Processing apparatus, processing method, joining device, and method for manufacturing article

Abstract

To provide a processing apparatus that reduces the number of dies that are subjected to pre-processing but are not used for manufacture.SOLUTION: A processing apparatus has: a first conveying unit that conveys a die used for joining processing, of a plurality of dies, to a holding unit; and a second conveying unit that conveys the holding unit holding the die conveyed by the first conveying unit to a pre-processing unit that applies material to the die or changes the properties of a surface. The holding unit holds the die by using the self-weight of the die.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a processing apparatus, a processing method, a joining apparatus, and a method for manufacturing an article. [Background technology]

[0002] Patent Document 1 describes a method for manufacturing an article by bonding a substrate and a die that has been separated through a dicing process, and also describes performing a pretreatment on the die for the bonding process. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-77928 A Summary of the Invention [Problem to be solved by the invention]

[0004] Generally, pre-processing of dies is performed for each unit, for example, for each unit (substrate) that has undergone a dicing process. Also, the number of dies used in manufacturing (bonding process) varies depending on the type and number of products to be manufactured. This results in a difference between the total number of dies that have been pre-processed and the total number of dies that will be used in the bonding process, and some of the dies that have been pre-processed may not be used in manufacturing.

[0005] Here, it is preferable that the bonding process is performed within a certain time after the pretreatment in order to maintain the strength of the bond (adhesion strength) between the object and the die when the die is bonded to the object. This is because the strength of the bond may decrease if a die that has been in the pretreatment for a certain time is used for bonding. In this way, if the strength of the bond between the object and the die is in a decreased state, it affects the quality of the product to be manufactured. Also, depending on the type of pretreatment or bonding process, dies that are not used in manufacturing (dies that have been in the pretreatment for a certain time) may be discarded.

[0006] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a processing apparatus that reduces the number of dies that are not used in manufacturing despite having been subjected to pre-processing. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, a processing apparatus as one aspect of the present invention has a first transport unit that transports a die to be used for a joining process from among a plurality of dies to a holding unit, and a second transport unit that transports the holding unit holding the die transported by the first transport unit to a pre-processing unit that applies a material to the die or changes the properties of its surface, and is characterized in that the holding unit holds the die by utilizing the die's own weight.

[0008] Further objects or other aspects of the present invention will become apparent from the embodiments described below with reference to the drawings. Effect of the Invention

[0009] According to the present invention, it is possible to provide a processing apparatus that reduces the number of dies that are not used in manufacturing despite having been subjected to pre-processing. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic view of a joining device according to a first embodiment. [Diagram 2] 1 is an example of a die used in a bonding process. [Diagram 3] 4 is a flowchart of a joining process in the first embodiment. [Figure 4] This is an example in which one type of die is held in a carrier. [Diagram 5] FIG. 11 is a schematic view of a joining device according to a second embodiment. [Figure 6] FIG. 13 illustrates an example of transferring dies to a carrier based on quality. [Figure 7] 10 is a flowchart of a method for manufacturing an article in a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the following embodiment does not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of these features are necessarily essential to the invention, and each embodiment may be arbitrarily combined. Furthermore, in the drawings, the same reference numbers are used for the same or similar configurations, and duplicated explanations are omitted.

[0012] In addition, in this specification and drawings, directions are basically indicated by an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are mutually orthogonal. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

[0013] A specific configuration will be described below for each embodiment.

[0014] First Embodiment 1 is a schematic diagram of a bonding apparatus 100 in this embodiment. The bonding apparatus 100 includes a processing section 10, a bonding processing section 20, an inter-apparatus conveying section 50 that conveys an object processed in the processing section 10 to the bonding processing section 20, and a first control section 101. The inter-apparatus conveying section 50 is, for example, a conveying hand. Note that, in this embodiment, an example is shown in which an object processed in the processing section 10 is conveyed to the bonding processing section 20 by the inter-apparatus conveying section 50 that is separate from the processing section 10 and the bonding processing section 20, but the conveying of the object may be performed by a conveying section that constitutes a part of the processing section 10 or the bonding processing section 20.

