Quality control supporting method, quality control supporting system, and work system

Abstract

To provide a quality control supporting method, a quality control supporting system, and a work system that facilitate effective utilization of inspection data from an inspection machine which inspects a substrate assembly based on its electrical characteristics.SOLUTION: A quality control supporting method for supporting quality control for a component mounting system 20, has first acquisition processing, second acquisition processing, and detection processing. The component mounting system 20 comprises a first inspection machine 101 and a second inspection machine 102. In the first acquisition processing, inspection data obtained by inspecting electrical characteristics of a substrate assembly is acquired by the first inspection machine 101, as first data. In the second acquisition processing, second data obtained by inspecting a state of a joint member printed on a substrate is acquired by the second inspection machine 102. In the detection processing, a sign of an abnormality is detected based on the first data and the second data.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure generally relates to a quality control support method, a quality control support system, and an operation system, and more particularly to a quality control support method, a quality control support system, and an operation system that support quality control related to a component mounting system. [Background technology]

[0002] Patent Document 1 describes an inspection machine that inspects a board (printed circuit board) on which components (electronic components) are mounted, that is, a board assembly, by in-circuit inspection (ICT) and functional inspection (FT). This inspection machine inspects the board assembly, including the mounting state of the components on the board, by measuring electrical characteristics such as resistance, voltage drop, or polarity of each component and comparing them with predicted values ​​for the component. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2020-507764 Summary of the Invention [Problem to be solved by the invention]

[0004] The inspection machine described in Patent Document 1 inspects the board assembly, that is, the board on which components are mounted, and therefore the inspection data is only used for evaluating the board assembly.

[0005] The present disclosure has been made in consideration of the above-mentioned reasons, and aims to provide a quality control support method, quality control support system, and work system that make it easy to effectively utilize inspection data from an inspection machine that inspects board assemblies based on electrical characteristics. [Means for solving the problem]

[0006] A quality control support method according to one aspect of the present disclosure is a method for supporting quality control of a component mounting system that produces a board assembly by mounting components on a board with a bonding member, and includes a first acquisition process, a second acquisition process, and a detection process. The component mounting system includes a first inspection machine and a second inspection machine. In the first acquisition process, inspection data obtained by inspecting electrical characteristics of the board assembly using the first inspection machine is acquired as first data. In the second acquisition process, second data obtained by inspecting a state of a bonding member printed on the board using the second inspection machine is acquired. In the detection process, a sign of an abnormality is detected based on the first data and the second data.

[0007] A quality control support system according to one aspect of the present disclosure is a quality control support system that supports quality control for a component mounting system that produces a board assembly by mounting components on a board with a bonding member, and includes a first acquisition unit, a second acquisition unit, and a detection unit. The first acquisition unit acquires, as first data, inspection data obtained by inspecting electrical characteristics of the board assembly using a first inspection machine included in the component mounting system. The second acquisition unit acquires, as second data, inspection data obtained by inspecting a state of the bonding member printed on the board using a second inspection machine included in the component mounting system. The detection unit detects a sign of an abnormality based on the first data and the second data.

[0008] A work system according to one aspect of the present disclosure includes the quality control support system and the component mounting system that mounts the components on the board to produce the board assembly. Effect of the Invention

[0009] The present disclosure has the advantage of being able to provide a quality control support method, quality control support system, and operation system that facilitate effective use of inspection data from an inspection machine that inspects board assemblies based on electrical characteristics. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic diagram showing an overview of an operation system including a quality control support system according to a first embodiment. [Diagram 2] FIG. 2 is a conceptual diagram showing a production process of a board assembly by the component mounting system of the above-mentioned working system. [Diagram 3] FIG. 3 is a conceptual diagram showing the state of quality control regarding a component mounting system by the quality control support method according to the first embodiment. [Figure 4] FIG. 4 relates to the first embodiment and is a conceptual diagram showing how a board assembly is inspected by a first inspection machine made up of an in-circuit tester. [Diagram 5] FIG. 5 is a flowchart showing an example of the quality control support method. [Figure 6] FIG. 6 is a schematic configuration diagram showing an overview of an operation system including a quality control support system according to the second embodiment. [Figure 7] FIG. 7 is a conceptual diagram showing the state of quality control regarding a component mounting system by the quality control support method according to the second embodiment. [Figure 8] FIG. 8 is a flowchart showing an example of the quality control support method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] (Embodiment 1) The quality control support method, the data set generating method, the program, the quality control support system 10 (see FIG. 1), and the operation system 100 (see FIG. 1) according to this embodiment will be described below with reference to FIGS. 1 to 5.

[0012] (1) Overview The quality control support method according to this embodiment is a quality control support method that supports quality control related to a component mounting system 20. As shown in Fig. 1 and Fig. 2, the component mounting system 20 produces a board assembly P10 by mounting a component P2 on a board P1 with a bonding member P3.

[0013] In this embodiment, the component mounting system 20 includes one or more solder forming machines 1, one or more mounting machines 2, and one or more reflow furnaces 3. The solder forming machine 1, the mounting machine 2, and the reflow furnace 3 are connected to each other and form a mounting line together with inspection machines (first inspection machine 101 and second inspection machines 102, 103, 104) described later. In other words, the component mounting system 20 according to this embodiment is a mounting line formed by connecting a plurality of devices including the mounting machine 2 to each other. In such a component mounting system 20 (mounting line), while the board P1 passes through the solder forming machine 1, the mounting machine 2, and the reflow furnace 3 in this order, the components P2 are mounted on the board P1 to produce a board assembly P10.

[0014] The component mounting system 20 is used in operations for manufacturing various products such as electronic devices, automobiles, clothing, food, medicine, and crafts in facilities such as factories, laboratories, offices, and educational facilities.

[0015] 1, a board assembly P10 produced by such a component mounting system 20 is inspected by a first inspection machine 101 provided at the last stage of the component mounting system 20. The first inspection machine 101 is an inspection machine (inspection device) that inspects the board assembly P10 based on at least electrical characteristics and judges, for example, whether a continuity state or the like in the board assembly P10 is normal / abnormal. If the first inspection machine 101 judges the board assembly P10 to be normal (no abnormality), it is confirmed that the board assembly P10 produced by the component mounting system 20 (mounting line) including the solder forming machine 1, the mounting machine 2, and the reflow furnace 3 has been produced normally.

[0016] However, since the first inspection machine 101 that performs inspection based on electrical characteristics inspects the board assembly P10, that is, the board P1 on which the component P2 is mounted, the inspection data is basically used to evaluate the board assembly P10. In other words, the inspection data of the first inspection machine 101 is usually only used to determine whether the electrical continuity state, etc. of the board assembly P10 is normal / abnormal, and it is difficult to say that the inspection data of the first inspection machine 101 is being used sufficiently effectively in this case.

[0017] Therefore, the quality control support method according to this embodiment supports quality control regarding the component mounting system 20 by effectively utilizing the inspection data of the first inspection machine 101 through the functions described below.

[0018] That is, the quality control support method according to the present embodiment is a method for supporting quality control regarding the component mounting system 20, and includes a first acquisition process, a second acquisition process, and an association process. The component mounting system 20 generates a board assembly P10 by mounting a component P2 on a board P1 with a bonding member P3. In the first acquisition process, inspection data obtained from a first inspection machine 101 that inspects the board assembly P10 based on at least electrical characteristics is acquired as first data D1 (see FIG. 3). In the second acquisition process, second data D2, D3, D4 (see FIG. 3) are acquired. The second data D2, D3, D4 are data regarding the board P1 and are different from the first data D1. In the association process, the first data D1 is associated with the second data D2, D3, D4.

[0019] According to the above aspect, the inspection data (first data D1) obtained from the first inspection machine 101 that inspects the board assembly P10 based on at least the electrical characteristics is associated with data (second data D2, D3, D4) other than the first data D1 regarding the board P1. Since the board assembly P10 is generated by mounting the component P2 on the board P1 with the bonding member P3, the first data D1 and the second data D2, D3, D4 are associated with each board P1, for example. As a result, when the component P2 is mounted on a certain board P1, the first data D1, which is the inspection data obtained from the first inspection machine 101, can be handled in association with the second data D2, D3, D4, which are different from the first data D1 regarding the board P1. As a result, for example, the first data D1, which is the inspection data of the first inspection machine 101, can be fed back to the component mounting system 20 and used to update various conditions or parameters, etc., thereby making it possible to effectively utilize the inspection data of the first inspection machine 101. This has the advantage that it is easy to effectively utilize the inspection data of the inspection machine (first inspection machine 101) that inspects the board assembly P10 based on the electrical characteristics.

[0020] Furthermore, by using the quality control support method according to the present embodiment, it is also possible to realize a method for generating a data set including the first data D1 and the second data D2, D3, and D4. That is, in the quality control support method, the first data D1 is associated with the second data D2, D3, and D4 in the association process, and by utilizing this, it is possible to generate a data set including the first data D1 and the second data D2, D3, and D4.

[0021] In short, the data set generation method according to the present embodiment is a data set generation method used for managing the component mounting system 20, and includes a first acquisition process, a second acquisition process, and a generation process. As described above, the component mounting system 20 generates a board assembly P10 by mounting a component P2 on a board P1 with a bonding member P3. In the first acquisition process, inspection data obtained from a first inspection machine 101 that inspects the board assembly P10 based on at least electrical characteristics is acquired as first data D1. In the second acquisition process, second data D2, D3, D4 are acquired. The second data D2, D3, D4 are data related to the board P1 and are different from the first data D1. In the generation process, a data set including the first data D1 and the second data D2, D3, D4 is generated by associating the first data D1 with the second data D2, D3, D4.

[0022] In this way, according to the dataset generation method, by adopting a generation process instead of the association process of the quality control support method, a dataset including first data D1 and second data D2, D3, and D4 can be obtained as a product.

[0023] Moreover, the quality control support method according to the present embodiment is executed by a quality control support system 10 as an example. In other words, the quality control support system 10 is one aspect for realizing the above-mentioned quality control support method. That is, the quality control support system 10 is a system for supporting quality control regarding the component mounting system 20, and includes a first acquisition unit 11, a second acquisition unit 12, and an association unit 13 as shown in FIG. 1. As described above, the component mounting system 20 produces a board assembly P10 by mounting a component P2 on a board P1 with a bonding member P3. The first acquisition unit 11 acquires, as first data D1, inspection data obtained from a first inspection machine 101 that inspects the board assembly P10 based on at least electrical characteristics. The second acquisition unit 12 acquires second data D2, D3, and D4. The second data D2, D3, and D4 are data regarding the board P1 and are different from the first data D1. The association unit 13 associates the first data D1 with the second data D2, D3, and D4.

[0024] Here, the quality control support system 10 mainly comprises a computer system having one or more processors and one or more memories. In other words, the quality control support method according to this embodiment is used on a computer system (quality control support system 10). That is, the quality control support method can also be embodied as a program. Similarly, the data set generation method can also be embodied as a program. Therefore, the program according to this embodiment is a program for causing one or more processors to execute the quality control support method according to this embodiment or the data set generation method according to this embodiment.

[0025] Furthermore, the work system 100 according to this embodiment includes a quality control support system 10 and a component mounting system 20. The component mounting system 20 mounts a component P2 on a board P1 to produce a board assembly P10.

[0026] (2) Details The quality control support method, the data set generating method, the program, the quality control support system 10, and the operation system 100 according to this embodiment will be described in detail below.

