Wafer loading and unloading system for epitaxial reactor, and epitaxial reactor
The wafer loading and unloading system with a linear actuator and fork configuration addresses the large footprint issue by minimizing the length of the handling robot and end effector, allowing for reduced dimensions and increased manufacturing density in epitaxial reactors.
Patent Information
- Application Number
- JP2024118605
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-07-27
- Filing Date
- 2024-07-24
- Publication Date
- 2025-02-06
AI Technical Summary
Existing wafer loading and unloading systems for epitaxial reactors have a large footprint due to the constraints imposed by the need for a minimum length of the reaction chamber and end effector, limiting the ability to reduce the overall dimensions of the epitaxial reactor.
The use of a wafer loading and unloading system with a linear actuator and conveying device, such as a fork, that moves wafers along a translation axis, allowing for reduced length of the handling robot and end effector, and a lifting system to vertically position the actuator, minimizing the system's footprint.
This configuration enables a smaller footprint, enabling multiple reaction chambers to be positioned radially, reducing the overall dimensions of the epitaxial reactor and enhancing manufacturing density and efficiency.
Smart Images

Figure 2025019007000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a wafer loading and unloading system for an epitaxial reactor, and to an epitaxial reactor equipped with such a loading and unloading system. [Background technology]
[0002] Known epitaxial reactors comprise a reaction chamber, generally placed on a support, into which a wafer is introduced in order to undergo a process of epitaxial deposition of semiconductor material.
[0003] In known solutions, the wafer and its support are loaded into and unloaded from the reaction chamber by an articulated wafer handling robot positioned in a wafer handling chamber facing and connected to the reaction chamber.
[0004] In known solutions, the robot handling system comprises an articulated arm at its end to which an end handling device, or "end effector", is hinged, which is suitable for gripping and inserting wafers and wafer supports into the reaction chamber.
[0005] There is a need to reduce the footprint of epitaxial reactors, and in particular, wafer loading and unloading systems inside the reaction chamber of epitaxial reactors.
[0006] In known solutions, however, due to the intense heat within the reaction chamber, the robot joint, and therefore the articulated robot arm, must be kept outside the reaction chamber, and only the end effector can extend inside the reaction chamber volume to place the wafer and wafer support.
[0007] Due to constraints imposed by the manufacturing process and required yield requirements, both the reaction chamber and the end effector must have a certain minimum length, and therefore the possibility of reducing the length of the reaction chamber or the end effector in order to reduce the footprint of the epitaxial reactor is limited.
[0008] Indeed, since the end effector must be long enough to transport the wafer into and out of the reaction chamber, the handling chamber must be large enough to ensure rotation of the handling robot, and in particular the end effector and the robot articulated arm to which it is connected, during wafer loading and unloading operations.
[0009] A possible technical solution to reduce the footprint of known loading and unloading systems would be to position multiple reaction chambers in a radial arrangement relative to a single handling robot, however, such a technical solution would also result in a large footprint and would not achieve the required footprint reduction. Summary of the Invention [Means for solving the problem]
[0010] The object of the present invention is to make available a wafer loading and unloading system for an epitaxial reactor, and an epitaxial reactor equipped with the loading and unloading system, in order to solve at least some of the problems noted in the prior art.
[0011] A primary objective of the present invention is to enable a wafer loading and unloading system for an epitaxial reactor, and an epitaxial reactor comprising the loading and unloading system, with reduced overall dimensions in order to maximize wafer production density.
[0012] This and other objects are achieved according to the independent claims by a wafer loading and unloading system for an epitaxial reactor and by an epitaxial reactor comprising the loading and unloading system.
[0013] The dependent claims relate to preferred and advantageous embodiments of the invention.
