Mounting device and mounting method

Abstract

To provide a mounting device and a mounting method that are capable of reducing the difference in joint strength among electronic components.SOLUTION: A mounting device 1 includes a mounting section 3 that directly mounts an electronic component C held by a mounting head 31 onto a substrate S, a supply section 6 that supplies an electronic component C, a pickup section 71 that picks up the electronic component C from the supply section 6 using a pickup head 700 and transfers the electronic component C to the mounting head 31, a moving mechanism 73 that moves the mounting head 31 and the pickup head 700 relatively to each other, a substrate support section 2 that supports and moves the substrate S, a first irradiation section 8 that individually irradiates the electronic component C before being mounted with ultraviolet light, and a second irradiation section 9 that individually applies ultraviolet light onto a mounting area B of the substrate S where electronic component C should be mounted.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a mounting apparatus and a mounting method. [Background technology]

[0002] 2. Description of the Related Art Electronic components such as semiconductor chips are picked up from a wafer or tray, transported onto a substrate, and pressed against the substrate for mounting.

[0003] Here, in so-called direct bonding, in which electronic components are directly bonded to a substrate, the bonding surfaces of the substrate or electronic components are cleaned and activated, and then the components are brought into contact with each other to bond them, without using adhesives or the like. For example, as shown in Patent Document 1, the mounting surfaces of the substrate or electronic components are cleaned and activated by performing plasma treatment on the substrate or electronic components in a reduced pressure chamber. Here, activation refers to terminating the mounting surfaces of the substrate or electronic components with hydroxyl groups, respectively, to make them in a state in which water molecules can be easily bonded. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-021966 A Summary of the Invention [Problem to be solved by the invention]

[0005] For example, the state of cleaning and activation of the bonding surfaces of the substrate and electronic components affects the bonding strength. However, the degree of cleanliness and activity of the bonding surfaces decreases with the passage of time. In the above-mentioned conventional technology, the bonding surfaces of the substrate are cleaned and activated in a plasma processing device, and the bonding surfaces of the electronic components in a state where the wafer is individually diced and attached to a wafer sheet or placed on a tray are cleaned and activated in a batch, and then each is transported to a bonding device, and the electronic components are mounted on the substrate one by one. Then, the time from the cleaning and activation processing to the mounting of the electronic components on the substrate differs for each electronic component. As time passes after the cleaning and activation processing, the state where water molecules are easily bonded is gradually lost, and the possibility of organic matter adhering to the surface increases. For this reason, the degree of cleanliness and activity differs for each electronic component, resulting in differences in bonding strength for each electronic component. In particular, in a bonding device, there is a large time difference between the cleaning and activation processes and bonding of the first and last electronic components supplied from a wafer sheet or tray, and this results in a large difference in the bonding strength of the electronic components.

[0006] An object of the embodiments of the present invention is to provide a mounting apparatus and a mounting method that can reduce the difference in bonding strength between electronic components. [Means for solving the problem]

[0007] In order to achieve the above object, the mounting apparatus of the embodiment has a mounting section that directly mounts electronic components held by a mounting head onto a substrate, a supply section that supplies the electronic components, a pickup section that picks up the electronic components from the supply section using a pickup head and passes them to the mounting head, a moving mechanism that moves the mounting head and the pickup head relative to one another, a substrate support section that supports and moves the substrate, a first irradiation section that irradiates ultraviolet light individually onto the electronic components before mounting, and a second irradiation section that irradiates ultraviolet light individually onto mounting areas of the substrate where the electronic components are to be mounted.

[0008] The mounting method of the embodiment is a mounting method for directly mounting an electronic component onto a substrate, in which a pick-up head of a pick-up unit picks up the electronic component from a supply unit that supplies the electronic component, a mounting head of a mounting unit receives the electronic component from the pick-up head and mounts the received and held electronic component onto the substrate supported by a substrate support unit, and before mounting, a first irradiation unit irradiates ultraviolet light onto the electronic component in the supply unit or the electronic component held by the mounting head, and before mounting, a second irradiation unit irradiates ultraviolet light onto a mounting area of ​​the substrate where the electronic component is to be mounted. Effect of the Invention

[0009] In the embodiment of the present invention, the difference in bonding strength between electronic components can be reduced. [Brief description of the drawings]

[0010] [Figure 1] 1 is a front view showing a schematic configuration of a mounting device according to an embodiment; [Diagram 2] FIG. 2 is a plan view showing a schematic configuration of a mounting device. [Diagram 3] 1A and 1B are enlarged views showing a flipping operation of an electronic component, the left side being a front view and the right side being a plan view. [Figure 4] 11 is a left side view showing the pickup operation of the pickup unit to pick up an electronic component. FIG. [Diagram 5] 10 is an explanatory diagram showing the operation from when a pickup head picks up an electronic component to when a mounting head mounts it; FIG. [Figure 6] 1 is a flowchart showing a procedure from picking up to mounting an electronic component. [Figure 7] 13 is an enlarged view showing the inversion operation of a modified example in which two first irradiation units are provided on a rotating body with a pickup head sandwiched therebetween, the left side being a front view and the right side being a plan view. FIG. [Figure 8] 8A to 8C are plan views showing a procedure for picking up electronic components according to the modified example of FIG. 7. [Figure 9]13 is an enlarged view showing an inversion operation of a modified example in which a first irradiation unit is provided on an arm unit, the left side being a front view and the right side being a plan view. FIG. [Figure 10] 13 is an enlarged view showing an inversion operation of a modified example in which two first irradiation units are provided on an arm unit with a pickup head sandwiched therebetween, the left side being a front view and the right side being a plan view. FIG. [Figure 11] 11 is an explanatory diagram showing an operation of irradiating ultraviolet light onto each electronic component to be picked up; FIG. [Figure 12] FIG. 1A is an explanatory diagram showing an example of irradiating ultraviolet light when an electronic component is handed over to a mounting head, and FIG. 1B is an explanatory diagram showing an example of irradiating ultraviolet light by a first irradiation unit provided separately from the pickup unit when the electronic component is handed over. [Figure 13] FIG. 13 is a plan view showing a second irradiating unit provided separately from the moving object. [Figure 14] FIG. 1A is an explanatory diagram showing an example of irradiating ultraviolet light to an electronic component before it is picked up by a first irradiation unit provided separately from the pickup unit; FIG. 1B is an explanatory diagram showing an example of picking up an electronic component while irradiating ultraviolet light when the electronic component is handed over by a first irradiation unit provided separately from the pickup unit; and FIG. 1C is an explanatory diagram showing irradiating ultraviolet light to an electronic component before it is picked up by a first irradiation unit provided in a pickup head. [Figure 15] FIG. 2A is a cross-sectional view showing a pickup head incorporating a first irradiation unit, and FIG. 2B is a cross-sectional view showing the pickup head to which the first irradiation unit is attached. [Figure 16] FIG. 13 is a front view showing a schematic configuration of another embodiment of the mounting device. [Figure 17] 11 is an explanatory diagram showing an example in which ultraviolet light is irradiated simultaneously onto both an electronic component immediately before mounting and a mounting area; FIG. [Figure 18] 11 is an explanatory diagram showing an example in which ultraviolet light is sequentially irradiated onto both a mounting area before mounting and an electronic component immediately before mounting; FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. This embodiment is a mounting device 1 that mounts an electronic component C on a substrate S, as shown in the schematic configuration of Figures 1 and 2. Note that the drawings are schematic, and the size (hereinafter also referred to as dimensions) and shape of each part, the relative size ratios of each part, etc. may differ from the actual ones.

