Drawing device and drawing method

Abstract

To provide a drawing device that can appropriately focus, rotate, and expand / contract an electron beam.SOLUTION: A drawing device includes a charged particle source 110, a drawing unit 2, a stage 270 that holds a drawing target 300, a drive unit that moves the stage 270 in an in-plane direction and a vertical direction and has an actuator that moves the stage 270 vertically, a first measuring device 290 that measures the height position of the upper surface of the drawing target 300, and a control unit 3 that irradiates the stage 270 with a charged particle beam while moving the stage 270 in the in-plane direction, and controls the drive unit to move the stage 270 vertically such that the height of the position of the region is constant on the basis of the height position of the region of the drawing target 300 to be irradiated with the charged particle beam obtained before drawing of the drawing target 300 begins and the sensitivity coefficient of the actuator.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The embodiments relate to a drawing apparatus and a drawing method. [Background technology]

[0002] For example, with the increasing integration of LSIs (Large Scale Integrated Circuits) and the like, semiconductor devices are becoming finer year by year. Semiconductor devices are formed by reducing and transferring onto a wafer a high-precision original pattern (mask, or particularly, those used in steppers and scanners are also called reticles. Hereinafter, collectively referred to as masks) formed on quartz using a reduction projection exposure apparatus. The mask is drawn by a charged particle beam drawing apparatus using an electron beam or the like (hereinafter, a charged particle beam drawing apparatus using an electron beam will be referred to as an "electron beam drawing apparatus"). Here, drawing means forming a desired pattern on an object (e.g., a mask) by irradiating the object with an electron beam or the like.

[0003] As an electron beam lithography device, for example, a multi-beam type electron beam lithography device (hereinafter, sometimes referred to as a multi-beam lithography device) that irradiates multiple electron beams at once is known. In this multi-beam lithography device, for example, an electron beam emitted from an electron gun passes through an aperture member (also referred to as a shaping aperture array substrate) having multiple openings (holes) to form multiple beams. Then, each electron beam that forms the multiple beams is blanked and controlled by a blanking plate. The electron beam that has passed through the blanking plate is reduced in size by an optical system and irradiated at a desired position on a mask to be lithographed (for example, see Patent Document 1).

[0004] In an electron beam lithography system, the focus of the electron beam is adjusted to the surface of the mask using an objective lens. When the mask surface is uneven, the electron beam lithography system must dynamically perform focus correction (dynamic focus) during lithography. When dynamic focus is performed, the image of the electron beam rotates from the desired image on the mask surface, and the magnification of the electron beam image varies from the desired magnification, degrading the positional accuracy of the electron beam irradiated to the mask. In particular, in a multi-beam lithography system, the number of electron beams irradiated simultaneously in one irradiation is large compared to a single-beam lithography system (e.g., hundreds of thousands). Therefore, if the image of the electron beam rotates and the magnification of the image of the electron beam varies for the entire multi-beam, an unacceptable position error may occur. Therefore, in a multi-beam lithography system, it is required to simultaneously perform dynamic focus of the electron beam and adjustment of rotation and expansion and contraction according to the height of the beam irradiation position of the mask. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2006-261342 A Summary of the Invention [Problem to be solved by the invention]

[0006] Therefore, an object of the embodiment is to provide a charged particle beam drawing apparatus capable of keeping the mask surface height constant and suppressing positional errors within the mask surface. [Means for solving the problem]

[0007] The drawing apparatus according to the embodiment includes a charged particle source that emits a charged particle beam, a drawing unit that irradiates a drawing object with the charged particle beam, a stage that holds the drawing object, a drive unit that moves the stage in an in-plane direction of the stage and in a direction perpendicular to an upper surface of the stage, the drive unit having an actuator that moves the stage in the vertical direction, a first measuring device that measures the height position of the upper surface of the drawing object, and a control unit that irradiates the charged particle beam while moving the stage in the in-plane direction, and controls the drive unit to move the stage vertically so that the height of the area is constant based on the height position of the area of ​​the drawing object to be irradiated with the charged particle beam obtained before drawing of the drawing object begins and a sensitivity coefficient of the actuator. Effect of the Invention

