Resin material supply device, resin material supply method, resin material supply program, resin molding manufacturing apparatus, and resin molding manufacturing method

Abstract

To provide a resin material supply device, a resin material supply method, a resin material supply program, a resin molding manufacturing apparatus, and a resin molding manufacturing method, which can suppress generation of variations in a coating amount of a liquid resin material on a predetermined path.SOLUTION: A resin material supply device for discharging a liquid resin material to an object along a predetermined path includes a storage part storing the resin material and having a discharge part for discharging the resin material, an extrusion member which is inserted into the storage part and extrudes the resin material from the discharge part, a moving mechanism for relatively moving the storage part in an in-plane direction of the surface of the object, with respect to the object, and a control part for performing control of the extrusion member and the moving mechanism, wherein the control part corrects a moving speed of the storage part, on the basis of a discharge amount per unit time of the resin material discharged from the storage part and a target discharge amount of the resin material per unit time.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a resin material supplying device, a resin material supplying method, a resin material supplying program, a resin molded product manufacturing device, and a resin molded product manufacturing method. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing a resin molded product by sealing a semiconductor substrate with a resin material. In this process, liquid resin material for sealing is applied onto a release film using a dispenser, and this is placed on the lower die of a molding die. Meanwhile, a semiconductor substrate before resin sealing is placed on the upper die of the molding die, and the die is clamped in this state. As a result, chips and the like mounted on the semiconductor substrate are resin-sealed in the cavity of the lower die, and a resin-sealed substrate is obtained. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-13023 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, the liquid resin material is applied to a predetermined path on a release film by discharging the liquid resin material from the dispenser and moving the dispenser in a horizontal direction. At this time, the movement speed of the dispenser is set to match the discharge speed of the liquid resin material to be discharged. However, since the viscosity and compressibility of the liquid resin material during the discharge of the dispenser vary due to, for example, temperature changes, it is not easy to apply the liquid resin material uniformly over the entire path. Therefore, there is a risk that the amount of the liquid resin material applied in the path varies, and the distribution of the amount of the liquid resin material applied on the release film varies.

[0005] The present invention has been made to solve this problem, and aims to provide a resin material supplying device, a resin material supplying method, a resin material supplying program, a resin molded product manufacturing device, and a resin molded product manufacturing method that can suppress variation in the amount of liquid resin material applied along a specified path. [Means for solving the problem]

[0006] The resin material supplying device of the present invention is a resin material supplying device for discharging liquid resin material along a predetermined path onto an object, and comprises a storage section for storing the resin material and having a discharge section for discharging the resin material, an extrusion member inserted into the storage section for extruding the resin material from the discharge section, a moving mechanism for moving the storage section relatively in the in-plane direction of the application surface relative to the object, and a control section for controlling the extrusion member and the moving mechanism, and the control section corrects the movement speed of the storage section based on the discharge amount per unit time of the resin material discharged from the storage section and a target discharge amount of the resin material per unit time.

[0007] The resin material supplying method of the present invention is a resin material supplying method in which a resin material is discharged along a predetermined path onto an object by a resin material supplying device having a storage section that stores liquid resin material and has a discharge section that discharges the resin material, an extrusion member that is arranged in the storage section and extrudes the resin material from the discharge section, a moving mechanism for moving the storage section, and a control section for controlling the extrusion member and the moving mechanism, the method comprising: a first step of setting a movement speed of the storage section and the path; a second step of detecting an amount of the resin material discharged per unit time when the storage section is moved relatively in an in-plane direction of the application surface of the object at the movement speed; and a third step of correcting the movement speed of the storage section based on the detected amount of the resin material discharged per unit time and a target amount of the resin material discharged per unit time, and the second and third steps are repeated until the storage section moves to the end point of the path.

