Lamination penetration capacitor
Patent Information
- Application Number
- JP2023139719
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-08-30
- Publication Date
- 2025-03-13
AI Technical Summary
【0015】 本発明の一つの態様は、直流抵抗を低減すると共に信頼性の低下を抑制する積層貫通コンデンサを提供する。
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Figure 2025033763000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a multilayer feedthrough capacitor. [Background technology]
[0002] A known multilayer feedthrough capacitor comprises an element body, a pair of first external electrodes spaced apart from each other and arranged on the element body, a second external electrode spaced apart from the pair of first external electrodes and arranged on the element body, and a number of internal electrodes arranged within the element body (see, for example, Patent Document 1). The multiple internal electrodes include an internal electrode connected to the pair of first external electrodes, and an internal electrode facing the internal electrode and connected to the second external electrode. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2018-67562 A Summary of the Invention [Problem to be solved by the invention]
[0004] An object of one aspect of the present invention is to provide a multilayer feedthrough capacitor that reduces DC resistance and suppresses deterioration in reliability. [Means for solving the problem]
[0005] A multilayer feedthrough capacitor according to one embodiment of the present invention comprises an element body, a pair of first external electrodes spaced apart from each other and arranged on the element body, a second external electrode spaced apart from the pair of first external electrodes and arranged on the element body, and a plurality of internal electrodes arranged within the element body. The plurality of internal electrodes include at least one first internal electrode connected to the pair of first external electrodes, at least one second internal electrode connected to the pair of first external electrodes, and at least one third internal electrode connected to the second external electrode. The element body includes a first region in which the at least one first internal electrode and the at least one third internal electrode are arranged facing each other, and a second region in which at least one second internal electrode is arranged. A first connection width between each of the pair of first external electrodes and the at least one first internal electrode is smaller than a second connection width between each of the pair of first external electrodes and the at least one second internal electrode.
[0006] In one embodiment, the at least one second internal electrode is connected to a pair of first external electrodes separately from the at least one first internal electrode. The at least one second internal electrode is arranged in a second region different from a first region in which the at least one first internal electrode and the at least one third internal electrode are arranged opposite each other. Therefore, the at least one second internal electrode contributes to reducing DC resistance. In one embodiment, the first connection width is smaller than the second connection width. That is, the connection length between each of the first external electrodes and the at least one second internal electrode is greater than the connection length between each of the first external electrodes and the at least one first internal electrode. Therefore, current easily flows through the at least one second internal electrode. The at least one second internal electrode further contributes to reducing the DC resistance. As a result, the above-described one aspect reduces the DC resistance.
[0007] Not only in feedthrough multilayer capacitors, but in electronic components, external electrodes tend to include a plating layer and an underlayer for forming the plating layer in order to improve mountability. The plating layer is formed, for example, by electrolytic plating. When the plating layer is formed by electrolytic plating, there is a risk that a plating solution will reach the interface between the underlayer and the element body and then penetrate into the element body. Penetration of the plating solution into the element body may reduce the reliability of the electronic component. The path of penetration of the plating solution into the element body includes, for example, a connection end of the internal electrode with the external electrode and an interface with the element body. In the one aspect, the first connection width is smaller than the second connection width. That is, the length of the connection end of the at least one first internal electrode with each of the pair of first external electrodes is smaller than the length of the connection end of the at least one second internal electrode with each of the pair of first external electrodes. Therefore, the plating solution is unlikely to penetrate into the element body from the interface between the connection end of the at least one first internal electrode and the element body. As a result, the one aspect suppresses a decrease in reliability.
[0008] In the above aspect, the multiple internal electrodes may include at least one fourth internal electrode connected to the pair of first external electrodes and at least one fifth internal electrode connected to the second external electrode. The element body may include a third region in which the at least one fourth internal electrode and the at least one fifth internal electrode are arranged facing each other. A third connection width between each of the pair of first external electrodes and the at least one fourth internal electrode may be smaller than the second connection width. The second region may be located between the first region and the third region. In the configuration in which the third connection width is smaller than the second connection width, the connection length between each of the first external electrodes and the at least one second internal electrode is greater than the connection length between each of the first external electrodes and the at least one fourth internal electrode. Therefore, current is more likely to flow through the at least one second internal electrode. The at least one second internal electrode contributes more to reducing the DC resistance. As a result, this configuration further reduces the DC resistance. In a configuration in which the third connection width is smaller than the second connection width, the length of the connection end of the at least one fourth internal electrode with each of the pair of first external electrodes is smaller than the length of the connection end of the at least one second internal electrode with each of the pair of first external electrodes. Therefore, a plating solution is unlikely to penetrate into the element body from the interface between the connection end of the at least one fourth internal electrode and the element body. As a result, this configuration suppresses a decrease in reliability. The element body may have a shape in which the ridges of the element body are curved or chamfered. In this case, the thickness of the base layer tends to be small at the ridges of the element body. In a configuration in which the thickness of the base layer is small, the plating solution tends to pass through the base layer and reach the interface between the base layer and the element body. Therefore, the plating solution tends to penetrate more easily into the interface between the element body and the connection end of the internal electrode that is close to the ridges and the external electrode than into the interface between the element body and the connection end of the internal electrode that is far from the ridges and the external electrode. In a configuration in which the second region is located between the first region and the third region, the first region and the third region tend to be closer to the edge portion than the second region. That is, the first region and the third region may be more susceptible to infiltration of plating solution than the second region. However, in a configuration in which the first connection width is smaller than the second connection width and the third connection width is smaller than the second connection width, as described above, it is difficult for plating solution to infiltrate into the element body. Therefore, even in a configuration in which the second region is located between the first region and the third region, it is possible to maintain the suppression of a decrease in reliability.
[0009] In the above one aspect, the at least one fourth internal electrode may include an electrode region that faces the at least one fifth internal electrode and has a width larger than the third connection width. The configuration in which the at least one fourth internal electrode includes the electrode region tends to increase the opposing area between the at least one fourth internal electrode and the at least one fifth internal electrode, and therefore, this configuration can increase the capacitance.
[0010] In the above-mentioned one aspect, the at least one second internal electrode may include a plurality of second internal electrodes opposed to each other at a distance smaller than a distance between the at least one fourth internal electrode and the at least one fifth internal electrode. The configuration in which the second internal electrodes face each other at a distance smaller than the distance between the at least one fourth internal electrode and the at least one fifth internal electrode can increase the number of second internal electrodes disposed in the second region, and therefore can further reduce the DC resistance. The configuration in which the second internal electrodes face each other at a distance smaller than the distance between the at least one fourth internal electrode and the at least one fifth internal electrode can increase the distance between the at least one fourth internal electrode and the at least one fifth internal electrode, thereby suppressing short circuits between the at least one fourth internal electrode and the at least one fifth internal electrode.
