Resin sealing device

Abstract

To provide a resin sealing device capable of obtaining a resin sealed product in which an external connection terminal of an electronic component is exposed, by using fewer members and manufacturing steps.SOLUTION: A resin sealing device 1A has a metal mold 2 for clamping an electronic component 10 with an upper metal mold 2A and a lower metal mold 2B having cavity recess portions 3A, 3B respectively. The metal mold 2 has a plurality of rods 5 arranged so as to be freely advanced and retreated into and from a plurality of through-holes 4 formed in a bottom surface 3A-1 of the cavity recess portion 3A of the upper metal mold 2A. Resin is filled in a state where the rods 5 advanced from the plurality of through-holes 4 come into contact with and press against the end surfaces 12B of the plurality sleeves 12 by a clamp, and also a heat dissipation member 13 is in contact with a bottom surface 3B-1 of the cavity recess portion 3B of the lower metal mold 2B, whereby the end surfaces 12B of the plurality of sleeves 12 and an end surface 13B of the heat dissipation member 13 are exposed to form a mold product.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin sealing apparatus for sealing electronic components with resin. [Background technology]

[0002] As a method for molding a large power module consisting of a heat sink, an insulating layer, a substrate, a semiconductor power chip, and external connection terminals (hereinafter referred to as "vertical terminals") standing vertically on the substrate, there is a method in which an outer frame of a resin case is set around the module, liquid resin is potted, and then a lid made of the same material as the resin case is placed on the module. Alternatively, there is a method in which a small power module molded with epoxy resin is incorporated into the outer frame of the resin case of the large power module, and liquid resin is potted on the module (for example, see Patent Document 1).

[0003] The vertical terminals are located on the heat dissipation surface of the board and on the opposite side of the heat sink, which provides the advantage of allowing a long distance between the terminals and the ground, and ensuring good insulation characteristics. In addition, various external circuit devices can be stacked on the top surface of a large power module, which provides the advantage of shortening the distance between the wiring for connecting to various external circuit devices, reducing noise and improving reliability, as well as enabling miniaturization (see, for example, Patent Document 2).

[0004] Known as an exposure molding method for vertical terminals is, for example, the method described in Patent Document 3. In this method, lead pins are provided vertically on the surface of a substrate on which an integrated circuit is formed, and in a package that is sealed with resin using a mold, the package has exposed parts formed by attachments that are inserted and adhered to the lead pins before molding and that can be removed after molding, and these exposed parts are configured as terminals. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 7224272 [Patent Document 2] Japanese Patent Application Publication No. 10-22435 [Patent Document 3] Japanese Utility Model Application Publication No. 3-110847 Summary of the Invention [Problem to be solved by the invention]

[0006] When setting a resin case frame around a large power module and potting it with liquid resin, there are problems such as the need for an outer frame and a resin case lid, adhesive, gel material such as silicone, and parts and processes for the injection process, as well as the long curing time and high costs.

[0007] The method described in Patent Document 3 has the problem of deformation due to the use of rubber, resin, etc., attachments, and also has the problem of increased cost due to the need for a process of attaching and detaching the attachments.

[0008] SUMMARY OF THE PRESENT EMBODIMENTS Accordingly, an object of the present invention is to provide a resin sealing apparatus capable of obtaining a resin sealed product in which the external connection terminals of an electronic component are exposed, using fewer materials and manufacturing steps. [Means for solving the problem]

[0009] The resin sealing apparatus of the present invention is a resin sealing apparatus for resin sealing an electronic component having a plurality of sleeves, each having holes for arranging a plurality of external connection terminals approximately vertically on one end surface of a substrate, and a heat dissipation member arranged on the other end surface of the substrate, and the resin sealing apparatus has a mold for clamping the electronic component using a first mold and a second mold, each having a cavity recess, and the mold has a plurality of pressing members arranged so as to be able to move forward and backward in a plurality of through holes formed in the bottom surface of the cavity recess of the first mold, and the plurality of pressing members each protruding from the plurality of through holes abut against and press against the end surfaces of the plurality of sleeves by clamping, and the heat dissipation member abuts against the bottom surface of the cavity recess of the second mold, and the mold is filled with resin to expose the end surfaces of the plurality of sleeves and the end surface of the heat dissipation member.

