Dividing method for workpiece

Abstract

To provide a method for dividing a workpiece which does not require preparation for an exclusive holding surface when dividing the workpiece.SOLUTION: A dividing method for a package substrate 2, which is a workpiece: includes a housing step of housing a package substrate 2 in a housing tray 12 by placing the package substrate 2 located on a resin layer 18 of the housing tray 12 having a bottom plate 11 on which the resin layer 18 is laid and a side wall portion 16 protruding in a direction crossing a surface direction of the bottom plate 11; and a dividing step of dividing the package substrate 2, held on a holding table 30 via the storage tray 12, into a plurality of chips 6 along dividing grooves 24 each of which has a depth reaching the resin layer 18 but not reaching the bottom plate 11.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a method for dividing a workpiece. [Background technology]

[0002] When dividing a workpiece such as a package substrate without holding it on tape, a method has been used in which the package substrate is directly fixed to a holding table of a cutting device having a dedicated holding surface with escape grooves corresponding to the dividing positions of the package substrate and suction holes corresponding to the chips, and then divided into individual package device chips (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-170501 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the conventional technology, it is necessary to prepare a dedicated holding surface for each package substrate. Therefore, there is a problem to be solved, which is to reduce the number of steps required to prepare a dedicated holding surface when dividing a workpiece.

[0005] The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a method for dividing a workpiece that does not require the preparation of a dedicated holding surface when dividing the workpiece. [Means for solving the problem]

[0006] The method for dividing a workpiece of the present invention is a method for dividing a workpiece, and includes a storage step of placing the workpiece on a resin layer of a tray having a bottom plate with a resin layer laminated thereon and a side wall portion protruding in a direction intersecting the surface direction of the bottom plate, and storing the workpiece in the tray, and a dividing step of dividing the workpiece held on a holding table via the tray into a plurality of chips by dividing grooves that reach the resin layer but do not reach the bottom plate.

[0007] In addition, the method of dividing a workpiece of the present invention may further include a first conveying step of conveying the tray containing the workpiece to the holding table after the storage step, and a second conveying step of conveying the tray from the holding table after the division step.

[0008] In addition, the method of dividing a workpiece of the present invention further includes a storage step of stacking and storing a plurality of trays containing the workpieces on which the dividing step has been performed so that the side wall portions of the trays arranged vertically are in direct contact with each other, and the thickness of the side wall portions may be greater than the combined thickness of the resin layer and the thickness of the workpieces.

[0009] Furthermore, the method for dividing a workpiece of the present invention may further include a pick-up step of picking up the chips from the tray after the dividing step, and the storing step may be performed on another workpiece after the pick-up step.

[0010] Furthermore, the method for dividing a workpiece of the present invention may further include, after the pick-up step, a resin layer regenerating step of laminating a new resin layer on the resin layer or replacing the resin layer with a new resin layer.

[0011] In addition, in the method for dividing a workpiece of the present invention, the tray may further include a frame body, and the frame body and the resin layer each have at least one through hole, and a suction force generated on the holding surface of the holding table may be applied to the workpiece through each of the through holes, so that the workpiece is suction-held on the holding surface via the tray.

[0012] In addition, the method for dividing a workpiece of the present invention may further include a heating step, after the pick-up step, in which the resin layer has thermoplasticity and the resin layer is heated to backfill the division grooves formed by the dividing step. Effect of the Invention

[0013] According to the present invention, it is possible to provide a method for dividing a workpiece that does not require the preparation of a dedicated holding surface when dividing the workpiece. [Brief description of the drawings]

