Electrostatic adsorption device, warpage straightening method, and attachment method

Abstract

To provide an electrostatic adsorption device of which a curvature adoptive performance is enhanced, and provide a warpage straightening method and an attachment method, using them.SOLUTION: An electrostatic adsorption device constructed so as to perform an electrostatic adsorption of an adsorption object, comprises: a structure body; and an electrode member. The structure body is constructed so as to enable a curvature part of which at least one part of the structure is deformed. The curvature part is curved from one side to the other side of a first direction. The first direction is a direction parallel to a flat surface orthogonal to a thickness direction of the structure body. The electrode member is provided to that at least one part is covered with the structure body. The electrode member includes an adsorption surface for performing the electrostatic adsorption of the adsorption object. The adsorption surface of the electrode member is arranged at a position corresponded to a curvature of the curving part in a curvature state where the curvature part is formed in the structure body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electrostatic adsorption device, a warp correction method, and an attachment method. [Background technology]

[0002] Patent Document 1 discloses an electrostatic attraction device (electrostatic chuck) that attracts and holds a substrate (object to be attracted) whose surface is flat. The electrostatic attraction device attracts and releases the object to be attracted by utilizing the electrostatic force acting between the device and the object to be attracted when a voltage is applied. In other words, the electrostatic attraction device is capable of attracting the object to be attracted by generating a potential difference between the device itself and the object to be attracted by an electrode. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-109827 A Summary of the Invention [Problem to be solved by the invention]

[0004] If the surface to which the object to be attracted is not flat, there is a concern that the electrostatic attraction device of Patent Document 1 may not be able to properly attract the object to be attracted.

[0005] The present invention aims to provide an electrostatic adsorption device with improved curved surface adaptability (the ability to properly adsorb an object even if the surface to which the object is to be adsorbed is curved), as well as to provide a warp correction method and an attachment method using the same. [Means for solving the problem]

[0006] According to the present invention, there is provided an electrostatic adsorption device configured to electrostatically adsorb an object to be adsorbed, comprising a structure and an electrode member, the structure being configured so that a curved portion can be formed by deformation of at least a portion of the structure, the curved portion being curved from one side to the other side in a first direction, the first direction being a direction parallel to a plane perpendicular to a thickness direction of the structure, the electrode member being arranged so that at least a portion of the electrode member is covered by the structure, and the electrode member having an adsorption surface for electrostatically adsorbing the object to be adsorbed, and the adsorption surface of the electrode member being positioned at a position corresponding to the curvature of the curved portion when the structure is in a curved state in which the curved portion is formed.

[0007] According to the present invention, the electrode member is provided so that at least a part of the electrode member is covered by the structure capable of forming a curved portion, and therefore the electrode member is provided integrally with the structure. As a result, when a curved portion is formed in the structure (when the structure is curved), the electrode member moves accordingly, and the suction surface of the electrode member is disposed at a position corresponding to the curvature of the curved portion. As a result, in the present invention, the suction surface of the electrode member can be disposed at a position along the curved surface of the object to be suctioned, corresponding to the curvature of the curved portion, and curved surface adaptability is improved. [Brief description of the drawings]

[0008] [Figure 1] Fig. 1A is an exploded perspective view of an electrostatic adhesion device 100 according to an embodiment, and Fig. 1B is a perspective view of the electrostatic adhesion device 100 shown in Fig. 1A. Figs. 1A and 1B are perspective views of the electrostatic adhesion device 100 on the adhesion surface side. [Diagram 2] Fig. 2A is a plan view of the structure 10 shown in Fig. 1A as seen from the adsorption surface side of the electrostatic adsorption device 100. Fig. 2B is a plan view of the structure 10 shown in Fig. 2A as seen from the opposite side to Fig. 2A. Fig. 2C is a side view of the structure 10 shown in Fig. 2A as seen from the direction corresponding to the arrow A. [Diagram 3]In Fig. 3A, the first plate-shaped portion 2A is indicated by a solid line, and the second plate-shaped portion 2B is indicated by a dashed line, so that the components of the structure 10 shown in Fig. 2A can be easily distinguished. For the sake of convenience, the third plate-shaped portion 2C is not shown in Fig. 3A. Fig. 3B is a diagram showing the third plate-shaped portion 2C, which is a component of the structure 10 shown in Fig. 2A. [Figure 4] Fig. 4A is a perspective view of the structure 10 shown in Fig. 2A, and Fig. 4B is an enlarged view of region B shown in Fig. 4A. Fig. 4C is an enlarged view of the structure 10 shown in Fig. 2A. [Diagram 5] FIG. 5A is a perspective view of a state in which one electrode member 20 is disposed at approximately the center of the structure 10, and FIG. 5B is an enlarged view of region B shown in FIG. 5A. [Figure 6] Fig. 6A is a bottom view of the electrode member 20 (as viewed from the side opposite to the adsorption surface 20A1). Fig. 6B is a top view of the electrode member 20 (as viewed from the adsorption surface 20A1 side). Fig. 6C is a front view of the electrode member 20. Fig. 6D is a perspective view of the electrode member 20. [Figure 7] Fig. 7 is a diagram for explaining the movement of the position of the adsorption surface of the electrode member 20 when the electrostatic adsorption device 100 transitions from a flat state to a curved state. For convenience of explanation, in Fig. 7, the electrostatic adsorption device 100 is indicated by a dashed line, and the imaginary plane Sr is indicated by a solid line. [Figure 8] Fig. 8A is a perspective view of the electrostatic adhesion device 100 in a curved state. Fig. 8B is an enlarged view of the adhesion surface side of the electrostatic adhesion device 100 shown in Fig. 8A. Fig. 8C is an enlarged view of the surface opposite to the adhesion surface side of the electrostatic adhesion device 100 (the surface opposite to the view shown in Fig. 8B). [Figure 9] 9A to 9C are diagrams illustrating the relationship between the tensile stress and the Poisson's ratio. [Figure 10]Fig. 10A is a plan view of a prototype electrostatic adhesion device 100 as viewed from the adhesion surface side. Fig. 10B is a perspective view of the electrostatic adhesion device 100 shown in Fig. 10A. Fig. 10C is an enlarged view showing the state (planar state) of the electrostatic adhesion device structure 10 shown in Fig. 10A before deformation, and Fig. 10D is an enlarged view showing the state (curved state) after deformation. Fig. 10E is a perspective view showing the state (curved state) of the electrostatic adhesion device structure 10 shown in Fig. 10A after deformation. [Figure 11] Fig. 11A is a diagram showing the state before a horizontal tensile stress is applied to the structure 10 shown in Fig. 10A. Fig. 11B is a diagram showing the state in which a horizontal tensile stress is applied to the structure 10 shown in Fig. 11A and the structure is stretched horizontally by 10 mm. Fig. 11C is a diagram showing the state in which a further horizontal tensile stress is applied from the state shown in Fig. 11B and the structure is stretched horizontally by 20 mm. [Figure 12] 12A and 12B are diagrams showing a state before bending stress is applied to the structure 10 shown in FIG. 10A. The viewing angles are different between FIG. 12A and FIG. 12B. FIG. 12C and FIG. 12D are diagrams showing a state in which bending stress is applied to the structure 10 shown in FIG. 12A to form a curved portion in the structure 10, and the radius of curvature of the imaginary surface of the curved portion (see FIG. 7) is set to R200 mm. The viewing angles are different between FIG. 12C and FIG. 12D. FIG. 12E and FIG. 12F are diagrams showing a state in which the structure 10 shown in FIG. 12B is further curved, and the radius of curvature of the imaginary surface of the curved portion is set to R100 mm. The viewing angles are different between FIG. 12E and FIG. 12F. [Figure 13] Figures 13A to 13C are views corresponding to Figures 11A to 11C, respectively. In Figures 13A to 13C, electrode members 20 are arranged on structure 10, but in Figures 11A to 11C, electrode members 20 are not arranged on structure 10. [Figure 14] Figures 14A to 14C are views corresponding to Figures 12A to 12C, respectively. In Figures 14A to 14C, electrode members 20 are arranged on structure 10, but in Figures 12A to 12C, electrode members 20 are not arranged on structure 10. [Figure 15] FIG. 15 is a diagram showing the state of a film attracted to the electrostatic attraction device 100. As shown in FIG. [Figure 16] 16A and 16B are diagrams for explaining a calculation formula for performing bending deformation while keeping the inside dimension of the peripheral edge of an auxetic structure constant. [Figure 17] 17A and 17B are schematic diagrams for explaining a modified example 1-1 of the structure 10. Figs. 17C and 17D are schematic diagrams for explaining a modified example 1-2 of the structure 10. Figs. 17E and 17F are schematic diagrams for explaining a modified example 1-3 of the structure 10. [Figure 18] Figures 18A and 18B are diagrams showing how the structure of modified example 1-1 shown in Figures 17A and 17B is deformed. Figures 18C and 18D are diagrams showing how the structure of modified example 1-2 shown in Figures 17C and 17D is deformed. Figures 18E and 18F are diagrams showing how the structure of modified example 1-3 shown in Figures 17E and 17F is deformed. [Figure 19] Fig. 19A is a perspective view showing a structure 10 corresponding to modified example 1-2. Fig. 19B shows a plan view and a side view of the structure 10 shown in Fig. 19A. Fig. 19C is an enlarged view of region A shown in Fig. 19B. [Figure 20] FIG. 20 shows a state in which the structure 10 shown in FIG. 19 has been bent and deformed. [Figure 21] FIG. 21 is a plan view showing a structure 10 according to Modification Example 1-4. [Figure 22] Fig. 22A is a bottom view (view from the opposite side to the adsorption surface) of the electrode member 20 according to the modified example. Fig. 22B is a side view seen from the direction of the arrow B shown in Fig. 22A. Fig. 22C is a side view seen from the direction of the arrow C shown in Fig. 22A. Fig. 22D is a perspective view of the electrode member according to the modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Various features shown in the following embodiments can be combined with each other. Also, each feature can be an invention independently. In addition, the dimensions shown in the drawings are merely examples of the embodiments and modified examples, and the present invention is not limited to these dimensions.

[0010] 1. Description of the configuration of the embodiment The electrostatic attraction device 100 according to the embodiment shown in FIG. 1A and FIG. 1B is configured to electrostatically attract an object to be attracted. In particular, the electrostatic attraction device 100 is suitable for electrostatically attracting an object to be attracted having a curved surface. The object to be attracted is, for example, a wafer or a film. In the embodiment, the object to be attracted is described as being a wafer or a film, but is not limited thereto, and the device may be used to attract other objects having a curved surface.

[0011] There are various types of electrostatic chucks (electrostatic adsorption devices), such as a Coulomb type, a Johnsen-Rahbek type, and a gradient type, and the electrostatic adsorption device 100 according to the embodiment is applicable to, for example, these types.

[0012] In addition, the X direction, Y direction, and Z direction shown in each drawing are perpendicular to one another. The X direction is an example of a first direction, and the Y direction is an example of a second direction intersecting the first direction. The X direction and the Y direction are parallel to a plane perpendicular to the thickness direction of the structure 10 of the electrostatic adsorption device 100 according to the embodiment. The Z direction is the thickness direction of the structure 10.

