Inductor component

Abstract

To reduce heat generation at a contact face between a coil and an external electrode.SOLUTION: An inductor component 1 includes: an element 10; a coil 20 provided inside the element; and first and second external electrodes 30, 40 that are provided on the element and electrically connected to the coil. The coil has a winding part 23 which is spirally wound along an axial AX direction, first and second lead lines 21, 22 which respectively connect the winding part, one end and the other end of the winding part, and the first and second external electrodes. At least one of the first and second external electrodes has an embedded part 31, 41 which is embedded in the element. At least one of the first and second lead lines has a connection part 211 that is connected to the winding part, and a curved part 212 that curves from the connection part toward the embedded part. When viewed form the axial direction, the curved part has a concave shape. A length dimension L1 of the contact face between the embedded part and the lead line is larger than a wiring width W1 of the connection part. The length dimension L1 is larger than a height dimension D1 in a direction perpendicular to the contact face of the embedded part.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an inductor component. [Background technology]

[0002] A conventional inductor component is described in JP 2017-11044 A (Patent Document 1). This inductor component has an element body, a coil provided within the element body, and first and second external electrodes provided within the element body and electrically connected to the coil, and the coil has a winding portion and first and second lead-out wirings connecting one end and the other end of the winding portion to the first and second external electrodes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-011044 A Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional inductor components, the countermeasure against cracks has been to reduce the firing residual stress that occurs at the interface between the external electrode and the element body. To reduce the firing residual stress, the volume of the external electrodes and the wiring width of the lead-out wiring are reduced in conventional inductor components. However, in conventional inductor components, current concentrates at the contact surface where the lead-out wiring and the external electrode come into contact, which can cause the contact surface to heat up.

[0005] The present disclosure provides an inductor component that suppresses heat generation at the contact surface between a coil and an external electrode. [Means for solving the problem]

[0006] In order to solve the above problems, an inductor component according to one aspect of the present disclosure comprises: The body and A coil provided within the element body; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with The coil has a winding portion wound in a spiral shape along an axial direction, the coil has the winding portion, and first and second escape wirings connecting one end and the other end of the winding portion to the first external electrode and the second external electrode, At least one of the first external electrode and the second external electrode has an embedded portion embedded in the element body, At least one of the first escape wiring and the second escape wiring has a connection portion connected to the winding portion and a curved portion curved from the connection portion toward the embedded portion, When viewed from the axial direction, the curved portion has a concave shape, and a length dimension L1 of a contact surface between the embedded portion and the lead-out wiring is larger than a wiring width W1 of the connection portion; The length dimension L1 is greater than a height dimension D1 of the embedded portion in a direction perpendicular to the contact surface.

[0007] By making the length dimension L1 of the contact surface between the curved portion and the embedded portion larger than the wiring width W1 of the connection portion, the contact surface between the curved portion and the embedded portion becomes larger, and the amount of current flowing per unit area can be reduced. As a result, heat generated at the contact surface between the curved portion and the embedded portion can be dissipated, and the temperature rise at the contact surface can be suppressed. Effect of the Invention

[0008] According to an inductor component according to one aspect of the present disclosure, heat generation at the contact surface between the coil and the external electrode can be suppressed. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a first embodiment of an inductor component. [Diagram 2] FIG. 2 is a see-through front view seen from a first side surface side in the first embodiment. [Diagram 3] FIG. 2 is an exploded view of the first embodiment. [Figure 4] FIG. 11 is a see-through front view seen from a first side surface side in the second embodiment. [Diagram 5] FIG. 11 is an exploded view of the second embodiment. [Figure 6] FIG. 11 is a see-through front view seen from a first side surface side in a third embodiment. [Figure 7] FIG. 11 is an exploded view of the third embodiment. [Figure 8] FIG. 13 is a see-through front view seen from the top surface side in the fourth embodiment. [Figure 9A] FIG. 13 is an exploded view of the fourth embodiment. [Figure 9B] FIG. 13 is an exploded view of the fourth embodiment. [Figure 9C] FIG. 13 is an exploded view of the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an inductor component according to an embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the drawings include some schematic views and may not reflect actual dimensions or proportions.

[0011] First Embodiment Fig. 1 is a perspective view showing a first embodiment of an inductor component, Fig. 2 is a see-through front view of the inductor component seen from a first side surface side, and Fig. 3 is an exploded view of the inductor component.

[0012] 1 to 3, the inductor component 1 has an element body 10, a coil 20 provided on the element body 10, and a first external electrode 30 and a second external electrode 40 provided on the element body 10 and electrically connected to the coil 20. For convenience, the element body and the coil are depicted as transparent in Fig. 2 so that the structure can be easily understood, but they may also be translucent or opaque.

[0013] The inductor component 1 is electrically connected to wiring on a circuit board (not shown) via first and second external electrodes 30, 40. The inductor component 1 is used, for example, as an impedance matching coil (matching coil) for high-frequency circuits, and is used in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, car electronics, and medical and industrial machinery. However, the uses of the inductor component 1 are not limited to this, and it can also be used, for example, in tuning circuits, filter circuits, and rectifying and smoothing circuits.

[0014] The element body 10 is formed in a substantially rectangular parallelepiped shape. The element body 10 includes a first side surface 13 and a second side surface 14 opposing each other, a first end surface 15 and a second end surface 16 opposing each other, a bottom surface 17 connected between the first side surface 13 and the second side surface 14 and between the first end surface 15 and the second end surface 16, and a top surface 18 opposing the bottom surface 17. In other words, the outer surface of the element body 10 is composed of the first side surface 13, the second side surface 14, the first end surface 15, the second end surface 16, the bottom surface 17, and the top surface 18.

[0015] As shown in FIG. 1 , the X direction is perpendicular to the first end face 15 and the second end face 16, and is the direction from the first end face 15 to the second end face 16. The Y direction is perpendicular to the first side face 13 and the second side face 14, and is the direction from the second side face 14 to the first side face 13. The Z direction is perpendicular to the bottom face 17 and the top face 18, and is the direction from the bottom face 17 to the top face 18. The X direction is also called the length direction of the element body 10, the Y direction is also called the width direction of the element body 10, and the Z direction is also called the height direction of the element body 10. The X direction, the Y direction, and the Z direction are perpendicular to each other, and when arranged in the order of X, Y, and Z, they form a left-handed system.

[0016] As shown in FIG. 3, the element body 10 is configured by stacking multiple insulating layers 11. Specifically, the element body 10 is configured by stacking multiple insulating layers 11 from the second side surface 14 toward the first side surface 13. The number of insulating layers 11 is not limited to the number in FIG. 3. In the present application, stacked is not limited to the direction in which layers are stacked during manufacturing, but also includes the reverse direction. In FIG. 3, the layers are stacked in order from the upper left to the lower right. In other exploded views, the layers are stacked in order in the same manner.

[0017] The insulating layer 11 is made of a magnetic material or a non-magnetic material. Examples of the magnetic material include ferrite, and examples of the non-magnetic material include glass such as borosilicate glass, alumina, and resin. A plurality of insulating layers 11 are stacked in the Y direction. The insulating layers 11 are in the form of layers extending in the XZ plane perpendicular to the stacking direction in the Y direction. The thickness of the insulating layers 11 is not particularly limited, but is, for example, the same thickness. Note that, in the plurality of insulating layers 11, the interface between two adjacent insulating layers 11 may not be clear due to firing or the like. The thicknesses of the insulating layers 11 may be different. For example, the insulating layer 11 corresponding to the second side surface 14 and the insulating layer 11 corresponding to the first side surface 13 may be thicker or thinner than the other insulating layers 11.

[0018] The first external electrode 30 is L-shaped and extends from the first end face 15 to the bottom face 17. The first external electrode 30 has a first embedded portion 31 provided in the element body 10 and extending along the first end face 15, a second embedded portion 32 provided in the element body 10 and connected to the first embedded portion 31 and extending along the bottom face 17, and a first plating layer 33 located on the surface of the element body 10 and formed on the surfaces of the first and second embedded portions 31, 32.

[0019] The first and second embedded portions 31, 32 may be made of a conductive material such as Ag, Cu, or Au, and glass particles, or may be made of the same material as the coil 20.

[0020] The first plating layer 33 is provided on the first and second embedded portions 31, 32 and is L-shaped. The first plating layer 33 protrudes from the surface of the element body 10. Note that the first plating layer 33 may be partially or entirely embedded inside the element body 10.

