Masking material and deposition apparatus of metal film using the same

Abstract

To provide a masking material capable of stably depositing a metal film on a surface of a substrate using the surface of the substrate as a cathode.SOLUTION: A masking material 60 is for depositing, by electrolytic plating, a metal film F of a prescribed pattern P on a surface of a substrate B with a metal layer Ba formed. The masking material 60 includes: a mask part 65 having a penetration part 68 in accordance with a predetermined pattern P; and a metal mesh 67 being a conductive member to have contact with the metal layer Ba. The mask part 65 includes an elastic material. The mask part 65 includes a metal mesh 67 embedded therein so as to expose a part of the metal mesh 67 from a contact face 65a to have contact with the metal layer Ba in a surface of the mask part 65.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a masking material and a film forming apparatus for forming a metal film using the masking material. [Background technology]

[0002] Conventionally, a metal coating has been formed by precipitating a metal on the surface of a substrate by electrolytic plating (for example, Patent Document 1). In Patent Document 1, the film forming apparatus includes a container (housing) that contains a plating solution. An opening is formed in the container, and the opening is sealed with an electrolyte membrane. The film forming apparatus further includes a pressing mechanism that presses the electrolyte membrane against the substrate by the hydraulic pressure of the plating solution.

[0003] Here, when a metallic underlayer of a predetermined pattern is formed on the surface of the substrate, a voltage is applied between the anode and the substrate while pressing the substrate with the liquid pressure of the electrolyte membrane. This allows a metal coating of a predetermined pattern to be formed on the underlayer. However, when a underlayer of a predetermined pattern is not formed on the substrate, it is also possible to use a masking material such as that shown in Patent Document 2. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-125087 A [Patent Document 2] JP 2016-108586 A Summary of the Invention [Problem to be solved by the invention]

[0005] Here, as shown in Patent Document 2, when a metal coating is formed on the surface of a substrate on which a metal layer has been formed, the surface of the substrate is made to act as a cathode for electrolytic plating. In this case, a conductive jig for conducting the metal layer on the substrate surface to a power source must be arranged together with a masking material every time a film is formed, which makes the preparation work complicated. In addition, if the conductive jig is misaligned in position, the metal coating may become uneven.

[0006] The present invention has been made in consideration of these points, and aims to provide a masking material that can stably form a metal coating on the surface of a substrate by using the surface of the substrate as a cathode. [Means for solving the problem]

[0007] In view of the above problems, the masking material of the present invention is a masking material for forming a metal coating of a predetermined pattern by electrolytic plating on the surface of a substrate on which a metal layer is formed, the masking material comprising a mask portion having through portions formed according to the predetermined pattern, and a conductive member in contact with the metal layer, the mask portion being made of an elastic material, and the conductive member being embedded in the mask portion such that a portion of the conductive member is exposed from a contact surface of the mask portion that contacts the metal layer.

[0008] According to the present invention, the conductive member of the mask member is embedded such that a part of the conductive member is exposed from the contact surface of the mask portion that contacts the metal layer. This allows the conductive member and the metal layer of the substrate to be electrically connected when the substrate is covered with the masking material during film formation. In this state, if the conductive member is electrically connected to the negative electrode of the plating power source, the surface of the metal layer of the substrate can be made to act as a cathode on which a metal film is formed. As a result, a metal film corresponding to the through portion formed in the mask portion can be stably formed on the surface of the metal layer of the substrate.

[0009] In a more preferred embodiment, the conductive member is a metal mesh, and the metal mesh is embedded in the mask portion so as to be exposed from the mask portion at the contact surface. In a further preferred embodiment, the metal mesh is disposed so as to surround the periphery of the mask portion. In another preferred embodiment, the masking material includes a resin mesh that fixes the mask portion on the opposite side of the metal mesh from the contact surface.

