Exposure apparatus, exposure method, and production method of article

Abstract

To provide an exposure apparatus advantageous for improving productivity when a damage is generated at a driving shaft of an adjustment unit.SOLUTION: An exposure apparatus for projecting an image of a pattern of an original plate onto a substrate, and scanning and exposing the substrate includes: an adjustment unit which is a unit for adjusting exposure light from a light source including a body, and a plurality of driving shafts for driving so as to deform the body during scanning and exposing; a detection part for detecting a damage of the driving shaft; a computing part for computing driving amounts of a plurality of the driving shafts for respective regions to scan and expose the substrate, where the computing part computes driving amounts of driving shafts other than a predetermined driving shaft for respective regions to scan and expose the substrate by a restriction of not driving the predetermined driving shaft when detecting a damage of the predetermined driving shaft by the detection part.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an article. [Background technology]

[0002] In the manufacture of liquid crystal panels, organic electroluminescence displays, semiconductor devices, and the like, exposure apparatuses are used to expose a pattern of an original onto a substrate coated with a photosensitive material. In exposure apparatuses, the requirements for finer patterns to be exposed and higher overlay accuracy are becoming stricter year by year. To improve the finer patterns and higher overlay accuracy, methods have been proposed for correcting illuminance unevenness and distortion using an adjustment unit. For example, there is a method of correcting illuminance unevenness using a variable slit that can locally change the illumination range of the illumination light illuminating the original, and a method of correcting distortion by deforming a flat glass with multiple actuators. In these adjustment units, multiple drive shafts deform the members of the adjustment unit, allowing local adjustment of the exposure amount, etc.

[0003] However, if a certain drive shaft among the multiple drive shafts breaks down, it becomes impossible to deform the member of the adjustment unit into the desired shape. In such a case, it is necessary to temporarily halt the production of the article to repair the broken drive shaft, which may result in a decrease in productivity.

[0004] Patent document 1 discloses that when a specific drive axis of a variable slit of an exposure device fails, the production of an article can be continued by recalculating the drive amount of the non-failed drive axis. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2023-49841 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the method described in Patent Document 1 does not provide detailed information about changing the drive amount of the drive axis during scanning exposure, and does not specifically describe how scanning exposure is performed by varying the drive amount for each area of ​​the substrate.

[0007] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, an object of the present invention is to provide an exposure apparatus that is advantageous in improving productivity when a failure occurs in the drive shaft of the adjustment unit. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, an exposure apparatus as one aspect of the present invention is an exposure apparatus that projects an image of a pattern of an original onto a substrate and scans and exposes the substrate, and includes an adjustment unit that adjusts the exposure light from a light source and includes an object and a plurality of drive axes that drive the object to deform during scanning and exposure, a detection unit that detects failure of the drive axes, and a calculation unit that calculates the drive amounts of the plurality of drive axes for each area where the substrate is scanned and exposed, and is characterized in that when a failure of a specified drive axis is detected by the detection unit, the calculation unit calculates the drive amounts of drive axes other than the specified drive axis for each area where the substrate is scanned and exposed, with the constraint that the specified drive axis is not driven. Effect of the Invention

[0009] According to the present invention, it is possible to provide an exposure apparatus that is advantageous in terms of improving productivity when a failure occurs in the drive shaft of the adjustment unit. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus. [Diagram 2] FIG. 2 is a schematic diagram showing a configuration of an adjustment unit. [Diagram 3] FIG. 13 is a diagram illustrating a driving position of an adjustment shaft in a comparative example. [Figure 4]13 is a flowchart relating to drive amount calculation. [Diagram 5] FIG. 13 is a diagram showing distortion measurement marks. [Figure 6] FIG. 13 is a diagram showing the results of distortion measurement. [Figure 7] FIG. 13 is a diagram showing divided regions and the calculation results of the drive amount in each region. [Figure 8] 13 is a schematic diagram showing a configuration of an adjustment unit in a modified example. FIG. [Figure 9] 1 is a flowchart of a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to refer to the same components, and duplicated explanations will be omitted.

[0012] An exposure apparatus 100 in this embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic diagram showing the overall configuration of the exposure apparatus 100. In this embodiment, a coordinate system is defined with the plane on which the substrate 10 is placed as the XY plane, and the direction perpendicular to the XY plane as the Z direction. Furthermore, within the XY plane, the scanning direction in which the substrate 10 is scanned is the Y direction, and the non-scanning direction perpendicular to the scanning direction is the X direction.