[0014] [Figure 1] 1 is a perspective view showing an example of a workpiece to be divided by a workpiece dividing method according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a perspective view of a storage tray used in the workpiece dividing method according to the embodiment. [Diagram 3] 11A and 11B are diagrams illustrating a storing step according to the present embodiment. [Figure 4] 11A to 11C are diagrams illustrating a first transport step according to the embodiment. [Diagram 5] FIG. 11 is a diagram illustrating a division step according to the embodiment. [Figure 6] 11A to 11C are diagrams illustrating a second conveying step according to the embodiment. [Figure 7] FIG. 4 is a diagram illustrating a cleaning step according to the present embodiment. [Figure 8] 11A to 11C are diagrams illustrating a third transport step according to the embodiment. [Figure 9] FIG. 11 is a diagram illustrating a storage step according to the present embodiment. [Figure 10] 11A and 11B are diagrams illustrating a pick-up step according to the embodiment. [Figure 11] FIG. 4 is a diagram illustrating a heating step according to the present embodiment. [Figure 12] FIG. 4 is a diagram illustrating a heating step according to the present embodiment. [Figure 13] FIG. 4 is a diagram illustrating a resin layer regeneration step according to the present embodiment. [Figure 14] 13A to 13C are diagrams illustrating a modified example of the division step according to the embodiment. [Figure 15] 13A to 13C are diagrams illustrating a modified example of the division step according to the embodiment. [Figure 16] 13A to 13C are diagrams illustrating a modified example of the pick-up step according to the embodiment. [Figure 17] 13A and 13B are diagrams illustrating a modified example of the storage step according to the embodiment. [Figure 18] 13A and 13B are diagrams showing modified examples of the storage tray used in the workpiece dividing method according to the embodiment. [Figure 19] 2 is a flowchart showing steps performed in the workpiece dividing method according to the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] With reference to Figs. 1 to 19, the dividing method of the workpiece according to the present embodiment will be described. The dividing method of the workpiece according to the present embodiment includes a storage step, a first conveying step, a dividing step, a second conveying step, a storage step, a pick-up step, and a heating step. The dividing method of the workpiece according to the present embodiment may include a resin layer regenerating step instead of the heating step. The dividing method of the workpiece according to the present embodiment may further include a cleaning step and / or a third conveying step. The dividing method of the workpiece according to the present embodiment is preferably performed in the order of the storing step, the first conveying step, the dividing step, the second conveying step, the storage step, the pick-up step, and the heating step. However, the dividing method of the workpiece according to the present embodiment is not limited to being performed in the order of the storing step, the first conveying step, the dividing step, the second conveying step, the storage step, the pick-up step, and the heating step. The cleaning step can be performed after the second conveying step and before the third conveying step. The third conveying step can be performed after the cleaning step and before the storage step.

[0016] FIG. 1 is a perspective view showing an example of a workpiece to be divided in the dividing method of the workpiece according to the present embodiment. FIG. 2 is a perspective view of a storage tray used in the dividing method of the workpiece according to the present embodiment. FIG. 3 is a diagram for explaining the storing step according to the present embodiment. FIG. 4 is a diagram for explaining the first conveying step according to the present embodiment. FIG. 5 is a diagram for explaining the dividing step according to the present embodiment. FIG. 6 is a diagram for explaining the second conveying step according to the present embodiment. FIG. 7 is a diagram for explaining the cleaning step according to the present embodiment. FIG. 8 is a diagram for explaining the third conveying step according to the present embodiment. FIG. 9 is a diagram for explaining the storing step according to the present embodiment. FIG. 10 is a diagram for explaining the picking up step according to the present embodiment. FIG. 11 and FIG. 12 are diagrams for explaining the heating step according to the present embodiment. FIG. 13 is a diagram for explaining the resin layer regenerating step according to the present embodiment. FIG. 14 and FIG. 15 are diagrams for explaining a modified example of the dividing step according to the present embodiment. FIG. 16 is a diagram for explaining a modified example of the picking up step according to the present embodiment. FIG. 17 is a diagram for explaining a modified example of the storing step according to the present embodiment. FIG. 18 is a diagram for explaining a modified example of the storing tray used in the dividing method of the workpiece according to the present embodiment. FIG. 19 is a flowchart showing the steps performed in the workpiece dividing method according to this embodiment.

[0017] The X-axis, Y-axis, and Z-axis directions in each diagram are perpendicular to each other. The X-axis and Y-axis directions are nearly horizontal, and the Z-axis direction is up-down (vertical). In each diagram, of the two arrows indicating the X-axis direction, the -X side is the left, and the +X side is the right. Of the two arrows indicating the Y-axis direction, the -Y side is the front, and the +Y side is the rear. Of the two arrows indicating the Z-axis direction, the +Z side is the up, and the -Z side is the down.

[0018] The method for dividing a workpiece according to the present embodiment is carried out by a processing device that processes a workpiece. The processing device processes a workpiece such as a semiconductor wafer. The processing device can carry out the method for dividing a workpiece in a cutting device, a grinding device, a polishing device, a grinding and polishing device, a plasma processing device, a laser processing device, a bit cutting device, a tape application device, a cleaning device, a tape peeling device, or the like.

[0019] 1 shows a perspective view of a package substrate 2 in which multiple semiconductor chips are mounted on a frame substrate 4. The package substrate 2 is configured by mounting and bonding multiple semiconductor chips to a frame substrate 4 such as a lead frame, and sealing each semiconductor chip with resin.

[0020] The electrodes of each semiconductor chip are connected to a plurality of bumps 8. A plurality of division lines 10 are formed in a grid pattern on the surface of the package substrate 2, and a semiconductor chip is mounted in each area partitioned by the division lines 10.

[0021] Such a package substrate 2 is divided into individual chips 6 (semiconductor devices) by cutting the division lines 10 using a cutting device (see FIG. 5) as an example of a processing device 71. When dividing the package substrate 2, the package substrate 2 is mounted on a holding table 30 while being adhered to the resin layer 18 of the storage tray 12, and cutting is performed along the division lines 10 of the package substrate 2, dividing the package substrate 2 into individual chips 6. The package substrate 2 is an example of a workpiece.

