Multilayer electronic component

Abstract

To relieve the problem of decrease in strength of a multilayer electronic component that can occur when a bottleneck part is formed in an internal electrode.SOLUTION: A multilayer electronic component includes: a main body including dielectric layers and internal electrode layers alternately disposed with the dielectric layers in a first direction, first and second surfaces facing each other in the first direction, third and fourth surfaces facing each other in a second direction that is perpendicular to the first direction, and fifth and sixth surfaces facing each other in a third direction that is perpendicular to the first direction and the second direction; and external electrodes disposed on the third and fourth surfaces. The internal electrode layer includes a main part, a lead part extending from the main part to the third surface or the fourth surface, connected to the external electrode, and being smaller in the third direction than the main part, and reinforcement patterns disposed on both sides of the lead part in the third direction. The reinforcement pattern contains carbide.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multilayer ceramic capacitors (MLCCs), which are one type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products or automotive products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones and mobile phones, on-board chargers (OBCs) for electric vehicles, circuits such as DC-DC converters, and infotainment systems, to charge or discharge electricity.

[0003] Currently, due to the trend toward higher capacitance and smaller size of multilayer ceramic capacitors, new technologies are being demanded to ensure reliability in high temperature, high humidity and high voltage environments.

[0004] One method for improving moisture resistance reliability is to form a bottleneck in a region where the internal electrodes are connected to the external electrodes to increase the number of paths through which moisture can penetrate from the outside. In this case, the specific gravity of the internal electrodes decreases, which may cause a problem of reduced chip strength.

[0005] Therefore, when a bottleneck portion is formed in an internal electrode to improve moisture resistance reliability, it is necessary to develop a structural feature to improve the side effect of reducing chip strength. Summary of the Invention [Problem to be solved by the invention]

[0006] One of the various objects of the present invention is to alleviate the problem of a decrease in strength of a multilayer electronic component that can occur when a bottleneck portion is formed in an internal electrode.

[0007] However, the scope of the present invention is not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0008] A multilayer electronic component according to an embodiment of the present invention includes a main body including dielectric layers and internal electrode layers alternately arranged with the dielectric layers in a first direction, the main body including first and second sides facing the first direction, third and fourth sides facing a second direction perpendicular to the first direction, and fifth and sixth sides facing a third direction perpendicular to the first and second directions, and external electrodes arranged on the third and fourth sides, the internal electrode layers including a main portion, a lead portion extending from the main portion to the third or fourth side and connected to the external electrodes, the lead portion having a smaller size in the third direction than the main portion, and reinforcement patterns arranged on both sides of the lead portion in the third direction, the reinforcement patterns including carbide. Effect of the Invention

[0009] One of the various effects of the present invention is that in a structure of an internal electrode layer having a main portion and a lead portion having a width smaller than that of the main portion, by arranging a reinforcing pattern containing carbide on both sides in the width direction of the lead portion, it is possible to simultaneously ensure the moisture resistance reliability and strength of the multilayer electronic component.

[0010] However, the various and beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0011] [Figure 1] 1 is a perspective view showing a schematic configuration of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2]2 is a cross-sectional view taken along line II' in FIG. [Diagram 3] 2 is a cross-sectional view taken along line II-II' in FIG. [Figure 4] FIG. 2 is a cross-sectional view taken along line III-III' in FIG. [Diagram 5] FIG. 2 is an exploded perspective view showing the structure of a main body according to an embodiment. [Figure 6] FIG. 2 is a plan view showing a structure of an internal electrode layer according to an embodiment. [Figure 7] FIG. 5 is an enlarged view of the P region and the P′ region in FIG. [Figure 8] FIG. 2 is a schematic diagram showing the morphology of particles according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0013] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0014] In the drawings, the first direction is the direction in which the internal electrode layers 121, 122 are alternately arranged with the dielectric layer sandwiched therebetween, or the thickness (T) direction, and of the second and third directions which are directions perpendicular to the first direction, the second direction can be defined as the length (L) direction and the third direction can be defined as the width (W) direction.