[0015] The bonding processing unit 20 performs a process of bonding a substrate 2 (first object) on which a semiconductor device is formed, and a die (chip) 30 including a semiconductor device. Here, in this embodiment, the bonding region of the substrate 2 to which the die 30 is bonded will be described as a semiconductor device formed on the substrate 2. The processing unit 10 includes a pre-processing unit 60, which performs pre-processing for the bonding process on the object (substrate 2 or die 30) to be bonded. Specifically, the pre-processing unit applies a material to the object to be bonded and changes the properties of the surface of the object. The pre-processing unit 60 may perform pre-processing on both the substrate 2 and the die 30.

[0016] The substrate 2 may be a silicon wafer, a silicon wafer on which wiring is formed, a glass wafer, a glass panel on which wiring is formed, a printed wiring board (PWB) on which wiring is formed, a printed circuit board (PCB) on which electronic components are mounted, or a metal panel. Alternatively, the substrate 2 may be a substrate in which a die on which a semiconductor device is formed is bonded to a wafer on which a semiconductor device is formed.

[0017] For example, the die 30 may be a die 30 that has been singulated through a dicing process (cutting process), a stack of several singulated dies 30, or a structure such as a small piece of material, an optical element, a MEMS, etc.

[0018] The processing section 10 of this embodiment has a pre-processing section 60, a transport processing section 70, a second control section 14, and a memory section 15. The pre-processing section 60 of this embodiment includes a cleaning section 11, an activation processing section 12, and a hydrophilic processing section 13. Each section included in the pre-processing section 60 processes each of the objects (substrate 2 and die 30) transported from the transport processing section 70, thereby performing pre-processing for the bonding process of the objects. Note that the pre-processing section 60 may perform pre-processing on the die 30, and the substrate 2 may be pre-processed by a different pre-processing section.

[0019] The first control unit 101 is a control unit that controls each part of the bonding apparatus 100. The second control unit 14 is a control unit that controls each part of the processing unit 10. The first control unit 101 and the second control unit 14 can be configured by, for example, a CPU, a PLD such as an FPGA, an ASIC, a general-purpose or dedicated computer with a program built in, or a combination of all or part of these. Note that, in this embodiment, an example is shown in which the first control unit 101 and the second control unit 14 are separate, but the second control unit 14 may control each part of the bonding apparatus 100 together, or the first control unit 101 may control each part of the bonding apparatus 100 by itself without providing a control unit in the processing unit 10.

[0020] The cleaning unit 11 cleans the transported object. The activation processing unit 12 performs a process for activating the surface of the object using, for example, plasma or the like. The hydrophilic processing unit 13 performs a process for providing OH groups to the surface of the object. In this embodiment, the pre-processing unit 60 performs the pre-processing as described above, but the pre-processing unit 60 performs a pre-processing according to the bonding method in the bonding processing unit 20. The bonding method in the bonding processing unit 20 is, for example, bonding with an adhesive, temporary bonding with a temporary adhesive, bonding with hybrid bonding, atomic diffusion bonding, vacuum bonding, bump bonding, etc., and various temporary bonding and permanent bonding methods can be used. For example, when the bonding method in the bonding processing unit 20 is bonding with an adhesive, the pre-processing is a process for applying a material such as an adhesive. For example, when the bonding method in the bonding processing unit 20 is hybrid bonding, the pre-processing is a process for changing the properties of the surface of the die 30. The pre-processing may also include a process for detecting an abnormality in the die 30 and repairing it.

[0021] Generally, pre-processing of dies is performed for each fixed unit. This is because performing pre-processing on each die would take a long time. For example, for each unit (each substrate) on which a dicing process has been performed. In conventional pre-processing, the dies 30 separated by the dicing process were provided to the pre-processing unit 60 while held by a dicing tape (second holding unit) 41 attached to a dicing frame 40. Then, pre-processing was performed for each dicing frame 40 (each substrate) while held by the dicing tape (second holding unit) 41.

[0022] Here, the number of dies 30 used in manufacturing (joining process) varies depending on the type and number of products to be manufactured. As a result, the total number of dies 30 that have been pre-processed differs from the total number of dies 30 that are used in the joining process, and some of the dies 30 that have been pre-processed may not be used in manufacturing.

