Light emitting device and method for manufacturing the same

Abstract

To provide a highly reliable light emitting device that includes a plurality of light emitting elements connected in parallel.SOLUTION: A light emitting device includes an inner light emitting section including an inner light emitting element and an inner wavelength conversion member arranged on the inner light emitting element, and a plurality of outer light emitting sections that is arranged around the inner light emitting section and connected in parallel to each other, each of which includes an outer light emitting element and an outer wavelength conversion member arranged on the outer light emitting element. The plurality of outer light emitting sections includes a first light emitting section including a first light emitting element and a first wavelength conversion member, and a second light emitting section including a second light emitting element and a second wavelength conversion member. In plan view, the area of the first wavelength conversion member is smaller than the area of the second wavelength conversion member, and the ratio of the forward voltage of the first light emitting element to the forward voltage of the second light emitting element is 0.95 or more and 1.05 or less.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device and a method for manufacturing a light emitting device. [Background technology]

[0002] For example, Patent Document 1 discloses a light emitting device in which covering members are provided between a plurality of light emitting elements mounted on a substrate and between light-transmitting members on each light emitting element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-107728 Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, when a plurality of light emitting elements are connected in parallel, there is a possibility that some of the light emitting elements may be thermally damaged.

[0005] The embodiments of the present disclosure have been made in consideration of the above-mentioned problems, and have an object to provide a highly reliable light emitting device. [Means for solving the problem]

[0006] In one aspect of the present disclosure, a light emitting device comprises an inner light emitting section including an inner light emitting element and an inner wavelength conversion member arranged on the inner light emitting element, and a plurality of outer light emitting sections arranged around the inner light emitting section and connected in parallel to each other, each of the outer light emitting sections including an outer light emitting element and an outer wavelength conversion member arranged on the outer light emitting element, wherein the plurality of outer light emitting sections include a first light emitting section including a first light emitting element and a first wavelength conversion member, and a second light emitting section including a second light emitting element and a second wavelength conversion member, wherein, in a planar view, an area of ​​the first wavelength conversion member is smaller than an area of ​​the second wavelength conversion member, and a ratio of a forward voltage of the first light emitting element to a forward voltage of the second light emitting element is 0.95 or more and 1.05 or less.

[0007] In one aspect of the present disclosure, a method for manufacturing a light-emitting device includes the steps of: preparing a light-transmitting sheet having a first main surface and a second main surface located opposite to the first main surface; forming a plurality of grooves on the first main surface to provide the light-transmitting sheet with a plurality of convex portions, including a first convex portion and a second convex portion in a plan view; arranging a plurality of light-emitting elements on the plurality of convex portions, including arranging light-emitting elements on the first convex portions and the second convex portions with their light-emitting surfaces facing each other; arranging, on the first main surface of the light-transmitting sheet, light-shielding members that are arranged in the plurality of grooves and that collectively hold the plurality of light-emitting elements; removing a portion of the light-transmitting sheet from the second main surface side of the light-transmitting sheet so that the light-shielding members arranged in the grooves are exposed; and singulating the light-emitting device to produce inner light-emitting elements and inner wave elements arranged on the inner light-emitting elements. and a step of obtaining a light emitting device comprising: an inner light emitting section having an inner wavelength converting member; and a plurality of outer light emitting sections arranged around the inner light emitting section, each having an outer light emitting element and an outer wavelength converting member arranged on the outer light emitting element, wherein the step of arranging the plurality of light emitting elements includes: arranging the light emitting element on the second convex section so that, in a planar view, an outer edge of the light emitting element arranged on the second convex section is located inside the outer edge of the second convex section; and arranging the light emitting element on the first convex section so that a part of the outer edge of the light emitting element arranged on the first convex section is located outside the outer edge of the first convex section, and the step of arranging the light shading member includes not covering an upper surface of the light emitting element arranged on the second convex section with the light shading member, and covering a part of an upper surface of the light emitting element arranged on the first convex section with the light shading member. [Effects of the Invention]

[0008] According to the embodiments of the present disclosure, it is possible to provide a highly reliable light emitting device including a plurality of light emitting elements connected in parallel. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic plan view of a light emitting device according to a first embodiment. [Figure 2]FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is an enlarged view of an area D in FIG. [Figure 4] 2 is a circuit diagram illustrating a connection mode of the light-emitting element 10. FIG. [Figure 5] FIG. 10 is a schematic plan view of a light emitting device according to a second embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] FIG. 2 is a schematic cross-sectional view illustrating one step of the method for manufacturing the light emitting device according to the first embodiment. [Figure 8] FIG. 2 is a schematic cross-sectional view illustrating one step of the method for manufacturing the light emitting device according to the first embodiment. [Figure 9] FIG. 2 is a schematic cross-sectional view illustrating one step of the method for manufacturing the light emitting device according to the first embodiment. [Figure 10] FIG. 2 is a schematic cross-sectional view illustrating one step of the method for manufacturing the light emitting device according to the first embodiment. [Figure 11] FIG. 2 is a schematic cross-sectional view illustrating one step of the method for manufacturing the light emitting device according to the first embodiment. [Figure 12A] FIG. 10 is a schematic plan view of a light emitting device according to a third embodiment. [Figure 12B] FIG. 12B is a schematic cross-sectional view taken along line XII-XII in FIG. 12A. [Figure 13] FIG. 10 is a schematic cross-sectional view illustrating one step of a method for manufacturing a light emitting device according to a third embodiment. [Figure 14] FIG. 10 is a schematic cross-sectional view illustrating one step of a method for manufacturing a light emitting device according to a third embodiment. [Figure 15] FIG. 10 is a schematic cross-sectional view illustrating one step of a method for manufacturing a light emitting device according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a light-emitting device and a method for manufacturing a light-emitting device according to an embodiment of the present disclosure will be described with reference to the drawings. The embodiments shown below are illustrative of a light-emitting device and a method for manufacturing a light-emitting device for embodying the technical concept of the present embodiment, and are not limited thereto. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc. of components described in the embodiments are not intended to limit the scope of the present disclosure, but are merely illustrative examples. Note that the size, positional relationship, etc. of components shown in each drawing may be exaggerated for clarity. Furthermore, in the following description, the same names and symbols indicate the same or similar components, and detailed description will be omitted as appropriate. Furthermore, as cross-sectional views, end views showing only the cut surface may be shown.

[0011] In the following description, terms indicating specific directions or positions (e.g., "above," "below," and other terms including these terms) may be used. However, these terms are used merely to facilitate understanding of relative directions or positions in the referenced drawings. As long as the relative direction or position relationship indicated by terms such as "above" and "below" in the referenced drawings is the same, the arrangement in drawings other than those disclosed herein, actual products, etc., does not have to be the same as in the referenced drawings. In this specification, the positional relationship expressed as "above (or below)" includes, for example, when two components are assumed to exist, a case in which the two components are in contact with each other, and a case in which the two components are not in contact with each other and one component is located above (or below) the other component. Furthermore, in this specification, unless otherwise specified, a component covering an object to be covered includes a case in which the component is in contact with the object to be covered and directly covers the object to be covered, and a case in which the component is not in contact with the object to be covered and indirectly covers the object to be covered. Furthermore, in this specification, "area" means an area in a plan view unless otherwise specified.

[0012] 1. First Embodiment (1.1. Overall structure) A light-emitting device 1 according to a first embodiment will be described with reference to FIGS. 1 to 4. The light-emitting device 1 includes a plurality of light-emitting units 50. The plurality of light-emitting units 50 includes an inner light-emitting unit 50A disposed at the center in a plan view and a plurality of outer light-emitting units 50B disposed around the inner light-emitting unit 50A and connected in parallel to each other. In the example shown in FIG. 1, the light-emitting device 1 includes nine light-emitting units 50. Specifically, eight outer light-emitting units 50B are disposed in a matrix in a rectangular area (hereinafter also referred to as a rectangular area R) in a plan view around one inner light-emitting unit 50A. In this specification, the term "rectangle" includes both a square and a rectangle. However, the number and arrangement of the light-emitting units 50 are not limited to the above-described embodiment. For example, the light-emitting device 1 may include light-emitting units other than the inner light-emitting unit 50A and the outer light-emitting unit 50B. In the present disclosure, the inner light-emitting unit 50A, the outer light-emitting unit 50B, and the light-emitting units other than the inner light-emitting unit 50A and the outer light-emitting unit 50B may be referred to simply as light-emitting units 50 without distinguishing one from another.

