Coil component

Abstract

To provide a coil component which suppresses difficulties in the plating process of coils with high aspect ratios and current leakage through magnetic bodies between adjacent turns.SOLUTION: A coil component 1000 includes an insulating wall 400 that covers the side surface of a coil and fills the gaps between the turns of the coil, an insulating film 500 that is arranged between the insulating walls and covers the upper surface of the coil, and external electrodes 610, 620 that are arranged on a main body 100 and connected to the coil, the insulating wall includes multiple layers, an interface is formed between the layers of the insulating wall, and the height of the insulating wall in the first direction T is greater than or equal to the height of the outer surface of the insulating film in the first direction, on the basis of one surface of a support member 200 on which the multiple turns of the coil are arranged.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a coil component. [Background technology]

[0002] An inductor, which is one type of coil component, is a typical passive electronic component used in electronic devices along with resistors and capacitors.

[0003] As electronic devices become increasingly more sophisticated and smaller in size, the number of electronic components used in the electronic devices is also increasing and becoming smaller.

[0004] On the other hand, in order to improve the inductance characteristics of a coil component within a limited size, it is advantageous to increase the number of turns of the coil, increase the area of ​​the central core, and increase the effective volume of the magnetic material.

[0005] However, while a coil having a high aspect ratio is suitable for achieving the above features, problems such as difficulties in the plating process and current leakage through the magnetic material between adjacent turns can occur. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent Publication No. 2022-092860 Summary of the Invention [Problem to be solved by the invention]

[0007] One object of embodiments of the present invention is to facilitate forming high aspect ratio coils through insulating walls and to prevent current leakage between adjacent turns.

[0008] Another object of the present invention is to improve the inductance characteristics of a coil component by providing a space within a main body in which a magnetic body can be disposed. [Means for solving the problem]

[0009] According to one aspect of the present invention, there may be provided a coil component including: a body including a first surface and a second surface facing each other in a first direction; a support member disposed within the body and having one surface and another surface facing each other; a coil disposed on the support member and having a plurality of turns, the coil including a lower surface in contact with the support member, an upper surface facing the lower surface, and a side surface connecting the upper surface and the lower surface; an insulating wall covering a side surface of the coil and filling spaces between each turn of the coil; an insulating film disposed between the insulating walls and covering an upper surface of the coil; and an external electrode disposed on the body and connected to the coil, the insulating wall including a plurality of layers, an interface being formed between each layer of the insulating wall, and a height of the insulating wall in the first direction based on one surface of the support member is greater than or equal to a height of an outer surface of the insulating film in the first direction.

[0010] According to another aspect of the present invention, a coil includes a main body including a first surface and a second surface facing each other in a first direction, a support member disposed within the main body, a coil disposed on the support member and having a plurality of turns, the coil including a lower surface contacting the support member and an upper surface facing the lower surface, insulating walls disposed between each turn of the coil, an insulating film disposed between the insulating walls and interposed between an upper surface of the coil and the main body, and an external electrode disposed on the main body and connected to the coil, the insulating walls including a plurality of layers, an interface being formed between each layer of the insulating walls, and the upper surface of the coil may be concave toward the support member. Effect of the Invention

[0011] According to one aspect of the present invention, a coil with a high aspect ratio can be easily formed through an insulating wall to prevent current leakage between adjacent turns.

[0012] According to another aspect of the present invention, a space in which a magnetic body can be disposed within a main body is secured, thereby improving the inductance characteristics of the coil part. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view showing a coil component according to a first embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view taken along line II' of FIG. 1. [Diagram 3] FIG. 3 is an enlarged view of region A1 in FIG. [Figure 4] 2 is a cross-sectional view taken along line II-II' of FIG. 1. [Diagram 5] 5 is a view relating to a first modified example of the first embodiment and corresponding to FIG. 4. [Figure 6] 11 is a view relating to a second modified example of the first embodiment and corresponding to FIG. 3. [Figure 7] 11 is a view relating to a third modified example of the first embodiment and corresponding to FIG. 3. [Figure 8] 13 is a view relating to a fourth modified example of the first embodiment and corresponding to FIG. 3. [Figure 9] 1 is a view showing a coil device according to a second embodiment of the present invention, which corresponds to FIG. 2; [Figure 10] FIG. 10 is an enlarged view of region B in FIG. [Figure 11] 11 is a view relating to a modified example of the second embodiment and corresponding to FIG. 10. [Figure 12] 5 is a diagram illustrating a schematic diagram of a part of a manufacturing process of the coil component illustrated in FIG. 4. [Figure 13] 8 is a diagram illustrating a schematic diagram of a part of a manufacturing process of a coil component including a coil having a multi-layer structure as shown in FIG. 7. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The terms used in this application are merely used to describe certain embodiments and are not intended to limit the present invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, the terms "include" or "have" specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and should be understood not to preclude the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. And, throughout the specification, "on" means to be located above or below the target part, and does not necessarily mean to be located on the upper side based on the direction of gravity.

[0015] Furthermore, the term "bonding" does not only refer to cases where the components are in direct physical contact with each other in the contact relationship between the components, but is used as a concept that also encompasses cases where another structure is interposed between the components and the components are in contact with that other structure.

[0016] The size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited by the drawings.

[0017] In the drawings, the T direction may be defined as the first direction or length direction, the L direction may be defined as the second direction or length direction, and the W direction may be defined as the third direction or width direction.

[0018] Hereinafter, coil devices according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components are designated by the same reference numbers, and duplicated description thereof will be omitted.

[0019] Various types of electronic components are used in electronic devices, and various types of coil components can be appropriately used between such electronic components for the purpose of removing noise, etc.

[0020] That is, in electronic devices, coil components can be used as power inductors, high frequency inductors, general beads, high frequency beads (GHz beads), common mode filters, and the like.

[0021] First embodiment FIG. 1 is a perspective view showing a schematic diagram of a coil device 1000 according to a first embodiment of the present invention, FIG. 2 is a drawing showing a cross section along line II' in FIG. 1, FIG. 3 is an enlarged view of area A1 in FIG. 2, and FIG. 4 is a drawing showing a cross section along line II-II' in FIG. 1.

