Processing device

Abstract

To provide a processing device that can prevent processing defects in advance.SOLUTION: A grinding and polishing device 1 includes: a holding table 9 that holds a workpiece 200; a processing unit 400 that processes the workpiece held by the holding table 9; an inspection unit 500 that inspects the processing quality of the workpiece 200 processed by the processing unit 400; and a control unit 100. The control unit 100 includes: a processing condition storage part 1021 that stores processing conditions by the processing unit 400; an inspection result storage part 1022 that stores the inspection result of the inspection unit 500; a data creation part 1011 that creates data associating multiple inspection results using the same processing conditions with a time series; and an output part 1012 that outputs at least part of the data to an arbitrary monitor 600.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] In order to prevent processing defects, a method has been adopted in which after processing, a product is inspected before being sent to the next process, and defective products are removed, or the processing quality is inspected and if it does not meet a standard value, the product is reprocessed. As a method for inspecting processing quality, a method is known in which after a grinding step, a polishing step is performed in which the workpiece is polished by a polishing means, and after this polishing step, the thickness variation of the workpiece is measured (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-093517 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the conventional technology, although it is possible to remove defective workpieces before they become final products, it is not possible to prevent the occurrence of defective processing. Therefore, there is a problem to be solved, which is to prevent defective processing in advance.

[0005] The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a processing device capable of preventing processing defects before they occur. [Means for solving the problem]

[0006] The processing apparatus of the present invention is a processing apparatus comprising a holding table for holding a workpiece, a processing unit for processing the workpiece held on the holding table, an inspection unit for inspecting the processing quality of the workpiece processed by the processing unit, and a control unit, and the control unit comprises a processing condition memory section for storing processing conditions used by the processing unit, an inspection result memory section for storing inspection results used by the inspection unit, a data creation section for creating multiple data linking the inspection results processed under the same processing conditions with the time when the workpiece was processed by the processing unit, and an output section for outputting at least a portion of the data to an arbitrary monitor.

[0007] The processing device of the present invention may further include a notification unit that recommends inspection of the processing device when the inspection results fluctuate by a range or rate equal to or greater than a threshold value within a predetermined period of time.

[0008] In the processing apparatus of the present invention, the data creation unit may create first data linking the inspection results processed under first processing conditions with the time when the processing was performed by the processing unit, and second data linking the inspection results processed under second processing conditions with the time when the processing was performed by the processing unit.

[0009] In the processing device of the present invention, the notification unit may recommend inspection of the processing device when the inspection results under two or more types of processing conditions fluctuate in the same direction, either improving or worsening, by a range or percentage equal to or greater than a threshold value.

[0010] In the processing apparatus of the present invention, the notification unit may recommend inspection of the processing condition that fluctuates by a range or percentage equal to or greater than the threshold value when either of the inspection results fluctuates by a range or percentage equal to or greater than the threshold value under two or more types of processing conditions.

[0011] In the processing apparatus of the present invention, the processing unit may be a grinding unit that grinds a workpiece, and the inspection unit may be a measuring device that measures the variation in thickness of the workpiece ground by the grinding unit.

[0012] In the processing apparatus of the present invention, the processing unit may be a polishing unit that polishes a workpiece, and the inspection unit may be a measuring device that measures the variation in thickness of the workpiece polished by the polishing unit.

[0013] In the processing apparatus of the present invention, the processing unit is a cutting unit that cuts the workpiece, and the inspection unit is an imaging unit that images the cutting groove by the cutting unit, and may measure at least one of the values ​​of the size or number of chippings generated in the cutting groove. Effect of the Invention

[0014] According to the present invention, processing defects can be prevented before they occur. [Brief description of the drawings]

