Electronic apparatus
Patent Information
- Application Number
- JP2023133041
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-08-17
- Publication Date
- 2025-02-28
Smart Images

Figure 2025027855000001_ABST
Abstract
Description
[Technical field]
[0001] An embodiment of the present invention relates to an electronic device. [Background technology]
[0002] For example, electronic devices include heat-generating electronic components such as a CPU (Central Processing Unit). In electronic devices, a heat sink is provided close to the electrical components, and a fan blows air onto the heat sink, thereby cooling (dissipating heat) the electronic components. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2002-141451 A Summary of the Invention [Problem to be solved by the invention]
[0004] An object of the present invention is to provide an electronic device capable of improving cooling efficiency. [Means for solving the problem]
[0005] The electronic device according to the embodiment includes a duct, a fan unit, and a heat sink. The duct includes an upper airflow direction plate and a lower airflow direction plate. The duct has an opening. The fan unit is insertable and removable from the duct. The heat sink is disposed adjacent to a first electronic component. The upper airflow direction plate extends from the opening in a first direction. At least a portion of the heat sink and the lower airflow direction plate are separated from the upper airflow direction plate in a second direction perpendicular to the first direction. A first space is formed in the duct, the first space being continuous with the opening, aligned with the opening in the first direction, and positioned between the lower airflow direction plate and the upper airflow direction plate, and between at least a portion of the heat sink and the upper airflow direction plate. In a first state in which the fan unit is disposed in the duct, the fan unit is positioned between at least a portion of the heat sink and the first space, and between the lower airflow direction plate and the first space, and can blow air in the first space toward the heat sink. The lower airflow direction plate has an inclined portion. The inclined portion is aligned with the heat sink in the first direction, is located between the heat sink and the opening in the first direction, and is inclined so as to move away from the first space toward the heat sink. [Brief description of the drawings]
[0006] [Figure 1] FIG. 1 is a schematic perspective view illustrating an electronic device according to an embodiment. [Diagram 2] FIG. 2 is a schematic exploded perspective view illustrating the electronic device according to the embodiment. [Diagram 3] FIG. 3 is a schematic plan view illustrating the electronic device according to the embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view illustrating the electronic device according to the embodiment. [Diagram 5] FIG. 5 is a schematic perspective view illustrating a duct of the electronic device according to the embodiment. [Figure 6] FIG. 6 is a schematic perspective view illustrating a duct of the electronic device according to the embodiment. [Figure 7] FIG. 7 is a schematic perspective view illustrating a duct of the electronic device according to the embodiment. [Figure 8] FIG. 8 is a schematic perspective view illustrating a fan unit of the electronic device according to the embodiment. [Figure 9] FIG. 9 is a schematic perspective view illustrating a fan unit of the electronic device according to the embodiment. [Figure 10] 10A and 10B are schematic perspective views illustrating a part of the electronic device according to the embodiment. [Figure 11] FIG. 11 is a schematic plan view illustrating a part of the electronic device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification and each drawing, elements similar to those already explained are given the same reference numerals and detailed explanations are omitted as appropriate.
[0008] FIG. 1 is a schematic perspective view illustrating an electronic device according to an embodiment. FIG. 2 is a schematic exploded perspective view illustrating the electronic device according to the embodiment. The electronic device 100 according to the embodiment has a substantially rectangular parallelepiped housing 80. The electronic device 100 is an electronic computing device such as an industrial computer.
[0009] The housing 80 has a front surface 80f and a rear surface 80b opposite the front surface 80f. The housing 80 has a side surface 80s and a side surface 80t that connect the front surface 80f and the rear surface 80b and are spaced apart from each other.
[0010] An air intake port is provided on the front surface 80f, and an air filter holder 82 is attached to the air filter holder 82. The air filter holder 82 holds an air filter 81 (FIG. 2).
[0011] 2, the fan unit 10 can be disposed on the rear surface 80b side of the air filter 81 and the air filter holder 82. The fan unit 10 can be inserted into and removed from the housing 80 of the electronic device 100 through an opening 80p (air intake) provided in the front surface 80f. That is, the fan unit 10 can be inserted into and removed from the housing 80.
[0012] FIG. 3 is a schematic plan view illustrating the electronic device according to the embodiment. 3 shows the inside of the housing 80. A duct 30 (air duct), a heat sink 40, a first electronic component 51, a second electronic component 52, a power supply unit 53, and an expansion card holder 54 are provided inside the housing 80 of the electronic device 100. These are directly or indirectly fixed to the housing 80 by fixing means such as screws. A memory 57 is also provided inside the housing 80.