[0011] In the above-mentioned one aspect, the at least one first internal electrode may include an electrode region that faces the at least one third internal electrode and has a width larger than the first connection width. The configuration in which the at least one first internal electrode includes the electrode region tends to increase the opposing area between the at least one first internal electrode and the at least one third internal electrode, and therefore, this configuration can increase the capacitance.
[0012] In the above-mentioned one aspect, the at least one second internal electrode may include a plurality of second internal electrodes opposed to each other at a distance smaller than a distance between the at least one first internal electrode and the at least one third internal electrode. The configuration in which the second internal electrodes face each other at a distance smaller than the distance between the at least one first internal electrode and the at least one third internal electrode can increase the number of second internal electrodes disposed in the second region, and therefore can further reduce the DC resistance. The configuration in which the second internal electrodes face each other at a distance smaller than the distance between the at least one first internal electrode and the at least one third internal electrode can increase the distance between the at least one first internal electrode and the at least one third internal electrode, thus suppressing short circuits between the at least one first internal electrode and the at least one third internal electrode.
[0013] In the above aspect, the multiple internal electrodes may include at least one sixth internal electrode connected to the pair of first external electrodes. The element body may include a fourth region in which the at least one sixth internal electrode is arranged. The first connection width may be smaller than a fourth connection width between each of the pair of first external electrodes and the at least one sixth internal electrode. The first region may be located between the second region and the fourth region. In a configuration in which the multiple internal electrodes include the at least one sixth internal electrode, the at least one sixth internal electrode is connected to a pair of first external electrodes separately from the at least one first internal electrode. The at least one sixth internal electrode is arranged in a fourth region that is different from a first region in which the at least one first internal electrode and the at least one third internal electrode are arranged opposite each other. Therefore, the at least one sixth internal electrode contributes to reducing DC resistance. In a configuration in which the first connection width is smaller than the fourth connection width, the connection length between each of the first external electrodes and the at least one sixth internal electrode is greater than the connection length between each of the first external electrodes and the at least one first internal electrode. Therefore, current is more likely to flow through the at least one sixth internal electrode. The at least one sixth internal electrode contributes more to reducing DC resistance. As a result, these configurations further reduce DC resistance. In a configuration in which the first connection width is smaller than the fourth connection width, the length of the connection end of the at least one first internal electrode with each of the pair of first external electrodes is smaller than the length of the connection end of the at least one sixth internal electrode with each of the pair of first external electrodes. Therefore, a plating solution is unlikely to penetrate into the element body from the interface between the connection end of the at least one first internal electrode and the element body. As a result, this configuration suppresses a decrease in reliability.
[0014] In the above one aspect, the at least one first internal electrode may include a plurality of first internal electrodes having different first connection widths. Even in a configuration in which the at least one first internal electrode includes a plurality of first internal electrodes having different first connection widths, the first connection width of each of the plurality of first internal electrodes is smaller than the second connection width. Therefore, the plating solution is unlikely to penetrate into the element body from the interface between the element body and each of the connection ends of the plurality of first internal electrodes. As a result, this configuration still prevents a decrease in reliability. Effect of the Invention
[0015] One aspect of the present invention provides a multilayer feedthrough capacitor that reduces DC resistance and suppresses degradation of reliability. [Brief description of the drawings]
[0016] [Figure 1] FIG. 1 is a perspective view showing a feedthrough multilayer capacitor in accordance with one embodiment. [Diagram 2] FIG. 2 is an exploded perspective view showing the element body and a number of internal electrodes. [Diagram 3] FIG. 3 is a diagram showing a cross-sectional configuration of the feedthrough multilayer capacitor in accordance with this embodiment. [Figure 4] FIG. 4 is a diagram showing a cross-sectional configuration of the feedthrough multilayer capacitor in accordance with this embodiment. [Diagram 5] FIG. 5 is a plan view showing the internal electrodes. [Figure 6] FIG. 6 is a plan view showing the internal electrodes. [Figure 7] FIG. 7 is a plan view showing the internal electrodes. [Figure 8] FIG. 8 is a plan view showing the internal electrodes. [Figure 9] FIG. 9 is a plan view showing the internal electrodes. [Figure 10] FIG. 10 is an exploded perspective view showing the element body and a number of internal electrodes. [Figure 11] FIG. 11 is a plan view showing the internal electrodes. [Figure 12] FIG. 12 is an exploded perspective view showing the element body and a number of internal electrodes. [Figure 13] FIG. 13 is an exploded perspective view showing the element body and a number of internal electrodes. [Figure 14] FIG. 14 is a plan view showing the internal electrodes. [Figure 15] FIG. 15 is a plan view showing the internal electrodes. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0017] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated description will be omitted.
[0018] The configuration of the multilayer feedthrough capacitor CD1 in accordance with this embodiment will be described with reference to Fig. 1 to Fig. 9. Fig. 1 is a perspective view showing the multilayer feedthrough capacitor in accordance with this embodiment. Fig. 2 is an exploded perspective view showing the element body and a number of internal electrodes. Figs. 3 and 4 are views showing a cross-sectional configuration of the multilayer feedthrough capacitor in accordance with this embodiment. Each of Figs. 5 to 9 is a plan view showing the internal electrodes.
[0019] 1 to 4, the multilayer feedthrough capacitor CD1 comprises an element body 1, a pair of external electrodes 10, an external electrode 20, and a plurality of internal electrodes 30. The pair of external electrodes 10 are arranged on the element body 1 at a distance from each other. The external electrode 20 is arranged on the element body 1 at a distance from the pair of external electrodes 10. The multiple internal electrodes 30 are arranged within the element body 1.
[0020] The element body 1 has a rectangular parallelepiped shape. In this specification, the rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, or a rectangular parallelepiped shape with rounded corners and ridges. The element body 1 includes a pair of end faces 1a facing each other and four side faces 1c connecting the pair of end faces 1a. The outer surface of the element body 1 includes the pair of end faces 1a and the four side faces 1c. Each of the pair of end faces 1a and the four side faces 1c has a rectangular shape. In this specification, the rectangular shape includes, for example, a shape with each corner chamfered or a shape with each corner rounded. In FIG. 1, the illustration of the multiple internal electrodes 30 is omitted.
[0021] The element body 1 includes a plurality of dielectric layers 5. The dielectric layers 5 are stacked in a third direction D3. Each dielectric layer 5 is made of a sintered ceramic green sheet containing a dielectric material. The dielectric material includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. The dielectric layers 5 are integrated to the extent that the boundaries between the dielectric layers 5 are not visible.
[0022] A pair of end faces 1a face each other in a first direction D1. Of the four side faces 1c, a pair of side faces 1c face each other in a second direction D2. Another pair of side faces 1c face each other in a third direction D3. The four side faces 1c extend in the first direction D1 so as to connect the pair of end faces 1a. The first direction D1 intersects with the second direction D2 and also intersects with the third direction D3. The second direction D2 intersects with the third direction D3. In this embodiment, the first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other. The length of the element body 1 in the first direction D1 is, for example, 0.8 to 3.4 mm. The length of the element body 1 in the second direction D2 is, for example, 0.3 to 1.8 mm. The length of the element body 1 in the third direction D3 is, for example, 0.3 to 1.8 mm. For example, the first direction D1 of the element body 1 is the long side direction.