[0010] The present invention discloses a film forming apparatus for forming a metal film including the above-mentioned masking material. The film forming apparatus includes a container having an opening formed at a position facing the substrate, and the opening is covered with an electrolyte membrane while the plating solution is contained therein. The film forming apparatus further includes a moving mechanism for moving at least one of the container and the substrate so that the container and the substrate can be brought into contact with each other via the masking material, and a pressure boosting mechanism for increasing the liquid pressure of the plating solution contained in the container. The film forming apparatus includes an anode disposed in the container at a position facing the electrolyte membrane, and a power source for applying a voltage between the anode and the substrate, the masking material being disposed between the electrolyte membrane and the substrate, and the conductive member being electrically connected to the negative electrode of the power source at least during film formation. Effect of the Invention

[0011] According to the present invention, a metal film can be stably formed on the surface of a substrate by using the surface of the substrate as a cathode. [Brief description of the drawings]

[0012] [Figure 1] Fig. 1(a) is a schematic cross-sectional view showing an example of a film forming apparatus equipped with a masking material according to an embodiment of the present invention before forming a metal film, and Fig. 1(b) is a cross-sectional view illustrating the state of the film forming apparatus of Fig. 1(a) during film formation. [Diagram 2]Fig. 2(a) is a schematic perspective view of the masking material shown in Fig. 1(a) viewed from below. Fig. 2(b) is a partially enlarged cross-sectional view taken along line AA in Fig. 2(a). Fig. 2(c) is a partially enlarged cross-sectional view taken along line BB in Fig. 2(a). [Diagram 3] 3(a) to 3(d) are schematic diagrams for explaining the method for producing the masking material according to this embodiment. [Figure 4] 4(a) to 4(d) are schematic diagrams for explaining the method for producing the masking material according to this embodiment. [Diagram 5] FIG. 5(a) is an enlarged cross-sectional view showing the state of the metal coating during deposition corresponding to FIG. 2(b), and FIG. 5(b) is an enlarged cross-sectional view showing the state of the metal coating during deposition corresponding to FIG. 2(c). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] First, a film forming apparatus 1 equipped with a masking material 60 according to an embodiment of the present invention will be described with reference to FIG. 1(a) and FIGS. 2(a) to (c).

[0014] 1(a), the film forming apparatus 1 is a film forming apparatus that forms a metal coating F of a predetermined pattern P on a substrate B by electrolytic plating. The film forming apparatus 1 forms a metal coating in a state in which a masking material 60 is sandwiched between an electrolyte membrane 13 and the substrate B. The film forming apparatus 1 includes an anode 11, an electrolyte membrane 13, and a power source 14 that applies a voltage between the anode 11 and the substrate B.

[0015] The film forming apparatus 1 includes a container 15 that contains an anode 11 and a plating solution L, a mounting table 40 for mounting a substrate B thereon, and a masking material 60. During film formation, the masking material 60 is mounted on the mounting table 40 together with the substrate B. The electrolyte membrane 13 is disposed between the masking material 60 and the anode 11.

[0016] The film forming apparatus 1 includes a linear actuator 70 that raises and lowers the container 15. The linear actuator 70 corresponds to the "moving mechanism" of the present invention, and may be a device that moves at least one of the container 15 and the substrate B so that the container 15 and the substrate B can be brought into contact with and separated from each other via a masking material 60 described later.

[0017] The substrate B functions as a cathode. The substrate B is a plate-shaped substrate. In this embodiment, the substrate B is a rectangular substrate. Of the surfaces of the substrate B, the surface facing the electrolyte membrane 13 is a film formation surface that functions as a cathode. In this embodiment, the substrate B is an insulating substrate Bb having a metal layer Ba formed on its surface (see FIG. 5). The insulating substrate Bb is made of an electrically insulating material such as glass, ceramics, resin, or a composite material thereof. The metal layer Ba may be made of a metal such as aluminum or copper.

[0018] In this embodiment, since the wiring pattern is formed from the metal film F, a base material having a metal layer Ba of copper or the like formed on the surface of an insulating substrate Bb of resin or the like is used as the base material B. In this case, after the metal film F is formed, the metal layer Ba other than the portion on which the metal film F is formed is removed by etching or the like. This allows a pattern (wiring pattern) P made of the metal film F to be formed on the surface of the insulating substrate Bb.

[0019] The anode 11 is, for example, a non-porous (e.g., non-porous) anode made of the same metal as the metal of the metal coating. The anode 11 has a block or plate shape. The material of the anode 11 can be, for example, copper. The anode 11 dissolves when a voltage is applied from the power source 14. However, when a film is formed using only metal ions of the plating solution L, the anode 11 is an anode that is insoluble in the plating solution L. The anode 11 is electrically connected to the positive electrode of the power source 14. The negative electrode of the power source 14 is electrically connected to a metal plug 42 of the mounting table 40 described later.

