Apparatus for producing plastic films as well as method for operating the same

Abstract

To provide an apparatus for producing a plastic film and a method for operating the apparatus of for producing a plastic film, having improved energy efficiency.SOLUTION: A plastic film producing apparatus (10) for producing a plastic film has a heat source unit (30), a heat sink unit (32), and a heat pump (42). The heat source unit (30) has an exhaust heat outlet thermally connected to an inlet of the heat pump (42). The heat sink unit (32) has a process-utilizing heat supply unit thermally connected to an outlet of the heat pump (42). Also, a method for operating the plastic film producing apparatus (10) is disclosed.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an apparatus for producing thin resin films and a method for operating the apparatus. [Background technology]

[0002] A known resin thin film manufacturing apparatus usually includes at least one extruder and a stretching device.

[0003] The method of producing a resin thin film using a resin thin film production apparatus requires an extremely large amount of energy due to the configuration of each part of the apparatus, especially the stretching device that requires heat for the process. Therefore, it is known to design each component device that constitutes the resin thin film production apparatus to be an energy-saving type and potentially equipped with a heat recovery device. Also, it is desirable to improve the energy efficiency of the resin thin film production apparatus. Summary of the Invention [Problem to be solved by the invention]

[0004] It is an object of the present invention to provide a resin thin film manufacturing apparatus and a method of operating the resin thin film manufacturing apparatus that have improved energy efficiency. [Means for solving the problem]

[0005] The object of the present invention is achieved by a resin thin film manufacturing apparatus provided. The resin thin film manufacturing apparatus of the present invention comprises a heat source device, a radiator, and a heat pump, the heat pump having a heat supply source and an output part for useful heat. The heat source device has a heat exhaust port that is thermally connected to the supply part of the heat pump, and the radiator (heat sink) has a process use heat supply source that is thermally connected to the outlet of the heat pump.

[0006] The inventors recognized the possibility of improving energy efficiency because the exhaust heat of one of the multiple component devices of the resin thin film manufacturing equipment (control device) can be used as process heat for the other component devices. The heat pumping device can pump up the exhaust heat from one component device of the control device and supply it to the other component devices of the control device as process heat, improving the energy efficiency of the control device.

[0007] For example, within the meaning of this specification, a heat transfer circuit constitutes a thermal connection. For example, a biaxially oriented thin film manufacturing apparatus, such as biaxially oriented polypropylene (BOPP) film, biaxially oriented polyethylene terephthalate (BOPET) film, biaxially oriented polyamide (BOPA) film, biaxially oriented polyethylene (BOPE) film, biaxially oriented polylactic acid (BOPLA) film, biaxially oriented polypropylene capacitor (BOPP-C) film, or battery separator film (BSF), constitutes a coordinating apparatus.

[0008] In an embodiment of the invention, a heat transfer connection to the heat pump can be realized with an energy efficient heat pump, with the inlet side of the heat pump being an evaporator and / or the outlet side of the heat pump being a condenser.

[0009] For example, a compressor is provided downstream of the inlet of the heat pump and upstream of its outlet. A throttle valve is provided downstream of the heat pump and upstream of its inlet.

[0010] In an embodiment of the invention, the overall device has a first heat transfer circuit for thermally connecting the heat source device to the heat pump, the first heat transfer circuit providing an efficient and low heat loss thermal connection between the heat pump and the heat source device.

[0011] The first heat transfer circuit comprises a pump for a heat transfer medium, which may be hot oil or pressurized water.

[0012] The first heat transfer circuit includes, for example, a first heat exchanger, particularly an air-type heat exchanger, connected to a heat exhaust port of a heat source device. Therefore, the use of a heat source device is not essential.

[0013] In order to further improve energy efficiency, the overall device includes a second heat source device, the first heat transfer circuit includes a second heat exchanger, and the heat exhaust port of the second heat exchanger is specifically directly connected to the second heat exchanger in a heat transfer manner.

[0014] The second heat exchanger is, for example, provided upstream of the first heat exchanger and / or downstream of the inlet of the heat pump.

[0015] In an embodiment of the present invention, a first heat exchanger including an air scrubber and a liquid heat exchanger is provided at the heat exhaust port of the heat source device, thus performing the dual functions of air scrubbing and heat exchange.

[0016] In an embodiment of the invention, the overall device comprises a second heat transfer circuit thermally connecting the heat sink to the heat pump, providing an efficient and low heat loss connection between the heat pump and the heat sink.

[0017] The second heat transfer circuit comprises a pump for transporting a heat transfer medium, notably using hot oil or pressurized water.

[0018] In an embodiment of the present invention, the overall device includes an additional heater disposed in the second heat transfer device downstream of the heat pump and upstream of the radiator. The additional heater reduces the inlet end of the radiator for process heat utilization, allowing the use of a low-power heat pump.

[0019] In order to drive the additional heater independently of the heat pump, the second heat transfer circuit comprises a bypass passage having a bypass valve, which opens the downstream of the heat pump and the upstream of the additional heater and / or connects the upstream point of the heat pump to the downstream of the radiator.

