Mask housing device, deposition device, and mask cassette

Abstract

To provide a mask housing device, a deposition device, and a deposition device, capable of surely performing a position adjustment of a horizontal direction of the mask cassette.SOLUTION: A mask housing device comprises, in a state where a mask cassette 200 is supported by a first support part 141, a plurality of depression members 152 in which a mask cassette 200 is pressed from both side surfaces to a first direction that is parallel to a support surface of the first support part 141 to position the mask cassette 200 in the first direction. In the mask cassette 200, it is depressed by each depression member 152 to one place from a plurality of places depressed by the plurality of depression members 152, and thereby, a guide surface 225 is provided to move the mask cassette itself in a second direction parallel to the support surface and vertical to the first direction.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a mask storage device, a film forming device, and a mask cassette.

Background Art

[0002] Conventionally, in a film forming device, in order to enable the replacement of a mask inside the device, a technique of providing a mask storage device capable of accommodating a plurality of masks is known. Patent Document 1 discloses a technique of opening a lid on the upper part of a chamber body and taking in and out a mask cassette capable of accommodating a plurality of masks in multiple stages into and from the chamber body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Patent Document 1 discloses a technique for detecting whether the position of a mask cassette is correct, but does not disclose a technique for performing horizontal position adjustment of the mask cassette. Therefore, there is still room for improvement regarding the position adjustment of the mask cassette.

[0005] An object of the present invention is to provide a mask storage device, a film forming device, and a mask cassette capable of more reliably performing horizontal position adjustment of a mask cassette.

Means for Solving the Problems

[0006] The mask storage device of the present invention includes: a mask cassette capable of accommodating a plurality of masks in multiple stages; a chamber body capable of accommodating the mask cassette; A support member disposed in the chamber body and supporting the mask cassette, A mask storage device comprising: With the mask cassette supported by the support member, a plurality of pressing members are provided for positioning the mask cassette in a first direction by pushing the mask cassette from both side surfaces with respect to the first direction parallel to the support surface of the support member. The mask cassette is provided with a guide surface at one of a plurality of locations pressed by the plurality of pressing members, and when pressed by the pressing member, the mask cassette itself is moved in a second direction parallel to the support surface and perpendicular to the first direction.

Effect of the Invention

[0007] As described above, according to the present invention, the horizontal position adjustment of the mask cassette can be performed more reliably.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Embodiments for Carrying Out the Invention

[0009] Hereinafter, with reference to the drawings, embodiments for carrying out this invention will be exemplarily and specifically described in detail based on examples. However, the following examples merely exemplarily show preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. Also, in the following description, the hardware configuration, software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the device are not intended to limit the scope of the present invention to these unless otherwise specifically described.

[0010] The present invention relates to a film forming apparatus for forming a thin film on a substrate. The present invention can be preferably applied to an apparatus for forming a thin film of a desired pattern on the surface of a substrate by vacuum evaporation. As the material of the substrate, any material such as glass, resin, metal, etc. can be selected, and as the evaporation material, any material such as organic materials, inorganic materials (metals, metal oxides, etc.) can also be selected. The technology of the present invention can be specifically applied to manufacturing apparatuses for organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members, etc. The present invention can also be applied to a film forming apparatus that forms a film by a method other than evaporation, for example, sputtering.

[0011] (Example) With reference to FIGS. 1 to 20, a mask storage device, a film forming apparatus, and a mask cassette according to an embodiment of the present invention will be described.

[0012] <Manufacturing line of electronic device> FIG. 1 is a schematic configuration diagram of a part of a film forming apparatus, and more specifically, is a top view schematically showing a part of the configuration of a manufacturing line of an electronic device.

[0013] As generally shown in FIG. 1, the film forming apparatus 1 includes a plurality of film forming chambers 10 in which film formation on a substrate is performed, a mask stocker chamber 100 as a mask storage device for storing masks before and after use, and a transfer chamber 30 disposed at the center thereof.

[0014] In the transfer chamber 30, a transfer robot 40 for transferring the substrate between the plurality of film forming chambers 10 and transferring the mask between the film forming chamber 10 and the mask stocker chamber 100 is installed. The transfer robot 40 is, for example, a robot having a structure in which a robot hand for holding a substrate or a mask is attached to a multi-joint arm.

[0015] In the film forming apparatus 1, in the flow direction of the substrate, the substrate sent from the upstream side is transported to the film forming apparatus 1 A pass chamber 50 for sending and a buffer chamber 60 for conveying the substrate on which the film formation process in this film forming apparatus 1 is completed to another film forming apparatus on the downstream side are connected. The transfer robot 40 receives the substrate from the upstream pass chamber 50 and transfers it to one of the film forming chambers 10 in this film forming apparatus. Further, the transfer robot 40 receives the substrate on which the film formation process in the film forming apparatus 1 is completed from one of the plurality of film forming chambers 10 and transfers it to the buffer chamber 60 connected to the downstream side. A turning chamber 70 for changing the direction of the substrate is provided between the buffer chamber 60 and the pass chamber 50 on the further downstream side. Thereby, the direction of the substrate can be made the same in the upstream film forming apparatus and the downstream film forming apparatus, and the substrate processing becomes easy.

