Sensor and manufacturing method for simultaneously manufacturing multiple sensors

Abstract

To provide a sensor that is integrally formed into a sheet-like shape for detecting liquid.SOLUTION: A sensor 10 of the present invention has a sheet-like shape, is at least partially formed into a laminated structure, and detects a contact with liquid through power generation, and the sensor 10 comprises: a metal layer 20 as a metal electrode that comes into contact with the liquid to cause an oxidation reaction; an insulating layer 30 that is arranged inside the metal layer 20 when seen from a thickness direction of the metal layer 20, and is laminated on at least one face of the metal layer 20; and a conductive layer 40 as an air electrode that is arranged on the opposite side of the metal layer 20 with the insulating layer 30 therebetween and inside the insulating layer 30 when seen from the thickness direction of the metal layer 20 and is laminated on the insulating layer 30, and that comes into contact with the liquid to cause a reductive reaction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a sensor and a manufacturing method for simultaneously manufacturing multiple sensors. [Background technology]

[0002] Patent Document 1 discloses an electrode portion that corresponds to an air battery or a water battery, as shown in FIG. 1, paragraphs “0025” to “0031” and the like of the specification. The following technical matters are disclosed in paragraphs "0025" to "0031" of the specification. (1) The electrode portion has a positive electrode portion, a negative electrode portion, and a separator disposed between the positive electrode portion and the negative electrode portion. (2) The positive electrode part is composed of a positive electrode current collector. (3) The negative electrode portion is composed of a negative electrode current collector. (4) The separator is disposed between the positive electrode part and the negative electrode part in a state of appropriate contact with both, and the separator prevents a short circuit between the positive electrode part and the negative electrode part, and has a role of absorbing and retaining the electrolyte solution, and examples of the separator that can be used include polyethylene fiber, polypropylene fiber, glass fiber, resin nonwoven fabric, glass nonwoven fabric, and filter paper. Furthermore, the following can be understood from Figure 1: (5) The positive electrode portion, the negative electrode portion, and the separator are each formed in a sheet shape. (6) When viewed from the direction in which the positive electrode portion, the negative electrode portion and the separator are stacked, the separator has an area larger than those of the positive electrode portion and the negative electrode portion and protrudes outward from the entire periphery of the positive electrode portion and the negative electrode portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-222585 A Summary of the Invention [Problem to be solved by the invention]

[0004] As described above, one of the functions of the separator constituting the electrode part disclosed in Patent Document 1 is to absorb the electrolyte and hold the electrolyte. Therefore, the electrode part disclosed in Patent Document 1 is used by stacking the positive electrode part, the negative electrode part, and the separator, each of which is formed in a sheet shape, but it cannot be integrally formed only by the positive electrode part, the negative electrode part, and the separator. If they were integrally formed into a laminated structure, the separator made of materials such as polyethylene fibers and polypropylene fibers would not be able to prevent a short circuit between the positive electrode part and the negative electrode part.

[0005] An object of the present invention is to provide a sensor for detecting liquid that is integrally formed in a sheet shape. [Means for solving the problem]

[0006] The sensor according to the first aspect comprises: A sensor having a sheet shape, at least a portion of which is configured to have a laminated structure, for detecting contact with a liquid by generating electricity, A metal layer as a metal electrode that undergoes an oxidation reaction upon contact with a liquid; an insulating layer disposed on an inner side of the metal layer as viewed in a thickness direction of the metal layer and laminated on at least one surface of the metal layer; a conductive layer as an air electrode, the conductive layer being disposed on the opposite side of the metal layer with the insulating layer interposed therebetween and on the inner side of the insulating layer as viewed in a thickness direction of the metal layer, the conductive layer being laminated on the insulating layer, the conductive layer causing a reduction reaction when in contact with a liquid; Equipped with.

[0007] The sensor according to the second embodiment comprises: In the sensor of the first aspect, The insulating layer is disposed on a portion of the at least one surface when viewed in a thickness direction of the metal layer.

[0008] The sensor of the third aspect comprises: In the sensor of the second aspect, The total perimeter length of the insulating layer is greater than the total perimeter length of the metal layer.

[0009] The sensor according to the fourth aspect comprises: In the sensor of the second aspect, The thickness of the insulating layer at the entire peripheral edge is formed to be gradually thinner from the inside to the peripheral edge.

[0010] The sensor according to the fifth aspect comprises: In the sensor of the fourth aspect, The entire peripheral edge of the conductive layer is located at the entire peripheral end of the insulating layer when viewed in the thickness direction of the metal layer.

[0011] The sensor according to the sixth aspect comprises: In the sensor of the second aspect, The thickness of the conductive layer at the entire peripheral edge is formed to be gradually thinner from the inside to the peripheral edge.

[0012] The sensor according to the seventh aspect is In the sensor of the sixth aspect, The entire peripheral edge of the conductive layer is located at the entire peripheral end of the insulating layer when viewed in the thickness direction of the metal layer.

[0013] The sensor according to the eighth aspect is In the sensor of the second aspect, the insulating layer has a first inner periphery; The conductive layer has a second inner periphery surrounding the first inner periphery when viewed in a thickness direction of the metal layer.

[0014] A method for simultaneously manufacturing a plurality of sensors according to the first embodiment (the sensor refers to a sensor according to any one of the first to eighth embodiments; the same applies below) includes the steps of: A first step of preparing a metal sheet that undergoes an oxidation reaction upon contact with a liquid; A second step of printing a plurality of the insulating layers on one side of the metal sheet; a third step of printing the conductive layer on a surface of each of the insulating layers opposite to the surface on the metal sheet side; a fourth step of dividing the metal sheet into a plurality of metal layers, each of the metal layers including the insulating layer; Includes.

[0015] A method for simultaneously manufacturing a plurality of sensors according to a second aspect includes the steps of: In the method of the first aspect, The metal sheet prepared in the first step has a plurality of slits formed therein, In the fourth step, all bridges sandwiched between two adjacent slits among the plurality of slits are cut to divide the metal sheet.

[0016] A method for simultaneously manufacturing a plurality of sensors according to a third aspect includes the steps of: A first step of providing a metal sheet; A second step of forming a plurality of anodized layers or a plurality of photoresist layers corresponding to the plurality of insulating layers on one surface of the metal sheet; A third step of printing the conductive layer on a surface of each of the plurality of anodized layers or the plurality of photoresist layers opposite to the surface of the metal sheet; a fourth step of dividing the metal sheet into a plurality of metal layers, each of which includes a respective one of the plurality of anodized layers or the plurality of photoresist layers; Includes.