[0020] In the embodiment of the present invention, the overall device includes two heat pumps connected in parallel between the heat source device and the radiator, and the two heat pumps have different temperature performance ranges. Since both heat pumps have a single narrow temperature performance range, the overall device can be more energy efficient in operation than the overall device with separate heat pumps.

[0021] In particular, a heat source device is heat conductively connected to the inlet of each heat pump, and a heat sink is heat conductively connected to the outlet of each heat pump.

[0022] The inlet of the heat pump can be arranged in series with the first heat transfer circuit and / or the outlet of the heat pump can be arranged in series with the second heat transfer circuit to improve energy efficiency. It is particularly efficient to arrange the outlet of the second heat transfer circuit in reverse order with respect to the inlet of the first heat transfer circuit in the flow direction of the heat transfer medium.

[0023] In an embodiment of the present invention, the heat source device or the second heat source device, particularly when a stretching device such as a transverse orienter, a simultaneous stretching device, an extruder, a casting device and / or a pulling roll device is used, can efficiently utilize the exhaust heat of the device.

[0024] In particular, stretching equipment such as transverse orienters, machine direction orienters, crystallizers, feedstock dryers and / or water baths of co-stretching equipment can be used as heat sinks to utilize the waste heat that meets the process utilization heat requirements of said equipment. The preheating zone of the transverse orienter can also be used as a heat sink.

[0025] In particular, the cooling water, the heat exhaust of the heating furnace of the stretching device, the metering device of the extruder and the heat exhaust of the extruder of the stretching device for the tension rollers can be utilized for exhaust. The heat source device is in particular a transverse orienter.

[0026] The heat source device according to the embodiment of the present invention includes a heat recovery device in which the exhaust port of the heat recovery device serves as the exhaust port of the heat source device, and therefore the exhaust heat of the heat source device can be used particularly efficiently.

[0027] The object of the present invention can also be achieved by a method for operating a resin thin film manufacturing apparatus that includes a heat source device, a heat dissipation device and a heat pump. The method includes the following steps: - supplying exhaust heat from a heat source device to a heat pump; - The process of supplying used heat from the heat pump to the radiator as process heat.

[0028] The features and advantages of the overall system are equally applicable to the method of operation of the plastic thin film manufacturing system and vice versa. The components of the overall system are also specified and configured to carry out the method of operation.

[0029] For example, if the exhaust heat of the heat source device is utilized as the exhaust heat of the heat recovery device of the heat source device, the energy efficiency can be further increased.

[0030] Other useful heat, such as heat from a heat pump generating additional heat for the overall system, can be fed into the radiator to meet maximum heat demand.

[0031] Another useful heat can be generated in the second heat transfer circuit of the overall device which transports the useful heat of the heat pump to the radiator, and the other useful heat can be efficiently supplied to the radiator.

[0032] To protect the heat pump, a bypass valve in the bypass of the second heat transfer circuit can be opened to form a bypass for the heat pump, and when the return temperature from the radiator of the second heat transfer circuit exceeds the temperature of the second heat transfer circuit immediately downstream of the heat pump, a shut-off valve can be closed upstream of the heat pump. [Brief description of the drawings]

[0033] Other features and advantages of the present invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: [Figure 1] FIG. 1 is a perspective view of a resin thin film manufacturing apparatus according to a first embodiment of the present invention; [Diagram 2] A piping diagram for supplying a medium for heating a roller by a heat transfer circuit connected to a heat source device of the resin thin film manufacturing apparatus of the first embodiment of FIG. [Diagram 3] A flowchart showing an embodiment of the method of operating the resin thin film manufacturing apparatus of the present invention. [Figure 4] A piping diagram showing a second embodiment of the present invention. [Diagram 5] A piping diagram showing an embodiment of the present invention in which a fluidization tank is provided in an exhaust gas purification device. [Figure 6] 1 is a piping diagram showing a portion of a first heat transfer circuit according to an embodiment of the present invention; [Figure 7] FIG. 3 is a piping diagram showing a modified heat transfer circuit according to a third embodiment of the present invention. [Figure 8] FIG. 8 is a piping diagram showing a fourth embodiment of the present invention, which is different from the piping diagram of FIG. [Figure 9] A pipeline diagram showing a fifth embodiment of the present invention, which is different from the pipeline diagram of FIG. [Figure 10] A pipeline diagram showing a sixth embodiment of the present invention, which is different from the pipeline diagram of FIG. [Figure 11] A pipeline diagram showing a seventh embodiment of the present invention, which is different from the pipeline diagram of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] FIG. 1 is a schematic diagram of a thin resin film manufacturing apparatus 10 that includes various different components.

[0035] In the illustrated example, the resin thin film manufacturing apparatus 10 includes an extruder 12, a casting apparatus 14, a machine direction orienter (MDO) 16, a transverse direction orienter (TDO) 18, a tension roller apparatus 20, and a winder 22, in addition to a heat pump 24.