[0013] The light emitting device 1 can be used, for example, as a light source for a flash of an imaging device for capturing images (including still images and moving images). The imaging device is mounted, for example, on a mobile communication terminal. When the light emitting device 1 according to this embodiment is used as a flash light source of the imaging device, light can be emitted by switching between, for example, a first illumination mode in which only the inner light emitting unit 50A arranged in the center in a plan view emits light, and a second illumination mode in which the inner light emitting unit 50A and the multiple outer light emitting units 50B emit light. Note that the first illumination mode has a narrower illumination angle than the second illumination mode. Therefore, since the light emitting device 1 can switch the illumination light between the first illumination mode and the second illumination mode, it is possible to perform imaging according to the imaging mode, such as telephoto or close-up, of the imaging device.

[0014] Each light-emitting unit 50 has a light-emitting element 10 and a wavelength conversion member 20. In this specification, for convenience of explanation, the prefix "inside" is added to the light-emitting element and the translucent member of the inner light-emitting unit 50A, and the reference numerals representing the light-emitting element and the translucent member of the inner light-emitting unit 50A are marked with "A." The prefix "outside" is added to the light-emitting element and the translucent member of the outer light-emitting unit 50B, and the reference numerals representing the light-emitting element and the translucent member of the outer light-emitting unit 50B are marked with "B."

[0015] The inner light-emitting unit 50A has an inner light-emitting element 10A. The outer light-emitting unit 50B has an outer light-emitting element 10B. Note that the light-emitting element included in each light-emitting unit 50 may be simply referred to as the light-emitting element 10, without distinguishing between the inner light-emitting element 10A, the outer light-emitting element 10B, and light-emitting elements other than the inner light-emitting element 10A and the outer light-emitting element 10B.

[0016] The multiple outer light-emitting units 50B are connected in parallel to each other and emit light collectively. This allows the multiple outer light-emitting units 50B to be switched collectively between a state in which all of the multiple outer light-emitting units 50B emit light and a state in which all of the multiple outer light-emitting units 50B do not emit light. The multiple outer light-emitting units 50B can be turned on or off collectively by, for example, a light-emission control unit. By turning on or off the multiple outer light-emitting units 50B collectively, the number of channels of the light-emission control unit assigned to the outer light-emitting units 50B becomes one, which makes it easier to design the wiring between the light-emitting device 1 and the light-emission control unit.

[0017] When multiple light-emitting units 50 are connected in parallel, differences in the areas of the light-emitting units 50 can cause differences in the forward voltage Vf of each light-emitting unit 50, resulting in different amounts of current flowing through each light-emitting unit 50. Specifically, when a light-emitting unit 50 including a small-area light-emitting element 10p and a light-emitting unit 50 including a large-area light-emitting element 10q are connected in parallel, the current value flowing through each light-emitting element 10 changes depending on the current-voltage characteristics of the light-emitting element 10. Furthermore, the current density of the light-emitting element 10p with the smallest area among the multiple light-emitting elements 10 tends to be higher. Because the forward voltage Vf of the light-emitting element 10 varies depending on the current density, the forward voltage Vf of the light-emitting element 10p with the smallest area increases, causing more current to flow through the light-emitting element 10q with a relatively low forward voltage Vf (i.e., the light-emitting element with the largest area), increasing the amount of heat generated by the light-emitting element 10q. This can result in thermal damage to the light-emitting element 10q. Furthermore, if the amount of current flowing through each light-emitting unit 50 differs from one another, the brightness of the light emitted from each light-emitting unit 50 is likely to vary, and when multiple light-emitting units 50 are turned on at the same time, uneven illumination may occur on the illuminated surface.

[0018] Furthermore, in conventional light-emitting devices in which one wavelength conversion member is provided for one light-emitting element, the area of ​​the wavelength conversion member is selected according to the area of ​​the light-emitting element to efficiently transmit light emitted from the light-emitting element through the wavelength conversion member. In other words, a larger-area light-emitting element is placed below a larger-area wavelength conversion member, and a smaller-area light-emitting element is placed below a smaller-area wavelength conversion member. Therefore, in conventional light-emitting devices containing wavelength conversion members with different areas, the areas of the light-emitting elements placed below them are also different. When the light-emitting elements are connected in parallel in this state, as described above, the forward voltages Vf of the light-emitting units 50 are different, and the amount of current flowing through each light-emitting unit 50 may differ. In this embodiment, a light-emitting device is provided that takes into account the above-mentioned issues when multiple light-emitting units 50 are connected in parallel.

[0019] The outer light-emitting unit 50B includes a first light-emitting unit 50B1 and a second light-emitting unit 50B2. In the light-emitting device 1 shown in FIG. 1, the first light-emitting unit 50B1 is arranged at a corner of a rectangular region R, and the second light-emitting unit 50B2 is arranged at a side of the rectangular region R in a plan view. The first light-emitting unit 50B1 includes a first light-emitting element 10B1 and a first wavelength conversion member 20B1. The second light-emitting unit 50B2 includes a second light-emitting element 10B2 and a second wavelength conversion member 20B2. As shown in FIG. 4, the first light-emitting element 10B1 included in the first light-emitting unit 50B1 and the second light-emitting element 10B2 included in the second light-emitting unit 50B2 are connected in parallel to each other. The inner light-emitting element 10A of the inner light-emitting unit 50A is connected to the first light-emitting element 10B1 of the first light-emitting unit 50B1 and the second light-emitting element 10B2 of the second light-emitting unit 50B2 by an independent channel (current path). This makes it possible to irradiate light by switching between a first irradiation mode in which only the inner light-emitting unit 50A emits light and a second irradiation mode in which the inner light-emitting unit 50A and the multiple outer light-emitting units 50B emit light, as described above.

[0020] In this embodiment, the first wavelength conversion member 20B1 and the second wavelength conversion member 20B2 are rectangular in plan view. Furthermore, the area S1 of the first wavelength conversion member 20B1 is smaller than the area S2 of the second wavelength conversion member 20B2 in plan view. Specifically, the ratio of the area S1 of the first wavelength conversion member 20B1 to the area S2 of the second wavelength conversion member 20B2 is, for example, 0.8 or less, or 0.6 or less. Furthermore, the ratio of the area S1 of the first wavelength conversion member 20B1 to the area S2 of the second wavelength conversion member 20B2 is, for example, 0.2 or more, or 0.5 or more.

[0021] The ratio of the forward voltage Vf1 of first light-emitting element 10B1 to the forward voltage Vf2 of second light-emitting element 10B2 is 0.95 or more and 1.05 or less. In light-emitting device 1 according to the first embodiment, the difference in the area of ​​first light-emitting element 10B1 and the area of ​​second light-emitting element 10B2 is reduced in plan view, thereby reducing the difference in the forward voltages Vf between first light-emitting element 10B1 and second light-emitting element 10B2. In plan view, the ratio of the area of ​​first light-emitting element 10B1 to the area of ​​second light-emitting element 10B2 is 0.7 or more and 1.3 or less. By setting the area of ​​first light-emitting element 10B1 within the above range, the difference in the current densities of the currents flowing through first light-emitting element 10B1 and second light-emitting element 10B2 can be reduced, and the ratio of the forward voltages Vf between first light-emitting element 10B1 and second light-emitting element 10B2 can be set to 0.95 or more and 1.05 or less.