[0008] The resin material supplying program of the present invention is a resin material supplying program that discharges the resin material along a predetermined path onto an object by a resin material supplying device having a storage section that stores liquid resin material and has a discharge section that discharges the resin material, an extrusion member that is arranged within the storage section and extrudes the resin material from the discharge section, a moving mechanism for moving the storage section, and a control section for controlling the extrusion member and the moving mechanism, and causes the control section to execute a first step of setting the movement speed of the storage section and the path, a second step of detecting the discharge amount of the resin material per unit time when the storage section is moved relatively in an in-plane direction of the application surface of the object at the movement speed, and a third step of correcting the movement speed of the storage section based on the detected discharge amount per unit time and a target discharge amount of the resin material per unit time, and repeats the second and third steps until the storage section moves to the end point of the path.

[0009] The apparatus for manufacturing a resin molded product according to the present invention has the above-mentioned resin material supplying device, and is equipped with a resin material supplying module that supplies liquid resin material onto a film using the resin material supplying device, and a press module equipped with an upper mold and a lower mold.The film to which the resin material has been supplied and a substrate are placed between the upper mold and the lower mold, and a resin molded product is manufactured in which the substrate is sealed with resin material by clamping the molds.

[0010] The manufacturing method of the resin molded product of the present invention is a method of manufacturing a resin molded product using the above-mentioned manufacturing apparatus for resin molded products, and includes the steps of supplying liquid resin material onto a film using a resin material supplying device, placing the film to which the resin material has been supplied and a substrate between the upper mold and the lower mold, and clamping the upper mold and the lower mold to manufacture a resin molded product in which the substrate is sealed with resin material. Effect of the Invention

[0011] According to the present invention, it is possible to suppress the occurrence of variations in the amount of liquid resin material applied along a predetermined path. [Brief description of the drawings]

[0012] [Figure 1] FIG. 2 is a plan view showing a resin molding apparatus; [Diagram 2] FIG. [Diagram 3] 4A to 4C are cross-sectional views showing the operation of the dispenser. [Figure 4] 4A to 4C are cross-sectional views showing the operation of the dispenser. [Diagram 5] FIG. [Figure 6] 4 is a plan view showing a coating path of a liquid resin material dispensed from a dispenser onto a release film. FIG. [Figure 7] 11 is a graph showing the relationship between the movement time and the movement distance of a dispenser. [Figure 8] 11 is a graph showing the relationship between the discharge time and the discharge amount of a liquid resin material. [Figure 9] FIG. 13 is a block diagram showing control of the moving speed of the dispenser. [Figure 10] 11 is a graph showing the relationship between the moving distance of the dispenser and the weight of the liquid resin material that has already been dispensed. [Figure 11] 10 is a flowchart showing a flow of supplying a liquid resin material. [Figure 12] 11 is a plan view showing another example of a coating path of a liquid resin material dispensed from a dispenser onto a release film. FIG. [Figure 13] 10 is a flowchart showing a flow of supplying a liquid resin material by dripping and draining. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of a resin material supplying device and a resin molding device including the same according to the present invention will be described with reference to the drawings. Fig. 1 is a schematic plan view of the resin material supplying device according to this embodiment. Note that the following description may be given according to the directions indicated in the drawings. However, the present invention is not limited to these directions.

[0014] <1. Overview of resin molding equipment> As shown in Fig. 1, the resin molding apparatus according to this embodiment includes a resin material supply module 2, a plurality of (three in this embodiment) press modules 3, a substrate module 4, a control unit 5, and a display unit 6. Each of the modules 2 to 4 can be independently attached or detached. Although the press module 3 in this embodiment is composed of three modules, it may be composed of one or more than two modules.

[0015] <1-1. Resin material supply module> The resin material supply module 2 has a resin material supply mechanism 21 that supplies liquid resin material for resin molding. Here, the liquid resin material includes not only a resin material that is liquid at room temperature (room temperature) but also a resin material that melts from a solid resin material into a liquid state when heated, and may be a thermoplastic resin material or a thermosetting resin material. A thermosetting resin material is liquid at room temperature, but its viscosity decreases when heated, and it polymerizes and hardens when further heated. The liquid resin material in this embodiment is preferably a thermosetting resin material with a relatively high viscosity that does not flow quickly at room temperature. The viscosity of the liquid resin material is preferably, for example, 100 to 200 Pa·s.

