Mold, resin molding device, and, method for producing resin mold

Abstract

To stably perform an operation of a movable pin at high accuracy, while suppressing deformation of a plate for a movable pin.SOLUTION: A mold includes an upper mold 2 having a recess 21 that forms a cavity C where resin material J is filled, a lower mold 3 arranged opposite to the upper mold 2 and clamped together with the upper mold 2, a movable pin plate 62 provided on the side opposite to the lower mold 3 with respect to the upper mold 2 and to which a movable pin 61 that can move back and forth within the recess 21 is fixed, multiple connecting rods 63 provided on the side of the movable pin plate 62 opposite to the upper mold 2, with one end fixed to the movable pin plate 62, a plate driving unit 64 that moves the movable pin plate 62 through the multiple connecting rods 63 so that the movable pin 63 can move back and forth within the recess 21, and multiple deformation suppression members 9 interposed between the upper mold 2 and the movable pin plate 62 to suppress deformation of the movable pin plate 62 relative to the upper mold 2.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product. [Background technology]

[0002] 2. Description of the Related Art As disclosed in Patent Document 1, there is a conventional resin molding apparatus that uses a movable pin that operates separately from a mold to fix and position a part, which is an object to be molded, placed in a cavity.

[0003] In this resin molding device, multiple movable pins are mounted on a mounting plate, and the mounting plate is configured to receive power from a power transmission mechanism to move the multiple movable pins simultaneously with the same stroke. Also, each movable pin slides in a guide hole provided in the mold to move back and forth within the cavity. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-084755 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when resin molding causes resin material to get into the guide hole, the sliding resistance between the movable pin and the guide hole increases, causing the mounting plate on which the movable pin is mounted to bend and deform, making it difficult to operate the movable pin stably and with high precision.

[0006] The present invention has been made to solve the above problems, and its main object is to suppress deformation of the movable pin plate while stably operating the movable pin with high precision. [Means for solving the problem]

[0007] That is, the molding die of the present invention is characterized in that it comprises a first die having a recess that forms a cavity into which a resin material is filled, a second die arranged opposite the first die and clamped together with the first die, a movable pin plate provided on the opposite side of the first die from the second die and having a movable pin fixed thereto that can move back and forth within the recess, a plurality of connecting rods provided on the opposite side of the movable pin plate from the first die and having one end fixed to the movable pin plate, a plate driving unit that moves the movable pin plate via the plurality of connecting rods so that the movable pins move back and forth within the recess, and a plurality of deformation suppression members provided between the first die and the movable pin plate and suppressing deformation of the movable pin plate relative to the first die. Effect of the Invention

[0008] According to the present invention configured in this manner, it is possible to suppress deformation of the movable pin plate, while allowing the movable pin to move stably with high accuracy. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic diagram showing a configuration of a resin molding apparatus according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a cross-sectional view showing a schematic configuration of a molding module according to the embodiment. [Diagram 3] 4 is a cross-sectional view showing a schematic configuration of a fixing mechanism for an upper mold according to the embodiment; FIG. [Figure 4] 4 is a plan view showing a positional relationship of a connecting rod and the like with respect to a resin molding region in the embodiment; FIG. [Diagram 5] 5A to 5C are cross-sectional views illustrating the behavior of the movable pin plate in the presence or absence of the distance defining member according to the embodiment. [Figure 6] 5A to 5C are cross-sectional views illustrating the behavior of the movable pin plate with and without the deformation suppressing member of the embodiment. [Figure 7]11 is a schematic diagram showing a change in the distance between an upper mold and a movable pin plate before and after mold opening begins in the embodiment. FIG. [Figure 8] 4 is a flowchart showing a method for manufacturing a resin molded product in the embodiment. [Figure 9] 4A is a cross-sectional view showing a molding material set and FIG. 4B is a cross-sectional view showing mold clamping in the embodiment. [Figure 10] 5A and 5B are cross-sectional views showing (c) protrusion of an upper movable pin and (d) injection of a resin material in the embodiment. [Figure 11] 13(e) is a cross-sectional view showing the movable pin being pulled back, and FIG. 13(f) is a cross-sectional view showing the completion of filling and curing of the resin material in the embodiment. [Figure 12] FIG. 10(g) is a cross-sectional view showing the movable pin ejection and start of mold opening in the same embodiment. [Figure 13] 10 is a cross-sectional view illustrating a schematic configuration of a deformation suppressing member in a modified embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0011] The molding die of technology 1 according to the present invention is characterized in that it comprises a first die having a recess that forms a cavity into which a resin material is filled, a second die arranged opposite the first die and clamped together with the first die, a movable pin plate provided on the opposite side of the second die with respect to the first die and having a movable pin fixed thereto that can move back and forth within the recess, a plurality of connecting rods provided on the opposite side of the movable pin plate with respect to the first die and having one end fixed to the movable pin plate, a plate driving unit that moves the movable pin plate via the plurality of connecting rods so that the movable pins move back and forth within the recess, and a plurality of deformation suppression members provided between the first die and the movable pin plate and that suppress deformation of the movable pin plate relative to the first die.

[0012] With this molding die, multiple connecting rods are connected and fixed to the movable pin plate, and multiple deformation suppression members are provided to suppress deformation of the movable pin plate relative to the first die. Therefore, even if the sliding resistance increases as the movable pin slides in the sliding hole formed in the first die, deformation of the movable pin plate can be suppressed, and the movable pin can be operated stably with high precision.

[0013] In addition to the configuration of the above-mentioned technology 1, the molding die of Technology 2 according to the present invention is preferably arranged so that the plurality of deformation suppression members are provided on the outside and inside of the resin molding area formed by the first die and the second die when viewed from the mold clamping direction. With this configuration, multiple deformation suppression members are provided on the outside and inside of the resin molding area where the deformation amount increases when the movable pin plate bends, so that deformation of the movable pin plate can be suppressed evenly in a balanced manner.