[0022] Meanwhile, in order to more clearly show the connections between the components, the insulating film 500 and the outer insulating layer that may be applied to this embodiment are omitted in FIG.

[0023] 1 to 4, a coil device 1000 according to the present embodiment may include a main body 100, a support member 200, a coil 300, an insulating wall 400, an insulating film 500, and external electrodes 610 and 620. In the embodiment shown in FIG.

[0024] The coil device 1000 according to the present embodiment includes insulating walls 400 that fill the spaces between each turn of the coil 300, thereby enabling a coil with a high aspect ratio to be stably formed and improving the insulation reliability between each turn of the coil 300.

[0025] In addition, by forming the insulating wall 400 in multiple layers, the coil 300 can be formed with a higher aspect ratio, and as the number of turns of the coil 300 increases within a limited size, the inductance capacity can be increased. dc The properties can also be improved.

[0026] Meanwhile, the coil device 1000 according to the present embodiment may include an insulating film 500 covering the upper surface of the coil 300. By forming the height of the outer surface of the insulating film 500 to be equal to or lower than the height of the end of the insulating wall 400, more space can be secured in which the magnetic body of the main body 100 can be disposed, and the effective volume can be increased, thereby improving the inductance characteristics.

[0027] In this embodiment, the line width LWw of the insulating wall 400 arranged between each turn of the coil 300 is 3 μm or more and 8 μm or less, the thickness of the insulating film 500 along the first direction T is 6 μm or more and 8 μm or less, and the thickness of the support member 200 along the first direction T can be formed to be 50 μm or less, but is not limited thereto.

[0028] The main components constituting the coil device 1000 according to this embodiment will be described in detail below.

[0029] The main body 100 has the external appearance of the coil device 1000 according to this embodiment, and can have a support member 200, a coil 300, an insulating wall 400, and an insulating film 500 embedded therein.

[0030] The main body 100 may be formed in an overall hexahedral shape.

[0031] The main body 100 includes a first surface 101 and a second surface 102 that face each other in a thickness direction T (first direction), a third surface 103 and a fourth surface 104 that face each other in a length direction L (second direction), and a fifth surface 105 and a sixth surface 106 that face each other in a width direction W (third direction). The third to sixth surfaces 103, 104, 105, and 106 of the main body 100 correspond to wall surfaces of the main body 100 that connect the first surface 101 and the second surface 102 of the main body 100.

[0032] The main body 100 may be exemplarily formed so that the coil device 1000 according to the present embodiment, in which the external electrodes 610 and 620 described below are formed, has a length of 2.5 mm, a width of 2.0 mm, and a thickness of 0.8 mm; a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.6 mm; a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.6 mm; a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.4 mm; a length of 1.4 mm, a width of 1.2 mm, and a thickness of 0.65 mm; a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm; a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm; or a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.5 mm, but is not limited thereto. Meanwhile, the above-mentioned exemplary values ​​for the length, width, and thickness of the coil part 1000 refer to values ​​that do not reflect process errors, and therefore values ​​within the range that is recognized as process errors should be considered to fall within the above-mentioned exemplary values.

[0033] The length of the coil part 1000 may refer to the maximum value among the dimensions of a plurality of line segments that are spaced apart from each other in the thickness direction T by connecting two outermost boundary lines facing each other in the length direction L of the coil part 1000 shown in an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T taken at the center of the width direction W of the coil part 1000. Alternatively, the length of the coil part 1000 may refer to the minimum value among the dimensions of the above-mentioned plurality of line segments. Alternatively, the length of the coil part 1000 may refer to the arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the length direction L may be equally spaced from each other in the thickness direction T, but the scope of the present invention is not limited thereto.

[0034] The thickness of the coil part 1000 may refer to the maximum value among the dimensions of a plurality of line segments spaced apart from each other in the length direction L by connecting two outermost boundary lines facing each other in the thickness direction T of the coil part 1000 shown in an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T taken at the center of the width direction W of the coil part 1000 in the above image in parallel with the thickness direction T. Alternatively, the thickness of the coil part 1000 may refer to the minimum value among the dimensions of the above-mentioned plurality of line segments. Alternatively, the thickness of the coil part 1000 may refer to the arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the thickness direction T may be equally spaced from each other in the length direction L, but the scope of the present invention is not limited thereto.

[0035] The width of the coil part 1000 may refer to the maximum value among the dimensions of a plurality of line segments spaced apart from each other in the length direction L by connecting two outermost boundary lines facing each other in the width direction W of the coil part 1000 shown in an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-width direction W taken at the center of the thickness direction T of the coil part 1000 in the above image in parallel with the width direction W. Alternatively, the width of the coil part 1000 may refer to the minimum value among the dimensions of the above-mentioned plurality of line segments. Alternatively, the width of the coil part 1000 may refer to the arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the width direction W may be equally spaced from each other in the length direction L, but the scope of the present invention is not limited thereto.

[0036] Alternatively, each of the length, width, and thickness of the coil device 1000 may be measured by a micrometer measurement method. The micrometer measurement method may be performed by setting a zero point with a micrometer that has been subjected to Gage R&R (Repeatability and Reproducibility), inserting the coil device 1000 according to the present embodiment between the tips of the micrometer, and rotating a measuring lever of the micrometer. Meanwhile, when measuring the length of the coil device 1000 by the micrometer measurement method, the length of the coil device 1000 may mean a value measured once, or may mean an arithmetic average of values ​​measured multiple times. This may be equally applied to the width and thickness of the coil device 1000.

[0037] The body 100 may include a magnetic material and a resin. Specifically, the body 100 may be formed by laminating one or more magnetic composite sheets in which a magnetic material is dispersed in a resin. However, the body 100 may have a structure other than the structure in which a magnetic material is dispersed in a resin. For example, the body 100 may be made of a magnetic material such as ferrite, or may be made of a non-magnetic material.

