Method for manufacturing light-emitting device

Abstract

To more reliably separate a light-emitting element from a support substrate in a method for manufacturing a light-emitting device.SOLUTION: A method for manufacturing a light-emitting device includes the steps of: preparing a first structure comprising a support substrate, a first bonding member disposed on the surface of the support substrate, and a plurality of light-emitting elements each having a first surface and a second surface opposite to the first surface, the first surface being in contact with the first bonding member, and a plurality of electrodes being disposed on the second surface side; preparing a second structure comprising a substrate including a base material and a plurality of terminal portions disposed on the surface of the base material, and a second bonding member disposed on the surface of the base material between the plurality of terminal portions and having a thickness greater than that of the terminal portions; arranging the first structure on the second bonding member of the second structure such that the plurality of electrodes and the plurality of terminal portions are opposed to each other with a gap; connecting the plurality of electrodes to the plurality of terminal portions; and after the connecting step, removing the first bonding member and the second bonding member by bringing them into contact with a dissolving solution to separate the support substrate from the plurality of light-emitting elements.SELECTED DRAWING: Figure 2F

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing a light emitting device. [Background technology]

[0002] A light-emitting device having a light-emitting element mounted on a base material is known. In a manufacturing process of such a light-emitting device, when mounting the light-emitting element on the base material, for example, a step of forming a bonding member on the base material, a step of providing the light-emitting element on a support substrate to prepare a support substrate for mounting the light-emitting element, a step of providing the support substrate for mounting the light-emitting element on the bonding member so that the light-emitting element and the bonding member face each other, and a step of peeling off the support substrate from the support substrate for mounting the light-emitting element are performed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2021-103774 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present disclosure is to more reliably separate a light emitting element from a supporting substrate in a manufacturing method for a light emitting device having a light emitting element. [Means for solving the problem]

[0005] A method for manufacturing a light emitting device according to an embodiment of the present disclosure includes the steps of: preparing a first structure including a supporting substrate, a first bonding member disposed on a surface of the supporting substrate, and a plurality of light emitting elements each having a first surface and a second surface opposite to the first surface, the first surface being in contact with the first bonding member, and a plurality of electrodes being disposed on the second surface side; preparing a second structure including a substrate having a base material and a plurality of terminal portions disposed on a surface of the base material, and a second bonding member disposed on the surface of the base material between the plurality of terminal portions and having a thickness greater than that of the terminal portions; disposing the first structure on the second bonding member of the second structure such that the plurality of electrodes and the plurality of terminal portions face each other with a space between them; connecting the plurality of electrodes and the plurality of terminal portions; and, after the connecting step, removing the first bonding member and the second bonding member by contacting them with a dissolving liquid, and peeling the supporting substrate from the plurality of light emitting elements. Effect of the Invention

[0006] According to an embodiment of the present disclosure, in a method for manufacturing a light emitting device having a light emitting element, separation of the light emitting element from the supporting substrate can be performed more reliably. [Brief description of the drawings]

[0007] [Figure 1] 1 is a cross-sectional view illustrating a schematic view of a light emitting device according to a first embodiment. [Figure 2A] 2A to 2C are diagrams illustrating an example of a manufacturing process of the manufacturing method of the light emitting device according to the first embodiment. [Figure 2B] 2A to 2C are diagrams illustrating an example of a manufacturing process of the manufacturing method of the light emitting device according to the first embodiment. [Figure 2C] 2A to 2C are diagrams illustrating an example of a manufacturing process of the manufacturing method of the light emitting device according to the first embodiment. [Figure 2D] 2A to 2C are diagrams illustrating an example of a manufacturing process of the manufacturing method of the light emitting device according to the first embodiment. [Figure 2E] 2A to 2C are diagrams illustrating an example of a manufacturing process of the manufacturing method of the light emitting device according to the first embodiment. [Figure 2F] 2A to 2C are diagrams illustrating an example of a manufacturing process of the manufacturing method of the light emitting device according to the first embodiment. [Figure 2G] 2A to 2C are diagrams illustrating an example of a manufacturing process of the manufacturing method of the light emitting device according to the first embodiment. [Figure 3A] 10A to 10C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a second embodiment. [Figure 3B] 10A to 10C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a second embodiment. [Figure 4A] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a third embodiment. [Figure 4B] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a third embodiment. [Figure 4C] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a third embodiment. [Figure 5A] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a fourth embodiment. [Figure 5B] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a fourth embodiment. [Figure 5C] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a fourth embodiment. [Figure 5D] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a fourth embodiment. [Figure 5E] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a fourth embodiment. [Figure 5F] 13A to 13C are diagrams illustrating an example of a manufacturing process of a manufacturing method for a light emitting device according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, a manufacturing method of an embodiment according to the present disclosure and a light-emitting device obtained by the manufacturing method (hereinafter, sometimes referred to as a "light-emitting device according to an embodiment") will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "upper", "lower", and other terms including these terms) will be used as necessary. However, the use of these terms is for the purpose of facilitating understanding of the invention with reference to the drawings, and the technical scope of the present disclosure is not limited by the meaning of these terms. In addition, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or members.

[0009] In addition, the embodiments shown below are examples of light-emitting devices and the like for embodying the technical ideas of the present disclosure, and do not limit the present disclosure to the following. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are intended to be illustrative, and are not intended to limit the scope of the present disclosure, unless otherwise specified. In addition, the contents described in one embodiment can be applied to other embodiments and modified examples. In addition, the size and positional relationship of the members shown in the drawings may be exaggerated in order to clarify the explanation. In addition, in order to avoid the drawings becoming overly complicated, schematic diagrams that omit the illustration of some elements, or end views that show only the cut surface as a cross-sectional view may be used.

