Displacement sensor, displacement analysis device, displacement analysis method, and displacement analysis program

Abstract

To provide a displacement sensor, a displacement analysis device, a displacement analysis method, and a displacement analysis program for improving the accuracy of detecting displacement of an object to be detected.SOLUTION: A conductive element 110 is arranged to overlap a plurality of conductive wires 111, such that, for example, the conductive element is alternated in a direction intersecting one direction of a substrate such as a flexible substrate 120 or a low-flexible substrate 130 and extends along one direction. When the state of contact between the conductive wires 111 becomes dense according to displacement of the substrate, a resistance value is reduced, and when the state of contact between the conductive wires 111 becomes sparse, the resistance value is increased, and thus a change in the resistance value following the displacement of the substrate can be obtained.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a displacement sensor, a displacement analysis device, a displacement analysis method, and a displacement analysis program, and more particularly to a displacement sensor, a displacement analysis device, a displacement analysis method, and a displacement analysis program using a conductive element. [Background technology]

[0002] Displacement sensors have been used to digitize human "movements" by recording the positions and movements of parts of the human body, such as joints, that characterize the movements of the body. The digitized movements are used to develop devices that reproduce the movements of the body. Displacement sensors are also useful not only for digitizing "movements," but also for digitizing the expansion and contraction and reactions of machines and materials used by people.

[0003] For example, a displacement sensor using a conductive element has been developed as a displacement sensor capable of detecting large distortions occurring in a soft object with a simple structure and good sensitivity (see, for example, Non-Patent Document 1).

[0004] Specifically, the displacement sensor disclosed in Non-Patent Document 1 is a displacement sensor that uses an inductive element, and includes an elastic substrate and an inductive element that is arranged on the elastic substrate so that a conductive wire extends in a direction along the stretching direction while reciprocating in a direction intersecting the stretching direction of the elastic substrate.

[0005] This allows the displacement of the stretchable substrate or the displacement of the movable part arranged along the stretchable substrate to be detected based on the characteristic that the inductance of the inductive element increases as the stretchable substrate stretches and decreases as the stretchable substrate contracts. [Prior art documents] [Non-patent literature]

[0006] [Non-Patent Document 1] Anita Vogl, Patrick Parzer, Teo Babic, Joanne Leong, Alex Olwal, Michael Haller, "StretchEBand: Enabling Fabric-Based Interactions through Rapid Fabrication of Textile Stretch Sensors", [online], Proceedings of CHI 2017 (SIGCHI Conference on Human Factors in Computing Systems), ACM, pp. 2617-2627, [Retrieved July 26, 2023], Internet<URL:https: / / research.google / pubs / pub46725.pdf> Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the displacement sensor disclosed in Non-Patent Document 1, although the inductance of the inductive element increases as the elastic substrate stretches and decreases as the substrate contracts, the change in resistance value does not follow the displacement of the detected object, resulting in low accuracy in detecting the displacement of the detected object.

[0008] FIG. 13 is a graph showing the relationship between the change in resistance value over time obtained by the displacement sensor disclosed in Non-Patent Document 1 and the elongation rate of the stretchable substrate. As shown in Fig. 13, the displacement sensor disclosed in Non-Patent Document 1 does not obtain a change in resistance value that follows the expansion of the stretchable substrate. In other words, the displacement of the object to be detected cannot be accurately measured only from the change in resistance value. Therefore, there is a problem in that the accuracy of detecting the displacement of the object to be detected is low.

[0009] The present invention has been made in consideration of these points, and aims to provide a displacement sensor, a displacement analysis device, a displacement analysis method, and a displacement analysis program that improve the detection accuracy of the displacement of an object to be detected. [Means for solving the problem]

[0010] In order to solve the above problems, the present invention provides a displacement sensor using a conductive element, characterized in that the conductive element is arranged so that a plurality of conductive wires are overlapped and alternately extend along one direction of a substrate while intersecting the one direction. Thereby, the conductive element is arranged such that a plurality of conductive wires overlap each other and extend along one direction while alternating with a direction intersecting the one direction of the base material.

[0011] The present invention also provides a displacement analysis device using a displacement sensor that uses conductive elements, the displacement analysis device comprising: a resistance value receiving means for receiving a resistance value of the conductive elements obtained from a displacement sensor that is made of conductive elements that are arranged so that a plurality of conductive wires overlap and extend along one direction of a base material while alternating in a direction intersecting the one direction; and an analysis means for analyzing the resistance value received by the resistance value receiving means.

[0012] As a result, the resistance value receiving means receives the resistance value of the conductive element obtained from the displacement sensor consisting of conductive elements arranged so that multiple conductive wires overlap and extend along one direction while alternating in a direction intersecting with one direction of the base material, and the resistance value received by the resistance value receiving means is analyzed by the analysis means.

[0013] The present invention also provides a displacement analysis method using a displacement sensor that uses conductive elements, the displacement analysis method comprising the steps of: receiving, by a resistance value receiving means, a resistance value of the conductive elements obtained from a displacement sensor that is made of conductive elements that are arranged so that a plurality of conductive wires overlap and extend along one direction of a base material while alternating in a direction intersecting the one direction; and analyzing, by an analysis means, the resistance value received by the resistance value receiving means.

[0014] As a result, the resistance value receiving means receives the resistance value of the conductive element obtained from the displacement sensor consisting of conductive elements arranged so that multiple conductive wires overlap and extend along one direction while alternating in a direction intersecting with one direction of the base material, and the resistance value received by the resistance value receiving means is analyzed by the analysis means.