[0036] The resin thin film manufactured by the resin thin film manufacturing apparatus 10 is, for example, a biaxially oriented polypropylene (BOPP) thin film, a biaxially oriented polyethylene terephthalate (BOPET) thin film, a biaxially oriented polyamide (BOPA) thin film, a biaxially oriented polyethylene (BOPE) thin film, a biaxially oriented polylactic acid (BOPA) thin film, a biaxially oriented polypropylene capacitor (BOPP-C) thin film, or a battery partition film (BSF).

[0037] To produce a resin film, the extruder 12 produces a ribbon-shaped film on a chill roll of a casting device 14. For this purpose, the extruder 12 produces from a starting product, such as a granular material, a melt ribbon that is fed to the chill roll and is formed into a resin film.

[0038] The resin film is conveyed from the casting apparatus 14 to a machine direction orienter 16. In the machine direction orienter 16, the resin film is stretched in the machine direction to form a stretched film.

[0039] In the machine direction orienter 16, the resin film is heated to a desired temperature and passes through a number of heated rollers to perform the stretching process.

[0040] The resin film is stretched in the machine direction, or tensile direction, between at least two rollers in machine direction orienter 16 to form a stretched film.

[0041] The resulting stretched film is transferred from the machine direction orienter 16 to the transverse direction orienter 18 where the film is stretched in the transverse direction.

[0042] Along the pulling direction of the resin film manufacturing apparatus 10, the lateral orienter 18 has a heating furnace 26 which forms different treatment zones for heat treating the film.

[0043] In the first zone, called the preheat zone, the film is heated, followed by a second zone (the "stretch zone") where the film is stretched laterally so that the film has a larger width and a smaller thickness than when it was delivered to the second zone.

[0044] After completing the stretching process, the thin film passes through third and additional zones (constituting the "heat treatment zone", "post-heat zone" and / or "anneal zone") that, for example, relieve or relax internal stresses in the thin film at elevated temperatures. One or more of said zones may also be a heat dissipation source.

[0045] The film is then transported through a final additional zone (the "cooling zone") where the film is cooled.

[0046] An additional area called a neutral area serves the purpose of separating two adjacent areas. For example, a neutral area is a space without air conditioning.

[0047] The region containing the lateral director 18 may be divided into different regions and / or configured for different region lengths. For example, fewer neutral regions or shortened neutral regions may be provided or may be provided at different points. Variations in other regions are also contemplated.

[0048] After passing through the transverse orienter 18, the biaxially stretched film passes through a tension roller arrangement 20 and is then taken up by a wind-up arrangement 22.

[0049] For example, the plastic film manufacturing apparatus 10 can be configured in other ways with simultaneous stretching devices replacing or supplementing the machine direction orienter 16 and the cross direction orienter 18.

[0050] The machine direction orienter 16 and the cross direction orienter 18 require at least active process heat.

[0051] The machine direction orienter 16 and the cross direction orienter 18 require simultaneous utilization of exhaust heat, but may use different devices.

[0052] For example, the extruders making up extruder 12 and the chill rolls or chill / water bath of casting apparatus 14 require a cooling water type waste heat supply device to be heated.

[0053] For example, the machine direction orienter 16, the cross direction orienter 18, the extruder 12, the casting system 14 and the tension roller system 20 are provided with warm exhaust air exhaust.

[0054] For example, the lateral director 18 includes the region and also an optional heat recovery device 28 .

[0055] The heat recovery system 28 receives both fresh air from the environment and exhaust air (exhaust air) from, for example, the heat treatment and / or cooling zones of the furnace 26. The exhaust air from the furnace 26 can be used to preheat the fresh air to the furnace, and a portion of the exhaust air from the furnace 26 can be fed directly back to the furnace 26 as process heating air.

[0056] The heat recovery system 28 is itself well known, as are the extruder 12, the casting system 14, the machine direction orienter 16, the cross direction orienter 18, the tension roller system 20 and the winder system 22.

[0057] A heat pump 24, shown diagrammatically in FIG. 1, is heat conductively connected to each of the extruder 12, the casting apparatus 14, the machine direction orienter 16, the cross direction orienter 18, the tension roller apparatus 20, and the winding apparatus 22 (collectively referred to as "process apparatuses 12-22") to receive waste heat from each of the process apparatuses 12-22 and / or to supply process heat to one of the process apparatuses 12-22.

[0058] As part of the resin thin film manufacturing apparatus 10 shown in FIG. 1, in addition to the heat pump 24, a heat source device 30 and a radiator 32 are shown in FIG.

[0059] In the illustrated embodiment, the heat source device 30 is the transverse orienter 18 of the plastic film manufacturing apparatus 10. Other devices included in the plastic film manufacturing apparatus 10 include other stretching devices, such as the machine direction orienter 16 (or co-stretching device, if provided), the extruder 12, the casting device 14, and / or the tension roller device 20.

[0060] The heat source may be, for example, an area such as an annealing area where a heat source device 30 is provided. The heat source device 30 may be an annealing area and a preheating area, an annealing area and a heating area for the annealing area, or an annealing area, a preheating area and a heating area.