[0014] For example, when the movable pin is withdrawn from the recess and pulled back, the movable pin plate may be curved convexly toward the first mold due to the sliding resistance between the movable pin and the sliding hole formed in the first mold. In other words, the distance between the center and the end of the movable pin plate may change. Then, when multiple movable pins are provided on the movable pin plate, the amount of pulling back of each movable pin to the recess of the first mold varies. As a result, the quality of the resin molded product is adversely affected. In order to optimally solve this problem, it is desirable that the molding die of Technology 3 according to the present invention, in addition to the configuration of Technology 1 or 2 described above, the multiple deformation suppression members are fixed to the surface of the first die opposite the surface facing the second die, and contact the surface of the movable pin plate opposite the first die, thereby suppressing deformation of the movable pin plate. With this configuration, even if the sliding resistance of the movable pin to the slide hole increases, the deformation suppression member can suppress deformation of the movable pin plate. Also, when multiple movable pins are provided on the movable pin plate, the retraction amount of each movable pin to the recess of the first die can be made uniform, preventing deterioration of the quality of the resin molded product.

[0015] In addition to the configurations of any one of the above-mentioned techniques 1 to 3, the molding die of technology 4 according to the present invention desirably has a fixed portion that is inserted into a through hole formed in the movable pin plate and fixed to a surface of the first die opposite to the surface facing the second die, and a contact portion that is provided on the fixed portion and contacts a surface of the movable pin plate opposite the first die when the movable pin plate is deformed in a direction away from the first die. This configuration allows the multiple deformation suppression members to be easily configured, and also effectively suppresses deformation of the movable pin plate such that the movable pin plate is curved convexly toward the first die.

[0016] In the resin molding, at the stage of hardening the resin material, the movable pin is retracted from the recess. Then, the resin material hardens with the movable pin retracted from the recess. Therefore, as a specific embodiment for preventing a negative effect on the quality of the resin molded product, in addition to the configuration of any one of the above-mentioned techniques 1 to 4, the molding die of technique 5 according to the present invention preferably has the plurality of deformation suppressing members that suppress deformation of the movable pin plate relative to the first die when the movable pin is retracted from the recess.

[0017] In addition to the configuration of any one of the above-mentioned techniques 1 to 5, the molding die of technique 6 according to the present invention is preferably such that the multiple connecting rods are connected and fixed to the movable pin plate outside the resin molding area formed by the first die and the second die when viewed from the mold clamping direction. With this configuration, the connecting rods are outside the resin molding area and therefore outside the recesses of the first mold, and can be connected and fixed to the movable pin plate regardless of the position of the recesses of the first mold. Note that connecting and fixing the connecting rods outside the resin molding area makes the movable pin plate more susceptible to bending and deformation, but the provision of multiple deformation suppression members makes it possible to suppress deformation of the movable pin plate.

[0018] In addition to the configuration of any one of the above-mentioned techniques 1 to 6, the molding die of technique 7 according to the present invention desirably has the plate driving unit equipped with a movable plate to which the other ends of the multiple connecting rods are connected and fixed, and by moving the movable plate, the movable pin plate is moved via the multiple connecting rods. With this configuration, no gap is created between the plate driving portion and the movable pin plate, so that a plurality of connecting rods can be moved simultaneously with the same stroke.

[0019] In the configuration of the above-mentioned technique 7, for example, when the movable pin is inserted into the recess and protruded, the movable pin plate may be curved in a convex shape toward the opposite side to the first mold due to the sliding resistance between the movable pin and the sliding hole formed in the first mold. In other words, the distance between the center and the end of the movable pin plate may change. Then, when multiple movable pins are provided on the movable pin plate, the protrusion amount of each movable pin into the recess of the first mold varies. As a result, the position of the molding object varies in the cavity, which adversely affects the quality of the resin molded product. In order to suitably solve this problem, it is desirable that the mold of Technology 8 according to the present invention further includes, in addition to the configuration of Technology 7 described above, a distance determining member provided between the movable plate and the movable pin plate, which determines the distance between the movable plate and the movable pin plate. With this configuration, even if the sliding resistance of the movable pin against the sliding hole increases, the distance regulating member can suppress deformation of the movable pin plate. Also, when multiple movable pins are provided on the movable pin plate, the protrusion amounts of each movable pin against the recess of the first mold can be made uniform, the molding object can be accurately positioned in the cavity, and deterioration of the quality of the resin molded product can be prevented.

[0020] In addition to the configuration of any one of the above-mentioned techniques 1 to 8, the molding die of technique 9 according to the present invention preferably further includes a load sensor on at least one of the plurality of connecting rods for measuring a load applied to the connecting rod. With this configuration, by measuring the load applied to the connecting rod, it is possible to eliminate defects (e.g., damage to the first mold, damage to the deformation suppression member, etc.) caused by connecting a component whose dimensions or position change when the mold is opened (e.g., a support pillar or the first mold) to a component whose dimensions or position do not change (e.g., a deformation suppression member).

[0021] A resin molding apparatus according to a tenth aspect of the present invention is characterized in that it includes the molding die according to any one of the first to ninth aspects described above, and a clamping mechanism for clamping the molding die. With this resin molding device, the movable pins can be moved stably and with high precision while suppressing deformation of the movable pin plate, thereby improving the quality of the resin molded product.

[0022] Furthermore, a resin molding apparatus according to Technology 11 of the present invention is characterized in that it includes the molding die of Technology 9 described above, a mold clamping mechanism for clamping the molding die, and a control unit for controlling the plate driving unit so that the load obtained by the load sensor becomes a predetermined value when the molding die is opened by the mold clamping mechanism. This resin molding device can eliminate problems (e.g., damage to the first mold, damage to the deformation suppression member, etc.) caused by connecting a component whose dimension or position changes when the mold is opened (e.g., a support pillar or the first mold) to a component that does not change (e.g., a deformation suppression member).