[0015] The present invention also provides a displacement analysis program using a displacement sensor that uses conductive elements, characterized in that the program makes a computer function as a resistance value receiving means for receiving a resistance value of the conductive elements obtained from a displacement sensor that is made of conductive elements that are arranged so that a plurality of conductive wires overlap and extend along one direction of a base material while alternating in a direction intersecting the one direction, and as an analysis means for analyzing the resistance value received by the resistance value receiving means.

[0016] As a result, the resistance value receiving means receives the resistance value of the conductive element obtained from the displacement sensor consisting of conductive elements arranged so that multiple conductive wires overlap and extend along one direction while alternating in a direction intersecting with one direction of the base material, and the resistance value received by the resistance value receiving means is analyzed by the analysis means. Effect of the Invention

[0017] According to the displacement sensor, displacement analysis device, displacement analysis method, and displacement analysis program of the present invention, the conductive elements are arranged so that multiple conductive wires overlap and extend along one direction while alternating in a direction intersecting one direction of the substrate, so that displacement of the substrate changes the conductive path between the multiple conductive wires.

[0018] Specifically, if the contact between the conductive wires becomes closer in response to the displacement of the substrate, the resistance value decreases, and if the contact between the conductive wires becomes looser, the resistance value increases, so that it is possible to obtain a change in resistance value that follows the displacement of the substrate, thereby improving the detection accuracy of the displacement of the object to be detected. [Brief description of the drawings]

[0019] [Figure 1] 1A and 1B are a plan view and an enlarged view of a portion of a conductive element, showing a displacement sensor according to a first embodiment; [Diagram 2] 1A is a plan view showing an example of the arrangement of conductive elements arranged on a stretchable substrate, and FIG. 1B is an enlarged view showing an example of the arrangement of conductive wires that constitute the conductive elements. [Diagram 3] FIG. 4 is a diagram showing a change in resistance value caused by displacing a displacement sensor. [Figure 4] 1 is a reference diagram showing the characteristics of the change in resistance value of a conductive element and the change in a conductive wire during the elongation process of an elastic substrate. [Diagram 5] 13 is a reference diagram showing the characteristics of the change in resistance value of a conductive element and the change in the conductive wire when the stretchable substrate is maintained in an elongated state. FIG. [Figure 6] 1 is a reference diagram showing the characteristics of the change in resistance value of a conductive element and the change in a conductive wire during the contraction process of an elastic substrate. [Figure 7] FIG. 13 is a diagram showing the measurement results of resistance value changes in a tensile cycle test at the same elongation rate using displacement sensors with different widths of wave-shaped alternating units formed of conductive elements. [Figure 8] 5A and 5B are a plan view and an enlarged view of a portion of a conductive element, showing a displacement sensor according to a second embodiment. [Figure 9] This is a reference diagram showing the characteristics of the change in resistance value of the conductive element and the change in the conductive wire during the process of applying tensile strain so that the side of the low-elasticity substrate on which the conductive element is arranged becomes convex. [Figure 10] This is a reference diagram showing the characteristics of the change in resistance value of the conductive element and the change in the conductive wire during the process of applying compressive strain so that the side of the low-elasticity substrate on which the conductive element is arranged becomes concave. [Figure 11] FIG. 11 is a block diagram showing the concept of a displacement analysis device and a displacement analysis program according to a third embodiment. [Figure 12] 10 is a reference diagram showing an example of a result of analysis of resistance value information by an analysis unit of the displacement analysis device. FIG. [Figure 13]1 is a graph showing the relationship between the change in resistance value over time obtained by the displacement sensor disclosed in Non-Patent Document 1 and the elongation rate of a stretchable substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. First Embodiment FIG. 1 is a plan view showing a displacement sensor according to a first embodiment and an enlarged view of a part of a conductive element.

[0021] 1, the displacement sensor 100 according to the first embodiment is a sensor that uses a conductive element 110, and includes the conductive element 110 and an elastic substrate 120. An electrode E1 is provided at one end of the conductive element 110, and an electrode E2 is provided at the other end.

[0022] In the displacement sensor 100 of this embodiment, the arrangement of the conductive element 110 arranged on the stretchable substrate 120 changes as the stretchable substrate 120 expands or contracts, and the resistance value of the conductive element 110 to the AC voltage applied to the conductive element 110 from electrodes E1 and E2 provided at both ends of the conductive element 110 changes.

[0023] By understanding the characteristics of the change in resistance value of the conductive element 110, it is possible to detect the displacement of the conductive element 110, the displacement of the elastic substrate 120 on which the conductive element 110 is arranged, or the displacement of the object to which the displacement sensor 100 is attached.

[0024] The conductive element 110 is formed by arranging conductive wires 111 on the elastic substrate 120. Specifically, the conductive element 110 extends along the longitudinal direction of the elastic substrate 120 while the conductive wires 111 are alternated in a direction intersecting with the longitudinal direction, which is one direction of the elastic substrate 120.

[0025] Furthermore, as shown in the enlarged view of FIG. 1, the conductive element 110 is arranged so that the conductive wire 111 is folded back and overlapped multiple times to form an alternating unit that is alternating in a direction intersecting with the longitudinal direction.

[0026] As described later, the conductive wire 111 is folded back and overlapped multiple times to form the conductive element 110, and the contact state between adjacent conductive wires 111 is increased or decreased by expanding or contracting the elastic base material 120. The tension applied to the conductive wire 111 also changes due to the expansion or contraction of the elastic base material 120.

[0027] In the example of Fig. 1, the conductive wire 111 is arranged in a wave shape from one end side of the conductive element 110, and is folded back at the upper end of the wave shape. The conductive wire 111 is arranged along the wave shape formed from one end side to the lower end of the wave shape. The conductive wire 111 is further folded back at the lower end of the wave shape, and the conductive wire 111 is arranged at the upper end of the wave shape along the formed wave shape, and is arranged down to the lower end of the next wave shape.