[0013] The exposure apparatus 100 in this embodiment is a lithography apparatus used in a photolithography process, which is a manufacturing process for devices such as semiconductor devices and FPDs. The exposure apparatus 100 in this embodiment exposes a substrate 10 through an original 3 on which a pattern is formed, and performs an exposure process of transferring the pattern of the original 3 to the substrate 10. The exposure apparatus 100 in this embodiment is a so-called step-and-scan scanning exposure apparatus that performs scanning exposure while synchronously scanning the original 3 and the substrate 10.

[0014] The exposure apparatus 100 includes an illumination optical system 1, an alignment scope 2, an original stage 30, a projection optical system 4, a substrate stage 11, and a controller 20. The original 3 is held by the original stage 30, and the substrate 10 is held by the substrate stage 11. The controller 20 includes a storage device such as a CPU and a memory, and controls the exposure apparatus 100 as a whole.

[0015] The illumination optical system 1 includes a mercury lamp 13 (light source), fly-eye lenses 14a and 14b, condenser lenses 15a and 15b, a plane mirror 16, an illuminance sensor 17 (measurement unit), a variable slit 18 (light shielding plate), and an imaging optical system 19. Light emitted from the mercury lamp 13 passes through the fly-eye lens 14a, the condenser lens 15a, and the fly-eye lens 14b. Thereafter, the optical path is bent by the plane mirror 16, and the light passes through the condenser lens 15b and enters the variable slit 18 and the imaging optical system 19 in that order.

[0016] The illuminance sensor 17 measures a portion of the light irradiated onto the variable slit 18. The illuminance sensor 17 is calibrated by an illuminance unevenness sensor 12 configured on the substrate stage 11, and is used as an illuminance monitor of the light irradiated onto the substrate 10 in this embodiment.

[0017] The adjustment unit 40 is a unit that corrects distortion by deforming an optical member (glass). FIG. 2 is a diagram showing the configuration of the adjustment unit 40. Light irradiated to the adjustment unit 40 passes through a flat glass 40a (object) and is illuminated on the substrate 10. The adjustment unit 40 has a flat glass 40a, a support member 40b, a ball screw 40c, and a stepping motor 40d. The support member 40b, the ball screw 40c, and the stepping motor 40d are collectively called a drive shaft 40e. The support member 40b holds the flat glass 40a, and the power of the stepping motor 40d is transmitted to the ball screw 40c, which drives the support member 40b in a direction perpendicular to the paper surface to deform the flat glass 40a. A plurality of support members 40b, ball screws 40c, and stepping motors 40d are mounted, and distortion within the irradiation area is corrected by locally deforming the flat glass 40a. That is, the adjustment unit 40 has a plurality of drive shafts 40e. In FIG. 2, the flat glass 40a has a rectangular shape, but this is not limited to a rectangular shape and can be changed to an arc shape or the like according to the shape of the illumination light.

[0018] A plurality of variable slits 18 are arranged in the non-scanning direction to block a portion of the exposure light and define an illumination range illuminated on the substrate 10. The imaging optical system 19 is configured to illuminate the object plane (the surface on which the original 3 is placed) of the projection optical system 4 with slit light whose illumination range is defined by the variable slits 18. In addition, the alignment scope 2 detects an alignment mark provided on the original 3 and an alignment mark provided on the substrate 10 via the projection optical system 4.

[0019] The projection optical system 4 is configured to include a first parallel plate 5a, a second parallel plate 5b, a first plane mirror 6, a second plane mirror 7, a convex mirror 8, and a concave mirror 9, and projects an image of the pattern of the original 3 illuminated by the illumination optical system 1 onto a substrate 10. The original 3 is disposed on the object plane of the projection optical system 4, and the substrate 10 is disposed on the image plane of the projection optical system 4. The projection optical system 4 can be configured as any of an equal-magnification imaging optical system, an enlarged imaging optical system, and a reduced imaging optical system, but is configured as an equal-magnification optical system in the exposure apparatus 100 of this embodiment.

[0020] The slit light that has passed through the original 3 irradiates the substrate 10 via the first parallel plate 5a, the first plane mirror 6, the first surface 9a of the concave mirror 9, the convex mirror 8, the second surface 9b of the concave mirror 9, the second plane mirror 7, the second parallel plate 5b, and the adjustment unit 40. Then, the original 3 and the substrate 10 are scanned in a scanning direction (Y direction) parallel to the substrate surface at a speed ratio according to the projection magnification of the projection optical system 4, whereby the pattern formed on the original 3 can be transferred onto the substrate 10.

