High temperature face plate for deposition use

Abstract

To provide a processing chamber face plate subjected to temperature control.SOLUTION: A face plate includes a main body 102 having a plurality of open holes 152 formed to penetrate. A heater element 160 arranged in the main body surrounds the plurality of open holes; a support ring arranged in the main body surrounds the heater element; and the support ring includes a main body and a cantilever extended inward in the radial direction from the main body and contacting the main body of the face plate.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to heated faceplates for use in substrate processing chambers. [Background technology]

[0002] In the manufacture of integrated circuits, deposition processes such as chemical vapor deposition (CVD) or atomic layer deposition (ALD) are used to deposit films of various materials on semiconductor substrates. In other operations, layer-altering processes such as etching are repeatedly used to fabricate various layers of electronic devices, such as semiconductor devices.

[0003]

[0003] Producing defect-free semiconductor devices is desirable when fabricating integrated circuits, and as the need for improved devices continues to grow, so does the need for improved methods and apparatus for producing such devices. Chemicals used in new processes, such as precursor gases, constantly require enhanced process control, such as temperature control, to perform such processes to a given specification. Thus, there is a need in the art for process chamber components that can provide enhanced temperature control for device manufacturing and processing. Summary of the Invention

[0004]

[0004] In one embodiment, a faceplate for a processing chamber comprises a body having a plurality of apertures formed therethrough, a heating element disposed within the body surrounding the plurality of apertures, and a support ring disposed within the body surrounding the heating element and including a main body and a cantilever extending radially inward from the main body, the cantilever in contact with the body of the faceplate.

[0005] In another embodiment, a faceplate for a processing chamber comprises a body having a plurality of apertures formed therethrough, the body comprising a first extension and a second extension, each of the first extension and the second extension extending outwardly from an outer surface of the body, the first extension and the second extension together defining a recess, each of the first extension and the second extension having a greater thickness at a radially outer edge compared to a radially inner edge. The faceplate also comprises a heating element disposed within the body, the heating element surrounding the plurality of apertures and positioned radially inward of the first extension and the second extension. The faceplate comprises a support ring disposed within the recess of the body, the support ring comprising a main body and surrounding the heating element. A radially outer edge of each of the first and second extensions contacts the support ring and a radially inner edge of each of the first and second extensions is spaced from the support ring.

[0006] In another embodiment, a process chamber includes a chamber body, a substrate support disposed within the chamber body, and a lid assembly disposed on the chamber body, the lid assembly including a faceplate, the faceplate including a body having a plurality of apertures formed therethrough, a heating element disposed within the body surrounding the plurality of apertures, and a support ring disposed within the body surrounding the heating element and including a main body and a cantilever extending radially inward from the main body, the cantilever in contact with the body of the faceplate.

[0007]

[0007] In order to allow the above-mentioned features of the present disclosure to be understood in detail, the present disclosure briefly summarized above will now be described more particularly with reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings only show exemplary embodiments, and therefore should not be considered as limiting the scope thereof, and the present disclosure may admit of other equally effective embodiments. [Brief description of the drawings]

[0008] [Figure 1A]

[0008] A schematic cross-sectional view of a process chamber according to one embodiment of the present disclosure is shown. [Figure 1B]

[0009] 1B shows an enlarged partial view of the process chamber of FIG. 1A. [Diagram 2]

[0010] 1A and 1B show enlarged partial views of the process chamber 100 according to one embodiment of the present disclosure, particularly showing the blocker plate 136 and the face plate 138 adjacent the sidewall 104 of the chamber body 102. [Diagram 3]

[0011] 3 shows an enlarged view of the joint of the face plate depicted in FIG. 2. [Figure 4]

[0012] 1 illustrates the temperature of a faceplate according to one embodiment of the present disclosure. [Figure 5A]

[0013] 13 shows a view of a face plate assembly according to another embodiment of the present disclosure. [Figure 5B]

[0014] 1 illustrates a perspective view of one embodiment of a support ring. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009]

[0015] For ease of understanding, wherever possible, the same reference numerals have been used to designate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0010]

[0016] Embodiments of the present disclosure generally relate to an apparatus for gas distribution in a process chamber. More specifically, aspects of the present disclosure relate to a metal faceplate. The faceplate has a body formed from a distribution section surrounded by a coupling section. A heater is disposed within the distribution section for heating the body to an elevated temperature. A support ring is disposed within the coupling section of the faceplate. A cantilever extends from the support ring and creates a load bearing point for supporting the faceplate. A gap is disposed between the support ring and the faceplate. The gap acts as a thermal choke and limits heat transfer between the distribution section and the coupling section of the faceplate.