[0023] In addition, it is preferable that the bonding process is performed within a certain time after the pretreatment in order to maintain the strength of the bond (adhesion strength) between the object and the die 30 when the die 30 is bonded to the object. This is because the strength of the bond may decrease if the die 30 is used for bonding after a certain time has passed since the pretreatment. In this way, if the strength of the bond between the object and the die 30 is in a decreased state, it affects the quality of the product to be manufactured. Also, depending on the type of pretreatment or bonding process, the die 30 not used for manufacturing (die after a certain time has passed since the pretreatment) may be discarded.

[0024] Therefore, in this embodiment, a pre-processing is performed on the die 30 to be used in the bonding process. Specifically, a first transport unit 71 acquires the die 30 to be used in the bonding process from among the multiple dies 30 held by the dicing tape 41 attached to the dicing frame 40, and transports it to a carrier (holding unit) 72. The first transport unit 71 is, for example, a transport hand. The carrier 72 holds the die 30 on its upper surface (the surface on the +Z direction side). This carrier 72 may hold the die 30 by using only the weight of the die 30, or may hold the die 30 by using the weight of the die 30 and a holding mechanism (for example, a suction mechanism) provided in the carrier 72.

[0025] The dies 30 to be used for the bonding process held by the carrier 72 are pre-processed by each of the processing units 11 to 13 for each carrier 72. This allows the pre-processing to be performed only on the dies 30 required for the bonding process, and reduces the number of dies 30 that are not used for manufacturing despite having been pre-processed.

[0026] FIG. 2 shows an example of a die 30 used in a bonding process. In the bonding process, multiple types of die 30 may be bonded to one semiconductor device (a region to be bonded, for example, a chip) among multiple semiconductor devices (regions to be bonded) on a substrate 2. In this case, the number of each type of die 30 may differ depending on the product (semiconductor device) to be manufactured. For example, as shown in FIG. 2(a), a case will be described in which a bonding process is performed using a first group 310 which is a group of a first type of die 31, a second group 320 which is a group of a second type of die 32, and a third group 330 which is a group of a third type of die 33. The required type and required number of die 30 to be used in the bonding process are, for example, as shown in a fourth group 80 shown in FIG. 2(b) depending on the product to be manufactured. In the example of FIG. 2(b), the fourth group 80 is an example including one die 31, two dies 32, and three dies 33. The fourth group 80 is bonded to each of the multiple semiconductor devices on the substrate 2. The types and the number of dies in fourth group 80 vary depending on the products (semiconductor devices) to be manufactured. In other words, the types of dies and the number of each type of die included in fourth group 80 bonded to each of the multiple semiconductor devices on the substrate may differ from one another.

[0027] 3 is a flowchart of the bonding process in this embodiment. First, the die 30 (the die 30 included in the fourth group 80) to be used for bonding is held by the carrier 72 (S110, holding process). Next, the carrier 72 holding the die 30 is transported to the pretreatment section 60 where pretreatment for the bonding process (for example, coating of a material or changing the surface properties of an object) is performed (S120, transport process). Next, the pretreatment is performed on the die 30 transported in the transport process by the pretreatment section 60 (S130, pretreatment process). Next, the bonding process is performed between the die 30 pretreated in the pretreatment process and the substrate 2 by the bonding process section 20 (S140, bonding process). In this embodiment, the processing method performed in advance for the pretreatment and bonding process includes the holding process and the transport process.