[0012] [Electronic components] First, the electronic component C to be mounted in this embodiment can be, for example, a semiconductor element such as a logic, memory, or image sensor. In this embodiment, a rectangular parallelepiped semiconductor chip is used as the semiconductor element. The semiconductor chip is a bare chip that is separated by cutting a semiconductor wafer. The bare chip has a functional surface on one of the front and back sides that functions as a semiconductor element. Electrodes are provided on the surface of the functional surface, and the electronic component C is mounted by flip-chip connection that bonds to electrode pads on a substrate S.

[0013] The electronic component C has a plurality of positioning marks provided on a surface on which electrodes of the electronic component C are formed, that is, on a face. This embodiment is an example of an apparatus for face-down mounting in which the face side faces the board S.

[0014] [substrate] In this embodiment, the substrate S on which the electronic component C is mounted is a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed, etc. The substrate S is provided with a mounting area B in which the electronic component C is mounted, and a plurality of marks for positioning are provided outside the mounting area B.

[0015] [Mounting equipment] The mounting device 1 of this embodiment is a device that directly mounts electronic components C and a substrate S whose bonding surfaces have been cleaned and activated by plasma processing or the like, without using adhesives or the like. As shown in Figs. 1 and 2, the mounting device 1 has a substrate support section 2 that supports and moves the substrate S, a mounting section 3 that directly mounts the electronic components C on the substrate S, a first imaging section 4 that images the marks of the electronic components C held in the mounting section 3 from below, a second imaging section 5 that images the marks of the substrate S from a position above the mounting section 3, a supply section 6 that supplies the electronic components C, a transport section 7 that transports the electronic components C from the supply section 6 to the mounting position OA, a first irradiation section 8 that irradiates ultraviolet light onto the electronic components C before mounting, a second irradiation section 9 that irradiates ultraviolet light onto the mounting area B of the substrate S, and a control device 100 that controls the operation of the mounting device 1.

[0016] In the following description, the direction in which the mounting unit 3 moves the electronic component C to mount it on the board S is referred to as the Z axis, and the two axes perpendicular to each other in a plane perpendicular to the Z axis are referred to as the X axis and the Y axis. In this embodiment, the Z axis is vertical, the direction following gravity is referred to as the downward direction, and the direction against gravity is referred to as the upward direction, and the position on the Z axis is referred to as the height. The X axis and the Y axis are on a horizontal plane, and when viewed from the front side of FIG. 1, the X axis is the left-right direction, and the Y axis is the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, the side on which the electronic component C is mounted is referred to as the upper side and the opposite side is referred to as the lower side with respect to the board S or the board support unit 2.

[0017] The board support unit 2 is a mechanism that supports and moves the board S on which the electronic components C are mounted, and is a so-called board stage. The mounting unit 3 is a mechanism that directly mounts the electronic components C on the board S. The mounting unit 3 has a mounting head 31 that holds the electronic components C. The mounting head 31 has a transmission portion that allows a mark on the board S facing the electronic components C to be recognized through transmission while holding the electronic components C.

[0018] The board support unit 2 and the mounting unit 3 each have a positioning mechanism. The positioning mechanism performs positioning of the board S and the electronic component C based on the positions of the board S and the electronic component C determined from the images of the marks captured by the first imaging unit 4 and the second imaging unit 5. Each unit of the mounting apparatus 1 as described above is mounted on a support stand 11 installed on an installation surface. The top surface of the support stand 11 is a horizontal plane.

[0019] The supply unit 6 supplies electronic components C. The transfer unit 7 transfers the electronic components C from the supply unit 6 to the mounting position OA. The transfer unit 7 has a pickup unit 71 and a movement mechanism 73. The pickup unit 71 has a pickup head 700 that picks up the electronic components C from the supply unit 6 at the pickup position PU and passes them to the mounting head 31. The movement mechanism 73 moves the mounting head 31 and the pickup head 700 relative to each other. The movement mechanism 73 in this embodiment moves the pickup unit 71 into the space created by the board support unit 2 retracting the board S from the mounting position OA, and positions it at the mounting position OA.

[0020] The first irradiation unit 8 irradiates ultraviolet light individually onto the electronic components C before mounting. In this embodiment, the first irradiation unit 8 is provided so as to be movable together with the pickup head 700 by a moving mechanism 73. The second irradiation unit 9 irradiates ultraviolet light individually onto the mounting area B of the substrate S where the electronic components C are to be mounted. By such irradiation of ultraviolet light, the bonding surfaces of the electronic components C and the mounting area B are cleaned and activated.

[0021] The control device 100 controls the operation of the mounting device 1. The control device 100 is configured, for example, by an electronic circuit or a computer that operates according to a predetermined program. In other words, the control device 100 executes control of the mounting device 1 by a processing device such as a PLC reading out a program and data from a storage device. Each part will be described in detail below.

[0022] (Substrate support part) As shown in Fig. 1 and Fig. 2, the substrate support unit 2 is disposed on a support base 11, and includes a stage 21 and a driving mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The driving mechanism 22 is, for example, a two-axis moving mechanism having a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and moving the stage 21 in a horizontal plane by a ball screw, a linear motor, or the like, driven by a rotary motor (not shown). This driving mechanism 22 functions as a positioning mechanism that positions the substrate S. Although not shown, the driving mechanism 22 includes a θ driving mechanism that rotates and moves the stage 21 in a horizontal plane.

[0023] The driving mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.

