Coating processing device, coating processing method, coating processing program, and storage medium

Abstract

To provide a technique that can improve quality of the coating processing.SOLUTION: A coating processing device according to one embodiment of the present disclosure includes: a substrate holding unit that holds and moves a substrate having multiple pixels; a discharge head that has multiple nozzles arrayed along a prescribed direction and discharges functional liquid to the multiple pixels of the substrate held by the substrate holding unit from the multiple nozzles; and a control unit that manages each component. The control unit performs first processing that determines whether to discharge the functional liquid from each nozzle at one timing on the basis of the data that specifies a distribution of aggregates of the functional liquid formed on the substrate, second processing that determines whether the discharging nozzles are arrayed consecutively in the prescribed number or greater; and third processing that sets a voltage applied to at least one of non-discharging nozzles to a prescribed voltage that is greater than zero but does not cause functional liquid discharge when it is determined that the discharging nozzles are arrayed consecutively in the prescribed number or greater.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a coating processing apparatus, a coating processing method, a coating processing program, and a storage medium. [Background technology]

[0002] Conventionally, there is known a coating processing apparatus that applies droplets of a functional liquid to a transported substrate by an inkjet method. For example, a coating processing apparatus is disclosed that includes a transport mechanism that holds and moves the substrate, and a plurality of ejection heads that drop droplets of the functional liquid from above onto the substrate held by the transport mechanism (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-007906 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can improve the quality of a coating process. [Means for solving the problem]

[0005] A coating processing apparatus according to an embodiment of the present disclosure includes a substrate holding unit, a discharge head, and a control unit. The substrate holding unit holds and moves a substrate having a plurality of pixels. The discharge head has a plurality of nozzles aligned along a given direction, and discharges functional liquid from the plurality of nozzles onto the plurality of pixels of the substrate held by the substrate holding unit. The control unit controls each unit. The control unit also performs a first process, a second process, and a third process. The first process determines whether or not the functional liquid is discharged from each of the nozzles at one timing based on data that defines the distribution of the aggregate of the functional liquid formed on the substrate. The second process determines whether or not a given number or more of discharge nozzles determined to discharge the functional liquid are consecutively arranged in discharge pattern data that is created based on the determination result of the first process and indicates the distribution of the presence or absence of discharge from the plurality of nozzles at the one timing. In the third process, when it is determined in the second process that the ejection nozzles are lined up in succession in a number equal to or greater than a given number, the voltage applied to at least one of the non-ejection nozzles determined not to eject the functional liquid at the one timing is set to a given voltage greater than zero at which the functional liquid is not ejected. Effect of the Invention

[0006] According to the present disclosure, the quality of the coating process can be improved. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a left side view showing a schematic configuration of a coating treatment apparatus according to an embodiment. [Diagram 2] FIG. 2 is a plan view showing a schematic configuration of the coating treatment apparatus according to the embodiment. [Diagram 3] FIG. 3 is a plan view of the carriage according to the embodiment. [Figure 4] FIG. 4 is a perspective view of the ejection head according to the embodiment, as viewed obliquely from below. [Diagram 5] FIG. 5 is a flowchart illustrating an example of a processing procedure of a control processing executed by the coating processing apparatus according to the embodiment. [Figure 6] FIG. 6 is a diagram showing an example of ejection pattern data created by the coating processing apparatus according to the embodiment. [Figure 7] FIG. 7 is a diagram showing an example of a voltage application process executed by the coating processing apparatus according to the embodiment for non-ejection nozzles. [Figure 8] FIG. 8 is a diagram showing an example of a criterion for a voltage application process executed by the coating processing apparatus according to the embodiment for non-ejection nozzles. [Figure 9] FIG. 9 is a diagram showing another example of the standard for the voltage application process executed by the coating processing apparatus according to the embodiment for the non-ejection nozzles. [Figure 10] FIG. 10 is a diagram for explaining another example of the standard for the voltage application process executed by the coating processing apparatus according to the embodiment for the non-ejection nozzles. [Figure 11] FIG. 11 is a diagram showing an example of the distribution of the ejection amount from each nozzle before the correction process is performed. [Figure 12] FIG. 12 is a diagram showing an example of drive waveform signals with different drive voltages. [Figure 13] FIG. 13 is a flowchart illustrating an example of a processing procedure of a control processing executed by a coating processing apparatus according to a modified example of the embodiment. [Figure 14] FIG. 14 is a diagram showing an example of a typical distribution of the ejection amount of the functional liquid from each nozzle according to a modified example of the embodiment. [Figure 15] FIG. 15 is a diagram showing an example of the distribution of the discharge amount of the functional liquid from each discharge nozzle in the reference example. [Figure 16] FIG. 16 is a diagram showing a comparison between the representative values ​​and the actual measured values ​​of the ejection amount of the functional liquid from each ejection nozzle in the reference example. [Figure 17] FIG. 17 is a diagram showing an example of the distribution of the ejection amount of the functional liquid from each ejection nozzle according to a modified example of the embodiment. [Figure 18] FIG. 18 is a diagram showing a comparison between representative values ​​and actual measured values ​​of the ejection amount of the functional liquid from each ejection nozzle according to the modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, with reference to the attached drawings, embodiments of the coating processing apparatus, coating processing method, coating processing program, and storage medium disclosed in the present application will be described in detail. Note that the present disclosure is not limited to the embodiments shown below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of each element may differ from the reality. Furthermore, there may be parts in which the dimensional relationships and ratios of each element differ between the drawings.

[0009] Conventionally, there has been known a coating processing apparatus that applies droplets of a functional liquid to a transported substrate by an inkjet method. For example, a coating processing apparatus has been disclosed that includes a transport mechanism that adsorbs and holds the substrate while moving it, and a plurality of ejection heads that drop droplets of the functional liquid from above onto the substrate held by the transport mechanism.

[0010] On the other hand, in the above conventional technology, when a unique ejection pattern occurs in which, for example, among a number of nozzles arranged in a row, some nozzles eject functional liquid at the same timing and some nozzles do not eject functional liquid, the ejection amount may vary significantly, which may cause a significant deterioration in the quality of application of the functional liquid to the substrate.

[0011] Therefore, there is a need for a technology that can overcome the above-mentioned problems and improve the quality of the coating process.

[0012] <Configuration of Coating Treatment Device> First, the configuration of a coating treatment apparatus 1 according to an embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a left side view showing a schematic configuration of the coating treatment apparatus 1 according to an embodiment, and Fig. 2 is a plan view showing a schematic configuration of the coating treatment apparatus 1 according to an embodiment.

[0013] In the following, in order to clarify the positional relationships, the mutually perpendicular X-axis, Y-axis, and Z-axis directions are defined, the Y-axis direction is the transport direction of the substrate S, and the positive Z-axis direction is the vertical upward direction.

[0014] In addition, in this disclosure, the front-to-rear direction is defined as the positive Y-axis direction being the front and the negative Y-axis direction being the rear, the left-to-right direction is defined as the positive X-axis direction being the right and the negative X-axis direction being the left, and the up-down direction is defined as the positive Z-axis direction being the up and the negative Z-axis direction being the down.