[0021] The first plating layer 33 is formed by, for example, Ni, Sn, Au, Cu plating, or the like. For example, a Ni plating layer is provided on the first and second embedded portions 31, 32, and a Sn plating layer is provided on the Ni plating layer. As shown in FIG. 1 and FIG. 2, the height of the first plating layer 33 in the Z-axis direction at the first end surface 15 is greater than the height of the first embedded portion 31 in the Z-axis direction. The length of the first plating layer 33 in the X-axis direction at the bottom surface 17 is greater than the length of the second embedded portion 32 in the X-axis direction. The height of the first plating layer 33 in the Z-axis direction may be smaller than or the same as the height of the first embedded portion 31 in the Z-axis direction. The length of the first plating layer 33 in the X-axis direction may be smaller than or the same as the length of the second embedded portion 32 in the X-axis direction.

[0022] The second external electrode 40 has an L-shape extending from the second end face 16 to the bottom face 17. The second external electrode 40 has a first embedded portion 41 provided in the element body 10 and extending along the second end face 16, a second embedded portion 42 provided in the element body 10 and connected to the first embedded portion 41 and extending along the bottom face 17, and a second plating layer 43 located on the surface of the element body 10 and formed on the surfaces of the first and second embedded portions 41, 42.

[0023] The first and second embedded portions 41, 42 may be made of a conductive material such as Ag, Cu, or Au, and glass particles, or may be made of the same material as the coil 20.

[0024] The first plating layer 43 is provided on the first and second embedded portions 41, 42 and is L-shaped. The first plating layer 43 protrudes from the surface of the element body 10. Note that the first plating layer 43 may be partially or entirely embedded inside the element body 10. Note that the plating layer is a layer including a plating film.

[0025] The first plating layer 43 is formed by, for example, Ni, Sn, Au, Cu plating, or the like. For example, a Ni plating layer is provided on the first and second embedded portions 41, 42, and a Sn plating layer is provided on the Ni plating layer. As shown in FIG. 1 and FIG. 2, the height of the second plating layer 43 in the Z-axis direction at the second end surface 16 is greater than the height of the first embedded portion 41 in the Z-axis direction. At the bottom surface 17, the length of the second plating layer 43 in the X-axis direction is greater than the length of the second embedded portion 42 in the X-axis direction. The height of the second plating layer 43 in the Z-axis direction may be smaller than or the same as the height of the first embedded portion 41 in the Z-axis direction. The length of the second plating layer 43 in the X-axis direction may be smaller than or the same as the length of the second embedded portion 42 in the X-axis direction.

[0026] As shown in FIG. 3, the first and second embedded parts 31, 32 have a configuration in which a plurality of first external electrode conductor layers 35 embedded in the element body 10 are laminated in surface contact. The first and second embedded parts 41, 42 have a configuration in which a plurality of second external electrode conductor layers 45 embedded in the element body 10 are laminated in surface contact. The first external electrode conductor layer 35 extends along the first end face 15 and the bottom face 17, and the second external electrode conductor layer 45 extends along the second end face 16 and the bottom face 17. By providing the embedded parts 31, 32, 41, 42 in the element body 10, the inductor component 1 can be made smaller. In addition, the coil 20 and the embedded parts 31, 32, 41, 42 can be formed in the same process, and the variation in the positional relationship between the coil 20 and the first and second external electrodes 30, 40 can be reduced, thereby reducing the variation in the electrical characteristics of the inductor component 1. Note that a portion of the external electrode conductor layers 35 and 45 may be embedded in the element body 10, with the other portion being formed on the outer surface of the element body 10, or the entire external electrode conductor layers 35 and 45 may be formed on the outer surface of the element body 10. Also, the first and second plating layers 33, 43 are not shown in Fig. 3.

[0027] The coil 20 has an outer peripheral surface 20a on the inner diameter side, which is the axis AX side, and an outer peripheral surface 20b on the outer diameter side opposite the inner diameter. The axis AX of the coil 20 is parallel to the bottom surface 17 of the element body 10, and the coil has a helical structure wound while progressing along the axis so as to intersect the first side surface 13 and the second side surface 14 of the element body 10. The axis of the coil is parallel to the Y direction. The coil 20 contains Ag. Note that the coil 20 may contain a conductive material other than Ag (e.g., Cu, Au, etc.) or glass.

[0028] The coil 20 is formed in a substantially rectangular shape when viewed from the axis AX direction, but is not limited to this shape. The shape of the coil 20 may be, for example, a circle, an ellipse, a rectangle, or another polygon. The axial direction of the coil 20 refers to a direction parallel to the central axis of the spiral around which the coil 20 is wound. The axial direction of the coil 20 and the lamination direction of the insulating layer 11 are the same direction. In this application, "parallel" is not limited to a strict parallel relationship, and also includes a substantial parallel relationship taking into account the range of realistic variations.

[0029] The coil 20 has a winding portion 23, a first escape wiring 21 located between a first end of the winding portion 23 and the first external electrode 30, and a second escape wiring 22 located between a second end of the winding portion 23 and the second external electrode 40. In this embodiment, the winding portion 23 and the first and second escape wirings 21, 22 are integrated together and no clear boundary exists between them, but this is not limited thereto, and a boundary may exist between them by forming the winding portion and the escape wiring using different materials or different construction methods.

[0030] The winding portion 23 is wound in a spiral shape along the axis AX. In other words, the winding portion 23 refers to a portion where the coils 20 are wound in a spiral shape and overlap each other when viewed in a direction parallel to the axis AX. The first and second escape wirings 21 and 22 refer to portions that are not overlapped. The winding portion 23 is formed in a substantially rectangular shape when viewed in the direction of the axis AX, but is not limited to this shape. The shape of the winding portion 23 may be, for example, a circle, an ellipse, or another polygon.

[0031] 2 and 3, the winding portion 23 includes a plurality of coil wiring layers 201, 202, 203, and 204 each wound along a plane, and via wirings 601, 602, and 603 connecting the plurality of coil wiring layers 201, 202, 203, and 204. Note that the number of coil wiring layers and the number of via wirings are not limited to those described above.

[0032] The first to fourth coil wiring layers 201, 202, 203, 204 are sandwiched between insulating layers 11 and laminated in order along the axis AX direction (Y direction). That is, the lamination direction of the insulating layers 11 is the same as the axis AX direction.

[0033] The first to fourth coil wiring layers 201, 202, 203, and 204 are wound on a main surface (XZ plane) of the insulating layer 11 perpendicular to the axis AX direction. The number of turns of the coil wiring layers 201, 202, 203, and 204 is less than one turn, but may be one turn or more.

[0034] The first and fourth coil wiring layers 201, 204 have pads 24 connected to via wiring at one end thereof and at both ends of the second and third coil wiring layers 202, 203. The pads 24 protrude further inwardly of the coil 20 than the first to fourth coil wiring layers 201, 202, 203, 204 as viewed in the direction of the axis AX. As shown in FIG. 3, a part of the pads 24 does not protrude further outwardly of the coil 20 than the first to fourth coil wiring layers 201, 202, 203, 204 as viewed in the direction of the axis AX, and the pads 24 and the first to fourth coil wiring layers 201, 202, 203, 204 are substantially flush with each other at the outer tip of the coil 20. The pads 24 may protrude outwardly or may protrude both inwardly and outwardly.

[0035] The pad portion 24 is circular. The diameter of the pad portion 24 is larger than the wiring width of the first to fourth coil wiring layers 201, 202, 203, 204. The wiring width of the first to fourth coil wiring layers 201, 202, 203, 204 is a dimension in a width direction perpendicular to the extension direction of the first to fourth coil wiring layers 201, 202, 203, 204 as viewed from the axis AX direction. The above wiring width is an average value of the wiring width of the coil 20.

[0036] The first to third via wirings 601, 602, 603 penetrate the insulating layer 11 in the thickness direction (Y direction). The coil wiring layers adjacent in the stacking direction are electrically connected in series via the via wirings. Specifically, the first coil wiring layer 201 and the second coil wiring layer 202 are electrically connected via the first via wiring 601. The second coil wiring layer 202 and the third coil wiring layer 203 are electrically connected via the second via wiring 602. The third coil wiring layer 203 and the fourth coil wiring layer 204 are electrically connected via the third via wiring 603.

[0037] In this way, the multiple coil wiring layers 201, 202, 203, and 204 are electrically connected in series to each other to form a spiral. However, it is not necessary for all the coil wiring layers to be electrically connected in series, and some or all of the coil wiring layers may be electrically connected in parallel to each other.

[0038] The first escape wiring 21 is connected at one end to the first coil wiring layer 201, and at the other end to the first external electrode 30. The second escape wiring 22 is connected at one end to the fourth coil wiring layer 204, and at the other end to the second external electrode 40.