[0020] The plating solution L is a solution containing the metal of the metal film to be formed in an ion state. Examples of the metal include copper and nickel. The plating solution L is a solution in which these metals are dissolved (ionized) with an acid such as nitric acid, phosphoric acid, or sulfuric acid. Examples of the solvent of the solution include water and alcohol. For example, when the metal is copper, the plating solution L can be an aqueous solution containing copper sulfate, copper pyrophosphate, or the like.

[0021] The electrolyte membrane 13 is a membrane that can be impregnated (contained) with metal ions together with the plating solution L by contacting the electrolyte membrane 13 with the plating solution L. The electrolyte membrane 13 is a flexible membrane. The material of the electrolyte membrane 13 is not particularly limited as long as the metal ions of the plating solution L can migrate to the substrate B side when a voltage is applied from the power source 14. Examples of the material of the electrolyte membrane 13 include resins having an ion exchange function, such as fluororesins such as Nafion (registered trademark) manufactured by DuPont. The thickness of the electrolyte membrane 13 is preferably in the range of 20 μm to 200 μm.

[0022] The container 15 is made of a material insoluble in the plating solution L. The container 15 has a container space 15a for containing the plating solution L. The anode 11 is disposed in the container space 15a of the container 15. An opening 15d is formed in the container space 15a at a position facing the base material B. The opening 15d of the container 15 is covered with the electrolyte membrane 13. Specifically, the periphery of the electrolyte membrane 13 is sandwiched between the container 15 and the frame 17. This allows the plating solution L in the container space 15a to be sealed by the electrolyte membrane 13.

[0023] As shown in Fig. 1(a) and Fig. 1(b), the linear actuator 70 raises and lowers the housing 15 so that the electrolyte membrane 13 and the masking material 60 can be brought into contact with and separated from each other. In this embodiment, the mounting table 40 is fixed, and the housing 15 is raised and lowered by the linear actuator 70. The linear actuator 70 is an electric actuator, and converts the rotational motion of a motor into linear motion by a ball screw or the like (not shown). However, instead of the electric actuator, a hydraulic or pneumatic actuator may be used.

[0024] The container 15 is formed with a supply port 15b for supplying the plating solution L to the container space 15a. The container 15 is formed with a discharge port 15c for discharging the plating solution L from the container space 15a. The supply port 15b and the discharge port 15c are holes communicating with the container space 15a. The supply port 15b and the discharge port 15c are formed on either side of the container space 15a. The supply port 15b is fluidly connected to a liquid supply pipe 50. The discharge port 15c is fluidly connected to a liquid discharge pipe 52.

[0025] The film forming apparatus 1 further includes a tank 90, a liquid supply pipe 50, a liquid discharge pipe 52, and a pump 80. As shown in FIG. 1(a), the tank 90 contains a plating solution L. The liquid supply pipe 50 connects the tank 90 to the accommodation body 15. The liquid supply pipe 50 is provided with a pump 80. The pump 80 supplies the plating solution L from the tank 90 to the accommodation body 15. The liquid discharge pipe 52 connects the tank 90 to the accommodation body 15. The liquid discharge pipe 52 is provided with a pressure adjustment valve 54. The pressure adjustment valve 54 adjusts the pressure (liquid pressure) of the plating solution L in the accommodation space 15a to a predetermined pressure.

[0026] In this embodiment, the plating solution L is sucked from the tank 90 into the liquid supply pipe 50 by driving the pump 80. The sucked plating solution L is pumped from the supply port 15b to the accommodation space 15a. The plating solution L in the accommodation space 15a is returned to the tank 90 via the discharge port 15c. In this manner, the plating solution L circulates within the film forming apparatus 1.

[0027] Furthermore, by continuing to drive the pump 80, the liquid pressure of the plating solution L in the accommodation space 15a can be maintained at a predetermined pressure by the pressure regulating valve 54. The pump 80 presses the masking material 60 by the electrolyte membrane 13 acting on the liquid pressure of the plating solution L. The pump 80 increases the liquid pressure of the plating solution L accommodated in the accommodation body 15, and corresponds to the "pressure boosting mechanism" of the present invention.

[0028] The mounting table 40 has, for example, a main body 41 made of an insulating material. The main body 41 is formed with a protrusion 43 protruding toward the mask side, and the protrusion 43 is formed with a recess 44 for accommodating the substrate B. The main body 41 is provided with a metal plug 42 connected to the negative electrode of the power source 14.