[0028] By repeating this process, a conductive element 110 is formed, and the starting end of the conductive wire 111 provided on one end of the conductive element 110, the ending end of the conductive wire 111 provided on the other end of the conductive element 110, and the electrodes E1 and E2 can be formed.

[0029] As a result, the displacement sensor 100 according to the first embodiment can obtain a change in resistance value that follows the displacement of the stretchable substrate 120, and can grasp the displacement of the stretchable substrate 120, etc. from this change in resistance value.

[0030] By making the conductive element 110 into a multiple structure using conductive wire 111 in this manner, it is possible to obtain a change in resistance value that follows the displacement of the elastic substrate 120, so it is preferable to use a conductive thread that is not subjected to an insulating coating treatment for the conductive wire 111.

[0031] The material of the stretchable substrate 120 may be a stretchable warp-knitted, weft-knitted, or woven fabric, or a cloth-like elastic resin. In the present embodiment, the conductive element 110 is disposed on the stretchable substrate 120, but the conductive element 110 may be disposed on clothing made of a stretchable cloth to form clothing that measures displacement.

[0032] FIG. 2 is a plan view showing an example of the arrangement of conductive elements arranged on a stretchable substrate, and an enlarged view showing an example of the arrangement of conductive wires that constitute the conductive elements. Fig. 2(A) is a plan view showing an example of the arrangement of conductive elements 110 arranged on the stretchable substrate 120. As shown in Fig. 2(A), the conductive elements 110 arranged on the stretchable substrate 120 may be arranged to extend along the longitudinal direction, which is one direction of the stretchable substrate 120, while alternating in a direction intersecting the longitudinal direction.

[0033] For example, as shown in FIG. 2(A) (a), the conductive elements 110 may have straight sides alternating in a direction intersecting the longitudinal direction, or as shown in (b), the conductive elements 110 may be arranged in a serpentine manner so as to draw a sine curve.

[0034] The conductive elements 110 may also be arranged in a rectangular wave shape as in (C) or (d), or in a sawtooth shape as in (e), so long as they are arranged extending along the longitudinal direction while alternating in a direction intersecting the longitudinal direction, which is one direction of the elastic substrate 120.

[0035] Fig. 2(B) is an enlarged view showing an example of the arrangement of the conductive wire 111 constituting the conductive element 110. As shown in Fig. 2(B), the conductive wire 111 is arranged so as to be folded back and overlapped multiple times, thereby forming an alternating unit in which the conductive wire 111 is alternated in a direction intersecting with the longitudinal direction, and the position where the conductive wire 111 is folded back can be set arbitrarily.

[0036] 2B, for example, the conductive wire 111 is first arranged in a wave shape from one end of the conductive element 110 and then folded back at the other end. The conductive wire 111 is then arranged from the other end to the one end along the wave shape formed from the one end.

[0037] Furthermore, conductive wire 111 is arranged along the wave shape formed by folding back at one end to the other end. A conductive element 110 is formed by making the starting end side and the terminal end side of conductive wire 111 into electrode E1 and electrode E2.

[0038] 2(B), the conductive wire 111 is first arranged in a wave shape from one end of the conductive element 110, and when one wave shape is formed, it is folded back to the one end. The conductive wire 111 is arranged along the wave shape formed from the one end to the starting point of the one wave shape.

[0039] Furthermore, the conductive wire 111 is folded back at the starting point of one of the waveforms, and is arranged along the formed one of the waveforms to the end point of the one of the waveforms, and the next waveform is arranged with the conductive wire 111. By repeating this, the conductive element 110 is formed, and the starting end side of the conductive wire 111 provided on one end side of the conductive element 110 and the ending end side of the conductive wire 111 provided on the other end side of the conductive element 110 can be made into the electrodes E1 and E2.

[0040] In addition, in the upper and interrupted arrangement examples in Figure 2 (B), an example has been described in which a single conductive wire 111 is arranged in a wave shape as if drawn in one stroke to form a conductive element 110, but the conductive element 110 can also be formed using fragmentary conductive wire 111.

[0041] For example, in the arrangement example at the bottom of Fig. 2(B), a plurality of fragmentary conductive wires 111 are arranged in a wave shape to form a conductive element 110. Even in the arrangement example at the bottom of Fig. 2(B), the conductive element 110, in which the conductive wires 111 are arranged so as to overlap, expands and contracts the expandable substrate 120, thereby increasing and decreasing the contact state between adjacent conductive wires 111. This makes it possible to obtain a change in resistance value due to the expansion and contraction displacement.

[0042] For ease of explanation, the figure shows a gap between the conductive wires 111, but the conductive wires 111 can also be arranged so that they are in contact with each other.

[0043] FIG. 3 is a diagram showing a change in resistance value caused by displacing the displacement sensor. As shown in FIG. 3, the displacement sensor 100 can obtain different resistance change characteristics depending on the state of the extension process (A), the state in which the extension state is maintained (hereinafter referred to as the extension maintenance process) (B), and the contraction process (C).

[0044] In the elongation process (A) of Figure 3, as the elongation rate of the elastic substrate 120 increases, i.e., as the amount of tension on the elastic substrate 120 increases, the resistance value of the conductive element 110 increases in response to the increase in the amount of tension on the elastic substrate 120, and the resistance value changes from increasing to decreasing as the increase in the amount of tension is reduced to zero, i.e., the elongation rate remains constant.

[0045] In addition, in the elongation maintenance process (B) in Figure 3, the resistance value of the conductive element 110 decreases when the elongation rate of the elastic substrate 120 is maintained at a constant amount, i.e., when the increase in the amount of tension on the elastic substrate 120 is set to zero.