[0061] In the illustrated embodiment, heat dissipator 32 is the machine direction orienter 16, however, heat dissipator 32 may be a crystallizer, a feed dryer, and / or a water bath of a co-stretcher in extruder 12.

[0062] The heat pump 24 thermally connects the heat source device 30 to the radiator 32 and supplies process heat to the radiator 32 .

[0063] The heat source 30 for the lateral orientation device 18 is shown in FIG.

[0064] The waste heat of the heat recovery device 28 , such as slightly cooled exhaust air from the heating furnace 26 , is supplied to the heat pump 24 as waste heat of the heat source device 30 .

[0065] The machine direction orienter 16, shown diagrammatically in FIG. 2, includes an inlet 33 which provides a process heat input, a plurality of rollers 34, and a plurality of media mixers 36.

[0066] A heat transfer medium, such as heat transfer oil or pressurized water, flows through the rollers 3 to control the temperature of the rollers 3 .

[0067] The media mixer 36 receives the heat transfer medium introduced to the multiple rollers 34 and the heat transfer medium discharged from the rollers 34, sets the temperature of the heat transfer medium to the rollers 34 (the inlet temperature), and in particular sets the temperature of each roller 34 or each component of the rollers 34.

[0068] The heat pump 24 in the illustrated embodiment includes a first heat transfer circuit 38 and a second heat transfer circuit 40 in addition to a first heat pump 42 .

[0069] The first heat pump 42 includes an evaporator 44 , a compressor 46 , and a condenser 48 along with a throttle valve 50 .

[0070] The evaporator 44 constitutes the source of the first heat pump 42 .

[0071] A condenser 48 is disposed downstream of a compressor 46 which is disposed downstream of the evaporator 44 .

[0072] The condenser 48 constitutes a useful heat outlet for the first heat pump 42 .

[0073] A throttle valve 50 is disposed downstream of the condenser 48 and upstream of the evaporator 44 .

[0074] The first heat transfer circuit 38 includes a first heat exchanger 52 along with a pump 54. Heat transfer oil or pressurized water can be used as the heat transfer medium. The source of the first heat pump 42, which in this embodiment includes a compressor 46, is located within the first heat transfer circuit 38.

[0075] In the illustrated embodiment, the pump 54 provided upstream of the supply body (in this embodiment, the evaporator 44) is provided between the first heat exchanger 52 and the supply body.

[0076] The first heat exchanger 52 is formed independently of the heat medium that transports the exhaust heat of the heat source device 30. In this embodiment, the first heat exchanger 52 that uses air as a heat medium is provided as an air heat exchanger.

[0077] The first heat exchanger 52 receives the exhaust heat from the heat source device 30, that is, the exhaust air.

[0078] Therefore, the first heat transfer circuit 38 is connected in a heat transfer manner between the heat source device 30 and the object to which heat is supplied from the first heat pump 42 (the evaporator 44 in this embodiment).

[0079] A second heat transfer circuit 40 thermally connects the outlet of the first heat pump 42 to the heat sink 32 .

[0080] The heat transfer medium of the second heat transfer circuit 40 may be heat transfer oil or pressurized water.

[0081] The second heat transfer circuit 40 comprises a pump 56 in the first embodiment connected to the radiator 32, and the outlet of the first heat pump 42 (the condenser 48 in the illustrated embodiment) is integrated with the second heat transfer circuit 40.

[0082] A second heat transfer circuit 40 , for example, transitions from the inlet 33 to the heat transfer circuit of the radiator 32 to provide heat transfer media to the media mixer 36 and, optionally, to the rollers 34 .

[0083] During operation of the resin film production apparatus 10, and in particular during production of the resin film, the method illustrated diagrammatically in FIG. 3 is carried out.

[0084] During operation of the resin thin film manufacturing apparatus 10, the heat source device 30 generates exhaust heat. For example, the heating furnace 26 of the lateral orientation device 18 generates exhaust heat in the form of exhaust (step S1).

[0085] A part of the exhaust heat is supplied again to the heating furnace 26 as process heat by the heat recovery device 28 (step S2). The exhaust heat of the heat recovery device 28, which is composed of slightly cooled exhaust gas from the heating furnace 26, is exhaust heat of the heat source device 30 having a temperature range of, for example, 60°C to 140°C.

[0086] In step S3, the exhaust heat of the heat source device 30 is supplied to the heat pump 24, that is, the first heat exchanger 52 of the first heat transfer circuit .

[0087] The exhaust heat of the heat source device 30 is transferred to the heat transfer medium of the first heat transfer circuit 38 and is supplied to the supply section of the first heat pump 42 (in this embodiment, the evaporator 44) (step S4).

[0088] Therefore, the exhaust heat of the heat source device 30 is supplied to the first heat pump .

[0089] The temperature of the heat transfer medium in the first heat transfer circuit 38 immediately downstream of the evaporator 44 is considered the supply temperature of the first heat pump 42 .

