Wafer test cassette, wafer test system and wafer test method

Abstract

To provide a wafer test cassette that can reduce a point discharge phenomenon in a test program.SOLUTION: A wafer test cassette includes a first enclosure, a second enclosure, a first fluid port and a gas supply device. The first enclosure has a first magnetic member and the second enclosure has a second magnetic member. The second magnetic member is arranged to correspond to the first magnetic member. The first enclosure is closely jointed to the second enclosure to form a test space. The first enclosure includes a probe card, and the second enclosure supports a wafer. When the first enclosure is jointed to the second enclosure, a probe is electrically contacted with a solder pad of the wafer. The first fluid port is provided in the first enclosure or in the second enclosure, which is used to introduce external gas from the outside to the test space. After the test space receives the external gas, air pressure in the test space becomes higher than atmospheric pressure. Further provided are a wafer test system and a wafer test method.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a wafer test, and more particularly to a wafer test cassette, a wafer test system, and a wafer test method that suppress tip discharge of a probe. [Background technology]

[0002] When the design of an integrated circuit is completed, the wafer needs to undergo a pre-burn-in test and an electrical test. Conventionally, the wafer is subjected to the pre-burn-in and reliability test by using a test stand and a probe card for each wafer. Each wafer is placed on a carrier base and electrically contacted with the probes of the probe card to complete the test. Therefore, the more wafers there are, the more test stands and probe cards are required, and the test process requires more time and equipment costs.

[0003] In the existing technology, in order to improve the efficiency of the pre-burn-in test, a composite test unit system has been developed that can perform the pre-burn-in test on multiple wafers at the same time. The above-mentioned system has multiple test unit arrays in one test equipment, and each wafer is placed in each test unit array. Each test unit has at least one cassette to fix the wafer, and the wafer is subjected to the pre-burn-in test or electrical test through the test machine.

[0004] Meanwhile, in the recently developed wafer test cassette, the probe card and the wafer are pre-positioned and placed in the wafer test cassette, and the wafer test cassette is directly electrically connected to the test machine and placed in the test unit to perform the pre-burn test or the electrical test. The existing wafer test cassette uses a clip type or a vacuum type to connect the upper and lower housings. In the clip type, the fixing effect of the upper and lower housings is limited, and the force is not uniform, which may cause deformation. In addition, since the probe card performs the test at a high voltage during the test process, tip discharge is easily generated, which may result in damage to the probe card and the wafer.

[0005] Therefore, how to improve the use efficiency of the wafer test cassette through structural design improvement and overcome the above-mentioned shortcomings has become one of the important issues to be solved in this field. Summary of the Invention [Problem to be solved by the invention]

[0006] The technical problem that the present invention seeks to solve is to provide a wafer test cassette that addresses the shortcomings of existing technology. [Means for solving the problem]

[0007] The wafer test cassette includes a first housing and a second housing, the first housing having a first magnetic member and the second housing having a second magnetic member, and the second magnetic member is arranged corresponding to the first magnetic member, so that the first and second housings are tightly coupled to form a test space. The first housing includes a probe card, and the second housing supports a wafer, and when the first housing and the second housing are coupled, at least one probe is in electrical contact with at least one solder pad of the wafer. The first fluid port is installed in the first housing or the second housing and is used to introduce an external gas from the outside into the test space. In addition, the gas supply device has a first flow path, and the first flow path is connected to the first fluid port, and the gas supply device provides the external gas to the test space. After the test space receives the external gas, the air pressure in the test space becomes higher than atmospheric pressure. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram showing a wafer test cassette according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is another schematic view showing the wafer test cassette according to the first embodiment of the present invention. [Diagram 3] FIG. 11 is a schematic diagram showing a wafer test cassette according to a second embodiment of the present invention. [Figure 4] FIG. 13 is a schematic diagram showing a wafer test cassette according to a third embodiment of the present invention. [Diagram 5] FIG. 13 is a schematic diagram showing a wafer test cassette according to a fourth embodiment of the present invention. [Figure 6] FIG. 13 is a schematic diagram showing a wafer test cassette according to a fifth embodiment of the present invention. [Figure 7] FIG. 13 is a schematic diagram showing a wafer test cassette according to a sixth embodiment of the present invention. [Figure 8] FIG. 13 is a schematic diagram showing a wafer test cassette according to a seventh embodiment of the present invention. [Figure 9] 1 is a flowchart showing a wafer testing method according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Please refer to Figures 1 and 2. Figure 1 is a schematic diagram showing a wafer test cassette according to a first embodiment of the present invention. Figure 2 is another schematic diagram showing a wafer test cassette according to the first embodiment of the present invention.

