Pickup member, pickup jig and method for fabricating pickup member

Abstract

To provide a pickup member capable of picking up only the target element more easily than before.SOLUTION: A pickup member is a member having a base and a protrusion extending from the top surface of the base, picks up elements, and has an adhesive surface formed on a portion of the tip surface of the protrusion and a non-adhesive surface formed on the other portion of the tip surface of the protrusion.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a pickup member, a pickup jig, and a method for manufacturing a pickup member. [Background technology]

[0002] 2. Description of the Related Art In recent years, the chip size of light-emitting elements has been rapidly reduced, and there is an increasing demand for image display devices using micro LEDs (Light Emitting Diodes) having a chip size of several tens of μm square as pixels.

[0003] In display devices and light-emitting devices using such micro LEDs, the elements must be arranged with high precision on the substrate, but mounting defects such as misalignment can occur. Therefore, it is necessary to pick up and repair the mounted elements.

[0004] A conventional method for picking up such tiny elements involves pressing the convex portions of a stamp tool having a stamp layer in which convex portions made of an adhesive material are formed in a matrix pattern against the top surface of the element on the substrate, and then lifting the stamp tool to pick up only the target element (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2022-98290 Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention provides a pickup member, a pickup jig, and a method for manufacturing a pickup member that can pick up only an element to be picked up more easily than ever before. [Means for solving the problem]

[0007] The present invention provides a pick-up member for picking up an element, the pick-up member having a base and a convex portion extending from an upper surface of the base, the pick-up member comprising an adhesive surface formed on a portion of the tip surface of the convex portion and a non-adhesive surface formed on another portion of the tip surface of the convex portion. The present invention also provides a pickup tool comprising: a member for picking up a target element from a plurality of elements placed on a substrate, the member having a base and a convex portion extending from an upper surface of the base, the pickup member having an adhesive surface formed on a portion of the tip surface of the convex portion and a non-adhesive surface formed on another portion of the tip surface of the convex portion; and a support portion for supporting the pickup member. The present invention also provides a method for producing a pickup member, the method including the steps of: preparing a structure made of an adhesive material and having a convex portion; and forming a non-adhesive surface by subjecting the remaining area of ​​the tip surface of the convex portion to an adhesiveness-reducing treatment, except for a certain area of ​​the tip surface of the convex portion. Effect of the Invention

[0008] According to the present invention, it is possible to realize a pickup member, a pickup jig, and a method for manufacturing a pickup member that can pick up only a target element more easily than in the past. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is an explanatory diagram showing a schematic configuration of a transport device for a pickup jig according to a first embodiment of the present invention. [Diagram 2] FIG. 1 is an explanatory diagram showing a schematic configuration of a pickup jig according to a first embodiment of the present invention. [Diagram 3] 3 is an explanatory diagram showing an example of an arrangement of elements mounted on the substrate shown in Fig. 1. Fig. 3(A) shows an arrangement of elements arranged in a matrix on the surface of the substrate. Fig. 3(B) shows the arrangement of elements as viewed from the Y-axis direction of Fig. 3(A). [Figure 4] 4 is an explanatory diagram showing a state in which the pickup jig according to the first embodiment of the present invention has been moved above an element, as viewed from the Y-axis direction. FIG. [Diagram 5] 4 shows an example of the formation of an adhesive surface and a non-adhesive surface on the tip surface of a convex portion of a pickup member of a pickup jig according to a first embodiment of the present invention. [Figure 6] 10A to 10C show other examples of the formation of adhesive and non-adhesive surfaces on the tip surface of the convex portion of the pickup member of the pickup jig according to the first embodiment of the present invention. [Figure 7] 3A to 3C are explanatory diagrams showing an example of a method for producing a pickup member of the pickup jig according to the first embodiment of the present invention. [Figure 8] FIG. 11 is an explanatory diagram showing a schematic configuration of a pickup jig according to a second embodiment of the present invention. [Figure 9] 10A to 10C are explanatory views showing an example of a method for producing a pickup member of a pickup jig according to a second embodiment of the present invention. [Figure 10] FIG. 11 is an explanatory diagram showing a schematic configuration of a pickup jig according to a modified example of the second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present invention will now be described in more detail with reference to the accompanying drawings. The following description is illustrative in all respects and should not be construed as limiting the present invention.