[0022] The light emitting element 10 has an element side surface 11. In the inner light emitting element 10A, the side surface facing the element side surface 11 of the outer light emitting element 10B is referred to as the inner element side surface 11A. In the outer light emitting element 10B, the side surface facing the element side surface 11 of the inner light emitting element 10A is referred to as the inner element facing side surface 11B1. In addition, in the outer light emitting element 10B, the side surface facing the element side surface 11 of the outer light emitting element 10B is referred to as the outer element facing side surface 11B2.

[0023] The wavelength conversion member 20 has a member-side surface 25. In the inner wavelength conversion member 20A, the side surface facing the member-side surface 25 of the outer wavelength conversion member 20B is referred to as the inner member-side surface 25A. In the outer wavelength conversion member 20B, the side surface facing the member-side surface 25 of the inner wavelength conversion member 20A is referred to as the inner member-facing side surface 25B1. In addition, in the outer wavelength conversion member 20B, the side surface facing the member-side surface 25 of the outer wavelength conversion member 20B is referred to as the outer member-facing side surface 25B2.

[0024] The first light-emitting element 10B1 included in the first light-emitting unit 50B1 has an outer element-facing side surface 11B2, and the first wavelength conversion member 20B1 included in the first light-emitting unit 50B1 has an outer member-facing side surface 25B2. On the other hand, the second light-emitting element 10B2 included in the second light-emitting unit 50B2 has an inner element-facing side surface 11B1 and an outer element-facing side surface 11B2, and the second wavelength conversion member 20B2 included in the second light-emitting unit 50B2 has an inner member-facing side surface 25B1 and an outer member-facing side surface 25B2. A separation distance D1 between the outer element-facing side surface 11B2 of the first light-emitting element 10B1 and the outer element-facing side surface 11B2 of the second light-emitting element 10B2 is longer than a separation distance D2 between the outer member-facing side surface 25B2 of the first wavelength conversion member 20B1 and the outer member-facing side surface 25B2 of the second wavelength conversion member 20B2. With this configuration, it is possible to reliably guide the light emitted from the light emitting element 10 into the wavelength conversion member 20 .

[0025] In the light emitting device 1, the inner light emitting element 10A and the outer light emitting elements 10B are arranged at the same separation distance in a plan view. That is, as shown in FIG. 1, the first light emitting element 10B1 and the second light emitting element 10B2, and the inner light emitting element 10A and the second light emitting element 10B2 are all arranged at a separation distance D1. By arranging the first light emitting element 10B1, the second light emitting element 10B2, and the inner light emitting element 10A at the same separation distance D1 in this way, the manufacturing of the light emitting device 1 is facilitated and the placement accuracy of each light emitting element is improved. Furthermore, the separation distance D1 is 3 μm or more and 200 μm or less, and preferably 3 μm or more and 120 μm or less. This allows the light emitting device 1 to be made smaller.

[0026] The outer light emitting elements 10B are arranged such that, in a plan view, the inner side surface of the light emitting element 10 of one outer light emitting section 50B is located on an extension line L of the inner side surface of the light emitting element 10 of the adjacent other outer light emitting section 50B. Specifically, as shown in Fig. 3, the first light emitting element 10B1 is arranged such that the inner element facing side surface 11B1 of the adjacent second light emitting element 10B2 is located on an extension line L of the outer element facing side surface 11B2 of the first light emitting element 10B1.

[0027] Furthermore, in a plan view, the separation distance D3 between the outer surface 33 of the light-shielding member 31 and the outer surface 27 of the first light-emitting element 10B1 is preferably 0.3 times or more the length a of the short side of the first light-emitting element 10B1, and may be 0.5 times or more, for example. This reduces leakage of light emitted from the first light-emitting element 10B1 to the outside. Furthermore, the separation distance D3 is, for example, 5 times or less, or 3 times or less the length a of the short side of the first light-emitting element 10B1. Note that when the shape of the first light-emitting element 10B1 is square in a plan view, the short side of the light-emitting element corresponds to one side of the square-shaped first light-emitting element 10B1.

[0028] (1.2. Light-emitting element 10) The light-emitting device 10 has a semiconductor structure. The light-emitting device 10 may further have a growth substrate such as a silicon substrate or a sapphire substrate. The semiconductor structure includes a nitride semiconductor. In this specification, nitride semiconductors include, for example, In x Al y Ga 1-x-y The term "nitride semiconductor" includes all semiconductors with compositions in which the composition ratios x and y in the chemical formula represented by N (0≦x≦1, 0≦y≦1, x+y≦1) are varied within their respective ranges. Furthermore, nitride semiconductors also include those in the above chemical formula that further contain a Group V element other than N (nitrogen), and those that further contain various elements added to control various physical properties such as the conductivity type of the semiconductor. The semiconductor structure includes a p-type layer, an n-type layer, and an active layer. The active layer is a light-emitting layer that emits light and has, for example, an MQW (Multiple Quantum Well) structure including multiple barrier layers and multiple well layers. The light emitted by the active layer is, for example, ultraviolet light or visible light. For example, a plurality of light-emitting elements 10 whose optical characteristics (brightness, chromaticity, etc.) vary within a predetermined range are selected and used in the light-emitting device 1.

[0029] The light-emitting element 10 further includes a device electrode 12. The device electrode 12 is disposed, for example, on the lower surface of the semiconductor structure and is electrically connected to the semiconductor structure. The light-emitting element 10 has at least two device electrodes 12. One of the two device electrodes 12 functions as an anode electrode, and the other functions as a cathode electrode.

[0030] (1.3. Wavelength conversion member 20) The inner light-emitting unit 50A has an inner wavelength conversion member 20A arranged on the inner light-emitting element 10A. The outer light-emitting unit 50B has an outer wavelength conversion member 20B arranged on the outer light-emitting element 10B. Note that the wavelength conversion member of each light-emitting unit 50 may be simply referred to as the wavelength conversion member 20 without distinguishing between the inner wavelength conversion member 20A, the outer wavelength conversion member 20B, and wavelength conversion members other than the inner wavelength conversion member 20A and the outer wavelength conversion member 20B.

[0031] The wavelength conversion member 20 can convert the wavelength of and diffuse the light emitted by the light emitting element 10. Specific materials for the wavelength conversion member 20 will be described later.

[0032] The wavelength conversion member 20 may have a phosphor layer disposed on the light emitting element 10 and a light diffusion layer disposed on the phosphor layer. As an example, the inner wavelength conversion member 20A may have an inner phosphor layer disposed on the inner light emitting element 10A and an inner light diffusion layer disposed on the inner phosphor layer. The outer wavelength conversion member 20B may have an outer phosphor layer disposed on the outer light emitting element 10B and an outer light diffusion layer disposed on the outer phosphor layer. The wavelength conversion member 20 may have only a phosphor layer, or may include layers other than the phosphor layer and the light diffusion layer. The layers other than the phosphor layer and the light diffusion layer are, for example, translucent layers that do not contain phosphors or light diffusion materials, as described below.

[0033] The phosphor layer contains a phosphor that converts the wavelength of at least a portion of the light emitted by the light emitting element 10. The phosphor layer may be made of resin, ceramic, glass, or the like containing a phosphor, or a sintered body of a phosphor. The phosphor layer may also be made of a resin layer containing a phosphor disposed on one surface of a molded body of resin, ceramic, glass, or the like.

[0034] The resin for the phosphor layer may be a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, an epoxy-modified resin, or a phenolic resin. Silicone resin or its modified resin, which has excellent light resistance and heat resistance, is particularly suitable as the resin for the phosphor layer.

[0035] As the phosphor, for example, yttrium aluminum garnet phosphor (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate phosphors (e.g., Ca8MgSiO 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 oxynitride phosphors such as (La,Y)3Si6N 11:(Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu), or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Al x )F 6-x :Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) can be used.

