endoscope

Abstract

To provide an endoscope which allows effective utilization of a space inside an insertion portion.SOLUTION: An insertion portion 2 includes: a supporting member 71 for supporting an imaging optical system 70; an image pickup device 72 supported by the supporting member 71; a first circuit board 73 facing an end surface 72B of the image pickup device 72; a second circuit board 74 arranged to be perpendicular to the first circuit board 73; a cable 75 connected to the second circuit board 74; a covering member 76; and a tip end member 78 with a hole part 781 where the supporting member 71 and the imaging optical system 70 are inserted. The supporting member 71 includes a cylindrical part 711 and a rectangular cylinder part 712. The cylindrical part 711 is supported by the hole part 781, and a gap CL is provided between the tip end member 78 and the covering member 76. A diameter of a circumscribed circle 712E of the rectangular cylinder part 712 is equal to or more than an outer diameter Da of the cylindrical part 711.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an endoscope. [Background technology]

[0002] Patent Document 1 describes an imaging module that includes a chip-size package in which a plurality of connection lands are arranged on the back side of a light receiving section of an imaging element, a circuit board in which a plurality of connection electrodes are electrically and mechanically connected to the connection lands of the chip-size package via bumps, and an underfill agent filled in the gap between the chip-size package and the circuit board.

[0003] Patent Document 2 describes a circuit board unit in which a first signal cable is connected to a front row of lands on the surface of a circuit board so that an imaging element can be mounted on the surface, and the first signal cable is connected to the front row of lands and extends axially rearward, and a second signal cable is connected to a rear row of lands that are arranged in a vertical row in the axial direction and are arranged so as to overlap vertically with the surface of the circuit board.

[0004] Patent document 3 describes an imaging device comprising a solid-state imaging element, an objective lens unit for forming a subject image on the solid-state imaging element, and a holder for holding the solid-state imaging element and the objective lens unit, in which an area other than the light receiving area of ​​the solid-state imaging element, which is approximately parallel to the light receiving area, is abutted against the holder, and the light receiving area and the optical axis center of the objective lens unit are arranged approximately perpendicular to each other. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6038424 [Patent Document 2] Patent No. 6697244 [Patent Document 3] JP 2005-95432 A Summary of the Invention [Problem to be solved by the invention]

[0006] The technique disclosed herein provides an endoscope that can effectively utilize the space inside the insertion portion. [Means for solving the problem]

[0007] An endoscope according to one aspect of the technique disclosed herein includes an insertion portion to be inserted into a subject, the insertion portion including an imaging optical system, a cylindrical support member that supports the imaging optical system internally, an imaging element provided on a base end side of the insertion portion with respect to the imaging optical system and supported by the support member, a first board surface that faces a surface of the imaging element on the base end side of the insertion portion and a second board surface opposite to the first board surface, and connected to the imaging element on the first board surface, and a second circuit board provided on the base end side of the insertion portion with respect to the first circuit board, including a third board surface that intersects with the first board surface and a fourth board surface opposite to the third board surface, and connected to the second board surface on at least one of the third board surface and the fourth board surface. the imaging optical system; a substrate; a cable connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit board; a covering member covering a portion of the support member, the imaging element, the first circuit board, the second circuit board, and the cable; and a tip member having a hole through which the support member and the imaging optical system are inserted, the support member including a cylindrical portion supporting the imaging optical system and a square tube portion supporting the imaging element, the cylindrical portion being supported in the hole of the tip member, a gap being provided between the tip member and the covering member or the square tube portion of the support member, the covering member covering at least a portion of the square tube portion, and a diameter of a circumscribing circle of the square tube portion being equal to or greater than an outer diameter of the cylindrical portion.

[0008] An endoscope according to one aspect of the technique disclosed herein includes an insertion portion to be inserted into a subject, the insertion portion including an imaging optical system, a cylindrical support member that supports the imaging optical system inside the insertion portion, an imaging element provided on a base end side of the insertion portion with respect to the imaging optical system and supported by the support member, a first board surface that faces a surface of the imaging element on the base end side of the insertion portion and a second board surface opposite to the first board surface, a first circuit board connected to the imaging element on the first board surface, a cable provided on the base end side of the insertion portion with respect to the first circuit board and electrically connected to the first circuit board, a part of the support member, the imaging element, the first circuit board, and The imaging device has a covering member that covers the cable, and a tip member having a hole through which the support member and the imaging optical system are inserted, the support member including a cylindrical portion that supports the imaging optical system and a square tube portion that supports the imaging element, the cylindrical portion being supported in the hole of the tip member, a gap being provided between the tip member and the covering member or the square tube portion of the support member, the first substrate surface being provided with a plurality of terminals electrically connected to the imaging element, and when viewed in the axial direction of the insertion portion, the total area of ​​the plurality of terminals being 30% or less of the area of ​​the end face of the imaging element at the tip side of the insertion portion. Effect of the Invention