[0027] (2.1) Premise In this embodiment, a case will be described in which the component mounting system 20 is used in the manufacture of electronic devices in a factory. A typical electronic device has various circuit blocks, such as a power supply circuit and a control circuit. In the manufacture of these circuit blocks, as an example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) to a board P1 (including a printed wiring board). In the mounting process, a component P2 (including an electronic component) is mounted (mounted) on the board P1. In the soldering process, for example, the board P1 on which the component P2 is mounted is heated in a reflow furnace 3 to melt the cream solder and perform soldering.

[0028] In the mounting process, the component mounting system 20 performs an operation of mounting a plurality of components P2 on the board P1. As a result, the board assembly P10 consisting of the board P1 on which the plurality of components P2 are mounted is generated by the component mounting system 20. In other words, the board assembly P10 includes the board P1 and the plurality of components P2 mounted on the board P1.

[0029] In the present disclosure, a "board assembly" is produced by mounting a component P2 on a board P1, and more specifically, is an intermediate product (semi-finished product) or final product in which the component P2 is mounted on the board P1 with a bonding member P3. In other words, the board assembly P10 produced by the component mounting system 20 is the board P1 in a state in which the component P2 is mounted with the bonding member P3, or in other words, is an intermediate product or final product including the board P1, the component P2, and the bonding member P3.

[0030] The "substrate" in this disclosure is a member on which the component P2 is mounted, and is a printed wiring board having an electrically insulating substrate body and conductive wiring formed on the surface or inside of the substrate body. The substrate P1 includes not only printed wiring boards literally formed in a plate shape, but also substrates molded three-dimensionally, such as three-dimensional molded substrates. As an example in this embodiment, the substrate P1 is a plate-shaped printed wiring board with wiring formed on the surface.

[0031] In the present disclosure, a "component" refers to a member to be mounted on the substrate P1, and includes electronic components and the like. In the present embodiment, as an example, a case will be described in which the component mounting system 20 is used to mount the component P2 by surface mount technology (SMT). That is, the component P2 is a surface mount component (SMD: Surface Mount Device), and is mounted by being placed on the surface (mounting surface) of the substrate P1. However, this is not limiting, and the component mounting system 20 may be used to mount the component P2 by insertion mount technology (IMT). In this case, the component P2 is a component for insertion mounting having lead terminals, and is mounted on the surface (mounting surface) of the substrate P1 by inserting the lead terminals into holes in the substrate P1.

[0032] The "joint member" in this disclosure is a member for mounting the component P2 on the substrate P1, and includes, for example, solder and conductive paste such as silver paste. "Mounting" here means mechanical and electrical connection to the substrate P1. More specifically, the joint member P3 mechanically and electrically connects the terminals of the component P2 to the wiring formed on the substrate P1. As an example, in this embodiment, the joint member P3 is cream solder, and soldering is performed by heating it in a reflow furnace 3.

[0033] In the present disclosure, "association" means to provide a connection (relationship) between a plurality of matters, and includes linking, that is, associating, a plurality of data with each other. That is, by linking the first data D1 with the second data D2, D3, and D4 in the association process, the first data D1 and the second data D2, D3, and D4 are linked with each other, and a connection is created between the first data D1 and the second data D2, D3, and D4. As a result, for example, it is possible to identify the second data D2, D3, and D4 associated with the first data D1 based on the first data D1. Conversely, it is also possible to identify the first data D1 associated with the second data D2, D3, and D4 based on the second data D2, D3, and D4.

[0034] Various means can be adopted as a means for realizing the association between the first data D1 and the second data D2, D3, and D4. That is, as an example of a means for realizing the association between two entities, there are the following means. The first means is a means for directly associating two entities by defining two entities having a common key as a linked relationship using some matter (data) of the two entities as a key. The second means is a means for associating two entities by making the two entities belong to the same group. The third means is a means for indirectly associating two entities by linking the two entities to a third matter (data) different from the two entities as a key. The fourth means is a means for directly associating two entities by linking the two entities. In this embodiment, as an example, the first means is used to indirectly link the first data D1 and the second data D2, D3, and D4.

[0035] (2.2) Configuration of component mounting system Next, the configuration of a component mounting system 20 in which the quality control support method according to this embodiment is used will be described with reference to FIGS.

[0036] As described above, the component mounting system 20 according to this embodiment includes a plurality of devices that constitute a mounting line. Here, the component mounting system 20 includes one or more (one in the example of FIG. 1) solder forming machines 1, one or more (three in the example of FIG. 1) mounting machines 2, and one or more (one in the example of FIG. 1) reflow furnaces 3. The solder forming machine 1, the three mounting machines 2, and the reflow furnace 3 are connected to each other and constitute one mounting line together with inspection machines (first inspection machine 101 and second inspection machines 102, 103, 104). That is, in this embodiment, as an example, the component mounting system 20 includes, in addition to the solder forming machine 1, the three mounting machines 2, and the reflow furnace 3, a first inspection machine 101, and three second inspection machines 102, 103, 104.

[0037] A plurality of devices included in the component mounting system 20 (solder formation machine 1, three mounters 2, reflow furnace 3, first inspection machine 101, and three second inspection machines 102, 103, 104) are arranged in a line and connected to form a mounting line. Specifically, the solder formation machine 1, the second inspection machine 102, the three mounters 2, the second inspection machine 103, the reflow furnace 3, the second inspection machine 104, and the first inspection machine 101 are arranged in this order from the upstream side of the mounting line. In other words, in the mounting line, the left end (solder formation machine 1) side in FIG. 1 is the upstream side, and the right end (first inspection machine 101) side in FIG. 1 is the downstream side.

[0038] Therefore, in the component mounting system 20 according to the present embodiment, the board P1 moves between the multiple devices in the following order: the solder forming machine 1 at the head, the second inspection machine 102, the three mounting machines 2, the second inspection machine 103, the reflow furnace 3, the second inspection machine 104, and the first inspection machine 101 at the rear. That is, the board P1 passes through the multiple devices in sequence while moving from the left end to the right end of FIG. 1. The component mounting system 20 mounts one or more (multiple in the present embodiment) components P2 on the board P1 while the board P1 passes through the multiple devices. Thus, the component mounting system 20 introduces the board P1 from the solder forming machine 1 side, mounts multiple components P2 (electronic components) on the board P1, and then discharges the board assembly P10 from the first inspection machine 101 side.

[0039] The solder forming machine 1 is a device that places (forms) the bonding material P3 on the surface of the substrate P1. In the present embodiment, as an example, since the bonding material P3 is cream solder, the solder forming machine 1 is a solder printer (cream solder printer) such as a screen printer. Therefore, in the drawings such as FIG. 1, the solder forming machine 1 is labeled "Printer". In the solder application process, the solder forming machine 1 uses a mask such as a metal mask to print (apply) the bonding material P3 in a desired shape (pattern) on the surface of the substrate P1, thereby placing the bonding material P3 on the substrate P1. The mask has holes formed in accordance with the pad positions formed on the surface of the substrate P1, and the bonding material P3 is attached to the surface of the substrate P1 through the holes by a squeegee.

[0040] 2, a bare board P1 is introduced into the solder forming machine 1. That is, the board P1 is introduced into the solder forming machine 1 without the components P2 and the bonding members P3 attached thereto, and the board P1 is discharged from the solder forming machine 1 with the bonding members P3 arranged (formed) thereon.

[0041] The mounting machine 2 is a device that mounts components P2 on a board P1 in a mounting process. The component mounting system 20 includes a plurality of (three in this embodiment) mounting machines 2. In this embodiment, these mounting machines 2 have a common configuration.

[0042] In the component mounting system 20, a single mounter 2 may mount a plurality of components P2 of the same or different types on the board P1, or a plurality of mounters 2 (three in this embodiment) may mount a plurality of components P2 of the same or different types on the board P1. For example, a plurality of mounters 2 sequentially mount the components P2 on one board P1, thereby ultimately generating a board assembly P10 on which a plurality of components P2 are mounted. As an example in this embodiment, the mounter 2 is a chip mounter (surface mounter) that mounts the components P2, which are electronic components, on the surface of the board P1 on which the bonding members P3 are formed, so as to correspond to the mounting of the components P2 by surface mount technology (SMT). Therefore, in the drawings such as FIG. 1, the mounter 2 is labeled "Mounter".

[0043] 2, the board P1 on which the bonding material P3 has been formed by the solder forming machine 1 is introduced into the mounting machine 2. That is, the board P1 to which the bonding material P3 has been added is introduced into the mounting machine 2, and the board P1 on which the component P2 has been placed (mounted) is discharged from the mounting machine 2. In the board P1 discharged from the mounting machine 2, the bonding of the component P2 by the bonding material P3 has not yet been completed.

[0044] More specifically, the mounting machine 2 has a capturing unit for capturing the component P2. The capturing unit is, for example, a suction nozzle, and captures (holds) the component in a state in which it can be released (i.e., released from capture). The mounting machine 2 captures the component P2 supplied to the supply unit with the capturing unit, moves the capturing unit in a state in which it has captured the component P2, and releases the component P2 on the board P1, thereby mounting the component P2 on the mounting surface of the board P1. The "supply unit" here refers to a portion (location) of the component mounting system 20 for supplying the components P2 used in the component mounting system 20. The component mounting system 20 has multiple supply units, and performs mounting work using the components P2 supplied to each supply unit. For example, the supply unit is configured to be able to mount a tape feeder for supplying the components P2. The tape feeder is equipped with a reel of carrier tape containing multiple components P2, thereby making it possible to supply the multiple components P2 from the supply unit to the component mounting system 20.

[0045] The reflow furnace 3 is a device that bonds the component P2 to the board P1 with the bonding material P3. In this embodiment, as an example, the bonding material P3 is cream solder, and the reflow furnace 3 heats the board P1 on which the component P2 is mounted in the soldering process to melt the bonding material P3 and perform soldering. In other words, the reflow furnace 3 is a device that bonds the component P2 to the board P1 with the bonding material P3 by heating and melting the bonding material P3 arranged on the surface of the board P1, and is, as an example, a far-infrared air reflow furnace. Therefore, in the drawings such as FIG. 1, the reflow furnace 3 is labeled "Reflow."

[0046] 2, a board P1 on which bonding members P3 have been formed by a solder forming machine 1 and on which components P2 have been arranged (mounted) by a mounting machine 2 is introduced into the reflow furnace 3. That is, the board P1 on which the components P2 and bonding members P3 have been added is introduced into the reflow furnace 3, and the board P1 on which the components P2 have been joined by the bonding members P3, i.e., a board assembly P10, is discharged from the reflow furnace 3.

[0047] The first inspection machine 101 is an inspection machine that performs an inspection based on at least the electrical characteristics of the board assembly P10, and is, for example, an in-circuit tester (ICT) or a function tester (FCT). The in-circuit tester is an inspection machine that inspects the electrical characteristics of each part of the board assembly P10 (the board P1, the component P2, or the bonding member P3) while a minute current that does not cause the board assembly P10 to operate as intended is passed through the board assembly P10. The function tester is an inspection machine that inspects the electrical characteristics of each part of the board assembly P10 (the board P1, the component P2, or the bonding member P3) while an operating current for operating the board assembly P10 is passed through the board assembly P10.

[0048] That is, the first inspection machine 101 is a machine that inspects the board assembly P10 by measuring the electrical characteristics of the board assembly P10, unlike an optical appearance inspection machine that inspects the board assembly P10 from an image captured by a camera or the like. This type of first inspection machine 101 inspects the following inspection items: the state (including the conductive state, etc.) of each of the board P1, the component P2, and the bonding member P3, the mounting state of the component P2, or the conductive state of at least a part of the board assembly P10. That is, the first inspection machine 101 can find, for example, a short circuit abnormality in which adjacent pins of the component P2 are short-circuited via the bonding member P3, an open circuit abnormality in which a pin of the component P2 and the board P1 (pad) are not conductive, and the like. This type of first inspection machine 101 makes it easy to find defects that are difficult to find by an appearance inspection machine or visual inspection.