[0036] The phosphor layer may contain one type of phosphor or may contain a plurality of types of phosphors. The light emitting part 50 emits light of a color in which, for example, the color of the visible light emitted by the light emitting element 10 and the color of the light emitted by the phosphor in the phosphor layer excited by the light emitted by the light emitting element 10 are mixed. Or, the light emitting part 50 emits light of a color in which the color of the ultraviolet light emitted by the light emitting element 10 and the color of the light emitted by the phosphor in the phosphor layer excited by the light emitted by the light emitting element 10 are mixed. The plurality of light emitting parts 50 may be composed of light emitting parts 50 having the same emission peak wavelength as each other, or may include light emitting parts 50 having different emission peak wavelengths from each other.

[0037] The upper surface of the light diffusion layer can constitute the upper surface of the wavelength conversion member 20. The light diffusion layer may contain a light diffusion material that diffuses the light emitted by the light emitting element 10. As the light diffusion layer, a resin, ceramic, glass, etc. containing a light diffusion material can be used. Examples of the light diffusion material include titanium oxide or silicon oxide. The same resin as the resin of the phosphor layer can be used as the resin of the light diffusion layer.

[0038] The wavelength conversion member 20 may further include a light-transmitting layer disposed between the light-emitting element 10 and the phosphor layer. As an example, the inner wavelength conversion member 20A may further include an inner light-transmitting layer disposed between the inner light-emitting element 10A and the inner phosphor layer. The outer wavelength conversion member 20B may further include an outer light-transmitting layer disposed between the outer light-emitting element 10B and the outer phosphor layer.

[0039] For example, the thickness of the light diffusion layer in the vertical direction (hereinafter simply referred to as "thickness") is, for example, 10 μm or more and 150 μm or less, or 20 μm or more and 80 μm or less. The thickness of the phosphor layer is, for example, 20 μm or more and 150 μm or less, or 30 μm or more and 100 μm or less. The thickness of the light-transmitting layer 23 is, for example, 1 μm or more and 150 μm or less, or 10 μm or more and 60 μm or less. Note that the wavelength conversion member 20 may be configured to include only one or only two of the light diffusion layer, the phosphor layer, and the light-transmitting layer.

[0040] (1.4. Light blocking member 31) The light emitting device 1 further includes a light-shielding member 31. When the light-shielding member 31 contains a light-reflective additive described below, the reflectance of the light-shielding member 31 at the peak wavelength of the light emitting element 10 is, for example, 70% or more, and preferably 80% or more. When the light-shielding member 31 contains a light-absorbing additive, the absorptance of the light-shielding member 31 at the peak wavelength of the light emitting element 10 is, for example, 50% or more, and preferably 70% or more. The reflectance and absorptance can be measured using, for example, a spectrophotometer. The light-shielding member 31 has insulating properties.

[0041] The light-shielding member 31 integrally holds the inner light-emitting unit 50A and the plurality of outer light-emitting units 50B, and is filled around the light-emitting unit 50. The upper surfaces of the wavelength conversion members 20 are exposed from the light-shielding member 31. The upper surfaces of the wavelength conversion members 20 form the light-emitting surface of the light-emitting device 1.

[0042] By providing the light emitting device 1 with the light blocking member 31, when one light emitting section 50 emits light and an adjacent light emitting section 50 does not emit light, it is possible to reduce the possibility that the light emitted from one light emitting section 50 will leak into the wavelength converting member 20 of the adjacent light emitting section 50, causing the wavelength converting substance contained in the wavelength converting member 20 to emit light. As a result, it is possible to increase the contrast of the light irradiated by the light emitting device 1.

[0043] As shown in FIG. 2, in the first light-emitting unit 50B1, a portion of the upper surface 26 of the first light-emitting element 10B1 is covered by the light-shielding member 31. Specifically, in a plan view, the first light-emitting unit 50B1 has a portion of the upper surface 26 covered by the light-shielding member 31 on a side that is not adjacent to another outer light-emitting unit 50B. As an example, as shown in FIGS. 1 and 2, in a plan view, the first light-emitting unit 50B1 has a portion of the upper surface 26 covered by the light-shielding member 31 on an outer side that is not adjacent to the second light-emitting unit 50B2. On the other hand, the upper surface 26 of the second light-emitting element 10B2 in the second light-emitting unit 50B2 is not covered by the light-shielding member 31.

[0044] The light-shielding member 31 may contain an additive. The thermal conductivity of the additive is, for example, 0.05 W / m·K or more and 2000 W / m·K or less, preferably 0.1 W / m·K or more and 400 W / m·K or less, and more preferably 1 W / m·K or more and 250 W / m·K or less.

[0045] It is preferable that the light-shielding member 31 has light reflectivity and reflects the light emitted by the light-emitting units 50, or has light absorption properties and absorbs the light emitted by the light-emitting units 50. In this way, when the light-shielding member 31 has light reflectivity, the light from each light-emitting unit 50 can be efficiently reflected by the light-shielding member 31, and the luminous flux of the light-emitting device 1 is likely to be high.

[0046] The light-shielding member 31 may be, for example, a resin material containing a light-reflective additive or a light-absorbing additive. Examples of light-reflective additives used in the light-shielding member 31 include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, and silicon oxide. One of these may be used alone, or two or more may be used in combination. Carbon black or the like may also be used as the light-absorbing additive. The resin material used in the light-shielding member 31 may be, for example, a resin material whose main component is a thermosetting resin, such as an epoxy resin, a silicone resin, a silicone-modified resin, or a phenolic resin.

[0047] The light reflectance of the light-reflective additive contained in the light-shielding member 31 is, for example, 80% to 99%, and one example is 90% to 99%. The content of the additive contained in the light-shielding member 31 is, for example, 30% to 80% by mass, and preferably 55% to 80% by mass, when the entire light-shielding member 31 is taken as 100% by mass.

[0048] The light-emitting section 50 may further include an external electrode. The external electrode is disposed on the lower surface of the element electrode 12 of the light-emitting element 10 and is electrically connected to the light-emitting element 10. When the light-emitting section 50 includes an external electrode, one light-emitting section 50 has at least two external electrodes. One of the two external electrodes functions as an anode electrode, and the other functions as a cathode electrode. The external electrode is, for example, a metal layer formed by a sputtering method or the like. The lower surface of the external electrode is exposed from the light-shielding member 31 and is joined via solder or the like to a conductive portion disposed on a substrate on which the light-emitting device 1 is mounted.

[0049] (1.5.Summary) As described above, the light emitting device 1 in this embodiment includes an inner light emitting unit 50A and multiple outer light emitting units 50B that are arranged around the inner light emitting unit 50A and connected in parallel to each other. The inner light emitting unit 50A includes an inner light emitting element 10A and an inner wavelength conversion member 20A that is arranged on the inner light emitting element 10A. The outer light emitting unit 50B includes an outer light emitting element 10B and an outer wavelength conversion member 20B that is arranged on the outer light emitting element 10B. The multiple outer light emitting units 50B include a first light emitting unit 50B1 that includes a first light emitting element 10B1 and a first wavelength conversion member 20B1, and a second light emitting unit 50B2 that includes a second light emitting element 10B2 and a second wavelength conversion member 20B2. In a plan view, the area of ​​the first wavelength conversion member 20B1 is smaller than the area of ​​the second wavelength conversion member 20B2, and the ratio of the forward voltage Vf1 of the first light-emitting element 10B1 to the forward voltage Vf2 of the second light-emitting element 10B2 is 0.95 or more and 1.05 or less. With this configuration, it is possible to reduce thermal damage that may occur in the light-emitting device 1 including multiple light-emitting elements 10 connected in parallel, and it is possible to provide a highly reliable light-emitting device.

[0050] That is, when a light-emitting section 50 including a small-area light-emitting element 10p and a light-emitting section 50 including a large-area light-emitting element 10q are connected in parallel, the value of the current flowing through each light-emitting element 10 changes depending on the current-voltage characteristics of the light-emitting element 10. Furthermore, among the multiple light-emitting elements 10, the light-emitting element 10p with the smallest area tends to have a higher current density. Because the forward voltage Vf of the light-emitting element 10 varies depending on the current density, the forward voltage Vf of the small-area light-emitting element 10p increases, causing more current to flow through the light-emitting element 10q with a relatively low forward voltage Vf (i.e., a large area), increasing the amount of heat generated by the light-emitting element 10q. This can result in thermal damage to the light-emitting element 10q. In contrast, in this embodiment, the light-emitting device 1 has the above-described configuration, thereby reducing the occurrence of thermal damage.