[0009] According to the technique of the present disclosure, it is possible to effectively utilize the space inside the insertion portion of the endoscope. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic diagram showing an endoscope 1 according to an embodiment of the technology of the present disclosure. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing the internal configuration of the tip portion 7 of the endoscope 1 shown in FIG. [Diagram 3] FIG. 3 is a schematic cross-sectional view taken along line AA in FIG. [Figure 4] FIG. 4 is a schematic cross-sectional view taken along line BB in FIG. [Diagram 5]FIG. 5 is a schematic diagram of the imaging element 72 as viewed in the axial direction from the tip end side. [Figure 6] FIG. 6 is a schematic diagram of the imaging element 72 and the first circuit board 73 as viewed in the axial direction from the tip end side. [Figure 7] FIG. 7 is a schematic diagram showing a modification of the cross section taken along line BB of FIG. [Figure 8] FIG. 8 is a schematic cross-sectional view taken along line CC in FIG. [Figure 9] FIG. 9 is a schematic diagram showing a modified example of the covering member 76, and corresponds to FIG. [Figure 10] FIG. 10 is a schematic cross-sectional view showing a first modified example of the tip portion 7. As shown in FIG. [Figure 11] FIG. 11 is a schematic cross-sectional view showing a second modified example of the tip portion 7. As shown in FIG. [Figure 12] FIG. 12 is a schematic cross-sectional view showing a third modified example of the tip portion 7. As shown in FIG. [Figure 13] FIG. 13 is a schematic cross-sectional view showing a fourth modified example of the tip portion 7. As shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] 1 is a schematic diagram showing an endoscope 1 according to an embodiment of the technology of the present disclosure. The endoscope 1 in the figure includes a long insertion section 2 to be inserted into a subject, an operation section 3 connected to the base end of the insertion section 2 and used for grasping and operating the endoscope 1, and a universal cord 4 for connecting the endoscope 1 to system components such as a light source device and a processor device (not shown). The endoscope 1 is not particularly limited, and may be, for example, an upper endoscope for observing the stomach or duodenum, a lower endoscope (colonoscope) for observing the large intestine, or a bronchoscope.

[0012] The insertion section 2 is composed of a flexible section 5, a bending section 6, and a tip section 7, which are arranged in sequence from the base end to the tip. The flexible section 5 is flexible and can be bent in any direction along the insertion path of the insertion section 2. The operation section 3 is provided with angle knobs 8 and 9, a treatment tool introduction port 12, an air / water supply button 10, a suction button 11, etc.

[0013] The bending portion 6 is bent in each of the up-down and left-right directions by operating the angle knobs 8 and 9. A treatment tool such as forceps is inserted from a treatment tool introduction port 12 and led out from a forceps port (not shown) provided at the tip portion 7. The tip portion 7 is also provided with an observation window (not shown) for photographing an internal site to be observed, and an illumination window (not shown) for irradiating the site to be observed with illumination light.

[0014] The insertion portion 2 moves along its axial direction and is inserted into the subject, and by rotating the angle knobs 8 and 9 of the operation unit 3, the bending portion 6 of the insertion portion 2 is bent up, down, left, and right. This allows the tip portion 7 of the insertion portion 2 to be oriented in a desired direction inside the body, and an observation image can be obtained through an observation window provided in the tip portion 7. Hereinafter, the axial direction of the insertion portion 2 will be simply referred to as the axial direction. Also, the side of the operation unit 3 in the axial direction will be referred to as the base end side, and the side of the tip portion 7 in the axial direction will be referred to as the tip side.

[0015] FIG. 2 is a schematic cross-sectional view showing the internal configuration of the tip portion 7 of the endoscope 1 shown in FIG. 2, the tip portion 7 has a tip member 78 provided at the most distal end side, and a cylindrical exterior member 77 provided at the base end side of the tip member 78. The tip member 78 and the exterior member 77 have a cylindrical outer shape, and components necessary for imaging, a light guide, a treatment tool channel, etc. are provided inside. The tip member 78 is provided with a cylindrical hole 781 that extends from the end face on the base end side to the end face on the tip end side.

[0016] The tip portion 7 includes, as components necessary for imaging, an imaging optical system 70, a cylindrical support member 71 that internally supports the imaging optical system 70, an imaging element 72 that is provided on the base end side of the imaging optical system 70 and supported by the support member 71, a first circuit board 73, a second circuit board 74, a cable 75, and a covering member 76 that covers a portion of the support member 71, the imaging element 72, the first circuit board 73, the second circuit board 74, and the cable 75.

[0017] The imaging optical system 70 includes a cylindrical lens frame 70B having a larger diameter at the distal end than at the proximal end in the illustrated example, and a lens group (four lenses 70A in the illustrated example) supported inside the lens frame 70B. The maximum diameter Db of the imaging optical system 70 is shown in Fig. 2. In this specification, this maximum diameter Db is defined as the outer diameter of the imaging optical system 70.

[0018] The support member 71 includes a cylindrical portion 711 that internally supports a small diameter portion on the base end side of the lens frame 70B, and a square tube portion 712 that supports the imaging element 72. The cylindrical portion 711 is disposed on the tip side of the square tube portion 712.

[0019] Fig. 3 is a schematic cross-sectional view taken along the line AA in Fig. 2. In Fig. 3, the imaging optical system 70 and the tip member 78 are omitted. As shown in Fig. 3, the cylindrical portion 711 has an outer peripheral surface 711A having a circular cross section perpendicular to the axial direction, and an inner peripheral surface 711B having a circular cross section perpendicular to the axial direction. The inner peripheral surface 711B supports a small diameter portion on the base end side of a lens frame 70B constituting the imaging optical system 70. Fig. 2 shows the outer diameter Df of the portion of the imaging optical system 70 supported by the inner peripheral surface 711B (the small diameter portion of the lens frame 70B).

[0020] 2, a portion of the imaging optical system 70 outside the support member 71 and the cylindrical portion 711 of the support member 71 are inserted into a hole 781 of the tip member 78, and the cylindrical portion 711 is supported by the inner circumferential surface of this hole 781. The outer diameter Da of the cylindrical portion 711 (diameter of the outer circumferential surface 711A in FIG. 3, see FIG. 2) is larger than the maximum diameter Db of the imaging optical system 70. As a result, the imaging optical system 70 is not directly supported by the hole 781 of the tip member 78.

[0021] The supporting form between the cylindrical portion 711 and the hole portion 781, and the supporting form between the imaging optical system 70 and the cylindrical portion 711 are not particularly limited, but for example, any one of fitting, bonding, and screw fastening, or a combination of two or more of these, can be adopted.