[0015] FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line I-I' in FIG. 1, FIG. 3 is a cross-sectional view taken along line II-II' in FIG. 1, FIG. 4 is a cross-sectional view taken along line III-III' in FIG. 1, FIG. 5 is an exploded perspective view showing the structure of a main body according to one embodiment, FIG. 6 is a plan view showing the structure of an internal electrode layer according to one embodiment, FIG. 7 is an enlarged view of regions P and P' in FIG. 4, and FIG. 8 is a schematic diagram showing the morphology of particles according to one embodiment.

[0016] Hereinafter, a multilayer electronic component according to one embodiment of the present invention and various examples thereof will be described in detail with reference to FIGS.

[0017] A multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and internal electrode layers 121, 122 alternately arranged with the dielectric layer in a first direction. The body 110 includes first and second sides 1, 2 facing the first direction, third and fourth sides 3, 4 facing a second direction perpendicular to the first direction, and fifth and sixth sides 5, 6 facing a third direction perpendicular to the first and second directions. The body 110 also includes external electrodes 131, 132 arranged on the third and fourth sides. The internal electrode layers include main parts 121a, 122a, lead parts 121b, 122b extending from the main part to the third or fourth side and connected to the external electrodes, the lead parts having a smaller size in the third direction than the main parts, and reinforcement patterns 121c, 122c arranged on both sides of the lead parts in the third direction, the reinforcement patterns including carbide.

[0018] The body 110 may include a dielectric layer 111 and internal electrode layers 121 and 122 that are alternately arranged in a first direction with the dielectric layer 111 sandwiched therebetween.

[0019] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not have a perfect hexahedron shape with straight lines but can have a substantially hexahedron shape.

[0020] The main body 110 can include a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction perpendicular to the first direction and the second direction.

[0021] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not need to be particularly limited and can be determined in consideration of the size of the ceramic electronic component. For example, 300 or more dielectric layers can be stacked to form the main body.

[0022] The raw materials for forming the dielectric layer 111 are diverse depending on the purpose. Specifically, for the main purpose of achieving a high capacitance per unit volume, ferroelectric BaTiO3 can be used as the material, and for the main purpose of improving reliability in a high-temperature environment, paraelectric CaZrO3 can be used as the material. Examples of BaTiO3-based materials include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y)Examples include O3 (0 < y < 1), and examples of CaZrO3-based materials include (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0023] The average thickness td of the dielectric layer 111 is not particularly limited.

[0024] When aiming for miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 can be 3 μm or more.

[0025] The average thickness td of the dielectric layer 111 can mean the average thickness of the dielectric layer 111 disposed between the first and second internal electrode layers 121 and 122.

[0026] The average thickness td of the dielectric layer 111 can be measured by scanning an image of a cross-section (L-T cross-section) of the main body 110 in the third and first directions with a scanning electron microscope (SEM).

[0027] For example, the average thickness td of the dielectric layer 111 is extracted from an image scanned with a scanning electron microscope (SEM) of a cross-section in the length and thickness directions (L-T) cut at the central portion in the width direction of the main body 110. Among the dielectric layers, with respect to one dielectric layer at the point where the central line in the length direction of the main body intersects the central line in the thickness direction as a reference, for a total of 5 dielectric layers, 2 layers on the upper side and 2 layers on the lower side, with the point where the central line in the length direction of the main body intersects the central line in the thickness direction as a reference, after determining 5 points at equal intervals, 2 points on the left side and 2 points on the right side centered on one reference point, the thickness at each point is measured and the average value can be measured.

[0028] As shown in FIG. 2, the internal electrode layers 121, 122 and the dielectric layers 111 are alternately arranged in the first direction.

[0029] The internal electrode layers 121, 122 may be divided into a first internal electrode layer 121 and a second internal electrode layer 122. The first and second internal electrode layers 121, 122 are alternately arranged to face each other with a dielectric layer 111 constituting the body 110 therebetween, and may be in contact with third and fourth surfaces 3, 4 of the body 110, respectively, and connected to external electrodes 131, 132, which will be described later.

[0030] Referring to FIG. 2, the first internal electrode layer 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode layer 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4.

