Ring frame carrier processing device and chip pickup device

Abstract

To provide a ring frame carrier processing device and a chip pickup device capable of appropriately preventing abnormal heating of a heater.SOLUTION: A ring frame carrier processing device includes a slack correction unit 30 that corrects slack of an adhesive sheet whose expansion is released. The slack correction unit 30 includes a heater drive unit 37 that supplies a heater current Ih, an electromagnetic switch 38 that interrupts the heater current Ih, and a drive circuit 39 that supplies a drive current Id of the electromagnetic switch 38. The drive circuit 39 includes: a first relay 42 that is activated when an air detection unit 36 detects the supply of air CA; and a second relay 43 that is activated when a drive signal S3 is input from a control unit 40, and supplies the drive current Id to the electromagnetic switch 38 via the first relay 42 and the second relay 43 that are connected in series. The second relay 43 interrupts the drive current Id after a predetermined period has elapsed.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a ring frame carrier processing device that corrects slack in an adhesive sheet attached to a ring frame after the sheet is released from the expansion, and a chip pickup device that picks up chips on the expanded adhesive sheet. [Background technology]

[0002] A chip pickup device holds a ring frame carrier having an adhesive sheet to which multiple chips formed from a diced wafer are attached, stretches the adhesive sheet to expand it, and picks up the chips from the expanded adhesive sheet (for example, Patent Document 1). However, after the chips are picked up, the adhesive sheet becomes loose when the expansion is released, and in this loose state, the ring frame carrier cannot be automatically carried out by a robot hand or the like, which is a problem. Patent Document 1 discloses a device that blows heated air onto the loose adhesive sheet to correct the slackness of the adhesive sheet. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2005 / 114714 Summary of the Invention [Problem to be solved by the invention]

[0004] In the prior art including Patent Document 1, air is sent to a heated heater to generate heated air. However, the prior art has the following problems due to the configuration in which an electric current is supplied to the heater on the condition that a flow meter detects an air flow, and the heater is prevented from running dry. That is, when air leaks from the path from the flow meter to the heater, even though no air is being supplied to the heater, the flow meter detects an air flow, so an electric current is supplied to the heater, and the heater etc. exceeds the allowable temperature in a short time due to abnormal heat generation. In addition, there is a problem that a safety circuit using a thermocouple etc. cannot cut off the electric current in time, and the temperature use is cut off, causing a long stop in production.

[0005] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a ring frame carrier processing device and a chip pickup device that can appropriately prevent abnormal heat generation from the heater. [Means for solving the problem]

[0006] The ring frame carrier processing device of the present invention is a ring frame carrier processing device including a ring frame carrier holding section which holds an adhesive sheet in an expanded state by pulling the sheet in order to allow a pick-up head to pick up a chip supplied by the ring frame carrier having an annular ring frame and an adhesive sheet, and a slack correction section which corrects slack in the adhesive sheet when the expansion by the ring frame carrier holding section is released, the slack correction section including a hot air generating section which blows air heated by a heater onto the adhesive sheet, an air supplying section which feeds air into the hot air generating section, and a slack correction section which corrects slack in the adhesive sheet when the expansion by the ring frame carrier holding section is released. the heater driving unit supplies current to the heater, an electromagnetic switch cuts off the current supplied from the heater driving unit, a driving circuit supplies a driving current to the electromagnetic switch, and a control unit controls at least the air supply unit and the driving circuit, the driving circuit including a first relay which operates when the air detection unit detects the supply of air, and a second relay which operates when a driving signal is input from the control unit, and supplies the driving current to the electromagnetic switch via the first relay and the second relay which are connected in series, and the second relay cuts off the driving current after a predetermined time has elapsed.

[0007] The chip pickup device of the present invention includes a ring frame carrier holding section that holds a ring frame carrier having an annular ring frame and an adhesive sheet in a state in which the adhesive sheet is stretched and expanded, a pick-up head that picks up chips on the expanded adhesive sheet, and a slack correction section that corrects slack in the adhesive sheet when the expansion by the ring frame carrier holding section is released, and the slack correction section includes a hot air generating section that blows air heated by a heater onto the adhesive sheet, an air supplying section that feeds air into the hot air generating section, and a detection section that detects the air supplied to the heater. the heater driving unit for supplying a current to the heater, an electromagnetic switch for cutting off the current supplied from the heater driving unit to the heater, a driving circuit for supplying a driving current to the electromagnetic switch, and a control unit for controlling at least the air supply unit and the driving circuit, the driving circuit including a first relay which is activated when the air detection unit detects the supply of air, and a second relay which is activated when a driving signal is input from the control unit, the driving current is supplied to the electromagnetic switch via the first relay and the second relay which are connected in series, and the second relay cuts off the driving current after a predetermined time has elapsed. Effect of the Invention