[0016] As shown in Fig. 1, the resin material supply mechanism 21 includes a table 21A on which a release film F is placed, a discharge mechanism 21B that discharges the resin material, and a weight detection unit 25. The table 21A is provided with a release film supply mechanism 22 that feeds the release film F wound on a reel and cuts and separates the release film F. The separated release film F is sucked and held on the upper surface of the table 21A by a suction mechanism. A frame-shaped member 21C is placed on the upper surface of the release film F (see Fig. 2). A space corresponding to a lower die cavity MC described later is formed in the frame-shaped member 21C.

[0017] As shown in Fig. 2, the discharge mechanism 21B has a dispenser 24. The dispenser 24 has a cartridge 240 in which a liquid resin material is accommodated, and a push-out member 244 for pushing out the liquid resin material accommodated in the cartridge 240. The push-out member 244 may be a so-called plunger. The cartridge 240 has a cylindrical outer tube 241 made of a hard material such as metal, a cylindrical inner tube 242 accommodated in the outer tube 241, made of an elastically deformable material such as plastic, and in which the liquid resin material is accommodated, and a lid body 243 disposed on the surface of the liquid resin material inside the inner tube 242.

[0018] The extrusion member 244 is configured to move in the vertical direction by the servo motor 28. There may be a gap between the extrusion member 244 and the inner tube 242, but the lid 243 provided on the cartridge 240 serves to seal the inner tube 242 so that the liquid resin material does not leak. The lid 243 is made movable in the axial direction of the inner tube 242 by being pressed by the extrusion member 244. A through hole 245 is formed in the lower part of the outer tube 241, and a lower end 249 of the inner tube 242 protrudes downward from the through hole 245. The lower end 249 of the inner tube 242 protruding from the outer tube 241 is provided with a discharge part 246 having a discharge port. The discharge part 246 may be formed by attaching a tube made of a soft material to the lower end 249. The liquid resin material is discharged from the discharge port of the discharge part 246 by pressing the lid 243 toward the discharge part 246 by the extrusion member 244. Also, a chuck 247 is provided at the discharge part 246 at the lower end part 249 of the inner cylinder 242 protruding from the outer cylinder 241. This chuck 247 is capable of pressing the discharge part 246 from the radially outward direction, thereby closing the discharge part 246. In other words, it is possible to stop the liquid resin material from being discharged from the discharge port.

[0019] When the extrusion member 244 moves downward, the liquid resin material is extruded from the discharge portion 246, and the liquid resin material is applied onto the release film F. The liquid resin material is applied to a path R on the release film F as shown in FIG. 6 described later, but generally, the liquid resin material stored in one cartridge 240 can be applied to a plurality of paths R. That is, the extrusion member 244 moves downward in the cartridge 240 a plurality of times by a predetermined distance, and the liquid resin material can be applied to one path R with one downward movement. Therefore, before the liquid resin material is used up, when the extrusion member 244 moves downward once and the application of the liquid resin material to one path R is completed, the liquid resin material remains in the cartridge 240. Therefore, pressure is applied to the remaining liquid resin material by the pushing member 244, and as a result, the liquid resin material remaining mainly in the lower end portion 249 of the inner tube 242 may be discharged from the discharge portion 246 even if the pushing member 244 has not moved downward. Hereinafter, this phenomenon may be referred to as dripping.

[0020] 4, when the discharge portion 246 of the lower end portion 249 of the inner cylinder 242 is pressed by the chuck 247, the liquid resin material remaining near the lower end portion 249 is pushed out and discharged onto the release film F (hereinafter, sometimes referred to as "draining"). The amount of the liquid resin material discharged by dripping and draining can be calculated in advance by conducting a characteristic test of the dispenser 24 in advance.

[0021] The dispenser 24 is configured to be freely movable in the horizontal direction (in-plane direction) and up-down direction, which is the placement surface of the release film F, by a moving mechanism having a servo motor or the like. More specifically, a flange 2411 protruding radially outward is provided at the upper end of the outer cylinder 241 of the cartridge 240, and a plurality of locking members 27 are locked to this flange 2411, thereby supporting the cartridge 240 from above. The locking members 27 are moved horizontally and up-down by the servo motor, thereby moving the cartridge 240. The push-out member 244 and the chuck 247 are also movable together with the cartridge 240. Alternatively, instead of the dispenser 24, the table 21A may be configured to be freely movable on a horizontal plane. That is, it is sufficient that the dispenser 24 can move on a horizontal plane relative to the release film F.