[0028] This embodiment will be described in detail with reference to FIG. 1. The processing section 10 has a transport processing section (processing device) 70 that transports the die 30 used in the bonding process to the carrier 72. In this embodiment, an example in which the transport processing section 70 is included in the processing section 10 is shown, but the transport processing section 70 may be included in a device other than the bonding device 100 or the processing section 10. The transport processing section 70 has a first transport section 71, a carrier stocker 73 that stores the carrier 72, and a second transport section 74 that transports the carrier 72. Here, the second control section 14 may be included in the transport processing section 70. The first transport section 71 may include, for example, a pickup head (not shown) and a release head (not shown). The first transport section 71 may peel off the die 30 to be transported to the carrier 72 from the dicing tape 41 by the release head, and hold the die 30 by suction with the pickup head. In this embodiment, an example in which the first transport sections 71 are provided for the number (three) of types of die 30 is described, but the number of first transport sections 71 is not particularly limited. In addition, it is preferable that a plurality of carriers 72 are provided according to the processing speed of the processing section 10. The number of second transport sections 74 may be equal to the number of carriers 72 moving in the transport processing section 70, or each carrier 72 may be transported by a number of second transport sections 74 less than the number of carriers 72. In the present embodiment, an example in which the carriers 72 are stored in the carrier stocker 73 has been shown, but the carrier stocker 73 may not be provided. In this case, the carriers 72 are not stored at a predetermined position, and the carriers 72 move to a position to receive the dies 30 after delivering the pre-processed object to the inter-apparatus transport section 50.

[0029] First, the second conveying unit 74 holds the carrier 72 stored in the carrier stocker 73 and moves the carrier 72 to a position where the carrier 72 can receive the die 31. Next, the first conveying unit 71 acquires the die 31 held on the dicing tape 41 and conveys it to the carrier 72. This operation of the first conveying unit 71 is repeated until the required number of dies 31 are conveyed to the carrier 72. The second conveying unit 74 moves the carrier 72 holding the die 31 to a position where the carrier 72 can receive the die 32. Next, the first conveying unit 71 acquires the die 32 held on the dicing tape 41 and conveys it to the carrier 72. This operation of the first conveying unit 71 is repeated until the required number of dies 32 are conveyed to the carrier 72. The second conveying unit 74 moves the carrier 72 holding the die 31 and the die 32 to a position where the carrier 72 can receive the die 33. Next, the first conveying unit 71 acquires the die 33 held on the dicing tape 41 and conveys it to the carrier 72. This operation of the first transport unit 71 is repeated until the required number of dies 33 are transported to the carrier 72. Through these operations, the carrier 72 comes to a state in which the dies 30 required for bonding (fourth group 80) are held thereon.

[0030] The second control unit 14 controls the operation of the first transport unit 71 and the second transport unit 74 according to the type and number of dies 30 required for bonding. For example, one die 31, two dies 32, and three dies 33 are used for bonding a certain semiconductor device on the substrate 2, and three dies 31, one die 32, and no die 33 are used for bonding another semiconductor device on the substrate 2. In this case, the second control unit 14 controls the carrier 72 to hold an appropriate type and number of dies 30 based on information on the dies 30 used in the bonding process (information on the type and number of dies 30 required in the bonding process) previously stored in the storage unit 15. Alternatively, the second control unit 14 controls the carrier 72 to hold an appropriate type and number of dies 30 based on information on the dies 30 used in the bonding process (information on the type and number of dies 30 required in the bonding process) transmitted from another device. That is, based on information about the dies 30 stored in the memory unit 15 or transmitted from another device, the second control unit 14 controls at least one of the first transport unit 71 and the second transport unit 74 to have the carrier 72 hold an appropriate type and number of dies 30. For example, the second control unit 14 controls the first transport unit 71 to transport an appropriate type and number of dies 30 to the carrier 72. Then, for the carrier 72 holding the fourth group 80 for semiconductor devices not using dies 33, the second control unit 14 moves the carrier 72 to the next position (in this case, the cleaning unit 11) without moving the carrier 72 to a position where the dies 33 can be received.

[0031] Next, the second conveying unit 74 conveys the carrier 72 holding the dies 30 (fourth group 80) to be used for bonding to pretreatment units such as the cleaning unit 11, the activation unit 12, and the hydrophilic treatment unit 13, where the dies 30 included in the fourth group 80 are pretreated. For example, the second conveying unit 74 conveys the carrier 72 into the cleaning unit 11, and after the pretreatment in the cleaning unit 11 is completed, the second conveying unit 74 conveys the carrier 72 into the activation treatment unit 12. Then, after the pretreatment in the activation treatment unit 12 is completed, the second conveying unit 74 conveys the carrier 72 into the hydrophilic treatment unit 13. Then, the dies 30 pretreated by the pretreatment unit 60 are conveyed to the bonding treatment unit 20 by the second conveying unit 74 and the inter-apparatus conveying unit 50.