[0008] According to the present invention, abnormal heat generation in the heater can be appropriately prevented. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a configuration diagram of a main part of a ring frame carrier processing device according to an embodiment of the present invention; [Diagram 2] FIG. 1 is a cross-sectional view for explaining a process of carrying a ring frame carrier into a ring frame carrier processing device according to an embodiment of the present invention. [Diagram 3] FIG. 1 is a cross-sectional view illustrating a state in which a ring frame carrier holding unit of a ring frame carrier processing device according to an embodiment of the present invention has moved to a pick-up operation position. [Figure 4]1 is a cross-sectional view illustrating a process in which a chip is picked up from an expanded adhesive sheet in a chip pickup device according to an embodiment of the present invention; [Diagram 5] FIG. 1 is a cross-sectional view illustrating a state of an adhesive sheet in which the expansion is released after the chip is picked up in the ring frame carrier processing device according to an embodiment of the present invention; [Figure 6] FIG. 11 is a cross-sectional view illustrating a process of correcting slack in an adhesive sheet after a chip is picked up in a ring frame carrier processing device according to an embodiment of the present invention. [Figure 7] FIG. 2 is an explanatory diagram of the configuration of a control system of a slack correction unit provided in the ring frame carrier processing device according to the embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for the purpose of explanation, and can be modified as appropriate according to the specifications of the ring frame carrier processing device and the chip pick-up device. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations will be omitted.

[0011] First, the configuration of the main parts of the ring frame carrier processing device SU will be described with reference to Figures 1 to 6. Figure 1 is a perspective view conceptually showing the main parts of the ring frame carrier processing device SU. Figures 2 to 6 are partial cross-sectional views explaining the configuration and function of the ring frame carrier processing device SU.

[0012] 1 and 2, the ring frame carrier processing device SU includes a ring frame carrier holding section 20 that holds a ring frame carrier 10, and a slack correction section 30 that corrects slack in an adhesive sheet 11 of the ring frame carrier 10. The ring frame carrier 10 has an annular ring frame 12 and a stretchable adhesive sheet 11 stretched over the ring frame 12. A plurality of chips 13 formed by dividing a wafer into individual pieces are held on the upper surface (adhesive surface) of the adhesive sheet 11.

[0013] The ring frame carrier holding section 20 is equipped with a lifting section 22 fixed above a plurality of (four in this example) support columns 21, and a drive section 23 that raises and lowers the lifting section 22 by moving the support columns 21 up and down. The lifting section 22 is configured with an annular ring frame holder 24 fixed above the plurality of support columns 21, and a ring frame guide 25 fixed to the underside of the ring frame holder 24. The ring frame guide 25 has the function of supporting and holding both ends of the ring frame 12 of the ring frame carrier 10 from below.

[0014] 1 and 2, a cylindrical sheet expansion ring 26 is disposed below the lifting unit 22, the position of which is fixed relative to the driving unit 23. The sheet expansion ring 26 is open at the top, and an annular tip portion 26a is formed at the top. An ejector 27 is disposed inside the sheet expansion ring 26. The ejector 27 moves up and down (lifts and lowers) by an ejector lifting mechanism (not shown).

[0015] The drive unit 23 is moved horizontally by a drive unit movement mechanism (not shown). When the drive unit 23 moves horizontally, the support 21, the lifting unit 22 (ring frame retainer 24, ring frame guide 25), and the sheet expansion ring 26 move horizontally together. Meanwhile, the horizontal position of the ejector 27 is fixed and not linked to the horizontal movement of the drive unit 23. Hereinafter, the horizontal position of the ejector 27 is referred to as the pick-up operation position PP.

[0016] 2 shows a state in which the drive unit 23 has moved to a hot air blowing position close to the ejection unit 31 of the slack correction unit 30. The ejection unit 31 is fixed in position and is not linked to the horizontal movement of the drive unit 23. High-temperature air (hot air HA) heated by a heater is ejected from the tip of the ejection unit 31 (see FIG. 6). The position of the ejection unit 31 and the ejection direction of the hot air HA are set so that the hot air HA is blown onto the adhesive sheet 11 that has become loose after the expansion by the ring frame carrier holding unit 20 described below is released.

