Electronic component pick-up device and mounting device

Abstract

To provide a pickup device and a mounting device capable of satisfactorily peeling an electronic component from an adhesive sheet.SOLUTION: In a pickup device having a pickup portion for picking up electronic components attached to an adhesive sheet and a backup portion, the backup portion has an adsorption surface for adsorbing and holding the adhesive sheet, and a pressing portion 230 in which a plurality of rectangular cylindrical frame bodies 30 are arranged coaxially with a common shaft and nested in the adsorption surface so as to be movable. The pressing portion 230 has a notch 35 that is provided on a facing surface 31 of the plurality of frame bodies facing the adhesive sheet and sucks the adhesive sheet by negative pressure, and the facing surface 31 of each of the plurality of frame bodies has protruding portions 32 provided only at the four corners of the facing surface 31, the protruding portions that protrude toward the adhesive sheet and can press the electronic components through the adhesive sheet. The remaining parts of the facing surface 31 other than the four corners where the protruding portions 32 are provided is a non-pressing portion 33 that does not press the electronic components through the adhesive sheet.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a pickup device and a mounting device for electronic components. [Background technology]

[0002] When mounting semiconductor chips, which are electronic components, on a substrate such as a lead frame, wiring board, or interposer substrate, the semiconductor chips are picked up one by one and transferred to a predetermined position on the substrate for mounting. In this case, the semiconductor chips to be picked up may be attached to an adhesive sheet.

[0003] Such semiconductor chips are formed by cutting a wafer, which is a substrate, while it is attached to an adhesive sheet, and are then singulated, and remain attached to the adhesive sheet even after singulation. In order to peel and pick up electronic components such as semiconductor chips attached to an adhesive sheet, a pickup device having a pickup mechanism and a push-up mechanism is used. The pickup mechanism sucks the electronic components with a suction nozzle. The push-up mechanism pushes up the electronic components from the underside of the adhesive sheet with a pin or the like to assist in peeling the electronic components from the adhesive sheet.

[0004] Recently, semiconductor chips have been getting thinner. If a thin semiconductor chip is simply pushed up while stretching the adhesive sheet with a pin or the like, the semiconductor chip is likely to be damaged. Therefore, as shown in Patent Document 1, a pickup device has been developed that has multiple push-up bodies arranged concentrically with their axes aligned so that the peeling of the adhesive sheet attached to the underside of the semiconductor chip proceeds gradually from the periphery to the center of the semiconductor chip. In such a pickup device, the upper surface shape of the multiple push-up bodies is usually formed into the same shape as the semiconductor chip to be picked up, for example, rectangular.

[0005] In the above-mentioned pickup device, first, the adhesive sheet is sucked by negative pressure, while multiple push-up bodies are simultaneously raised to a predetermined height, and the entire underside of the semiconductor chip to be picked up is pressed and pushed up. Then, the push-up bodies are successively lowered, starting from the outermost push-up body, and the inner push-up bodies are successively lowered. As a result, the support of the underside of the semiconductor chip by the push-up bodies is successively released from the periphery toward the center, so that while the semiconductor chip is supported, the adhesive tape is gradually peeled off from the periphery of the semiconductor chip by the force of the stretched adhesive tape trying to return to its original shape and the force of suction. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 7023590 Summary of the Invention [Problem to be solved by the invention]

[0007] However, even when multiple push-up bodies are used as described above, if the adhesive sheet has a strong adhesive force, the adhesive sheet may not be sufficiently peeled off from the semiconductor chip, which increases the possibility that the semiconductor chip may not be picked up from the adhesive sheet.

[0008] An object of the present invention is to provide a pick-up device and a mounting device that are capable of successfully peeling an electronic component from an adhesive sheet. [Means for solving the problem]

[0009] The electronic component pickup device of the embodiment has a pickup unit that picks up electronic components affixed to an adhesive sheet, and a backup unit provided opposite the surface of the adhesive sheet opposite the electronic components, the backup unit having an adsorption surface that adsorbs and holds an area of ​​the adhesive sheet corresponding to the electronic components to be picked up, and a plurality of frame bodies that are rectangular cylinders with different outer sizes, the plurality of frame bodies being nested coaxially within the adsorption surface, a pressing unit provided to be movable along the common axis, and notches provided on opposing surfaces of the plurality of frame bodies that face the adhesive sheet and suck the adhesive sheet by negative pressure, the opposing surface of each of the plurality of frame bodies having protrusions that protrude toward the adhesive sheet and are capable of pressing the electronic components through the adhesive sheet, the protrusions being provided only at four corners of the opposing surface, and the opposing surface other than the four corners where the protrusions are provided are non-pressing units that do not press the electronic components through the adhesive sheet.

[0010] The mounting device of the embodiment is a mounting device that includes a supply device that holds an adhesive sheet on which a semiconductor chip is adhered, a substrate stage on which a substrate is placed, a pickup device that picks up the semiconductor chip from the adhesive sheet held by the supply device, and a mounting mechanism that mounts the semiconductor chip removed by the pickup device onto the substrate. Effect of the Invention

[0011] According to the present invention, it is possible to provide a pick-up device and a mounting device that are capable of successfully peeling an electronic component from an adhesive sheet. [Brief description of the drawings]

[0012] [Figure 1] 1 is a partially perspective front view showing a schematic configuration of an electronic component pickup device according to a first embodiment. [Diagram 2] FIG. 2 is a plan view showing an adsorption surface of the first embodiment. [Diagram 3] 1A is a plan view showing a pressing portion of the first embodiment, and FIG. 1B is a side view showing the pressing portion of the first embodiment. [Figure 4] 11 is an explanatory diagram showing a region pressed by a protruding portion and a region not pressed by a non-pressing portion. FIG. [Diagram 5] FIG. 2 is an exploded view showing the pressing portion of the first embodiment, the left side being a front view and the right side being a side view. [Figure 6] 5A to 5C are explanatory diagrams showing the operation of a pressing portion according to the first embodiment. [Figure 7] 5A to 5C are explanatory diagrams showing the operation of a pressing portion according to the first embodiment. [Figure 8] 5A to 5C are operation explanatory views showing the second cam mechanism of the first embodiment. [Figure 9] 5A to 5C are operation explanatory views showing the first cam mechanism of the first embodiment. [Figure 10] FIG. 13 is a configuration diagram showing a mounting device according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, a pickup device according to an embodiment will be described with reference to the drawings. The drawings shown below are schematic, and the size, shape, and relative size ratios of each part may differ from the actual ones.