[0039] The first outgoing wiring 21 has a first connecting portion 211 connected to the winding portion 23, and a first curved portion 212 including a curved surface curved from the first connecting portion 211 toward the first embedded portion 31 side. The curved surface of the first curved portion 212 has a concave shape, and a length dimension L1 of a first contact surface between the first embedded portion 31 and the first outgoing wiring 21 of the first curved portion 212 is larger than a wiring width W1 of the first connecting portion 211. In a cross section perpendicular to the first end face 15 and the top face 18 and crossing the first curved portion 212, the length dimension L1 is larger than a height dimension D1 in a direction perpendicular to the first contact surface of the first embedded portion 31. The concave shape is a shape concave toward the first curved portion 212 side, and is, for example, a shape having a fillet or a part of an ellipse. In other words, the first curved portion 212 has a concave shape from the first curved portion 212 toward the element body 10 side. Moreover, the wiring width W1 of the first connection portion 211 is the same as the wiring width of the winding portion 23. Moreover, in this embodiment, the length dimension refers to the maximum value of the dimension in the lateral direction (Z direction) of the first adhesive surface between the first embedded portion 31 and the first curved portion 212. The wiring width W1 of the connection portion means the width between the wirings in the first connection portion 211. In this specification, the part of the first extraction wiring 21 that contacts the first embedded portion 31 and has a concave curved surface is referred to as the first curved portion 212, and the part that connects the first curved portion and the winding portion 23 and has a certain wiring width W1 is referred to as the first connection portion 211. Moreover, the length of the first connection portion 211 along the extension direction is not particularly specified, and may be shorter or longer than the wiring width W1.

[0040] In conventional inductor components, attempts have been made to reduce the wiring width of the lead wiring and the height of the external electrodes. However, in the above configuration, the current density per unit area of ​​the plating layer may become high. In such a case, if the plating layer has, for example, a Ni plating layer and a Sn plating layer, electromigration occurs in the plating layer, and Ni diffuses into the Sn plating layer. As a result, the Ni plating layer disappears, the Sn plating layer comes into contact with the embedded portion, and atoms (e.g., Ag) contained in the embedded portion diffuse into the Sn plating layer (Ag is eaten by Sn). In such a case, the current becomes even more difficult to flow, the direct current resistance (Rdc) increases, and as a result, heat is generated and the risk of disconnection increases.

[0041] In contrast, in the present disclosure, the length dimension L1 of the first contact surface between the first curved portion 212 and the first embedded portion 31 is larger than the wiring width W1 of the first connection portion 211, and the length dimension L1 is larger than the height dimension D1 of the first embedded portion 31. Therefore, even if the height dimension D1 of the first embedded portion 31 is small, the area of ​​the first contact surface between the first curved portion 212 and the first embedded portion 31 can be increased to reduce the amount of current flowing per unit area, and heat can be dissipated in the first lead wiring 21. As a result, the temperature rise at the first contact surface can be suppressed, and electromigration can be suppressed. For example, when the first plating layer 33 includes a Ni plating layer and a Sn plating layer, even if the height dimension D1 of the first embedded portion 31 is reduced, the Ni plating layer can be suppressed from disappearing. As a result, the Sn plating layer can be prevented from contacting the first embedded portion 31, and the diffusion of atoms contained in the first embedded portion 31 can be reduced. Moreover, by reducing the wiring width W1, the overlapping portion of the first lead wiring 21 and the winding portion 23 can be reduced as viewed from the extending direction of the axis AX, and the magnetic flux is not blocked, so that inductance can be obtained efficiently. Furthermore, by reducing the wiring width W1 and increasing the length dimension L1, the residual stress generated in the first lead wiring 21 can be kept as low as possible, and cracks can be suppressed. In this embodiment, the height dimension refers to the dimension in the direction perpendicular to the first adhesive surface (height direction) as viewed from the first adhesive surface between the first embedded portion 31 and the first curved portion 212. Furthermore, when the first adhesive surface is not clear, the portion where the multiple external electrode conductor layers 35 overlap each other as viewed from the direction parallel to the axis AX may be the first embedded portion 31, and the boundary between the first embedded portion 31 and the first curved portion 212 may be the first adhesive surface.

[0042] Preferably, the surface of the first curved portion 212 is smoothly curved. That is, the first curved portion 212 has no corners. If the first curved portion 212 has corners, current will concentrate at the corners and it will be impossible to obtain a high frequency Q value. In contrast, by having a curved shape, there will be no corners where current will concentrate and it will be possible to obtain a high frequency Q value.

[0043] Preferably, in the first escape wiring 21, when projected onto the second side surface 14 along the axis AX direction, the maximum height dimension D2 of the first curved portion 212 in a direction parallel to the height dimension D1 of the embedded portion is greater than the height dimension D1 of the first embedded portion 31. With the above configuration, the surface area of ​​the first escape wiring 21 is increased, and heat can be dissipated more effectively in the first escape wiring 21.

[0044] Preferably, in a cross section perpendicular to the first end surface 15 and the top surface 18, the increase rate of the wiring width of the first curved portion 212 increases from the contact surface between the first connecting portion 211 and the first curved portion 212 to the contact surface between the first embedded portion 31 and the first curved portion 212. That is, the wiring width of the first curved portion 212 is larger than the wiring width W1 of the first connecting portion 211, and has the largest length dimension L1 at the first contact surface between the first curved portion 212 and the first embedded portion 31. With the above configuration, the area of ​​the first contact surface between the first curved portion 212 and the first embedded portion 31 is increased, and the amount of current flowing per unit area can be reduced. The increase rate refers to the increase in the wiring width per unit length along the extension direction of the first curved portion 212 increasing as it approaches the first embedded portion 31. Furthermore, when measuring the wiring width of the first curved portion 212, if a part of the wiring width overlaps with the first embedded portion 31, that part is not included in the wiring width.

[0045] Preferably, when projected onto the second side surface 14 along the axis AX direction, a first contact a1 having a maximum height dimension D2 of the first curved portion 212, a second contact a2 having a height dimension D3 that is half the height dimension D2, which is the maximum value of the height dimension of the first curved portion 212, and a third contact a3 where the surface of the first curved portion 212 and the first embedded portion 31 come into contact are provided in this order on the first contact surface between the first embedded portion 31 and the first curved portion 212. That is, the first contact a1, the second contact a2, and the third contact a3 are arranged in the reverse Z direction. At this time, the length dimension L3 along the contact surface between the first embedded portion 31 and the first curved portion 212 from the second contact a2 to the third contact a3 is greater than the length dimension L2 along the contact surface between the first embedded portion 31 and the first curved portion 212 from the first contact a1 to the second contact a2. With the above configuration, the area of ​​the first contact surface is increased, the amount of current flowing per unit area can be reduced, and the temperature rise in the first contact surface can be suppressed. The first contact a1, the second contact a2, and the third contact a3 may be aligned in the Z direction.

[0046] Preferably, the length dimension L1 of the first contact surface between the first curved portion 212 and the first embedded portion 31 is 10 μm or more. With the above configuration, the area of ​​the first contact surface is increased, and the amount of current flowing per unit area can be reduced. In addition, the surface area of ​​the first curved portion 212 is increased, and heat generated in the first curved portion 212 can be dissipated. The upper limit of the length dimension L1 is not particularly limited, but may be, for example, 80 μm when the length dimension L of the first embedded portion 31 is 121 μm. In addition, the upper limit of the length dimension L1 is not particularly limited, but may be, for example, 2 / 3 or less of the length dimension L of the first embedded portion 31.

[0047] Preferably, when projected onto the second side surface 14 along the axis AX direction, the ratio of the length dimension L1 of the first contact surface to the length dimension L of the first embedded portion 31 is 1 / 8 or more and 2 / 3 or less. The length dimension L refers to the length of the portion of the first embedded portion 31 exposed to the surface of the element body 10 as viewed from the axis AX direction, and the length dimension L1 refers to the length of the contact surface between the first embedded portion 31 and the first curved portion 212 as viewed from the axis AX direction. When the ratio is 1 / 8 or more, the area of ​​the first contact surface is increased, and the amount of current flowing per unit area can be reduced. When the ratio is 2 / 3 or less, the distance between the winding portion 23 and the first curved portion 212 can be kept appropriate, and stray capacitance can be suppressed. In addition, the first curved portion 212 and the winding portion 23 can be isolated from each other, and the risk of a short circuit between the first curved portion 212 and the winding portion 23 can be reduced. Furthermore, residual stress can be appropriately suppressed, and the occurrence of cracks occurring between the first embedded portion 31 and the first curved portion 212 can be suppressed. If the above ratio is too small, the risk of disconnection due to migration increases. If the above ratio is too large, the distance between the winding portion 23 and the first outgoing wiring 21 becomes short, and the stray capacitance increases. Also, the first curved portion 212 and the winding portion 23 become close to each other, and the risk of short circuit increases. Furthermore, the residual stress increases, and the risk of cracking increases. Note that exposed means being on the surface of the element body 10, and may be completely exposed to the outside without overlapping with other layers or parts, or other layers or parts may overlap the exposed part.