[0014] For a better understanding of the present invention and for realizing its advantages, some illustrative and non-limiting embodiments thereof will now be described with reference to the accompanying drawings, in which: [Brief description of the drawings]
[0015] [Figure 1] FIG. 1 is a schematic top view of an epitaxial reactor according to the prior art. [Diagram 2] FIG. 2 is a schematic top view of an epitaxial reactor according to one embodiment of the present invention. [Diagram 3] FIG. 3 is a schematic top view of an epitaxial reactor wafer loading and unloading system according to one embodiment of the present invention in an initial operating configuration. [Figure 4] FIG. 4 is a schematic top view of the loading and unloading system illustrated in FIG. 3 in another operational configuration. [Diagram 5] FIG. 5 is a schematic top view of the loading and unloading system illustrated in FIG. 3 in another operational configuration. [Figure 6] FIG. 6 is a schematic top view of the loading and unloading system illustrated in FIG. 3 in another operational configuration. [Figure 7] FIG. 7 is a perspective cross-sectional view of a wafer loading and unloading system for an epitaxial reactor, in accordance with one embodiment of the present invention. [Figure 8] FIG. 8 is a perspective view of the components of the loading and unloading system illustrated in FIG. 7 in an initial operational configuration. [Figure 9] FIG. 9 is a perspective view of the components of the loading and unloading system illustrated in FIG. 7 in a second operational configuration. [Figure 10] FIG. 10 is a perspective view of the components of the loading and unloading system illustrated in FIG. 7 in a third operational configuration. [Figure 11] FIG. 11 is a side view of the loading and unloading system in an initial operational configuration, according to one embodiment. [Figure 12] FIG. 12 is a side view of the loading and unloading system in a second operational configuration, according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] Referring to the drawings, a loading and unloading system is generally designated by the reference numeral 1 .
[0017] The loading and unloading system 1 is configured to load and unload wafers 2 into a reaction chamber 3 of an epitaxial reactor 4 .
[0018] According to one embodiment, the wafers 2 are placed on respective wafer supports and the system 1 is configured to move the wafer supports on which the wafers 2 are placed.
[0019] According to a further embodiment, the wafer 2 is not placed on a wafer support: according to this embodiment, the system 1 is arranged to move the wafer 2 directly.
[0020] The system 1 comprises a handling robot 5 .
[0021] In one aspect of the invention, the system 1 comprises a linear actuator 6. The linear actuator 6 extends along a translation axis 7.
[0022] The handling robot 5 is configured to transfer the wafer 2 to a linear actuator 6 .
[0023] In addition, the linear actuator 6 is configured to receive the wafer 2 from the handling robot 5 .
[0024] The linear actuator 6 is further configured to advance the wafer 2 along a translation axis 7 to position the wafer 2 inside the reaction chamber 3 .
[0025] Advantageously, such a configured loading and unloading system 1 has a smaller footprint than the prior art. In particular, such a configured system 1 allows for the use of handling robots 5 having articulated arms of reduced length. Additionally, such a configured system 1 allows for the use of end effector components of reduced length compared to the prior art. As a further advantage, the space below the linear actuator 6 is not occupied and can therefore be used for positioning additional components, thus further reducing the overall footprint of the system 1.
[0026] According to one embodiment, the handling robot 5 and the linear actuator 6 are configured to move a wafer support on which the wafer 2 is placed.
[0027] According to a further embodiment, the handling robot 5 and the linear actuator 6 are configured to move the wafer 2 directly.
[0028] According to one embodiment, the linear actuator 6 comprises a conveying device 8 .
[0029] The transport device 8 is configured to receive and support the wafer 2 transferred from the handling robot 5 .
[0030] In addition, the transport device 8 is configured to transport the wafer 2 along the translation axis 7. In this way, the transport device 8 can load the wafer 2 into the reaction chamber 3.
[0031] According to one embodiment, the transport device 8 is configured to move a wafer support on which the wafer 2 is placed.
[0032] According to a further embodiment, the transport device 8 is configured to move the wafer 2 directly.
[0033] According to one embodiment, the linear actuator 6 comprises a track 9 .
[0034] The track 9 extends in a direction parallel to the translation axis 7 .
[0035] The conveying device 8 is connected to a track 9 .
[0036] The track 9 is configured to guide the movement of the conveying device 8 along the translation axis 7 .
[0037] The track 9 extends from a start limit 10 of the movement on one side and to an end limit 11 of the movement on the opposite side. The end limit 11 of the movement faces the reaction chamber 3, whereas the start limit 10 of the movement faces the reaction chamber 3.
[0038] According to one embodiment, the linear actuator 6 comprises a drive system 12 .
[0039] The drive system 12 is configured to drive the movement of the conveying device 8 along the track 9 in the direction of the translation axis 7 .
[0040] According to one embodiment, drive system 12 is an electromechanical drive system.
[0041] According to one embodiment, the conveying device 8 is a fork 13 .
[0042] The fork 13 includes at least two prongs 14 , and preferably only two prongs 14 .