[0046] Furthermore, in the contraction process (C) of Figure 3, as the elongation rate of the elastic substrate 120 decreases, i.e., as the amount of tension on the elastic substrate 120 decreases, the resistance value of the conductive element 110 temporarily increases, and then the resistance value of the conductive element 110 decreases in response to the decrease in the amount of tension on the elastic substrate 120.

[0047] In this manner, when the displacement sensor 100 is extended, the resistance value increases, when the extension of the displacement sensor 100 is stopped, the resistance value changes from increasing to decreasing, when the extension state of the displacement sensor 100 is maintained, the resistance value decreases, and when the displacement sensor 100 is contracted, the resistance value temporarily increases and then changes to decreasing. From this characteristic, the extension / contraction state of the displacement sensor 100 can be detected.

[0048] FIG. 4 is a reference diagram showing the characteristics of the change in resistance value of the conductive element and the change in the conductive wire during the elongation process of the stretchable substrate. As shown in FIG. 4, during the process of stretching the stretchable substrate 120, the stretchable substrate 120 is pulled outward in the longitudinal direction, and the conductive elements 110 arranged in a wave shape are pulled outward in the longitudinal direction of the stretchable substrate 120.

[0049] At this time, the conductive wires 111 constituting the conductive element 110 are pulled outward in the longitudinal direction between adjacent conductive wires 111, widening the gap between the conductive wires 111. As a result, the conductive wires 111 change from dense to sparse, and the conductive path changes from short to long. As the conductive path becomes longer, the resistance value increases.

[0050] Furthermore, by stretching the elastic base material 120, the conductive element 110 is pulled outward in the longitudinal direction of the elastic base material 120. As a result, a tension acts on the conductive wire 111 constituting the conductive element 110, pulling it outward in the longitudinal direction. The tension on the conductive wire 111 increases the resistance value.

[0051] As described above, during the process of stretching the elastic substrate 120, the corrugated conductive wires 111 are pulled outward in the longitudinal direction, causing the conductive path to change from short to long, and it is thought that the resistance value increases due to the increased tension on the conductive wires 111.

[0052] FIG. 5 is a reference diagram showing the characteristics of the change in resistance value of the conductive element and the change in the conductive wire when the stretchable substrate is maintained in an elongated state. As shown in FIG. 5, when the stretchable substrate 120 is maintained in an elongated state, the stretchable substrate 120 is pulled in the longitudinal direction, and the conductive elements 110 arranged in a wave shape are pulled in the longitudinal direction of the stretchable substrate 120.

[0053] Although the stretchable substrate 120 is pulled outward in the longitudinal direction, by reducing the increase in the amount of tension to 0, stress relaxation occurs in the stretchable substrate 120. Due to the effect of this stress relaxation, the conductive element 110, which was pulled outward in the longitudinal direction, returns slightly to the inward direction in the longitudinal direction.

[0054] At this time, the conductive wires 111 constituting the conductive element 110 move the spacing between adjacent conductive wires 111 slightly inward in the longitudinal direction, narrowing the spacing between the conductive wires 111. As a result, the conductive wires 111 change slightly from sparse to dense, causing a small change in the conductive path from long to short. As the conductive path becomes shorter, the resistance value decreases.

[0055] Furthermore, by maintaining the stretchable substrate 120 in an elongated state, stress generated in the stretchable substrate 120 is relieved, causing the conductive element 110 to return slightly to the inside in the longitudinal direction of the stretchable substrate 120. As a result, the conductive wire 111 constituting the conductive element 110 also returns to the inside in the longitudinal direction, and the tension on the conductive wire 111 also decreases. The reduction in tension on the conductive wire 111 reduces the resistance value.

[0056] As described above, when the stretchable substrate 120 is maintained in an elongated state, the conductive wires 111 that were pulled outward in the longitudinal direction return slightly inward due to stress relaxation, changing the conductive path from long to short, and it is considered that the resistance value decreases due to the reduction in tension on the conductive wires 111 caused by stress relaxation. Then, by transitioning from the elongation process of the stretchable substrate 120 to a state in which the stretchable substrate 120 is maintained in an elongated state, the resistance value of the conductive element 110 changes from an increase to a decrease.

[0057] FIG. 6 is a reference diagram showing the characteristics of the change in resistance value of the conductive element and the change in the conductive wire during the contraction process of the stretchable substrate. As shown in FIG. 6, during the process of contracting the stretchable substrate 120, the stretchable substrate 120 returns to the inside in the longitudinal direction, and the conductive elements 110 arranged in a wave shape return to the inside in the longitudinal direction of the stretchable substrate 120.

[0058] At this time, the conductive wires 111 constituting the conductive element 110 move toward the inside in the longitudinal direction of the adjacent conductive wires 111, narrowing the gap between the conductive wires 111. As a result, the conductive wires 111 change from sparse to dense, and the conductive path changes from long to short. As the conductive path becomes shorter, the resistance value decreases.

[0059] On the other hand, by contracting the stretchable substrate 120, the conductive element 110 returns to the inside in the longitudinal direction of the stretchable substrate 120. As a result, the conductive wire 111 constituting the conductive element 110 also returns to the inside in the longitudinal direction, and the tension is reduced.

[0060] As the tension on the conductive wire 111 decreases, the conductive fibers that make up the conductive wire 111 become less entangled, and the conductive wire 111 becomes unraveled. This causes the spacing between the conductive fibers that make up the conductive wire 111 to increase. As a result, the conductive wire 111 changes from dense to sparse, and the conductive path changes from short to long. It is believed that when the conductive path becomes longer, the resistance value temporarily increases.

[0061] As described above, during the process of contracting the elastic substrate 120, the conductive wires 111 formed in a wavy shape return to their longitudinally inward position, causing the conductive path to change from long to short, and the conductive fibers are unraveled due to a decrease in tension on the conductive wires 111, causing the conductive path to change from short to long, which is thought to result in a temporary increase in resistance.