[0022] Fig. 4 is a schematic cross-sectional view taken along line BB in Fig. 2. In Fig. 4, the imaging optical system 70 and the tip member 78 are omitted. As shown in Figs. 3 and 4, the outer peripheral surface 712A of the rectangular tube portion 712 has a cross section perpendicular to the axial direction that forms a polygon having more than one side (in the example of Figs. 3 and 4, an octagon having four corners of a square chamfered). Note that the outer peripheral surface 712A may have a shape in which the corners of the polygon having more than one side are chamfered in a curved (R-shaped) shape rather than in a straight line shape.

[0023] 4, a rectangular plate-shaped recess 712B is provided on the end surface on the base end side of the rectangular tube portion 712. An opening 712C communicating with the internal space SP of the cylindrical portion 711 is formed in the bottom surface of the recess 712B.

[0024] 5 is a schematic diagram of the imaging element 72 viewed from the tip side in the axial direction. The imaging element 72 is a packaged CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. As shown in FIG. 5, the imaging element 72 has a rectangular shape when viewed in the axial direction. The imaging element 72 is supported by the rectangular tube portion 712 in the recess 712B shown in FIG. 4.

[0025] As shown in FIG. 4, an adhesion region 712D (a region between a rectangular frame of a dashed line in the figure and an outer periphery of the recess 712B) to which the imaging element 72 is adhered is provided on the bottom surface of the recess 712B. The imaging element 72 is supported by the angular tube portion 712 by being adhered to the recess 712B in the adhesion region 712D. The imaging element 72 may be supported by the angular tube portion 712 by being fitted into the recess 712B. The imaging element 72 may be supported by the angular tube portion 712 by being fitted into the recess 712B and further being adhered to the adhesion region 712D. The imaging element 72 may be supported by the angular tube portion 712 by being adhered to the side wall of the recess 712B.

[0026] The imaging element 72 has a rectangular frame-shaped peripheral region 72a (see FIG. 5) on an end face 72A on the tip side, which is adhered to the adhesion region 712D shown in FIG. 4. From the viewpoint of increasing the light receiving area of ​​the imaging element 72 while realizing a reduction in the diameter of the insertion portion 2, it is preferable that the area of ​​the peripheral region 72a is 50% or less of the area of ​​the end face 72A.

[0027] As shown in FIG. 2, the first circuit board 73 includes a first board surface 731 facing the end surface 72B on the base end side of the imaging element 72, and a second board surface 732 on the opposite side (base end side) to the first board surface 731, and is connected to the imaging element 72 at the first board surface 731. The first circuit board 73 is a rigid board having a bending rigidity greater than that of the imaging element 72, and is, for example, in the form of a plate in which a plurality of wirings are laminated from the first board surface 731 to the second board surface 732 via an insulating layer. The first circuit board 73 is, for example, a ceramic board, a glass board, a silicon board, or the like. The first circuit board 73 is arranged in a state in which the first board surface 731 and the second board surface 732 intersect in the axial direction (perpendicular to the axial direction in the example of FIG. 2).

[0028] A plurality of terminals are two-dimensionally arranged on end surface 72B of imaging element 72. Furthermore, terminals 73T (see FIG. 6) corresponding to each of the plurality of terminals of imaging element 72 are two-dimensionally arranged on first substrate surface 731 of first circuit board 73. Each terminal of end surface 72B of imaging element 72 and terminals 73T corresponding to each terminal on first substrate surface 731 of first circuit board 73 are electrically and mechanically connected by solder balls H. An underfill agent is preferably provided between imaging element 72 and first circuit board 73 to strengthen the connection therebetween.

[0029] 6 is a schematic diagram of the imaging element 72 and the first circuit board 73 viewed from the tip side in the axial direction. A plurality of terminals 73T (35 in the illustrated example) are two-dimensionally arranged on the first board surface 731 of the first circuit board 73. The total area of ​​the plurality of terminals 73T viewed in the axial direction is, for example, 30% or less of the area of ​​the end face 72A on the tip side of the imaging element 72. This makes it possible to prevent the circuit formed on the first circuit board 73 from becoming complicated. When the total area of ​​the plurality of terminals 73T exceeds 30% of the area of ​​the end face 72A of the imaging element 72, the mechanical connection between the imaging element 72 and the first circuit board 73 can be made stronger.

[0030] Figure 6 shows length 72X of the long side of imaging element 72, length 73X of two of the four sides of first circuit board 73 that run along this long side, length 72Y of the short side of imaging element 72, and length 73Y of two of the four sides of first circuit board 73 that run along this short side.

[0031] When viewed in the axial direction, the size of first circuit board 73 is larger than the size of imaging element 72. "The size of first circuit board 73 is larger than the size of imaging element 72" refers to any one of the following configurations: a configuration in which length 73X is larger than length 72X and length 73Y is larger than length 72Y, a configuration in which length 73X is the same as length 72X and length 73Y is larger than length 72Y, and a configuration in which length 73X is larger than length 72X and length 73Y is the same as length 72Y.

[0032] In the example of FIG. 6, length 73X is greater than length 72X and length 73Y is greater than length 72Y, and the entire imaging element 72 overlaps with first circuit board 73 when viewed in the axial direction.

[0033] Moreover, when viewed in the axial direction, the size of first circuit board 73 is larger than the outer diameter Df shown in Fig. 2. The size of first circuit board 73 here refers to length 73X and length 73Y.