[0015] [Figure 1] 1 is a perspective view of a configuration example of a processing device according to an embodiment of the present invention; [Diagram 2] 2 is a plan view of a configuration example of an inspection unit of the processing apparatus shown in FIG. 1. [Diagram 3] FIG. 2 is a diagram illustrating an example of a functional configuration of a control unit according to the present embodiment. [Figure 4] FIG. 13 is a diagram showing a graph created as an example of data output by an output unit. [Diagram 5] FIG. 13 is a diagram showing a graph created as an example of data output by an output unit. [Figure 6] FIG. 2 illustrates an example of a processing device and corresponding example inspection results. [Figure 7] FIG. 11 is a diagram showing an example of the inspection result in a table format as an example of the inspection result. [Figure 8] FIG. 8 is a diagram showing an example of the inspection results in the tabular form of FIG. 7 in a graph form. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The processing device according to the present embodiment will be described with reference to Figs. 1 to 8. Fig. 1 is a perspective view of a configuration example of the processing device according to the present embodiment. Fig. 2 is a plan view of a configuration example of an inspection unit of the processing device shown in Fig. 1. Fig. 3 is a diagram showing an example of a functional configuration of a control unit of this embodiment. Figs. 4 and 5 are diagrams showing graphs created as an example of data output by an output unit. Fig. 6 is a diagram showing an example of a processing device and an example of corresponding inspection results. Fig. 7 is a diagram showing an example of inspection results in a table format as an example of the inspection results. Fig. 8 is a diagram showing an example of the inspection results in a graph format from the tabular format of Fig. 7.

[0017] The X-axis, Y-axis, and Z-axis directions shown in each figure are perpendicular to each other. The X-axis and Y-axis directions are approximately horizontal, and the Z-axis direction is up-down (vertical). In each figure, of the two arrows indicating the Y-axis direction, the -Y side is the left, and the +Y side is the right. Of the two arrows indicating the X-axis direction, the -X side is the front, and the +X side is the rear. Of the two arrows indicating the Z-axis direction, the +Z side is the up, and the -Z side is the down.

[0018] The processing apparatus processes a workpiece such as a semiconductor wafer. The processing apparatus can be used for processing the workpiece in a cutting apparatus, a grinding apparatus, a polishing apparatus, a grinding and polishing apparatus, a plasma processing apparatus, a laser processing apparatus, a bit cutting apparatus, a tape application apparatus, a tape peeling apparatus, or the like. In this embodiment, a grinding and polishing apparatus 1 will be used as an example of the processing apparatus. FIG. 1 is a diagram showing the grinding and polishing apparatus 1 which will be described as an example of the processing apparatus.

[0019] The workpiece 200 to be processed by the grinding and polishing apparatus 1 is, for example, a disk-shaped semiconductor wafer made of silicon as a base material, or an optical device wafer made of sapphire, SiC (silicon carbide), or the like. As shown in Fig. 1, the workpiece 200 has a protective member 205 attached to a front surface 202, and the back surface 201 of the workpiece 200 is ground by the grinding and polishing apparatus 1 to be thinned to a predetermined thickness, and then the back surface 201 is polished. The protective member 205 is formed in a disk shape of the same size as the workpiece 200, and is made of a flexible synthetic resin.

[0020] As shown in FIG. 1, the grinding / polishing apparatus 1 mainly includes an apparatus main body 2, a rough grinding unit 3, a finish grinding unit 4, a polishing unit 5, four holding tables 9 (91-94) installed on a turntable 8, a thickness measuring unit 10, cassettes 11 and 12, a position table 13, a transport arm 15, a robot pick 16, a spinner cleaning device 17, and a control unit 100. The grinding / polishing apparatus 1 is an example of a processing apparatus. The rough grinding unit 3, the finish grinding unit 4, and the polishing unit 5 are examples of a processing unit 400. The thickness measuring unit 10 is an example of an inspection unit 500. The rough grinding unit 3 and the finish grinding unit 4 are examples of a grinding unit. The thickness measuring unit 10 is an example of a measuring device that measures the thickness variation of the workpiece 200 ground by the grinding unit.

[0021] The grinding and polishing apparatus 1 is a fully automatic type processing apparatus, and is configured to perform a series of operations, consisting of rough grinding, finish grinding, polishing, cleaning, and loading / unloading, on the workpiece 200, fully automatically under the control of the control unit 100.

[0022] The rough grinding unit 3 includes a disk-shaped wheel mount 32 attached to the lower end of the spindle 31, and a rough grinding wheel 33 attached to the lower surface of the wheel mount 32. The rough grinding wheel 33 has a number of grinding wheels (not shown) for rough grinding, which are arranged in an annular shape and fixed to the lower surface of the wheel mount 32. The rough grinding unit 3 is arranged so as to be movable up and down relative to the holding table 9. The rough grinding unit 3 rotates the rough grinding wheel 33 via the spindle 31, and presses the grinding wheels against a back surface 201 of the workpiece 200 held on the holding table 9, thereby roughly grinding the back surface 201 of the workpiece 200.