[0062] FIG. 7 is a diagram showing the measurement results of the change in resistance value in a tensile cycle test at the same elongation rate, using displacement sensors with different widths of wave-shaped alternating units formed of conductive elements. As shown in Figure 7, when the width of the alternating unit is 1 mm, the resistance value increases in accordance with the stretch, but when the width of the alternating unit is 3 mm, the increase in the resistance value stops midway through the stretch. From this, it is believed that a smaller width of the alternating unit allows for a larger stretch to be measured because there are more contact points between the conductive threads.

[0063] From these results, it is possible to adjust the detection range of the resistance value of the conductive element 110 to be measured by adjusting the width of the alternating unit, and the width of the alternating unit can be changed according to the range of motion of the part to be measured.

[0064] In other words, by reducing the width of the alternating unit in places where the range of motion is large, the movement of the range of motion can be detected in detail, and by increasing the width of the alternating unit in places where the range of motion is small, the movement of the range of motion can be detected and the amount of conductive wire 111 used can be reduced.

[0065] As described above, in the displacement sensor 100 of this embodiment, the arrangement of the conductive element 110 arranged on the stretchable substrate 120 changes as the stretchable substrate 120 stretches and contracts, and the resistance value of the conductive element 110 to the AC voltage applied to the conductive element 110 from the electrodes E1 and E2 provided at both ends of the conductive element 110 changes so as to follow the stretching.

[0066] By understanding the characteristics of the change in resistance value of the conductive element 110, it is possible to detect the displacement of the conductive element 110, the displacement of the elastic substrate 120 on which the conductive element 110 is arranged, or the displacement of the object to which the displacement sensor 100 is attached.

[0067] Second Embodiment Next, a second embodiment of the present invention will be described. The displacement sensor of this embodiment has almost the same configuration as that shown in the first embodiment, except for the characteristics of the base material. Specifically, the base material shown in the first embodiment is made of an elastic material, whereas the base material shown in the second embodiment is made of a low elastic material. Therefore, the same reference numerals are used for the components almost the same as those in the first embodiment, and the description thereof will be omitted as appropriate.

[0068] FIG. 8 is a plan view showing a displacement sensor according to the second embodiment and an enlarged view of a part of a conductive element. 8, the displacement sensor 100 according to the second embodiment is a displacement sensor using a conductive element 110, and includes the conductive element 110 and a low-elasticity substrate 130. An electrode E1 is provided at one end of the conductive element 110, and an electrode E2 is provided at the other end.

[0069] In the displacement sensor 100 of this embodiment, by applying tensile or compressive strain to the plane where the longitudinal direction, which is one direction of the low-elasticity substrate 130, and the conductive element 110 intersect, the arrangement state of the conductive element 110 arranged on the low-elasticity substrate 130 changes, and the resistance value of the conductive element 110 to the AC voltage applied to the conductive element 110 from electrodes E1 and E2 provided at both ends of the conductive element 110 changes.

[0070] By understanding the characteristics of the change in resistance value of the conductive element 110, it is possible to detect the displacement of the conductive element 110, the displacement of the low-elasticity substrate 130 on which the conductive element 110 is arranged, or the displacement of the object to which the displacement sensor 100 is attached.

[0071] That is, in the displacement sensor 100 of the first embodiment, the base material is an elastic base material 120, so that the expansion and contraction displacement of the base material can be detected, and in the displacement sensor 100 of the second embodiment, the base material is a low-elasticity base material 130, so that the bending displacement of the base material can be detected.

[0072] The conductive element 110 is formed by arranging conductive wires 111 on the low-elasticity substrate 130. Specifically, the conductive element 110 extends along the longitudinal direction of the elastic substrate 120 while the conductive wires 111 are alternated in a direction intersecting with the longitudinal direction, which is one direction of the low-elasticity substrate 130.

[0073] Furthermore, as shown in the enlarged view of FIG. 1, the conductive element 110 is arranged so that the conductive wire 111 is folded back and overlapped multiple times to form an alternating unit that is alternating in a direction intersecting with the longitudinal direction.

[0074] As described later, the conductive element 110 is formed by arranging the conductive wire 111 so that it is folded back and overlapped multiple times, and the contact state between adjacent conductive wires 111 increases or decreases by applying tensile or compressive strain to the low-elasticity substrate 130. In addition, the tension applied to the conductive wire 111 changes due to the tensile or compressive strain of the low-elasticity substrate 130.

[0075] Further, low-elasticity felt material, polyester material, etc. can be used as the material of the low-elasticity substrate 130. Further, in the present embodiment, an example in which the conductive element 110 is disposed on the low-elasticity substrate 130 will be described, but by disposing the conductive element 110 on clothing formed from a low-elasticity material, clothing for measuring displacement can also be formed.

[0076] For convenience of explanation, the portion where the multiple conductive wires 111 constituting the conductive element 110 are folded back is referred to as a corner portion, and the portion where the multiple conductive wires 111 are bundled is referred to as a bundle portion.

[0077] FIG. 9 is a reference diagram showing the characteristics of the change in resistance value of the conductive element and the change in the conductive wire during the process of applying tensile strain so that the side of the low-elasticity substrate on which the conductive element is arranged becomes convex.

[0078] As shown in Figure 9 (A), in the process of applying tensile strain so that the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged becomes convex, the low-elasticity substrate 130 is strained while being pulled outward in the longitudinal direction, and the conductive element 110 arranged in a wave shape is strained while being pulled outward in the longitudinal direction of the elastic substrate 120.