[0031] At this time, the first and second internal electrode layers 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0032] Referring to FIG. 5, the body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrode layers 121 are printed and ceramic green sheets on which the second internal electrode layers 122 are printed, and then firing the stacked ceramic green sheets.

[0033] There is no particular limitation on the materials forming the main parts 121a, 122a and the lead parts 121b, 122b of the internal electrode layers 121, 122, and any material having excellent electrical conductivity may be used. For example, the internal electrodes may be formed by printing a conductive paste for the internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet.

[0034] The method for printing the conductive paste for the internal electrodes may be a screen printing method, a gravure printing method, or the like, but the present invention is not limited thereto.

[0035] Meanwhile, in one embodiment of the present invention, in addition to main parts 121a, 122a that form capacitance in the internal electrode layers 121, 122 and lead parts 121b, 122b that ensure connectivity with the external electrodes, reinforcing patterns 121c, 122c containing carbide are arranged on both sides of the width of the lead parts, the specific structure of which will be described later.

[0036] The average thickness te of the internal electrode layers 121, 122 is not particularly limited and may vary depending on the purpose. In order to miniaturize the multilayer electronic component 100, the average thickness te of the internal electrode layers 121, 122 may be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrode layers 121, 122 may be 3 μm or more.

[0037] The average thickness te of the internal electrode layers 121 and 122 may be calculated by determining five points, two on the left side and two on the right side, at equal intervals based on a reference point where the center line of the length direction of the body intersects with the center line of the thickness direction of the body, for a total of five internal electrode layers, two on the top and two on the bottom, among the internal electrode layers extracted from an image obtained by scanning a cross section in the length and thickness direction (LT) cut at the center of the width direction of the body 110 using a scanning electron microscope (SEM). The average thickness te of the internal electrode layers 121 and 122 may be calculated by measuring the thickness of each point and calculating an average value based on a reference point where the center line of the length direction of the body intersects with the center line of the thickness direction of the body.

[0038] The body 110 may include a capacitance forming portion Ac which is a region where the dielectric layer 111 and the internal electrode layers 121 and 122 are arranged to overlap in a first direction. In particular, the capacitance forming portion Ac may refer to a region where main portions 121a and 122a of the internal electrode layers 121 and 122 described below overlap in the first direction to form a capacitance.

[0039] Moreover, the capacitance forming portion Ac can be formed by repeatedly laminating a plurality of first and second internal electrode layers 121, 122 with the dielectric layer 111 interposed therebetween.

[0040] 2 and 3, cover portions 112 and 113 may be disposed on one and the other surfaces of the capacitance forming portion Ac in the first direction.

[0041] The covers 112 and 113 can prevent damage to the internal electrodes due to physical or chemical stress, and can also improve the strength of the multilayer electronic component 100 .

[0042] The cover parts 112 and 113 do not include an internal electrode layer, may include the same material as the dielectric layer 111, and may be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively. However, the components of the cover parts are not limited to the same components as the dielectric layer 111 of the capacitance forming part Ac, and may include components different from those of the dielectric layer 111 of the capacitance forming part Ac.

[0043] There is no particular limitation on the average thickness tc of the covers 112, 113. In order to achieve a smaller size and higher capacity of the multilayer electronic component, the average thickness tc of the covers 112, 113 may have a value of 15 μm or less.

[0044] The average thickness tc of the cover parts 112, 113 may mean the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112, 113 measured at five equally spaced points on the upper or lower part of the capacitance forming part Ac.

[0045] Referring to FIG. 3, margin portions 114 and 115 may be disposed on one and other surfaces of the capacitance forming portion Ac in the third direction.

[0046] The margin portions 114, 115 include a margin portion 114 arranged on one surface in the third direction of the capacitance forming portion Ac, and a margin portion 115 arranged on the other surface. That is, the margin portions 114, 115 can be arranged on both surfaces in the width direction of the capacitance forming portion.

[0047] The margin portions 114 and 115 may refer to the regions between both ends of the main portions 121a and 122a and the boundary surface of the body 110 in a cross section of the body 110 cut in the width-thickness (WT) direction, as shown in FIG.

[0048] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0049] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin portions are to be formed, to form internal electrodes.