[0010] The wafer test cassette 1A includes a first housing 11 and a second housing 12. A first magnetic member 111 is provided in the first housing 11, and a second magnetic member 121 is provided in the second housing 12. 1 and 2 show the wafer test cassette 1A of this embodiment from the perspective of a side view.

[0011] In this embodiment, the shape of the wafer test cassette 1A is rectangular, circular or other shapes, which can be adjusted according to actual needs, and is not limited thereto in the present invention.

[0012] The first magnetic member 111 is disposed around the first housing 11, and the second magnetic member 121 is disposed around the second housing 12. As shown in Fig. 1 and Fig. 2, the wafer test cassette 1A includes at least one pair of the first magnetic member 111 and the second magnetic member 121 corresponding to each other, and the first magnetic member 111 and the second magnetic member 121 in each pair are disposed correspondingly. That is, the position of the first magnetic member 111 in the first housing 11 corresponds to the position of the second magnetic member 121 in the second housing 12.

[0013] Please refer to Fig. 1. In this embodiment, the wafer test cassette 1A includes a first fluid port 11F1. The first fluid port 11F1 is installed in the first housing 11 or the second housing 12 and is used to introduce an external gas from the outside into the test space TS.

[0014] The first fluid port 11F1 is connected to a gas supply device 6. The gas supply device 6 has a first flow path 61, which is connected to the first fluid port 11F1, and the gas supply device 6 is used to supply an external gas to the test space TS.

[0015] In this embodiment, the external gas is normal air or an inert gas, including nitrogen, helium, neon, argon, krypton, etc. In some embodiments, the external gas is a mixed inert gas.

[0016] Furthermore, after the gas supply device 6 injects the gas into the test space TS, the pressure in the test space TS becomes higher than the external atmospheric pressure.

[0017] The gas supply device 6 injects gas into the test space TS, so that the internal pressure of the test space TS exceeds the external pressure. Therefore, the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 is set based on the air pressure value in the test space TS. That is, when either the first magnetic member 111 or the second magnetic member 121 is a permanent magnet, the strength of the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 is predetermined according to the air pressure to be supplied that is predicted in the test space TS.

[0018] When either the first magnetic member 111 or the second magnetic member 121 is a non-permanent magnet, the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 is strengthened by increasing the air pressure value in the test space TS. That is, the air pressure value in the test space TS can be adjusted according to actual needs, and the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 can be flexibly adjusted accordingly.

[0019] In this embodiment, the first housing 11 is magnetically connected to the test end T1 by an electrical connection port 118, and the second housing 12 is magnetically connected to the carrier base SB.

[0020] Furthermore, in this embodiment, the wafer test cassette 1A includes only one first fluid port 11F1, and the external gas provided by the gas supply device 6 is only injected, and there is no other passage for discharging. Therefore, when the first housing 11 and the second housing 12 are separated, the air pressure is naturally released, and the injected external gas naturally dissipates.

[0021] The present invention further provides a wafer test system including a wafer test cassette 1A and a pressure transducer 18. The pressure transducer 18 is used to detect the pressure in the wafer test cassette 1A (test space TS). The wafer test system also includes a discharge transducer 17. The discharge transducer is used to monitor whether the probe 1121 in the wafer test cassette 1A generates a tip discharge. According to a specific embodiment, the pressure transducer 18 detects the current pressure value in the test space TS. The discharge transducer 17 monitors whether the probe generates a tip discharge, and if no tip discharge occurs, the system maintains the current pressure value in the test space TS. If a tip discharge occurs, the system controls the wafer test cassette 1A to inject an external gas into the test space TS. The pressure value in the test space TS can suppress the tip discharge of the probe. Furthermore, in some embodiments, the magnetic attraction force between the first housing 11 and the second housing 12 is increased to further improve the pressure value in the test space TS and improve the tip discharge state of the probe. In some embodiments, the wafer test system also includes a control circuit, which is connected to the discharge transducer and the barometric pressure transducer, respectively. When a tip discharge of the probe occurs, the control circuit calculates a pressure value required to suppress the tip discharge, and injects external gas into the test space TS so that the pressure value of the test space TS reaches the calculated pressure value. A more detailed description is provided below.