[0079] At this time, as shown in Fig. 9(B), in the bundled portion of the conductive wires 111 constituting the conductive element 110, the conductive wires 111 that are close to each other are pulled outward in the longitudinal direction and distorted, narrowing the distance between the conductive wires 111. As a result, the conductive wires 111 change from sparse to dense, and the conductive path changes from long to short. As the conductive path becomes shorter, the resistance value decreases.

[0080] 9(C), at the corners of the conductive wires 111 constituting the conductive element 110, adjacent conductive wires 111 are distorted while being pulled outward in the longitudinal direction, so that the distance between the conductive wires 111 increases. As a result, the conductive wires 111 change from dense to sparse, and the conductive path changes from short to long. As the conductive path becomes longer, the resistance value increases.

[0081] During the process of applying tensile strain so that the side of the low-elasticity substrate 130 on which the conductive element 110 is placed becomes convex, it is thought that the resistance value decreases in the bundle portion and increases in the corner portion; however, the conductive wire 111 in the corner portion moves first, and then the conductive wire 111 in the bundle portion moves, so that the resistance value of the conductive element 110 temporarily increases and then decreases.

[0082] On the other hand, in the process of relaxing the tensile strain from a state in which the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged becomes convex, the strain is relaxed as the low-elasticity substrate 130 returns to the inside in the longitudinal direction, and the conductive element 110 arranged in a wave shape is relaxed as it returns to the inside in the longitudinal direction of the low-elasticity substrate 130.

[0083] At this time, in the bundled portion of the conductive wires 111 that make up the conductive element 110, the adjacent conductive wires 111 return to the inside in the longitudinal direction, eliminating the distortion, and the distance between the conductive wires 111 increases. As a result, the conductive wires 111 change from dense to sparse, and the conductive path changes from short to long. As the conductive path becomes longer, the resistance value increases.

[0084] Furthermore, at corners of the conductive wires 111 constituting the conductive element 110, the distance between the conductive wires 111 narrows as the adjacent conductive wires 111 return to the inside in the longitudinal direction, alleviating distortion. As a result, the conductive wires 111 change from sparse to dense, and the conductive path changes from long to short. As the conductive path becomes shorter, the resistance value decreases.

[0085] In the process of relaxing the tensile strain from a state in which the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged becomes convex, it is thought that the resistance value increases in the bundle portion and decreases in the corner portion; however, the conductive wire 111 in the bundle portion moves first, and then the conductive wire 111 in the corner portion moves, so that the resistance value of the conductive element 110 temporarily increases and then decreases.

[0086] From the above, based on the characteristic that the resistance value of the conductive element 110 temporarily increases, it is possible to detect the displacement caused by applying tensile strain so that the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged is convex.

[0087] In addition, based on the characteristic that the resistance value of the conductive element 110 temporarily increases, decreases, and then temporarily increases again, it is possible to detect the displacement in which the tensile strain is relaxed from a state in which the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged is made convex.

[0088] FIG. 10 is a reference diagram showing the characteristics of the change in resistance value of the conductive element and the change in the conductive wire during the process of applying compressive strain so that the side of the low-elasticity substrate on which the conductive element is arranged becomes concave.

[0089] As shown in Figure 10 (A), in the process of applying compressive strain so that the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged becomes concave, the low-elasticity substrate 130 is strained while being compressed inward in the longitudinal direction, and the conductive element 110 arranged in a wave shape is strained while being compressed inward in the longitudinal direction of the elastic substrate 120.

[0090] 10(B), in the bundled portion of the conductive wires 111 constituting the conductive element 110, the conductive wires 111 that are close to each other are compressed inward in the longitudinal direction and distorted, so that the distance between the conductive wires 111 increases. As a result, the conductive wires 111 change from dense to sparse, and the conductive path changes from short to long. As the conductive path becomes longer, the resistance value increases.

[0091] 10(C), at the corners of the conductive wires 111 constituting the conductive element 110, adjacent conductive wires 111 are compressed inward in the longitudinal direction while being distorted, narrowing the gap between the conductive wires 111. As a result, the conductive wires 111 change from sparse to dense, and the conductive path changes from long to short. As the conductive path becomes shorter, the resistance value decreases.

[0092] During the process of applying compressive strain so that the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged becomes concave, it is thought that the resistance value increases in the bundle portion and decreases in the corner portion; however, the conductive wire 111 in the bundle portion moves first, and then the conductive wire 111 in the corner portion moves, so that the resistance value of the conductive element 110 temporarily increases and then decreases.

[0093] On the other hand, in the process of relaxing the compressive strain from a state in which the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged becomes concave, the strain is relaxed as the low-elasticity substrate 130 returns to the outside in the longitudinal direction, and the conductive element 110 arranged in a wave shape is relaxed as it returns to the outside in the longitudinal direction of the low-elasticity substrate 130.

[0094] At this time, in the bundled portion of the conductive wires 111 that make up the conductive element 110, the adjacent conductive wires 111 return to the outside in the longitudinal direction, relieving the distortion, and the spacing between the conductive wires 111 narrows. As a result, the conductive wires 111 change from sparse to dense, and the conductive path changes from long to short. As the conductive path becomes shorter, the resistance value decreases.

[0095] Furthermore, at corners of the conductive wires 111 constituting the conductive element 110, the adjacent conductive wires 111 return to the outside in the longitudinal direction, alleviating distortion, and the distance between the conductive wires 111 increases. As a result, the conductive wires 111 change from dense to sparse, and the conductive path changes from short to long. As the conductive path becomes longer, the resistance value increases.

[0096] In the process of relaxing the compressive strain from a state in which the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged becomes concave, it is thought that the resistance value decreases in the bundle portion and increases in the corner portion; however, the conductive wire 111 in the corner portion moves first, and then the conductive wire 111 in the bundle portion moves, so that the resistance value of the conductive element 110 temporarily increases and then decreases.

