Power supply input terminal and electronic component unit

Abstract

To provide a power supply input terminal capable of improving the space efficiency of a substrate, and an electronic component unit.SOLUTION: A power supply input terminal 200 applied to an electronic component unit 1 comprises: an input part 210 to which electric power is input from a power supply; and a plurality of substrate connection parts 220 which extend from the input part 210 and are connected to a plurality of substrates 300 respectively.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a power input terminal and an electronic component unit. [Background technology]

[0002] For example, Patent Document 1 discloses a semiconductor device including a substrate on which electronic components such as switching elements and capacitors are mounted, and a control substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-39015 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the semiconductor device described in the above-mentioned Patent Document 1, a terminal (power input terminal) for taking in power from a power source is provided on a board on which electronic components are mounted. Also, a pin header is provided as a connection component between the board and a control board, but the more components are mounted on the board, the lower the space efficiency may be, and in this respect, there is room for further improvement.

[0005] The present invention has been made in consideration of the above circumstances, and has an object to provide a power input terminal and an electronic component unit that can improve the space efficiency of a board. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, the power supply input terminal of the present invention is characterized in having an input section to which power is input from a power supply, and a plurality of board connection sections extending from the input section and connected to each of a plurality of boards.

[0007] In order to achieve the above-mentioned object, the electronic component unit of the present invention comprises a power input terminal to which power is input from a power source, and a plurality of substrates arranged at intervals along the plate thickness direction, and the power input terminal comprises an input portion to which the power is input, and a plurality of substrate connection portions extending from the input portion and connected to each of the plurality of substrates. Effect of the Invention

[0008] The power input terminal and electronic component unit according to the present invention have the advantage that the space efficiency of the board can be improved. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a side view showing a schematic configuration of an electronic component unit according to this embodiment. [Diagram 2] FIG. 2 is a perspective view showing a schematic configuration of a power input terminal according to the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to this embodiment. In addition, the components in the following embodiments include those that are replaceable and easy for a person skilled in the art, or those that are substantially the same.

[0011] [Embodiment] 1 is incorporated into a wire harness that is wired in a vehicle such as an automobile. The wire harness is, for example, a component in which a number of wiring materials used for power supply and signal communication are bundled together to connect various devices mounted in a vehicle, and the wiring materials are connected to the devices by connectors or the like.

[0012] The wire harness includes a conductive wiring material and an electronic component unit 1 electrically connected to the wiring material. The wiring material referred to here is, for example, an insulated wire in which a conductor part (core wire) made of a bundle of conductive metal wires is covered with an insulating covering part.

[0013] The electronic component unit 1 is installed, for example, in an engine room or a vehicle interior of a vehicle, and realizes various functions. The electronic component unit 1 of this embodiment realizes a configuration that can improve the space efficiency of the boards 300 by applying a power input terminal 200 as a component that takes in power from a power source and supplies the power to each board 300. Each component of the electronic component unit 1 will be described in detail below with reference to Figs. 1 and 2.

[0014] In addition, the wire harness may further include a grommet, a protector, a fixing device, an electric connection box, and the like.

[0015] In the following description, the three mutually intersecting directions are conveniently referred to as the "length direction X," the "width direction Y," and the "height direction Z." Here, the length direction X, the width direction Y, and the height direction Z are perpendicular to each other. The XY directions shown in FIG. 1 typically correspond to the extension direction of the mounting surface 300S of the substrate 300, and the height direction Z corresponds to the thickness direction of the substrate 300, the direction in which multiple substrates 300 are stacked, etc. Unless otherwise specified, each direction used in the following description will be described as a direction in a state in which each part of the electronic component unit 1 is assembled.

[0016] 1, electronic component unit 1 includes a plurality of electronic components 100, a power input terminal 200, and a plurality of substrates 300. Electronic component unit 1 is formed as a unit by, for example, housing these components in a housing and assembling them together.

[0017] The electronic component 100 is an element that is mounted on the substrate 300 and electrically connected to perform various functions, and is, for example, an electronic control unit including a capacitor, a relay, a resistor, a transistor, a microcomputer, etc.