[0011] <<First embodiment>> A schematic configuration of a conveying device 3, a pickup jig 100, and a pickup member 1 according to a first embodiment of the present invention will be described with reference to Figs. 1 to 7. In the following description, the three axes of the Cartesian coordinate system are the X-axis, the Y-axis, and the Z-axis, which are parallel to a horizontal plane and perpendicular to each other, and the Z-axis is parallel to a direction (vertical direction) perpendicular to the XY plane consisting of the X-axis and the Y-axis. In the example of Fig. 1, the positive and negative directions of the X-axis correspond to the right and left directions on the horizontal plane, respectively, the positive and negative directions of the Y-axis correspond to the front and back directions on the horizontal plane, respectively, and the positive and negative directions of the Z-axis correspond to the downward and upward directions in the vertical direction, respectively. The X-axis, Y-axis, and Z-axis are also shown in other figures.

[0012] FIG. 1 is an explanatory diagram showing a schematic configuration of a conveying device 3 for a pickup jig 100 according to a first embodiment of the present invention. The conveying device 3 in FIG. 1 is merely an example, and any mechanism for conveying the pickup jig 100 may be used as long as it can convey the pickup jig 100 to the substrate 20 and the substrate 22. As shown in FIG. 1, the conveying device 3 includes a substrate holding table 24 for detachably holding the substrate 20 and the substrate 22, a rail 31 extending in the X-axis direction, a rail 32 extending in the Y-axis direction, a holding unit 33 for holding the pickup jig 100, and an imaging camera 34 attached to the holding unit 33 for imaging the element 21 on the substrate 20. The rail 32 is provided so as to be movable in the X-axis direction along the rail 31, and the holding unit 33 and the imaging camera 34 are provided so as to be movable in the Y-axis direction along the rail 32. The conveying device 3 is connected to a control device 4 via a wired or wireless network 5. The control device 4 is not limited to being provided outside the conveying device 3, and may be incorporated in the conveying device 3.

[0013] The size of each element in Fig. 1 and the relative size relationships between each element are not necessarily drawn to scale, and are exaggerated and some parts are omitted or simplified for the sake of convenience. For example, the size of element 21 on substrate 20 in Fig. 1 is drawn much larger than its actual size for the sake of convenience. The same applies to the other figures.

[0014] The pickup jig 100 is transported in the X-axis direction along rails 31 by an X-axis direction drive mechanism (not shown), and is transported in the Y-axis direction along rails 32 by a Y-axis direction drive mechanism (not shown). A holder 33 that holds the pickup jig 100 transports the pickup jig 100 in the Z-axis direction by, for example, extending and contracting a cylinder in the vertical direction by a Z-axis direction drive mechanism (not shown). The control device 4 controls the X-axis direction drive mechanism, the Y-axis direction drive mechanism, and the Z-axis direction drive mechanism via a network 5.

[0015] The imaging camera 34 is used to capture images of the exterior of the elements 21 arranged on the substrate 20 at a predetermined observation magnification to check for the presence or absence of elements 21B that have been defectively mounted, such as damaged or misaligned. As shown in Fig. 1, the imaging camera 34 is provided on a holder 33 that is movable in the X-axis direction and the Y-axis direction along the rails 31 and 32, respectively, and is disposed at a position where it can capture an image of the elements 21 from above. The control device 4 controls the imaging camera 34 via the network 5.

[0016] The imaging camera 34 transmits image data of the element 21 on the board 20 obtained by imaging to the control device 4 via the network 5. The control device 4 performs image processing of the image data received from the imaging camera 34 to detect the element 21B that has become a mounting failure and identify its position coordinates (X coordinate, Y coordinate, and Z coordinate). More specifically, the X coordinate and the Y coordinate of the element 21B are coordinates indicating the center position of the upper surface of the element 21B, and the Z coordinate of the element 21B is coordinates indicating the height from the upper surface of the board 20 to the upper surface of the element 21B. The control device 4 controls the X-axis direction drive mechanism and the Y-axis direction drive mechanism to transport the pickup jig 100 to the position coordinates (X coordinate, Y coordinate) of the element 21B that has become a mounting failure. Next, the control device 4 controls the Z-axis direction drive mechanism to lower the tip surface 120 of the pickup member 1 of the pickup jig 100 to the Z coordinate in the positive direction of the Z axis and press it against the upper surface of the element 21B with a predetermined force. As described later, the tip surface 120 of the pickup member 1 of the pickup jig 100 has an adhesive surface 121. The adhesive surface 121 has an adhesive force stronger than that of the upper surface of the substrate 20. Therefore, when the pickup jig 100 is pressed against the upper surface of the element 21B with a predetermined force, the element 21B is adhered, and when the pickup jig 100 is lifted in this state, the element 21B can be peeled off from the substrate 22. Therefore, after the control device 4 adheres the upper surface of the element 21B to the adhesive surface 121, it controls the Z-axis direction drive mechanism to raise the pickup jig 100 in the negative direction of the Z axis, thereby making it possible to pick up the element 21B.

