Electronic device and magnetic shield member thereof

Abstract

To provide an electronic device which is less interfered by magnetism, has a high freedom of assembly, can be manufactured in simple manufacturing steps, maintains a heat discharge effect, and satisfies a downsizing need, and a magnetic shield member of the electronic device.SOLUTION: There is provided an electronic device including a first assembly 1, a second assembly 2, and magnetic shield members 3. The first assembly is an electronic component. The second assembly is provided next to the first assembly. At least a part of the magnetic shield members are provided between the first assembly and the second assembly. The magnetic interference among elements can be reduced by providing the magnetic shield members between the first assembly and the second assembly.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to electronic equipment, and more particularly to an electronic device and a magnetic shield member thereof that are particularly susceptible to low magnetic interference. [Background technology]

[0002] With the advancement of technology, miniaturization of electronic devices has become one of the current trends. A typical electronic device on the market, such as a power adapter, is usually composed of multiple electronic components (e.g., transformers, inductors) and assemblies (e.g., housings). To achieve miniaturization, the configuration between the electronic components and the assemblies needs to be designed to be relatively compact. However, an excessively compact configuration may cause excessive magnetic interference between multiple electronic components. In addition, if the distance between the electronic components and the assemblies is too close, the magnetic interference of the electronic components will be reflected by the assemblies, so that the electronic components will also be affected by the magnetic interference.

[0003] In order to solve the above-mentioned problems, in some existing technologies, the electronic device further includes a copper plate. The copper plate is vertically arranged between two electronic components, and the copper plate is grounded, thereby reducing the magnetic interference between the two electronic components. However, the vertical copper plate is large in size, cannot meet the demand for miniaturization, and also makes the manufacturing process of the electronic device more difficult. In addition, the copper plate has a high cost and low flexibility in use.

[0004] In addition, in another prior art, the housing (i.e., assembly part) of the electronic device further includes an opening. The opening is disposed corresponding to the electronic component. By providing the opening, the magnetic interference reflected by the shell is reduced. However, by providing the opening in the housing, the heat dissipation area of ​​the housing is reduced, and the heat dissipation efficiency of the electronic device is reduced. In addition, providing the opening in the housing requires additional manufacturing costs and complicates the manufacturing process.

[0005] Thus, there is a need to provide an electronic device and its magnetic shielding member that overcomes the problems faced by existing technology. Summary of the Invention Problem to be solved

[0006] The present invention aims to provide a type of electronic device and a magnetic shield member thereof that reduce magnetic interference, have a high degree of freedom in assembly, have a simple manufacturing process, reduce comments, maintain heat dissipation effect, and satisfy the need for miniaturization.

[0007] In order to achieve the above object, the present invention provides an electronic device, comprising at least one first assembly, at least one second assembly, and at least one magnetic shield member, the first assembly being an electronic component; The electronic device includes a second assembly disposed adjacent to the first assembly, and at least a portion of the magnetic shielding member disposed between the first assembly and the second assembly.

[0008] In order to achieve the above-mentioned object, the present invention provides a magnetic shielding member applied to an electronic device, the electronic device including a first assembly and a second assembly, the first assembly being an electronic component, the second assembly being provided adjacent to the first assembly, and at least a portion of the magnetic shielding member being provided between the first assembly and the second assembly.

[0009] In one embodiment, the magnetic shielding member includes a magnetic barrier layer and at least one insulating sheet, a surface of the at least one insulating sheet is attached to one side of the magnetic barrier layer, and the at least one insulating sheet is provided facing the at least one first assembly.

[0010] In one embodiment, the magnetic shielding member is affixed to at least one of the first assembly and the second assembly.

[0011] In one embodiment, the magnetic shielding member is a flexible sheet structure and is surrounded by the periphery of the first assembly to form an enclosing structure.

[0012] In one embodiment, the surrounding structure is at least one of a circle, a triangle, a polygon, or an irregular shape.