[0015] The coating processing apparatus 1 is a drawing apparatus that performs drawing on the substrate S by an inkjet method while transporting the substrate S along a transport direction. The substrate S is, for example, a substrate used in a flat panel display, and has a plurality of pixels (not shown) arranged in a matrix.

[0016] The coating processing apparatus 1 is accommodated in a chamber room 100. An inert gas (such as nitrogen gas) is supplied to the chamber room 100. The coating processing apparatus 1 discharges a functional liquid onto the substrate S in an inert gas atmosphere to perform drawing on the substrate S. Note that the coating processing apparatus 1 may be an apparatus that is not accommodated in the chamber room 100.

[0017] In addition to ink, the functional liquid includes liquids that form a hole injection layer (HIL) and a hole transport layer (HTL). The functional liquid also includes multiple types of inks that are different in color. For example, the functional liquid includes R (red), G (green), and B (blue) inks.

[0018] 2, an electric room 101 in which a control device 9 and the like are housed is provided adjacent to the chamber room 100. Also, the chamber room 100 is provided with an exchange room 102 for exchanging a functional liquid tank (not shown) in which a functional liquid is stored.

[0019] 1 and 2, the coating processing apparatus 1 includes a stand 2, a pair of first guide rails 3, a substrate transport mechanism 4, a pair of second guide rails 5, a coating unit 6, an inspection mechanism 7, and a control device 9. The substrate transport mechanism 4 is an example of a substrate holding unit.

[0020] The stand 2 is disposed so as to extend along the transport direction (Y-axis direction) of the substrate S. The upper surface of the stand 2 is horizontal.

[0021] The pair of first guide rails 3 are disposed on the upper surface of the stand 2. The pair of first guide rails 3 extend linearly along the transport direction of the substrate S. The pair of first guide rails 3 are disposed spaced apart in the horizontal direction (X-axis direction) perpendicular to the transport direction.

[0022] The substrate transport mechanism 4 holds the substrate S and moves the held substrate S along the transport direction (Y-axis direction). Specifically, the substrate transport mechanism 4 includes a stage 40, a rotating unit 41, and a moving unit .

[0023] Stage 40 is, for example, a vacuum suction stage, and suctions the lower surface (the surface opposite to the surface to be drawn) of substrate S. Rotating unit 41 is provided below stage 40, and rotates stage 40 around a vertical axis (Z axis).

[0024] A work alignment camera (not shown) that captures an image of an alignment mark of the substrate S on the stage 40 is provided above the stage 40. The rotating unit 41 corrects the position of the substrate S by rotating based on the image captured by the work alignment camera.

[0025] The moving unit 42 is provided below the rotating unit 41 and supports the rotating unit 41 and the stage 40. The moving unit 42 is attached to the pair of first guide rails 3 and is movable along the pair of first guide rails 3 by a driving unit (not shown) provided on at least one of the pair of first guide rails 3, such as a linear motor.

[0026] The substrate transport mechanism 4 can move the moving part 42 along the pair of first guide rails 3, thereby moving the stage 40 and the substrate S held by suction on the stage 40 along the transport direction (Y-axis direction).

[0027] Further, at the end of the substrate transport mechanism 4 on the negative side in the Y-axis direction, there is provided a carry-in / out section 10 into which the substrate S is carried in from the outside by a substrate carry-in / out mechanism (not shown) and into which the substrate S is carried out to the outside.

[0028] 2, the pair of second guide rails 5 extend linearly in a direction (X-axis direction) perpendicular to the transport direction of the substrate S. The pair of second guide rails 5 are disposed at an interval in the transport direction (Y-axis direction) of the substrate S. The pair of second guide rails 5 are disposed on supports 5a that are disposed above the frame 2 and at a position higher than the stage 40.

[0029] The pair of second guide rails 5 extend outward (to the sides) of the gantry 2 in a plan view. On the sides of the gantry 2 and between the pair of second guide rails 5, for example, a maintenance unit 50 is disposed.

[0030] The maintenance unit 50 performs maintenance of the discharge head 63, which will be described later, and eliminates or prevents discharge defects of the discharge head 63. The application unit 6, which will be described later, is movable between a drawing position, which is a position above the stand 2, and a maintenance position, which is above the maintenance unit 50.

[0031] A plurality of coating units 6 are arranged along a direction (X-axis direction) perpendicular to the transport direction of the substrate S. For example, three coating units 6 are arranged along the X-axis direction. The number of coating units 6 is not limited to three. Each coating unit 6 includes a carriage plate 60, a carriage rotation unit 61, a carriage 62, and a plurality of discharge heads 63.

[0032] The carriage plate 60 is attached to the pair of second guide rails 5. The carriage plate 60 is movable along the pair of second guide rails 5 by a drive unit (not shown) provided on at least one of the pair of second guide rails 5, such as a linear motor.

[0033] 1, the carriage rotating part 61 is disposed below the carriage plate 60. The carriage rotating part 61 is attached to the center of the carriage plate 60 in the transport direction (Y-axis direction). A carriage 62 is attached to the lower end of the carriage rotating part 61. The carriage rotating part 61 supports the carriage 62 so as to be rotatable around a vertical axis (Z-axis).

[0034] The carriage rotation unit 61 rotates the carriage 62 about an axis parallel to the vertical direction based on an image captured by a carriage alignment camera (not shown) provided on the stage 40. This causes the position of the carriage 62 to be corrected.

[0035] The multiple ejection heads 63 are provided on the carriage 62. Each ejection head 63 is connected to a functional liquid tank (not shown) via a supply tube (not shown), receives the functional liquid from the functional liquid tank via the supply tube, and ejects droplets of the functional liquid onto the substrate S. Each ejection head 63 can eject, for example, multiple types of functional liquid.

[0036] Fig. 3 is a plan view of a carriage 62 according to an embodiment. The carriage 62 is, for example, a flat plate-like member and has a plurality of openings 62a. For example, in the example shown in Fig. 3, the carriage 62 has a total of 12 openings 62a arranged in a matrix along the main transport direction and the secondary transport direction.

[0037] Although an example in which twelve openings 62a are provided in the carriage 62 has been shown here, the number of openings 62a may be more or less than twelve.

[0038] Each of the openings 62a accommodates an ejection head 63. The ejection head 63 is mounted on the carriage 62 so as to cover the opening 62a. The ejection heads 63 are arranged at intervals in the transport direction (Y-axis direction) of the substrate S and in a direction perpendicular to the transport direction (X-axis direction), for example. A detailed configuration of the ejection head 63 will be described later.

[0039] Returning to the description of Figures 1 and 2, the inspection mechanism 7 receives droplets of functional liquid using the inspection film 73 and inspects the droplet ejection state. The inspection film 73 is a water-repellent inspection film. Specifically, the inspection film 73 is an inspection film whose surface (the surface onto which droplets are ejected) has water-repellency.

[0040] The inspection mechanism 7 includes a moving unit 70 , an inspection table 71 , a film feed unit 72 , an inspection film 73 , and an imaging unit 74 .

[0041] The moving unit 70 is attached to the pair of first guide rails 3. The moving unit 70 is movable along the pair of first guide rails 3 by a drive unit (not shown) provided on at least one of the pair of first guide rails 3.

[0042] The moving unit 70 moves among a discharge position, an imaging position, and a standby position that are set along the transport direction of the substrate S. The discharge position is a position below the multiple discharge heads 63. The imaging position is a position below the imaging unit 74. The standby position is a position outside the coating unit 6.