[0018] The power supply input terminal 200 is made of a metal material having electrical conductivity, and is provided on a substrate 300 on which electronic components 100 are mounted, thereby enabling the power taken in from a power supply to be supplied to each electronic component 100. The power supply input terminal 200 is formed, for example, by forming a single sheet metal into a shape corresponding to each part by various processes such as punching, pressing, and bending, so that each part is integrally formed three-dimensionally.

[0019] The power input terminal 200 of this embodiment includes an input section 210 and a plurality of board connection sections 220, as shown in FIGS.

[0020] The input unit 210 is a portion to which power is directly input from a power source by being electrically connected to a wiring material via a connecting part such as a connector. The input unit 210 of this embodiment extends along the extension direction of the mounting surface 300S of the substrate 300 as shown in FIG.

[0021] The board connection part 220 is a part that extends from the input part 210 and is connected to each of the multiple boards 300. As shown in Fig. 1, the board connection part 220 of this embodiment extends along a height direction Z that intersects with the mounting surface 300S of the board 300. The board connection part 220 is composed of a first board connection part 221 that is connected to a first board 310 that is a main board among the multiple boards 300, and a second board connection part 222 that is connected to a second board 320 that is a sub-board among the multiple boards 300.

[0022] The first substrate connection portion 221 is a portion that extends from the input portion 210 toward one side (the lower side in Figs. 1 and 2) in the height direction Z and is electrically connected to the first substrate 310. The first substrate connection portion 221 in this embodiment is formed by bending a plate-like member such as a metal plate into a substantially L-shape. As shown in Fig. 2, two first substrate connection portions 221 are provided, and each first substrate connection portion 221 is disposed at an interval along the width direction Y.

[0023] 2, the first board connection part 221 includes a main body part 221a and a connection part 221b. The main body part 221a is a rising part formed continuously with the input part 210. The connection part 221b is provided at the tip part of the main body part 221a and is configured to have a width (length in the width direction Y) smaller than the width (length in the width direction Y) of the main body part 221a. Therefore, the first board connection part 221 is fixed by, for example, soldering, in a state where the connection part 221b is inserted into a through hole formed in the first board 310. The first board connection part 221 is electrically connected to the electronic circuit of the first board 310 by fixing the connection part 221b to the mounting surface 310S of the first board 310.

[0024] The second substrate connection portion 222 extends from the input portion 210 toward the other side (the upper side in FIGS. 1 and 2) in the height direction Z, and is electrically connected to the second substrate 320. The second substrate connection portion 222 of this embodiment is formed by bending a plate-like member such as a metal plate into a substantially L-shape and bending it toward the opposite side to the first substrate connection portion 221, similar to the first substrate connection portion 221. As shown in FIG. 2, the second substrate connection portion 222 is provided alone and is disposed between the two first substrate connection portions 221 that are disposed at an interval along the width direction Y.

[0025] 2, the second board connection part 222 includes a main body part 222a and a connection part 222b. The main body part 222a is a falling part formed continuously with the input part 210. The connection part 222b is provided at the tip part of the main body part 222a and is configured to have a width (length in the width direction Y) smaller than the width (length in the width direction Y) of the main body part 221a. Therefore, the second board connection part 222 is fixed by, for example, soldering, in a state where the connection part 222b is inserted into a through hole formed in the second board 320. The second board connection part 222 is electrically connected to the electronic circuit of the second board 320 by fixing the connection part 222b to the mounting surface 320S of the second board 320.

[0026] As described above, the plurality of substrates 300 are made up of a first substrate 310 serving as a main substrate and a second substrate 320 serving as a sub-substrate.

[0027] The first board 310 and the second board 320 are mounted with various electronic components 100 and constitute an electronic circuit that electrically connects the electronic components 100 to each other. The first board 310 and the second board 320 are formed, for example, by a so-called printed circuit board (PCB). Therefore, the first board 310 and the second board 320 are formed in a substantially rectangular plate shape with the height direction Z being the plate thickness direction by printing a wiring pattern (printed pattern) on an insulating layer made of an insulating material such as epoxy resin, glass epoxy resin, paper epoxy resin, or ceramic, and the circuit body is constituted by the wiring pattern. The first board 310 is, for example, a power board, and power elements that can be interposed between a power source and various electronic devices and distribute power are mounted on the mounting surface 310S as the electronic components 100. The second board 320 is, for example, a control board, and control elements are mounted on the mounting surface 320S as the electronic components 100. Therefore, the first substrate 310 and the second substrate 320 constitute different electronic circuits.