[0023] The finish grinding unit 4, like the rough grinding unit 3, includes a disk-shaped wheel mount 42 attached to the lower end of the spindle 41, and a finish grinding wheel 43 attached to the lower surface of the wheel mount 42. The finish grinding wheel 43 has a number of grinding wheels for finish grinding, which are arranged in a ring shape and fixed to the lower surface of the wheel mount 42. The grinding wheels for finish grinding are formed by binding abrasive grains having a finer particle size with a binder, compared to the grinding wheels for rough grinding. The finish grinding unit 4, like the rough grinding unit 3, is arranged so as to be movable up and down relative to the holding table 9. The finish grinding unit 4 performs finish grinding on the back surface 201 of the workpiece 200 held on the holding table 9 by pressing the grinding wheels against the back surface 201 of the workpiece 200 while rotating the finish grinding wheel 43 around a rotation axis (not shown) via the spindle 41.

[0024] The polishing unit 5 includes a polishing pad attached to the lower end of the spindle via a polishing mount. The polishing pad of the polishing unit 5 rotates together with the spindle and presses against the back surface 201 of the workpiece 200 after finish grinding, which is held on the holding table 9, thereby polishing the back surface 201 of the workpiece 200.

[0025] The polishing unit 5 is configured to be movable in a horizontal direction (X-axis direction in FIG. 1) and a vertical direction (Z-axis direction in FIG. 1). Although not shown, the polishing unit 5 is connected to a processing liquid supply unit that selectively supplies a polishing liquid or a cleaning liquid to the back surface 201 of the workpiece 200 during polishing.

[0026] 1, the turntable 8 is a disk-shaped table provided on the upper surface of the apparatus body 2, is provided so as to be rotatable in the horizontal direction (the direction of the arrow R in the figure), and is rotationally driven at a predetermined timing. On the turntable 8, for example, four holding tables 9 (91-94) are arranged at equal intervals, for example, at a phase angle of 90 degrees. Also, on the turntable 8, for example, a thickness measuring unit 10 is provided for measuring the thickness of the workpiece 200 after polishing.

[0027] The thickness measuring unit 10 includes a support 211 erected on the turntable 8, an arm 212 extending horizontally from the upper end of the support 211, and a measuring head 213 fixed to the tip of the arm 212. The measuring head 213, for example, emits ultrasonic waves toward the rear surface 201 of the workpiece 200 and measures the height position of the rear surface 201 of the workpiece 200 from the reflection time. In this case, since the distance from the measuring head 213 to the holding table 9 is measured in advance and known, the thickness of the workpiece 200 can be measured from the difference value between the measured height position and the distance from the rear surface 201. In this embodiment, as shown in FIG. 2, the thickness measuring unit 10 moves the measuring head 213 in an arc shape (arrow RA) in a radial region on one side from the center 2001 to the outer periphery 2002 of the workpiece 200 so as to pass through the center of the workpiece 200, measures the thickness at multiple points (for example, three points) of the moving trajectory, and transmits the thickness to the control unit 100. Based on the received measurement values, the control unit 100 calculates the overall cross-sectional shape by regarding the opposite radial area of ​​the workpiece 200 as a symmetrical shape. The thickness measuring unit 10 may perform the measurement by rotating the holding table 9.

[0028] The holding table 9 has a holding surface (not shown) that holds the front surface 202 side of the workpiece 200 via a protective member 205. The holding table 9 has a structure that includes a vacuum chuck on the holding surface, and holds the workpiece 200 placed on the holding surface by vacuum suction.

[0029] The holding table 9 is rotated by a motor (not shown) during grinding and polishing. As the turntable 8 rotates, the holding tables 91 to 94 move around the loading / unloading area A, the rough grinding area B, the finish grinding area C, and the polishing area D in that order, as shown in FIG.

[0030] 1, the cassettes 11 and 12 are containers for the workpiece 200 having a plurality of slots. One cassette 11 accommodates the workpiece 200 before grinding and polishing, and the other cassette 12 accommodates the workpiece 200 after polishing. The position table 13 is a table on which the workpiece 200 removed from the cassette 11 is temporarily placed and its center is aligned.

[0031] The transport arm 15 is configured to be movable in the horizontal direction (Y-axis direction), and transports the workpiece 200 before grinding and polishing that is placed on the position table 13, and places it on the holding table 91 located in the load-in / load-out area A. The transport arm 15 also transports the polished workpiece 200 that is placed on the holding table 91 located in the load-in / load-out area A again, and places it on the spinner table of the spinner cleaning device 17.