[0017] The picked up element 21B is transported onto the substrate 22 by the transport device 3. The upper surface of the substrate 22 has an adhesive force stronger than that of the adhesive surface 121. Therefore, when the pickup jig 100 is lowered and the picked up element 21B is pressed against the substrate 22 with a predetermined force, the element 21B can be peeled off from the pickup jig 100.

[0018] Fig. 2 is an explanatory diagram showing a schematic configuration of the pickup jig 100 according to the first embodiment of the present invention. The upper surfaces of the support part 10 and the base part 11 are approximately parallel to the XY plane consisting of the X-axis and the Y-axis. In Fig. 2, the surfaces of the support part 10 and the base part 11 on the positive side of the Z-axis (vertical downward direction) are referred to as the "upper surface", and the surfaces on the negative side of the Z-axis (vertical upward direction) are referred to as the "lower surface". As shown in FIG. 2, the pickup jig 100 according to the first embodiment of the present invention is composed of a base 11, a protrusion 12 extending in the Z-axis direction from the upper surface of the base 11, and a support 10 that supports the base 11.

[0019] The support 10 is made of a material having a rigidity and thickness such that it will not deform even if the tip surface 120 of the protrusion 12 is strongly pressed against the upper surface of the element 21B. The rigidity, etc. of the support 10 may be improved by chemical strengthening treatment, hardening treatment, etc. Examples of materials for the support 10 include glass such as float glass and quartz glass, plastic, metals such as aluminum, copper, and stainless steel, and ceramics. The lower surface of the base 11 is fixed to the upper surface of the support 10. The lower surface of the support 10 is fixed to the lower part of the holding part 33.

[0020] Materials for the base 11 and the protrusions 12 include, for example, adhesive materials such as silicone, acrylic, urethane, and natural rubber, and may be either natural or synthetic resins. When resin is used as the adhesive material, processing is easy, and since resin has elasticity in addition to adhesiveness, it is possible to realize a pickup jig 100 that can pick up the element 21B with a predetermined adhesive force when the tip surface 120 of the protrusions 12 is pressed against the upper surface of the element.

[0021] The base 11 and the protrusions 12 may be manufactured as a single unit by molding using a mold, or may be manufactured separately and then joined by an adhesive. In this case, the material of the base 11 and the material of the protrusions 12 do not necessarily need to be the same, and they may be made of different materials.

[0022] An adhesive surface 121 and a non-adhesive surface 122 are formed on the tip surface 120 of the protrusion 12. In FIG. 2, the area of ​​the non-adhesive surface 122 that has been treated to reduce adhesion is shown as a gray area surrounded by a dotted line. The non-adhesive surface 122 is formed in the area surrounding the adhesive surface 121 of the tip surface 120. Furthermore, it is formed in the side surface area of ​​the protrusion 12. That is, as shown in FIG. 2, the non-adhesive surface 122 is formed not only on the positive side and negative side of the X axis of the protrusion 12, but also on the positive side of the Y axis (front side of the paper) and the negative side of the Y axis (back side of the paper) not shown in FIG. 2. The same applies to other figures.

[0023] When tip surface 120 of protrusion 12 is pressed against the upper surface of element 21B with a predetermined force, the adhesive force between adhesive surface 121 of tip surface 120 of protrusion 12 and the upper surface of element 21B is stronger than the adhesive force between the upper surface of substrate 20 and the lower surface of element 21B, and thus element 21B can be separated from substrate 20. For substrate 20 and element 21, the surface on the side in the negative direction of the Z axis (vertically upward) is referred to as the "upper surface," and the surface on the side in the positive direction of the Z axis (vertically downward) is referred to as the "lower surface."

[0024] Fig. 3 is an explanatory diagram showing an example of an arrangement of elements 21 mounted on the substrate 20 shown in Fig. 1. Fig. 3(A) shows an arrangement of elements 21 arranged in a matrix on the surface of the substrate 20. Fig. 3(B) shows the arrangement of elements 21 when Fig. 3(A) is viewed from the Y-axis direction.

[0025] The substrate 20 is a support plate on which the element 21 is mounted, and may be, for example, a lighting substrate for an in-vehicle headlamp on which micro LEDs are arranged as light-emitting elements, or a substrate for a display device on which micro LEDs are arranged as pixels of each of the R, G, and B colors. In the example of Fig. 3, the substrate 20 is flat, but it may be a flexible substrate, a thin rigid substrate, or a rigid-flexible substrate on which the element 21 is mounted and then curved.