[0029] As shown in FIG. 1(a), the masking material 60 includes a frame 61 and a screen mask 62. A peripheral edge 62a of the screen mask 62 is fixed to the frame 61. For example, the frame 61 may be made of a metal material such as stainless steel, or a resin material such as a thermoplastic resin. The frame 61 may be made of a metal material and may be in contact with a metal mesh 67, which will be described later. This allows the metal coating F to be formed on the surface of the metal layer Ba by simply connecting the frame 61 to the negative electrode of the power source 14 without providing a metal plug 42 on the mounting table 40.

[0030] 2, the screen mask 62 has through-holes 68 formed in accordance with a predetermined pattern P of the metal film F. The screen mask 62 includes a resin mesh 64, a mask portion 65, and a metal mesh 67. The screen mask 62 is a mask having flexibility of about 50 μm to 400 μm. The screen mask 62 is supported by the frame 61 on the substrate B side relative to the frame 61.

[0031] The resin mesh 64 is fixed to the frame 61. The resin mesh 64 has a plurality of openings 64c, 64c, ... formed in a lattice pattern. Specifically, as shown in FIG. 2(b) and the like, the resin mesh 64 is a mesh-like portion in which a plurality of oriented wires 64a, 64b are woven so as to intersect. The plurality of wires 64a, 64a are arranged at intervals, and the plurality of wires 64b, 64b intersecting the plurality of wires 64a, 64a are arranged at intervals. As a result, a plurality of openings 64c, 64c, ... are formed in the resin mesh 64 in a lattice pattern. The material of the wires 64a, 64b is not particularly limited as long as it has corrosion resistance to the plating solution L. Examples of the material of the wires 64a, 64b include resin materials such as polyester.

[0032] The mask portion 65 is fixed to the resin mesh 64. The mask portion 65 has through-holes 68 formed according to a predetermined pattern P. The mask portion 65 is a portion that is brought into close contact with the substrate B during film formation by pressure from the electrolyte membrane 13. The material of the mask portion 65 is not particularly limited as long as it can be brought into close contact with the substrate B. For example, the material of the mask portion 65 may be a rubber material such as silicone rubber (PMDS) or ethylene propylene diene rubber (EPDM). The hardness of the rubber material is preferably HS100 or less, more preferably HS50 or less, in Shore A hardness.

[0033] The mask portion 65 is made of an elastic material that undergoes compressive elastic deformation due to pressure from the electrolyte membrane 13. In order to ensure adhesion to the base material B, the amount of deformation in the thickness direction (pressing direction) of the mask portion 65 due to pressure from the electrolyte membrane 13 may be in the range of 5 to 20% of the thickness of the mask portion before deformation. The screen mask 62 having the predetermined pattern P can be manufactured by a general silk screen manufacturing technique using an emulsion.

[0034] As shown in FIG. 2(c), the metal mesh 67, which is a conductive member, is disposed on the contact surface 65a of the mask portion 65, which contacts the metal layer Ba of the substrate B. The metal mesh 67 is made of wires 67a, 67b such as stainless steel, nickel, titanium, gold, copper, silver, and palladium. The metal mesh 67 is a mesh having a structure similar to that of the resin mesh 64. The metal mesh 67 has a plurality of openings 67c, 67c, ... formed in a lattice shape. The plurality of wires 67a, 67a are arranged at intervals, and the plurality of wires 67b, 67b intersecting the wires 67a, 67a are arranged at intervals. As a result, the metal mesh 67 has a plurality of openings 67c, 67c, ... formed in a lattice shape. In this embodiment, the elastic material constituting the mask portion 65 is inserted into the openings 67c. As a result, the metal mesh 67 is fixed to the mask portion 65.

[0035] In this way, the metal mesh 67 is embedded in the mask portion 65 so as to be exposed from the mask portion 65 at the contact surface 65a of the mask portion 65. As shown in FIG. 2(a), the metal mesh 67 is arranged so as to surround the periphery of the mask portion 65. As a result, the metal mesh 67 is arranged so as to surround the entire through-portion 68 of the mask portion 65, so that the metal coating F having a pattern corresponding to the through-portion 68 can be uniformly formed. Furthermore, the masking material 60 includes a resin mesh 64 for fixing the mask portion 65 on the opposite side of the contact surface 65a with the metal mesh 67 sandwiched therebetween. As a result, the elastic portion 65b of the mask portion 65 is arranged between the resin mesh 64 and the metal mesh 67, so that the metal mesh 67 can be made to conform to the surface of the metal layer Ba of the substrate B.