[0028] 1, the first substrate 310 and the second substrate 320 are disposed at an interval along the height direction Z. Therefore, the first substrate 310 located on one side in the height direction Z (the lower side in FIGS. 1 and 2) can receive the power taken in from the input section 210 from the first substrate connection section 221 formed continuously with the input section 210. Conversely, the second substrate 320 located on the other side in the height direction Z (the upper side in FIGS. 1 and 2) can receive the power taken in from the input section 210 from the second substrate connection section 222 formed continuously with the input section 210 and facing in the opposite direction to the first substrate connection section 221. The first substrate 310 and the second substrate 320 are electrically connected to each other via the first substrate connection section 221 and the second substrate connection section 222, which are respectively connected to the input section 210.

[0029] The electronic component unit 1 described above includes a power input terminal 200 to which power is input from a power source, and a plurality of boards 300 (first board 310, second board 320). The power input terminal 200 also includes an input section 210 to which power is input, and a plurality of board connection sections 220 (first board connection section 221, second board connection section 222) that extend from the input section 210 and are connected to each of the plurality of boards 300 (first board 310, second board 320).

[0030] According to this configuration, the power supply input terminal 200 can supply power to each of the different boards 300 by integrally forming the input section 210 and the board connection section 220. Therefore, the electronic component unit 1 can directly supply power input from the power supply from the power supply input terminal 200 without using a connecting part such as a pin header. Therefore, the electronic component unit 1 of this embodiment can reduce the number of parts mounted on the board 300, thereby improving the space efficiency of each board 300.

[0031] Furthermore, the board connection portion 220 of the power input terminal 200 described above includes a first board connection portion 221 connected to the first board 310 and a second board connection portion 222 connected to the second board 320 arranged at an interval along the height direction Z, which is the plate thickness direction of the first board 310. The first board connection portion 221 and the second board connection portion 222 are formed in opposite directions. With this configuration, the power input terminal 200 can reduce the projected area of ​​the components on the board 300 by having the first board connection portion 221 and the second board connection portion 222 branch off in the height direction Z. Therefore, the electronic component unit 1 of this embodiment can reduce the space required to mount the power input terminal 200 on the board 300, thereby improving the space efficiency of each board 300.

[0032] The electronic component unit 1 according to the embodiment of the present invention described above is not limited to the above embodiment, and various modifications are possible within the scope of the claims.

[0033] For example, the number of first board connection parts and second board connection parts provided on the power input terminal is not particularly limited, and the positions of the first board connection parts and second board connection parts relative to the input part are not particularly limited to the form shown in FIG.

[0034] Furthermore, the number of substrates is not particularly limited, and the number of substrate connection parts provided corresponding to the number of substrates is also not particularly limited.

[0035] Moreover, the electronic component unit 1 according to this embodiment may be configured by appropriately combining the components of the embodiment and modified examples described above. [Explanation of symbols]

[0036] 1 Electronic Components Unit 100 Electronic Components 200 Power input terminal 210 Input section 220 Board connection part 221 First board connection part 222 Second board connection part 300 Substrates 310 First board 320 Second Board X length direction Y Width direction Z Height direction (thickness direction of the board)

Claims

1. an input section to which power is input from a power source; and a plurality of board connection parts extending from the input part and connected to the plurality of boards, Power input terminal.

2. the substrate connection portion includes a first substrate connection portion connected to a first substrate, and a second substrate connection portion connected to a second substrate disposed at an interval in a thickness direction of the first substrate, The first substrate connection portion and the second substrate connection portion are formed in opposite directions to each other.

2. The power input terminal according to claim 1.

3. a power input terminal to which power is input from a power supply; A plurality of substrates arranged at intervals along a plate thickness direction, the power supply input terminal includes an input section to which the power is input, and a plurality of board connection sections extending from the input section and connected to the plurality of boards, respectively. Electronic component unit.

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