[0023] Each of the pair of external electrodes 10 is disposed on a corresponding one of the pair of end faces 1a and on four side faces 1c. Each external electrode 10 includes a first electrode portion located on the corresponding end face 1a and a second electrode portion located on a part of each of the four side faces 1c. The first electrode portion is continuous with the second electrode portion. The second electrode portion covers an area of the side face 1c closer to the corresponding end face 1a. The pair of external electrodes 10 includes a signal external electrode.
[0024] The external electrodes 20 are disposed on a pair of side surfaces 1c. The multilayer feedthrough capacitor CD1 may include a pair of external electrodes 20. FIG. 1 shows an example in which the multilayer feedthrough capacitor CD1 includes a pair of external electrodes 20. The pair of external electrodes 20, each of which is disposed on a corresponding one of the pair of side surfaces 1c, are spaced apart from each other and face each other in the second direction D2. The multilayer feedthrough capacitor CD1 may include only one external electrode 20. In this case, the one external electrode 20 is disposed, for example, on one of the pair of side surfaces 1c. The external electrode 20 includes a ground external electrode. For example, when the external electrode 10 includes a first external electrode, the external electrode 20 includes a second external electrode.
[0025] As shown in FIG. 3 and FIG. 4, the external electrodes 10, 20 include underlayers 10a, 20a. The underlayers 10a, 20a include a terminating metal layer. The sintered metal layer is formed by applying a conductive paste to the outer surface of the element body 1 and baking it. The conductive paste includes a metal powder, a glass component, an organic binder, and an organic solvent. The metal powder included in the conductive paste includes, for example, Cu powder or Ni powder. The underlayers 10a, 20a include a layer formed by sintering the metal powder included in the conductive paste. The external electrodes 10, 20 include at least one plating layer on the underlayers 10a, 20a. In this embodiment, the external electrode 10 includes two plating layers 10b, 10c on the underlayer 10a, and the external electrode 20 includes two plating layers 20b, 20c on the underlayer 20a. The underlayers 10a, 20a are underlayers for forming the plating layers 10b, 20b. The plating layer 10b is located between the underlayer 10a and the plating layer 10c, and the plating layer 20b is located between the underlayer 20a and the plating layer 20c. The plating layers 10b and 20b include, for example, a Ni plating layer. The plating layers 10b and 20b may include, instead of the Ni plating layer, a Sn plating layer, a Cu plating layer, or a Au plating layer. The plating layers 10c and 20c include a solder plating layer. The solder plating layer includes a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. These plating layers are formed by a plating method. The plating method includes, for example, an electrolytic plating method.
[0026] As shown in Figs. 2 to 4, the element body 1 includes regions R1, R2, and R3. Regions R1 and R3 include signal inner electrodes and ground inner electrodes, and mainly contribute to forming the capacitance of the multilayer feedthrough capacitor CD1. Region R2 includes current-carrying inner electrodes, and mainly contributes to reducing the DC resistance (Rdc) of the multilayer feedthrough capacitor CD1. Region R2 is disposed between regions R1 and R3. In this embodiment, region R2 is disposed between regions R1 and R3 in the third direction D3. For example, when region R1 includes the first region, region R2 includes the second region, and region R3 includes the third region.
[0027] In the region R1, a plurality of internal electrodes 31 and a plurality of internal electrodes 33 are arranged. That is, in the region R1, at least one internal electrode 31 and at least one internal electrode 33 are arranged. The plurality of internal electrodes 30 include an internal electrode 31 and an internal electrode 33. The internal electrode 31 includes a signal internal electrode. The internal electrode 33 includes a ground internal electrode. As shown in FIG. 2 to FIG. 4, each internal electrode 31 and each internal electrode 33 face each other with the dielectric layer 5 interposed therebetween. Each internal electrode 31 and each internal electrode 33 face each other with a distance L1. Each internal electrode 31 and each internal electrode 33 are arranged alternately. For example, when the internal electrode 31 includes a first internal electrode, the internal electrode 33 includes a third internal electrode.
[0028] 5, the internal electrode 31 extends in the first direction D1 and is exposed on each of the pair of end faces 1a. The internal electrode 31 is connected to each of the pair of external electrodes 10. The internal electrode 31 is electrically connected to the pair of external electrodes 10. The internal electrode 31 is not exposed on the side surface 1c and is spaced apart from the side surface 1c. The internal electrode 31 is not connected to the external electrode 20.
[0029] The internal electrode 31 includes a connection region 31a and an electrode region 31b. The internal electrode 31 includes two connection regions 31a and one electrode region 31b. The one electrode region 31b is located between the two connection regions 31a in the first direction D1. The two connection regions 31a and the one electrode region 31b are continuous with each other. The connection region 31a and the electrode region 31b have a rectangular shape when viewed from the third direction D3. For example, when the connection region 31a includes the first connection region, the electrode region 31b includes the first electrode region.
[0030] Each of the two connection regions 31a is connected to a corresponding one of the pair of external electrodes 10. Each of the connection regions 31a, in which each of the connection regions 31a and the corresponding external electrodes 10 are connected to each other, is connected to the corresponding external electrode 10 with a connection width W31a. The connection width W31a is the length of a connection end of at least one internal electrode 31 with each of the pair of external electrodes 10. The connection width W31a is, for example, the same as the width of the connection region 31a in the second direction D2. The electrode region 31b has a width W31b in the second direction D2. The connection width W31a is, for example, smaller than the width W31b. The connection width W31a may be equal to or smaller than the width W31b. The connection width W31a may be the same as the width W31b. The width of the connection region 31a in the second direction D2 may be the same as the width of the electrode region 31b in the second direction D2. 2 and 5 show an example in which the connection width W31a is smaller than the width W31b. At least one internal electrode 31 includes a plurality of internal electrodes 31 having different connection widths W31a. Each of the plurality of internal electrodes 31 has, for example, a connection width W31a different from each other. In this specification, the width being "same" may include the case where the widths are equal to each other, as well as the case where the widths are equal to each other including slight differences or manufacturing errors within a preset range. For example, when the average value of the connection width W31a falls within a range of ±10% of the average value of the width W31b, the connection width W31a is considered to be the same as the width W31b.
[0031] As shown in Fig. 6, the internal electrode 33 extends in the second direction D2 and is exposed to at least one of the pair of side surfaces 1c. The internal electrode 33 is connected to the external electrode 20. The internal electrode 33 is exposed to each of the pair of side surfaces 1c and connected to each of the external electrodes 20. The internal electrode 33 is electrically connected to the external electrode 20. The internal electrode 33 is not exposed to the end face 1a and is spaced from the end face 1a. The internal electrode 33 is not connected to the external electrode 10. At least one internal electrode 33 faces the electrode region 31b.