[0024] Although not shown, a loader / unloader that supplies / stores the substrate S to / from the stage 21 is provided at one of the moving ends in the X-axis direction of the stage 21 of the substrate support unit 2 (specifically, the moving end on the right side in the figure). With the stage 21 moved to the moving end, the substrate support unit 2 receives the substrate S from the loader and passes the substrate S to the unloader.

[0025] (Mounting section) The mounting unit 3 has a mounting head 31 and a drive mechanism 32. The mounting head 31 has a roughly rectangular parallelepiped shape, and has a hollow portion 31a and a holding portion 31b as a transmission portion. The hollow portion 31a is a cylindrical through-hole formed with the Z-axis direction as its axis. The holding portion 31b is a plate-like member that can transmit light for imaging, and is attached so as to cover the opening of the hollow portion 31a on the side facing the substrate S. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool, and holds the electronic component C.

[0026] A suction hole 31c is formed in the center of the holding portion 31b, which is connected to a suction path formed in the holding portion 31b. The suction path inside the holding portion 31b is a flow path for connecting the suction hole 31c to a negative pressure source (not shown), and is provided so that the electronic component C can be sucked and held by generating negative pressure in the suction hole 31c. The area where the holding portion 31b sucks and holds the electronic component C and its surroundings can be imaged through the electronic component C held by the pickup head 700. Even when the holding portion 31b sucks and holds the electronic component C, the mark on the board S can be imaged through the area. In other words, the mounting head 31 has a transparent portion so that the mark on the board S can be imaged by the second imaging unit 5.

[0027] The driving mechanism 32 includes movable bodies 33, 34, and 35, and is a mechanism for driving the mounting head 31. The movable body 33 is provided movably along a Y-axis guide rail 33a provided on the support base 11. The movable body 34 is provided movably along an X-axis guide rail 34a provided on the top surface of the movable body 33. The movable body 35 is provided movably along a Z-axis guide rail 35a provided on the front surface of the movable body 34. The movable body 35 is formed in a generally concave shape in a plan view. These movable bodies 33, 34, and 35 are driven by a ball screw, a linear motor, or the like, driven by a rotary motor.

[0028] The mounting head 31 is provided under a movable body 35 that moves in the Z-axis direction. The movable body 35 performs an operation for mounting the electronic component C held by the holding portion 31b of the mounting head 31 onto the board S. The movable body 35 on which the mounting head 31 is provided moves in the X-axis direction and the Y-axis direction by the movement of the movable bodies 33 and 34. This causes the driving mechanism 32 to function as a positioning mechanism that positions the electronic component C held by the mounting head 31. Although not shown in the figure, the driving mechanism 32 includes a θ driving mechanism that rotates and moves the mounting head 31 within a horizontal plane.

[0029] (First imaging unit) The first imaging unit 4 has a camera, a lens, a lens barrel, a light source, etc., and is fixed to a receiving hole 11a provided in the support base 11. The first imaging unit 4 is disposed so that the optical axis of the camera can capture an image of the mark of the electronic component C held by the mounting head 31. Specifically, the first imaging unit 4 is disposed so that the optical axis is in the vertical direction.

[0030] (Second imaging unit) The second imaging unit 5 has a camera, a lens, a lens barrel, a light source, etc., and is supported and fixed by a frame (not shown) or the like above the support stand 11, more specifically, at a position above the mounting head 31. The second imaging unit 5 is disposed in a direction such that the optical axis of the camera passes through the holding portion 31b of the mounting head 31 and can capture an image of the marks around the mounting area B of the board S. In other words, it is disposed so that the optical axis is vertical.

[0031] (Supply Department) The supply unit 6 has a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device that supports a wafer sheet WS to which electronic components C are attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. In this embodiment, the electronic components C are formed by dividing a wafer attached to the wafer sheet WS into individual pieces. The wafer sheet WS is attached to a wafer ring R (see FIG. 4). The support mechanism 61 has a ring holder 61a to which the wafer ring R is attached. The support mechanism 61 is ring-shaped with a hollow inside of the wafer ring R. The ring holder 61a is also ring-shaped like the wafer ring R. This forms a space below the wafer attached to the wafer sheet WS.

[0032] Although not shown, a loader / unloader that supplies / stores the wafer ring R in the ring holder 61a is provided at one of the moving ends of the support mechanism 61 in the Y-axis direction (specifically, the moving end on the front side in the figure). When the support mechanism 61 is moved to the moving end, the support mechanism 61 receives the wafer ring R from the loader and passes the wafer ring R to the unloader.

[0033] Although not shown, the support mechanism 61 has an expanding mechanism that stretches the wafer sheet WS with the ring holder 61a to create gaps between the electronic components C, and a push-up mechanism that holds the stretched wafer sheet WS and pushes up the electronic components C from below to separate them from the wafer sheet WS. The support mechanism 61 also has a θ drive mechanism that rotates the ring holder 61a within a horizontal plane. The push-up mechanism is fixedly disposed on the support base 11 inside the ring-shaped support mechanism 61, and the transfer unit 7 receives the electronic components C from the supply unit 6, that is, picks them up, at this position (pick-up position PU).

[0034] The driving mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the driving mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and moves the support mechanism 61 in the X-axis and Y-axis directions in a horizontal plane by a ball screw, a linear motor, or the like driven by a rotary motor (not shown). The driving mechanism 62 functions as a positioning mechanism that positions the electronic component C with respect to the pickup unit 71.

[0035] (transfer department) The transport unit 7 moves the mounting head 31 and the pick-up head 700 relative to each other. The transport unit 7 includes a pick-up unit 71, an arm unit 72, and a moving mechanism 73. As shown in Figs. 3A and 3B, the pick-up unit 71 includes a pick-up head 700 and an inverting unit 710. The pick-up head 700 is a member that sucks and holds an electronic component C and releases the electronic component C by releasing the suction. In this embodiment, the pick-up head 700 is moved by the transport unit 7 to deliver the electronic component C to the mounting head 31. However, the movement for delivery only needs to be relative, and either or both of the pick-up head 700 and the mounting head 31 may move. Note that in Figs. 1 and 2, the dotted lines in the figures show the pickup unit 71 moving to a position where it delivers the electronic component C to the mounting head 31 located at the mounting position OA.