[0013] 1-1.Structure 10 The structure 10 is made of a resin material or a metal material. The resin material is preferably a material that has a suitable elasticity and can ensure the insulation of the electrode member 20 described later. The resin material may be, for example, polyurethane resin, polyamide resin, polyimide resin, acrylate resin, or the like. The metal material may be, for example, stainless steel. The material may be different depending on the location of the structure 10. For example, the first plate-shaped portion 2A described later may be made of polyurethane resin so as to have a relatively high elasticity, and the second plate-shaped portion 2B described later may be made of polyamide resin, polyimide resin, or acrylate resin so as to have a relatively low elasticity. When the structure 10 is made of a material having electrical conductivity, it is preferable to ensure insulation by, for example, providing an insulating film on the structure 10 or providing an insulating film on the electrode member 20 itself.

[0014] In the embodiment, the structure 10 has a rhombus as the overall shape of the region in which the storage section 1 is formed, but is not limited to this. For example, it may be a polygonal shape other than a rhombus. The dimensional ratio in the X direction and the Y direction is arbitrary. The structure 10 can be manufactured using, for example, a 3D printer, but is not limited to this method.

[0015] 1-1-1. Storage section 1 As shown in Figures 4A and 4B, the structure 10 includes a plurality of storage sections 1. The storage sections 1 have gaps 1A and partition walls 1B. An electrode member 20 is stored in the gaps 1A. The partition walls 1B partition adjacent gaps 1A.

[0016] 1, 4A, and 4B, the partition wall 1B is provided so as to surround the lateral side surface of the electrode member 20. This makes it possible to prevent adjacent electrode members 20 from contacting each other and to insulate the electrode members 20 from each other. Note that the partition wall 1B does not necessarily need to cover the entire lateral side surface of the electrode member 20.

[0017] The gap 1A is configured as a space capable of accommodating the electrode member 20. As shown in FIG. 4C, in one embodiment, the gap 1A has a diamond shape in plan view. The space of the gap 1A is divided by a third plate-shaped portion 2C described later. Two electrode members 20 can be inserted into the gap 1A. In the embodiment, the space of the gap 1A is divided into two by the third plate-shaped portion 2C, but it may be divided into three or more. That is, three or more electrode members 20 may be inserted into the gap 1A, not limited to two. Also, the space of the gap 1A may not be divided, and one electrode member 20 may be inserted.

[0018] The gaps 1A are arranged to be lined up in a plane. Specifically, the gaps 1A are arranged to be lined up in the X direction, and the gaps 1A are also arranged to be lined up in the Y direction. In this manner, the X direction and the Y direction are directions in which the electrode members 20 and the gaps 1A (housing portions 1) are arranged. In the embodiment, the directions in which the electrode members 20 and the gaps 1A (housing portions 1) are arranged (i.e., the X direction and the Y direction) are described as being orthogonal (forming 90 degrees), but this is not limited thereto, and it is sufficient that they intersect.

[0019] In this way, the structure 10 can accommodate a plurality of electrode members 20 (36 in one embodiment) arranged in a planar manner. In other words, the structure 10 has gaps 1A arranged two-dimensionally, and as a result, the structure 10 can accommodate a plurality of electrode members 20 arranged two-dimensionally. It is not essential that the structure 10 has gaps 1A arranged two-dimensionally, and the gaps 1A may be arranged one-dimensionally (for example, linearly). For example, the gaps 1A may be arranged only on the line L shown in FIG. 2A.

[0020] The accommodation unit 1 is configured to expose the adsorption surface 20A1 of the electrode member 20. That is, as shown in Fig. 1B and Fig. 2A, the structure 10 is open at the top (the adsorption surface side of the structure 10) and the adsorption surface 20A1 of the electrode member 20 is exposed.

[0021] 1-1-2. Plate-shaped part 2 The structure 10 includes a plate-shaped portion 2. The plate-shaped portion 2 has a function of insulating adjacent electrode members 20 from each other, as well as a function of transmitting stress applied to the structure 10 (stress that curves the structure 10) to each part of the structure 10.

[0022] As shown in Fig. 3A and Fig. 3B, the plate-shaped portion 2 has a plurality of first plate-shaped portions 2A, a plurality of second plate-shaped portions 2B, and a plurality of third plate-shaped portions 2C. The surfaces of the first plate-shaped portions 2A to 2C form the partition wall 1B of the storage portion 1 described above. In the embodiment, the plate-shaped portion 2 (the first plate-shaped portions 2A to 2C) and the force application portion 3 described later, which are components of the structure 10, are described as being integrally formed, but are not limited to this. The components of the structure 10 may each be composed of an independent member (separate member), and the structure 10 may be formed by assembling these together.

[0023] 1-1-2-1.First plate-shaped part 2A The first plate-shaped portions 2A are spaced apart from one another. In the embodiment, the first plate-shaped portions 2A are arranged so as to be aligned in the Y direction. When the structure 10 is viewed from above (when the structure 10 is viewed from the same direction as in FIG. 2A), the first plate-shaped portions 2A are configured in a wavy shape. The first plate-shaped portions 2A are configured by alternately connecting inclined portions 2A1 and protruding portions 2A2. The first plate-shaped portions 2A are provided so as to extend in the X direction. The first plate-shaped portions 2A are arranged so as to be aligned independently in the Y direction. In other words, the first plate-shaped portions 2A are not directly connected to one another.

[0024] As shown in Fig. 4C, the inclined portion 2A1 is preferably configured to have a predetermined inclination angle θ with respect to the X direction. Specifically, the predetermined inclination angle θ is, for example, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, or 75 degrees, and may be within the range of the two values ​​exemplified here. When the inclination angle θ is close to 45 degrees, the efficiency of the bending deformation in the Y direction increases. For this reason, it is more preferable that the inclination angle θ is 35 degrees or more and 55 degrees or less. The inclination angle θ may be different for each inclined portion 2A1, or may vary within one inclined portion 2A1. In this case, it is sufficient that the inclination angle θ is one of the values ​​listed above, or falls within the range of the two values ​​listed above.

[0025] The protruding portion 2A2 is provided so as to connect the pair of inclined portions 2A1, and in one embodiment, is flat or substantially flat. The protruding portion 2A2 is a portion corresponding to a peak (top) or a valley (bottom) of the first plate-shaped portion 2A.

[0026] In the embodiment, the second plate-shaped portion 2B is a flat plate, but the second plate-shaped portion 2B may also be configured in a wavy shape. At least one of the first plate-shaped portion 2A and the second plate-shaped portion 2B is preferably configured in a wavy shape when the structure 10 is viewed in a plan view. In addition, in a modified example 1-4 (see FIG. 21) described later, both are configured in a wavy shape.

[0027] The width in the Z direction of the first plate-shaped portion 2A is greater than the width in the Z direction of the second plate-shaped portion 2B. In other words, as shown in Fig. 4B and Fig. 4C, the position of the end face 2B1 of the second plate-shaped portion 2B is lower than the position of the end face 2A3 of the first plate-shaped portion 2A. This makes it possible to prevent the electrode members 20 from coming into contact with each other even if the entire electrostatic adsorption device 100 is curved and deformed, reducing the distance between the electrode members 20.

[0028] 1-1-2-2. Second plate-shaped portion 2B The second plate-shaped portion 2B has a function of transmitting a force (stress that curves the structure 10) applied to the force application portion 3 described below to the adjacent first plate-shaped portion 2A. In addition, the second plate-shaped portion 2B has a function of restricting the deformation mode of the first plate-shaped portion 2A. As shown in FIG. 3A, the multiple second plate-shaped portions 2B are provided at intervals from each other. In addition, the second plate-shaped portion 2B is connected to a pair of adjacent first plate-shaped portions 2A. The second plate-shaped portion 2B is provided so as to extend in the Y direction.

[0029] The second plate-shaped portion 2B has one end in the Y direction connected to one of the first plate-shaped portions 2A, and has the other end in the Y direction connected to the other first plate-shaped portion 2A. Specifically, one end of the second plate-shaped portion 2B is connected to the protruding portion 2A2 corresponding to the peak of one of the first plate-shaped portions 2A, and the other end of the second plate-shaped portion 2B is connected to the protruding portion 2A2 corresponding to the valley of the other of the first plate-shaped portions 2A. It should be noted that the second plate-shaped portion 2B does not have to be connected to the first plate-shaped portion 2A at its end portion.

[0030] The second plate-shaped portions 2B are arranged so as to be aligned in the X direction and also aligned in the Y direction. Specifically, as shown in Fig. 3A, the arrangement (positional relationship) of the second plate-shaped portions 2B in an arbitrary row and the second plate-shaped portions 2B in an adjacent row in the Y direction to the arbitrary row is staggered. In other words, the second plate-shaped portions 2B adjacent to each other in the Y direction are not aligned in the Y direction, but are arranged at positions shifted in the X direction.

[0031] In addition, the elasticity of the first plate-shaped portion 2A and the elasticity of the second plate-shaped portion 2B are different. In the embodiment, since the entire plate-shaped portion 2 is made of the same material, the elasticity of the first plate-shaped portion 2A and the elasticity of the second plate-shaped portion 2B can be made different depending on factors such as the thickness, length, and shape of the constituent members. The elasticity may be made different by changing the material. In the embodiment, the thickness (width in the Y direction) of the first plate-shaped portion 2A is thinner than the thickness (width in the X direction) of the second plate-shaped portion 2B, and in addition, the shape of the first plate-shaped portion 2A is wavy. Therefore, the elasticity of the first plate-shaped portion 2A is greater than that of the second plate-shaped portion 2B.

[0032] The above-mentioned first plate-shaped portion 2A is a plate material formed in a corrugated shape, and has relatively high elasticity due to its shape. In contrast, the second plate-shaped portion 2B is not formed in a corrugated shape, and has relatively lower elasticity than the first plate-shaped portion 2A. For this reason, the first plate-shaped portion 2A may be referred to as a high elasticity portion, and the second plate-shaped portion 2B may be referred to as a low elasticity portion. The first plate-shaped portion 2A may be referred to as a high elasticity rod, and the second plate-shaped portion 2B may be referred to as a low elasticity rod. Furthermore, when the structure 10 is an auxetic structure described later, the first plate-shaped portion 2A may also be referred to as a chevron-shaped element.