[0090] The supply temperature range of the first heat pump 42 is, for example, 55°C to 140°C.

[0091] The first heat pump 42 heats the heat transfer medium in the second heat transfer circuit 40 at a useful heat outlet (in this embodiment, the condenser 48) to a temperature level that exceeds the supply temperature before the first heat pump 42 (step S5).

[0092] For example, the temperature of the heat transfer medium in the second heat transfer circuit 40 immediately downstream of the first heat pump 42 is 90° C. to 160° C., but temperatures of 200° C. or higher are also acceptable.

[0093] The useful heat generated in the first heat pump 42 is supplied from the second heat transfer circuit 40 to the radiator 32 as process heat.

[0094] In the illustrated embodiment, rollers 34 of machine direction orienter 16 are heated by supplied process heat.

[0095] In this way, the exhaust heat of the heat source device 30 is reused extremely efficiently, and the energy efficiency of the all-resin thin film manufacturing apparatus 10 is significantly improved.

[0096] 4 to 8 show another embodiment of the resin thin film manufacturing apparatus 10 of the present invention, which generally corresponds to the above-mentioned embodiment. Therefore, the same parts as those in the above-mentioned embodiment are given the same reference numerals in Fig. 4 to 8, and only the differences will be described below.

[0097] FIG. 4 shows a part of a resin thin film manufacturing apparatus 10 according to a second embodiment similar to that shown in FIG.

[0098] Unlike the first embodiment, the resin thin film manufacturing apparatus 10 includes an additional heater 58 .

[0099] The additional heater 58 disposed in the second heat transfer circuit 40 is a heat transfer heater such as a heating coil that heats the heat transfer medium of the second heat transfer circuit 40. A heat exchanger may be used as the additional heater 58.

[0100] An additional heater 58 is disposed downstream of the first heat pump 42 and upstream of the radiator 32 .

[0101] In this embodiment, the second heat transfer circuit 40 comprises a bypass circuit 60 provided with a bypass valve 62 which closes the bypass circuit 60 .

[0102] The bypass path 60 branches off from the remainder of the second heat transfer circuit 40 downstream of the radiator 32 and upstream of the first heat pump 42, bypassing the first heat pump 42 and reopening the remainder of the second heat transfer circuit 40 downstream of the first heat pump 42 and upstream of the additional heater 58.

[0103] Also, a shutoff valve 64 may be provided in the second heat transfer circuit 40 located upstream of the first heat pump 42 and downstream of the branch of the bypass circuit 60 .

[0104] An additional heater 58 may heat the heat transfer medium in the second heat transfer circuit 40 and supply it to the first heat pump 42 in addition or instead.

[0105] As a result, in addition to or instead of the first heat pump 42, another useful heater can be provided in the radiator 32 as process heat (step S7, shown by dotted lines in FIG. 3).

[0106] During start-up of the resin thin film manufacturing apparatus 10, if the radiator 32 requires particularly high process heat, the additional heater 58 can be switched on. In addition to the useful heat provided by the first heat pump 42, the additional heater 58 can also provide useful additional heat to achieve the required temperature level for the process heat supply of the inlet 33 or the radiator 32.

[0107] If the temperature of the second heat transfer circuit 40 immediately downstream of the first heat pump 42 is lower than its return temperature, ie the temperature downstream of the radiator 32, the first heat pump 42 cannot be operated.

[0108] In this case, the bypass valve 62 is opened and the shutoff valve 64 is closed (if not already closed) to bypass the first heat pump 42 (step S8, shown by the dotted line in FIG. 3).

[0109] The additional heater 58 generates heat for use in the entire process to the radiator 32. If the heat source device 30 does not supply sufficient exhaust heat, the additional heater 58 may need to be operated when the resin thin film manufacturing apparatus 10 is started up.

[0110] However, as long as it is compatible with the maximum output of the additional heater 58, the operation of the additional heater 58 allows the first heat pump 42 with a low heat output to be used, thereby reducing the operating costs of the resin thin film manufacturing apparatus 10.

[0111] 5 shows an embodiment of a heat exchanger 52 of the first heat transfer circuit 38. This embodiment can be used in each of the other embodiments as the heat exchanger or one of the heat exchangers of the first heat transfer circuit 38.

[0112] The heat exchanger 52 of this embodiment includes a gas precipitator 66 in addition to a liquid heat exchanger 68. The gas precipitator 66 and an optional air filter 80 can be used as part of the exhaust purification system 65.

[0113] The gas precipitator 66 includes a fluidized bed 70 having a liquid bed 74, a liquid atomizer 72, an air inlet 76 through which the exhaust air passes, and an exhaust outlet 78.

[0114] A liquid atomizer 72 is provided in the fluidized bed 70 between the exhaust inlet 76 and the exhaust outlet 78 .

[0115] A liquid sump 74 is provided on one side of an exhaust inlet 76 spaced and opposite from the liquid atomizer 72 .

[0116] The liquid reservoir 74 also serves as the bottom side of the flow tank 70 .