[0036] As shown in FIGS. 3A and 3B, the pickup head 700 has a support portion 701, a collet 702, and a detachable portion 703. The support portion 701 is a rectangular column attached to the reversing portion 710. The collet 702 is a metal member having a rectangular parallelepiped shape. The collet 702 is provided with a suction hole 702a, which is a through hole that attracts the electronic component C by negative pressure. The detachable portion 703 is provided at one end of the support portion 701, and detachably holds the collet 702. The detachable portion 703 has a magnet therein, and attracts and holds the collet 702 by the magnetic attraction. The contact surfaces of the detachable portion 703 and the collet 702 are provided with projections and recesses that fit together to prevent misalignment. The suction hole 702a of the collet 702 communicates with a negative pressure generating circuit including a vacuum pump, a valve, etc., via a ventilation path and piping (not shown) provided in the attachment / detachment portion 703 and the support portion 701.

[0037] The reversing unit 710 reverses the pick-up head 700. This reverses the electronic component C that is sucked and held by the pick-up head 700, up and down. In this embodiment, the first irradiation unit 8 is provided in the reversing unit 710. That is, the pick-up head 700 and the first irradiation unit 8 are provided by the reversing unit 710 so as to be rotatable between a direction facing the wafer sheet WS and a direction facing the mounting head 31.

[0038] The reversing unit 710 has a driving unit 711 and a rotating body 712. The driving unit 711 can be, for example, a rotary motor. The rotating body 712 is connected to the driving unit 711 and is provided so as to be rotatable around an axis in the Y direction. The pick-up head 700 and the first irradiation unit 8 are attached to the rotating body 712 via a support unit 701 and are provided so as to be rotatable (reversible) together with the rotating body 712. The pick-up head 700 and the first irradiation unit 8 are provided adjacent to each other so that the first irradiation unit 8 can irradiate ultraviolet light to an electronic component C adjacent to the electronic component C picked up by the pick-up head 700.

[0039] The arm 72 is a member having a pickup unit 71 at one end. As shown in FIG. 2, the arm 72 has an extension 72a and a base 72b. The extension 72a is an L-shaped member formed by a rectangular parallelepiped member extending linearly in the Y-axis direction toward the front and a rectangular parallelepiped member extending linearly in the X-axis direction toward the mounting unit 3. At one end of the extension 72a toward the mounting unit 3, a reversing unit 710 is provided so that the rotation axis of the driving unit 711 is in the Y-axis direction. The pickup head 700 and the first irradiation unit 8 are attached to the rotation axis of the driving unit 711 via a rotating body 712, so that the pickup head 700 and the first irradiation unit 8 are rotatably provided. The base 72b is a plate-like body parallel to the X-axis direction, and is fixed to the other end of the extension 72a (see FIG. 4).

[0040] The moving mechanism 73 drives the arm unit 72 to move the pickup unit 71 between the supply unit 6 and the mounting position OA. As shown in FIG. 4, the moving mechanism 73 has a fixed body 731, a first driving unit 732, a moving body 733, and a second driving unit 734. Note that the first irradiation unit 8 is not shown in FIG. 4. The fixed body 731 is a rectangular parallelepiped member fixed to the support base 11 (see FIG. 2) and extending in the X-axis direction. The position of the fixed body 731 is fixed with respect to the mounting position OA.

[0041] The first driving unit 732 drives the arm unit 72 in the X-axis direction. The first driving unit 732 has a first driving source 732a and a first sliding unit 732b. The first driving source 732a is a linear motor extending in the X-axis direction, and is provided along the upper surface of the fixed body 731 (a surface parallel to the XY plane). The first sliding unit 732b is a linear guide extending in the X-axis direction, and is provided on the front surface of the fixed body 731 (a surface parallel to the XZ plane).

[0042] The movable body 733 is a rectangular parallelepiped block to which a movable element of the first driving source 732a and a slider of the first sliding portion 732b are attached, so that the movable body 733 is slidably movable in the X-axis direction in accordance with the operation of the first driving source 732a.

[0043] The second driving unit 734 drives the arm unit 72 in the Z-axis direction. The second driving unit 734 has a second driving source 734a and a second sliding unit 734b. The second driving source 734a is a linear motor extending in the Z-axis direction, and is provided on the moving body 733. The second sliding unit 734b is a linear guide extending in the Z-axis direction, and is provided on the moving body 733.

[0044] The base portion 72b of the arm portion 72 has a movable element of a second drive source 734a attached thereto, and also has a slider of a second sliding portion 734b attached thereto, so that the base portion 72b is slidably provided in the Z-axis direction.

[0045] (First irradiation unit) The first irradiation unit 8 uses, for example, an LED element that outputs ultraviolet light as a light source. The first irradiation unit 8 of this embodiment irradiates ultraviolet light onto the electronic components C in the supply unit 6 before the pickup head 700 picks up the electronic components C from the supply unit 6. That is, the first irradiation unit 8 irradiates ultraviolet light onto the electronic components C on the wafer sheet WS mounted on the supply unit 6. As described above, the first irradiation unit 8 is provided so as to be movable together with the pickup head 700 by the moving mechanism 73. More specifically, as shown in FIGS. 3(A) and (B), the first irradiation unit 8 is attached to a position adjacent to the pickup head 700 on the rotating body 712. The adjacent position here refers to a position where the first irradiation unit 8 can irradiate ultraviolet light onto the electronic components C adjacent to the electronic components C picked up by the pickup head 700 (see FIG. 5(A)). The electronic components C adjacent to the electronic components C to be picked up are the electronic components C to be picked up next. The first irradiating section 8 is connected to the control device 100 via wiring (not shown), whereby the light emission is controlled.

[0046] (Second irradiation unit) The second irradiation unit 9 uses, as a light source, for example, an LED element that outputs ultraviolet light. In this embodiment, the second irradiation unit 9 is provided on the side of the moving body 35 on which the mounting head 31 is provided, so that it can irradiate ultraviolet light downward. The mounting area B of the board S supported by the stage 21 of the board support unit 2 is positioned below the second irradiation unit 9 by the drive mechanism 22, and ultraviolet light is irradiated immediately before the electronic component C is mounted in the mounting area B. In this way, the time from UV irradiation to mounting can be shortened. The second irradiation unit 9 is connected to the control device 100 via wiring (not shown), so that light emission is controlled.

[0047] (Control device) The control device 100 controls the first imaging unit 4, the second imaging unit 5, the transport unit 7, the negative pressure generating circuit, the positioning mechanism, and the like.

[0048] Furthermore, the control device 100 controls the moving mechanism 73 of the transfer unit 7 and the drive mechanism 62 of the supply unit 6 based on map information indicating the position coordinates of the electronic components C on the wafer sheet WS, thereby sequentially positioning the electronic components C to be picked up at the pick-up position PU. Picking up here refers to removing the electronic components C from a member on which they are placed, such as the wafer sheet WS, and receiving them.