[0010] According to the resin sealing device of the present invention, when the electronic component is clamped by the first and second dies, the pressing members respectively protruding from the multiple through holes abut and press the end faces of the multiple sleeves, and the heat dissipation member abuts the bottom surface of the cavity recess of the second die, and resin is filled in such a state that the resin can be prevented from penetrating between the end faces of the multiple sleeves and the multiple pressing members, and the end faces of the multiple sleeves and the heat dissipation member are exposed and molded. As a result, by erecting external connection terminals in the holes of the multiple sleeves after molding, a resin sealing product with exposed external connection terminals can be obtained. In particular, in the resin sealing device of the present invention, the end faces of the multiple sleeves are pressed individually by the multiple pressing members, so that the variation in height from the end face of the heat dissipation member to the end faces of the multiple sleeves can be absorbed, and the resin can be prevented from penetrating into the holes of the sleeves. In addition, excessive mold clamp load can also be absorbed.

[0011] Alternatively, instead of the sleeve, a plurality of external connection terminals each having a step at its tip and a pin portion thinner than the step at the tip of the step, each standing substantially vertically, may be used. That is, another resin sealing device of the present invention is a resin sealing device for resin sealing an electronic component having a plurality of external connection terminals each having a step at its tip and a pin portion thinner than the step at the tip of the step, each standing substantially vertically on one end surface of a substrate, and a heat dissipation member disposed on the other end surface of the substrate, the resin sealing device being a mold for clamping the electronic component with a first mold and a second mold each having a cavity recess, the first mold including a plurality of through holes formed in a bottom surface of the cavity recess of the first mold so as to be freely advanced and retreated, and the pin portions of the plurality of external connection terminals are each arranged so as to be freely advanced and retreated, The mold has insertion holes into which the pins are respectively inserted, and is provided with a plurality of pressing members which abut against and press against the step portions of the plurality of external connection terminals when the pin portions are inserted into the respective insertion holes, and the plurality of pressing members which each protrude from the plurality of through holes abut against and press against the step portions when the pin portions are inserted into the respective insertion holes by a clamp, and the heat dissipation member is abutted against the bottom surface of the cavity recess of the second mold, and resin is filled in to expose the pin portions and step portions of the plurality of external connection terminals and the end surface of the heat dissipation member.

[0012] According to the resin sealing device of the present invention, when the electronic component is clamped by the first and second dies, the pressing members respectively protruding from the multiple through holes press against the stepped portions of the multiple external connection terminals with the pin portions inserted into the insertion holes, and the heat dissipation member presses against the bottom surface of the cavity recess of the second die, so that the resin is filled in a state where the resin can be prevented from penetrating between the stepped portions of the multiple external connection terminals and the multiple pressing members, and the pin portions and stepped portions of the multiple external connection terminals and the end surface of the heat dissipation member are exposed and molded. This makes it possible to obtain a resin-sealed product in which the external connection terminals are exposed without erecting the external connection terminals in the holes of the sleeve after molding. In particular, in the resin sealing device of the present invention, the stepped portions of the multiple external connection terminals are pressed individually by the multiple pressing members, so that the variation in height from the end surface of the heat dissipation member to the stepped portions of the multiple external connection terminals can be absorbed, and it is possible to prevent the resin from penetrating into the insertion hole and covering the pin portions. In addition, it is also possible to absorb an excessive mold clamp load.

[0013] Here, it is preferable that the pressing members are movable pins arranged to be able to advance and retreat from the insertion holes, and that the movable pins have the ability to scrape out any resin that has seeped into the insertion holes. In this way, if resin has seeped into the insertion holes, the movable pins can be used to scrape out the resin inside the insertion holes, enabling automatic cleaning.

[0014] Furthermore, the resin sealing device of the present invention can have an elastic member that advances the multiple pressing members and biases the multiple pressing members one by one or in multiple. This makes it possible to press the step of the sleeve or the external connection terminal with an appropriate pressure. Furthermore, when biasing the multiple pressing members with one elastic member, it is possible to press the multiple pressing members collectively with the elastic member even if the pitch of the multiple pressing members is narrowed.