[0021] The adjustment unit 40 may be provided, for example, downstream of the projection optical system 4, but is not limited to this and may be provided at another location in the projection optical system 4. The adjustment unit 40 may be provided in the illumination optical system 1 rather than the projection optical system 4. The variable slit 18 may be provided downstream of the illumination optical system 1, but is not limited to this and may be provided at another location in the illumination optical system 1. The variable slit 18 may be provided in the projection optical system 4 rather than the illumination optical system 1. That is, the adjustment unit 40 and the variable slit 18 are provided in at least one of the illumination optical system 1 and the projection optical system 4.

[0022] The illuminance unevenness sensor 12 measures the slit light that has passed through the projection optical system 4. The illuminance unevenness sensor 12 measures the slit light at each position in the irradiation area defined by the variable slit 18, and can measure the illuminance unevenness in the irradiation area.

[0023] Here, the illumination range on the substrate 10 illuminated by the slit light is the same as the illumination range of the original 3. Therefore, the variable slit 18 of the illumination optical system 1 is equivalent to defining the illumination shape on the substrate 10. By changing the slit width with the variable slit 18, it is possible to control the amount of exposure of the substrate 10 in scanning exposure.

[0024] The control unit 20 has a calculation unit 21, a drive control unit 22, and a detection unit 23. The calculation unit 22 calculates the drive amount of the drive axis 40e, which will be described in detail later. The drive control unit 22 controls the drive of each of the multiple drive axes 40e of the adjustment unit 40 based on the drive amount calculated by the calculation unit 21. The detection unit 23 detects a failure of the drive axis 40e. The control unit 20 can also control each part of the exposure apparatus 100. The control unit 20 is configured, for example, by a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), an ASIC (abbreviation of Application Specific Integrated Circuit), a computer with a built-in program, or a combination of all or part of these.

[0025] This embodiment is characterized in that when a failure of a predetermined drive axis is detected by the detection unit 23, the drive amounts of the drive axes other than the predetermined drive axis are calculated for each region of the substrate to be scanned and exposed, under the constraint that the predetermined drive axis is not driven. Here, the method of Patent Document 1 will be described as a comparative example.

[0026] Fig. 3 shows, as a comparative example, the drive amount of each of the multiple drive shafts 40e in the adjustment unit 40. Fig. 3(a) is a graph showing the drive amount when there is no failure in the drive shaft, and Fig. 3(b) is a graph showing the drive amount when a specific drive shaft (the seventh drive shaft) is failed.

[0027] In the comparative example, the drive amount of each drive axis is recalculated so that the relative drive amount between the specific drive axis shown in Fig. 3(a) and each drive axis does not change, with the failed specific drive axis as the origin. That is, the drive amount of each drive axis is recalculated with the position of the specific drive axis as the origin so that the general shape of the graph in Fig. 3(a) does not change. However, when exposure is performed by driving as described above, the exposure amount increases or decreases uniformly, so other adjustments (adjustments of the light source output and stage speed) are made to achieve the target exposure amount.

[0028] However, the method of the comparative example is a calculation method to be applied to a unit that adjusts the amount of exposure light, and cannot be applied to the adjustment unit 40 that performs distortion correction. Even if it is applied to a unit that adjusts the amount of exposure light, adjustments of the light source output and stage speed are necessary, making the adjustments complicated, and if the synchronization accuracy of multiple adjustments is poor, there is a risk of the exposure performance deteriorating.

[0029] The following describes a method for adjusting the adjustment unit 40 in this embodiment. In this embodiment, a process for performing distortion correction by deforming the adjustment unit 40 is performed, and will be described using the flowchart in Fig. 4. Each step in the flowchart can be executed by controlling each part of the exposure apparatus 100 by the control unit 20.

[0030] In step S500, a sensitivity table for each drive axis of the adjustment unit 40 is obtained. For example, the mark is measured by the alignment scope 2 while moving only one drive axis, and the image change amount in the X and Y directions is obtained in advance for all axes. This measurement is performed for all axes. This makes it possible to calculate the drive amount for each axis relative to the distortion correction amount. The position of the drive axis for correction can be calculated by multiplying the distortion to be actually corrected by the value in the sensitivity table.