[0022] In this embodiment, the discharge transducer 17 is an optical transducer, and can transmit the monitoring image information or the monitoring signal to an analysis circuit (not shown) for analysis. The analysis circuit (not shown) can use the monitoring image information or the monitoring signal to perform analysis related to the magnitude and nature of the air pressure of the injected inert gas, the test program of the wafer test cassette 1A, the level of the probe voltage during the preheat program, the conditions and probability of tip discharge, and other big data.

[0023] Furthermore, a user or manufacturer can adjust the magnitude of the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 according to actual needs, such as by adjusting the installation positions of the first magnetic member 111 and the second magnetic member 121, or the selection of materials for the first magnetic member 111 and the second magnetic member 121, or the quantity of the first magnetic member 111 and the second magnetic member 121, or the strength of the magnetic force when the first magnetic member 111 and the second magnetic member 121 are electromagnets.

[0024] According to the present invention, by injecting an inert gas or nitrogen into the wafer test cassette 1A and making the pressure inside the wafer test cassette 1A higher than the pressure of the external environment, it is possible to suppress the occurrence of tip discharge (corona discharge).

[0025] 1 and 2, the first magnetic member 111 and the second magnetic member 121 are respectively disposed in the first housing 11 and the second housing 12. The periphery of the first housing 11 includes a first convex portion 11F extending downward. Similarly, the periphery of the second housing 12 includes a second convex portion 12F extending upward. In this embodiment, the first magnetic member 111 is disposed in the first convex portion 11F, and the second magnetic member 121 is disposed in the second convex portion 12F.

[0026] The first protrusion 11F and the second protrusion 12F are disposed to correspond to each other. When the first housing 11 and the second housing 12 are closely coupled to each other by the first magnetic member 111 and the second magnetic member 121, the first protrusion 11F is closely coupled to the second protrusion 12F.

[0027] A seal member 16 is installed between the first convex portion 11F and the second convex portion 12F of the wafer test cassette 1A. The seal member 16 may be configured as an O-ring. The seal member 16 is used to enhance the sealing after the first housing 11 and the second housing 12 are combined. The seal member 16 is installed around the test space TS and is associated with the test space TS defined by the first housing 11 and the second housing 12. In some embodiments, the seal member 16 is installed on the first convex portion 11F or the second convex portion 12F, but it can be adjusted according to actual requirements and is not limited in the present invention. When the first housing 11 and the second housing 12 are closely combined by the first magnetic member 111 and the second magnetic member 121, the first convex portion 11F of the first housing 11 and the second convex portion 12F of the second housing 12 are closely combined by the seal member 16.

[0028] In the embodiment shown in FIG. 1, a probe card 112 is installed in the first housing 11. The probe card 112 includes one or more probes 1121. When the first housing 11 and the second housing 12 are combined, the one or more probes 1121 protrude toward the second housing 12. Furthermore, in this embodiment, a wafer 13 is installed in the wafer test cassette 1A, and the second housing 12 carries the wafer 13. When the first housing 11 and the second housing 12 are combined, the one or more probes 1121 protrude into the second housing, and the probes 1121 make electrical contact with solder pads (test contact points) of the wafer 13.

[0029] In the present invention, the first magnetic member 111 and the second magnetic member 121 do not necessarily have to face each other. The present invention covers a fixed configuration in which the first housing 11 and the second housing 12 are coupled together by generating a magnetic attraction force between the first magnetic member 111 and the second magnetic member 12. Furthermore, in some embodiments, one of the first magnetic member 111 and the second magnetic member 121 is a non-permanent magnet (e.g., an electromagnet), and the other is a permanent magnet or a non-magnetic conductive material. For example, the conductive material is iron, cobalt, nickel, or the like.

[0030] In this embodiment, there may be a plurality of first magnetic members 111 and a plurality of second magnetic members 121. The number of the first magnetic members 111 and the number of the second magnetic members 121 are the same, but the present invention does not limit the number of the first magnetic members 111 and the second magnetic members 121.