[0048] Preferably, at least one of the first external electrode 30 and the second external electrode 40 further has a first plating layer 33 covering at least a part of the portion of the first embedded portion 31 exposed on the surface of the element body 10, and the first plating layer 33 contains different metal atoms than the first embedded portion 31 and the first escape wiring 21. Specifically, the first plating layer 33 contains Ni, and the first embedded portion 31 and the first escape wiring 21 do not contain Ni. Even in the case of the above configuration, electromigration is less likely to occur in the first external electrode 30.

[0049] Preferably, when the element body 10 and the coil 20 are projected onto the second side surface 14 along the axis AX direction of the coil 20, the outer peripheral surface 20a on the inner diameter side of the first curved portion 212 has a curved surface. By having the above-mentioned aspect, the first curved portion 212 has a smoother surface. If the first curved portion 212 had corners, current would be likely to concentrate at the corners, but by having a smooth surface, current concentration is unlikely to occur.

[0050] In one embodiment, when the element body 10 and the coil 20 are projected onto the second side surface 14 along the axis AX direction of the coil 20, the outer peripheral surface 20a on the inner diameter side of the first curved portion 212 describes a fillet shape from the first connecting portion 211 side of the first curved portion 212 to the first embedded portion 31, and the fillet radius of the fillet shape is 10 μm or more. The fillet radius is preferably 30 μm or more, and more preferably 100 μm or more. The fillet radius is, for example, 300 μm or less. If the fillet radius becomes too large, the distance between the first curved portion 212 and the winding portion 23 becomes small, and the first curved portion 212 and the winding portion 23 may come into contact with each other, causing a short circuit.

[0051] Preferably, when element body 10 and coil 20 are projected onto second side surface 14 along the axis AX direction of coil 20, first curved portion 212 forms a fillet shape on outer peripheral surface 20a on the inner diameter side of coil 20. In this embodiment, in inductor component 1 having an L-shaped electrode, by providing the fillet shape of first curved portion 212 on the outer peripheral surface 2a side on the inner diameter side, it is possible to improve adhesion between first curved portion 212 and first embedded portion 31.

[0052] Preferably, the height dimension D1 of the first embedded portion 31 is 20 μm or less. The lower limit of the height dimension D1 of the first embedded portion 31 is not particularly limited, but is, for example, 10 μm. From the viewpoint of expanding the coil arrangement area, it is preferable that the value of the height dimension D1 of the first embedded portion 31 is small. If the value of the height dimension D1 of the first embedded portion 31 is too small, current concentration becomes severe.

[0053] Preferably, the height dimension D4 of the first plating layer 33 in a direction parallel to the first height dimension D1 is 10 μm or less. By having the above configuration, the DC resistance can be reduced and the Q value is improved. The height dimension D4 of the first plating layer 33 is preferably 8 μm or less. The lower limit of the height dimension D4 is not particularly limited, but is, for example, 1.5 μm. Note that the height dimension D1 and the height dimension D4 are both dimensions in the X-axis direction as shown in FIG. 2, and the sum of the height dimension D1 and the height dimension D4 is the height dimension of the first embedded portion 31 and the first plating layer 33.

[0054] Although the first escape wiring 21 and the first external electrode 30 have been described above, the second escape wiring 22 and the second external electrode 40 may also have a similar configuration.

[0055] (Manufacturing method of inductor component 1) Next, a description will be given of an example of a method for manufacturing the inductor component 1. Note that the method for manufacturing the inductor component 1 is not limited to the following method, and another manufacturing method may be used.

[0056] First, prepare an insulating paste mainly composed of borosilicate glass and a conductive paste mainly composed of Ag. The insulating paste becomes an insulating layer after firing, which will be described later. The conductive paste becomes a coil wiring layer, an extraction wiring, a via wiring, or a buried portion depending on the position where it is applied after firing, which will be described later.

[0057] Next, an insulating paste is applied by screen printing to form the portion that will become the insulating layer. A required amount of conductive paste is applied by screen printing onto the applied insulating paste, and the coil wiring layer, lead wiring, and embedded portion are formed by a patterning process using a photolithography method.

[0058] Next, a required amount of insulating paste is applied by screen printing onto the insulating paste that has been applied and patterned with the conductive paste, and openings are then formed in the insulating paste by a patterning process using a photolithography method.

[0059] Next, a required amount of conductive paste is applied by screen printing onto the insulating paste with the openings. At this time, the openings are filled with the conductive paste to form the via wiring and the embedded portion. In addition, similar to the above, a patterning process using a photolithography method is performed to form the coil wiring layer, the lead wiring, and the embedded portion.

[0060] Next, the unsintered laminate is sintered under predetermined conditions to obtain a coil wiring layer, lead wiring, via wiring, and embedded portion from the conductive paste, and an insulating layer from the insulating paste.

[0061] The element body is then subjected to barrel processing, and then a plating layer is formed by barrel plating on the portion where the embedded portion is exposed from the element body, forming Ni plating having a thickness of 2 μm to 10 μm and Sn plating having a thickness of 2 μm to 10 μm. Through the above steps, the inductor component 1 is completed.

[0062] In the above, the unsintered laminate was sintered, but instead, the mother laminate may be sintered after providing through holes, and then the through holes may be filled with magnetic paste to form the internal magnetic members. In this case, after filling with the magnetic paste, the laminate is cut by dancing or the like. In this case, the magnetic paste can be thermally cured to form the internal magnetic members and the external magnetic members.

[0063] <Second embodiment> Fig. 4 is a see-through front view of inductor component 1A of the second embodiment as seen from the first side surface side. Fig. 5 is an exploded view of inductor component 1A of the second embodiment. Inductor component 1A differs from inductor component 1 of the first embodiment in the shape of coil 20. This difference will be described below. The other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are used, and description thereof will be omitted.

[0064] The coil 20A has a winding portion 23A, a first escape wiring 21A located between a first end of the winding portion 23A and the first external electrode 30, and a second escape wiring 22A located between a second end of the winding portion 23A and the second external electrode 40. Note that plating layers are not shown in Figures 4 and 5. The coil 20A is formed from the same material as the coil 20.

[0065] The winding portion 23A is formed in an elliptical shape when viewed from the axis AX direction. Since the winding portion 23A is elliptical, firing residual stress is unlikely to occur and current concentration is unlikely to occur. Note that the winding portion 23A may have a shape other than an ellipse.

[0066] The winding portion 23A includes a plurality of coil wiring layers 201A, 202A each wound along a plane, and a longitudinal via wiring 601A connecting the plurality of coil wiring layers 201A, 202A. By connecting the coil wiring layers through the longitudinal via wiring, the coil 20A can be formed more stably. The number of coil wiring layers and the number of via wirings are not limited to the above. The via wirings may have a shape other than the longitudinal via wiring, and may be circular or rectangular. The end of the coil wiring layer connected to the circular via wiring forms a circular pad portion, and the diameter of the circular pad portion is larger than the line width of the middle portion of the coil wiring layer. Also, the coil wiring layer may have via wirings of different shapes.

[0067] <Third embodiment> Fig. 6 is a see-through front view of inductor component 1B of the third embodiment as seen from the first side surface side. Fig. 7 is an exploded view of inductor component 1B of the third embodiment. Inductor component 1B differs from inductor component 1 of the first embodiment in external electrodes 30B, 40B and coil 20B. These differences will be described below. The other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are used, and description thereof will be omitted.

[0068] As shown in Figs. 6 to 7, the inductor component 1B has an element body 10, a coil 20B provided on the element body 10, and a first external electrode 30B and a second external electrode 40B provided on the element body 10 and electrically connected to the coil 20B. The coil 20B has a winding portion 23B, a first lead wiring 21B connected between a first end of the winding portion 23B and the first external electrode 30B, and a second lead wiring 22B connected between a second end of the winding portion 23B and the second external electrode 40B. The coil 20B is formed with a similar configuration to the coil 20. Note that plating layers are not shown in Figs. 6 and 7.

[0069] The first external electrode 30B is a bottom electrode provided on the bottom surface 17, and has a first embedded portion 31B and a plating layer formed on the surface of the first embedded portion 31B. The second external electrode 40B is a bottom electrode provided on the bottom surface 17, and has a first embedded portion 41B and a plating layer formed on the surface of the first embedded portion 41B. With the above configuration, the floating capacitance between the external electrode and the coil is reduced, thereby improving the high-frequency characteristics. The first external electrode 30B has a configuration in which a plurality of first external electrode conductor layers 35B embedded in the element body 10 are stacked in surface contact, and the second external electrode 40B has a configuration in which a plurality of second external electrode conductor layers 45B embedded in the element body 10 are stacked in surface contact. The first external electrode 30B and the second external electrode 40B are formed from the same material as in the first embodiment.

