Liquid jetting head

Abstract

To improve cooling efficiency.SOLUTION: An inkjet head 5 includes: a head body 30 that jets ink; a drive circuit 35 that controls operation of the head body 30; a flexible substrate 62 mounted with the drive circuit 35 and electrically connected to the head body 30; a cooling member 50 that is thermally in contact with the drive circuit 35; and a support member 70 that receives heat from the drive circuit 35. The cooling member 50 and the support member 70 are fixed in a longitudinally center part of the head body 30.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] An embodiment of the present disclosure relates to a liquid jet head. [Background technology]

[0002] Patent Document 1 discloses a liquid jet head including a liquid jet head chip for jetting liquid and a cooling unit including a refrigerant flow path through which a refrigerant passes. The cooling unit includes a cooling pipe that forms the refrigerant flow path, and a cooling plate that contacts the outer surface of the cooling pipe. The cooling pipe is sandwiched between a pair of cooling plates. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-84704 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in a configuration in which the cooling pipe is sandwiched between a pair of cooling plates, there is a high possibility that a gap will occur between the cooling pipe and the cooling plate. If a gap occurs between the cooling pipe and the cooling plate, it becomes difficult for heat to be transferred from the cooling pipe to the cooling plate, and the cooling efficiency may decrease.

[0005] The present disclosure has been made in consideration of the above problems, and aims to improve cooling efficiency. [Means for solving the problem]

[0006] (1) A liquid ejection head according to one aspect of the present disclosure includes a head body that ejects liquid, a drive circuit that controls the operation of the head body, a flexible substrate on which the drive circuit is mounted and which is electrically connected to the head body, a cooling member that is in thermal contact with the drive circuit, and a support member that receives heat from the drive circuit, wherein the cooling member and the support member are fixed at the longitudinal center of the head body.

[0007] (2) In the liquid jet head of aspect (1), the flexible substrate may have a plurality of drive circuits mounted thereon at intervals in the longitudinal direction, and the cooling member and the support member may be fixed directly below a drive circuit that is central in the longitudinal direction among the plurality of drive circuits.

[0008] (3) In the liquid jet head according to aspect (1) or (2), the cooling member and the supporting member may be fixed to each other via a through hole formed in the flexible substrate.

[0009] (4) In the liquid jet head according to aspect (3), the through hole may be closed within a plane of the flexible substrate.

[0010] (5) In the liquid jet head of the aspect (4), a plurality of the drive circuits may be mounted on the flexible substrate at intervals in the longitudinal direction, and the through hole may be formed at a position overlapping with a central drive circuit in the longitudinal direction among the plurality of drive circuits in a cross section perpendicular to the longitudinal direction.

[0011] (6) In a liquid ejection head according to any one of (1) to (5), the head body is provided with a nozzle row for ejecting the liquid, and the head body is provided with a base member located on the head body and having a long hole formed on its underside to expose the nozzle row, and a flow path member attached to both ends of the head body in the longitudinal direction, and the cooling member and the flow path member may be fixed to both ends of the head body in the longitudinal direction.

[0012] (7) In the liquid jet head according to the aspect (6), the flow path member may be provided at both ends of the support member in the longitudinal direction of the head body.

[0013] (8) In the liquid jet head of the aspect (6) or (7), the liquid jet head may further include a substrate body having an electrical circuit mounted thereon and electrically connected to the flexible substrate, and a connecting member connecting the substrate body and the cooling member.

[0014] (9) A liquid ejection head according to one aspect of the present disclosure includes a head body having a nozzle row for ejecting liquid, a base member located on the head body and having a long hole formed on its underside to expose the nozzle row, a drive circuit for controlling the operation of the head body, a flexible substrate on which the drive circuit is mounted and which is electrically connected to the head body, a cooling member in thermal contact with the drive circuit, and a flow path member attached to both longitudinal ends of the head body, wherein the cooling member and the flow path member are fixed at both longitudinal ends of the head body.

[0015] (10) In the liquid jet head according to the aspect (9), a support member is provided that receives heat from the drive circuit, The flow path member may be provided at both ends of the support member in the longitudinal direction of the head main body.

[0016] (11) In the liquid jet head of the aspect (9) or (10), the liquid jet head may further include a substrate body having an electrical circuit mounted thereon and electrically connected to the flexible substrate, and a connecting member connecting the substrate body and the cooling member. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a schematic configuration diagram of a printer according to an embodiment. [Diagram 2] FIG. 2 is a schematic diagram illustrating the configuration of an inkjet head and an ink circulation mechanism according to an embodiment. [Diagram 3] FIG. 2 is a front view of an inkjet head according to an embodiment. [Figure 4] FIG. 4 is a cross-sectional view illustrating a flow of ink according to an embodiment. [Diagram 5] FIG. 4 is a cross-sectional perspective view taken along the line VV shown in FIG. [Figure 6] FIG. 2 is a perspective view of a cooling unit according to one embodiment. [Figure 7] FIG. 7 is a cross-sectional perspective view taken along line VII-VII of FIG. 6. [Figure 8] 4 is a cross-sectional view illustrating a recess of a cooling member according to one embodiment. FIG. [Figure 9] 1A to 1C are explanatory diagrams showing a cooling unit manufacturing process according to an embodiment. [Figure 10] 11A to 11C are schematic diagrams illustrating modified examples of the flow of ink and coolant according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0019] In the embodiments and modifications described below, the same reference numerals may be used to designate corresponding configurations, and the description thereof may be omitted. In the following description, expressions indicating relative or absolute arrangements, such as "parallel," "orthogonal," "center," and "coaxial," do not only strictly indicate such arrangements, but also indicate a state in which the components are relatively displaced with a tolerance or an angle or distance to an extent that the same function is obtained.

[0020] [Printer 1] FIG. 1 is a schematic diagram of a printer 1 according to an embodiment. As shown in FIG. 1, a printer 1 (liquid jet recording apparatus) of this embodiment includes a pair of transport mechanisms 2, 3, an ink tank 4, an inkjet head 5 (liquid jet head), an ink circulation mechanism 6, and a scanning mechanism .

[0021] In the following explanation, an X, Y, Z Cartesian coordinate system is used as necessary. The X direction is the transport direction (sub-scanning direction) of the recording medium P (e.g., paper, etc.). The Y direction is the scanning direction (main scanning direction) of the scanning mechanism 7. The Z direction is the height direction (gravity direction) perpendicular to the X and Y directions.