[0032] The internal electrode 33 includes a connection region 33a and an electrode region 33b. The internal electrode 33 includes two connection regions 33a and one electrode region 33b. The one electrode region 33b is located between the two connection regions 33a in the second direction D2. The two connection regions 33a and the one electrode region 33b are continuous with each other. The connection region 33a and the electrode region 33b have a rectangular shape when viewed from the third direction D3. For example, when the connection region 33a includes a third connection region, the electrode region 33b includes a third electrode region.
[0033] Each of the two connection regions 33a is connected to a corresponding one of the pair of external electrodes 20. The connection region 33a is electrically connected to the corresponding external electrode 20. The width of the connection region 33a in the first direction D1 is smaller than the width of the electrode region 33b in the first direction D1. The electrode region 33b has a width W33b in the second direction D2. The width W33b is, for example, the same as the width W31b. The width W33b is, for example, the same as the width W31b. The width W33b may be larger than the connection width W31a. The width W33b may be equal to or larger than the connection width W31a.
[0034] A plurality of internal electrodes 32 are arranged in the region R2. That is, at least one internal electrode 32 is arranged in the region R2. The plurality of internal electrodes 30 includes an internal electrode 32. At least one internal electrode 32 is arranged in the region R2. The at least one internal electrode 32 includes a plurality of internal electrodes 32. The internal electrode 32 includes a current-carrying internal electrode. As shown in FIG. 2 to FIG. 4, the plurality of internal electrodes 32 face each other with the dielectric layer 5 interposed therebetween. The plurality of internal electrodes 32 face each other with a distance L2. Each internal electrode 34 and each internal electrode 35 are alternately arranged. The distance L2 is, for example, smaller than the distance L1. Therefore, at least one internal electrode 32 faces at a distance L2 smaller than the distance L1 between the at least one internal electrode 31 and the at least one internal electrode 33. The plurality of internal electrodes 32 may include an internal electrode 32 facing the internal electrode 33. In this case, the multiple internal electrodes 32 must necessarily include an internal electrode 32 that does not face the internal electrode 33. For example, when the internal electrode 31 includes a first internal electrode, the internal electrode 32 includes a second internal electrode.
[0035] 7, the internal electrode 32 extends in the first direction D1 and is exposed on each of the pair of end faces 1a. The internal electrode 32 is connected to each of the pair of external electrodes 10. The internal electrode 32 is electrically connected to the pair of external electrodes 10. The internal electrode 32 is not exposed on the side surface 1c and is spaced apart from the side surface 1c. The internal electrode 32 is not connected to the external electrode 20. The internal electrode 32 has a rectangular shape when viewed from the third direction D3.
[0036] The internal electrode 32 is connected to the pair of external electrodes 10 at a connection width W32a. The connection width W32a is the length of a connection end of at least one internal electrode 32 with each of the pair of external electrodes 10. The internal electrode 32 has a width W32b in the second direction D2. The connection width W32a is, for example, the same as the width W32b. The width W32b is, for example, the same as the width W31b. The width W32b may be larger than the width W31b. For example, when the connection width W31a includes the first connection width, the connection width W32a includes the second connection width.
[0037] In this embodiment, the width W32b is equal to all of the connection width W32a, the width W31b, and the width W33b, and is greater than the connection width W31a. The width W32b is equal to the connection width W32a, and is greater than the widths W31b and W33b, and the widths W31b and W33b may be equal to or greater than the connection width W31a.
[0038] In the region R3, a plurality of internal electrodes 34 and a plurality of internal electrodes 35 are arranged. That is, in the region R3, at least one internal electrode 34 and at least one internal electrode 35 are arranged. The plurality of internal electrodes 30 include an internal electrode 34 and an internal electrode 35. The internal electrode 34 includes a signal internal electrode. The internal electrode 35 includes a ground internal electrode. As shown in FIG. 2 to FIG. 4, each internal electrode 34 and each internal electrode 35 face each other with a dielectric layer 5 interposed therebetween. Each internal electrode 34 and each internal electrode 35 face each other with a distance L3. Each internal electrode 34 and each internal electrode 35 are arranged alternately. The distance L2 is, for example, smaller than the distance L3. Therefore, at least one internal electrode 32 faces at a distance L2 smaller than the distance L3 between at least one internal electrode 34 and at least one internal electrode 35. The plurality of internal electrodes 32 may include an internal electrode 32 facing the internal electrode 35. In this case, the multiple internal electrodes 32 must necessarily include an internal electrode 32 that does not face the internal electrode 35. For example, when the internal electrode 31 includes a first internal electrode, the internal electrode 34 includes a fourth internal electrode, and the internal electrode 35 includes a fifth internal electrode.
[0039] 8, the internal electrode 34 extends in the first direction D1 and is exposed on each of the pair of end faces 1a. The internal electrode 34 is connected to each of the pair of external electrodes 10. The internal electrode 34 is electrically connected to the pair of external electrodes 10. The internal electrode 34 is not exposed on the side surface 1c and is spaced apart from the side surface 1c. The internal electrode 34 is not connected to the external electrode 20.
[0040] The internal electrode 34 includes a connection region 34a and an electrode region 34b. The internal electrode 34 includes two connection regions 34a and one electrode region 34b. The one electrode region 34b is located between the two connection regions 34a in the first direction D1. The two connection regions 34a and the one electrode region 34b are continuous with each other. The connection region 34a and the electrode region 34b have a rectangular shape when viewed from the third direction D3. For example, when the connection region 34a includes a fourth connection region, the electrode region 34b includes the fourth electrode region.
[0041] Each of the two connection regions 34a is connected to a corresponding one of the pair of external electrodes 10. Each of the connection regions 34a, in which each of the connection regions 34a and the corresponding external electrodes 10 are connected to each other, is connected to the corresponding external electrode 10 with a connection width W34a. The connection width W34a is the length of a connection end of at least one internal electrode 34 with each of the pair of external electrodes 10. The connection width W34a is, for example, the same as the width of the connection region 34a in the second direction D2. The electrode region 34b has a width W34b in the second direction D2. The connection width W34a is, for example, smaller than the width W34b. The connection width W34a may be equal to or smaller than the width W34b. The connection width W34a may be the same as the width W34b. The width of the connection region 34a in the second direction D2 may be the same as the width of the electrode region 34b in the second direction D2. 2 and 8 show an example in which the connection width W34a is smaller than the width W34b. For example, when the connection width W31a includes the first connection width, the connection width W34a includes the third connection width.