[0013] In one embodiment, the second assembly is an electronic component, and the at least one insulating sheet of the magnetic shielding member includes a first insulating sheet and a second insulating sheet, the first insulating sheet and the second insulating sheet are respectively attached to opposite sides of the magnetic barrier layer, the first insulating sheet being provided toward the first assembly, and the second insulating sheet being provided toward the second assembly.

[0014] In one embodiment, the second assembly is a non-electronic component, and at least one insulating sheet of the magnetic shielding member is attached to one side of the magnetic barrier layer, with the at least one insulating sheet facing toward the first assembly and the magnetic barrier layer facing toward the second assembly.

[0015] In one embodiment, the magnetic barrier layer of the magnetic shielding member is applied to the second assembly.

[0016] In one embodiment, the magnetic barrier layer of the magnetic shielding member includes a plurality of magnetic sheets that are laminated and bonded to one another.

[0017] In one embodiment, two adjacent magnetic sheets of the magnetic barrier layer are attached by double-sided tape.

[0018] In one embodiment, the magnetic shielding member further includes at least one protective layer, which is removably provided on one side of the magnetic barrier layer or one side of the at least one insulating sheet, and is the outermost layer of the magnetic shielding member.

[0019] In one embodiment, the at least one protective layer includes a first protective layer and a second protective layer, the first protective layer and the second protective layer being removably provided on two opposing outermost layers of the magnetic shield member, respectively.

[0020] In one embodiment, at least one protective layer of the magnetic shield member is a release film. [Brief description of the drawings]

[0021] [Figure 1] 1 is a conceptual plan view of the structure of an electronic device according to a first embodiment of the present invention; [Diagram 2] 2 is a partially enlarged conceptual diagram of a region B of the electronic device in FIG. 1. [Diagram 3] 2 is a conceptual diagram of a partial cross-sectional structure of a magnetic shield member of the electronic device of FIG. 1. [Figure 4] FIG. 11 is a conceptual plan view of the structure of an electronic device according to a second embodiment of the present invention. [Diagram 5] FIG. 11 is a conceptual diagram showing a cross-sectional structure of an electronic device according to a third embodiment of the present invention. [Figure 6] 6 is a partially enlarged conceptual diagram of a region C of the electronic device in FIG. 5. [Figure 7] FIG. 13 is a conceptual diagram showing a three-dimensional structure of an electronic device according to a fourth embodiment of the present invention. [Figure 8] 8 is a conceptual exploded structural view of the electronic device shown in FIG. 7. [Figure 9] 13 is a conceptual diagram showing a partial cross-sectional structure of a magnetic shield member for electronic devices according to a modified example of the present invention. FIG. [Figure 10] FIG. 13 is a conceptual diagram showing a partial cross-sectional structure of a magnetic shield member for electronic devices according to another modified example of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] A number of exemplary embodiments embodying the features and advantages of the present invention are described in detail below. It is to be understood that the present invention may be modified in various ways without departing from the scope of the present invention, and that the description and illustrations are intended to be illustrative rather than limiting in nature.

[0023] FIG. 1 is a schematic plan view of an electronic device according to a first embodiment of the present invention, and FIG. 2 is a partially enlarged schematic view of an area B of the electronic device in FIG. 1. As shown in FIGS. 1 and 2, in this embodiment, the electronic device 100 includes at least one first assembly 1, at least one second assembly 2, and at least one magnetic shield member 3. In this embodiment, an example of one first assembly 1, one second assembly 2, and one magnetic shield member 3 will be described, but the present invention is not limited thereto. In this embodiment, the first assembly 1 is an electronic component, and the electronic component may be, for example, an inductive element, but is not limited thereto. In this embodiment, the second assembly 2 is also an electronic component, and the electronic component may be, for example, a transformer, but is not limited thereto. The first assembly 1 and the second assembly 2 are both provided on a circuit board A, and the second assembly 2 is provided adjacent to one side of the first assembly 1. The magnetic shield member 3 is provided between the first assembly 1 and the second assembly 2. By providing the magnetic shielding member 3 between the first assembly 1 and the second assembly 2, the interaction of magnetic interference between the first assembly 1 and the second assembly 2 is reduced. In this embodiment, the magnetic shielding member 3 is attached to the second assembly 2, but is not limited thereto. In one embodiment, the magnetic shielding member 3 is attached to the first assembly 1, or the magnetic shielding member 3 is attached to the first assembly 1 and the second assembly 2 simultaneously.