[0014] [First embodiment] [composition] FIG. 1 shows a pickup device 1 according to the first embodiment, which has a pickup mechanism 100 that peels off an electronic component 3 attached to an adhesive sheet 2 from the adhesive sheet 2 and picks it up, and a pressing unit 230 that presses up the electronic component 3 to assist in peeling it off from the adhesive sheet 2. The pressing unit 230 is disposed at a position where the electronic component 3 is picked up, and the pickup mechanism 100 is positioned opposite the pressing unit 230. The electronic component 3 to be picked up is positioned at the pickup position where the pressing unit 230 is located. The electronic component 3 positioned at the pickup position is sandwiched between the pickup mechanism 100 and the pressing unit 230. At the same time, the electronic component 3 is pressed up by the pressing unit 230 via the adhesive sheet. As a result, the electronic component 3 is peeled off from the adhesive sheet 2, adsorbed and held by the pickup mechanism 100, and picked up. Each part will be described in detail below.

[0015] In the following description, the direction in which the pressing unit 230 presses up the electronic component 3 is the Z direction indicated by the arrow in the figure, the direction in which the roller shaft 82 moves, which is perpendicular to the Z direction and will be described later, to move the pressing unit 230 in the Z direction is the X direction indicated by the arrow in the figure, and the direction perpendicular to the Z direction and the X direction is the Y direction. Also, a straight line extending in the Z direction is the Z axis, and two axes that are perpendicular to each other in a plane perpendicular to the Z axis, an axis extending in the X direction, and an axis extending in the Y direction are the Y axis. In this embodiment, the X axis and the Y axis are horizontal axes, and the Z axis is a vertical axis. Furthermore, in this embodiment, the direction following gravity is the downward direction, and the direction against gravity is the upward direction. However, the installation direction is not limited to this. Also, the position in the Z direction may be called the height.

[0016] [Electronic components] Examples of the electronic component 3 include semiconductor elements, and resistors and capacitors other than semiconductor elements. Examples of the semiconductor elements include discrete semiconductors such as transistors, diodes, LEDs, capacitors, and thyristors, and integrated circuits such as ICs and LSIs. In this embodiment, as shown in Fig. 1, a rectangular parallelepiped semiconductor chip is used as the electronic component 3. Each semiconductor chip is obtained by cutting a semiconductor wafer into cubes.

[0017] [Adhesive sheet] The electronic component 3 is attached to the adhesive sheet 2. The adhesive sheet 2 is a thin sheet made of stretchable resin, one side of which is an adhesive surface. In this embodiment, an ultraviolet curing resin that is cured by ultraviolet light is used for the adhesive surface, and it exhibits adhesiveness in an uncured state. When picking up the electronic component 3, the adhesive sheet 2 is irradiated with ultraviolet light to cure the adhesive surface, thereby eliminating or reducing the adhesive force, so that the electronic component 3 can be easily peeled off from the adhesive sheet 2. However, due to the influence of the composition of the ultraviolet curing resin and the state of ultraviolet light irradiation, there are cases where the adhesive force cannot be sufficiently eliminated or reduced. The adhesive sheet 2 is held by a wafer ring (not shown). The semiconductor wafer attached to the adhesive surface of the adhesive sheet 2 is cut into cubes and individualized, so that a plurality of electronic components 3 are attached to the adhesive sheet 2.

[0018] The adhesive sheet 2 to which the multiple electronic components 3 are attached is provided so that the wafer ring can be moved in directions along the X-axis, Y-axis, and Z-axis and in a rotational direction around the Z-axis by a drive mechanism (not shown). As a result, the adhesive sheet 2 is provided so as to be positionable in directions along the X-axis and Y-axis and in a rotational direction around the Z-axis with respect to the backup unit 200 described below, and is provided so as to be able to approach and separate from the suction surface 220 of the backup unit 200. Note that it is sufficient that the wafer ring and the backup unit 200 are configured to be driven to move relative to each other. In other words, the backup unit 200 may move in a direction along the Z-axis and approach and separate from the fixed adhesive sheet 2 in a direction along the Z-axis.

[0019] [Pickup device] The pick-up device 1 of this embodiment is a device that individually peels off and removes a plurality of electronic components 3 attached to an adhesive sheet 2 from the adhesive sheet 2. The pick-up device 1 has a pick-up mechanism 100, a backup unit 200, and a control device 300.

[0020] (Pickup mechanism) The pick-up mechanism 100 picks up the electronic components 3 attached to the adhesive sheet 2. The pick-up mechanism 100 has a pick-up unit 4 that individually holds the electronic components 3 by suction.

[0021] The pickup unit 4 has a main body 5 and a suction nozzle 8. The main body 5 is a cylindrical member, and is driven in directions along the X-axis, Y-axis, and Z-axis by X-, Y-, and Z-drive sources (not shown). One end face of the main body 5 is provided with a protrusion 6 that protrudes toward the adhesive sheet 2. The main body 5 has a suction hole 7 with an open tip formed in the end face of the protrusion 6 in the direction along the Z-axis. This suction hole 7 is connected to an air pressure circuit including a suction pump (not shown).

[0022] The suction nozzle 8 is detachably connected to the protrusion 6 and is a truncated cone-shaped member whose diameter decreases toward the tip. The suction nozzle 8 is made of an elastic material such as rubber or soft synthetic resin. The suction nozzle 8 has a nozzle hole 9 whose one end communicates with the suction hole 7 and whose other end opens to the flat surface 8a at the tip.

[0023] (Backup Department) The backup unit 200 is provided facing the surface opposite the adhesive surface of the adhesive sheet 2 (the surface opposite to the surface to which the electronic component 3 is attached). The backup unit 200 has a container 210, an adsorption surface 220, a pressing unit 230, and a driving unit 20.

[0024] <Containment Unit> The container 210 is a cylindrical container with an axis parallel to the Z axis. A suction pump 211 that sucks the inside of the container 210 via piping or the like is connected to the container 210. The adsorption surface 220 is a surface that adsorbs and holds an area of ​​the adhesive sheet 2 that corresponds to the electronic component 3 to be picked up. The area that corresponds to the electronic component 3 is an area that surrounds the area of ​​the adhesive sheet 2 to which the electronic component 3 to be picked up is affixed, and is larger than this area.

[0025] <Adsorption surface> 2, the suction surface 220 is formed on a cap attached to an opening of the container 210 facing the adhesive sheet 2. A plurality of suction holes 221 are provided on the suction surface 220. The suction holes 221 are connected to the suction pump 211 (see FIG. 1) through the inside of the backup unit 200 or a pipe not shown.