[0017] Next, the process of loading the ring frame carrier 10 into the ring frame guide 25 of the ring frame carrier holding section 20 will be described with reference to Figures 1 and 2. In this embodiment, the ring frame carrier 10 is automatically loaded into the ring frame guide 25 by a transport means having at its tip a robot hand 14 that supports the ring frame 12 from below with two forks (loading process). Similarly, the ring frame carrier 10 held in the ring frame guide 25 is automatically removed by a transport means having at its tip a robot hand 14 (unloading process).

[0018] In the carrying-in process, the transport means inserts the robot hand 14, which supports the ring frame carrier 10 from below, to a predetermined position between the ring frame presser 24 of the lifting / lowering section 22 and the ring frame guide 25. Next, the transport means moves the robot hand 14 downward to transfer the ring frame carrier 10 to the ring frame guide 25. Next, the transport means removes the robot hand 14 from the lifting / lowering section 22. Through this operation, the ring frame carrier 10 is placed at a predetermined position on the ring frame guide 25 (see FIG. 2). In the carrying-out process, the transport means operates the robot hand 14 in the opposite manner to the carrying-in process.

[0019] 3 shows a state in which the drive unit moving mechanism moves the drive unit 23 in the horizontal direction so that the vicinity of the center of the ring frame 12 is the position of the ejector 27 (pickup operation position PP) after the ring frame carrier 10 is carried into the ring frame guide 25. In plan view, in the ring frame carrier 10 held by the ring frame guide 25, the adhesive sheet 11 between the multiple chips 13 on the adhesive sheet 11 and the ring frame 12 is at the position of the tip portion 26a of the sheet expansion ring 26. Also, in plan view, the multiple chips 13 on the adhesive sheet 11 are in the internal opening of the ring frame holder 24, and the ring frame 12 is in a position overlapping at least a part of the ring frame holder 24.

[0020] Next, referring to Figures 4 and 5, a chip pick-up process using a chip pick-up device PU (Figure 4) equipped with a ring frame carrier processing device SU and a pick-up head PH that picks up chips 13 on an adhesive sheet 11 will be described. The pick-up head PH moves horizontally and moves up and down by a pick-up head moving mechanism (not shown). Pick-up of chips 13 on the adhesive sheet 11 is performed with the adhesive sheet 11 stretched and expanded.

[0021] First, the step of expanding the adhesive sheet (sheet expanding step) will be described with reference to Fig. 4. In the sheet expanding step, after the ring frame carrier 10 is held by the ring frame guide 25, the drive unit 23 lowers the lifting unit 22. As a result, the back surface of the adhesive sheet 11 stretched on the ring frame 12 of the ring frame carrier 10 comes into contact with the tip portion 26a of the sheet expanding ring 26. When the drive unit 23 further lowers the lifting unit 22, the ring frame carrier 10 is released from the ring frame guide 25, and the back surface of the adhesive sheet 11 is supported by the tip portion 26a of the sheet expanding ring 26.

[0022] When the drive unit 23 further lowers the lift unit 22, the lower surface of the ring frame presser 24 comes into contact with the upper surface of the ring frame 12. When the drive unit 23 further lowers the lift unit 22, the ring frame 12 is pushed down by the ring frame presser 24, and the ring frame 12 is lowered to a position lower than the height of the tip end 26a of the sheet expansion ring 26 (the state shown in FIG. 4). In this state, the adhesive sheet 11 is pulled toward the outer periphery and expanded. In this way, the ring frame carrier holding unit 20 holds the ring frame carrier 10 having the annular ring frame 12 and adhesive sheet 11, in a state in which the adhesive sheet 11 is pulled and expanded.

[0023] Next, referring to Fig. 4, a process (chip pick-up process) of picking up the chip 13 on the expanded adhesive sheet 11 by the pick-up head PH will be described. In the chip pick-up process, first, the drive unit moving mechanism moves the drive unit 23 in the horizontal direction to move the chip 13 to be picked up to the pick-up work position PP. At this time, the drive unit moving mechanism moves the drive unit 23 in the horizontal direction based on the position of the chip 13 recognized by an image recognition device equipped with a camera (not shown). Next, the ejector lifting mechanism lifts the ejector 27 to slightly lift the adhesive sheet 11 from below. The ejector 27 has a function of heating the adhesive sheet 11 to reduce the adhesive force of the adhesive sheet 11.

[0024] Next, the pickup head moving mechanism moves the pickup head PH to above the chip 13 to be picked up, and lowers the pickup head PH. Once the pickup head PH holds (adsorbs) the chip 13, the pickup head moving mechanism then raises the pickup head PH. At this time, a push-up member (not shown) built into the ejector 27 is protruded from the upper surface of the ejector 27 in accordance with the rise of the pickup head PH, and pushes up the chip 13. In this way, the ejector 27 assists in peeling the chip 13 from the adhesive sheet 11 by heating and pushing up.