[0051] Furthermore, in the light emitting device 1 according to the present embodiment, the difference between the area of ​​the first light emitting element 10B1 included in the first light emitting unit 50B1 arranged at the corner of the rectangular region R and the area of ​​the second light emitting element 10B2 included in the second light emitting unit 50B2 arranged at the side of the rectangular region R is reduced. Specifically, the ratio of the area A1 of the first light emitting element 10B1 to the area A2 of the second light emitting element 10B2 is set to be 0.7 or more and 1.3 or less. In this way, by reducing the difference between the area A1 of the first light emitting element 10B1 and the area A2 of the second light emitting element 10B2, it is possible to reduce fluctuations in the forward voltage Vf of each outer light emitting element 10B.

[0052] Moreover, in this embodiment, the light emitting device 1 further includes a light-shielding member 31 that integrally holds the inner light-emitting member 50A and the plurality of outer light-emitting members 50B, and the first light-emitting member 50B1 has a part of the upper surface 26 of the first light-emitting element 10B1 covered by the light-shielding member 31. With this configuration, it becomes easy to reduce the difference in area in a planar view between the outer light-emitting elements 10B that are respectively included in the plurality of outer light-emitting members 50B, without being affected by the difference in area in a planar view between the outer wavelength conversion members 20B that are respectively included in the plurality of outer light-emitting members 50B.

[0053] 2. Second Embodiment Next, a light emitting device 2 according to a second embodiment will be described with reference to Figures 5 and 6. In the following embodiments, the configurations different from those of the first embodiment will be mainly described. Furthermore, the same components as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment.

[0054] The light emitting device 2 according to the second embodiment differs from the first embodiment in that, in each of the inner light emitting unit 50A and the plurality of outer light emitting units 50B, a portion of the upper surface of the light emitting element 10 is covered by the light blocking member 31. That is, as shown in Fig. 5 , in the light emitting device 2, a portion of the upper surface of the light emitting element 10 is covered by the light blocking member 31 in each of the inner light emitting unit 50A arranged in the center of the rectangular region R, the first light emitting unit 50B1 arranged at the corner of the rectangular region R, and the second light emitting unit 50B2 arranged at the side of the rectangular region R.

[0055] Specifically, in the light emitting device 2, the area of ​​the light emitting element 10 included in each of the inner light emitting unit 50A and the plurality of outer light emitting units 50B is larger than the area of ​​the wavelength conversion member 20 included in each of the inner light emitting unit 50A and the plurality of outer light emitting units 50B in a plan view. For example, as shown in FIG. 5 , in each light emitting unit 50, the light emitting element 10 and the wavelength conversion member 20 are arranged so that the outer periphery of the wavelength conversion member 20 fits inside the outer periphery of the light emitting element 10 in a plan view, and the upper surface 26 along the outer periphery of the light emitting element 10 is covered with a light-shielding member 31. Also, as shown in FIG. 6 , the separation distance D2 between the component side surfaces 25 of adjacent wavelength conversion members 20 is longer than the separation distance D4 between the component side surfaces 11 of the light emitting elements 10. This configuration reduces the separation distance between the light emitting elements 10, allowing for the use of larger light emitting elements, assuming the light emitting device 2 has the same planar area and number of light emitting elements. This improves the light extraction of the light emitting device 2.

[0056] 3. Third Embodiment Next, a light emitting device 3 according to a third embodiment will be described with reference to Figures 12A and 12B. In the following embodiments, the description will focus on configurations that are different from those in the first embodiment. Furthermore, the same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment.

[0057] The light-emitting device 3 according to the third embodiment differs from the first embodiment in that it further includes a light-absorbing portion 32 on the outer upper surface of the light-shielding member 31. That is, as shown in FIG. 12A , the light-emitting device 3 further includes a light-absorbing portion 32 on the outer upper surface of the light-shielding member 31, surrounding the plurality of outer wavelength conversion members 20B and having a higher light absorption rate than the light-shielding member 31. The light-absorbing portion 32 is disposed surrounding the outside of the rectangular region R. The provision of the light-absorbing portion 32 in the light-emitting device 3 reduces the possibility that a portion of the light emitted from the plurality of light-emitting elements 10, particularly a portion of the light emitted from the plurality of outer light-emitting elements 10B, will be emitted toward the outer surface of the light-emitting device 3 and become stray light on the irradiation surface. Specifically, as shown in FIG. 12B , a portion of the upper surface of the outer light-emitting element 10B is embedded in the light-shielding member 31. When the outer light-emitting element 10B emits light, most of the light from the outer light-emitting element 10B is emitted to the outside through the outer wavelength conversion member 20B, while a portion of the light is emitted toward the outer surface of the light-emitting device through the light-shielding member 31. By providing the light emitting device 3 with a light absorbing portion 32 on the outer upper surface of the light shielding member 31, the light (for example, arrow T in Figure 12B) that passes through the light shielding member 31 and is emitted to the outside can be absorbed by the light absorbing portion 32, resulting in a light emitting device with reduced stray light on the irradiation surface.

[0058] The light absorbing portion 32 has a higher light absorption rate than the light blocking member 31. For example, the light absorbing portion 32 has a light absorption rate of 50% or more, 60% or more, or 70% or more for light with a peak emission wavelength of 450 nm. For example, the light absorbing portion 32 has a light reflectance of 50% or less, 40% or less, or 30% or less for light with a peak emission wavelength of 450 nm. On the other hand, the light blocking member 31 has a light absorption rate of 30% or less, 20% or less, or 10% or less for light with a peak emission wavelength of 450 nm. For example, the light blocking member 31 has a light reflectance of 70% or more, 80% or more, or 90% or more for light with a peak emission wavelength of 450 nm. The light absorption rate and light reflectance can be measured using, for example, a spectrophotometer.

[0059] The light absorbing portion 32 may be a member made of a resin material containing a light absorbing substance such as carbon black, or may be a member containing graphite, or may be a black portion obtained by irradiating the surface of the light blocking member 31 with laser light to transform titanium oxide or the like contained in the light blocking member 31. The transformed titanium oxide has a smaller band gap energy than titanium oxide before being irradiated with laser light. Furthermore, the transformed titanium oxide contained in the light absorbing portion 32 has a smaller band gap energy than titanium oxide contained in the rest of the light blocking member 31. The titanium oxide contained in the light blocking member 31 is, for example, rutile titanium oxide.

[0060] In the light emitting device 3 according to the third embodiment, a recess C that surrounds the plurality of outer wavelength conversion members 20B is provided on the outer upper surface of the light blocking member 31, and the light absorbing portion 32 is a resin member containing a light absorbing material that is disposed in the recess C. Providing the recess C in the light emitting device 3 and disposing the light absorbing portion 32 in the recess C makes it possible to reduce an increase in size of the light emitting device 3 in the height direction. Note that the light emitting device 3 may not be provided with the recess C, and may instead be provided by applying a resin material containing a light absorbing material onto the flat surface of the outer upper surface of the light blocking member 31, for example.

[0061] In the light-emitting device 3 according to the third embodiment, the outer surface of the light-absorbing portion 32 is located on approximately the same plane as the outer surface of the light-shielding member 31. As a result, when the outer light-emitting element 10B emits light, light that passes through the light-shielding member 31 and is emitted toward the outer surface of the light-emitting device can be efficiently absorbed, resulting in a light-emitting device with reduced stray light on the irradiated surface. Note that the light-absorbing portion 32 may be located more inward than the outer surface of the light-shielding member 31 in a plan view.