[0070] The coil 20B has a winding portion 23B, a first escape wiring 21B connected between a first end of the winding portion 23B and a first external electrode 30B, and a second escape wiring 22B connected between a second end of the winding portion 23B and a second external electrode 40B. The coil 20B is made of the same material as the coil 20.

[0071] The winding portion 23B includes a plurality of coil wiring layers 201B, 202B, 203B, and 204B each wound along a plane, and via wirings 601B, 602B, and 603B connecting the plurality of coil wiring layers 201B, 202B, 203B, and 204B. Note that the number of coil wiring layers and the number of via wirings are not limited to the above.

[0072] The first to fourth coil wiring layers 201B, 202B, 203B, 204B are made of the same material as the coil wiring layers in the first embodiment, and are provided in the same manner as in the first embodiment.

[0073] The first to third via wirings 601B, 602B, 603B are provided on the bottom surface 17 side of the axis AX. Unlike the first embodiment, in the third embodiment, the first to third via wirings 601B, 602B, 603B are not provided at the corners of the coil wiring layer. When the first embedded portion 31B and the first embedded portion 41B are provided, the via wirings 601B, 602B, 603B are not provided at the corners of the coil wiring layer, so that the distance from the end face of the element body 10 is increased, thereby reducing the risk of via disconnection due to cracks caused by external force.

[0074] The pad portion 24 protrudes inward of the coil 20B from the first to fourth coil wiring layers 201B, 202B, 203B, and 204B when viewed from the axis AX direction. As shown in Fig. 6, the pad portion 24 does not protrude outward from the coil 20B from the first to fourth coil wiring layers 201B, 202B, 203B, and 204B when viewed from the axis AX direction, and the pad portion 24 and the first to fourth coil wiring layers 201B, 202B, 203B, and 204B are substantially flush with each other at the outer tip of the coil 20B. With the above configuration, it is possible to suppress an increase in stray capacitance between the via wirings 601B, 602B, and 603B and the first external electrode 30B and the second external electrode 40B.

[0075] The first lead wiring 21B is connected at one end to the first coil wiring layer 201B and at the other end to the first external electrode 30B. The first lead wiring 21B has a first connection portion 211B connected to the winding portion 23B and a first curved portion 212B including a curved surface curved from the first connection portion 211B toward the first embedded portion 31B. The curved surface of the first curved portion 212B has a concave shape, and a length dimension L1 of a first contact surface between the first embedded portion 31B of the first curved portion 212B and the first lead wiring 21 is larger than the wiring width W1 of the first connection portion 211. When projected onto the second side surface 14 along the axis AX, the length dimension L1 is larger than a height dimension D1 in a direction perpendicular to the first contact surface of the first embedded portion 31. In this embodiment, the length dimension refers to the maximum value of the dimension in the lateral direction (X direction) of the first adhesive surface between the first embedded portion 31B and the first curved portion 212B.

[0076] The second lead wiring 22B has one end connected to the fourth coil wiring layer 204B and the other end connected to the second external electrode 40B. The second lead wiring 22B has a connection portion connected to the winding portion 23B and a curved portion including a curved surface that curves from the connection portion toward the first embedded portion. The curved surface of the curved portion has a concave shape, and a length dimension L1 of a contact surface between the curved portion, the first embedded portion 41B, and the lead wiring is larger than the wiring width W1 of the connection portion.

[0077] Preferably, the surface of the first curved portion 212B is smoothly curved. That is, the first curved portion 212B does not have corners. By having a curved shape, it is possible to obtain a high frequency Q value without having corners where current concentration occurs.

[0078] Preferably, when projected onto the second side surface 14 along the axis AX direction, the maximum height dimension D2 of the first curved portion 212B is greater than the height dimension D1 of the first embedded portion 31B. With the above configuration, the surface area of ​​the first escape wiring 21B is increased, and heat can be more effectively dissipated in the first escape wiring 21B.

[0079] Preferably, in a cross section perpendicular to the first end surface 15 and the top surface 18, the increase rate of the wiring width of the first curved portion 212B increases from the contact surface between the first connecting portion 211B and the first curved portion 212B to the contact surface between the first embedded portion 31B and the first curved portion 212B. That is, the wiring width of the first curved portion 212B is larger than the wiring width W1 of the first connecting portion 211B, and has the largest length dimension L1 at the first contact surface between the first curved portion 212B and the first embedded portion 31B. By having the above configuration, the area of ​​the first contact surface between the first curved portion 212B and the first embedded portion 31B is increased, and the amount of current flowing per unit area can be reduced. The increase rate means that the increase amount of the wiring width per unit length along the extension direction of the first curved portion 212B increases as it approaches the first embedded portion 31B.

[0080] Preferably, the length dimension L1 of the first contact surface between the first curved portion 212B and the first embedded portion 31B is 10 μm or more. With the above configuration, the area of ​​the first contact surface is increased, and the amount of current flowing per unit area can be reduced. In addition, the surface area of ​​the first curved portion 212B is increased, and heat generated in the first curved portion 212B can be dissipated. The upper limit of the length dimension L1 is not particularly limited, but is, for example, 80 μm when the length dimension L of the first embedded portion 31 is 121 μm. In addition, the upper limit of the length dimension L1 is not particularly limited, but is, for example, 2 / 3 or less of the length dimension L of the first embedded portion 31 (i.e., L1 / L).

[0081] Preferably, when projected onto the second side surface 14 along the axis AX, the ratio of the length dimension L1 of the first contact surface to the length dimension L of the first embedded portion 31B is 1 / 8 or more and 2 / 3 or less. When the ratio is 1 / 8 or more, the area of ​​the first contact surface is increased, and the amount of current flowing per unit area can be reduced. When the ratio is 2 / 3 or less, the distance between the winding portion 23B and the first curved portion 212B can be appropriately maintained, and stray capacitance can be suppressed. In addition, the first curved portion 212B and the winding portion 23B can be isolated, and the risk of a short circuit between the first curved portion 212B and the winding portion 23B can be reduced. Furthermore, residual stress can be appropriately suppressed, and the occurrence of cracks occurring between the first embedded portion 31B and the first curved portion 212B can be suppressed. If the ratio is too small, the risk of disconnection due to migration increases. If the ratio is too large, the distance between the winding portion 23B and the first escape wiring 21B becomes short, increasing the stray capacitance. Also, the first curved portion 212B and the winding portion 23B become close, increasing the risk of short circuit. Furthermore, the residual stress becomes large, increasing the risk of cracking.

[0082] Preferably, at least one of the first external electrode 30B and the second external electrode 40B further has a first plating layer (not shown) covering at least a part of the portion of the first embedded portion 31B exposed on the surface of the element body 10, and the first plating layer contains different metal atoms than the first embedded portion 31B and the first escape wiring 21B. Specifically, the first plating layer contains Ni, and the first embedded portion 31B and the first escape wiring 21B do not contain Ni. Even in the case of the above configuration, electromigration is less likely to occur in the first external electrode 30B.

[0083] Preferably, when the element body 10 and the coil 20B are projected onto the second side surface 14 along the axis AX direction of the coil 20B, the outer peripheral surface 20aB on the inner diameter side of the first curved portion 212B has a curved surface. With the above-mentioned embodiment, the first curved portion 212B has a smoother surface. If the first curved portion 212B had corners, current would be likely to concentrate at the corners, but with a smooth surface, current concentration is unlikely to occur.

[0084] In one embodiment, when the element body 10 and the coil 20B are projected onto the second side surface 14 along the axis AX direction of the coil 20B, the outer peripheral surface 20aB on the inner diameter side of the first curved portion 212B describes a fillet shape from the first connecting portion 211B side of the first curved portion 212B to the first embedded portion 31B, and the fillet radius of the fillet shape is 10 μm or more. The fillet radius is preferably 30 μm or more, and more preferably 100 μm or more. The fillet radius is, for example, 300 μm or less. If the fillet radius becomes too large, the distance between the first curved portion 212B and the winding portion 23B becomes small, and the first curved portion 212B and the winding portion 23B may come into contact with each other, causing a short circuit.

[0085] Preferably, the height dimension of the first plating layer in a direction parallel to the height dimension D1 is 10 μm or less. By having the above configuration, the DC resistance can be reduced and the Q value is improved. The height dimension of the first plating layer is preferably 8 μm or less. The lower limit of the height dimension of the first plating layer is not particularly limited, but is, for example, 1.5 μm.