[0025] Next, the PH moving mechanism moves the PH holding the chip 13 to a target position (not shown) to perform a predetermined operation. The predetermined operation performed by the PH is to mount or bond the chip 13 onto a substrate, mount (transfer) the chip 13 onto a tray or relay stage, or transfer it to another work head.

[0026] 4, the push-up member of the ejector 27 is then lowered and placed inside the ejector 27. Thereafter, the process of moving the chip 13 to be picked up to the pick-up work position PP, pushing it up by the ejector 27, and picking up the chip 13 by the pick-up head PH is repeated, so that the multiple chips 13 supplied by the ring frame carrier 10 are picked up in order and placed on the transfer target.

[0027] When the pick-up operation of the chips 13 is completed, the ring frame carrier 10 is carried out from the ring frame guide 25 by the transport means. Fig. 5 shows a state in which the drive unit 23 raises the lifting unit 22 to move the ring frame carrier 10 to a height at which it can be carried out, and the expansion of the adhesive sheet 11 by the ring frame carrier holding unit 20 is released.

[0028] 5, the adhesive sheet 11 stretched on the ring frame 12 is expanded in the sheet expanding process, and is further heated in the expanded state in the chip pick-up process by the ejector 27, and is repeatedly pushed upward, causing slack (stretching). When the adhesive sheet 11 is in a slack state, the operation of the robot hand 14 of the transport means in the unloading process is hindered. For example, the robot hand 14 is prevented from entering below the ring frame carrier 10 held by the ring frame guide 25.

[0029] Therefore, prior to the carrying-out step, a step (slack correction step) is carried out in which the slack of the adhesive sheet 11, which has been released from the expansion by the ring frame carrier holding unit 20, is corrected by the slack correction unit 30. Fig. 6 illustrates a schematic of the correction of slack in the adhesive sheet 11 by the slack correction unit 30. In the slack correction step, first, the drive unit moving mechanism moves the drive unit 23 to the hot air blowing position (the state shown in Fig. 6). Next, the slack correction unit 30 ejects hot air HA (high temperature air) from the tip of the ejection unit 31 for a predetermined period of time. The adhesive sheet 11 heated by the hot air HA contracts, and the slack is eliminated.

[0030] Thus, the chip pick-up device PU includes a ring frame carrier holding unit 20 that holds a ring frame carrier 10 having an annular ring frame 12 and an adhesive sheet 11 in a state in which the adhesive sheet 11 is pulled and expanded, a pick-up head PH that picks up chips 13 on the expanded adhesive sheet 11, and a slack correction unit 30 that corrects slack in the adhesive sheet after the expansion by the ring frame carrier holding unit 20 is released. The slack correction unit 30 blows hot air HA (high-temperature air) from the tip of a blowing unit 31 onto the adhesive sheet 11. This eliminates slack in the adhesive sheet 11 before the carrying-out process.

[0031] Next, the configuration and function of the slack correction unit 30 that corrects slack in the adhesive sheet 11 whose expansion has been released will be described with reference to Fig. 7. The slack correction unit 30 includes a hot air generation unit 33 that ejects air (hot air HA) heated by a heater 32 from an ejection unit 31 and blows it onto the adhesive sheet 11, an air supply unit 35 such as a valve that sends air CA (cold air) supplied from an air source 34 to the hot air generation unit 33, and an air detection unit 36 ​​such as a flowmeter that detects the flow of the air CA supplied to the heater 32. The air CA supplied from the air supply unit 35 passes through the air detection unit 36 ​​and is sent to the hot air generation unit 33, heated by the heater 32, and ejected from the tip of the ejection unit 31 as hot air HA.

[0032] The slack correction unit 30 also includes a heater drive unit 37 that supplies current to the heater 32, an electromagnetic switch 38 that cuts off heater current Ih supplied from the heater drive unit 37 to the heater 32, a drive circuit 39 that supplies drive current Id to the electromagnetic switch 38, a control unit 40 that controls at least the air supply unit 35 and the drive circuit 39, and an operation unit 41 such as a touch panel. The operation unit 41 is connected to an input terminal T1 of the control unit 40. The hot air HA sprayed from the slack correction unit 30 is manually turned on and off from the operation unit 41.