[0033] 1-1-2-3.Third plate-shaped portion 2C The third plate-shaped portion 2C shown in FIG. 3B has a function of insulating two electrode members 20 arranged in the Y direction. The third plate-shaped portions 2C are arranged so as to be arranged in the X direction and also arranged so as to be arranged in the Y direction. As shown in FIG. 4A to FIG. 4C, the third plate-shaped portion 2C is connected to the second plate-shaped portion 2B. In the embodiment, the second plate-shaped portion 2B and the third plate-shaped portion 2C are configured in a cross shape when viewed in a plane. That is, the second plate-shaped portion 2B and the third plate-shaped portion 2C are connected so as to be perpendicular to each other (connected at 90 degrees). Note that the connection angle between them is not limited to this and may be an angle other than 90 degrees. The width of the third plate-shaped portion 2C in the Z direction is larger than the width of the second plate-shaped portion 2B in the Z direction. In other words, as shown in FIG. 4B and FIG. 4C, the position of the end surface 2B1 of the second plate-shaped portion 2B is lower than the position of the end surface 2C1 of the third plate-shaped portion 2C. As a result, even if the entire electrostatic attraction device 100 is curved and deformed, and the distance between the electrode members 20 becomes small, the electrode members 20 can be prevented from coming into contact with each other.

[0034] 1-1-3. Force acting part 3 The structure 10 further comprises a force application portion 3 . The force application unit 3 is configured so as to be connectable to a stress generating mechanism 30 (driving means) that applies a stress for deforming the structure 10. The configuration of the stress generating mechanism is not particularly limited, and various configurations such as a robot arm can be adopted. The force application unit 3 functions as a handle that is held by the stress generating mechanism such as a robot arm.

[0035] In the embodiment, the force application unit 3 is provided on the edge of the structure 10. The force application unit 3 is connected to the first plate-shaped portion 2A. In one example of the embodiment, the force application unit 3 is connected to the central first plate-shaped portion 2A among the multiple first plate-shaped portions 2A arranged in the Y direction. The stress applied to the force application unit 3 is transmitted to this central first plate-shaped portion 2A, and is sequentially transmitted to the first plate-shaped portion 2A adjacent to the central first plate-shaped portion 2A via the second plate-shaped portion 2B connected to this first plate-shaped portion 2A. As a result, the stress that bends the structure 10 is transmitted to the entire structure, and the structure 10 is deformed (bent). The stress applied to the force application unit 3 is, for example, a bending stress that bends the electrostatic adsorption device 100 (structure 10).

[0036] 1-1-4. Curved portion 10a The structure 10 is configured so that at least a part of the structure 10 can be deformed to form the curved portion 10a. The curved portion 10a is a portion that is curved when a stress that deforms the structure 10 is applied to the structure 10 via the force application unit 3, as shown in, for example, FIG. 13A to FIG. 13F. In one embodiment, the entire structure 10 is the curved portion 10a, but is not limited thereto. That is, in a state in which a stress is applied to the structure 10 via the force application unit 3, the structure 10 may simultaneously have the curved portion 10a and a portion (flat portion) where the structure 10 is not curved. In other words, the structure 10 may be configured so that the curved portion 10a and the flat portion can be mixed. Such a configuration that allows the curved portion 10a and the flat portion to be mixed can be realized, for example, by changing the material and shape that constitutes the structure 10 depending on the location. That is, it may be realized by configuring a part of the structure 10 with a flexible material and shape that is easily curved, and configuring the other part with a hard material and shape that is not easily curved.

[0037] In the embodiment, the curved portion 10a is curved from one side to the other side in the X direction, and is curved from one side to the other side in the Y direction.

[0038] The structure 10 is configured so that curvature in the X direction and curvature in the Y direction occur simultaneously. In other words, when stress is applied to the force application portion 3 of the structure 10, not only the structure 10 is curved in the X direction caused by the first plate-shaped portion 2A, but also the structure 10 is curved in the Y direction caused by the second plate-shaped portion 2B at the same time, forming a curved portion 10a. In other words, the structure 10 is configured so that curvature occurs simultaneously in multiple directions (in the embodiment, two directions, the X direction and the Y direction).

[0039] Specifically, the stress of the force application unit 3 is propagated to the first plate-shaped portion 2A connected to the force application unit 3, and the first plate-shaped portion 2A is deformed so as to be curved from one side in the X direction (an example of a first direction) to the other side. The curvature direction at this time may be the +Z direction or the -Z direction. When the curvature direction is the +Z direction, it can be said that the structure 10 (electrostatic adsorption device 100) is curved to form a convex shape, and when the curvature direction is the -Z direction, it can be said that the structure 10 (electrostatic adsorption device 100) is curved to form a concave shape.

[0040] When the first plate-shaped portion 2A is curved from one side to the other side in the X direction (one example of the first direction), as shown in FIG. 8A and FIG. 8B, the wavy first plate-shaped portion 2A is deformed, and the distance between the peaks and valleys in the Y direction is reduced. In other words, the first plate-shaped portion 2A is slightly closer to a flat plate shape than the wavy shape. As a result, the second plate-shaped portion 2B connected to the first plate-shaped portion 2A is moved by the deformation of the first plate-shaped portion 2A, receiving stress from the first plate-shaped portion 2A. Since this second plate-shaped portion 2B is also connected to the other first plate-shaped portion 2A, the stress is transmitted to the other first plate-shaped portion 2A. This is repeated in sequence, and the stress of the force application portion 3 is transmitted to all the first plate-shaped portions 2A and second plate-shaped portions 2B arranged in the Y direction, and as a result, the structure 10 is curved from one side to the other side in the Y direction.

[0041] Furthermore, in the electrostatic adhesion device 100, interference between the various parts is suppressed when the structure 10 is curved, enabling a smooth transition between the flat state and the curved state. This will be described below. When the first plate-shaped portion 2A is curved from one side to the other side in the X direction (an example of the first direction), as shown in FIG. 8A and FIG. 8B, the distance between the opposing protrusions 2A2 changes, and the size of the gap 1C changes accordingly. In the example of FIG. 8A and FIG. 8B, the structure 10 is curved to form a concave shape. Therefore, on the adsorption surface side of the electrostatic adsorption device 100, the distance between the opposing protrusions 2A2 becomes narrower than the state before the bending. That is, the gap 1C becomes smaller on the adsorption surface side of the electrostatic adsorption device 100. Conversely, as shown in FIG. 8C, on the side opposite the adsorption surface side of the electrostatic adsorption device 100, the distance between the opposing protrusions 2A2 becomes larger than the state before the bending. That is, the gap 1C becomes larger on the side opposite the adsorption surface side of the electrostatic adsorption device 100. Note that the case where the structure 10 is curved to form a concave shape has been described, but when it is curved to form a convex shape, the movement is reversed to the above. In this way, the structure 10 is configured so that, when transitioning from a flat state to a curved state, the size of the portion of the gap 1C on the adsorption surface side and the size of the portion of the gap 1C opposite to the adsorption surface side are in an inverse relationship, thereby avoiding interference between the various portions and realizing a smooth transition from the flat state to the curved state.

[0042] The position of the electrode member 20 when the structure 10 (electrostatic adsorption device 100) is curved to form a convex or concave shape will be described. As described below, each electrode member 20 has an adsorption surface 20A1 to which an object to be adsorbed is adsorbed. When the structure 10 is in a flat state, each adsorption surface 20A1 is disposed parallel to the XY plane. On the other hand, when the structure 10 is in a curved state, the position of each adsorption surface 20A1 moves to a position corresponding to a virtual plane Sr shown in FIG. 7. The position of each adsorption surface 20A1 when the curved portion 10a is formed will be described with reference to FIG. 7.

[0043] 7, positions P1 and P2 correspond to the positions of the suction surface 20A1 in a flat state. Positions P1 and P2 are reference positions on the suction surface 20A1, e.g., the center of gravity positions, and can be determined by any method. Position P1 is the position of the suction surface 20A1 closer to the periphery of the structure 10, and position P2 is the position of the suction surface 20A1 closer to the center of the structure 10.

[0044] 7, positions T1 and T2 correspond to the positions of the suction surfaces 20A1 in the curved state. Here, positions T1 and T2 are located on a virtual surface Sr. In the embodiment, the virtual surface Sr corresponds to a part of the surface of a sphere of an arbitrary radius. In other words, the virtual surface Sr is dome-shaped. Here, the movement of the positions of the two suction surfaces 20A1 is described, but the other suction surfaces 20A1 are also located on the virtual surface Sr in the curved state.

[0045] The virtual surface Sr may include, for example, a double curved surface or a single curved surface. A double curved surface corresponds to, for example, a spherical surface, an elliptical spherical surface, etc. A single curved surface corresponds to, for example, a cylindrical surface, etc. The virtual surface Sr in the structure 10 is not limited to a spherical surface, an elliptical spherical surface, or a cylindrical surface, and may be other complex curved surfaces. In other words, in the embodiment, the virtual surface Sr is described as a sphere (a part of the surface of a sphere), but this is not limited to this, and if the curvature of the structure 10 is complex, the virtual surface Sr will be a complex curved surface corresponding to the curvature.

[0046] In this manner, the chucking surfaces 20A1 of the electrode members 20 are arranged at positions corresponding to the curvature of the curved portion 10a (at positions T1 and T2 on the virtual plane Sr in the example of the embodiment) in the curved state in which the curved portion 10a is formed on the structure 10. This allows the curvature of the structure 10 to be adjusted in accordance with the curvature of the object to be attracted, and the chucking surfaces 20A1 to be arranged at positions along the curved surface of the object to be attracted. In other words, the chucking surfaces 20A1 of the electrode members 20 of the electrostatic chucking device 100 can be arranged at positions along the curved surface of the object to be attracted, corresponding to the curvature of the curved portion 10a, and the curved surface adaptability is improved. The curved surface adaptability refers to a performance indicating whether the position of the chucking surface 20A1 can be easily moved to a position along the curved surface of the object to be attracted.

[0047] An example of a structure that simultaneously generates curvatures in the X and Y directions in the structure 10 is an auxetic structure (expanded auxetic structure). For this reason, the structure 10 can be configured with an auxetic structure (expanded auxetic structure). The auxetic structure (expanded auxetic structure) will be described in detail later in "2. Auxetic Structure (Expanded Auxetic Structure)".

[0048] 1-2. Electrode member 20 1A and 1B, the electrode member 20 is configured to be insertable into the structure 10. When the electrode member 20 is inserted into the structure 10, the electrode member 20 engages with the structure 10 and the electrode member 20 is held by the structure 10.

[0049] The electrode member 20 is provided so as to be at least partially covered by the structure 10. In other words, the electrode member 20 is provided so as to be at least partially surrounded by the structure 10. That is, the arrangement of the electrode member 20 in the Z direction coincides with that of the structure 10. In other words, the electrode member 20 is not arranged so as to protrude from the structure 10 in the Z direction, but is arranged at the same position or approximately the same position. This makes it possible to suppress an increase in size of the electrostatic adsorption device 100. The portion of the electrode member 20 that is covered (surrounded) by the structure 10 may be in contact with the structure 10 or may not be in contact with the structure 10.

[0050] When the curved portion 10a is formed in the structure 10 (when the structure 10 is curved), the electrode member 20 moves accordingly, and the adsorption surface 20A1 of the electrode member 20 is disposed at a position corresponding to the curvature of the curved portion 10a. As a result, the adsorption surface 20A1 of the electrode member 20 can be disposed at a position along the curved surface of the object to be adsorbed, which corresponds to the curvature of the curved portion 10a. In other words, the curvature and radius of the curvature of the structure 10 itself and the curvature and radius of the virtual surface Sr tend to match, and the adsorption surface 20A1 can be disposed at a position along the curved surface of the object to be adsorbed. As a result, the electrostatic adsorption device 100 according to the embodiment has improved adaptability to the curved surface of the object to be adsorbed.