[0086] Preferably, the coil 20B has an outer peripheral surface 20aB on the inner diameter side and an outer peripheral surface 20bB on the outer diameter side opposite to the inner diameter, and when the element body 10 and the coil 20B are projected onto the second side surface 14 along the axis AX direction of the coil 20B, both the outer peripheral surface 20aB on the inner diameter side and the outer peripheral surface 20bB on the outer diameter side of the first curved portion 212B have curved surfaces. By having the above-mentioned aspect, the first curved portion 212B has a smoother surface. If the first curved portion 212B has a corner, current tends to concentrate at the corner, but by having a smooth surface, current concentration is unlikely to occur. Note that only the outer peripheral surface 20aB on the inner diameter side may have a curved surface, or only the outer peripheral surface 20bB on the outer diameter side may have a curved surface. In addition, the outer peripheral surface 20aB on the inner diameter side and the outer peripheral surface 20bB on the outer diameter side may have curved surfaces of different shapes.

[0087] Preferably, coil 20B has an outer peripheral surface 20aB on the inner diameter side and an outer peripheral surface 20bB on the outer diameter side opposite to the inner diameter, and when element body 10 and coil 20B are projected onto second side surface 14 along axis AX of coil 20B, both outer peripheral surface 20aB on the inner diameter side and outer peripheral surface 20bB on the outer diameter side of first curved portion 212B form a fillet shape. In this embodiment, in inductor component 1B having a bottom electrode, by providing a fillet shape on outer peripheral surface 20aA on the inner diameter side and on outer peripheral surface 20aB on the outer diameter side, it is possible to improve adhesion between first curved portion 212B and first embedded portion 31B.

[0088] Although the first escape wiring 21B and the first external electrode 30B have been described above, the second escape wiring 22B and the second external electrode 40B may also have a similar configuration.

[0089] <Fourth embodiment> FIG. 8 is a perspective front view of the inductor component 1C of the fourth embodiment as viewed from the top surface side. FIGS. 9A to 9C are exploded views of the inductor component 1C of the fourth embodiment. The dotted line at the bottom right of FIG. 9A is connected to the dotted line at the top left of FIG. 9B, and the dotted line at the bottom right of FIG. 9B is connected to the dotted line at the top of FIG. 9C. In the first embodiment, the axis of the coil is provided perpendicular to the first side surface 13 and the second side surface 14, but in this embodiment, the axis of the coil is provided perpendicular to the top surface and the bottom surface. In addition, the first external electrode 30 and the second external electrode 40 are L-shaped electrodes in the first embodiment, but are end surface electrodes provided on the first end surface 15 and the second end surface 16 in the fourth embodiment. The differences will be described below. The other configurations are the same as those in the first embodiment, and the same reference numerals as those in the first embodiment are used, and the description thereof will be omitted.

[0090] As shown in Figures 8 to 9C, the inductor component 1C has an element body 10, a coil 20C provided on the element body 10, and a first external electrode 30C and a second external electrode 40C provided on the element body 10 and electrically connected to the coil 20C.

[0091] The first external electrode 30C is an end surface electrode provided on the first end surface 15. The first external electrode 30C has a first embedded portion 31C provided in the element body and extending along the first end surface 15, and a first plating layer located on the surface of the element body 10 and formed on the surface of the first embedded portion 31C. The second external electrode 40C is an end surface electrode provided on the second end surface 16. The second external electrode 40C has a first embedded portion 41C provided in the element body and extending along the second end surface 16, and a first plating layer located on the surface of the element body 10 and formed on the surface of the first embedded portion 41C. With the above configuration, the influence of magnetic coupling between adjacent components is reduced, and the design freedom of component arrangement is increased. The first and second external electrodes 30C, 40C are formed from the same material as the external electrodes of the first embodiment. The first and second external electrodes 30C, 40C may have other forms. Additionally, plating layers are not shown in FIGS. 8, 9A, 9B and 9C.

[0092] 9A, 9B and 9C, the first embedded portion 31C has a configuration in which a plurality of first external electrode conductor layers 35C embedded in the element body 10 are stacked in surface contact. The first embedded portion 41C has a configuration in which a plurality of second external electrode conductor layers 45C embedded in the element body 10 are stacked in surface contact. The first external electrode conductor layer 35C extends along the first end face 15, and the second external electrode conductor layer 45C extends along the second end face 16.

[0093] The coil 20C has a winding portion 23C, a first escape wiring 21C connected between a first end of the winding portion 23C and a first external electrode 30C, and a second escape wiring 22C connected between a second end of the winding portion 23C and a second external electrode 40C. The coil 20C is formed with a similar configuration to the coil 20.

[0094] 8, 9A, 9B, and 9C, the winding portion 23C is parallel to the first end face 15 and is wound in a spiral shape along the direction of an axis AX1 that intersects the top face 18 and the bottom face 17. In other words, the axis AX1 is perpendicular to the top face 18 and the bottom face 17.

[0095] The winding portion 23C includes a plurality of coil wiring layers 201D, 202D, 203D, 204D, 205D, 206D, 207D, 208D, 209D, 210D, 211D, and 212D each wound along a plane, and via wirings 601C, 602C, 603C, 604C, 605C, 606C, 607C, 608C, 609C, 610C, and 611C connecting the plurality of coil wiring layers. Note that the number of coil wiring layers and the number of via wirings are not limited to the above.

[0096] The first to twelfth coil wiring layers 201D, 202D, 203D, 204D, 205D, 206D, 207D, 208D, 209D, 210D, 211D, and 212D are sandwiched between insulating layers 11 and stacked in order along the axis AX1 (Z direction). The first to twelfth coil wiring layers 201D, 202D, 203D, 204D, 205D, 206D, 207D, 208D, 209D, 210D, 211D, and 212D are made of the same material as the coil wiring layers of the first embodiment.

[0097] The first to eleventh via wirings 601C, 602C, 603C, 604C, 605C, 606C, 607C, 608C, 609C, 610C, and 611C penetrate the insulating layer 11 in the height direction (Z direction). The coil wiring layers adjacent to each other in the stacking direction are electrically connected in series via the via wirings. Specifically, the first coil wiring layer 201D and the second coil wiring layer 202D are electrically connected via the first via wiring 601C. The second coil wiring layer 202D and the third coil wiring layer 203D are electrically connected via the second via wiring 602C. The third coil wiring layer 203D and the fourth coil wiring layer 204D are electrically connected via the third via wiring 603C. The fourth coil wiring layer 204D and the fifth coil wiring layer 205D are electrically connected via the fourth via wiring 604C. The fifth coil wiring layer 205D and the sixth coil wiring layer 206D are electrically connected via the fifth via wiring 605C. The sixth coil wiring layer 206D and the seventh coil wiring layer 207D are electrically connected via the sixth via wiring 606C. The seventh coil wiring layer 207D and the eighth coil wiring layer 208D are electrically connected via the seventh via wiring 607C. The eighth coil wiring layer 208D and the ninth coil wiring layer 209D are electrically connected via the eighth via wiring 608C. The ninth coil wiring layer 209D and the tenth coil wiring layer 210D are electrically connected via the ninth via wiring 609C. The tenth coil wiring layer 210D and the eleventh coil wiring layer 211D are electrically connected via the tenth via wiring 610C. The eleventh coil wiring layer 211D and the twelfth coil wiring layer 212D are electrically connected via the eleventh via wiring 611C.

[0098] The first to eleventh via wirings 601C, 602C, 603C, 604C, 605C, 606C, 607C, 608C, 609C, 610C, and 611C are made of the same material as the coil wiring layer of the first embodiment.

[0099] The first lead wiring 21C is connected at one end to the first coil wiring layer 201D and at the other end to the first external electrode 30C. The first lead wiring 21C has a first connection portion 211C connected to the winding portion 23C and a first curved portion 212C including a curved surface curved from the first connection portion 211C toward the first embedded portion 31C. The curved surface of the first curved portion 212C has a concave shape, and a length dimension L1 of a first contact surface between the first embedded portion 31C of the first curved portion 212C and the first lead wiring 21C is larger than the wiring width W1 of the first connection portion 211C. When projected onto the bottom surface 17 along the axis AX1, the length dimension L1 is larger than a height dimension D1 in a direction perpendicular to the first contact surface of the first embedded portion 31C. In this embodiment, the length dimension refers to the dimension from the second side surface 14 to the first side surface 13. That is, the length dimension refers to the size in the Y-axis direction. The height dimension refers to the dimension from first end face 15 to second end face 16. That is, the height dimension refers to the size in the X-axis direction.