[0032] The robot pick 16 has a wafer holding part (e.g., a U-shaped hand) 161, and this wafer holding part 161 adsorbs and holds the workpiece 200 and transports it. Specifically, the robot pick 16 transports the workpiece 200 before grinding and polishing from the cassette 11 to the position table 13. In addition, the robot pick 16 transports the workpiece 200 after polishing from the spinner cleaning device 17 to the cassette 12. The spinner cleaning device 17 cleans the workpiece 200 after polishing to remove contamination such as grinding dust and polishing dust adhering to the ground and polished processed surface.

[0033] The control unit 100 controls each of the above-mentioned components constituting the grinding and polishing apparatus 1. That is, the control unit 100 causes the grinding and polishing apparatus 1 to perform a grinding and polishing operation on the workpiece 200. The functional configuration of the control unit 100 of the present invention will be described with reference to FIG. 3. The control unit 100 is a computer capable of executing a computer program. The control unit 100 has a control unit 101 having a microprocessor such as a CPU (central processing unit), a storage unit 102 having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device 103. The control unit 101 executes the computer program stored in the ROM on the RAM to generate a control signal for controlling the grinding and polishing apparatus 1, and the generated control signal is output to each component of the grinding and polishing apparatus 1 via the input / output interface device 103.

[0034] 3, the control unit 101 of the control unit 100 includes a data creation unit 1011, an output unit 1012, and a notification unit 1013. The storage unit 102 of the control unit 100 includes a processing condition storage unit 1021, and an inspection result storage unit 1022.

[0035] The control unit 100 is connected to a processing unit 400, an inspection unit 500, and a monitor 600 via an input / output interface device 103. The processing unit 400 is, for example, the rough grinding unit 3, the finish grinding unit 4, and the polishing unit 5 described in Fig. 1. The inspection unit 500 is, for example, the thickness measuring unit 10 described in Fig. 1.

[0036] The monitor 600 is a display device such as an LCD or an organic EL display. In this embodiment, the monitor 600 is connected to the grinding and polishing apparatus 1, which is an example of a processing apparatus, via the input / output interface device 103. In the above-described embodiment, the monitor 600 is connected to the processing apparatus, but this is not limited thereto, and the monitor 600 may be connected to another apparatus (not shown) connected through a wired or wireless communication line, or may be a display device formed integrally with the other apparatus.

[0037] The processing units 400 process the workpiece 200 held on the holding table 9. The rough grinding unit 3, the finish grinding unit 4, and the polishing unit 5, which are examples of the processing units 400, process the workpiece 200 held on the holding table 9 by grinding and polishing the workpiece 200.

[0038] The inspection unit 500 inspects the processing quality of the workpiece 200 processed by the processing unit 400. The thickness measuring unit 10, which is an example of the inspection unit 500, inspects the processing quality of the workpiece 200 by measuring the thickness of the workpiece 200.

[0039] The machining condition storage unit 1021 stores machining conditions for the machining unit 400. For example, the machining condition storage unit 1021 stores machining conditions for the workpiece 200 for each device constituting the machining unit 400. In this embodiment, for example, machining conditions are stored for each of the rough grinding unit 3, the finish grinding unit 4, and the polishing unit 5 constituting the machining unit 400.

[0040] The inspection result storage unit 1022 stores the inspection results by the inspection unit 500. For example, the inspection result storage unit 1022 stores the inspection results when the workpiece 200 is processed under the processing conditions stored in the processing condition storage unit 1021 for each device constituting the processing unit 400.

[0041] The data creation unit 1011 creates a plurality of data items by linking the inspection results obtained under the same processing conditions with the time when the workpiece 200 was processed by the processing unit 400. For example, the data creation unit 1011 selects processing conditions for which an instruction is received based on the operation of an operator of the grinding and polishing apparatus 1 from among the conditions stored in the processing condition storage unit 1021. Then, the data creation unit 1011 selects the inspection results corresponding to the selected processing conditions from the inspection result storage unit 1022. In this case, the data creation unit 1011 creates a plurality of data items by linking the inspection results obtained using the same processing conditions with the date and time when the workpiece 200 was processed.

[0042] The data created by the data creation unit 1011 can be expressed in any format, such as character strings, graphs, tables, logs, messages, etc. The data creation unit 1011 can create data of at least one of character strings, graphs, tables, logs, messages, etc., or a combination of these.