[0016] In the mask stocker chamber 100, the masks used in the film formation process in the film formation chamber 1 and the used masks are stored separately in two mask cassettes. The transfer robot 40 transfers the used mask from the film formation chamber 1 to the mask cassette in the mask stocker chamber 100, and transfers the new mask stored in the other mask cassette in the mask stocker chamber 100 to the film formation chamber 1.

[0017] Each chamber such as the film formation chamber 10, the mask stocker chamber 100, the transfer chamber 30, the buffer chamber 60, and the turning chamber 70 is maintained in a high vacuum state during the manufacturing process of the organic EL display panel. A series of film formation processes such as the transfer of the substrate with the transfer robot 40, the adjustment of the relative position (alignment) between the substrate and the mask, the fixing of the substrate onto the mask, and the film formation (evaporation) are automatically performed by the film forming apparatus 1.

[0018] In addition, the film forming apparatus 1 includes a control unit 80. The control unit 80 has functions such as controlling various operations of the mask stocker chamber 100 as a mask storage device, transporting and aligning the substrate, and controlling film formation. The control unit 80 can be configured by a computer having, for example, a processor, a memory, a storage, I / O, etc. In this case, the functions of the control unit 80 are realized by the processor executing a program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, part or all of the functions of the control unit 80 may be configured by a circuit such as an ASIC or an FPGA. Note that the control unit 80 may be provided for each film forming apparatus, or one control unit 80 may control a plurality of film forming apparatuses.

[0019] <Film forming chamber> In particular, with reference to FIG. 2, the configuration of the film forming chamber 10 and the film forming process will be described. The film forming chamber 10 includes a chamber 11, a support mechanism 12 provided in the chamber 11, and a film forming source 13 provided in the chamber 11. The inside of the chamber 11 is configured to be maintainable in a vacuum atmosphere or an inert gas atmosphere. In the chamber 11, the substrate S to be film formed is supported by the support mechanism 12 so as to face downward. Also, a mask M is disposed below the substrate S in a state of being positioned with respect to the substrate S. The mask M is provided with an opening at a position corresponding to the position where a thin film is to be formed on the substrate S, and is configured to cover the position on the substrate S where the thin film is not to be formed. Thereby, by performing film formation on the substrate S through the mask M, a thin film having a desired pattern (a pattern corresponding to the position where the opening is provided) is formed on the substrate S. As a specific example of the mask M, for example, a member composed of a mask frame having high rigidity provided on the outer periphery and a mask foil having low rigidity provided inside the mask frame can be mentioned. The mask frame and the mask foil can be joined by welding or the like. In the mask configured in this way, the above-described opening is provided in the mask foil. As another specific example, a mask integrally including a portion corresponding to the mask frame and a portion corresponding to the mask foil can be mentioned. Such a mask can be manufactured, for example, by processing a silicon wafer.

[0020] In this embodiment, film formation (deposition) by vacuum evaporation is performed. Specifically, the film formation source 13 in this embodiment is an evaporation source, and the film formation material evaporates or sublimes from the film formation source 13 and is deposited on the substrate S through the opening of the mask M, forming a thin film on the substrate S. Since the evaporation source is a known technique, it will be briefly described here. For example, the evaporation source includes a container (crucible) for accommodating the evaporation material, a heater for heating the container, a shutter for stopping the release of the evaporation material, a drive mechanism for driving various members such as the shutter, and an evaporation rate monitor for recognizing the thickness of the film to be formed. Note that, in this embodiment, the case where the film formation source 13 is an evaporation source is shown, but in the present invention, it is not limited thereto, and it is also applicable to a sputtering apparatus using a sputtering target as the film formation source.

[0021] In this film formation chamber 10, film formation is performed on the substrate S by the film formation source 13 in a state where the mask M stored in the mask stocker chamber 100 as the mask storage device is moved to a position where it is overlapped with the substrate S.

[0022] <Mask storage device> With reference to FIGS. 3 to 19, the configuration and operation (mechanism) of the mask stocker chamber 100 as the mask storage device will be described. In each figure, the configuration (mechanism) necessary for explaining the operation mechanism is mainly shown, and other configurations are appropriately omitted. Also, for some configurations, for the reason of being easily distinguishable from other configurations, they are shown by dotted lines as necessary. In FIGS. 5 to 15 and FIGS. 17 to 19, (a) shows a view seen from above, and (b) shows a view seen from the side. Also, in FIGS. 3, 5 to 19, the three axes (X, Y, and Z axes) are shown. The Z axis corresponds to the vertical direction in a state where the film formation apparatus 1 is installed on the horizontal plane, and the X axis and the Y axis correspond to directions parallel to the horizontal plane and perpendicular to each other.