[0026] The type of element 21 is, for example, a light-emitting element such as a micro LED or a mini LED, but may also be a discrete semiconductor such as a transistor or a thyristor, or an integrated circuit such as an IC or an LSI. The element 21 is mounted on the substrate 20 via an adhesive or the like. The size of element 21 is not limited to a minute element such as a micro LED (approximately 100 μm square or less) or a mini LED (approximately 100 μm square to 200 μm square), but may be a larger chip LED (200 μm square to 5 mm square). The shape of element 21 is not limited to a square as shown in FIG. 3(A), but may be a rectangle or other shape.

[0027] The interval (mounting interval) between adjacent elements is not particularly limited, and is, for example, about 1 μm to 100 μm, but may be any other interval. In particular, the pickup jig 100 of the present invention is useful when the mounting interval is narrow, such as 20 μm or less. In the example of FIG. 3(A), the elements 21 are arranged in a matrix shape, but the arrangement is not limited to this, and may be, for example, a one-dimensional arrangement or other arrangement. In addition, the arrangement is not limited to an arrangement of the same type of elements 21, and may be an arrangement of any multiple types of elements 21, such as an arrangement in which three types of elements 21 corresponding to the pixels of each color of RGB are arranged in a predetermined pattern.

[0028] FIG. 4 is an explanatory diagram showing a state in which the pickup jig 100 according to the first embodiment of the present invention is moved onto a defectively mounted element 21B, as viewed from the Y-axis direction. For example, when a defectively mounted element 21B is found through visual inspection of element 21 by imaging camera 34, control device 4 records the position coordinates (X coordinate, Y coordinate, and Z coordinate) of the element, and causes conveying device 3 to move pickup jig 100 onto element 21B.

[0029] Then, the tip surface 120 of the protrusion 12 is pressed against the upper surface of the element 21B with a predetermined force. At this time, as will be described in detail later, if the adhesive force between the tip surface 120 and the upper surface of the element 21B is stronger than the adhesive force between the lower surface of the element 21B and the upper surface of the substrate 20, the pickup jig 100 can be lifted to pick up the element 21B.

[0030] However, if the entire surface of tip surface 120 of protrusion 12 is adhesive, there is a risk that when tip surface 120 is pressed against the upper surface of element 21B with a certain force, a normal element 21 arranged next to defectively mounted element 21B may also be picked up. This problem is more likely to occur as the size of the chip becomes smaller and the interval between adjacent elements becomes smaller.

[0031] As one method for avoiding such a problem, it is conceivable to fabricate the protrusion 12 so that the area of ​​the tip surface 120 of the protrusion 12 is smaller than the area of ​​the upper surface of the element 21B. In this case, in order to secure the minimum adhesive force required for picking up the element 21B, it is necessary to press the tip surface 120 of the protrusion 12 with a predetermined force against the upper surface of the element 21B. However, if the area of ​​the tip surface 120 of the protrusion 12 is small, the structure of the tip of the protrusion 12 cannot be maintained when a predetermined force is applied, and the protrusion 12 bends, and it becomes impossible to press the tip surface 120 of the protrusion 12 against the upper surface of the element 21B to a degree that can secure the minimum adhesive force required. Such a problem becomes prominent especially when the area of ​​the tip surface 120 of the protrusion 12 is several μm square or less.

[0032] In the present invention, the area of ​​the tip surface 120 of the protrusion 12 is made larger than the area of ​​the upper surface of the element 21B, and while the structure of the tip of the protrusion 12 is maintained against the pressure received from the upper surface of the element 21B when the tip surface 120 of the protrusion 12 is pressed against the upper surface of the element 21B, only a part of the tip surface 120 of the protrusion 12 is made into the adhesive surface 121 so that only the target element 21B can be picked up. That is, the adhesive surface 121 having adhesiveness is formed not on the entire surface of the tip surface 120 of the protrusion 12 but only on a partial area, and a non-adhesive surface 122 is formed in the area where the adhesive surface 121 is not formed.

[0033] Fig. 5 shows an example of the formation of an adhesive surface and a non-adhesive surface on the tip surface 120 of the convex portion 12 of the pickup member 1 of the pickup jig 100 according to the first embodiment of the present invention. In the example of Fig. 5(A), a rectangular adhesive surface 121 is formed in the central portion of the square tip surface 120 of the convex portion 12, and a non-adhesive surface 122 is formed in the surrounding area.

[0034] Here, it is desirable that the area of ​​the tip surface 120 of the convex portion 12 is larger than the area of ​​the upper surface of the element 21B to be picked up. In this way, the structure of the tip of the convex portion 12 is easily maintained when the tip surface 120 of the convex portion 12 is pressed against the upper surface of the element 21B, and when the tip surface 120 of the convex portion 12 is pressed against the upper surface of the element 21B, the entire upper surface of the element 21B fits within the tip surface 120 of the convex portion 12, so that the tip surface 120 of the convex portion 12 can be pressed against the entire upper surface of the element 21B with an even force, and the element 21B can be more reliably adhered to the tip surface 120 of the convex portion 12.