[0017] A method for simultaneously manufacturing a plurality of sensors according to a fourth aspect includes the steps of: In the method of the third aspect, The metal sheet prepared in the first step has a plurality of slits formed therein, In the fourth step, all bridges sandwiched between two adjacent slits among the plurality of slits are cut to divide the metal sheet.

[0018] A manufacturing method for simultaneously manufacturing a plurality of sensors according to a fifth aspect includes the steps of: A first step of preparing a metal sheet that undergoes an oxidation reaction upon contact with a liquid; A second step of applying at least one of the insulating layers to at least one surface of the metal sheet; a third step of applying at least one conductive layer to a surface of the at least one insulating layer opposite to the surface of the metal sheet; a fourth step of dividing the metal sheet into a plurality of metal layers, each of the metal layers including the insulating layer; Includes. Effect of the Invention

[0019] According to the first to eighth aspects of the sensor, it is possible to provide a sensor for detecting liquid that is integrally formed in a sheet shape. Furthermore, according to the manufacturing method for simultaneously manufacturing a plurality of sensors according to the first to fifth aspects, it is possible to reduce the manufacturing cost of sensors for detecting liquid that are integrally formed in a sheet shape. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1A is a plan view and FIG. 1B is a cross-sectional view of a sensor according to a first embodiment, and FIG. 1C is a schematic diagram for explaining the mechanism by which the sensor generates electricity upon contact with water. [Diagram 2] 1A and 1B are a plan view and a cross-sectional view of a sensor according to a second embodiment. [Diagram 3] 11A and 11B are a plan view and a cross-sectional view of a sensor according to a third embodiment. [Figure 4] 13A and 13B are a plan view and a cross-sectional view of a sensor according to a fourth embodiment. [Diagram 5] 13A and 13B are a plan view and a cross-sectional view of a sensor according to a fifth embodiment. [Figure 6] 13A and 13B are a plan view and a cross-sectional view of a sensor according to a sixth embodiment. [Figure 7] 13A and 13B are a plan view and a cross-sectional view of a sensor according to a seventh embodiment. [Figure 8] 13A and 13B are a plan view and a cross-sectional view of a sensor according to an eighth embodiment. [Figure 9]13A and 13B are a plan view and a cross-sectional view of a sensor according to a ninth embodiment. [Figure 10] 3A to 3C are cross-sectional views of several modified examples of the peripheral portion of the insulating layer and the conductive layer that constitute the sensor of the first embodiment. [Figure 11] FIG. 4 is a flow diagram of a method for manufacturing a plurality of sensors, each of which is the sensor of the first embodiment. [Figure 12] FIG. 12 is a schematic diagram for explaining each flow of FIG. 11. [Figure 13] 13A to 13C are schematic diagrams for explaining each flow of a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] <Overview> First, sensors 10, 10A to 10H according to a number of embodiments (see FIGS. 1 to 9) and a sensor according to a modification thereof (see FIG. 10) will be described. Next, a method for simultaneously manufacturing a plurality of sensors 10, 10A to 10H and their modified examples, and their modified examples will be described. In the following description, please note that in this specification, components having equivalent functions are denoted by the same or equivalent reference numerals in each drawing referred to in different embodiments, etc.

[0022] Sensor of the First Embodiment The function, configuration, action, and effect of the sensor 10 of the first embodiment will be described below with reference to Fig. 1. Fig. 1 shows (A) a plan view and (B) a cross-sectional view of the sensor 10 of the first embodiment, and (C) a schematic diagram for explaining the mechanism by which the sensor generates electricity upon contact with water.

[0023] <Function and configuration of the sensor of the first embodiment> The sensor 10 is a so-called liquid detection sensor that has a function of detecting contact with a liquid (for example, water) by generating electricity. For example, the detection of power generation is performed by an electromotive force detector (for example, a voltmeter or ammeter, not shown) included in a transmission circuit 52 (see FIG. 1(C)) connected to the sensor 10. The sensor 10 is in a sheet shape, and at least a part of it is configured in a laminated structure. The sensor 10 includes a metal layer 20, an insulating layer 30, and a conductive layer 40. The metal layer 20, the insulating layer 30, and the conductive layer 40 function as a metal electrode, an insulating film, and an air electrode, respectively, in a water battery or an air battery.

[0024] Here, the sensor 10 constitutes a detection system 100 together with a transmitting device 50 and a receiving device 60 as shown in FIG. 1(C) as an example. The transmitting device 50 has a transmitting circuit 52 and a transmitting antenna 54, and detects power generation by the sensor 10 using the transmitting circuit 52 connected to the sensor 10 by wiring W, and transmits radio waves based on the detection of power generation via the transmitting antenna 54. The receiving device 60 has a receiving circuit 62 and a receiving antenna 64 , receives radio waves transmitted by the transmitting antenna 54 via the receiving antenna 64 , and decodes the radio waves received by the transmitting antenna 54 via the receiving circuit 62 .

[0025] (metal layer) The metal layer 20 is, for example, a metal plate, i.e., a sheet-shaped metal member. The metal layer 20 is, for example, configured to include one or more materials selected from magnesium (Mg), an Mg alloy, zinc (Zn), a Zn alloy, aluminum (Al), and an Al alloy.

[0026] (insulating layer) As an example, the insulating layer 30 is a plate made of insulating resin, that is, a sheet-shaped insulating member. When viewed from the thickness direction of the metal layer 20 (in a plan view), the insulating layer 30 is disposed inside the metal layer 20 and is laminated on one surface of the metal layer 20. In other words, when viewed from the thickness direction of the metal layer 20, the insulating layer 30 is disposed on a part of one surface of the metal layer 20. Here, in this specification, "laminated" means that one layer is stacked on the other layer, and the other layer is directly contacted and fixed to the one layer without using any means other than each layer, such as an adhesive (not shown in the figure). As a specific example, it means that the other layer is physically adhered to the one layer or fixed in a manner that exerts an anchor effect or the like.

[0027] (Conductive layer) The conductive layer 40 is, for example, a conductive plate, that is, a sheet-like conductive member. The conductive layer 40 is a layer that is disposed on the opposite side of the insulating layer 30 to the metal layer 20 and on the inner side of the insulating layer 30 when viewed in the thickness direction of the metal layer 20, and is laminated on the insulating layer 30.