[0049] In the present embodiment, as an example, the first inspection machine 101 is an in-circuit tester (ICT). Therefore, in the drawings such as Fig. 1, the first inspection machine 101 is marked with the notation "ICT." The first inspection machine 101 consisting of an in-circuit tester has an advantage that, for example, even if an abnormality in a short circuit mode occurs, the component P2 included in the board assembly P10 is unlikely to be damaged because the current for inspection is minute.

[0050] The second inspection machine 102 is disposed between the solder forming machine 1 and the mounting machine 2, that is, at a position downstream of the solder forming machine 1 and upstream of the mounting machine 2. Therefore, the board P1 discharged from the solder forming machine 1 is sent to the mounting machine 2 via the second inspection machine 102. The second inspection machine 102 is an inspection machine that inspects the state of the bonding member P3 disposed on the board P1 before the component P2 is mounted on the board P1. In other words, the second inspection machine 102 inspects the board P1 in a state after the bonding member P3 is formed and before the component P2 is mounted, and inspects, for example, the amount of adhesion (solder amount) of the bonding member P3 or whether the bonding member P3 is correctly attached. As an example in this embodiment, the second inspection machine 102 is a solder paste inspection device (SPI: Solder Paste Inspection) that inspects the state of the bonding member P3 formed on the board P1 using two-dimensional or three-dimensional images. Therefore, in the drawings such as FIG. 1, the second inspection machine 102 is labeled "SPI."

[0051] The second inspection machine 103 is disposed between the mounting machine 2 and the reflow furnace 3, that is, at a position downstream of the mounting machine 2 and upstream of the reflow furnace 3. Therefore, the board P1 discharged from the mounting machine 2 is sent to the reflow furnace 3 via the second inspection machine 103. The second inspection machine 103 is an inspection machine that inspects the state of at least one of the bonding member P3 and the component P2 disposed on the board P1 after the component P2 is mounted on the board P1. That is, the second inspection machine 103 inspects the board P1 after the component P2 is mounted and in a state in which the bonding of the component P2 by the bonding member P3 is incomplete, and inspects, for example, whether the position of the component P2 on the board P1 is correct (whether the deviation is within an allowable range). As an example in this embodiment, the second inspection machine 103 is a board inspection device that inspects the board P1 (including the bonding member P3) in a state in which the component P2 is mounted and the bonding of the component P2 by the bonding member P3 is incomplete, using two-dimensional or three-dimensional images. The "substrate inspection device" referred to here includes an automated optical inspection device (AOI), also known as a substrate visual inspection device, and an automated X-ray inspection device (AXI). In the present embodiment, as an example, the second inspection device 103 is an automated optical inspection device (AOI). Therefore, in the drawings such as FIG. 1, the second inspection device 103 is labeled "AOI."

[0052] The second inspection machine 104 is disposed between the reflow furnace 3 and the first inspection machine 101, that is, downstream of the reflow furnace 3 and upstream of the first inspection machine 101. Therefore, the board P1 discharged from the reflow furnace 3 is sent to the first inspection machine 101 via the second inspection machine 104. The second inspection machine 104 is an inspection machine that inspects the state of at least one of the joining member P3 and the component P2 disposed on the board P1 after the component P2 is mounted on the board P1. In other words, the second inspection machine 104 inspects the board P1 after the mounting of the component P2 and the joining of the component P2 by the joining member P3 is completed, and inspects, for example, whether the position of the component P2 on the board P1 is correct or not, or whether the joining member P3 is correctly attached or not. In this embodiment, as an example, the second inspection machine 104 is a board inspection device that inspects the state of the board P1 (including the joining material P3) on which the component P2 is mounted and the joining of the component P2 by the joining material P3 is completed, using two-dimensional or three-dimensional images. In this embodiment, as an example, the second inspection machine 104 is an automated optical inspection machine (AOI). Therefore, in the drawings such as FIG. 1, the second inspection machine 104 is labeled "AOI."

[0053] In this embodiment, all of these three second inspection machines 102, 103, and 104 are inspection machines different from the first inspection machine 101 included in the component mounting system 20. In particular, in this embodiment, all of the three second inspection machines 102, 103, and 104 are arranged upstream of the first inspection machine 101 in the mounting line. In other words, the board P1 that has been inspected by the three second inspection machines 102, 103, and 104 is sent to the first inspection machine 101. In addition, all of the three second inspection machines 102, 103, and 104 are optical inspection machines that inspect the board P1 (including the components P2 and the bonding members P3) from images captured by a camera or the like, unlike the first inspection machine 101 that performs inspection based on electrical characteristics. That is, in the component mounting system 20 including the first inspection machine 101 and the (three) second inspection machines 102, 103, and 104, both inspection based on electrical characteristics and optical inspection can be performed on the board assembly P10.

[0054] In this embodiment, the first inspection machine 101 and the (three) second inspection machines 102, 103, and 104 form a mounting line together with the solder forming machine 1, the mounting machine 2, and the reflow furnace 3. That is, the first inspection machine 101 and the (three) second inspection machines 102, 103, and 104 are included in the components of the component mounting system 20. In particular, since the first inspection machine 101, which is an in-circuit tester, is disposed at the end of the mounting line, the board assembly P10 finally discharged from the mounting line is the board assembly P10 that has been inspected by the first inspection machine 101. That is, in the mounting line constructed by the component mounting system 20 in this embodiment, in addition to the production of the board assembly P10, inspection based on the electrical characteristics of the produced board assembly P10 is consistently performed.

[0055] Therefore, the component mounting system 20 can mount a plurality of components P2 while dividing the work among a plurality of devices, and ultimately produce a board assembly P10 on which a plurality of components P2 are mounted. Moreover, since the first inspection machine 101 and a plurality of (here, three) second inspection machines 102, 103, and 104 inspect the board P1 (or the board assembly P10 including the board P1), the component mounting system 20 can realize the production of the board assembly P10 including inspection.

[0056] Furthermore, each of the solder forming machine 1, the mounting machine 2, the reflow furnace 3, the first inspection machine 101, and the second inspection machines 102, 103, and 104 included in the component mounting system 20 has a user interface, a conveying device, a control device, a communication device, and the like.

[0057] The user interface includes, for example, a touch panel display, and accepts user operations and presents (displays, etc.) information to the user. The user interface is not limited to a touch panel display, and may include, for example, an input device such as a keyboard, a pointing device, a mechanical switch, or a gesture sensor. The user interface may also include a voice input / output unit instead of or in addition to the touch panel display. The transport device is a device that transports the substrate P1, and is realized by a belt conveyor or the like.

[0058] The control device is a device that controls the operation of each part. The control device is mainly composed of a microcontroller having one or more processors and one or more memories. In other words, the functions of the control device are realized by the processor of the microcontroller executing a program recorded in the memory of the microcontroller. The program may be pre-recorded in the memory, or may be provided via a telecommunication line such as the Internet, or may be recorded on a non-transitory recording medium such as a memory card and provided.

[0059] The communication device is configured to communicate with a higher-level system (including the quality control support system 10) directly or indirectly via a network or a repeater, etc. This allows each of the solder forming machine 1, the mounting machine 2, the reflow oven 3, the first inspection machine 101, and the second inspection machines 102, 103, and 104 to transmit and receive data to and from the quality control support system 10.

[0060] (2.3) Configuration of quality control support system Next, the configuration of the quality control support system 10 according to this embodiment will be described with reference to FIG.

[0061] As described above, the quality control support system 10 is a system that supports quality control regarding the component mounting system 20. In this embodiment, as described above, the solder forming machine 1, the three mounting machines 2, the reflow furnace 3, the first inspection machine 101, and the three second inspection machines 102, 103, and 104 included in the component mounting system 20 are arranged in a line and connected to form a mounting line. Therefore, the quality control support system 10 is connected to the solder forming machine 1, the three mounting machines 2, the reflow furnace 3, the first inspection machine 101, and the three second inspection machines 102, 103, and 104 so as to be able to communicate with them, and supports quality control of these devices.

[0062] 1, the quality control support system 10 includes a first acquisition unit 11, a second acquisition unit 12, an association unit 13, an output unit 14, a notification unit 15, an additional acquisition unit 16, an estimation unit 17, a communication unit 18, and a data storage unit 19. In this embodiment, the quality control support system 10 is mainly configured as a computer system having one or more processors and one or more memories, as described above. Among the quality control support system 10, the functions of at least the first acquisition unit 11, the second acquisition unit 12, the association unit 13, the output unit 14, the notification unit 15, the additional acquisition unit 16, and the estimation unit 17 are embodied by one or more processors executing programs.

[0063] As described above, the first acquisition unit 11 executes the first acquisition process to acquire the first data D1. The first data D1 is inspection data acquired from the first inspection machine 101. The first inspection machine 101 is an inspection machine that inspects the board assembly P10 based on at least electrical characteristics, and in this embodiment, as an example, is an in-circuit tester (ICT).

[0064] The second acquisition unit 12 executes a second acquisition process to acquire second data D2, D3, and D4. The second data D2, D3, and D4 are data related to the board P1 and are different from the first data D1. In the present embodiment, as an example, the second data D2, D3, and D4 are inspection data acquired from three second inspection machines 102, 103, and 104, respectively (see FIG. 3). In other words, in the second acquisition process, the second data D2, D3, and D4 including inspection data obtained by the second inspection machines 102, 103, and 104 different from the first inspection machine 101 included in the component mounting system 20 are acquired.

[0065] That is, in this embodiment, the second acquisition unit 12 is configured to be able to acquire three types of second data D2, D3, and D4. The second data D2 is inspection data of a second inspection machine 102 consisting of a solder print inspection machine (SPI), and is acquired from the second inspection machine 102. The second data D3 is inspection data of a second inspection machine 103 consisting of an automatic optical inspection machine (AOI) in the upstream stage of the reflow furnace 3, and is acquired from the second inspection machine 103. The second data D4 is inspection data of a second inspection machine 104 consisting of an automatic optical inspection machine (AOI) in the downstream stage of the reflow furnace 3, and is acquired from the second inspection machine 104.

[0066] The associating unit 13 executes an associating process for associating the first data D1 with the second data D2, D3, and D4. In the present embodiment, as an example, the associating unit 13 directly associates two targets by defining two targets having a common key as a linked relationship using some matter (data) of the two targets (the first data D1 and the second data D2, D3, and D4) as a key. Here, as an example, the key data is unique identification information (hereinafter referred to as "substrate ID") attached to each individual substrate P1.

[0067] The output unit 14 executes an output process that outputs the result of the association process. That is, the quality control support method according to this embodiment has an output process that outputs the result of the association process. The "result of the association process" here is the result of the association between the first data D1 and the second data D2, D3, and D4 performed by the association unit 13, in other words, a data set including the first data D1 and the second data D2, D3, and D4 in an associated state. The output mode of the output unit 14 includes, for example, output to the notification unit 15, transmission to the component mounting system 20 or other systems, display, audio output, recording (writing) to a non-temporary recording medium (including the data storage unit 19), and printing (printout).

[0068] In this embodiment, as an example, the output unit 14 directly or indirectly outputs the result of the association process to the notification unit 15 and the data storage unit 19. Furthermore, in this embodiment, as an example, the output unit 14 directly or indirectly transmits the result of the association process to the component mounting system 20. Since each device included in the component mounting system 20 has a user interface as described above, the result of the association process transmitted from the output unit 14 can be presented to a person such as a worker on the user interface of the component mounting system 20. In addition, for example, according to a display or audio output mode, the output unit 14 can output the result of the association process to a person such as a worker.

