imaging information PI as a correction in the memory 93 (step S116). At this time, the number of retries for the platform 211 is also incremented by one and stored.

[0093] In step S113, if the number of the mounting table side markers 211m in the previous imaging information PI is 0, one mounting table side marker 211m is captured by the 60° rotation. This pattern corresponds to the initial state of FIG. 6(A). Therefore, the control unit 90 stores the rotation direction of the mounting table 211 in the preset direction and the amount of deviation of the mounting table 211 acquired in step S103 as a correction value in the memory 93 (step S117). At this time, the number of retries for the mounting table 211 incremented by one is also stored.

[0094] On the other hand, in step S114, the control unit 90 determines whether the amount of misalignment between the two platform side markers 211m captured in the imaging information PI is outside the allowable range. If the amount of misalignment between the two platform side markers 211m is outside the allowable range (step S114: YES), this means that the rotation angle of the platform 211 is slightly misaligned. For this reason, the control unit 90 stores the amount of misalignment of the platform 211 acquired in step S103 in the memory 93 as a correction value (step S118). At this time, the control unit 90 also stores a number incremented by one for the number of retries of the platform 211.

[0095] Conversely, if the amount of misalignment between the two mounting table side markers 211m is within the allowable range (step S114: NO), it can be said that the rotation of the mounting table 211 is completed almost accurately and each lift pin 31 faces each through hole 211a. Therefore, the positioning of the mounting table 211 can be completed, and the process proceeds to step S119.

[0096] When the process proceeds to step S119, this means that the positioning of the turntable 21 and the mounting table 211 is completed. Therefore, the control unit 90 ends the positioning of the target mounting table 211, and proceeds to loading of the substrate W by the transport device 14a.

[0097] After performing any one of steps S112 and S115 to S118, the control unit 90 proceeds to step S120. In step S120, the control unit 90 rotates the turntable 21 based on the set correction value and rotation direction of the turntable 21, and rotates the mounting table 211 based on the correction value and rotation direction of the mounting table 211. In other words, the substrate processing apparatus 1 rotates the turntable 21 and the mounting table 211 together, thereby reducing the time loss caused by performing corrections separately. After step S120, the control unit 90 returns to step S102, performs imaging by the imaging device 60, and repeats the same process flow.

[0098] As described above, in the method for placing the substrate W, by using the turntable-side marker 21m and the mounting table-side marker 211m, both the revolving turntable 21 and the rotating mounting table 211 can be positioned in a short time. Even if the turntable 21 or the mounting table 211 is misaligned due to disturbances such as eccentricity or thermal effects, the positions of the turntable 21 and the mounting table 211 can be readjusted to accurately place the substrate W on the mounting table 211. As a result, the substrate processing apparatus 1 can suppress the generation of particles caused by the substrate W rubbing against the mounting table 211 when the mounting table 211 rotates.

[0099] The substrate processing apparatus 1 and the method of placing the substrate W are not limited to the above embodiment, and may take various modified forms. For example, each of the processing vessel side markers 11m, each of the turntable side markers 21m, and each of the mounting table side markers 211m is not limited to being formed in a circular shape in a plan view, and may take various shapes. For example, each of the processing vessel side markers 11m, each of the turntable side markers 21m, and each of the mounting table side markers 211m may take a polygonal shape such as a triangular shape or a square shape. Also, the turntable side markers 21m and the mounting table side markers 211m may be formed by cutting out the edges of a disk.

[0100] Furthermore, the number of each of the processing vessel side marker 11m, the turntable side marker 21m, and the mounting table side marker 211m is not limited to two, and may be one, or three or more. For example, one each of the processing vessel side marker 11m, the turntable side marker 21m, and the mounting table side marker 211m each having a triangular shape is provided, and the positions of each marker are corrected so that the apexes of the triangle are aligned in the radial direction. Even in this case, the substrate processing apparatus 1 can efficiently position the turntable 21 and the mounting table 211.

[0101] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0102] A first aspect of the present disclosure includes a processing vessel 11, a turntable 21 rotatably provided within the processing vessel 11, a mounting table 211 having a center of rotation at a position away from the center of rotation of the turntable 21 and rotatable relative to the turntable 21, an imaging device 60 provided in the processing vessel 11 for imaging the turntable 21 and the mounting table 211, and a control unit 90 for processing imaging information PI of the imaging device 60 and controlling the rotation of the turntable 21 and the operation of the mounting table 211, and the turntable 21 may enter an imaging range of the imaging device 60 due to the rotation of the turntable 21. The mounting base 211 has a mounting base side marker 211m that can enter the imaging range of the imaging device 60 by rotating the mounting base 211, and the control unit 90 recognizes the circumferential position of the turntable 21 based on the turntable side marker 21m included in the imaging information PI and corrects the position of the turntable 21 if the turntable side marker 21m is misaligned, and recognizes the circumferential position of the mounting base 211 based on the mounting base side marker 211m included in the imaging information PI and corrects the position of the mounting base 211 if the mounting base side marker 211m is misaligned.