[0117] The liquid sump 74 is connected to the inlet of the liquid heat exchanger 68 and the liquid sprayer 72 is connected to the outlet of the liquid heat exchanger 68 .

[0118] A pump is connected between the sump 74 and the liquid heat exchanger 68 .

[0119] During operation of the resin thin film manufacturing apparatus 10 , exhaust air from the heat source device 30 flows through the exhaust inlet 76 into the fluidization tank 70 , and is then discharged from the fluidization tank 70 at the exhaust outlet 78 .

[0120] The liquid supplied from the liquid heat exchanger 68 to the fluidization tank 70 is atomized by the liquid atomizer 72, so that the exhaust gas from the heat source device 30 from the exhaust gas inlet 76 flows through the atomized liquid at the same time. Impurities in the exhaust gas from the heat source device 30, especially hydrocarbons, dissolve in the atomized liquid in the fluidization tank 70, so that the exhaust gas is purified. At the same time, the heat in the exhaust gas is absorbed and transferred by the atomized liquid.

[0121] The atomized liquid in the liquid reservoir 74 is heated and absorbs a portion of the exhaust heat of the heat source device 30 .

[0122] The liquid to be heated in the sump 74 is delivered to the liquid heat exchanger 68 and the heat in the liquid is transferred into the first heat transfer circuit 38 .

[0123] The gas precipitator 66 includes an air filter 80 , such as an electrostatic precipitator, disposed in the exhaust stream downstream of the fluidized bed 70 .

[0124] Alternatively, a skimming vessel 81 can be placed between the fluidization vessel 70 and the liquid heat exchanger 68 (shown in dotted lines in FIG. 5).

[0125] The liquid reservoir 74 and the liquid sprayer 72 are connected to a skimming tank 81 to form a circuit. At the same time, the skimming tank 81 is connected to the liquid heat exchanger 68.

[0126] During operation of the resin thin film manufacturing apparatus 10, the liquid from the liquid reservoir 74 is supplied to the slag removal tank 81 and heated.

[0127] The liquid to be heated in the skimming vessel 81 can be fed to the liquid heat exchanger 68 where some of the heat can be removed. The liquid to be cooled is then fed back to the skimming vessel 81.

[0128] Alternatively, it is possible to omit the liquid reservoir 74. Alternatively, a liquid outlet can be provided in the flow vessel 70.

[0129] 6 shows another embodiment which is to be combined with other embodiments. The first heat transfer circuit 38 of this embodiment comprises a second heat exchanger 82.

[0130] The second heat exchanger 82 is in thermal contact with waste heat, for example, exhaust air or cooling water, from a directly adjacent second heat source device 84. The second heat exchanger 82 is, for example, an air-type or liquid-type heat exchanger.

[0131] The same devices listed for heat source device 30 may be considered as second heat source device 84 .

[0132] For example, a second heat source device 84 is provided upstream of the first heat exchanger 52. In this case, the exhaust heat of the multiple heat source devices 30 and the fluidization tank 70 can be supplied from the first heat pump 42 to the radiator 32 as process heat.

[0133] The second heat exchanger 82 provided upstream of the first heat exchanger 52 is particularly efficient, especially when the second heat source device 84 supplies a low volume of exhaust heat to the heat source device 30 and has a very large temperature difference and a high heat transfer rate.

[0134] FIG. 7 shows a fourth embodiment of a part of the apparatus 10 for producing a resin film similar to that of FIGS. 2 and 4, in which the heat pump 24 comprises a first heat pump 42 and a second heat pump 86 .

[0135] The first heat pump 42 is provided in the heat pump 24 similar to the first heat pump 42 of the previous embodiment. A second heat pump 86 similar to the first heat pump 42 is provided between the first heat transfer circuit 38 and the second heat transfer circuit 40 and in parallel with the first heat pump 42.

[0136] An evaporator 44 , to which the heat transfer medium is supplied from the first heat pump 42 , is connected to the first heat transfer circuit 38 and the outlet of the first heat pump 42 , and a condenser 48 is provided in the second heat transfer circuit 40 .

[0137] In the illustrated embodiment, the supply inlet of the second heat pump 86 is located downstream of the supply inlet of the first heat pump 42 of the first heat transfer circuit 38, while the outlet of the second heat pump 86 is located downstream of the outlet of the first heat pump 42 of the second heat transfer circuit 40.

[0138] The inlets and outlets of the first heat pump 42 and the second heat pump 86 are arranged in series.

[0139] The outlet of the second heat transfer circuit 40 is in a reverse heat transfer medium flow order to the inlet of the first heat transfer circuit 38 .

[0140] For example, the temperature of the first heat transfer medium of the first heat transfer circuit 38 is 85° C. at the inlet of the first heat pump 42, and the residual temperature at the inlet of the second heat pump 86 is still 55° C. The first heat pump 42 and the second heat pump 86 heat the heat transfer medium of the second heat transfer circuit 40 to a temperature of 148° C.