[0034] Fig. 3 shows a circumscribing circle 712E of an outer peripheral surface 712A of the rectangular tube portion 712. As shown in Fig. 3, the diameter of the circumscribing circle 712E is larger than the outer diameter Da of the cylindrical portion 711 (the diameter of the outer peripheral surface 711A in Fig. 3, see Fig. 2). However, as shown in Fig. 7, the diameter of the circumscribing circle 712E may be the same as the outer diameter of the cylindrical portion 711. Fig. 7 is a schematic diagram showing a modified example of the BB cross section of Fig. 2.

[0035] The second circuit board 74 is provided on the base end side with respect to the first circuit board 73, and includes a third board surface 741 that intersects with the first board surface 731 (orthogonal in the example of Figure 2), and a fourth board surface 742 opposite the third board surface 741 (a board surface that is perpendicular to the first board surface 731 in the example of Figure 2).

[0036] The second circuit board 74 is connected to the second board surface 732 of the first circuit board 73 at each of the third board surface 741 and the fourth board surface 742. The second circuit board 74 is a rigid board having a bending rigidity greater than that of the imaging element 72, and is, for example, in the form of a plate in which a plurality of wirings are laminated via an insulating layer from the third board surface 741 to the fourth board surface 742. The second circuit board 74 is, for example, a ceramic board, a glass board, a silicon board, or the like.

[0037] A plurality of terminals 73t are provided on the second board surface 732 of the first circuit board 73. Furthermore, terminals 74t are provided on each of the third board surface 741 and the fourth board surface 742 of the second circuit board 74. The terminals 73t and the terminals 74t are electrically and mechanically connected to each other by solder Hb.

[0038] A terminal (not shown) electrically connected to the terminal 74t is provided on the third board surface 741 of the second circuit board 74, and a wire is connected to this terminal. A terminal (not shown) electrically connected to the terminal 74t is provided on the fourth board surface 742 of the second circuit board 74, and a wire is connected to this terminal. The wires connected to the terminals on the third board surface 741 and the fourth board surface 742 are bundled together to form a cable 75, which extends to the universal cord 4.

[0039] Second circuit board 74 may be configured so that only one of third board surface 741 and fourth board surface 742 is connected to second board surface 732 of first circuit board 73. Second circuit board 74 may be configured so that only one of third board surface 741 and fourth board surface 742 is connected to cable 75.

[0040] At least one of length 73X and length 73Y of first circuit board 73 may be the same as axial length 74L of second circuit board 74 (length in the direction along third board surface 741 and fourth board surface 742; see FIG. 2), but is preferably different. For example, length 74L being greater than at least one of length 73X and length 73Y facilitates connection between cable 75 and second circuit board 74. Furthermore, when length 74L is smaller than at least one of length 73X and length 73Y, the attitude of second circuit board 74 relative to first circuit board 73 can be easily stabilized.

[0041] Although thickness 73D (see FIG. 2) of first circuit board 73 and thickness 74D (see FIG. 2) of second circuit board 74 may be the same, it is preferable that they are different. For example, thickness 74D of second circuit board 74 is smaller than thickness 73D of first circuit board 73, so that the space around second circuit board 74 can be effectively utilized. Furthermore, when thickness 74D of second circuit board 74 is larger than thickness 73D of first circuit board 73, the rigidity of the connection between first circuit board 73 and second circuit board 74 can be increased, and durability can be improved.

[0042] Fig. 8 is a schematic cross-sectional view taken along line CC in Fig. 2. As shown in Fig. 8, second circuit board 74 is disposed at approximately the center of first circuit board 73 in a direction along the short side of imaging element 72. The arrangement is not limited to this, and second circuit board 74 may be configured to be disposed at one end of first circuit board 73 in a direction along the short side of imaging element 72, for example.

[0043] 4 and 8, the covering member 76 has, for example, a rectangular cylindrical shape whose cross section perpendicular to the axial direction is a square frame. The covering member 76 is made of, for example, a metal. As shown in Fig. 2, the covering member 76 surrounds and covers the rectangular cylindrical portion 712 of the supporting member 71, the imaging element 72, the first circuit board 73, the second circuit board 74, and the cable 75.

[0044] As shown in FIG. 4, the inner peripheral surface 76B of the covering member 76 is in direct or indirect contact with the outer peripheral surface 712A of the rectangular tube portion 712. For example, the rectangular tube portion 712 can be fitted into the covering member 76 so that the outer peripheral surface 712A is in direct contact with the inner peripheral surface 76B. Alternatively, the outer peripheral surface 712A of the rectangular tube portion 712 can be bonded to the inner peripheral surface 76B with an adhesive so that the outer peripheral surface 712A is in indirect contact with the inner peripheral surface 76B. In this way, the outer peripheral surface 712A of the rectangular tube portion 712 is in direct or indirect contact with the inner peripheral surface 76B of the covering member 76, thereby reinforcing the rectangular tube portion 712.

[0045] 8, the inner circumferential surface 76B of the covering member 76 is in direct or indirect contact with each of the four side surfaces of the first circuit board 73. For example, the first circuit board 73 can be fitted into the covering member 76, so that the side surface of the first circuit board 73 is in direct contact with the inner circumferential surface 76B. Alternatively, the side surface of the first circuit board 73 can be bonded to the inner circumferential surface 76B with an adhesive, so that the side surface of the first circuit board 73 is in indirect contact with the inner circumferential surface 76B. In this way, the side surface of the first circuit board 73 is in direct or indirect contact with the inner circumferential surface 76B of the covering member 76, so that the first circuit board 73 can be reinforced.

[0046] 6 is the same as length 72X, inner circumferential surface 76B of covering member 76 will directly or indirectly contact each of the two side surfaces (side surfaces along the long sides of imaging element 72) of first circuit board 73. When length 73Y shown in FIG. 6 is the same as length 72Y, inner circumferential surface 76B of covering member 76 will directly or indirectly contact each of the two side surfaces (side surfaces along the short sides of imaging element 72) of first circuit board 73. Even in such a case, first circuit board 73 can be reinforced.