[0032] In the present embodiment, an example has been shown in which the fourth group 80 to be bonded to one semiconductor device (bonded region) among the multiple semiconductor devices (bonded regions) on the substrate 2 is held by the carrier 72. However, the present invention is not limited to this example, and multiple fourth groups 80 to be bonded to multiple semiconductor devices (bonded regions) may be held by the carrier 72. For example, the dies 30 used to bond all of the semiconductor devices (bonded regions) on the substrate 2 may be held together by the carrier 72.

[0033] Here, in this embodiment, an example has been shown in which a plurality of types of dies 30 are held in the carrier 72, but one type of die 30 may be held in the carrier 72 depending on the manufacturing process or the product to be manufactured. Fig. 4 shows an example in which one type of die 30 (first type of die 31) is held in the carrier 72, and the carrier 72 holds three of the first type of dies 31.

[0034] According to this embodiment, the die 30 to be used in the bonding process is held by the carrier 72, and the die 30 held by the carrier 72 is pre-treated, so that the pre-treatment can be performed only on the die 30 to be used in the bonding process. In other words, the die 30 that is not used in the bonding process at this timing is not pre-treated, so that the die 30 can be pre-treated and used for the bonding process at another timing. This makes it possible to reduce the number of dies 30 that are not used in manufacturing despite having been pre-treated.

[0035] <Second embodiment> In addition to the features of the first embodiment, this embodiment is characterized in that the second control unit 14 controls the second conveying unit 74 and the inter-apparatus conveying unit 50 based on the time that has elapsed since the pretreatment was performed. FIG. 5 is a schematic diagram of a bonding apparatus 200 in this embodiment. The bonding apparatus 200 has a measurement unit 16 that measures the time that has elapsed since the pretreatment (for example, application of a material or change in the surface properties of an object) was performed. The measurement unit 16 measures the time that has elapsed since the pretreatment was performed for each carrier 72 (the die 30 held by the carrier 72). The measurement unit 16 may measure each time that has elapsed since each pretreatment was performed, may measure the time that has elapsed since a specific pretreatment was performed, or may measure the time that has elapsed since the last pretreatment was completed. The second control unit 14 controls the conveying of the carrier 72 to the bonding processing unit 20 based on the time (measurement result) measured by the measurement unit 16. Specifically, the second control unit 14 controls the second conveying unit 74 and the inter-apparatus conveying unit 50 that convey the carrier 72 based on the time measured by the measurement unit 16. In addition, the information measured by the measurement unit 16 may be stored in the memory unit 15, and the second control unit 14 may read the information from the memory unit 15 to control the second transport unit 74, which transports the carrier 72, and the inter-apparatus transport unit 50.

[0036] According to this embodiment, the second control unit 14 controls the transport of the carriers 72 based on the time that has elapsed since the pretreatment was performed, so that the carriers 72 can be transported to the bonding processing unit 20 after the time that has elapsed since the pretreatment was performed is the same for each carrier 72. This can reduce variation in the quality of the bonding processing, such as the bonding strength. It is also possible to preferentially transport to the bonding processing unit 20 the carriers 72 holding the dies 30 for which the pretreatment was performed a long time ago.

[0037] <Third embodiment> In addition to the features of the first embodiment, this embodiment is characterized in that the die 30 is transported to the carrier 72 based on quality information. FIG. 6 is a diagram showing an example of transporting the die 30 to the carrier 72 based on quality. FIG. 6(a) is a map showing the quality of the die 30. The die 30 has different quality due to, for example, geometric quality (chips, cracks) and conductivity. Chips and cracks can occur, for example, during a dicing process. The quality of the die 30 inspected by an inspection device or the like is represented by a quality map as shown in FIG. 6(a). This quality map is a map in which the position and quality of the die 30 correspond to each other. FIG. 6(a) shows a quality map 410 of a first group 310 which is a group of a first type of die 31, a quality map 420 of a second group 320 which is a group of a second type of die 32, and a quality map 430 of a third group 330 which is a group of a third type of die 33. In this embodiment, an example is shown in which the quality of the die 30 is divided into three stages, A, B, and C, but the stages of the quality division are not limited to this example. The order of quality is A, B, C.