[0008] According to the embodiment, it is possible to provide a drawing apparatus and a drawing method capable of keeping the mask surface height constant and suppressing positional errors within the mask surface. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a multi-beam writing apparatus according to the first embodiment. [Diagram 2] FIG. 2 is a diagram showing an example of the relationship between the Z stage, the mirror, the holder, and the XY coordinate detector on the XY plane. [Diagram 3] FIG. 3 is a perspective view of the Z stage and the mirror. [Figure 4] FIG. 4 is a cross-sectional view showing an example of the Z stage and the mirror in the YZ plane. [Diagram 5] FIG. 5 is a cross-sectional view showing an example of the Z stage and the mirror in the YZ plane. [Figure 6] FIG. 6 is a cross-sectional view showing an example of the Z stage and the mirror in the YZ plane. [Figure 7] FIG. 7 is a cross-sectional view showing an example of the Z stage and the mirror in the YZ plane. [Figure 8]FIG. 8 is a diagram showing an example of the relationship between the Z stage, the holder, and the mask in the YZ plane. [Figure 9] FIG. 9 is a flowchart of an example of the drawing method according to the first embodiment. [Figure 10] FIG. 10 is a flowchart of an example of the drawing method according to the first embodiment. [Figure 11] FIG. 11 is a partial schematic diagram of a multi-beam drawing apparatus according to a first modification of the first embodiment. [Figure 12] FIG. 12 is a diagram showing an example of the relationship between the X stage, the first Z driving section, the second Z driving section, the Z stage, and the holding section in the YZ plane. [Figure 13] FIG. 13 is a diagram showing an example of the relationship between the X stage, the third Z driving unit, the Z stage, the fourth Z driving unit, and the holding unit in the YZ plane. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described with reference to the drawings. In the following description, components having substantially the same functions and configurations are given the same reference numerals. Furthermore, each embodiment shown below is an example of an apparatus or method for embodying the technical idea of ​​the embodiment, and the technical idea of ​​the embodiment does not specify the material, shape, structure, arrangement, etc. of the components as described below. The technical idea of ​​the embodiment can be modified in various ways within the scope of the claims.

[0011] <1> First embodiment 1 is a schematic diagram of a drawing apparatus using charged particle multi-beams according to the first embodiment. In this embodiment, a configuration using an electron beam as an example of the charged particle beam will be described. However, the charged particle beam is not limited to an electron beam, and may be another charged particle beam such as an ion beam.

[0012] The drawing apparatus 1 shown in FIG. 1 includes a drawing unit 2 that draws a desired pattern by irradiating an electron beam onto an object such as a mask or a wafer, and a control unit 3 that controls the drawing operation by the drawing unit 2.

[0013] The drawing unit 2 has an electron beam column (which may be simply referred to as a column) 100 and a drawing chamber (which may be simply referred to as a chamber) 200.

[0014] The electron beam barrel 100 and the drawing chamber 200 form a sealed internal space. In order to avoid interference between gas molecules in the air and the electron beam, and to protect the electron gun that is provided on the upper part of the electron beam barrel 100 and becomes very hot, the drawing apparatus 1 is provided with an exhaust mechanism (not shown) that exhausts gas from the electron beam barrel 100 and the drawing chamber 200. For example, a vacuum pump such as a turbo molecular pump is used as the exhaust mechanism.

[0015] Arranged within the electron beam column 100 are an electron gun 110, an illumination lens 120, a shaping aperture array substrate 130, a blanking plate 140, a reduction lens 150, a limiting aperture member 160, an objective lens 170, and a deflector 180.

[0016] An electron gun 110 (charged particle source) emits an electron beam 400 (charged particle beam).

[0017] The illumination lens 120 controls the electron beam 400 emitted from the electron gun 110 so as to illuminate the entire shaping aperture array substrate 130 substantially perpendicularly. The illumination lens 120 is, for example, an electromagnetic lens.

[0018] The shaping aperture array substrate 130 forms a multi-beam 500 of a predetermined shape from the electron beam 400. Specifically, the shaping aperture array substrate 130 has openings (holes) formed in a matrix at a predetermined arrangement pitch. Each opening is formed in a rectangular or circular shape of the same dimensions. For example, a portion of the electron beam 400 passes through these multiple openings to form a multi-beam 500 consisting of multiple electron beams (e.g., hundreds of thousands).