[0010] First Embodiment [Light emitting device] As a premise for explaining the manufacturing method of the light emitting device according to the first embodiment, a configuration example of the light emitting device 1 will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view showing a schematic diagram of the light emitting device according to the first embodiment. FIG. 1 shows a cross section cut so as to pass through a first surface and a plurality of electrodes of the light emitting element. As shown in FIG. 1, the light emitting device 1 according to the first embodiment has a substrate 10, a plurality of light emitting elements 20, a plurality of conductive members 30, and a light reflective member 40. The light emitting device 1 does not have to have the light reflective member 40. In the light emitting device 1, a plurality of light emitting elements 20 are arranged on the substrate 10. For example, a plurality of light emitting elements 20 are arranged in a matrix on the substrate 10.

[0011] The substrate 10 has a flat base material 11 and a plurality of terminal portions 12 arranged on the base material 11. The plurality of terminal portions 12 are arranged spaced apart from one another on a surface 11a of the base material 11. The light-emitting element 20 has a first surface 20a, a second surface 20b on which a plurality of electrodes 22 are arranged on the opposite side of the first surface 20a, and one or a plurality of side surfaces 20c connecting the first surface 20a and the second surface 20b.

[0012] In each light-emitting element 20, each electrode 22 is disposed facing each terminal portion 12. The electrodes 22 of each light-emitting element 20 may have an anode side electrode and a cathode side electrode, and may have three or more electrodes. The terminal portions 12 facing the electrodes 22 of each light-emitting element 20 may have an anode side terminal portion and a cathode side terminal portion, and may have three or more terminal portions. The electrodes 22 of the light-emitting element 20 and the terminal portions 12 of the substrate 10 facing them are electrically connected by a conductive member 30.

[0013] The light reflective member 40 is provided on the front surface 11a of the base material 11, exposes the first surface 20a of the light emitting element 20, and covers the second surface 20b and the side surface 20c. The light reflective member 40 may also cover the side surface of the terminal portion 12, the side surface of the electrode 22, and the side surface of the conductive member 30.

[0014] By covering the side surface 20c of the light-emitting element 20 with the light-reflective member 40, the light emitted from the side surface 20c of the light-emitting element 20 is reflected by the light-reflective member 40. Also, by covering the second surface 20b of the light-emitting element 20 with the light-reflective member 40, the light proceeding downward from the light-emitting element 20 is reflected by the light-reflective member 40. As a result, the light extraction efficiency of the light-emitting device 1 can be improved. Also, the light-reflective member 40 can clearly define the boundary between the light-emitting area and the non-light-emitting area when the light-emitting element 20 is individually turned on. This improves the contrast ratio between the light-emitting area and the non-light-emitting area.

[0015] Each component of the light emitting device 1 will now be described.

[0016] (Substrate 10) The substrate 11 has, for example, a substantially rectangular shape in a plan view. However, the shape is not limited thereto. A transparent substrate or an opaque substrate may be used as the substrate 11. Examples of materials for transparent substrates include glass, quartz, sapphire, ceramics (for example, transparent alumina), and organic films (for example, PET). Examples of materials for opaque substrates include semiconductors (for example, Si, Ge, GaAs, InP), ceramics (for example, alumina, aluminum nitride, silicon nitride), and organic materials (for example, FR4).

[0017] Examples of the terminal portion 12 include metals such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, and Ni, and / or alloys containing at least these metals. On the surface 11a of the substrate 11, a region where the terminal portion 12 is not arranged may or may not be covered with an insulating film.

[0018] (Light emitting element) The light emitting element 20 is, for example, substantially rectangular or substantially square in plan view. However, the shape is not limited thereto. The light emitting element 20 may be, for example, a square with one side of 40 μm or more and 100 μm or less in plan view. In the light emitting element 20, the first surface 20a and the second surface 20b are, for example, parallel to each other. The side surface 20c may be perpendicular to the first surface 20a or may be inclined with respect to the first surface 20a. In the example of FIG. 1, the opposing side surfaces 20c are inclined in a direction narrowing from the first surface 20a side to the second surface 20b side in a cross-sectional view.

[0019] The light emitting element 20 includes a semiconductor laminate and positive and negative electrodes 22 arranged on a second surface 20b, which is the surface of the semiconductor laminate. The light emitting element 20 is flip-chip mounted on the substrate 10 with the second surface 20b, on which the electrodes 22 are arranged, facing the substrate 10. In this case, the first surface 20a located on the opposite side to the second surface 20b becomes the main light extraction surface of the light emitting element 20.

[0020] In the light emitting device 1, the light emitting elements 20 may be arranged two-dimensionally in a matrix on the substrate 10. In this case, the light emitting elements 20 can be arranged in an array with a predetermined interval in each row and column direction. For example, the number of light emitting elements 20 included in the light emitting device 1 can be 100 or more and 2,000,000 or less, preferably 1,000 or more and 500,000 or less, and more preferably 3,000 or more and 150,000 or less. When the light emitting device 1 includes 100 or more light emitting elements, road projection including simple messaging and the like is possible when used for road projection in vehicle headlights and the like. In addition, when the number of light emitting elements included in the light emitting device 1 is 2,000,000 or less, high-definition road projection can be realized, the light emitting device 1 can be made small, and each light emitting element 20 can emit light with sufficient illuminance when individually turned on.

[0021] The light emitting element 20 can be selected to emit light of any wavelength. For example, the light emitting element 20 that emits blue light or green light can be selected from nitride semiconductors (In X Al Y Ga 1-X-Y N, 0≦X, 0≦Y, X+Y≦1) can be selected. As the light emitting element 20 that emits red light, a semiconductor represented by GaAlAs or AlInGaP can be used. Furthermore, a semiconductor light emitting element made of a material other than these can also be used. The composition and emitted color of the light emitting element 20 used can be appropriately selected depending on the purpose.