[0033] 7, the air supply unit 35 is connected to the output terminal T2 of the control unit 40. The air supply unit 35 is controlled by an air supply signal S1 output from the output terminal T2 of the control unit 40. Specifically, when the air supply signal S1 is ON, the air supply unit 35 supplies the air CA supplied from the air source 34 toward the hot air generation unit 33. On the other hand, when the air supply signal S1 is OFF, the air supply unit 35 cuts off the supply of the air CA supplied from the air source 34 to the hot air generation unit 33.

[0034] 7, the drive circuit 39 includes a first relay 42, a second relay 43, and a relay relay 44 connected in series. The first relay 42 is activated by an air detection signal S2 output from the air detector 36.

[0035] The relay relay 44 is connected to the output terminal T3 of the control unit 40. The relay relay 44 has a function of relaying the drive signal S3 output from the output terminal T3 of the control unit 40 to the second relay 43, and outputting the drive signal S3 as a trigger signal S4 to the heater drive unit 37. The second relay 43 is operated by the drive signal S3 relayed by the relay relay 44. Note that the trigger signal S4 may be output to the heater drive unit 37 via the relay relay 44, or may be output directly from the control unit 40 to the heater drive unit 37.

[0036] 7, the second relay 43 has a function of relaying the drive current Id of the electromagnetic switch 38, which is supplied from the drive power supply 45, to the first relay 42. When the drive signal S3 is ON, the second relay 43 relays the drive current Id supplied from the drive power supply 45 to the first relay 42. When the drive signal S3 is OFF, the second relay 43 cuts off relay of the drive current Id supplied from the drive power supply 45 to the first relay 42.

[0037] The second relay 43 is a time relay that cuts off the drive current Id after a predetermined time has elapsed. When the drive signal S3 is turned ON, a built-in timer of the second relay 43 turns ON, and when the predetermined time has elapsed, the second relay 43 cuts off relay of the drive current Id to the first relay 42. Here, the predetermined time is set to a time that will not cause the heater 32 to malfunction due to abnormal heat generation caused by empty heating of the heater 32, even if air CA is not fed to the hot air generating unit 33.

[0038] 7, the first relay 42 has a function of relaying the driving current Id supplied via the second relay 43 to the electromagnetic switch 38. When the air detection signal S2 is ON (a state in which the supply of air is detected), the first relay 42 relays the driving current Id to the electromagnetic switch 38. When the air detection signal S2 is OFF (a state in which the supply of air is not detected), the first relay 42 cuts off relay of the driving current Id to the electromagnetic switch 38. Note that the function realized by the first relay 42 and the air detection unit 36 ​​may be realized by a flow switch FS in which a flow sensor and a relay are integrated.

[0039] Thus, the drive circuit 39 includes a first relay 42 that operates when the air detection unit 36 ​​detects the supply of air CA (flow of air CA), and a second relay 43 that operates when a drive signal S3 is input from the control unit 40. The drive circuit 39 supplies a drive current Id supplied from a drive power supply 45 to the electromagnetic switch 38 via the first relay 42 and second relay 43 connected in series, and the second relay 43 cuts off the drive current Id after a predetermined time has elapsed.

[0040] 7, the heater driving unit 37 includes a third relay 46 such as a solid-state relay and a temperature regulator 47 connected in series. The temperature signal S5 of the heater 32 measured by a temperature sensor 48 such as a thermocouple that measures the temperature of the heater 32, and a trigger signal S4 relayed by a relay relay 44 of the driving circuit 39 from the driving signal S3 output from the control unit 40 are input to the temperature regulator 47. The temperature regulator 47 outputs a temperature control signal S6 and an error signal S7 based on the trigger signal S4 and the temperature signal S5. The third relay 46 is operated by the temperature control signal S6 output from the temperature regulator 47. The error signal S7 output from the temperature regulator 47 is input to an input terminal T4 of the control unit 40.

[0041] When the trigger signal S4 (drive signal S3) is OFF, the temperature regulator 47 outputs the temperature control signal S6 that is OFF. When the trigger signal S4 (drive signal S3) is ON and the temperature signal S5 indicates that the temperature of the heater 32 is within the normal range, the temperature regulator 47 outputs the temperature control signal S6 that is ON. When the trigger signal S4 (drive signal S3) is ON and the temperature signal S5 indicates that the temperature of the heater 32 is within an abnormal range, such as abnormal heat generation, the temperature regulator 47 outputs the temperature control signal S6 that is OFF.

[0042] Furthermore, the temperature regulator 47 outputs an OFF error signal S7 when the temperature signal S5 indicates that the temperature of the heater 32 is in the normal range, and outputs an ON error signal S7 when the temperature signal S5 indicates that the temperature of the heater 32 is in the abnormal range.