[0043] The inspection table 71 is attached to the center of the upper surface of the moving unit 70. The inspection table 71 moves together with the moving unit 70. That is, the inspection table 71 moves between a discharge position, an imaging position, and a waiting position. The length of the inspection table 71 is longer than the discharge area where droplets of the functional liquid are discharged onto each inspection film 73 by the application unit 6.

[0044] The inspection table 71 has an adsorption plate (not shown) on the upper surface. The adsorption plate of the inspection table 71 is made of, for example, a porous material. A suction device (not shown) is also housed inside the inspection table 71. The inspection table 71 adsorbs the inspection film 73 by sucking the adsorption plate with the suction device.

[0045] The film feed unit 72 is provided above the moving unit 70. The film feed unit 72 feeds the test film 73 (test medium) that receives the test droplets discharged from the multiple discharge heads 63 in the left-right direction (the direction perpendicular to the transport direction).

[0046] 1, the imaging unit 74 is attached to the second guide rail 5 via a base 74a. A moving mechanism (not shown) for moving the imaging unit 74 in the left-right direction is provided on the base 74a. The imaging unit 74 is attached to, for example, the second guide rail 5 located at the front of the pair of second guide rails 5.

[0047] The imaging unit 74 captures an image of the droplets of the functional liquid discharged onto the inspection film 73. Note that a plurality of imaging units 74 may be provided, and the droplets of the functional liquid discharged onto the inspection film 73 may be captured by the plurality of imaging units 74. In this case, the imaging unit 74 may be fixed to the second guide rail 5 without being movable in the left-right direction.

[0048] In the inspection mechanism 7, the droplet discharge state (eg, the amount of functional liquid discharged) in the discharge head 63 is inspected based on the result of imaging the droplets of the functional liquid discharged onto the inspection film 73 by the imaging unit 74.

[0049] 2 is, for example, a computer, and includes a control unit 91 and a storage unit 92. The storage unit 92 is realized by, for example, a semiconductor memory element such as a random access memory (RAM) or a flash memory, or a storage device such as a hard disk or an optical disk.

[0050] The control unit 91 includes a microcomputer and various circuits including a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM, an input / output port, etc. The CPU of the microcomputer realizes control of each part in the coating processing apparatus 1 by reading and executing a program stored in the ROM.

[0051] The program may be recorded in a computer-readable storage medium and installed from the storage medium into the storage unit 92 of the control device 9. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.

[0052] <Configuration of ejection head> Next, a configuration example of the ejection head 63 according to the embodiment will be described with reference to Fig. 4. Fig. 4 is a perspective view of the ejection head 63 according to the embodiment, as viewed obliquely from below.

[0053] 4, the ejection head 63 has, for example, a head body 63a and a flange portion 63b protruding laterally from the head body 63a. The ejection head 63 is inserted, for example, from above the carriage 62 (see FIG. 3) into the opening 62a (see FIG. 3). As a result, the head body 63a of the ejection head 63 is disposed within the opening 62a.

[0054] Furthermore, the flange portion 63b of the ejection head 63 comes into contact with the upper surface of the carriage 62. This causes the ejection head 63 to be locked to the carriage 62. Furthermore, while the ejection head 63 is locked to the carriage 62, the ejection head 63 is fixed by a fixing portion (not shown) provided on the carriage 62.

[0055] The ejection head 63 is, for example, a nozzle head of a piezoelectric type or a resistance heating type. A plurality of nozzles 64 are formed on a lower surface 63c of the head body 63a. The plurality of nozzles 64 are, for example, arranged in a line at equal intervals along a first direction D1. The first direction D1 is an example of a given direction.

[0056] The first direction D1 is a direction intersecting the scanning direction Ds (for example, a direction perpendicular to the scanning direction Ds), for example, the X-axis direction. The scanning direction Ds is a direction in which the substrate S is scanned, for example, the Y-axis positive direction when the substrate S moves forward.

[0057] The head body 63a has a pump section (not shown) that includes a cavity for storing functional liquid, a piezoelectric element for changing the volume of the cavity, a vibration plate, etc., and by applying a voltage to the piezoelectric element to vibrate the vibration plate, the volume of the cavity is changed and droplets of the functional liquid are ejected from each ejection hole.

[0058] Additionally, the ejection head 63 is provided with a functional liquid introduction section that is connected to a functional liquid tank via a supply tube, and a head substrate that is connected to a control device 9 (see FIG. 2) via a flexible flat cable.

[0059] The arrangement of the multiple nozzles 64 in the ejection head 63 according to the embodiment is not limited to the example shown in FIG. 4, and multiple rows of the multiple nozzles 64 aligned along the first direction D1 may be arranged side by side along the scanning direction Ds.

[0060] <Details of control process> Next, details of the control process performed by the coating processing apparatus 1 according to the embodiment will be described with reference to Fig. 5 to Fig. 12. Fig. 5 is a flowchart showing an example of a processing procedure of the control process executed by the coating processing apparatus 1 according to the embodiment.

[0061] As shown in FIG. 5, first, the control unit 91 (see FIG. 2) sets a counter n to 1 for counting the number of ejection processes in which ejection is performed at the same timing from multiple nozzles 64 (see FIG. 4) of the ejection head 63 (see FIG. 4) at the same time (step S101).

[0062] Next, the control unit 91 determines whether or not to eject the functional liquid from each nozzle 64 at the nth timing based on data that defines the distribution of the desired functional liquid aggregate formed on the substrate S (step S102).

[0063] The process of step S102 is an example of a first process. Data defining the desired distribution of the aggregates of the functional liquid, which is used in the process of step S102, is stored in advance in the storage unit 92, for example.

[0064] Next, the control unit 91 creates discharge pattern data indicating the distribution of the presence or absence of discharge from the multiple nozzles 64 at the n-th timing based on the result of the process in step S102 (step S103). Fig. 6 is a diagram showing an example of the discharge pattern data created by the coating processing apparatus 1 according to the embodiment.

[0065] 6 shows a case where, for example, 32 nozzles 64 are arranged in a row along the first direction D1 (see FIG. 4) in one ejection head 63. In addition, in the example of Fig. 6, nozzles 64 determined to eject functional liquid in the process of step S102 (hereinafter also referred to as "ejection nozzles") are shown with black circles.

[0066] 6, the nozzles 64 that are determined not to eject functional liquid in the process of step S102 (hereinafter also referred to as "non-ejection nozzles") are indicated by white circles. Note that in the present disclosure, the number of nozzles 64 arranged in one ejection head 63 along the first direction D1 is not limited to 32.

[0067] Returning to the description of Fig. 5, following the process of step S103, the control unit 91 determines whether or not the ejection nozzles are arranged consecutively in a given number or more (for example, six or more) in the ejection pattern data created in the process of step S103 (step S104). The process of step S104 is an example of the second process.

[0068] Then, when it is determined that there are a given number or more of ejection nozzles lined up in succession (step S104, Yes), the control unit 91 sets the applied voltage of at least one non-ejection nozzle to a given voltage V1 (step S105). The process of step S105 is an example of a third process. This voltage V1 is a voltage that is greater than zero and does not eject functional liquid, and is also referred to as "applied voltage V1" in Figures 7 to 9.