[0028] (Features of the sensor of the first embodiment) As shown in FIG. 1A, the metal layer 20, the insulating layer 30, and the conductive layer 40 each have, for example, a square shape when viewed in the thickness direction of the metal layer 20, and are similar to one another. The insulating layer 30 and the conductive layer 40 are disposed in parallel with each other with their centers overlapping with the center of the metal layer 20 as viewed from the thickness direction of the metal layer 20. Therefore, in the sensor 10, when viewed from the thickness direction of the metal layer 20, the peripheral portion of the insulating layer 30 forms a rectangular frame of equal width and protrudes from the entire peripheral edge of the conductive layer 40. As described above, the sensor 10 of the first embodiment is in a sheet shape as a whole, with a portion of the sensor having a laminated structure and the remaining portion having a single-layer structure. In addition, the end faces (four long surfaces connecting the front and back surfaces) of the metal layer 20, the insulating layer 30 and the conductive layer 40 are formed on surfaces that are approximately perpendicular to the front (or back) surfaces of each layer, as shown in Figure 1 (B).

[0029] <Function of the Sensor of the First Embodiment> Next, the operation of the sensor 10 of the first embodiment will be described with reference to Fig. 1(C) In the following description, it is assumed that the main material of the metal layer 20 is magnesium (Mg) as an example. If the sensor 10 is immersed in water for some reason, and a water path is formed between the metal layer 20 and the conductive layer 40, an oxidation reaction shown in the following (1) occurs in the metal layer 20. As a result, the generated electrons (4e - ) moves to the conductive layer 40 via the wiring W (see FIG. 1(C)). In response to this, in the conductive layer 40, a reduction reaction shown in the following (2) occurs. As a result of these chemical reactions, the reaction shown in (3) below occurs between the end face and its periphery of the metal layer 20 and the end face and its periphery of the conductive layer 40, which are connected by the aforementioned water path, resulting in power generation (discharge). The insulating layer 30 of the first embodiment does not have liquid permeability like the separator of a general water battery or air battery, and therefore, in the first embodiment, the following reactions (1) to (3) do not occur inside the separator. (1) 2Mg → 2Mg 2+ +4e - (2)O2+2H2O+4e - → 4OH - (3) 2Mg + O2 + 2H2O → 2Mg(OH)2

[0030] <Effects of the Sensor of the First Embodiment> In the sensor 10 of the first embodiment, a metal layer 20 and an insulating layer 30 are laminated (fixed in a state of physical contact or in a manner that exerts an anchor effect or the like), and the insulating layer 30 and a conductive layer 40 are laminated (see FIG. 1(B)). Unlike the separator in a normal water battery or air battery, the insulating layer 30 does not have liquid permeability. However, if a water path is formed between the metal layer 20 and the conductive layer 40, an oxidation-reduction reaction can occur between the metal layer 20 and the conductive layer 40. Therefore, according to the first embodiment, it is possible to provide a sensor for detecting liquid that is integrally formed in a sheet shape.

[0031] <Relationship between the sensor of the first embodiment and sensors of other embodiments described below> As described above, the sensor 10 of the first embodiment has been described, and the sensor 10 can be simply expressed as follows. Sensors 10A, 10B, etc. of other embodiments (see Figs. 2 to 10) are based on the simply expressed sensor 10, and each has a part of the configuration different from that of the sensor 10. In the following description, the simply expressed configuration of the sensor 10 is taken as the basic configuration. The sensor 10, simply represented as: A sensor that is in a sheet shape, at least a portion of which is configured in a laminated structure, and detects contact with a liquid (for example, water) by generating electricity, A metal layer 20 as a metal electrode that undergoes an oxidation reaction upon contact with a liquid; an insulating layer 30 disposed inside the metal layer 20 when viewed in a thickness direction of the metal layer 20 and laminated on one surface of the metal layer 20; a conductive layer 40 as an air electrode, which is disposed on the opposite side of the insulating layer 30 to the metal layer 20 and on the inner side of the insulating layer 30 when viewed in the thickness direction of the metal layer 20, and which is laminated on the insulating layer 30 and which causes a reduction reaction when in contact with a liquid; It is equipped with the following.

[0032] The above is a description of the sensor 10 of the first embodiment.

[0033] <Sensor according to the second embodiment> Next, the function, configuration, action, and effect of the sensor 10A of the second embodiment will be described with reference to Fig. 2. Fig. 2 shows (A) a plan view and (B) a cross-sectional view of the sensor 10A of the second embodiment. As described above, the sensor 10A has the basic configuration of the sensor 10 of the first embodiment (see FIG. 1). Hereinafter, only the points of difference between the sensor 10A and the sensor 10 of the first embodiment will be described.

[0034] <Function, configuration and action of the sensor of the second embodiment> In the second embodiment, the conductive layer 40 of the first embodiment is changed to a conductive layer 40A. The conductive layer 40A is configured in the same shape as the insulating layer 30 and is disposed in the same posture as the insulating layer 30 when viewed in the thickness direction of the metal layer 20. Therefore, the entire peripheral edge of the conductive layer 40A is located at the entire peripheral end of the insulating layer 30 when viewed in the thickness direction of the metal layer 20.

[0035] <Effects of the sensor according to the second embodiment> In the sensor 10A of the second embodiment, the distance between the metal layer 20 and the conductive layer 40 is closer than in the first embodiment. Therefore, the sensor 10A of the second embodiment has higher sensitivity than that of the first embodiment.

[0036] The above is a description of the sensor 10A of the second embodiment.

[0037] <Sensor according to the third embodiment> Next, the function, configuration and action of the sensor 10B of the third embodiment will be described with reference to Fig. 3. Fig. 3 shows (A) a plan view and (B) a cross-sectional view of the sensor 10B of the third embodiment. As described above, the sensor 10B has the basic configuration of the sensor 10 of the first embodiment (see FIG. 1). Hereinafter, the sensor 10B will be described only in terms of the differences from the sensor 10 of the first embodiment.