[0043] 7, the third relay 46 has a function of relaying the heater current Ih supplied from the heater power supply 49 to the electromagnetic switch 38. When the temperature adjustment control signal S6 is ON, the third relay 46 relays the heater current Ih supplied from the heater power supply 49 to the electromagnetic switch 38. When the temperature adjustment control signal S6 is OFF, the third relay 46 cuts off relay of the heater current Ih supplied from the heater power supply 49 to the electromagnetic switch 38.

[0044] When the drive current Id is being supplied from the drive circuit 39 and the heater current Ih is being supplied from the heater drive unit 37, the electromagnetic switch 38 relays the heater current Ih to the heater 32. That is, the heater current Ih is supplied from the heater power supply 49 to the heater 32. On the other hand, when the heater current Ih is being supplied from the heater drive unit 37 but the drive current Id is not being supplied from the drive circuit 39, the electromagnetic switch 38 cuts off the supply of the heater current Ih to the heater 32.

[0045] 7, the conditions under which the drive circuit 39 supplies the drive current Id to the electromagnetic switch 38 will be described. The drive circuit 39 supplies the drive current Id to the electromagnetic switch 38 when the drive signal S3 output from the control unit 40 is ON and the air detection signal S2 output from the air detection unit 36 ​​is ON. Furthermore, the drive circuit 39 cuts off the supply of the drive current Id to the electromagnetic switch 38 when the drive signal S3 output from the control unit 40 is ON and the air detection signal S2 output from the air detection unit 36 ​​is OFF.

[0046] Furthermore, the drive circuit 39 cuts off the drive current Id when a predetermined time has elapsed since starting the supply of the drive current Id to the electromagnetic switch 38. This cuts off the supply of the heater current Ih to the heater 32, making it possible to prevent the heater 32 and other components from breaking down due to abnormal heat generation.

[0047] 7, the control by the control unit 40 of the operation of the slack correction unit 30 to blow hot air HA onto the adhesive sheet 11 (operation of ejecting hot air HA) in the slack correction process will be described. The operation of the slack correction unit 30 to eject hot air HA is automatically performed in the slack correction process in the ring frame carrier processing device SU (chip pick-up device PU), and is also performed by operation from the operation unit 41, such as for maintenance work on the ring frame carrier processing device SU (chip pick-up device PU).

[0048] 7, in the operation of spraying hot air HA, the control unit 40 turns on the air supply signal S1 and the drive signal S3. When the air supply signal S1 is turned on, air CA supplied from the air source 34 is supplied from the air supply unit 35 to the hot air generation unit 33. When the drive signal S3 is turned on, the trigger signal S4 is turned on, and temperature control by the temperature regulator 47 of the heater drive unit 37 is started. When the temperature of the heater 32 is normal (the temperature signal S5 is in the normal range), a heater current Ih is supplied from the heater drive unit 37 to the electromagnetic switch 38.

[0049] Furthermore, when the drive signal S3 is turned ON, the timer of the second relay 43 is turned ON and the drive current Id supplied from the drive power supply 45 is relayed to the first relay 42. When the air detection signal S2 is ON (a state in which the supply of air is detected), the first relay 42 relays the drive current Id to the electromagnetic switch 38. That is, the drive current Id is supplied from the drive circuit 39 to the electromagnetic switch 38. As a result, the heater current Ih supplied from the heater power supply 49 is supplied to the heater 32 via the electromagnetic switch 38.

[0050] 7, air CA supplied to hot air generation unit 33 is heated by heater 32, the temperature of which has been increased by heater current Ih, and becomes hot air HA, which is then ejected from ejection unit 31. In this manner, when control unit 40 turns on air supply signal S1 and drive signal S3, and air detection unit 36 ​​detects the supply of air CA, heater current Ih is supplied to heater 32, and air CA heated by heater 32 becomes hot air HA, and is ejected from ejection unit 31.

[0051] The second relay 43 cuts off the supply of the driving current Id when a predetermined time has elapsed since the drive signal S3 turned ON and the built-in timer turned ON. This cuts off the driving current Id supplied from the drive circuit 39 to the electromagnetic switch 38, and cuts off the heater current Ih supplied to the heater 32 via the electromagnetic switch 38. Meanwhile, since the air supply signal S1 remains ON, the supply of air CA to the hot air generator 33 via the air supply unit 35 continues, and the heater 32, whose temperature had risen, is cooled by the air CA to about room temperature.