[0042] As shown in Fig. 9, the internal electrode 35 extends in the second direction D2 and is exposed to at least one of the pair of side surfaces 1c. The internal electrode 35 is connected to the external electrode 20. The internal electrode 35 is exposed to each of the pair of side surfaces 1c and connected to each of the external electrodes 20. The internal electrode 35 is electrically connected to the external electrode 20. The internal electrode 35 is not exposed to the end face 1a and is spaced from the end face 1a. The internal electrode 35 is not connected to the external electrode 10. At least one internal electrode 35 faces the electrode region 34b.
[0043] The internal electrode 35 includes a connection region 35a and an electrode region 35b. The internal electrode 35 includes two connection regions 35a and one electrode region 35b. The one electrode region 35b is located between the two connection regions 35a in the second direction D2. The two connection regions 35a and the one electrode region 35b are continuous with each other. The connection region 35a and the electrode region 35b have a rectangular shape when viewed from the third direction D3. For example, when the connection region 35a includes a fifth connection region, the electrode region 35b includes a fifth electrode region.
[0044] Each of the two connection regions 35a is connected to a corresponding one of the pair of external electrodes 20. The connection region 35a is electrically connected to the corresponding external electrode 20. The width of the connection region 35a in the first direction D1 is smaller than the width of the electrode region 35b in the first direction D1.
[0045] The electrode region 35b has a width W35b in the second direction D2. The width W35b is, for example, the same as the width W31b. The width W35b is, for example, the same as the width W31b. The width W35b may be greater than the connection width W31a. The width W35b may be equal to or greater than the connection width W31a. The width W35b is, for example, the same as the width W34b. The width W35b may be greater than the connection width W34a. The width W35b may be equal to or greater than the connection width W34a.
[0046] Each of the two connection regions 35a is connected to a corresponding one of the pair of external electrodes 20. The connection region 35a is electrically connected to the corresponding external electrode 20. The width of the connection region 35a in the first direction D1 is smaller than the width of the electrode region 35b in the first direction D1.
[0047] The internal electrodes 30 include a conductive material that is typically used as an internal electrode for a multilayer electric element. The conductive material included in the internal electrodes 30 includes Ni or Cu. The internal electrodes 30 are formed as a sintered body of a conductive paste that includes the conductive material.
[0048] In the example shown in Figures 3 and 4, region R1 includes two internal electrodes 31 and two internal electrodes 33, and the total number of internal electrodes included in region R1 is four. Region R2 includes four internal electrodes 32, and the total number of internal electrodes included in region R2 is four. The total number of internal electrodes included in region R2 is the same as the total number of internal electrodes included in region R1. In this embodiment, the total number of internal electrodes included in region R2 is not limited to the case where it is the same as the total number of internal electrodes included in region R1. In other words, the number of dielectric layers 5 included in region R2 is not limited to the case where it is the same as the number of dielectric layers 5 included in region R1.
[0049] As described above, the interval L2 is, for example, smaller than the interval L1. When the interval L2 is smaller than the interval L1, the thickness of each dielectric layer 5 included in the region R2 is smaller than the thickness of each dielectric layer 5 included in the region R1. The thickness of each dielectric layer 5 included in the region R2 is, for example, about 1 / 10 to 1 / 2 of the thickness of each dielectric layer 5 included in the region R1. Therefore, the number of dielectric layers 5 included in the region R2 may be greater than the number of dielectric layers 5 included in the region R1. That is, the total number of internal electrodes included in the region R2 may be greater than the total number of internal electrodes included in the region R1. In this embodiment, the number of the dielectric layers 5 included in the region R2 may be 10 to 500. The number of the dielectric layers 5 included in the region R1 may be 3 to 300.
[0050] 3 and 4, region R3 includes two internal electrodes 34 and two internal electrodes 35, and the total number of internal electrodes included in region R3 is four. The total number of internal electrodes included in region R2 is the same as the total number of internal electrodes included in region R3. In this embodiment, the total number of internal electrodes included in region R2 is not limited to the case where it is the same as the total number of internal electrodes included in region R3. In other words, the number of dielectric layers 5 included in region R2 is not limited to the case where it is the same as the number of dielectric layers 5 included in region R3.
[0051] As described above, the interval L2 is, for example, smaller than the interval L3. When the interval L2 is smaller than the interval L3, the thickness of each dielectric layer 5 included in the region R2 is smaller than the thickness of each dielectric layer 5 included in the region R3. The thickness of each dielectric layer 5 included in the region R2 is, for example, about 1 / 10 to 1 / 2 of the thickness of each dielectric layer 5 included in the region R3. Therefore, the number of dielectric layers 5 included in the region R2 may be greater than the number of dielectric layers 5 included in the region R3. That is, the total number of internal electrodes included in the region R2 may be greater than the total number of internal electrodes included in the region R3. In this embodiment, the number of dielectric layers 5 included in region R3 may be 3 to 300.
[0052] The feedthrough capacitor CD1 is mounted on an electronic device. The electronic device includes a circuit board or an electronic component. For example, the feedthrough capacitor CD1 is solder-mounted on the electronic device. In the feedthrough capacitor CD1, one of the side surfaces 1c includes a mounting surface facing the electronic device.
[0053] A multilayer feedthrough capacitor CD2 according to a first modified example of this embodiment will be described with reference to Fig. 10 and Fig. 11. Fig. 10 is an exploded perspective view showing an element body and a plurality of internal electrodes. Fig. 11 is a plan view showing the internal electrodes. The multilayer feedthrough capacitor CD2 is generally similar to or the same as the above-mentioned multilayer feedthrough capacitor CD1, but the multilayer feedthrough capacitor CD2 differs from the multilayer feedthrough capacitor CD1 in terms of the configurations of the element body 1 and the plurality of internal electrodes 30. The following mainly describes the differences between the multilayer feedthrough capacitor CD1 and the multilayer feedthrough capacitor CD2.
[0054] 10, in the first modified example, the element body 1 includes a region R1, a region R2, and a region R4. The region R1 is located between the region R2 and the region R4. In the present embodiment, the region R1 is located between the region R2 and the region R4 in the third direction D3. For example, when the region R1 includes the first region, the region R4 includes the fourth region.
[0055] A plurality of internal electrodes 36 are arranged in the region R4. That is, at least one internal electrode 36 is arranged in the region R4. The plurality of internal electrodes 30 include an internal electrode 36. At least one internal electrode 36 is arranged in the region R4. The internal electrode 36 includes a current-carrying internal electrode. For example, when the internal electrode 31 includes a first internal electrode, the internal electrode 36 includes a sixth internal electrode.
[0056] 11, the internal electrode 36 extends in the first direction D1 and is exposed on each of the pair of end faces 1a. The internal electrode 36 is connected to each of the pair of external electrodes 10. The internal electrode 36 is electrically connected to the pair of external electrodes 10. The internal electrode 36 is not exposed on the side surface 1c and is spaced apart from the side surface 1c. The internal electrode 36 is not connected to the external electrode 20. The internal electrode 36 has a rectangular shape when viewed from the third direction D3. The internal electrode 36 is connected to the pair of external electrodes 10 at a connection width W36a. The connection width W36a is the length of a connection end of at least one internal electrode 36 with each of the pair of external electrodes 10. The internal electrode 36 has a width W36b in the second direction D2. The connection width W36a is, for example, the same as the width W36b. The width W36b is, for example, the same as the width W31b. The width W36b may be larger than the width W31b. For example, when the connection width W31a includes the first connection width, the connection width W36a includes the fourth connection width.