[0013] The duct 30 is connected to the rear side of an air intake port provided on the front surface 80f of the housing 80. The duct 30 is provided so as to extend from the front surface 80f side to the rear surface 80b side.
[0014] The fan unit 10 can be inserted into the duct 30 as shown in Fig. 3. The fan unit 10 includes, for example, an axial fan. The fan unit 10 is disposed above the front portion 40a of the heat sink 40. The fan unit 10 draws air into the duct 30 from the outside of the housing 80 through an air intake port on the front surface 80f, and sends the air into the housing 80, such as the heat sink 40.
[0015] The heat sink 40 is disposed on the rear surface 80b side relative to a portion of the duct 30. A front portion 40a of the heat sink 40 overlaps with the duct 30 and the fan unit 10 in the vertical direction. A rear portion 40b of the heat sink 40 does not overlap with the duct 30 and the fan unit 10 in the vertical direction.
[0016] The heat sink 40 is disposed adjacent to a first electronic component 51. The first electronic component 51 is, for example, a CPU, and serves as a heat source. The first electronic component 51 is disposed substantially below the center of the heat sink 40. The heat sink 40 dissipates heat from the first electronic component 51. As shown in FIG. 1, in this example, the planar shape of the heat sink 40 is rectangular.
[0017] The second electronic component 52 is disposed closer to the side surface 80t than the duct 30 and the heat sink 40. The second electronic component 52 is, for example, a HDD (hard disk drive), and serves as a heat source.
[0018] The expansion card holder 54 is provided closer to the rear surface 80b than the heat sink 40. Between the expansion card holder 54 and the heat sink 40 is an expansion card mounting area 55.
[0019] The power supply unit 53 is provided closer to the side surface 80t than the expansion card mounting area 55 and closer to the rear surface 80b than the second electronic component 52. The memory 57 is provided, for example, closer to the side surface 80s than the heat sink 40 and closer to the rear surface 80b than the duct 30.
[0020] FIG. 4 is a schematic cross-sectional view illustrating the electronic device according to the embodiment. FIG. 4 shows a cross section taken along line A1-A2 shown in FIG. Fig. 4 shows a state in which the fan unit 10 is disposed in the duct 30 (hereinafter sometimes referred to as a first state). As shown in Fig. 4, in this example, the heat sink 40 has a plate-shaped base portion 41 and a plurality of fins 42. The base portion 41 is provided on a first electronic component 51. The plurality of fins 42 extend upward from an upper surface of the base portion 41. The fins 42 are, for example, plate-shaped extending in the front-rear direction.
[0021] The duct 30 has an opening 31 that opens toward the front surface 80f of the housing 80. Air is taken into the duct 30 through the opening 31.
[0022] 4, the duct 30 has an upper airflow direction flaps 32, a lower airflow direction flaps 33, and a fan unit guide portion 34. The duct 30 further has a first side panel 35 (FIG. 5, etc.) and a second side panel 36 (FIG. 5, etc.). The opening 31 is formed by the upper airflow direction flaps 32, the fan unit guide portion 34, and the front ends of the first side panel 35 and the second side panel 36, and has a substantially rectangular shape.
[0023] 4, the upper airflow direction plate 32 has a first upper plate portion 321 and a second upper plate portion 322. The first upper plate portion 321 extends from one end portion 31p of the opening portion 31 in the first direction D1.
[0024] In the description of the embodiment, the direction perpendicular to the first direction D1 is the second direction D2, and the direction perpendicular to the first direction D1 and the second direction D2 is the third direction D3. For convenience of description, the direction from the opening 31 of the duct 30 to the heat sink 40 (or the position where the fan unit 10 is inserted) is referred to as the "rear", and the opposite direction of the rear is referred to as the "front". The front is, for example, the opening direction of the opening 31 of the duct 30. The first direction D1 is a direction along the front-rear direction (for example, a direction parallel to the front-rear direction). The direction from the lower airflow direction plate 33 or the heat sink 40 to the upper airflow direction plate 32 is referred to as the "upward", and the opposite direction of the upward direction is referred to as the "downward". The downward direction is, for example, the airflow direction of the fan unit 10. The second direction D2 is a direction along the vertical direction (for example, a direction parallel to the vertical direction).