[0050] In addition, in order to suppress steps caused by the internal electrode layers 121, 122, after stacking, the internal electrode layers can be cut so as to be exposed on the fifth and sixth faces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be stacked in the width direction on both side faces of the capacitance forming portion Ac to form margin portions 114, 115.

[0051] On the other hand, there is no need to particularly limit the width of the marginal portions 114, 115. However, in order to more easily achieve a smaller size and higher capacity of the multilayer electronic component, the average width of the marginal portions 114, 115 can be 15 μm or less.

[0052] The average width of the margin portions 114, 115 may mean the average size of the margin portions 114, 115 in the third direction, and may be the average value of the sizes of the margin portions 114, 115 in the third direction measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0053] 1 and 2, external electrodes 131 and 132 are disposed on a body 110. As shown in FIG.

[0054] The external electrodes 131 and 132 are disposed on the body 110 and connected to the internal electrode layers 121 and 122. Specifically, the external electrodes 131 and 132 may be connected to the lead portions 121b and 122b of the internal electrode layers 121 and 122.

[0055] As shown in FIG. 2, the external electrodes 131, 132 may be arranged on the third and fourth surfaces 3, 4, respectively, of the body 110, and may include a first external electrode 131 connected to the first internal electrode layer 121 and a second external electrode 132 connected to the second internal electrode layer 122.

[0056] In this embodiment, the ceramic electronic component 100 has a structure having two external electrodes 131, 132, but the number and shapes of the external electrodes 131, 132 can be changed depending on the form of the internal electrode layers 121, 122 or other purposes.

[0057] Meanwhile, the external electrodes 131 and 132 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0058] For example, the external electrodes 131 and 132 may include an electrode layer disposed on the body 110 and a plating layer formed on the electrode layer.

[0059] To give a more specific example of the electrode layer, the electrode layer can be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and resin.

[0060] Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the body 110. Also, the electrode layer may be formed by transferring a sheet containing a conductive metal onto the body 110, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0061] The conductive metal contained in the electrode layer may be any material having excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0062] The plating layer may be a plating layer containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, and may be formed of a plurality of layers.

[0063] More specifically, the plating layer may be a Ni plating layer or a Sn plating layer, and may be a form in which a Ni plating layer and a Sn plating layer are sequentially formed on an electrode layer, or a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are sequentially formed. The plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0064] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0065] In order to simultaneously achieve miniaturization and high capacity, the multilayer electronic component 100 may have a size of 0201 (length x width, 0.2 mm x 0.1 mm) or less, and in the case of a product in which reliability in a high temperature and high pressure environment is important, the multilayer electronic component 100 may have a size of 3216 (length x width, 3.2 mm x 1.6 mm) or more, but is not limited to this.

[0066] Here, the length of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in a second direction, and the width of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component in a third direction.

[0067] 6, the internal electrode layers 121, 122 according to an embodiment include main parts 121a, 122a and lead parts 121b, 122b that extend from the main parts to the third surface or the fourth surface, are connected to the external electrodes, and are smaller in size in the third direction than the main parts. This reduces the width of the internal electrode-external electrode connection parts that are vulnerable to moisture penetration from the outside, thereby improving the moisture resistance reliability of the multilayer electronic component 100.

[0068] On the other hand, in the conventional case where the internal electrode layers 121, 122 are formed into a structure including main portions 121a, 122a and lead portions 121b, 122b having a smaller size in the third direction than the main portions, although this is advantageous for improving moisture resistance reliability, the corner regions of the body 110 have a high specific gravity of highly brittle ceramic material, which may have the side effect of weakening the strength of the multilayer electronic component.

[0069] In one embodiment of the present invention, the internal electrode layers 121, 122 have a structure including main portions 121a, 122a and lead portions 121b, 122b that are smaller in size in the third direction than the main portions, while reinforcing patterns 121c, 122c containing carbide, which is chemically stable, has high mechanical strength, and has excellent electrical properties, are arranged on both sides of the width of the lead portions 121b, 122b, thereby simultaneously ensuring the moisture resistance reliability and strength of the laminated electronic component 100.