[0022] The resin material supplying module 2 has a resin material storage section 11 that stores a plurality of cartridges 240. When the liquid resin material is used up in the dispenser 24, the cartridge 240 of the dispenser 24 is replaced with a new cartridge.

[0023] The weight detection unit 25 includes a weight sensor (not shown) installed below the table 21A. The weight sensor may be a known load sensor, and measures the weight of the table 21A and the release film F, and the total weight of the liquid resin material supplied onto the release film F at predetermined time intervals (also referred to as unit time). The weight detection unit 25 detects the weight of the liquid resin material supplied per unit time by the difference between the total weight measured previously and the total weight measured this time using the weight sensor.

[0024] The resin material loader 12 is configured to be movable on rails between the resin material supply module 2 and the press module 3. The resin material loader 12 can hold the release film F to which the liquid resin material has been supplied by the resin material supply mechanism 21, and transport it to the press module 3.

[0025] <1-2. Press module> As shown in FIG. 5, the press module 3 is configured with a press frame in which a lower fixed platen 31 and an upper fixed platen 33 are integrated with a plate-like member 32. A movable platen 34 is provided between the lower fixed platen 31 and the upper fixed platen 33. The movable platen 34 is movable up and down along the plate-like member 32. A clamping mechanism 35 for moving the movable platen 34 up and down is provided on the lower fixed platen 31. The clamping mechanism 35 is configured with a pair of ball screws or the like. The clamping mechanism 35 clamps the mold M by moving the movable platen 34 upward, and opens the mold M by moving the movable platen 34 downward. The drive source of the clamping mechanism 35 is not particularly limited, but for example, an electric motor such as a servo motor can be used.

[0026] The upper mold UM and the lower mold LM as the molding mold M are arranged opposite to each other, and each is composed of a metal mold or the like. An upper heater plate 37 incorporating an upper heater 371 is arranged on the lower surface of the upper fixed platen 33, and the upper mold UM is attached below the upper heater plate 37. The upper mold UM is provided with a substrate setting section (not shown) for placing the substrate S. The substrate S on which a chip or the like is mounted is attached to the substrate setting section of the upper mold UM. A lower heater plate 36 incorporating a lower heater 361 is arranged on the upper surface of the movable platen 34, and the lower mold LM is provided on the lower heater plate 36. A suction mechanism is provided in the lower mold cavity MC, and this suction mechanism holds the release film F on which a liquid resin material is applied.

[0027] The mold clamping mechanism 35 clamps the molding die M, and heats the lower die LM with the lower heater plate 36. This hardens the liquid resin material in the lower die cavity MC. That is, with the pre-resin-sealing substrate Sa and the release film F placed between the upper die UM and the lower die LM, the mold clamping mechanism 35 clamps the molding die M. As a result, the chips mounted on the pre-resin-sealing substrate Sa (pre-molding substrate) are resin-sealed in the lower die cavity MC to become the resin-sealed substrate Sb (resin molded product).

[0028] <1-3. Circuit board module> As shown in FIG. 1, the substrate module 4 transports a pre-resin-sealed substrate Sa (pre-molding substrate) on which a chip before resin sealing is mounted, and transports a resin-sealed substrate Sb (resin molded product) after resin sealing. The substrate module 4 has a substrate loader 41, a first storage section 43 for storing the pre-resin-sealed substrate Sa, a second storage section 44 for storing the resin-sealed substrate Sb, and a substrate transfer section 45. The substrate transfer section 45 can move in the front-rear direction within the substrate module 4 and transfer the pre-resin-sealed substrate Sa to the substrate loader 41. The substrate transfer section 45 can receive the resin-sealed substrate Sb transported from the substrate loader 41. The substrate loader 41 moves horizontally within the substrate module 4 and each press module 3.