[0022] (Conductive material) The conductive member 30 may be made of, for example, copper (Cu) or gold (Au). The conductive member 30 may be made of zinc (Zn), chromium (Cr), and / or nickel (Ni), etc. The thickness of the conductive member 30 may be, for example, 3 μm or more and 10 μm or less.

[0023] (Light-reflecting member) The light reflecting member 40 is preferably made of a soft resin having a relatively low elasticity and excellent shape conformability. As the material of the light reflecting member 40, a resin material having good transparency and insulating properties, for example, a thermosetting resin such as an epoxy resin or a silicone resin, can be suitably used. In addition, the light reflecting member 40 is preferably made of a white resin containing particles of a light reflecting material in a base resin. Examples of the light reflecting material include titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, and glass filler.

[0024] [Method for manufacturing the light emitting device according to the first embodiment] Next, a manufacturing method of the light emitting device 1 according to the first embodiment will be described. The manufacturing method of the light emitting device 1 according to the first embodiment includes the steps of: preparing a first structure including a support substrate, a first bonding member disposed on the surface of the support substrate, and a plurality of light emitting elements having a first surface and a second surface opposite to the first surface, the first surface being disposed in contact with the first bonding member, and a plurality of electrodes being disposed on the second surface side; preparing a second structure including a substrate having a base material and a plurality of terminal portions disposed on the surface of the base material, and a second bonding member disposed between the plurality of terminal portions on the surface of the base material and having a thickness greater than that of the terminal portions; disposing the first structure on the second bonding member of the second structure such that the plurality of electrodes and the plurality of terminal portions face each other at a distance; connecting the plurality of electrodes and the plurality of terminal portions; and, after the connecting step, removing the first bonding member and the second bonding member by contacting them with a dissolving solution, and peeling the support substrate from the plurality of light emitting elements.

[0025] Hereinafter, each manufacturing step of the method for manufacturing the light emitting device according to the first embodiment will be described with reference to the drawings.

[0026] 2A to 2G are diagrams illustrating an example of a manufacturing process of the manufacturing method of the light emitting device according to the first embodiment. Specifically, FIG. 2B is a plan view illustrating the manufacturing process of the light emitting device. Also, FIG. 2A and FIGS. 2C to 2G are cross-sectional views illustrating the manufacturing process of the light emitting device. In the explanation of the manufacturing method, "preparing" a component is not limited to manufacturing the component, but also includes acquiring the component, such as purchasing the component or receiving the component.

[0027] (Step of preparing a first structure) First, as shown in FIG. 2A, a first structure 110 is prepared, which includes a support substrate 50, a first bonding member 60 arranged on a surface 50a of the support substrate 50, and a plurality of light-emitting elements 20 each having a first surface 20a and a second surface 20b located opposite the first surface 20a, the first surface 20a and the first bonding member 60 arranged in contact with each other, and a plurality of electrodes 22 arranged on the second surface 20b side.

[0028] Specifically, first, a glass substrate or the like is prepared as the support substrate 50. Then, a material to become the first bonding member 60 is placed on the surface 50a of the support substrate 50. The first bonding member 60 can be placed by using, for example, a screen printing method. The first bonding member 60 preferably has adhesiveness. By making the first bonding member 60 adhesive, it becomes possible to attach and support the light emitting element 20 to be placed later on the first bonding member 60.

[0029] Next, a plurality of light-emitting elements 20 are prepared, and each of the light-emitting elements 20 is attached to the first bonding member 60 so that the first surface 20a of each of the light-emitting elements 20 contacts the first bonding member 60 on the support substrate 50. For example, 100 to 2,000,000 light-emitting elements 20 can be attached to the first bonding member 60 in a matrix form.

[0030] The first bonding member 60 may be made of a material that is dissolvable in a predetermined solvent. The first bonding member 60 preferably has the above-mentioned adhesiveness and chemical resistance to metal plating. The first bonding member 60 may be made of, for example, a phenol-based resin, an epoxy-based resin, a silicone-based resin, or an acrylic-based resin. The first bonding member 60 may be, for example, a resist.

[0031] (Step of preparing a second structure) Next, as shown in Figures 2B and 2C, a second structure 120 is prepared, which includes a substrate 10 having a base material 11 and a plurality of terminal portions 12 arranged on a surface 11a of the base material 11, and a second bonding member 70 arranged between the plurality of terminal portions 12 on the surface 11a of the base material 11 and having a thickness greater than that of the terminal portions 12. Note that, for convenience, in Figure 2B, the base material 11 is shown without a dot pattern, the terminal portions 12 are shown with a high-density dot pattern, and the second bonding member 70 is shown with a low-density dot pattern. Also, Figure 2C is a cross-sectional view taken along line IIC-IIC in Figure 2B.

[0032] Specifically, first, a substrate 10 is prepared, which has a base material 11 and a plurality of terminal portions 12. The substrate 10 can be prepared, for example, by forming a plurality of pairs of terminal portions 12 on a surface 11a of a flat base material 11 such as a silicon plate by a plating method, a sputtering method, a vapor deposition method, or the like.

[0033] Next, a second bonding member 70 is formed on the front surface 11a of the base material 11, the second bonding member 70 being disposed between the pair of terminal portions 12 and being thicker than the thickness of the terminal portions 12. Specifically, the second bonding member 70 having a planar size smaller than the planar size of the light emitting element 20 in a cross-sectional view is formed in the region where the light emitting element 20 is to be placed, so that each electrode 22 of the light emitting element 20 and each terminal portion 12 of the substrate 10 can face each other at a distance when the light emitting element 20 is placed later.