[0022] 2, a perspective view of the storage tray 12 according to the present embodiment is shown. The storage tray 12 is an example of a tray according to the present embodiment. The storage tray 12 has a chip storage section 14 formed as a recess, and the chip storage section 14 is formed to be slightly larger in size than the package substrate 2, and is set so as to be able to store all of the individual chips 6 of the package substrate 2 at once.

[0023] The storage tray 12 includes a frame 13. The frame 13 has a bottom plate 11 and four side wall portions 16 formed to protrude upward (in the +Z direction) intersecting with the surface direction (XY plane) of the bottom plate 11. The side wall portions 16 are configured to surround the bottom plate 11. In the embodiment shown in Fig. 2, the number of side wall portions 16 is four, but this is not limited thereto, and it is sufficient that three or more side wall portions are arranged so that the package substrates 2, which are the workpieces, can be stacked.

[0024] A resin layer 18 is laminated in the center of the bottom plate 11. That is, the chip storage section 14 is surrounded by a side wall section 16. A resin layer 18 having an adhesive surface 19 is disposed in the chip storage section 14. The resin layer 18 is formed of, for example, a thermosetting resin such as urethane, epoxy, or silicone, or a thermoplastic resin such as polyethylene or polypropylene, and is attached to the chip storage section 14 by, for example, a double-sided tape. The resin layer 18 is formed inside the storage tray 12. The resin layer 18 has thermoplastic properties.

[0025] In the accommodation step, as shown in FIG. 3, the package substrate 2, which is the workpiece, is placed on the resin layer 18 laminated on the accommodation tray 12, and the package substrate 2, which is the workpiece, is accommodated in the chip accommodation portion 14 (see FIG. 2) of the accommodation tray 12. As shown in FIG. 3, the package substrate 2 is attached by the adhesive force of the resin layer 18, or in the case of the resin layer 18 without a glue layer, the package substrate 2 is fixed in close contact with the resin layer 18, and is surrounded and held by the side wall portion 16 constituting the frame body 13 of the accommodation tray 12. Therefore, the package substrate 2 can be reliably held in the accommodation tray 12. As a result, the package substrate 2, which is the workpiece, can be divided and transported without the need to prepare a dedicated holding surface 17 when dividing the package substrate 2. After the accommodation step is performed, the first transport step is performed.

[0026] In the first conveying step, as shown in Fig. 4, a process is performed in which the storage tray 12 containing the package substrate 2 as the workpiece is held by the conveying device 21 and conveyed to the processing area A where the holding table 30 is arranged. As shown in Fig. 4, the processing device 71 includes the conveying device 21 and a suction pad 22. The suction pad 22 is formed at the left-right (X-axis direction) end of the conveying device 21 so as to protrude downward (-Z direction). The conveying device 21 of the processing device 71 holds the upper surface of the side wall portion 16 constituting the frame 13 of the storage tray 12 in a state of being sucked by the suction pad 22, and conveys the storage tray 12 containing the package substrate 2 to the processing area A.

[0027] 4, the package substrate 2 is attached by the adhesive force of the resin layer 18, or in the case of the resin layer 18 not having a glue layer, the package substrate 2 is fixed in close contact with the resin layer 18. Therefore, the package substrate 2 is securely held in the storage tray 12, and by setting the cutting depth so as not to reach the holding surface 17 of the holding table 30, it becomes unnecessary to form a cutout groove for the cutting blade in the holding surface 17 according to the planned dividing line of the package substrate 2. Therefore, even when the package substrate 2, which is the workpiece, is transported in the first transport step, it can be safely performed without the need to prepare a dedicated holding surface 17.

[0028] 4, in the first conveying step, the upper surface of the side wall portion 16 constituting the frame 13 of the receiving tray 12 in which the package substrate 2 is accommodated is sucked and held by the suction pad 22 for conveying, but this is not limited thereto. For example, in the first conveying step, the upper surface of the bottom plate 11 constituting the frame 13 of the receiving tray 12 in which the package substrate 2 is accommodated may be sucked and held by the suction pad 22 for conveying. After the first conveying step is performed, the division step is performed.

[0029] 5, in the dividing step, a process is carried out in which the package substrate 2, which is the workpiece held on the holding table 30 via the storage tray 12, is divided into a plurality of chips 6 by a cutting mechanism 40 provided in the processing device 71 along dividing grooves 24 that reach the resin layer 18 but do not reach the bottom plate 11. In the dividing step, the package substrate 2 is adhered and held by the resin layer 18 formed in the chip storage portion 14 of the storage tray 12.