[0038] 6(b) is a map showing the quality of each of the multiple semiconductor devices (objects to which die 30 is bonded) formed on substrate 2. The quality of the multiple semiconductor devices formed on substrate 2 is also inspected by an inspection device or the like, and is expressed as a quality map. This quality map is a map in which the positions and qualities of the multiple semiconductor devices on substrate 2 correspond to each other. In this embodiment, the quality of the semiconductor devices formed on substrate 2 is also classified into three levels, A, B, and C, similar to the quality classification of die 30.

[0039] In general, it is preferable to bond the die 30 having the same quality (quality grade) as the quality (quality grade) of the semiconductor device formed on the substrate 2. Therefore, in this embodiment, the die 30 is transported to the carrier 72 not only based on the type and number of the die 30 corresponding to the product to be manufactured, but also based on the quality of the die 30 corresponding to the quality of the semiconductor device formed on the substrate 2.

[0040] FIG. 6(c) is an example of transporting the die 30 to the carrier 72 based on the quality. The storage unit 15 in this embodiment stores the quality map 21 of each of the multiple semiconductor devices formed on the substrate 2, which is information on quality, and the quality map 410, the quality map 420, and the quality map 430, which are quality maps of each die. The second control unit 14 determines the quality of the die 30 to be transported to the carrier 72 based on the quality map 21. For example, when the second control unit 14 transports the die 30 to a carrier 72 that does not hold the die 30, the second control unit 14 checks the quality of the semiconductor device formed on the substrate 2 to which the carrier 72 that will transport the die 30 corresponds by referring to the quality map 21. As an example, an example will be described in which the quality of the semiconductor device formed on the substrate 2 to which the carrier 72 that will transport the die 30 corresponds is A. In this case, the second control unit 14 controls the first transport unit 71 to transport the die 31 with the quality A to the carrier 72 by referring to the quality map 410. Regarding the die 32 and the die 33, the second control unit 14 refers to the quality map 420 and the quality map 430 and controls the first transport unit 71 to transport the die 32 and the die 33, which have a quality of A, to the carrier 72. By controlling in this way by the second control unit 14, it is possible to transport the die 30, which has the same quality as the semiconductor device formed on the substrate 2, to the carrier, as shown in FIG. 6(c).

[0041] In the present embodiment, the die 30 having the same quality as the semiconductor device formed on the substrate 2 is held on the carrier 72. However, the second control unit 14 may control the quality of the multiple dies 30 held on the carrier 72 to be the same based on the information on the quality of the die 30, and the quality of the multiple dies 30 may be different from the quality of the semiconductor device formed on the substrate 2. For example, when the quality of the semiconductor device formed on the substrate 2 is A and there is no die of quality A among the dies 30, the quality of the multiple dies 30 held on the carrier 72 may be B. Alternatively, the second control unit 14 may control the first conveying unit 71 based only on the information on the quality of the die without considering the quality of the semiconductor device formed on the substrate 2. In addition, the second control unit 14 may control the quality of the multiple dies 30 held on the carrier 72 to be different from each other based on the information on the quality of the die 30. For example, the die 31 and the die 32 may have quality A, and the die 33 may have quality B but not quality A. In such a case, the second control unit 14 may control the multiple dies to be held on the carrier 72 based on the die quality information so that die 31 and die 32 are of quality A, and die 33 is of quality B.

[0042] According to this embodiment, the die 30 is transported to the carrier 72 based on information on the quality of the die 30, so that the number of dies 30 that are not used for bonding despite having been pre-processed can be reduced, and the bonding process can be performed while taking into consideration the quality of the dies 30 to be used for bonding. When the quality of the semiconductor devices formed on the substrate 2 is taken into consideration, the bonding process can be performed using dies 30 of the same quality as the semiconductor devices formed on the substrate 2.

[0043] <Fourth embodiment> The present embodiment is characterized in that an article is manufactured using the above-described joining device.