[0069] The notification unit 15 executes a notification process. The notification process is a process of notifying when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are normal. That is, the quality control support method according to the present embodiment has a notification process of notifying when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are normal. In the present embodiment, as an example, the condition for the notification unit 15 to notify is that all the inspection results of the multiple (three) second inspection machines 102, 103, and 104 are normal. As an example, the determination of whether the condition for notifying is satisfied is executed by the output unit 14 or the notification unit 15. The notification mode of the notification unit 15 includes, for example, direct notification such as display, audio output, and printing (printout), as well as indirect notification by transmission to the component mounting system 20 or other systems (including mobile terminals, etc.).

[0070] In the present embodiment, when the notification unit 15 issues a notification, it notifies at least the recommended information. The recommended information is information related to changes in the inspection conditions in the second inspection machines 102, 103, and 104. That is, in the notification process, the recommended information related to changes in the inspection conditions in the second inspection machines 102, 103, and 104 is notified.

[0071] The additional acquisition unit 16 executes the additional acquisition process. The additional acquisition process is a process for acquiring additional information when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are abnormal. The additional information is information related to a user's judgment regarding the inspection results of the second inspection machines 102, 103, and 104. That is, the quality control support method has an additional acquisition process for acquiring additional information related to a user's judgment regarding the inspection results of the second inspection machines 102, 103, and 104 when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are abnormal. As an example in this embodiment, the condition for the additional acquisition unit 16 to acquire the additional information is that the inspection result of any one of the multiple (three) second inspection machines 102, 103, and 104 is abnormal.

[0072] When the inspection result of the first inspection machine 101 is abnormal, the estimation unit 17 executes an estimation process to estimate the cause of the abnormality. The cause of the abnormality here includes position information on a specific location of the board assembly P10. In other words, when there is an abnormality in the component P2 or the joining member P3 at a specific location of the board assembly P10, the component P2 or the joining member P3 can be identified according to the position information. In this embodiment, the estimation unit 17 estimates the cause of the abnormality (including the position information) from the inspection data of the first inspection machine 101 using a node list based on the arrangement of the component P2 in the board assembly P10. The "node list" here is a list of the component P2 included between two test nodes used for inspection by the first inspection machine 101 consisting of an in-circuit tester (ICT) or the like. As an example, the estimation unit 17 estimates the cause of the abnormality using a trained model generated by machine learning.

[0073] The communication unit 18 is configured to communicate with the component mounting system 20 and / or the upper system directly or indirectly via a network or a repeater, etc. This allows the quality control support system 10 to exchange data with the component mounting system 20 and / or the upper system. Strictly speaking, the communication unit 18 communicates with each of the devices included in the component mounting system 20 (the solder formation machine 1, the three mounting machines 2, the reflow oven 3, the first inspection machine 101, and the three second inspection machines 102, 103, 104).

[0074] The data storage unit 19 stores (stores) various data such as the results of the association process and data (the first data D1 and the second data D2, D3, D4, etc.) collected from each device included in the component mounting system 20. The data storage unit 19 also stores information necessary for calculations in the first acquisition unit 11, the second acquisition unit 12, the association unit 13, the output unit 14, the notification unit 15, the additional acquisition unit 16, the estimation unit 17, etc. The data storage unit 19 includes a rewritable non-volatile memory such as an EEPROM (Electrically Erasable Programmable Read-Only Memory).

[0075] The operation of each part of the quality control support system 10 will be explained in detail in the section "(3) Quality control support method."

[0076] Furthermore, the quality control support system 10 may further include a processing device, a user interface, and the like, in addition to the above configuration. However, the processing device, the user interface, and the like are not essential components of the quality control support system 10. In FIG. 1, components of the quality control support system 10 other than the first acquisition unit 11, the second acquisition unit 12, the association unit 13, the output unit 14, the notification unit 15, the additional acquisition unit 16, the estimation unit 17, the communication unit 18, and the data storage unit 19 are omitted as appropriate.

[0077] The processing device performs integrated management of the mounting line (component mounting system 20) by controlling devices included in the component mounting system 20. In other words, the quality control support system 10 also functions as an integrated management system for the mounting line.

[0078] The user interface includes, for example, a touch panel display, and receives user operations and presents (displays, etc.) information to the user. The user interface is not limited to a touch panel display, and may include, for example, an input device such as a keyboard, a pointing device, a mechanical switch, or a gesture sensor. The user interface may also include a voice input / output unit instead of or in addition to the touch panel display.

[0079] As described above, the quality control support system 10 according to this embodiment constitutes the operation system 100 together with the component mounting system 20. That is, as shown in Fig. 1, the operation system 100 according to this embodiment includes the quality control support system 10 and the component mounting system 20. The component mounting system 20 is a system that mounts a component P2 on a board P1 to produce a board assembly P10.

[0080] (3) Quality control support method The quality control support method according to this embodiment will be described in more detail below. In this embodiment, the quality control support method is executed by the quality control support system 10 as described above. Therefore, the quality control support method according to this embodiment will be described below as the operation of the quality control support system 10.

[0081] (3.1) Basic form First, a basic aspect of the quality control support method according to this embodiment will be described with reference to Fig. 3. Fig. 3 is a conceptual diagram showing the state of quality control related to a component mounting system 20 according to the quality control support method.

[0082] In this embodiment, according to component mounting system 20 including first inspection machine 101 and multiple (here, three) second inspection machines 102, 103, and 104, each inspection machine obtains inspection data such as the example shown in FIG. 3.

[0083] That is, as shown in Fig. 3, the first inspection machine 101 consisting of an in-circuit tester (ICT) measures the electrical characteristics of the board assembly P10 discharged from the reflow furnace 3, and outputs the result of the inspection of the board assembly P10 as inspection data. Therefore, the first data D1, which is the inspection data of the first inspection machine 101, includes data representing, for example, a short-circuit mode abnormality in which adjacent pins of the component P2 are short-circuited via the joining member P3, and a disconnection mode abnormality in which the pin of the component P2 and the board P1 are not conductive. In the example of Fig. 3, the first data D1 includes two files D11 and D12. The file D11 is data representing a disconnection mode abnormality of the 7th or 8th pin of the component P2 called "IC-2", and the file D12 is data representing a short-circuit mode abnormality between the 5th and 6th pins of the component P2 called "IC-1".

[0084] In this way, in the first acquisition process of the quality control support method according to this embodiment, not only is the presence or absence of an abnormality obtained, but if an abnormality is found, inspection data from the first inspection machine 101 including information on the position (specific location) of the abnormality in the board assembly P10 is obtained as the first data D1. That is, in the first acquisition process, the first data D1 including position information on the specific location of the board assembly P10 is obtained. In other words, the first data D1 includes position information on the specific location of the board assembly P10.

[0085] However, the first inspection machine 101, which performs an inspection based on the electrical characteristics of the board assembly P10, does not inherently output inspection data in a manner that allows identification of the cause of the abnormality, such as, for example, position information regarding the location of the abnormality, when the inspection result of the first inspection machine 101 is abnormal. The quality control support method according to this embodiment is capable of identifying the cause of such an abnormality precisely because it has an estimation process that estimates the cause (position information) of the abnormality in the inspection result of the first inspection machine 101. In other words, as illustrated in FIG. 3, the files D11 and D12 in a manner that allows identification of the cause of the abnormality do not actually directly represent the inspection data from the first inspection machine 101, but represent the result identified (estimated) through the estimation process.

[0086] In short, in the first acquisition process of the quality control support method according to this embodiment, the inspection data output from the first inspection machine 101 is not directly acquired, but the inspection data is acquired as the first data D1 via the estimation process. This makes it possible to acquire the first data D1 including position information on a specific location of the board assembly P10, as described above. Then, in the estimation process, as described above, the position information is estimated using a node list based on the arrangement of the component P2 in the board assembly P10. In other words, in the first acquisition process, the position information is acquired using a node list based on the arrangement of the component P2 in the board assembly P10. The estimation process will be described in detail in the section "(3.2) Estimation Process".

[0087] As shown in Fig. 3, the second inspection machine 102, which is a solder print inspection device (SPI), captures an image of the substrate P1 discharged from the solder formation machine 1, and outputs the result of inspecting the state of the bonding material P3 arranged on the substrate P1 as inspection data. Therefore, the second data D2, which is the inspection data of the second inspection machine 102, includes, for example, data indicating the amount (solder amount) of the bonding material P3 attached, or whether the bonding material P3 is attached correctly. In the example of Fig. 3, the second data D2 includes image data D21 to D28 obtained by capturing images of each of a plurality of (here, eight) inspection areas set on the substrate P1 with a camera. Each of the image data D21 to D28 is image data including the bonding material P3 arranged (formed) at a plurality of locations on the substrate P1.

[0088] As shown in Fig. 3, the second inspection machine 103, which is an automatic optical inspection device (AOI), takes an image of the board P1 discharged from the mounting machine 2, and outputs the result of inspecting the state of at least one of the bonding material P3 and the component P2 arranged on the board P1 as inspection data. Therefore, the second data D3, which is the inspection data of the second inspection machine 103, includes data indicating whether the position of the component P2 on the board P1 is correct (whether the deviation is within an allowable range), etc. In the example of Fig. 3, the second data D3 includes image data D31 to D38 obtained by capturing an image of each of a plurality of (here, eight) inspection areas set on the board P1 with a camera. The image data D31 to D38 are image data including parts of the components P2 and the bonding material P3 arranged (formed) at a plurality of locations on the board P1.

[0089] As shown in Fig. 3, the second inspection machine 104, which is an automatic optical inspection device (AOI), captures an image of the board P1 discharged from the reflow furnace 3, and outputs the result of inspecting the state of at least one of the bonding material P3 and the component P2 arranged on the board P1 as inspection data. Therefore, the second data D4, which is the inspection data of the second inspection machine 104, includes data indicating, for example, whether the position of the component P2 on the board P1 is correct or not, or whether the bonding material P3 is attached correctly or not. In the example of Fig. 3, the second data D4 includes image data D41 to D48 obtained by capturing an image of each of a plurality of (here, eight) inspection areas set on the board P1 with a camera. The image data D41 to D48 are image data including a part of the component P2 and the bonding material P3 arranged (formed) at a plurality of places on the board P1.

[0090] In the quality control support method according to this embodiment, a first acquisition process acquires inspection data obtained from a first inspection machine 101 as first data D1, and a second acquisition process acquires inspection data obtained from second inspection machines 102, 103, 104 as second data D2, D3, D4. Then, the quality control support method associates the first data D1 with the second data D2, D3, D4 through an association process.

[0091] In the present embodiment, as an example, in the association process, some of the items (data) of the two targets (the first data D1 and the second data D2, D3, D4) are used as a key, and the two targets having a common key are defined as a linked relationship, thereby directly associating the two targets. The key data is unique identification information (substrate ID) attached to each board P1. In short, the first data D1 and the second data D2, D3, D4 all contain the key board ID. Since the board ID is unique identification information for the board P1, the same board ID is used for the same board P1 in the first inspection machine 101 and the three second inspection machines 102, 103, 104. Therefore, the first data D1 and the second data D2, D3, D4 obtained by the first inspection machine 101 and the three second inspection machines 102, 103, 104 for the same board P1 all contain the same board ID.