[0022] In the following description, the arrows in the X, Y, and Z directions are defined as the plus (+) side and the opposite side as the minus (-) side. In this embodiment, the +Z side corresponds to the upward direction of gravity, and the -Z side corresponds to the downward direction of gravity.

[0023] The transport mechanisms 2 and 3 transport the recording medium P to the +X side. The transport mechanisms 2 and 3 each include a pair of rollers 11 and 12 extending in the Y direction, for example. A plurality of ink tanks 4 are provided, each containing ink of four colors, for example, yellow, magenta, cyan, and black.

[0024] A plurality of inkjet heads 5 are provided, and configured to be capable of ejecting ink of four colors, yellow, magenta, cyan, and black, according to the ink tanks 4 connected thereto.

[0025] FIG. 2 is a schematic diagram of the inkjet head 5 and the ink circulation mechanism 6 according to an embodiment. 1 and 2, the ink circulation mechanism 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes a circulation flow path 23 having an ink supply pipe 21 and an ink discharge pipe 22, a pressure pump 24 connected to the ink supply pipe 21, and a suction pump 25 connected to the ink discharge pipe 22.

[0026] The pressure pump 24 pressurizes the inside of the ink supply pipe 21, and sends ink to the inkjet head 5 through the ink supply pipe 21. As a result, the ink supply pipe 21 side relative to the inkjet head 5 becomes a positive pressure.

[0027] The suction pump 25 reduces the pressure inside the ink discharge tube 22 and sucks ink from the inkjet head 5 through the ink discharge tube 22. This creates a negative pressure on the ink discharge tube 22 side relative to the inkjet head 5. The ink is circulated between the inkjet head 5 and the ink tank 4 through the circulation flow path 23 by driving the pressure pump 24 and the suction pump 25.

[0028] 1, the scanning mechanism 7 causes the inkjet head 5 to scan back and forth in the Y direction. The scanning mechanism 7 includes a guide rail 28 extending in the Y direction, a carriage 29 movably supported on the guide rail 28, and a drive device that moves the carriage 29. The drive device is composed of, for example, a motor, a pulley, a belt, etc.

[0029] <Inkjet head 5> The inkjet head 5 is mounted on a carriage 29. The inkjet head 5 of this embodiment is an electromechanical conversion type inkjet head that ejects ink from a head chip including an actuator plate formed of a piezoelectric element such as PZT (lead zirconate titanate).

[0030] In this inkjet head 5, to eject ink, a voltage is applied between the electrodes of the driving wall of the ejection channel formed in the actuator plate, causing the driving wall to slide and deform in thickness. This changes the volume of the ejection channel, causing the ink in the ejection channel to be ejected through the nozzle hole. Note that the liquid ejection method is not limited to the electromechanical conversion method described above, and may be an electrification control method, a pressurized vibration method, an electrothermal conversion method, an electrostatic suction method, or the like.

[0031] The charge control method applies an electric charge to the material with a charging electrode, and controls the flight direction of the material with a deflection electrode to eject it from the nozzle.The pressure vibration method applies ultra-high voltage to the material to eject it from the nozzle tip side, and when no control voltage is applied, the material is ejected from the nozzle in a straight line, but when a control voltage is applied, electrostatic repulsion occurs between the materials, causing the material to scatter and not be ejected from the nozzle.

[0032] In addition, the electrothermal conversion method uses a heater installed in the space where the material is stored to suddenly vaporize the material, generating bubbles, and the pressure of the bubbles causes the material in the space to be ejected. The electrostatic attraction method applies a small amount of pressure to the space where the material is stored, forming a meniscus of the material in the nozzle, and in this state applies electrostatic attraction before drawing out the material. Other technologies that can be applied include a method that uses the viscosity change of the fluid due to an electric field, and a method that uses discharge sparks to eject the material.

[0033] Fig. 3 is a front view of an inkjet head 5 according to an embodiment. Fig. 4 is a cross-sectional view illustrating the flow of ink according to an embodiment. Fig. 5 is a perspective cross-sectional view taken along the line VV shown in Fig. 3. As shown in these figures, the inkjet head 5 comprises a head body 30 (ejection portion) that ejects ink, a cooling pipe 41 through which ink (coolant) passes to cool a drive circuit 35 (heat source), and a cooling member 50 in which at least a portion of the cooling pipe 41 is embedded.

[0034] [Head body 30] The head body 30 has a rectangular box shape. A nozzle row (not shown) for ejecting ink is provided on the bottom surface of the head body 30. The head body 30 is supported by a base member 31 that is installed on the carriage 29. The base member 31 is formed to be longer than the head body 30 in the X direction. A long hole (not shown) is formed on the bottom surface of the base member 31 to expose the nozzle row of the head body 30.

[0035] [Drive circuit 35] The driving circuit 35 is, for example, a driver IC that controls the operation of the head main body 30 and the operation of the circulation mechanism. The driving circuit 35 is in thermal contact with the cooling member 50. In the example shown in the figure, the driving circuit 35 is in indirect contact with the cooling member 50 via an insulating member 36. The insulating member 36 is, for example, a sheet-like member made of an insulating material such as silicon. The heat source is not limited to the driving circuit 35 such as a driver IC. The heat source may be any other electronic component as long as it generates heat when driven.

[0036] [Substrate part 60] The inkjet head 5 includes a substrate unit 60 on which the drive circuit 35 is mounted. The substrate unit 60 includes a substrate main body 61 on which a plurality of electric circuits are mounted, and a flexible substrate 62 that electrically connects the substrate main body 61 to each drive electrode (electrodes of the drive wall) of the actuator plate described above.

[0037] The board body 61 is, for example, a rigid board. The board body 61 is connected to the cooling member 50 and the like via a connecting member (not shown). A connector 65 is provided on the upper part of the board body 61. The board body 61 is electrically connected to an external main controller, a power source, and the like via the connector 65.

[0038] The substrate body 61 may be a flexible substrate. In this case, the substrate body 61 may not be provided with the connector 65, and a part of the substrate body 61 may be extended outside the inkjet head 5 and directly connected to the printer 1.