[0049] Furthermore, the control device 100 controls the positioning of the pick-up head 700 of the pick-up unit 71 and the first irradiation unit 8 at the pick-up position PU, the irradiation of ultraviolet light by the first irradiation unit 8 on the electronic component C, holding of the electronic component C by the pick-up head 700, the inversion of the pick-up head 700 by the inversion unit 710, movement of the pick-up unit 71 by the moving mechanism 73 to the mounting position OA where the mounting head 31 is waiting, the transfer of the electronic component C from the pick-up head 700 to the mounting head 31, the irradiation of ultraviolet light by the second irradiation unit 9 on the mounting area B, the positioning of the mounting area B of the substrate S at the mounting position OA by the substrate support unit 2, and mounting of the electronic component C in the mounting area B by the mounting head 31.

[0050] [Operation] The operation of the present embodiment as described above will be described with reference to the flowchart of FIG. 6 in addition to the above-mentioned FIG. 1 to FIG. 5. In the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support unit 2, and is retreated together with the stage 21 from the position facing the mounting head 31, that is, the mounting position OA. In FIG. 4, the wafer sheet WS, the electronic components C and the wafer ring R, which are attached to the wafer sheet WS and are obtained by dividing the wafer, are shown in a Y-direction cross section on the pickup position PU. In FIG. 5, the wafer sheet WS, the electronic components C and the wafer ring R, which are attached to the wafer sheet WS and are obtained by dividing the wafer, and the substrate S, which is shown by a schematic representation of the mounting area B, are shown in an X-direction cross section on the pickup position PU. For ease of understanding, the pickup positions PU on the wafer sheet WS in FIG. 4 and FIG. 5 are not the same. In addition, the electronic components C and the mounting area B of the substrate S, which are irradiated with ultraviolet light, which will be described later, are shown hatched.

[0051] A wafer ring R with a wafer sheet WS attached thereto is attached by an autoloader to a ring holder 61a of a support mechanism 61 in the supply unit 6 (see FIG. 2). Electronic components C, which are individual pieces of a wafer, are attached to the wafer sheet WS.

[0052] First, the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pick-up position PU. Then, the arm unit 72 moves in the X-axis and Z-axis directions to position the first irradiation unit 8 at the pick-up position PU, as shown in Fig. 5(A). In other words, the first irradiation unit 8 is positioned directly above the electronic component C to be picked up, and ultraviolet light is irradiated onto the electronic component C to be picked up (step S101).

[0053] Next, the arm unit 72 moves in the X-axis direction to position the tip of the pickup head 700 of the pickup unit 71 at the pickup position PU, i.e., directly above the electronic component C to be picked up. At this time, the first irradiation unit 8 is positioned directly above the electronic component C adjacent to the electronic component C to be picked up, as shown in FIG. 5(B). The electronic component C adjacent to the electronic component C to be picked up is the next electronic component C to be picked up. That is, FIG. 5 shows that the electronic components C on the wafer sheet WS are picked up from the right end toward the left. In this state, the first irradiation unit 8 irradiates ultraviolet light onto the electronic component C directly below, and the pickup head 700 adsorbs the electronic component C that has been pushed up by a push-up mechanism (not shown) at the pickup position PU (step S102).

[0054] After the pickup head 700 adsorbs and holds the electronic component C, it moves in the Z-axis direction away from the wafer sheet WS, thereby removing the electronic component C from the wafer sheet WS and picking it up (step S103), as shown in FIG. 5(C).

[0055] 3(A) and 3(B), the reversing unit 710 rotates the pick-up head 700 by 180° to reverse the electronic component C. As shown in Fig. 1 and Fig. 5(D), the arm unit 72 moves in the X-axis direction, so that the pick-up head 700 of the pick-up unit 71 comes to a position (mounting position OA) facing the holding unit 31b of the mounting head 31, and the arm unit 72 moves in the Z-axis direction, so that the electronic component C approaches the holding unit 31b.

[0056] The electronic component C is held by the holder 31b of the mounting head 31 by suction from the suction hole 31c of the mounting head 31, and the electronic component C is transferred to the holder 31b by releasing the suction of the electronic component C by the pickup head 700 (step S104). After the transfer of the electronic component C is completed and the pickup head 700 is retracted from directly below the mounting head 31, the first imaging unit 4 captures an image of the mark of the electronic component C held by the mounting head 31, and the control device 100 calculates the amount of deviation between the position of the mark captured by the first imaging unit 4 and a reference position, and operates the driving mechanism 32 so as to eliminate the amount of deviation, thereby positioning the electronic component C. After the first imaging unit 4 finishes capturing the image, the board support unit 2 positions the mounting area B where the electronic component C is to be mounted to a position facing the second irradiation unit 9, as shown in FIG. 5(E), and the second irradiation unit 9 irradiates the mounting area B where the electronic component C is to be mounted with ultraviolet light.

[0057] In the above, the mounting area B of the board S is irradiated with ultraviolet light after the electronic component C is handed over to the mounting head 31, but if the pickup head 700 is not at the mounting position OA, the board S may be moved to irradiate the mounting area B with ultraviolet light. In other words, the mounting area B may be irradiated with ultraviolet light in advance in the state shown in Figures 5(B) and (C). In this way, if ultraviolet light is irradiated in advance, mounting can be performed immediately after the handover, and the takt time can be shortened.

[0058] After irradiating the mounting area B with ultraviolet light, the board support unit 2 moves the mounting area B, where the electronic component C is to be mounted, to the mounting position OA. At this time, the second imaging unit 5 captures an image of the mark on the board S that is visible in the transparent area around the electronic component C through the mounting head 31. The control device 100 calculates the amount of deviation between the position of the mark captured by the second imaging unit 5 and a reference position, and positions the board S by operating the driving mechanism 22 so as to eliminate the amount of deviation. As shown in FIG. 5(F), the driving mechanism 32 drives the mounting head 31 toward the board S, and the electronic component C held by the mounting head 31 is mounted on the board S (step S105).

[0059] If the next electronic component C is not the last electronic component C to be picked up (NO in step S106), the processes from step S102 onwards are repeated. In this manner, by repeating the operations of transferring the electronic components C from the wafer sheet WS, handing over the electronic components C to the mounting head 31, positioning the electronic components C and the board S, and mounting, the electronic components C are sequentially mounted in each mounting area B of the board S. The board S on which a predetermined number of electronic components C have been mounted is transported by the board support section 2 and stored in the unloader.