[0030] 5, the cutting mechanism 40 includes a spindle 45 and a cutting blade 46. The cutting mechanism 40 moves the cutting blade 46 downward (-Z direction) toward the package substrate 2, which is the workpiece, while rotating the spindle 45, thereby pressing the cutting blade 46 against the package substrate 2 to cut the package substrate 2. In this case, in the division step, the cutting blade 46 is moved downward (-Z direction) to fully cut the package substrate 2, while the tip of the cutting blade 46 cuts a part of the resin layer 18 and moves downward (-Z direction) to a depth where the bottom plate 11 is not cut.

[0031] Since the resin layer 18 can be cut at any position where the dividing lines 10 (see FIG. 1) are formed, cutting can be performed with the cutting blade 46 without the need to prepare an escape groove in the resin layer 18 according to the chip size, as in the case of the conventional package substrate. Therefore, in the dividing step of this embodiment, since the package substrate is divided without cutting into the holding surface 17 while it is stored in the storage tray 12, it is not necessary to prepare a dedicated holding surface 17 in which an escape groove for the cutting blade 46 to cut is formed, and precise alignment with the holding surface 17 of the holding table 30, such as placing the package substrate on the holding surface in accordance with the escape groove, is also not required. As a result, it is possible to reduce production costs and production man-hours. Furthermore, since it is not necessary to replace the dedicated holding surface 17 for each package substrate 2, which is the workpiece, as in the case of the conventional package substrate, even if the object to be cut is changed, the dividing step can be performed without changing the holding surface 17, and the number of work steps can be reduced.

[0032] Furthermore, since the resin layer 18 is not completely cut in the dividing step of this embodiment, the resin layer 18 can be regenerated in the heating step (see Figures 11 and 12) or resin regeneration step (see Figure 13) described below, and as a result, the storage tray 12 having the resin layer 18 can be reused.

[0033] In the above-mentioned dividing step, the cutting mechanism 40 is provided with the spindle 45 and the cutting blade 46, but is not limited to this. For example, a laser processing device (not shown) provided in the processing device 71 may perform a process of dividing the package substrate 2, which is the workpiece, into a plurality of chips 6 by dividing grooves 24 that reach the resin layer 18 but do not reach the bottom plate 11. After the dividing step is performed, a second conveying step is performed.

[0034] In the second transport step, as shown in FIG. 6, the storage tray 12 containing the chips 6 is held by the transport device 21 and transported from the processing area A where the holding table 30 is arranged to the cleaning area B where the cleaning table 31 is arranged. As shown in FIG. 6, the processing device 71 includes the transport device 21 and the suction pad 22. The suction pad 22 is formed at the left-right (X-axis direction) end of the transport device 21 so as to protrude downward (-Z direction). The transport device 21 of the processing device 71 holds the upper surface of the side wall portion 16 constituting the frame 13 of the storage tray 12 in a state of being sucked by the suction pad 22, and transports the storage tray 12 containing the chips 6 from the processing area A to the cleaning area B.

[0035] 6, the chip 6 is attached by the adhesive force of the resin layer 18, and is surrounded and held by the side wall portion 16 constituting the frame body 13 of the storage tray 12. Therefore, the chip 6 can be securely held in the storage tray 12. Therefore, even when the chip 6 is transported in the second transport step, the transport can be performed safely without the need to prepare a dedicated holding surface 17.

[0036] 6, in the second transport step, the upper surface of the side wall 16 constituting the frame 13 of the storage tray 12 in which the chips 6 are stored is sucked and held by the suction pad 22 for transport, but this is not limited thereto. For example, in the second transport step, the upper surface of the bottom plate 11 constituting the frame 13 of the storage tray 12 in which the chips 6 are stored may be sucked and held by the suction pad 22 for transport.

[0037] 6, the transfer device 21 used in the second transfer step is the same as the transfer device 21 used in the first transfer step, but this is not limited thereto, and the transfer device 21 used in the first transfer step and the transfer device 21 used in the second transfer step may be different devices. After the second transfer step is performed, a cleaning step is performed.

[0038] In the cleaning step, as shown in Fig. 7, a cleaning liquid is supplied to the chip 6 transported to the cleaning table 31, and the cleaning table 31 is rotated to clean the chip 6. As shown in Fig. 7, a cleaning device as an example of a processing device 71 supplies a cleaning liquid made of pure water to the chip 6 from a cleaning liquid supply nozzle 53 while rotating the cleaning table 31 around its axis. The cleaning liquid supplied to the chip 6 flows from the center to the outer periphery on the chip 6 due to centrifugal force generated by the rotation of the cleaning table 31, cleaning the chip 6 and removing cutting debris and the like from the chip 6. After the cleaning step is performed, a third transport step is performed.

[0039] In the third transport step, as shown in FIG. 8, a process is performed in which the storage tray 12 containing the chips 6 is held by the transport device 21 and transported from the cleaning area B where the cleaning table 31 is arranged to the storage area B where the holding table 32 is arranged. As shown in FIG. 8, the processing device 71 includes the transport device 21 and the suction pad 22. The suction pad 22 is formed at the left-right (X-axis direction) end of the transport device 21 so as to protrude downward (-Z direction). The transport device 21 of the processing device 71 holds the upper surface of the side wall portion 16 constituting the frame 13 of the storage tray 12 in a state of being sucked by the suction pad 22, and transports the storage tray 12 containing the chips 6 from the cleaning area B to the storage area B.