[0034] The second bonding member 70 can be formed by using a photolithography method or a screen printing method. The photolithography method is preferable because it can form a fine pattern. The second bonding member 70 preferably has adhesiveness. When the second bonding member 70 has adhesiveness, it becomes possible to attach and support the light emitting element 20 to be placed later on the second bonding member 70.

[0035] The second bonding member 70 may be made of a material that can be dissolved in a predetermined solvent. For example, the second bonding member 70 may be made of a material appropriately selected from the materials exemplified as the first bonding member 60. The second bonding member 70 may be made of the same material as the first bonding member 60, or may be made of a different material. It is preferable to select a material that can be dissolved in the same solvent as the first bonding member 60 for the second bonding member 70. In this case, the second bonding member 70 and the first bonding member 60 can be dissolved simultaneously, and therefore the manufacturing process can be simplified.

[0036] The cross-sectional shape of the second bonding member 70 may be rectangular or square. That is, the contact surface (upper surface) of the second bonding member 70 that contacts the light emitting element 20 and the side surface can be in a substantially perpendicular relationship. This makes it possible to accurately ensure the contact area between the light emitting element 20 and the second bonding member 70, and the area in which the conductive member 30 that connects the terminal portion 12 of the substrate 10 and the electrode 22 of the light emitting element 20 is to be disposed later.

[0037] The cross-sectional shape of the second bonding member 70 may be tapered. The cross-sectional shape may be such that the width increases from the surface 11a of the base material 11 toward the light emitting element 20, or the width decreases from the surface 11a of the base material 11 toward the light emitting element 20. If the cross-sectional shape increases from the surface 11a of the base material 11 toward the light emitting element 20, the contact area between the light emitting element 20 and the second bonding member 70 can be increased, and the light emitting element 20 and the second bonding member 70 can be more reliably attached to each other.

[0038] By forming the second bonding member 70 thicker than the terminal portion 12, when the light emitting element 20 is later placed on the second bonding member 70, the terminal portion 12 provided on the base material 11 and the electrode 22 of the light emitting element 20 to be placed on the second bonding member 70 can be spaced apart from each other with the second bonding member 70 sandwiched therebetween. The thickness of the second bonding member 70 can be, for example, 5 μm or more and 20 μm or less.

[0039] (Step of placing the first structure on the second structure) Next, as shown in FIG. 2D, the first structure 110 is placed on the second bonding member 70 of the second structure 120 such that the multiple electrodes 22 and the multiple terminal portions 12 face each other at a distance.

[0040] Specifically, first, the second structure 120 is placed on a stage with each terminal portion 12 facing upward. Then, the first structure 110 is placed on the second structure 120 so that each electrode 22 faces each terminal portion 12. At this time, the upper surface of the second bonding member 70 contacts the second surface 20b located between adjacent electrodes 22 of each light-emitting element 20. A part of the upper surface of the second bonding member 70 may cover an end of the electrode 22. Each electrode 22 of the light-emitting element 20 and each terminal portion 12 of the substrate 10 are placed at a distance from each other.

[0041] Next, the light emitting element 20 and the substrate 10 arranged on the stage are heated at a predetermined temperature and pressurized. At this time, the light emitting element 20 and the substrate 10 are thermocompression bonded on the stage via the second bonding member 70. That is, the second bonding member 70 softens, and the light emitting element 20 and the substrate 10 are bonded via the second bonding member 70 due to the adhesiveness of the second bonding member 70. As a result, the third structure 130 is obtained. The predetermined temperature is set to a temperature at which the second bonding member 70 softens or higher. For example, if the temperature at which the second bonding member 70 softens is 90°C, it is preferable to set the predetermined temperature to 95°C or higher, including a margin. In addition, the heating time at the predetermined temperature is preferably, for example, 1 minute or more and 1 hour or less. By heating under such conditions, the second bonding member 70 can be softened to a degree that it exhibits adhesiveness.

[0042] (Step of connecting a plurality of electrodes to a plurality of terminal portions) Next, as shown in Fig. 2E, the electrodes 22 and the terminals 12 are connected to each other. Specifically, for example, electrolytic plating or electroless plating is used to form a conductive member 30 that electrically connects the electrodes 22 of the light-emitting element 20 to the terminals 12 of the substrate 10. The conductive member 30 can be made of, for example, copper (Cu) or gold (Au). The conductive member 30 may also be made of zinc (Zn), chromium (Cr), and / or nickel (Ni), etc.

[0043] The second bonding member 70 has a function of supporting the light emitting element 20, and also a function of serving as a plating mask when connecting the terminal portion 12 and the electrode 22. Therefore, it is not necessary to arrange a plating mask again before this step, and the number of steps can be reduced. Furthermore, when a plating mask is arranged in addition to the second bonding member 70, a different dissolving solution may be required when removing the plating mask, which may complicate the process. However, by giving the second bonding member 70 two functions, a function of supporting the light emitting element 20 and a function of serving as a plating mask, such a concern does not arise.

[0044] (Step of peeling off the supporting substrate) Next, as shown in FIG. 2F, the support substrate 50 is peeled off from the plurality of light emitting elements 20. For example, the first bonding member 60 and the second bonding member 70 are removed by contacting them with a dissolving liquid, and the support substrate 50 is peeled off from the plurality of light emitting elements 20. Specifically, for example, with the first structure 110 facing downward and the second structure 120 facing upward, the first bonding member 60 and the second bonding member 70 are immersed in the dissolving liquid, the first bonding member 60 and the second bonding member 70 are dissolved, and the support substrate 50 is dropped downward. Alternatively, the dissolving liquid may be sprayed onto the first bonding member 60 and the second bonding member 70 using a nozzle, the first bonding member 60 and the second bonding member 70 are dissolved, and the support substrate 50 may be peeled off.