[0031] In step S501, distortion data for the entire exposure area is acquired. The distortion generated by the projection optical system 4 is dependent on the device because the curved shape generated differs for each device. As shown in FIG. 5(a), distortion data is obtained by exposing the pattern of the original 3 onto the substrate 10, where marks M1-1 to M5-7 for measuring distortion are arranged at regular intervals, and measuring the amount of deviation of each mark using an optical microscope such as a length measuring machine. The length measuring machine can be a device external to the exposure device 100, but may also be a device provided within the exposure device 100.

[0032] As an example, the measurement of mark M1-1 will be explained using Fig. 5(b). The dashed frame in Fig. 5(b) is the design position of mark M1-1. If no deviation due to distortion occurs, ideally mark M1-1 would be exposed at the dashed line position, but in reality it is exposed at the solid line position, causing deviation. In this case, if the XY position of the dashed line is (X, Y) and the XY position of the solid line is (X', Y'), the deviation amounts Dx and Dy of mark M1-1 are calculated by the following formula 1. Dx=XX´ Dy = YY´ Equation (1)

[0033] All exposed marks for distortion measurement are measured with a length measuring machine, and the deviations Dx and Dy for each mark are measured. Fig. 6 shows data summarizing the measurement results of each mark measured with the length measuring machine. The deviations of marks M1-1 to M5-7 are measured, and the design position X300, position Y301, X component Dx302 of the deviation, and Y component Dy303 are recorded for each mark. This distortion data is measured, and the measurement results shown in Fig. 6 are stored in a storage device in the control unit 20.

[0034] In step S502, a drive amount switching position in the exposure area where scanning exposure is performed is determined. FIG. 7(a) is a diagram showing the areas and positions in the exposure area where the drive amount is switched. As an example, the exposure area is divided into areas EA1 to EA10 as shown in FIG. 7(a), and the drive amount is switched at the area switching positions P1 to P10. For each switching position P1 to P10, a drive amount as shown in FIG. 7(b) is calculated, and the areas EA1 to EA10 are scanned and exposed while driving each of the drive axes (drive axis 1 to drive axis 13) of the adjustment unit 40 to perform correction. In this embodiment, the number of divisions of the areas is described as 10, but it may be more or less than that. It is sufficient that the optimal division number is determined according to the scanning speed of the substrate stage and the drive speed of the drive axis of the adjustment unit 40.

[0035] In step S503, constraint conditions are determined when calculating the drive amount of the adjustment unit 40 by optimization calculation. In the optimization calculation, the least squares method is used to calculate the drive amount for correcting the distortion measured in S501. At this time, the following constraint conditions are added, and an optimal solution that simultaneously satisfies the added conditions is determined.

[0036] (constraint 1) Calculations are performed by adding constraints so that the change in other optical components such as astigmatism is kept below the allowable value. Constraint 1 is set because, although distortion is improved by driving the adjustment unit 40 to deform the flat glass, there is a possibility that optical characteristics such as astigmatism may deteriorate.

[0037] (constraint 2) The drive positions of the multiple drive shafts when scanning and exposing a first region (e.g., region EA3) of the substrate are defined as first drive positions. The drive positions of the multiple drive shafts when scanning and exposing a second region (e.g., region EA4) adjacent to the first region in the scanning direction (Y direction) by scanning exposure are defined as second drive positions. The difference between the first drive position and the second drive position is set not to exceed a first predetermined value.

[0038] Constraint 2 is because, when the difference between the first drive position and the second drive position is large, there is a possibility that the drive may not be able to keep up with the exposure of the second region. Therefore, the first predetermined value may be set in consideration of the speed of the drive axis. It is preferable that the first predetermined value is a value that is 50% or less of the drive amount that the drive axis can drive. For example, if the drive axis is ±6 mm, the first predetermined value may be set to 6 mm or less. If the drive amount is within that range, the scanning exposure of the second region can be performed without any problems. More preferably, the first predetermined value may be set to a value that is 25% or less of the drive amount that the drive axis can drive.

[0039] (constraint 3) The difference in drive position between adjacent drive shafts (for example, drive shafts 7 and 8) among the plurality of drive shafts is prevented from exceeding a second predetermined value.

[0040] Constraint 3 is because, if the position difference of the drive shaft becomes large, a large force is applied to the flat glass, which may cause damage. It is preferable that the second predetermined value is a value that is 50% or less of the driving amount that the drive shaft can drive. For example, if the drive shaft is ±6 mm, the second predetermined value can be set to 6 mm or less. This is because, with a driving amount within that range, there is a low risk of the glass being damaged. More preferably, the second predetermined value can be set to a value that is 25% or less of the driving amount that the drive shaft can drive.