[0043] Additionally, the fork 13 includes a handle 15 connected to the at least two prongs 14 .
[0044] The fork 13 faces the reaction chamber 3 .
[0045] Specifically, the prongs 14 are positioned substantially parallel to the translation axis 7 .
[0046] The handle 15 also extends parallel to the translation axis 7 , specifically along the translation axis 7 .
[0047] In addition, a handle 15 is positioned on the opposite side of the reaction chamber 3 relative to the prongs 14 .
[0048] According to this configuration, the fork 13 is configured to support the wafer 2 received from the handling robot 5, transport the wafer 2 along the translation axis 7 to the reaction chamber 3, and deposit the wafer 2 into the reaction chamber 3. The wafer 2 is supported by the prongs 14 of the fork 13.
[0049] In addition, after processing of the wafer 2, the fork 13 is configured to pick up the wafer 2 from the reaction chamber 3 via the prongs 14 and move and position the wafer 2 relative to the handling robot 5 to enable transfer of the processed wafer 2 to the handling robot 5.
[0050] According to one embodiment, the fork 13 is configured to move, support, place and pick up a wafer support on which the wafer 2 is placed.
[0051] According to a further embodiment, the fork 13 is configured to directly move, support, deposit and pick up the wafer 2 .
[0052] According to one embodiment, the transport device 8 can move from a start position 24 (Figure 8), or a rest position, to an end position 25 (Figure 10), or a position for placing the wafer 2 in the reaction chamber 3 and for withdrawing the wafer 2 from the reaction chamber 3.
[0053] Furthermore, the conveying device 8 can be moved to a transfer position 26 (FIG. 9) interposed between a start position 24 of the movement and an end position 25 of the movement.
[0054] In particular, when the transport device 8 is located at the transfer position 26 , the transport device 8 is configured to receive the wafer 2 from the handling robot 5 .
[0055] Preferably, when the transport device 8 is located in the transfer position 26, the transport device 8 is also configured to transfer the wafer 2 to the handling robot 5 after processing.
[0056] According to one embodiment, the handling robot 5 is positioned laterally to the linear actuator 6 relative to the transfer position 26 .
[0057] "Lateral" means in a horizontal plane, laterally relative to the translation axis 7, and therefore not aligned along the translation axis 7.
[0058] According to an embodiment in which the conveying device 8 is a fork 13 , the start position 24 of the movement corresponds to the fork position 13 in which the end of the handle 15 opposite the prong 14 is substantially positioned at the start limit 10 of the movement of the track 9 .
[0059] Additionally, end position 25 corresponds to fork position 13, where the end of handle 15 opposite prong 14 is located substantially at end end 11 of travel of track 9. At end position 25, prong 14 extends beyond track 9. Additionally, handle 15 protrudes from track 9. In this manner, prong 14 and a portion of handle 15 can be introduced into reaction chamber 3 for depositing wafer 2 therein.
[0060] Advantageously, such a configuration allows the use of a fork 13 of reduced length compared to the "end effectors" of the prior art. Indeed, such a configuration of the system 1 does not require providing additional space to allow the translation-rotation movement of the fork for inserting the wafer inside the reaction chamber. In contrast, the fork 13 configured thus does not perform a rotation but a movement in the direction of the translation axis 7 for depositing the wafer 2 into the reaction chamber 3 and for extracting the wafer 2 from the reaction chamber 3. Such a movement therefore requires a smaller footprint than the prior art and also requires a fork 13 of reduced size with respect to the prior art.
[0061] According to one embodiment, the system 1 comprises a lifting system 16 .
[0062] The lifting system 16 is connected to the linear actuator 6 .
[0063] The lifting system 16 is configured to advance the linear actuator 6 along a direction transverse to the translation axis 7 .
[0064] Specifically, the lifting system 16 is configured to advance the linear actuator 6 vertically, i.e., move the linear actuator 6 along a direction substantially transverse to the plane defined by the conveying device 8, i.e. the forks 13.
[0065] Specifically, the lifting system 16 is configured to vertically advance the linear actuator 6 relative to the handling robot 5 (FIGS. 11-12).