[0029] <1-4. Control unit> The control unit 5 is configured by a computer such as a PLC that controls the operation of the resin molding device. The control unit 5 has a storage unit configured by a HDD, SSD, etc., and this storage unit stores a program for executing resin molding in the resin molding device. Then, this program is executed by the CPU of the control unit 5, thereby performing resin molding including supplying a liquid resin material, which will be described later. The program can be transmitted to the control unit 5 via a dedicated line, an electric communication line such as the Internet, or provided to the control unit 5 by a storage medium 51 such as a CD-ROM, a DVD-ROM, or a memory card.

[0030] <1-5.Display section> The display unit 6 displays various states of the resin molding device and inputs information for operation, and is configured as a known liquid crystal display fixed to the housing of the substrate module 4 in a state visible from the outside, and the display is controlled by the control unit 5. The display unit 6 is configured as a touch panel that can be operated by pressing the display on the screen with a finger. The display unit 6 may also be configured as a display of an external desktop computer, notebook computer, tablet terminal, or the like connected via a network.

[0031] <2.Resin material supply method> Next, a method of supplying liquid resin material onto the release film F by the dispenser 24 in the resin material supply module 2 will be described. FIG. 6 is a plan view showing a route R of the dispenser. The dispenser 24 applies liquid resin material onto the release film F while moving horizontally above the release film F by the above-mentioned moving mechanism. As shown in FIG. 6, the dispenser 24 is set to proceed linearly from a starting point R1 to the right side, front side, left side, front side, right side in this order, and to stop at an end point R2. However, this route R is only an example, and the route may include a curve.

[0032] In this embodiment, as shown in FIG. 7, the target moving speed is set in the control unit 5 so that the dispenser 24 starts from the starting point R1 and arrives at the end point R2 at time Tg. Also, as shown in FIG. 8, the extrusion speed of the extrusion member 244 is set so that the dispenser 24 starts discharging the liquid resin material from the starting point R1 and completes discharging the target weight of the resin material at the end point R2. That is, the extrusion amount (or extrusion speed) of the extrusion member 244 is set in the control unit 5 so that a certain amount (hereinafter referred to as the target discharge amount) of the liquid resin material is discharged per unit time from time 0, and the discharge of the liquid resin material is completed at time Tg. This makes it possible to discharge a uniform amount of the liquid resin material over the entire length of the path R (liquid resin material with a uniform line width is applied). Note that FIG. 8 shows the relationship between the target time and the discharge amount of the liquid resin material by one movement of the extrusion member 244 corresponding to the application of the liquid resin material to one path R, and does not include the discharge amount of the liquid resin material related to the dripping and draining described above.

[0033] However, since the viscosity and compressibility of the liquid resin material vary depending on the temperature change during discharging, the liquid resin material may not be discharged uniformly from the discharge part 246 per unit time in accordance with the extrusion of the extrusion member 244. That is, there is a risk that the liquid resin material will not be discharged according to the graph shown in FIG.

[0034] Therefore, in this embodiment, the moving speed of the dispenser 24 is controlled as described below, so that a roughly uniform amount of liquid resin material is dispensed over the entire length of the path R.

[0035] Fig. 9 is a block diagram showing the control of the moving speed of the dispenser. As shown in Fig. 9, when the target moving speed of the dispenser 24 is input, the control unit 5 drives the servo motor of the moving mechanism accordingly, and moves the dispenser 24 in the horizontal direction along the path R. Then, the weight detection unit 23 detects the weight of the liquid resin material applied to the release film F every unit time (for example, every 0.1 to 0.5 seconds). When there is a difference between the detected discharge amount of the liquid resin material per unit time and the target discharge amount of the liquid resin material per unit time shown in Fig. 8, the control unit 5 changes the target value of the moving speed of the dispenser 24, and moves the dispenser 24 by the servo motor based on the new target value.