[0015] Furthermore, the resin sealing device of the present invention preferably has a release film stretched over either or both of the bottom surface of the cavity recess of the first mold and the bottom surface of the cavity recess of the second mold. This makes it possible to further prevent the resin from penetrating between the end surfaces of the sleeves or between the step portions of the external connection terminals and the pressing members, or into the end surfaces of the heat dissipation members. Furthermore, even if excessive pressure is applied to the electronic component by the clamping of the mold, the thickness and elasticity of the release film make it possible to absorb the excessive pressure. Effect of the Invention

[0016] (1) A resin sealing device for resin-sealing an electronic component having a substrate on one end surface of which are provided a plurality of sleeves each having holes for providing a plurality of external connection terminals approximately vertically, and a heat dissipation member on the other end surface of the substrate, the resin sealing device having a mold for clamping the electronic component using a first mold and a second mold each having a cavity recess, the mold including a plurality of pressing members each arranged to be able to advance and retreat from a plurality of through holes formed in a bottom surface of the cavity recess of the first mold and each abutting and pressing against the end surfaces of the plurality of sleeves, the resin being filled in a state in which the pressing members each advance from the plurality of through holes and abut against and press the end surfaces of the plurality of sleeves, and the heat dissipation member is abutted against the bottom surface of the cavity recess of the second mold, and the mold is molded so that the end surfaces of the plurality of sleeves and the end surfaces of the heat dissipation member are exposed. By providing the external connection terminals in the holes of the plurality of sleeves after molding, it is possible to obtain a resin-sealed product in which the external connection terminals of the electronic component are exposed, using fewer materials and with fewer manufacturing steps. In addition, the height variation from the end face of the heat dissipation member to each end face of the multiple sleeves can be absorbed, and the infiltration of resin into the holes of the sleeve can be prevented, resulting in a high-quality resin-sealed product. Furthermore, the excessive mold clamp load can also be absorbed, preventing damage to electronic components and improving quality.

[0017] (2) A resin sealing device for resin-sealing an electronic component having a plurality of external connection terminals, each of which has a step at its tip and a pin portion thinner than the step at the tip of the step, standing substantially vertically on one end surface of a substrate, and a heat dissipation member disposed on the other end surface of the substrate, the device being a mold for clamping the electronic component using a first mold and a second mold, each of which has a cavity recess, the first mold having insertion holes into which the pin portions of the plurality of external connection terminals are respectively inserted, the first mold having a plurality of through holes formed in a bottom surface of the cavity recess, each of which is disposed so as to be freely advanced and retreated from a plurality of through holes formed in a bottom surface of the cavity recess, and the first mold has insertion holes into which the pin portions of the plurality of external connection terminals are respectively inserted with the pin portions inserted into the insertion holes. According to the resin sealing device having a mold in which the pins of the external connection terminals and the end faces of the heat dissipation member are exposed by filling the resin with the mold in which the pressing members advance from the through holes to press the stepped portions of the external connection terminals, and the heat dissipation member is in contact with the bottom surface of the cavity recess of the second mold, a resin sealing product in which the external connection terminals are exposed can be obtained with fewer materials and manufacturing steps, and the process of erecting the external connection terminals in the holes of the sleeve after molding can be eliminated. In addition, the variation in height from the end face of the heat dissipation member to the stepped portions of the external connection terminals can be absorbed, and the resin can be prevented from entering the insertion hole and covering the pins, so that a high-quality resin sealing product can be obtained. Furthermore, the mold can absorb an excessive clamp load, so that damage to electronic components can be prevented and the quality can be improved.

[0018] (3) The multiple pressing members are movable pins arranged to be able to advance and retreat from the insertion holes. By having the movable pins to scrape out resin that has entered the insertion holes, if resin enters the insertion holes, the resin in the insertion holes can be scraped out by the movable pins to automatically clean the holes, thereby reducing the work of cleaning the mold.

[0019] (4) The elastic member causes the multiple pressing members to advance, and the configuration has an elastic member that biases the multiple pressing members one by one or in multiples, so that the step portions of the sleeve and the external connection terminal can be pressed with an appropriate pressure, and the electronic component is not damaged by excessive force. Also, when biasing multiple pressing members with one elastic member, it is possible to narrow the pitch of the multiple pressing members even in electronic components with narrow pitches of the sleeve and the external connection terminals.