[0047] 4 shows the outer diameter Dc of the covering member 76. The outer diameter Dc is larger than the maximum diameter Db (see FIG. 2) of the imaging optical system 70. In addition, the circumscribing circle 712E (see FIG. 3) of the rectangular tube portion 712 is larger than the outer diameter Da of the cylindrical portion 711. As a result, as shown in FIG. 2, a gap CL is provided between the covering member 76 and the rectangular tube portion 712 and the tip member 78.

[0048] Fig. 9 is a schematic diagram showing a modified example of the covering member 76, and corresponds to Fig. 4. As shown in Fig. 9, the cross-sectional shape of the outer circumferential surface 76A of the covering member 76 may be circular rather than rectangular.

[0049] The tip portion 7 of the endoscope 1 configured as above is manufactured, for example, as follows. First, an assembly is manufactured by assembling the support member 71, the imaging element 72, the first circuit board 73, the second circuit board 74, the cable 75, and the covering member 76. Next, the imaging optical system 70 is inserted into the cylindrical portion 711 of the support member 71 of this assembly, and the optical positions of the imaging element 72 and the imaging optical system 70 are adjusted by using an image captured by the imaging element 72, and the imaging optical system 70 is fixed to the cylindrical portion 711. Next, the assembly to which the imaging optical system 70 is fixed is inserted into a hole portion 781 of the tip member 78, and the cylindrical portion 711 and the tip member 78 are fixed in a state in which the tip surface of the imaging optical system 70 and the tip surface of the tip member 78 are aligned.

[0050] The optical positions of the imaging element 72 and the imaging optical system 70 may vary due to assembly errors, individual differences between the imaging element 72 and the imaging optical system 70, etc. For example, in Fig. 2, assuming that the imaging optical system 70 is located closer to the imaging element 72, it is necessary to fix the cylindrical portion 711 and the tip member 78 in a state where the end faces on the tip side of the covering member 76 and the square tube portion 712 are closer to the tip member 78. Since the tip portion 7 has a gap CL, even if there is variation in the optical positions of the imaging element 72 and the imaging optical system 70, the tip surface of the imaging optical system 70 and the tip surface of the tip member 78 can be aligned.

[0051] Furthermore, in the endoscope 1, the outer peripheral surface 712A of the rectangular tube portion 712 contacts the inner peripheral surface 76B of the covering member 76. This makes it possible to protect the unit including the support member 71, the image sensor 72, the first circuit board 73, the second circuit board 74, and the cable 75, and to increase durability. The inside of this support member 71 is filled with an adhesive such as an insulating epoxy resin, ensuring watertightness of the image sensor 72, etc.

[0052] In the endoscope 1, the side surface of the first circuit board 73 is in contact with the inner circumferential surface 76B of the covering member 76. The imaging element 72 is not in contact with the covering member 76. This allows the imaging element 72 between the support member 71 and the first circuit board 73 to be protected more firmly. In particular, when the total area of ​​the multiple terminals 73T is 30% or less of the area of ​​the end face 72A of the imaging element 72, the mechanical connection strength between the imaging element 72 and the first circuit board 73 is low, so that the protective effect of the contact between the square tube portion 712 and the first circuit board 73 and the covering member 76 can be enhanced. In addition, when the area of ​​the peripheral region 72a of the imaging element 72 is 50% or less of the area of ​​the end face 72A, the mechanical connection strength between the imaging element 72 and the square tube portion 712 is low, so that the protective effect of the contact between the square tube portion 712 and the covering member 76 can be enhanced.

[0053] Furthermore, in the endoscope 1, the covering member 76 covers the entire second circuit board 74. For this reason, even if the strength of the second circuit board 74 is reduced when the length 74L of the second circuit board 74 is large or the thickness 74D of the second circuit board 74 is small, the second circuit board 74 can be reinforced by the covering member 76.

[0054] Fig. 10 is a schematic cross-sectional view showing a first modified example of the tip portion 7. Fig. 10 differs from Fig. 2 in that the outer diameter Da of the cylindrical portion 711 is the same as the diameter of the circumscribing circle 712E of the rectangular tube portion 712, and that the imaging element 72 is supported on the end surface 712S on the base end side of the rectangular tube portion 712.

[0055] In the modification shown in Fig. 10, the thickness of the rectangular tube portion 712 is thin, so that the imaging element 72 is supported by an end surface 712S on the base end side of the rectangular tube portion 712. For example, the imaging element 72 is adhered to the end surface 712S on the base end side of the rectangular tube portion 712 with an adhesive. In the modification shown in Fig. 10, a gap CL is provided between the covering member 76 and the tip member 78. In the modification shown in Fig. 10, the outer diameter of the covering member 76 can be made smaller than that of the configuration shown in Fig. 2, so that the diameter of the insertion portion 2 can be made thinner.

[0056] 10, it is preferable that the side surface of the imaging element 72 is not in contact with the covering member 76. This can prevent the covering member 76 from directly applying force to the imaging element 72.

[0057] FIG. 11 is a schematic cross-sectional view showing a second modified example of the tip portion 7. In FIG. 11, the difference from FIG. 2 is that a recess 712a is added to the end of the base end side and the outer periphery side of the square tube portion 712, and the tip portion of the covering member 76 directly or indirectly contacts this recess 712a. That is, in the modified example shown in FIG. 11, the covering member 76 covers a part of the square tube portion 712, and there is no gap between the covering member 76 and the tip member 78, and a gap CL is provided between the square tube portion 712 and the tip member 78. According to the modified example shown in FIG. 11, the outer diameter of the covering member 76 can be made smaller than that of the configuration shown in FIG. 2, so that the diameter of the tip portion 7 can be made thinner.