[0040] 8, chip 6 is attached by the adhesive force of resin layer 18, and is surrounded and held by side wall portion 16 constituting frame body 13 of storage tray 12. Therefore, chip 6 can be securely held in storage tray 12. Therefore, even when chip 6 is transported in the third transport step, the transport can be performed safely without the need for a dedicated transport device.

[0041] 8, in the third transport step, the upper surface of the side wall 16 constituting the frame 13 of the storage tray 12 in which the chips 6 are stored is sucked and held by the suction pad 22 for transport, but this is not limited thereto. For example, in the third transport step, the upper surface of the bottom plate 11 constituting the frame 13 of the storage tray 12 in which the chips 6 are stored may be sucked and held by the suction pad 22 for transport.

[0042] 8, the transport device 21 used in the third transport step is the same as the transport device 21 used in the first transport step and the second transport step, but this is not limited thereto, and the transport device 21 used in the first transport step and the second transport step and the transport device 21 used in the third transport step may be different devices. After the third transport step is performed, a storage step is performed.

[0043] In the storage step, as shown in FIG. 9, a process is performed in which a plurality of storage trays 12 for storing chips 6 formed as a result of performing the division step shown in FIG. 5 are stacked and stored so that the side wall portions 16 of the storage trays 12 arranged vertically are in direct contact with each other. As shown in FIG. 9, the side wall portions 16 constituting the frame body 13 of the storage tray 12 are formed to protrude upward (in the +Z direction). The thickness of the side wall portions 16 is formed to be greater than the total thickness of the resin layer 18 and the package substrate 2, which is the workpiece. Therefore, by arranging the side wall portions 16 constituting the frame body 13 constituting another storage tray 12 in direct contact with the upper end of the side wall portions 16 protruding upward, each storage tray 12 can be stacked and arranged in a state in which the resin layer 18 and the package substrate 2, which is the workpiece, are accommodated in the storage tray 12. By stacking the side wall portions 16 of each storage tray 12 multiple times, each storage tray can be stacked high upward (in the +Z direction) for storage. This makes it possible to reduce the storage space for the chips 6. The pick-up step is carried out after the storage step is carried out. Note that the storage step may be omitted and the pick-up step may be carried out instead.

[0044] In the pick-up step, as shown in FIG. 10, a die bonder device as an example of a processing device 71 includes a chip holder 23. In the pick-up step, as shown in FIG. 10, a process is performed in which the chip 6 is picked up upward (in the +Z direction) by the chip holder 23 from the storage tray 12. As the chip holder 23, a collet that adsorbs and transports the chip 6 can be used. The pick-up step is performed at least after the division step shown in FIG. 5. After the pick-up step is performed, the heating step described in FIG. 11 and FIG. 12 is performed, and the storage step described in FIG. 3 is performed again on the package substrate 2, which is another workpiece. This allows the storage step to be performed continuously using the storage tray 12.

[0045] In the heating step, as shown in Figs. 11 and 12, the resin layer 18 is heated to backfill the division grooves 24 formed in the division step described in Fig. 5. The heating step is performed at least after the pick-up step described in Fig. 10. In the division step described in Fig. 5, a cutting mechanism 40 is used to divide the resin layer 18 into a plurality of chips 6 by the division grooves 24 that are deep enough to reach the resin layer 18 but not reach the bottom plate 11. When the division step is performed, as shown in Fig. 11, a part 44 of the resin layer 18 corresponding to the division grooves 24 is scraped off in the division step. As a result, as shown in Fig. 11, the surface of the resin layer 18 becomes uneven, and the holding force for the package substrate 2 and the chips 6 is weakened, making it impossible to reuse the storage tray 12.

[0046] Therefore, in the heating step of this embodiment, the storage tray 12 is placed on the heating table 33 having a built-in heater 54 provided in a heating device as the processing device 71. Then, by supplying heat generated from the heater 54 built in the heating table 33 to the storage tray 12, the thermoplastic resin layer 18 is softened and the division grooves 24 formed in the resin layer 18 can be filled back, and as a result, the resin layer 18 can be flattened. In the heating step, in order to flatten the resin layer 18, the resin layer 18 may be pressed with a plate or an external force may be applied to the resin layer 18, such as by supplying hot air to the resin layer 18, to promote flattening. The storage tray 12 with the resin layer 18 flattened can be reused because the holding force for the package substrate 2 and the chip 6 is restored. After the heating step is performed, the processing is performed again to perform the tray storage step. After the heating step is performed, the storage tray 12 can be reused by storing another workpiece, that is, the package substrate 2, in the storage tray 12.