[0060] If the next electronic component C is the last electronic component C to be picked up (YES in step S106), the pickup head 700 adsorbs the electronic component C in the same manner as above, but the first irradiation unit 8 does not irradiate it with ultraviolet light (step S107). Then, in the same manner as above, the electronic component C is picked up (step S108), the electronic component C is transferred, and the second irradiation unit 9 irradiates it with ultraviolet light (step S109), and the electronic component C is mounted (step S110). The wafer sheet WS from which all the electronic components C to be mounted have been picked up is transported by the support mechanism 61 and stored in the unloader.

[0061] [Effects] (1) The mounting apparatus 1 of this embodiment includes a mounting unit 3 that directly mounts electronic components C held by a mounting head 31 onto a substrate S, a supply unit 6 that supplies the electronic components C, a pickup unit 71 that picks up electronic components C from the supply unit 6 using a pickup head 700 and passes them to the mounting head 31, a moving mechanism 73 that moves the mounting head 31 and the pickup head 700 relative to one another, a substrate support unit 2 that supports and moves the substrate S, a first irradiation unit 8 that irradiates ultraviolet light individually onto the electronic components C before mounting, and a second irradiation unit 9 that irradiates ultraviolet light individually onto mounting areas B of the substrate S where the electronic components C are to be mounted.

[0062] Furthermore, this embodiment is a mounting method for directly mounting an electronic component C onto a substrate S, in which the pick-up head 700 of the pick-up unit 71 picks up an electronic component C from the supply unit 6 which supplies the electronic components C, the mounting head 31 of the mounting unit 3 receives the electronic component C from the pick-up head 700, and mounts the received and held electronic component C onto a substrate S supported by the substrate support unit 2, and before mounting, the first irradiation unit 8 irradiates ultraviolet light onto the electronic component C in the supply unit 6 or the electronic component C held by the mounting head 31, and before mounting, the second irradiation unit 9 irradiates ultraviolet light onto the mounting area B of the substrate S where the electronic component C is to be mounted.

[0063] When cleaning and activating the bonding surface required for mounting the electronic component C directly to the substrate S, is performed on multiple electronic components C or multiple mounting areas B of the substrate S on which the multiple electronic components C are placed, all at once before supplying the electronic components C and the substrate S to the mounting device 1, there are problems as follows. That is, since the mounting device 1 mounts the electronic components C one by one, the state of the bonding surface changes depending on the time that elapses between mounting the first electronic component C and mounting the last electronic component C. As time passes after the cleaning and activation process, the state in which water molecules are easily bonded is gradually lost, and the possibility of organic matter adhering to the surface increases. As a result, the state of cleaning and activation is degraded on the surface on which the waiting electronic component C is mounted and on the mounting area B of the substrate S, and the bonding strength between the electronic component C to be mounted later and the substrate S is reduced. In the mounting of this embodiment, as described above, each electronic component C can be individually irradiated with ultraviolet light to clean and activate it before being mounted in the mounting area B of the substrate S. This makes it less likely that there will be differences in the time between cleaning and activating each electronic component C and mounting it, thereby reducing differences in the bonding strength of each electronic component C.

[0064] (2) The first irradiating unit 8 irradiates the electronic components C in the supply unit 6 with ultraviolet light before the pick-up head 700 picks up the electronic components C from the supply unit 6. That is, the first irradiating unit 8 irradiates the electronic components C on the wafer sheet WS mounted in the supply unit 6 with ultraviolet light. For this reason, there is no difference in the time from when each electronic component C is cleaned and activated until it is mounted.

[0065] (3) The first irradiation unit 8 is provided so as to be movable together with the pickup head 700 by the moving mechanism 73. Therefore, the first irradiation unit 8 can be positioned with respect to the electronic component C by the moving mechanism 73 shared with the pickup head 700, and the device configuration can be simplified.

[0066] (4) The first irradiation unit 8 is provided adjacent to the pick-up head 700 so as to be able to irradiate ultraviolet rays to electronic components C adjacent to the electronic component C picked up by the pick-up head 700. Therefore, since the pick-up head 700 can pick up an electronic component C and irradiate the adjacent electronic component C with ultraviolet rays, there is no need to set aside time for irradiation separately from the pick-up.

[0067] (5) The pickup unit 71 has a reversing unit 710 that reverses the pickup head 700, and the first irradiation unit 8 is provided in the reversing unit 710 so as to be reversible together with the pickup head 700. Therefore, the first irradiation unit 8 can be provided adjacent to the reversing pickup head 700 without interfering with the operation of the reversing pickup head 700, and the first irradiation unit 8 can easily irradiate ultraviolet light to electronic components C adjacent to the electronic component C to be picked up.

[0068] [Variations] (1) Two first irradiation units 8 may be arranged on either side of the pickup head 700. For example, as shown in Figs. 7(A) and (B), two first irradiation units 8 are attached to a rotating body 712 on either side of the pickup head 700. This allows ultraviolet light to be irradiated by one of the first irradiation units 8 to the next electronic component C to be picked up, adjacent to the electronic component C to be picked up, even if the electronic components C move in the opposite directions relative to each other for picking up, as shown in Fig. 8.

[0069] Moreover, the first irradiation unit 8 does not necessarily have to be provided on the rotating body 712. For example, as shown in Fig. 9(A) and (B), the first irradiation unit 8 may be fixed to the extension portion 72a of the arm unit 72. Even in this case, as shown in Fig. 10(A) and (B), two first irradiation units 8 may be arranged on either side of the pickup head 700.

[0070] (2) The first irradiation unit 8 may irradiate the electronic component C to be picked up by the pick-up head 700 with ultraviolet light. That is, the first irradiation unit 8 irradiates the electronic component C to be picked up at the pick-up position PU before it is picked up with ultraviolet light (FIG. 11(A)), and then the pick-up head 700 picks up the electronic component C immediately after the irradiation at the pick-up position PU (FIG. 11(B)), and delivers it to the mounting head 31 for mounting (see FIGS. 5(D) to (F)). While the mounting is being performed by the mounting head 31, the electronic component C to be picked up next is positioned at the pick-up position PU, and similarly, the first irradiation unit 8 irradiates the electronic component C with ultraviolet light before it is picked up (FIG. 11(C)), and then the pick-up head 700 picks up the electronic component C immediately after the irradiation at the pick-up position PU (FIG. 11(D)), and delivers it to the mounting head 31 for mounting (see FIGS. 5(D) to (F)). This makes it possible to shorten the time from when each electronic component C is irradiated with ultraviolet light until it is mounted.