[0026] By operating the suction pump 211, a suction force is generated on the suction surface 220 via the plurality of suction holes 221. Therefore, by operating the suction pump 211 and bringing the suction surface 220 into contact with the surface of the adhesive sheet 2 opposite to the adhesive surface, the adhesive sheet 2 is adsorbed and held. That is, in this embodiment, the entire area of ​​the suction surface 220 in which the suction holes 221 are provided corresponds to the electronic component 3. Note that since the suction holes 221 are provided over substantially the entire area of ​​the suction surface 220, the entire area of ​​the suction surface 220 including above the pressing portion 230 may be the area corresponding to the electronic component 3.

[0027] <Pressing part> The pressing unit 230 has a plurality of rectangular cylinder-shaped frame bodies 30 with different outer sizes, and the plurality of frame bodies 30 are nested coaxially with a common axis in the adsorption surface 220 and are provided so as to be movable along the common axis. The surface of each frame body 30 facing the adhesive sheet 2 is defined as the facing surface 31. Here, the common axis is parallel to the Z axis. The pressing unit 230 is provided so as to be able to advance and retreat within a rectangular opening 222 provided in the adsorption surface 220.

[0028] 2 and 3(A) and (B), the frame body 30 is a rectangular tubular body whose cross section perpendicular to a common axis is similar in shape to the electronic component 3. The frame bodies 30A to 30G have an end face facing the adhesive sheet 2 as a rectangular frame-shaped facing surface 31. In this embodiment, frame bodies 30 having a smaller outer shape are sequentially inserted into the frame body 30, so that seven frame bodies 30A to 30G are coaxially nested and slidably arranged.

[0029] The outer size of the outermost frame body 30G is the same as or slightly smaller than the outer size of the surface of the electronic component 3 to be picked up that is attached to the adhesive sheet 2. "Slightly smaller" means that the outer size is permissible, for example, up to the width of the opposing surface 31 determined by the thickness of the side wall of the frame body 30G smaller than the outer size of the surface of the electronic component 3 that is attached to the adhesive sheet 2. This makes it possible to peel off the adhesive sheet 2 from the outermost periphery while suppressing the load on the electronic component 3. In the following description, when the frames 30A to 30G are not to be distinguished from one another, they may be referred to as frame body 30.

[0030] On each of the opposing surfaces 31 of the plurality of frame bodies 30A to 30G, protruding portions 32 that protrude toward the adhesive sheet 2 and can press the electronic component 3 via the adhesive sheet 2 are provided only at the four corners of each opposing surface 31. The surface of the protruding portion 32 that faces the adhesive sheet 2 is a flat pressing surface 32a that presses the adhesive sheet 2. The pressing surfaces 32a of the protruding portions 32 in the plurality of frame bodies 30A to 30G press the adhesive sheet 2 along four straight lines extending from the center of the electronic component 3 toward the four corners. In this way, the pressing surfaces 32a are connected in straight lines extending from the center of the electronic component 3 toward the four corners, so that the adhesive sheet 2 can be stably supported even if the contact area is small, as shown in the shaded area PA in FIG. 4.

[0031] The opposing surface 31 has non-pressing portions 33 that do not press the electronic component 3 through the adhesive sheet 2, except for the four corners where the protruding portions 32 are provided. The non-pressing portions 33 are recessed portions that are farther from the adhesive sheet 2 than the height position of the pressing surfaces 32a of the protruding portions 32. Therefore, even if the pressing surfaces 32a come into contact with the adhesive sheet 2, the non-pressing portions 33 do not press the electronic component 3 through the adhesive sheet 2. The non-pressing portions 33 are provided over the entire length of the sides connecting the protruding portions 32 at the four corners.

[0032] Further, inside the innermost frame 30A, a pressing body 34 is provided which is movable along a common axis and capable of pressing the electronic component 3 via the adhesive sheet 2. The pressing body 34 is a columnar body whose surface facing the adhesive sheet 2 is a rectangular pressing surface 34a. The pressing surface 34a is a curved surface (see FIG. 5(H)). The pressing surface 34a in this embodiment is a partial side surface of a cylinder (semi-cylindrical).

[0033] Furthermore, as shown in Fig. 3(A), each opposing surface 31 is provided with a notch 35 for sucking the adhesive sheet 2 by negative pressure. In this embodiment, the notch 35 is provided in the non-pressing portion 33. The notch 35 is a suction path formed in the center of each edge of the four sides of the opposing surface 31 and in the vicinity of the protruding portion 32. The suction force of the suction pump 211 is transmitted to the notch 35 through the notch 35 and the gaps between the frames 30A to 30G and the pressing body 34 (not shown) provided in the housing body 210. As a result, the suction force acts on a wide area other than the shaded area shown in Fig. 4.

[0034] The width of the pressing surface 32a (the length of the X- or Y-direction component corresponding to the length in the direction toward the common axis) determined by the thickness of the sidewalls (the frame thickness) of each of the frame bodies 30A to 30G is preferably about 0.6 mm or less, but this embodiment is not limited to this. Also, the electronic component 3 in this embodiment is rectangular, but is not limited to this and may be square. If the electronic component 3 is square, the pressing surface 32a may also be square.

[0035] <Drive unit> 1, the drive unit 20 moves all of the frame bodies 30 and the pressing bodies 34 in a pressing direction to press the adhesive sheet 2, thereby performing a first pressing operation in which the pressing surfaces 32a of the protrusions 32 and the pressing surfaces 34a of the pressing bodies 34 press the electronic component 3 via the adhesive sheet 2. After performing the first pressing operation, the drive unit 20 also performs a separating operation in which each frame body 30 is sequentially moved from one of the frame bodies 30 to the adjacent frame body 30 and pressing body 34 in a separating direction in which the adhesive sheet 2 is peeled off from the electronic component 3.

[0036] Furthermore, together with the separating operation, the driving unit 20 performs a second pressing operation to move the frame body 30 and the pressing body 34 in the pressing direction so that the position of the pressing surface 32a, 34a of at least one of the frame body 30 and the pressing body 34 other than the frame body 30 that moved in the separating direction exceeds the position of the pressing surface 32a by the first pressing operation in the pressing direction. Here, in this embodiment, the separating direction is the opposite direction to the pressing direction. The driving unit 20 has a separating driving unit 20A that moves each frame body 30 and pressing body 34 individually in the separating direction, and a pressing driving unit 20B that moves all of the frame bodies 30 and pressing bodies 34 in the pressing direction.