[0038] The magnetic material can be a ferrite or metallic magnetic powder.

[0039] The ferrite may be, for example, at least one of spinel type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, and Ni-Zn, hexagonal type ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, and Ba-Ni-Co, garnet type ferrites such as Y, and Li-based ferrites.

[0040] The metal magnetic powder may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). For example, the metal magnetic powder may be at least one of pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder and Fe-Cr-Al alloy powder.

[0041] The metal magnetic powder can be amorphous or crystalline. For example, the metal magnetic powder can be Fe-Si-B-Cr amorphous alloy powder, but is not necessarily limited thereto.

[0042] The ferrite and metal magnetic powder may each have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

[0043] The body 100 may include two or more types of magnetic materials dispersed in a resin. Here, different types of magnetic materials means that the magnetic materials dispersed in the resin are distinguished from each other in any one of average diameter, composition, crystallinity, and shape.

[0044] The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like, either alone or in combination.

[0045] The main body 100 has a core 110 that passes through the support member 200 and the coil 300. The core 110 may be formed by filling the through hole of the support member 200 with a magnetic composite sheet, but is not limited thereto.

[0046] The support member 200 may be disposed within the main body 100. The support member 200 is configured to support the coil 300 and the insulating wall 400. Meanwhile, in some embodiments, such as when the coil 300 corresponds to a wound coil or has a coreless structure, the support member 200 may be omitted.

[0047] The support member 200 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as a polyimide, or a photosensitive insulating resin, or may be formed of an insulating material in which such an insulating resin is impregnated with a reinforcing material such as glass fiber or an inorganic filler. For example, the support member 200 may be formed of a material such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) resin, PID (PhotoImagable Dielectric), Copper Clad Laminate (CCL), etc., but is not limited thereto.

[0048] As the inorganic filler, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0049] When the support member 200 is made of an insulating material containing a reinforcing material, the support member 200 can provide better rigidity. When the support member 200 is made of an insulating material not containing glass fiber, it is advantageous to reduce the overall thickness (meaning the sum of the dimensions of the coil 300 and the support member 200 along the thickness direction T in FIG. 1) of the support member 200 and the coil 300, thereby reducing the thickness of the components. When the support member 200 is made of an insulating material containing a photosensitive insulating resin, the number of processes for forming the coil 300 is reduced, which is advantageous to reduce production costs, and fine vias 320 can be formed.

[0050] The thickness Ts of the support member 200 along the first direction T may be 50 μm or less, and preferably, may be 10 μm or more and 50 μm or less, but is not limited thereto.

[0051] In the coil device 1000 according to the present embodiment, by forming the thickness Ts of the support member 200 to be thin, 50 μm or less, it is possible to secure space for forming a coil 300 with a high aspect ratio within the same size, and space can also be secured for arranging the magnetic body within the main body 100, thereby increasing the effective volume and improving the inductance characteristics.

[0052] The coil 300 of this embodiment may be disposed on the support member 200. Also, the coil 300 of this embodiment may be insulated from the body 100 by the insulating wall 400 and the insulating film 500.

[0053] The coil 300 is embedded in the main body 100 and exhibits the characteristics of the coil component 1000. For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil 300 can stabilize the power supply of an electronic device by storing an electric field in a magnetic field and maintaining an output voltage.

[0054] The coil 300 may be formed on at least one of both opposing surfaces of the support member 200 and may have a plurality of turns. The coil 300 may include a lower surface in contact with the support member 200, an upper surface facing the lower surface, and a side surface connecting the upper surface and the lower surface. The side surface of the coil 300 may be covered by an insulating wall 400, and the upper surface of the coil 300 may be covered by an insulating film 500.

[0055] Referring to FIG. 3, in the coil device 1000 according to this embodiment, the insulating wall 400 is formed of multiple layers, and in this case, the side of the coil 300 may include at least one protrusion P1 protruding toward the interface Iw between each layer of the insulating wall 400.

[0056] The protrusion P1 may be formed by a region where the line width LWw of the insulating wall 400 becomes narrower at the interface Iw region of each layer when the layers of the insulating wall 400 are stacked in sequence, and then, when the coil 300 is formed through electrolytic plating, a metal component fills the above-mentioned region.

[0057] When the protrusion P1 is formed on the side of the coil 300, the line width LWc in each turn of the coil 300 may be maximum in the region adjacent to the protrusion P1. That is, the line width LWw of the insulating wall 400 may be minimum in the region adjacent to the protrusion P1, and thereby the line width LWc of the coil 300 may be maximum in the region adjacent to the protrusion P1.

[0058] Here, the line width LWc of the coil 300 may refer to, for example, an arithmetic average value of at least three or more dimensions of a plurality of line segments spaced apart from each other in the first direction T by connecting the outermost boundary lines of each turn of the first coil pattern 311 shown in an optical microscope image or a scanning electron microscope (SEM) image of a second direction L-first direction T cross section taken at the center of the third direction W of the coil device 1000 in the second direction L. Here, the plurality of line segments may be equally spaced from each other, but the scope of the present invention is not limited thereto.

[0059] Meanwhile, the line width LWw of the insulating wall 400 can also be measured in a similar manner.

[0060] The coil 300 of this embodiment may include coil patterns 311 , 312 , a via 320 , and lead-out portions 331 , 332 .

[0061] Specifically, referring to Figures 2 and 4, the coil 300 of this embodiment may include a first coil pattern 311 arranged on one side of the support member 200, a first pull-out portion 331 extending from an outer end of the first coil pattern 311 to the third surface 103 of the main body 100, a second coil pattern 332 arranged on the other side of the support member 200, a second pull-out portion 332 extending from the outer end of the second coil pattern 312 to the fourth surface 104 of the main body 100, and a via 320 connecting the first coil pattern 311 and the second coil pattern 312.

[0062] 1 to 4, the first coil pattern 311 and the second coil pattern 312 are each arranged on opposite sides of the support member 200, and may be in the form of a planar spiral having multiple turns with the core 110 of the main body 100 as its axis.