[0031] Please refer to Fig. 3. Fig. 3 is a schematic diagram showing a wafer test cassette according to a second embodiment of the present invention.

[0032] The wafer test cassette 1B is similar to the wafer test cassette 1A of the first embodiment. The difference is that the gas supply device 6 includes a switch device 62, which is connected between the gas supply device 6 and the first fluid port 11F1. In this embodiment, the switch device 62 is a gas supply / pressure reduction switch device and is a two-way valve. When the gas supply device 6 supplies an external gas, the switch device 62 (two-way valve) is switched to the forward direction (only in, not out). When the test space TS is depressurized (gas in the space is discharged), the switch device 62 (two-way valve) is switched to the reverse direction (only out, not in). Therefore, the test space TS and the gas supply device 6 can be switched by the direction of the switch device 62, and the function of increasing the atmospheric pressure by using the gas supply device 6 to supply an external gas, or the function of depressurizing by using the switch device 62 is realized. In this embodiment, the switch device 62 is connected to a control circuit (not shown) and the direction is switched through the control circuit (not shown).

[0033] According to some embodiments, the first fluid port 11F1 is a plurality (two or more), at least one of which is connected to a flow path connected to the aforementioned switch device 62 (e.g., a two-way valve). The operation of the two-way valve 62 is as described above.

[0034] Please refer to FIG. 4. FIG. 4 is a schematic diagram showing a wafer test cassette according to the third embodiment of the present invention. The wafer test cassette 1C is similar to the wafer test cassette 1A according to the first embodiment. The main difference is that the wafer test cassette 1C includes a plurality of first fluid ports 11F1. The plurality of first fluid ports 11F1 are installed on the first housing 11 or the second housing 12, respectively. Although the number of the first fluid ports 11F1 is two or more, the external gas provided from the gas supply device 6 only enters (is injected) and does not exit (is not discharged from the first fluid port 11F1), similar to the test space TS of the wafer test cassette 1A according to the first embodiment.

[0035] Please refer to Fig. 5. Fig. 5 is a schematic diagram showing a wafer test cassette according to a fourth embodiment of the present invention.

[0036] The wafer test cassette 1D is similar to the wafer test cassette 1B of the second embodiment, except that the wafer test cassette 1D includes a plurality of first fluid ports 11F1. The plurality of first fluid ports 11F1 are connected to a gas supply device 6 via a single switch device 62.

[0037] Similarly, in this embodiment, the switch device 62 is a gas supply / pressure switch device and a two-way valve. In a specific embodiment, the switch device 62 is connected to one of the first fluid ports 11F1, and when the gas supply device 6 supplies external gas, the switch device 62 (two-way valve) is switched to the forward direction (only in, not out). When the test space TS is depressurized (gas in the space is discharged), the switch device 62 (two-way valve) is switched to the reverse direction (only out, not in). Therefore, the test space TS and the gas supply device 6 can be switched by the direction of the switch device 62, and the function of increasing the atmospheric pressure by using the gas supply device 6 to supply external gas, or the function of depressurizing by using the gas supply device 6 is realized.

[0038] Similarly, the switch device 62 is connected to a control circuit (not shown) and effects directional switching through the control circuit (not shown).

[0039] Furthermore, in this embodiment, the first magnetic member 111 and the second magnetic member 121 are permanent magnets or non-magnetic conductive bodies, so that the magnetic force isolation component 19A is a magnetic barrier component and is movably installed in the second housing 12. The magnetic barrier component 19A in this embodiment is also applicable to the wafer test cassettes 1A-1C in the above-mentioned embodiments.

[0040] Please refer to Fig. 6. Fig. 6 is a schematic diagram showing a wafer test cassette according to a fifth embodiment of the present invention.

[0041] The wafer testing cassette 1E of this embodiment is similar to the wafer testing cassette 1A of the first embodiment, with the main difference being that the wafer testing cassette 1E includes a first fluid port 11F1 and a second fluid port 11F2.

[0042] The first fluid port 11F1 is connected to the gas supply device 6 and is used to inject gas provided from the gas supply device 6 into the test space TS of the wafer test cassette 1E. The second fluid port 11F2 is used to reduce the pressure in the test space TS and to exhaust the gas in the test space TS. According to the embodiment of FIG. 6, the gas supply device 6 has a second fluid flow path 65, and the second flow path 6 is connected to the second fluid port 11F2.