[0058] FIG. 12 is a schematic cross-sectional view showing a third modified example of the tip portion 7. In FIG. 12, the difference from FIG. 2 is that a recess 712a is added to the end of the base end side and outer periphery side of the square tube portion 712, the tip portion of the covering member 76 is in direct or indirect contact with this recess 712a, and the imaging element 72 is supported on the end surface 712S on the base end side of the square tube portion 712. In the modified example shown in FIG. 12, there is no gap between the covering member 76 and the tip member 78, and a gap CL is provided between the square tube portion 712 and the tip member 78. According to the modified example shown in FIG. 12, the diameter of the tip portion 7 can be made thinner than the configuration shown in FIG. 2.

[0059] FIG. 13 is a schematic cross-sectional view showing a fourth modified example of the tip portion 7. In FIG. 13, the difference from FIG. 2 is that the recess 712B formed in the square tube portion 712 is formed deeper, and the imaging element 72, the first circuit board 73, and the second circuit board 74 are moved to the tip side. In the modified example shown in FIG. 13, the distance Lb between the end face 712S on the base end side of the support member 71 and the first board surface 731 of the first circuit board 73 is smaller than the distance La between the imaging element 72 and the first board surface 731 (in other words, the thickness of the solder ball H). With this configuration, for example, when the end face 712S of the square tube portion 712 and the first board surface 731 are bonded with an adhesive, peeling of the adhesive can be suppressed.

[0060] In the configuration examples of the tip portion 7 described so far, the second circuit board 74 is not essential and may be omitted. In this case, the configuration is such that the terminal 73t of the first circuit board 73 and the cable 75 are connected.

[0061] As described above, this specification describes at least the following items. In the following, components corresponding to the above-described embodiment are shown in parentheses, but the present invention is not limited to these.

[0062] (1) An insertion section (insertion section 2) to be inserted into a subject, The insertion part is An imaging optical system (imaging optical system 70); A cylindrical support member (support member 71) that supports the imaging optical system therein; an imaging element (imaging element 72) provided on the proximal end side of the insertion portion with respect to the imaging optical system and supported by the support member; a first circuit board (first circuit board 73) including a first board surface (first board surface 731) facing a surface (end surface 72B) of the imaging element on the base end side of the insertion portion and a second board surface (second board surface 732) opposite to the first board surface, the first circuit board being connected to the imaging element on the first board surface; a second circuit board (second circuit board 74) provided on the base end side of the insertion portion with respect to the first circuit board, including a third board surface (third board surface 741) intersecting the first board surface and a fourth board surface (fourth board surface 742) opposite to the third board surface, and connected to the second board surface at at least one of the third board surface and the fourth board surface; a cable (cable 75) connected to at least one of the third board surface and the fourth board surface of the second circuit board; a covering member (covering member 76) covering a portion of the support member, the imaging element, the first circuit board, the second circuit board, and the cable; a tip member (tip member 78) having a hole portion (hole portion 781) through which the support member and the imaging optical system are inserted, The support member includes a cylindrical portion (cylindrical portion 711) that supports the imaging optical system, and a square tube portion (square tube portion 712) that supports the imaging element, The cylindrical portion is supported in the hole of the tip member, A gap (gap CL) is provided between the tip member and the angular tube portion of the covering member or the support member, The covering member covers at least a portion of the rectangular tube portion, The diameter of the circumscribing circle (circumscribing circle 712E) of the angular tube portion is equal to or greater than the outer diameter (outer diameter Da) of the cylindrical portion.

[0063] (2) The endoscope according to (1), The outer diameter (maximum diameter Db) of the imaging optical system is smaller than the outer diameter (outer diameter Da) of the cylindrical portion.

[0064] (3) The endoscope according to (1) or (2), The imaging element is supported by an end surface (end surface 712S) of the support member on the base end side of the insertion portion, An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

[0065] (4) The endoscope according to (1) or (2), An endoscope, wherein when viewed in the axial direction of the insertion portion, the size of the first circuit board (length 73X and length 73Y) is larger than the size (outer diameter Df) of the portion of the imaging optical system that is supported by the support member.

[0066] (5) The endoscope according to (4), An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

[0067] (6) The endoscope according to (1) or (2), the size of the first circuit board is larger than the size of the imaging element when viewed in the axial direction of the insertion portion.

[0068] (7) The endoscope according to (6), An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

[0069] (8) The endoscope according to (1) or (2), An endoscope, wherein a distance (distance Lb) between an end face (end face 712S) on the base end side of the insertion portion of the support member and the first board surface of the first circuit board is smaller than a distance (distance La) between the imaging element and the first board surface.

[0070] (9) The endoscope according to (1) or (2), the endoscope, wherein an outer diameter (outer diameter Dc) of the covering member is larger than an outer diameter (maximum diameter Db) of the imaging optical system when viewed in the axial direction of the insertion portion.

[0071] (10) The endoscope according to (1) or (2), An endoscope, wherein the thickness (thickness 73D) of the first circuit board and the thickness (thickness 74D) of the second circuit board are different.

[0072] (11) The endoscope according to (10), The second circuit board has a thickness smaller than a thickness of the first circuit board.

[0073] (12) The endoscope according to (1) or (2), An endoscope, wherein a first length (at least one of length 73X and length 74X) in a direction along the first board surface and the second board surface of the first circuit board is different from a second length (length 74L) in a direction along the third board surface and the fourth board surface of the second circuit board.

[0074] (13) The endoscope according to (12), The second length is greater than the first length.