[0052] Furthermore, if the slack in the adhesive sheet 11 is corrected before the timer of the second relay 43 turns OFF after a predetermined time has elapsed, the control unit 40 is set to turn OFF the drive signal S3 before the predetermined time has elapsed. Even in this case, the air supply signal S1 remains ON, so the supply of air CA to the hot air generating unit 33 via the air supply unit 35 continues, and the heater 32, whose temperature has risen, is cooled to approximately room temperature by the air CA. That is, the control unit 40 allows the air supply unit 35 to continue supplying air CA even after turning OFF the drive signal S3, and then turns OFF the air supply signal S1 to stop the supply of air CA.

[0053] 7, the control unit 40 turns off the air supply signal S1 and the drive signal S3 when a preset time has elapsed since the air supply signal S1 and the drive signal S3 were turned on. The preset time is set in consideration of the time required for the heater 32 to cool down to room temperature after the timer of the second relay 43 turns off. When the trigger signal S4 turns off, the temperature adjustment control by the temperature regulator 47 of the heater drive unit 37 ends. Furthermore, when the air supply signal S1 turns off, the supply of air CA to the hot air generator 33 via the air supply unit 35 is cut off (stopped).

[0054] The control unit 40 may keep the air supply signal S1 ON even after turning off the drive signal S3 to allow the air supply unit 35 to continue supplying the air CA, and then turn off the air supply signal S1 to stop the supply of the air CA. In other words, the air supply unit 35 operates under the control of the control unit 40 regardless of the state of the electromagnetic switch 38.

[0055] Next, a protection function of the slack correction unit 30 during abnormal operation will be described with reference to Fig. 7. Even if the air supply signal S1 and drive signal S3 are turned ON, air CA is supplied from the air supply unit 35, and temperature control by the temperature regulator 47 of the heater drive unit 37 is started, the slack correction unit 30 does not supply heater current Ih to the heater 32 if the air detection unit 36 ​​does not detect the supply of air CA or if the flow rate is insufficient (air detection signal S2 is OFF).

[0056] This prevents the heater 32 from running dry when air CA is not being supplied. For example, if there is a malfunction of the air source 34, or a missing pipe in the path from the air source 34 to the air supply unit 35, or in the path from the air supply unit 35 to the air detection unit 36, air CA is not supplied to the heater 32, and the heater 32 generates abnormal heat. This can prevent a malfunction due to running dry, in which the heater 32 generates abnormal heat.

[0057] 7, the air supply unit 35 is controlled by an air supply signal S1 from the control unit 40 regardless of the state of the electromagnetic switch 38. Therefore, the supply of air CA continues after the electromagnetic switch 38 cuts off the heater current Ih. Therefore, even if the flow rate of the air CA supplied to the hot air generation unit 33 is insufficient and the heater 32 is abnormally heated, the heater 32 can be cooled by the continuously supplied air CA, and breakdowns of the heater 32, etc. can be prevented.

[0058] On the other hand, in the case of a failure such as a missing tube in the path from the air detection unit 36 ​​to the hot air generation unit 33, which causes the air CA not to be supplied to the heater 32, the air detection unit 36 ​​detects the supply of air CA (the air detection signal S2 is ON), and the heater current Ih is supplied to the heater 32. In other words, the heater 32 goes into an empty-heating state, and if this state continues for a long period of time, there is a risk of the heater 32 failing due to abnormal heating.

[0059] In the slack correction unit 30 of this embodiment, when a predetermined time has elapsed that is shorter than the time from when the drive signal S3 is turned ON until the heater 32 breaks down due to dry heating, the second relay 43, which is a time-limit relay, cuts off the drive current Id of the electromagnetic switch 38, thereby cutting off the heater current Ih that had been supplied to the heater 32. This makes it possible to prevent the heater 32 from breaking down due to dry heating.

[0060] As described above, the ring frame carrier processing apparatus SU of this embodiment includes a ring frame carrier holding section 20 that holds the adhesive sheet 11 in an expanded state by pulling it so that the chip 13 supplied by the ring frame carrier 10 having the annular ring frame 12 and the adhesive sheet 11 can be picked up by the pick-up head PH, and a slack correction section 30 that corrects slack in the adhesive sheet 11 when the expansion by the ring frame carrier holding section 20 is released.

[0061] The slack correction unit 30 includes a hot air generating unit 33 that blows air (hot air HA) heated by a heater 32 onto the adhesive sheet 11, an air supply unit 35 that sends air to the hot air generating unit 33, an air detection unit 36 ​​that detects the air CA supplied to the heater 32, a heater driving unit 37 that supplies a heater current Ih to the heater 32, an electromagnetic switch 38 that cuts off the heater current Ih supplied from the heater driving unit 37 to the heater 32, a driving circuit 39 that supplies a driving current Id to the electromagnetic switch 38, and a control unit 40 that controls at least the air supply unit 35 and the driving circuit 39.