[0037] In this embodiment, the separation operation is performed in sequence from the outermost frame body 30 to the adjacent inner frame body 30. In the second pressing operation, all frame bodies 30 and pressing bodies 34 other than the frame body 30 that has just moved in the separation direction, that is, all frame bodies 30 and pressing bodies 34 located inside the frame body 30 that has just moved in the separation direction, are moved so that their pressing surfaces 32a, 34a are higher than the height positions at which the pressing surfaces 32a, 34a of the frame body 30 and pressing body 34 that have just moved in the separation direction were located before the movement. Finally, just before the electronic component 3 is picked up, the pressing surface 34a of the innermost pressing body 34 exceeds the position of the pressing surface 32a by the first pressing operation in the pressing direction.

[0038] The separation drive unit 20A has a first drive member 241 and a conversion mechanism 250. The first drive member 241 is a cylindrical member, and is driven in a direction along a common axis by a drive mechanism 21A such as a ball screw mechanism or a cam roller mechanism driven by a servo motor. The drive mechanism 21A is housed in a common housing together with a drive mechanism 21B described later, and drives the first drive member 241 independently of a second drive member 242 described later.

[0039] The conversion mechanism 250 converts the motion of a single first driving member 241 that moves along a common axis into a separating motion of the multiple frame bodies 30A-30G and the pressing body 34. The conversion mechanism 250 has a frame 50, an extension portion 60, a biasing member 70, a first cam mechanism 80, and a second cam mechanism 90. The frame 50 is a member that is housed in the housing body 210 and supports the pressing portion 230, the first cam mechanism 80, and the second cam mechanism 90.

[0040] As shown in FIG. 1, the frame 50 has a support block 51, a first support plate 52, a linear guide 53, and a second support plate 54. The support block 51 is a rectangular parallelepiped provided on the adhesive sheet 2 side in the housing 210, and a rectangular parallelepiped guide hole 51a is formed inside the support block 51, through which the pressing part 230 is inserted so as to be slidable in the direction along the Z axis. Furthermore, a protrusion 51b protruding outward from the opposite side surface is provided on the adhesive sheet 2 side of the support block 51. Here, the opposite side surface means that the sides are in a positional relationship facing each other with respect to a common axis. For example, as in this embodiment, when the support block 51 is a rectangular parallelepiped, two of the four side surfaces that are located (facing each other) across the common axis are the opposite side surfaces.

[0041] The first support plate 52 is a disk-shaped member to which the support block 51 is attached. The linear guide 53 is a member that supports a moving body 83 (described later) so as to be slidable in the X direction by a guide rail. The second support plate 54 is a disk-shaped member provided on the drive unit 20 side of the frame 50. A hole through which the first drive member 241 is inserted is formed in the second support plate 54. In addition, a tip of a second drive member 242 is fixed to the second support plate 54. The first support plate 52, the linear guide 53, and the second support plate 54 are connected and fixed to each other by a support column in the Z axis direction (not shown).

[0042] As shown in FIG. 3(A) and FIG. 5, the extensions 60 are provided in pairs on the outer sides of the opposing side surfaces of each frame body 30 and pressing body 34. Here, the opposing side surfaces of the frame body 30 and pressing body 34 refer to two side surfaces located (opposing) on ​​either side of a common axis when the frame body 30 and pressing body 34 are rectangular tubular or columnar as in this embodiment. There are two sets of opposing side surfaces in one frame body 30 or pressing body 34, and in this embodiment, the set opposing in the X-axis direction is considered to be the opposing side surfaces. In addition, the outer side of the side surface refers to the portions that are both ends when the side surface is viewed from the front. A total of four extensions 60 are provided from the two opposing side surfaces of each frame body 30.

[0043] The extensions 60 are provided at the lower ends of the side surfaces. The pair of extensions 60 of the outermost frame body 30G is provided on the outermost side, and the extensions 60 are provided successively further inward as the frame bodies 30F to 30A become more inward. The extensions 60 of the innermost pressing body 34 are provided one on each of the opposing side surfaces. The extensions 60 can also be regarded as portions in which the lower ends of the two side walls opposing each other in the Y-axis direction are extended a predetermined amount downward beyond the lower ends of the two side walls opposing each other in the X-axis direction, and both ends of the extensions are extended in the X-axis direction.

[0044] As shown in Fig. 1 and Fig. 3(A), the biasing member 70 is a member that biases each of the frame bodies 30 and the extension portion 60 of the pressing body 34 individually in the separation direction. The biasing member 70 can be configured using an elastic member such as a leaf spring or a coil spring. In this embodiment, the biasing member 70 is a member having a pin at the tip of a cylinder containing a compression coil spring, which moves forward and backward according to the expansion and contraction of the compression coil spring. The biasing member 70 is provided in a direction parallel to the Z axis, one end of which is attached to the protruding portion 51b of the support block 51, and the other end of the pin, which is the tip of the pin, is in contact with the extension portion 60, so that the biasing member 70 biases each of the frame bodies 30 and the pressing body 34.

[0045] The first cam mechanism 80 is a mechanism that is driven by a first driving member 241 and sequentially allows the movement of each frame body 30 and the pressing body 34 in the separation direction from the outside to the inside. The first cam mechanism 80 has a cam surface 81, a roller shaft 82, and a moving body 83.

[0046] The cam surface 81 is provided on the surface of each frame body 30 and pressing body 34 opposite to the adhesive sheet 2, and is a surface having a different shape for each frame body 30 and pressing body 34 in a direction intersecting a common axis, specifically, along the X-axis direction. In this embodiment, the cam surface 81 is a surface having a portion whose distance from the pressing surfaces 32a, 34a sequentially varies for each frame body 30 and pressing body 34. The cam surface 81 is formed on the end surfaces of two side surfaces of each frame body 30 and pressing body 34 facing each other in the direction along the Y-axis, specifically, on the lower end surfaces opposite to the pressing surfaces 32a, 34a.

[0047] 5(A) to 5(H), the cam surface 81 of the present embodiment includes a matching surface 84, a step surface 85, and a stopper surface 86. The matching surfaces 84 are surfaces that match each other when the distances d from the pressing surfaces 32a, 34a of all of the frames 30 and pressing bodies 34 are constant and the positions of the pressing surfaces 32a, 34a of all of the frames 30 and pressing bodies 34 are aligned.