[0038] <Function, configuration and action of the sensor of the third embodiment> In the third embodiment, the insulating layer 30 and the conductive layer 40 of the first embodiment are changed to an insulating layer 30B and a conductive layer 40B, respectively. The insulating layer 30B is configured to have the same shape as the insulating layer 30 and is disposed in the same position as the insulating layer 30 when viewed from the thickness direction of the metal layer 20. Moreover, the conductive layer 40B is configured to have the same shape as the insulating layer 30B and is disposed in the same position as the insulating layer 30B when viewed from the thickness direction of the metal layer 20. Therefore, the entire peripheral edge of the conductive layer 40B is located at the entire peripheral end of the insulating layer 30B when viewed from the thickness direction of the metal layer 20. As described above, the insulating layer 30B does not protrude outside the metal layer 20 when viewed in the thickness direction of the metal layer 20. In other words, the insulating layer 30B is disposed inside the metal layer 20 when viewed in the thickness direction of the metal layer 20.

[0039] <Effects of the sensor according to the third embodiment> The effects of the sensor 10B of the third embodiment are similar to those of the second embodiment.

[0040] The above is a description of the sensor 10B of the third embodiment.

[0041] <Sensor according to the fourth embodiment> Next, the function, configuration, and action of a sensor 10C of the fourth embodiment will be described with reference to Fig. 4. Fig. 4 shows (A) a plan view and (B) a cross-sectional view of the sensor 10C of the fourth embodiment. As described above, the sensor 10C has the basic configuration of the sensor 10 of the first embodiment (see FIG. 1). Hereinafter, the sensor 10C will be described only in terms of the differences from the sensor 10 of the first embodiment.

[0042] <Function, configuration and action of the sensor of the fourth embodiment> In the fourth embodiment, the insulating layer 30 and the conductive layer 40 of the first embodiment are changed to an insulating layer 30C and a conductive layer 40C, respectively. The insulating layer 30C is configured in a rectangular shape different from the insulating layer 30 when viewed from the thickness direction of the metal layer 20, and is disposed at a position shifted from a position symmetrical with respect to the metal layer 20. Also, the conductive layer 40C is configured in a rectangular shape different from the insulating layer 30C when viewed from the thickness direction of the metal layer 20, and is disposed at a position shifted from a position symmetrical with respect to the insulating layer 30C. In the sensor 10C, when viewed from the thickness direction of the metal layer 20, the peripheral portion of the insulating layer 30C forms a rectangular frame of different widths and protrudes from the entire peripheral edge of the conductive layer 40C.

[0043] <Effects of the sensor according to the fourth embodiment> The effects of the sensor 10C of the fourth embodiment are similar to those of the first embodiment.

[0044] The above is a description of the sensor 10C of the fourth embodiment.

[0045] <Sensor according to the fifth embodiment> Next, the function, configuration, and action of a sensor 10D of the fifth embodiment will be described with reference to Fig. 5. Fig. 5 shows (A) a plan view and (B) a cross-sectional view of the sensor 10D of the fifth embodiment. As described above, the sensor 10D has the basic configuration of the sensor 10 of the first embodiment (see FIG. 1). Hereinafter, the sensor 10D will be described only in terms of the differences from the sensor 10 of the first embodiment.

[0046] <Function, configuration and action of the sensor of the fifth embodiment> In the fifth embodiment, the insulating layer 30 and the conductive layer 40 of the first embodiment are changed to an insulating layer 30D and a conductive layer 40D, respectively. The insulating layer 30D is a layer composed of a plurality of (four in the fifth embodiment as an example) rectangular bands arranged at a fixed interval along either the width direction or the length direction of the metal layer 10 as viewed from the thickness direction of the metal layer 20, and a plurality of (three in the fifth embodiment as an example) connecting portions connecting the central portions of each band. As viewed from the thickness direction of the metal layer 20, the conductive layer 40D has a shape approximately similar to that of the insulating layer 30D, and is disposed inside the insulating layer 30D. In sensor 10D, the peripheral portion of insulating layer 30D protrudes from the entire peripheral edge of conductive layer 40D when viewed in the thickness direction of metal layer 20. In sensor 10D, the entire peripheral length of insulating layer 30D and the entire peripheral length of conductive layer 40D are longer than the entire peripheral length of metal layer 20.

[0047] <Effects of the sensor according to the fifth embodiment> The sensor 10D of the fifth embodiment differs from the sensor of the first embodiment in that the length of the entire periphery of the conductive layer 40D is longer than the length of the entire periphery of the metal layer 20. Therefore, the sensor 10D of the fifth embodiment has higher sensitivity than that of the first embodiment.

[0048] The above is a description of the sensor 10D of the fifth embodiment.

[0049] Sensor of Sixth Embodiment Next, the function, configuration, and action of a sensor 10E of the sixth embodiment will be described with reference to Fig. 6. Fig. 6 shows (A) a plan view and (B) a cross-sectional view of the sensor 10E of the sixth embodiment. As described above, the sensor 10E has the basic configuration of the sensor 10 of the first embodiment (see FIG. 1). Hereinafter, the sensor 10E will be described only in terms of the differences from the sensor 10 of the first embodiment.

[0050] <Function, configuration and action of the sensor of the sixth embodiment> In the sixth embodiment, the insulating layer 30 and the conductive layer 40 in the first embodiment are changed to an insulating layer 30E and a conductive layer 40E, respectively. The insulating layer 30E is composed of a first insulating layer 30E1 and a second insulating layer 30E2. That is, the insulating layer 30E is composed of a plurality of insulating layers (two, for example, in the sixth embodiment). The first insulating layer 30E1 and the insulating layer 30E2, for example, have the same rectangular shape and are arranged side by side along either the width direction or the length direction of the metal layer 20. The conductive layer 40E is composed of a first conductive layer 40E1 and a second conductive layer 40E2. That is, the conductive layer 40E is composed of a plurality of conductive layers (two, for example, in the sixth embodiment). In addition, the first insulating layer 30E1 and the second insulating layer 30E2 are connected by an insulating connection layer 30E3 made of the same material as the first insulating layer 30E1 and the second insulating layer 30E2. The first conductive layer 40E1 and the second conductive layer 40E2 are connected by a conductive connection layer 40E3 made of the same material as the first conductive layer 40E1 and the second conductive layer 40E2 and formed on the insulating connection layer 30E3. Here, the insulating connection layer 30E3 and the conductive connection layer 40E3 on the insulating connection layer 30E3 are referred to as a connection layer BG. In the sensor 10E, the peripheral portion of the first insulating layer 30E1 protrudes from the entire peripheral edge of the first conductive layer 40E1, and the peripheral portion of the second insulating layer 30E2 protrudes from the entire peripheral edge of the second conductive layer 40E2, when viewed in the thickness direction of the metal layer 20. In the sensor 10E, the entire peripheral length of the insulating layer 30E and the entire peripheral length of the conductive layer 40E are longer than the entire peripheral length of the metal layer 20.