[0035] It is desirable that the area of ​​the adhesive surface 121 is approximately the same as the area of ​​the upper surface of the element 21B to be picked up, or smaller than the area of ​​the upper surface of the element 21B to be picked up, taking into account positioning errors and dimensional errors of the element 21B. In this way, when the tip surface 120 of the protrusion 12 is pressed against the upper surface of the element 21B, it is possible to reduce the possibility that a normal element 21 arranged next to the element 21B will be picked up together with the element 21B.

[0036] 5(B), the adhesive surface 121 is formed so that a part of the outer periphery of the rectangular adhesive surface 121 forms a part of the outer periphery of the tip surface 120 of the protrusion 12, and a non-adhesive surface 122 is formed in the remaining area. By forming the adhesive surface 121 in this manner, when the support part 10 is moved above the element 21B by the transport device 3, the midpoint of one side of the tip surface 120 including one side of the adhesive surface 121 can be positioned as the reference point RP, which makes it easier to align the position at the time of picking up when aligning the position using the imaging camera 34.

[0037] 5(C), the adhesive surface 121 is formed so that a part of the outer periphery of the rectangular adhesive surface 121 forms a part of the outer periphery of the tip surface 120 of the convex portion 12, and one corner of the rectangular adhesive surface 121 coincides with one corner of the tip surface 120 of the convex portion 12, and a non-adhesive surface 122 is formed in the other area. By forming the adhesive surface 121 in this manner, when the support portion 10 is moved above the element 21B by the conveying device 3, not only the midpoint of one side of the tip surface 120 including one side of the adhesive surface 121, but also the vertex of one corner of the tip surface 120 that coincides with one corner of the adhesive surface 121 can be positioned as the reference point RP, so that when the alignment is performed using the imaging camera 34, alignment at the time of picking up is facilitated.

[0038] In the example of Fig. 5(D), the adhesive surface 121 is formed so that the apex of one corner of the triangular adhesive surface 121 coincides with the apex of one corner of the tip surface 120 of the protrusion 12, and the non-adhesive surface 122 is formed in the other area. By forming the adhesive surface 121 in this manner, when the support unit 10 is moved above the element 21B by the transport device 3, the apex of one corner of the tip surface 120 that coincides with the apex of one corner of the adhesive surface 121 can be positioned as the reference point RP, which makes it easier to align the position at the time of picking up when aligning using the imaging camera 34. Note that the shape of the adhesive surface 121 is not limited to the above shape, and may be any shape such as a polygonal shape such as a pentagon or hexagon, a circle, an ellipse, or the like.

[0039] (Modification) FIG. 6 shows another example of the formation of the adhesive surface 121 and the non-adhesive surface 122 on the tip surface 120 of the protrusion 12 of the pickup member of the pickup jig according to the first embodiment of the present invention.

[0040] In the example of Fig. 6(A), the adhesive surface 121 is formed so that a part of the outer periphery of the adhesive surface 121, which has a corner at one end and a semicircle at the other end, forms a part of the outer periphery of the circular tip surface 120, and the non-adhesive surface 122 is formed in the remaining area. RP is a reference point for positioning. In this way, not only the shape of the adhesive surface 121 but also the shape of the tip surface 120 may be any shape such as a polygonal shape such as a hexagon, a circle, an ellipse, or the like.

[0041] 6(B), the adhesive surface 121 is formed such that a part of the outer periphery and one corner of the sector-shaped adhesive surface 121 respectively form a part of the outer periphery and one corner of the diamond-shaped tip surface 120, and the remaining area is formed with a non-adhesive surface 122. By forming the adhesive surface 121 in this manner, when the carrier device 3 moves the support part 10 above the element 21B, the apex of one corner of the tip surface 120 that coincides with one corner of the adhesive surface 121 can be positioned as the reference point RP, facilitating alignment during pick-up.

[0042] 6(C), the adhesive surface 121 is formed such that part of the outer periphery of the semi-elliptical adhesive surface 121 forms part of the outer periphery of the hexagonal tip surface 120, and the remaining area is formed as a non-adhesive surface 122. By forming the adhesive surface 121 in this manner, when the carrier device 3 moves the support part 10 above the element 21B, the midpoint of one side of the tip surface 120, including one side of the adhesive surface 121, can be positioned as a reference point RP, facilitating alignment during pick-up.