[0070] Specifically, the internal electrode layers 121, 122 of the multilayer electronic component 100 according to an embodiment of the present invention include main parts 121a, 122a, lead parts 121b, 122b that extend from the main parts to the third surface or the fourth surface and are connected to the external electrodes and have a smaller size in the third direction than the main parts, and reinforcement patterns 121c, 122c that are disposed on both sides of the lead parts in the third direction, the reinforcement patterns including carbide. As a result, the internal electrode layers 121, 122 are formed in a bottleneck pattern to improve the moisture resistance reliability of the multilayer electronic component 100, while the specific gravity of the dielectric material in the corner regions of the body 110 is reduced, thereby improving the strength of the multilayer electronic component 100.

[0071] Carbide may be referred to by different names depending on the industrial field, but in the present invention, carbide refers to a compound of carbon (C) and a metal element or a compound of carbon (C) and a nonmetal element.

[0072] The carbide contained in the reinforcing patterns 121c and 122c is preferably chemically stable, has high mechanical strength, and has excellent electrical properties so as to improve the strength of the multilayer electronic component 100. Specifically, the carbide according to an embodiment is preferably an interstitial carbide, a covalent carbide, or a mixture thereof.

[0073] Specific examples of the interstitial carbide and the covalent carbide include tungsten carbide, titanium carbide, silicon carbide, zirconium carbide, hafnium carbide, vanadium carbide, niobium carbide, tantalum carbide, chromium carbide, and molybdenum carbide, and the reinforcing patterns 121c and 122c according to one embodiment may include one or more of tungsten carbide, titanium carbide, silicon carbide, zirconium carbide, hafnium carbide, vanadium carbide, niobium carbide, tantalum carbide, chromium carbide, and molybdenum carbide.

[0074] Among the above-mentioned interstitial carbides and covalent carbides, examples of carbides having excellent mechanical properties such as compressive strength, Young's modulus and elastic modulus, chemical resistance and electrical properties include tungsten carbide (WC), titanium carbide (TiC) and silicon carbide (SiC). That is, in one embodiment, it is more preferable that the reinforcing patterns 121c and 122c include one or more of tungsten carbide (WC), titanium carbide (TiC) and silicon carbide (SiC).

[0075] A method for forming the reinforcing patterns 121c, 122c including carbide on both sides of the lead portions 121b, 122b in the third direction according to an embodiment of the present invention is not particularly limited. For example, the reinforcing patterns may be formed by printing a conductive paste for forming the main portion and the lead portion on a ceramic sheet for forming a dielectric layer, and printing the reinforcing patterns including carbide powder on both sides of the lead portion in the width direction, or the main portion, the lead portion, and the reinforcing patterns may be formed simultaneously.

[0076] Meanwhile, the reinforcing patterns 121c and 122c may contain various conductive metal elements in addition to the above-mentioned carbides. Examples of conductive metal elements that may be contained in the reinforcing patterns 121c and 122c include copper (Cu), nickel (Ni), silver (Ag), palladium (Pd), and tin (Sn), and the reinforcing patterns 121c and 122c may further contain one or more of Cu-Ni alloys and Ag-Ni alloys, which are alloys of these metals.

[0077] In an embodiment, the reinforcing patterns 121c, 122c may be spaced apart from the main parts 121a, 122a and the lead parts 121b, 122b, thereby effectively preventing moisture that has penetrated into the body 110 from diffusing into the capacitance forming part Ac.

[0078] In an embodiment, the reinforcing patterns 121c and 122c are preferably spaced apart from the external electrodes 131 and 132. This can effectively prevent moisture from penetrating into the body 110 from the outside.

[0079] In one embodiment, it is more preferable that the reinforcement patterns 121c, 122c are disposed so as to be spaced apart from the main parts 121a, 122a, the lead parts 121b, 122b, and the external electrodes 131, 132 at the same time. This not only reduces the permeation path itself of moisture from the outside into the main body 110, but also effectively prevents moisture that has permeated into the inside of the main body 110 from diffusing into the main parts 121a, 122a that constitute the capacitance forming part Ac.