[0051] <Effects of the Sensor of the Sixth Embodiment> The effects of the sensor 10E of the sixth embodiment are similar to those of the fifth embodiment.

[0052] The above is a description of the sensor 10E of the sixth embodiment.

[0053] <Sensor according to the seventh embodiment> Next, the function, configuration, and action of a sensor 10F of the seventh embodiment will be described with reference to Fig. 7. Fig. 7 shows (A) a plan view and (B) a cross-sectional view of a sensor 10F of the seventh embodiment. As described above, the sensor 10F has the basic configuration of the sensor 10 of the first embodiment (see FIG. 1). Hereinafter, the sensor 10F will be described only in terms of the differences from the sensor 10 of the first embodiment.

[0054] <Function, configuration and action of the sensor of the seventh embodiment> In the seventh embodiment, the insulating layer 30 and the conductive layer 40 of the first embodiment are changed to an insulating layer 30F and a conductive layer 40F, respectively. The insulating layer 30F is configured to have an inner peripheral edge 30F1 (an example of a first inner peripheral edge) in which a through hole having a shape similar to the outer diameter of the insulating layer 30 of the first embodiment is formed in the center. The conductive layer 40F is configured to have an inner peripheral edge 40F1 (an example of a second inner peripheral edge) in which a through hole having a shape similar to the outer diameter of the conductive layer 40 of the first embodiment is formed in the center. That is, the conductive layer 40F has an inner peripheral edge 40F1 surrounding the inner peripheral edge 30F1 when viewed from the thickness direction of the metal layer 20. In the sensor 10F, the entire peripheral portion (the inner peripheral edge 30F1 and the outer peripheral edge) of the insulating layer 30F protrudes from the entire peripheral edge (the inner peripheral edge 40F1 and the outer peripheral edge) of the conductive layer 40F when viewed in the thickness direction of the metal layer 20. In the sensor 10F, the entire peripheral length of the insulating layer 30F and the entire peripheral length of the conductive layer 40F are longer than the entire peripheral length of the metal layer 20.

[0055] <Effects of the sensor according to the seventh embodiment> The effects of the sensor 10F of the seventh embodiment are similar to those of the fifth and sixth embodiments.

[0056] The above is a description of the sensor 10F of the seventh embodiment.

[0057] Sensor of Eighth Embodiment Next, the function, configuration, and action of a sensor 10G of the eighth embodiment will be described with reference to Fig. 8. Fig. 8 shows (A) a plan view and (B) a cross-sectional view of the sensor 10G of the eighth embodiment. As described above, the sensor 10G has the basic configuration of the sensor 10 of the first embodiment (see FIG. 1). Hereinafter, the sensor 10G will be described only in terms of the differences from the sensor 10 of the first embodiment.

[0058] <Function, configuration and action of the sensor of the eighth embodiment> In the eighth embodiment, the insulating layer 30 and the conductive layer 40 of the first embodiment are changed to an insulating layer 30G and a conductive layer 40G, respectively. The insulating layer 30G is configured in a circular shape. That is, unlike the first to seventh embodiments (see Figs. 1 to 7), the shape of the insulating layer is a shape other than a rectangle or a combination of a plurality of rectangles. When viewed in the thickness direction of the metal layer 20, the conductive layer 40G has a shape substantially similar to that of the insulating layer 30G, i.e., a circular shape, and is disposed inside the insulating layer 30G. In sensor 10G, when viewed in the thickness direction of metal layer 20, the entire peripheral edge portion of insulating layer 30G protrudes beyond the entire peripheral edge of conductive layer 40G.

[0059] <Effects of the Sensor of the Eighth Embodiment> The effects of the sensor 10G of the eighth embodiment are similar to those of the first embodiment.

[0060] The above is a description of the sensor 10G of the eighth embodiment.

[0061] Sensor of ninth embodiment Next, the function, configuration, and action of a sensor 10H of the ninth embodiment will be described with reference to Fig. 9. Fig. 9 shows (A) a plan view and (B) a cross-sectional view of the sensor 10H of the ninth embodiment. As described above, the sensor 10H has the basic configuration of the sensor 10 of the first embodiment (see FIG. 1). Hereinafter, the sensor 10H will be described only in terms of the differences from the sensor 10B (see FIG. 3) of the third embodiment.

[0062] <Function, configuration and action of the sensor of the 9th embodiment> In the case of the sensor 10B of the third embodiment, the insulating layer 30B and the conductive layer 40B are laminated only on one side of the metal layer 20, whereas in the case of the sensor 10H of the ninth embodiment, the insulating layer 30B and the conductive layer 40B are laminated on both sides of the metal layer 20.

[0063] <Effects of the Sensor of the Ninth Embodiment> In the sensor 10H of the ninth embodiment, conductive layers 40B are disposed on both sides of the metal layer 20. Therefore, the sensor 10H of the ninth embodiment has higher sensitivity than that of the third embodiment.

[0064] The above is a description of the sensor 10H of the ninth embodiment.

[0065] <Sensor of Multiple Modifications> Next, several modified examples (see FIG. 10) will be described.

[0066] <Modifications of the Peripheral Parts of the Insulating Layer and the Conductive Layer> FIG. 10 is a cross-sectional view of a number of modified examples of the peripheral portion of the insulating layer 30 and the conductive layer 40 that constitute the sensor 10 (see FIG. 1) of the first embodiment. As described above, the end faces (four long faces connecting the front and back surfaces) of the insulating layer 30 and the conductive layer 40 are formed in planes that are approximately perpendicular to the front (or back) surfaces of each layer, as shown in FIG. 1(B). In contrast to this, the end faces of the insulating layer 30 and the conductive layer 40 may be deformed, for example, as shown in Figs. 10(A) to 10(F).

[0067] (First Modification) 10(A), the end face of the insulating layer 30 may be an inclined surface 32A that inclines inward from the metal layer 20 side to the conductive layer 40 side. In other words, the layer thickness of the entire peripheral end of the insulating layer 30 may be formed to gradually become thinner from the inside to the periphery. In the case of the first embodiment (see FIG. 1(C)), a corner of the insulating layer 30 exists between the metal layer 20 and the conductive layer 40. In contrast, in the case of the first modified example, the insulating layer 30 between the metal layer 20 and the conductive layer 40 has no corner and forms a flat surface. Therefore, the first modified example has higher sensitivity than the first embodiment.