[0063] The first coil pattern 311 is disposed on one surface of the support member 200, and may have a plurality of turns centered around the core 110. An end of the outermost turn of the first coil pattern 311 may be connected to a first lead-out portion 331 extending to the third surface 103 of the body 100.

[0064] In addition, the second coil pattern 312 may be disposed on the other surface of the support member 200 and may form at least a plurality of turns with the core 110 as an axis. An end of the outermost turn of the second coil pattern 312 may be connected to a second lead-out portion 332 extending to the fourth surface 104 of the body 100.

[0065] An insulating wall 400 may be disposed between each turn of the coil patterns 311 and 312. The insulating wall 400 fills the gap between each turn of the coil patterns 311 and 312, thereby preventing a short circuit or current leakage between adjacent turns.

[0066] In addition, an insulating film 500 is disposed on the upper surfaces of the coil patterns 311 and 312 between the insulating walls 400 , so that the coil patterns 311 and 312 can be insulated from the body 100 .

[0067] 1 and 2, the lead-out portions 331 and 332 may extend from the coil patterns 311 and 312 to the third surface 103 or the fourth surface 104 of the body 100.

[0068] Specifically, the first lead-out portion 331 may be connected to an outer end of the first coil pattern 311, extended to the third surface 103 of the body 100, and connected to the first external electrode 610. The second lead-out portion 332 may be connected to an outer end of the second coil pattern 312, extended to the fourth surface 104 of the body 100, and connected to the second external electrode 620.

[0069] 4, the coil 300 of the present embodiment may further include a via 320 connecting the first coil pattern 311 and the second coil pattern 312. Specifically, the via 320 may pass through the support member 200 to connect inner ends of the innermost turns of the first coil pattern 311 and the second coil pattern 312 to each other.

[0070] Meanwhile, the via 320 of the present embodiment may have a circular shape based on the LW cross section, and may have a shape in which the diameter decreases from one side of the support member 200 toward the inside and then increases again from the inside to the other side. That is, the cross-sectional area of ​​the via 320 on the LW cross section may be smallest at the inside of the support member 200.

[0071] The above feature can be achieved by irradiating a laser from each of both sides of the support member 200 when processing a via hole in the support member 200 so that the via 320 can be disposed. However, the scope of the present invention is not limited thereto, and may vary depending on the thickness Ts of the support member 200, the intensity and time of the irradiated laser, etc. For example, the via 320 may be formed in a cylindrical shape or a tapered shape.

[0072] As the coil 300 includes the above-mentioned configuration, a signal input to the first external electrode 610 can be output to the second external electrode 620 via the first lead-out portion 331, the first coil pattern 311, the via 320, the second coil pattern 312, and the second lead-out portion 332. With this structure, each component of the coil 300 can function as a single coil connected between the first external electrode 610 and the second external electrode 620 as a whole.

[0073] At least one of the coil patterns 311, 312, the via 320, and the lead-out portions 331, 332 may include at least one conductive layer.

[0074] For example, when the first coil pattern 311, the via 320, and the first lead-out portion 331 are formed on one surface of the support member 200 by plating, each of the first coil pattern 311, the via 320, and the first lead-out portion 331 may include a seed layer and an electrolytic plating layer. The seed layer may be formed by an electroless plating method or a vapor phase deposition method such as sputtering. Each of the seed layer and the electrolytic plating layer may have a single layer structure or a multilayer structure. The multilayer electrolytic plating layer may be formed in a conformal film structure in which one electrolytic plating layer covers another electrolytic plating layer, or may be formed in a shape in which one electrolytic plating layer is laminated on only one surface of one electrolytic plating layer. The seed layer of the first coil pattern 311, the seed layer of the via 320, and the seed layer of the first lead-out portion 331 may be formed integrally and no boundary may be formed between them, but is not limited thereto. The electrolytic plating layer of the first coil pattern 311, the electrolytic plating layer of the via 320, and the electrolytic plating layer of the first lead-out portion 331 may be integrally formed without any boundary between them, but is not limited thereto.

[0075] Each of the coil patterns 311, 312, the via 320, and the lead-out portions 331, 332 may include a conductive material such as, but is not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo) or an alloy thereof.

[0076] 1 to 4, a coil device 1000 according to the present embodiment may include an insulating wall 400 that covers a side surface of a coil 300 and fills spaces between each turn of the coil 300. In the embodiment shown in FIG.

[0077] The insulating wall 400 can function as a plating resist when the coil 300 is formed through electrolytic plating, and remains as is after the coil 300 is formed without being removed, thereby improving the insulation between the coil 300 and the body 100 and preventing short circuits and current leakage between adjacent turns of the coil 300.

[0078] 3, the insulating wall 400 of the present embodiment may be formed to include a plurality of layers, and an interface Iw may be formed between each layer of the insulating wall 400. In order to form a coil 300 with a high aspect ratio, the height Hw of the insulating wall 400 must also be high, but in order to maintain stable placement and alignment of the insulating wall 400, it is preferable to form the insulating wall 400 in a plurality of layers as in the present embodiment.

[0079] Here, the height Hw of the insulating wall 400 is based on one surface or the other surface of the support member 200 that is in contact with the insulating wall 400. That is, the height Hw of the insulating wall 400 disposed on one surface of the support member 200 may be a numerical value obtained by measuring the distance from one surface of the support member 200 to the end of the insulating wall 400 along the first direction T. Also, the height Hw of the insulating wall 400 disposed on the other surface of the support member 200 may be a numerical value obtained by measuring the distance from the other surface of the support member 200 to the end of the insulating wall 400 along the first direction T.

[0080] The height Hw of the insulating wall 400 may, for example, refer to an optical microscope image or a scanning electron microscope (SEM) image of a second direction L-first direction T cross section taken at the center of the coil device 1000 in the third direction W, and may refer to an arithmetic average value of at least three or more dimensions of a plurality of line segments spaced apart from each other in the second direction L by connecting the outermost boundary line of the insulating wall 400 shown in the image in the first direction T. Here, the plurality of line segments may be equally spaced from each other, but the scope of the present invention is not limited thereto.