[0041] (constraint 4) The average of the drive positions of the multiple drive axes is set to 0. Note that Constraint 4 can be set in the case where a drive axis failure is not detected. Constraint 4 can be set so that the solution for the drive amount does not diverge.

[0042] The calculation unit 21 calculates the drive amounts of the multiple drive shafts 40e while setting the multiple constraints described above.

[0043] In step S504, the detection unit 23 judges (detects) a failure of the drive shaft 40e of the adjustment unit 40. As a first method for judging a failure, there is a method in which the drive shaft of the adjustment unit 40 is driven when returning to the origin, and the change is confirmed by an encoder to confirm whether the drive is being performed as instructed. The measurement result of the encoder is transmitted to the detection unit 23, and a failure can be judged.

[0044] As a second method, when the drive axes of the adjustment unit 40 are not broken, all axes are driven to the 0 position and distortion measurement is performed in advance with the alignment scope 2. After that, a similar measurement is performed at the timing when the production process starts, and the position of the drive axis is calculated from the distortion measurement result and the sensitivity table measured in step S500, and it is determined whether the drive axis is operating normally. Since there is measurement variability in the measurements with the alignment scope 2, if there is a deviation that is greater than that variance, it can be determined that the axis cannot be driven and is broken.

[0045] In step S505, if a failure is determined in S504, the constraint conditions for the optimization calculation using the least squares method are changed. Among the constraint conditions described in step S503, the constraint for constraint 4 is excluded. Then, a constraint (constraint 5) is set to fix the failed drive shaft (predetermined drive shaft) so that it is not driven. That is, if a failure is determined in S504, constraints 1, 2, 3, and 5 are set.

[0046] In step S506, the drive amount of each drive axis at the correction position within the exposure area is calculated. As shown in Fig. 7(a), the exposure area is divided into 10 areas of equal size, and the positions where the areas switch are P1 to P10, and the drive amount of the adjustment unit at each position is calculated. Fig. 7(b) shows the results of calculating the drive amount for each drive axis of the adjustment unit at each position. In this example, there are a total of 13 drive axes, and the drive amount for each axis at each position P1 to P11 is obtained. At this time, the drive amount of the adjustment unit at one of positions P1 to P10 is calculated using the following formula (2).

[0047]

number

[0048] Here, m is the number of distortion measurement points, n is the number of drive axes of the adjustment unit, and the matrix I defines the explanatory variables of each constraint condition.

[0049] When setting the measured target value in the condition matrix on the right side of formula (2) and calculating the correction amount for each drive axis at that time, the correction amount is calculated by applying the sensitivity coefficient that represents the relationship between the drive amount and distortion change at the measurement mark position as the explanatory variable on the left side (formula (3)). The position of the mark for measuring distortion does not necessarily coincide with the position of the drive shaft of the adjustment unit. In such a case, an approximate value is calculated from the distortion value of the measurement position using a method such as linear interpolation.

[0050]

number

[0051] Next, the calculation of the correction amount when the Pth drive axis has failed will be explained. First, the calculation method when the drive axis is normal and not broken will be explained. The above-mentioned constraints 1 to 3 are set, and the correction amount is calculated by the following formula (4). Note that the left side is a matrix with N 1s set.

[0052]

number

[0053] On the other hand, when the Pth drive axis fails, the correction amount is calculated using the following formula (5) in order to fix the constraint condition to the position of the failed axis as explained in S505. In the matrix on the left side of formula (5), the Pth value is set to 1, and the others are set to 0. In addition, the position of the failed Pth drive axis is specified on the right side (condition for fixing a specified drive axis).

[0054]

number

[0055] Next, calculation of the correction amount when constraints 1 to 3 described in S503 are set will be described. For constraint 1, as shown in the following formula (6), a specified value condition indicating the tolerance of the allowable range of other optical components is set in the condition matrix on the right side, and the inequality sign is used as the condition of the formula to calculate the correction amount that satisfies the constraint condition.