[0023] <<Overall configuration of the mask stocker>> FIG. 3 is a diagram schematically showing the entirety of the mask stocker chamber 100. The mask stocker chamber 100 includes a mask cassette 200 capable of storing a plurality of masks M in multiple stages, a chamber body 111 capable of storing the mask cassette 200, and a lid 120 capable of opening and closing the opening 111a of the chamber body 111. Inside (lower side) of the lid 120, a plurality of ribs 121 for enhancing the strength of the lid 120 are provided within a range that does not interfere with various mechanisms inside the chamber body 111.

[0024] In the chamber body 111, an opening 111a is provided at the upper part in the vertical direction, and the opening 111a is opened and closed by a lid 120 configured to be reciprocally movable in the Z-axis direction (vertical direction). The mask stocker chamber 100 according to the present embodiment includes a lid movement mechanism 125 that moves the lid 120 between a first position where the lid 120 closes the opening 111a and a second position vertically above the first position. In FIG. 3, the lid 120 shown by the solid line indicates the state of being located at the first position, and the lid 120 shown by the dotted line indicates the state of being located at the second position. As shown in the drawing, in the state where the lid 120 has moved to the second position, the mask cassette 200 is configured to be movable horizontally to a position between the opening 111a and the lid 120.

[0025] The lid movement mechanism 125 includes a screw shaft 125a, a drive source 125b such as a motor that rotates the screw shaft 125a forward and backward, and a nut 125c that moves along the screw shaft 125a as the screw shaft 125a rotates forward and backward. The lid 120 is fixed to the nut 125c and thus moves together with the nut 125c. Although it is desirable to provide a linear guide so that the lid 120 moves up and down in a stable state, it is omitted in each drawing. Further, in the present embodiment, the case where the lid movement mechanism 125 is configured by a ball screw mechanism is shown, but as long as it is a mechanism capable of linearly reciprocating the lid 120, it is not limited to the ball screw mechanism. Rather, various configurations such as a rack and pinion mechanism can be adopted. In the mask stocker chamber 100 according to this embodiment, there are also a plurality of mechanisms for reciprocating each member. However, in these mechanisms as well, various known techniques such as a ball screw mechanism and a rack and pinion mechanism can be adopted, so the description thereof will be omitted as appropriate below.

[0026] And the mask stocker chamber 100 is also provided with a mask cassette moving mechanism that lowers the mask cassette 200 that has moved to a position between the opening 111a and the lid 120 (located at the second position) to a position inside the chamber body 111. Note that this mask cassette moving mechanism is also used to raise the mask cassette 200 when taking out the mask cassette 200 from the chamber body 111. The mask cassette moving mechanism and its operation will be described later.

[0027] On the side wall surface of the chamber body 111, a mask opening 111b for taking the mask M in and out of the chamber body 111 is provided. This mask opening 111b is configured to be openable and closable by a lid 112 for the mask opening.

[0028] Inside the chamber body 111, there are a support base 130 for supporting the mask cassette 200 and a lifting mechanism for lifting the support base 130 to change the height-directional positional relationship between the mask cassette 200 and the mask opening 111b. Similar to the lid movement mechanism 125, this lifting mechanism employs a ball screw mechanism including a screw shaft 135 and a drive source 136 such as a motor. However, as described above, other mechanisms may be employed. Note that the support base 130 may have the function of a nut, or the support base 130 may be fixed to the nut. With the lifting mechanism configured as described above, the mask cassette 200 is moved together with the support base 130 so that the mask M to be carried out from the chamber body 111 is at the same height position as the mask opening 111b, and the mask M can be carried out by the robot hand 90. Also, a used mask M can be carried into the chamber body 111 and placed at a predetermined position in the mask cassette 200. In this way, the used mask M and the newly used mask M can be exchanged. Further, in this embodiment, the mask cassettes 200 are configured to be stackable inside the chamber body 111. FIG. 3 shows a state in which two mask cassettes 200 are stacked and stored inside the chamber body 111, but the mask cassettes 200 may be configured to be stacked in three or more stages.

[0029] <<Mask Cassette>> Referring to FIG. 4, the detailed configuration of the mask cassette 200 will be described. FIG. 4(a) is a plan view of the mask cassette, FIG. 4(b) is a bottom view of the mask cassette, FIG. 4(c) is a front view of the mask cassette, and FIGS. 4(d1) and 4(d2) are side views of the mask cassette, where FIG. 4(d1) shows one of the two side surfaces and FIG. 4(d2) shows the other side surface.