[0020] (5) By providing a release film stretched over either or both of the bottom surface of the cavity recess of the first mold and the bottom surface of the cavity recess of the second mold, it is possible to further prevent the resin from penetrating between the end surfaces of the sleeves or between the step portions of the external connection terminals and the pressing members, or into the end surface of the heat dissipation member. Even if excessive pressure is applied to the electronic component by clamping the mold, the thickness and elasticity of the release film can absorb the excessive pressure, preventing damage to the electronic component and further improving quality. [Brief description of the drawings]

[0021] [Figure 1] 1 is a schematic configuration diagram showing a main part of a resin sealing apparatus according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a diagram showing a state after the mold in FIG. 1 has been clamped. [Diagram 3] FIG. 11 is a schematic configuration diagram showing a main part of a resin sealing apparatus according to a second embodiment of the present invention. [Figure 4] FIG. 4 is a diagram showing a state after the mold in FIG. 3 has been clamped. [Diagram 5] FIG. 11 is a schematic configuration diagram showing a main part of a resin sealing apparatus according to a third embodiment of the present invention. [Figure 6] FIG. 6 is a diagram showing a state after the mold in FIG. 5 has been clamped. [Figure 7] FIG. 13 is a schematic configuration diagram showing a main part of a resin sealing apparatus according to a fourth embodiment of the present invention. [Figure 8] FIG. 8 is a diagram showing a state after the mold in FIG. 7 has been clamped. [Figure 9] FIG. 13 is a schematic configuration diagram showing a main part of a resin sealing apparatus according to a fifth embodiment of the present invention. [Figure 10] FIG. 10 is a diagram showing a state after the mold in FIG. 9 has been clamped. [Figure 11] FIG. 13 is a schematic configuration diagram showing a main part of a resin sealing apparatus according to a sixth embodiment of the present invention. [Figure 12] FIG. 12 is a diagram showing the state after the mold in FIG. 11 has been clamped. [Figure 13] FIG. 13 is a schematic configuration diagram showing a main part of a resin sealing apparatus according to a seventh embodiment of the present invention. [Figure 14] 14A to 14C are diagrams illustrating an operation state of the movable pin in FIG. 13. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] <Embodiment 1> FIG. 1 is a schematic diagram showing a main part of a resin sealing apparatus in a first embodiment of the present invention, and FIG. 2 is a diagram showing a state after the mold of FIG. 1 has been clamped.

[0023] As shown in Fig. 1, a resin sealing apparatus 1A in the first embodiment of the present invention seals an electronic component 10 with resin. In the electronic component 10, a plurality of sleeves 12 are provided on one end surface of a substrate 11, and a heat dissipation member 13 is provided on the other end surface. A power semiconductor chip (not shown) and the like are provided on the substrate 11. The sleeves 12 are provided with holes 12A for providing external connection terminals (not shown) substantially perpendicularly to the substrate 11. An example of the substrate 11 is a metal plate such as a lead frame.

[0024] The resin sealing apparatus 1A includes a mold 2 consisting of an upper mold 2A as a first mold and a lower mold 2B as a second mold. An electronic component 10 is clamped by the upper mold 2A and the lower mold 2B, and resin is filled into cavity recesses 3A and 3B, thereby sealing the electronic component with resin.

[0025] A plurality of through holes 4 are formed in the bottom surface 3A-1 of the cavity recess 3A of the upper mold 2A. A rod 5 as a pressing member is disposed in each of the through holes 4 so as to be able to move forward and backward. The outer diameter of an end surface 4A of the rod 5 is substantially the same as the outer diameter of an end surface 12B of the sleeve 12. The rods 5 are biased one by one by a spring 6 as an elastic member in a direction in which they advance from the through hole 4 into the cavity recess 3A. The rods 5 individually come into contact with the end surfaces 12B of the sleeve 12 and press the sleeve 12 so as to close the holes 12A of the sleeve 12.

[0026] In the above-mentioned resin sealing apparatus 1A, as shown in FIG. 2, when the electronic component 10 is clamped and closed by the upper mold 2A and the lower mold 2B, the multiple rods 5 protruding from the multiple through holes 4 of the upper mold 2A abut against and press the end faces 12B of the multiple sleeves 12, respectively, and the end face 13B of the heat dissipation member 13 abuts against the bottom surface 3B-1 of the cavity recess 3B of the lower mold 2B.

[0027] Filling the resin in this state prevents the resin from penetrating between the end faces 12B of the sleeves 12 and the rods 5, and the end faces 12B of the sleeves 12 and the end face 13B of the heat dissipation member 13 are exposed during molding, leaving the holes 12A of the sleeves 12 open. As a result, by providing external connection terminals (not shown) in the holes 12A of the sleeves 12 after molding, a resin-sealed product with exposed external connection terminals can be obtained.