[0043] The data creation unit 1011 creates first data linking the inspection results of processing under the first processing conditions with the time when processing was performed by the processing unit 400, and second data linking the inspection results of processing under the second processing conditions with the time when processing was performed by the processing unit 400. This makes it possible to distinguish whether the problem is an abnormality in a processing device such as the grinding / polishing device 1 or whether inappropriate processing conditions have been set.

[0044] For example, if both the first data linking the inspection result processed under the first processing condition with the time when the processing was performed by the processing unit 400 and the second data linking the inspection result processed under the second processing condition with the time when the processing was performed by the processing unit 400 are abnormal, that is, if both the processing results under two or more processing conditions have deteriorated or improved, multiple abnormalities occur despite the change in processing conditions, so it can be determined that the processing conditions are not inappropriate but that the processing device itself is abnormal. On the other hand, if only one of the first data linking the inspection result processed under the first processing condition with the time when the processing was performed by the processing unit 400 or the second data linking the inspection result processed under the second processing condition with the time when the processing was performed by the processing unit 400 is abnormal, it can be determined that the processing conditions are inappropriate because no abnormality occurs under one of the processing conditions. In this way, by outputting the quality trends under two or more processing conditions to the monitor 600, it is possible to determine whether the deterioration is due to the processing conditions or the processing device and to investigate the cause.

[0045] The output unit 1012 outputs at least a part of the data created by the data creation unit 1011 in chronological order to any one of the monitors 600. The data output by the output unit 1012 may be any one or more of a character string, a graph, a table, a log, and a message, or a combination of these.

[0046] In the above embodiment, the output unit 1012 outputs data to the monitor 600 connected to the grinding / polishing apparatus 1, but this is not a limitation. For example, the data may be sent to a monitor connected to a server (not shown) or to a monitor of another communication device such as a smartphone for output. This allows for flexible design without being limited by the device configuration of the processing apparatus.

[0047] The notification unit 1013 recommends inspection of the grinding and polishing device 1 if the inspection result fluctuates within a predetermined period of time with a fluctuation width (width) or fluctuation rate (rate of change) equal to or greater than a threshold value. The predetermined period used by the notification unit 1013 to make a recommendation can be set to any time based on the operation of the operator. Fluctuations with a width or rate equal to or greater than a threshold value include both improvement and deterioration of the inspection result.

[0048] The notification unit 1013 may determine whether the fluctuation is greater than or equal to a threshold value based on the number of processed workpieces 200 converted into a predetermined period. For example, the number of processed workpieces 200 for 100 sheets may be estimated and set as the predetermined period. The deterioration of the inspection result includes a state in which the value fluctuates beyond an expected range.

[0049] For example, if the inspection result is approaching the threshold value even though a predetermined period has not yet elapsed, it is assumed that the inspection result is deteriorating. In this case, the notification unit 1013 displays a message on the monitor 600 recommending inspection of the grinding / polishing apparatus 1. This makes it possible to make the operator aware of the abnormality of the grinding / polishing apparatus 1, which is a processing device. As a result, it is possible to prevent processing defects from occurring.

[0050] Also, when edge chipping of the grinding / polishing apparatus 1 decreases, it is possible that the grindstone has become dull and is not being properly ground. Therefore, even if the inspection result has improved, if the variation is greater than or equal to the threshold value within a predetermined period, some abnormality may occur. Therefore, even if the result has improved, the notification unit 1013 displays a message on the monitor 600 recommending inspection of the grinding / polishing apparatus 1. This makes it possible to make the worker aware of the abnormality of the grinding / polishing apparatus 1, which is a processing device. As a result, processing defects can be prevented in advance.

[0051] For example, the total thickness variation (TTV) of the workpiece 200 of the grinding and polishing apparatus 1 will be described as an example of the inspection result. TTV refers to the difference between the maximum and minimum thickness values ​​in the flatness application area of ​​the wafer. TTV is an example of the thickness variation of the workpiece 200. When calculating the inspection result based on TTV, the purpose is to detect the direction of deterioration with respect to the reference value. Therefore, the notification unit 1013 judges whether or not the result deviates from +○ nm or +○ % based on the initial processing.

[0052] If the result deviates from an absolute value such as +○nm based on the initial processing, an absolute value indicated by |maximum value-minimum value|, or a percentage expressed as +○%, the notification unit 1013 determines that there is an error, and displays a message on the monitor 600 recommending inspection of the grinding and polishing apparatus 1.