[0043] 6(D), the adhesive surface 121 is formed so that a vertex of one corner of the hexagonal adhesive surface 121 of the hexagonal tip surface 120 coincides with a vertex of one corner of the hexagonal tip surface 120, and a non-adhesive surface 122 is formed in the remaining area. By forming the adhesive surface 121 in this manner, when the carrier device 3 moves the support portion 10 above the element 21B, the vertex of one corner of the tip surface 120 that coincides with the vertex of one corner of the hexagonal adhesive surface 121 can be positioned as the reference point RP, facilitating alignment during pickup.

[0044] 7A and 7B are explanatory diagrams showing an example of a method for producing the pickup member 1 of the pickup jig 100 according to the first embodiment of the present invention. As shown in Fig. 7A, a structure having a base 11 and a protrusion 12 is prepared by molding an adhesive material (e.g., silicone resin, etc.) with a mold.

[0045] 7(B), a dummy chip (for example, element 21) is placed on the portion of tip surface 120 of protrusion 12 where adhesive surface 121 is to be left. Note that this is not limited to a dummy chip, and may be a mask or the like.

[0046] Next, as shown in Figure 7(C), as a stickiness reduction process, oxygen plasma generated in the plasma generation chamber is transported by downflow to the plasma processing chamber, and the oxygen plasma is irradiated onto the surface of the structure (in the Z direction) to oxidize the surface, thereby reducing the stickiness of the area not masked by the dummy chip.

[0047] By generating oxygen plasma by discharge and oxidizing the surface of the structure with plasma to form an oxide film on the surface, the adhesiveness of the surface can be efficiently reduced. For example, when silicone resin is used as the material of the structure, the surface of the structure can be oxidized by irradiating the surface of the structure with oxygen plasma to form a SiO2 film on the surface of the structure, and the adhesiveness of the surface of the structure can be efficiently reduced.

[0048] Alternatively, the adhesion reduction process may use ozone gas to reduce the adhesion of the area not masked by the dummy chip. When the structure is placed in ozone gas, the ozone is thermally decomposed, and the active oxygen atoms produced as a result cause an oxidation reaction on the surface of the structure to form an oxide film, thereby efficiently reducing the adhesion of the surface.

[0049] Also, high-concentration, high-temperature, and high-pressure ozone gas may be used, ethylene gas may be added to ozone gas, or ultraviolet light may be used in combination. As a result, ozone can be thermally decomposed more efficiently than in the case of using normal ozone gas, and active oxygen atoms can be generated more efficiently. For example, when silicone resin is used as the material of the structure, a SiO2 film can be formed on the surface by oxidizing the surface of the structure with active oxygen atoms generated from ozone gas by performing a tackiness reduction treatment in a high-temperature, high-pressure ozone atmosphere, and the tackiness of the surface of the structure can be efficiently reduced.

[0050] Finally, as shown in Fig. 7(D), when the dummy chip is removed from the tip surface 120 of the protrusion 12, a non-adhesive surface 122 is formed around the portion of the tip surface 120 that was masked by the dummy chip, and the pickup member 1 is completed with the adhesive surface 121 remaining in the masked portion. In this way, forming the adhesive surface 121 by leaving the adhesive surface 121 by masking or the like is also included in the formation of the adhesive surface of the present invention. Note that a mask may be provided on other than the tip surface 121 of the protrusion 12 and a treatment to reduce adhesion may be performed to make the other than the tip surface 121 of the protrusion 12 adhesive.

[0051] The area of ​​the tip surface 120 of the protrusion 12 may be larger than the area of ​​the upper surface of the element 21B to be picked up, and the area of ​​the adhesive surface 121 may be approximately the same as or smaller than the area of ​​the upper surface of the element 21B to be picked up. In this way, the structure of the tip of the protrusion 12 is easily maintained when the tip surface 120 of the protrusion 12 is pressed against the upper surface of the element 21B, and when the tip surface 120 of the protrusion 12 is pressed against the upper surface of the element 21B, the entire upper surface of the element 21B fits within the tip surface 120 of the protrusion 12, so that the entire upper surface of the element 21B can be pressed with an even force, and a pickup jig 100 that is unlikely to pick up a normal element 21 arranged next to the element 21B together with the element 21B can be realized. Note that the base 11 may be extended without having the protrusion 12.

[0052] In this way, even when minute elements 21 are arranged, a pickup member 1 can be realized that can pick up only the target element 21B more easily than in the past.

[0053] (Variation 1) As a first variant of the method for manufacturing the pickup member 1 of the pickup jig 100 according to the first embodiment of the present invention, a structure having a base 11 and a convex portion 12 may be prepared by molding a non-adhesive material, and then an adhesive sheet may be adhered with an adhesive to an area corresponding to the dummy chip on the tip surface 120 of the convex portion 12 to form an adhesive surface 121.