[0092] Therefore, in the association process, the first data D1 and the second data D2, D3, and D4 containing the same substrate ID are associated with each other using the substrate ID as a key. As a result, the first data D1 and the second data D2, D3, and D4 related to the same substrate P1 are associated with each other. In other words, the first data D1 and the second data D2, D3, and D4 are associated with each substrate P1 (substrate ID). Then, the result of the association process, that is, a data set including the first data D1 and the second data D2, D3, and D4 in an associated state, is stored (stored) in the data storage unit 19 in the output process.

[0093] Furthermore, in this embodiment, as described above, the second data D2, D3, and D4 include image data. In the association process, the position information in the first data D1 is associated with image data corresponding to a specific location in the image data of the second data D2, D3, and D4. In other words, when the first data D1 and the second data D2, D3, and D4 are subdivided into a plurality of data, these subdivided data, that is, the position information in the first data D1 is associated with the image data of the second data D2, D3, and D4. For example, the file D11 of the first data D1 is associated with the image data D27, D37, and D47 of the inspection area corresponding to the 7th pin or the 8th pin of the component P2 called "IC-2" in the second data D2, D3, and D4. Meanwhile, the file D12 of the first data D1 is associated with the image data D22, D32, and D42 of the inspection area corresponding to the 5th pin or the 6th pin of the component P2 called "IC-1" among the second data D2, D3, and D4. Therefore, in the association process, the first data D1 and the second data D2, D3, and D4 are associated not only in units of the board P1 but also in units of "position" within the board P1.

[0094] 3, the inspection result of the first inspection machine 101 is abnormal (Failed), and the inspection results of the three second inspection machines 102, 103, and 104 are all normal (Passed). That is, in this case, even though none of the three second inspection machines 102, 103, and 104 located upstream from the first inspection machine 101 found any abnormality, the first inspection machine 101 ultimately determined that there was an abnormality. In such a case, the associated first data D1 and second data D2, D3, and D4 provide an opportunity to review, for example, the inspection result or inspection conditions of any of the three second inspection machines 102, 103, and 104.

[0095] That is, in the quality control support method according to this embodiment, when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are normal, a notification is made by the notification process. Therefore, in the case as shown in Fig. 3, the notification made by the notification process can provide a trigger for a user (operator) of the component mounting system 20 to review the inspection result or inspection conditions of any of the three second inspection machines 102, 103, and 104, for example.

[0096] Moreover, in this embodiment, as described above, the first data D1 and the second data D2, D3, and D4 are associated not only in units of the board P1, but also in units of "position" within the board P1. For example, a file D11 representing an abnormality in a disconnection mode of the 7th or 8th pin of the component P2, "IC-2," can provide an opportunity to review the inspection results or inspection conditions related to the associated image data D27, D37, and D47. Similarly, a file D12 representing an abnormality in a short-circuit mode between the 5th and 6th pins of the component P2, "IC-1," can provide an opportunity to review the inspection results or inspection conditions related to the associated image data D22, D32, and D42.

[0097] In addition, in the quality control support method according to the present embodiment, in the notification process, recommendation information regarding changes in the inspection conditions in the second inspection machines 102, 103, and 104 is notified. That is, because the inspection conditions in the second inspection machines 102, 103, and 104 are loose, there is a possibility that the first inspection machine 101 judges an abnormality as an abnormality even though the second inspection machines 102, 103, and 104 did not find an abnormality. Therefore, as the recommendation information, information promoting a change in the inspection conditions is notified so as to make the inspection conditions in at least one of the second inspection machines 102, 103, and 104 stricter. As an example, with respect to the inspection conditions in the second inspection machine 102, the recommendation information may include information recommending that a threshold value used for determining whether or not the amount of solder is insufficient by comparing with the amount of solder is increased. Similarly, with respect to the inspection conditions in the second inspection machine 103, the recommendation information may include information recommending that a threshold value used for determining whether or not the amount of solder is insufficient by comparing with the amount of positional deviation of the component P2 is decreased.

[0098] Furthermore, in the quality control support method according to the present embodiment, when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are also abnormal, additional information is acquired by additional acquisition processing. That is, in the case of FIG. 3, all of the three second inspection machines 102, 103, and 104 are normal, but when the inspection result of at least one of the three second inspection machines 102, 103, and 104 is abnormal, the additional acquisition processing is executed. As an example, if the inspection result of the second inspection machine 104 for a certain board P1 is abnormal, the board P1 would normally be removed from the mounting line at that point in time, but depending on the operation, the board P1 may be returned to the mounting line at the user's discretion (visual inspection). In such a case, the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are also abnormal, so additional information is acquired by additional acquisition processing.

[0099] Here, the additional information is information related to a user's judgment regarding the inspection results of the second inspection machines 102, 103, 104. One example of the additional information is information that, when the inspection result of the second inspection machine 104 was abnormal, the user intervened and judged that the board P1 was normal. Furthermore, the additional information in such a case includes information for identifying the user who intervened, that is, the user who judged that the board P1 was normal. By acquiring such additional information, the quality control support system 10 can utilize the first data D1 to educate or identify the user.

[0100] Meanwhile, in the second acquisition process, second data including at least one of information on the bonding member P3, information on the component P2, and information on the inspection conditions of any of the inspection machines including the first inspection machine 101 included in the component mounting system 20 may be acquired. That is, the second data is not limited to the inspection data of the second inspection machines 102, 103, and 104, and may include at least one of information on the bonding member P3, information on the component P2, and information on the inspection conditions of any of the inspection machines. Here, the information on the bonding member P3 includes information that identifies the product number, lot number, or manufacturer, etc., of the bonding member P3. The information on the component P2 includes information that identifies the product number, lot number, or manufacturer, etc., of the component P2. The information on the inspection conditions of any of the inspection machines (the first inspection machine 101 and the second inspection machines 102, 103, and 104) includes information that identifies the current inspection conditions (such as a threshold value for judgment) of the inspection machine, or a change history of the inspection conditions. Furthermore, the change history of the inspection conditions includes information that the inspection conditions have been changed, the date and time of the change, and the entity that made the change (such as a user name).

[0101] In this way, when the second data includes information other than the inspection data of the second inspection machines 102, 103, and 104, the first data D1 and the second data are associated with each other, so that the first data D1 can be further utilized. For example, it is possible to analyze and manage the characteristics or quality of the board assembly P10 for each part number, lot number, or manufacturer of the joining member P3 or the component P2. Specifically, for a board P1 using a joining member P3 with a certain part number, if the first data D1, which is the inspection data of the first inspection machine 101, is not satisfactory, it can provide an opportunity to reconsider the part number of the joining member P3. Therefore, it is possible to improve the mounting quality, including the selection of the joining member P3 or the component P2.

[0102] Furthermore, if the second data includes a change history of the inspection conditions, for example, when the inspection conditions are changed according to the recommended information, it can be used to verify whether the recommended information was appropriate. Specifically, if the first data D1, which is the inspection data of the first inspection machine 101, is not satisfactory after the inspection conditions of a certain inspection machine are changed according to the recommended information, it is possible to give notice that the recommended information was not appropriate.

[0103] (3.2) Estimation process Next, the estimation process in the quality control support method according to this embodiment will be described in detail with reference to Fig. 4. Fig. 4 is a conceptual diagram showing the inspection of a board assembly P10 by a first inspection machine 101 made up of an in-circuit tester (ICT).

[0104] A first inspection machine 101 that performs an inspection based on the electrical characteristics of a board assembly P10 performs an inspection for a plurality of test cases for one board assembly P10, and outputs inspection data for each test case. Each of the plurality of test cases measures the resistance value between two test nodes and inspects the continuity state. Since a plurality of such test cases are set for one board assembly P10, a plurality of combinations of two test nodes are set for one board assembly P10. A plurality of components P2 may be included between the two test nodes. Therefore, this type of first inspection machine 101 outputs, in addition to the inspection data for each test case, a node list that lists the components P2 included between the two test nodes for each test case.

[0105] On the other hand, various data (including trace data, inspection data, etc.) related to the production process of the board assembly P10 in the mounting line (component mounting system 20) is basically managed on a mounting point basis. The "mounting point" here corresponds to each of the components P2 or the terminals (including pins and leads) of the components P2, that is, various data related to the production process is managed on a component P2 or terminal basis of the components P2. Therefore, the minimum unit of data is different between the inspection data of the first inspection machine 101 output for each test case that may include multiple components P2, and the various data related to the production process for each component P2 or terminal of the components P2, and it is not suitable to manage them in association with each other.

[0106] In the quality control support method of this embodiment, the estimation process performed by the estimation unit 17 makes it easy to associate such inspection data (first data D1) of the first inspection machine 101 with various data related to the part P2 or each terminal of the part P2 in the production process.

[0107] That is, as an example, when the first inspection machine 101 inspects a board assembly P10 having a circuit configuration as shown in FIG. 4, the inspection is performed using two of the four test nodes, "Node A," "Node B," "Node C," and "Node D."

[0108] For example, in a test case using two test nodes "NodeA" and "NodeB", a list of parts P2 included between these two test nodes "NodeA" and "NodeB" exists as a node list. Specifically, in the example of FIG. 4, in the node list, "NodeA" is associated with part numbers and pin numbers "R23.2", "R22.1", "C90.1", "IC2.3", and "IC1.9", and "NodeB" is associated with part numbers and pin numbers "IC2.4", "C91.2", and "IC1.8". Here, the character string before "." represents the part number that identifies part P2, and the character string after "." represents the pin number (shown in FIG. 4). In such a case, if a short circuit abnormality occurs in a test case using two test nodes "NodeA" and "NodeB", it is estimated that one of the paths of current I1 and I2 shown in FIG. 4 has occurred.

[0109] Therefore, in this case, the inference process uses the node list to infer from the inspection data that the cause of the abnormality is a short circuit between "IC1.8" and "IC1.9" or a short circuit between "IC2.3" and "IC2.4." In other words, it is inferred that the abnormality is caused by a short circuit between pins 8 and 9 of component P2 called "IC1," or a short circuit between pins 3 and 4 of component P2 called "IC2." In this way, the inference process can infer position information regarding a specific location of the board assembly P10 using the node list.

[0110] (3.3) Flowchart Next, an overview of the quality control support method according to this embodiment, that is, the operation of the quality control support system 10, will be described with reference to the flowchart shown in Fig. 5. Fig. 5 shows a series of flows of the quality control support method for one board P1.

[0111] The quality control support system 10 first executes a first acquisition process to acquire first data D1 in the first acquisition unit 11 (S1), and then executes a second acquisition process to acquire second data D2, D3, and D4 in the second acquisition unit 12 (S2).

[0112] Next, the quality control support system 10 executes an association process in which the association unit 13 associates the first data D1 with the second data D2, D3, and D4 (S3). In this association process, the first data D1 and the second data D2, D3, and D4 are associated for each board ID using the board IDs included in the first data D1 and the second data D2, D3, and D4 as keys. Therefore, the first data D1 and the second data D2, D3, and D4 obtained by the first inspection machine 101 and the three second inspection machines 102, 103, and 104 for the same board P1 are associated with each other. The association process generates a data set including the first data D1 and the second data D2, D3, and D4 in an associated state with each other (S4).

[0113] Next, the quality control support system 10 executes an output process in which the output unit 14 outputs the data set (S5), and further judges whether the inspection result of the first inspection machine 101 is "abnormal" or not (S6). In process S6, a judgment is made about the inspection result of the first inspection machine 101 for the board P1 having the board ID included in the first data D1 and the second data D2, D3, D4 constituting the data set. If the inspection result of the first inspection machine 101 is not "abnormal" (S6: No), the quality control support system 10 ends the series of processes for this board P1.