[0069] For example, in the example shown in Fig. 6, seven discharge nozzles, which is equal to or greater than a given number (e.g., six or more), are lined up in a row. Therefore, the control unit 91 sets the applied voltage of at least one non-discharge nozzle (e.g., adjacent to the continuously lined-up discharge nozzles) to voltage V1, as shown in Fig. 7. Fig. 7 is a diagram showing an example of a voltage application process executed by the coating processing apparatus 1 according to the embodiment to the non-discharge nozzles.

[0070] 7, non-ejecting nozzles for which the applied voltage is set to voltage V1 in the process of step S105 are hatched with diagonal lines, and non-ejecting nozzles for which the applied voltage remains zero are left as white circles.

[0071] In this manner, in the embodiment, when a given number or more of ejection nozzles are lined up in succession, the voltage V1 applied to the non-ejection nozzles is set to a level at which functional liquid is not ejected either. This makes it possible to reduce significant distortion of the ejection head 63 when ejecting functional liquid all at once, even if a unique ejection pattern occurs in which ejection nozzles are lined up in succession.

[0072] Therefore, according to the embodiment, since a desired amount of functional liquid can be stably discharged from each discharge nozzle, the quality of the coating process of the functional liquid on the substrate S can be improved.

[0073] Also, in an embodiment, the control unit 91 may set the applied voltage to non-ejection nozzles adjacent to a given number or more of consecutively arranged ejection nozzles to voltage V1 in the process of step S105 as shown in FIG.

[0074] This makes it possible to reduce significant distortion of the ejection head 63 when ejecting the functional liquid all at once at the boundary between a group of ejection nozzles and non-ejection nozzles, which is prone to significant distortion when an unusual ejection pattern is generated.

[0075] Therefore, according to the embodiment, since a desired amount of functional liquid can be stably discharged from each discharge nozzle, the quality of the coating process of the functional liquid on the substrate S can be improved.

[0076] In the example of Figure 7, a configuration is shown in which the applied voltage to one non-ejection nozzle that is directly adjacent to multiple ejection nozzles that are arranged in succession is set to voltage V1, but the present disclosure is not limited to such an example.

[0077] Fig. 8 is a diagram showing an example of a standard for voltage application processing executed by the coating processing apparatus 1 according to the embodiment for non-discharge nozzles. As shown in Fig. 8, in the embodiment, in the processing of step S105, the control unit 91 may increase the number N2 of non-discharge nozzles for which the applied voltage is set to voltage V1 as the number N1 of the multiple discharge nozzles arranged consecutively increases.

[0078] For example, when the number N1 of consecutively arranged ejection nozzles is 6 to 15, the number N2 of non-ejection nozzles adjacent to this group of ejection nozzles and having an applied voltage set to voltage V1 may be 1 / 3 of the number N1. Note that the number N2 of non-ejection nozzles is the sum of the non-ejection nozzles located at both ends of the group of ejection nozzles.

[0079] Furthermore, for example, when the number N1 of consecutively arranged ejection nozzles is between 16 and 25, the number N2 of non-ejection nozzles adjacent to this group of ejection nozzles, the applied voltage of which is set to voltage V1, should be 2 / 3 of the number N1. Furthermore, for example, when the number N1 of consecutively arranged ejection nozzles is 26 or more, the applied voltage of all non-ejection nozzles should be set to voltage V1.

[0080] In this way, by increasing the number N2 of non-ejection nozzles whose applied voltage is set to voltage V1 as the number N1 of consecutive ejection nozzles increases, it is possible to reduce significant distortion when ejecting functional liquid all at once in the ejection head 63, which is prone to greater distortion as the number N1 increases.

[0081] Therefore, according to the embodiment, since a desired amount of functional liquid can be stably discharged from each discharge nozzle, the quality of the coating process of the functional liquid on the substrate S can be improved.

[0082] 8, in the embodiment, the control unit 91 may set the applied voltage to all non-ejection nozzles to voltage V1 in the process of step S105. This also allows a desired amount of functional liquid to be stably ejected from each ejection nozzle, thereby improving the quality of the coating process of the functional liquid on the substrate S.

[0083] 9 is a diagram showing another example of the standard for the voltage application process executed by the coating processing apparatus 1 according to the embodiment for the non-discharge nozzles. As shown in Fig. 9, in the embodiment, the control unit 91 may increase the value of the voltage V1 in the process of step S105 as the number N1 of the multiple discharge nozzles arranged consecutively increases.

[0084] For example, if the number N1 of consecutively arranged ejection nozzles is between 6 and 15, the value of the voltage V1 set as the applied voltage to a given non-ejection nozzle may be 30% of the reference voltage Vh of the applied voltage set to the ejection nozzles.

[0085] Furthermore, for example, if the number N1 of consecutively arranged ejection nozzles is between 16 and 25, the value of the voltage V1 set as the applied voltage to a given non-ejection nozzle may be 40% of the reference voltage Vh of the applied voltage set to the ejection nozzles.

[0086] Furthermore, for example, when the number N1 of consecutively arranged ejection nozzles is 26 or more, the value of the voltage V1 set as the applied voltage to a given non-ejection nozzle may be 50% of the reference voltage Vh of the applied voltage set to the ejection nozzle.

[0087] In this way, by increasing the value of the voltage V1 set as the voltage applied to the non-ejecting nozzles as the number N1 of consecutive ejection nozzles increases, it is possible to reduce significant distortion when ejecting functional liquid all at once in the ejection head 63, which is prone to greater distortion as the number N1 increases.

[0088] Therefore, according to the embodiment, since a desired amount of functional liquid can be stably discharged from each discharge nozzle, the quality of the coating process of the functional liquid on the substrate S can be improved.

[0089] In addition, in the embodiment, the voltage V1 applied to a given non-ejection nozzle may be in the range of 10% to 60% of the reference voltage Vh applied to the ejection nozzles. By setting the voltage V1 in this range, functional liquid is not ejected from the non-ejection nozzles, and distortion of the ejection head 63 can be reduced.

[0090] In addition, in the embodiment, the waveform of the voltage applied to the discharge nozzles may be the same as or different from the waveform of the voltage applied to the non-discharge nozzles. By making the waveform of the voltage applied to the discharge nozzles different from the waveform of the voltage applied to the non-discharge nozzles, the effect of reducing distortion of the discharge head 63 can be further optimized, and the quality of the coating process of the functional liquid on the substrate S can be improved.

[0091] Note that the reference values ​​for the processing of step S105 shown in Figures 8 and 9 are merely examples, and these reference values ​​can be changed in various ways depending on the number of nozzles 64 provided in the ejection head 63, the spacing between the nozzles 64, the material of the ejection head 63, the ejection method of the ejection head 63, etc.

[0092] For example, in the above embodiment, an example has been shown in which when the number N1 of consecutive ejection nozzles is six or more, the applied voltage to at least one non-ejection nozzle is set to voltage V1.

[0093] However, in the present disclosure, the threshold value of the number N1 at which the applied voltage of at least one non-ejecting nozzle is set to voltage V1 is not limited to 6, and may be 5 or less, or 7 or more. This threshold value can be changed in various ways depending on, for example, the number of nozzles 64, the spacing between the nozzles 64, the material of the ejection head 63, the ejection method of the ejection head 63, etc.