[0039] The flexible substrate 62 extends obliquely downward so as to be spaced apart in the Y direction from the substrate main body 61. The portions of the flexible substrate 62 that extend obliquely downward are connected to the respective drive electrodes of the actuator plate described above.

[0040] A plurality of drive circuits 35 are mounted in a straight line at intervals in the X direction on the flexible substrate 62. The drive circuits 35 are driver ICs that generate a large amount of heat. For this reason, a support member 70 is provided to receive heat from each drive circuit 35. In Fig. 3, the support member 70 is indicated by a two-dot chain line.

[0041] [Support member 70] The support member 70 is formed of a material with excellent thermal conductivity and heat dissipation properties, such as aluminum. A pair of support members 70 are provided in the Y direction via the cooling member 50 or the like. The support member 70 includes a main body portion 71 extending in the X direction, end side fixing portions 72 provided at both ends of the main body portion 71 in the X direction, and a central lower side fixing portion 73 provided below the center of the main body portion 71 in the X direction.

[0042] The main body 71 is formed in a flat plate shape. The main body 71 faces each of the drive circuits 35 in the Y direction via the flexible substrate 62. The main body 71 is in thermal contact with each of the drive circuits 35.

[0043] The end fixing portions 72 extend in the Z direction from both ends of the main body portion 71. The pair of support members 70 are screwed at the end fixing portions 72 through the respective through holes 57 of the cooling member 50.

[0044] The central lower fixing portion 73 extends to the -Z side from a lower side of the center in the X direction of the main body portion 71. The pair of support members 70 are screwed to the respective central lower fixing portions 73 via the central lower recesses 58 of the cooling member 50.

[0045] [Flow path members 80, 90] The inkjet head 5 includes an inlet-side flow path member 80 and an outlet-side flow path member 90. Each flow path member is formed from a resin material such as polyethylene, polycarbonate, polypropylene, polyethylene terephthalate, polyphenylene sulfide, etc. Each of the flow path members 80 and 90 is formed in an L-shape.

[0046] The inlet side flow path member 80 is provided on one side in the X direction (+X side) of the inkjet head 5. The inlet side flow path member 80 is provided with an inlet port 81 to which the above-mentioned ink supply tube 21 is connected. The inlet side flow path member 80 is attached to one side in the X direction (+X side) of the head main body 30 via a fastening member such as a bolt.

[0047] The inlet-side flow path member 80 has a first inlet branched path 82 and a second inlet branched path 83 that branch off from an inlet passage into which ink flows in from an inlet port 81. The first inlet branched path 82 is a path that guides ink from the inlet passage of the inlet port 81 into the head main body 30. The second inlet branched path 83 is a path that guides ink from the inlet passage of the inlet port 81 into the cooling pipe 41.

[0048] The outlet side flow path member 90 is provided on the other side in the X direction (-X side) of the inkjet head 5. The outlet side flow path member 90 is provided with an outlet port 91 to which the above-mentioned ink discharge pipe 22 is connected. The outlet side flow path member 90 is attached to the other side in the X direction (-X side) of the head main body 30 via a fastening member such as a bolt.

[0049] The outlet-side flow path member 90 has a first outlet branch path 92 and a second outlet branch path 93 that branch off from an outlet path through which ink flows out to the outlet port 91. The first outlet branch path 92 is a path that guides ink from inside the head main body 30 to the outlet path of the outlet port 91. The second outlet branch path 93 is a path that guides ink from inside the cooling pipe 41 to the outlet path of the outlet port 91.

[0050] [Cooling pipe 41] The cooling pipe 41 has corrosion resistance against ink. Here, corrosion resistance means the speed at which corrosion progresses when the cooling pipe 41 is impregnated with ink. The cooling pipe 41 has higher corrosion resistance than the cooling member 50. Here, high corrosion resistance means that corrosion against ink progresses slowly. The cooling pipe 41 is formed of, for example, stainless steel.

[0051] The cooling pipe 41 may be made of a copper alloy, a titanium alloy, a nickel alloy, a chromium alloy, etc. The cooling pipe 41 is preferably made of a material having higher corrosion resistance against ink than the cooling member 50. For example, the material of the cooling pipe 41 can be changed depending on the design specifications.

[0052] The cooling pipe 41 branches off from a flow path (liquid flow path) of an inlet port 81 through which ink passes. The cooling pipe 41 has a cooling flow path 42 through which ink passes as a coolant. The cooling flow path 42 communicates with a second inflow branch path 83 of the inlet side flow path member 80 and a second outflow branch path 93 of the outlet side flow path member 90.

[0053] For example, when the pressure pump 24 and the suction pump 25 are operated, the ink in the ink tank 4 is sent to the head main body 30 and the cooling pipe 41 via the inlet port 81 of the inlet side flow path member 80, the first inflow branch path 82, and the second inflow branch path 83 in that order. Thereafter, the ink is returned to the ink tank 4 via the first outflow branch path 92 and the second outflow branch path 93 of the outlet side flow path member 90, and the outlet port 91 in that order.

[0054] The cooling pipe 41 is insert molded into the cooling member 50. Here, insert molding means pouring material around a part placed in a mold and molding it as one part. The cooling pipe 41 of this embodiment is molded as one part by pouring the material of the cooling member 50 around the cooling pipe 41 placed in the mold 100. Hereinafter, the part in which the cooling pipe 41 and the cooling member 50 are integrated is referred to as the "cooling unit 40."

[0055] Fig. 6 is a perspective view of a cooling unit 40 according to one embodiment. Fig. 7 is a cross-sectional perspective view taken along line VII-VII shown in Fig. 6. Fig. 8 is a cross-sectional view illustrating recesses 53A, 53B, 53C, and 53D of a cooling member 50 according to one embodiment. As shown in these drawings, the cooling pipe 41 has a straight pipe shape. The cooling pipe 41 extends linearly along the X direction. The cooling pipe 41 has a cylindrical shape extending along the X direction.

[0056] An end of the cooling pipe 41 is disposed outside the outer shape of the cooling member 50. One end (+X side end) of the cooling pipe 41 is disposed outside (+X side) of one side surface (+X side surface) of the cooling member 50. The other end (-X side end) of the cooling pipe 41 is disposed outside (-X side) of the other side surface (-X side surface) of the cooling member 50. A portion of the cooling member 50 other than both ends in the X direction (a portion on the central side in the X direction) is embedded in the cooling member 50.