[0066] Advantageously, the lifting system 16 is therefore configured to allow the linear actuator 6, and in particular the transport device 8, to be vertically raised and lowered relative to the handling robot 5. In this way, by lifting the linear actuator 6, the transport device 8 can receive or pick up the wafer 2 from the handling robot 5 by gripping the wafer 2 with its forks and then inserting the wafer 2 inside the reaction chamber 3. In particular, the transport device 8 can receive or pick up the wafer support on which the wafer 2 is placed by the handling robot 5, by gripping the wafer support with its forks and then inserting the wafer support on which the wafer 2 is placed into the reaction chamber 3. Similarly, by lowering the linear actuator 6, the transport device 8 has the ability to transfer the wafer 2 to the handling robot 5 after processing of the wafer 2. Furthermore, the transport device 8 has the ability to deposit the wafer 2 or the wafer support on which the wafer 2 is placed by lowering the linear actuator 6 in the reaction chamber 3. Conversely, the transport device 8 has the capability of picking up the wafer 2 from the reaction chamber 3 by raising the linear actuator 6 so as to directly grasp the wafer 2 or the wafer support on which the wafer 2 is placed with a fork.
[0067] According to one embodiment, the lifting system 16 is configured to move the linear actuator 6 vertically when the transport device 8 is in the transfer position 26 .
[0068] According to one embodiment, the lifting system 16 is configured to move the linear actuator 6 vertically when the transport device 8 is in the end position 25 of the movement.
[0069] According to one embodiment, the lifting system 16 is configured to move vertically and in conjunction with the conveying device 8 , in particular the forks 13 and the track 9 .
[0070] According to one embodiment, the lifting system 16 is a hydraulic type system. Alternatively, the lifting system 16 is a pneumatic type system. Alternatively, the lifting system 16 is an electromechanical type system.
[0071] According to one embodiment, the lifting system 16 is positioned below the track 9 .
[0072] According to one embodiment, the system 1 is configured such that when the transport device 8 moves between the transfer position 26 and the end position 25 of movement and vice versa to transport a wafer 2, the transport device 8 is in a raised configuration. Furthermore, when the transport device 8 moves between the transfer position 26 and the end position 25 of movement and vice versa without transporting a wafer 2, the transport device 8 is in a lowered configuration.
[0073] “Raised configuration” and “lowered configuration” are defined as the maximum and minimum height dimensions achieved by the lifting system 16 with respect to the handling robot 5 by the transport device 8 .
[0074] According to one embodiment, the system 1 comprises two linear actuators 6 .
[0075] The two linear actuators 6 are positioned opposite each other with respect to the handling robot 5 .
[0076] In addition, the linear actuators 6 are positioned parallel to one another.
[0077] Specifically, both linear actuators 6 define respective translation axes 7. The respective translation axes 7 defined by the two linear actuators 6 are parallel but do not overlap.
[0078] In particular, each linear actuator 6 can be positioned facing a respective reaction chamber 3. Hence, a translation axis 7 defined by each linear actuator 6 is directed towards the respective reaction chamber 3.
[0079] Advantageously, such a configuration provides a further reduction in the overall footprint of the system 1. Indeed, the two respective linear actuators 6, and consequently the two respective reaction chambers 3, can be served by a single handling robot 5. As a further advantage, the parallel arrangement of the two linear actuators 6 with the handling robot 5 interposed therebetween minimizes the overall footprint of the system 1.
[0080] According to one embodiment, the two linear actuators 6 are arranged vertically and parallel to the translation axis 7 and mirrored with respect to a plane of symmetry 27 through which the handling robot 5 passes.
[0081] Each linear actuator 6 may comprise all the features previously discussed and, to avoid redundancy, will not be repeated here.
[0082] According to one embodiment, the system 1 comprises four linear actuators 6 defining pairs of two linear actuators 6. Each linear actuator 6 is positioned along a direction parallel to a translation axis 7.
[0083] Specifically, each pair of two linear actuators 6 is positioned on an opposite side with respect to the handling robot 5. Hence, the system 1 comprises two linear actuators 6 adjacent to and parallel to each other, positioned on one side of the handling robot 5. Furthermore, the system 1 comprises two additional linear actuators 6 adjacent to and parallel to each other, positioned on one side of the handling robot 5 opposite to the side on which the other two linear actuators 6 are positioned.
[0084] Advantageously, such a configuration allows four separate linear actuators 6, and therefore four separate reaction chambers 3, to be served by a single handling robot 5 interposed between two pairs of linear actuators 6.
[0085] According to one embodiment, the handling robot 5 is configured to pick up the wafer 2 from one or more linear actuators 6 , in particular after the process of epitaxial deposition on the wafer 2 .