[0043] Furthermore, in this embodiment, since the first magnetic member 111 and the second magnetic member 121 are non-permanent magnets, the magnetic barrier component 19B is a control circuit and can adjust the magnetic attraction forces of the first magnetic member 111 and the second magnetic member 121. The magnetic barrier component 19B of this embodiment is also applicable to the wafer test cassettes 1A-1C of the previous embodiments.

[0044] Please refer to Fig. 7. Fig. 7 is a schematic diagram showing a wafer test cassette according to a sixth embodiment of the present invention.

[0045] Wafer testing cassette 1F is similar to wafer testing cassette 1E, with the main difference being that first fluid port 11F1 is connected to gas supply apparatus 6 through a first unidirectional switch device 63. Second fluid port 11F2 is connected to gas containment apparatus 7 through a second unidirectional switch device 64.

[0046] When the gas supply device 6 supplies an external gas, the first unidirectional switch device 63 (unidirectional valve) is opened, and the external gas can be supplied to the test space TS of the wafer test cassette 1F from the gas supply device 6. At this time, the second unidirectional switch device 64 (unidirectional valve) is closed.

[0047] When the test space TS is depressurized (when the gas in the space is to be released), the first one-way switch device 63 (one-way valve) is closed and the second one-way switch device 64 is opened. At this time, the gas in the test space TS can be released to the gas containing device 7.

[0048] Please refer to Fig. 8. Fig. 8 is a schematic diagram showing a wafer test cassette according to a seventh embodiment of the present invention.

[0049] Wafer test cassette 1G is similar to wafer test cassette 1E, with the main difference being that first fluid port 11F1 is connected to gas supply 6 via first unidirectional switch device 63. Second fluid port 11F2 is connected to gas supply 6 via second unidirectional switch device 64.

[0050] When the gas supply device 6 supplies an external gas, the first unidirectional switch device 63 (unidirectional valve) is opened, and the external gas is supplied from the gas supply device 6 to the test space TS of the wafer test cassette 1G. At this time, the second unidirectional switch device 64 (unidirectional valve) is closed.

[0051] When the pressure in the test space TS is reduced (when the gas in the space is to be released), the first one-way switch device 63 (one-way valve) is closed and the second one-way switch device 64 is opened. At this time, the gas in the test space TS is released to the gas supply device 6.

[0052] It is clear that the present invention does not limit the number of the first fluid ports and the second fluid ports and their arrangement positions. The embodiments shown here are merely examples and do not imply technical limitations.

[0053] Please refer to FIG. 9. FIG. 9 is a flow chart showing a wafer test method according to an embodiment of the present invention. The wafer test method 100 includes a detection step S1, a monitoring step S2, and a control step S3. In the detection step S1, the air pressure value of the test space in the wafer test cassette is detected while the wafer test cassette is executing a test program. In the monitoring step S2, it is monitored whether the probe in the wafer test cassette is generating tip discharge. In the control step S3, the air pressure value of the test space is maintained or the air pressure value of the test space is increased based on the result of the monitoring step S2.

[0054] When the wafer test cassette performs a test at a high voltage, tip discharge is likely to occur between the probes. Therefore, the purpose is to solve the problem of tip discharge of the probes through the detection step S1, the monitoring step S2, and the control step S3. Specifically, in order to prevent tip discharge when performing a test at a high voltage, gas is introduced into the test space to increase the air pressure in the test space to suppress tip discharge. If tip discharge still occurs in the probe, it indicates that the air pressure in the test space in the wafer test cassette is insufficient. Therefore, the tip discharge of the probes is further suppressed by using a method of increasing the air pressure (e.g., injecting gas from the outside to strengthen the air pressure in the test space). If tip discharge does not occur in the probe, it means that the air pressure in the test space is suitable for the voltage at which the current probe detects the wafer, and at this time, the air pressure in the test space is maintained. In some embodiments, like the wafer test cassette of the first embodiment, when tip discharge is detected in the probe, the magnetic attraction force of the first and second housings can be strengthened to further increase the air pressure in the test space.