[0081] In the coil device 1000 of the present embodiment, the height Hw of the insulating wall 400 in the first direction T may be equal to or greater than the height Hf of the outer surface of the insulating film 500 in the first direction T. That is, the end of the insulating wall 400 may be coplanar with the insulating film 500 or may protrude beyond the insulating film 500.

[0082] 3, the line width LWw of the insulating wall 400 may be smallest at the interface Iw between each layer of the insulating wall 400. This allows the side of the coil 300 to include a protrusion P1 in a region adjacent to the interface Iw between each layer of the insulating wall 400.

[0083] Meanwhile, the number of protrusions P1 formed on any one side surface of each turn of the coil 300 may be less than the number of layers included in the insulating wall 400.

[0084] In the coil device 1000 according to the present embodiment, the line width LWw of the insulating wall 400 filling the spaces between each turn of the coil 300 can be not less than 3 μm and not more than 8 μm.

[0085] [Table 1]

[0086] The above table 1 shows the occurrence or nonoccurrence of short circuit or current leakage between adjacent turns of the coil 300 and the rate of change in inductance capacitance by changing the line width LWw of the insulating wall 400 of the coil part 1000. The sample used in the experiment was the coil part 1000 having a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm, and the number of turns of the coil 300 was 10.5 turns, and the line width LWw of the insulating wall 400 as the reference was set to 10 μm. Five samples were used for each experimental example, and if any of them had a short circuit or current leakage, it was marked as "NG", and if none had occurred, it was marked as "OK". In the case of the rate of change in inductance capacitance Ls, an increase of 3% or more from the reference capacitance was set as a valid effect, and the arithmetic average value of the five samples was recorded.

[0087] Referring to Table 1, when the line width LWw of the insulating wall 400 was less than 3 μm, a short circuit or current leakage occurred between adjacent turns of the coil 300. On the other hand, when the line width LWw of the insulating wall 400 was more than 8 μm, the rate of change in the inductance capacitance Ls with respect to the reference capacitance did not reach 3%.

[0088] Therefore, when the line width LWw of the insulating wall 400 filling the gap between each turn of the coil 300 is formed to be 3 μm or more and 8 μm or less, it is possible to have an effective effect of preventing short circuits or current leakage between adjacent turns of the coil 300 while increasing the inductance capacitance Ls by 3% or more.

[0089] 1 and 2, the insulating wall 400 of the present embodiment may be disposed to contact at least one of the third surface 103 and the fourth surface 104 of the body 100. The insulating wall 400 may be disposed to fill not only the areas between the turns of the coil 300 but also the areas on the support member 200 where the coil 300 is not formed.

[0090] That is, the insulating wall 400 may be disposed with a wider line width in a region opposite the lead-out portions 331 and 332 with respect to the support member 200. Also, the insulating wall 400 may cover the inner surface of the innermost turn of the coil 300 and may cover the outer surface of the outermost turn.

[0091] The insulating wall 400 may be a known resist film, and may be formed by laminating a resist film and then curing it, or by applying and curing a resist film material, but is not limited thereto.

[0092] As a method for laminating the resist film, for example, a method of performing a hot press process in which pressure is applied at a high temperature for a certain period of time, then the pressure is reduced and cooled to room temperature, followed by a cold press process to lower the temperature and separate the working tool, may be used.

[0093] Examples of methods that can be used to apply the resist film include a screen printing method in which ink is applied by squeezing, and a spray printing method in which ink is atomized and applied.

[0094] Thereafter, the insulating wall 400 can be formed by applying a photolithography method or the like to the semi-cured resist film.

[0095] 2 to 4, the coil device 1000 according to the present embodiment may include an insulating film 500 disposed between the insulating walls 400 and covering the upper surface of the coil 300.

[0096] The insulating film 500 is configured to provide insulation between the upper surface of the coil 300 and the main body 100. Since the coil component 1000 according to this embodiment has a double insulation structure of the insulating wall 400 and the insulating film 500, the insulation reliability between the coil 300 and the main body 100 can be improved.

[0097] 2 and 3, the height Hf of the insulating layer 500 based on one surface of the support member 200 may be equal to or lower than the height Hw of the insulating wall 400 .

[0098] In the coil component 1000 according to this embodiment, the height Hf of the insulating film 500 is formed to be higher than the height Hw of the insulating wall 400. Compared to the case where the upper surface of the insulating wall 400 and the upper surface of the coil 300 are integrally covered, the height of the insulating film 500 is formed to be lower, thereby making it possible to secure more space for disposing the magnetic body within the main body 100, thereby increasing the effective volume and improving the inductance characteristics.

[0099] In the coil device 1000 according to the present embodiment, the thickness Tf of the insulating film 500 along the first direction T can be not less than 6 μm and not more than 8 μm.

[0100] [Table 2]

[0101] Table 2 above shows the occurrence or nonoccurrence of defects in which the magnetic material of the main body 100 penetrates into the coil 300, and the rate of change in the effective volume, by changing the thickness Tf of the insulating film 500 of the coil part 1000. The sample used in the experiment was the coil part 1000 having a length of 1.0 mm, a width of 0.7 mm, a thickness of 0.65 mm, and a coil 300 with 10.5 turns, and the thickness Tf of the insulating film 500 as the reference was set to 11 μm. Five samples were used for each experimental example, and if any of them had a short circuit or current leakage, it was marked as "NG", and if none of them had occurred, it was marked as "OK". In the case of the rate of change in the effective volume, an increase of 3% or more relative to the reference volume was set as a valid effect, and the arithmetic average value of the five samples was recorded.

[0102] Referring to Table 2, when the thickness Tf of the insulating film 500 was less than 6 μm, a defect occurred in which the magnetic material of the main body 100 penetrated into the coil 300. On the other hand, when the thickness Tf of the insulating film 500 was more than 8 μm, the rate of change in the effective volume with respect to the reference volume did not reach 3%.