[0100] The second lead wiring 22C has one end connected to the twelfth coil wiring layer 212D and the other end connected to the second external electrode 40C. The second lead wiring 22C has a connection portion connected to the winding portion 23C and a curved portion including a curved surface that curves from the connection portion toward the first embedded portion. The curved surface of the curved portion has a concave shape, and a length dimension L1 of a contact surface between the curved portion, the first embedded portion 41C, and the lead wiring is larger than the wiring width W1 of the connection portion.

[0101] Preferably, the surface of the first curved portion 212C is smoothly curved. That is, the first curved portion 212C does not have corners. By having a curved shape, it is possible to obtain a high frequency Q value without having corners where current concentration occurs.

[0102] Preferably, a maximum height dimension D2 of the first curved portion 212C is larger than a height dimension D1 of the first embedded portion 31C when projected onto the bottom surface 17 along the axis AX1 direction. With the above configuration, the surface area of ​​the first escape wiring 21C is increased, and heat can be more effectively dissipated in the first escape wiring 21C.

[0103] Preferably, when projected onto the bottom surface 17 along the axis AX1 direction, the increase rate of the wiring width of the first curved portion 212C increases from the contact surface between the first connecting portion 211C and the first curved portion 212C to the contact surface between the first embedded portion 31C and the first curved portion 212C. That is, the wiring width of the first curved portion 212C is larger than the wiring width W1 of the first connecting portion 211C, and has the largest length dimension L1 at the first contact surface between the first curved portion 212C and the first embedded portion 31C. By having the above configuration, the area of ​​the first contact surface between the first curved portion 212C and the first embedded portion 31C is increased, and the amount of current flowing per unit area can be reduced. The increase rate refers to the increase in the wiring width per unit length along the extension direction of the first curved portion 212C increasing as it approaches the first embedded portion 31C.

[0104] Preferably, the length dimension L1 of the first contact surface between the first curved portion 212C and the first embedded portion 31C is 10 μm or more. With the above configuration, the area of ​​the first contact surface is increased, and the amount of current flowing per unit area can be reduced. In addition, the surface area of ​​the first curved portion 212C is increased, and heat generated in the first curved portion 212C can be dissipated. The upper limit of the length dimension L1 is not particularly limited, but may be, for example, 70 μm. In addition, the upper limit of the length dimension L1 is not particularly limited, but may be, for example, 1 / 2 or less of the length dimension L of the first embedded portion 31.

[0105] Preferably, when projected onto the bottom surface 17 along the axis AX direction, the ratio of the length dimension L1 of the first contact surface to the length dimension L of the first embedded portion 31C is 1 / 8 or more and 2 / 3 or less. When the ratio is 1 / 8 or more, the area of ​​the first contact surface is increased, and the amount of current flowing per unit area can be reduced. When the ratio is 2 / 3 or less, the distance between the winding portion 23C and the first curved portion 212C can be appropriately maintained, and stray capacitance can be suppressed. In addition, the first curved portion 212C and the winding portion 23C can be isolated, and the risk of a short circuit between the first curved portion 212C and the winding portion 23C can be reduced. Furthermore, residual stress can be appropriately suppressed, and the occurrence of cracks occurring between the first embedded portion 31C and the first curved portion 212C can be suppressed. If the ratio is too small, the risk of disconnection due to migration increases. If the ratio is too large, the distance between the winding portion 23C and the first escape wiring 21C becomes short, increasing the stray capacitance, and the first curved portion 212C and the winding portion 23C become close to each other, increasing the risk of short circuiting. Furthermore, the residual stress increases, increasing the risk of cracking.

[0106] Preferably, at least one of the first external electrode 30C and the second external electrode 40C further has a first plating layer (not shown) covering at least a part of the portion of the first embedded portion 31C exposed on the surface of the element body 10, and the first plating layer contains different metal atoms than the first embedded portion 31C and the first escape wiring 21C. Specifically, the first plating layer contains Ni, and the first embedded portion 31C and the first escape wiring 21C do not contain Ni. Even in the case of the above configuration, electromigration is less likely to occur in the first external electrode 30C.

[0107] Preferably, when the element body 10 and the coil 20C are projected onto the bottom surface 17 along the axis AX1 direction, the outer peripheral surface 20aC on the inner diameter side of the first curved portion 212C has a curved surface. With the above-mentioned aspect, the first curved portion 212C has a smoother surface. If the first curved portion 212C had corners, current would be likely to concentrate at the corners, but with a smooth surface, current concentration is unlikely to occur.

[0108] In one embodiment, when the element body 10 and the coil 20C are projected onto the bottom surface 17 along the axis AX1 direction, the outer peripheral surface 20aC on the inner diameter side of the first curved portion 212C describes a fillet shape from the first connecting portion 211C side of the first curved portion 212C to the first embedded portion 31C, and the fillet radius of the fillet shape is 10 μm or more. The fillet radius is preferably 30 μm or more, and more preferably 100 μm or more. The fillet radius is, for example, 300 μm or less. If the fillet radius becomes too large, the distance between the first curved portion 212C and the winding portion 23C becomes small, and the first curved portion 212C and the winding portion 23C may come into contact with each other, causing a short circuit.

[0109] Preferably, the height dimension of the first plating layer in a direction parallel to the height dimension D1 is 10 μm or less. By having the above configuration, the DC resistance can be reduced and the Q value is improved. The height dimension of the first plating layer is preferably 8 μm or less. The lower limit of the height dimension of the first plating layer is not particularly limited, but is, for example, 1.5 μm.

[0110] Preferably, the coil 20C has an inner diameter side outer peripheral surface 20aC and an outer diameter side outer peripheral surface 20bC opposite to the inner diameter, and when the element body 10 and the coil 20C are projected onto the bottom surface 17 along the axis AX1 direction, both the inner diameter side outer peripheral surface 20aC and the outer diameter side outer peripheral surface 20bC of the first curved portion 212C have curved surfaces. By having the above-mentioned aspect, the first curved portion 212C has a smoother surface. If the first curved portion 212C has a corner, current tends to concentrate at the corner, but by having a smooth surface, current concentration is unlikely to occur. Note that only the inner diameter side outer peripheral surface 20aC may have a curved surface, or only the outer diameter side outer peripheral surface 20bC may have a curved surface. In addition, the inner diameter side outer peripheral surface 20aC and the outer diameter side outer peripheral surface 20bC may have curved surfaces of different shapes.

[0111] Preferably, coil 20C has an inner diameter side outer peripheral surface 20aC and an outer diameter side outer peripheral surface 20bC opposite to the inner diameter, and when element body 10 and coil 20C are projected onto bottom surface 17 along axis AX1, both inner diameter side outer peripheral surface 20aC and outer diameter side outer peripheral surface 20bC of first curved portion 212C form a fillet shape. In this embodiment, in inductor component 1C having end face electrodes, by providing a fillet shape on inner diameter side outer peripheral surface 20aC and outer diameter side outer peripheral surface 20bC, it is possible to improve adhesion between first curved portion 212C and first embedded portion 31C.

[0112] Although the first escape wiring 21C and the first external electrode 30C have been described above, the second escape wiring 22C and the second external electrode 40C may also have a similar configuration.

[0113] (Manufacturing method of inductor component 1C) Next, an example of a method for manufacturing the inductor component 1C will be described. Note that the method for manufacturing the inductor component 1C is not limited to the following method, and another manufacturing method may be used.

[0114] The inductor component 1C can be manufactured in the same manner as the inductor component 1. However, in the inductor component 1C, the lamination direction of the insulating paste is the Z-axis direction.

[0115] The present disclosure is not limited to the above-described embodiments, and design modifications are possible without departing from the scope of the present disclosure. For example, the respective characteristic points of the first to fourth embodiments may be combined in various ways.