[0047] 11 and 12, the resin layer 18 can be flattened and the storage tray 12 can be reused, but the resin layer 18 softens and the thickness of the entire resin layer 18 is slightly reduced by the amount of the resin layer 18 that backfills the division grooves 24. Therefore, instead of or after the heating step described in Fig. 11 and 12, a resin layer regeneration step shown in Fig. 13 may be performed.

[0048] In the resin layer regeneration step, as shown in FIG. 13, a new resin layer 181 is laminated on the resin layer 18 of the storage tray 12. The resin layer 181 has the same structure as the resin layer 18. The resin layer 181 may have a different structure from the resin layer 18 as long as it has an adhesive component. The resin layer regeneration step can flatten the resin layer 18, which has an uneven surface due to the scraping off of the part 44 of the resin layer 18 corresponding to the division groove 24. The storage tray 12 with the flattened resin layer 18 can be reused because the holding force for the package substrate 2 and the chip 6 is restored. The resin layer regeneration step may be performed when the thickness of the resin layer 18 becomes too thin due to the heating step, or when foreign matter such as contamination such as grinding dust and polishing dust cannot be completely removed even after cleaning.

[0049] In the resin layer regeneration step of the embodiment described above, a new resin layer 181 is laminated on the resin layer 18 of the storage tray 12, but this is not limited thereto, and the old resin layer 18 may be peeled off and replaced with a new resin layer 18. As a result, the storage tray 12 on which the new resin layer 18 is arranged can be reused because the holding force for the package substrate 2 and the chip 6 is restored. After the resin layer regeneration step is performed, the process returns to the tray storage step.

[0050] In the division step described with reference to Figure 5 above, the package substrate 2 is adhered and held to the resin layer 18 formed in the chip accommodating section 14 of the accommodating tray 12, but this is not limited to the above. The package substrate 2 may be held by suction by creating a negative pressure between the frame body 13 and the resin layer 18.

[0051] As shown in FIG. 14, in the division step of the modified example, the processing device 71 may further include a suction source 51. The negative pressure generated by the suction source 51 can create a negative pressure between the frame body 13 and the resin layer 18. In this case, the through holes 41 and 42 leading to the suction source 51 are formed in the frame body 13 and the resin layer 18, respectively. By driving the suction source 51 to generate a negative pressure, the suction force generated on the holding surface 17 of the holding table 30 is applied to the package substrate 2, which is the workpiece, through the through holes 41 and 42, so that the slight gap between the frame body 13 and the resin layer 18 can be made negative pressure, and the package substrate 2, which is the workpiece, can be suction-held on the holding surface 17, i.e., downward (-Z direction), through the storage tray 12. As a result, the package substrate 2, which is the workpiece, can be held by a plurality of forces, namely, adhesive holding by the adhesive force of the resin layer 18 and suction holding by the suction force of the suction source 51, so that the processing of the workpiece can be easily and safely performed. The suction and holding by the suction force of the suction source 51 is particularly useful for preventing the package substrate 2 from shifting during the separation step.

[0052] 14, one through hole 41 and one through hole 42 are formed, but this is not a limitation and it is sufficient that at least one of each is formed. That is, a plurality of through holes 41 and a plurality of through holes 42 may be provided. By forming a plurality of through holes 41 and a plurality of through holes 42, the suction force generated by the suction source 51 can be applied to the workpiece, i.e., the package substrate 2, via the respective through holes 41 and 42, and can be efficiently transmitted between the frame 13 and the resin layer 18, so that the suction holding of the workpiece, i.e., the package substrate 2, can be more reliably performed.

[0053] In the embodiment of FIG. 14, the frame body 13 and the resin layer 18 are respectively formed with the through-holes 41 and 42 leading to the suction source 51, but this is not limited thereto. As shown in FIG. 15, by forming fine through-holes (not shown) in the resin layer 18 through which gas passes along the vertical direction (Z-axis direction), the through-holes 41 leading to the suction source 51 are formed only in the frame body 13, and a negative pressure can be created between the frame body 13 and the resin layer 18. In this case, as shown in FIG. 15, by driving the suction source 51 to generate a negative pressure, a slight gap generated between the frame body 13 and the resin layer 18 can be made negative pressure through the through-holes 41 formed in the frame body 13 and the fine through-holes formed in the resin layer 18, and the package substrate 2, which is the workpiece, can be sucked and held. As a result, it is not necessary to form a large through-hole 42 as shown in FIG. 14 in the resin layer 18, and therefore the processing cost of the resin layer 18 can be reduced.