[0011]

[0017] FIG. 1A shows a schematic cross-sectional view of a process chamber 100 according to one embodiment. FIG. 1B shows an enlarged schematic view of details of the process chamber 100. The process chamber 100 includes a body 102 having a sidewall 104 and a base 106. A lid assembly 108 is coupled to the body 102. The body 102 and the lid assembly 108 define a process space 110. The body 102 is formed from a metallic material, such as aluminum or stainless steel, although other metals suitable for use with the process space 110 therein are contemplated. A substrate support 112 is disposed within the process space 110 and supports a substrate 114 during processing. The substrate support 112 includes a support body 116 coupled to a shaft 118. The shaft 118 is coupled to a bottom surface of the support body 116 and extends out of the body 102 through an opening 120 in the base 106. The shaft 118 is coupled to an actuator 122. An actuator 122 vertically actuates the shaft 118, and the support body 116 coupled thereto, between a substrate loading position and a substrate processing position. To facilitate processing of the substrate 114 within the processing chamber 100, the substrate 114 is disposed on an upper surface of the support body 116 opposite the shaft 118.

[0012]

[0018] A port 124 is formed in the sidewall 104 to facilitate access of the substrate 114 into the process space 110. A door 126, such as a slit valve, is actuated to selectively allow the substrate 114 to be loaded onto or removed from the support body 116 through the port 124. An electrode 128 is optionally disposed within the support body 116 and electrically connected to a power source 130 via a shaft 118. The electrode 128 is selectively biased by the power source 130 to generate an electrostatic field for chucking the substrate 114 to the support body 116. In certain embodiments, a heater 133, such as a resistive heater, is disposed within the support body 116 for heating the substrate 114 disposed on the support body 116.

[0013]

[0019] An inlet port 174 is disposed in the lid 134. The inlet port 174 is fluidly coupled to a gas conduit 146. The gas conduit 146 allows gas to flow from a first gas source 148, such as a process gas source, through the inlet port 174 into the first space 140. A second gas source 190 may provide a cleaning gas to remove particle deposits from the interior surfaces of the processing chamber 100. A seal 180, such as an O-ring, is disposed in the annular extension 172 in a groove, such as a dovetail groove, between the blocker plate 136 and the lid 134 to isolate the process space 110 from the outside environment and to allow the reduced pressure system 132 to maintain a reduced pressure therein. The reduced pressure system 132 is fluidly coupled to the process space 110 for evacuating gas from the process space 110.

[0014]

[0020] The lid assembly 108 includes a lid 134, a blocker plate 136, a face plate 138, and a clamp 135. The blocker plate 136 includes a concave circular distribution portion 170 surrounded by an annular extension 172. The blocker plate is disposed between the lid 134 and the face plate 138 and is coupled to the lower surface 141 of the lid 134 and the upper surface 149 of the face plate 138 at the annular extension 172. A clamp 135 is coupled to the lower surface of the lid 134, the outer surface 143 of the blocker plate 136, the outer edge 145 of the support ring 158 (shown in FIG. 2), and the upper surface 105 of the side wall 104. The clamp 135 facilitates fastening of the face plate 138. The lid 134 is coupled to the upper surface 137 of the annular extension 172 opposite the body 102. The face plate 138 is coupled to the lower surface 139 of the annular extension 172. A first space 140 is defined between the blocker plate 136 and the lid 134. A second space 142 is defined between the blocker plate 136 and an upper surface 149 of the face plate 138. A plurality of apertures 144 are formed through the distribution portion 170 of the blocker plate 136 to facilitate fluid communication between the first space 140 and the second space 142.

[0015]

[0021] The faceplate 138 has a distribution portion 176 and a coupling portion 178 (shown in FIG. 2 ) disposed radially outward of the distribution portion 176. The distribution portion 176 is disposed between the process space 110 and the second space 142 to facilitate fluid flow therebetween. The coupling portion 178 surrounds the distribution portion 176 at a periphery of the faceplate 138. To facilitate processing of the substrate 114, an RF generator 182 is coupled to the faceplate 138 to excite gas from the first gas source 148, the second gas source 190, or both the first gas source 148 and the second gas source 190 to generate ionized species. In one embodiment, the RF generator 182 and the faceplate 138 in conjunction with the electrode 128 facilitate generation of a capacitively coupled plasma in the process space 110.