[0025] The second upper plate portion 322 bends and extends downward from the rear end of the first upper plate portion 321. The second upper plate portion 322 closes the rear side of the duct 30 above the fan unit 10.
[0026] At least a portion of the heat sink 40 (the front portion 40a and the central portion 40c in the first direction D1) is separated from the upper airflow direction flare 32 in the second direction D2. The lower airflow direction flare 33 is separated from the upper airflow direction flare 32 in the second direction D2.
[0027] An opening 39 is provided on the rear surface of the duct 30 and is located below the second upper plate portion 322. The heat sink 40 is disposed in the opening 39. More specifically, a front portion 40a and a central portion 40c of the heat sink 40 are disposed inside the duct 30 forward of the opening 39, and a rear portion 40b of the heat sink 40 is disposed outside the duct 30 rearward of the opening 39. In other words, the duct 30 does not cover the rear end of the heat sink 40. Air taken into the duct 30 from the opening 31 can flow to the outside from the opening 39.
[0028] A first space SP1 is formed in the duct 30. The first space SP1 is continuous with the opening 31 and aligned with the opening 31 in the first direction D1. That is, the first space SP1 is connected to the rear of the opening 31. The first space SP1 is in contact with the upper airflow direction flare 32. The first space SP1 is located between at least a part of the heat sink 40 and the upper airflow direction flare 32. The first space SP1 is also located between the upper airflow direction flare 32 and the lower airflow direction flare 33.
[0029] In a first state in which the fan unit 10 is disposed in the duct 30, the fan unit 10 is located between the first space SP1 and at least a part of the heat sink 40. In the first state, the fan unit 10 is located between the first space SP1 and the lower air deflector 33. In the first state, the fan unit 10 can blow air downward toward the heat sink 40 (and the inclined portion 331 of the lower air deflector 33).
[0030] The inclined portion 331 is located in front of the heat sink 40. In other words, the inclined portion 331 is aligned with the heat sink 40 in the first direction D1, and is located between the heat sink 40 and the opening 31 in the first direction D1.
[0031] The inclined portion 331 is inclined in a direction away from the first space SP1 as it approaches the heat sink 40. In other words, the inclined portion 331 is plate-shaped with a downward inclination toward the rear. In this example, the front end 331f of the inclined portion 331 is aligned with the upper end of the fin 42 in the first direction D1. The rear end 331e of the inclined portion 331 is aligned with the base portion 41 in the first direction D1. In other words, the height of the front end 331f (position in the second direction D2) is approximately the same as the height of the upper end of the fin 42, and the height of the rear end 331e is approximately the same as the height of the base portion 41.
[0032] The dashed arrows in Fig. 4 indicate the direction of air flow. Air drawn in from the air intake on the front surface 80f is guided to the air intake of the fan by the upper air deflector 32. That is, for example, when the fan unit 10 is operated, air flows from the front surface 80f through the opening 31 into the first space SP1. The air in the first space SP1 is sent downward by the fan unit 10.
[0033] 4, part of the airflow sent from fan unit 10 hits inclined portion 331 of lower airflow direction vane 33 from above. The direction of the airflow changes depending on the inclination of inclined portion 331. The airflow that hits inclined portion 331 flows from the front end to the rear end of heat sink 40, and then flows from the rear end of heat sink 40 to the rear of heat sink 40.
[0034] 4, another part of the airflow sent from the fan unit 10 hits the heat sink 40 from above the heat sink 40. The airflow hitting the heat sink 40 from above flows, for example, rearward and from the rear end of the heat sink 40 to the rear of the heat sink 40.
[0035] For example, a reference example configuration may be considered in which air is blown onto the heat sink only from the front of the heat sink. In this case, the air mainly flows from the front end to the rear end of the heat sink. Here, the air flow speed may decrease on the heat sink due to high flow resistance caused by, for example, pressure loss due to fins.
[0036] In addition, in a heat sink, the temperature is highest at the base, which receives heat from the heat source, and the temperature decreases from the base of the fins to the tips of the fins. In a reference example in which air is blown onto the heat sink only from the front of the heat sink, the air mainly hits the tips and bases of the fins. In the base, which is the hottest, the air may only hit the end faces.