[0045] The dissolving liquid may be a mixed liquid containing sulfuric acid and an organic solvent, etc. As the organic solvent, for example, at least one solvent selected from the group consisting of alcohol solvents such as 2-propanol, ketone solvents such as acetone, ester solvents such as ethyl acetate, and ether solvents can be used.

[0046] (Step of placing light reflective member) Next, as shown in FIG. 2G, a light-reflecting member 40 is disposed on the substrate 10 as necessary. For example, an uncured white resin that covers the light-emitting elements 20 is disposed on the substrate 10, and the white resin is made to flow and fill between the opposing side surfaces 20c of the adjacent light-emitting elements 20 and between the second surface 20b of the light-emitting elements 20 and the surface 11a of the base material 11. The white resin is then cured to form the light-reflecting member 40. The uncured white resin can be disposed on the substrate 10 by, for example, potting, spraying, or printing. When the first surface 20a of the light-emitting element 20 is covered with the white resin, the first surface 20a is exposed by polishing or the like.

[0047] Through the above steps, the light emitting device 1 in which a plurality of light emitting elements 20 are mounted on the substrate 10 can be manufactured.

[0048] As described above, in the manufacturing method of the light emitting device 1, after the step of connecting the electrodes 22 and the terminal portions 12, the supporting substrate 50 is peeled off from the light emitting elements 20. That is, when peeling off the supporting substrate 50, the electrodes 22 of the light emitting elements 20 are already connected to the terminal portions 12 of the substrate 10. Therefore, the light emitting elements 20 are not carried away together with the supporting substrate 50, and peeling of the light emitting elements 20 and the supporting substrate 50 can be performed more reliably. In addition, since the first bonding member 60 and the second bonding member 70 are removed by contacting them with a dissolving liquid, the supporting substrate 50 can be easily peeled off from the light emitting elements 20 with fewer steps.

[0049] Furthermore, in the process of peeling off the support substrate 50, the first bonding member 60 and the second bonding member 70 are immersed in a dissolving liquid and dissolved while the first structure 110 faces downward and the second structure 120 faces upward, and the support substrate 50 is then dropped, thereby eliminating the need to pick up the support substrate 50 using a suction tool or the like.

[0050] Second to Fourth Embodiments In the second to fourth embodiments, examples of manufacturing methods for the light emitting device 1 different from that of the first embodiment will be described.

[0051] [Method of manufacturing the light emitting device according to the second embodiment] In the method for manufacturing the light emitting device according to the second embodiment, in the step of preparing a first structure, a plurality of first bonding members spaced apart from each other are arranged on the surface of the supporting substrate in correspondence with the positions of the plurality of light emitting elements.

[0052] 3A and 3B are cross-sectional views that diagrammatically show an example of a manufacturing process of the method for manufacturing the light emitting device according to the second embodiment.

[0053] 3A and 3B show a process for preparing a first structure 110A. The first structure 110A differs from the first structure 110 in that the single continuous first bonding member 60 is replaced with a plurality of first bonding members 60A spaced apart from each other.

[0054] 3A, a support substrate 50 is prepared, and a plurality of first bonding members 60A spaced apart from each other are arranged on a surface 50a of the support substrate 50 in correspondence with the positions of the plurality of light-emitting elements 20. The plurality of first bonding members 60A can be arranged by using, for example, photolithography or screen printing.

[0055] In this step, alignment marks 60M to be used when disposing the light emitting element 20 on the first bonding member 60 may be disposed on the surface 50a of the support substrate 50 together with the first bonding member 60A, using the same material as the first bonding member 60A. The positions and number of the alignment marks 60M are arbitrary, but for example, when the surface 50a of the support substrate 50 is rectangular in a plan view, a pair of alignment marks 60M may be disposed in the diagonal direction of the surface 50a. The alignment marks 60M may be, for example, cross-shaped in a plan view.

[0056] 3B, a plurality of light emitting elements 20 are prepared, and each light emitting element 20 is attached to the first bonding member 60A so that the first surface 20a of each light emitting element 20 contacts the first bonding member 60A on the support substrate 50. For example, the first bonding member 60A may be a material appropriately selected from the materials exemplified as the first bonding member 60. When arranging each light emitting element 20, the alignment mark 60M is used as a reference, so that each first bonding member 60A and each light emitting element 20 can be aligned with high accuracy.

[0057] Thereafter, the same steps as those in FIGS. 2B to 2G of the first embodiment are carried out to obtain the light emitting device 1.

[0058] Thus, in the second embodiment, in the step of preparing the first structure 110A, a plurality of first bonding members 60A are arranged on the surface 50a of the support substrate 50 so as to correspond to the positions of the plurality of light emitting elements 20 and are spaced apart from each other. This allows the amount of the first bonding members 60A to be reduced compared to the amount of the first bonding members 60 in the first embodiment. As a result, the time required to remove the first bonding members 60A and the second bonding members 70 can be reduced compared to the time required to remove the first bonding members 60 and the second bonding members 70 in the first embodiment. In addition, the amount of residues generated when removing the first bonding members 60A can be reduced.

[0059] In a plan view, the size of each of the multiple first bonding members 60A is preferably smaller than the first surface 20a of the light emitting element 20. This makes the above-mentioned effects more pronounced.

[0060] Furthermore, in the process of arranging the multiple first bonding members 60A, by arranging the alignment marks 60M using the same material as the first bonding members 60A, a separate process of arranging the alignment marks is not required, thereby simplifying the manufacturing process.

[0061] [Method for manufacturing a light emitting device according to the third embodiment] The manufacturing method for the light emitting device according to the third embodiment further includes a step of arranging a third bonding member covering at least a portion of the light emitting element on the first bonding member between the step of preparing the first structure and the step of arranging it on the second bonding member, and a step of processing the third bonding member to form walls between the light emitting elements between the step of arranging the third bonding member and the step of connecting, and in the peeling step, the first bonding member, the second bonding member and the third bonding member are removed by contacting them with a dissolving liquid.