[0028] In particular, in this resin sealing apparatus 1A, since end faces 12B of the multiple sleeves 12 are pressed individually by multiple rods 5, the variation in height from end face 13B of heat dissipation member 13 to each end face 12B of the multiple sleeves 12 can be absorbed and the infiltration of resin into holes 12A of sleeves 12 can be prevented, resulting in a high-quality resin sealing product. In addition, since an excessive mold clamp load can be absorbed by spring 6, damage to electronic components can be prevented and quality is improved.

[0029] In addition, in this resin sealing apparatus 1A, the outer diameter of the end face 4A of the rod 5 is approximately the same as the outer diameter of the end face 12B of the sleeve 12, so that no resin pressure is applied to the end face 4A of the rod 5 when the resin is filled into the cavity recess 3A. This prevents the rod 5 from being pushed up by the resin pressure, which would cause a gap to form between the rod 5 and the sleeve 12, thereby preventing resin leakage.

[0030] <Embodiment 2> Fig. 3 is a schematic diagram showing the main part of a resin sealing apparatus in a second embodiment of the present invention, and Fig. 4 is a diagram showing a state after the mold is clamped in Fig. 3. In the following, components common to the above-mentioned components are given the same reference numerals, and detailed description thereof will be omitted.

[0031] 3 and 4, in the resin sealing apparatus 1B in the second embodiment of the present invention, in addition to the resin sealing apparatus 1A in the first embodiment, a release film 20 is stretched over the upper mold 2A. The release film 20 covers at least the bottom surface 3A-1 of the cavity recess 3A of the upper mold 2A. By having this release film 20 adhere to the end surface 12B of the sleeve 12, it is possible to further prevent the resin from penetrating into the end surface 12B of the sleeve 12, thereby improving the quality.

[0032] Although not shown, a release film can also be applied to the lower mold 2B. In this case, the release film covers at least the bottom surface 3B-1 of the cavity recess 3B of the lower mold 2B. By having this release film 20 adhere to the end surface 13B of the heat dissipation member 13, the resin can be further prevented from penetrating into the end surface 13B of the heat dissipation member 13, improving the quality.

[0033] Furthermore, by stretching the release film in this manner, even if excessive pressure is applied to electronic component 10 by the clamping of mold 2, the thickness and elasticity of this release film makes it possible to absorb the excessive pressure. Therefore, damage to electronic component 10 can be prevented, further improving the quality.

[0034] <Embodiment 3> Fig. 5 is a schematic diagram showing the main part of a resin sealing apparatus in a third embodiment of the present invention, and Fig. 6 is a diagram showing a state after the mold is clamped in Fig. 5. In the following, components common to the above-mentioned components are given the same reference numerals, and detailed description thereof will be omitted.

[0035] 5 and 6, the resin sealing apparatus 1C in the third embodiment of the present invention is configured to press two sleeves 12 against one spring 6 via two rods 5. This makes it possible to accommodate electronic components with a narrow pitch between the sleeves 12 by narrowing the spacing between the rods 5. It is also possible to configure one spring 6 to press each of the sleeves 12 individually via three or more rods 5.

[0036] <Fourth embodiment> Fig. 7 is a schematic diagram showing the main part of a resin sealing apparatus in a fourth embodiment of the present invention, and Fig. 8 is a diagram showing a state after the mold is clamped in Fig. 7. In the following, components common to the above-mentioned components are given the same reference numerals, and detailed description thereof will be omitted.

[0037] 7 and 8, in a resin sealing apparatus 1D according to a fourth embodiment of the present invention, in addition to the resin sealing apparatus 1C according to the third embodiment, a release film 20 is stretched over the upper mold 2A. The release film 20 covers at least the bottom surface 3A-1 of the cavity recess 3A of the upper mold 2A. By having this release film 20 adhere to the end surface 12B of the sleeve 12, it is possible to further prevent the resin from penetrating into the end surface 12B of the sleeve 12, thereby improving the quality.

[0038] Although not shown, a release film can also be applied to the lower mold 2B. In this case, the release film covers at least the bottom surface 3B-1 of the cavity recess 3B of the lower mold 2B. By having this release film 20 adhere to the end surface 13B of the heat dissipation member 13, the resin can be further prevented from penetrating into the end surface 13B of the heat dissipation member 13, improving the quality.