[0024] In this embodiment, the magnetic shield member 3 includes a magnetic barrier layer 31 and at least one insulating sheet 32. In this embodiment, the at least one insulating sheet 32 ​​includes a first insulating sheet 32a and a second insulating sheet 32b. The first insulating sheet 32a and the second insulating sheet 32b are respectively attached to opposite sides of the magnetic barrier layer 31. The first insulating sheet 32a is provided facing the first assembly 1, and the second insulating sheet 32b is provided facing the second assembly 2. By providing the first insulating sheet 32a and the second insulating sheet 32b of the magnetic shield member 3, the insulating effect between the first assembly 1 and the second assembly 2 is improved.

[0025] FIG. 3 is a conceptual diagram of a partial cross-sectional structure of the magnetic shield member of the electronic device of FIG. 1. As shown in FIGS. 1 to 3, in this embodiment, the magnetic barrier layer 31 of the magnetic shield member 3 includes a plurality of magnetic sheets 311, which are laminated and bonded to each other. In this embodiment, the magnetic barrier layer 31 is formed by laminating and bonding five magnetic sheets 311, but is not limited to this. The number of magnetic sheets 311 may be adjusted according to the required magnetic interference strength. Two adjacent magnetic sheets 311 are laminated and bonded to each other via an adhesive layer 33, and the adhesive layer 33 may be, for example, a double-sided tape, but is not limited to this. The first insulating sheet 32a and the second insulating sheet 32b are attached to both opposing sides of the magnetic barrier layer 31 via the adhesive layer 33, respectively. By providing the magnetic barrier layer 31 with a plurality of magnetic sheets 311 laminated, the strength of the magnetic shield member 3 to block magnetic interference is improved. Compared with the copper plate used in the related art, the magnetic shield member 3 of the present invention is thinner and less expensive, so that it is possible to save space and reduce costs. In addition, the magnetic shield member 3 of the present invention can obtain the effect of blocking magnetic interference without grounding, and is easy to assemble and has a high degree of freedom.

[0026] FIG. 4 is a planar structural conceptual diagram of an electronic device according to a second embodiment of the present invention. As shown in FIG. 4, in this embodiment, the electronic device 101 includes one first assembly 1, a plurality of second assemblies 2, and one magnetic shield member 3. In this embodiment, the first assembly 1 may be, for example, an inductive element, but is not limited thereto. The plurality of second assemblies 2 are all electronic components, and include a first electronic component 2a, a second electronic component 2b, and a third electronic component 2c. The first assembly 1, the first electronic component 2a, the second electronic component 2b, and the third electronic component 2c are all provided on the same surface of the circuit board A. The first electronic component 2a, the second electronic component 2b, and the third electronic component 2c are respectively provided on three different sides of the first assembly 1. In this embodiment, the magnetic shield member 3 is a flexible sheet-like structure, and surrounds the periphery of the first assembly 1 to form a rectangular surrounding structure. The rectangular surrounding structure formed by the magnetic shield member 3 surrounds the periphery of the first assembly 1, so that at least a part of the magnetic shield member 3 is located between the first assembly 1 and the first electronic component 2a, at least a part of the magnetic shield member 3 is located between the first assembly 1 and the second electronic component 2b, and at least a part of the magnetic shield member 3 is located between the first assembly 1 and the third electronic component 2c. The surrounding structure formed by the flexible magnetic shield member 3 reduces magnetic interference between the first assembly 1 and a plurality of second assemblies 2. The first assembly 1 has a first side, a second side, a third side, a fourth side, a fifth side, and a sixth side (not indicated with reference numerals in the figure), and in this embodiment, the flexible magnetic shield member 3 surrounds the first side, the second side, the third side, and the fourth side of the first assembly 1. In other embodiments, the flexible magnetic shielding member 3 may surround the second side, the fourth side, the fifth side and the sixth side of the first assembly 1, or the flexible magnetic shielding member 3 may surround the first side, the third side, the fifth side and the sixth side of the first assembly 1, or the flexible magnetic shielding member 3 may surround the first side, the second side, the third side, the fourth side, the fifth side and the sixth side of the first assembly 1.