[0055] [Beneficial Effects of the Embodiments] One beneficial effect of the present invention is that the wafer test cassette, wafer test system and wafer test method provided by the present invention can increase the pressure of the injected inert gas by adjusting the magnetic attraction force. In particular, by increasing the atmospheric pressure inside the wafer test cassette to several times higher than the atmospheric pressure outside, it is possible to effectively and significantly reduce the tip discharge phenomenon during the test program, reduce damage to the probes of the probe card and reduce the test cost. [Explanation of symbols]

[0056] 1A, 1B, 1C, 1D, 1E, 1F, 1G Wafer Test Cassette 11 First Case 11F First protrusion 11F1 First fluid port 11F2 Second fluid port 111 First magnetic member 112 Probe Card 1121 Probe 118 Electrical connection port 12 Second housing 12F 2nd protrusion 121 Second magnetic member 13 Wafer 16 Sealing material 17 Discharge transducer 18 Barometric transducer 19A, 19B Magnetic Barrier Components 6 Gas supply equipment 61 First Channel 62 Switching Device 63 First unidirectional switch device 64 Second unidirectional switch device 7 Gas Containment Device F Magnetic attraction force T1 Test End TS Test Space SB Carrier Base S1-S3 Step

Claims

1. a first housing having a first magnetic member; a second housing having a second magnetic member disposed corresponding to the first magnetic member, and being closely coupled to the first housing to form a test space; a first fluid port disposed in the first housing or the second housing and used to introduce an external gas into the test space; a gas supply device having a first flow path connected to the first fluid port and used to supply the external gas to the test space; A wafer test cassette comprising: the first housing includes a probe card, the probe card including at least one probe, the second housing carries a wafer, and when the first housing and the second housing are mated, the at least one probe is in electrical contact with at least one solder pad of the wafer; After the test space receives the external gas, the air pressure in the test space is higher than the atmospheric pressure outside the wafer test cassette. A wafer test cassette comprising:

2. 2. The wafer test cassette of claim 1, wherein the external gas comprises an inert gas.

3. 2. The wafer test cassette of claim 1, wherein the magnetic attraction force between the first magnetic member and the second magnetic member is set based on the air pressure value in the test space.

4. 4. The wafer test cassette of claim 3, wherein the magnetic attraction force between the first magnetic member and the second magnetic member increases with increasing air pressure, and the pin pressure at which the probes make electrical contact with the solder pads of the wafer does not change.

5. 2. The wafer test cassette of claim 1, wherein the first housing is magnetically connected to a test end and the second housing is magnetically connected to a carrier base.

6. 2. The wafer testing cassette of claim 1, further comprising a switch device located between the first fluid port and the gas supply device and used to introduce or exhaust the external gas into or from the test space through the first flow path.

7. 2. The wafer testing cassette of claim 1, further comprising a second fluid port installed in the first enclosure or the second enclosure, connected to the gas supply device, and used to introduce the external gas into the test space or exhaust it from the test space.

8. 8. The wafer testing cassette of claim 7, wherein the gas supply has a second flow path, the second flow path being connected to the second fluid port.

9. 8. The wafer test cassette of claim 7, wherein the first fluid port and the second fluid port are used simultaneously to introduce the external gas into the test space or to exhaust the external gas from the test space, or one of the first fluid port and the second fluid port is used to introduce the external gas into the test space and the other is used to exhaust the external gas from the test space.

10. 2. The wafer test cassette of claim 1, wherein after the probe card and the wafer in the wafer test cassette complete a test program, the external gas is discharged and the first housing and the second housing are released from their tightly coupled state.

11. 2. The wafer test cassette of claim 1, further comprising a seal member, the seal member being located between the first enclosure and the second enclosure and enclosing the test space.

12. A wafer test cassette according to claim 1; a discharge transducer disposed in one of the first housing or the second housing and used to detect whether the probe is generating a tip discharge; an air pressure transducer for detecting an air pressure value in the test space; Equipped with A wafer test system comprising:

13. The wafer testing system of claim 12 further comprising a control circuit connected to the discharge transducer and the barometric pressure transducer, respectively.

14. a detection step of detecting an air pressure value of a test space in a wafer test cassette in which a test program is being executed; a monitoring step of monitoring whether a probe in the wafer test cassette is generating a tip discharge; a control step of maintaining or enhancing the air pressure value of the test space based on the results of the monitoring step; Includes A wafer test method comprising:

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