[0023] In addition, the manufacturing method of a resin molded product of Technology 12 according to the present invention is a manufacturing method of a resin molded product using a molding die of any one of Technologies 1 to 9 described above, and is characterized by having a mold clamping process of clamping the first die and the second die, and a resin molding process of switching the movable pin from a state in which it protrudes into the recess to a state in which it is pulled back, and molding the resin into an object to be molded. This method for manufacturing a resin molded product can suppress deformation of the movable pin plate while allowing the movable pin to be moved stably and with high precision, thereby improving the quality of the resin molded product.

[0024] <One embodiment of the present invention> DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. Generally, the entire part of the resin molding device that can be replaced depending on the type of object to be molded is called the mold, but in the following, for ease of explanation, the part having the cavity or the part on which the object to be molded is placed is referred to as the mold. Also, in all of the drawings shown below, for ease of understanding, some parts are omitted or exaggerated as appropriate and schematic drawings are used. The same components are given the same reference numerals and explanations are omitted as appropriate.

[0025] <Overall configuration of resin molding equipment> The resin molding apparatus 100 of this embodiment resin-moldes a molding object W to which an electronic component (not shown) is connected, by transfer molding using a resin material J.

[0026] Here, the molding object W may be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a wiring board, a lead frame, or the like, with or without wiring. The resin material J for resin molding is, for example, a composite material containing a thermosetting resin, and the resin material J may be in the form of granules, powder, liquid, sheet, tablet, or the like. Furthermore, the electronic component (not shown) connected to the upper surface of the molding object W may be, for example, a bare chip or a chip sealed with resin.

[0027] Specifically, as shown in Fig. 1, the resin molding apparatus 100 includes, as its components, a supply module 100A that supplies a molding object W and a resin material J before molding, a molding module 100B that performs resin molding, and a storage module 100C that stores the molding object W after molding (hereinafter, a resin molded product P). The supply module 100A, the molding module 100B, and the storage module 100C can be attached to and detached from the other components, and can be replaced. Also, the number of each component can be increased, for example, to two or three molding modules 100B.

[0028] The supply module 100A is provided with a molding object supply section 11 which supplies the molding object W, a resin material supply section 12 which supplies the resin material J, and a transport device 13 (hereinafter, loader 13) which receives the molding object W from the molding object supply section 11 and transports it to the molding module 100B, and receives the resin material J from the resin material supply section 12 and transports it to the molding module 100B.

[0029] The loader 13 moves between the supply module 100A and the molding module 100B, and moves along a rail (not shown) provided between the supply module 100A and the molding module 100B.

[0030] As shown in Figures 1 and 2, the molding module 100B has a molding mold that forms a cavity C into which resin material J is filled, and has a first mold 2 (hereinafter, upper mold 2) and a second mold 3 (hereinafter, lower mold 3) arranged opposite each other, and a mold clamping mechanism 5 that clamps the upper mold 2 and the lower mold 3.

[0031] In this embodiment, the upper mold 2 and the lower mold 3 are respectively formed with recesses 21 and 31 for forming a cavity C. Here, the recess 21 formed on the mold surface of the upper mold 2, i.e., the surface facing the lower mold 3, and the recess 31 formed on the mold surface of the lower mold 3, i.e., the surface facing the upper mold 2, face each other, thereby forming the cavity C. The lower mold 3 is also provided with a resin injecting section 4 for injecting a resin material J into the cavity C. The upper mold 2 is held by an upper mold holder 101, which is fixed to an upper platen 102. The lower mold 3 is held by a lower mold holder 103, which is fixed to a movable platen 104 that is raised and lowered by a mold clamping mechanism 5.

[0032] The resin injection section 4 is formed in the lower die 3 and includes a pot 41 for accommodating the resin material J, and a transfer mechanism 42 having a plunger 421 provided at the bottom of the pot 41. The pot 41 is formed, for example, of a cylindrical member 43. The cylindrical member 43 is fitted into a through hole formed in the lower die 3.

[0033] The transfer mechanism 42 moves the plunger 421 while the upper die 2 and the lower die 3 are clamped, and injects the resin material J from the pot 41 into the cavity C. This transfer mechanism 42 pressure-feeds the resin material J, which has been heated and melted in the pot 41, into the cavity C by the plunger 421. Note that a resin passage (not shown) that connects the pot 41 and the cavity C is formed in the upper die 2 or the lower die 3. In addition, an air vent (not shown) is formed in the upper die 2 on the opposite side to the pot 41.

[0034] Then, when the plunger 421 is raised while the upper die 2 and the lower die 3 are clamped by the clamping mechanism 5, the molten resin material J is injected into the cavity C through the resin passage. As a result, the electronic components (not shown) of the molding object W accommodated in the cavity C are resin-sealed.

[0035] As shown in FIG. 1, the storage module 100C is provided with a storage section 14 for storing the resin molded product P, and a transport device 15 (hereinafter, unloader 15) for receiving the resin molded product P from the molding module 100B and transporting it to the storage section 14.

[0036] The unloader 15 moves between the molding module 100B and the storage module 100C, and moves along a rail (not shown) provided between the molding module 100B and the storage module 100C.

[0037] <Specific Configuration of Molding Module 100B> Next, a specific configuration of the molding module 100B of this embodiment will be described.

[0038] 2, the upper mold 2 and the lower mold 3 of the molding module 100B have a fixing mechanism 6 that fixes the molding object W by moving a movable pin 61 back and forth within the cavity C during resin molding. The fixing mechanism 6 is provided in each of the upper mold 2 and the lower mold 3. Since the fixing mechanism 6 of the upper mold 2 and the fixing mechanism 6 of the lower mold 3 have the same configuration, the following will explain the fixing mechanism 6 of the upper mold 2 and omit the explanation of the fixing mechanism 6 of the lower mold 3.