[0103] Therefore, when the thickness Tf of the insulating film 500 covering the upper surface of the coil 300 is formed to be 6 μm or more and 8 μm or less, a short circuit due to magnetic material penetration between the upper surface of the coil 300 and the main body 100 is prevented, while the effective volume of the coil component 1000 is increased by 3% or more, which is an effective effect.

[0104] The insulating film 500 may include a known insulating material such as Parylene and may be formed by a method such as vapor deposition, but is not limited thereto, and may also be formed by laminating an insulating film on the upper surface of the coil 300 between the insulating walls 400.

[0105] 1 and 2, the external electrodes 610, 620 may be disposed on the main body 100 and connected to the coil 300. Specifically, the first external electrode 610 may be disposed on the third surface 103 of the main body 100 and may be in contact with the first lead-out portion 331, and the second external electrode 620 may be disposed on the fourth surface 104 of the main body 100 and may be in contact with the second lead-out portion 332.

[0106] The first external electrode 610 may be disposed on the third surface 103 of the main body 100, and may extend to at least a portion of the first surface 101, the second surface 102, the fifth surface 105, and the sixth surface 106 of the main body 100. The second external electrode 500 may be disposed on the fourth surface 104 of the main body 100, and may extend to at least a portion of the first surface 101, the second surface 102, the fifth surface 105, and the sixth surface 106 of the main body 100.

[0107] When the coil device 1000 according to the present embodiment is mounted on a circuit board, the external electrodes 610 and 620 electrically connect the coil device 1000 to the circuit board, etc. For example, the first external electrode 610 and the second external electrode 620, which are respectively extended to the first surface 101 of the body 100 and spaced apart from each other, may be electrically connected to a connection portion of the circuit board.

[0108] The external electrodes 610, 620 may be formed of a conductive material such as, but not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or an alloy thereof.

[0109] Each of the external electrodes 610, 620 may be formed of a plurality of layers. For example, the first external electrode 610 may include a first layer in contact with the first lead-out portion 331 and a second layer disposed on the first layer. Here, the first layer may be a conductive resin layer including conductive powder including at least one of copper (Cu) and silver (Ag) and insulating resin, or a copper (Cu) plating layer. The second layer may be a double-layer structure of a nickel (Ni) plating layer / tin (Sn) plating layer.

[0110] Meanwhile, the coil device 1000 according to the present embodiment may further include an external insulating layer that covers the third to sixth surfaces 103, 104, 105, and 106 of the body 100 and is disposed in areas other than the areas where the external electrodes 610 and 620 are disposed.

[0111] The outer insulating layer may be formed, for example, by applying and curing an insulating material including an insulating resin on the surface of the body 100. In this case, the insulating layer may include at least one of thermoplastic resins such as polystyrene-based, vinyl acetate-based, polyester-based, polyethylene-based, polypropylene-based, polyamide-based, rubber-based, and acrylic-based, thermosetting resins such as phenol-based, epoxy-based, urethane-based, melamine-based, and alkyd-based, and photosensitive insulating resins.

[0112] Modification of the first embodiment FIG. 5 relates to a first modified example 1000' of the first embodiment and corresponds to FIG.

[0113] Comparing FIG. 5 with FIG. 4, the shape of the via 320 in this modification is different.

[0114] Therefore, when describing this modified example, only the shape of the via 320 that differs from the first embodiment of the present invention will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0115] 5, the via 320 of this modified example may have a circular shape based on the LW cross section, and may have a shape in which the diameter decreases from one surface to the other surface of the support member 200. That is, the cross-sectional area of ​​the via 320 on the LW cross section may be smallest on the other surface of the support member 200, and may have a tapered shape.

[0116] The above feature can be realized by irradiating a laser only on one surface of the support member 200 when processing a via hole in the support member 200 so that the via 320 can be disposed.

[0117] On the other hand, in the case of a support member 200 having a small thickness, it is easy to form a via hole even if the laser is irradiated to only one surface, so it is preferable that the thickness Ts' of the support member 200 of this modified example is thinner than that of the first embodiment.

[0118] In the coil device 1000 ′ according to this modified example, the risk of voids occurring in the vias 320 due to the narrow via holes being plated with metal during the plating process of the coil 300 can be reduced.

[0119] FIG. 6 relates to a second modified example A2 of the first embodiment and corresponds to FIG.

[0120] Comparing FIG. 6 with FIG. 3, the difference is that the end of the insulating wall 400 protrudes from the outer side surface Ef of the insulating film 500 in this modification.

[0121] Therefore, when describing this modified example, only the insulating wall 400 and the insulating film 500 that are different from the first embodiment of the present invention will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0122] 6, in this modified example, a height Hf of the insulating film 500 based on one surface of the support member 200 may be formed lower than the height of the end of the insulating wall 400. That is, an outer surface Ef of the insulating film 500 may be formed between the insulating walls 400 and inside the end of the insulating wall 400.

[0123] In this modified example, the insulating film 500 is inserted further inward between the insulating walls 400, thereby providing space for arranging the magnetic material of the main body 100, thereby further increasing the effective volume and further improving the inductance characteristics.

[0124] FIG. 7 relates to a third modified example A3 of the first embodiment and corresponds to FIG.

[0125] Comparing FIG. 7 with FIG. 3, the coil 300 of this modification differs from the first embodiment in that it includes multiple layers.

[0126] Therefore, when describing this modified example, only the multi-layer structure of the coil 300, which differs from the first embodiment of the present invention, will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0127] 7, in this modified example, the coil 300 includes a plurality of layers, and an interface Ic may be formed between each layer of the coil 300. For example, an interface Ic may be formed between each layer in the first coil pattern 311.

[0128] Also, the line width in each turn of the coil 300 may be greatest at the interface Ic of the coil 300.

[0129] In addition, the interface Ic of the coil 300 is located at the same level as the interface Iw of the insulating wall 400, and can be coplanar with each other.