[0062] 4A to 4C are cross-sectional views that diagrammatically show an example of a manufacturing process of the method for manufacturing the light emitting device according to the third embodiment.

[0063] First, a step of preparing the first structure 110 shown in FIG. 2A of the first embodiment is performed. Next, as shown in FIG. 4A, a third bonding member 80 that covers at least a part of the light emitting element 20 is disposed on the first bonding member 60 of the first structure 110. The third bonding member 80 may be formed to be thicker than the light emitting element 20 so as to cover the entire light emitting element 20. The third bonding member 80 can be disposed by using, for example, a screen printing method.

[0064] The third bonding member 80 may be made of a material that can be dissolved in a predetermined solvent. For example, the third bonding member 80 may be made of a material appropriately selected from the materials exemplified as the first bonding member 60. The third bonding member 80 may be made of the same material as the first bonding member 60, or may be made of a different material. It is preferable to select a material that can be dissolved in the same solvent as the first bonding member 60 and the second bonding member 70 for the third bonding member 80. In this case, the third bonding member 80 can be dissolved simultaneously with the first bonding member 60 and the second bonding member 70, and therefore the manufacturing process can be simplified.

[0065] 4B, the third bonding member 80 is processed to form walls 80W between the light emitting elements 20. The walls 80W can be formed, for example, by removing unnecessary portions of the third bonding member 80 by etching. The steps described with reference to FIGS. 4A and 4B can be performed between the step of preparing the first structure 110 and the step of disposing the first structure 110 on the second bonding member 70 of the second structure 120.

[0066] Next, as shown in Fig. 4C, the first structure 110 is disposed on the second bonding member 70 of the second structure 120 such that the electrodes 22 and the terminal portions 12 face each other at a distance, thereby forming the third structure 130. The specific method of disposing is as described with reference to Fig. 2D. In this step, for example, a space surrounded by the terminal portions 12, the electrodes 22, the second bonding member 70, and the wall 80W is formed. This space becomes the region in which the conductive member 30 is formed.

[0067] 2E to 2G of the first embodiment are then performed to obtain the light emitting device 1. However, in the step of peeling off the support substrate 50 described with reference to Fig. 2F, the first bonding member 60, the second bonding member 70, and the third bonding member 80 are removed by contacting them with a dissolving liquid.

[0068] As described above, in the third embodiment, the third bonding member 80 that covers at least a part of the light emitting element 20 is disposed on the first bonding member 60, and the third bonding member 80 is further processed to form walls 80W between the light emitting elements 20. This makes it possible to prevent short-circuiting of the electrodes 22 between adjacent light emitting elements 20 in the process of connecting the electrodes 22 and the terminal portions 12.

[0069] Furthermore, in the process of peeling off the support substrate 50, the first bonding member 60, the second bonding member 70, and the third bonding member 80 are removed by contacting them with a dissolving liquid. Therefore, if a material that can be dissolved in the same dissolving liquid as the first bonding member 60 and the second bonding member 70 is selected for the third bonding member 80, the third bonding member 80 can be removed without performing an additional process.

[0070] [Method of manufacturing the light emitting device according to the fourth embodiment] In the manufacturing method of the light emitting device according to the fourth embodiment, the step of preparing the first structure includes the steps of temporarily fixing the second surface side of the multiple light emitting elements to the surface of the transparent substrate via a sacrificial layer, placing the transparent substrate to which the light emitting elements are temporarily fixed on a support substrate having a first bonding member disposed on its surface, with the first bonding member facing the multiple light emitting elements, and irradiating the sacrificial layer with laser light through the transparent substrate, and transferring the sacrificial layer and the multiple light emitting elements onto the first bonding member.

[0071] In addition, the manufacturing method for the light emitting device according to the fourth embodiment may include a step of placing a fourth bonding member covering at least a portion of the light emitting element on the first bonding member after the step of transferring the multiple light emitting elements and between the step of preparing a first structure and the step of placing on the second bonding member, a step of removing the sacrificial layer after the step of placing the fourth bonding member, and a step of removing the fourth bonding member between the step of removing the sacrificial layer and the step of placing on the second bonding member.

[0072] 5A to 5F are cross-sectional views that diagrammatically show an example of a manufacturing process of the method for manufacturing a light emitting device according to embodiment 4. FIGs. 5A to 5C show a part of a process of preparing a first structure.

[0073] 5A, a transparent substrate 200 is prepared, and the second surfaces 20b of the multiple light-emitting elements 20 are temporarily attached to the surface of the transparent substrate 200 via a sacrificial layer 210. A release layer 220 is provided between the surface of the transparent substrate 200 and the sacrificial layer 210. The electrodes 22 of the multiple light-emitting elements 20 are covered with the sacrificial layer 210.

[0074] The transparent substrate 200 may be made of any material, as long as it has a certain level of transmittance to the laser light described below. For example, sapphire, glass, silicon, etc. may be used. The sacrificial layer 210 may be made of any material, as long as it is a material that is mainly made of a thermosetting resin, such as a silicone resin, a silicone modified resin, an epoxy resin, or a phenolic resin, or a thermoplastic resin, such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin. The peeling layer 220 may be made of any material, as long as it is a material that disappears upon irradiation with the laser light described below. For example, a material mainly made of an epoxy resin, an acrylic resin, or a polyimide resin may be used. For example, a mixture of a fluorene monomer and propylene glycol monomethyl ether acetate (PGMAE) may be used. For example, light having an emission peak wavelength in the wavelength range of 250 nm to 400 nm may be used as the laser light.