[0016]

[0022] One or more apertures 152 are disposed through the face plate 138 in the distribution section 176. The apertures 152 allow fluid communication between the second space 142 and the process space 110. In operation, gas flows from the inlet port 174 into the first space 140, through the plurality of apertures 144 in the blocker plate 136 into the second space 142, and through the plurality of apertures 152 in the face plate 138 into the process space 110. The placement and sizing of the apertures 152 allows for selective flow of gas into the process space 110 to achieve a desired gas distribution. In one embodiment, a uniform gas distribution may be desired, which is achieved by selective flow of gas into the process space 110.

[0017]

[0023] One or more heating elements 160 are disposed within the faceplate 138. In one embodiment, the heating elements 160 are disposed radially outward of the apertures 152. The heating elements 160 may be any element capable of providing heat to the faceplate 138. In one embodiment, the heating elements 160 include a resistive heater. The resistive heater may be embedded within the faceplate 138 and may surround the apertures 152 of the faceplate 138. The heating elements 160 heat the faceplate 138 to a high temperature, such as 300° C. or higher. For example, the heating elements 160 may heat the faceplate 138 to 400° C., 500° C., or higher. Increasing the temperature of the faceplate 138 to 300° C., 400° C., 500° C., or higher during processing results in reduced particle formation on the faceplate 138. This means improved deposition on the substrate 114 and improved processing of the substrate 114, as well as increased tool uptime.

[0018]

[0024]

[0023] Figure 2 shows an enlarged partial view of the process chamber 100 of Figure 1A in accordance with one embodiment of the present disclosure. In particular, Figure 2 shows the blocker plate 136 and the face plate 138 adjacent to the sidewall 104 of the chamber body 102.

[0019]

[0025] A recess 153 is formed in a radially outer edge of the mating portion 178 of the faceplate 138. A support ring 158 is disposed in the recess 153 formed in the mating portion 178 of the faceplate 138. The support ring 158 is disposed radially outward of both the distribution portion 176 and the heating element 160 of the faceplate 138. Seals 154 and 156 are disposed above and below the mating portion 178 of the faceplate 138. The seals 154 and 156 are disposed in dovetail grooves in the blocker plate 136 and the sidewall 104. The seals 154 and 156 may be O-rings that provide a vacuum seal to the process space 110. The support ring 158 provides structural and mating support for the faceplate 138. The support ring 158 is constructed from a material such as, but not limited to, aluminum, aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, or stainless steel. The support ring 158 has a main body 161 and a lip 162 disposed on the outer edge 145 of the support ring 158. The lip 162 extends radially outward from the support ring 158 to facilitate handling of the face plate 138 during preventive maintenance.

[0020]

[0026] The support ring 158 further includes a radially inner cantilever 164. The cantilever 164 is disposed opposite the lip 162 and extends radially inward from an inner surface 163 of the support ring 158. The cantilever 164 provides structural support and a weight-bearing surface for the faceplate 138. For example, the cantilever 164 prevents the faceplate 138 from sagging, resulting in improved deposition and enhanced uniformity and processing of the substrate 114. The minimal contact and lower thermal conductance of the support ring 158 confines heat within the faceplate 138, thereby limiting the power used to heat the faceplate and helping to meet thermal budget targets.

[0021]

[0027] FIG 3 shows an enlarged view of the mating portion 178 of the face plate 138 depicted in FIG 2. As shown in FIG 3, the support ring 158 engages with a recess 153 formed in the outer periphery of the face plate 138. The face plate 138 includes a stepped surface that corresponds to the shape of the radially inner surface of the support ring 158. To facilitate assembly of the face plate 138 and the support ring 158, the support ring 158 may be formed from multiple segments that are assembled to form a complete loop around the face plate 138.

[0022]

[0028] When the support ring 158 is assembled with the face plate 138, the support ring 158 contacts the face plate 138 only at selected points within the recess 153, which minimizes heat transfer therebetween. For example, the support ring 158 contacts the face plate 138 at (1) the top surface 184 of the cantilever 164, (2) the radially outer edge of the top surface 165 of the main body 161 of the support ring 158, and (3) the radially outer edge of the bottom surface 167 of the main body 161 of the support ring 158. The top surface 184 of the cantilever 164 is the load-bearing structure of the support ring 158. In one embodiment, which may be combined with other embodiments, the cantilever 164 has a nominal thickness of about 8 millimeters (mm) to 20 mm. In another embodiment, the cantilever 164 is about 10 mm thick.