[0094] Furthermore, in the present disclosure, the applied voltage to at least some of the non-ejection nozzles may be set to voltage V1 only when, for example, the number of consecutive non-ejection nozzles between groups of ejection nozzles that are consecutively arranged in a given number or more is a given number (for example, six or more).

[0095] This makes it possible to further optimize the effect of reducing distortion of the discharge head 63, thereby improving the quality of the coating process of the functional liquid on the substrate S.

[0096] FIG. 10 is a diagram for explaining another example of the standard for the voltage application process executed by the coating processing apparatus 1 according to the embodiment for the non-ejection nozzles.

[0097] 10 shows the distribution of the ejection amount of functional liquid when the control unit 91 (see FIG. 2) operates the application unit 6 (see FIG. 2) and the inspection mechanism 7 (see FIG. 2) to eject functional liquid from each nozzle 64 (see FIG. 4) under uniform ejection conditions to the inspection mechanism 7. The horizontal axis of the graph in FIG. 10 indicates the nozzle number, which is numbered so that the numbers gradually increase from one end to the other end for the multiple nozzles 64 lined up in a row.

[0098] For example, in this embodiment, as shown in FIG. 10, the intermediate value M between the maximum and minimum discharge amounts for all the nozzles 64 is set as a threshold value, and all the nozzles 64 are grouped into two groups G1 and G2.

[0099] In an embodiment, in the processing of step S105, the control unit 91 may set the number N2 of non-ejection nozzles belonging to group G1 having a large ejection volume under uniform ejection conditions to be greater than the number N2 of non-ejection nozzles belonging to group G2 having a small ejection volume.

[0100] This also enables a desired amount of functional liquid to be stably discharged from each discharge nozzle, so that the quality of the coating process of the functional liquid onto the substrate S can be improved.

[0101] In addition, in an embodiment, in the processing of step S105, the control unit 91 may cause the value of the voltage V1 of the non-ejection nozzles belonging to group G1, which has a large ejection volume under uniform ejection conditions, to be greater than the value of the voltage V1 of the non-ejection nozzles belonging to group G2, which has a small ejection volume.

[0102] This also enables a desired amount of functional liquid to be stably discharged from each discharge nozzle, so that the quality of the coating process of the functional liquid onto the substrate S can be improved.

[0103] In the example of FIG. 10, an example is shown in which all of the nozzles 64 are divided into two groups G1 and G2, but the present disclosure is not limited to such an example, and all of the nozzles 64 may be divided into three or more groups.

[0104] Returning to the explanation of Fig. 5, following the processing of step S105 explained so far, the control unit 91 operates the application unit 6 (see Fig. 2) and the inspection mechanism 7 (see Fig. 2) and so on to eject the functional liquid from each ejection nozzle to the inspection mechanism 7 under the ejection conditions set in the processing of step S105 (step S106).

[0105] That is, in the process of step S106, the control unit 91 ejects the functional liquid to the inspection mechanism 7 under the voltage application conditions set respectively to the ejection nozzles and non-ejection nozzles in the process of step S105 described above.

[0106] It should be noted that, in the process of step S104 described above, if it is determined that the given number or more of ejecting nozzles are not consecutively arranged (step S104, No), the process proceeds to step S106.

[0107] In the process of step S106, for example, the control unit 91 applies a voltage that is 100% of the reference voltage Vh to the ejection nozzles, applies voltage V1 to some or all of the non-ejection nozzles, and applies no voltage to the non-ejection nozzles to which voltage V1 is not set as the applied voltage. This causes droplets of functional liquid to be ejected from all the ejection nozzles onto the test film 73 (see FIG. 2).

[0108] Then, the control unit 91 captures the droplets of the functional liquid discharged onto the inspection film 73 with the imaging unit 74 and analyzes the captured image to determine the amount (volume, weight, etc.) of each droplet. In this way, the control unit 91 measures the discharge amount of each discharge nozzle (step S107).

[0109] An example of the results measured in the process of step S107 is shown in Fig. 11. Fig. 11 is a diagram showing an example of the distribution of the ejection amounts ejected from each ejection nozzle before the correction process is performed.

[0110] Moreover, the process of step S107 does not necessarily have to be performed based on the process of step S106. For example, a scale capable of measuring the weight of droplets with high accuracy may be separately provided in the coating processing apparatus 1, and the control unit 91 may measure the discharge amount of each discharge nozzle under the discharge conditions determined in the processes of steps S101 to S105 by discharging droplets of the functional liquid from each discharge nozzle onto the scale.

[0111] Returning to the description of Fig. 5, following the process of step S107, the control unit 91 derives correction parameters for the ejection conditions for each ejection nozzle based on the results of the measurement made in the process of step S107 (step S108).

[0112] The correction parameters for each ejection nozzle derived in the processing of step S108 are parameters that correct the ejection conditions for each ejection nozzle so as to reduce the difference in the total amount of functional liquid filled for each pixel of the substrate S (see FIG. 2).

[0113] For example, in the correction process according to the embodiment, first, the control unit 91 divides all the target ejection nozzles into a plurality of groups based on the ejection amount under the ejection conditions determined in the processes of steps S101 to S105. For example, as shown in Fig. 11, when the minimum ejection amount is A1 and the maximum ejection amount is A5, the control unit 91 divides the ejection nozzles into a plurality of groups (for example, four) by the ejection amount for all the target ejection nozzles.

[0114] For example, the control unit 91 assigns nozzles with ejection in the range of ejection amounts A1 to A2 to COM1, and nozzles with ejection in the range of ejection amounts A2 to A3 to COM2. Furthermore, the control unit 91 assigns nozzles with ejection in the range of ejection amounts A3 to A4 to COM3, and nozzles with ejection in the range of ejection amounts A4 to A5 to COM4. The ejection amounts A2, A3, and A4 are values ​​calculated, for example, by the following formulas (1) to (3). A2=A1+(A5-A1)×(1 / 4) ···(1) A3=A1+(A5-A1)×(1 / 2) ···(2) A4=A1+(A5-A1)×(3 / 4) ···(3)

[0115] That is, in the correction process according to the embodiment, as shown in FIG. 11, the control unit 91 divides all the target ejection nozzles into groups COM1 to COM4, ​​from the group with the smallest ejection amount to the group with the largest ejection amount.

[0116] The control unit 91 then corrects the drive voltage of each of the ejection nozzles belonging to COM1 to COM4 according to the group they belong to. For example, as shown in Fig. 12, for the ejection nozzles belonging to COM1, which is the group with the smallest ejection volume under the ejection conditions determined by the processing in steps S101 to S105, the drive voltage is corrected so that it becomes the highest (for example, a voltage that is 100% of the reference voltage Vh).

[0117] In addition, for nozzles with ejection that belong to COM2, a group that has a larger ejection volume than COM1 under the ejection conditions obtained by the processing of steps S101 to S105, the drive voltage is corrected so that it is lower than that of COM1 (for example, 97.5% of the reference voltage Vh).

[0118] In addition, for nozzles with ejection that belong to COM3, a group that has a larger ejection volume than COM2 under the ejection conditions obtained by the processing of steps S101 to S105, the drive voltage is corrected so that it is lower than that of COM2 (for example, 95.0% of the reference voltage Vh).