[0062] <4. Method for manufacturing light emitting device 1> 7 to 11, a method for manufacturing the light emitting device 1 according to the first embodiment will be described below. The method for manufacturing the light emitting device 1 includes a step of forming grooves 300 in the first main surface 121 of the light-transmitting sheet 120, as shown in FIG. 7. A first support member 201 supports the light-transmitting sheet 120 so that a second main surface 122, which is the opposite side to the first main surface 121, faces the first support member 201. The light-transmitting sheet 120 has, in this order from the first main surface 121 side, a light-transmitting layer, a phosphor layer, and a light-diffusing layer.

[0063] In the step of forming the grooves 300, a plurality of grooves 300 are formed on the first main surface 121 so as to form a grid pattern in a plan view, for example. The grooves 300 can be formed using, for example, a blade or laser light. The grooves 300 do not penetrate the light-transmitting sheet 120, and the bottoms of the grooves 300 are located, for example, in the light diffusion layer. Alternatively, instead of the step of forming the grooves 300 in the light-transmitting sheet 120, a light-transmitting sheet 120 with grooves 300 already formed therein may be prepared by receiving, including purchasing, the light-transmitting sheet 120.

[0064] By forming the multiple grooves 300, the light-transmitting sheet 120 has multiple convex portions, including a first convex portion P1 and a second convex portion P2, on the first main surface 121. As an example, the first convex portion P1 is a portion where the first light-emitting element 10B1 will be arranged and which will later become the first wavelength conversion member 20B1. As another example, the second convex portion P2 is a portion where the second light-emitting element 10B2 will be arranged and which will later become the second wavelength conversion member 20B2. In FIG. 7, the second convex portion P2 is located on the inside, and the two first convex portions P1 are located on the outside, sandwiching the second convex portion P2. Note that FIG. 7 may also show a cross-sectional view passing through a portion that will become one inner light-emitting portion 50A and a portion that will become two outer light-emitting portions 50B. In this case, the first convex portion P1 is a portion where the outer light-emitting element 10B will be arranged and which will later become the outer wavelength conversion member 20B. The second protrusion P2 is a portion where the inner light emitting element 10A will be arranged later and which will become the inner wavelength conversion member 20A. Furthermore, in this case, the multiple first protrusions P1 are arranged to surround the second protrusion P2 in a plan view.

[0065] After the step of forming the grooves 300, a step of arranging the light-emitting elements 10 on the first main surface 121 of the light-transmitting sheet 120 is performed, as shown in FIG. 8. For example, a plurality of light-emitting elements 10 are arranged on the first main surface 121 of the light-transmitting sheet 120. Furthermore, an uncured bonding member 41 is supplied onto the first main surface 121 by a dispenser. After the bonding member 41 is supplied, the bonding member 41 is cured. The step of curing the bonding member 41 is performed by, for example, heating. As a result, the light-emitting elements 10 and the light-transmitting sheet 120 are bonded via the bonding member 41. An element electrode 12 is located on the surface of the light-emitting element 10 opposite to the surface facing the first main surface 121.

[0066] Specifically, the light-emitting elements 10 are arranged on the first convex portion P1 and the second convex portion P2 with their light-emitting surfaces facing each other. At this time, in a plan view, the outer edge of the light-emitting element 10 arranged on the second convex portion P2 is arranged so as to be located inside the outer edge of the second convex portion P2. On the other hand, in a plan view, a part of the outer edge of the light-emitting element 10 arranged on the first convex portion P1 is arranged so as to be located outside the outer edge of the first convex portion P1. In other words, in a plan view, a part of the upper surface (lower surface in FIG. 8) of the light-emitting element 10 arranged on the first convex portion P1 is located outside the first convex portion P1. As a result, in a subsequent step of arranging the light-shielding member 31, the upper surface of the light-emitting element 10 arranged on the second convex portion P2 is not covered by the light-shielding member 31, and a part of the upper surface of the light-emitting element 10 arranged on the first convex portion P1 is covered by the light-shielding member 31.

[0067] In the step of arranging the light-emitting elements, for example, the inner light-emitting element 10A and the plurality of outer light-emitting elements 10B are arranged at the same separation distance D1 in a plan view as described above. At this time, the plurality of outer light-emitting elements 10B may be arranged such that the inner side surface of one outer light-emitting section 50B is located on an extension line L of the inner side surface of another adjacent outer light-emitting section 50B.

[0068] After the step of arranging the light-emitting element 10, as shown in FIG. 9, a step of arranging a light-blocking member 31 containing an additive is provided. In the step of arranging the light-blocking member 31, for example, the light-blocking member 31 is formed using a transfer molding method using a mold, an injection molding method, or a compression molding method. As another method, for example, a resin material that softens when heated may be prepared, the light-emitting element 10 may be embedded in the softened resin material, and then hardened to arrange the light-blocking member 31. The light-blocking member 31 is arranged inside the grooves 300 and covers the first main surface 121 and side surfaces of the light-transmitting sheet 120. In other words, the light-blocking member 31 is partially arranged in the multiple grooves 300 on the first main surface 121 of the light-transmitting sheet 120, and holds the multiple light-emitting elements 10 collectively.

[0069] In the step of arranging the light-shielding member 31, if the light-shielding member 31 is arranged so as to cover the element electrodes 12 of the light-emitting element, the light-shielding member 31 is removed using, for example, a grinding device, and the surfaces of the element electrodes 12 are exposed from the light-shielding member 31 as shown in FIG. 10 . At this time, a portion of the element electrodes 12 may be removed. Thereafter, if necessary, a metal film is formed on the surfaces of the element electrodes 12. The metal film corresponds to an external electrode. The metal film is formed by, for example, a sputtering method or a vapor deposition method.

[0070] After the step of arranging the light-shielding member 31, the structure 501 including the light-transmitting sheet 120, light-emitting element 10, element electrode 12, bonding member 41, and light-shielding member 31 is turned upside down and transferred from the first support member 201 to the second support member 202. Then, for example, a grinding device is used to remove a portion of the light-transmitting sheet 120. Furthermore, the light-transmitting sheet 120 is removed until the light-shielding members 31 arranged in the grooves 300 are exposed. After that, the light-shielding members 31 are cut in the region outside the light-emitting portions 50 using, for example, a blade or a laser, to separate the light-emitting devices. This separates the structure 501 into a plurality of light-emitting portions 50, as shown in FIG. 11 . In this way, a light emitting device 1 is manufactured, which includes an inner light emitting unit 50A having an inner light emitting element 10A and an inner wavelength conversion member 20A arranged on the inner light emitting element 10A, and a plurality of outer light emitting units 50B arranged around the inner light emitting unit 50A, each having an outer light emitting element 10B and an outer wavelength conversion member 20B arranged on the outer light emitting element 10B.

[0071] <5. Manufacturing Method of Light-Emitting Device 3> 13 to 15, a method for manufacturing the light emitting device 3 according to the third embodiment will be described. First, the structure shown in Fig. 11 is prepared before being separated into individual light emitting devices. The steps up to the step of preparing the structure shown in Fig. 11 are the same as the method for manufacturing the light emitting device 1 according to the first embodiment.

[0072] 13, recesses C surrounding the plurality of outer wavelength conversion members 20B are formed on the outer upper surface of the light blocking member 31. The recesses C are formed by removing a part of the outer upper surface of the light blocking member 31 using a blade, for example.

[0073] 14, the light absorbing portion 32 is disposed in the recess C provided on the outer upper surface of the light blocking member 31. The light absorbing portion 32 is made of, for example, a resin material containing carbon black. The light absorbing portion 32 is formed by, for example, a transfer molding method using a mold, an injection molding method, or a compression molding method.

[0074] 15 , the light absorbing portion 32 and the light blocking member 31 are cut using a blade, a laser, or the like through the light absorbing portion 32 to separate the light emitting devices 3. By cutting the light absorbing portion 32 and the light blocking member 31 through the light absorbing portion 32, the outer surface of the light absorbing portion 32 and the outer surface of the light blocking member 31 are positioned on approximately the same plane on the outer surface of the light emitting device 1.