[0044] FIG. 7 is a flow chart of the manufacturing method of the article in this embodiment. First, a holding step (S210) is performed in which the die 30 to be used in the bonding process is held by the holding section (carrier 72) by utilizing the weight of the die 30. Next, a transport step (S220) is performed in which the holding section holding the die 30 in the holding step is transported to a pre-treatment section 60 in which the die 30 is coated with a material or the surface properties are changed. Next, a pre-treatment step (S230) is performed in which the die 30 transported in the transport step is coated with a material or the surface properties are changed. Next, a bonding step (S240) is performed in which a bonding process is performed to bond the die 30 processed in the pre-treatment step to a first object (substrate 2) different from the die 30. Then, a manufacturing step (S250) is performed in which an article is manufactured from a second object composed of the die 30 and the first object bonded in the bonding step.

[0045] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, LEDs, sensors, optical devices, and the like.

[0046] The manufacturing process includes, for example, packaging. According to the manufacturing method of the present invention, it is possible to manufacture an article with a smaller number of dies 30 that are not used in manufacturing despite having been subjected to pre-processing, compared to the conventional method.

[0047] The disclosure of the present specification includes the following processing apparatus, processing method, joining apparatus, and method for manufacturing an article.

[0048] [Item 1] a first conveying unit that conveys a die to be used in the bonding process from among the plurality of dies to the holding unit; A second conveying unit conveys the holder holding the die conveyed by the first conveying unit to a pre-treatment unit that applies a material to the die or changes the surface properties of the die, The holding portion holds the die by utilizing the die's own weight. A processing device comprising:

[0049] [Item 2] 2. The processing device according to item 1, wherein the holding section holds a plurality of the dies.

[0050] [Item 3] 3. The processing apparatus according to item 2, wherein the plurality of dies held by the holding unit include a first type of die and a second type of die.

[0051] [Item 4] 4. The processing device according to item 3, wherein the number of the first type of dies is different from the number of the second type of dies.

[0052] [Item 5] A control unit that controls the first transport unit, 5. The processing apparatus according to any one of items 1 to 4, wherein the control unit controls the first transport unit based on information about a quality of the die.

[0053] [Item 6] 6. The processing apparatus according to item 5, wherein the control unit controls the first transport unit based on information about the quality of an object to be bonded to the die.

[0054] [Item 7] 6. The processing apparatus according to item 5, wherein the first transport section transports to the holding section a second type of die having the same quality grade as the first type of die transported to the holding section.

[0055] [Item 8] 8. The processing apparatus according to any one of items 1 to 7, wherein the first transport unit transports a die to be used in the bonding process from each of a plurality of second holding units.

[0056] [Item 9] 9. The processing apparatus according to any one of items 1 to 8, wherein the second transport unit transports a plurality of the holders.

[0057] [Item 10] 10. The processing apparatus according to any one of items 1 to 9, wherein the holding unit holds the die corresponding to one bonding region on a substrate on which the bonding process is performed.

[0058] [Item 11] 10. The processing apparatus according to any one of items 1 to 9, wherein the holding unit holds the dies corresponding to a plurality of bonding regions on a substrate on which the bonding process is performed.

[0059] [Item 12] A control unit that controls the first transport unit and the second transport unit; A storage unit that stores information regarding the die used in the bonding process, 12. The processing apparatus according to any one of items 1 to 11, wherein the control unit controls at least one of the first transport unit and the second transport unit based on the information stored in the memory unit.

[0060] [Item 13] A measuring unit for measuring the time elapsed since the application of the material or the change of the property was performed; A control unit that controls the conveyance of the holding unit, 13. The processing apparatus according to any one of items 1 to 12, wherein the control unit controls the conveyance of the holding unit based on a measurement result of the measurement unit.