[0071] (3) After the pickup head 700 transfers the electronic component C to the mounting head 31, the first irradiation unit 8 may irradiate the electronic component C held by the mounting head 31 with ultraviolet light. For example, as shown in Fig. 12(A), after the pickup head 700 transfers the electronic component C to the mounting head 31, the pickup head 700 may move so that the adjacent first irradiation unit 8 faces the electronic component C, and the first irradiation unit 8 may irradiate ultraviolet light. This makes it possible to shorten the time from when the electronic component C is irradiated with ultraviolet light until it is mounted.

[0072] 12(B), a first irradiation unit 8 may be provided at the tip of an arm 8a swingably provided on the support base 11, and the electronic component C may be transferred from the pickup head 700 to the mounting head 31, and the pickup head 700 may move away from directly below the mounting head 31, after which the arm 8a may swing so that the first irradiation unit 8 faces the electronic component C, and the first irradiation unit 8 may irradiate the electronic component C with ultraviolet light. Since ultraviolet light can be irradiated onto the electronic component C during the period from when the pickup head 700 returns to pick up the next electronic component C until the next electronic component C is picked up and handed over to the mounting head 31, including the time taken for the pickup head 700 to return, the tact time can be shortened. Also, the time required for irradiation with ultraviolet light for cleaning and activation can be reliably secured.

[0073] Furthermore, in this case, it is easy to prevent the stage 21 from interfering with the first irradiation unit 8 so that the stage 21 can move the board S so that the second irradiation unit 9 is located in the mounting area B to be irradiated with ultraviolet light when the first irradiation unit 8 is directly under the mounting head 31 to irradiate the electronic component C with ultraviolet light. This allows the second irradiation unit 9 to irradiate the mounting area B with ultraviolet light in parallel with the irradiation of the electronic component C with ultraviolet light by the first irradiation unit 8, so that the tact time can be further shortened. In this way, if the first irradiation unit 8 is installed separately from the pickup head 700, it can irradiate the electronic component C to be picked up and the electronic component C adjacent to it regardless of the pickup direction, so that one first irradiation unit 8 can handle any pickup direction. It is sufficient that the first irradiation unit 8 can be positioned so that the electronic component C held by the mounting head 31 can be irradiated with ultraviolet light, and the movement for this purpose is not limited to swinging.

[0074] (4) The second irradiation unit 9 is not limited to being provided on the moving body 35. For example, as shown in Fig. 13, the second irradiation unit 9 may be provided at the tip of a swinging arm 9a provided on the support base 11 so as to be able to irradiate ultraviolet light onto the mounting area B of the board S supported by the board support unit 2. In this case, when the electronic component C is transferred to the holder 31b and the image capturing by the first image capturing unit 4 is completed, the arm 9a swings and the second irradiation unit 9 moves above the board S on the stage 21. Thereafter, the board support unit 2 positions the mounting area B where the electronic component C is to be mounted in a position facing the second irradiation unit 9, and the second irradiation unit 9 irradiates ultraviolet light onto the mounting area B where the electronic component C is to be mounted.

[0075] After irradiating the mounting area B with ultraviolet light, the board support unit 2 moves the mounting area B, where the electronic component C is to be mounted, to the mounting position OA. At this time, the second imaging unit 5 images the mark on the board S visible in the transparent area around the electronic component C through the mounting head 31 to position the board S. Then, the driving mechanism 32 drives the mounting head 31 toward the board S, and the electronic component C held by the mounting head 31 is mounted on the board S.

[0076] In the above, the mounting area B of the board S is irradiated with ultraviolet light after the electronic component C is transferred to the mounting head 31. However, the arm 9a and the board support unit 2 may be moved to irradiate the mounting area B with ultraviolet light before the electronic component C is transferred to the mounting head 31. In this case, even if the pickup head 700 is at the mounting position OA, the mounting area B of the board S can be irradiated with ultraviolet light. In this way, if the mounting area B of the board S is irradiated with ultraviolet light in advance, the electronic component C can be mounted immediately after being transferred to the mounting head 31, and the tact time can be shortened. In addition, the irradiation of ultraviolet light by the first irradiation unit 8 to the electronic component C held by the mounting head 31 and the irradiation of ultraviolet light by the second irradiation unit 9 to the mounting area B can be performed in parallel. In particular, when combined with the embodiment of the pickup head 700 and the first irradiation unit 8 illustrated in FIG. 12(A), the tact time can be further shortened.

[0077] FIG. 14(A) shows a configuration in which a second irradiation unit 9 is provided at the tip of an arm 9a, and a first irradiation unit 8 is provided at the tip of the swinging arm 8a, so that an electronic component C before being picked up can be irradiated with ultraviolet light. In this case, as shown in FIG. 14(A), irradiation of ultraviolet light by the first irradiation unit 8 provided on the arm 8a to the electronic component C before being picked up and irradiation of ultraviolet light by the second irradiation unit 9 provided on the arm 9a to the mounting area B can be performed in parallel. Also, FIG. 14(B) shows an example in which the embodiment illustrated in FIG. 12(B) is combined with an embodiment in which a second irradiation unit 9 is provided at the tip of the arm 9a. In this case, irradiation of ultraviolet light by the first irradiation unit 8 to the electronic component C held by the mounting head 31 and irradiation of ultraviolet light by the second irradiation unit 9 to the mounting area B can be performed in parallel.

[0078] (5) The first irradiation unit 8 may be provided in the pickup head 700. In this case, as shown in FIG. 14(C), the first irradiation unit 8 provided in the arm 8a can irradiate the electronic component C before pickup with ultraviolet light, and the second irradiation unit 9 provided in the arm 9a can irradiate the mounting area B with ultraviolet light in parallel. As an example of a mode in which the first irradiation unit 8 is provided in the pickup head 700, as shown in FIG. 15(A), a light source of the first irradiation unit 8 is provided in the ventilation path 701a provided in the detachable unit 703 and the support unit 701. The detachable unit 703 and the collet 702 are made of a material that can transmit ultraviolet light. Also, as shown in FIG. 15(B), a window 704 that can transmit ultraviolet light may be provided at the end of the support unit 701 opposite to the collet 702, and the light source of the first irradiation unit 8 may be provided on the window 704. Furthermore, since the first irradiation unit 8 installed on the pickup head 700 in this manner can irradiate the electronic component C to be picked up and adjacent electronic components C regardless of the pickup direction, any pickup direction can be handled by a single first irradiation unit 8. After the electronic component C is transferred to the holder 31b, the electronic component C can also be irradiated with ultraviolet light.