[0056]

number

[0057] Regarding constraint 2, the condition is determined as shown in equation (7), and the explanatory variable matrix on the left side of equation (6) and the condition matrix on the right side are similarly set. Position difference between adjacent regions: correction amount n - Correction amount n+1 ≦First predetermined value Equation (7)

[0058] Regarding constraint 3, the condition is determined as shown in the following equation (89), and the explanatory variable matrix on the left side of equation (6) and the condition matrix on the right side are set accordingly. Position difference between adjacent drive mechanisms: correction amount n - Correction amount n+1 ≦second predetermined value... Equation (8)

[0059] The calculation unit 22 creates equations with constraints added, such as equations (2) to (8), and calculates drive amounts that satisfy each constraint. Then, based on the calculated drive amounts, the drive control unit 22 controls the drive shaft 40e to be driven, and distortion correction is performed during scanning exposure.

[0060] In this embodiment, distortion can be corrected by changing the position of the drive axis for each divided area during scanning exposure. In addition, by setting constraint 2, it is also possible to change the drive amount during scanning exposure. In addition, each drive axis is driven so that the relative positional relationship between a specific drive axis and the other drive axes when a failure of the specific drive axis is detected is different from the relative positional relationship between the specific drive axis and the other drive axes when no failure is detected.

[0061] In the above description, it is assumed that there is one specific drive shaft (broken drive shaft), but there may be two or more. However, as the number of broken drive shafts increases, the possibility of running out of solutions for the calculations increases, so it is preferable to replace or repair the drive shaft before the number of broken parts increases.

[0062] <Modification> In the above, a description has been given of the adjustment unit 40 capable of correcting distortion. As a modified example, this embodiment may be applied to the variable slit 18. Fig. 8 is a schematic diagram of an adjustment unit (variable slit 18) in the modified example.

[0063] The variable slit 18 has a light shielding member 18a (object), an adjustment unit 18c, and an axis 18d. The adjustment unit 18c and the axis 18d are collectively referred to as a drive axis 18e. The variable slit 18 blocks a part of the exposure light and defines an illumination range illuminated on the substrate 10. The light irradiated to the variable slit 18 passes through an opening 18b formed in the light shielding member 18a, thereby illuminating the original 3 in the shape of the opening 18b. The variable slit 18 has a plurality of adjustment units 18c constituted by a pulse motor, a ball screw, etc., and the adjustment units 18c are driven under the control of a variable slit control unit 22.

[0064] The variable slit 18 can adjust the shape of the opening 18b by deforming the light blocking member 18a by driving the adjustment portion 18c, thereby adjusting the amount of exposure light with which the substrate 10 is exposed.

[0065] Specifically, the length of the opening 18b in the scanning direction (Y direction) (hereinafter referred to as the slit width) is changed by driving the adjustment unit 18c. A plurality of adjustment units 18c are arranged in the non-scanning direction (X direction). The adjustment units 18c do not necessarily have to be arranged on a straight line in the non-scanning direction (X direction), and may be arranged, for example, in an arc shape. In the exposure apparatus 100, the illumination shape that illuminates the original 3 is described as being rectangular, but is not limited thereto, and the illumination shape may be, for example, an arc shape.

[0066] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. FIG. 9 is a flow chart of the method for manufacturing an article according to this embodiment. The method for manufacturing an article according to this embodiment includes a step of forming a latent image pattern on a photosensitive material applied on a substrate by exposure using the exposure apparatus 100 described above to obtain an exposed substrate (exposure step, step S11). The method also includes a step of developing the substrate exposed in this step to obtain a developed substrate (development step, step S12). Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing step, step S13). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0067] Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

[0068] The disclosure of the present specification includes at least the following exposure apparatus, exposure method, and article manufacturing method.

[0069] (Item 1) An exposure apparatus that projects an image of a pattern of an original onto a substrate and performs scanning exposure on the substrate, comprising: an adjustment unit that adjusts exposure light from a light source, the adjustment unit including an object and a plurality of drive shafts that drive the object so as to deform the object during scanning exposure; A detection unit that detects a failure of the drive shaft; a calculation unit that calculates drive amounts of the plurality of drive axes for each region of the substrate that is subjected to scanning exposure; having The exposure apparatus is characterized in that, when a failure of a specified drive axis is detected by the detection unit, the calculation unit calculates the drive amount of a drive axis other than the specified drive axis for each area where the substrate is scanned and exposed, under the constraint that the specified drive axis is not driven.

[0070] (Item 2) The exposure apparatus described in item 1, characterized in that the calculation unit calculates the drive amounts of the multiple drive axes when scanning and exposing the first area of ​​the substrate and the second area, under the constraint that the difference between the drive positions of the multiple drive axes when scanning and exposing a first area of ​​the substrate and the drive positions of the multiple drive axes when scanning and exposing a second area adjacent to the first area in the scanning direction by scanning exposure does not exceed a first predetermined value.