[0051] As shown in FIGS. 6A to 6D, the electrode member 20 includes a base portion 20A and an insertion portion 20B. As shown in FIG. 5B, the base 20A is disposed on the second plate-shaped portion 2B in a state where the electrode member 20 is inserted into the structure 10. The base 20A has an adsorption surface 20A1 for electrostatically adsorbing an object to be adsorbed. In the embodiment, the adsorption surface 20A1 is configured as a flat surface, but is not limited thereto, and may be configured as a curved surface, may have a configuration having a plurality of projections and recesses, or may be configured as a mixture of flat surfaces and curved surfaces. The base 20A and the insertion portion 20B are both accommodated in the accommodation portion 1. In the embodiment, the electrode member 20 is held in the housing 1 by frictional force between the electrode member 20 and the surface of the structure 10. Here, the electrode member 20 has a plurality of (two in the embodiment) insertion portions 20B. This increases the surface area of ​​the electrode member 20, making it easier for the electrode member 20 to be held in the housing 1. The insertion portions 20B are inserted into a substantially triangular space formed by the first plate-shaped portion 2A, the second plate-shaped portion 2B, and the third plate-shaped portion 2C. A gap 20C is formed between the pair of insertion portions 20B. When the electrode member 20 is housed in the housing 1, the second plate-shaped portion 2B is disposed in the gap 20C.

[0052] In the embodiment, the diamond-shaped gap 1A of the structure 10 is divided at the third plate-shaped portion 2C. A pair of electrode members 20 are disposed in the space of the divided gap 1A symmetrically with respect to the third plate-shaped portion 2C. Positive and negative voltages are applied to the pair of electrode members 20, respectively, via a voltage application device 50 (see FIG. 16B) having a power source. This enables the electrostatic adsorption device 100 to adsorb an object to be adsorbed. Note that one electrode member 20 may be assembled in the diamond-shaped gap 1A of the structure 10, and the voltages applied to adjacent electrode members 20 may be different, that is, positive or negative. Also, the number of electrode members 20 assembled in the diamond-shaped gap 1A of the structure 10 may be more than two.

[0053] The adsorption surface 20A1 of the electrode member 20 is preferably bipolar. The electrode member 20 is preferably composed of a positive electrode, a negative electrode, and an insulating region therebetween. The insulating region is a component of the electrode member 20 for insulating the positive electrode and the negative electrode of the electrode member 20. When the attraction surface 20A1 is a bipolar type, there is no need to connect or arrange an electrode on the side of the object to be attracted, and the object to be attracted can be transported by being attracted from one side.

[0054] In order to make the attracting surface 20A1 bipolar, it is preferable to uniformly disperse the positive and negative electrodes on the attracting surface 20A1. Also, one electrode member 20 may be configured to have both the positive and negative electrodes.

[0055] The material constituting the electrode member 20 can be, for example, a metal such as stainless steel or aluminum, or a semiconductor such as a doped Si wafer. The material (insulating material) constituting the insulating region of the electrode member 20 may be, for example, polyamide, polyimide, acrylate, or the like. The electrode member 20 may be manufactured by any method, using known techniques such as a 3D printer or a water jet method.

[0056] In the electrostatic adsorption device 100, at least one of the adsorption surface 20A1 side and the opposite side of the electrode member 20 may be covered with an insulator (insulating layer). When an insulating layer is provided on the adsorption surface 20A1 side of the electrode member 20, if the insulating layer is elastically deformable or soft, the flexibility of the insulating layer on the adsorption surface 20A1 also makes it possible to adapt to the surface shape of the object to be adsorbed, such as a curved surface. In addition, it is also possible to prevent the electrode member 20 inserted into the structure 10 from falling off.

[0057] The dimensions of the adsorption surface 20A1 of the electrode member 20 in the X and Y directions can be various, for example, 10 μm to 10 cm, 10 μm to 1000 μm, 1 to 10 mm, 1 to 10 cm, 10 cm or more, etc. Furthermore, the dimensions in the X direction and the Y direction may be different.

[0058] As shown in Figures 6A and 6D, the electrode member 20 has a top portion 20a. The top portion 20a is not sharp like the apex of a triangle, but has, for example, a flat surface. This makes it possible for the electrode member 20 to suppress the deformation of the first plate-shaped portion 2A from being hindered.

[0059] 2. Auxetic Structure 2-1. Poisson's ratio of structure 10 Meanwhile, a structure called an auxetic structure is known. The structure 10 according to the embodiment does not necessarily have to be the same as an auxetic structure, but it is preferable to use an auxetic structure to adsorb a curved wafer or film. Here, an auxetic structure as an example of the structure 10 will be described in detail.

[0060] In the following description, in one embodiment, the tensile direction is the X direction described above. In the following explanation, the term Poisson's ratio is used. This Poisson's ratio corresponds to the ratio of the amount of deformation in the longitudinal direction (tensile direction) of a material to the amount of deformation in the lateral direction (direction perpendicular to the tensile direction) that occurs when a load is applied to the material.

[0061] If the structure 10 is an auxetic structure, the structure 10 is defined as having a negative or zero Poisson's ratio in which the dimension perpendicular to the tensile direction is stretched or constant, and the electrode member 20 will be supported by the structure 10 having such a Poisson's ratio.

[0062] It should be noted that in the embodiment, the Poisson's ratio is expanded and applied to the electrostatic adhesion device 100 (structure 10). That is, the Poisson's ratio of the electrostatic adhesion device 100 (structure 10) can be defined as the amount of change in the width of the electrostatic adhesion device 100 (structure 10) in the X direction and the amount of change in the width of the electrostatic adhesion device 100 (structure 10) in the Y direction. More specifically, in the embodiment, the Poisson's ratio of the auxetic structure (structure 10) is used for deformation based on the geometric pattern (arrangement) of the structure 10, not deformation based on the material composition of the structure 10. The auxetic structure can be regarded as a structure including a skeletal portion forming a geometric pattern (arrangement) and a patterned space formed between the skeletal portions. The skeletal portion also has a portion that undergoes bending deformation like a hinge. The auxetic structure also utilizes its property of deforming into a dome shape when a bending stress is applied.

[0063] In addition, the auxetic structure generally has a negative Poisson's ratio. Here, the case where the Poisson's ratio is 0 is also included. For this reason, the auxetic structure may be defined as an extended auxetic structure so that the auxetic structure with a Poisson's ratio of 0 can also be included.

[0064] 2-2.Explanation of Poisson's ratio Here, the relationship between the Poisson's ratio and the deformation due to tensile stress will be briefly explained with reference to Figures 9A to 9C. In Figures 9A to 9C, the shape before the application of tensile stress is represented by a solid line, and the shape after the application of tensile stress is represented by a dashed line. In a typical material or structure with a positive Poisson's ratio as shown in FIG. 9A, the shape 1-1 before the application of tensile stress and the shape 1-2 after the application of tensile stress are in compression in a direction perpendicular to the tensile direction. When the Poisson's ratio shown in FIG. 9B is negative, the shape 2-2 after the application of tensile stress to the shape 2-1 before the application of tensile stress expands in a direction perpendicular to the tensile direction. When the Poisson's ratio shown in FIG. 9C is zero, the shape 3-2 after the application of tensile stress to the shape 3-1 before the application of tensile stress remains constant in the direction perpendicular to the tensile direction. In Figures 9B and 9C, the dimension is elongated or constant in both of the two directions perpendicular to the tensile direction, but the dimension may be elongated or constant in only one direction perpendicular to the tensile direction.

[0065] 2-3. Chevron-shaped element (first plate-shaped portion 2A) As shown in Figs. 10A and 10B, the wavy first plate-shaped portion 2A described above corresponds to a chevron-shaped element in an auxetic structure. The chevron-shaped element has a longitudinal direction in the X direction, and a plurality of chevron-shaped elements are arranged parallel to the Y direction. An electrode member 20 is inserted between adjacent chevron-shaped elements. Here, as shown in Figs. 10C and 10D, the chevron-shaped element is deformed by the tensile stress (load) in the X direction so that the wave height of the chevron shape becomes lower (deformed so that the width in the Y direction becomes smaller) and elongates in the X direction. As a result, the bending angle of the chevron-shaped element is expanded from about 90° to an obtuse angle. At this time, the entire electrostatic adsorption device 100 (structure 10) is also expanded in the Y direction. That is, it is also expanded in a direction perpendicular to the tensile direction.

[0066] FIG. 10E shows a state where the structure 10 of the electrostatic adsorption device 100 is bent so that the adsorption surface side is bent to form a concave shape by applying a bending stress that bends the structure 10. As shown in FIG. 10E, it is preferable to apply the bending stress so that the inside dimension of the peripheral edge fr (see also FIG. 1B) on the adsorption surface side of the structure 10 is constant. The inside dimension corresponds to a curve along the surface of the imaginary surface Sr of the curved portion 10a or the peripheral edge fr shown in FIG. 10E. When such a bending stress is applied, the dimension of the concave curved surface (compound curved surface) inside the peripheral edge fr on the adsorption surface side becomes constant or becomes shorter. Here, the concave curved surface (compound curved surface) corresponds to the above-mentioned imaginary surface Sr. However, even if the dimension becomes shorter, the width by which the shortening occurs is kept very small. This is because when the structure 10 is bent to form a concave shape, the part on the adsorption surface side of the first plate-shaped portion 2A as a chevron-shaped element tries to shrink, but the first plate-shaped portion 2A interferes with the electrode member 20, making it difficult to shrink. In addition, the contraction of the first plate-shaped portion 2A is also suppressed by the second plate-shaped portion 2B serving as a low-elasticity portion. In this manner, the dimensions of the concave curved surface are kept constant or are prevented from shortening, so that the area of ​​the concave curved surface is also kept constant or is prevented from shrinking. This makes it possible to suppress the formation of wrinkles on the object to be attracted. The fact that the portion of the structure 10 on the adsorption surface side becomes less likely to shrink corresponds to the position of the neutral surface (the surface that does not expand or contract) of the structure 10 being closer to the adsorption surface side when the structure 10 is bent.

[0067] In the above, an example of deformation when the structure 10 is curved to form a concave shape has been described. Here, when the structure 10 is curved to form a convex shape, the diamond-shaped planar virtual surface Sr of the structure 10 is deformed to form a convex curved surface (for example, see the virtual surface Sr in FIG. 7). The area of ​​the convex curved surface is larger than that of the diamond-shaped planar virtual surface Sr before deformation. When the area of ​​the convex curved surface is enlarged, the electrostatically adsorbed object (for example, a film) can be more reliably adsorbed. In other words, when the electrostatic adsorption device 100 is adsorbed to the adsorption object in a flat state and then transitions to a curved state, the area expands from the flat state to the curved state, and therefore, a stress acts so as to taut the surface of the adsorption object, which has the advantage of suppressing the occurrence of wrinkles in the adsorption object. It should be noted that although constant or increasing area advantages are mentioned herein, embodiments do not exclude decreasing area configurations.