[0114] On the other hand, if the inspection result of the first inspection machine 101 is "abnormal" (S6: Yes), the quality control support system 10 causes the estimation unit 17 to execute estimation processing to identify (estimate) the cause of the abnormality, that is, the abnormal part (S7). Then, the quality control support system 10 determines whether the inspection results of the second inspection machines 102, 103, 104 are "normal" (S8). If the inspection results of all three second inspection machines 102, 103, 104 are "normal" (S8: Yes), the quality control support system 10 causes the notification unit 15 to execute notification processing to notify recommended information (S9).

[0115] On the other hand, if the inspection result of at least one of the three second inspection machines 102, 103, 104 is not "normal" (S8: No), the quality control support system 10 judges whether the user has intervened in the inspection results of the second inspection machines 102, 103, 104 (S10). If the inspection result of the second inspection machines 102, 103, 104 is not "normal" but the user has intervened and judged it to be normal (S10: Yes), the quality control support system 10 executes an additional acquisition process to acquire additional information in the additional acquisition unit 16 (S11).

[0116] The quality control support system 10 performs feedback (S12) when the notification process (S9) or the addition process (S11) is completed, or when the user is not involved (S10: No). The "feedback" here means providing an opportunity to review the inspection results or inspection conditions of any of the second inspection machines 102, 103, and 104 based on the associated first data D1 and second data D2, D3, and D4. Thus, the entity that ultimately reviews the inspection results or inspection conditions may be the user or the quality control support system 10.

[0117] Furthermore, the flowchart shown in FIG. 5 is merely an example, and the order of the processes may be changed as appropriate, and processes may be added or deleted as appropriate.

[0118] (4) Variations The first embodiment is merely one of various embodiments of the present disclosure. Various modifications of the first embodiment are possible depending on the design and the like, as long as the object of the present disclosure can be achieved. In addition, all of the drawings referred to in this disclosure are schematic diagrams, and the ratios of the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensional ratios. In addition, functions similar to those of the quality control support method according to the first embodiment may be embodied in a quality control support system 10, a (computer) program, or a non-transitory recording medium on which a program is recorded. The program according to one aspect is a program for causing one or more processors to execute the quality control support method according to the first embodiment.

[0119] Below, we will list some modified examples of the embodiment 1. The modified examples explained below can be applied in appropriate combinations.

[0120] The quality control support system 10 in the present disclosure includes a computer system. The computer system is mainly composed of a processor and a memory as hardware. The processor executes a program recorded in the memory of the computer system to realize the function of the quality control support system 10 in the present disclosure. The program may be pre-recorded in the memory of the computer system, provided through an electric communication line, or provided by recording it in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits such as IC or LSI referred to here are called by different names depending on the degree of integration, and include integrated circuits called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Furthermore, a field-programmable gate array (FPGA) that is programmed after the manufacture of the LSI, or a logic device that can reconfigure the connection relationship inside the LSI or reconfigure the circuit partition inside the LSI, can also be adopted as a processor. The electronic circuits may be integrated in one chip or distributed among multiple chips. The chips may be integrated in one device or distributed among multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Thus, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

[0121] Furthermore, it is not essential for quality control support system 10 that multiple functions are concentrated in one housing. The components of quality control support system 10 may be distributed across multiple housings. Furthermore, at least some of the functions of quality control support system 10 may be realized by cloud (cloud computing) or the like.

[0122] Functions that can be realized by distributing them among two or more systems such as the cloud (or server) and the edge include, for example, the following functions. That is, the acquisition and association of the first data D1 and the second data D2, D3, and D4 are realized at the edge, and the utilization of the generated data set is realized at the cloud. In this case, by analyzing the data set (the associated first data D1 and second data D2, D3, and D4) at the cloud, it is possible to provide an opportunity to review, for example, the inspection results or inspection conditions of any of the three second inspection machines 102, 103, and 104.

[0123] Conversely, in the first embodiment, at least some of the functions of the quality control support system 10 or the operation system 100 that are distributed among a plurality of devices may be integrated into one housing. For example, some of the functions that are distributed between the component mounting system 20 and the quality control support system 10 may be integrated into the component mounting system 20.

[0124] Specifically, the function of the estimation unit 17 may be provided in the first inspection machine 101. In this case, when the inspection result of the first inspection machine 101 is abnormal, the first inspection machine 101 can execute an estimation process to estimate the cause of the abnormality. That is, the first inspection machine 101 can estimate the cause of the abnormality (including position information) from the inspection data of the first inspection machine 101 using a node list based on the arrangement of the component P2 in the board assembly P10. This allows the first inspection machine 101 to output the inspection data of the component P2 or each terminal of the component P2. As a result, the minimum unit of data is the same for the inspection data of the first inspection machine 101 and various data of the component P2 or each terminal of the component P2 related to the production process, making it easier to manage them in association with each other.

[0125] In addition, in the association process, the data used as a key for associating the first data D1 and the second data D2, D3, and D4 is not limited to the unique identification information (substrate ID) attached to each substrate P1. As an example, the first data D1 and the second data D2, D3, and D4 may be associated with each other using the number of substrates P1 inspected by the first inspection machine 101 and the three second inspection machines 102, 103, and 104 (hereinafter referred to as the "substrate number") as a key. However, in this case, for example, if a substrate P1 determined to be abnormal by any of the three second inspection machines 102, 103, and 104 is excluded, a difference in the number of substrates occurs between the inspection machine (first inspection machine 101) located downstream. In other words, even if the substrate P1 is the same, the number of substrates may differ between the first inspection machine 101 and the second inspection machines 102, 103, and 104.

[0126] Furthermore, in the association process, if the unique identification information (board ID) given to each board P1 is used as a key for associating the first data D1 and the second data D2, D3, and D4, it is easy to know the missing number of the board P1 on the mounting line based on the board ID. In other words, if the order of the board IDs flowing on the mounting line is known in advance in the inspection machine or quality control support system 10, it can know that the board P1 is a missing number if the board P1 is not inspected with the board IDs in this order by any of the inspection machines. As an example, when the first inspection machine 101 knows the order of the board IDs flowing on the mounting line, if the board P1 is not inspected with the board IDs in this order, the first inspection machine 101 can know that a missing number has occurred.

[0127] Furthermore, the use of the component mounting system 20 is not limited to the manufacture of electronic devices in a factory. For example, when the component mounting system 20 is used to mount mechanical components on a glass plate, the component mounting system 20 performs an operation of mounting a mechanical component, which is a component P2, on a glass plate, which is a substrate P1.

[0128] Furthermore, the component mounting system 20 only needs to include one or more solder formation machines 1, one or more mounters 2, and one or more reflow furnaces 3, and may, for example, include only one or two mounters 2, or may include four or more mounters 2. Similarly, multiple solder formation machines 1 or reflow furnaces 3 may be provided. Furthermore, it is not an essential configuration for the component mounting system 20 that the multiple devices included in the component mounting system 20 are arranged in a row and connected to form a mounting line.

[0129] Furthermore, the multiple mounting machines 2 (three in the first embodiment) included in the component mounting system 20 are not limited to having a common configuration, and may have some different characteristics. That is, since there are many types, performances, characteristics, or specifications of individual mounting machines 2, the multiple mounting machines 2 included in the component mounting system 20 may also have different characteristics from one another. Specifically, the mounting machines 2 may differ from one another in, for example, the speed (maximum mounting speed), the number of capture units (number of nozzles), the number of supply units, the type of capture unit, the number of slots, the number and model of mounting heads, etc.

[0130] Furthermore, the solder forming machine 1 may be any machine that places (forms) the bonding material P3 on the surface of the substrate P1, and is not limited to a solder printer, and may be, for example, a dispenser or the like.

[0131] Furthermore, the inspection machines (first inspection machine 101 and second inspection machines 102, 103, 104) are not essential components of the component mounting system 20. Therefore, for example, at least one of the first inspection machine 101 and the second inspection machines 102, 103, 104 does not have to be included in the component mounting system 20. As an example, the first inspection machine 101 is not included in the mounting line constructed by the component mounting system 20, and may be installed in a location separate from the mounting line. In this case, the board assembly P10 produced by the component mounting system 20 is transported to the first inspection machine 101 for inspection by the first inspection machine 101.

[0132] In addition, the first inspection machine 101 is not limited to an in-circuit tester (ICT) as long as it is an inspection machine that performs an inspection based on at least the electrical characteristics of the board assembly P10. For example, the first inspection machine 101 may be a function tester (FCT) or a combination of an in-circuit tester and a function tester.

[0133] In addition, the means for realizing the association between the first data D1 and the second data D2, D3, and D4 is not limited to a means for directly associating the two targets by using some matter (data) of the two targets as a key and defining the two targets having a common key as a linked relationship. For example, the association between the first data D1 and the second data D2, D3, and D4 may be realized by a means for associating the two targets by making the two targets belong to the same group. Furthermore, a means for indirectly associating the two targets by using a third matter (data) other than the two targets as a key and linking the two targets to the key, or a means for directly associating the two targets by connecting the two targets, etc. may be adopted.

[0134] Furthermore, the condition for the notification unit 15 to make a notification is not limited to that all of the inspection results of the multiple (three) second inspection machines 102, 103, 104 are normal, but may be that some of the inspection results of the multiple (three) second inspection machines 102, 103, 104 are normal. In this case, the notification process makes a notification when the inspection result of the first inspection machine 101 is abnormal and some of the inspection results of the multiple second inspection machines 102, 103, 104 are normal.

[0135] Furthermore, the quality control support method according to the first embodiment is not limited to a case where all the processes are executed by one or more processors, and at least some of the processes may involve human intervention. For example, a notification process may be executed by a human using a user interface or the like.

[0136] (Embodiment 2) The quality control support method according to this embodiment differs from the quality control support method according to the first embodiment in that it has a function of detecting a sign of an abnormality. Hereinafter, the same components as those in the first embodiment will be denoted by the same reference numerals and the description thereof will be omitted as appropriate.

[0137] In this embodiment, the definition of the "second inspection machine" is different from that in the first embodiment, and the "second inspection machines 103, 14" in the first embodiment are "third inspection machines" in this embodiment. That is, as shown in FIG. 6, in this embodiment, the third inspection machine 103 is an automatic optical inspection machine (AOI) located between the mounting machine 2 and the reflow furnace 3, and the third inspection machine 104 is an automatic optical inspection machine (AOI) located between the reflow furnace 3 and the first inspection machine 101. The solder print inspection machine (SPI) located between the solder formation machine 1 and the mounting machine 2 is the second inspection machine 102 in this embodiment as in the first embodiment. Thus, in the working system 100A according to this embodiment, the component mounting system 20 includes the first inspection machine 101, the second inspection machine 102, and two third inspection machines 103, 104 in addition to the solder formation machine 1, the three mounting machines 2, and the reflow furnace 3.

[0138] The inspection data of the third inspection machines 103, 104 is used as third data D3 (see FIG. 7). That is, the second data D2 (see FIG. 7) is inspection data of the second inspection machine 102 consisting of a solder print inspection machine (SPI) and is acquired from the second inspection machine 102. The third data D3 is inspection data of the third inspection machine 103 consisting of an automatic optical inspection machine (AOI) in the upstream stage of the reflow furnace 3 and is acquired from the third inspection machine 103. Moreover, the third data different from the third data D3 is inspection data of the third inspection machine 104 consisting of an automatic optical inspection machine (AOI) in the downstream stage of the reflow furnace 3 and is acquired from the third inspection machine 104.