[0030] The mask cassette 200 includes a top plate portion 210, a bottom plate portion 220, and a plurality of support columns 215 connecting the top plate portion 210 and the bottom plate portion 220. Further, a plurality of support portions 230 for supporting the mask M are provided on the inner surface side of the support columns 215. Thereby, a plurality of masks M can be stored in multiple stages.

[0031] On the top plate portion 210, a plurality of first supported portions 211 and positioning pins 212 (upper surface side pins) are provided. On the bottom plate portion 220, a plurality of through holes 221 into which the first supported portions 211 enter are provided so that the first supported portions 211 provided on the lower mask cassette 200 do not interfere when the mask cassettes 200 are stacked.

[0032] Also, on the bottom plate portion 220, when the mask cassettes 200 are stacked, the positioning pins 212 provided on the lower mask cassette 200 are inserted, so that the mask cassettes 200 A plurality of positioning holes 222 for aligning the mask cassettes 200 with each other in the X-axis direction and the Y-axis direction are also provided. A positioning pin 131 is also provided on the support base 130. When the mask cassette 200 is directly supported by the support base 130, the pin 131 is inserted into the positioning hole 222. Thereby, the mask cassette 200 is also aligned with the support base 130 in the X-axis direction and the Y-axis direction. The pins 212 and 131 preferably have a tapered shape. Thereby, even if the mask cassettes 200 are slightly displaced from each other or the mask cassette 200 and the support base 130 are slightly displaced in the X-axis direction and the Y-axis direction, the pins 212, 131 can be more reliably inserted into the positioning hole 222. Also, the above-mentioned displacement can be corrected. Further, by configuring the inner peripheral surface of the positioning hole 222 to be tapered toward the depth of the hole, the above-mentioned displacement correction can be performed more reliably.

[0033] On the side surface side of the mask cassette 200, a plurality of second supported portions 223 and pressed surfaces 224 are provided, and a pair of guide surfaces 225 are provided. The second supported portion 223 is provided at the lower end of the support column portion 215, and the pressed surface 224 and the pair of guide surfaces 225 are provided inside the second supported portion 223.

[0034] The plurality of first supported portions 211 provided on the top plate portion 210 and the plurality of second supported portions 223 provided on the side surface side of the mask cassette 200 are used when moving the mask cassette 200 up and down by the mask cassette moving mechanism. Further, the pressed surface 224 and the pair of guide surfaces 225 are used to align the mask cassette 200 in the X-axis direction and the Y-axis direction during the process of lowering the mask cassette 200 by the mask cassette moving mechanism. Hereinafter, the mechanism and operation for taking the mask cassette 200 in and out of the chamber main body 111 will be described.

[0035] <<Operation of Mask Stock>> With reference to FIGS. 5 to 19, the operation of the mask stock chamber 100 will be described. In these figures, the mechanism for taking the mask cassette 200 in and out of the chamber main body 111 is shown as the center, and various configurations such as the chamber main body 111 are shown with appropriate omissions.

[0036] As described above, the mask stock chamber 100 is provided with a mask cassette moving mechanism. The mask cassette moving mechanism includes a first moving mechanism 140 and a second moving mechanism 150 provided vertically below the first moving mechanism 140.

[0037] The first moving mechanism 140 includes a first support portion 141 that supports the mask cassette 200, and a fixing unit 142 provided on the first support portion 141 and configured to be able to fix and release the fixation of the mask cassette 200. In the illustrated example, the first support portion 141 and the fixing unit 142 are provided at four locations, but the number of these is not limited, and an appropriate number can be provided according to usage conditions and the like. For the fixing unit 142, a mechanism that can mechanically fix and release the fixation of the mask cassette 200 can be adopted, or a mechanism that can fix and release the fixation of the mask cassette 200 by using magnetic force or the like can also be adopted. The first support portion 141 and the fixing unit 142 are configured to be reciprocally movable in the Z-axis direction (see FIG. 5(b)) and also configured to be reciprocally movable in the X-axis direction (see FIG. 5(a)). Regarding the mechanism for reciprocally moving the first support portion 141 and the fixing unit 142 in the Z-axis direction, an independent mechanism may be provided from the lid moving mechanism 125, or by fixing the first support portion 141 to the lid 120, the first support portion 141 and the fixing unit 142 may be configured to move together with the lid 120 by the lid moving mechanism 125. In the illustrated example, the latter configuration is adopted. That is, the lid moving mechanism 125 also has the function of the Z-axis direction moving mechanism in the first moving mechanism 140. Also, regarding the mechanism for reciprocally moving the first support portion 141 and the fixing unit 14 2 in the X-axis direction, as described above, a ball screw mechanism or a rack and pinion mechanism may be adopted, or since the reciprocating movement distance is short, it is also suitable to adopt an electric actuator such as a solenoid. As described above, the first moving mechanism 140 includes a mechanism for moving the first support portion 141 and the fixing unit 142 in the Z-axis direction and a mechanism for moving them in the X-axis direction.