[0080] An example of a method for measuring the types and amounts of elements contained in the reinforcement patterns 121c, 122c is to polish the multilayer electronic component 100 in the second direction to expose the center of the lead portion 121b in the second direction, and then perform a scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDS) analysis of the reinforcement patterns 121c, 122c under an acceleration voltage of 20 kV. If the reinforcement patterns 121c, 122c include carbide, the carbon (C) element and metal and nonmetal elements constituting the carbide can be measured.

[0081] 7, at least a portion of the carbides included in the reinforcing pattern 121c may be present in the form of particles 10, 10'. In one embodiment, the particles 10, 10' may be divided into first particles 10 and second particles 10', and the reinforcing pattern 121c may include at least one of the first particles 10 and the second particles 10'.

[0082] The first particles 10 may refer to carbide particles 11, and the second particles 10' may refer to particles in which carbide 13 is disposed on the surface of a conductive metal 12.

[0083] That is, the reinforcing pattern 121c may have a structure including a first particle 10 composed of carbide particles 11, may have a structure including a second particle 10' in which carbide 13 is arranged on at least a portion of the surface of the conductive metal 12, or may have a structure including both the first particle 10 and the second particle 10'.

[0084] Hereinafter, the shape and average size of the first particles 10 will be described based on the first particles 10, but the same can be applied to the second particles 10'.

[0085] 8, the shape of the first particle 10 can be determined from the relationship between the length a of the major axis and the length b of the minor axis of the particle. In the present invention, the shape of the particle is not particularly limited, but having a substantially spherical shape is advantageous in blocking the propagation of cracks and can prevent short circuits between adjacent reinforcement patterns 121c and 122c by reducing printing variations. Here, the fact that the particle has a substantially spherical shape can mean that b / a is 0.7 to 1.0, preferably 0.8 to 1.0, more preferably 0.9 to 1.0.

[0086] On the other hand, if the average size of the first particles 10 is substantially the same as the average thickness te of the internal electrode layers 121 and 122, the packing rate of the reinforcement pattern 121c may be insufficient, resulting in a short circuit. If the average size of the first particles 10 is less than 1 / 5 of the average thickness te of the internal electrode layers 121 and 122, the packing rate of the reinforcement pattern 121c may be low due to the excessive average size of the first particles 10, resulting in a low effect of improving the strength of the multilayer electronic component 100. Therefore, in one embodiment, the average size of the first particles 10 is adjusted to 1 / 5 or less of the average thickness te of the internal electrode layers 121 and 122, thereby improving the strength of the multilayer electronic component 100.

[0087] In one embodiment, the average size of the first particles 10 is preferably 500 nm or less, which makes the effect of improving the strength of the multilayer electronic component 100 more significant.

[0088] In one embodiment, the average size of the first particles 10 may refer to a value obtained by dividing the sum of the length a of the major axis and the length b of the minor axis of the first particles 10 by 2. Such an average size of the first particles 10 may be further generalized by measuring any 10 or more first particles 10, and may be measured from an image obtained by observing the region where the reinforcing patterns 121c and 122c are formed under an accelerating voltage of 20 kV using a scanning electron microscope (SEM) after polishing the multilayer electronic component 100 in the second direction to expose the center of the lead portion 121b in the second direction.

[0089] Meanwhile, when the reinforcing patterns 121c and 122c include one or more of the first particles 10 and the second particles 10', the effect of preventing crack occurrence may vary depending on the filling rate of one or more of the first particles 10 and the second particles 10'.

[0090] Specifically, in the conventional case where the reinforcing patterns 121c and 122c are not formed, there is a possibility that a large number of cracks will occur due to the brittleness of the ceramic material in the bottleneck portions of the internal electrode layers 121 and 122.

[0091] On the other hand, in the reinforcement patterns 121c and 122c, when the area fraction of the first particles 10 is less than 30%, the phenomenon of crack occurrence is alleviated, but it may not be enough to suppress the crack occurrence itself. However, when the area fraction of the first particles 10 exceeds 70%, the specific gravity of the first particles 10 in the reinforcement patterns 121c and 122c is excessive, so that there is a risk of fine cracks occurring between the first particles 10. Therefore, in one embodiment, by adjusting the area fraction of the first particles 10 in the reinforcement patterns 121c and 122c to 30% or more and 70% or less, the phenomenon of crack occurrence in the bottleneck parts of the internal electrode layers 121 and 122 corresponding to the corner regions of the main body 110 can be effectively suppressed.