[0086] The following description refers to a linear actuator 6 , but it should be understood that it is also applicable to an embodiment in which the system 1 comprises two linear actuators 6 parallel and on opposite sides to the handling robot 5 .
[0087] According to one embodiment, the handling robot 5 is positioned laterally relative to the linear actuator 6 .
[0088] Specifically, the handling robot 5 is configured to transfer the wafer 2 to the linear actuator 6 by moving the wafer 2 either directly or supported by a wafer support along a direction substantially transverse to the translation axis 7.
[0089] Similarly, the handling robot 5 is configured to pick up the wafer 2 from the linear actuator 6 along a direction substantially transverse to the translation axis 7, either directly or by picking up a wafer support on which the wafer 2 is positioned.
[0090] Advantageously, such a configuration minimizes the footprint of the handling robot 5 and the footprint of the linear actuator 6, as well as the movement of the wafer 2 being loaded onto or unloaded from the linear actuator 6 via the handling robot 5.
[0091] According to one embodiment, the handling robot 5 comprises an articulated arm 17 .
[0092] The articulated arm 17 extends between a fulcrum end 18 and an opposite gripping end 19 .
[0093] The articulated arm 17 may include a number of joints and articulated segments interposed between a fulcrum end 18 and a gripping end 19 .
[0094] According to one embodiment, the handling robot 5 comprises an end effector 20 .
[0095] An end effector 20 is connected to the articulated arm 17 at a gripping end 19 .
[0096] The end effector 20 is configured to move the wafer 2. In addition, the end effector 20 is configured to deposit or pick up the wafer 2 onto or from the linear actuator 6 and, in particular, the transfer device 8.
[0097] According to one embodiment, the end effector 20 is configured to move a wafer support on which the wafer 2 is positioned.
[0098] According to a further embodiment, the end effector 20 is configured to move the wafer 2 directly.
[0099] According to one embodiment, the end effector 20 is movable in a handling plane parallel to the translation axis 7 , which is fixed relative to the frame 21 of the epitaxial reactor 4 .
[0100] In a further embodiment of the invention, an epitaxial reactor 4 comprises at least one reaction chamber 3 and the loading and unloading system 1 described above.
[0101] The reaction chamber 3 is positioned along a translation axis 7 defined by a linear actuator 6 .
[0102] In particular, the reaction chamber 3 is positioned facing the linear actuator 6 , ie open in the direction of the translation axis 7 .
[0103] As a result, the linear actuator 6 is configured to move the wafer 2 along a translation axis 7 towards the reaction chamber 3 .
[0104] According to one embodiment, the epitaxial reactor 4 comprises two reaction chambers 3 .
[0105] Furthermore, the system 1 comprises two linear actuators 6 and a handling robot 5 interposed between the two linear actuators 6 .
[0106] Specifically, the handling robot 5 is configured to operate with both linear actuators 6 positioned between them, i.e., to selectively transfer the wafer 2 to the two linear actuators 6 and pick up the wafer 2 from the two linear actuators 6.
[0107] The linear actuators 6 are positioned parallel to one another.
[0108] In addition, the reaction chambers 3 face respective linear actuators 6 .
[0109] According to one embodiment, the two reaction chambers 3 and the two linear actuators 6 are positioned parallel to a translation axis 7 defined by the linear actuators 6 and on opposite sides with respect to the plane through which the handling robot 5 passes.
[0110] According to one embodiment, the two reaction chambers 3 and the two linear actuators 6 are arranged mirror-aligned with respect to a plane of symmetry 27 parallel to the translation axis 7 defined by the linear actuators 6 and through which the handling robot 5 passes.
[0111] According to one embodiment, the handling robot 5 is configured to alternately transfer a wafer 2 to one of two linear actuators 6 and a subsequent wafer 2 to the other of the two linear actuators 6 .
[0112] Advantageously, this allows for a reduction in the overall production time of the processed wafers and therefore increases the efficiency of the epitaxial reactor 4 .
[0113] According to one embodiment, the epitaxial reactor 4 comprises a loading station 22 ("load lock").
[0114] The loading station 22 is configured to store a number of wafers 2 to be used in the reaction chamber 3 for an epitaxial deposition process.
[0115] Preferably, at the loading station 22, wafer pre-treatment operations 2 can be performed to prepare the wafer 2 for a subsequent epitaxial deposition process.