[0075] (14) The endoscope according to (1) or (2), A plurality of terminals (terminals 73T) electrically connected to the imaging element are provided on the first substrate surface, the total area of ​​the plurality of terminals, when viewed in the axial direction of the insertion portion, is 30% or less of the area of ​​an end face (end face 72A) of the imaging element on the tip side of the insertion portion;

[0076] (15) The endoscope according to (1) or (2), the imaging element is supported by the support member through adhesion; An endoscope, wherein an area of ​​the region (peripheral region 72a) of the imaging element that is adhered to the support member is 50% or less of an area of ​​an end face (end face 72A) of the imaging element on the tip side of the insertion portion.

[0077] (16) An insertion section (insertion section 2) to be inserted into a subject, The insertion part is An imaging optical system (imaging optical system 70); A cylindrical support member (support member 71) that supports the imaging optical system therein; an imaging element (imaging element 72) provided on the proximal end side of the insertion portion with respect to the imaging optical system and supported by the support member; a first circuit board (first circuit board 73) including a first board surface (first board surface 731) facing a surface (end surface 72B) of the imaging element on the base end side of the insertion portion and a second board surface (second board surface 732) opposite to the first board surface, the first circuit board being connected to the imaging element on the first board surface; a cable (cable 75) provided on the base end side of the insertion portion with respect to the first circuit board and electrically connected to the first circuit board; a covering member (covering member 76) that covers a portion of the support member, the imaging element, the first circuit board, and the cable; a tip member (tip member 78) having a hole portion (hole portion 781) through which the support member and the imaging optical system are inserted, The support member includes a cylindrical portion (cylindrical portion 711) that supports the imaging optical system, and a square tube portion (square tube portion 712) that supports the imaging element, The cylindrical portion is supported in the hole of the tip member, A gap (gap CL) is provided between the tip member and the angular tube portion of the covering member or the support member, A plurality of terminals (terminals 73T) electrically connected to the imaging element are provided on the first substrate surface, the total area of ​​the plurality of terminals, when viewed in the axial direction of the insertion portion, is 30% or less of the area of ​​an end face (end face 72A) of the imaging element on the tip side of the insertion portion;

[0078] (17) The endoscope according to (16), the imaging element is supported by the support member through adhesion; An endoscope, wherein an area of ​​the region (peripheral region 72a) of the imaging element that is adhered to the support member is 50% or less of an area of ​​an end face (end face 72A) of the imaging element on the tip side of the insertion portion.

[0079] (18) The endoscope according to (16) or (17), a second circuit board (second circuit board 74) provided on the base end side of the insertion portion with respect to the first circuit board, including a third board surface (third board surface 741) intersecting the first board surface and a fourth board surface (fourth board surface 742) opposite to the third board surface, and connected to the second board surface at at least one of the third board surface and the fourth board surface; the cable is connected to at least one of the third board surface and the fourth board surface of the second circuit board; The endoscope, wherein the covering member covers a portion of the support member, the imaging element, the first circuit board, the second circuit board, and the cable.

[0080] (19) The endoscope according to (18), The covering member covers at least a portion of the rectangular tube portion.

[0081] (20) The endoscope according to (19), The diameter of the circumscribing circle (circumscribing circle 712E) of the angular tube portion is equal to or greater than the outer diameter (outer diameter Da) of the cylindrical portion.

[0082] (twenty one) The endoscope according to (20), The outer diameter (maximum diameter Db) of the imaging optical system is smaller than the outer diameter (outer diameter Da) of the cylindrical portion.

[0083] (twenty two) The endoscope according to (18), The imaging element is supported by an end surface (end surface 712S) of the support member on the base end side of the insertion portion, An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

[0084] (twenty three) The endoscope according to (18), An endoscope, wherein when viewed in the axial direction of the insertion portion, the size of the first circuit board (length 73X and length 73Y) is larger than the size (outer diameter Df) of the portion of the imaging optical system that is supported by the support member.

[0085] (twenty four) The endoscope according to (23), An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

[0086] (twenty five) The endoscope according to (18), the size of the first circuit board is larger than the size of the imaging element when viewed in the axial direction of the insertion portion.

[0087] (26) The endoscope according to (25), An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member. [Explanation of symbols]

[0088] 1 Endoscope 2 Insertion section 3 Control section 4 Universal Code 5 Soft part 6 Curved section 7 Tip 8,9 Angle knob 10 Air / water supply button 12 Treatment tool inlet 70 Imaging Optical System 70B Lens frame 71 Support member 72 Image sensor 72A, 72B, 712S end face 72a Surrounding Area 73 1st circuit board 73T,73t,74t terminal 74 Second circuit board 75 Cable 76 Covering material 76A,711A,712A outer surface 76B,711B Inner surface 77 Exterior materials 78 Tip Parts 711 Cylindrical part 712 Square tube part 712B, 712a Recess 712C aperture 712D adhesive area 712E Circumcircle 731 First board surface 732 Second board surface 741 Third board surface 742 4th board surface 781 Hole

Claims

1. An insertion portion to be inserted into a subject, The insertion portion is An imaging optical system; a cylindrical support member that supports the imaging optical system therein; an imaging element provided on a proximal end side of the insertion portion with respect to the imaging optical system and supported by the support member; a first circuit board including a first board surface facing a surface of the imaging element on a base end side of the insertion portion and a second board surface opposite to the first board surface, the first circuit board being connected to the imaging element on the first board surface; a second circuit board provided on a base end side of the insertion portion with respect to the first circuit board, the second circuit board including a third board surface intersecting the first board surface and a fourth board surface opposite to the third board surface, and connected to the second board surface at at least one of the third board surface and the fourth board surface; a cable connected to at least one of the third board surface and the fourth board surface of the second circuit board; a covering member covering a portion of the support member, the imaging element, the first circuit board, the second circuit board, and the cable; a tip member having a hole through which the support member and the imaging optical system are inserted, the support member includes a cylindrical portion that supports the imaging optical system, and a rectangular tube portion that supports the imaging element, The cylindrical portion is supported in the hole of the tip member, A gap is provided between the tip member and the angular tube portion of the covering member or the support member, The covering member covers at least a portion of the rectangular tube portion, An endoscope, wherein the diameter of a circumscribing circle of the angular tube portion is equal to or greater than the outer diameter of the cylindrical portion.