[0039] Specifically, as shown in Figure 3, the fixing mechanism 6 includes a movable pin plate 62 to which a movable pin 61 that can move back and forth within the recess 21 is fixed, a plurality of connecting rods 63 having one end fixed to the movable pin plate 62, and a plate drive unit 64 that moves the movable pin plate 62.

[0040] The movable pin plate 62 is provided on the opposite side of the upper mold 2 from the lower mold 3. Specifically, the movable pin plate 62 is provided between the upper mold 2 and the upper platen 102. The movable pin plate 62 is provided with a plurality of movable pins 61. The plurality of movable pins 61 slide in slide holes 2h1 formed penetrating the upper mold 2 in the thickness direction. Each slide hole 2h1 is connected to a recess 21 formed in the upper mold 2. When a plurality of movable pins 61 are moved forward and backward relative to one recess 21, a configuration is adopted in which a plurality of slide holes 2h1 are connected to one recess 21. The movable pin plate 62 corresponds to the shape of the upper mold 2 in a plan view (as viewed from the mold clamping direction), and in this embodiment, it has, for example, a rectangular shape as shown in FIG. 4.

[0041] The multiple connecting rods 63 are provided on the opposite side of the movable pin plate 62 from the upper die 2. Specifically, the multiple connecting rods 63 are provided penetrating the upper platen 102. Note that the upper platen 102 has through holes formed therein corresponding to the respective connecting rods 63.

[0042] As shown in FIG. 4, the multiple connecting rods 63 are connected and fixed to the movable pin plate 62 outside the resin molding region R formed by the upper mold 2 and the lower mold 3 in a plan view (as viewed from the mold clamping direction). The resin molding region R includes at least a region in which the cavity C of the upper mold 2 and the lower mold 3 is formed, and the outside of the resin molding region R is the outside of the cavity C. In this embodiment, the resin molding region R is substantially the same region as the molding object W placed in the molding die in a plan view, and the outside of the resin molding region R is the outside of the molding object W to be resin molded. The multiple connecting rods 63 are arranged at positions that are point symmetrical on the movable pin plate 62. Furthermore, the multiple connecting rods 63 are connected and fixed to both sides of the movable pin plate 62 that correspond to each other. In this embodiment, two connecting rods 63 are connected and fixed to each of the opposing short sides of the movable pin plate 62. Furthermore, in order for the movable pin plate 62 to move up and down while maintaining greater parallelism, it is preferable that the connecting rod 63 is provided near a position (plate moving section 642) to which the driving force from the plate driving section 64 described below is transmitted, when viewed from the mold clamping direction.

[0043] Here, the connection structure between one end of the connecting rod 63 and the movable pin plate 62 will be described.

[0044] In this embodiment, one end of the connecting rod 63 and the movable pin plate 62 are connected and fixed from the mold surface side of the upper mold 2, i.e., the parting line surface side, as shown in Fig. 3. Specifically, a through hole 2h2 is formed in the upper mold 2 outside the resin molding region R. This through hole 2h2 is formed at a position corresponding to the connecting rod 63.

[0045] One end of the connecting rod 63 is connected by a connecting member 7 inserted into the through hole 2h2 of the upper die 2. The connecting member 7 includes a bolt 71 and a collar 72 that regulates the amount of tightening of the bolt 71. As shown in the partially enlarged cross-sectional view of FIG. 3, the connecting member 7 is screwed into a female threaded hole 631 formed in one end of the connecting rod 63 through a through hole 62h1 formed in the movable pin plate 62, thereby connecting and fixing one end of the connecting rod 63 to the movable pin plate 62. Note that the reference numeral 73 denotes a washer. The collar 72 of the connecting member 7 has a tightening surface 7a that contacts the lower surface of the movable pin plate 62 (the surface facing the upper die 2). By screwing the bolt 71 of the connecting member 7 into the female threaded hole 631, the tightening surface 7a contacts the lower surface of the movable pin plate 62, and the upper surface of the movable pin plate 62 (the surface opposite to the upper die 2) is tightly attached to the lower end surface of one end of the connecting rod 63.

[0046] The plate driving portion 64 moves the movable pin plate 62 via a plurality of connecting rods 63 so that the movable pin 61 moves back and forth within the recess 21 .

[0047] Specifically, the plate driving unit 64 includes a movable plate 641 to which the other ends of the multiple connecting rods 63 are fixedly connected, and a plate moving unit 642 that moves the movable plate 641, as shown in FIG.

[0048] The movable plate 641 is provided on the opposite side of the upper platen 102 from the movable pin plate 62 (above the upper platen 102). The other ends of the multiple connecting rods 63 are connected and fixed to this movable plate 641.

[0049] The plate moving part 642 moves the movable plate 641 in the up-down direction (mold clamping direction). In this embodiment, it is provided above the movable plate 641 (on the opposite side of the connecting rod 63 with respect to the movable plate 641). The plate moving part 642 can be configured using, for example, a ball screw mechanism 642a. In this embodiment, a driving force from a driving motor 642b is transmitted to the ball screw mechanism 642a connected to the movable plate 641 by a transmission mechanism 642c such as a transmission belt. The plate moving part 642 may be configured using other actuators such as an air cylinder or a linear motor.

[0050] When the plate moving part 642 moves the movable plate 641 in the vertical direction, the movable pin plate 62 moves in the vertical direction via the multiple connecting rods 63 connected to the movable plate 641. As a result, the multiple movable pins 61 move forward and backward within the recess 21, and switch between a state in which they protrude into the recess 21 (an advanced state) and a state in which they are pulled back from the recess 21 (an withdrawn state).

[0051] <Distance regulation member 8> As shown in Figures 3, 4, and 5(a), the molding module 100B of this embodiment includes one or more distance defining members 8 that define the distance between the movable plate 641 and the movable pin plate 62. In this embodiment, multiple distance defining members 8 are provided.