[0062] The drive circuit 39 includes a first relay 42 that operates when the air detection unit 36 ​​detects the supply of air CA, and a second relay 43 that operates when a drive signal S3 is input from the control unit 40, and supplies a drive current Id to the electromagnetic switch 38 via the first relay 42 and second relay 43 connected in series, and the second relay 43 cuts off the drive current Id after a predetermined time has elapsed. This makes it possible to appropriately prevent abnormal heat generation in the heater 32. [Industrial Applicability]

[0063] The ring frame carrier processing device and chip pick-up device of the present invention have the effect of being able to appropriately prevent abnormal heat generation from the heater, and are useful in fields where chips are removed from adhesive sheets and mounted on substrates. [Explanation of symbols]

[0064] 10 Ring Frame Carrier 11 Adhesive sheet 12 Ring Frame 13 Chips 20 Ring frame carrier holder 30 Slack correction section 32 Heater 33 Hot air generator 35 Air supply section 36 Air detector 37 Heater drive unit 38 Electromagnetic Switch 39 Drive circuit 40 Control section 42 First Relay 43 Second Relay CA Air HA Hot Air Id Drive current Ih Heater current PH Pickup Head PU chip pick-up device S3 Drive signal SU Ring Frame Carrier Processing Device

Claims

1. A ring frame carrier processing device including a ring frame carrier holding unit that holds an adhesive sheet in an expanded state by pulling the adhesive sheet so that a pick-up head can pick up a chip supplied by the ring frame carrier having an annular ring frame and an adhesive sheet, and a slack correction unit that corrects slack in the adhesive sheet when the expansion by the ring frame carrier holding unit is released, The slack correction unit is A hot air generating unit that blows air heated by a heater onto the adhesive sheet; an air supply unit that supplies air to the hot air generating unit; an air detection unit that detects air supplied to the heater; a heater driving unit that supplies a current to the heater; an electromagnetic switch that cuts off the current supplied from the heater driving unit to the heater; a drive circuit for supplying a drive current to the electromagnetic switch; A control unit that controls at least the air supply unit and the drive circuit, The drive circuit includes a first relay that is activated when the air detection unit detects the supply of air, and a second relay that is activated when a drive signal is input from the control unit, and supplies the drive current to the electromagnetic switch via the first relay and the second relay connected in series, and the second relay cuts off the drive current after a predetermined time has elapsed.

2. 2. The ring frame carrier processing apparatus according to claim 1, wherein said second relay is a time relay which cuts off said driving current when said predetermined time has elapsed.

3. 2. The ring frame carrier processing apparatus according to claim 1, wherein said air supply unit is operated under control of said control unit regardless of the state of said electromagnetic switch.

4. 2 . The ring frame carrier processing apparatus according to claim 1 , wherein the control unit causes the air supply unit to continue supplying air even after the drive signal is turned off, and then stops the supply of air.

5. A chip pickup device including a ring frame carrier holding section that holds a ring frame carrier having an annular ring frame and an adhesive sheet in a state in which the adhesive sheet is stretched and expanded, a pickup head that picks up chips on the expanded adhesive sheet, and a slack correction section that corrects slack in the adhesive sheet when the expansion by the ring frame carrier holding section is released, The slack correction unit is A hot air generating unit that blows air heated by a heater onto the adhesive sheet; an air supply unit that supplies air to the hot air generating unit; an air detection unit that detects air supplied to the heater; a heater driving unit that supplies a current to the heater; an electromagnetic switch that cuts off the current supplied from the heater driving unit to the heater; a drive circuit for supplying a drive current to the electromagnetic switch; A control unit that controls at least the air supply unit and the drive circuit, The drive circuit includes a first relay that is activated when the air detection unit detects the supply of air, and a second relay that is activated when a drive signal is input from the control unit, and the drive current is supplied to the electromagnetic switch via the first relay and the second relay that are connected in series, and the second relay cuts off the drive current after a predetermined time has elapsed.

6. 6. The chip pickup device according to claim 5, wherein said second relay is a time relay which cuts off said driving current when said predetermined time has elapsed.

7. 6. The chip pickup device according to claim 5, wherein said air supply unit operates under the control of said control unit regardless of the state of said electromagnetic switch.

8. 6. The chip pickup device according to claim 5, wherein the control unit causes the air supply unit to continue supplying air even after the drive signal is turned off, and then stops the supply of air.

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