[0037] In contrast, in the embodiment, in the first state in which the fan unit 10 is disposed in the duct 30, the fan unit 10 is located between at least a part of the heat sink 40 and the first space SP1, and can blow air in the first space SP1 toward the heat sink 40. This allows air to be blown from above to the heat sink 40. When air is blown onto the heat sink 40 from above, the air is blown from the center of the upper surface of the heat sink 40 toward the base portion 41, for example. This allows for, for example, improved cooling efficiency. The air that hits the heat sink 40 from above the heat sink 40 flows, for example, backward. This shortens the distance that the air flows on the heat sink 40 compared to when the air flows from the front end to the rear end of the heat sink 40, and therefore the flow path resistance can be reduced. This allows, for example, to suppress a decrease in flow rate and improve cooling efficiency. In addition, for example, the fan unit 10 can be disposed close to the heat sink 40. This allows for, for example, to suppress the air from the fan unit 10 from leaking out of the duct 30 before hitting the heat sink 40, and improves cooling efficiency. The distance between the fan unit 10 and the heat sink 40 is, for example, shorter than the height of the heat sink 40 or the height of the fan unit 10 .
[0038] In the first state, the fan unit 10 is located between the lower airflow direction flare 33 and the first space SP1. This allows air to be sent from above to the lower airflow direction flare 33. The lower airflow direction flare 33 is provided with an inclined portion 331. The inclination of the inclined portion 331 allows an airflow to be generated on the heat sink 40 in a rearward direction. This allows the air exchange efficiency in the duct 30 to be improved.
[0039] The fan of the fan unit 10 has a blade 13 that blows air. The fan unit 10 has a front portion 13e and a rear portion 13b that are part of the movable range of the blade 13. In the first state, at least a part of the rear portion 13b may be aligned with the center portion 40c of the heat sink 40 in the second direction D2. This allows air to be efficiently blown from above onto the center portion 40c of the heat sink 40. For example, in the first state, at least a part of the rear portion 13b may be aligned with the first electronic component 51 in the second direction D2. This allows air to be blown onto a high-temperature portion of the heat sink 40. Also, in the first state, at least a part of the front portion 13e may be aligned with the inclined portion 331 in the second direction D2. This allows air to be blown onto the inclined portion 331 from above, and efficiently generates an airflow toward the rear.
[0040] The fan and the heat sink 40 may be offset in the front-to-rear direction. For example, a center position P1 of the fan of the fan unit 10 in the first direction D1 is between a center position P2 of the heat sink 40 in the first direction D1 and a position P3 of the inclined portion 331 (e.g., the rear end 331e) in the first direction D1.
[0041] 5 to 7 are schematic perspective views illustrating ducts of the electronic device according to the embodiment. As shown in FIGS. 5 to 7, the upper airflow direction plate 32, the fan unit guide portion 34, and the lower airflow direction plate 33 (FIG. 7) extend in a third direction D3.
[0042] The duct 30 has a first side panel 35 and a second side panel 36. The first side panel 35 and the second side panel 36 face each other in the third direction D3. The first side panel 35 connects, for example, one end of the upper airflow direction panel 32, one end of the fan unit guide portion 34, and one end of the lower airflow direction panel 33. The second side panel 36 connects, for example, the other end of the upper airflow direction panel 32, the other end of the fan unit guide portion 34, and the other end of the lower airflow direction panel 33. At least a part of the heat sink 40, the fan unit 10 in the first state, and the first space SP1 are located between the first side panel 35 and the second side panel 36.
[0043] 5, the second side plate 36 is a flat plate extending in the first direction D1 from the opening 31 of the duct 30. The second side plate 36 is provided with a protrusion 36p protruding toward the first side plate 35. The second side plate 36 is also provided with at least one side hole 36a penetrating the second side plate 36 in the third direction D3. In this example, the multiple side holes 36a are provided at positions aligned with the heat sink 40 in the third direction D3.
[0044] The first side panel 35 has a first panel portion 351, a second panel portion 352, and a third panel portion 353. The first panel portion 351 has a flat plate shape extending from the opening 31 of the duct 30 in the first direction D1.
[0045] The second plate portion 352 is located rearward of the first plate portion 351 and has a flat plate shape extending in the first direction D1. The width of the duct 30 is narrower at the second plate portion 352. That is, the second plate portion 352 is closer to the second side plate 36 than the first plate portion 351. In other words, the second plate portion 352 is between the first plate portion 351 and the second side plate 36 in the third direction D3.