[0019] The blanking plate 140 performs blanking control of the multi-beam 500 that has passed through the multiple openings of the shaping aperture array substrate 130. Specifically, the blanking plate 140 has multiple openings formed to correspond to each of the formed multi-beams 500. A pair of two electrodes (blanker: blanking deflector) is disposed in each opening of the blanking plate 140. An amplifier (not shown) that applies a voltage is disposed in one of the two electrodes for each electron beam, and the other of the two electrodes for each electron beam is grounded. The electron beams that pass through each opening are deflected independently by the voltage applied to the pair of two electrodes. Blanking control is performed by the deflection of the electron beams. In this way, the multiple blankers perform blanking control of the corresponding electron beams among the multi-beams 500 that have passed through the multiple openings of the shaping aperture array substrate 130.

[0020] The reduction lens 150 deflects the multi-beam 500 that was not deflected by the blanking plate 140 so as to form a crossover at a central opening formed in the limiting aperture member 160. The reduction lens 150 is, for example, an electromagnetic lens.

[0021] The limiting aperture member 160 has an opening (hole) at the center. The limiting aperture member 160 passes each electron beam that has been blanking-controlled by the blanking plate 140 so as to pass through the limiting aperture member 160 through the opening at the center. The limiting aperture member 160 blocks each electron beam that has been blanking-controlled by the blanking plate 140 so as not to pass through the limiting aperture member 160. Blocking an electron beam by the limiting aperture member 160 in this manner is described as "turning off an electron beam" or the like. Also, passing an electron beam through the limiting aperture member 160 is described as "turning on an electron beam" or the like. In this manner, the limiting aperture member 160 blocks each electron beam that has been deflected to be turned off by the blanker of the blanking plate 140. Then, the electron beam that has passed through the limiting aperture member 160 from when the electron beam is turned on until when it is turned off becomes the beam of one shot. Hereinafter, the multi-beams that have passed through the limiting aperture member 160 will be referred to as multi-beams 600.

[0022] The objective lens 170 adjusts the focus of the multi-beams 600 that have passed through the limiting aperture member 160 to form an image with a desired reduction ratio. The objective lens 170 is, for example, an electromagnetic lens.

[0023] The deflector 180 collectively deflects each electron beam (the entire multi-beam 600) that has passed through the limiting aperture member 160 in the same direction. As a result, the desired multi-beam 600 is irradiated onto a drawing target 300 such as a mask, which will be described later. The deflector 180 is composed of a group of at least four electrodes.

[0024] In the drawing chamber 200, a base 210, a Y driver 220, an X driver 240, a Z driver 260, a stage 270, a mirror 271, a holder 272, a awning 273, and an earth pin 274 are arranged, for example, in this order, each of which is supported on the base 210. In addition, an XY coordinate detector 280 is provided on a side surface of the drawing chamber 200, and a Z coordinate detector 290 is provided on the top surface of the drawing chamber. These coordinate detectors have detection circuits.

[0025] The Y driving unit 220 provided on the base 210 is a driving mechanism that moves the stage 270 in the Y direction within the stage surface. The Y driving unit 220 includes, for example, a motor and an air bearing.

[0026] X driving section 240 is a driving mechanism that moves stage 270 in the X direction (direction perpendicular to the Y direction) in the stage plane. X driving section 240 includes, for example, a motor and an air bearing.

[0027] The Z driving unit 260 moves the stage 270 along the Z direction perpendicular to the stage surface. The Z driving unit 260 can be configured with multiple actuators with good response, such as piezoelectric elements. In this case, it is possible to control each actuator independently. In other words, by controlling each actuator independently, it is possible to control the inclination of the stage 270 and perform balance adjustment. Also, the Z driving unit 260 may be a single actuator. Note that, as the actuator used in the Z driving unit 260, an actuator with backlash, such as a motor that converts lateral movement into lifting and lowering, is not suitable. It is sufficient to have a configuration with good response (for example, an operating speed of several tens of Hz or more), a sufficient stroke (for example, several μm), and direct drive, and is not limited to a piezoelectric actuator. The Z driving unit 260 is used to correct unevenness in height of the drawing target object 300 during drawing. Therefore, the Y driving unit 220, the X driving unit 240, and the Z driving unit 260 constitute a driving unit that moves the stage 270 in the in-plane direction of the stage 270 and in the vertical direction to the upper surface of the stage 270.

[0028] The mirror 271 is made up of a Y mirror 2711 for measuring the coordinate in the Y direction (Y coordinate) of the stage 270, and an X mirror 2712 for measuring the coordinate in the X direction (X coordinate).