[0054] In the pick-up step described with reference to FIG. 10, the chip 6 is picked up by the chip holder 23 when the resin layer 18 is in a substantially flat state, but this is not the only possible case. As shown in FIG. 16, in the pick-up step, the chip 6 may be picked up by the chip holder 23 in a state in which the resin layer 18 is deformed into a convex shape upward (in the +Z direction), that is, into a convex shape on the side to which the chip 6 is fixed, by the gas supplied by the gas supply source 52. In this case, an opening 43 is formed in the frame 13, and the processing device 71 includes a gas supply source 52. By driving the gas supply source 52 to supply (blow) gas between the frame 13 and the resin layer 18, a gap is generated between the frame 13 and the resin layer 18 through the opening 43, and the resin layer 18 can be made into a fan shape by lifting the vicinity of the center of the resin layer 18 upward (in the +Z direction). As a result, the interval between the chips 6 arranged on the resin layer 18 can be widened, making it easier to pick up the chips in the pick-up step and improving the pick-up accuracy.

[0055] In the storage step described above with reference to Fig. 9, the storage trays 12 are stored stacked such that the side walls 16 of the storage trays 12 arranged above and below are in direct contact with each other, but this is not the only possible case. For example, as shown in Fig. 17, the storage trays 12 may be stored covered with lids 61.

[0056] As shown in FIG. 17, the lid 61 is formed by a lid body 62 formed along the X-axis direction (horizontal direction) and a lid side wall 63 formed by protruding downward (-Z direction) from the end of the lid body 62 in the X-axis direction. In the storage step, the lid 61 is placed on the storage tray 12. The bottom plate 11 constituting the frame 13 of the storage tray 12 is formed along the horizontal direction (X-axis direction), and the lid body 62 constituting the lid 61 is also formed along the horizontal direction (X-axis direction) above the storage tray 12. Therefore, it is possible to prevent contamination such as grinding dust and polishing dust from entering from above or below. In addition, transportation may be performed in a state in which the lid 61 is placed on the storage tray 12.

[0057] 17, the side wall 16 constituting the frame 13 of the storage tray 12 protrudes upward (in the +Z direction), and the lid side wall 63 constituting the lid 61 protrudes downward (in the -Z direction). The lid 61 overlaps the storage tray 12. This makes it possible to prevent contamination such as grinding debris and polishing debris from entering from the side.

[0058] In the above embodiment, the side wall 16 constituting the frame 13 of the storage tray 12 is formed to protrude in the +Z direction (upward), but this is not limited thereto, and it may be formed to protrude in the -Z direction (downward) as shown in Fig. 18. Since the side wall 16 protrudes downward, for example, even if the spindle 45 and cutting blade 46 constituting the cutting mechanism 40 are moved downward (-Z direction) in the division step, the possibility of the cutting blade 46 constituting the cutting mechanism 40 colliding with the side wall 16 can be eliminated.

[0059] This allows the package substrate 2, which is the workpiece, to be safely divided into chips 6, particularly in the dividing step. Even when dividing the package substrate 2 into chips 6 in the dividing step, scraps and cutting chips of the package substrate 2 do not remain inside the storage tray 12 but can be blown outward during the dividing step, preventing contamination such as cutting chips from adhering to the package substrate 2.

[0060] With reference to FIG. 19, each step performed in the workpiece dividing method according to this embodiment will be described.

[0061] First, the processing device 71 performs a receiving step shown in FIG. 3 in which the receiving tray 12, on which the package substrates 2 are received, is held by the conveying device 21 and conveyed to the holding table 30 (step S11).

[0062] After the accommodation step of step S11, the processing device 71 carries out a first transport step shown in FIG. 4 in which the transport device 21 holds the accommodation tray 12 accommodating the package substrates 2 and transports it to the holding table 30 (step S12).

[0063] After the accommodation step of step S12, the processing device 71 performs a division step shown in FIG. 5 in which the package substrate 2, which is the workpiece held on the holding table 30 via the accommodation tray 12, is divided into multiple chips 6 by the cutting mechanism 40 along dividing grooves 24 that reach the resin layer 18 but do not reach the bottom plate 11 (step S13).

[0064] After the dividing step of step S13, the processing device 71 performs a second transfer step shown in FIG. 6 in which the storage tray 12 is transferred from the holding table 30 (step S14).

[0065] After the second transport step of step S14, the processing device 71 transports the chip 6 from the holding table 30 to the cleaning table 31, supplies a cleaning liquid to the transported chip 6, and performs the cleaning step shown in Figure 7 in which the chip 6 is cleaned by rotating the cleaning table 31 (step S15).

[0066] After the cleaning step of step S15, the processing device 71 performs a third transfer step shown in FIG. 8 in which the chips 6 are transferred from the cleaning table 31 to the storage tray 12 by the transfer device 21 (step S16).

[0067] After the third transport step of step S16, the processing device 71 performs a storage step shown in Figure 9 in which multiple storage trays 12 containing chips 6 are stacked and stored so that the side wall portions 16 of the storage trays 12 arranged above and below are in direct contact with each other (step S17).