[0054] (Variation 2) As a second variant of the method for manufacturing the pickup member 1 of the pickup jig 100 according to the first embodiment of the present invention, a structure having a base 11 and a protrusion 12 may be prepared by molding an adhesive material into a mold, and then the entire surface of the structure may be irradiated with plasma or the entire surface of the structure may be oxidized using ozone gas to produce a non-adhesive structure, and an adhesive sheet may be adhered with an adhesive to an area corresponding to the dummy chip on the tip surface 120 of the protrusion 12 to form an adhesive surface 121.

[0055] (Variation 3) As a third variant of the method for manufacturing the pickup member 1 of the pickup jig 100 according to the first embodiment of the present invention, a structure having a base 11 and a protrusion 12 may be prepared by molding an adhesive material into a mold, and the entire surface of the structure may be irradiated with plasma or the entire surface of the structure may be oxidized using ozone gas, and then the oxide on a portion of the surface of the tip surface 120 of the protrusion 12 may be removed by mechanical polishing with an alumina abrasive or the like, or by treatment with hydrofluoric acid, to form an adhesive surface 121.

[0056] (Variation 4) In the present invention, the pickup jig 100 for picking up the defectively mounted element 21B has been described, but the pickup jig 100 may also be used as a mounting jig for mounting a normal replacement element in the position from which the defectively mounted element 21B was removed.

[0057] In this case, the material and area of ​​the adhesive surface 121 of the mounting pick-up jig 100 are set so that the adhesive force between the adhesive surface 121 and the upper surface of the replacement element is weaker than the adhesive force between the substrate 20 and the lower surface of the element. Then, after the replacement element is adhered to the adhesive surface 121, the mounting pick-up jig 100 is moved to the position where the defectively mounted element 21B was removed, and the replacement element is pressed and adhered onto the substrate 20, and when the pick-up jig 100 is pulled up, the replacement element remains adhered to the substrate 20.

[0058] In this manner, it is possible to realize a mounting pick-up jig 100 that can easily mount a replacement element at the position where the defectively mounted element 21B has been removed.

[0059] <<Second embodiment>> Next, a pickup jig 100B according to a second embodiment of the present invention will be described with reference to FIGS.

[0060] FIG. 8 is an explanatory diagram showing a schematic configuration of a pickup jig 100B according to a second embodiment of the present invention. As shown in FIG. 8, the pickup jig 100B according to the second embodiment of the present invention is the same as the pickup jig 100 according to the first embodiment in that it is composed of a base 11, a protrusion 12B extending from the upper surface of the base 11 in the Z-axis direction, and a support part 10 that supports the base 11. The difference from the first embodiment is that a tip surface 120B of the protrusion 12B is inclined at a predetermined inclination angle with respect to the upper surface of the base 11. Then, in the direction in which the protrusion 12B extends, an adhesive surface 121B is formed in a region (hereinafter also referred to as an edge region) including a part of the tip surface 120B farthest from the base 11, and a non-adhesive surface 122B is formed in the other region of the tip surface 120B.

[0061] 9A and 9B are explanatory diagrams showing an example of a method for producing a pickup member 1B of a pickup jig 100B according to a second embodiment of the present invention. As shown in Fig. 9A, a structure having a base 11 and a protrusion 12B with an inclined tip surface 120B is prepared by molding an adhesive material with a metal mold.

[0062] Next, as shown in FIG. 9(B), a dummy chip (for example, element 21B) is disposed in the edge region of tip surface 120B of protrusion 12B.

[0063] Next, as shown in FIG. 9C, as a stickiness reducing process, the surface of the structure is irradiated with plasma to reduce the stickiness of the area not masked by the dummy chip.

[0064] Finally, as shown in FIG. 9(D), when the dummy chip is removed from the convex portion 12B, a non-adhesive surface 122B is formed around the portion that was masked by the dummy chip, and the pickup jig 100B is completed with an adhesive surface 121B remaining in the masked portion.

[0065] By using the pickup jig 100B, the area of ​​contact with the element 21B is reduced, so that it is possible to increase the pressing strength when the tip surface 120B of the protrusion 12 is pressed against the upper surface of the element 21B with a predetermined force. Also, since the region farther from the adhesive surface 121B is farther from the upper surface of the substrate 20, it is possible to realize a pickup jig 100B that is less likely to pick up a normal element 21 arranged next to the element 21B together with the element 21B.