[0036] This point will be described with reference to FIG. 10. FIG. 10 is a graph showing the relationship between the moving distance of the dispenser and the weight of the liquid resin material already discharged. For example, when the detected amount of liquid resin material discharged per unit time is higher than the target amount of liquid resin material discharged per unit time (0 to L1 in FIG. 10), the moving speed of the dispenser 24 is controlled to be increased (L1 to L2 in FIG. 10). On the other hand, when the detected amount of liquid resin material discharged per unit time is lower than the target amount of liquid resin material discharged per unit time (L3 to L4 in FIG. 10), the moving speed of the dispenser 24 is controlled to be decreased (L4 to L5 in FIG. 10). That is, the control unit 5 changes the target value of the moving speed according to the difference between the detected amount of liquid resin material discharged per unit time and the target and target amount of liquid resin material discharged per unit time. The larger the difference between the detected amount of liquid resin material discharged per unit time and the target amount of liquid resin material discharged per unit time, the larger the change amount of the target value of the moving speed. On the other hand, when the difference between the detected amount of liquid resin material discharged per unit time and the target amount of discharged per unit time is small, the amount of change in the target value of the moving speed is also small. Thus, the control unit 5 controls the servo motor according to the changed target value of the moving speed. In this way, the control unit 5 performs feedback control on the moving speed of the dispenser 24 as shown in FIG.

[0037] The above control will be explained again with reference to the flow chart shown in Fig. 11. First, the total weight of the liquid resin material to be discharged and the movement time of the extrusion member 244 are set (step S1). Next, the movement speed and movement path (distance) of the dispenser 24 are set (step S2). That is, the settings shown in the graphs of Fig. 7 and Fig. 8 are performed. Note that steps S1 and S2 may be reversed.

[0038] When the setting is completed in this manner, the dispenser 24 is moved from the starting point R1 toward the end point R2 while discharging the liquid resin material (step S3). During this process, the control unit 5 detects the weight of the liquid resin material discharged per unit time by the weight detection unit 25 (step S4). Then, the control unit 5 judges whether there is a difference between the detected discharge amount of the liquid resin material per unit time and the target discharge amount, and if there is a difference (YES in step S5), the control unit 5 changes the movement speed of the dispenser 24 as described above (step S7). That is, the target movement speed of the dispenser 24 is newly set.

[0039] Thereafter, if there is no difference between the detected amount of liquid resin material discharged per unit time and the target amount of discharged resin (NO in step S5) and the dispenser 24 has moved to the end point R2 (YES in step S6), the process ends. On the other hand, if the dispenser 24 has not moved to the end point R2 (NO in step S6), steps S3 to S7 are repeated. In this manner, the liquid resin material is applied over the entire length of the set path R. Note that in step S5, the difference between the detected amount of liquid resin material discharged per unit time and the target amount of discharged resin is determined, and no difference can mean a case where the difference is completely zero, or a case where a small range of difference is set, and if the difference is within this range, the target movement speed of the dispenser 24 is not changed.

[0040] However, if the liquid resin material continues to be discharged from the discharge part 246 due to dripping and draining as described above even after the dispenser 24 stops at the end point R2, an excessive amount of the liquid resin material may be applied at the end point R2. Therefore, hereinafter, the control after the dispenser 24 stops at the end point R2 will be described with reference to the flowchart of FIG.

[0041] As described above, the amount of liquid resin material discharged by dripping and draining can be calculated in advance. Therefore, when the control unit 5 determines that the dispenser 24 has arrived at the end point R2 (YES in step S11), as shown in FIG. 13, the dispenser 24 is moved from the end point R2 along the path R toward the start point R1, and discharges the liquid resin material by dripping (step S12). Then, when the control unit 5 determines that the discharge of the liquid resin material by dripping is completed (YES in step S13), the chuck 247 is closed, and the liquid resin material is discharged by draining (step S14). Then, when the control unit 5 determines that the discharge of the liquid resin material by draining is completed (YES in step S15), the movement of the dispenser 24 is stopped (step S16), and the process is terminated. Therefore, during this movement, the liquid resin material is discharged from the dispenser 24 by dripping and draining. During this time, the control unit 5 can perform the control shown in steps S3 to S7 of FIG. 11 described above. However, it is also possible to control only the extrusion speed of the extrusion member 244 without performing such feedback control.