[0046] The third plate portion 353 is a step portion that connects the rear end of the first plate portion 351 and the front end of the second plate portion 352. The third plate portion 353 is a flat plate extending along the second direction D2 and the third direction D3. For example, as shown by a dashed line in FIG. 5, a connector 21 for connecting a connector 22 (see FIG. 9) of the fan unit 10 is attached to the third plate portion 353. The connector 21 is electrically connected to a power source that drives the fan of the fan unit 10 and a control circuit that controls the operation of the fan.
[0047] The fan unit guide portion 34 has a front plate portion 341 and a guide plate portion 342. The front plate portion 341 is located at the front end of the fan unit guide portion 34, and is a flat plate extending in the second direction D2 and the third direction D3. The guide plate portion 342 is a flat plate extending in the first direction D1 and the third direction D3 from the upper end of the front plate portion 341. An opening 342p penetrating the guide plate portion 342 in the second direction D2 is provided in approximately the center of the guide plate portion 342.
[0048] For example, as shown in FIG. 7, the lower louver 33 is connected to the rear side of the front plate portion 341 and is located below the guide plate portion 342.
[0049] 8 and 9 are schematic perspective views illustrating fan units of the electronic device according to the embodiment. 8 and 9 are directions in a first state in which the fan unit 10 is disposed inside the duct 30. In the explanation of FIG.
[0050] The fan unit 10 has a unit structure including connectors for electrical signals and power. The fan unit 10 has a fan 11 (e.g., an axial fan) and a holder 12. The holder 12 includes a cover portion 12a having a substantially rectangular parallelepiped outer shape and a connection portion 12b protruding laterally from the cover portion 12a. The cover portion 12a covers the upper side, lower side, and front side of the fan 11. An opening 12e is provided on the upper and lower surfaces of the cover portion 12a. This allows the wind generated by the fan 11 to pass through the cover portion 12a in the second direction D2. A handle 12h is provided on the front surface of the cover portion 12a.
[0051] The connection portion 12b protrudes from a front portion of the cover portion 12a toward the first side panel 35 (see FIG. 5, etc.). The connection portion 12b is continuous with the front surface of the cover portion 12a. As shown in FIG. 9, the connection portion 12b has a surface 121 facing rearward. The surface 121 is provided with a connector 22 electrically connected to the fan 11.
[0052] For example, when placing the fan unit 10 in the duct 30, the rear portion of the fan unit 10 is placed on the guide plate portion 342 (see FIG. 5, etc.) from the opening 31 of the duct 30, and the fan unit 10 is pushed rearward. The fan unit 10 is supported by the guide plate portion 342. The fan 11 is located above the opening 342p of the guide plate portion 342. Air can be sent from the fan 11 through the opening 342p toward the heat sink 40 located below the opening 342p. The protrusions 35p and 36p (see FIG. 5, etc.) of the duct 30 are located above the fan unit 10. The position of the fan unit 10 in the up-down direction is regulated by the protrusions 35p, 36p, and the guide plate portion 342.
[0053] 5 and the connector 22 shown in FIG. 9 face each other when the fan unit 10 is inserted into the duct 30. The connector 21 and the connector 22 are connected by pushing the fan unit 10 backward so as to insert it into the duct 30. As a result, the fan 11 is electrically connected to at least one of a power supply that drives the fan 11 and a control circuit that controls the fan 11 via the connectors 21 and 22.
[0054] When removing the fan unit 10 from the duct 30, the handle 12h of the fan unit 10 is grasped and the fan unit 10 is pulled forward. This causes the fan unit 10 to be pulled out of the duct 30 through the opening 31. By pulling the fan unit 10 forward, the connection between the connector 21 and the connector 22 is released.
[0055] In this way, the fan unit 10 is pushed from outside the duct 30 into the duct 30 through the opening 31 along the first direction D1 from the opening 31 toward the first space SP1. Also, the fan unit 10 is pulled out from inside the duct 30 to outside the duct through the opening 31 in the opposite direction to the first direction D1. This makes it possible to easily replace the fan unit 10.
[0056] For example, industrial equipment such as industrial computers is designed to operate 24 hours a day, 365 days a year, and in order to reduce downtime of the systems in which they are installed, maintenance must be done in a short period of time. For this reason, CPU cooling fans, which are limited in life, are placed on the front of the unit to make them easier to replace, and a method is used in which air is blown onto the heat source and heat sink. As CPUs become more powerful, the amount of heat they generate also tends to increase. When the CPU gets too hot, its safety circuit activates and performance decreases, so sufficient cooling is desirable.