[0068] (Second Modification) 10(B), the end face of the insulating layer 30 may be a curved surface 32B that is recessed inward at a different rate of change from the metal layer 20 side to the conductive layer 40 side. In other words, the layer thickness of the entire peripheral end of the insulating layer 30 may be formed to gradually become thinner from the inside to the periphery. The effects of the second modified example are similar to those of the first modified example.

[0069] (Third Modification) 10(C), the end face of the insulating layer 30 may be inclined surface 32A, and the end of the conductive layer 40 may be laminated on the inclined surface 32A. In other words, the entire peripheral edge of the conductive layer 40 may be located at the entire peripheral end of the insulating layer 30 (as an example, the portion where the inclined surface 32A is formed) when viewed from the thickness direction of the metal layer 20. In the third embodiment, the distance between the metal layer 20 and the conductive layer 40 is shorter than in the first modified example (see FIG. 10(A)). Therefore, the third modification has a higher sensitivity than the first modification.

[0070] (Fourth Modification) 10(D), the end face of the insulating layer 30 may be inclined surface 32A, and the end face of the conductive layer 40 may be inclined surface 42D having the same inclination direction as inclined surface 32A, so that the end of the conductor 40 is laminated on inclined surface 32A. In other words, the entire peripheral edge of the conductive layer 40 may be located at the entire peripheral end of the insulating layer 30 (the portion where inclined surface 32A is formed, as an example) when viewed from the thickness direction of the metal layer 20. The effects of the fourth modified example are similar to those of the third modified example.

[0071] (Fifth Modification) 10(E), the end face of the conductive layer 40 may be an inclined surface 42E that inclines inward from the boundary surface side with the insulating layer 30 to the opposite side. In other words, the layer thickness of the entire peripheral end of the conductive layer 40 may be formed to gradually become thinner from the inside to the periphery. In the case of the fifth modified example, since the end face of the conductive layer 40 is formed as an inclined surface 42E, water can be more easily adhered to the end face of the conductive layer 40 compared to the first embodiment (see FIG. 1(C)). Therefore, the fifth modified example has higher sensitivity than the first embodiment.

[0072] (Sixth Modification) 10(F), the end face of the conductive layer 40 may be a curved surface 42F that is recessed inward at a different rate of change from the boundary surface side with the insulating layer 30 to the opposite side. In other words, the layer thickness of the entire peripheral end of the conductive layer 40 may be formed to gradually become thinner from the inside to the periphery. Therefore, the sixth modified example has higher sensitivity than the first embodiment.

[0073] <Other Modifications> The first to sixth modified examples have been described as being modified examples of the first embodiment, respectively. However, these modified examples may also be applied to the sensor 10A of the second embodiment to the sensor 10H of the ninth embodiment. The cross sections of the end portions of the insulating layer 30 etc. in the first to sixth modified examples have been described as being cross sections of the entire peripheral end portion. However, the cross sections of these modified examples may be cross sections of only a portion of the entire peripheral end portion. In the description of the first embodiment, the shape of the metal layer 20 seen from the thickness direction is a square shape. However, the shape of the metal layer 20 seen from the thickness direction does not have to be a square shape. For example, the metal layer 20 may be a polygonal shape other than a square, or may have a shape including a curved portion in part or all of the periphery. This point is the same for cases other than the first embodiment. In the description of the first embodiment, the shape of the insulating layer 30 seen from the thickness direction is a square shape. However, the shape of the metal layer 20 seen from the thickness direction does not have to be a square shape. For example, the metal layer 20 may be a polygonal shape other than a square, or may have a shape including curved portions in part or all of the periphery. This point is the same for cases other than the first embodiment. In the description of the ninth embodiment, the insulating layer 30B and the conductive layer 40B are laminated on both sides of the metal layer 20, over the entire surface of the metal layer 20. However, in a modification of the ninth embodiment, the insulating layer 30 and the conductive layer 40 of the first embodiment may be laminated on one surface of the metal layer 20, and an insulating layer and a conductive layer other than the insulating layer 30 and the conductive layer 40 of the first embodiment may be laminated on the other surface. In addition, although not specifically mentioned in the description of each embodiment, part or all of the periphery of one or both of the insulating layer 30 and the conductive layer 40 may be made to have a periphery that moves between one side and the other side of a specified center line, such as a sine curve, to make it easier for an oxidation-reduction reaction to occur. In addition, in the sixth embodiment (see Figure 6), multiple stacked layers (first insulating layer 30E1 and first conductive layer 40E1, and second insulating layer 30E2 and second conductive layer 40E2) were connected by a connection layer BG, but the multiple stacked layers may be connected by wiring W instead of the connection layer BG.

[0074] The above is a description of the sensors of the modified examples. Also, the above is a description of the embodiments and the modified examples.

[0075] <Manufacturing method for manufacturing multiple sensors simultaneously> Next, variations in the manufacturing method for simultaneously manufacturing a plurality of sensors 10, 10A to 10H and their modified examples will be described.

[0076] <First manufacturing method> First, the specific contents and effects of the first manufacturing method S100 (see FIG. 11) will be described with reference to FIG. 11 and FIG. 12. FIG. 11 is a flow diagram of a manufacturing method for a plurality of sensors 10, and FIG. 12 is a schematic diagram for explaining each flow in FIG.

[0077] <Specific details of the first manufacturing method> The first manufacturing method S100 includes a first step S10, a second step S20, a third step S30, and a fourth step S40.

[0078] (1st step) The first step S10 is a step of preparing a metal sheet MS. The metal sheet MS corresponds to a plurality of metal layers 20 that are arranged in a predetermined direction (for example, the vertical direction and the horizontal direction) and connected to each other. In other words, the metal sheet MS can be said to be an assembly of a plurality of metal layers 20, and therefore exhibits a property of causing an oxidation reaction when it comes into contact with a liquid (for example, water).

[0079] (2nd process) The second step S20 is a step performed after the first step S10, and is a step of applying (printing, as an example) a plurality of insulating layers 30 to one side of the metal sheet MS. Here, the printing method for the plurality of insulating layers 30 is offset printing, screen printing, inkjet printing, or other printing using a dispersion liquid in which an insulating resin (not shown) is dispersed in a solvent instead of ink.