[0141] In contrast to the increased power of each heat pump using the second heat pump 86, the two heat pumps each have reduced power but greater efficiency. The first heat pump 42 and the second heat pump 86 can be designed with a small temperature performance range and still achieve high efficiency. Although the investment is higher, there is an advantage in reduced operating costs when using a single heat pump.

[0142] The fourth embodiment shown in FIG. 8 corresponds to the third embodiment of FIG. 7 in which additional heat is supplied to the first heat transfer circuit 38 by a second heat source device 84 via a second heat exchanger 82 in the embodiment of FIG. 6.

[0143] In this embodiment, either or both of the first heat exchanger 52 and the second heat exchanger 82 according to the embodiment of FIG. 5 may be used.

[0144] A fifth embodiment of the resin thin film manufacturing apparatus 10 shown in Fig. 1 is shown in Fig. 9. The fifth embodiment is based on the first embodiment, but constitutes a starting point for other embodiments. In particular, the resin thin film manufacturing apparatus 10 in the fifth embodiment includes the exhaust gas purification device 65 described in the embodiment of Fig. 5, and the first heat exchanger 52 of the first heat transfer circuit 38 includes the gas dust collector 66 described in the embodiment of Fig. 5.

[0145] In this embodiment, the heat sink 32 is the lateral orientation device 18 of the resin thin film manufacturing apparatus 10. If the lateral orientation device 18 and the heat sink 32 are the same device, the lateral orientation device 18 may be the heat source device 30.

[0146] The lateral director 18 includes an inlet 33 and an air heat exchanger 88 .

[0147] An air heat exchanger 88 provided in the second heat transfer circuit 40 receives the heat transfer medium heated by the first heat pump 42 .

[0148] An air heat exchanger 88 is provided downstream of the heat recovery unit 28 of the lateral director 18 and upstream of the furnace 26 .

[0149] The air heat exchanger 88 receives a fresh air stream that is preheated in the heat recovery device 28 of the furnace 26, and the fresh air stream is further heated in the air heat exchanger 88. The heated fresh air stream is then provided to the furnace 26, for example, in a preheating zone.

[0150] An air flow control valve 90 may be provided in the fresh air path between the heat recovery system 28 and the furnace 26, particularly downstream of the air heat exchanger 88, to provide for failure of the first heat pump 42 or to regulate temperature levels.

[0151] FIG. 10 shows a sixth embodiment based on the fifth embodiment in which the first heat transfer circuit 38 is not provided and the exhaust gas from the heat source device 30, particularly the exhaust gas from the heat recovery device 28, is supplied to the evaporator 44 of the first heat pump 42.

[0152] For this purpose, an evaporator 44 is provided downstream of an exhaust gas purification device 65 shown in Fig. 10. The exhaust gas passing through a gas precipitator 66 and an optional air filter 80 is purified by the exhaust gas purification device 65 and then supplied directly to the evaporator 44.

[0153] 10, the first heat transfer circuit 38 can be omitted. In the other embodiments, the exhaust gas or exhaust heat present in the liquid of the heat source device 30 can be directly supplied to the evaporator 44 of the first heat pump 42.

[0154] The exhaust gas stream cooled in the evaporator 44 of the first heat pump 42 or the heat exchanger 52 of the first heat transfer circuit 38 can be used in all embodiments, including cooling in the cooling area of ​​the lateral director 18, low temperature heating in other processes or heating of buildings, etc.

[0155] Regardless of this embodiment, the exhaust gas of the heat source device 30 can be cooled and / or expanded in the heat exchanger 52 or the evaporator 44 of the first heat transfer circuit 38. A gas precipitator, such as the gas precipitator 66 of the embodiment of Figure 5, can be supplied with water obtained at the heat source device 30 to reduce the necessary make-up of fresh water for the process.

[0156] 11 illustrates a resin thin film manufacturing apparatus 10 including a plurality of heat source devices 30 having two lateral direction orienters 18 and an additional device. Two or more heat source devices 30 may be provided in the resin thin film manufacturing apparatus 10.

[0157] The exhaust streams of the multiple heat source devices 30 are mixed and supplied to the evaporator 44 of the first heat pump 42 or the heat exchanger 52 of the first heat transfer circuit 38 .

[0158] Single or multiple air purification devices 65 as shown in Figure 5 may also be used. For example, a single air purification device 65 is necessary since it already purifies the mixed exhaust stream. [Explanation of symbols]

[0159] 10··Resin thin film manufacturing equipment, 12··Extruder, 14··Casting equipment, 16··Machine direction orienter (MDO), 18··Transverse direction orienter (TDO), 20··Tension roller equipment, 22··Wind-up machine, 24··Heat pump, 26··Heating furnace, 28··Heat recovery equipment, 30··Heat source equipment, 32··Heat sink, 33··Inlet, 34··Roller, 36··Media mixer, 38··First heat transfer circuit, 40··Second heat transfer equipment, 42··First heat pump, 44··Evaporator, 46··Compressor, 48··Condenser, 50··Throttling valve, 52··First heat exchanger, 54··Pump,

[0033] 58...additional heater, 60...bypass, 64...shutoff valve, 65...exhaust gas purification device, 66...gas dust collector, 68...liquid heat exchanger, 70...fluidized bed, 72...liquid sprayer, 74...liquid reservoir, 76...air inlet, 78...air outlet, 80...air filter, 81...slag removal bed, 82...second heat exchanger, 84...second heat source device, 86...second heat pump, 88...air heat exchanger,

Claims

1. The system includes a heat source device (30), a radiator (32), and a heat pump (42), The heat pump (42) includes a heat source and an output for useful heat; The heat source device (30) includes a discharge pipe that supplies heat to the heat pump (42); The resin thin film manufacturing apparatus is characterized in that the radiator (32) is provided with a process heat supply source that is heat-transferably connected to the outlet of the heat pump (42).