[0116] In particular, the handling robot 5 is configured to pick up the wafer 2 to be used in the reaction chamber 3 from the loading station 22 and then transfer it to the linear actuator 6 .
[0117] According to one embodiment, the epitaxial reactor 4 comprises a cooling station 23 .
[0118] The cooling station 23 is configured to store a number of wafers 2 which are removed from the linear actuator 6 by the handling robot 5 from the reaction chamber 3 and thus on which an epitaxial deposition process has been performed.
[0119] In particular, the cooling station 23 is adapted to store the wafer 2, which is cooled after the epitaxial deposition process.
[0120] The cooling station 23 is separate from the loading station 22 .
[0121] According to one embodiment, the loading station 22 and / or the cooling station 23 are positioned interposed between the linear actuator 6 and the reaction chamber 3 of the epitaxial reactor 4 .
[0122] According to one embodiment, the handling robot 5 is positioned interposed between the loading station 22 and the cooling station 23 .
[0123] According to one embodiment, the handling robot 5, the loading station 22 and / or the cooling station 23 are positioned substantially aligned along an axis parallel to the translation axis 7 of the respective linear actuators 6 and interposed between the translation axes 7 of the respective linear actuators 6. Preferably, the loading station 22, the handling robot 5 and the cooling station 23 are positioned substantially aligned along a plane of symmetry 27.
[0124] Advantageously, the epitaxial reactor 4 constructed therefore has a smaller footprint than the prior art.
[0125] According to one embodiment, the loading station 22, the cooling station 23 and the transfer position 26 of each linear actuator 6 are arranged in a diamond configuration, preferably symmetrical with respect to a plane of symmetry 27 defined by the linear actuator 6 and parallel to the translation axis 7 along which the handling robot 5 passes, and even more preferably centered on the fulcrum end 18 of the handling robot 5 (Figures 3-6).
[0126] Of course, those skilled in the art could make modifications or adaptations to the present invention, but without departing from the scope of the claims set forth below. [Explanation of symbols]
[0127] 1 Loading and Unloading System 2 Wafer 3. Reaction chamber 4. Epitaxial Reactor 5 Handling robot 6 Linear Actuators 7. Direction of movement 8. Transport Devices 9. Binary 10 Start limit of movement 11 End limit of movement 12 Drive system 13. Fork 14 Prong 15 Handle 16 Lifting System 17 Articulated Arm 18 Support end 19 Grip end 20 Handling End 21 Frame 22 Loading Station 23 Cooling Station 24 Start position of movement 25 End position of movement 26 Transfer position 27 Symmetry Plane
Claims
1. A system (1) for loading and unloading wafers (2) into a reaction chamber (3) of an epitaxial reactor (4), comprising: A handling robot (5); a linear actuator (6) extending along a translation axis (7); the handling robot (5) is configured to transfer the wafer (2) to the linear actuator (6); and The system (1), wherein the linear actuator (6) is configured to receive the wafer (2) from the handling robot (5) and move the wafer (2) along the translation axis (7) to position the wafer (2) inside the reaction chamber (3).
2. the linear actuator (6) comprises a transport device (8) configured to receive and support the wafer (2) transferred from the handling robot (5), the transport device (8) being configured to transport the wafer (2) along the translation axis (7) so as to load the wafer (2) inside the reaction chamber (3); The linear actuator (6) comprises a track (9) extending in a direction parallel to the translation axis (7); The conveying device (8) is connected to the track (9); and The system (1) according to claim 1, wherein the track (9) is configured to guide the movement of the conveying device (8) along the translation axis (7).
3. said conveying device (8) being a fork (13) with at least two prongs (14), preferably only two prongs (14), and a handle (15) connected to the at least two prongs (14); The fork (13) faces the reaction chamber (3), said prongs (14) and said handle (15) are positioned substantially parallel to said translation axis (7); and The system (1) according to claim 2, wherein the handle (15) is positioned on an opposite side of the prong (14) from the reaction chamber (3).
4. said conveying device (8) being movable from a start position (24) of movement to an end position (25) of movement in said reaction chamber (3) and to a transfer position (26) interposed between said start position (24) of movement and said end position (25), the transport device (8) is configured to receive the wafer (2) from the handling robot (5) when the transport device (8) is positioned at the transfer position (26); when the transport device (8) is positioned at the transfer position (26), the transport device (8) is configured to transfer the wafer (2) after processing to the handling robot (5); and 3. The system (1) according to claim 2, wherein the handling robot (5) is positioned laterally with respect to the linear actuator (6) at the transfer position (26).