[0139] 6, the quality control support system 10A according to this embodiment includes, in addition to the configuration described in the first embodiment, a third acquisition unit 21, a detection unit 22, and a notification unit 23. Similar to the first acquisition unit 11, the second acquisition unit 12, the association unit 13, and the like, the third acquisition unit 21, the detection unit 22, and the notification unit 23 are realized by one or more processors executing a program.

[0140] The third acquisition unit 21 executes a third acquisition process to acquire third data D3. The third data D3 is data related to the substrate P1 and is different from the first data D1. As an example in the present embodiment, the third data D3 includes inspection data obtained by third inspection machines 103 and 104 different from the first inspection machine 101 and the second inspection machine 102. The third data D3 acquired in the third acquisition process is associated with the second data D2 in an association process.

[0141] That is, the quality control support method according to this embodiment includes a third acquisition process for acquiring third data D3 including inspection data obtained by third inspection machines 103, 104 different from the first inspection machine 101 and the second inspection machine 102 included in the component mounting system 20. The third inspection machines 103, 104 are inspection machines that inspect the state of at least one of the joining member P3 and the component P2 arranged on the board P1 after the component P2 is mounted on the board P1. In the association process, the second data D2 and the third data D3 are further associated with each other.

[0142] The detection unit 22 executes a detection process to detect a sign of abnormality when the inspection result of the second inspection machine 102 is normal. In the detection process, based on the first data D1 and the second data D2 associated with the first data D1, the detection unit 22 detects a sign of abnormality when the inspection result of the second inspection machine 102 is normal. As an example, the detection unit 22 detects the sign of abnormality using a trained model generated by machine learning.

[0143] The notification unit 23 executes a notification process for notifying the user of a sign when a sign is detected by the detection process. In other words, the quality control support method according to this embodiment has a notification process for notifying the user of a sign when a sign is detected by the detection process. The "notification of a sign" here includes notifying the user of the presence of a sign of an abnormality and the cause (details) of the abnormality for which the sign has been detected. The notification form of the notification unit 23 includes, for example, direct notification such as display, audio output, and printing (printout), as well as indirect notification by transmission to the component mounting system 20 or other systems (including mobile terminals, etc.).

[0144] In the quality control support method according to the present embodiment, while the inspection results of the inspection machines (the first inspection machine 101, the second inspection machine 102, and the third inspection machines 103 and 104) are in the "normal" range, that is, before the inspection results become "abnormal", it is possible to detect a sign of an abnormality. The data set (the associated first data D1 and the second data D2) generated in the association process can be used to detect a "sign" of an abnormality. For example, by focusing on the correlation between the first data D1, which is the inspection data of the first inspection machine 101, and the inspection data of the second inspection machine 102, which performs an inspection before the component P2 is mounted on the board P1, it is possible to detect a sign of an abnormality using the inspection data (the second data D2) of the second inspection machine 102. If a sign of an abnormality is detected, for example, before the abnormality occurs, that is, before the board assembly P10 becomes defective, the printing conditions or temperature profile of the solder forming machine 1 can be checked, and measures such as maintenance of the solder forming machine 1, stirring of the cream solder, or temperature adjustment can be taken.

[0145] That is, the quality control support method according to this embodiment includes a detection process. Here, the second inspection machine 102 is an inspection machine that inspects the state of the bonding member P3 arranged on the board P1 before the component P2 is mounted on the board P1. In the detection process, a sign of an abnormality is detected when the inspection result of the second inspection machine 102 is normal, based on the first data D1 and the second data D2 associated with the first data D1. Then, when a sign of an abnormality is detected, the sign is notified by a notification process.

[0146] FIG. 7 is a conceptual diagram showing the state of quality control regarding the component mounting system 20 by the quality control support method according to this embodiment.

[0147] According to the component mounting system 20 including the first inspection machine 101, the second inspection machine 102, and the third inspection machine 103 in this embodiment, each inspection machine obtains inspection data such as that illustrated in FIG.

[0148] That is, as shown in Fig. 7, the first inspection machine 101 consisting of an in-circuit tester (ICT) measures the electrical characteristics of the board assembly P10 discharged from the reflow furnace 3, and outputs the results of the inspection of the board assembly P10 as inspection data. Therefore, the first data D1 which is the inspection data of the first inspection machine 101 includes data representing electrical characteristics, such as the resistance value between two test nodes in a certain test case. In the example of Fig. 7, the first data D1 is data representing the resistance values ​​(maximum value, minimum value, and nominal value) between two test nodes with respect to the number of boards (the number of inspected boards P1).

[0149] 7, a first inspection machine 101 consisting of an in-circuit tester (ICT) measures electrical characteristics of the board assembly P10 discharged from the reflow furnace 3, and outputs the results of the inspection of the board assembly P10 as inspection data. Therefore, the first data D1, which is the inspection data of the first inspection machine 101, includes data representing electrical characteristics, such as a resistance value between two test nodes in a certain test case. In the example of FIG. 7, the first data D1 is data representing the resistance values ​​(maximum value, minimum value, and nominal value) between two test nodes with respect to the number of boards (the number of inspected boards P1).

[0150] 7, the second inspection machine 102, which is a solder print inspection device (SPI), captures an image of the board P1 discharged from the solder formation machine 1, and outputs the result of inspecting the state of the bonding material P3 arranged on the board P1 as inspection data. Therefore, the second data D2, which is the inspection data of the second inspection machine 102, includes data representing, for example, the amount of adhesion (solder amount) of the bonding material P3. In the example of FIG. 7, the second data D2 is data representing the amount of solder (maximum value, minimum value, and nominal value) relative to the number of boards (the number of inspected boards P1).

[0151] As shown in Fig. 7, the third inspection machine 103, which is an automatic optical inspection device (AOI), takes an image of the board P1 discharged from the mounting machine 2, and outputs the result of inspecting the state of at least one of the bonding members P3 and the components P2 arranged on the board P1 as inspection data. Therefore, the third data D3, which is the inspection data of the third inspection machine 103, includes data indicating whether or not the position of the components P2 on the board P1 is correct (whether or not the deviation is within an allowable range). In the example of Fig. 7, the third data D3 includes image data D31 to D38 obtained by capturing an image by a camera for each of a plurality of (here, eight) inspection areas set on the board P1.

[0152] Here, there is a correlation between the resistance value in the first data D1 and the amount of solder included in the second data D2. In other words, as the amount of solder, which is the amount of bonding material P3, decreases, the resistance value tends to increase accordingly. As is clear from FIG. 7, the amount of solder tends to gradually decrease as the number of tests increases. This is because the amount of bonding material P3 (solder amount) placed on the board P1 by the solder forming machine 1 gradually decreases due to, for example, clogging of the mask of the solder forming machine 1 or an increase in the viscosity of the bonding material P3 over time.

[0153] 7, the inspection result of the third inspection machine 103 is abnormal (Failed). In such a case, the associated first data D1 and second data D2 can be used to detect a sign of abnormality. Furthermore, the third data D3 associated with the first data D1 and the second data D2 provides an opportunity to reconsider the judgment conditions for detecting a sign of abnormality.

[0154] That is, in the quality control support method according to the present embodiment, a sign of an abnormality can be detected from the first data D1, which is the inspection data of the first inspection machine 101, and the second data D2, which is the inspection data of the second inspection machine 102, which are associated with each other. As an example, when focusing on the data of the number of boards V1 in FIG. 7, it is found from the first data D1 that the resistance value is within the allowable range (determined to be normal) but has decreased, so the amount of solder in the second data D2 at this time (number of boards V1) is set as the threshold for detecting the sign. That is, when the amount of solder in the second data D2, which is the inspection data of the second inspection machine 102, is within the allowable range (determined to be normal) but is below the threshold of the sign range, the quality control support system 10A detects the sign of an abnormality with the detection unit 22 and notifies with the notification unit 23.

[0155] When a sign of an abnormality is reported, the component mounting system 20 may take measures such as stopping the transport of the substrate P1, performing maintenance on the solder formation machine 1, stirring the cream solder, or adjusting the temperature. The entity that executes these measures may be a user or the component mounting system 20.

[0156] 7, if the inspection result of the third inspector 103 is abnormal, the number of boards for sign detection is changed from "V1" to "V2" (ST1) so that the number of boards V2 in the first data D1 at that time becomes the number of boards for sign detection. Furthermore, the number of boards for sign detection is also changed from "V1" to "V2" in the second data D2 associated with the first data D1 (ST2). As a result, the amount of solder in the second data D2 at this time (number of boards V2) becomes the threshold for sign detection.

[0157] Fig. 8 is a flowchart showing a characteristic operation example of the quality control support method according to this embodiment. The overall process flow of the quality control support method according to this embodiment is the same as that of embodiment 1, and steps S21 to S25 shown in Fig. 8 are inserted between steps S5 and S6 in the flowchart of Fig. 5.

[0158] The quality control support system 10A first executes a detection process in which the detection unit 22 detects signs of abnormality from the first data D1 and the second data D2 (S21), and determines whether or not there are signs (S22). If there are signs of abnormality (S22: Yes), the quality control support system 10A executes a notification process in which the notification unit 23 notifies the user of the signs (S23), and executes a third acquisition process in which the third acquisition unit 21 acquires third data (S24).

[0159] On the other hand, if there is no sign of abnormality (S22: No), the quality control support system 10A skips the notification process and executes a third acquisition process to acquire the third data in the third acquisition unit 21 (S24). Then, the quality control support system 10A executes an association process to associate the second data D2 with the third data D3 in the association unit 13 (S25). At this time, in the association process, the second data D2 and the third data D3 are associated for each board ID using the board ID included in the second data D2 and the third data D3 as a key. Therefore, the second data D2 and the third data D3 obtained by the second inspection machine 102 and the two third inspection machines 103, 104 for the same board P1 are associated with each other.

[0160] Furthermore, the flowchart shown in FIG. 8 is merely an example, and the order of the processes may be changed as appropriate, and processes may be added or deleted as appropriate.

[0161] Incidentally, as a modification of the second embodiment, a sign of abnormality may be detected based on the correlation between the second data D2 and the third data D3. That is, by focusing on the correlation between the second data D2, which is the inspection data of the second inspection machine 102, and the third data D3, which is the inspection data of the third inspection machines 103 and 104, it becomes possible to detect the sign using the inspection data (second data D2) of the second inspection machine 102. In this case, it is not essential to detect the sign of abnormality based on the correlation between the first data D1 and the second data D2.

[0162] The configuration described in the second embodiment (including the modified example) can be applied in appropriate combination with the configuration described in the first embodiment (including the modified example).

[0163] (summary) As described above, the quality control support method according to the first aspect is a method for supporting quality control regarding a component mounting system (20), and includes a first acquisition process, a second acquisition process, and an association process. The component mounting system (20) produces a board assembly (P10) by mounting a component (P2) on a board (P1) with a bonding member (P3). In the first acquisition process, inspection data obtained from a first inspection machine (101) that inspects the board assembly (P10) based on at least electrical characteristics is acquired as first data (D1). In the second acquisition process, second data (D2, D3, D4) that is data regarding the board (P1) and is different from the first data (D1) is acquired. In the association process, the first data (D1) is associated with the second data (D2, D3, D4).