[0057] Conventionally, an air duct is used to create a flow path that sends air to the front of the heat sink (the surface perpendicular to the fins), and by narrowing the flow path, the air speed is increased and cooling performance is improved. With this method, air can leak from the gap between the duct and the board before the cooling air reaches the heat sink from the fan, and the air speed can sometimes decrease due to flow resistance inside the duct.
[0058] In contrast, according to the embodiment, for example, the fan can be easily replaced from the front, and when mounted, the exhaust part of the fan is arranged directly above the heat sink, eliminating the effects of air leakage between the fan and the heat sink and the reduction in wind speed due to flow resistance, thereby improving the cooling efficiency. Also, for example, it is possible to achieve both the ability to replace the fan from the front and sufficient cooling of the CPU.
[0059] 10A and 10B are schematic perspective views illustrating a part of the electronic device according to the embodiment. The electronic device 100 further has a locking member 24 that prevents the fan unit 10 arranged in the duct 30 from falling off. Fig. 10(a) shows a state in which the locking member 24 is in an unlocked position, and Fig. 10(b) shows a state in which the locking member 24 is in a locked position.
[0060] For example, the locking member 24 is attached to the housing 80 so as to be rotatable about a rotation axis extending in the front-rear direction. The locking member 24 can move between a locked position and an unlocked position by rotating 90 degrees.
[0061] As shown in FIG. 10(a), in the unlocked position, the locking member 24 does not overlap with the fan unit 10 disposed in the duct 30 in the first direction D1.
[0062] 10(b), the locking member 24 is disposed at a fixed position located forward (opposite the first direction D1) when viewed from the fan unit 10 disposed in the duct 30. In this way, the locking member 24 restricts the fan unit 10 disposed in the duct 30 from moving forward. The locking member 24 may be fixed at the fixed position by any means, such as engagement with a protrusion or a claw.
[0063] FIG. 11 is a schematic plan view illustrating a part of the electronic device according to the embodiment. The arrows in Fig. 11 indicate the direction of air flow. In the plan view shown in Fig. 11, the second electronic component 52 is aligned with the duct 30 in the third direction D3. The second side plate 36 is located between the first side plate 35 and the second electronic component 52. As described above with reference to Fig. 5 etc., the second side plate 36 is provided with a side hole 36a.
[0064] A part of the air blown from the fan unit 10 passes through the side hole 36a and flows from the second side plate 36 toward the second electronic component 52. This makes it possible to cool the second electronic component 52.
[0065] For example, when the HDD (second electronic component 52) heats up, the oil in the bearings evaporates, shortening its lifespan. In contrast, according to the embodiment, it is possible to efficiently cool the HDD arranged in parallel with the CPU. For example, a high airflow speed can be obtained by increasing the pressure inside the duct 30 using a fan.
[0066] The embodiment may include the following features. (Configuration 1) A duct including an upper wind deflector and a lower wind deflector and having an opening; a fan unit that can be inserted into and removed from the duct; a heat sink disposed adjacent to the first electronic component; Equipped with The upper wind direction plate extends in a first direction from the opening, At least a portion of the heat sink and the lower airflow direction plate are separated from the upper airflow direction plate in a second direction perpendicular to the first direction, A first space is formed in the duct, the first space is continuous with the opening, is aligned with the opening in the first direction, and is located between the lower airflow direction plate and the upper airflow direction plate, and between at least a portion of the heat sink and the upper airflow direction plate; In a first state in which the fan unit is disposed in the duct, the fan unit is located between at least a portion of the heat sink and the first space, and between the lower airflow direction vane and the first space, and is capable of blowing air in the first space toward the heat sink, The electronic device has a downward airflow direction vane that is aligned with the heat sink in the first direction, is located between the heat sink and the opening in the first direction, and has an inclined portion that inclines away from the first space as it approaches the heat sink. (Configuration 2) The fan unit includes: the air is pushed from outside the duct into the duct through the opening along the first direction from the opening to the first space, The electronic device of configuration 1, wherein the electronic device is pulled out from inside the duct through the opening along a direction opposite to the first direction. (Configuration 3) The electronic device described in configuration 2 further includes a locking member that is arranged at a fixed position in the opposite direction from the fan unit arranged in the duct, thereby restricting movement of the fan unit arranged in the duct in the opposite direction. (Configuration 4) The fan unit has a blade that blows air and a rear portion and a front portion that are movable ranges of the blade, In the first state, at least a portion of the rear portion is aligned in the second direction with a central portion of the heat sink in the first direction, 4. The electronic device of any one of configurations 1 to 3, wherein in the first state, at least a portion of the front portion is aligned with the inclined portion in the second direction. (Configuration 5) a second electronic component aligned with the duct in a third direction perpendicular to the first direction and the second direction in a plan view; The duct includes a first side plate and a second side plate facing each other in the third direction, at least a portion of the heat sink and the first space are located between the first side plate and the second side plate, The electronic device of any one of configurations 1 to 4, wherein the second side panel is located between the first side panel and the second electronic component, and has a side hole penetrating the second side panel in the third direction.