[0042] However, the control unit 5 adjusts the moving speed of the dispenser 24 so that the amount of liquid resin material discharged per unit time on the path R is less than the target discharge amount described above (for example, 1 / 2 or less of the target discharge amount). This is because the liquid resin material discharged by dripping and draining is discharged onto the path R where the liquid resin material has already been applied, and the liquid resin material is laminated in two layers. Therefore, in order to make the amount of liquid resin material applied on the path R as uniform as possible, it is necessary to reduce the discharge amount per unit length due to dripping and draining. Note that the liquid resin material discharged by dripping and draining can also be discharged to a location other than the path R.

[0043] <3. Features> Since the viscosity and compressibility of the liquid resin material vary depending on the temperature change during dispensing, it may not be discharged uniformly from the discharge section 246 per unit time according to the set extrusion of the extrusion member 244. Therefore, in the resin material supply module 2 according to this embodiment, the discharge amount per unit time of the liquid resin material discharged from the dispenser 24 is detected, and compared with a target discharge amount of the liquid resin material per unit time. If there is a difference between the two, the moving speed of the dispenser 24 is corrected.

[0044] For example, when the detected amount of liquid resin material discharged is higher than the target amount of liquid resin material discharged per unit time, the movement speed of the dispenser 24 is increased to reduce the amount of liquid resin material discharged per unit length on the path R. On the other hand, when the detected amount of liquid resin material discharged is lower than the target amount of liquid resin material discharged per unit time, the movement speed of the dispenser 24 is decreased to increase the amount of liquid resin material discharged per unit length on the path R. This makes it possible to suppress variations in the amount of liquid resin material applied over the entire path R.

[0045] In addition, other than the above-mentioned fluctuations in the viscosity and compressibility of the resin material, other factors may be considered as reasons why the liquid resin material is not discharged from the discharge portion 246 as set. For example, since the liquid resin material has a high viscosity and is a compressible fluid, it is possible that the liquid resin material is not discharged in the set amount even if the extrusion member 244 is moved at the set speed. In addition, if the inner tube 242 of the dispenser 24 is made of elastically deformable plastic, the inner tube 242 may be deformed, and the deformation of the inner tube 242 may prevent the liquid resin material from being discharged in the set amount. Therefore, various factors may be considered as reasons why the liquid resin material is not discharged as set, depending on the structure of the dispenser 24 and the composition of the liquid resin material. Therefore, as in this embodiment, it is effective to control the application amount of the liquid resin material to the path R by correcting the movement speed of the dispenser 24 based on the discharge amount per unit time of the liquid resin material discharged from the dispenser 24.

[0046] <4. Modifications> Although one embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. In addition, the gist of the following modifications can be appropriately combined. In addition, any of the following modifications can be combined with the configuration of the above embodiment.

[0047] (1) In the above embodiment, the liquid resin material is discharged by dripping and draining by moving the dispenser 24 from the end point R2 to the start point R1. However, since the discharge amount of the liquid resin material by dripping and draining can be calculated in advance, the above-mentioned feedback control can be performed while taking these discharge amounts into consideration. That is, the weight of the liquid resin material discharged per unit time by dripping and draining can also be detected, and the movement speed of the dispenser 24 can be set based on this. In this case, the extrusion member 244 completes one downward movement before arriving at the end point R2 of the path R, and then, while detecting the weight of the liquid resin material discharged by dripping and draining, the movement speed of the dispenser 24 is controlled so that the discharge is completed at the end point R2.

[0048] (2) The configuration of dispenser 24 is not particularly limited as long as liquid resin material is discharged by extrusion by extrusion member 244 and dispenser 24 is movable in the horizontal direction. Therefore, the container that stores liquid resin material and discharges it from discharge part 246 does not need to be composed of outer tube 241 and inner tube 242, and may be composed of a single container.

[0049] (3) In the above embodiment, the release film F is given as an example of an object to which the liquid resin material is applied, but the object is not limited to this, and can also be, for example, a wafer or a substrate on which electronic components are mounted. Therefore, the present invention can also be applied to cases where a liquid resin material is applied to these objects.