[0068] The structure 10 is composed of a first plate-shaped portion 2A having a relatively high elasticity and a second plate-shaped portion 2B having a relatively low elasticity. When the structure 10 is an auxetic structure, the structure consisting of the first plate-shaped portion 2A and the second plate-shaped portion 2B can be defined as a reentrant honeycomb structure.

[0069] By changing the inclination angle θ of the inclined portion 2A1, which is the inclined portion of the chevron-shaped element, it is possible to adjust the degree of extension and bending in the Y direction when tension (stretching) in the X direction is transmitted to the Y direction. When the inclination angle θ is small, the degree of extension in the Y direction relative to the tension (stretching) in the X direction can be made larger, so the shape of the double curved surface can be deformed by changing the inclination angle θ. In addition, the shape of the virtual surface Sr can also be changed by changing the spacing between the chevron-shaped elements, i.e., the length of the second plate-shaped portion 2B.

[0070] 2-4. Properties of the auxetic structure according to the embodiment 2-4-1.Deformation due to application of tensile stress in the X direction 11A to 11C show the change in shape when the tensile stress (no bending stress) in the X direction is changed in the structure 10. The structure 10 as an auxetic structure is configured so that the width in the Y direction increases when a tensile stress is applied in the X direction. This will be explained below. The first plate-shaped portion 2A is also called a chevron-shaped element.

[0071] When a tensile stress is applied in the X direction, the chevron-shaped elements (first plate-shaped portion 2A), which are two elastic elements connected to the force application portion 3, are deformed so as to extend in the X direction. This extension of the chevron-shaped elements in the X direction is an elastic deformation of the chevron-shaped elements such that the wave height of the chevron-shaped elements decreases. In other words, this extension is a shape change in which the peaks and valleys of the chevron-shaped elements act as hinges and the angle formed by the peaks and valleys increases. In effect, this extension is not an elastic extension of the material of the chevron-shaped elements themselves. The extension of the chevron-shaped element at the center in the Y direction is transmitted to the adjacent chevron-shaped elements via the second plate-shaped portion 2B, and these chevron-shaped elements also extend in the X direction.

[0072] Here, as shown in Fig. 3A, the two chevron-shaped elements (first plate-shaped portion 2A) connected to the force application portion 3 are referred to as the first high elasticity rod R1, the next high elasticity rod as the second high elasticity rod R2, the third high elasticity rod R3, the fourth high elasticity rod R4, and the fifth high elasticity rod R5 in that order. Also, as shown in Fig. 3B, the low elasticity rods (second plate-shaped portion 2B) connected to the inside of each high elasticity rod are referred to as the first low elasticity rod r1 to the fifth low elasticity rod r5, respectively.

[0073] At this time, when a tensile stress is applied from the force application unit 3 to the two upper and lower first high elasticity rods R1, both first high elasticity rods R1 are deformed and elongated so that the wave height of the waves decreases (the height difference between the peaks and valleys decreases). When the two upper and lower first high elasticity rods R1 are elongated, the tensile stress is transmitted in the X direction to the upper and lower second high elasticity rods R2 via the upper and lower second low elasticity rods r2 (rods that are relatively less likely to change in dimension), and the upper and lower second high elasticity rods R2 also elongate. In the same manner, the tensile stress in the X direction is transmitted to all of the upper and lower third high elasticity rods R3 to fifth high elasticity rods R5.

[0074] When a tensile stress is applied to the two upper and lower first highly elastic rods R1, they are deformed so that the wave height decreases. Here, the first low elasticity rod r1 (dimensions unchanged) is interposed between the peak of one first high elasticity rod R1 and the valley of the other first high elasticity rod R1. On the other hand, there is no connection between the valley of one first high elasticity rod R1 and the peak of the other first high elasticity rod R1 (i.e., a gap 1C is formed). Therefore, the one and the other first high elasticity rods R1 are deformed so that the interval (distance) between the valley of one first high elasticity rod R1 and the peak of the other first high elasticity rod R1 becomes larger. In other words, the valley of one first high elasticity rod R1 moves upward, and the peak of the other first high elasticity rod R1 moves downward.

[0075] When the valley of the first high elasticity rod R1 on one side moves upward, the second low elasticity rod r2 on one side also moves upward. When the second low elasticity rod r2 on one side moves upward, the second high elasticity rod R2 (the peak) on one side also moves upward. Here, as described above, the second high elasticity rod R2 also elongates and deforms so that the wave height decreases. Therefore, when the Y-direction position of the peak of the second high elasticity rod R2 on one side is used as a reference, the valley of the second high elasticity rod R2 on one side moves upward. The operation of the other second low elasticity rod r2 and the second high elasticity rod R2 is symmetrical to the above-mentioned one second low elasticity rod r2 and the second high elasticity rod R2 on one side, so it will not be described. Such an action is transmitted sequentially to the third low elasticity rod r3 to the fifth low elasticity rod r5 and the third high elasticity rod R3 to the fifth high elasticity rod R5 in the same manner as described above. In this manner, in the auxetic structure, when a tensile stress is applied to the first highly elastic rod R1 to elongate it in the X direction, the dimensions of the auxetic structure in the Y direction (both sides) perpendicular to the tensile direction expand. The fifth high-elastic rod R5 located at the apex of the diamond shape has the smallest degree of elongation. Specifically, the elongation of the elastic rods decreases stepwise (regularly) from the first high-elastic rod R1 toward the apex of the diamond shape. In addition, the degree of increase in the interval (distance) between adjacent elastic rods also gradually decreases from the first highly elastic rod R1 toward the apex of the diamond shape.

[0076] The auxetic structure (structure 10) described here has a negative Poisson's ratio. Note that the thickness (dimension in the Z direction) of this structure 10 does not change substantially. In other words, although the structure 10 is described as being a two-dimensional auxetic structure, if it is a three-dimensional auxetic structure, there may be dimensional changes in the three-dimensional direction.

[0077] 2-4-2. Deformation due to bending direction 12A to 12F show changes in shape when bending stress (not the tensile stress described in FIGS. 11A to 11C) is applied to structure 10. FIG. When bending stress is applied to the structure 10 as an auxetic structure, the structure 10 is bent so that the diagonal line in the X direction of the diamond of the structure 10 becomes convex upward. At the same time, bending also occurs in a direction (Y direction) perpendicular to the X direction of the XY plane, and a double curved surface is generated in the structure 10. Note that this double curved surface corresponds to a virtual surface Sr that represents the position after the adsorption surface 20A1 of the electrode member 20 has moved when the electrode member 20 is placed on the structure 10.

[0078] The reason why a double curved surface (curved surface) is generated is as follows. The stress generating mechanism 30 generates a convex bend in the upward direction (+Z direction) in the structure 10. At this time, the circumferential dimension of the upper surface (convex surface) of the structure 10 in the Z direction becomes larger than the circumferential dimension of the lower surface (concave surface) in the Z direction. The upper surface (convex surface) corresponds to the surface Rg1 shown in FIG. 2C, and the lower surface (concave surface) corresponds to the surface Rg2 in the same figure. Here, consider a case where a bending stress on the structure 10 causes tensile stress to act on both the upper surface (convex surface) and the lower surface (concave surface) of the structure 10. When the structure 10 has a negative Poisson's ratio, the influence of the stretch in the X direction on the stretch in the Y direction is greater on the upper surface (convex surface) of the structure 10 than on the lower surface (concave surface). In other words, the stretch of the upper surface (convex surface) of the structure 10 is relatively long, and the stretch of the lower surface (concave surface) of the structure 10 is relatively short. In this way, there is a difference in the stretch in the Y direction between the upper surface (convex surface) and the lower surface (concave surface), which generates a bending stress in the Y direction. In other words, the structure 10 is curved from one side to the other side in the Y direction.

[0079] In the above, the case where both the upper surface (convex surface) and the lower surface (concave surface) are stretched is described, but the present invention is not limited to this. Even when the size of the lower surface (concave surface) is constant, or when the size of the lower surface (concave surface) is shortened and compressive stress occurs, bending stress in the Y direction occurs, and a double curved surface is generated.

[0080] 2-4-3. Deformation of the structure 10 with the electrode member 20 assembled therein 13A to 13C and 14A to 14F show deformation of the auxetic structure (structure 10) incorporating the electrode member 20. From these figures, it can be seen that the deformation when the electrode member 20 is incorporated is similar to the contents explained in Sections 2-4-1 and 2-4-2.

[0081] 2-4-4. Functions of auxetic structures As described above, when the stress generating mechanism 30 applies a bending stress to the electrostatic adhesion device 100 (structure 10), the electrostatic adhesion device 100 (structure 10) is curved simultaneously in the X direction (an example of a first direction) and the Y direction (an example of a second direction), generating a double curved surface. In other words, the structure 10 is configured so that curvature in the X direction and curvature in the Y direction occur simultaneously. The curvatures that occur simultaneously in multiple directions are based on Function 1 and Function 2 described below.

[0082] Feature 1 When the structure 10 is pulled in a particular direction (X direction), not only does the width of the structure 10 increase in the particular direction, but the width also increases in a direction intersecting the particular direction (Y direction). Function 1 is the content described in section 2-4-1 above. Function 1 is effectively achieved by disposing the second plate-shaped portion 2B at the widest facing portion (the valley and the mountain) of the adjacent wavy first plate-shaped portion 2A. Note that it is not necessary for the second plate-shaped portion 2B to completely match the widest facing portion, and it may be slightly shifted. Function 1 is effectively achieved by the elasticity of the second plate-shaped portion 2B being smaller than that of the first plate-shaped portion 2A. This is because the deformation of any one of the first plate-shaped portions 2A is easily transmitted to the first plate-shaped portion 2A adjacent to that first plate-shaped portion 2A, making it easier to ensure the amount of deformation of the structure 10 in the Y direction.

[0083] Feature 2 When bending stress is applied to the structure 10 so that the structure 10 is convex in the +Z direction, there is a difference between the amount of dimensional change in the upper surface (corresponding to region Rg1 in FIG. 2C ) in the Z direction and the amount of dimensional change in the lower surface (corresponding to region Rg2 in FIG. 2C ) in the Z direction. In the embodiment, the amount of dimensional change in the upper surface is larger than the amount of dimensional change in the lower surface. Here, when the structure 10 is an auxetic structure, the amount of dimensional change in the Y direction will change depending on the amount of dimensional change in the tensile direction. Since the amount of dimensional change in the upper surface in the tensile direction is large, the amount of dimensional change in the Y direction will be large. Conversely, since the amount of dimensional change in the lower surface in the tensile direction is small, the amount of dimensional change in the Y direction will be small. In this way, a difference in the amount of dimensional change will occur in the Y direction as well, which causes curvature in the Y direction.

[0084] In the description here, functions 1 and 2 are employed to configure the structure 10 so that curvature in the X direction and curvature in the Y direction occur simultaneously, but the above functions 1 and 2 are not essential, and other functions may be employed.