[0103] As described above, the substrate processing apparatus 1 can accurately position the mounting table 211, which rotates relatively to the turntable 21, by using the mounting table-side marker 211m that can enter the imaging range of the imaging device 60. As a result, even if disturbance such as eccentricity or thermal influence occurs in the turntable 21 and causes the position of the turntable 21 or the mounting table 211 to shift, the position of the mounting table 211 can be corrected using the imaging information PI of the imaging device 60. As a result, it is possible to accurately mount the substrate W on the mounting table 211, and to significantly reduce particles generated due to rubbing of the substrate W, etc.

[0104] Furthermore, the control unit 90 sets both the correction direction and correction amount for the position of the turntable 21 and the correction direction and correction amount for the mounting table 211 based on one piece of imaging information PI captured by the imaging device 60. This allows the substrate processing apparatus 1 to reduce the time loss in positioning the mounting table 211 after first positioning the turntable 21, thereby improving work efficiency. As a result, the thermal effect on the substrate W previously loaded can be suppressed.

[0105] The processing vessel 11 also has a processing vessel marker 11m provided within the imaging range of the imaging device 60, and the controller 90 recognizes the circumferential position of the turntable 21 based on the relative positions of the processing vessel marker 11m and the turntable marker 21m included in the imaging information PI. This allows the substrate processing apparatus 1 to accurately correct the position of the turntable 21.

[0106] Furthermore, when the mounting table side marker 211m is not present in the imaging information PI, the control unit 90 rotates the mounting table 211 by a set angle and performs imaging with the imaging device 60. This allows the substrate processing apparatus 1 to include the mounting table side marker 211m in the imaging information PI even when the mounting table side marker 211m is not present.

[0107] Furthermore, the mounting table side markers 211m are provided in a pair on the outer periphery of the mounting table 211, and the control unit 90 rotates the mounting table 211 so that the pair of mounting table side markers 211m are positioned within the imaging range of the imaging device 60. This allows the substrate processing apparatus 1 to easily correct the position of the mounting table 211.

[0108] Furthermore, the control unit 90 rotates the mounting table 211 in a first direction when any one of the pair of mounting table side markers 211m is included in the imaging information PI, and ends correction of the position of the mounting table 211 when both of the pair of mounting table side markers 211m are included in the imaging information PI captured after the rotation in the first direction, whereas it rotates in a second direction opposite to the first direction when only one of the pair of mounting table side markers 211m is included in the imaging information PI captured after the rotation in the first direction, and places the pair of mounting table side markers 211m in the imaging range of the imaging device 60. This allows the substrate processing apparatus 1 to accurately correct the position of the mounting table 211.

[0109] Furthermore, the control unit 90 calculates the amount of correction for correcting the position of the mounting table 211 based on the position of the mounting table side marker 211m in the imaging information PI. This allows the control unit 90 to easily obtain the amount of deviation of the mounting table 211.

[0110] Furthermore, the control unit 90 calculates the amount of correction for correcting the position of the mounting table 211 based on the position of the mounting table marker 211m relative to the turntable marker 21m included in the imaging information PI. This allows the control unit to obtain the amount of deviation of the mounting table 211 with even greater accuracy.

[0111] A second aspect of the present disclosure includes a processing vessel 11, a turntable 21 rotatably provided within the processing vessel 11, a mounting table 211 having a center of rotation at a position away from the center of rotation of the turntable 21 and rotatable relative to the turntable 21, and an imaging device 60 provided in the processing vessel 11 for imaging the turntable 21 and the mounting table 211, the turntable 21 having a turntable side marker 21m that can enter the imaging range of the imaging device 60 by the rotation of the turntable 21, and the mounting table 211 being rotatable relative to the center of rotation of the mounting table 211. In a substrate processing apparatus 1 having a mounting table side marker 211m that can enter an imaging range of a mounting device 60, a method for mounting a substrate W on the mounting table 211 is provided, in which the circumferential position of the turntable 21 is recognized based on the turntable side marker 21m included in the imaging information PI of the imaging device 60, the position of the turntable 21 is corrected if the turntable side marker 21m is misaligned, and the circumferential position of the mounting table 211 is recognized based on the mounting table side marker 211m included in the imaging information PI, and the position of the mounting table 211 is corrected if the mounting table side marker 211m is misaligned. Even in this case, the method for mounting the substrate W can accurately position the mounting table 211 that rotates relative to the turntable 21.