[0027] In some embodiments, the flexible magnetic shielding member 3 may form a surrounding structure of different shapes as required, such as, but not limited to, at least one of a circular, triangular, polygonal, or irregular shape, providing high assembly freedom and flexibility.

[0028] FIG. 5 is a schematic diagram of a partial cross-sectional structure of an electronic device according to a third embodiment of the present invention, and FIG. 6 is a schematic diagram of a partial enlargement of an area C of the electronic device in FIG. 5. As shown in FIGS. 5 and 6, in this embodiment, the electronic device 102 includes one first assembly 1, one second assembly 2, and one magnetic shield member 3. In this embodiment, the first assembly 1 may be, for example, but is not limited to, an inductive element. The second assembly 2 may be, for example, but is not limited to, a non-electronic component, such as a housing having a heat dissipation function. The housing is provided to cover the circuit board A so that an accommodation space 4 is formed between the housing and the circuit board A. The first assembly 1 is provided on the circuit board A and is located in the accommodation space 4. The magnetic shield member 3 is located in the accommodation space 4 and includes one magnetic barrier layer 31 and one insulating sheet 32. The insulating sheet 32 ​​of the magnetic shield member 3 is attached to one side of the magnetic barrier layer 31, the insulating sheet 32 ​​is provided facing the first assembly 1, and the magnetic barrier layer 31 is provided facing the second assembly 2. By providing the magnetic shielding member 3 between the first assembly 1 and the second assembly 2, it is possible to prevent the magnetic interference generated by the first assembly 1 from being reflected by the second assembly 2, thereby realizing the effect of reducing the magnetic interference. Compared to the prior art, the magnetic shielding member 3 of the present invention can realize the effect of reducing the magnetic interference without the need to provide an opening in the housing, and the heat dissipation area of ​​the housing without an opening is increased, improving the heat dissipation performance. In this embodiment, the magnetic barrier layer 31 of the magnetic shielding member 3 is directly attached to one surface of the second assembly 2, but is not limited thereto.

[0029] FIG. 7 is a schematic diagram of a three-dimensional structure of an electronic device according to a fourth embodiment of the present invention, and FIG. 8 is a schematic diagram of an exploded structure of the electronic device shown in FIG. 7. As shown in FIGS. 7 and 8, in this embodiment, the electronic device 103 includes a plurality of first assemblies 1, one second assembly 2, and one magnetic shield member 3. In this embodiment, the plurality of first assemblies 1 are all electronic components, and include a first electronic component 1a, a second electronic component 1b, and a third electronic component 1c. The second assembly 2 is a non-electronic component, and may be, for example, a housing having a heat dissipation function, but is not limited thereto. The housing is provided to cover the circuit board A so that an accommodation space 4 is formed between the housing and the circuit board A. The first electronic component 1a, the second electronic component 1b, and the third electronic component 1c are provided on the same surface of the circuit board A, and are located in the accommodation space 4. The first electronic component 1a is provided on one side of the second electronic component 1b, and the third electronic component 1c is provided on the other side of the second electronic component 1b. The magnetic shield member 3 is provided in the accommodation space 4 and is located between the multiple first assemblies 1 and the second assemblies 2. The magnetic shield member 3 includes a first portion 35, a second portion 36, and a third portion 37. The second portion 36 is connected between the first portion 35 and the third portion 37. The magnetic shield member 3 is attached to the second assembly 2 and is located above the first electronic component 1a, the second electronic component 1b, and the third electronic component 1c. The first portion 35 is provided corresponding to the first electronic component 1a, the second portion 36 is provided corresponding to the second electronic component 1b, and the third portion 37 is provided corresponding to the third electronic component 1c. By providing the first portion 35, the second portion 36, and the third portion 37 of the magnetic shield member 3 corresponding to the multiple first assemblies 1, respectively, it is possible to avoid the magnetic interference generated by the multiple first assemblies 1 being reflected by the second assembly 2, thereby realizing the effect of reducing the magnetic interference. In some embodiments, the shape of the magnetic shield member 3 may be changed based on the shape and position of the first assembly 1, but the present invention is not limited to the above embodiments.