[0052] 5(b), the movable pin plate 62 may be curved in a convex shape toward the opposite side to the upper die 2 due to the sliding resistance when the movable pin 61 enters the recess 21. In other words, the distance between the center and the end of the movable pin plate 62 changes, and the amount of protrusion of each movable pin 61 into the recess 21 varies.

[0053] This distance regulating member 8 suppresses bending of the movable pin plate 62 when the movable pin 61 is inserted into the recess 21. Specifically, the distance regulating member 8 suppresses the movable pin plate 62 from curving convexly upward (toward the opposite direction to the upper die 2) due to sliding resistance between the movable pin 61 and the sliding hole 2h1 formed in the upper die 2 when the movable pin 61 is inserted into the recess 21, so that each of the multiple movable pins 61 is positioned at the same position within the recess 21. This distance regulating member 8 ensures that the multiple movable pins 61 protrude the same amount within the recess 21.

[0054] The distance regulating member 8 is provided between the movable plate 641 and the movable pin plate 62. In order to suppress deflection, it is preferable that the distance regulating member 8 is provided inside the multiple connecting rods 63 when viewed from the mold clamping direction (see FIG. 4). More preferably, the distance regulating member 8 is provided closer to the portion where the recess 21 (cavity C) is formed when viewed from the mold clamping direction. Each distance regulating member 8 has a constant length and regulates a constant distance between the movable plate 641 and the movable pin plate 62 between one end face and the other end face in the axial direction.

[0055] The distance regulation members 8 are provided penetrating the upper platen 102, similar to the above-mentioned connecting rods 63. Note that the upper platen 102 has through holes formed therein corresponding to the respective distance regulation members 8. The distance regulation members 8 of this embodiment are connected and fixed to the movable plate 641, and are not connected and fixed to the movable pin plate 62, and function as so-called tension rods between the movable plate 641 and the movable pin plate 62. Note that the distance regulation members 8 do not have to be connected and fixed to the movable plate 641. Also, the distance regulation members 8 may be connected and fixed to the movable pin plate 62, not to the movable plate 641.

[0056] <Deformation suppression member 9> Furthermore, the molding module 100B of this embodiment further includes a plurality of deformation suppressing members 9 for suppressing deformation of the movable pin plate 62 relative to the upper mold 2, as shown in FIGS.

[0057] 6(b), when the movable pins 61 are withdrawn from the recesses 21 and pulled back, the movable pin plate 62 may be curved in a convex shape toward the upper die 2 due to the sliding resistance between the movable pins 61 and the sliding holes 2h1 formed in the upper die 2. In other words, the distance between the center and the ends of the movable pin plate 62 changes, causing variations in the amount of pulling back of each movable pin 61 relative to the recesses 21.

[0058] The deformation suppressing members 9 suppress bending of the movable pin plate 62 when the movable pin 61 is withdrawn from the recess 21. The plurality of deformation suppressing members 9 are provided between the upper die 2 and the movable pin plate 62.

[0059] As shown in FIG. 4, the plurality of deformation suppressing members 9 are provided in a well-balanced manner on the outer side and inner side of the resin molding region R formed by the upper mold 2 and the lower mold 3 when viewed from the mold clamping direction so as to appropriately suppress the deflection of the movable pin plate 62. The plurality of deformation suppressing members 9 are fixed to the surface of the upper mold 2 opposite to the mold surface, and contact the surface of the movable pin plate 62 opposite to the upper mold 2 to suppress the deformation of the movable pin plate 62. The plurality of deformation suppressing members 9 in this embodiment suppress the deformation of the movable pin plate 62 relative to the upper mold 2 in a state in which the movable pin 61 is retracted from the recess 21. As a result, the retracted position (retracted position) of each of the plurality of movable pins 61 relative to the recess 21 becomes the same. In other words, the deformation suppressing members 9 cause the plurality of movable pins 61 to be retracted by the same amount relative to the recess 21.

[0060] Specifically, as shown in the enlarged cross-sectional views of Fig. 3 and Fig. 6(a), the plurality of deformation suppressing members 9 have a fixing portion 91 fixed to a surface of the upper die 2 opposite to the die surface, and a contact portion 92 provided on the fixing portion 91 and contacting a surface of the movable pin plate 62 opposite to the upper die 2 when the movable pin plate 62 moves in a direction away from the upper die 2. In this embodiment, a through hole 62h2 into which the fixing portion 91 is inserted is formed in the movable pin plate 62, and the fixing portion 91 is fixed to the upper die 2 in a state where it is inserted into the through hole 62h2 of the movable pin plate 62. In addition, an accommodating recess 621 for accommodating the contact portion 92 is formed in an upper portion of the through hole 62h2.

[0061] Here, the contact portion 92 forms a flange portion at the upper end portion (the end portion opposite to the upper die 2) of the fixed portion 91, and in this embodiment, as shown in the enlarged cross-sectional view of FIG. 6(a), is constituted by an annular member 921 such as a washer fixed to the upper end portion of the fixed portion 91. The lower surface of this annular member 921 contacts the bottom surface of the accommodation recess 621, thereby suppressing deformation of the movable pin plate 62. Here, an upper end fixing portion 91a for fixing the annular member 921 is provided at the upper end portion of the fixed portion 91, and the movement of the movable pin plate 62 is restricted by the annular member 921 contacting the upper end fixing portion 91a. In this embodiment, the fixed portion 91 has a bolt 911 and a collar 912 provided around the bolt 911, and the upper end fixing portion 91a is constituted by the head portion of the bolt 911. In this configuration, the annular member 921 is fixed by being sandwiched between the collar 912 and the head portion of the bolt 911. The fixed portion 91 and the contact portion 92 may be an integral member.