[0053] For example, we will explain the variation range when the average TTV of the workpieces 200 contained in the first cassette is 2 nm, the average TTV of the workpieces 200 contained in the tenth cassette is 1 nm, and the average TTV of the workpieces 200 contained in the 25th cassette is 5 nm.

[0054] Considering the fluctuation range of the 25th cassette, it is calculated using the absolute values ​​below. |5nm (TTV of 25th cassette)-2nm (TTV of 1st cassette)| As a result, the fluctuation range of the 25th cassette is calculated to be 3 nm.

[0055] In addition, considering the fluctuation range of the first cassette, it is calculated using the following absolute values. |1nm (TTV of 10th cassette)-5nm (TTV of 25th cassette)| As a result, the fluctuation range of the 10th cassette is calculated to be 4 nm.

[0056] For example, a fluctuation rate (rate of change) will be described when the average TTV of the workpieces 200 contained in the first cassette is 1 nm and the average TTV of the workpieces 200 contained in the 25th cassette is 10 nm.

[0057] Considering the fluctuation rate (rate of change) of the 25th cassette, it is calculated by the following formula 1. 1 nm (TTV of the 1st cassette) / 10 nm (TTV of the 25th cassette) (Equation 1) As a result, the fluctuation rate for the 25th cassette is calculated to be 10%.

[0058] As described above, the notification unit 1013 notifies the user that an inspection is recommended if the fluctuation range or the rate of fluctuation of the inspection result exceeds a preset threshold value. This prevents the occurrence of defects in the product as a result of actual processing due to the fluctuation range or rate of fluctuation of the inspection result such as TTV exceeding the threshold value for detecting product defects (processing defects), and more reliably prevents defects due to processing from occurring compared to a case where a judgment is simply based on a threshold value for judging a product defect (processing defect).

[0059] Next, a description will be given of an example of data output by the output unit 1012. As shown in Fig. 4 and Fig. 5, a graph of TTV (maximum wafer thickness - minimum wafer thickness) showing the thickness variation of the wafer after grinding for each processing condition is output to the monitor 600.

[0060] 4 and 5, the horizontal axis indicates the workpiece number when one cassette containing 25 workpieces 200 is processed, and the vertical axis indicates the TTV of the workpieces 200 for each workpiece number. In FIGS. 4 and 5, the dotted line s1 is the threshold value for detecting product defects (processing defects). In FIGS. 4 and 5, the solid line t1 is a value indicating the TTV which is the inspection result (processing result) of the first cassette (first 25 pieces). In FIGS. 4 and 5, the solid line t2 is a value indicating the TTV which is the inspection result (processing result) of the 25th cassette (last 25 pieces).

[0061] 4(1), (2), and (3) show the transition of TTV under processing conditions a, b, and c, respectively. As shown in FIG. 4(1), (2), and (3), the TTV value is larger for the 25th cassette than for the 1st cassette under all processing conditions. That is, under all processing conditions, the inspection results fluctuate in the same manner, that is, the results deteriorate at a rate of fluctuation equal to or greater than the threshold value. Since multiple inspection results deteriorate despite different processing conditions being set, the notification unit 1013 determines that an abnormality has occurred in the grinding / polishing device 1, which is the processing device, and outputs a message to the monitor 600 recommending inspection of the processing device. This allows the operator or manager of the processing device to quickly notice the abnormality in the processing device.

[0062] 5(1), (2), and (3) show the transition of TTV under processing conditions a, b, and c, respectively. As shown in FIG. 5(1), under processing condition a, the TTV value is larger for the 25th cassette than for the 1st cassette, so the inspection result tends to deteriorate at a rate of change equal to or greater than the threshold value. On the other hand, as shown in FIG. 5(2), under processing condition b, the TTV value is smaller for the 25th cassette than for the 1st cassette, so the inspection result tends to improve at a rate of change equal to or greater than the threshold value. On the other hand, as shown in FIG. 5(3), under processing condition b, the TTV value is almost the same between the 1st cassette and the 25th cassette, so the inspection result tends to be constant. In this way, even when different processing conditions are set, only the inspection result under processing condition a tends to deteriorate in accordance with the processing conditions. Therefore, the notification unit 1013 determines that the processing condition a is incorrect, not that there is an abnormality in the grinding and polishing device 1, which is the processing device, and outputs a message recommending inspection of processing condition a to the monitor 600. This enables the operator or manager of the processing device to quickly notice any improper settings of the processing conditions.