[0085] 2-5. Electrostatic adhesion 15 shows a state in which wiring of a voltage application device 50 is applied to the electrode member 20 of an electrostatic adhesion device 100 having an auxetic structure. It also shows a state in which a plastic film is electrostatically adhered to the electrostatic adhesion device 100 in a flat state, and then the electrostatic adhesion device 100 is curved so that a double curved surface of R100 (mm) is formed.

[0086] 16A and 16B, a formula for generating a double curved surface while keeping the length of each side of the rhombus of the adsorption surface constant when the adsorption surface of the electrostatic adsorption device 100 shown in Fig. 15 is deformed from a flat surface to a double curved surface will be described. Note that the adsorption surface described in this section 2-5 is a surface corresponding to the virtual surface Sr, and does not refer to the adsorption surface 20A1 of the electrode member 20 alone.

[0087] In the diamond-shaped attraction surface in FIG. 16A, the horizontal length (X direction) of the attraction surface is defined as h. Moreover, the vertical length (Y direction) is defined as w. In addition, the output curvature radius is set to R. Also, the top corner of the rhombus is point a, and the right corner of the rhombus is point b.

[0088] Fig. 16B is a side view of the electrostatic adhesion device 100 when the adhesion surface is bent with a curvature radius R. The lower corner of the vertical (Y direction) diagonal of the diamond of the adhesion surface in Fig. 16A is at the center in the X direction of the adhesion surface in the side view of Fig. 12B. This point is set as the origin of the XZ coordinate system with the horizontal direction as the X axis and the vertical direction as the Y axis, and the coordinates of the origin are (0,0). In this case, the coordinates of the corner points on both ends of the horizontal (X direction) diagonal line of the diamond can be expressed as (x, 0) and (-x, 0) in FIG. 16B, respectively. When bent with a radius of curvature R, the inclination angle of the attraction surface at point b is defined as θ.

[0089] First, from h, w, and R, use the following formula to calculate z 2 Request.

number

[0090] The desired z 2 From this, x and θ can be calculated using the following formula.

number

[0091] The obtained x is the X-direction position of the points at both ends of the diagonal line in the X-direction of the diamond-shaped attraction surface using the force application unit 3 of the electrostatic attraction device 100 in order to bend the attraction surface to a radius of curvature R. The calculated θ is the inclination angle of the bend at this position in the X direction.

[0092] When actually operating the electrostatic adhesion device 100, it is preferable to calculate the radius of curvature R so as to gradually change from infinity to a target radius of curvature, and drive the electrostatic adhesion device 100 so as to follow the obtained values ​​of x and θ. This driving can be performed using, for example, a computer and a robot arm.

[0093] In Figure 15, the film appears to be cloudy due to the reflection of light, but when it was flat, it was attached without any wrinkles. On the other hand, when it was a double curved surface, wrinkles were visible on some parts of the adsorption surface, but it was confirmed that they were slight.

[0094] 3. Description of Various Methods Using the Electrostatic Adsorption Device 100 3-1.How to correct wafer warpage In recent years, the size of wafers has become larger and thinner, and as a result, the wafer may become warped (curved), for example, during transportation. The electrostatic adsorption device 100 is capable of adsorbing such a curved wafer while effectively avoiding damage, etc. This makes it possible to transport the wafer without damaging it, and also makes it possible to straighten the warp and return it to a flat shape. The use of the wafer is not particularly limited, but is suitable, for example, for power semiconductor wafers.

[0095] The method for straightening a warp of a garment according to the embodiment includes a suction step and a warp straightening step. In the chucking step, the wafer is placed on the chucking surface 20A1 of the electrode member 20 of the curved structure 10. In the warp straightening step, the structure 10 is deformed from a curved state to a flat state while the object to be attached is still attached to the attachment surface 20A1.

[0096] The above-mentioned curved state is, for example, a state in which the structure 10 is curved, as shown in Fig. 8A etc. Note that the structure 10 may be curved to form a convex shape, may be curved to form a concave shape, or may be curved in a combination of a convex shape and a concave shape.

[0097] In the planar state described above, for example, as shown in FIG. 1B, the attraction surfaces 20A1 of the multiple electrode members 20 are aligned at the same height.

[0098] In addition, the electrostatic attraction device 100 may be pressed against the wafer, which is the object to be attracted, to additionally deform the shape of the electrostatic attraction device 100 so that the shape of the electrostatic attraction device 100 matches or approaches the surface shape of the wafer. That is, in the attraction step, the object to be attracted may be attracted to the attraction surface 20A1 of the electrode member 20 while the structure 10 is deformed into a curved state.

[0099] The warpage correction method may be performed in a state where the wafer attracted to the suction step is placed on the mounting table. Furthermore, the warpage correction method may be such that the wafer is sucked under reduced pressure through suction holes formed in the mounting table to prevent the wafer from shifting from the mounting table.

[0100] In addition, the height difference between the uppermost adsorption surface and the lowermost adsorption surface is preferably 10 cm or less. Here, the uppermost suction surface is the suction surface 20A1 that is located at the highest position in the Z direction among the suction surfaces 20A1 in the curved portion 10a. Moreover, the lowermost suction surface is the suction surface 20A1 that is located at the lowest position in the Z direction among the suction surfaces 20A1 in the curved portion 10a.

[0101] 3-2. How to install the film Displays such as organic electroluminescence (EL) displays can have curved screens. However, as displays become larger, it becomes difficult to grasp the planar sheet-like member (e.g., a thin-film electronic device) used in the display and attach it evenly to the curved display structure. The electrostatic adsorption device 100 makes it possible to attach the film (sheet-like member) evenly to the curved surface of the display structure while effectively preventing damage to the film (sheet-like member).

[0102] The film attachment method according to the embodiment includes a suction step, a deformation step, and an attachment step. In the adsorption step, the film is adsorbed onto the adsorption surface 20A1 of the electrode member 20 of the structure 10. In the deformation step, the structure 10 is curved. The deformation step is performed before or after the adsorption step, or together with the adsorption step. In the attachment process, the film adsorbed to the curved structure 10 is attached to an attachment target. The attachment target is, for example, a structure constituting a display such as an organic electroluminescence display. In the attachment process, the voltage of the voltage application device 50 is controlled so that the film is detached (released) from the adsorption surface of the electrostatic adsorption device 100.

[0103] In addition, the area of ​​the virtual surface Sr related to the adsorption surface 20A1 in the curved state is larger or constant, or the amount of reduction is kept small even if it is reduced, compared to the planar area related to the adsorption surface 20A1 in the flat state. This makes it possible to effectively prevent wrinkles from occurring in the film. In other words, if the area related to adsorption were to be significantly reduced, the possibility of wrinkles forming in the film increases. However, when the electrostatic adsorption device 100 according to the embodiment transitions from the flat state to the curved state adsorption, the area of ​​the virtual surface Sr is larger or constant, or the amount of reduction is kept small even if it is reduced, so that it is easy to prevent wrinkles from forming in the film.

[0104] 4. Description of the Functions and Effects of the Embodiments In the electrostatic attraction device 100 according to the embodiment, the electrode member 20 is provided so that at least a part of the electrode member 20 is covered by the structure 10 capable of forming the curved portion 10a, and therefore the electrode member 20 is provided integrally with the structure 10. As a result, when the curved portion 10a is formed in the structure 10, the electrode member 20 moves accordingly, and the attraction surface 20A1 of the electrode member 20 is disposed at a position (see FIG. 7) corresponding to the curvature of the curved portion 10a. As a result, the attraction surface 20A1 of the electrode member 20 can be disposed at a position along the curved surface of the object to be attracted, corresponding to the curvature of the curved portion 10a, and the curved surface adaptability is improved.

[0105] Moreover, in the electrostatic chucking device 100 according to the embodiment, the electrode members 20 are provided integrally with the structure 10, and therefore, the electrostatic chucking device 100 can be made smaller and thinner.

[0106] 5. Variations 5-1. Modification 1: Modification of structure 10 5-1-1. Modification 1-1: Poisson's ratio is negative In Modification 1-1 shown in Figs. 17A and 17B, the structure 10 is made of an auxetic structure with a negative Poisson's ratio. As shown in Fig. 4C, in the embodiment, the first plate-shaped portion 2A has a flat protruding portion 2A2, but in Modification 1-1, this portion is formed at an acute angle. Even in such a form, the same effect as in the embodiment can be obtained. Note that the angle θ shown in the figure is greater than 0 degrees and less than 90 degrees. As shown in FIGS. 18A and 18B, when a tensile stress is applied to the structure 10, the width increases not only in the tensile direction but also in the direction perpendicular thereto.

[0107] 5-1-2. Variation 1-2: Poisson's ratio is zero In Modification 1-2 shown in FIGS. 17C, 17D, and 19A to 19C, the structure 10 is made of an auxetic structure (an expanded auxetic structure) having a Poisson's ratio of zero.

[0108] In this structure, the first plate-shaped portions 2A are arranged parallel to the Y direction so that the positions of the peaks and valleys of each first plate-shaped portion 2A coincide with the positions of the peaks and valleys of other first plate-shaped portions 2A in the X direction. This is where the configuration of Modification 1-2 differs from the embodiment and Modification 1-1. The angle at which the second plate-shaped portion 2B and the first plate-shaped portion 2A intersect is an acute angle θ (0°<θ<90°) and its supplementary angle (180°-θ). Preferably, the angle θ is in the range of 30°≦θ≦80°, and more preferably, 30°≦θ≦60°.

[0109] When a tensile stress in the X direction is applied to the structure 10, the first plate-shaped portion 2A extends in the X direction, and the valley of the first plate-shaped portion 2A is deformed so as to rise. However, the valley of the adjacent first plate-shaped portion 2A also moves so as to rise in the same manner, so the width of the structure 10 in the Y direction does not increase. That is, as shown in FIG. 18C and FIG. 18D, when a tensile stress is applied to the structure 10, the width only in the tensile direction increases, and the width in the direction perpendicular thereto remains the same. In the configuration of the embodiment and the modified example 1-1, the virtual surface Sr formed is a double curved surface (for example, a sphere, etc.), but in the configuration of the modified example 1-2, the virtual surface Sr formed is a single curved surface (for example, a cylindrical surface, etc.). That is, in the modified example 1-2, the structure 10 is configured so that only a curve related to a certain direction (X direction) occurs.

[0110] Fig. 20 shows the state of shape change when bending stress is applied to the structure 10 according to the modified example 1-2. As shown in Fig. 20, it can be seen that the dimension in the Y direction is unchanged (remains constant). In other words, it can be seen that the virtual surface Sr becomes a single curved surface.