[0062] Here, as shown in FIG. 3, a plurality of support pillars 10 are provided between the upper platen 102 and the upper mold 2 to keep the flatness of the upper mold 2 constant. As shown in FIG. 7(a), the support pillars 10 are contracted by clamping the upper mold 2 and the lower mold 3. The deformation suppressing member 9 functions when the movable pin 61 is pulled out of the cavity C (removed from the recess 21) while the upper mold 2 and the lower mold 3 are clamped. That is, when the movable pin 61 is pulled back from the cavity C to complete the filling of the resin material J, the movable pin plate 62 is in contact with the deformation suppressing member 9. Thereafter, when the mold is opened after the resin material J has hardened, the support pillars 10 are released from the contraction and expand to their original size, as shown in FIG. 7(b). As a result, the upper mold 2 descends relative to the upper platen 102 (movable pin plate 62). If this occurs, a large load will be applied to the contact portion 92 of the deformation suppressing member 9 as the support pillar 10 expands, and there is a possibility that the upper mold 2, the fixing portion 91, or the contact portion 92 will be damaged.

[0063] In order to solve the above problems, in this embodiment, as shown in Figures 3, 5 and 6, a load sensor LS that measures the load applied to the connecting rod 63 is provided on at least one of the multiple connecting rods 63. The controller CTL (see Figure 1) controls the plate driving unit 64 so that the load obtained by the load sensor LS becomes a predetermined value (zero in this embodiment). The predetermined value can be a value suitable for resin molding based on the type of the molding object W or the resin material J, and can be set to a value that does not damage the upper mold 2, the fixing portion 91 or the contact portion 92, for example.

[0064] Specifically, the force (pulling force accompanying the extension of the support pillar 10) applied to the connecting rod 63 when the upper mold 2 and the lower mold 3 are opened is measured by the load sensor LS, and the movable pin plate 62 is moved up and down so that the load measured by the load sensor LS becomes zero for a predetermined period from the start of mold opening. In other words, the movable pin plate 62 is moved toward the cavity C by the amount by which the movable pin plate 62 is pulled toward the cavity C, so that no load or a low load is applied. Here, the predetermined period from the start of mold opening is, for example, at least from the start of mold opening until the support pillar 10 extends and returns to its original size, and also at least from the start of mold opening until the mold surface of the upper mold 2 and the mold surface of the lower mold 3 are not in contact with each other. Note that the movable pin plate 62 may be moved up and down so that the load measured by the load sensor LS becomes a predetermined value (zero in this embodiment) from the start of mold opening to the completion of mold opening.

[0065] Additionally, the upper die 2 is provided with a plurality of ejector pins (not shown) for releasing the resin molded product P from the upper die 2 after resin molding. These ejector pins are provided to penetrate required locations of the upper die 2 so as to be movable up and down relative to the upper die 2, and are fixed to an ejector pin plate (not shown) provided on the upper side of the upper die 2. The ejector pin plate can be provided between the upper die 2 and the movable pin plate 62. In this case, the ejector pin plate has through holes formed therein through which the movable pin 61, connecting rod 63, connecting member 7, distance regulating member 8, deformation suppressing member 9, support pillar 10, etc. are inserted.

[0066] The ejector pin plate further has a return pin. When the mold is closed, the return pin comes into contact with the outside of the resin molding region R of the molding object W in the lower mold 3, thereby lifting the ejector pin plate relative to the upper mold 2. As a result, the ejector pins are retracted into the mold surface of the upper mold 2 when the mold is closed. On the other hand, when the mold is opened, as the lower mold 3 descends, the ejector pin plate descends relative to the upper mold 2, and the resin molded product P is released from the upper mold 2 by the ejector pins.

[0067] <Method of manufacturing resin molded product P> Next, a description will be given of the operation of the resin molding apparatus 100 of this embodiment and the method for manufacturing the resin molded product P. Note that the following operation is performed by, for example, a control unit CTL provided in the supply module 100A controlling each unit.

[0068] First, the molding material W and the resin material J are transported and set in the lower mold 3 opened by the loader 13 (step S1; setting molding material, see FIG. 9(a)). Specifically, the molding object W is aligned and placed on the lower mold 3, and the resin material J is supplied to the pot 41. In this embodiment, before placing the molding object W on the lower mold 3, the movable pin 61 of the lower mold 3 is protruded into the recess 31, and the movable pin 61 of the lower mold 3 supports the lower surface of the fixing portion of the molding object W. The movable pin 61 of the lower mold 3 is set to the same protruding amount in the recess 31 by the distance regulating member 8. Thereafter, the upper mold 2 and the lower mold 3 are clamped (step S2; clamping, see FIG. 9(b)).

[0069] Then, in a clamped state, the movable pin 61 of the upper die 2 is protruded into the recess 21 to bring the movable pin 61 into contact with the upper surface of the fixing portion of the work-piece W (step S3; protruding upper movable pin, see FIG. 10(c)). The movable pins 61 of the upper die 2 are set to the same protruding amount within the recess 21 by the distance regulating member 8. As a result, the work-piece W is sandwiched between the movable pin 61 of the lower die 3 and the movable pin 61 of the upper die 2, and positioned and fixed within the cavity C.

[0070] After the molding object W is positioned and fixed (with the movable pins 61 inserted into the recesses 21 and 31), the transfer mechanism 42 is controlled to inject the resin material J molten in the pot 41 into the cavity C by the plunger 421 (step S4; resin material injection, see FIG. 10(d)). After the resin material J is injected, the plate driver 64 moves the movable pin plate 62 out of the cavity C at an appropriate timing for molding. The movable pin plate 62 then comes into contact with the contact portion 92 of the deformation suppression member 9 and stops. As a result, the movable pins 61 are pulled back from the cavity C and stop at a predetermined position, and the movable pins 61 are in a state of being out of the recesses 21 and 31 (step S5; movable pin pull back, see FIG. 11(e)). Here, if the movable pin plate 62 is bent, the deformation is corrected by the deformation suppression member 9, so that the retracted positions of the movable pins 61 of the upper die 2 and the retracted positions of the movable pins 61 of the lower die 3 become the same.