[0038] The second moving mechanism 150 includes a second support portion 151 that supports the mask cassette 200 and a pressing member 152. The pressing members 152 are provided in a pair beside the second support portion 151. In the illustrated example, the second support portion 151 and the pair of pressing members 152 are provided at four locations, but the number thereof is not limited, and an appropriate number can be provided according to usage conditions and the like. The second support portion 151 and the pressing member 152 are configured to be reciprocally movable in the Z-axis direction (see Fig. 5(b)) and also configured to be reciprocally movable in the X-axis direction (see Fig. 5(a)). The second support portion 151 and the pressing member 152 are configured to be reciprocally movable in the Z-axis direction by a Z-axis direction moving mechanism 153. The Z-axis direction moving mechanism 153 includes a support member 153a having a nut, a screw shaft 153b, a drive source 153c, and a pair of linear guides 153d. In the illustrated example, the Z-axis direction moving mechanisms 153 are arranged on both sides in the X-axis direction, and one Z-axis direction moving mechanism 153 is configured to reciprocally move two sets of the second support portion 151 and the pressing member 152 together in the Z-axis direction. Regarding the mechanism for reciprocally moving the second support portion 151 and the pressing member 152 in the X-axis direction, as described above, a ball screw mechanism or a rack and pinion mechanism may be employed, or it is also preferable to employ an electric actuator such as a solenoid because the reciprocating distance is short. As described above, the second moving mechanism 150 includes a mechanism (Z-axis direction moving mechanism 153) for moving the second support portion 151 and the pressing member 152 in the Z-axis direction and a mechanism for moving them in the X-axis direction.

[0039] Regarding the operation of the mask stocker chamber 100 configured as described above until the mask cassette 200 is carried into the chamber main body 111 and supported by the support base 130, the operation will be described in the order of operation.

[0040] First, the lid 120 moves to the second position by the lid moving mechanism 125 (see FIG. 6). At this time, the first support portion 141 and the fixing unit 142 are located at the standby position (the outer position in the X-axis direction). Also, the second support portion 151 and the pressing member 152 are located below in the Z-axis direction and at the standby position (the outer position in the X-axis direction). Next, the second support portion 151 moves inward in the X-axis direction by the second moving mechanism 150 (see FIG. 7).

[0041] In this state, the mask cassette 200 is moved in the horizontal direction (Y-axis direction) by the transfer machine 95 to a position between the opening 111a of the chamber main body 111 and the lid 120 (see FIG. 8). Then, the second support portion 151 moves upward in the vertical direction by the second moving mechanism 150 to a position where it supports the mask cassette 200 (see FIG. 9). After that, the transfer machine 95 moves to a position outside the chamber main body 111 (see FIG. 10). As a result, the second support portion 151 supports the second supported portion 223 and the mask cassette 200 is in a supported state. In this embodiment, the lower end of the support column portion 215 is used as the second supported portion 223, and the second support portion 151 is configured to support this second supported portion 223. However, a configuration in which the bottom surface of the bottom plate portion 220 of the mask cassette 200 is used as the second supported portion and the second support portion 151 supports the bottom surface of the bottom plate portion 220 can also be adopted. In this case, there is an advantage that the design freedom of the support column portion 215 increases.

[0042] Thereafter, the second support portion 151 descends slightly to a predetermined position for position adjustment in the Z-axis direction by the second moving mechanism 150, and the first support portion 141 and the fixing unit 142 move inward in the X-axis direction by the first moving mechanism 140 (see FIG. 11). Then, the second support portion 151 moves downward in the vertical direction by the second moving mechanism 150 (see FIG. 12) , and the mask cassette 200 is supported by the first support portion 141. In this state, the mask cassette 200 is fixed by the fixing unit 142. Thereafter, the second support portion 151 moves to the standby position outside in the X-axis direction by the second moving mechanism 150 (see FIG. 13).

[0043] Next, the first support portion 141 and the fixed unit 142 are moved by the first moving mechanism 140 to a predetermined position vertically downward (FIG. 14). Then, by releasing the fixing of the mask cassette 200 by the fixed unit 142, the mask cassette 200 is in a state where movement in the horizontal direction (X-axis direction and Y-axis direction) is allowed. In this state, the pressing member 152 is moved inward in the X-axis direction by the second moving mechanism 150 (see FIG. 15), and the horizontal movement of the mask cassette 200 is adjusted.

[0044] The horizontal movement adjustment of the mask cassette 200 will be described in more detail with reference to FIG. 16. As described above, a plurality of pressed surfaces 224 are provided on the side surface side of the mask cassette 200, and a pair of guide surfaces 225 are provided. More specifically, as shown in FIG. 16, portions to be pressed by the pressing member 152 are provided at two locations (a total of four locations) on each of the both side surfaces of the mask cassette 200. Three of the four locations are constituted by the pressed surfaces 224. The pressed surface 224 is constituted by a plane perpendicular to the X-axis direction. And the remaining one location is constituted by a pair of guide surfaces 225. The pair of guide surfaces 225 are constituted by a pair of inclined surfaces whose distance between each other gradually narrows as it goes in the pressing direction by the pressing member 152.