[0050] (4) In the above embodiment, when the liquid resin material dispensed from the dispenser is applied to the release film F, the amount of the liquid resin material dispensed is detected by a weight sensor (not shown) connected to the table 21A that supports it. However, this is not limited to this, and the amount of the liquid resin material dispensed can also be detected (or measured) by other methods. [Explanation of symbols]

[0051] 24 Dispenser 241 Outer cylinder (container) 242 Inner cylinder (container) 244 Extrusion parts 25 Weight detection unit 5. Control section

Claims

1. A resin material supplying device for discharging a liquid resin material along a predetermined path onto an object, comprising: a container that contains the resin material and has a discharge portion that discharges the resin material; an extrusion member that is inserted into the container and extrudes the resin material from the discharge portion; A moving mechanism for moving the container relative to the object in an in-plane direction of a surface of the object; A control unit for controlling the pushing member and the moving mechanism; Equipped with The control unit corrects the movement speed of the storage unit based on the amount of the resin material discharged from the storage unit per unit time and a target amount of the resin material discharged per unit time.

2. The resin material supplying device according to claim 1 , further comprising a weight detection unit that supports the object and detects a weight of the resin material discharged from the container per unit time.

3. The control unit is A first step of setting a moving speed and a path of the storage unit; a second step of detecting an amount of the resin material discharged per unit time when the container is moved at the moving speed; a third step of correcting a moving speed of the container based on the detected discharge amount per unit time and a target discharge amount of the resin material per unit time; Run The second step and the third step are repeated until the storage unit moves to the end point of the path. The resin material supplying device according to claim 2 .

4. A resin material supplying method for discharging a resin material along a predetermined path onto an object by using a resin material supplying device including: a container portion for storing a liquid resin material and having a discharge portion for discharging the resin material; a push-out member inserted into the container portion for pushing out the resin material from the discharge portion; a moving mechanism for moving the container portion; and a control portion for controlling the push-out member and the moving mechanism, A first step of setting a moving speed and a path of the storage unit; a second step of detecting an amount of the resin material discharged per unit time when the container is moved relatively in an in-plane direction of the surface of the object at the moving speed; a third step of correcting a moving speed of the container based on the detected discharge amount per unit time and a target discharge amount of the resin material per unit time; Equipped with The second step and the third step are repeated until the storage unit moves to the end point of the path. Resin material supply method.

5. A resin material supplying program for discharging a resin material along a predetermined path onto an object by a resin material supplying device including: a container having a container unit that contains a liquid resin material and has a discharge unit that discharges the resin material; an extrusion member that is disposed within the container unit and extrudes the resin material from the discharge unit; a moving mechanism that moves the container unit; and a control unit that controls the extrusion member and the moving mechanism, The control unit, A first step of setting a moving speed and a path of the storage unit; a second step of detecting an amount of the resin material discharged per unit time when the container is moved relatively in an in-plane direction of the surface of the object at the moving speed; a third step of correcting a moving speed of the container based on the detected discharge amount per unit time and a target discharge amount of the resin material per unit time; Run the command, The resin material supplying program repeats the second step and the third step until the storage unit moves to an end point of the path.

6. a resin material supplying module including the resin material supplying device according to any one of claims 1 to 3, the resin material supplying module supplying a liquid resin material onto a film by the resin material supplying device; A press module including an upper die and a lower die; Equipped with An apparatus for manufacturing a resin molded product, which places a film to which the resin material has been supplied and a substrate between the upper mold and the lower mold, and produces a resin molded product in which the substrate is sealed with the resin material by clamping the molds.

7. A method for manufacturing a resin molded product using the apparatus for manufacturing a resin molded product according to claim 6, comprising the steps of: supplying a liquid resin material onto a film by the resin material supplying device; placing the film to which the resin material has been supplied and a substrate between the upper mold and the lower mold; a step of clamping the upper mold and the lower mold to produce a resin molded product in which the substrate is sealed with the resin material; The method for producing a resin molded product includes the steps of:

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