[0057] In the illustrated example, one cooling pipe 41 is provided, but the present invention is not limited to this. For example, multiple cooling pipes 41 may be provided. For example, the number of cooling pipes 41 can be changed according to design specifications.

[0058] In the illustrated example, the cross-sectional shape of the cooling pipe 41 (shape cut along the YZ plane) is a circular ring shape, but is not limited thereto. For example, the cross-sectional shape of the cooling pipe 41 may be a rectangular frame shape. For example, the cross-sectional shape of the cooling pipe 41 can be changed according to design specifications.

[0059] [Cooling member 50] The cooling member 50 has a higher thermal conductivity than the cooling pipes 41. The cooling member 50 is formed in a rectangular parallelepiped shape with its elongated side in the X direction. The cooling member 50 is formed of, for example, aluminum alone or an aluminum alloy.

[0060] The cooling member 50 may be made of a zinc alloy. The cooling member 50 is preferably made of a material having a higher thermal conductivity than the cooling pipe 41. For example, the material of the cooling member 50 can be changed according to the design specifications.

[0061] The cooling member 50 has a first surface 51 (-Y side surface) and a second surface 52 (+Y side surface) disposed on opposite sides of the cooling pipe 41. The first surface 51 is a surface along the XZ plane on the -Y side of the cooling pipe 41. The second surface 52 is a surface along the XZ plane on the +Y side of the cooling pipe 41.

[0062] The cooling member 50 has recesses 53A, 53B, 53C, and 53D in at least a part of the portion surrounding the cooling pipe 41. The recesses 53A, 53B, 53C, and 53D are open in four directions intersecting with the central axis of the cooling pipe 41. The four directions are, as viewed from the X direction, the +Z side and -Y side direction, the -Z side and -Y side direction, the +Z side and +Y side direction, and the -Z side and +Y side direction with respect to the central axis of the cooling pipe 41.

[0063] The recesses 53A, 53B, 53C, and 53D that open in four directions are a first upper recess 53A formed on the upper side (+Z side) of the first surface 51 of the cooling member 50, a first lower recess 53B formed on the lower side (-Z side) of the first surface 51 of the cooling member 50, a second upper recess 53C formed on the upper side of the second surface 52 of the cooling member 50, and a second lower recess 53D formed on the lower side of the second surface 52 of the cooling member 50.

[0064] The first upper recess 53A is open in the +Z and -Y directions with respect to the central axis of the cooling pipe 41 when viewed from the X direction. The first lower recess 53B is open in the -Z and -Y directions with respect to the central axis of the cooling pipe 41 when viewed from the X direction. The second upper recess 53C is open in the +Z and +Y directions with respect to the central axis of the cooling pipe 41 when viewed from the X direction. The second lower recess 53D is open to the -Z side and the +Y side with respect to the central axis of the cooling pipe 41 when viewed from the X direction.

[0065] The cooling member 50 has a partition portion 54 that partitions recesses 53A, 53B, 53C, and 53D that open in four directions. When viewed from the X direction, the partition portion 54 has an X shape that intersects with the central axis of the cooling pipe 41. When viewed from the X direction, the partition portion 54 has an upper extension portion 54A extending upward (+Z side) from the cooling pipe 41, a lower extension portion 54B extending downward (-Z side) from the cooling pipe 41, a first surface side extension portion 54C extending from the cooling pipe 41 to the first surface 51 side (-Y side), and a second surface side extension portion 54D extending from the cooling pipe 41 to the second surface 52 side (+Y side).

[0066] The upper extension portion 54A extends in the Z direction so as to separate the first upper recess 53A and the second upper recess 53C when viewed from the X direction. The lower extension portion 54B extends in the Z direction so as to separate the first lower recess 53B and the second lower recess 53D when viewed from the X direction. The first surface extending portion 54C extends in the Y direction so as to separate the first upper recess 53A and the first lower recess 53B when viewed from the X direction. The second surface extending portion 54D extends in the Y direction so as to separate the second upper recess 53C and the second lower recess 53D when viewed from the X direction.

[0067] The recesses 53A, 53B, 53C, and 53D have curved portions 55A, 55B, 55C, and 55D curved toward the cooling pipe 41. The curved portions 55A, 55B, 55C, and 55D are curved in an arc shape toward the outer circumferential surface of the cooling pipe 41 when viewed from the X direction.

[0068] When viewed from the X direction, the first upper recess 53A has a first upper curved portion 55A that curves toward the +Y side and the -Z side toward the cooling pipe 41. The first upper curved portion 55A smoothly connects the -Y side surface of the upper extension portion 54A and the +Z side surface of the first surface side extension portion 54C. When viewed from the X direction, the first lower recess 53B has a first lower curved portion 55B that curves toward the +Y side and the +Z side toward the cooling pipe 41. The first lower curved portion 55B smoothly connects the -Y side surface of the lower extending portion 54B and the -Z side surface of the first surface extending portion 54C. When viewed from the X direction, the second upper recess 53C has a second upper curved portion 55C that curves toward the -Y side and the -Z side toward the cooling pipe 41. The second upper curved portion 55C smoothly connects the +Y side surface of the upper extending portion 54A and the +Z side surface of the second surface extending portion 54D. When viewed from the X direction, the second lower recess 53D has a second lower curved portion 55D that curves toward the -Y side and the +Z side toward the cooling pipe 41. The second lower curved portion 55D smoothly connects the +Y side surface of the lower extending portion 54B and the -Z side surface of the second surface extending portion 54D.

[0069] The cooling member 50 has a heat source mounting surface 56 on which the drive circuit 35 is mounted. In the example shown in the figure, the heat source mounting surface 56 is indicated by a dashed line. The heat source mounting surface 56 is provided in a portion of the cooling member 50 other than the recesses 53A, 53B, 53C, and 53D.

[0070] In the illustrated example, the recesses 53A, 53B, 53C, and 53D are formed in a rectangular shape with rounded corners when viewed from the Y direction. In the illustrated example, six pairs of recesses 53A, 53B, 53C, and 53D (first upper recess 53A and first lower recess 53B) arranged in the Z direction are arranged at intervals in the X direction. In the X direction, the recesses 53A, 53B, 53C, and 53D and the heat source arrangement surface 56 are alternately arranged. Note that the shapes, number of recesses 53A, 53B, 53C, and 53D, their arrangement locations, and the like are not limited to those described above and can be changed according to design specifications.