[0045] With the above configuration, when the four pressing members 152 move inward in the X-axis direction and press the three pressed surfaces 224 and the pair of guide surfaces 225 respectively, the mask cassette 200 is clamped from both sides in the X-axis direction, so the position adjustment in the X-axis direction is performed. Further, when the pair of guide surfaces 225 are pressed by the pressing members 152, the mask cassette 200 is also adjusted in position in the Y-axis direction. Since the pair of guide surfaces 225 are provided only at one location, the mask cassette 200 is preferably positioned with respect to the Y-axis direction. Note that the pressing member 152 according to this embodiment is configured by a columnar member and is configured to be rotatable about a central axis parallel to the Z-axis direction. Thereby, during the process of adjusting the position of the mask cassette 200, sliding between the pressing member 152 and the pressed surface 224 and between the pressing member 152 and the guide surface 225 can be suppressed, and the generation of wear powder can be suppressed.

[0046] As described above, in the mask stocker chamber 100, with the mask cassette 200 supported by the first support portion 141 as a support member, in the X-axis direction (first direction) parallel to the support surface by the first support portion 141, a plurality of pressing members 152 are provided for positioning the mask cassette 200 in the X-axis direction by pushing the mask cassette 200 from both side surfaces. And in the mask cassette 200, at one of a plurality of locations pressed by the plurality of pressing members 152, a guide surface 225 is provided which moves the mask cassette 200 itself in the Y-axis direction (second direction) parallel to the above support surface and perpendicular to the X-axis direction by being pressed by the pressing member 152.

[0047] As described above, after the horizontal position adjustment of the mask cassette 200 is completed, the mask cassette 200 is fixed again by the fixing unit 142. Then, by the second moving mechanism 150, the pressing member 152 moves to the standby position outside in the X-axis direction (see FIG. 17). Thereafter, by the first moving mechanism 140, the first support portion 141 and the fixing unit 142 move downward in the vertical direction, and the tip of the positioning pin 131 provided on the support base 130 is inserted into the positioning hole 222. In this state, the fixing of the mask cassette 200 by the fixing unit 142 is released, and further, by the first moving mechanism 140, the first support portion 141 moves downward in the vertical direction. As a result, the positioning pin 131 is completely inserted into the positioning hole 222, and the mask cassette 200 is supported in a state of being positioned on the support base 130 (see FIG. 18). As described above, the positioning pin 131 has a tapered shape, its tip is inserted into the positioning hole 222, and is completely inserted into the positioning hole 222 after the fixing of the mask cassette 200 by the fixing unit 142 is released. Therefore, while avoiding the twisting between the first moving mechanism 140 and the mask cassette 200, the positioning between the mask cassette 200 and the support base 130 is possible. Thereafter, by the first moving mechanism 140, the first support portion 141 and the fixing unit 142 move to the standby position outside in the X-axis direction (see FIG. 19). As described above, the positioning pin 131 has a tapered shape, its tip is inserted into the positioning hole 222, and is completely inserted into the positioning hole 222 after the fixing of the mask cassette 200 by the fixing unit 142 is released. Therefore, while avoiding the twisting between the first moving mechanism 140 and the mask cassette 200, the positioning between the mask cassette 200 and the support base 130 is possible. Thereafter, by the first moving mechanism 140, the first support portion 141 and the fixing unit 142 move to the standby position outside in the X-axis direction (see FIG. 19).

[0048] Through the above steps, the operation of supporting the mask cassette 200 on the support base 130 is completed. Thereafter, the lid 120 is moved downward in the vertical direction to the first position by the lid moving mechanism 125, and the opening 111a is closed. In the above description, the operation of supporting the mask cassette 200 on the support base 130 has been described. However, the same operation is also performed when another mask cassette 200 is stacked on the mask cassette 200. Also in this case, the operations up to those shown in FIG. 17 above are the same. Thereafter, the first support portion 141 and the fixing unit 142 are moved downward in the vertical direction by the first moving mechanism 140, and the tip of the positioning pin 212 provided on the lower mask cassette 200 is inserted into the positioning hole 222 of the upper mask cassette 200. The operation mechanism from when the tip of the pin 212 is inserted into the positioning hole 222 until it is completely inserted is the same as the operation mechanism from when the tip of the positioning pin 131 is inserted into the positioning hole 222 until it is completely inserted. The subsequent operations are also the same.

[0049] When the mask cassette 200 is carried out of the chamber main body 111, it may be carried out in a procedure approximately reverse to the carrying-in procedure described so far, and thus the description thereof is omitted.