[0111] 5-1-3. Modification 1-3: Positive Poisson's ratio In the modified example 1-3 shown in FIG. 17E and FIG. 17F, the structure 10 has a positive Poisson's ratio. This structure 10 has a honeycomb structure. The angle θ between the first plate-shaped portions 2A aligned in the X direction and the second plate-shaped portions 2B aligned in the Y direction satisfies 90°<θ<180°. In this structure, when a tensile stress is applied to the first plate-shaped portions 2A in their longitudinal direction (X direction), the first plate-shaped portions 2A are deformed so that the distance between the first plate-shaped portions 2A is shortened. The structure 10 may adopt a configuration such as that of Modification 1-3.

[0112] 5-1-4. Modification 1-4: Auxetic structure without reentrant honeycomb structure FIG. 21 shows an example of a structure having a sinusoidal lattice pattern as another example of an auxetic structure. This structure 10 does not have a reentrant honeycomb structure. In addition, this structure 10 does not include a second plate-shaped portion 2B. That is, the structure 10 is composed of a first plate-shaped portion 2A extending in the X direction and a first plate-shaped portion 2A extending in the Y direction. When the location where bending deformation is applied (the location of the handle) and the direction of bending stress are changed in the structure 10 having this sinusoidal lattice pattern, the virtual surface Sr formed can take a single curved surface or multiple double curved surfaces. In other words, it becomes possible to generate virtual surfaces Sr of various shapes.

[0113] 5-2. Modification 2: Modification of electrode member 20 22A to 22D, the electrode member 20 has a slit 20B1 formed by cutting away a portion of the insertion portion 20B. The slit 20B1 is used to insert a terminal for wiring the electrode member 20 after the electrode member 20 is inserted into the structure 10. A cut-away portion 20B2 is also formed in the insertion portion 20B, reducing the volume of the insertion portion 20B. This allows the electrode member 20 to be made lighter.

[0114] 5-3.Other forms In the embodiment, the electrostatic adhesion device 100 is described as being capable of transitioning between a flat state and a curved state, but is not limited thereto. The electrostatic adhesion device 100 may be in a form in which the curved state is fixed. In this case, the structure 10 has a curved portion 10a. Such an electrostatic adhesion device 100 is suitable, for example, when it is desired to specialize in gripping an adhesion target having a curved surface of a predetermined shape.

[0115] The structure 10 of the electrostatic attraction device 100 according to the embodiment may be configured to be curved in three or more directions at the same time. In other words, the structure 10 has an additional curvature direction in the XY plane other than the X and Y directions. This makes it easier to deal with the complexity of the surface of the attraction target.

[0116] In the embodiment, when the structure 10 is curved with a certain curvature, the curvature is constant from one side to the other side in the X direction, but the present invention is not limited to this. For example, the structure 10 may have a structure capable of forming a complex curve in which the curvature varies from one side to the other side in the X direction. The same applies to curvature in the Y direction. Such a structure can be realized by various configurations, for example, by making the configuration (size) of the storage unit 1 different from the same, and by providing variation.

[0117] In the embodiment, when stress is applied, bending occurs simultaneously in a plurality of directions, but the present invention is not limited to this. As in the embodiment described in Modification 1-2, bending may occur in only one direction.

[0118] Various embodiments are exemplified below. The embodiments of [Appendix 1] to [Appendix 20] shown below can be combined with each other.

[0119] [Appendix 1] An electrostatic adsorption device 100 configured to electrostatically adsorb an object to be adsorbed, The present invention includes a structure 10 and an electrode member 20. The structure 10 is configured so that at least a portion of the structure 10 can be deformed to form a curved portion 10a, The curved portion 10a is curved from one side to the other side in a first direction (X direction), The first direction is a direction parallel to a plane perpendicular to the thickness direction (Z direction) of the structure 10, the electrode member 20 is provided so as to be at least partially covered by the structure 10, and the electrode member 20 has an adsorption surface 20A1 for electrostatically adsorbing the adsorption target, The electrostatic attraction device 100 is such that, in a curved state in which the curved portion 10a is formed in the structure 10, the attraction surface 20A1 of the electrode member is disposed at a position corresponding to the curvature of the curved portion 10a.

[0120] [Appendix 2] Electrostatic adsorption device 100 according to claim 1, The structure 10 has a plurality of storage sections 1, The storage section 1 has a gap section 1A and a partition wall 1B, The electrode member 20 is accommodated in each of the gaps 1A. Each of the partition walls 1B partitions the adjacent gaps 1A.

[0121] [Appendix 3] Electrostatic adsorption device 100 according to claim 2, The partition wall 1B is provided so as to surround the lateral side surface of the electrode member 20, in the electrostatic adsorption device 100.

[0122] [Appendix 4] The electrostatic adsorption device 100 according to claim 2 or 3, The electrostatic adsorption device 100 has a plurality of the gaps 1A arranged in a plane.

[0123] [Appendix 5] The electrostatic adsorption device 100 according to any one of Supplementary Note 2 to Supplementary Note 4, The housing portion 1 is configured so that the adsorption surface 20A1 of the electrode member 20 is exposed.

[0124] [Appendix 6] An electrostatic adsorption device 100 according to any one of Supplementary Note 1 to Supplementary Note 5, The structure 10 has a plurality of first plate-shaped portions 2A and a plurality of second plate-shaped portions 2B, The first plate-shaped portions 2A are spaced apart from one another, The electrostatic adsorption device 100 includes a plurality of second plate-shaped portions 2B provided at intervals from one another and connected to a pair of adjacent first plate-shaped portions 2A.

[0125] [Appendix 7] 7. The electrostatic adsorption device 100 according to claim 6, In the electrostatic adsorption device 100, at least one of the first plate-shaped portion 2A and the second plate-shaped portion 2B is configured in a wavy shape when the structure 10 is viewed in a plan view.

[0126] [Appendix 8] The electrostatic adsorption device 100 according to claim 6 or 7, Each of the first plate-shaped portions 2A is provided to extend in the first direction, Each of the second plate-shaped portions 2B is provided to extend in a second direction, The second direction is a direction parallel to a plane perpendicular to the thickness direction of the structure 10 and intersects with the first direction.

[0127] [Appendix 9] An electrostatic adsorption device 100 according to any one of Supplementary Note 6 to Supplementary Note 8, In the electrostatic adsorption device 100, the elasticity of the first plate-shaped portion 2A and the elasticity of the second plate-shaped portion 2B are different from each other.

[0128] [Appendix 10] An electrostatic adsorption device 100 according to any one of Supplementary Note 1 to Supplementary Note 9, The curved portion 10a is curved from one side to the other side in a second direction in addition to the first direction, The electrostatic adsorption device 100, wherein the second direction is a direction parallel to a plane perpendicular to the thickness direction of the structure 10, and the first direction and the second direction are directions intersecting each other.

[0129] [Appendix 11] The electrostatic adsorption device 100 according to claim 10, The electrostatic adsorption device 100 is configured such that the structure 10 is curved in the first direction and the second direction simultaneously.

[0130] [Appendix 12] The electrostatic adsorption device 100 according to claim 10 or 11, The structure is configured such that the width in the second direction is constant or increases when a tensile stress is applied in the first direction.

[0131] [Appendix 13] An electrostatic adsorption device 100 according to any one of Supplementary Note 1 to Supplementary Note 12, The structure 10 further includes a force application portion 3, An electrostatic adsorption device (100), wherein the force application portion is provided on an edge portion of the structure (10), and the force application portion (3) is configured to be connectable to a stress generating mechanism (30) that applies stress to deform the structure (10).

[0132] [Appendix 14] An electrostatic adsorption device 100 according to any one of Supplementary Note 1 to Supplementary Note 13, The structure 10 is deformable between the curved state and a planar state; In the planar state, the electrostatic attraction device 100 has the attraction surfaces 20A1 of the plurality of electrode members 20 aligned at the same height.

[0133] [Appendix 15] An electrostatic adsorption device 100 according to any one of Supplementary Note 1 to Supplementary Note 14, The object to be attracted is an electrostatic attraction device 100, which is a wafer or a film.

[0134] [Appendix 16] An electrostatic adsorption device 100 according to any one of Supplementary Note 1 to Supplementary Note 15, The structure 10 is an electrostatic adsorption device 100 made of a resin material or a metal material.

[0135] [Appendix 17] An electrostatic adsorption device 100 according to any one of Supplementary Note 1 to Supplementary Note 16, The height between the top and bottom adsorption surfaces is 10cm or less. The uppermost suction surface is the suction surface located at the highest position among the suction surfaces in the curved portion 10a, The lowermost adsorption surface of the electrostatic adsorption device 100 is the adsorption surface located at the lowest position among the adsorption surfaces of the curved portion 10a.

[0136] [Appendix 18] An electrostatic adsorption device 100 configured to electrostatically adsorb an object to be adsorbed, The present invention includes a structure 10 and an electrode member 20. The structure 10 has a curved portion 10a, The curved portion 10a is curved from one side to the other side in a first direction, the first direction is a direction parallel to a plane perpendicular to a thickness direction of the structure 10, the electrode member 20 is provided so as to be at least partially covered by the structure 10, and the electrode member 20 has an adsorption surface 20A1 for electrostatically adsorbing the adsorption target, The electrostatic attraction device 100, in which the attraction surface 20A1 of the electrode member 20 is disposed at a position corresponding to the curvature of the curved portion 10a of the structure 10.

[0137] [Appendix 19] A method for correcting warpage of an object to be attracted, using the electrostatic attraction device 100 according to any one of Supplementary Note 1 to Supplementary Note 17, The method includes a suction step and a warpage correction step, In the suction step, the object to be suctioned is suctioned onto the suction surface 20A1 of the electrode member 20 of the structure 10 in the curved state, or the object to be suctioned is suctioned onto the suction surface 20A1 of the electrode member 20 while the structure 10 is being deformed into the curved state, In the warp straightening step, the structure 10 is deformed from the curved state to a flat state while the object to be attracted is kept attracted to the attraction surface 20A1, In the flat state, the height positions of the plurality of suction surfaces 20A1 are uniform.

[0138] [Appendix 20] A method for attaching an object to be attracted using the electrostatic attraction device 100 according to any one of Supplementary Note 1 to Supplementary Note 18, The method includes a suction step, a deformation step, and an attachment step, In the adsorption step, the object to be adsorbed is adsorbed onto the adsorption surface 20A1 of the electrode member 20 of the structure 10, In the deformation step, the structure 10 is brought into the curved state, and the deformation step is a step that is performed before, after, or together with the adsorption step, In the attaching step, the object to be attached that is attached to the structure 10 in the curved state is attached to an attachment target body, which is an attachment method.

[0139] Subsequently, various embodiments will be illustrated. The embodiments of [Appendix 1] to [Appendix 11] described below can be combined with each other.

[0140] [Appendix 1] An electrostatic adhesion device 100 in which an electrode member 20 for electrostatic adhesion is supported by an expanded auxetic structure (hereinafter referred to as structure 10) having a negative or zero Poisson's ratio in which the dimension perpendicular to the tensile direction is either elongated or constant.

[0141] [Appendix 2] Electrostatic adsorption device 100 according to claim 1, The structure 10 can form a main surface (virtual surface Sr) that can be deformed in a mutual direction between a flat surface and a curved surface, or between a first curved surface and a second curved surface, The main surface (virtual surface Sr) constitutes the main surface (virtual surface Sr) of the electrostatic adsorption device 100, The main surface (virtual surface) of the electrostatic adhesion device 100 is an electrostatic adhesion surface.