[0164] According to this embodiment, the inspection data (first data (D1)) obtained from the first inspection machine (101) that inspects the board assembly (P10) based on the electrical characteristics is associated with data (second data (D2, D3, D4)) other than the first data (D1) related to the board (P1). Since the board assembly (P10) is generated by mounting the component (P2) on the board (P1) with the joining material (P3), the first data (D1) and the second data (D2, D3, D4) are associated with each board (P1), for example. As a result, when the component (P2) is mounted on the board (P1), the first data (D1), which is the inspection data obtained from the first inspection machine (101), can be handled in association with the second data (D2, D3, D4) different from the first data (D1) of the board (P1). As a result, for example, the first data (D1), which is the inspection data of the first inspection machine (101), can be fed back to the component mounting system (20) and used to update various conditions or parameters, thereby making it possible to effectively utilize the inspection data of the first inspection machine (101). This has the advantage that it is easy to effectively utilize the inspection data of the inspection machine (first inspection machine (101)) that inspects the board assembly (P10) based on electrical characteristics.

[0165] The quality control support method according to the second aspect is the same as the first aspect, and further includes an output process of outputting a result of the association process.

[0166] According to this embodiment, it becomes easier to effectively utilize the inspection data of the inspection machine (first inspection machine (101)) that inspects the board assembly (P10) based on the electrical characteristics.

[0167] A quality control support method according to a third aspect is the first or second aspect, in which the second acquisition process acquires second data (D2, D3, D4) including inspection data obtained by a second inspection machine (102, 103, 104). The second inspection machine (102, 103, 104) is an inspection machine different from the first inspection machine (101) included in the component mounting system (20).

[0168] According to this embodiment, the inspection data of an inspection machine (first inspection machine (101)) that inspects the board assembly (P10) based on electrical characteristics can be fed back to the second inspection machine (102, 103, 104).

[0169] The quality control support method according to the fourth aspect is the same as that of the third aspect, and further includes a notification process for issuing a notification when the inspection result of the first inspection machine (101) is abnormal and the inspection result of the second inspection machine (102, 103, 104) is normal.

[0170] According to this aspect, when the inspection conditions of the second inspection machine (102, 103, 104) are lenient, a notification is given, which can provide an opportunity to review the inspection results and inspection conditions of the second inspection machine (102, 103, 104).

[0171] A quality control support method according to a fifth aspect is the fourth aspect, in which the notification process notifies recommended information regarding changes to the inspection conditions in the second inspection machine (102, 103, 104).

[0172] According to this embodiment, it is possible to suggest a change in the inspection conditions of the second inspection machine (102, 103, 104).

[0173] A quality control support method according to a sixth aspect is any of the third to fifth aspects, further comprising an additional acquisition process for acquiring additional information when the inspection result of the first inspection machine (101) is abnormal and the inspection result of the second inspection machine (102, 103, 104) is also abnormal. The additional information is information related to a user's judgment on the inspection result of the second inspection machine (102, 103, 104).

[0174] According to this aspect, when a user's decision is involved in the inspection results of the second inspection machine (102, 103, 104), it becomes possible to identify that fact, and this can provide an opportunity for the user to review their operation.

[0175] The quality control support method according to the seventh aspect is in any one of the third to sixth aspects, further including a detection process. The second inspection machine (102) is an inspection machine that inspects the state of the joining material (P3) placed on the board (P1) before the component (P2) is mounted on the board (P1). The detection process detects a sign of an abnormality when the inspection result of the second inspection machine (102) is normal, based on the first data (D1) and the second data (D2) associated with the first data (D1).

[0176] According to this embodiment, by detecting a sign of an abnormality before the inspection result of the second inspector (102) deviates from the normal range, it is possible to provide an opportunity to review the mounting process at an early stage.

[0177] The quality control support method according to the eighth aspect is the same as that of the seventh aspect, and further includes a third acquisition process for acquiring third data (D3) including inspection data obtained by a third inspection machine (103, 104). The third inspection machine (103, 104) is an inspection machine different from the first inspection machine (101) and the second inspection machine (102) included in the component mounting system (20). The third inspection machine (103, 104) is an inspection machine that inspects the state of at least one of the joining member (P3) and the component (P2) arranged on the board (P1) after the component (P2) is mounted on the board (P1). In the association process, the second data (D2) is further associated with the third data (D3).

[0178] According to this embodiment, even if the inspection data of the first inspection machine (101) is not available, the result of associating the inspection data of the second inspection machine (102) with the inspection data of the third inspection machine (103, 104) can be effectively utilized.

[0179] The quality control support method according to a ninth aspect is the method of the seventh or eighth aspect, further comprising a notification process of notifying a user of a sign when the sign is detected by the detection process.

[0180] According to this embodiment, by detecting a sign of an abnormality before the inspection result of the second inspector (102) deviates from the normal range, it is possible to provide an opportunity to review the mounting process at an early stage.

[0181] A quality control support method according to a tenth aspect is any one of the first to ninth aspects, in which the second acquisition process acquires second data (D2, D3, D4) including at least one of the following three pieces of information: information on a joining member (P3), information on a component (P2), and information on an inspection condition in any of the inspection machines including a first inspection machine (101) included in the component mounting system (20).

[0182] According to this embodiment, the inspection data of the first inspection machine (101) can provide an opportunity to review at least one of the joint member (P3), the part (P2), and the inspection conditions of any of the inspection machines.

[0183] A quality control support method according to an eleventh aspect is any one of the first to tenth aspects, in which the first acquisition process acquires first data (D1) including position information relating to a specific location of the substrate assembly (P10).

[0184] According to this embodiment, the inspection data of the first inspector (101) can be acquired in a state in which a specific location of the board assembly (P10) can be identified.

[0185] A quality control support method according to a twelfth aspect is the eleventh aspect, in which in the first acquisition process, position information is acquired using a node list based on the arrangement of components (P2) in a board assembly (P10).

[0186] According to this embodiment, the inspection data of the first inspector (101) can be acquired in a state in which a specific location of the board assembly (P10) can be identified.

[0187] A quality control support method according to a thirteenth aspect is the eleventh or twelfth aspect, in which the second data (D2, D3, D4) includes image data. In the association process, position information in the first data (D1) is associated with image data corresponding to a specific location in the image data of the second data (D2, D3, D4).

[0188] According to this embodiment, it becomes easier to effectively utilize the inspection data of the first inspection machine (101) for each specific portion of the board assembly (P10).

[0189] A data set generation method according to a fourteenth aspect is a data set generation method used for managing a component mounting system (20), and includes a first acquisition process, a second acquisition process, and a generation process. The component mounting system (20) produces a board assembly (P10) by mounting a component (P2) on a board (P1) with a bonding member (P3). In the first acquisition process, inspection data obtained from a first inspection machine (101) that inspects the board assembly (P10) based on at least electrical characteristics is acquired as first data (D1). In the second acquisition process, second data (D2, D3, D4) that is data related to the board (P1) and is different from the first data (D1) is acquired. In the generation process, a data set including the first data (D1) and the second data (D2, D3, D4) is generated by associating the first data (D1) with the second data (D2, D3, D4).

[0190] This embodiment has the advantage that it is easy to effectively utilize the inspection data of the inspection machine (first inspection machine (101)) that inspects the board assembly (P10) based on the electrical characteristics.

[0191] A program according to a fifteenth aspect is a program for causing one or more processors to execute the quality control support method according to any one of the first to thirteenth aspects or the dataset generating method according to the fourteenth aspect.

[0192] This embodiment has the advantage that it is easy to effectively utilize the inspection data of the inspection machine (first inspection machine (101)) that inspects the board assembly (P10) based on the electrical characteristics.

[0193] A quality control support system (10, 10A) according to a sixteenth aspect is a quality control support system (10, 10A) that supports quality control related to a component mounting system (20), and includes a first acquisition unit, a second acquisition unit, and an association unit. The component mounting system (20) produces a board assembly (P10) by mounting a component (P2) on a board (P1) with a bonding member (P3). The first acquisition unit acquires, as first data (D1), inspection data obtained from a first inspection machine (101) that inspects the board assembly (P10) based on at least electrical characteristics. The second acquisition unit acquires second data (D2, D3, D4) that is data related to the board (P1) and is different from the first data (D1). The association unit associates the first data (D1) with the second data (D2, D3, D4).

[0194] This embodiment has the advantage that it is easy to effectively utilize the inspection data of the inspection machine (first inspection machine (101)) that inspects the board assembly (P10) based on the electrical characteristics.

[0195] A work system (100, 100A) according to a 17th aspect includes a quality control support system (10, 10A) according to the 16th aspect, and a component mounting system (20) that mounts a component (P2) on a board (P1) to produce a board assembly (P10).

[0196] This embodiment has the advantage that it is easy to effectively utilize the inspection data of the inspection machine (first inspection machine (101)) that inspects the board assembly (P10) based on the electrical characteristics.

[0197] Not limited to the above aspects, various aspects (including modified examples) of the quality control support method according to the first and second embodiments can be embodied in a quality control support system (10, 10A), an operation system (100, 100A), a program, and a non-transitory recording medium having the program recorded thereon.

[0198] The configurations according to the second to thirteenth aspects are not essential to the quality control support method and may be omitted as appropriate. [Explanation of symbols]

[0199] 10,10A Quality control support system 20 Component Mounting System 100,100A working system 101 First Inspection Machine 102 2nd Inspection Machine 103,104 2nd inspection machine (3rd inspection machine) D1 First data D2 Second Data D3 Second data (third data) P1 Board P2 Parts P3 Joint material P10 PCB Assembly

Claims

1. 1. A quality control support method for supporting quality control regarding a component mounting system that produces a board assembly by mounting components on a board with a bonding member, comprising: the component mounting system includes a first inspection machine and a second inspection machine, a first acquisition process for acquiring, as first data, inspection data obtained by inspecting electrical characteristics of the board assembly using the first inspection machine; a second acquisition process for acquiring second data obtained by inspecting a state of the bonding material printed on the substrate by the second inspection machine; A detection process for detecting a sign of an abnormality based on the first data and the second data. Quality control support method.

2. In the detection process, a state in which the resistance value indicated by the first data is within an allowable range and the amount of the bonding material indicated by the second data is decreasing is detected as the sign. The quality control support method according to claim 1.

3. The component mounting system further includes a third inspection machine, a third acquisition process for acquiring third data obtained by inspecting, by the third inspection machine, at least one of a state of the component and a state of the bonding member after the component is mounted on the board; In the detection process, the sign is detected based on the first data, the second data, and the third data. The quality control support method according to claim 1 or 2.

4. The method further includes a notification process for notifying the user of the sign when the sign is detected by the detection process. The quality control support method according to any one of claims 1 to 3.

5. The component mounting system further includes a solder forming machine that places the bonding member on the substrate, The notification process includes performing any one of maintenance of the solder forming machine, stirring the joining material, and adjusting the temperature of the joining material. The quality control support method according to claim 4.

6. the first data includes position information of a particular portion of the substrate assembly; the second data includes image data; The method further includes associating image data of a region corresponding to the specific location among the image data obtained by the second inspection machine with the first data. The quality control support method according to any one of claims 1 to 5.

7. a notification process for notifying recommendation information recommending a change in an inspection condition related to the second data associated with the first data when an inspection result of the specific portion by the first inspection machine is abnormal and an inspection result of the specific portion by the second inspection machine is normal. The quality control support method according to claim 6.

8. A quality control support system that supports quality control regarding a component mounting system that produces a board assembly by mounting components on a board with a bonding member, comprising: a first acquisition unit that acquires, as first data, inspection data obtained by inspecting electrical characteristics of the board assembly using a first inspection machine included in the component mounting system; a second acquisition unit that acquires second data obtained by inspecting a state of the bonding material printed on the board using a second inspection machine included in the component mounting system; a detection unit that detects a sign of an abnormality based on the first data and the second data, Quality control support system.

9. The quality control support system according to claim 8 ; and a component mounting system that mounts the components on the substrate to produce the substrate assembly. Working system.

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