[0029] The XY coordinate detector 280 is a laser measurement mechanism for detecting the Y coordinate and the X coordinate of the stage 270. As shown in Fig. 2, the XY coordinate detector 280 includes a Y coordinate detector 281 for measuring the Y coordinate of the stage 270, and an X coordinate detector 282 for measuring the X coordinate of the stage 270. The Y coordinate detector 281 and the X coordinate detector 282 irradiate laser light toward a Y mirror 2711 and an X mirror 2712, respectively, and measure the distance based on the phase of the reflected laser light. A configuration including the XY coordinate detector 280 and the mirror 271 functions as one measurement device for measuring the positional deviation in the in-plane direction of the stage 270 (the drawing target 300).

[0030] The Z coordinate detector 290 is a laser measurement mechanism for detecting the Z coordinate (hereinafter also referred to as "height position") of the drawing target 300 such as a mask. Specifically, the Z coordinate detector 290 measures the Z coordinate of the drawing target 300 by irradiating the drawing target 300 with laser light 293 in an oblique direction and receiving the laser light 293 reflected by the surface (top surface) of the drawing target 300.

[0031] The holder 272 is provided on the stage 270, and supports a drawing target 300 such as a mask. Examples of the drawing target 300 include a wafer, and a mask for exposure such as a mask blank onto which a pattern is transferred using a reduction projection type exposure device such as a stepper or scanner using an excimer laser as a light source, or an extreme ultraviolet exposure device. As an example, the following description will be given using a mask as the drawing target.

[0032] A canopy 273 is provided on the stage 270 and includes an earth pin 274. The earth pin 274 contacts the mask 300 and is grounded via the canopy 273.

[0033] The control unit 3 includes a control circuit 310 , a deflection control circuit 320 , a stage position detection circuit 330 , a stage drive control circuit 340 , a sensitivity update circuit 350 , an angle determination circuit 360 , a map generation circuit 370 , and a storage unit 380 .

[0034] The control circuit 310 controls the entire control unit 3 .

[0035] The deflection control circuit 320 controls the electron gun 110 , the illumination lens 120 , the reduction lens 150 , the objective lens 170 , and the deflector 180 .

[0036] The stage position detection circuit 330 controls the XY coordinate detector 280 and the Z coordinate detector 290 .

[0037] The stage drive control circuit 340 controls the Y drive section 220 , the X drive section 240 , and the Z drive section 260 .

[0038] The sensitivity update circuit 350 derives a sensitivity coefficient of the actuator in the Z drive section 260 based on the data stored in the storage section 380. Details will be described later.

[0039] Angle determination circuit 360 calculates the mirror angle of mirror 271. Details will be described later.

[0040] The map generation circuit 370 generates a Z map of the surface of the mask 300, as will be described in more detail below.

[0041] The storage unit 380 is, for example, a non-volatile storage unit, and stores various data.

[0042] In addition, the control circuit 310, the deflection control circuit 320, the stage position detection circuit 330, the stage drive control circuit 340, the sensitivity update circuit 350, the angle determination circuit 360, and the map generation circuit 370 may be software executed by a computer.

[0043] FIG. 2 is a layout diagram showing an example of a stage 270, a mirror 271, a holder 272, a Y-coordinate detector 281, and an X-coordinate detector 282 on the XY plane.

[0044] 2, a mask placement area 275 for placing a mask 300 is provided on the stage 270. In addition, in the mask placement area 275, a plurality of holders 272 (for example, three in FIG. 2) are provided.

[0045] Fig. 3 is a perspective view of the stage 270 and the mirror 271. Figs. 4 to 7 are cross-sectional views showing an example of the stage 270 and the mirror 271 in the YZ plane.

[0046] As shown in FIG. 4, it is preferable that the angle Θ (mirror angle) between the laser light reflecting surface of the Y mirror 2711 directed toward the Y coordinate detector 281 and the upper surface of the stage 270 is 90 degrees.

[0047] As shown in Fig. 5, when the mirror angle Θ of the Y mirror 2711 is greater than 90 degrees, when the stage 270 moves in the Z direction by a distance dh1, the Z coordinate 2711B at which the Y mirror 2711 reflects the Y coordinate detection laser light moves by a distance dh1 from the Z coordinate 2711A as shown in Fig. 6. At this time, the coordinate also moves in the Y direction by a distance dw1. The same is true when the mirror angle Θ of the Y mirror 2711 is less than 90 degrees as shown in Fig. 7. In this way, when the mirror angle Θ of the Y mirror 2711 is greater or smaller than 90 degrees, the coordinate in the Y direction moves even though the stage 270 moves only in the Z direction.