[0080] (3rd step) The third step S30 is a step performed after the second step S20, and is a step of applying (printing, as an example) a conductive layer 40 onto each insulating layer 30 printed in the second step S20. In other words, the third step S30 is a step of printing a conductive layer 40 on the surface of each of the multiple insulating layers 30 opposite to the surface on the metal sheet MS side. The printing method for the multiple conductive layers 40 may be, as an example, an offset printing method, a screen printing method, an inkjet method, or another printing method. In any printing method, a dispersion liquid in which conductive fine particles (not shown) are dispersed in a solvent may be used as the substitute ink.

[0081] Here, if the printing methods for both the third step S30 and the fourth step S40 are offset printing methods, an offset printing device (not shown) capable of multi-color printing can be used to first print (transfer) multiple insulating layers 30 onto the metal sheet MS using a blanket located upstream in the transport direction of the metal sheet MS, and then print (transfer) multiple conductive layers 40 using another blanket located downstream so that they overlap each of the multiple insulating layers 30. Furthermore, when the printing method for both the third step S30 and the fourth step S40 is an inkjet printing method, an inkjet printing device (not shown) capable of multi-color printing is used to first print the multiple insulating layers 30 by ejecting a dispersion liquid in which insulating resin microparticles are dispersed in a solvent from an inkjet head as liquid microparticles onto the metal sheet MS, and then printing (transferring) the multiple conductive layers 40 by ejecting a dispersion liquid in which conductive microparticles are dispersed in a solvent as other liquid microparticles so as to overlap each of the multiple insulating layers 30.

[0082] (4th step) The fourth step S40 is a step performed after the third step S30, and is a step of dividing (disassembling) the metal sheet MS into a plurality of metal layers 20 so that each of the metal layers 20 includes the plurality of insulating layers 30 printed in the third step S30. This step is performed using a cutting machine (not shown).

[0083] <Effects of the first manufacturing method> The first manufacturing method S100 can simultaneously manufacture multiple sensors 10, 10A to 10G (see FIGS. 1 to 8) in a short manufacturing time. Therefore, the first manufacturing method S100 can manufacture the sensors 10, 10A to 10G at low cost. In addition, in the case where the insulating layer 30 or the like protrudes from the conductive layer 40 or the like in the plan view of each of the sensors 10 (see FIG. 1), 10C (see FIG. 4), 10D (see FIG. 5), 10E (see FIG. 6), 10F (see FIG. 7), and 10G (see FIG. 8), the yield rate can be reduced by forming the insulating layer 30 or the like and the conductive layer 40 or the like by printing using the first manufacturing method to manufacture the sensor. This is because even if the printing area of ​​the conductive layer 40 or the like relative to the insulating layer 30 or the like is shifted for some reason, the protruding part of the insulating layer 30 or the like makes it easy to maintain the conductive layer 40 or the like and the metal layer 20 apart from each other. From this viewpoint, the first manufacturing method is also effective.

[0084] <Additional information on the first manufacturing method> When manufacturing the sensor 10H (see FIG. 9) using the first manufacturing method S100, for example, the second step S20 is performed on both sides of the metal sheet MS, and then the third step S30 is performed on each insulating layer 30B printed on both sides of the metal sheet MS.

[0085] This concludes the description of the first manufacturing method S100.

[0086] <Second manufacturing method> Next, the specific contents and effects of the second manufacturing method S100A (see FIG. 13) will be described with reference to FIG. 13. FIG. 13 is a schematic diagram for explaining each flow of the second manufacturing method S100A. Hereinafter, only the parts of the second manufacturing method S100A that are different from the first manufacturing method S100 (see FIGS. 11 and 12) will be described.

[0087] <Details of the second manufacturing method> In the second manufacturing method S100A, (1) in a first step S10 in the first manufacturing method S100, a metal sheet MS having a plurality of slits ST formed therein is prepared, and (2) in a fourth step S40, all bridges (portions of the metal sheet MS between adjacent slits ST) sandwiched between two adjacent slits among the plurality of slits ST are cut to divide the metal sheet MS.

[0088] <Effects of the second manufacturing method> In the second manufacturing method S100A, before the insulating layers 30 etc. and the conductive layers 40 etc. are printed (before the second step S20 and the third step S30), a portion of the metal sheet MS to be cut in the fourth step has already been cut. Therefore, according to the second manufacturing method S100A, the sensor 10 etc. can be easily divided by simply cutting the multiple bridges.

[0089] This concludes the description of the second manufacturing method S100A.

[0090] <Modification of manufacturing method for simultaneously manufacturing multiple sensors> Next, a description will be given of a modified manufacturing method for simultaneously manufacturing a plurality of sensors 10, 10A to 10H and their modified sensors. In the following description, only the differences from the first manufacturing method S100 and the second manufacturing method S100A described above will be described.

[0091] <First Modification> In the above-described first manufacturing method S100 (see FIGS. 11 and 12) and second manufacturing method (see FIG. 13), it has been described that the insulating layer 30 is formed by coating (specifically, printing) in the second step S20. However, as long as the insulating layer 30 that insulates the metal layer 20 from the conductive layer 40 can be formed, it may be realized by a method other than coating. For example, in the second step, the metal sheet MS may be masked with holes only in the areas where the multiple insulating layers 30 are to be formed, and the metal sheet MS may be anodized to form the multiple anodized film layers into insulating layers.

[0092] <Second Modification> Also, for example, in the second step, a photosensitive insulating resin layer such as a dry film (not shown) may be applied to substantially the entire surface of one side of the metal sheet MS, and the photosensitive insulating resin layer may be exposed to a pattern corresponding to multiple insulating layers to form a photo-crosslinked pattern in the photosensitive insulating resin layer, and further the photosensitive insulating resin layer may be etched to form multiple insulating layers.

[0093] <Third modified example> Also, for example, in the second step, an insulating film (a collection of insulating layers, see Figures 3(B) and 9(B) as an example) may be applied to the entire surface of at least one side of the metal sheet MS, and then in the third step, a conductive film (a collection of conductive layers, see Figures 3(B) and 9(B) as an example) may be applied onto the insulating film. When manufacturing the exemplary sensor 10B (see FIG. 3), for example, (1) one side of the metal sheet MS may be masked and an insulating film and a conductive film may be formed by dip coating, (2) an insulating film and a conductive film may be formed on one side of the metal sheet MS by spray coating, or (3) one of the insulating film and the conductive film may be formed by spray coating and the other by dip coating. Furthermore, when manufacturing the exemplary sensor 10H (see FIG. 9), (1) an insulating film and a conductive film may be formed on both sides of the metal sheet MS by dip coating, (2) an insulating film and a conductive film may be formed on both sides of the metal sheet MS by spray coating, or (3) one of the insulating film and the conductive film may be formed by spray coating and the other by dip coating.