[0023]

[0029] At locations within the recess 153 where the edge of the support ring 158 does not contact the face plate 138, gaps are created, such as gaps 190, 192a, and 192b. Gaps 190, 192a, and 192b are spaces disposed radially between the face plate 138 and the support ring 158. Gap 190 is disposed between the cantilever 164 and the sidewall 185 of the recess 153. In one embodiment, as depicted in FIG. 3, gap 192a is disposed between the inner surface 163a of the support ring 158 and extends at least partially across the top surface 165 of the main body 161 of the support ring 158. Gap 192b is disposed between the inner surface 163b and extends at least partially across the bottom surface 167 of the main body 161 of the support ring 158. In another embodiment, gap 192a is disposed between inner surface 163a of support ring 158 and the stepped lower surface of extension 186. Gap 192b is disposed between inner surface 163b of support ring 158 and the stepped upper surface of extension 188. Gaps 190, 192a, and 192b minimize the contact area between faceplate 138 and support ring 158 to limit heat transfer from heating element 160 to seals 154, 156, keeping the temperature of seals 154, 156 lower (e.g., below their degradation temperature) to prevent degradation thereof and reduce power requirements to heating element 160. Gaps 190, 192a, and 192b provide a thermal choke and further provide space for thermal expansion. In one embodiment, which may be combined with other embodiments, the width of the gap 190, 192a, or 192b is about 0.1 mm to 5 mm, for example about 0.5 mm to 2 mm. The size, shape, and arrangement of the gaps 190, 192a, 192b disposed about the support ring 158 may be selected in relation to a desired rate of heat transfer with the coupling 178. Additionally, the depth, width, and cross-section of the gaps 190, 192a, and 192b may be adjusted as needed. Any arrangement of gaps, channels, grooves, recesses, or notches that can minimize heat transfer may be utilized as a thermal break.

[0024]

[0030] The joint 178 has extensions 186 and 188 that partially define the recess 153. The extensions 186 and 188 provide the primary thermal choke feature of the design. The reduced cross-sectional area of ​​the extensions 186 and 188 reduces heat conduction, resulting in a thermal choke within the joint 178. The extension 186 has a planar upper surface and a stepped lower surface. The planar upper surface of the extension 186 abuts the lower surface 139 of the blocker plate 136. The extension 186 extends above the upper surface 165 of the main body 161 of the support ring 158. The extension 186 at least partially contacts the upper surface 165 of the main body 161 of the support ring 158. The stepped lower surface 189 of the extension 186 is positioned between the radially inner surface of the support ring 158 and the face plate 138. The extension 188 has a planar lower surface and a stepped upper surface. The planar lower surface of the extension 188 is adjacent to the upper surface 105 of the side wall 104. The extension 188 extends below the lower surface of the support ring 158. The extension 188 is in at least partial contact with the lower surface of the support ring 158. The extensions 186 and 188 provide a thermal choke from the distribution portion 176 to the coupling portion 178 by creating additional clearance above / below the main body 161 due to the presence of their respective stepped surfaces. The thermal choke provided by the extensions 186, 188 limits the transfer of heat from the heating element 160 to the vacuum seals 154 and 156. The extensions 186 and 188 are thinned portions of the face plate 138. In one embodiment, which may be combined with other embodiments, extensions 186 and 188 have a nominal thickness of about 0.5 mm to 5 mm, such as about 0.5 mm to 3 mm. It is understood that the depth, width, and cross-section of extensions 186 and 188 disposed about support ring 158 may be selected in relation to the desired rate of heat transfer to and from coupling 178.

[0025]

[0031] Gaps 193a and 193b are also utilized as thermal breaks. Gap 193a provides a thermal break between blocker plate 136 and extension 186. Gap 193a is defined by a recess located in lower surface 139 of blocker plate 136 adjacent vacuum seal 154. Gap 193b between sidewall 104 and extension 188. Gap 193b is defined by a recess in upper surface 105 of sidewall 104 adjacent vacuum seal 156. The depth, width, and cross-section of gaps 193a and 193b may be selected in conjunction with a desired rate of heat transfer from faceplate 138 to seals 154 and 156.