[0036] A manufacturing method of such a masking material 60 will be described. First, a frame body 61 to which a resin mesh 64 is fixed is prepared. Next, an uncured ultraviolet curable resin 82A is applied to a screen mask 62 by a roller or a brush. Next, as shown in FIG. 3(a), ultraviolet rays UV are irradiated onto the ultraviolet curable resin (emulsion) according to a predetermined pattern P to form a cured portion 82 according to the predetermined pattern. Next, the uncured portion 82a is washed away, and a molding space 82b for molding the mask portion 65 is formed as shown in FIG. 3(b). Next, as shown in FIG. 3(c), a material 65A that is arranged on a resin plate 85 and that will become the mask portion 65 is poured into the molding space 82b, and the material 65A is impregnated into the resin mesh 64. A metal mesh 67 is placed on the material 65A so that a part of the material 65A is impregnated. Finally, as shown in FIG. 3(d), the material 65A is cured to form the mask portion 65. Furthermore, the resin plate 85 is removed from the mask portion 65, and the hardened portion 82 is removed by etching. This makes it possible to obtain the masking material 60 shown in FIG.

[0037] Another manufacturing method of the masking material 60 will be described. As shown in FIG. 4(a), ultraviolet rays UV are irradiated onto an ultraviolet curing resin (emulsion) 82A according to a predetermined pattern P to form a cured portion 82 according to the predetermined pattern. Next, as shown in FIG. 4(b), the uncured portion 82a is washed away, and a resin plate 85 is placed together with a metal mesh 67. Next, as shown in FIG. 4(c), a material 65A to be the mask portion 65 is poured into the molding space 82b. Finally, as shown in FIG. 4(d), the material 65A is cured to form the mask portion 65. Furthermore, the resin plate 85 is removed from the mask portion 65, and the cured portion 82 is removed by etching. As a result, the masking material 60 shown in FIG. 2 and the like can be obtained.

[0038] A film forming method using the film forming apparatus 1 will be described with reference to Fig. 1 and Fig. 5. First, as shown in Fig. 1(a), the substrate B is placed on the mounting table 40. In this embodiment, the metal layer Ba of the substrate B protrudes from the mounting table 40 with the substrate B accommodated in the recess 44. This allows the mask portion 65 of the masking material 60 to be uniformly brought into contact with the surface of the substrate B.

[0039] Next, the masking material 60 is placed on the mounting table 40. At this time, the masking material 60 is accommodated so that the surface of the base material B fits within the internal space 69 of the frame 61 of the masking material 60. In addition, as a result, the surface of the base material B is covered with the mask portion 65 of the masking material 60.

[0040] 1(b), the linear actuator 70 is driven. The housing 15 is lowered toward the masking material 60. When the masking material 60 is integrally attached to the housing 15 at a position facing the electrolyte membrane 13, the surface of the base material B can be covered with the mask portion 65 of the masking material 60 by lowering the housing 15.

[0041] Next, the pump 80 is driven. This causes the plating solution L to be supplied to the accommodation space 15a of the accommodation body 15. Since the liquid discharge pipe 52 is provided with the pressure regulating valve 54, the liquid pressure of the plating solution L in the accommodation space 15a is maintained at a predetermined pressure.

[0042] This pressing force allows the screen mask 62 to be brought into close contact with the metal layer Ba of the substrate B. Since the mask portion 65 is made of an elastic material, the mask portion 65 is compressed and elastically deformed by the liquid pressure of the plating solution L, improving the adhesion between the mask portion 65 and the substrate B. Since the mask portion 65 is fixed to the resin mesh 64, the mask portion 65 can be pressed uniformly through the resin mesh 64, as shown in FIG. 5(a). When the pressing of the electrolyte membrane 13 is continued, the seepage liquid (plating solution) La that seeps out from the electrolyte membrane 13 swollen by the plating solution L is filled into the through portions 68 formed in the screen mask 62.