[0079] 16 , the mounting device 1 may be an apparatus in which the mounting head 31 moves to a delivery position DP to receive an electronic component C from a pickup head 700, and then returns to the mounting position OA to mount the electronic component C in the mounting area B. In this case, a first irradiation unit 8 that irradiates ultraviolet light toward the electronic component C held by the mounting head 31 and a second irradiation unit 9 that irradiates ultraviolet light toward the substrate S supported by the substrate support unit 2 are provided at the tip of an arm 8a that is swingably provided on the support base 11.

[0080] In this case, as shown in Figures 17(A) and (B), the pickup head 700 picks up the electronic component C and delivers it to the mounting head 31 at the delivery position DP. Then, as shown in Figure 17(C), when the mounting head 31 returns to the mounting position OA, the first irradiation unit 8 and the second irradiation unit 9 irradiate both the electronic component C held by the mounting head 31 and the mounting area B of the board S with ultraviolet light. Thereafter, as shown in Figure 17(D), the mounting head 31 descends and mounts the electronic component C in the mounting area B. In this way, by irradiating both the electronic component C and the mounting area B with ultraviolet light immediately before mounting, the time from irradiation of ultraviolet light to mounting can be significantly shortened.

[0081] Of course, even if the mounting head 31 does not move to receive the electronic component C as shown in FIG. 1, it is applicable as long as the distance between the mounting head 31 and the board S at the mounting position OA is set to a distance that allows the first irradiation unit 8 and the second irradiation unit 9 to be inserted, similar to the mounting device 1 shown in FIG. 16.

[0082] However, it is not necessary to irradiate both at the same time. For example, as shown in Fig. 18(A) and (B), when the pickup head 700 picks up an electronic component C and delivers it to the mounting head 31 at the delivery position DP, the second irradiation unit 9 irradiates the mounting area B of the board S with ultraviolet light. Then, as shown in Fig. 18(C), when the mounting head 31 returns to the mounting position OA, the first irradiation unit 8 irradiates the electronic component C held by the mounting head 31 with ultraviolet light. Thereafter, as shown in Fig. 18(D), the mounting head 31 descends and mounts the electronic component C in the mounting area B.

[0083] (7) The supply unit 6 is not limited to a device that supplies electronic components C attached to a wafer sheet WS. For example, the supply unit 6 may be a device that supplies electronic components C arranged on a tray. The moving mechanism 73 may be configured to pick up and transfer electronic components C individually from the supply unit 6. For this reason, the arm unit 72 may be configured to move in the X-axis and Y-axis directions, or the arm unit 72 and the support mechanism 61 may be configured to move in the X-axis and Y-axis directions.

[0084] [Other embodiments] The present invention is not limited to the above-described embodiment, and in the implementation stage, the components can be modified and embodied without departing from the gist of the invention. In addition, various inventions can be formed by appropriately combining the multiple components disclosed in the above-described embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, components from different embodiments may be appropriately combined. [Explanation of symbols]

[0085] 1 Mounting equipment 2 Board support 3. Mounting section 4 First imaging unit 5 Second imaging unit 6 Supply section 7 Transfer section 8 First irradiation section 8a Arm 9 Second irradiation section 9b Arm 11 Support stand 11a Receiving hole 21 Stage 22 Drive mechanism 22a Guide rail 22b Guide rail 23 Moving Board 23a Through hole 31 Mounting head 31a Hollow part 31b Holding part 31c Suction hole 32 Drive mechanism 33 Mobile 33a Guide rail 34 Mobile 34a Guide rail 35 Mobile 35a Guide rail 61 Support mechanism 61a Ring holder 62 Drive mechanism 62a Guide rail 62b Guide rail 71 Pickup section 72 Arm section 72a Extension 72b Base part 73 Moving mechanism 100 Control device 700 Pickup Head 701 Support part 701a Ventilation path 702 Colette 702a Suction hole 703 Detachable part 710 Inversion section 711 Drive unit 712 Rotating Body 721 Drive unit 731 Fixed body 732 First Drive 732a First driving source 732b First sliding part 733 Mobile 734 Second Drive 734a Secondary driving source 734b Second sliding part

Claims

1. a mounting section that directly mounts the electronic components held by the mounting head onto a substrate; a supply unit that supplies the electronic components; a pickup unit that picks up the electronic components from the supply unit by a pickup head and transfers them to the mounting head; a movement mechanism for moving the mounting head and the pickup head relative to each other; a substrate support section that supports and moves the substrate; a first irradiation unit that irradiates the electronic components individually with ultraviolet light before mounting; a second irradiation unit that irradiates ultraviolet light individually onto a mounting area of ​​the substrate where the electronic component is to be mounted; A mounting device comprising:

2. 2. The mounting apparatus according to claim 1, wherein the first irradiation section irradiates the electronic components in the supply section with ultraviolet light before the pick-up head picks up the electronic components from the supply section.

3. 2. The mounting apparatus according to claim 1, wherein the first irradiating section irradiates the electronic component held by the mounting head with ultraviolet light after the pickup head delivers the electronic component to the mounting head.

4. 2. The mounting apparatus according to claim 1, wherein the second irradiating section irradiates the mounting area with ultraviolet light in parallel with the irradiation of the electronic component with ultraviolet light by the first irradiating section.

5. 2. The mounting apparatus according to claim 1, wherein the first irradiation unit is movable together with the pickup head by the movement mechanism.

6. 6. The mounting apparatus according to claim 5, wherein the first irradiation unit is provided adjacent to the pick-up head so as to be able to irradiate ultraviolet light onto the electronic component adjacent to the electronic component picked up by the pick-up head.

7. 6. The mounting apparatus according to claim 5, wherein the first irradiation section is provided adjacent to the pick-up head so as to be able to irradiate the electronic component picked up by the pick-up head with ultraviolet light.

8. the pickup unit has a reversing unit that reverses the pickup head, 6. The mounting device according to claim 5, wherein the first irradiation section is provided in the reversing section so as to be reversible together with the pickup head.

9. A mounting method for directly mounting an electronic component onto a substrate, comprising the steps of: picking up the electronic components from a supply unit that supplies the electronic components by a pick-up head of a pick-up unit; a mounting head of a mounting unit receives the electronic component from the pickup head, and mounts the received and held electronic component on the board supported by a board support unit; a first irradiation unit irradiates the electronic component in the supply unit or the electronic component held by the mounting head with ultraviolet light before mounting; a second irradiation unit irradiates a mounting area of ​​the board where the electronic component is to be mounted with ultraviolet light before the mounting; A mounting method comprising:

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