[0071] (Item 3) 3. The exposure apparatus according to item 2, wherein the first predetermined value is a value that is 50% or less of the maximum drive amount of the drive shaft.

[0072] (Item 4) The exposure apparatus described in any one of items 1 to 3, characterized in that the calculation unit calculates the drive amounts of the multiple drive axes under the constraint that the difference in drive positions of adjacent drive axes among the multiple drive axes does not exceed a second predetermined value.

[0073] (Item 5) 5. The exposure apparatus according to item 4, wherein the second predetermined value is a value that is 50% or less of the maximum drive amount of the drive shaft.

[0074] (Item 6) The exposure apparatus described in any one of items 1 to 5, characterized in that when the detection unit does not detect a failure of a drive axis, the calculation unit calculates the drive amounts of the multiple drive axes under the constraint that the average of the drive positions of the multiple drive axes is 0, and when the detection unit detects a failure of a specific drive axis, the calculation unit calculates the drive amounts of the multiple drive axes by excluding the constraint regarding the average of the drive positions of the multiple drive axes.

[0075] (Item 7) The exposure apparatus described in any one of items 1 to 6, characterized in that the calculation unit calculates the drive amounts of the multiple drive axes so that a relative positional relationship between the specified drive axis and a drive axis other than the specified drive axis when a failure of the specified drive axis is detected by the detection unit is different from a relative positional relationship between the specified drive axis and a drive axis other than the specified drive axis when a failure of the specified drive axis is not detected by the detection unit.

[0076] (Item 8) 8. The exposure apparatus according to any one of items 1 to 7, wherein the object is a flat glass, and the multiple drive shafts adjust the exposure light by deforming the flat glass.

[0077] (Item 9) 9. The exposure apparatus according to item 8, wherein the adjustment unit adjusts distortion of the exposure light.

[0078] (Item 10) a projection optical system for projecting an image of the pattern of the original onto the substrate; 10. The exposure apparatus according to item 8 or 9, wherein the adjustment unit is provided in the projection optical system.

[0079] (Item 11) 8. The exposure apparatus according to any one of items 1 to 7, wherein the object is a light-shielding member, and the multiple drive shafts adjust the exposure light by deforming the light-shielding member.

[0080] (Item 12) 12. The exposure apparatus according to item 11, wherein the adjustment unit adjusts an exposure amount of the exposure light with which the substrate is exposed.

[0081] (Item 13) an illumination optical system that illuminates the original with light from a light source; 13. The exposure apparatus according to item 11 or 12, wherein the adjustment unit is provided in the illumination optical system.

[0082] (Item 14) an illumination optical system that illuminates the original with light from a light source; a projection optical system that projects an image of the pattern of the original onto the substrate; Further comprising: 8. The exposure apparatus according to any one of items 1 to 7, wherein the adjustment unit is provided in at least one of the illumination optical system and the projection optical system.

[0083] (Item 15) An exposure method for projecting an image of a pattern of an original onto a substrate and scanning and exposing the substrate, the exposure method comprising: a unit for adjusting exposure light from a light source, the adjustment unit including an object and a plurality of drive shafts for driving the object so as to deform the object during scanning and exposure, the exposure method comprising the steps of: a detection step of detecting a failure of the drive shaft; a calculation step of calculating drive amounts of the plurality of drive axes for each region of the substrate that is subjected to scanning exposure; Including, The exposure method is characterized in that the calculation step calculates, when a failure of a specified drive axis is detected by the detection step, a drive amount of a drive axis other than the specified drive axis for each area of ​​the substrate to be scanned and exposed, under the constraint that the specified drive axis is not driven.