[0048] The step surface 85 is a surface that continues from the matching surface 84 and the distance from the pressing surfaces 32a, 34a decreases stepwise. The length w of the matching surface 84 in the X-axis direction becomes longer toward the inner frame body 30 and pressing body 34, and accordingly, the starting end p of the step surface 85 is shifted along the X-axis. This means that the timing at which the roller shaft 82, which will be described later, reaches the step surface 85 becomes slower toward the inner frame body 30 and pressing body 34. As a result, the phase of movement of each frame body 30 and pressing body 34 is shifted, that is, the timing at which each frame body 30 and pressing body 34 starts moving in the peeling direction is shifted. The stopper surface 86 is a surface that constitutes the end q of the step surface 85. The distance of the stopper surface 86 from the matching surface 84 in the X-axis direction is common to each frame body 30 and pressing body 34.

[0049] The roller shaft 82 contacts the cam surface 81 of each frame body 30 and the pressing body 34, and urges each frame body 30 and the pressing body 34 in a direction against the urging member 70, and moves in a direction intersecting the separation direction, specifically, in a direction along the X-axis. The roller shaft 82 has a length that spans the two side surfaces on which the cam surface 81 is formed. When the roller shaft 82 does not reach the step surface 85, that is, when the roller shaft 82 contacts the matching surface 84, it pushes up all the frame bodies 30 and the pressing body 34 in a direction against the urging member 70. At this time, the heights of the pressing surfaces 32a, 34a of all the frame bodies 30 and the pressing body 34 are the same. When the roller shaft 82 reaches the step surface 85 of each frame body 30 and the pressing body 34, the urging force of the urging member 70 causes each frame body 30 and the pressing body 34 to move in the separation direction in sequence.

[0050] In this embodiment, the timing at which the roller shaft 82 reaches the step surface 85 is later for the frame body 30 and the pressing body 34 that are closer to the inside, so the roller shaft 82 moves successively in the separating direction from the outer frame body 30 to the inner pressing body 34. Furthermore, as the roller shaft 82 moves to each step on the step surface 85, the moving distance of each frame body 30 and pressing body 34 in the separating direction increases by a constant amount from the outer frame body 30 to the inner pressing body 34. The stopper surface 86 defines the moving end of the roller shaft 82.

[0051] The range of movement of the roller shaft 82 is within the range of the outer edge of the adsorption surface 220. In this embodiment, the roller shaft 82 moves within the range of the inner diameter of the container 210. Therefore, the cam surface 81 is also formed within this range.

[0052] Returning to Fig. 1, the movable body 83 has a movable block 83a and a bearing 83b. The movable block 83a is a member having a substantially rectangular parallelepiped shape, and is provided so as to be slidable in the X-axis direction by linear guide 53. The bearing 83b is a member provided on the frame body 30 side of the movable body 83, and is a member that rotatably supports the axis of the roller shaft 82 in the direction along the Y-axis.

[0053] The second cam mechanism 90 is a mechanism that converts the movement of the first driving member 241 along the pressing and separating directions (movement in the Z-axis direction) into movement in a direction (X-axis direction) intersecting the pressing and separating directions of the roller shaft 82. The second cam mechanism 90 has a roller 92 and an inclined surface 91 in contact with the roller 92, and is a linear cam in which one of the roller 92 and the inclined surface 91 is a driving cam that moves along a common axis, i.e., the Z-axis, and the other is a driven cam that moves in a direction intersecting the Z-axis (X-axis direction).

[0054] The second cam mechanism 90 of the present embodiment has an inclined surface 91, a roller 92, and a bearing 93. The inclined surface 91 is provided on the surface of the moving block 83a opposite the frame body 30, and is a surface inclined with respect to the Z-axis direction. The roller 92 comes into contact with the inclined surface 91 and moves in a direction approaching the adhesive sheet 2, thereby moving the moving block 83a to the left in the figure along the X-axis direction (see FIG. 1).

[0055] The bearing 93 rotatably supports the shaft of the roller 92 in the direction along the Y axis. The bearing 93 is fixed to an end of the first driving member 241. Therefore, as the first driving member 241 moves, the bearing 93 moves together with the roller 92 toward the adhesive sheet 2.

[0056] The pressing drive unit 20B has a second drive member 242. The second drive member 242 is a cylindrical member arranged coaxially with the first drive member 241, and is driven independently of the first drive member 241 in a direction along a common axis by a drive mechanism 21B such as a ball screw mechanism or a cam roller mechanism driven by a servo motor. The second drive member 242 drives the frame 50. The pressing drive unit 20B performs the above-mentioned first pressing operation and second pressing operation by the second drive member 242 driving the frame 50.

[0057] The control device 300 is a device that controls each part of the pickup device 1. The control device 300 can be configured, for example, by a dedicated electronic circuit including a processor, a memory, etc., or a computer that operates with a predetermined program. The control contents of the exhaust control by the suction pump 211, the drive control by the drive unit 20, the pickup control by the pickup mechanism 100, etc. are programmed, and various settings are stored in a storage unit such as a memory. The control device 300 executes the program according to such settings by a processing device such as a PLC. For example, in order to execute the movement of the frame body 30 and the pressing body 34 in the first pressing operation and the second pressing operation, the operation amount of the second driving member 242 is stored in advance in the storage unit, and the control device 300 controls the driving mechanism 21B according to this operation amount.

[0058] [Operation] The operation of the pickup device 1 of this embodiment as described above will be described with reference to Figs. 6 to 9 in addition to the above drawings. First, the drive mechanism for driving the wafer ring moves the adhesive sheet 2 so that the electronic component 3 to be picked up is aligned horizontally with the pressing surface 32a of the pressing unit 230 as shown in Fig. 6(A) and the portion of the adhesive sheet 2 to which the electronic component 3 is attached is in contact with the adsorption surface 220. That is, the electronic component 3 to be picked up is positioned relative to the pressing unit 230. This movement is performed based on map information including the position coordinates of the electronic component 3 in advance.

[0059] 6(A), suction pump 211 applies suction force to suction holes 221 to adsorb adhesive sheet 2 to adsorption surface 220. As a result, a portion of adhesive sheet 2 corresponding to electronic component 3 to be picked up is adsorbed and held on adsorption surface 220, and the area of ​​electronic component 3 is supported by pressing surface 32a of protruding portion 32 of frame body 30 and pressing surface 34a of pressing body 34.

[0060] After adhesive sheet 2 is thus sucked and held by suction surface 220, pick-up unit 4 moves towards electronic component 3, and suction nozzle 8 comes into contact with and sucks the upper surface of electronic component 3 to be picked up.