[0039] <Fifth Preferred Embodiment> Fig. 9 is a schematic diagram showing the main part of a resin sealing apparatus in a fifth embodiment of the present invention, and Fig. 10 is a diagram showing a state after the mold is clamped in Fig. 9. In the following, components common to the above-mentioned components are given the same reference numerals, and detailed description thereof will be omitted.

[0040] 9 and 10, in a resin sealing apparatus 1E in the fifth embodiment of the present invention, instead of the multiple sleeves 12 of the resin sealing apparatus 1A in the first embodiment, multiple external connection terminals 50 are provided substantially perpendicularly to the substrate 11. The external connection terminals 50 have a step portion 50A at their tip portions, and a pin portion 50B thinner than the step portion 50A at the tip of the step portion 50A.

[0041] Further, each of the multiple through holes 4 provided in the cavity recess 3A of the upper mold 2A is provided with a rod 51 having an insertion hole 51A into which the pin portion 50B of the external connection terminal 50 is inserted, instead of the rod 5 in the first embodiment. The outer diameter of the end face 51B of the rod 51 is substantially the same as the outer diameter of the step portion 50A of the external connection terminal 50. With the pin portion 50B inserted into the insertion hole 51A, the rod 51 abuts against the step portion 50A of the external connection terminal 50, respectively, and presses the external connection terminal 50 so as to close the insertion hole 51A.

[0042] In the above-mentioned resin sealing apparatus 1E, as shown in FIG. 10, when the electronic component 10 is clamped and closed by the upper mold 2A and the lower mold 2B, the pin portions 50B of the multiple external connection terminals 50 are inserted into the insertion holes 51A of the multiple rods 51 protruding from the multiple through holes 4 of the upper mold 2A, and with the pin portions 50B inserted into the insertion holes 51A, the multiple rods 51 abut against and press against the step portions 50A of the multiple external connection terminals 50, respectively, with the heat dissipation member 13 abutting against the bottom surface 3B-1 of the cavity recess 3B of the lower mold 2B.

[0043] Filling the resin in this state prevents the resin from entering between the step portions 50A of the external connection terminals 50 and the rods 51, and the pin portions 50B and step portions 50A of the external connection terminals 50 and the end face 13B of the heat dissipation member 13 are exposed during molding. This makes it possible to obtain a resin sealed product in which the external connection terminals 50 are exposed from the beginning, without having to erect the external connection terminals in the holes 12A of the sleeve 12 after molding as in the resin sealing apparatus 1A of the first embodiment.

[0044] In particular, in this resin sealing apparatus 1E, the step portions 50A of the multiple external connection terminals 50 are individually pressed by the multiple rods 51, so that the variation in height from the end face 13B of the heat dissipation member 13 to the step portions 50A of the multiple external connection terminals 50 can be absorbed and the resin can be prevented from penetrating into the insertion holes 51A and covering the pin portions 50B, so that a high-quality resin sealing product can be obtained. In addition, the spring 6 can absorb an excessive mold clamp load, so that damage to the electronic components can be prevented and the quality is improved.

[0045] In addition, in this resin sealing apparatus 1E, the outer diameter of the end face 51B of the rod 51 is approximately the same as the outer diameter of the step portion 50A of the external connection terminal 50, so that resin pressure is not applied to the end face 51B of the rod 51 when the resin is filled into the cavity recess 3A. This prevents the rod 51 from being pushed up by the resin pressure, which would cause a gap to be generated between the rod 51 and the step portion 50A of the external connection terminal 50, thereby preventing resin leakage.

[0046] <Sixth embodiment> Fig. 11 is a schematic diagram showing the main part of a resin sealing apparatus in a sixth embodiment of the present invention, and Fig. 12 is a diagram showing a state after the mold is clamped in Fig. 11. In the following, components common to the above-mentioned components are given the same reference numerals, and detailed description thereof will be omitted.

[0047] 11 and 12, the resin sealing apparatus 1F in the sixth embodiment of the present invention is configured to press two external connection terminals 50 against one spring 6 via two rods 51. This makes it possible to accommodate electronic components with a narrow pitch between the external connection terminals 50 by narrowing the interval between the rods 51. It is also possible to configure the external connection terminals 50 to be individually pressed against one spring 6 via three or more rods 51.