[0075] 11, the light absorbing portions 32 may be formed by irradiating laser light onto positions surrounding the plurality of outer wavelength conversion members 20B on the outer upper surface of the light shielding member 31. In this case, the light shielding member 31 contains, for example, titanium oxide, and the titanium oxide located in the region irradiated with the laser light is transformed into the light absorbing portions 32.

[0076] <6. Other embodiments> Although the embodiments of the present disclosure have been described above, they are not limited to the above. For example, in the above embodiment, the area of ​​the first light-emitting element 10B1 included in the first light-emitting unit 50B1 arranged at the corner of the rectangular region R is set to match the area of ​​the second light-emitting element 10B2 included in the second light-emitting unit 50B2 arranged at the side of the rectangular region R. However, the present disclosure is not limited to this, and the area of ​​the second light-emitting element 10B2 included in the second light-emitting unit 50B2 arranged at the side of the rectangular region R may be set to match the area of ​​the first light-emitting element 10B1 included in the first light-emitting unit 50B1 arranged at the corner of the rectangular region R.

[0077] Furthermore, in the light emitting device 1 of the first embodiment, the area of ​​each light emitting element is adjusted to make the value and / or current density of the current flowing through first light emitting element 10B1 of first light emitting unit 50B1 closer to the value and / or current density of the current flowing through second light emitting element 10B2 of second light emitting unit 50B2. Alternatively, the resistance value of the wiring portion of the substrate on which outer light emitting unit 50B is mounted may be changed (for example, by changing the size of the wiring portion of the substrate to change the ease with which current flows) to make the value and / or current density of the current flowing through first light emitting element 10B1 of first light emitting unit 50B1 closer to the value and / or current density of the current flowing through second light emitting element 10B2 of second light emitting unit 50B2.

[0078] Furthermore, by using different types of bonding materials, such as solder, between the substrate on which the outer light-emitting unit 50B is mounted and the outer light-emitting element 10B for the first light-emitting unit 50B1 and the second light-emitting unit 50B2, the current value and / or current density flowing through the first light-emitting element 10B1 of the first light-emitting unit 50B1 and the current value and / or current density flowing through the second light-emitting element 10B2 of the second light-emitting unit 50B2 may be made closer to each other. Note that making the current densities flowing through the first light-emitting element 10B1 and the second light-emitting element 10B2 closer to each other has the effect of making the forward voltages Vf of the respective light-emitting elements 10 less likely to fluctuate, and making the current values ​​flowing through the first light-emitting element 10B1 and the second light-emitting element 10B2 closer to each other has the effect of making the brightness of the light emitted by each light-emitting element 10 closer to each other.

[0079] The present disclosure includes the following aspects. [Section 1] an inner light emitting unit including an inner light emitting element and an inner wavelength converting member disposed on the inner light emitting element; a plurality of outer light emitting units arranged around the inner light emitting unit and connected in parallel to each other, each of the outer light emitting units including an outer light emitting element and an outer wavelength converting member arranged on the outer light emitting element; the plurality of outer light-emitting units include a first light-emitting unit including a first light-emitting element and a first wavelength conversion member, and a second light-emitting unit including a second light-emitting element and a second wavelength conversion member; In a plan view, an area of ​​the first wavelength conversion member is smaller than an area of ​​the second wavelength conversion member, a ratio of the forward voltage of the first light emitting element to the forward voltage of the second light emitting element is not less than 0.95 and not more than 1.05. [Section 2] Item 2. The light emitting device according to item 1, wherein a ratio of an area of ​​the first light emitting element to an area of ​​the second light emitting element in a plan view is 0.7 or more and 1.3 or less. [Section 3] a light-shielding member that integrally holds the inner light-emitting unit and the plurality of outer light-emitting units; 3. The light emitting device according to item 1 or 2, wherein the first light emitting unit has a top surface of the first light emitting element partially covered by the light blocking member. [Section 4] Item 4. The light emitting device according to item 3, wherein an upper surface of the second light emitting element in the second light emitting portion is not covered with the light blocking member. [Section 5] Item 4. The light emitting device according to item 3, wherein a part of an upper surface of the outer light emitting element in each of the outer light emitting portions is covered with the light blocking member. [Section 6] the inner light-emitting portion and the plurality of outer light-emitting portions are arranged in a matrix in a rectangular area in a plan view, 6. The light emitting device according to any one of items 1 to 5, wherein the first light emitting section is disposed at a corner of the rectangular region. [Section 7] Item 3. The light emitting device according to item 3, wherein, in a planar view, on the side of the first light emitting section that is not adjacent to other light emitting sections included in the plurality of outer light emitting sections, a portion of the upper surface of the inner light emitting element is covered by the light-shielding member. [Section 8] 8. The light emitting device according to any one of items 1 to 7, wherein the inner light emitting element and the plurality of outer light emitting elements are arranged at the same distance from each other in a plan view. [Section 9] Item 4. The light emitting device according to item 3, wherein, in a plan view, a distance between an outer surface of the light blocking member and an outer surface of the first light emitting element is 0.3 times or more the length of a short side of the first light emitting element. [Section 10] Item 4. The light emitting device according to item 3, further comprising a light absorbing portion that surrounds the plurality of outer wavelength conversion members on the outer upper surface of the light blocking member and has a higher light absorption rate than the light blocking member. [Section 11] the light blocking member has a recessed portion on an outer upper surface that surrounds the plurality of outer wavelength converting members, Item 11. The light emitting device according to item 10, wherein the light absorbing portion is disposed within the recess. [Section 12] Item 12. The light emitting device according to item 10 or 11, wherein an outer surface of the light absorbing portion is positioned on approximately the same plane as an outer surface of the light blocking member. [Section 13] Item 13. The light emitting device according to any one of items 1 to 12, wherein the light emitting device can be switched between a first irradiation mode in which only the inner light emitting unit emits light and a second irradiation mode in which the inner light emitting unit and the plurality of outer light emitting units emit light. [Section 14] Item 14. The light emitting device according to any one of items 1 to 13, which is a light source for a flash when taking an image. [Section 15] preparing a light-transmitting sheet having a first main surface and a second main surface located opposite to the first main surface; forming a plurality of grooves on the first main surface to provide a plurality of convex portions, including first convex portions and second convex portions, on the light-transmitting sheet in a plan view; a step of arranging a plurality of light-emitting elements on the plurality of convex portions, the step including arranging light-emitting elements on the first convex portion and the second convex portion such that light-emitting surfaces thereof face each other; a step of arranging a light-shielding member on a first main surface of the light-transmitting sheet, the light-shielding member being disposed in the plurality of grooves and collectively holding the plurality of light-emitting elements; removing a portion of the light-transmitting sheet from a second main surface side of the light-transmitting sheet so that the light-blocking member disposed in the groove is exposed; By singulating, and obtaining a light emitting device including an inner light emitting unit including an inner light emitting element and an inner wavelength converting member disposed on the inner light emitting element, and a plurality of outer light emitting units disposed around the inner light emitting unit, each of the outer light emitting units including an outer light emitting element and an outer wavelength converting member disposed on the outer light emitting element, The step of arranging the plurality of light-emitting elements includes, in a plan view, disposing the light emitting element on the second convex portion such that an outer edge of the light emitting element disposed on the second convex portion is positioned inside an outer edge of the second convex portion; disposing the light-emitting element on the first convex portion so that a part of an outer edge of the light-emitting element disposed on the first convex portion is positioned outside an outer edge of the first convex portion; The step of disposing the light blocking member includes: A method for manufacturing a light-emitting device, comprising not covering an upper surface of a light-emitting element placed on the second convex portion with the light-shielding member, and covering a portion of an upper surface of a light-emitting element placed on the first convex portion with the light-shielding member. [Section 16] Item 16. The method for manufacturing a light emitting device according to item 15, further comprising, after the step of removing a portion of the light-transmitting sheet, a step of providing a light absorbing portion on the outer upper surface of the light-shielding member, the light absorbing portion surrounding the plurality of outer wavelength conversion members and having a higher light absorption rate than the light-shielding member. [Section 17] The step of providing the light absorbing portion includes: forming recesses surrounding the plurality of outer wavelength conversion members on an outer upper surface of the light blocking member; Item 17. The method for manufacturing a light emitting device according to item 16, further comprising: disposing the light absorbing portion in the recess. [Section 18] The step of obtaining the light emitting device includes: Item 18. A method for manufacturing a light emitting device according to item 16 or 17, comprising cutting the light absorbing portion and the light blocking member through the light absorbing portion in a plan view to separate the light absorbing portion and the light blocking member.