[0048] 4 to 7 have been described with a focus on Y mirror 2711. However, the same applies to X mirror 2712. Therefore, if the mirror angle Θ of Y mirror 2711 or X mirror 2712 is not 90 degrees, that is, if an installation error occurs in the measuring device including Y mirror 2711 and X mirror 2712, a positional deviation occurs in the in-plane direction based on the height position of stage 270.

[0049] Next, FIG. 8 shows an example of the stage 270, the holder 272, and the mask 300 in the YZ plane.

[0050] As shown in Fig. 8, the mask 300 placed on the holder 272 is bent downward at the center and upward at the end. This bending varies due to, for example, changes in air pressure. In the case of Fig. 8, the distance between the Z coordinate (300A) of the center of the mask 300 and the Z coordinate (300B) of the end of the mask 300 is dh2.

[0051] As shown in FIG. 8, when the mask 300 is warped or has irregularities, it is necessary to adjust the focus of the multi-beam 600 according to the height of the irradiation position.

[0052] In the imaging apparatus 1 according to this embodiment, the position of the stage 270 is controlled so that the height of the imaging position is constant.

[0053] An example of a drawing method using the drawing device 1 according to this embodiment will be described below. Fig. 9 is a flowchart of an example of the drawing method according to this embodiment.

[0054] [S1001] Control circuit 310 measures the sensitivity of the actuator that drives Z drive unit 260 before drawing on mask 300. Here, a method of measuring the sensitivity of the actuator will be described with reference to FIG.

[0055] [S2001] When measuring the sensitivity of the actuator, a mask may be placed on holding unit 272, or mask 300 may not be placed on holding unit 272. Also, a mark for measuring the sensitivity of Z drive unit 260 may be provided on mask 300, or may be provided directly on stage 270.

[0056] The stage drive control circuit 340 operates the actuator to drive the stage 270 in the Z direction. The set value sv of the Z coordinate is stored in the storage unit 380, for example.

[0057] [S2002] The Z coordinate detector 290 measures the Z coordinate of a mark provided on the mask 300 or the stage 270. Then, the Z coordinate detector 290 stores in the memory unit 380 the measured value Zmeas of the Z coordinate of the measured mark.

[0058] [S2003] The control circuit 310 judges whether or not all Z coordinates of the marks to be measured have been measured. If all Z coordinates of the marks to be measured have been measured, the control circuit 310 ends the measurement (S2003, YES) and proceeds to step S2004. If all Z coordinates have not been measured, the control circuit 310 returns to step S2001.

[0059] [S2004] Sensitivity update circuit 350 reads out Z coordinate setting value sv and measured value Zmeas stored in storage unit 380, and calculates actuator sensitivity coefficient k. As an example, if Z height when Z coordinate is setting value sv is Zmeas, and Z height when Z coordinate is setting value sv+Δsv is Zmeas+ΔZmeas, then k that satisfies ΔZmeas=k*Δsv is calculated and stored in storage unit 380. Note that sensitivity update may be performed during drawing.

[0060] [S1002] The control circuit 310 measures the mirror angle of the mirror 271 .

[0061] Specifically, the stage drive control circuit 340 detects the stage position by scanning the reference mark on the stage 270 and detecting the mark position while moving the stage 270 by the Z drive unit 260. Then, the stage position detection circuit 330 detects the fluctuation of the Y coordinate and the X coordinate via the XY coordinate detector 280. The XY coordinate detector 280 stores, for example, the fluctuation of the Y coordinate and the X coordinate in the storage unit 380. Then, the angle determination circuit 360 reads, for example, the Y coordinate and the X coordinate stored in the storage unit 380, and calculates the mirror angle of the Y mirror 2711 and the mirror angle of the X mirror 2712 based on the relationship with the Z coordinate. Then, the angle determination circuit 360 calculates the mirror angle coefficient f of the Y mirror 2711 and the mirror angle coefficient g of the X mirror 2712 based on the calculated mirror angle of the Y mirror 2711 and the mirror angle of the X mirror 2712, and stores them in the storage unit 380.

[0062] [S1003] After these preliminary measurements are made, writing begins on mask 300 .