[0050] <Method for manufacturing an electronic device> Next, an example of a method for manufacturing an electronic device using the film forming apparatus 1 according to the present embodiment will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device will be exemplified as an example of the electronic device. First, the organic EL display device to be manufactured will be described. FIG. 20(a) is an overall view of the organic EL display device 560, and FIG. 20(b) shows a cross-sectional structure of one pixel.

[0051] As shown in Fig. 20(a), in the display area 561 of the organic EL display device 560, a plurality of pixels 562 each including a plurality of light-emitting elements are arranged in a matrix. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel refers to the smallest unit capable of displaying a desired color in the display area 561. In the case of the organic EL display device according to this embodiment, the pixel 562 is composed of a combination of a first light-emitting element 562R, a second light-emitting element 562G, and a third light-emitting element 562B that exhibit different emissions. The pixel 562 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color or more.

[0052] Fig. 20(b) is a partial cross-sectional schematic view taken along line A-B in Fig. 20(a). The pixel 562 has an organic EL element including a first electrode (anode) 564, a hole transport layer 565, any one of light-emitting layers 566R, 566G, 566B, an electron transport layer 567, and a second electrode (cathode) 568 on a substrate 563. Among these, the hole transport layer 565, the light-emitting layers 566R, 566G, 566B, and the electron transport layer 567 correspond to the organic layers. Also, in this embodiment, the light-emitting layer 566R is an organic EL layer that emits red light, the light-emitting layer 566G is an organic EL layer that emits green light, and the light-emitting layer 566B is an organic EL layer that emits blue light. The light-emitting layers 566R, 566G, 566B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. Also, the first electrode 564 is formed separately for each light-emitting element. The hole transport layer 565, the electron transport layer 567, and the second electrode 568 may be formed in common with a plurality of light-emitting elements 562R, 562G, 562B, or may be formed for each light-emitting element. In order to prevent the first electrode 564 and the second electrode 568 from being short-circuited by foreign matter, an insulating layer 569 is provided between the first electrodes 564. Further, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 570 for protecting the organic EL element from moisture and oxygen is provided.

[0053] In FIG. 20(b), the hole transport layer 565 and the electron transport layer 567 are shown as a single layer, but depending on the structure of the organic EL display element, they may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer. Further, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 564 to the hole transport layer 565 can be formed between the first electrode 564 and the hole transport layer 565. Similarly, an electron injection layer can also be formed between the second electrode 568 and the electron transport layer 567.

[0054] Next, an example of a method for manufacturing an organic EL display device will be specifically described. First, a substrate 563 on which a circuit (not shown) for driving the organic EL display device and a first electrode 564 are formed is prepared.

[0055] An acrylic resin is spin-coated on the substrate 563 on which the first electrode 564 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the first electrode 564 is formed to form an insulating layer 569. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0056] The substrate 563 on which the insulating layer 569 is patterned is carried into a first film-forming apparatus, the substrate is held by a substrate support unit, and the hole transport layer 565 is formed as a common layer on the first electrode 564 in the display region. The hole transport layer 565 is formed by vacuum deposition. Actually, since the hole transport layer 565 is formed in a size larger than the display region 561, a high-definition mask is not required.

[0057] Next, the substrate 563 on which the hole transport layer 565 is formed is carried into a second film-forming apparatus and held by a substrate support unit. Alignment (first alignment and second alignment) between the substrate and the mask is performed, the substrate is placed on the mask, and a light-emitting layer 566R that emits red light is formed in the portion where the element that emits red light of the substrate 563 is arranged.

[0058] Similar to the formation of the light-emitting layer 566R, a light-emitting layer 566G that emits green light is formed by a third film-forming apparatus, and further, a light-emitting layer 566B that emits blue light is formed by a fourth film-forming apparatus. After the formation of the light-emitting layers 566R, 566G, and 566B is completed, an electron transport layer 567 is formed over the entire display region 561 by a fifth film-forming apparatus. The electron transport layer 567 is formed as a layer common to the three-color light-emitting layers 566R, 566G, and 566B.

[0059] The substrate on which up to the electron transport layer 567 is formed is transferred to a sputtering apparatus, and a second electrode 568 is formed. Then, it is transferred to a plasma CVD apparatus to form a protective layer 570, and the organic EL display device 560 is completed.

[0060] From the time when the substrate 563 on which the insulating layer 569 is patterned is loaded into the film-forming apparatus until the formation of the protective layer 570 is completed, if the substrate is exposed to an atmosphere containing moisture or oxygen, the light-emitting layer made of an organic EL material may be deteriorated by moisture or oxygen. Therefore, in this example, the loading and unloading of the substrate between the film-forming apparatuses are performed under a vacuum atmosphere or an inert gas atmosphere.