[0084] (Item 16) An exposure step of exposing a substrate using the exposure apparatus according to any one of items 1 to 14 to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate, A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate. [Explanation of symbols]

[0085] 3 Original version 10 Substrate 100 Exposure device 13 Mercury lamp (light source) 18 Variable slit (adjustment unit) 18a Light-shielding material (object) 18c adjustment section 18d axis 18e Drive shaft 40 Adjustment Unit 40a Flat glass (object) 40b Support member 40c ball screw 40d stepper motor 40e Drive shaft 20 Control section 21 Calculation section 22 Drive control unit 23 Detection unit

Claims

1. An exposure apparatus that projects an image of a pattern of an original onto a substrate and performs scanning exposure on the substrate, comprising: an adjustment unit that adjusts exposure light from a light source, the adjustment unit including an object and a plurality of drive shafts that drive the object so as to deform the object during scanning exposure; A detection unit that detects a failure of the drive shaft; a calculation unit that calculates drive amounts of the plurality of drive axes for each region of the substrate that is subjected to scanning exposure; having The exposure apparatus is characterized in that, when a failure of a specified drive axis is detected by the detection unit, the calculation unit calculates the drive amount of a drive axis other than the specified drive axis for each area where the substrate is scanned and exposed, under the constraint that the specified drive axis is not driven.

2. The exposure apparatus according to claim 1, wherein the calculation unit calculates the drive amounts of the multiple drive axes when scanning and exposing the first area of ​​the substrate and the second area, under the constraint that the difference between the drive positions of the multiple drive axes when scanning and exposing a first area of ​​the substrate and the drive positions of the multiple drive axes when scanning and exposing a second area adjacent to the first area in the direction scanned by the scanning exposure does not exceed a first predetermined value.

3. 3. An exposure apparatus according to claim 2, wherein the first predetermined value is a value that is 50% or less of an amount of drive that the drive shaft can drive.

4. 2. The exposure apparatus according to claim 1, wherein the calculation unit calculates the drive amounts of the plurality of drive axes under the constraint that a difference between drive positions of adjacent drive axes among the plurality of drive axes does not exceed a second predetermined value.

5. 5. An exposure apparatus according to claim 4, wherein the second predetermined value is a value equal to or less than 50% of the maximum drive amount of the drive shaft.

6. 2. The exposure apparatus according to claim 1, wherein when no drive axis failure is detected by the detection unit, the calculation unit calculates the drive amounts of the multiple drive axes under the constraint that the average of the drive positions of the multiple drive axes is 0, and when a failure of a specific drive axis is detected by the detection unit, the calculation unit calculates the drive amounts of the multiple drive axes by excluding the constraint regarding the average of the drive positions of the multiple drive axes.

7. 2. The exposure apparatus according to claim 1, wherein the calculation unit calculates the drive amounts of the multiple drive axes so that a relative positional relationship between the specified drive axis and a drive axis other than the specified drive axis when a failure of the specified drive axis is detected by the detection unit is different from a relative positional relationship between the specified drive axis and a drive axis other than the specified drive axis when a failure of the specified drive axis is not detected by the detection unit.

8. 2. The exposure apparatus according to claim 1, wherein the object is a flat glass, and the plurality of drive shafts adjust the exposure light by deforming the flat glass.

9. 9. The exposure apparatus according to claim 8, wherein the adjustment unit adjusts distortion of the exposure light.

10. a projection optical system for projecting an image of the pattern of the original onto the substrate; 9. The exposure apparatus according to claim 8, wherein the adjustment unit is provided in the projection optical system.

11. 2. The exposure apparatus according to claim 1, wherein the object is a light blocking member, and the plurality of drive shafts adjust the exposure light by deforming the light blocking member.

12. 12. The exposure apparatus according to claim 11, wherein the adjustment unit adjusts an exposure amount of the exposure light with which the substrate is exposed.

13. an illumination optical system that illuminates the original with light from a light source; 12. The exposure apparatus according to claim 11, wherein the adjustment unit is provided in the illumination optical system.

14. an illumination optical system that illuminates the original with light from a light source; a projection optical system that projects an image of the pattern of the original onto the substrate; Further comprising:

2. The exposure apparatus according to claim 1, wherein the adjustment unit is provided in at least one of the illumination optical system and the projection optical system.

15. An exposure method for projecting an image of a pattern of an original onto a substrate and scanning and exposing the substrate, the exposure method comprising: a unit for adjusting exposure light from a light source, the adjustment unit including an object and a plurality of drive shafts for driving the object so as to deform the object during scanning and exposure, the exposure method comprising the steps of: a detection step of detecting a failure of the drive shaft; a calculation step of calculating drive amounts of the plurality of drive axes for each region of the substrate that is subjected to scanning exposure; Including, The exposure method is characterized in that the calculation step calculates, when a failure of a specified drive axis is detected by the detection step, a drive amount of a drive axis other than the specified drive axis for each area of ​​the substrate to be scanned and exposed, under the constraint that the specified drive axis is not driven.

16. an exposure step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 14 to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate, A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

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