[0130] The above feature of this modified example can be realized, for example, by first disposing one layer of the insulating wall 400 having a multi-layer structure, and then disposing one layer of the coil 300 having a multi-layer structure, and repeating this process. However, this is not limited thereto, and the coil 300 may be formed in a divided process or integrally without an interface between the layers.

[0131] FIG. 8 relates to a fourth modified example A4 of the first embodiment and corresponds to FIG.

[0132] Comparing FIG. 8 with FIG. 3, the insulating film 500 of this modification is different in that the outer side surface Ef has a concave shape.

[0133] Therefore, when describing this modified example, only the shape of the outer side surface Ef of the insulating film 500, which differs from that of the first embodiment of the present invention, will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0134] 8, in this modified example, the upper surface Uc of the coil 300 may have a concave shape toward the support member 200. For example, the upper surface Uc of the first coil pattern 311 may be formed to have a concave shape in the first direction T.

[0135] In addition, the outer surface Ef of the insulating film 500 may be concave toward the support member 200 along the shape of the upper surface Uc of the coil 300. For example, the insulating film 500 may be conformally disposed along the shape of the upper surface Uc of the first coil pattern 311 and may be concave in the first direction T.

[0136] In this modified example, since the insulating film 500 covers the area adjacent to the end of the insulating wall 400, the insulation between the coil 300 and the main body 100 can be improved, while the magnetic material of the main body 100 is arranged in the area where the outer surface Ef of the insulating film 500 is formed in a concave shape, thereby increasing the effective volume and improving the inductance characteristics.

[0137] Second embodiment and its modifications Fig. 9 shows a coil device 2000 according to a second embodiment of the present invention, and corresponds to Fig. 2. Fig. 10 is an enlarged view of region B in Fig. 9.

[0138] Comparing Figures 9 and 2, and Figures 10 and 3, the coil device 2000 according to this embodiment differs in that the insulating wall 400 has a three-layer structure, the upper surface Uc of the coil 300 is concave, and two or more protrusions P1, P2 are formed on the side surface of each turn of the coil 300.

[0139] Therefore, when describing this embodiment, only the three-layer structure of the insulating wall 400, the shape of the upper surface Uc of the coil 300, and the protrusions P1 and P2 formed on the side of each turn of the coil 300, which are different from the first embodiment of the present invention, will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0140] 9 and 10, the insulating wall 400 of the present embodiment may be formed of three or more layers.

[0141] By forming the insulating walls 400 in three or more layers, the aspect ratio of the coil 300 disposed between the insulating walls 400 can be further increased, so that the number of turns in the coil component 2000 of a limited size can be increased, thereby increasing the inductance capacity, and the surface area of ​​the coil 300 can be increased, thereby increasing the R dc can also be reduced.

[0142] 10, in the coil device 2000 of this embodiment, the upper surface Uc of the coil 300 may have a concave shape facing the support member 200. As shown in FIG.

[0143] Meanwhile, the insulating film 500 of the present embodiment may be formed flat at the same level as the end of the insulating wall 400. That is, the insulating film 500 may be arranged to fill the space on the upper surface Uc of the coil 300 between the insulating walls 400, without being conformally formed along the shape of the upper surface Uc of the coil 300.

[0144] In the coil component 2000 according to this embodiment, the insulating film 500 is arranged thickly in an area where the insulation between the main body 100 and the coil 300 is weak, thereby improving the insulation reliability between the main body 100 and the coil 300.

[0145] Meanwhile, in this embodiment, two or more protrusions P1, P2 may be formed on the side of each turn of the coil 300. That is, since the insulating wall 400 has a three-layer structure, at least two protrusions P1, P2 may be formed on the side of the coil 300 in a region adjacent to the interface between each layer of the insulating wall 400.

[0146] FIG. 11 relates to modified example B' of the second embodiment and corresponds to FIG.

[0147] Comparing FIG. 11 with FIG. 10, the coil 300 of this modification differs from the second embodiment in that it includes multiple layers.

[0148] Therefore, when describing this modified example, only the multi-layer structure of the coil 300, which differs from the second embodiment of the present invention, will be described, and the description of the second embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0149] 11, in this modified example, the coil 300 may be formed in three or more layers, and an interface Ic may be formed between each layer of the coil 300. For example, an interface Ic may be formed between each layer in the first coil pattern 311.

[0150] Also, the line width in each turn of the coil 300 may be greatest at the interface Ic of the coil 300.

[0151] In addition, the interface Ic of the coil 300 is located at the same level as the interface Iw of the insulating wall 400, and can be coplanar with each other.

[0152] The above feature of this modified example can be realized, for example, by first disposing one layer of the insulating wall 400 having a three-layer structure, and then disposing one layer of the coil 300 having a three-layer structure, and repeating this process. However, this is not limited thereto, and the coil 300 may be integrally formed without an interface between the layers even if the coil 300 forming process is divided.

[0153] Coil component manufacturing process FIG. 12 is a diagram that illustrates a part of a manufacturing process for the coil device 1000 shown in FIG.

[0154] Referring to FIG. 12, first, the support member 200 is prepared, and then the via holes VH can be processed at the positions where the vias 320 are to be disposed.

[0155] Next, after laminating multiple resist films, the insulating wall 400 can be patterned through exposure and development to correspond to the shape of the coil 300. Here, the insulating wall 400 can have two or more layers, and an interface can be formed between each layer.

[0156] Next, the coil 300 may be formed through electrolytic plating. That is, the first coil pattern 311 and the second coil pattern 312 may be disposed while filling the space between the insulating walls 400, and the vias 320 may be integrally formed.

[0157] Next, an insulating film 500 may be disposed on each of an upper surface of the first coil pattern 311 and an upper surface of the second coil pattern 312. Here, an outer surface of the insulating film 500 may be formed so as not to protrude beyond an end of the insulating wall 400.

[0158] FIG. 13 is a diagram that illustrates a part of a manufacturing process of a coil component including the coil 300 having a multi-layer structure as shown in FIG.

[0159] Referring to FIG. 13, first, the support member 200 is prepared, and then the via holes VH can be processed at the positions where the vias 320 are to be disposed.