[0075] Next, as shown in FIG. 5B, a support substrate 50 having a first bonding member 60 disposed on its surface 50a is prepared, and a transparent substrate 200 having multiple light-emitting elements 20 temporarily attached thereto is positioned so that the first bonding member 60 and the multiple light-emitting elements 20 face each other.

[0076] Next, as shown in Fig. 5C, the sacrificial layer 210 and the peeling layer 220 are irradiated with laser light L through the transparent substrate 200. As a result, the peeling layer 220 disappears, and the sacrificial layer 210 and the plurality of light-emitting elements 20 can be transferred onto the first bonding member 60. Note that Fig. 5C shows a state in which the light-emitting element 20 and the sacrificial layer 210 located on the right side have already been transferred, and the light-emitting element 20 and the sacrificial layer 210 located on the left side are about to be transferred onto the first bonding member 60 by irradiation with the laser light L.

[0077] 5D, a fourth bonding member 90 that covers at least a portion of the light emitting element 20 is disposed on the first bonding member 60. In this step, it is preferable to dispose the fourth bonding member 90 so as not to reach the electrodes 22 of the light emitting element 20. In other words, it is preferable that the sacrificial layer 210 is exposed from the fourth bonding member 90. This step is performed after the step of transferring the plurality of light emitting elements 20, and between the step of preparing the first structure and the step of disposing the first structure on the second bonding member of the second structure.

[0078] The fourth bonding member 90 may be made of a material that can be dissolved in a predetermined dissolving liquid. For example, the fourth bonding member 90 may be made of a material appropriately selected from the materials exemplified as the first bonding member 60. The fourth bonding member 90 may be made of the same material as the first bonding member 60, or may be made of a different material. It is preferable to select a material that can be dissolved in a dissolving liquid different from that of the first bonding member 60 for the fourth bonding member 90. In this case, in FIG. 5F described later, the fourth bonding member 90 can be selectively dissolved without dissolving the first bonding member 60.

[0079] 5E, the sacrificial layer 210 is removed. The sacrificial layer 210 can be removed by, for example, reactive ion etching (RIE). When removing the sacrificial layer 210, the electrodes 22 and the fourth bonding member 90 are partly etched, and therefore, foreign matter 300 such as gold nanoparticles and resin pieces may adhere to the surface of the fourth bonding member 90.

[0080] Next, as shown in FIG. 5F, the fourth bonding members 90 are selectively removed without removing the first bonding members 60. This completes the first structure 110. The fourth bonding members 90 can be removed by contacting them with a predetermined dissolving liquid. By removing the fourth bonding members 90, the foreign matter 300 can also be removed at the same time.

[0081] Thereafter, the same steps as those in FIGS. 2B to 2G of the first embodiment are carried out to obtain the light emitting device 1.

[0082] As described above, the fourth embodiment includes a step of transferring the sacrificial layer 210 and the plurality of light emitting elements 20 onto the first bonding member 60, and then arranging the fourth bonding member 90 covering at least a part of the light emitting elements 20 on the first bonding member 60. Then, after the step of arranging the fourth bonding member 90, the sacrificial layer 210 is removed, and then the fourth bonding member 90 is removed. When the fourth bonding member 90 is removed, the foreign matter 300 is also removed at the same time, so that when connecting the electrode 22 of the light emitting element 20 and the terminal portion 12 of the substrate 10, abnormal deposition of plating that depends on the presence of the foreign matter 300 can be suppressed.

[0083] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0084] In addition to the above-described embodiment, the following supplementary notes are further disclosed. (Appendix 1) A support substrate; A first bonding member disposed on a surface of the support substrate; preparing a first structure including a plurality of light-emitting elements each having a first surface and a second surface opposite to the first surface, the first surface being in contact with the first bonding member, and a plurality of electrodes being disposed on the second surface side; A substrate having a base material and a plurality of terminal portions disposed on a surface of the base material; preparing a second structure including a second bonding member disposed between the plurality of terminal portions on a surface of the base material and having a thickness greater than that of the terminal portions; disposing the first structure on the second bonding member of the second structure such that the electrodes and the terminal portions face each other at a distance; connecting the plurality of electrodes and the plurality of terminal portions; A method for manufacturing a light emitting device, comprising the steps of: after the connecting step, removing the first bonding member and the second bonding member by contacting them with a dissolving liquid, and peeling the support substrate from the plurality of light emitting elements. (Appendix 2) The method for manufacturing a light emitting device described in Appendix 1, wherein in the peeling step, the first bonding member and the second bonding member are immersed in a dissolving liquid with the first structure facing downward and the second structure facing upward, the first bonding member and the second bonding member are dissolved, and the support substrate is dropped. (Appendix 3) 3. The method for manufacturing a light emitting device described in claim 1 or 2, wherein in the step of preparing the first structure, a plurality of first bonding members spaced apart from each other are arranged on the surface of the supporting substrate in correspondence with the positions of the plurality of light emitting elements. (Appendix 4) 4. The method for manufacturing a light emitting device according to claim 3, wherein, in a plan view, a size of each of the plurality of first bonding members is smaller than the first surface of the light emitting element. (Appendix 5) 5. The method for manufacturing a light emitting device according to claim 3, wherein in the step of preparing the first structure, an alignment mark to be used when placing the light emitting element on the first bonding member is placed on the surface of the supporting substrate together with the first bonding member using the same material as the first bonding member. (Appendix 6) a step of disposing a third bonding member on the first bonding member between the step of preparing the first structure and the step of disposing the first structure on the second bonding member, the third bonding member covering at least a portion of the light emitting element; The method further includes a step of processing the third bonding member to form a wall between the light emitting elements between the step of arranging the third bonding member and the step of connecting the light emitting elements, 3. The method for manufacturing a light emitting device according to claim 1, wherein in the peeling, the first bonding member, the second bonding member, and the third bonding member are removed by contacting them with a dissolving liquid. (Appendix 7) The step of preparing a first structure includes: a step of temporarily attaching the second surface sides of the plurality of light-emitting elements to a surface of a transparent substrate via a sacrificial layer; a step of disposing the transparent substrate, to which the light emitting elements are temporarily fixed, on the support substrate, on which the first bonding member is disposed on a surface thereof, so that the first bonding member and the plurality of light emitting elements face each other; A method for manufacturing a light emitting device described in Appendix 1 or 2, comprising a step of irradiating the sacrificial layer with laser light through the transparent substrate, and transferring the sacrificial layer and the plurality of light emitting elements onto the first bonding member. (Appendix 8) a step of arranging a fourth bonding member on the first bonding member to cover at least a part of the light emitting element, the fourth bonding member being placed on the first bonding member after the step of transferring the plurality of light emitting elements and between the step of preparing the first structure and the step of temporarily fixing the first structure on the second bonding member; removing the sacrificial layer after the step of disposing the fourth bonding member; The method for manufacturing a light emitting device according to claim 7, further comprising the step of removing the fourth bonding member between the step of removing the sacrificial layer and the step of placing the fourth bonding member on the second bonding member. (Appendix 9) 9. The method for manufacturing a light emitting device according to claim 8, wherein in the step of arranging the fourth bonding member, the fourth bonding member is arranged so as not to reach the plurality of electrodes. [Explanation of symbols]