[0061] Next, the first pressing operation is performed by the pressing drive unit 20B of the drive unit 20. That is, the drive mechanism 21B drives the second drive member 242 by a preset amount of movement toward the adhesive sheet 2 side, and thereby, as shown in FIG. 6(B), the pressing unit 230 supported by the frame 50, that is, the frame bodies 30A to 30G and the pressing body 34 are collectively pressed toward the adhesive sheet 2 side. Then, the pressing surface 32a of the protruding portion 32 and the pressing surface 34a of the pressing body 34 press the entire electronic component 3 evenly, so that the part of the adhesive sheet 2 to which the electronic component 3 is attached is pushed out beyond the adsorption surface 220 of the container 210. At this time, the adhesive sheet 2 is supported by the pressing surfaces 32a of the protruding portions 32 of all the frame bodies 30, but is not supported by the non-pressing portions 33. A suction force acts on this unsupported part of the adhesive sheet 2 due to the negative pressure acting on the notch 35. That is, the portions of the adhesive sheet 2 corresponding to the outer periphery of the electronic component 3 are supported by the pressing surfaces 32a of the protruding portions 32 of the frame body 30G in the portions corresponding to the corners of the electronic component 3, while the portions of the adhesive sheet 2 corresponding to the sides of the outer periphery of the electronic component 3 are not supported. The adhesive sheet 2 is supported at the portions corresponding to two adjacent corners of the electronic component 3, and due to the suction force acting on the unsupported portion between them, peeling of the adhesive sheet 2 begins from the intermediate portion of the supported distance.

[0062] Then, the separating operation and the second pressing operation are performed by the separating operation unit 20A and the pressing operation unit 20B of the driving unit 20. That is, the driving mechanism 21A drives the first driving member 241 toward the adhesive sheet 2 side, thereby moving the roller 92 toward the adhesive sheet 2 side, as shown in Figs. 8(A) to (C). That is, the roller 92 is raised along the Z-axis direction. This moving direction is indicated by a white arrow in the figure. Then, the roller 92 presses against the inclined surface 91, so that the moving block 83a and the bearing 83b of the moving body 83 move in the X direction. This moving direction is indicated by a black arrow in the figure. As a result, the roller shaft 82 moves to the left in the figure along the X direction, as shown in Fig. 9.

[0063] When the roller shaft 82 moves in this manner, as shown in Fig. 9, which shows the cam surface 81 viewed from below, the roller shaft 82 moves from the coincident surface 84 of the frame body 30 and the pressing body 34 along each step of the stepped surface 85. Then, as shown in Figs. 6(C), (D), (E) and Figs. 7(A), (B), (C), (D) and (E), due to the biasing force of the biasing member 70, the frames 30F, 30E, 30D, 30C, 30B, 30A and the pressing body 34 move in the separating direction in sequence from the outer frame body 30G, that is, perform a separating operation in which they descend.

[0064] In this way, each time the frame bodies 30G, 30F, 30E, 30D, 30C, 30B, 30A, and the pressing body 34 move in the separating direction, the second driving member 242 moves all the frame bodies 30 and the pressing body 34 in the pressing direction, that is, performs the second pressing operation to raise them. In this embodiment, the separating operation and the second pressing operation are performed simultaneously in parallel. Each time each frame body 30 moves in the separating direction, the distance that all the frame bodies 30 move in the pressing direction is smaller than the movement distance of each frame body 30 in the separating direction. However, among the frame bodies 30 other than the frame body 30 that has been moved in the separating direction, the pressing surface 32a of the protruding portion 32 of at least one frame body 30 and the pressing surface 34a of the pressing body 34 come to a position beyond the reference position H in the pressing direction, that is, upward.

[0065] When the frame bodies 30 move in sequence, the suction force of the suction pump 211 acts, and the peeling of the adhesive sheet 2 progresses from the outer periphery side to the inner periphery side of the electronic component 3. Eventually, as shown in FIG. 7(E), only the innermost pressing body 34 presses the adhesive sheet 2, and the pressing surfaces 32a of the frame bodies 30A to 30G on the outer periphery of the pressing body 34 are located at or below the position of the suction surface 220 of the container 210, and the region of the pressing surface 34a of the innermost pressing body 34 becomes the part of the adhesive sheet 2 attached to the electronic component 3. At this time, each time a peeling operation is performed in sequence starting from the outer periphery frame body 30, the pressing surfaces 32a, 34a of the frame bodies 30 on the inner periphery of the frame body 30 are sequentially pressed and moved to a position higher than the reference position H. Therefore, the relative height (height difference) between the pressing surface 32a (pressing surface 32a of the protruding portion 32 supporting the electronic component 3) of the frame body 30 that has been peeled and the pressing surfaces 32a, 34a of the pressing body 34 located one periphery inside the pressing surface 32a can be gradually increased. Therefore, the adhesive sheet 2 can be satisfactorily peeled off from the electronic component 3.

[0066] Since the pressing surface 34a of the innermost pressing body 34 is curved, the area in contact with the adhesive sheet 2 is very small. Therefore, by raising the suction nozzle 8 that has suctioned the electronic component 3, the electronic component 3 is easily peeled off from the adhesive sheet 2. In other words, the pressing surface 34a of the pressing body 34 suppresses the stress applied to the electronic component 3, making it possible to peel it off. Thereafter, by raising the suction nozzle 8, the electronic component 3 can be picked up from the adhesive sheet 2.

[0067] [Effects] (1) The pickup device 1 of this embodiment has a pickup section 4 that picks up an electronic component 3 attached to an adhesive sheet 2, and a backup section 200 that is provided facing the surface of the adhesive sheet 2 opposite to the electronic component 3. The backup section 200 has an adsorption surface 220 that adsorbs and holds an area of ​​the adhesive sheet 2 corresponding to the electronic component 3 to be picked up, and a plurality of rectangular cylindrical frame bodies 30 having different external sizes. The plurality of frame bodies 30 are nested coaxially and coaxially on a common axis within the adsorption surface 220, and a common and a notch 35 provided on an opposing surface 31 of the plurality of frame bodies 30 facing the adhesive sheet 2, which sucks in the adhesive sheet 2 by negative pressure. On the opposing surface 31 of each of the plurality of frame bodies 30, protrusions 32 that protrude toward the adhesive sheet 2 and can press the electronic component 3 through the adhesive sheet 2 are provided only at the four corners of the opposing surface 31, and the corners other than the four corners on the opposing surface 31 where the protrusions 32 are provided are non-pressing portions 33 that do not press the electronic component 3 through the adhesive sheet 2.