[0160] Next, a single layer of resist film is disposed, and then one layer of insulating wall 400 corresponding to the shape of coil 300 can be patterned through exposure and development.

[0161] Next, one layer of the coil 300 may be formed through electrolytic plating. That is, the first coil pattern 311 and the second coil pattern 312 may be disposed while filling the gap between the insulating walls 400, and the vias 320 may be integrally formed. Here, the coil 300 may be formed to have the same height as or a lower height than the end of the insulating walls 400.

[0162] Next, two layers of insulating wall 400 can be disposed on each of coil 300 and one layer of insulating wall 400. The two layers of insulating wall 400 can be formed by disposing a single layer of resist film on each of coil 300 and one layer of insulating wall 400, and then patterning the two layers of insulating wall 400 to correspond to the two-layer shape of coil 300 through exposure and development.

[0163] Next, two layers of the coil 300 may be formed through electrolytic plating. That is, two layers of the first coil pattern 311 and the second coil pattern 312 may be disposed while filling the space between the insulating walls 400. An interface may be formed between the first and second layers of the coil 300.

[0164] Next, an insulating film 500 may be disposed on each of an upper surface of the first coil pattern 311 and an upper surface of the second coil pattern 312. Here, an outer surface of the insulating film 500 may be formed so as not to protrude beyond an end of the insulating wall 400.

[0165] Although one embodiment of the present invention has been described above, a person having ordinary knowledge in the art may modify and change the present invention in various ways by adding, changing or deleting components without departing from the concept of the present invention described in the claims, and this may also be considered to be within the scope of the present invention. [Explanation of symbols]

[0166] 100:Main body 110: Core 200: Support member 300: Coil 311, 312: Coil pattern 320:Beer 331, 332: Drawer section 400: Insulated wall 500: Insulating film 610, 620: External electrode P1, P2: Protrusion Iw: Insulation wall interface Ic: Coil interface LWw: Insulation wall line width LWc: Coil line width Hw: Insulation wall height Hf: Insulation film height Ts, Ts': Thickness of supporting member Tf: Insulating film thickness Uc: Top of coil Ef: Outer surface of insulating film VH: Via Hole 1000, 1000', 2000: Coil parts

Claims

1. a main body including a first surface and a second surface facing each other in a first direction; a support member disposed within the body and having one surface and an opposite surface facing each other; a coil disposed on the support member, the coil having a plurality of turns, the coil including a lower surface in contact with the support member, an upper surface facing the lower surface, and a side surface connecting the upper surface and the lower surface; an insulating wall that covers a side surface of the coil and fills spaces between each turn of the coil; an insulating film disposed between the insulating walls and covering an upper surface of the coil; an external electrode disposed on the body and coupled to the coil; the insulating wall includes a plurality of layers, and an interface is formed between each layer of the insulating wall; a height of the insulating wall in the first direction based on one surface of the support member is equal to or greater than a height of an outer surface of the insulating film in the first direction; Coil parts.

2. the line width of the insulating wall is smallest at the interface between each layer of the insulating wall; The coil component according to claim 1 .

3. The insulating wall is formed of three or more layers. The coil component according to claim 1 .

4. The line width of the insulating wall filling the space between each turn of the coil is 3 μm or more and 8 μm or less. The coil component according to claim 1 .

5. The thickness of the insulating film in the first direction is 6 μm or more and 8 μm or less. The coil component according to claim 1 .

6. A side surface of the coil includes at least one protrusion protruding toward an interface of the insulating wall. The coil component according to claim 1 .

7. The line width of each turn of the coil is greatest in the region adjacent to the protrusion. The coil component according to claim 6.

8. an upper surface of the coil is concave toward the support member; The coil component according to claim 1 .

9. The outer surface of the insulating film is concave toward the support member along the shape of the upper surface of the coil. The coil component according to claim 8.

10. the coil includes a plurality of layers, and an interface is formed between each layer of the coil; The coil component according to claim 1 .

11. The line width of the coil is greatest at the interface of the coil. The coil component according to claim 10.

12. The coil is formed of three or more layers. The coil component according to claim 10.

13. an interface of the insulating wall and an interface of the coil are coplanar with each other; The coil component according to claim 10.

14. The thickness of the support member along the first direction is 50 μm or less. The coil component according to claim 1 .

15. The body further includes a third surface and a fourth surface facing each other in a second direction perpendicular to the first direction, The coil is a first coil pattern disposed on one surface of the support member; a first lead-out portion extending from an outer end of the first coil pattern to the third surface; a second coil pattern disposed on the other surface of the support member; a second lead-out portion extending from an outer end of the second coil pattern to the fourth surface; and a via connecting the first coil pattern and the second coil pattern. The coil component according to claim 1 .

16. The insulating wall is in contact with at least one of the third surface and the fourth surface. The coil component according to claim 15.

17. On a cross section perpendicular to the first direction and passing through the via, the cross-sectional area of ​​the via is smallest on the other surface of the support member; The coil component according to claim 15.

18. On a cross section perpendicular to the first direction and passing through the via, the cross-sectional area of ​​the via is smallest inside the support member; The coil component according to claim 15.

19. a main body including a first surface and a second surface facing each other in a first direction; a support member disposed within the body; a coil disposed on the support member, the coil having a plurality of turns, the coil including a lower surface in contact with the support member and an upper surface opposite the lower surface; an insulating wall disposed between each turn of the coil; an insulating film disposed between the insulating walls and interposed between the upper surface of the coil and the main body; an external electrode disposed on the body and coupled to the coil; the insulating wall includes a plurality of layers, and an interface is formed between each layer of the insulating wall; The upper surface of the coil has a concave shape toward the support member. Coil parts.

20. the insulating wall disposed between each turn of the coil has a line width of 3 μm or more and 8 μm or less, the insulating film has a thickness of 6 μm or more and 8 μm or less along the first direction, and the support member has a thickness of 50 μm or less along the first direction; The coil component according to claim 19.

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