[0071] The resin material J is also filled into the space formed after the movable pin 61 is pulled back, completing the filling of the resin material J into the cavity C (step S6; completion of filling of resin material). After that, as a predetermined curing time passes, the resin material J hardens and is molded into the molding object W (step S7; completion of curing of resin material, see FIG. 11(f)).

[0072] After a predetermined curing time has elapsed, the mold opening operation is started. Before the mold opening operation starts, the movable pin plate 62 is controlled to protrude the movable pin 61 into the cavity C (the movable pin 61 is caused to enter the cavity C) (step S8; movable pin protrusion, see FIG. 12(g)). Here, it is determined whether the load measured by the load sensor LS is equal to or greater than a predetermined value (zero in this embodiment) (step S9; movable pin load equal to or greater than predetermined value). Before the mold opening operation starts, the movable pin plate 62 is pulled back, so that the load measured by the load sensor LS is negative. When the load measured by the load sensor LS is zero, it is estimated that no load is applied to the movable pin plate 62 and the deformation suppressing member 9. Then, if the load measured by the load sensor LS is not equal to or greater than the predetermined value (NO in step S9), the plate driving unit 64 performs a protruding operation of the movable pin 61, and the load measured by the load sensor LS is equal to or greater than a predetermined value (see FIG. 12(g)). When the load measured by the load sensor LS reaches or exceeds a predetermined value (YES in step S9), the mold opening operation is started (step S10; mold opening start). Specifically, the lower mold 3 is lowered by the mold clamping mechanism 5.

[0073] During the mold opening operation, the plate driving unit 64 moves the movable pin plate 62 up and down so that the load measured by the load sensor LS becomes a predetermined value (zero in this embodiment) for a predetermined time (step S11; move the movable pin up and down so that the load of the movable pin becomes a predetermined value). In this way, the mold is opened while controlling the plate driving unit 64 so that the load measured by the load sensor LS becomes a predetermined value. The mold opening is completed by the lower mold 3 descending to the mold opening completion position (step S12; mold opening completed), and then the unloader 15 receives the resin molded product P from the lower mold 3 and transports it to the storage unit 14 (step S13; carry-out of the resin molded product), and the production of the resin molded product P is completed.

[0074] <Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, a plurality of connecting rods 63 are connected and fixed to the movable pin plate 62, and a plurality of deformation suppression members 9 are provided to suppress deformation of the movable pin plate 62 relative to the upper mold 2 and the lower mold 3. Therefore, even if the sliding resistance between the movable pin 61 and the sliding hole 2h1 formed in the upper mold 2 and the lower mold 3 increases, the deformation of the movable pin plate 62 can be suppressed, and the movable pin 61 can operate stably with high precision.

[0075] In this embodiment, since a plurality of deformation suppressing members 9 are provided on the outside and inside of the resin molding region R where the amount of deformation of the movable pin plate 62 increases as the plate 62 bends, it is possible to uniformly suppress deformation of the movable pin plate 62 in a balanced manner. Since the deformation suppressing members 9 are provided on the outside of the resin molding region R, they are also on the outside of the recesses 21, 31 of the upper die 2 and the lower die 3, and therefore the plurality of deformation suppressing members 9 can be provided regardless of the positions of the recesses 21, 31 of the upper die 2 and the lower die 3.

[0076] Furthermore, the deformation suppressing members 9 of this embodiment suppress deformation of the movable pin plate 62 relative to the upper die 2 when the movable pins 61 are retracted from the recesses 21, thereby preventing deterioration of the quality of the resin molded product P. Here, the multiple deformation suppressing members 9 come into contact with the surface of the movable pin plate 62 opposite to the respective dies 2, 3 to suppress deformation of the movable pin plate 62, thereby making it possible to suitably suppress deformation of the movable pin plate 62 in a convex curve toward the respective dies 2, 3.

[0077] Furthermore, in this embodiment, when the upper mold 2 and the lower mold 3 are opened by the mold clamping mechanism 5, the plate driving unit 64 is controlled so that the load obtained by the load sensor LS becomes zero, thereby eliminating malfunctions (e.g., damage to the upper mold 2, damage to the deformation suppression member 9, etc.) caused by connecting a component whose dimension or position changes when the mold is opened (e.g., the support pillar 10 or the upper mold 2) to a component whose dimension or position does not change (e.g., the deformation suppression member 9).

[0078] In addition, since the connecting rod 63 is connected and fixed to the movable pin plate 62 from the mold surface side of each of the upper mold 2 and the lower mold 3, i.e., the parting line surface side, the connection between the connecting rod 63 and the movable pin plate 62 can be released from the mold surface side of each of the upper mold 2 and the lower mold 3. As a result, the movable pin plate 62 provided on the upper mold 2 and the upper mold 2 or the movable pin plate 62 provided on the lower mold 3 and the lower mold 3 can be easily attached and detached. As a result, the replacement work of each mold 2, 3 and the movable pin plate 62 for changing the type of the resin molded product P can be easily performed.

[0079] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0080] For example, while the embodiment is configured such that the movable pin 61 is provided on both the upper mold 2 and the lower mold 3, it may be configured such that the movable pin 61 is provided on only one of the upper mold 2 or the lower mold 3.

[0081] In addition, in the above embodiment, the recesses forming the cavity C are provided in both the upper mold 2 and the lower mold 3, but the recesses forming the cavity C may also be provided in either the upper mold 2 or the lower mold 3.