[0026]

[0032] FIG. 4 illustrates a temperature gradient across faceplate 400. Faceplate 400 is similar to faceplate 138. The temperature is warmest in region 402, which includes distribution portion 176 (shown in FIG. 1A) of faceplate 400. This temperature cools gradually radially outward. Region 412 may thereby have the coldest temperature on faceplate 400. As illustrated in FIG. 4, faceplate 400 has regions 402, 404, 406, 408, 410, and 412 illustrating different temperatures across faceplate 400. FIG. 4 is an exemplary embodiment, and there may be fewer or more regions. In an exemplary embodiment, as illustrated in FIG. 4, the temperature of region 402 may be approximately 350° C. or greater. The temperature of region 404 may be approximately 25° C. to 40° C. lower than the temperature of region 402. Thereby, the temperature of region 402 may be about 310°C-325°C. Region 406 includes at least a portion of joint 178 (shown in FIG. 1) of face plate 400. The temperature of region 406 may be lower than the temperature of region 404 by about 10°C-15°C. Thereby, region 406 has a temperature of about 300°C. The temperature of region 408 is about 270°C-280°C. The temperature of region 408 is about 20°C-30°C cooler than region 406. The lower temperature of region 408 is due to gaps 190, 192a, and 192b (shown in FIG. 3). The temperature of region 410 is about 180°C-210°C. The temperature of region 412 is about 150°C-170°C.

[0027]

[0033] 5A is a cross-sectional view of a face plate assembly 500. The face plate assembly 500 may include one or more of the aspects described above and will not be described further.

[0028]

[0034] The faceplate assembly 500 is a modular assembly that includes one or more components. For example, the faceplate assembly includes a first support section 558a and a second support section 558b, which together form a ring when engaged with one another. In one embodiment, the first support section 558a and the second support section 558b each extend 180 degrees. However, other dimensions are also contemplated. The first support section 558a and the second support section 558b surround and secure the faceplate 138. To facilitate heating of the faceplate 138, a concentric heating element 560 is embedded within the faceplate 138. In one embodiment, the faceplate 138 is made by bonding (e.g., welding or brazing) two plates together, with the heating element 560 disposed at the interface between them. The concentric heating element 560 has a connection end 562 extending from the faceplate 138 to facilitate connection to a power source. The connecting ends 562 are disposed within respective openings 594 formed in the support sections 558. The support section 558a may have a corresponding opening 594. The openings 594 facilitate positioning the connecting ends 562 in an orientation 180 degrees from that shown in FIG. 5A. Thus, the faceplate assembly 500 may be used in chambers of various configurations (e.g., in a dual chamber platform) without the need for chamber specific components. The openings 594 are disposed approximately 90 degrees from the adjacent surfaces of the first and second sections 558a, 558b, although other locations are contemplated.

[0029]

[0035] A temperature sensor 508 (four shown) is disposed through each support section 558a, 558b. The temperature sensors 508 are used to determine and regulate the temperature of the faceplate 138. In one embodiment, the temperature sensors are located to the sides of the opening 594. It is contemplated that more or less than four temperature sensors 508 may be utilized.

[0030]

[0036] The first and second support sections 558a and 558b are connected to a mounting bracket 506. The mounting bracket 506 connects the support sections 558a, 558b by adhering to adjacent lips 162 on the first and second support sections 558a, 558b. In one embodiment, the first support section 558a and the second support section 558b each include two lips 162 disposed at lateral ends of the first support section 558a and the second support section 558b. A plurality of holes 504 are formed through each lip 162 and through the mounting bracket 506, which are aligned with each other for receiving fasteners therein. Each lip 162 also includes one or more notches 502 (two are shown in each lip 162) that are used to position and clamp the faceplate 138 within the processing chamber 100 (as shown in FIG. 1A).

[0031]

[0037] 5B depicts one embodiment of support section 558a (support section 558b is a mirror image). Support section 558a includes a main body 561 and one or more lips 162 (two shown) disposed on an outer edge 145 of support section 558a. A lip 162 extends radially outward from support section 558a to facilitate handling of face plate 138 (shown in FIG. 5A).

[0032]

[0038] In one embodiment depicted in FIG. 5B, the cantilever of the support section 558a is divided into a plurality of segmented cantilevers 564a-564f. The plurality of cantilevers 564a-564f operates similarly to the cantilever 164 shown in FIG. 3. The plurality of cantilevers 564a-564f extend from an inner surface 563 of the support section 558a. The plurality of cantilevers 564a-564f provide a larger surface area, resulting in greater thermal choke efficiency, while maintaining spacing therebetween to reduce thermal mass. An opening 594 is formed through the inner surface of the support section 558a. The connection end 562 of the heating element 560 may be disposed with the opening 594.