[0097] From the above, based on the property that the resistance value of the conductive element 110 temporarily increases, it is possible to detect the displacement caused by applying compressive strain so that the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged is concave.

[0098] In addition, based on the characteristic that the resistance value of the conductive element 110 temporarily increases, decreases, and then temporarily increases again, it is possible to detect the displacement in which the compressive strain is relieved from a state in which compressive strain is applied by making the side of the low-elasticity substrate 130 on which the conductive element 110 is arranged concave.

[0099] In the displacement sensor 100 of this embodiment, by applying tensile or compressive strain to the plane where the longitudinal direction, which is one direction of the low-elasticity substrate 130, and the conductive element 110 intersect, the arrangement state of the conductive element 110 arranged on the low-elasticity substrate 130 changes, and the resistance value of the conductive element 110 to the AC voltage applied to the conductive element 110 from electrodes E1 and E2 provided at both ends of the conductive element 110 changes.

[0100] By understanding the characteristics of the change in resistance value of the conductive element 110, it is possible to detect the displacement of the conductive element 110, the bending displacement of the low-elasticity substrate 130 on which the conductive element 110 is arranged, or the bending displacement of the object to which the displacement sensor 100 is attached.

[0101] Third embodiment Next, a third embodiment of the present invention will be described. The displacement analysis device and the displacement analysis program of this embodiment are an analysis device and an analysis program that utilize the displacement sensor shown in the first and second embodiments. Therefore, the displacement sensor has almost the same configuration as that shown in the first and second embodiments. Therefore, the same reference numerals are used for the components that are almost the same as those in the first and second embodiments, and the description thereof will be omitted as appropriate.

[0102] FIG. 11 is a block diagram showing the concept of a displacement analysis device and a displacement analysis program according to the third embodiment. As shown in FIG. 11, a displacement sensor 100 attached to an object to be detected, the displacement of which is to be analyzed, is connected to a displacement analyzing device 200.

[0103] The displacement analysis device 200 and the displacement analysis program of this embodiment are devices for detecting the movement of an object to be detected and identifying the object from its movement by analyzing resistance value information obtained from the displacement sensor 100 attached to the object to be detected whose displacement is to be analyzed. In addition, the material of the substrate and the width of the alternating unit of the displacement sensor 100 attached to the object to be detected can be adjusted depending on the type and magnitude of the displacement to be measured and the part to which it is attached.

[0104] The displacement analysis device 200 is an information processing device including a resistance value receiving means 210 , an information storage means 220 , an analysis means 230 , and a display means 240 . In addition, the displacement analysis device 200 may include a control unit (not shown) for interpreting a program and issuing instructions, a calculation unit for performing calculations according to the instructions of the program, an input unit for inputting information such as instruction signals via an input means, and an output unit for outputting data to a connected external device.

[0105] The resistance value receiving means 210 is for receiving the resistance value obtained by an AC voltage applied to the displacement sensor 100 by a voltage application means that applies an AC voltage to the conductive element 110 from electrodes E1 and E2 provided at both ends of the conductive element 110 (not shown here), and is connected to each displacement sensor 100 attached to the object to be detected and to the information storage means 220.

[0106] The resistance value received by the resistance value receiving means 210 is stored in the connected information storage means 220 in association with identification information for identifying the displacement sensor 100 and time information at which the resistance value was received.

[0107] The information storage means 220 is connected to the resistance value receiving means 210 and the analyzing means 230 , and is a storage medium for storing various pieces of information required for the displacement analyzing apparatus 200 . Specifically, the information storage means 220 can store the resistance value information received by the resistance value receiving means 210, analysis information required for analysis by the analysis means 230 described later, and the like. Furthermore, the information storage means 220 can store programs for causing the computer to function as the resistance value receiving means 210 and the analysis means 230 .

[0108] The analysis means 230 is for analyzing the resistance value information stored in the information storage means 220 . The analysis means 230 may include, for example, a calculation processing unit 231 , a learning unit 232 , and a judgment unit 233 .

[0109] The calculation processing unit 231 is for performing various calculation processes required for analysis. For example, the calculation processing unit 231 can calculate a graph showing the change in resistance value over time from the resistance value information stored in the information storage means 220, and can perform fast Fourier transform processing on these to calculate a graph showing the change in amplitude over frequency. This makes it possible to visualize the displacement of the displacement sensor 100.

[0110] The learning unit 232 is for learning information necessary for analysis. For example, it measures a change in resistance value from the displacement of an object to be learned, and creates learning displacement information with the displacement information of the object corresponding to the measurement result, such as a change in elongation rate or a change in bending rate, as a correct answer label.

[0111] A large amount of the created learning displacement information is input to the learning section 232 by an input means (not shown), and the learning section 232 performs learning to identify the displacement of the object to be detected from the input resistance value change.

[0112] The learning unit 232 performs learning for extracting characteristics of resistance value changes in the learning displacement information input to the learning unit 232 by deep learning using a neural network model called U-NET, for example, to determine the displacement of the object to be detected. Displacement identification learning information for identifying the displacement of the object to be detected obtained by learning is stored in the information storage means 220 by the learning unit 232.

[0113] The judgment unit 233 is connected to the information storage means 220, and is configured to analyze the input resistance value change based on the displacement identification learning information stored in the information storage means 220 by the learning unit 232, and judge the displacement of the object to be detected, the magnitude of the displacement, etc.

[0114] The display means 240 is connected to the analysis means 230 and serves to display the results of the analysis performed by the analysis means 230. The display means 240 is, for example, a monitor connected to the displacement analysis device 200 or a printer that outputs on paper. In addition, the information output by the displacement analysis device 200 via a network or the like can also be displayed on a terminal device such as a mobile phone or smartphone owned by a viewer of the analysis results.