[0071] The heat source arrangement surface 56 is a flat surface. The heat source arrangement surface 56 is provided along the XZ plane. The heat source arrangement surface 56 overlaps with the cooling pipe 41 when viewed from the Y direction. For example, the heat source arrangement surface 56 may have an outer shape larger than that of the drive circuit 35 when viewed from the Y direction. For example, when the drive circuit 35 has a rectangular shape when viewed from the Y direction, the heat source arrangement surface 56 may have a rectangular shape larger than that of the drive circuit 35. In the example shown in the figure, the heat source arrangement surface 56 is arranged at five locations spaced apart in the X direction in the cooling member 50 other than the pairs of recesses 53A, 53B, 53C, and 53D arranged in the Z direction.

[0072] The heat source arrangement surfaces 56 are provided on each of the first surface 51 and the second surface 52 of the cooling member 50. For example, the heat source arrangement surfaces 56 are arranged at five locations (a total of 10 locations on the first surface 51 and the second surface 52) spaced apart from each other in the X direction on each of the first surface 51 and the second surface 52 of the cooling member 50 other than the pairs of recesses 53A, 53B, 53C, and 53D aligned in the Z direction. Note that the shape, number of installations, arrangement location, and the like of the heat source arrangement surfaces 56 are not limited to this and can be changed according to design specifications.

[0073] A pair of upper and lower through holes 57 that open in the Y direction are formed on the end sides of the cooling member 50 in the X direction. A central lower recess 58 that is recessed from the lower surface of the cooling member 50 to the +Z side is formed on the lower center side of the cooling member 50 in the X direction. Each through hole 57 and the lower central recess 58 are portions through which screws for fixing the pair of support members 70 pass. In the example shown in the figure, the cooling member 50 is fixed to the pair of support members 70 via screws at a total of five locations: two locations at the top and bottom of both ends in the X direction and one location at the lower center in the X direction.

[0074] [Method of manufacturing inkjet head 5] The manufacturing method for the inkjet head 5 of this embodiment is a manufacturing method for an inkjet head 5 including a head body 30 that ejects ink, a cooling pipe 41 that is corrosion-resistant to the ink and through which ink passes to cool the drive circuit 35, and a cooling member 50 that has a higher thermal conductivity than the cooling pipe 41, and in the process of manufacturing the cooling member 50, the cooling pipe 41 is cast in a supported state.

[0075] The method of manufacturing the inkjet head includes a head body preparation process for preparing the head body 30, a cooling unit manufacturing process for manufacturing the cooling unit 40 (a process for manufacturing the cooling member 50), and a unit connection process for connecting the head body 30 and the cooling unit 40.

[0076] In the head body preparation process, the head body 30 including the above-mentioned actuator plate and nozzle plate, etc. is prepared. After the head body preparation process, the process proceeds to a cooling unit manufacturing process.

[0077] FIG. 9 is an explanatory diagram showing a cooling unit manufacturing process according to one embodiment. In the cooling unit manufacturing process, a pair of dies 110, 120 constituting a mold 100 for manufacturing the cooling unit 40, and cooling pipes 41 constituting the cooling unit 40 are prepared. In the example shown in the figure, the pair of dies 110, 120 is a first die 110 corresponding to the -Y side of the cooling unit 40, and a second die 120 corresponding to the +Y side of the cooling unit 40.

[0078] The first mold 110 has a first main body recess 111 recessed to fit the outer shape of the -Y side of the cooling member 50, and a first end side recess 112 recessed to fit the outer shape of the X-direction outer part of the -Y side of the cooling pipe 41. The first main body recess 111 and the first end side recess 112 are recessed to the -Y side from the +Y side surface (the surface mating with the second mold 120) of the first mold 110. The first end side recess 112 extends outward in the X direction from both side surfaces in the X direction of the first main body recess 111.

[0079] The first mold 110 has a first upper convex portion 113 and a first lower convex portion 114 that protrude along the outer shapes of the first upper recess 53A and the first lower recess 53B of the cooling member 50, a pair of first end side convex portions 115 that protrude along the outer shapes of the -Y side portions of a pair of through holes 57 at both ends in the X direction of the cooling member 50, and a first central lower convex portion 116 that protrudes along the outer shape of the -Y side portion of the central lower recess 58 of the cooling member 50.

[0080] The first upper convex portion 113, the first lower convex portion 114, the first end side convex portion 115, and the first central lower convex portion 116 protrude from the -Y side surface (bottom surface) of the first main body concave portion 111 to the +Y side. The first upper convex portion 113 and the first lower convex portion 114 have first curved portions 117 that curve so as to follow the outer shapes of the curved portions 55A, 55B of the first upper concave portion 53A and the first lower concave portion 53B, respectively. The first central lower convex portion 116 protrudes from the -Z side surface of the first main body concave portion 111 to the +Z side.

[0081] The second mold 120 has a second main body recess 121 recessed to fit the outer shape of the +Y side of the cooling member 50, and a second end side recess 122 recessed to fit the outer shape of the X-direction outer part of the +Y side of the cooling pipe 41. The second main body recess 121 and the second end side recess 122 are recessed from the -Y side surface (the mating surface with the first mold 110) of the second mold 120 to the +Y side. The second end side recess 122 extends outward in the X direction from both side surfaces in the X direction of the second main body recess 121.

[0082] The second mold 120 has a second upper convex portion 123 and a second lower convex portion 124 that protrude along the outer shapes of the second upper recess 53C and the second lower recess 53D of the cooling member 50, a pair of second end side convex portions 125 that protrude along the outer shapes of the +Y side portions of a pair of through holes 57 at both ends in the X direction of the cooling member 50, and a second central lower convex portion 126 that protrudes along the outer shape of the +Y side portion of the central lower recess 58 of the cooling member 50.