[0068] Therefore, the protrusions 32 connected by arranging a plurality of frames 30 in a nested manner can press a narrow area PA along a straight line from the center to the corner of the electronic component 3 through the adhesive sheet 2 (see FIG. 4), and can suck other areas, i.e., non-pressing parts 33 that are wide areas where the adhesive sheet 2 is not pressed. Therefore, a stronger suction force can be applied to the adhesive sheet 2 while maintaining stable support of the electronic component 3, so that the adhesive sheet 2 can be peeled off even if its adhesive force is strong. Moreover, the pressure by the pressing surface 32a can be gradually released from the outer periphery of the electronic component 3, so that a sudden decrease in the support area can be suppressed and damage to the electronic component 3 can be prevented.

[0069] The method of peeling off an adhesive sheet using multiple nested pressing members is usually used to peel off a thin semiconductor chip, which is easily damaged, from the adhesive sheet. By gradually releasing or gradually applying pressure from the outer edge of the semiconductor chip, the adhesive sheet is gradually peeled off from the outer edge of the semiconductor chip, thereby preventing damage to the semiconductor chip caused by peeling off all at once. For thin semiconductor chips, which are still easily damaged, the semiconductor chip is supported and sucked while a relatively large area is supported, thereby preventing damage. Here, even if the semiconductor chip is not thin, if an attempt is made to peel off the semiconductor chip from an adhesive sheet with strong adhesive force, it is not possible to peel it off all at once. In this case, for a relatively thick semiconductor chip (for example, thicker than about 100 μm), damage to the semiconductor chip is unlikely to occur, so it is possible to peel off the adhesive sheet with a strong suction force.

[0070] However, if a semiconductor chip is supported over a relatively large area to accommodate a thin semiconductor chip, the area of ​​the adhesive sheet to which the suction force is applied is small, and even if the suction force is increased, the semiconductor chip is difficult to peel off. In this embodiment, the area and shape of the electronic component 3 that supports it are minimized, and the suction force is applied to all other areas. Therefore, even if the electronic component 3 is thick and the adhesive sheet 2 has a strong adhesive force, it can be reliably peeled off and picked up. Note that this embodiment does not limit the thickness of the electronic component 3 to be applied, and can be applied to even a thin electronic component 3.

[0071] The adhesive force of the adhesive sheet 2 may be strong in the following cases. In the adhesive sheet 2 using an ultraviolet curing resin, as described above, the unevenness of the ultraviolet irradiation or the unevenness of the adhesive sheet 2 may cause unevenness in the reduced adhesive force on the adhesive sheet 2, and some strong parts may remain. In addition, ultraviolet irradiation may be omitted in order to reduce the impact on the operator or the line cost. In addition, since an adhesive sheet 2 using an ultraviolet curing resin is relatively expensive in the first place, such an adhesive sheet 2 may not be used. Such an adhesive sheet 2 is also applicable to this embodiment, but in this case, the adhesive force cannot be reduced by ultraviolet irradiation. Furthermore, since the adhesive sheet 2 in close contact with the back surface of the electronic component 3 is pressed by atmospheric pressure, it is the state of close contact at atmospheric pressure that makes it difficult to peel off, rather than the adhesive force. In this embodiment, the adhesive sheet 2 can be peeled off by applying a stronger suction force against such a strong adhesive force and atmospheric pressure.

[0072] (2) Among the frames 30 arranged in a nested manner, a pressing body 34 is provided inside the innermost frame 30 so as to be movable along a common axis and capable of pressing the electronic component 3 via the adhesive sheet 2, and the surface of the pressing body 34 facing the adhesive sheet 2 is curved. This makes it possible to reduce the contact area of ​​the pressing body 34 with the unpeeled portion that remains at the end of the peeling process, and the force required to peel the electronic component 3 is weakened, making it easier to pick up. In addition, the impact applied to the electronic component 3 during the final peeling can also be reduced.

[0073] [Second embodiment] A mounting device 400 including the pickup device 1 of the first embodiment will be described as the second embodiment with reference to Fig. 10. In the following description, the direction along a vertical straight line is defined as the Z-axis direction, and the directions along two straight lines perpendicular to each other in a horizontal plane perpendicular to the Z-axis direction are defined as the X-axis direction and the Y-axis direction.

[0074] The mounting device 400 includes a supply device 500, an intermediate stage 600, a substrate stage 700, and a mounting mechanism 800 in addition to the pickup device 1 and the control device 300. The supply device 500 is a device that holds an adhesive sheet 2 to which electronic components 3 such as semiconductor chips are attached. The supply device 500 includes a wafer ring 510, a wafer table 520, and a driving mechanism (not shown). The wafer ring 510 is a member that holds the adhesive sheet 2 to which the individualized electronic components 3 are attached. The wafer table 520 is a device that movably supports the wafer ring 510. The driving mechanism supports the wafer table 520 movably in the X-axis, Y-axis, Z-axis, and rotational (θ) directions around the Z-axis, and moves the wafer ring 510 along the X-axis, Y-axis, and Z-axis. It also rotates around the Z-axis.

[0075] The intermediate stage 600 is a stage on which the electronic component 3 is temporarily placed when the electronic component 3, which is sucked and held by the suction nozzle 8 of the pickup device 1, is transferred to the mounting mechanism 800. The substrate stage 700 is a member on which the substrate 710 is placed. In other words, it is a member that supports the substrate 710 on which the electronic component 3 is mounted. The substrate stage 700 is supported by an XYθ direction movement mechanism (not shown), and is provided so as to be movable in the X-axis direction, the Y-axis direction, and the θ (horizontal rotation) direction.

[0076] The mounting mechanism 800 is a mechanism that mounts the electronic component 3 picked up by the pickup device 1 on the substrate 710. The mounting mechanism 800 suction-holds the electronic component 3 from above the intermediate stage 600, and mounts the suction-held electronic component 3 at a predetermined position on the substrate 710 supported by the substrate stage 700. The mounting mechanism 800 has a mounting tool 810 and an XYZθ driving mechanism (not shown). The mounting tool 810 is a suction nozzle that suction-holds the electronic component 3. The XYZθ driving mechanism is a mechanism that moves the mounting tool 810 in the X-, Y-, and Z-axis directions and the θ (horizontal rotation) direction.

[0077] The pickup device 1 has the same configuration as that of the first embodiment described above. The control device 300 is obtained by adding a function of controlling the supply device 500, the substrate stage 700, and the mounting mechanism 800 to the control device 300 of the first embodiment.