2. 2. The resin thin film manufacturing apparatus according to claim 1, wherein the source of the heat pump (42) is an evaporator (44) and / or the outlet of the heat pump (42) is a condenser (48).

3. 3. The resin thin film manufacturing apparatus according to claim 1, further comprising a first heat transfer circuit for thermally transferring the heat source device to the heat pump device.

4. The resin thin film manufacturing apparatus according to claim 3, wherein the first heat transfer circuit (38) is provided with a first heat exchanger (52), in particular an air-heated heat exchanger or a fluid-heated heat exchanger (68), which is thermally connected to the heat exhaust port of the heat source device (30).

5. The resin thin film manufacturing apparatus (10) is provided with a second heat source device (84), and the first heat transfer circuit (38) is provided with a second heat exchanger (82) to which the thermal output of the second heat source device (84) is thermally connected.

6. 6. The apparatus for producing a thin resin film according to claim 4, wherein the heat exhaust port of the heat source device (30) is an exhaust port, and the first heat exchanger (52) comprises a gas washer and a liquid heat exchanger.

7. The resin thin film manufacturing apparatus (10) according to any one of claims 1 to 6, further comprising a second heat transfer circuit (40) for thermally transferring the heat radiator (32) to the heat pump (42).

8. The resin thin film manufacturing apparatus (10) according to claim 7, further comprising an additional heater (58) disposed in the second heat transfer circuit (40) downstream of the heat pump (42) and upstream of the radiator (32).

9. The resin thin film manufacturing apparatus of claim 8, wherein the second heat transfer circuit (40) includes a bypass passage (60) having a bypass valve (62), the bypass passage (60) opens downstream of the heat pump (42) and upstream of the additional heater (58) and / or creates a downstream of the radiator (32) from a point upstream of the heat pump (42).

10. The resin thin film manufacturing apparatus (10) is provided with two heat pumps (42, 86) connected in parallel between the heat source device (30) and the radiator (32), and in particular, the two heat pumps (42, 86) have different temperature characteristic ranges.

11. The resin thin film manufacturing apparatus according to claim 10, wherein the inlets of the two heat pumps (42, 86) are arranged in series in the first heat transfer circuit (38) and the outlets of the heat pumps (42, 86) are arranged in series in the second heat transfer circuit (40).

12. The thin resin film stretching apparatus according to any one of claims 1 to 11, wherein the heat source device (30) and / or the second heat source device (84) are a stretching device, in particular a transverse direction orienter (18), a simultaneous stretching device, a pulling device (12), a casting device (14) and / or a pulling roller device (20); and / or the heat radiator (32) is a water bath of a stretching device, in particular a transverse direction orienter (18), a machine direction orienter (16), a crystallizer, a raw material drying device and / or a simultaneous stretching device.

13. 13. The thin resin film stretching apparatus according to claim 1, wherein the heat source device (30) includes a heat recovery device (28), and a heat exhaust port of the heat recovery device (28) is a heat exhaust port of the heat source device (30).

14. A method for operating a resin thin film manufacturing apparatus (10) including a heat source device (30), a radiator (32), and a heat pump (42), comprising: supplying exhaust heat from the heat source device (30) to a heat pump (42); and supplying the useful heat of the heat pump (42) to the radiator (32) as process heat.

15. 15. The method for operating the resin thin film manufacturing apparatus (10) according to claim 14, further comprising a step of using exhaust heat from the heat source device (30) as exhaust heat for a heat recovery device (28) of the heat source device (30).

16. 16. A method for operating a resin thin film manufacturing apparatus (10) according to claim 14 or 15, further comprising the step of supplying useful heat generated by a heat pump (42) in an additional heater of the resin thin film manufacturing apparatus (10) to a radiator (32).

17. Useful heat generated in a heat pump (42) of a second heat transfer circuit (40) of the resin thin film manufacturing apparatus (10) is supplied to a radiator (32), and in particular, a bypass valve (62) of a bypass circuit (60) of the second heat transfer circuit (40) is opened to bypass the heat pump (42); A method for operating a resin thin film manufacturing apparatus (10) as described in claim 16, wherein when the return temperature from the radiator (32) exceeds the temperature of the second heat transfer circuit (40) immediately downstream of the heat pump (42), the shutoff valve (64) upstream of the heat pump (42) is closed.

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