[0068] After the storage step of step S17, the processing device 71 performs a pick-up step shown in FIG. 10 in which the chip 6 is picked up upward (in the +Z direction) by the chip holder 23 from the storage tray 12 (step S18).

[0069] After the pick-up step of step S18, the processing device 71 performs a heating step shown in Figures 11 and 12 in which the resin layer 18 is heated to backfill the division grooves 24 formed by the division step of step S13 (step S19). When this process is completed, the process returns to step S11.

[0070] In the above embodiment, the heating step is performed after the pick-up step of step S18, but this is not limited to the above. After the pick-up step of step S18, instead of the heating step of step S19, a resin regeneration step shown in FIG. 13 may be performed in which a new resin layer 181 is laminated on the resin layer 18 of the storage tray 12, or the old resin layer 18 is replaced with a new resin layer 18 (step S20). When this process is completed, the process returns to step S11.

[0071] As described above, in this embodiment, the resin layer 18 can be cut at any position along the intended division lines 10 (see FIG. 1 ), and therefore cutting can be performed with the cutting blade 46 without the need to prepare an escape groove according to the chip size as in conventional package substrates.

[0072] Therefore, in the dividing step of the present embodiment, since the cutting blade is not cut into the holding surface 17 while the package substrate is stored in the storage tray 12, there is no need to prepare a dedicated holding surface 17 for the package substrate having the escape groove, and precise alignment with the holding surface 17 of the holding table 30, such as placing the package substrate on the holding surface 17 in accordance with the escape groove, is also not required. As a result, it is possible to realize a reduction in production cost and a reduction in production man-hours. Furthermore, since there is no need to prepare a dedicated holding surface 17 for each package substrate 2, which is the workpiece, as in the case of the conventional package substrate, even if the object to be cut is changed, the dividing step can be performed without changing the holding surface 17, and the number of work steps can be reduced. As a result, it is possible to provide a dividing method for a workpiece that does not require the preparation of a dedicated holding surface 17 when dividing the workpiece.

[0073] The embodiments of the present invention are not limited to the above-mentioned embodiments and modifications, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological progress or a different technology derived therefrom, the present invention may be implemented using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0074] As described above, the method for dividing a workpiece of the present invention can eliminate the need to prepare a dedicated holding surface 17 when dividing a workpiece. Therefore, it is particularly useful in the field of dividing workpieces. [Explanation of symbols]

[0075] 2: package substrate, 4: frame substrate, 6: chip, 10: division line, 11: bottom plate, 12: storage tray, 13: frame, 14: chip storage section, 16: side wall section, 17: holding surface, 18: resin layer, 19: adhesive surface, 21: conveying device, 22: suction pad, 23: chip holder, 24: dividing groove, 30: holding table, 32: holding table, 33: heating table, 40: cutting mechanism, 41: hole, 42: hole, 43: opening, 51: suction source, 52: gas supply source, 54: heater, 61: lid, 71: processing device, 181: Resin layer

Claims

1. A method for dividing a workpiece, comprising the steps of: A bottom plate on which a resin layer is laminated; A tray having a side wall portion protruding in a direction intersecting the surface direction of the bottom plate. a step of placing a workpiece on the resin layer and accommodating the workpiece in the tray; The workpiece held on the holding table via the tray is The resin layer is divided into a plurality of chips by dividing grooves having a depth that does not reach the bottom plate. A division step. A method for dividing a workpiece, comprising:

2. After the containing step, The tray containing the workpiece is a first transfer step of transferring the workpiece to the holding table; After the division step, and a second conveying step of conveying the tray from the holding table.

2. The method for dividing a workpiece according to claim 1.

3. A plurality of said trays containing the workpieces on which the dividing step has been performed are The trays are stored stacked such that the side walls of the trays arranged vertically are in direct contact with each other. Further comprising a storage step; The thickness of the side wall portion is The thickness is greater than the sum of the thickness of the resin layer and the thickness of the workpiece.

3. The method for dividing a workpiece according to claim 2.

4. After the division step, A pick-up step of picking up the chip from the tray is further included, After the pick-up step, Performing the receiving step on another workpiece 4. The method for dividing a workpiece according to claim 3.

5. After the pick-up step, A new resin layer is laminated on the resin layer or the resin layer is replaced with a new resin layer. Further includes a resin layer regeneration step.

5. The method for dividing a workpiece according to claim 4.

6. The tray further comprises a frame, the frame and the resin layer each have at least one through hole; A suction force generated on a holding surface of the holding table is applied to the workpiece through each of the through holes, The workpiece is suction-held on the holding surface via the tray.

5. The method for dividing a workpiece according to claim 1, wherein the dividing step comprises dividing the workpiece into two pieces.

7. The resin layer has thermoplasticity, After the pick-up step, The method further includes a heating step of heating the resin layer to backfill the division grooves formed by the division step.

6. The method for dividing a workpiece according to claim 4 or 5.

Images