[0061] [Item 14] a holding step of holding a die to be used in a joining process among a plurality of dies on a holding part by utilizing the weight of the die; a conveying step of conveying the holding unit holding the die in the holding step to a pre-treatment unit which applies a material to the die or changes a surface property of the die; A processing method comprising the steps of:

[0062] [Item 15] a first conveying unit that conveys a die to be used in the bonding process from among the plurality of dies to the holding unit; A second conveying unit conveys the holder holding the die conveyed by the first conveying unit to a pre-treatment unit that applies a material to the die or changes the properties of a surface of the die; a joining processing section that joins the die processed in the pre-processing section to a first object different from the die, The holding portion holds the die by utilizing the die's own weight. A joining device characterized by:

[0063] [Item 16] a holding step of holding a die to be used in a joining process among a plurality of dies on a holding part by utilizing the weight of the die; a conveying step of conveying the holding unit holding the die in the holding step to a pre-treatment unit which applies a material to the die or changes a surface property of the die; a pretreatment step of applying the coating or changing the properties to the die transported in the transport step; a joining process for performing the joining process of joining the die treated in the pretreatment process to a first object different from the die; a manufacturing process for manufacturing an article from a second object constituted by the die and the first object joined in the joining process; A method for producing an article, comprising the steps of:

[0064] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. a first conveying unit that conveys a die to be used in the bonding process among the plurality of dies to the holding unit; A second conveying unit conveys the holder holding the die conveyed by the first conveying unit to a pre-treatment unit that applies a material to the die or changes a surface property of the die, The holding portion holds the die by utilizing the die's own weight. A processing device comprising:

2. The processing apparatus according to claim 1 , wherein the holder holds a plurality of the dies.

3. The processing apparatus according to claim 2 , wherein the plurality of dies held by the holder include a first type of die and a second type of die.

4. The processing apparatus according to claim 3 , wherein the number of the first type of dies is different from the number of the second type of dies.

5. A control unit that controls the first transport unit, The processing apparatus according to claim 1 , wherein the control unit controls the first transport unit based on information on the quality of the die.

6. The processing apparatus according to claim 5 , wherein the control unit controls the first transport unit based on information on a quality of an object to be bonded to the die.

7. The processing apparatus according to claim 5 , wherein the first transport section transports to the holder a second type of die having the same quality grade as the first type of die transported to the holder.

8. The processing apparatus according to claim 1 , wherein the first transport unit transports the die to be used in the bonding process from each of a plurality of second holders.

9. The processing apparatus according to claim 1 , wherein the second transport unit transports a plurality of the holders.

10. The processing apparatus according to claim 1 , wherein the holding section holds the die corresponding to one bonding region on a substrate on which the bonding process is performed.

11. The processing apparatus according to claim 1 , wherein the holding section holds the dies corresponding to a plurality of bonding regions on a substrate on which the bonding process is performed.

12. A control unit that controls the first transport unit and the second transport unit; A storage unit that stores information regarding the die used in the bonding process, The processing apparatus according to claim 1 , wherein the control unit controls at least one of the first transport unit and the second transport unit based on the information stored in the storage unit.

13. A measuring unit for measuring the time elapsed since the application of the material or the change of the property was performed; A control unit that controls the conveyance of the holding unit, The processing apparatus according to claim 1 , wherein the control unit controls the conveyance of the holding unit based on a measurement result of the measurement unit.

14. a holding step of holding a die to be used in a joining process among a plurality of dies on a holding part by utilizing the weight of the die; a conveying step of conveying the holding unit holding the die in the holding step to a pre-treatment unit which applies a material to the die or changes a surface property of the die; A processing method comprising the steps of:

15. a first conveying unit that conveys a die to be used in the bonding process among the plurality of dies to the holding unit; A second conveying unit that conveys the holder that holds the die conveyed by the first conveying unit to a pre-treatment unit that applies a material to the die or changes a surface property of the die; a joining processing section that joins the die processed in the pre-processing section to a first object different from the die, The holding portion holds the die by utilizing the die's own weight. A joining device characterized by:

16. a holding step of holding a die to be used in a joining process among a plurality of dies on a holding part by utilizing the weight of the die; a conveying step of conveying the holding unit holding the die in the holding step to a pre-treatment unit which applies a material to the die or changes a surface property of the die; a pretreatment step of applying the coating or changing the properties to the die transported in the transport step; a joining process for performing the joining process of joining the die treated in the pre-treatment process to a first object different from the die; a manufacturing process for manufacturing an article from a second object constituted by the die and the first object joined in the joining process; A method for producing an article, comprising the steps of:

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