[0030] FIG. 9 is a conceptual diagram of a partial cross-sectional structure of a magnetic shield member of an electronic device according to a modified example of the present invention. The magnetic shield member 3a of this embodiment is similar in structure to the magnetic shield member 3 shown in FIG. 3, and the same reference numerals denote the same elements and functions, and therefore, description thereof will be omitted here. Unlike the magnetic shield member 3 shown in FIG. 3, the magnetic shield member 3a of this embodiment includes at least one protective layer 34. The at least one protective layer 34 is described as an example of two protective layers 34, including a first protective layer 34a and a second protective layer 34b. The first protective layer 34a is removably provided on the first insulating sheet 32a, and is located on one side of the magnetic barrier layer 31. The second protective layer 34b is removably provided on the second insulating sheet 32b, and is located on the other side of the magnetic barrier layer 31. The first protective layer 34a and the second protective layer 34b are the two outermost layers of the magnetic shield member 3, respectively, and protect the magnetic barrier layer 31 and the insulating sheet 32, and prevent damage and sticking during transportation. In this embodiment, the first protective layer 34a and the second protective layer 34b are attached to the first insulating sheet 32a and the second insulating sheet 32b by double-sided tape, respectively, and are removed before assembling the element, but are not limited to this. In this embodiment, at least one protective layer 34 of the magnetic shield member 3 is, for example, but is not limited to, a release film.

[0031] FIG. 10 is a conceptual diagram of a partial cross-sectional structure of a magnetic shield member of an electronic device according to another modified example of the present invention. The magnetic shield member 3b of this embodiment is similar in structure to the magnetic shield member 3a shown in FIG. 9, and the same reference numerals denote the same elements and functions, and therefore the description thereof will be omitted here. Unlike the magnetic shield member 3a shown in FIG. 9, the first protective layer 34a of at least one protective layer 34 of the magnetic shield member 3b of this embodiment is removably provided on the insulating sheet 32 ​​and is located on one side of the magnetic barrier layer 31. The second protective layer 34b is removably provided on the other side of the magnetic barrier layer 31 (the other side of the insulating sheet 32). The first protective layer 34a and the second protective layer 34b are the two outermost layers of the magnetic shield member 3, respectively, and protect the magnetic barrier layer 31 and the insulating sheet 32, and prevent damage and sticking during transportation. In this embodiment, the first protective layer 34a and the second protective layer 34b are attached to the insulating sheet 32 ​​and the magnetic barrier layer 31 by the adhesive layer 33, respectively, and are removed before assembling the element, but are not limited to this. In this embodiment, at least one protective layer 34 of the magnetic shield member 3 is, for example, but is not limited to, a release film.

[0032] In view of the above, the present invention provides an electronic device and a magnetic shielding member with less magnetic interference. By providing a magnetic shielding member between a first assembly and a second assembly, mutual influence of magnetic interference is reduced. By providing an insulating sheet of the magnetic shielding member, the insulating effect between elements is improved. By providing a magnetic barrier layer by stacking multiple magnetic sheets, the strength of blocking magnetic interference is improved. Compared with the copper plate used in the conventional technology, the magnetic shielding member of the present invention is thinner and less expensive, so that space saving and cost reduction can be achieved. The magnetic shielding member of the present invention can block magnetic interference without grounding, is easy to assemble, and has a high degree of freedom. By forming a surrounding structure with the magnetic shielding member or providing it corresponding to multiple electronic components, magnetic interference between multiple elements is reduced. By providing a protective layer on the outermost layer of the magnetic shielding member, damage and sticking of the magnetic shielding member during transportation are prevented.