[0085] 1 Light emitting device 10 Substrate 11 Base material 11a surface 12 Terminal section 20 Light emitting element 20a Page 1 20b 2nd side 20c side 22 electrodes 30 Conductive material 40 Light-reflective material 50 Support substrate 50a surface 60, 60A First joint member 60M Alignment Mark 70 Second joining member 80 Third joint member 80W wall 90 Fourth Joint Member 110,110A 1st structure 120 Second structure 130 Third structure 200 Transparent substrate 210 Sacrificial Layer 220 Peeling layer 300 Foreign object

Claims

1. A support substrate; A first bonding member disposed on a surface of the support substrate; A step of preparing a first structure including a plurality of light emitting elements each having a first surface and a second surface located opposite to the first surface, the first surface being disposed in contact with the first bonding member, and a plurality of electrodes being disposed on the second surface side; A substrate having a base material and a plurality of terminal portions disposed on a surface of the base material; preparing a second structure including a second bonding member disposed between the plurality of terminal portions on a surface of the base material and having a thickness greater than that of the terminal portions; disposing the first structure on the second bonding member of the second structure such that the electrodes and the terminal portions face each other and are spaced apart from each other; connecting the plurality of electrodes and the plurality of terminal portions; A method for manufacturing a light emitting device, comprising the steps of: after the connecting step, removing the first bonding member and the second bonding member by contacting them with a dissolving liquid, and peeling the support substrate from the plurality of light emitting elements.

2. 2. The method for manufacturing a light-emitting device according to claim 1, wherein in the peeling step, the first bonding member and the second bonding member are immersed in a dissolving liquid with the first structure facing downward and the second structure facing upward, to dissolve the first bonding member and the second bonding member, and to drop the support substrate.

3. 3 . The method for manufacturing a light emitting device according to claim 1 , wherein in the step of preparing the first structure, a plurality of first bonding members spaced apart from each other are arranged on the surface of the supporting substrate in correspondence with the positions of the plurality of light emitting elements.

4. The method for manufacturing a light emitting device according to claim 3 , wherein a size of each of the plurality of first bonding members is smaller than a size of the first surface of the light emitting element in a plan view.

5. 4. The method for manufacturing a light emitting device according to claim 3, wherein in the step of preparing the first structure, an alignment mark to be used when placing the light emitting element on the first bonding member is placed on the surface of the supporting substrate together with the first bonding member using the same material as the first bonding member.

6. a step of disposing a third bonding member on the first bonding member between the step of preparing the first structure and the step of disposing the first structure on the second bonding member, the third bonding member covering at least a portion of the light emitting element; The method further includes a step of processing the third bonding member to form a wall between the light emitting elements between the step of arranging the third bonding member and the step of connecting the light emitting elements, The method for manufacturing a light emitting device according to claim 1 , wherein in the peeling, the first bonding member, the second bonding member and the third bonding member are removed by contacting them with a dissolving liquid.

7. The step of preparing a first structure includes: a step of temporarily attaching the second surface sides of the plurality of light-emitting elements to a surface of a transparent substrate via a sacrificial layer; a step of disposing the transparent substrate, to which the light emitting elements are temporarily fixed, on the support substrate, on which the first bonding member is disposed on a surface thereof, so that the first bonding member and the plurality of light emitting elements face each other; The method for manufacturing a light emitting device according to claim 1 , further comprising: a step of irradiating the sacrificial layer with laser light through the transparent substrate, and transferring the sacrificial layer and the plurality of light emitting elements onto the first bonding member.

8. a step of disposing a fourth bonding member on the first bonding member to cover at least a part of the light emitting element, the fourth bonding member being disposed on the first bonding member after the step of transferring the plurality of light emitting elements and between the step of preparing the first structure and the step of temporarily fixing the first structure on the second bonding member; removing the sacrificial layer after the step of disposing the fourth bonding member; The method for manufacturing a light emitting device according to claim 7 , further comprising the step of removing the fourth bonding member between the step of removing the sacrificial layer and the step of arranging on the second bonding member.

9. The method for manufacturing a light emitting device according to claim 8 , wherein in the step of arranging the fourth bonding member, the fourth bonding member is arranged so as not to reach the plurality of electrodes.

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