[0067] According to the embodiment, it is possible to provide an electronic device capable of improving cooling efficiency.
[0068] In this specification, "vertical" and "parallel" do not only mean strictly vertical and strictly parallel, but also include, for example, variations in the manufacturing process, and may mean substantially vertical and substantially parallel.
[0069] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other. [Explanation of symbols]
[0070] 10: Fan unit 11: Fan 12: Holder 12a: Cover part 12b: Connection 12e:Aperture 12h:Handle 13: Feather 13b: Posterior part 13e: Front part 21: Connector 22: Connector 24: Locking member 30: Duct 31: Opening 31p: One end 32:Upper wind direction board 33: Downward wind direction board 34: Fan unit guide part 35: 1st side plate 35p: Convex 36:Second side plate 36a: Side hole 36p: Convex 39: Opening 40: Heat sink 40a: Front part 40b: Back part 40c: central part 41: Base section 42: Finn 51: First electronic component 52: Second electronic component 53: Power supply unit 54: Expansion card holder 55: Expansion card mounting area 57: Memory 80: Cabinet 80b: Rear 80f:Front 80p: opening 80s, 80t: Side 81: Air filter 82: Air filter holder 100:Electronic equipment 121: Face 321: First upper plate 322: Second upper plate 331: Inclined part 331e: Rear end 331f: Front end 341: Front plate part 342: Guide plate part 342p: opening 351~353: 1st~3rd plate part D1~D3: 1st~3rd directions P1, P2, P3:Position SP1: 1st space
Claims
1. A duct including an upper wind deflector and a lower wind deflector and having an opening; a fan unit that can be inserted into and removed from the duct; a heat sink disposed adjacent to the first electronic component; Equipped with The upper airflow direction plate extends in a first direction from the opening, At least a portion of the heat sink and the lower airflow direction vane are spaced apart from the upper airflow direction vane in a second direction perpendicular to the first direction, A first space is formed in the duct, the first space is continuous with the opening, is aligned with the opening in the first direction, and is located between the lower airflow direction plate and the upper airflow direction plate, and between at least a portion of the heat sink and the upper airflow direction plate. In a first state in which the fan unit is disposed in the duct, the fan unit is located between at least a portion of the heat sink and the first space, and between the lower airflow direction vane and the first space, and is capable of blowing air in the first space toward the heat sink, The electronic device has a downward air deflector that is aligned with the heat sink in the first direction, is located between the heat sink and the opening in the first direction, and has an inclined portion that slopes away from the first space as it approaches the heat sink.
2. The fan unit includes: the air is pushed from outside the duct into the duct through the opening along the first direction from the opening to the first space, The electronic device according to claim 1 , wherein the electrical current is pulled out from inside the duct through the opening in a direction opposite to the first direction.
3. 3. The electronic device according to claim 2, further comprising a locking member that is arranged at a fixed position in the opposite direction from the fan unit arranged in the duct, thereby restricting movement of the fan unit arranged in the duct in the opposite direction.
4. The fan unit has a blade that blows air and a rear portion and a front portion that are movable ranges of the blade, In the first state, at least a portion of the rear portion is aligned in the second direction with a central portion of the heat sink in the first direction, 4. The electronic device according to claim 1, wherein in the first state, at least a part of the front portion is aligned with the inclined portion in the second direction.
5. a second electronic component aligned with the duct in a third direction perpendicular to the first direction and the second direction in a plan view; The duct includes a first side plate and a second side plate facing each other in the third direction, at least a portion of the heat sink and the first space are located between the first side plate and the second side plate, The electronic device according to any one of claims 1 to 3, wherein the second side panel is located between the first side panel and the second electronic component and has a side hole penetrating the second side panel in the third direction.
Citation Information
Patent Citations
Cooler of electronic equipment
JP2002141451A