[0094] As described above, a number of embodiments have been illustrated and described as examples of the sensor 10 and the manufacturing method for a number of sensors 10 of the present invention, but the present invention is not limited to these embodiments. The technical scope of the present invention also includes, for example, one of the above-mentioned embodiments or modified examples, (1) a form in which some of the components are replaced with components of another form (not shown), (2) a form in which some or all of the components of another form are added to the components (not shown), and other forms. In other words, the technical scope of the present invention also includes forms that combine the technologies disclosed in this specification. [Industrial Applicability]

[0095] The sensor 10 of each of the above-described embodiments can be used for any purpose in which it is desired to detect contact with a liquid, such as a water level sensor for detecting the water level of a river (not shown), a liquid leakage sensor for detecting liquid leakage, or other liquid detection sensors. In addition, since the sensor 10 etc. generates power when in contact with liquid, even if it has the same configuration, it can be used as a water battery or an air battery. [Explanation of symbols]

[0096] 10 Sensors 10A Sensor 10B Sensor 10C Sensor 10D Sensor 10E Sensor 10F Sensor 10G Sensors 10H Sensor 20 metal layer 30 Insulating layer 30B Insulating layer 30C Insulation layer 30D insulation layer 30E Insulation layer 30E1 First insulating layer 30E2 Second insulating layer 30E3 Insulating connection layer 30F Insulation Layer 30F1 Inner edge (an example of the first inner edge) 30G Insulation Layer 32A Slope 32B curved surface 40 Conductive Layer 40A conductive layer 40B conductive layer 40C conductive layer 40D Conductive Layer 40E Conductive layer 40E1 First conductive layer 40E2 Second conductive layer 40E3 Conductive connection layer 40F conductive layer 40F1 Inner edge (an example of the second inner edge) 40G conductive layer 42D sloped surface 42E Slope 42F curved surface 50 Transmitting device 52 Transmitting circuit 54 Transmitting Antenna 60 Receiving device 62 Receiving circuit 64 Receiving Antenna 100 Detection System BG connection layer MS Metal Sheet S10 1st process S20 2nd process S30 3rd process S40 4th process S100 First manufacturing method (an example of a manufacturing method for simultaneously manufacturing multiple sensors) S100A Second manufacturing method (an example of a manufacturing method for simultaneously manufacturing multiple sensors) ST Slit W Wiring

Claims

1. A sensor having a sheet shape, at least a portion of which is configured to have a laminated structure, for detecting contact with a liquid by generating electricity, A metal layer as a metal electrode that undergoes an oxidation reaction upon contact with a liquid; an insulating layer disposed on an inner side of the metal layer as viewed in a thickness direction of the metal layer and laminated on at least one surface of the metal layer; a conductive layer as an air electrode, the conductive layer being disposed on the opposite side of the metal layer with the insulating layer interposed therebetween and on the inner side of the insulating layer as viewed in a thickness direction of the metal layer, the conductive layer being laminated on the insulating layer, the conductive layer causing a reduction reaction when in contact with a liquid; A sensor comprising:

2. The insulating layer is disposed on a part of the at least one surface when viewed in a thickness direction of the metal layer. The sensor of claim 1 .

3. The total perimeter length of the insulating layer is longer than the total perimeter length of the metal layer. The sensor of claim 2.

4. The thickness of the insulating layer at the entire peripheral end portion is formed so as to become gradually thinner from the inside toward the peripheral edge. The sensor of claim 2.

5. the entire peripheral edge of the conductive layer is located at the entire peripheral end of the insulating layer when viewed in the thickness direction of the metal layer; The sensor of claim 4.

6. The thickness of the conductive layer at the entire peripheral end portion is formed to be gradually thinner from the inside to the peripheral edge. The sensor of claim 2.

7. the entire peripheral edge of the conductive layer is located at the entire peripheral end of the insulating layer when viewed in the thickness direction of the metal layer; The sensor of claim 6.

8. the insulating layer has a first inner periphery; the conductive layer has a second inner periphery surrounding the first inner periphery when viewed in a thickness direction of the metal layer. The sensor of claim 2.

9. A method for simultaneously manufacturing a plurality of sensors, each of which is a sensor according to any one of claims 1 to 8, comprising the steps of: A first step of preparing a metal sheet that undergoes an oxidation reaction upon contact with a liquid; a second step of printing a plurality of the insulating layers on one side of the metal sheet; a third step of printing the conductive layer on a surface of each of the insulating layers opposite to the surface on the metal sheet side; a fourth step of dividing the metal sheet into a plurality of metal layers, each of the metal layers including the insulating layer; The method includes:

10. The metal sheet prepared in the first step has a plurality of slits formed therein, In the fourth step, all bridges sandwiched between two adjacent slits among the plurality of slits are cut to divide the metal sheet.

10. The method of claim 9.

11. A method for simultaneously manufacturing a plurality of sensors, each of which is a sensor according to any one of claims 1 to 8, comprising the steps of: A first step of providing a metal sheet; A second step of forming a plurality of anodized layers or a plurality of photoresist layers corresponding to the plurality of insulating layers on one surface of the metal sheet; a third step of printing the conductive layer on a surface of each of the plurality of anodized layers or the plurality of photoresist layers opposite to the surface of the metal sheet; a fourth step of dividing the metal sheet into a plurality of metal layers, each of which includes a respective one of the plurality of anodization layers or the plurality of photoresist layers; The method includes:

12. The metal sheet prepared in the first step has a plurality of slits formed therein, In the fourth step, all bridges sandwiched between two adjacent slits among the plurality of slits are cut to divide the metal sheet. The method of claim 11.

13. A method for simultaneously manufacturing a plurality of sensors, each of which is a sensor according to any one of claims 1 to 8, comprising the steps of: A first step of preparing a metal sheet that undergoes an oxidation reaction upon contact with a liquid; a second step of applying at least one of the insulating layers to at least one surface of the metal sheet; a third step of applying at least one conductive layer to a surface of the at least one insulating layer opposite to the surface of the metal sheet; a fourth step of dividing the metal sheet into a plurality of metal layers, each of the metal layers including the insulating layer; The method includes:

Images