5. the start position (24) of said movement corresponds to a fork position (13), and the end of said handle (15) opposite said prong (14) is positioned substantially at the start limit (10) of the movement of said track (9); 5. The system (1) according to claim 3 or 4, wherein the end position (25) of the movement corresponds to a fork position (13), the end of the handle (15) opposite the prong (14) being positioned substantially at the end limit (11) of the movement of the track (9), and wherein at the end position (25) of the movement the prong (14) extends beyond the track (9) and the handle (15) protrudes from the track (9).
6. a lifting system (16) connected to the linear actuator (6), the lifting system (16) is configured to move the linear actuator (6) along a direction transverse to the translation axis (7); A system (1) according to any one of the preceding claims, wherein said lifting system (16) is preferably a hydraulic or pneumatic or electromechanical type system.
7. two linear actuators (6) positioned on opposite sides of the handling robot (5), the linear actuators (6) being positioned parallel to each other and each linear actuator (6) facing a respective reaction chamber (3); and The system (1) according to any one of claims 1 to 6, wherein the two linear actuators (6) are preferably arranged perpendicular and parallel to the translation axis (7) and mirror-positioned with respect to a plane of symmetry (27) through which the handling robot (5) passes.
8. 8. The system (1) according to claim 7, comprising four linear actuators (6) defining two pairs of linear actuators (6), each pair of two linear actuators (6) being positioned on opposite sides with respect to the handling robot (5), and the linear actuators (6) of each pair of linear actuators (6) being adjacent to and parallel to each other.
9. The system (1) according to any one of claims 1 to 8, wherein the handling robot (5) is positioned laterally relative to one or more linear actuators (6), and the handling robot (5) is configured to transfer the wafer (2) to the linear actuators (6) or pick up the wafer (2) from the linear actuators (6) and move the wafer (2) along a direction substantially transverse to the translation axis (7).
10. the handling robot (5) comprises an articulated arm (17) extending between a fulcrum end (18) and an opposite gripping end (19) and comprises an end effector (20) connected to the articulated arm (17) at the gripping end (19), the end effector (20) being configured to move the wafer (2) and to pick up or place the wafer (2) from the linear actuator (6), in particular from a transport device (8); The system according to any one of claims 1 to 9, wherein the end effector (20) is movable on a handling plane parallel to the translation axis (7) fixed to a frame (21) of the epitaxial reactor (4).
11. An epitaxial reactor (4) comprising at least one reaction chamber (3) and a loading and unloading system (1) according to any one of claims 1 to 10, the reaction chamber (3) is positioned facing the linear actuator (6) along the translation axis (7) defined by the linear actuator (6); and The linear actuator (6) is configured to move the wafer (2) along the translation axis (7) towards the reaction chamber (3), the epitaxial reactor (4).
12. It comprises two reaction chambers (3), The system (1) comprises two linear actuators (6) and a handling robot (5) interposed between the two linear actuators (6), the linear actuators (6) being positioned parallel to each other, and 12. The epitaxial reactor (4) according to claim 11, wherein the reaction chambers (3) face the respective linear actuators (6) and, optionally, the two reaction chambers (3) and the two linear actuators (6) are arranged in a mirror-like arrangement with respect to a plane of symmetry (27) parallel to the translation axis (7) defined by the linear actuators (6) and through which the handling robot (5) passes.
13. a loading station (22) configured to store a plurality of wafers (2) to be used in the reaction chamber (3) for the epitaxial deposition process, the handling robot (5) configured to pick up the wafers (2) to be used in the reaction chamber (3) from the loading station (22) and transfer them to a linear actuator (6); the epitaxial reactor (4) comprises a cooling station (23) configured to store a plurality of wafers (2) coming from the reaction chamber (3), the cooling station (23) being separate from the loading station (22); the loading station (22) and the cooling station (23) are positioned between the linear actuator (6) and the reaction chamber (3) of the epitaxial reactor (4); Optionally, said handling robot (5) is positioned interposed between said loading station (22) and said cooling station (23); and Optionally, the handling robot (5), the loading station (22) and the cooling station (23) are substantially aligned along an axis parallel to the translational axis (7) of the respective linear actuators (6) and positioned interposed between the translational axes (7) of the respective linear actuators (6).