[0112] The substrate processing apparatus 1 and the method for placing a substrate W according to the presently disclosed embodiment are illustrative in all respects and are not restrictive. The embodiments can be modified and improved in various forms without departing from the spirit and scope of the appended claims. The matters described in the above embodiments can be configured in other ways without any contradiction, and can be combined without any contradiction. [Explanation of symbols]

[0113] 1. Substrate Processing Equipment 11 Processing vessel 21 Rotating Table 21m Rotary table side marker 211 Placement table 211m Mounting platform side marker 60 Imaging Device 90 Control section PI Imaging Information

Claims

1. A processing vessel; a rotary table rotatably disposed within the processing vessel; a mounting table having a rotation center at a position separated from the rotation center of the rotary table and rotatable relative to the rotary table; an imaging device provided in the processing vessel for imaging the turntable and the mounting table; a control unit that processes imaging information of the imaging device and controls the rotation of the turntable and the operation of the mounting table, the turntable has a turntable side marker that can enter an imaging range of the imaging device by rotation of the turntable, the mounting table has a mounting table side marker that can enter an imaging range of the imaging device by rotating the mounting table, The control unit is Recognizing a circumferential position of the turntable based on the turntable side marker included in the imaging information, and correcting the position of the turntable when the turntable side marker is misaligned; a circumferential position of the placement stand is recognized based on the placement stand marker included in the imaging information, and the position of the placement stand is corrected if the placement stand marker is misaligned. Substrate processing equipment.

2. The control unit is setting both a correction direction and a correction amount for the position of the turntable and a correction direction and a correction amount for the placement table based on one piece of image information captured by the imaging device. The substrate processing apparatus according to claim 1 .

3. the processing vessel has a processing vessel side marker provided within an imaging range of the imaging device, the control unit recognizes a circumferential position of the turntable based on a relative position between the processing vessel side marker and the turntable side marker included in the imaging information. The substrate processing apparatus according to claim 1 .

4. when the imaging information does not include the placement table side marker, the control unit rotates the placement table by a set angle and captures an image of the imaging device. The substrate processing apparatus according to claim 1 .

5. the mounting table side markers are provided in a pair on the outer periphery of the mounting table, the control unit rotates the placement table so that the pair of placement table side markers are positioned within an imaging range of the imaging device. The substrate processing apparatus according to claim 1 .

6. the control unit rotates the placement table in a first direction when any one of the pair of placement table markers is included in the imaging information; when the imaging information captured after the rotation in the first direction includes both of the pair of the mounting table side markers, completing correction of the position of the mounting table, when the imaging information captured after the rotation in the first direction includes only one of the pair of the mounting table side markers, the imaging device rotates in a second direction opposite to the first direction, and places the pair of the mounting table side markers within an imaging range of the imaging device. The substrate processing apparatus according to claim 5 .

7. The control unit is calculating a correction amount for correcting the position of the placement table based on the position of the placement table side marker in the imaging information; The substrate processing apparatus according to claim 5 .

8. The control unit is calculating a correction amount for correcting the position of the placement table based on a position of the placement table side marker relative to the turntable side marker included in the imaging information; The substrate processing apparatus according to claim 5 .

9. A processing vessel; a rotary table rotatably disposed within the processing vessel; a mounting table having a rotation center at a position separated from the rotation center of the rotary table and rotatable relative to the rotary table; an imaging device provided in the processing vessel for imaging the turntable and the placement stage, the turntable has a turntable side marker that can enter an imaging range of the imaging device by rotation of the turntable, A method for placing a substrate on a placement table in a substrate processing apparatus, the placement table having a placement table side marker that can enter an imaging range of the imaging device by rotating the placement table, the method comprising: Recognizing a circumferential position of the turntable based on the turntable side marker included in the imaging information of the imaging device, and correcting the position of the turntable when the turntable side marker is misaligned; a circumferential position of the placement stand is recognized based on the placement stand marker included in the imaging information, and the position of the placement stand is corrected if the placement stand marker is misaligned. Method of placing the board.

Images