[0082] Furthermore, in controlling the movable pin plate 62 during mold opening, when the load measured by the load sensor LS becomes smaller than zero, the lowering of the lower mold 3, which is the mold opening operation, may be stopped. Then, with the lowering of the lower mold 3 stopped, the plate driving unit 64 may perform the protruding operation of the movable pin 61, and when the load measured by the load sensor LS becomes equal to or greater than zero, the lowering of the lower mold 3 may be resumed.

[0083] In addition, the deformation suppressing member may be configured so that the height position of the contact portion 92 can be adjusted. Specifically, as shown in FIG. 13, the height position of the annular member 921 (contact portion 92) can be adjusted by providing a spacer 922 such as a separate washer between the annular member 921 and the collar 912 in the fixed portion 91. By adjusting the height position of the annular member 921 (contact portion 92) in this manner, it is possible to adjust the amount of deflection suppression of the movable pin plate 62 and adjust the amount by which the movable pin 61 is withdrawn from the cavity C (recess 21). Also, as shown in FIG. 13, a bush 923 such as an oilless bush can be provided between the collar 912 of the fixed portion 91 and the through hole 62h2 of the movable pin plate 62, so that the movable pin plate 62 can move up and down smoothly. In addition, the fixed portion 91 can be fixed to the upper mold 2 by a spigot structure.

[0084] Furthermore, in the above embodiment, the connecting rod 63 and the movable pin plate 62 are connected and fixed from the mold surface side of the upper mold 2 and the mold surface side of the lower mold 3 using the connecting member 7, but they may be connected and fixed in other ways. For example, they may be connected and fixed from the side opposite to the mold surface of the upper mold 2 and the side opposite to the mold surface of the lower mold 3. Also, they may be connected and fixed from the side of the upper mold 2 and the side of the lower mold 3.

[0085] In the above embodiment, the movable pin plate 62 has a rectangular shape, but the shape is not limited thereto as long as it can hold the movable pin 61 and move it back and forth within the cavity C, and may be, for example, a polygonal shape, a circular shape, or the like. Also, the movable pin plate 62 may be composed of a plurality of plates.

[0086] In the above embodiment, the multiple connecting rods 63 were arranged in point-symmetric positions on the movable pin plate 62, but their arrangement is not particularly limited as long as the movable pin plate 62 can be moved up and down while maintaining parallelism.

[0087] In addition, in the above embodiment, before the molding object W is placed on the lower mold 3, the movable pin 61 of the lower mold 3 is protruded into the recess 31, and when the mold is closed, the movable pin 61 of the upper mold 2 is protruded into the recess 21 to fix the fixing portion of the molding object W, but the timing of this fixing is not particularly limited and may be any timing as long as it is before the resin is injected.

[0088] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0089] 100...Resin molding equipment W: Molding object P...Resin molded products J...Resin material C···Cavity 2...1st mold (upper mold) 21 Recess 3. Second type (lower type) 31 ...recess 5. Clamping mechanism 61 Movable pin 62 Movable pin plate 63 Connecting rod 64 Plate drive unit LS...Load Sensor R...Resin molding area 641···Movable plate 8. Distance regulation member 9. Deformation suppression member

Claims

1. a first mold having a recess that forms a cavity to be filled with a resin material; a second die disposed opposite to the first die and clamped together with the first die; a movable pin plate provided on the opposite side of the first die from the second die, the movable pin being fixed to the movable pin capable of moving back and forth within the recess; a plurality of connecting rods provided on the movable pin plate on the opposite side to the first die, the connecting rods having one end fixed to the movable pin plate; a plate driving unit that moves the movable pin plate via the plurality of connecting rods so that the movable pin moves back and forth within the recess; a plurality of deformation suppression members interposed between the first die and the movable pin plate, the deformation suppression members suppressing deformation of the movable pin plate relative to the first die.

2. The molding die according to claim 1 , wherein the plurality of deformation suppressing members are provided on the outer side and the inner side of a resin molding area formed by the first die and the second die when viewed from a die clamping direction.

3. The molding die according to claim 1 or 2, wherein the plurality of deformation suppression members are fixed to a surface of the first die opposite to a surface facing the second die, and contact a surface of the movable pin plate opposite to the first die, thereby suppressing deformation of the movable pin plate.

4. The plurality of deformation suppression members include a fixing portion that is inserted into a through hole formed in the movable pin plate and is fixed to a surface of the first die opposite to a surface facing the second die; A molding die according to any one of claims 1 to 3, further comprising a contact portion provided on the fixed portion which contacts a surface of the movable pin plate opposite the first die when the movable pin plate is deformed in a direction away from the first die.

5. The molding die according to claim 1 , wherein the plurality of deformation suppressing members suppress deformation of the movable pin plate relative to the first die when the movable pin is retracted from the recess.

6. The molding die according to any one of claims 1 to 5, wherein the plurality of connecting rods are connected and fixed to the movable pin plate outside the resin molding area formed by the first die and the second die when viewed from the mold clamping direction.

7. The mold according to any one of claims 1 to 6, wherein the plate driving unit includes a movable plate to which the other ends of the multiple connecting rods are connected and fixed, and moves the movable pin plate via the multiple connecting rods by moving the movable plate.

8. The molding die according to claim 7 , further comprising a distance defining member provided between the movable plate and the movable pin plate, defining a distance between the movable plate and the movable pin plate.

9. The mold according to claim 1 , wherein at least one of the plurality of connecting rods is provided with a load sensor that measures a load applied to the connecting rod.

10. The mold according to any one of claims 1 to 9, and a mold clamping mechanism that clamps the molding die.

11. The mold according to claim 9 , a mold clamping mechanism that clamps the molding die; a control unit that controls the plate drive unit so that the load obtained by the load sensor becomes a predetermined value when the mold is opened by the mold clamping mechanism.

12. A method for producing a resin molded product using the molding die according to any one of claims 1 to 9, a mold clamping step of clamping the first mold and the second mold; and a resin molding step of switching the movable pin from a protruding state into the recess to a pulled state and molding the resin into an object to be molded.

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