[0033]

[0039] Several embodiments described herein advantageously provide a faceplate that can be heated to high temperatures, such as above 350° C., with minimal sagging or sagging. Thermal chokes as disclosed allow the temperature of the faceplate to increase to high temperatures, limiting the buildup of contaminant particles while maintaining the sealing capability of the externally disposed seal.

[0034]

[0040] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is defined by the claims that follow.

Claims

1. 1. A face plate for a processing chamber, comprising: a body having a plurality of apertures formed therethrough; a heating element disposed within the body, the heating element surrounding the plurality of apertures; and a faceplate comprising: a support ring disposed within the body, the support ring surrounding the heating element and including a main body and a cantilever extending radially inward from the main body, the cantilever in contact with the body of the faceplate.

2. The face plate of claim 1 , wherein the body comprises aluminum and the support ring comprises aluminum, aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, or stainless steel.

3. The faceplate of claim 1 , further comprising a gap created between a radially inner surface of the cantilever and the body of the faceplate.

4. The faceplate of claim 1 , further comprising a gap created between a lower surface of the cantilever and the body of the faceplate.

5. 2. The face plate of claim 1, further comprising: a first gap created between a radially inner surface of the main body of the support ring and the body of the face plate; and a second gap created between a top surface of the main body and the body of the face plate.

6. 6. The face plate of claim 5, wherein the first gap and the second gap are each within a range of about 0.1 mm to 5 mm.

7. The faceplate of claim 1 , wherein the cantilever has a thickness in the range of approximately 8 mm to 20 mm.

8. 2. The face plate of claim 1, wherein the body comprises a first extension and a second extension, the first extension and the second extension each extending radially outward from an outer surface of the body, the first extension and the second extension together defining a recess for receiving the support ring.

9. The face plate of claim 8 , wherein the first extension and the second extension each have a greater thickness at a radially outer edge compared to a radially inner edge.

10. 10. The face plate of claim 9, wherein the radially outer edge of each of the first and second extensions contacts the support ring and the radially inner edge of each of the first and second extensions is spaced from the support ring.

11. 1. A face plate for a processing chamber, comprising: a body having a plurality of apertures formed therethrough, the body comprising a first extension and a second extension each extending outwardly from an outer surface of the body, the first extension and the second extension together defining a recess, each of the first extension and the second extension having a greater thickness at a radially outer edge compared to a radially inner edge; a heating element disposed within the body, the heating element surrounding the plurality of apertures and positioned radially inward of the first extension and the second extension; and a face plate comprising a support ring disposed within the recess of the body, the support ring comprising a main body and surrounding the heating element, the radially outer edge of each of the first extension and the second extension contacting the support ring and the radially inner edge of each of the first extension and the second extension being spaced from the support ring.

12. The face plate of claim 11 , wherein the body comprises aluminum and the support ring comprises aluminum, aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, or stainless steel.

13. The face plate of claim 12 , wherein the support ring further comprises a cantilever extending radially inward from the main body.

14. The faceplate of claim 13 further comprising a gap created between a radially inner surface of the cantilever and the body of the faceplate.

15. 15. The face plate of claim 14, wherein the gap is in the range of about 0.1 mm to 5 mm.

16. The faceplate of claim 14 further comprising a gap created between a lower surface of the cantilever and the body of the faceplate.

17. 17. The face plate of claim 16, wherein the gap is in the range of about 0.1 mm to 5 mm.

18. Chamber body, a substrate support disposed within the chamber body; and 1. A process chamber comprising a lid assembly disposed on the chamber body, the lid assembly comprising: A face plate, a body having a plurality of apertures formed therethrough; a heating element disposed within the body, the heating element surrounding the plurality of apertures; and A process chamber comprising: a faceplate; a support ring disposed within the body, surrounding the heating element, the support ring including a main body and a cantilever extending radially inward from the main body, the cantilever in contact with the body of the faceplate.

19. 20. The process chamber of claim 18, wherein the body comprises aluminum and the support ring comprises aluminum, aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, or stainless steel.

20. The process chamber of claim 18 , further comprising a gap created between a radially inner surface of the cantilever and the body of the faceplate.

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