[0142] [Appendix 3] The electrostatic adsorption device 100 according to claim 1 or 2, The structure 10 includes an elastic element (first plate-shaped portion 2A) and a non-elastic element (second plate-shaped portion 2B), The electrostatic adhesion device 100, wherein the non-elastic element constrains the deformation of the elastic element.

[0143] [Appendix 4] Electrostatic adsorption device 100 according to claim 3, The elastic element (first plate-shaped portion 2A) a plurality of chevron-shaped elements elastically deformable in at least a first direction (X-direction) that is a longitudinal direction of the chevron-shaped elements; The plurality of chevron-shaped elements are arranged in parallel in a second direction (Y direction) perpendicular to the first direction, a peak of the chevron shaped element and a valley of the adjacent chevron shaped element, and a valley of the chevron shaped element and a peak of the adjacent chevron shaped element are arranged to coincide with each other in the first direction, The inelastic element connects in the second direction between a peak or valley of one of the chevron-shaped elements where the spacing between adjacent chevron-shaped elements is maximum and a valley or peak of the adjacent chevron-shaped element, The electrostatic adhesion device 100, wherein the chevron shaped element and the non-elastic element have an angle at their joining point that is greater than 0° and less than 90°.

[0144] [Appendix 5] Electrostatic adsorption device 100 according to claim 3, The elastic element (first plate-shaped portion 2A) a plurality of chevron-shaped elements elastically deformable in at least the first direction (X direction) which is the longitudinal direction of the chevron-shaped elements; The chevron-shaped elements are arranged in parallel in a second direction (Y direction) perpendicular to the first direction, a peak of the chevron shaped element and a peak of the adjacent chevron shaped element, and a valley of the chevron shaped element and a valley of the adjacent chevron shaped element are arranged to coincide with each other in the first direction, Each of the chevron shaped elements comprises: On one side of the second direction, the inelastic element connects adjacent chevron-shaped elements between the peaks of the adjacent chevron-shaped elements in the second direction; and On the other side of the second direction, the inelastic element couples between the valleys of the adjacent chevron shaped elements in the second direction, in the electrostatic adsorption device 100.

[0145] [Appendix 6] Electrostatic adsorption device 100 according to claim 2, The electrostatic adhesion device 100, wherein the electrostatic adhesion surface of the structure 10 is capable of generating a double curved surface or a single curved surface.

[0146] [Appendix 7] The electrostatic adsorption device 100 according to claim 1 or 2, The electrostatic adhesion device 100 further comprises an actuation means for applying a bending stress to the structure 10 .

[0147] [Appendix 8] Electrostatic adsorption device 100 according to claim 2, An electrostatic adsorption device 100, in which the area of ​​the main surface of the structure 10 can expand or remain constant when the main surface of the structure 10 is deformed from a flat surface to a curved surface or from the first curved surface to the second curved surface.

[0148] [Appendix 9] 1. An electrostatic attraction method for electrostatically attracting a film using an electrostatic attraction device, transporting the film to an object to be attracted, and releasing the film from the surface of the object, comprising: The electrostatic adsorption device 100 is the electrostatic adsorption device 100 described in any one of Supplementary Note 1 to Supplementary Note 8, and An electrostatic adsorption method in which a bending stress is applied to the electrostatic adsorption surface of the electrostatic adsorption device 100 during the period from when the electrostatic adsorption device 100 electrostatically adsorbs a film to when the electrostatic adsorption device 100 releases the film from the surface of the object to be adsorbed, thereby deforming the electrostatic adsorption surface of the electrostatic adsorption device 100 into a curved surface, and thereby deforming the electrostatically adsorbed film into a curved shape.

[0149] [Appendix 10] 10. The electrostatic adsorption method according to claim 9, The electrostatic adsorption method includes deforming the electrostatic adsorption surface of the electrostatic adsorption device 100 with a robot arm.

[0150] [Appendix 11] The electrostatic adsorption method according to claim 9 or 10, The electrostatic adsorption method includes deforming the structure 10 constituting the electrostatic adsorption device 100 so that the area of ​​the electrostatic adsorption surface of the structure 10 increases or remains constant. [Explanation of symbols]

[0151] 100: Electrostatic adsorption device 10 :Structure 10a: Curved section 1: Storage section 1A: Gap 1B: Partition wall 1C: Gap 2: Plate-shaped part 2A: First plate-shaped portion (chevron-shaped element, high elasticity portion, elastic element) 2A1: Inclined part 2A2:Protrusion 2A3: End face R1: First high elastic rod R2: Second high elastic rod R3: Third high elastic rod R4: 4th high elastic rod R5: 5th high elastic rod 2B: Second plate-shaped portion (low elastic portion, non-elastic element) 2B1: End face r1: First low elastic rod r2: Second low elasticity rod r3: 3rd low elasticity rod r4: 4th low elastic rod r5: 5th low elastic rod 2C: Third plate-shaped part 2C1: End face 3: Force acting part 20: Electrode material 20A: Base 20A1: Adsorption surface 20B: Insertion part 20B1: Slit 20B2: Cutting section 20C: Gap 20a: Top 30: Stress generating mechanism (driving means) 50: Voltage application device Sr: Virtual surface

Claims

1. An electrostatic adsorption device configured to electrostatically adsorb an object to be adsorbed, A structure and an electrode member, The structure is configured so that a curved portion can be formed by deformation of at least a portion of the structure, The curved portion is curved from one side to the other side in a first direction, The first direction is a direction parallel to a plane perpendicular to a thickness direction of the structure, the electrode member is provided so as to be at least partially covered by the structure, and the electrode member has an adsorption surface for electrostatically adsorbing the object to be adsorbed, An electrostatic adsorption device, wherein the adsorption surface of the electrode member is arranged at a position corresponding to the curvature of the curved portion when the curved portion is formed in the structure.

2. 2. The electrostatic adsorption device according to claim 1, The structure has a plurality of housings, The storage section has a gap and a partition wall, The electrode member is housed in each of the gaps, An electrostatic adsorption device, wherein each partition wall partitions adjacent gaps.

3. 3. The electrostatic adsorption device according to claim 2, An electrostatic adsorption device, wherein the partition wall is provided to surround a lateral side surface of the electrode member.

4. 4. The electrostatic adsorption device according to claim 2, An electrostatic adsorption device, wherein a plurality of the gaps are arranged in a plane.

5. 4. The electrostatic adsorption device according to claim 2, The housing portion is configured so that the adsorption surface of the electrode member is exposed.

6. The electrostatic adsorption device according to any one of claims 1 to 3, The structure has a plurality of first plate-shaped portions and a plurality of second plate-shaped portions, The first plate-shaped portions are provided at intervals from one another, The electrostatic adsorption device, wherein the second plate-shaped portions are spaced apart from one another and connected to an adjacent pair of the first plate-shaped portions.

7. 7. The electrostatic adsorption device according to claim 6, An electrostatic adsorption device, wherein at least one of the first plate-shaped portion and the second plate-shaped portion is configured in a wavy shape when the structure is viewed in a plan view.

8. 7. The electrostatic adsorption device according to claim 6, Each of the first plate-shaped portions is provided to extend in the first direction, Each of the second plate-shaped portions is provided to extend in a second direction, An electrostatic adsorption device, wherein the second direction is a direction parallel to a plane perpendicular to a thickness direction of the structure and a direction intersecting the first direction.

9. 7. The electrostatic adsorption device according to claim 6, An electrostatic adsorption device, wherein the elasticity of the first plate-shaped portion and the elasticity of the second plate-shaped portion are different.

10. The electrostatic adsorption device according to any one of claims 1 to 3, The curved portion is curved from one side to the other side in a second direction in addition to the first direction, An electrostatic adsorption device, wherein the second direction is a direction parallel to a plane perpendicular to a thickness direction of the structure, and the first direction and the second direction are directions intersecting each other.

11. 11. The electrostatic adsorption device according to claim 10, An electrostatic adsorption device, wherein the structure is configured to bend in the first direction and bend in the second direction simultaneously.

12. 11. The electrostatic adsorption device according to claim 10, The structure is configured so that its width in the second direction remains constant or increases when a tensile stress is applied in the first direction.

13. The electrostatic adsorption device according to any one of claims 1 to 3, The structure further includes a force application portion, An electrostatic adsorption device, wherein the force application portion is provided on an edge portion of the structure, and the force application portion is configured to be connectable to a stress generating mechanism that applies stress to deform the structure.

14. The electrostatic adsorption device according to any one of claims 1 to 3, the structure is deformable between the curved state and a planar state; In the planar state, the adsorption surfaces of the plurality of electrode members are aligned at the same height.

15. The electrostatic adsorption device according to any one of claims 1 to 3, An electrostatic adsorption device, wherein the object to be adsorbed is a wafer or a film.

16. The electrostatic adsorption device according to any one of claims 1 to 3, The structure is an electrostatic adsorption device made of a resin material or a metal material.

17. The electrostatic adsorption device according to any one of claims 1 to 3, The height between the uppermost and lowermost adsorption surfaces is 10 cm or less; the uppermost suction surface is the suction surface at the highest position among the suction surfaces in the curved portion, An electrostatic adsorption device, wherein the lowermost adsorption surface is the adsorption surface that is located at the lowest position among the adsorption surfaces in the curved portion.

18. An electrostatic adsorption device configured to electrostatically adsorb an object to be adsorbed, A structure and an electrode member, The structure has a curved portion, The curved portion is curved from one side to the other side in a first direction, The first direction is a direction parallel to a plane perpendicular to a thickness direction of the structure, the electrode member is provided so as to be at least partially covered by the structure, and the electrode member has an adsorption surface for electrostatically adsorbing the object to be adsorbed, An electrostatic adsorption device, wherein the adsorption surface of the electrode member is positioned at a position corresponding to the curvature of the curved portion of the structure.

19. A method for correcting warpage of an object to be attracted using the electrostatic attraction device according to any one of claims 1 to 3, comprising the steps of: The method includes a suction step and a warpage correction step, In the suction step, the object to be attracted is attracted to the suction surface of the electrode member of the structure in the curved state, or the object to be attracted is attracted to the suction surface of the electrode member while the structure is being deformed into the curved state, In the warp straightening step, the structure is deformed from the curved state to a flat state while the object to be attracted is kept attracted to the attraction surface, In the flat state, the height positions of the plurality of suction surfaces are uniform.

20. A method for attaching an object to be attracted using the electrostatic attraction device according to any one of claims 1 to 3 and 18, comprising the steps of: The method includes a suction step, a deformation step, and an attachment step, In the adsorption step, the object to be adsorbed is adsorbed onto the adsorption surface of the electrode member of the structure, the deformation step is a step of putting the structure into the curved state, and the deformation step is a step that is performed before, after, or together with the adsorption step, In the attaching step, the object to be attached that is attached to the structure in the curved state is attached to an attachment target body.

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