[0066] (Modification) Fig. 10 is an explanatory diagram showing a schematic configuration of a pickup jig 100B1 according to a modified example of the second embodiment of the present invention. As a modified example of the pickup jig according to the second embodiment of the present invention, as shown in Fig. 10, the tip surface 120B1 of the convex portion 12B1 may have a curved shape. In this case, when an adhesive surface 121B1 is formed in a region including a part of the tip surface 120B1 farthest from the base portion 11 in the extension direction of the convex portion 12B1 and a non-adhesive surface 122B1 is formed in the other region of the tip surface 120B1, the adhesive surface 121B1 becomes approximately parallel to the upper surface of the element 21B.

[0067] Therefore, when the tip surface 120B1 of the protrusion 12B1 is pressed against the upper surface of the element 21B with a predetermined force, the entire surface of the adhesive surface 121B1 comes into substantially uniform contact with the upper surface of the target element 21B. As a result, the tip surface 120B1 of the protrusion 12B1 can be pressed against the entire upper surface of the element 21B with a substantially uniform force, making it easy to pick up the element 21B.

[0068] Furthermore, since the area farther from adhesive surface 121B1 is further from the upper surface of substrate 20 along the curved surface, pickup jig 100B1 can be realized that makes it difficult to pick up normal element 21 arranged next to element 21B together with element 21B.

[0069] A preferred embodiment of the present invention includes a combination of any of the above-mentioned aspects. In addition to the above-mentioned embodiment, various modifications of the present invention are possible. These modifications should not be interpreted as not belonging to the scope of the present invention. The present invention should include all modifications within the scope and meaning equivalent to the claims. [Explanation of symbols]

[0070] 1, 1B, 1B1: Pick-up member, 3: Conveyor device, 4: Control device, 5: Network, 10: Support, 11: Base, 12, 12B, 12B1: Convex portion, 20, 22: Substrate, 21, 21B: Element, 24: Substrate holder, 31, 32: Rail, 33: Holder, 34: Imaging camera, 100, 100B, 100B1: Pick-up jig, 120, 120B, 120B1: Tip surface, 121, 121B, 121B1: Adhesive surface, 122, 122B, 122B1: Non-adhesive surface, RP: Reference point

Claims

1. A member for picking up an element, the member having a base and a protrusion extending from an upper surface of the base, an adhesive surface formed on a partial area of ​​the tip surface of the protrusion; a non-adhesive surface formed in another region of the tip surface of the protrusion; A pickup member comprising:

2. The pickup member according to claim 1 , wherein a part of the outer periphery of the adhesive surface forms a part of the outer periphery of the tip surface of the convex portion.

3. the shape of the tip surface of the protrusion and the shape of the adhesive surface are polygonal, 2. The pickup member according to claim 1, wherein at least one of the corners of the adhesive surface is formed at the same position as at least one of the corners of the tip surface of the protrusion.

4. the area of ​​the tip surface of the protrusion is larger than the area of ​​the top surface of the element to be picked up; 4. The pickup member according to claim 1, wherein the area of ​​the adhesive surface is substantially the same as or smaller than the area of ​​the upper surface of the element to be picked up.

5. a tip surface of the protrusion is inclined with respect to an upper surface of the base, 4. The pickup member according to claim 1, wherein the adhesive surface is formed in a region including a portion of a tip surface of the protrusion that is farthest from the base in a direction in which the protrusion extends.

6. A pick-up member for picking up a target element from a plurality of elements placed on a substrate, the pick-up member having a base and a protrusion extending from an upper surface of the base, the pick-up member having an adhesive surface formed on a partial area of ​​a tip surface of the protrusion and a non-adhesive surface formed on another area of ​​the tip surface of the protrusion; A support portion that supports the pickup member; A pickup jig equipped with

7. the area of ​​the tip surface of the protrusion is larger than the area of ​​the top surface of the element to be picked up; The pickup tool according to claim 6 , wherein an area of ​​the adhesive surface is substantially the same as an area of ​​an upper surface of the element to be picked up or is smaller than an area of ​​the upper surface of the element to be picked up.

8. A step of preparing a structure made of an adhesive material and having a protrusion; forming a non-adhesive surface by subjecting the tip surface of the protrusion to an adhesion reducing treatment on the remaining area except for a part of the tip surface; A method for making a pick-up member, comprising:

9. 9. The method for producing a pickup member according to claim 8, wherein the adhesion reducing treatment is a treatment for reducing adhesion in another region of the tip surface of the convex portion by irradiating the other region with plasma.

10. 9. The method for producing a pickup member according to claim 8, wherein the adhesion reducing treatment is a treatment for reducing adhesion of the other area by oxidizing the surface of the other area of ​​the tip face of the convex portion with ozone gas.

11. The method for producing a pickup member according to any one of claims 8 to 10, wherein the adhesive material is a resin.

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