[0078] In such a mounting apparatus 400, the pickup device 1 picks up the electronic components 3 from the wafer ring 510 supported by the wafer table 520 of the supply device 500 as described above. The pickup device 1 delivers the picked up electronic components 3 to a mounting tool 810 of a mounting mechanism 800 via an intermediate stage 600. The mounting tool 810 mounts the electronic components 3 on a substrate 710 on a substrate stage 700. The mounting apparatus 400 sequentially repeats the operations of picking up the electronic components 3, delivering them, and mounting them on the substrate 710.

[0079] Such a mounting apparatus 400 can achieve the same advantageous effects as those of the first embodiment described above. Furthermore, due to this advantageous effect, it is possible to improve the mounting quality and reliability of the electronic components 3 by the mounting apparatus 400, and ultimately improve the quality of electronic component products such as semiconductor packages manufactured by mounting the electronic components 3 on the substrate 710.

[0080] It should be noted that the intermediate stage 600 does not necessarily have to be provided. In this case, the electronic component 3 is delivered from the suction nozzle 8 of the pickup device 1 to the mounting tool 810. When delivering, the suction nozzle 8 may be inverted to bring the electronic component 3 into an inverted state. Also, the electronic component 3 may be directly mounted on the substrate 710 by the suction nozzle 8. Also, the θ drive mechanism of the substrate stage 700 and / or the mounting mechanism 800 may be provided.

[0081] [Variations] This embodiment is not limited to the above-described embodiment, and the following modifications are also applicable.

[0082] (1) The protrusions 32 may be pin-shaped. For example, in the above embodiment, the opposing surfaces 31 of the protrusions 32 are arranged so as to be continuous, but the protrusions 32 may be pin-shaped, and the contact portions with the adhesive sheet 2 may be arranged at intervals. In addition, the pressing surface 32a may not be a flat surface, but may be a curved surface, a spherical surface, or a mountain shape having a ridge line.

[0083] (2) The curved surface of the pressing surface 34a of the pressing body 34 may be a partial sphere, which can reduce the contact area. However, the pressing surface 34a may be a flat surface. In this case, the flat surface may be provided with minute irregularities. Furthermore, the pressing body 34 may be pin-shaped to reduce the contact area.

[0084] (3) The supporting direction of the adhesive sheet 2, the pick-up direction of the pick-up mechanism 100, the driving direction of the first driving member 241 and the second driving member 242 of the backup section 200, and the moving direction of the frame body 30 and the pressing body 34 may be vertical, horizontal, or inclined relative to these.

[0085] (4) The driving unit 20 is not limited to the mechanism that drives the frame 30 and the pressing body 34 by a cam as described above. It may be a driving unit with a multi-axis configuration that transmits linear driving force to each of the frame 30 and the pressing body 34.

[0086] (5) The drive unit 20 is configured to move in the separating direction from the outer frame body 30G toward the adjacent inner frame bodies 30F, 30E, etc., in order, i.e., to be lowered. However, it may also be configured to move in the pressing direction from the outer frame body 30G toward the adjacent inner frame bodies 30F, 30E, etc., in order, i.e., to be raised.

[0087] (6) The number of frames 30 constituting the pressing unit 230 may be seven or more, or less than seven. When the number is less than seven, the size can be suppressed and it is easy to configure a driving unit with the above-mentioned multi-axis configuration. Also, when the number is seven or more, the effect on the electronic component 3 when the adhesive sheet 2 is peeled off can be further reduced.

[0088] [Other embodiments] Although the embodiment of the present invention and the modified examples of each part have been described above, these embodiments and the modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims. [Explanation of symbols]

[0089] 1 Pick-up device 2 Adhesive Sheet 3. Electronic Components 4 Pickup section 5 Main fuselage 6 Convex 7 Suction hole 8 Suction nozzle 8a flat surface 9 Nozzle hole 20 Drive unit 20A Remote Drive Unit 20B Pressing drive unit 21A, 21B Drive mechanism 30, 30A~30H frame 31 Opposite Surface 32 Protrusion 32a Pressing surface 33 Non-pressure part 34 Pressing body 34a Pressing surface 35 Notch 50 frames 51 Support block 51a Guide hole 51b Projection 52 First support plate 53 Linear guide 54 Second Support Plate 60 Extension 70 Pressing member 80 First cam mechanism 81 Cam surface 82 Roller shaft 83 Mobile 83a Moving Block 83b Bearing 84 Matching plane 85 Stair surface 86 Stopper surface 90 Second Cam Mechanism 91 Slope 92 Laura 93 Bearings 100 Pickup mechanism 200 Backup Department 210 Containment Unit 211 Suction pump 220 Adsorption surface 221 Suction hole 222 Opening 230 Pressing part 241 first driving member 242 Second driving member 250 Conversion Mechanism 300 Control device 400 Mounting Equipment 500 Feeding device 510 Wafer Ring 520 Wafer Table 600 Intermediate Stage 700 Substrate Stage 710 Substrate 800 Mounting Mechanism 810 Implementation Tools

Claims

1. A pickup unit that picks up an electronic component attached to an adhesive sheet; a backup portion provided on a surface of the adhesive sheet opposite to the electronic component; having The backup unit includes: an adsorption surface that adsorbs and holds an area of ​​the adhesive sheet that corresponds to the electronic component to be picked up; a pressing unit having a plurality of rectangular cylindrical frame bodies having different outer sizes, the plurality of frame bodies being nested coaxially with a common axis within the suction surface, the pressing unit being movable along the common axis; a notch provided on a surface of each of the plurality of frames facing the adhesive sheet, the notch sucking the adhesive sheet by negative pressure; having a protrusion portion that protrudes toward the adhesive sheet and is capable of pressing the electronic component via the adhesive sheet is provided only at four corners of the opposing surface of each of the plurality of frame bodies; a non-pressing portion that does not press the electronic component via the adhesive sheet, other than the four corners on the opposing surface where the protrusions are provided; A pickup device comprising:

2. a pressing body that is movable along the common axis and capable of pressing the electronic component via the adhesive sheet is provided inside the innermost frame body among the frame bodies that are nested, 2. The pickup device according to claim 1, wherein the surface of the pressing body facing the adhesive sheet is a curved surface.

3. A supply device that holds an adhesive sheet on which a semiconductor chip is adhered and held; a substrate stage on which a substrate is placed; a pick-up device that picks up the semiconductor chip from the adhesive sheet held by the supply device; a mounting mechanism that mounts the semiconductor chip taken out by the pickup device on the substrate, 3. A mounting apparatus, comprising: the pickup device according to claim 1.

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