[0063] The following factors are considered to be the causes of deterioration of the TTV during processing by the grinding and polishing device 1 as a processing device. Since the cause is not known, the worker needs to inspect it, but early detection of abnormalities is important for production management. Clogging of the holding table 9 due to contamination such as grinding debris and polishing debris, and accumulation of contamination on the outer periphery of the holding table 9. Deterioration of the wheel segment condition, e.g. changes in grinding load. Change in the inclination of the holding table 9 due to heat or some other factor. Deterioration of TTV due to uneven thickness of the BG (back grind) tape attached to the workpiece 200.

[0064] Therefore, in this embodiment, the notification unit 1013 is configured to recommend inspection of the processing device when the respective inspection results under two or more types of processing conditions fluctuate in the same direction of either improvement or deterioration by a range or ratio equal to or greater than a threshold value.

[0065] On the other hand, if the inspection results for either of two or more types of processing conditions fluctuate by a range or percentage equal to or greater than the threshold value, it is recommended to check the processing conditions that fluctuate by a range or percentage equal to or greater than the threshold value. This makes it possible to identify factors that cause deterioration such as TTV and prevent processing defects before they occur.

[0066] In the above-mentioned embodiment, the transition of the inspection results processed under the same processing conditions is output to the monitor 600, so that if the operator finds a large variation in the inspection results, he or she can take action before a product defect occurs, such as by stopping processing and inspecting the equipment. Also, since the inspection results under the same processing conditions are expected to be almost the same, by checking the change in the inspection results, even if an abnormality occurs in a location that cannot be monitored by a sensor or camera, it is possible to detect any change that may affect the product.

[0067] In the above-mentioned embodiment, as shown in Figures 4 and 5, each inspection result does not exceed the dotted line s1, which is the threshold value "170" for detecting product defects (processing defects), so that even if the inspection results gradually deteriorate, the conventional technology that judges only by the threshold value for detecting product defects (processing defects) cannot find an abnormality in production management. In contrast, in this embodiment, if the fluctuation range or the fluctuation rate of the inspection results exceeds a preset threshold value, a notification is issued recommending inspection, so that even within a range that is judged to be acceptable only by the threshold value for detecting product defects (processing defects), the user can notice the gradual deterioration, and it is possible to more reliably prevent defects from occurring through actual processing.

[0068] In the embodiment of Figures 4 and 5, the TTV of the workpiece 200 of the grinding and polishing apparatus 1 is described as an example of the inspection result, but this is not limited to this, and for example, as shown in Figure 6, the inspection results of various processing apparatuses may be targeted.

[0069] For example, as shown in Fig. 6, when a cutting device or a plasma processing device is used as the processing device, the number and size of chippings generated on the edge of the processed groove, the width of the processed groove, etc. can be used as the inspection result. When a polishing device is used as the processing device, the thickness variation (TTV) of the workpiece 200, etc. can be used as the inspection result. When a grinding device is used as the processing device, the number and size of chippings on the edge can be used as the inspection result.

[0070] In the above-described embodiment, the data creation unit 1011 creates a graph as data, but in the embodiment of FIG. 7, the data creation unit 1011 creates a table as data. Next, a case where the size of chipping of a cutting device (not shown) is used as an example of an inspection result will be described. The cutting device is an example of a processing device. A chipping measurement table (not shown) is installed adjacent to the cutting device, and a camera (not shown) is disposed to measure the number and size of chipping. The cutting device (not shown) is an example of a cutting unit that cuts the workpiece 200. The camera (not shown) is an example of an imaging unit that images the cut grooves of the workpiece 200 by the cutting device.

[0071] As shown in Fig. 7, as an example of the inspection results, the number of chippings of a specified size or larger, the maximum chipping value (μm), and the average chipping value (μm) in each cassette are shown in a table format. As shown in Fig. 8, the inspection results in the table format of Fig. 7 are shown in a graph format. By checking the table in Fig. 7 and the graph in Fig. 8, the worker can confirm the progress of the processing quality of the workpiece 200. In Fig. 8, the dotted line L1 indicates the search result of the maximum chipping value, the dashed line L2 indicates the inspection result of the average chipping size, and the dashed line L3 indicates the inspection result of the number of chippings of a specified size or larger.