[0116] The present disclosure includes the following aspects. <1> The body and A coil provided within the element body; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with The coil has a winding portion wound in a spiral shape along an axial direction, the coil has the winding portion, and first and second escape wirings connecting one end and the other end of the winding portion to the first external electrode and the second external electrode, At least one of the first external electrode and the second external electrode has an embedded portion embedded in the element body, At least one of the first escape wiring and the second escape wiring has a connection portion connected to the winding portion and a curved portion curved from the connection portion toward the embedded portion, When projected along the axis, the curved portion has a concave shape, and a length dimension L1 of a contact surface between the embedded portion and the lead-out wiring is larger than a wiring width W1 of the connection portion; The length dimension L1 is greater than a height dimension D1 of the embedded portion in a direction perpendicular to the contact surface. Inductor components. <2> When projected along the axial direction, the maximum height dimension D2 of the curved portion in a direction parallel to the height dimension D1 of the embedded portion is greater than the height dimension D1. <1> 2. An inductor component according to claim 1 . <3> an increasing rate of the wiring width of the curved portion increases from a contact surface between the connection portion and the curved portion to a contact surface between the buried layer and the curved portion; <2> 2. An inductor component according to claim 1 . <4> a first contact a1 having the maximum height dimension D2, a second contact a2 having a height dimension D3 that is half the maximum height dimension D2, and a third contact a3 at which a surface of the curved portion comes into contact with the buried layer when projected along the axial direction, in that order, on a contact surface between the buried layer and the curved portion; A length dimension L3 along a contact surface between the buried layer and the curved portion from the second contact a2 to the third contact a3 is greater than a length dimension L2 along a contact surface between the buried layer and the curved portion from the first contact a1 to the second contact a2. <2> or <3> 2. An inductor component according to claim 1 . <5> The length dimension L1 is 10 μm or more. <1> from <4> 13. An inductor component according to any one of claims 1 to 12. <6> a ratio of a length dimension L1 of a portion of the embedded portion facing a contact surface between the embedded portion and the curved portion to a length dimension L of a portion of the embedded portion exposed on the body surface when projected along the axial direction is 1 / 8 or more and 2 / 3 or less. <1> from <5> 13. An inductor component according to any one of claims 1 to 12. <7> at least one of the first external electrode and the second external electrode further has a plating layer covering at least a part of a portion of the embedded portion exposed on the body surface, The plating layer contains Ni, the first escape wiring and the embedded portion do not contain Ni; <1> from <6> 13. An inductor component according to any one of claims 1 to 12. <8> The coil has an outer circumferential surface on an inner diameter side and an outer circumferential surface on an outer diameter side opposite the inner diameter, When projected along the axial direction, at least one of an outer circumferential surface of the inner diameter side and an outer circumferential surface of the outer diameter side of the curved portion describes a fillet shape, The fillet radius of the fillet shape is 10 μm or more. <1> from <7> 13. An inductor component according to any one of claims 1 to 12. <9> The height dimension D1 of the buried layer is 20 μm or less. <1> from <8> 13. An inductor component according to any one of claims 1 to 12. <10> The height dimension D4 of the plating layer in a direction parallel to the height dimension D1 is 10 μm or less. <1> from <9> 13. An inductor component according to any one of claims 1 to 12. <11> the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is perpendicular to the first side and the second side, the first external electrode is formed continuously from the first end surface to the bottom surface, the second external electrode is formed continuously from the second end surface to the bottom surface; <1> from <10> 13. An inductor component according to any one of claims 1 to 12. <12> The coil has an outer circumferential surface on an inner diameter side and an outer circumferential surface on an outer diameter side opposite the inner diameter, When projected along the axial direction, an outer peripheral surface of the inner diameter side of the curved portion forms a fillet shape. <11> 2. An inductor component according to claim 1 . <13> the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is perpendicular to the first side and the second side, the first external electrode and the second external electrode are provided on the bottom surface; <1> from <10> 13. An inductor component according to any one of claims 1 to 12. <14> The coil has an outer circumferential surface on an inner diameter side and an outer circumferential surface on an outer diameter side opposite the inner diameter, When projected along the axial direction, both the outer peripheral surface of the inner diameter of the curved portion and the outer peripheral surface of the outer diameter side of the curved portion form a fillet shape. <13> 2. An inductor component according to claim 1 . <15> the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, The axis is perpendicular to the bottom surface and the top surface, the first external electrode is provided on the first end surface, The second external electrode is provided on the second end surface. <1> from <10> 13. An inductor component according to any one of claims 1 to 12. [Explanation of symbols]

[0117] 1,1A,1B,1C Inductor Components 10 Base 11 Insulating layer 13 First aspect 14 Second aspect 15 First end surface 16 Second end face 17 Bottom 18 Top 20, 20A, 20B, 20C Coil 20a,20b,20aB,20bB,20aC,20bC Outer surface 201~204,201A,202A,201B~204B,201C~212C Coil wiring 21,22,21A,22A,21B,22B,21C,22C Output wiring 211, 211A, 211B, 211C connection parts 212, 212A, 212B, 212C Curved section 23, 23A, 23B, 23C Winding section 24 Pad section 30,30A,30B,30C 1st external electrode 40,40A,40B,40C 2nd external electrode 31, 32, 41, 42, 31B, 41B, 31C, 41C Embedded part 33,43 Plating layer 601~603,601A,601B~603B,601C~611C Via wiring D1, D2, D3, D4 Height dimensions L, L1, L2, L3 Length dimensions W1 Wiring width at connection part a1,a2,a3 contacts

Claims

1. The body and A coil provided within the element body; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with The coil has a winding portion wound in a spiral shape along an axial direction, the coil has the winding portion, and a first lead wiring and a second lead wiring connecting one end and the other end of the winding portion to the first external electrode and the second external electrode, At least one of the first external electrode and the second external electrode has an embedded portion embedded in the element body, At least one of the first escape wiring and the second escape wiring has a connection portion connected to the winding portion and a curved portion curved from the connection portion toward the embedded portion, When projected along the axis, the curved portion has a concave shape, and a length dimension L1 of a contact surface between the embedded portion and the lead wiring is larger than a wiring width W1 of the connection portion; The length dimension L1 is greater than a height dimension D1 of the embedded portion in a direction perpendicular to the contact surface. Inductor components.

2. When projected along the axial direction, a maximum height dimension D2 of the curved portion in a direction parallel to a height dimension D1 of the embedded portion is greater than the height dimension D1. The inductor component according to claim 1 .

3. an increasing rate of the wiring width of the curved portion increases from a contact surface between the connection portion and the curved portion to a contact surface between the buried layer and the curved portion; The inductor component according to claim 2 .

4. a first contact a1 having the maximum height dimension D2, a second contact a2 having a height dimension D3 that is half the maximum height dimension D2, and a third contact a3, in this order, on a contact surface between the buried layer and the curved portion when projected along the axial direction, the third contact a3 being in contact with the buried layer at a surface of the curved portion; a length dimension L3 along a contact surface between the buried layer and the curved portion from the second contact a2 to the third contact a3 is greater than a length dimension L2 along a contact surface between the buried layer and the curved portion from the first contact a1 to the second contact a2; The inductor component according to claim 2 .

5. The inductor component according to claim 1 , wherein the length dimension L1 is 10 μm or more.

6. 3. An inductor component as described in claim 1 or 2, wherein, when projected along the axial direction, the ratio of the length dimension L1 of the portion facing the contact surface between the embedded portion and the curved portion to the length dimension L of the portion of the embedded portion exposed on the body surface is greater than or equal to 1 / 8 and less than or equal to 2 / 3.

7. at least one of the first external electrode and the second external electrode further has a plating layer covering at least a part of a portion of the embedded portion exposed on the body surface, The plating layer contains Ni, the first escape wiring and the embedded portion do not contain Ni; The inductor component according to claim 1 .

8. The coil has an outer circumferential surface on an inner diameter side and an outer circumferential surface on an outer diameter side opposite the inner diameter, When projected along the axial direction, at least one of an outer circumferential surface of the inner diameter side and an outer circumferential surface of the outer diameter side of the curved portion describes a fillet shape, The inductor component according to claim 1 , wherein the fillet shape has a fillet radius of 10 μm or more.

9. 3. The inductor component according to claim 1, wherein the buried layer has a height dimension D1 of 20 μm or less.

10. 3. The inductor component according to claim 1, wherein a height dimension D4 of said plating layer in a direction parallel to said height dimension D1 is 10 μm or less.

11. the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is perpendicular to the first side and the second side, the first external electrode is formed continuously from the first end surface to the bottom surface, the second external electrode is formed continuously from the second end surface to the bottom surface; The inductor component according to claim 1 .

12. The coil has an outer circumferential surface on an inner diameter side and an outer circumferential surface on an outer diameter side opposite the inner diameter, When projected along the axial direction, an outer peripheral surface of the curved portion on the inner diameter side forms a fillet shape. The inductor component of claim 11.

13. the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, the axis is perpendicular to the first side and the second side, The first external electrode and the second external electrode are provided on the bottom surface. The inductor component according to claim 1 .

14. The coil has an outer circumferential surface on an inner diameter side and an outer circumferential surface on an outer diameter side opposite the inner diameter, When projected along the axial direction, both the outer peripheral surface of the inner diameter of the curved portion and the outer peripheral surface of the outer diameter side of the curved portion form a fillet shape. The inductor component of claim 13.

15. the element body includes a first end face and a second end face opposing each other, a first side face and a second side face opposing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face opposing the bottom face, The axis is perpendicular to the bottom surface and the top surface, the first external electrode is provided on the first end surface, The second external electrode is provided on the second end surface. The inductor component according to claim 1 .

Images