[0119] Furthermore, for the nozzles with ejection that belong to COM4, ​​which is the group with the greatest ejection volume under the ejection conditions determined by the processes in steps S101 to S105, the drive voltage is corrected so that it becomes the lowest (for example, 92.5% of the reference voltage Vh).

[0120] Returning to the explanation of Fig. 5, following the process of step S108 explained above, the control unit 91 determines whether or not the above-mentioned evaluation has been completed for all timings at which the functional liquid is ejected from the ejection head 63 onto the substrate S (step S109).

[0121] Then, when the above-mentioned various evaluations at all timings have been completed (Yes at step S109), a series of control processes is completed.

[0122] On the other hand, if the above-mentioned various evaluations at all timings have not been completed (step S109, No), the control unit 91 increments the counter n that counts the number of ejection processes in which ink is ejected at the same timing from the multiple nozzles 64 (step S110). Then, the process returns to step S102.

[0123] <Modification> Next, a control process according to a modification of the embodiment will be described with reference to Fig. 13 to Fig. 18. Fig. 13 is a flowchart showing an example of a process procedure of the control process executed by the coating processing apparatus 1 according to the modification of the embodiment.

[0124] As shown in FIG. 13, first, the control unit 91 (see FIG. 2) sets a counter n to 1 for counting the number of ejection processes in which ejection is performed at the same timing from multiple nozzles 64 (see FIG. 4) of the ejection head 63 (see FIG. 4) at the same time (step S201).

[0125] Next, the control unit 91 determines whether or not to eject the functional liquid from each nozzle 64 at the n-th timing based on data that defines the distribution of the desired functional liquid aggregate formed on the substrate S (step S202). The process of step S202 is another example of the first process.

[0126] Next, the control unit 91 creates ejection pattern data indicating the distribution of the presence or absence of ejection from the multiple nozzles 64 at the n-th timing based on the result of the process in step S202 (step S203).

[0127] Next, the control unit 91 determines whether or not the ejection pattern data created in the process of step S203 includes a given number or more (for example, six or more) of ejection nozzles arranged in succession (step S204). The process of step S204 is another example of the second process.

[0128] Then, when it is determined that the given number or more of ejection nozzles are lined up in succession (step S204, Yes), the control unit 91 sets the applied voltage to at least one non-ejection nozzle to a given voltage V1 (step S205). The process of step S205 is another example of the third process.

[0129] On the other hand, if it is determined that the given number or more of ejection nozzles are not consecutively arranged (step S204, No), the process proceeds to step S206, which will be described next.

[0130] Following the processing of step S205 described above, the control unit 91 operates the application unit 6 (see FIG. 2) and the inspection mechanism 7 (see FIG. 2), etc., to eject functional liquid from each ejection nozzle to the inspection mechanism 7 under the ejection conditions set in the processing of step S205 (step S206).

[0131] Next, the control unit 91 captures the droplets of the functional liquid discharged onto the inspection film 73 (see FIG. 2) of the inspection mechanism 7 with the imaging unit 74 (see FIG. 2) and analyzes the image capture result to determine the amount (volume, weight, etc.) of each droplet. In this way, the control unit 91 measures the discharge amount of each discharge nozzle (step S207). The process of step S207 is an example of the fourth process.

[0132] The details of the processing in steps S201 to S207 explained so far are similar to the processing in steps S101 to S107 described above, and therefore detailed explanations will be omitted.

[0133] Next, the control unit 91 compares the discharge rates of the multiple discharge nozzles calculated in the process of step S207 with representative data (representative discharge rates) of the discharge rates of the multiple discharge nozzles (step S208). The process of step S208 is an example of a fifth process.

[0134] 14 is a diagram showing an example of a representative distribution of the amount of functional liquid discharged from each nozzle 64 according to a modified example of the embodiment. This data is obtained, for example, by discharging the functional liquid from all nozzles 64 under uniform discharging conditions onto the inspection film 73 of the inspection mechanism 7, capturing images of all droplets of the functional liquid discharged onto the inspection film 73 with the imaging unit 74, and analyzing the captured images. This representative distribution of the amount of functional liquid discharged from each nozzle 64 is stored in advance, for example, in the storage unit 92 (see FIG. 2).

[0135] Then, in the process of step S208, the actual measurement value of the ejection rate of each ejection nozzle obtained in the process of step S207 is compared with the representative ejection rate of the same ejection nozzle.

[0136] Fig. 15 is a diagram showing an example of the distribution of the amount of functional liquid ejected from each ejection nozzle in a reference example. In this reference example, as shown in Fig. 15, a unique ejection pattern occurs in which nozzles that eject functional liquid at the same timing are consecutive, and nozzles that do not eject functional liquid are also consecutive, and the applied voltage is set to zero for all non-ejection nozzles.

[0137] Therefore, the ejection head 63 is significantly distorted, and therefore even for ejection nozzles with the same nozzle number, the actual measured ejection amount deviates significantly from the representative ejection amount shown in FIG.

[0138] Returning to the description of Fig. 13, the control unit 91 then determines whether or not the correlation function of the regression curve is equal to or greater than a given value (for example, 0.7) in the comparison data obtained by comparing the representative value of the discharge amount of the functional liquid from each discharge nozzle in the process of step S208 with the actual measurement value (step S209).

[0139] 16 is a diagram showing a comparison between the representative value and the actual measurement value of the amount of functional liquid discharged from each discharge nozzle in the reference example. As shown in FIG. 16, in the reference example, the correlation function R 2 is less than a given value (e.g., 0.7).

[0140] In this way, when the correlation function of the regression curve is not equal to or greater than the given value (step S209, No), the control unit 91 readjusts the voltage application conditions for the non-ejecting nozzles (step S210) and returns to the processing of step S206. The processing of step S210 is an example of the sixth processing.

[0141] In the processing of step S210, for example, the control unit 91 readjusts the number N2 of non-ejection nozzles whose applied voltage is set to voltage V1, the value of voltage V1 of the non-ejection nozzles, the distribution of the non-ejection nozzles whose applied voltage is set to voltage V1, etc.

[0142] Thus, in the modified example, when the voltage application conditions for the non-ejecting nozzles are not sufficiently optimized, causing the actual ejection volume of the ejecting nozzles to deviate significantly from the representative ejection volume, the control unit 91 readjusts the voltage application conditions for the non-ejecting nozzles.

[0143] This allows the actual coating process to be performed after the actual discharge amount of the discharge nozzles is brought close to the representative discharge amount, so that the quality of the coating process of the functional liquid on the substrate S can be further improved.

[0144] The correlation function R of the regression curve used in the process of step S209 2 The threshold value is not limited to 0.7, and can be changed in various ways depending on, for example, the number of nozzles 64, the interval between the nozzles 64, the material of the discharge head 63, the discharge method of the discharge head 63, and the like.

[0145] 17 is a diagram showing an example of the distribution of the discharge amount of the functional liquid from each discharge nozzle according to a modified example of the embodiment. In this modified example, as shown in FIG. 17, a unique discharge pattern similar to that in the reference example described above occurs, and the applied voltage is set to V1 for the non-discharge nozzles determined in the process of step S205.