[0057] With reference to Fig. 12, a multilayer feedthrough capacitor CD3 according to a second modified example of this embodiment will be described. Fig. 12 is an exploded perspective view showing an element body and a plurality of internal electrodes. The multilayer feedthrough capacitor CD3 is generally similar to or the same as the above-mentioned multilayer feedthrough capacitor CD1, but the multilayer feedthrough capacitor CD3 differs from the multilayer feedthrough capacitor CD1 in terms of the configurations of the element body 1 and the plurality of internal electrodes 30. Below, the differences between the multilayer feedthrough capacitor CD1 and the multilayer feedthrough capacitor CD3 will be mainly described.
[0058] In the second modified example, the element body 1 includes a region R1, a region R2, a region R3, a region R4, and a region R5. A plurality of internal electrodes 31 and a plurality of internal electrodes 33 are arranged in the region R5. That is, at least one internal electrode 31 and at least one internal electrode 33 are arranged in the region R5. The internal electrodes 31 and the internal electrodes 33 face each other with the dielectric layer 5 interposed therebetween. The internal electrodes 31 and the internal electrodes 33 are arranged alternately. In the second modified example, the region R1, the region R2, the region R3, the region R4, and the region R5 are arranged in the third direction D3 in the order of the region R1, the region R2, the region R3, the region R4, and the region R5. In the second modified example, the connection width W31a is smaller than the width W31b, and the connection width W34a is smaller than the width W34b.
[0059] With reference to Figs. 13 to 15, a multilayer feedthrough capacitor CD4 according to a third modified example of this embodiment will be described. Fig. 13 is an exploded perspective view showing the element body and multiple internal electrodes. Figs. 14 and 15 are plan views showing the internal electrodes. The multilayer feedthrough capacitor CD4 is generally similar to or the same as the above-mentioned multilayer feedthrough capacitor CD1, but the multilayer feedthrough capacitor CD4 differs from the multilayer feedthrough capacitor CD1 in terms of the configurations of the element body 1 and multiple internal electrodes 30. The following mainly describes the differences between the multilayer feedthrough capacitor CD1 and the multilayer feedthrough capacitor CD4.
[0060] In the third modified example, the element body 1 includes a region R2, a region R6, and a region R7. The regions R2, R6, and R7 are arranged in the third direction D3 in the order of the region R6, the region R2, and the region R7. The region R2 includes at least one internal electrode 32. At least one internal electrode 32 is arranged in the region R2. In the region R6, a plurality of internal electrodes 31, a plurality of internal electrodes 33, a plurality of internal electrodes 37, and a plurality of internal electrodes 38 are arranged. That is, in the region R6, at least one internal electrode 31, at least one internal electrode 33, at least one internal electrode 37, and at least one internal electrode 38 are arranged. The plurality of internal electrodes 30 include the internal electrodes 31, 33, 37, and 38. The internal electrodes 37 and 38 include signal internal electrodes. The internal electrodes 37 and 38 and the internal electrodes 33 face each other with the dielectric layer 5 interposed therebetween. The internal electrodes 37 and 38 and the internal electrodes 33 are arranged alternately. In the region R6, the internal electrode 37 is arranged closer to the region R2 than the internal electrode 31, and the internal electrode 38 is arranged closer to the region R2 than the internal electrode 37.
[0061] 14, the internal electrode 37 is connected to each of a pair of external electrodes 10. The internal electrode 37 includes two connection regions 37a and one electrode region 37b. The one electrode region 37b is located between the two connection regions 37a in the first direction D1. The connection region 37a and the electrode region 37b have a rectangular shape when viewed in the third direction D3.
[0062] Each of the two connection regions 37a is connected to a corresponding one of the pair of external electrodes 10. Each of the connection regions 37a is connected to the corresponding external electrode 10 with a connection width W37a. The connection width W37a is, for example, the same as the width of the connection region 37a in the second direction D2. The connection width W37a is larger than the connection width W31a and smaller than the width W37b. The width W37b is, for example, the same as the width W31b.
[0063] As shown in Fig. 15, the internal electrodes 38 are connected to the pair of external electrodes 10, respectively. The internal electrodes 38 are connected to the pair of external electrodes 10 at a connection width W38a. The internal electrodes 38 have a width W38b in the second direction D2. The connection width W38a is, for example, the same as the width W38b. The connection width W38a is larger than the connection width W37a. The width W38b is, for example, the same as the width W31b.
[0064] In the region R7, a plurality of internal electrodes 31, a plurality of internal electrodes 33, a plurality of internal electrodes 37, and a plurality of internal electrodes 38 are arranged. That is, in the region R7, at least one internal electrode 31, at least one internal electrode 33, at least one internal electrode 37, and at least one internal electrode 38 are arranged. The internal electrodes 37, 38 and the internal electrodes 33 face each other with the dielectric layer 5 interposed therebetween. The internal electrodes 37, 38 and the internal electrodes 33 are arranged alternately. In the region R7, the internal electrode 37 is arranged closer to the region R2 than the internal electrode 31, and the internal electrode 38 is arranged closer to the region R2 than the internal electrode 37.
[0065] As described above, in the multilayer feedthrough capacitors CD1, CD2, CD3, and CD4, at least one internal electrode 32 is connected to a pair of external electrodes 10 separately from the at least one internal electrode 31. The at least one internal electrode 32 is arranged in the region R2 separate from the region R1 in which the at least one internal electrode 31 and the at least one internal electrode 33 are arranged opposite to each other. Therefore, the at least one internal electrode 32 contributes to reducing the DC resistance. In the feedthrough multilayer capacitors CD1, CD2, CD3, and CD4, the connection width W31a is smaller than the connection width W32a. That is, the connection length between each of the external electrodes 10 and the at least one internal electrode 32 is greater than the connection length between each of the external electrodes 10 and the at least one internal electrode 31. Therefore, a current easily flows through the at least one internal electrode 32. The at least one internal electrode 32 further contributes to reducing the DC resistance. As a result, the feedthrough multilayer capacitors CD1, CD2, CD3, and CD4 reduce the DC resistance. In the multilayer feedthrough capacitors CD1, CD2, CD3, and CD4, the connection width W31a is smaller than the connection width W32a. That is, the length of the connection end of at least one internal electrode 31 with each of the pair of external electrodes 10 is smaller than the length of the connection end of at least one internal electrode 32 with each of the pair of external electrodes 10. Therefore, the plating solution is unlikely to penetrate into the element body 1 from the interface between the connection end of at least one internal electrode 31 and the element body 1. As a result, the multilayer feedthrough capacitors CD1, CD2, CD3, and CD4 suppress deterioration in reliability.