2. 2. The endoscope according to claim 1, An endoscope, wherein the outer diameter of the imaging optical system is smaller than the outer diameter of the cylindrical portion.

3. The endoscope according to claim 1 or 2, the imaging element is supported on an end surface of the support member on a proximal end side of the insertion portion, An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

4. The endoscope according to claim 1 or 2, an endoscope, wherein, when viewed in the axial direction of the insertion portion, the size of the first circuit board is larger than the size of a portion of the imaging optical system that is supported by the support member;

5. The endoscope according to claim 4, An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

6. The endoscope according to claim 1 or 2, An endoscope, wherein the size of the first circuit board is larger than the size of the imaging element when viewed in the axial direction of the insertion portion.

7. The endoscope according to claim 6, An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

8. The endoscope according to claim 1 or 2, An endoscope, wherein a distance between an end face of the base end side of the insertion portion of the support member and the first board surface of the first circuit board is smaller than a distance between the imaging element and the first board surface.

9. The endoscope according to claim 1 or 2, An endoscope, wherein an outer diameter of the covering member is larger than an outer diameter of the imaging optical system when viewed in the axial direction of the insertion portion.

10. The endoscope according to claim 1 or 2, An endoscope, wherein the first circuit board and the second circuit board have different thicknesses.

11. The endoscope according to claim 10, An endoscope, wherein a thickness of the second circuit board is smaller than a thickness of the first circuit board. Endoscope.

12. The endoscope according to claim 1 or 2, An endoscope, wherein a first length of the first circuit board in a direction along the first board surface and the second board surface is different from a second length of the second circuit board in a direction along the third board surface and the fourth board surface.

13. 13. The endoscope according to claim 12, The second length is greater than the first length.

14. The endoscope according to claim 1 or 2, a plurality of terminals electrically connected to the imaging element are provided on the first substrate surface; An endoscope, wherein when viewed in the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​the end face of the imaging element at the tip side of the insertion portion.

15. The endoscope according to claim 1 or 2, the imaging element is supported by the support member through adhesion; An endoscope, wherein an area of ​​a region of the imaging element that is bonded to the support member is 50% or less of an area of ​​an end face of the imaging element on the tip side of the insertion portion.

16. An insertion portion to be inserted into a subject, The insertion portion is An imaging optical system; a cylindrical support member that supports the imaging optical system therein; an imaging element provided on a proximal end side of the insertion portion with respect to the imaging optical system and supported by the support member; a first circuit board including a first board surface facing a surface of the imaging element on a base end side of the insertion portion and a second board surface opposite to the first board surface, the first circuit board being connected to the imaging element on the first board surface; a cable provided on a proximal end side of the insertion portion with respect to the first circuit board and electrically connected to the first circuit board; a covering member covering a portion of the support member, the imaging element, the first circuit board, and the cable; a tip member having a hole through which the support member and the imaging optical system are inserted, the support member includes a cylindrical portion that supports the imaging optical system, and a rectangular tube portion that supports the imaging element, The cylindrical portion is supported in the hole of the tip member, A gap is provided between the tip member and the rectangular tube portion of the covering member or the support member, a plurality of terminals electrically connected to the imaging element are provided on the first substrate surface; An endoscope, wherein when viewed in the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​the end face of the imaging element at the tip side of the insertion portion.

17. 17. The endoscope according to claim 16, the imaging element is supported by the support member through adhesion; An endoscope, wherein an area of ​​a region of the imaging element that is bonded to the support member is 50% or less of an area of ​​an end face of the imaging element on the tip side of the insertion portion.

18. 18. The endoscope according to claim 16 or 17, a second circuit board provided on a base end side of the insertion portion with respect to the first circuit board, the second circuit board including a third board surface intersecting the first board surface and a fourth board surface opposite to the third board surface, and connected to the second board surface at at least one of the third board surface and the fourth board surface; the cable is connected to at least one of the third board surface and the fourth board surface of the second circuit board, An endoscope, wherein the covering member covers a portion of the support member, the imaging element, the first circuit board, the second circuit board, and the cable.

19. 20. The endoscope according to claim 18, The covering member covers at least a portion of the rectangular tube portion.

20. 20. The endoscope according to claim 19, An endoscope, wherein the diameter of a circumscribing circle of the angular tube portion is equal to or greater than the outer diameter of the cylindrical portion.

21. 21. The endoscope according to claim 20, An endoscope, wherein the outer diameter of the imaging optical system is smaller than the outer diameter of the cylindrical portion.

22. 20. The endoscope according to claim 18, the imaging element is supported on an end surface of the support member on a proximal end side of the insertion portion, An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

23. 20. The endoscope according to claim 18, an endoscope, wherein, when viewed in the axial direction of the insertion portion, the size of the first circuit board is larger than the size of a portion of the imaging optical system that is supported by the support member;

24. 24. The endoscope of claim 23, An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

25. 20. The endoscope according to claim 18, An endoscope, wherein the size of the first circuit board is larger than the size of the imaging element when viewed in the axial direction of the insertion portion.

26. 26. The endoscope according to claim 25, An endoscope, wherein a side surface of the first circuit board is in direct or indirect contact with the covering member.

Images