[0115] As described above, in the displacement analyzing device 200 of the present embodiment, the input resistance value information is analyzed and the analysis result is displayed on the display means 240, so that the displacement of the displacement sensor 100 can be visualized.

[0116] FIG. 12 is a reference diagram showing an example of the results of analysis of resistance value information by the analysis means of the displacement analysis device. As shown in FIG. 12, the analysis means 230 possessed by the displacement analysis device 200 has a calculation processing unit 231 which processes and calculates a graph showing the change in resistance value over time from the resistance value information stored in the information storage means 220, and the calculation processing unit 231 performs fast Fourier transform processing on these to calculate a graph showing the change in amplitude over frequency.

[0117] This visualizes the change in resistance and the change in amplitude versus frequency depending on the behavior of the object to which the displacement sensor 100 is attached. From this change in amplitude versus frequency, a graph can be obtained that corresponds to the behavior of the object to which the displacement sensor 100 is attached, and from this graph it is possible to identify what behavior the object is performing. [Explanation of symbols]

[0118] 100 Displacement Sensor 110 Conductive element 111 Conductive wire 120 Stretchable base material 130 Low elasticity base material 200 Displacement analysis device 210 Resistance value reception means 220 Information storage means 230 Analysis Means 231 Calculation Processing Unit 232 Learning Unit 233 Judgment Unit 240 Display Means Electrode E1 Electrode E2

Claims

1. In a displacement sensor using a conductive element, A conductive element in which a plurality of conductive wires are overlapped and arranged to extend along one direction of a substrate while alternating in a direction intersecting the one direction of the substrate; A displacement sensor comprising:

2. The conductive wire is Conductive yarn that is not coated with insulating material.

2. The displacement sensor according to claim 1,

3. The alternating units are arranged in a direction intersecting one direction of the base material, The conductive wire is folded back in the middle of the alternating unit or at an end of the alternating unit.

2. The displacement sensor according to claim 1,

4. The detection range of the resistance value of the conductive element to be measured can be adjusted by changing the width of the alternating units that are alternating in a direction intersecting one direction of the base material; 2. The displacement sensor according to claim 1,

5. The substrate is a stretchable substrate, 2. The displacement sensor according to claim 1, wherein the expansion displacement of the elastic substrate in the one direction can be detected based on the characteristic that the resistance value of the conductive element increases.

6. 6. The displacement sensor according to claim 5, wherein the stop of the extension displacement can be detected based on a characteristic where the resistance value of the conductive element changes from an increase to a decrease.

7. 7. The displacement sensor according to claim 6, wherein a state in which the extension displacement is stopped and maintained can be detected based on a characteristic in which a resistance value of the conductive element decreases.

8. The substrate is a stretchable substrate, 2. The displacement sensor according to claim 1, wherein the contraction displacement of the stretchable substrate in one direction can be detected based on the characteristic that the resistance value of the conductive element changes from a temporary increase to a decrease.

9. The substrate is a low-elasticity substrate, 2. The displacement sensor according to claim 1, wherein a bending displacement in a plane where one direction of the low-elasticity substrate and the conductive element intersect can be detected based on a characteristic that the resistance value of the conductive element temporarily increases.

10. 10. The displacement sensor according to claim 9, capable of detecting that the bending displacement has been relaxed based on the characteristic that the resistance value of the conductive element changes from a temporarily increasing characteristic to a decreasing characteristic and then temporarily increasing again.

11. In a displacement analysis device using a displacement sensor using a conductive element, a resistance value receiving means for receiving a resistance value of the conductive element obtained from a displacement sensor including a conductive element arranged so that a plurality of conductive wires overlap each other and extend along one direction of a base material while alternating in a direction intersecting the one direction; analysis means for analyzing the resistance value received by the resistance value receiving means; A displacement analysis device comprising:

12. The analysis means a learning means for learning, in association with each other, displacement information due to the displacement of the displacement sensor and resistance value information that changes due to the displacement of the displacement sensor; a displacement determination means for determining a displacement of the displacement sensor from newly obtained resistance value information based on the learning information obtained by the learning means; 12. The displacement analysis apparatus according to claim 11, further comprising:

13. The analysis means Detection object identification information for identifying a detection object to which the displacement sensor is attached; Object resistance value information, which is a resistance value that changes depending on the movement of an object attached to the object; A learning method for learning by relating the above; a detection object determination means for identifying the detection object from newly obtained resistance value information based on the learning information obtained by the learning means; 12. The displacement analysis apparatus according to claim 11, further comprising:

14. The analysis means a calculation processing unit that converts information about resistance value displacement versus time obtained from the displacement sensor into information about amplitude displacement versus frequency; 12. The displacement analysis apparatus according to claim 11, further comprising:

15. In a displacement analysis method using a displacement sensor using a conductive element, a step of receiving, by a resistance value receiving means, a resistance value of the conductive element obtained from a displacement sensor including conductive elements arranged so as to extend along one direction of a substrate while alternating in a direction intersecting the one direction of the substrate, with a plurality of conductive wires overlapping each other; an analysis means for analyzing the resistance value received by the resistance value receiving means; A displacement analysis method comprising:

16. In a displacement analysis program using a displacement sensor that uses a conductive element, Computer, a resistance value receiving means for receiving a resistance value of the conductive element obtained from a displacement sensor including a conductive element arranged so that a plurality of conductive wires overlap each other and extend along one direction of a base material while alternating in a direction intersecting the one direction; an analysis means for analyzing the resistance value received by the resistance value receiving means; A displacement analysis program characterized by functioning as follows.

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