[0083] The second upper convex portion 123, the second lower convex portion 124, the second end side convex portion 125, and the second central lower convex portion 126 protrude from the +Y side surface (bottom surface) of the second main body recess 121 to the -Y side. The second upper convex portion 123 and the second lower convex portion 124 have second curved portions 127 that curve to follow the outer shapes of the curved portions 55C, 55D of the second upper recess 53C and the second lower recess 53D, respectively. The second central lower convex portion 126 protrudes from the -Z side surface of the second main body recess 121 to the +Z side.

[0084] Next, the cooling pipe 41 is supported by one of a pair of dies (the second die 120 in the illustrated example). In the illustrated example, both side portions in the X direction of the cooling pipe 41 are inserted into the second end side recess 122 of the second die 120. As a result, the central side portion in the X direction of the cooling pipe 41 is supported by the second upper convex portion 123 and the second lower convex portion 124. At this time, the central side portion in the X direction of the cooling pipe 41 comes into contact (line contact or point contact) with the second curved portions 127 of the second upper convex portion 123 and the second lower convex portion 124.

[0085] Next, the first mold 110 and the second mold 120 are mated. For example, the mating surface of the first mold 110 and the mating surface of the second mold 120 are brought into contact with each other. As a result, the central side of the cooling pipe 41 in the X direction is also supported by the first upper convex portion 113 and the first lower convex portion 114. At this time, the central side of the cooling pipe 41 in the X direction is also in contact (line contact or point contact) with the first curved portion 117 of the first upper convex portion 113 and the first lower convex portion 114. Therefore, the central side of the cooling pipe 41 in the X direction is supported by the first upper convex portion 113, the first lower convex portion 114, the second upper convex portion 123, and the second lower convex portion 124. The first upper convex portion 113, the first lower convex portion 114, the second upper convex portion 123, and the second lower convex portion 124 become pipe support portions (portions for supporting the cooling pipe 41) during casting. During casting, the central side portion in the X direction of the cooling pipe 41 comes into contact with the first curved portion 117 and the second curved portion 127 (line contact or point contact).

[0086] Next, molten aluminum (at about 680°C) is poured into the mold 100. For example, with the first mold 110 and the second mold 120 joined together, the molten aluminum is poured into the internal space (around the cooling pipe 41) through a hole (not shown). In the cooling unit manufacturing process, casting is performed while the cooling pipe 41 is supported. After casting, the mold 100 is separated. This results in a cooling unit 40 in which the cooling pipe 41 and the cooling member 50 are integrated. After the cooling unit manufacturing process, the process proceeds to a unit connection process.

[0087] In the unit connecting process, the above-mentioned substrate portion 60, support member 70, flow path members 80, 90, etc. are connected to the head main body 30 and cooling unit 40 by connecting members, fastening members, etc. (not shown). Through the above processes, the inkjet head 5 is obtained.

[0088] [Effects] The inkjet head 5 of this embodiment comprises a head body 30 that ejects ink, a cooling pipe 41 that is corrosion-resistant to ink and through which ink passes to cool a drive circuit 35, and a cooling member 50 that has a higher thermal conductivity than the cooling pipe 41, in which at least a portion of the cooling pipe 41 is embedded, and has recesses 53A, 53B, 53C, and 53D in at least a portion of the portion surrounding the cooling pipe 41.

[0089] According to this configuration, by providing the cooling member 50 in which at least a part of the cooling pipe 41 is embedded, a gap is unlikely to occur between the cooling pipe 41 and the cooling member 50, and heat is easily transferred from the cooling pipe 41 to the cooling member 50. Therefore, the cooling efficiency can be improved. In addition, the portions of the mold 100 that correspond to the pipe support portions (portions for supporting the cooling pipes 41) during casting appear as the recesses 53A, 53B, 53C, and 53D of the cooling member 50. Therefore, it is possible to suppress displacement and deformation during casting.

[0090] In the inkjet head 5 of this embodiment, the cooling pipes 41 are insert-molded into the cooling member 50. According to this configuration, since a gap is unlikely to occur between the cooling pipes 41 and the cooling member 50 due to the insert molding, heat is easily transferred from the cooling pipes 41 to the cooling member 50. Therefore, the cooling efficiency can be improved.

[0091] In the inkjet head 5 of this embodiment, the recesses 53A, 53B, 53C, and 53D are open in four directions intersecting the central axis of the cooling pipe 41. According to this configuration, the portions of the mold 100 that correspond to the pipe support portions during casting appear as recesses 53A, 53B, 53C, and 53D that are open in four directions in the cooling member 50. Therefore, it is possible to more effectively suppress displacement and deformation during casting.

[0092] In the inkjet head 5 of this embodiment, the cooling member 50 has a partition portion 54 that separates the recesses 53A, 53B, 53C, and 53D that open in four directions. According to this configuration, even if the cooling member 50 has recesses 53A, 53B, 53C, and 53D that are open in four directions, a heat transfer path can be secured in the partition portion 54, thereby making it possible to more effectively improve the cooling efficiency.

[0093] In the inkjet head 5 of this embodiment, the recesses 53A, 53B, 53C, and 53D have curved portions 55A, 55B, 55C, and 55D that curve toward the cooling pipe 41. For example, if there is a gap between the pipe support part of the mold 100 and the cooling pipe 41 during casting, molten metal may flow into the gap, causing burrs. In this case, if the recess has a curved part that curves along the cooling pipe 41, the contact area between the pipe support part of the mold 100 and the cooling pipe 41 during casting tends to increase (surface contact), so that burrs are likely to occur. In contrast, according to this configuration, the recesses 53A, 53B, 53C, and 53D have curved parts 55A, 55B, 55C, and 55D that curve toward the cooling pipe 41, so that the contact area between the pipe support part of the mold 100 and the cooling pipe 41 during casting can be reduced (line contact or point contact). Therefore, the occurrence of burrs can be suppressed.

[0094] In the inkjet head 5 of this embodiment, the cooling member 50 has a heat source mounting surface 56 on which the drive circuit 35 is disposed, and the heat source mounting surface 56 is provided on the cooling member 50 other than the recesses 53A, 53B, 53C, and 53D. According to this configuration, the drive circuit 35 can be brought into contact with the heat source mounting surface 56 of the cooling member 50, so that the cooling efficiency can be improved more effectively.

[0095] In the inkjet head 5 of this embodiment, the heat source arrangement surface 56 is a flat surface. According to this configuration, if the outer surface of the drive circuit 35 is flat, the contact area between the drive circuit 35 and the heat source mounting surface 56 can be increased, so that the cooling efficiency can be improved more effectively.