[0063] [S1004] Control circuit 310 reads out sensitivity coefficient k of the actuator constituting Z driver 260 stored in storage unit 380.

[0064] [S1005] Control circuit 310 reads out mirror angle coefficient f of Y mirror 2711 and mirror angle coefficient g of X mirror 2712 stored in storage unit 380.

[0065] [S1006] The stage position detection circuit 330 acquires the height of the surface of the mask 300. Specifically, the stage drive control circuit 340 drives the Y drive unit 220 and the X drive unit 240. Then, the stage position detection circuit 330 detects the Z coordinate corresponding to the X coordinate and the Y coordinate of a predetermined area of ​​the mask 300. The height of the surface of the mask 300 may be acquired by reading out a Z map (a map showing the correspondence between the Y coordinate, the X coordinate, and the Z coordinate) stored in the storage unit 380. In this case, the map generation circuit 370 generates a Z map of the surface of the mask 300 using data detected in advance, and stores it in the storage unit 380. At this time, since the eaves 273 are arranged, the Z coordinate detector 290 cannot measure the height of the outer periphery of the mask 300. However, as shown in FIG. 11, a Z coordinate detector 251 is provided on the X(Y) drive unit 240 instead of the Z coordinate detector 290, and the height of the surface of the mask 300 is measured by measuring the distance from the stage 270, thereby making it possible to measure the height in real time.

[0066] [S1007] Control circuit 310 corrects the height of stage 270 during drawing on mask 300. Specifically, control circuit 310 dynamically controls stage drive control circuit 340 based on a previously determined sensitivity coefficient k and the Z coordinate of the mask surface so that the Z coordinate of the region of mask 300 irradiated with the multi-beams is constant. At this time, XY positional deviation is determined based on mirror angle coefficient f and mirror angle coefficient g, and stage tracking is performed by driving and controlling Y drive unit 220 and X drive unit 240 so as to absorb the XY positional deviation.

[0067] In this way, the Z coordinate of the mask 300 can be controlled taking into consideration the inclination of the reflecting surface of the mirror 271, the deflection of the mask, and unevenness, as described above. As a result, the height of the mask surface at the writing position can be controlled to be constant.

[0068] [S1008] Control circuit 310 determines whether or not drawing has finished, and repeats steps S1004 to S1008 until it has finished.

[0069] In the drawing apparatus 1 according to the embodiment described above, the Z coordinate of the area of ​​the mask 300 irradiated with the multi-beams can be kept constant by dynamically varying the Z coordinate of the stage 270 using a pre-determined sensitivity coefficient k and the Z coordinate of the mask surface.

[0070] Furthermore, before drawing on the mask 300, the drawing apparatus 1 according to this embodiment calculates the mirror angle coefficient f of the Y mirror 2711 and the mirror angle coefficient g of the X mirror 2712, obtains the positional deviation in the X and Y directions associated with the fluctuation of the Z coordinate, and controls the irradiation position by the deflector 180. This allows drawing with high positional accuracy even if the Z coordinate fluctuates.

[0071] <2> Second embodiment Next, a second embodiment will be described. In the first embodiment, the Z driving unit 260 has been described as being configured to be dynamically driven during drawing of the mask 300. However, in the second embodiment, another configuration for controlling the Z coordinate of the mask 300 will be described. Note that a description of the same configuration as in the first embodiment will be omitted.

[0072] A mechanism for adjusting the Z coordinate of the mask 300 will be described with reference to FIG.

[0073] As shown in FIG. 12, below the stage 270, a first Z driving section 261 and a second Z driving section 262 are provided as Z driving sections.

[0074] The first Z driving unit 261 is a driving mechanism that moves the stage 270 along the Z direction. For example, an ultrasonic motor can be used as the first Z driving unit 261. The first Z driving unit 261 is used to correct the thickness tolerance of the mask 300 within a range of, for example, several hundred μm, and is fixed during drawing. While the first Z driving unit 261 can correct a large tolerance, it has poor responsiveness and cannot operate dynamically during drawing on the mask 300. Therefore, the first Z driving unit 261 is used as a static driving unit.