[0066] In the multilayer feedthrough capacitor CD1, the multiple internal electrodes 30 include at least one internal electrode 34 connected to a pair of external electrodes 10 and at least one internal electrode 35 connected to the external electrode 20. The element body 1 includes a region R3 in which the at least one internal electrode 34 and the at least one internal electrode 35 are arranged opposite each other. A connection width W34a between each of the pair of external electrodes 10 and the at least one internal electrode 34 is smaller than a connection width W32a. The region R2 is located between the region R1 and the region R3. In the multilayer feedthrough capacitor CD1, the connection length between each of the external electrodes 10 and the at least one internal electrode 32 is greater than the connection length between each of the external electrodes 10 and the at least one internal electrode 34. Therefore, current tends to flow through the at least one internal electrode 32. The at least one internal electrode 32 contributes further to reducing the DC resistance. As a result, the multilayer feedthrough capacitor CD1 further reduces the DC resistance. In the multilayer feedthrough capacitor CD1, the length of the connection end of at least one internal electrode 34 with each of the pair of external electrodes 10 is shorter than the length of the connection end of at least one internal electrode 32 with each of the pair of external electrodes 10. Therefore, the plating solution is unlikely to penetrate into the element body 1 from the interface between the connection end of at least one internal electrode 34 and the element body 1. As a result, the multilayer feedthrough capacitor CD1 suppresses a decrease in reliability. In the multilayer feedthrough capacitor CD1, regions R1 and R3 tend to be closer to the ridge than region R2. That is, there is a risk that the plating solution may more easily penetrate into regions R1 and R3 than into region R2. However, in the multilayer feedthrough capacitor CD1, the connection width W31a is smaller than the connection width W32a, and the connection width W34a is smaller than the connection width W32a, so that the plating solution is less likely to penetrate into the element body 1, as described above. Therefore, even in a configuration in which region R2 is located between regions R1 and R3, the suppression of a decrease in reliability can be maintained.
[0067] In the multilayer feedthrough capacitor CD1, at least one internal electrode 34 faces at least one internal electrode 35 and includes an electrode region 34b having a width larger than the connection width W34a. The multilayer feedthrough capacitor CD1 tends to increase the opposing area between the at least one internal electrode 34 and the at least one internal electrode 35. Therefore, the multilayer feedthrough capacitor CD1 can increase the capacitance.
[0068] In the multilayer feedthrough capacitor CD1, at least one internal electrode 32 includes a plurality of internal electrodes 32 opposed to each other at a distance L2 that is smaller than the distance L3. The multilayer feedthrough capacitor CD1 can increase the number of internal electrodes 32 arranged in the region R2. Therefore, the multilayer feedthrough capacitor CD1 can further reduce the DC resistance. The multilayer feedthrough capacitor CD1 can increase the distance between the at least one internal electrode 34 and the at least one internal electrode 35. Therefore, the multilayer feedthrough capacitor CD1 suppresses short-circuiting between the at least one internal electrode 34 and the at least one internal electrode 35.
[0069] In the multilayer feedthrough capacitor CD1, the internal electrode 31 includes an electrode region 31b that faces the internal electrode 33 and has a width larger than the connection width W31a. In the multilayer feedthrough capacitor CD1, there is a tendency to increase the opposing area between at least one internal electrode 31 and at least one internal electrode 33. Therefore, the multilayer feedthrough capacitor CD1 can increase the capacitance.
[0070] In the multilayer feedthrough capacitor CD1, at least one internal electrode 32 includes a plurality of internal electrodes 32 opposed to each other at a distance L2 smaller than the distance L1. The multilayer feedthrough capacitor CD1 can increase the number of internal electrodes 32 arranged in the region R2. Therefore, the multilayer feedthrough capacitor CD1 can further reduce the DC resistance. The multilayer feedthrough capacitor CD1 can increase the distance between the at least one internal electrode 31 and the at least one internal electrode 33. Therefore, the multilayer feedthrough capacitor CD1 suppresses short-circuiting between the at least one internal electrode 31 and the at least one internal electrode 33.
[0071] In the multilayer feedthrough capacitor CD2, the multiple internal electrodes 30 include at least one internal electrode 36 connected to a pair of external electrodes 10. The element body 1 includes a region R4 in which the at least one internal electrode 36 is arranged. A connection width W31a is smaller than a connection width W36a between each of the pair of external electrodes 10 and the at least one internal electrode 36. Region R1 is located between region R2 and region R4. In the multilayer feedthrough capacitor CD2, at least one internal electrode 36 is connected to a pair of external electrodes 10 separately from at least one internal electrode 31. At least one internal electrode 36 is arranged in a region R4 different from the region R1 where at least one internal electrode 31 and at least one internal electrode 33 are arranged facing each other. Therefore, at least one internal electrode 36 contributes to reducing the DC resistance. In the multilayer feedthrough capacitor CD2, the connection width W31a is smaller than the connection width W36a, and the connection length between each of the external electrodes 10 and at least one internal electrode 36 is larger than the connection length between each of the external electrodes 10 and at least one internal electrode 31. Therefore, the current easily flows through the at least one internal electrode 36. The at least one internal electrode 36 contributes further to reducing the DC resistance. As a result, the multilayer feedthrough capacitor CD2 further reduces the DC resistance. In the multilayer feedthrough capacitor CD2, the length of the connection end of at least one internal electrode 31 with each of the pair of external electrodes 10 is shorter than the length of the connection end of at least one internal electrode 36 with each of the pair of external electrodes 10. Therefore, the plating solution is unlikely to penetrate into the element body 1 from the interface between the connection end of at least one internal electrode 31 and the element body 1. As a result, the multilayer feedthrough capacitor CD2 suppresses a decrease in reliability.
[0072] In the multilayer feedthrough capacitor CD1, at least one internal electrode 31 includes a plurality of internal electrodes 31 having different connection widths W31a. In the multilayer feedthrough capacitor CD1 as well, the connection width W31a of each of the multiple internal electrodes 31 is smaller than the connection width W32a. Therefore, the plating solution is unlikely to penetrate into the element body 1 from the interface between the element body 1 and the connection ends of each of the multiple internal electrodes 31. As a result, the multilayer feedthrough capacitor CD1 still suppresses deterioration in reliability.
[0073] The above describes the embodiments and modifications of the present invention, but the present invention is not necessarily limited to the above-described embodiments and modifications, and various modifications are possible without departing from the spirit of the present invention.