[0146] Therefore, since distortion of the discharge head 63 is reduced, the actual measured values ​​of the discharge amounts are relatively consistent with respect to the representative discharge amounts shown in FIG. 14 for the discharge-enabled nozzles with the same nozzle number.

[0147] 18 is a diagram showing a comparison between the representative value and the actual measurement value of the amount of functional liquid ejected from each ejection nozzle according to the modified example of the embodiment. As shown in FIG. 18, in the modified example, the correlation function R 2 is greater than or equal to a given value (e.g., 0.7).

[0148] In this way, when the correlation function of the regression curve is equal to or greater than a given value (step S209, Yes), the control unit 91 derives correction parameters for the ejection conditions for each ejection nozzle based on the results measured in the process of step S207 (step S211). The process of step S211 is an example of a seventh process.

[0149] The details of the process in step S211 are similar to those of step S108 described above, and therefore will not be described in detail.

[0150] Next, the control unit 91 determines whether or not the above-mentioned evaluation has been completed for all timings at which the functional liquid is discharged from the discharge head 63 onto the substrate S (step S212).

[0151] Then, when the above-mentioned various evaluations at all timings have been completed (Yes at step S212), a series of control processes is completed.

[0152] On the other hand, if the above-mentioned various evaluations at all timings have not been completed (step S212, No), the control unit 91 increments the counter n that counts the number of ejection processes in which ink is ejected at the same timing from the multiple nozzles 64 (step S213). Then, the process returns to step S202.

[0153] The coating processing apparatus 1 according to the embodiment includes a substrate holding unit (substrate transport mechanism 4), a discharge head 63, and a control unit 91. The substrate holding unit (substrate transport mechanism 4) holds and moves a substrate S having a plurality of pixels. The discharge head 63 has a plurality of nozzles 64 arranged along a given direction (first direction D1), and discharges functional liquid from the plurality of nozzles 64 onto a plurality of pixels of the substrate S held by the substrate holding unit (substrate transport mechanism 4). The control unit 91 controls each unit. The control unit 91 also performs a first process (steps S102, S202), a second process (steps S104, S204), and a third process (steps S105, S205). In the first process (steps S102, S202), it is determined whether or not to discharge functional liquid from each nozzle 64 at one timing based on data that specifies the distribution of an aggregate of functional liquid formed on the substrate S. The second process (steps S104, S204) is created based on the determination results of the first process, and determines whether or not a given number or more of ejection nozzles determined to eject functional liquid are lined up in succession in ejection pattern data that indicates the distribution of the presence or absence of ejection of the multiple nozzles 64 at one timing. The third process (steps S105, S205) sets the voltage applied to at least one of the non-ejection nozzles determined not to eject functional liquid at one timing to a given voltage V1 that is greater than zero and does not eject functional liquid. This makes it possible to improve the quality of the coating process of the functional liquid on the substrate S.

[0154] Furthermore, in the coating processing apparatus 1 according to the embodiment, the control unit 91 sets the applied voltage to the non-ejection nozzles adjacent to a given number or more of the ejection nozzles arranged consecutively to a given voltage V1 in the third process (steps S105, S205). This makes it possible to improve the quality of the coating process of the functional liquid on the substrate S.

[0155] Furthermore, in the coating processing apparatus 1 according to the embodiment, in the third process (steps S105, S205), the control unit 91 increases the number N2 of non-discharge nozzles whose applied voltage is set to a given voltage V1 as the number N1 of a given number or more of consecutively arranged discharge nozzles increases. This makes it possible to improve the quality of the coating process of the functional liquid on the substrate S.

[0156] Furthermore, in the coating processing apparatus 1 according to the embodiment, the control unit 91 sets the applied voltages of all non-ejection nozzles to a given voltage V1 in the third process (steps S105 and S205). This can improve the quality of the coating process of the functional liquid on the substrate S.

[0157] In the coating processing apparatus 1 according to the embodiment, the control unit 91 increases the value of the given voltage V1 in the third process (steps S105 and S205) as the number N1 of the plurality of ejection nozzles that are consecutively arranged in a given number or more increases. This makes it possible to improve the quality of the coating process of the functional liquid on the substrate S.

[0158] In addition, in the coating processing apparatus 1 according to the embodiment, the control unit 91 further performs a fourth process (step S207), a fifth process (step S208), and a sixth process (step S210). The fourth process (step S207) determines the discharge amounts of the multiple discharge nozzles under the voltage application conditions determined in the third process (step S205). The fifth process (step S208) compares the discharge amounts of the multiple discharge nozzles determined in the fourth process with the representative discharge amounts of the multiple discharge nozzles stored in advance in the storage unit 92. The sixth process (step S210) readjusts the voltage application conditions of the non-discharge nozzles when the correlation function of the regression curve of the comparison results determined in the fifth process is less than a given value. This can further improve the quality of the coating process of the functional liquid on the substrate S.

[0159] Furthermore, in the coating processing apparatus 1 according to the embodiment, when the correlation function of the regression curve of the comparison result obtained in the fifth process (step S208) is equal to or greater than a given value, the control unit 91 further performs a seventh process (step S211). The seventh process (step S211) obtains correction parameters for the ejection conditions for each nozzle based on the result of the fourth process (step S207) so as to reduce the difference in the total amount of functional liquid filled for each pixel.

[0160] Furthermore, in the coating processing apparatus 1 according to the embodiment, the given voltage V1 is in the range of 10% to 60% of the reference voltage Vh of the applied voltage applied to the discharge nozzles. This prevents the functional liquid from being discharged from the non-discharge nozzles, and reduces distortion of the discharge head 63.

[0161] Furthermore, in the coating processing apparatus 1 according to the embodiment, the waveform of the voltage applied to the discharge nozzles is different from the waveform of the voltage applied to the non-discharge nozzles, thereby improving the quality of the coating processing of the functional liquid on the substrate S.

[0162] The coating method according to the embodiment includes a first process (steps S102 and S202), a second process (steps S104 and S204), and a third process (steps S105 and S205). In the first process (steps S102 and S202), the discharge head 63 determines whether or not to discharge the functional liquid from each nozzle 64 at one timing based on data that defines the distribution of the aggregate of the functional liquid formed on the substrate S. The discharge head 63 has a plurality of nozzles 64 aligned along a given direction (first direction D1), and discharges the functional liquid onto a plurality of pixels of the substrate S. In the second process (steps S104 and S204), it determines whether or not a given number or more of discharge nozzles determined to discharge the functional liquid are aligned in succession in discharge pattern data that is created based on the determination result in the first process and indicates the distribution of the presence or absence of discharge from a plurality of nozzles at one timing. In the third step (steps S105 and S205), if it is determined in the second step that there are a given number or more of ejection nozzles lined up in succession, the voltage applied to at least one of the non-ejection nozzles determined not to eject functional liquid at one timing is set to a given voltage V1 that is greater than zero and does not eject functional liquid. This makes it possible to improve the quality of the coating process of the functional liquid on the substrate S.

[0163] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments, and various modifications are possible without departing from the spirit of the present disclosure. For example, in the above embodiments, an example is shown in which the substrate transport mechanism 4 has a mechanism for adsorbing and holding the substrate S, but the present disclosure is not limited to such an example, and for example, the substrate transport mechanism for holding and transporting the substrate S may be a mechanism for transporting the substrate S while floating it.