[0048] <Embodiment 7> Fig. 13 is a schematic diagram showing the main part of a resin sealing apparatus in a seventh embodiment of the present invention, and Fig. 14 is a diagram showing the operation state of the movable pin in Fig. 13. In the following, components common to the components described above are given the same reference numerals, and detailed description thereof will be omitted.

[0049] 13, in the resin sealing apparatus 1G according to the seventh embodiment of the present invention, an insertion hole 51A of a rod 51 is provided penetrating the rod 51, and a movable pin 52 is provided so as to be able to advance and retreat from the insertion hole 51A. When the movable pin 52 is retracted into the insertion hole 51A, the movable pin 52 is in a position where it does not get in the way when the pin portion 50B of the external connection terminal 50 is inserted. On the other hand, when the movable pin 52 advances from the insertion hole 51A, the movable pin 52 advances to a position where it protrudes from an end face 51B of the rod 51 as shown in FIG.

[0050] As a result, if resin seeps into the insertion hole 51A, the movable pin 52 can be advanced to a position where it protrudes from the end face 51B of the rod 51 after molding, thereby scraping out the resin inside the insertion hole 51A and automatically cleaning it, thereby reducing the cleaning work of the mold 2. [Industrial Applicability]

[0051] The present invention relates to a resin sealing apparatus for resin-sealing electronic components, and is particularly suitable as a resin sealing apparatus for molding a power module using a power semiconductor chip as a resin-sealed product. [Explanation of symbols]

[0052] 1A,1B,1C,1D,1E,1F,1G Resin sealing equipment 2. Mold 2A upper mold 2B Lower mold 3A, 3B Cavity recess 4 Through holes 5 Rod 6. Spring 10. Electronic Components 11 Substrate 12 Sleeve 13 Heat dissipation materials 20 Release film 50 External connection terminal 50A stepped section 50B Pin section 51 Rod

Claims

1. A resin sealing device for resin-sealing an electronic component having a substrate on one end surface of which a plurality of sleeves are provided, the sleeves having holes for providing a plurality of external connection terminals substantially vertically, and a heat dissipation member on the other end surface of the substrate, the device comprising: A resin sealing device having a mold that clamps the electronic component using a first mold and a second mold, each of which has a cavity recess, and a plurality of pressing members that are arranged to be able to move freely back and forth in a plurality of through holes formed in the bottom surface of the cavity recess of the first mold, and the plurality of pressing members that advance from the plurality of through holes abut and press against the end faces of the plurality of sleeves respectively by the clamp, and the heat dissipation member abuts against the bottom surface of the cavity recess of the second mold, and resin is filled in such a state that the end faces of the plurality of sleeves and the end face of the heat dissipation member are exposed and molded.

2. A resin sealing device for resin-sealing an electronic component, the electronic component having a plurality of external connection terminals provided substantially vertically on one end surface of a substrate, the external connection terminals having step portions at their tip portions and pin portions at the tip of the step portions that are thinner than the step portions, and a heat dissipation member provided on the other end surface of the substrate, a mold for clamping the electronic component using a first mold and a second mold each having a cavity recess, the mold including a plurality of pressing members each arranged to be able to move back and forth in a plurality of through holes formed in a bottom surface of the cavity recess of the first mold, the pressing members having insertion holes into which the pin portions of the plurality of external connection terminals are respectively inserted, the pressing members abutting against and pressing against step portions of the plurality of external connection terminals when the pin portions are inserted into the respective insertion holes, the pressing members each protruding from the plurality of through holes abutting against and pressing against the step portions when the pin portions are inserted into the respective insertion holes by the clamp, and ...

3. 3. The resin sealing device according to claim 2, wherein the pressing members are movable pins arranged to be capable of moving forward and backward from the insertion holes, the movable pins having a function of scraping out resin that has entered the insertion holes.

4. 4. The resin sealing device according to claim 1, further comprising an elastic member for forcing the plurality of pressing members forward, the elastic member biasing the plurality of pressing members one by one or a plurality of the pressing members.

5. 4. The resin sealing device according to claim 1, further comprising a release film attached to either or both of a bottom surface of the cavity recess of the first mold and a bottom surface of the cavity recess of the second mold.

6. 5. The resin sealing device according to claim 4, further comprising a release film attached to either or both of a bottom surface of the cavity recess of the first mold and a bottom surface of the cavity recess of the second mold.

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