[0092] As an example of a method for measuring the area fraction of the first particles 10, there is a method for measuring the area fraction of the first particles 10 as a ratio of the area in which the first particles 10 are formed to the area of ​​the area in the third direction (y) in which the first particles 10 are formed and the area in the first direction (x). In this case, the first particles 10 can be distinguished by polishing the laminated electronic component 100 in the second direction to expose the center of the lead portion 121b in the second direction, and then observing the areas in which the reinforcing patterns 121c and 122c are formed under a scanning electron microscope (SEM) at an acceleration voltage of 20 kV, and determining that the relatively dark areas are the areas in which the first particles 10 are formed.

[0093] Referring to the P' region of Fig. 7, the reinforcing patterns 121c, 122c may have a continuous plate shape. In this case, the continuous plate shape may be a shape that appears by sintering carbide or conductive metal. In this case, it is advantageous to eliminate steps if the average thickness of the plate-shaped reinforcing patterns 121c, 122c is the same as the average thickness of the internal electrode layers 121, 122 including the lead portions 121b, 122b.

[0094] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes can be made by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0095] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0096] The terms used in the present invention are merely for the purpose of describing one embodiment and are not intended to limit the present invention. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0097] 100 Multilayer electronic components 110 Main unit 111 Dielectric layer 121, 122 Internal electrode layer 121a, 122a Main section 121b, 122b Lead section 121c, 122c reinforcement pattern 112, 113 Cover part 114, 115 Margin 10 1st particle 10' 2nd particle

Claims

1. a body including dielectric layers and internal electrode layers alternately disposed in a first direction with the dielectric layers, the body including a first surface and a second surface facing the first direction, a third surface and a fourth surface facing a second direction perpendicular to the first direction, and a fifth surface and a sixth surface facing a third direction perpendicular to the first direction and the second direction; external electrodes disposed on the third surface and the fourth surface; the internal electrode layer includes a main portion, a lead portion extending from the main portion to the third surface or the fourth surface to be connected to the external electrode and having a size smaller than that of the main portion in the third direction, and reinforcement patterns disposed on both sides of the lead portion in the third direction, The laminated electronic component, wherein the reinforcing pattern comprises carbide.

2. 2. The laminated electronic component according to claim 1, wherein the reinforcing pattern comprises one or more of tungsten carbide, titanium carbide, silicon carbide, zirconium carbide, hafnium carbide, vanadium carbide, niobium carbide, tantalum carbide, chromium carbide, and molybdenum carbide.

3. The multilayer electronic component according to claim 1 , wherein the reinforcing pattern includes first particles made of the carbide.

4. The multilayer electronic component according to claim 3 , wherein an average size of the first particles is equal to or smaller than ⅕ of an average thickness of the internal electrode layers.

5. The multilayer electronic component according to claim 3 , wherein the first particles have an average size of 500 nm or less.

6. The multilayer electronic component according to claim 3 , wherein an area fraction of the first particles is 30% or more and 70% or less.

7. 4. The multilayer electronic component according to claim 3, wherein the length of the major axis of the first particle is a and the length of the minor axis of the first particle is b, where b / a is 0.9 or more and 1.0 or less.

8. The reinforcing pattern further comprises a conductive metal; The multilayer electronic component according to claim 1 , wherein the reinforcing pattern includes second particles having the carbide disposed on at least a portion of a surface of the conductive metal.

9. The multilayer electronic component according to claim 1 , wherein the reinforcing pattern is in the form of a continuous plate.

10. The multilayer electronic component according to claim 1 , wherein the reinforcing pattern is disposed apart from the main portion and the lead portion.

11. The multilayer electronic component according to claim 1 , wherein the reinforcing pattern is disposed apart from the external electrodes.

12. The multilayer electronic component according to claim 1 , wherein the reinforcing pattern further includes one or more of copper (Cu), nickel (Ni), silver (Ag), palladium (Pd), and tin (Sn).

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