[0043] Next, the pressing state by the electrolyte membrane 13 is maintained, and the metal coating F is formed. Specifically, a voltage is applied between the anode 11 and the substrate B. In this embodiment, a part of the metal mesh 67 is exposed from the contact surface 65a of the mask portion 65 that contacts the metal layer Ba. As a result, as shown in FIG. 5(b), when the substrate B is covered with the masking material 60 during film formation, the metal layer Ba of the substrate B can be electrically connected to the metal plug 42 through the metal mesh 67. If the metal mesh 67 and the negative electrode of the power source 14 for plating are electrically connected through the metal plug 42, the current A of the power source 14 flows from the metal layer Ba through the metal mesh 67 to the metal plug 42. In this way, the surface of the metal layer Ba of the substrate B can be made to act as a cathode on which the metal coating F is formed. As a result, the metal ions contained in the plating solution L are passed through the electrolyte membrane 13. The metal ions that have passed through the electrolyte membrane 13 move to the surface of the substrate B through the seepage liquid La, and are reduced on the surface of the substrate B. As a result, the metal film F corresponding to the through-portion 68 formed in the mask portion 65 can be formed on the surface of the metal layer Ba of the base material B stably.

[0044] Furthermore, the exudation liquid La is uniformly pressurized by the pressure of the electrolyte membrane 13, so that a homogeneous metal coating F can be formed. Thereafter, the linear actuator 70 raises the container 15, separates the substrate B from the electrolyte membrane 13, and removes the substrate B from the mounting table 40. When manufacturing wiring using the metal coating F, the metal layer Ba formed on the surface of the insulating substrate Bb of the substrate B may be etched, leaving the portion where the metal coating F is formed.

[0045] As described above, in the case where the masking material 60 is integrally attached to the container 15, when the container 15 is raised by the linear actuator 70 to separate the substrate B from the electrolyte membrane 13, the weight of the plating solution L can be supported by the masking material 60 via the electrolyte membrane 13. This makes it possible to suppress plastic deformation of the electrolyte membrane 13 due to the weight of the plating solution L.

[0046] Although the embodiment of the present invention has been described in detail above, the present invention is not limited to the above embodiment, and various design modifications can be made within the scope of the spirit of the present invention described in the claims. For example, a conductive member such as a metal foil may be used instead of a metal mesh as long as it can be in contact with the metal layer of the substrate. Also, a metal foil having a lattice structure with a plurality of through holes may be used instead of the metal mesh. A conductive mesh may be used instead of the resin mesh, and in this case, it is preferable that the conductive mesh is embedded in the mask portion so that the surface of the conductive mesh is not exposed. [Explanation of symbols]

[0047] 1: film forming device, 13: electrolyte membrane, 40: mounting table, 60: masking material, 61: frame, 62: screen mask, 64: resin mesh, 65: mask portion, 67: metal mesh, 68: through portion, B: substrate, Ba: metal layer, F: metal film, L: plating solution

Claims

1. A masking material for forming a metal film having a predetermined pattern on a surface of a substrate having a metal layer by electrolytic plating, comprising: The masking material includes a mask portion having a through portion formed according to the predetermined pattern; a conductive member disposed on a contact surface that contacts the metal layer; The masking material is characterized in that the mask portion is made of an elastic material, and the conductive member is embedded in the mask portion so that a portion of the conductive member is exposed from a contact surface of the mask portion that contacts the metal layer.

2. the conductive member is a metal mesh, The masking material according to claim 1 , wherein the metal mesh is embedded in the mask portion at the contact surface so as to be exposed from the mask portion.

3. The masking material according to claim 2 , wherein the metal mesh is disposed so as to surround a periphery of the mask portion.

4. The masking material according to claim 2 , further comprising a resin mesh for fixing the mask portion on the opposite side of the metal mesh from the contact surface.

5. A film forming apparatus for forming a metal film comprising the masking material according to claim 1, a container having an opening formed at a position facing the base material, the opening being covered with an electrolyte membrane while containing a plating solution; a moving mechanism that moves at least one of the container and the base material so that the container and the base material can be separated from each other via the masking material; a pressure boosting mechanism for increasing the liquid pressure of the plating solution contained in the container; an anode disposed inside the container at a position facing the electrolyte membrane; a power source that applies a voltage between the anode and the substrate; The masking material is disposed between the electrolyte membrane and the substrate, and the conductive member is electrically connected to the negative electrode of the power source at least during the deposition process.

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