[0074] At least one internal electrode 31, 34 may not include an electrode region 31b, 34b facing at least one internal electrode 33, 35 and having a width larger than the connection width W34a. As described above, a configuration in which at least one internal electrode 31, 34 includes an electrode region 31b, 34b facing at least one internal electrode 33, 35 and having a width larger than the connection width W31a, W34a tends to increase the facing area between at least one internal electrode 34 and at least one internal electrode 35. Therefore, the multilayer feedthrough capacitor CD1 can increase the capacitance. The at least one internal electrode 32 may not include multiple internal electrodes 32 opposed to each other at a distance L2 smaller than the distances L1 and L3. A configuration in which the at least one internal electrode 32 includes multiple internal electrodes 32 opposed to each other at a distance L2 can increase the number of internal electrodes 32 arranged in the region R2. Thus, the multilayer feedthrough capacitor CD1 can further reduce the DC resistance. The distance between the at least one internal electrode 31, 34 and the at least one internal electrode 33, 35 can be increased. Thus, the multilayer feedthrough capacitor CD1 suppresses short-circuiting between the at least one internal electrode 31, 34 and the at least one internal electrode 33, 35.
[0075] As will be understood from the above description of the embodiments and modifications, this specification includes disclosure of the following aspects. (Appendix 1) The body and A pair of first external electrodes disposed on the element body and spaced apart from each other; a second external electrode disposed on the element body and spaced apart from the pair of first external electrodes; A plurality of internal electrodes disposed within the element body; Equipped with the plurality of internal electrodes include at least one first internal electrode connected to the pair of first external electrodes, at least one second internal electrode connected to the pair of first external electrodes, and at least one third internal electrode connected to the second external electrode; The element body is a first region in which the at least one first internal electrode and the at least one third internal electrode are disposed opposite each other; a second region in which the at least one second internal electrode is disposed; a first connection width between each of the pair of first external electrodes and the at least one first internal electrode is smaller than a second connection width between each of the pair of first external electrodes and the at least one second internal electrode. (Appendix 2) the plurality of internal electrodes further includes at least one fourth internal electrode connected to the pair of first external electrodes and at least one fifth internal electrode connected to the second external electrode, the element body further includes a third region in which the at least one fourth internal electrode and the at least one fifth internal electrode are disposed opposite each other, a third connection width between each of the pair of first external electrodes and the at least one fourth internal electrode is smaller than the second connection width; 2. The multilayer feedthrough capacitor of claim 1, wherein the second region is located between the first region and the third region. (Appendix 3) The multilayer feedthrough capacitor according to claim 2, wherein the at least one fourth internal electrode includes an electrode region that faces the at least one fifth internal electrode and has a width greater than the third connection width. (Appendix 4) The multilayer feedthrough capacitor according to claim 2 or 3, wherein the at least one second internal electrode includes a plurality of second internal electrodes opposed to each other at a distance smaller than a distance between the at least one fourth internal electrode and the at least one fifth internal electrode. (Appendix 5) 5. The multilayer feedthrough capacitor according to claim 1, wherein the at least one first internal electrode includes an electrode region that faces the at least one third internal electrode and has a width larger than the first connection width. (Appendix 6) The multilayer feedthrough capacitor according to any one of appendix 1 to 5, wherein the at least one second internal electrode includes a plurality of second internal electrodes opposed to each other at a distance smaller than a distance between the at least one first internal electrode and the at least one third internal electrode. (Appendix 7) the plurality of internal electrodes further includes at least one sixth internal electrode connected to the pair of first external electrodes; the element body further includes a fourth region in which the at least one sixth internal electrode is disposed, the first connection width is smaller than a fourth connection width between each of the pair of first external electrodes and the at least one sixth internal electrode; 7. The multilayer feedthrough capacitor according to claim 1, wherein the first region is located between the second region and the fourth region. (Appendix 8) 8. The multilayer feedthrough capacitor according to claim 1, wherein the at least one first internal electrode includes a plurality of first internal electrodes having different first connection widths. [Explanation of symbols]
[0076] 1...Element body, 10,20...External electrode, 30...Internal electrode, 31,32,33,34,35,36...Internal electrode, 31a,33a,34a,35a...Connection area, 31b,33b,34b,3 5b... Electrode area, CD1, CD2, CD3, CD4... Multilayer feedthrough capacitor, R1, R2, R3, R4, R5, R6, R7... Area, W31a, W32a, W34a, W36a... Connection width.
Claims
1. The body and A pair of first external electrodes disposed on the element body and spaced apart from each other; a second external electrode disposed on the element body and spaced apart from the pair of first external electrodes; A plurality of internal electrodes disposed within the element body; Equipped with the plurality of internal electrodes include at least one first internal electrode connected to the pair of first external electrodes, at least one second internal electrode connected to the pair of first external electrodes, and at least one third internal electrode connected to the second external electrode; The element body is a first region in which the at least one first internal electrode and the at least one third internal electrode are disposed opposite each other; a second region in which the at least one second internal electrode is disposed; a first connection width between each of the pair of first external electrodes and the at least one first internal electrode is smaller than a second connection width between each of the pair of first external electrodes and the at least one second internal electrode.
2. the plurality of internal electrodes further includes at least one fourth internal electrode connected to the pair of first external electrodes and at least one fifth internal electrode connected to the second external electrode, the element body further includes a third region in which the at least one fourth internal electrode and the at least one fifth internal electrode are disposed opposite each other, a third connection width between each of the pair of first external electrodes and the at least one fourth internal electrode is smaller than the second connection width; The multilayer feedthrough capacitor of claim 1 , wherein the second region is located between the first region and the third region.
3. 3. The multilayer feedthrough capacitor according to claim 2, wherein the at least one fourth internal electrode includes an electrode region facing the at least one fifth internal electrode and having a width larger than the third connection width.
4. 3. The multilayer feedthrough capacitor according to claim 2, wherein the at least one second internal electrode includes a plurality of second internal electrodes opposed to each other at a distance smaller than a distance between the at least one fourth internal electrode and the at least one fifth internal electrode.
5. 2. The multilayer feedthrough capacitor according to claim 1, wherein the at least one first internal electrode includes an electrode region facing the at least one third internal electrode and having a width greater than the first connection width.
6. 2. The multilayer feedthrough capacitor according to claim 1, wherein the at least one second internal electrode includes a plurality of second internal electrodes opposed to each other at a distance smaller than a distance between the at least one first internal electrode and the at least one third internal electrode.
7. the plurality of internal electrodes further includes at least one sixth internal electrode connected to the pair of first external electrodes; the element body further includes a fourth region in which the at least one sixth internal electrode is disposed, the first connection width is smaller than a fourth connection width between each of the pair of first external electrodes and the at least one sixth internal electrode; The multilayer feedthrough capacitor of claim 1 , wherein the first region is located between the second region and the fourth region.
8. The multilayer feedthrough capacitor according to claim 1 , wherein the at least one first internal electrode includes a plurality of first internal electrodes having different first connection widths.
Citation Information
Patent Citations
Multilayer ceramic capacitor and mounting structure thereof
JP2018067562A