[0080] The embodiments of the present disclosure have been described above with reference to specific examples. However, the present disclosure is not limited to these specific examples. All forms that can be implemented by a person skilled in the art through appropriate design modifications based on the above-described embodiments of the present disclosure also fall within the scope of the present disclosure, as long as they include the gist of the present disclosure. In addition, within the scope of the concept of the present disclosure, a person skilled in the art may come up with various modified examples and examples of alterations, and these modified examples and examples of alterations also fall within the scope of the present disclosure. [Explanation of symbols]

[0081] 1, 2, 3: light emitting device, 10: light emitting element, 10A: inner light emitting element, 10B: outer light emitting element, 10B1: first light emitting element, 10B2: second light emitting element, 11: element side surface, 11A: inner element side surface, 11B1: inner element facing side surface, 11B2: outer element facing side surface, 12: element electrode, 20: wavelength conversion member, 20A: inner wavelength conversion member, 20B: outer wavelength conversion member, 20B1: first wavelength conversion member, 20B2: second wavelength conversion member, 23: light transmitting layer, 25: part member side surface, 25A: inner member side surface, 25B1: inner member facing side surface, 25B2: outer member facing side surface, 26: upper surface, 27, 33: outer surface, 31: light-shielding member, 32: light-absorbing portion, 41: joining member, 50: light-emitting portion, 50A: inner light-emitting portion, 50B: outer light-emitting portion, 50B1: first light-emitting portion, 50B2: second light-emitting portion, 120: light-transmitting sheet, 121: first main surface, 122: second main surface, 201: first support member, 202: second support member, 300: groove, 501: structure

Claims

1. An inner light emitting unit including an inner light emitting element and an inner wavelength converting member disposed on the inner light emitting element; a plurality of outer light emitting units arranged around the inner light emitting unit and connected in parallel to each other, each of the outer light emitting units including an outer light emitting element and an outer wavelength converting member arranged on the outer light emitting element; The plurality of outer light emitting units include a first light emitting unit including a first light emitting element and a first wavelength converting member, and a second light emitting unit including a second light emitting element and a second wavelength converting member, In a plan view, an area of ​​the first wavelength conversion member is smaller than an area of ​​the second wavelength conversion member, A light emitting device, wherein a ratio of a forward voltage of the first light emitting element to a forward voltage of the second light emitting element is equal to or greater than 0.95 and equal to or less than 1.

05.

2. The light emitting device according to claim 1 , wherein a ratio of an area of ​​the first light emitting element to an area of ​​the second light emitting element in a plan view is equal to or greater than 0.7 and equal to or less than 1.

3.

3. a light-shielding member that integrally holds the inner light-emitting portion and the plurality of outer light-emitting portions; The light emitting device according to claim 1 , wherein the first light emitting portion has an upper surface of the first light emitting element partially covered by the light blocking member.

4. The light emitting device according to claim 3 , wherein an upper surface of the second light emitting element in the second light emitting portion is not covered by the light blocking member.

5. The light emitting device according to claim 3 , wherein a part of an upper surface of the outer light emitting element in each of the outer light emitting sections is covered by the light blocking member.

6. the inner light emitting portion and the plurality of outer light emitting portions are arranged in a matrix in a rectangular region in a plan view, The light emitting device according to claim 1 , wherein the first light emitting portion is disposed at a corner of the rectangular region.

7. The light emitting device according to claim 3 , wherein, in a plan view, on a side of the first light emitting section that is not adjacent to other light emitting sections included in the plurality of outer light emitting sections, a portion of an upper surface of the inner light emitting element is covered by the light shielding member.

8. The light emitting device according to claim 1 , wherein the inner light emitting element and the plurality of outer light emitting elements are arranged at the same distance apart in a plan view.

9. The light emitting device according to claim 3 , wherein in a plan view, a distance between an outer surface of the light blocking member and an outer surface of the first light emitting element is 0.3 times or more as long as a short side of the first light emitting element.

10. The light emitting device according to claim 3 , further comprising a light absorbing portion that surrounds the plurality of outer wavelength conversion members on an outer upper surface of the light blocking member and has a higher light absorption rate than the light blocking member.

11. the light blocking member has a recessed portion on an outer upper surface surrounding the plurality of outer wavelength converting members, The light emitting device according to claim 10 , wherein the light absorbing portion is disposed within the recess.

12. The light emitting device according to claim 10 , wherein an outer surface of the light absorbing portion is positioned on approximately the same plane as an outer surface of the light blocking member.

13. The light emitting device according to claim 1 or 2, wherein the light emitting device is capable of emitting light by switching between a first irradiation mode in which only the inner light emitting portion emits light, and a second irradiation mode in which the inner light emitting portion and the plurality of outer light emitting portions emit light.

14. The light emitting device according to claim 1 , which is a light source for a flash when taking an image.

15. preparing a light-transmitting sheet having a first main surface and a second main surface located opposite to the first main surface; forming a plurality of grooves on the first main surface to provide a plurality of convex portions including a first convex portion and a second convex portion on the light-transmitting sheet in a plan view; a step of arranging a plurality of light-emitting elements on the plurality of convex portions, the step including arranging light-emitting elements on the first convex portion and the second convex portion such that light-emitting surfaces of the light-emitting elements face each other; a step of arranging a light-shielding member on a first main surface of the light-transmitting sheet, the light-shielding member being disposed in the plurality of grooves and collectively holding the plurality of light-emitting elements; removing a portion of the light-transmitting sheet from a second main surface side of the light-transmitting sheet so as to expose the light-shielding member disposed in the groove; By singulating, and obtaining a light emitting device including an inner light emitting section including an inner light emitting element and an inner wavelength converting member disposed on the inner light emitting element, and a plurality of outer light emitting sections disposed around the inner light emitting section, each of the outer light emitting sections including an outer light emitting element and an outer wavelength converting member disposed on the outer light emitting element, The step of arranging the plurality of light emitting elements includes, in a plan view, disposing the light emitting element on the second convex portion such that an outer edge of the light emitting element disposed on the second convex portion is positioned inside an outer edge of the second convex portion; and arranging the light-emitting element on the first convex portion such that a part of an outer edge of the light-emitting element arranged on the first convex portion is located outside an outer edge of the first convex portion, The step of disposing the light blocking member includes: A method for manufacturing a light-emitting device, comprising not covering an upper surface of a light-emitting element arranged on the second convex portion with the light-shielding member, and covering a portion of an upper surface of a light-emitting element arranged on the first convex portion with the light-shielding member.

16. The method for manufacturing a light emitting device according to claim 15 , further comprising, after the step of removing a portion of the light-transmitting sheet, a step of providing a light absorbing portion on an outer upper surface of the light-shielding member that surrounds the plurality of outer wavelength conversion members and has a higher light absorption rate than the light-shielding member.

17. The step of providing the light absorbing portion includes: forming a recess surrounding the plurality of outer wavelength conversion members on an outer upper surface of the light blocking member; The method for manufacturing a light emitting device according to claim 16 , further comprising: disposing the light absorbing portion in the recess.

18. The step of obtaining the light emitting device includes: The method for manufacturing a light emitting device according to claim 16 , comprising: dividing the light absorbing portion and the light blocking member into individual pieces by cutting the light absorbing portion and the light blocking member through the light absorbing portion in a plan view.

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