[0164] The disclosed embodiments should be considered to be illustrative and not restrictive in all respects. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0165] 1 Coating treatment equipment 4. Substrate transport mechanism (an example of a substrate holder) 9. Control Device 63 Discharge Head 64 Nozzles 91 Control Unit 92 Memory section D1 First direction (an example of a given direction) N1, N2 Number S-substrate V1 voltage (example of given voltage) Vh Reference voltage

Claims

1. a substrate holding unit that holds and moves a substrate having a plurality of pixels; an ejection head having a plurality of nozzles aligned along a given direction, and ejecting functional liquid from the plurality of nozzles onto the plurality of pixels of the substrate held by the substrate holding unit; A control unit for controlling each unit; Equipped with The control unit is a first process for determining whether or not to eject the functional liquid from each of the nozzles at one timing based on data that defines a distribution of the aggregate of the functional liquid formed on the substrate; a second process for determining whether or not a given number or more of ejection nozzles determined to eject the functional liquid are arranged consecutively in ejection pattern data that is created based on a result of the determination in the first process and indicates a distribution of the presence or absence of ejection from the plurality of nozzles at the one timing; a third process for setting a voltage applied to at least one of the non-ejection nozzles determined not to eject the functional liquid at the one timing to a given voltage that is greater than zero and at which the functional liquid is not ejected, when it is determined in the second process that the ejection nozzles are lined up in succession in a predetermined number or more. Coating processing equipment.

2. The control unit is In the third process, the applied voltage to the non-ejection nozzles adjacent to the plurality of ejection nozzles that are successively arranged in the given number or more is set to the given voltage. The coating treatment device according to claim 1 .

3. The control unit is In the third process, as the number of the plurality of ejection nozzles that are successively arranged in the given number or more increases, the number of the non-ejection nozzles whose applied voltage is set to the given voltage is increased. The coating treatment device according to claim 2 .

4. The control unit is In the third process, the applied voltage to all of the non-ejecting nozzles is set to the given voltage. The coating treatment device according to claim 3 .

5. The control unit is In the third process, the value of the given voltage is increased as the number of the plurality of ejection nozzles that are consecutively arranged in the given number or more increases. The coating treatment device according to any one of claims 1 to 4.

6. The control unit is a fourth process for calculating ejection amounts of the plurality of ejection nozzles under the voltage application conditions calculated in the third process; a fifth process for comparing the ejection rates of the plurality of ejection nozzles obtained in the fourth process with representative ejection rates of the plurality of ejection nozzles stored in a storage unit in advance; If the correlation function of the regression curve of the comparison result obtained in the fifth process is less than a given value, a sixth process is further performed to readjust the voltage application conditions of the non-ejecting nozzles. The coating treatment device according to any one of claims 1 to 4.

7. The control unit is When the correlation function of the regression curve of the comparison result obtained in the fifth process is equal to or greater than a given value, a seventh process is further performed to obtain a correction parameter for the ejection condition for each of the nozzles based on the result of the fourth process so as to reduce the difference in the total amount of the functional liquid filled for each of the pixels. The coating treatment apparatus according to claim 6 .

8. The given voltage is in the range of 10% to 60% of the reference voltage of the applied voltage applied to the ejection nozzle. The coating treatment device according to any one of claims 1 to 4.

9. The waveform of the voltage applied to the ejection nozzles is different from the waveform of the voltage applied to the non-ejection nozzles. The coating treatment device according to any one of claims 1 to 4.

10. a first step of determining whether or not to eject functional liquid from each of the nozzles at one timing in a discharge head having a plurality of nozzles aligned along a given direction and configured to discharge functional liquid onto a plurality of pixels of a substrate, based on data defining a distribution of an aggregate of the functional liquid formed on the substrate; a second step of determining whether or not a given number or more of ejection nozzles determined to eject the functional liquid are arranged in succession in ejection pattern data that is created based on the determination results in the first step and indicates a distribution of the presence or absence of ejection from the plurality of nozzles at the one timing; a third step of setting a voltage applied to at least one of the non-ejection nozzles determined not to eject the functional liquid at the one timing, when it is determined in the second step that the ejection nozzles are lined up in succession in a predetermined number or more, to a predetermined voltage that is greater than zero and does not eject the functional liquid; A coating treatment method comprising the steps of:

11. The third step comprises: The voltage applied to the non-ejection nozzles adjacent to the plurality of ejection nozzles that are successively arranged in the given number or more is set to the given voltage. The coating method according to claim 10.

12. The third step comprises: As the number of the plurality of ejection nozzles that are successively arranged in the given number or more increases, the number of the non-ejection nozzles whose applied voltage is set to the given voltage is increased. The coating method according to claim 11.

13. The third step comprises: The applied voltage of all the non-ejecting nozzles is set to the given voltage. The coating method according to claim 12.

14. The third step comprises: The value of the given voltage is increased as the number of the plurality of ejection nozzles that are consecutively arranged in the given number or more increases. The coating method according to any one of claims 10 to 13.

15. a fourth step of determining the ejection amounts of the plurality of ejection nozzles under the voltage application conditions determined in the third step; a fifth step of comparing the ejection rates of the plurality of ejection nozzles determined in the fourth step with representative ejection rates of the plurality of ejection nozzles stored in a storage unit in advance; and a sixth step of re-adjusting the voltage application conditions for the non-ejecting nozzles when the correlation function of the regression curve of the comparison result obtained in the fifth step is less than a given value. The coating method according to any one of claims 10 to 13.

16. and a seventh step of determining, based on the result of the fourth step, a correction parameter for the ejection conditions for each of the nozzles such that a difference in the total amount of the functional liquid filled for each of the pixels is reduced when the correlation function of the regression curve of the comparison result determined in the fifth step is equal to or greater than a given value. The coating method according to claim 15.

17. The given voltage is in the range of 10% to 60% of the reference voltage of the applied voltage applied to the ejection nozzle. The coating method according to any one of claims 10 to 13.

18. The waveform of the voltage applied to the ejection nozzles is different from the waveform of the voltage applied to the non-ejection nozzles. The coating method according to any one of claims 10 to 13.

19. a substrate holding unit that holds and moves a substrate having a plurality of pixels; an ejection head having a plurality of nozzles aligned along a given direction, and ejecting functional liquid from the plurality of nozzles onto the plurality of pixels of the substrate held by the substrate holding unit; For a coating treatment device equipped with a first step of determining whether or not to eject the functional liquid from each of the nozzles at one timing based on data that defines a distribution of the aggregate of the functional liquid formed on the substrate; a second step of determining whether or not a given number or more of ejection nozzles determined to eject the functional liquid are arranged consecutively in ejection pattern data that is created based on a result of the determination in the first step and indicates a distribution of the presence or absence of ejection from the plurality of nozzles at the one timing; a third step of setting a voltage applied to at least one of the non-ejection nozzles determined not to eject the functional liquid at the one timing to a given voltage that is greater than zero and does not eject the functional liquid when it is determined in the second step that the ejection nozzles are lined up in succession in a predetermined number or more. Coating treatment program.

20. A computer-readable storage medium storing a program that operates on a computer and controls a coating treatment device, The program causes a computer to control the coating processing device so as to perform the coating processing method according to any one of claims 10 to 13 when the program is executed. storage medium.

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