[0096] In the inkjet head 5 of this embodiment, the cooling member 50 has a first surface 51 and a second surface 52 arranged on opposite sides of the cooling piping 41, and a heat source mounting surface 56 is provided on each of the first surface 51 and the second surface 52.

[0097] According to this configuration, when multiple drive circuits 35 are provided, the drive circuits 35 can be in contact with both the first surface 51 and the second surface 52 of the cooling member 50, thereby more effectively improving the cooling efficiency.

[0098] In the inkjet head 5 of this embodiment, the end of the cooling pipe 41 is disposed outside the outer shape of the cooling member 50. According to this configuration, since the end portion of the cooling pipe 41 can be held down during casting, displacement and deformation can be suppressed.

[0099] In the inkjet head 5 of this embodiment, the cooling pipe 41 has a straight pipe shape. According to this configuration, it is easier to ensure the dimensional accuracy of the cooling pipes 41 and it is possible to reduce the manufacturing cost, compared to a case in which the cooling pipes 41 have a curved shape.

[0100] In the inkjet head 5 of this embodiment, the cooling pipes 41 are made of stainless steel, and the cooling member 50 is made of aluminum alone or an aluminum alloy. According to this configuration, when ink passes through the cooling pipe 41, corrosion caused by the ink is avoided and high cooling efficiency is obtained.

[0101] In the inkjet head 5 of this embodiment, the cooling pipe 41 branches off from an ink flow path through which ink passes, and has a cooling flow path 42 through which ink passes as a coolant. According to this configuration, ink can be supplied to the ink flow path, and ink can also be supplied to the cooling flow path 42 as a coolant.

[0102] The inkjet head 5 of this embodiment comprises a head body 30 that ejects ink, a cooling pipe 41 that is corrosion-resistant to the ink and through which ink passes to cool the drive circuit 35, and a cooling member 50 that has a higher thermal conductivity than the cooling pipe 41 and in which at least a portion of the cooling pipe 41 is insert-molded. According to this configuration, since a gap is unlikely to occur between the cooling pipes 41 and the cooling member 50 due to the insert molding, heat is easily transferred from the cooling pipes 41 to the cooling member 50. Therefore, the cooling efficiency can be improved.

[0103] The printer 1 of this embodiment includes the above-mentioned inkjet head 5 and a carriage 29 to which the inkjet head 5 is attached. According to this configuration, the printer 1 can improve the cooling efficiency of the inkjet head 5.

[0104] The manufacturing method for the inkjet head 5 of this embodiment is a manufacturing method for an inkjet head 5 including a head body 30 that ejects ink, a cooling pipe 41 that is corrosion-resistant to the ink and through which ink passes to cool the drive circuit 35, and a cooling member 50 that has a higher thermal conductivity than the cooling pipe 41, and in the process of manufacturing the cooling member 50, the cooling pipe 41 is cast in a supported state. According to this manufacturing method, by casting in a supported state of the cooling pipes 41, gaps are unlikely to occur between the cooling pipes 41 and the cooling member 50, and heat is easily transferred from the cooling pipes 41 to the cooling member 50. This makes it possible to improve the cooling efficiency. In addition, it is possible to suppress displacement and deformation during casting.

[0105] Although preferred embodiments of the present disclosure have been described and illustrated above, it should be understood that these are illustrative of the present disclosure and should not be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present disclosure. Thus, the present disclosure should not be considered as limited by the foregoing description, but rather by the scope of the claims.

[0106] [Variations] For example, in the above-described embodiment, the recess is open in four directions intersecting the central axis of the cooling pipe, but the present invention is not limited to this configuration. For example, the recess may be open in three or less directions intersecting the central axis of the cooling pipe, or five or more directions. For example, the direction in which the recess is open can be changed according to the design specifications.

[0107] For example, in the above-described embodiment, the cooling member has a partition portion that partitions the recessed portion that opens in four directions, but is not limited to this configuration. For example, the cooling member may have a partition portion that partitions the recessed portion that opens in three or less directions or five or more directions. For example, the cooling member may not have a partition portion. For example, the installation mode of the partition portion can be changed according to the design specifications.

[0108] For example, in the above-described embodiment, the recess has a curved portion curved toward the cooling pipe, but the present invention is not limited to this configuration. For example, the recess may have a curved portion curved along the cooling pipe. For example, the recess may have a curved portion curved toward the opposite side to the cooling pipe. For example, the recess may have a corner protruding toward the cooling pipe. For example, the recess may not have a curved portion. For example, the configuration of the recess can be changed according to the design specifications.

[0109] For example, in the above-described embodiment, the cooling member has a heat source mounting surface on which the drive circuit is mounted, and the heat source mounting surface is provided in a portion of the cooling member other than the recess, but the present invention is not limited to this configuration. For example, the heat source mounting surface may be provided in the recess of the cooling member. For example, the installation mode of the heat source mounting surface can be changed according to the design specifications.

[0110] For example, in the above-described embodiment, the heat source arrangement surface is a flat surface, but the present invention is not limited to this configuration. For example, the heat source arrangement surface may include a curved surface. For example, the heat source arrangement surface may have a shape that conforms to one surface of the drive circuit. For example, the configuration of the heat source arrangement surface may be changed according to the design specifications.

[0111] For example, in the above-described embodiment, the cooling member has a first surface and a second surface arranged on opposite sides of the cooling pipe, and the heat source arrangement surface is provided on each of the first surface and the second surface, but the present invention is not limited to this configuration. For example, the heat source arrangement surface may be provided on either the first surface or the second surface (one surface). For example, the installation mode of the heat source arrangement surface can be changed according to the design specifications.

[0112] For example, in the above-described embodiment, the end of the cooling pipe is disposed outside the outer shape of the cooling member, but the present invention is not limited to this configuration. For example, the end of the cooling pipe may be disposed inside the outer shape of the cooling member or on the same plane. For example, the arrangement of the end of the cooling pipe can be changed according to the design specifications.

[0113] For example, in the above-described embodiment, the cooling pipe has a straight pipe shape, but is not limited to this configuration. For example, the cooling pipe may have a curved shape. For example, the cooling pipe may include a straight portion and a curved portion. For example, the shape of the cooling pipe may be changed according to design specifications.