[0075] The second Z driving unit 262 is a driving mechanism that moves the stage 270 along the Z direction. One or more actuators (piezoelectric elements) can be used as the second Z driving unit 262. As in the first embodiment, the second Z driving unit 262 is used to correct the height of the mask 300 during drawing. The second Z driving unit 262 can be one that can correct the Z coordinate within a range of several μm or more. The second Z driving unit 262 can operate dynamically during drawing on the mask 300 by using one that has better responsiveness than the first Z driving unit 261. Therefore, the second Z driving unit 262 is used as a dynamic driving unit.

[0076] The positions of the first Z driving unit 261 and the second Z driving unit 262 may be interchanged. The first Z driving unit 261 and the second Z driving unit 262 are each controlled by a stage driving control circuit 340.

[0077] Still another mechanism for adjusting the Z coordinate of the mask 300 will be described with reference to FIG.

[0078] FIG. 13 is a diagram showing an example of the third Z driving section 263, the stage 270, the fourth Z driving section 264, and the holder 272 in the YZ plane.

[0079] 13, a third Z driving unit 263 is provided below the stage 270. A fourth Z driving unit 264 is provided on the stage 270 between the stage 270 and the holder 272. The third Z driving unit 263 is used as a static driving unit similar to the first Z driving unit 261 described above. The fourth Z driving unit 264 is used as a dynamic driving unit similar to the second Z driving unit 262 described above.

[0080] As described above, according to the drawing device 1 of this embodiment, by combining a static driving unit and a dynamic driving unit, it is possible to correct the Z coordinate of the surface of the mask 300 more flexibly than in the first embodiment.

[0081] Furthermore, in each of the above-described embodiments, the Z coordinate in the area required for operating Z driver 260 may be acquired and Z adjustment may be performed. For example, adjustment may be performed for each stripe.

[0082] Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. In addition, the drawings do not show all the configurations, and some are not shown. Furthermore, the above embodiment includes inventions at various stages, and various inventions can be extracted by appropriately combining the disclosed components. For example, even if some components are deleted from the disclosed components, the invention can be extracted as long as the desired effect is obtained. [Explanation of symbols]

[0083] 1...drawing device 2...drawing section 3...control section 100...electron beam column 110...electron gun 120...illumination lens 130...shaping aperture array substrate 140...blanking plate 150...reduction lens 160...limiting aperture member 170...objective lens 180...deflector 200...drawing chamber 210...base 220...Y drive section 240...X drive section 251...Z coordinate detector 260, 261, 262, 263, 264...Z drive section 270...stage 271...mirror 272...holding section 273...eaves 274...earth pin 275...mask placement area 280...XY coordinate detector 281...Y coordinate detector 282...X coordinate detector 290...Z coordinate detector 293...laser light 300...mask 310...control circuit 320: Deflection control circuit 330: Stage position detection circuit 340: Stage drive control circuit 350: Sensitivity update circuit 360: Angle determination circuit 370: Map generation circuit 380: Memory unit 400: Electron beam 500: Multi-beam 600: Multi-beam 2711: Y mirror 2712: X mirror

Claims

1. a charged particle source that emits a charged particle beam; a writing unit that irradiates a writing target with the charged particle beam; a stage for holding the drawing target; a driving unit that moves the stage in an in-plane direction of the stage and in a direction perpendicular to an upper surface of the stage, the driving unit including an actuator that moves the stage in the vertical direction; a first measuring device for measuring a height position of the upper surface of the drawing target object; a control unit that irradiates the charged particle beam while moving the stage in the in-plane direction, and controls the drive unit to move the stage in the vertical direction so that the height of the region is constant based on the height position of the region of the drawing target that is irradiated with the charged particle beam, which is acquired before drawing of the drawing target is started, and a sensitivity coefficient of the actuator; A drawing device comprising:

2. a second measuring device that measures a position of the drawing object in the in-plane direction, The imaging apparatus according to claim 1 , wherein the control unit corrects a positional deviation occurring in the in-plane direction depending on an installation error of the second measuring device by moving the stage in the vertical direction.

3. The control unit determines and updates the sensitivity coefficient of the actuator.

3. The drawing device according to claim 1 or 2.

4. A drawing method comprising: irradiating a charged particle beam onto a drawing target while moving a stage holding the drawing target in an in-plane direction of the stage; and controlling a drive unit to move the stage in the vertical direction so that the height of the region is constant based on a height position of a region of the drawing target irradiated with the charged particle beam, which is obtained before drawing on the drawing target starts, and a sensitivity coefficient of an actuator that moves the stage in a direction perpendicular to an upper surface of the stage.

Images