[0033] The present invention can be modified in various ways by those skilled in the art, and all such modifications and variations are within the scope of the claims of the present invention without departing from the technical spirit of the present invention. [Explanation of symbols]

[0034] 100, 101, 102, 103: Electronic equipment 1: First assembly 1a: First electronic component 1b: Second electronic component 1c: Third electronic component 2: Second assembly 2a: First electronic component 2b: Second electronic component 2c: The third electronic component 3, 3a, 3b: Magnetic shielding material 31: Magnetic barrier layer 311: Magnetic sheet 32: Insulation sheet 32a: First insulating sheet 32b: Second insulating sheet 33: Adhesive layer 34:Protective layer 34a: First protective layer 34b: Second protective layer 35: Part 1 36:Second part 37: 3rd part 4: Containment space A: Circuit board B, C: area

Claims

1. 1. An electronic device comprising: at least one first assembly, at least one second assembly, and at least one magnetic shield member; the first assembly is an electronic component; the second assembly is disposed adjacent to the first assembly; At least a portion of the magnetic shield member is provided between the first assembly and the second assembly.

2. A magnetic shield member for use in an electronic device, the electronic device includes a first assembly and a second assembly; the first assembly is an electronic component, and the second assembly is provided adjacent to the first assembly; At least a portion of the magnetic shield member is provided between the first assembly and the second assembly.

3. The electronic device according to claim 1 or the magnetic shielding member according to claim 2, wherein the magnetic shielding member is attached to at least one of the first assembly and the second assembly.

4. 3. The electronic device of claim 1 or the magnetic shielding member of claim 2, wherein the magnetic shielding member is a flexible sheet-like structure and is surrounded by the periphery of the first assembly to form a surrounding structure, the surrounding structure being at least one of a circle, a triangle, a polygon, or an irregular shape.

5. the magnetic shield member includes a magnetic barrier layer and at least one insulating sheet; a surface of the insulating sheet is bonded to the magnetic barrier layer, the insulating sheet being provided facing the first assembly; the second assembly is an electronic component; the insulating sheet includes a first insulating sheet and a second insulating sheet, the first insulating sheet and the second insulating sheet are attached to opposite sides of the magnetic barrier layer, The electronic device according to claim 1 or the magnetic shield member according to claim 2, wherein the first insulating sheet is provided facing the first assembly, and the second insulating sheet is provided facing the second assembly.

6. the magnetic shield member includes a magnetic barrier layer and at least one insulating sheet; The surface of the insulating sheet is attached to one side of the magnetic barrier layer, the insulating sheet is provided facing the first assembly, the second assembly is a non-electronic component; The insulating sheet is attached to one side of the magnetic barrier layer, the insulating sheet is disposed toward the first assembly, and the magnetic barrier layer is disposed toward the second assembly; The electronic device of claim 1 or the magnetic shield member of claim 2, wherein the magnetic barrier layer is attached to the second assembly.

7. the magnetic shield member includes a magnetic barrier layer; the magnetic barrier layer includes a plurality of magnetic sheets; The magnetic sheets are laminated and bonded to one another, The electronic device according to claim 1 or the magnetic shield member according to claim 2, wherein the two adjacent magnetic sheets of the magnetic barrier layer are adhered together via a double-sided tape.

8. the magnetic shield member includes a magnetic barrier layer, at least one insulating sheet, and at least one protective layer; the protective layer is detachably provided on one side of the magnetic barrier layer or one side of the at least one insulating sheet, and is an outermost layer of the magnetic shield member; the protective layer includes a first protective layer and a second protective layer; the first protective layer and the second protective layer are provided on two opposing outermost layers of the magnetic shield member, 3. The electronic device according to claim 1 or the magnetic shield member according to claim 2, wherein the protective layer is a release film.

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