[0072] As shown in FIG. 7 and FIG. 8, each inspection item such as the number of chippings of a specified size (e.g., XX μm) or more in the first cassette constituting the inspection result, the maximum value (μm) of chippings, and the average value (μm) of chippings do not exceed the threshold value for determining a product defect (processing defect), that is, the processing quality of the workpiece 200 is within a range where there is no problem, but if the fluctuation range of the numerical value of each inspection result exceeds a preset threshold value, the notification unit 1013 can recommend to the operator that the cutting device, which is the processing device, is inspected since a deterioration tendency is observed. The operator who receives the recommendation can consider whether to stop the processing in the processing device and perform the inspection. For example, if the maximum value or average value of chippings fluctuates by 10 μm or more, or if the number of chippings of a specified size or more increases by 10 or more, the notification unit 1013 can recommend to inspect the processing device.

[0073] As a result, it is possible to prevent the occurrence of product defects as a result of actual processing by the fluctuation range or rate of fluctuation of inspection results, such as the size of chipping, exceeding the threshold value for detecting product defects (processing defects), and it is possible to more reliably prevent defects due to processing compared to when a judgment is simply made based on a threshold value for judging a product defect (processing defect).

[0074] The range of variation for each test result can be set as an absolute value or a percentage of variation, and preset thresholds can be set arbitrarily for each test item that makes up the test result.

[0075] The embodiments of the present invention are not limited to the above-mentioned embodiments and modifications, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological progress or a different technology derived therefrom, the present invention may be implemented using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0076] As described above, the processing apparatus of the present invention can prevent processing defects, and is therefore particularly useful in the field of processing the workpiece 200 by using a processing unit. [Explanation of symbols]

[0077] 1: Grinding and polishing device, 2: Device body, 3: Rough grinding unit, 4: Finish grinding unit, 5: polishing unit, 8: turntable, 9: holding table, 10: thickness measuring unit, 91: holding table, 92: holding table, 93: holding table, 94: holding table, 100: control unit, 101: control unit, 102: memory unit, 200: workpiece, 400: Processing unit, 500: Inspection unit, 600: Monitor, 1011: data creation unit, 1012: output unit, 1013: notification unit, 1021: Processing condition storage unit, 1022: Inspection result storage unit

Claims

1. A holding table for holding the workpiece; a processing unit for processing a workpiece held on the holding table; an inspection unit that inspects the processing quality of the workpiece processed by the processing unit; A processing apparatus comprising: The control unit a processing condition storage unit that stores processing conditions for the processing unit; an inspection result storage unit that stores the inspection results by the inspection unit; The inspection results processed under the same processing conditions are linked to the time when the processing was performed by the processing unit. A data creation unit that creates a plurality of data; and an output unit that outputs at least a portion of the data to an arbitrary monitor. A processing device characterized by:

2. If the test results fluctuate by a range or percentage equal to or greater than the threshold within a specified period, The processing device further includes a notification unit that recommends inspection of the processing device.

2. The processing apparatus according to claim 1 .

3. The data creation unit: First data linking the inspection result processed under the first processing conditions with the time when the processing was performed by the processing unit; and creating second data linking the inspection result processed under the second processing conditions with the time when the processing was performed by the processing unit.

3. The processing apparatus according to claim 2.

4. The notification unit includes: Under two or more of the processing conditions, Each test result is greater than or equal to the threshold value. If the trend is the same, either improving or worsening Inspection of the processing equipment is recommended.

4. The processing apparatus according to claim 3.

5. The notification unit includes: Under two or more of the processing conditions, If either test result fluctuates by a range or percentage equal to or greater than the threshold value It is recommended to check the processing conditions that fluctuate by a range or rate exceeding the threshold value.

4. The processing apparatus according to claim 3.

6. The processing unit is a grinding unit that grinds a workpiece, The inspection unit is a measuring device that measures the thickness variation of the workpiece ground by the grinding unit.

4. The processing apparatus according to claim 1, wherein the processing apparatus is a processing apparatus having a processing hole.

7. The processing unit is a polishing unit that polishes a workpiece, The inspection unit is a measuring device that measures the thickness variation of the workpiece polished by the polishing unit.

4. The processing apparatus according to claim 1, wherein the processing apparatus is a processing apparatus having a processing hole.

8. The processing unit is a cutting unit that cuts a workpiece, the inspection unit is an imaging unit that images the cut groove by the cutting unit; At least one of the size and number of chippings generated in the cutting groove is measured.

4. The processing apparatus according to claim 1, wherein the processing apparatus is a processing apparatus having a processing hole.

Images