[0114] For example, in the above-described embodiment, the cooling pipe is made of stainless steel, and the cooling member is made of aluminum alone or an aluminum alloy, but the present invention is not limited to this configuration. For example, the cooling pipe may be made of a copper alloy, a titanium alloy, a nickel alloy, a chromium alloy, or the like, and the cooling member may be made of a zinc alloy, or the like. For example, the materials of the cooling pipe and the cooling member can be changed according to the design specifications.

[0115] For example, in the above-described embodiment, the cooling member has a recess in at least a part of the portion surrounding the cooling pipe, but is not limited to this configuration. For example, the cooling member does not need to have a recess. For example, it is sufficient that at least a part of the cooling pipe is embedded in the cooling member by insert molding or the like. For example, the installation mode of the recess can be changed according to the design specifications.

[0116] For example, in the above-described embodiment, the cooling pipe is branched from the ink flow path through which the ink passes, and has a cooling flow path through which the ink passes as a coolant, but the present invention is not limited to this configuration. For example, the ink may not pass through the cooling flow path. For example, the ink may be supplied to the ink flow path, and a coolant other than the ink may be supplied to the cooling flow path. For example, as shown in FIG. 10, the ink in the ink tank 4 may be sent to the inkjet head 5 via the ink supply pipe 21 by operating the pressure pump 24 and the suction pump 25, and the ink may be returned to the ink tank 4 via the ink discharge pipe 22, and the coolant in the coolant tank 204 may be sent to the cooling unit 40 via the coolant supply pipe 221 by operating the pressure pump 224 and the suction pump 225, and the coolant may be returned to the coolant tank 204 via the coolant discharge pipe 222. In this way, a coolant circulation flow path 223 may be formed separately from the ink circulation flow path 23. For example, the form of the ink and coolant flow paths may be changed according to the design specifications.

[0117] In addition, for example, in the above-described embodiment, an inkjet printer has been described as an example of a liquid jet recording apparatus, but the liquid jet recording apparatus is not limited to a printer. For example, a fax machine, an on-demand printer, or the like may be used. In the above-described embodiment, a configuration in which the inkjet head moves relative to the recording medium during printing (so-called shuttle machine) has been described as an example, but the present disclosure is not limited to this configuration. The configuration according to the present disclosure may be adopted in a configuration in which the recording medium moves relative to the inkjet head while the inkjet head is fixed (so-called fixed head machine). In the above embodiment, the recording medium P is paper, but this is not limited to the above configuration. The recording medium P is not limited to paper, and may be a metal material, a resin material, or a food product. In the above-described embodiment, the liquid ejection head is mounted on the liquid ejection recording device, but the present invention is not limited to this configuration. In other words, the liquid ejected from the liquid ejection head is not limited to the liquid that is to be landed on the recording medium, and may be, for example, a medicinal liquid to be mixed in a medicine, a food additive such as a seasoning or a fragrance to be added to food, or an aromatic to be sprayed into the air. In the above embodiment, the configuration has been described in which the Z direction coincides with the direction of gravity, but the present invention is not limited to this configuration, and the Z direction may be aligned with the horizontal direction. [Explanation of symbols]

[0118] 1. Printer (liquid jet recording device) 5. Inkjet head (liquid ejection head) 29 … Carriage 30 … Head body (injection part) 35 ... Drive circuit (heat source) 41 … Cooling pipes 42 … Cooling channel 50 ... Cooling material 51… Page 1 52…Second side 53A, 53B, 53C, 54D … Recesses 54 ... Partition 55A, 55B, 55C, 55D … Curved section 56 … Heat source placement surface

Claims

1. A head body that ejects liquid; A drive circuit for controlling the operation of the head body; a flexible substrate on which the driving circuit is mounted and which is electrically connected to the head body; a cooling member in thermal contact with the drive circuit; a support member that receives heat from the drive circuit, The cooling member and the support member are fixed to a center portion of the head body in a longitudinal direction. Liquid injection head.

2. A plurality of the drive circuits are mounted on the flexible substrate at intervals in the longitudinal direction, the cooling member and the support member are fixed directly below a central drive circuit in the longitudinal direction among the plurality of drive circuits; The liquid jet head according to claim 1 .

3. The cooling member and the support member are fixed via a through hole formed in the flexible substrate. The liquid jet head according to claim 1 .

4. The through hole is closed within the plane of the flexible substrate. The liquid jet head according to claim 3 .

5. A plurality of the drive circuits are mounted on the flexible substrate at intervals in the longitudinal direction, the through hole is formed at a position overlapping with a central driving circuit in the longitudinal direction among the plurality of driving circuits in a cross section perpendicular to the longitudinal direction; The liquid jet head according to claim 4 .

6. The head body is provided with a nozzle row for ejecting the liquid, a base member located on the head main body, the base member having a long hole formed on a lower surface thereof through which the nozzle row is exposed; a flow path member attached to both ends of the head body in the longitudinal direction, the cooling member and the flow path member are fixed to both ends of the head body in the longitudinal direction; The liquid jet head according to claim 1 .

7. The flow path members are provided at both ends of the support member in the longitudinal direction of the head body. The liquid jet head according to claim 6 .

8. a substrate body on which an electric circuit is mounted and which is electrically connected to the flexible substrate; A connecting member that connects the substrate body and the cooling member. The liquid jet head according to claim 6 .

9. a head body provided with a nozzle row for ejecting liquid; a base member located on the head main body, the base member having a long hole formed on a lower surface thereof through which the nozzle row is exposed; A drive circuit for controlling the operation of the head body; a flexible substrate on which the driving circuit is mounted and which is electrically connected to the head body; a cooling member in thermal contact with the drive circuit; a flow path member attached to both ends of the head body in the longitudinal direction, The cooling member and the flow path member are fixed to both ends of the head body in the longitudinal direction. Liquid injection head.

10. a support member for receiving heat from the drive circuit; The flow path members are provided at both ends of the support member in the longitudinal direction of the head body. The liquid jet head according to claim 9 .

11. a substrate body on which an electric circuit is mounted and which is electrically connected to the flexible substrate; A connecting member that connects the substrate body and the cooling member. The liquid jet head according to claim 9 .

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