[0061] <Advantages of the mask stocker chamber and film-forming apparatus according to this embodiment> According to this embodiment, with the mask cassette 200 supported by the first support portion 141 as a support member, in the direction parallel to the support surface by the first support portion 141, by a plurality of pressing members 152, In the X-axis direction, the mask cassette 200 is pushed in from both side surfaces to position the mask cassette 200 in the X-axis direction. Further, by the guide surface 225 provided on the mask cassette 200 being pressed by the pressing member 152, the mask cassette 200 moves in the Y-axis direction to position the mask cassette 200 in the Y-axis direction as well. Thereby, the horizontal position adjustment of the mask cassette 200 is performed more reliably. After the horizontal position adjustment of the mask cassette 200 is performed, the mask cassette 200 descends and is placed on the support base 130, or is stacked on another mask cassette 200. Therefore, it becomes possible to more reliably insert the pin into the positioning hole in the positioning structure composed of the pin and the positioning hole.

[0062] (Others) In the above-described embodiment, as a positioning structure for positioning the mask cassette 200 and the support base 130, a case is shown in which it is constituted by a positioning pin 131 provided on the support base 130 and a positioning hole 222 provided in the mask cassette 200. However, it is also possible to adopt a configuration in which a tapered positioning pin is provided on the lower surface of the mask cassette 200 and a positioning hole is provided in the support base 130. Thereby, a positioning structure for positioning the mask cassette 200 and the support base 130 can be configured. Further, in this case, by providing an upper surface side positioning hole on the upper surface of the mask cassette 200, a plurality of mask cassettes 200 can be stacked in a positioned state. Note that even when such a configuration is adopted, the operation mechanism from when the tip of the pin is inserted into the positioning hole until it is completely inserted is the same as the operation mechanism from when the tip of the positioning pin 131 is inserted into the positioning hole 222 until it is completely inserted.

Description of Reference Numerals

[0063] 1: Film forming apparatus; 10: Film forming chamber; 11: Chamber; 12: Support mechanism; 13: Film forming source; 30: Transfer chamber; 40: Transfer robot; 50: Pass chamber; 60: Buffer chamber; 70: Swivel chamber; 80: Control unit; 90: Robot hand; 95: Transfer device; 100: Mask stocker chamber; 111: Chamber body; 111a: Opening; 111b: Mask opening; 112: Cover for mask opening; 120: Cover body; 121: Rib; 125: Cover body moving mechanism; 125a: Screw shaft; 125b: Drive source; 125c: Nut; 130: Support base; 131: Pin; 135: Screw shaft; 140: First moving mechanism; 141: First support portion; 142: Fixed unit; 150: Second moving mechanism 151: Second support part 152: Pressing member 153: Z-axis direction movement mechanism 153a: Support member 153b: Screw shaft 153c: Driving source 153d: Linear guide 200: Mask cassette 210: Top plate part 211: First supported part 212: Pin 215: Support column part 220: Bottom plate part 221: Through hole 222: Positioning hole 223: Second supported part 224: Pressed surface 225: Guide surface 230: Support part M: Mask S: Substrate

Claims

1. A mask cassette that can store multiple masks in multiple layers, a chamber body capable of accommodating the mask cassette; a support member disposed in the chamber body and supporting the mask cassette; A mask storage device comprising: a plurality of pressing members configured to press the mask cassette from both side surfaces in a first direction parallel to a support surface of the support member while the mask cassette is supported by the support member, thereby positioning the mask cassette in the first direction; The mask cassette is provided with a guide surface at one of multiple locations pressed by the multiple pressing members, which guide surface moves the mask cassette itself in a second direction parallel to the support surface and perpendicular to the first direction when pressed by the pressing member.

2. 2. The mask storage device according to claim 1, wherein the guide surface is constituted by a pair of inclined surfaces whose distance from each other gradually decreases in the direction of the pressing force of the pressing member.

3. a mask opening for inserting and removing the mask into and from the inside of the chamber body is provided on a side wall surface of the chamber body, and a support table for supporting the mask cassette is provided inside the chamber body; 2. The mask storage device according to claim 1, further comprising a lifting mechanism for lifting the support table in order to change a positional relationship in a height direction between the mask cassette and the mask opening.

4. 4. The mask storage device according to claim 3, further comprising a positioning structure for positioning the mask cassette and the support table.

5. 5. The mask storage device according to claim 4, wherein the positioning structure is composed of a tapered pin provided on one of the mask cassette and the support base, and a positioning hole provided on the other of the mask cassette and the support base, into which the pin is inserted.

6. The mask cassette is configured so that a plurality of the mask cassettes can be stacked and stored inside the chamber body, The mask storage device according to claim 5, characterized in that the pin or the positioning hole is provided on the underside of the mask cassette, and the upper surface of the mask cassette is provided with an upper surface positioning hole into which the pin is inserted when the mask cassette is stacked, or a tapered upper surface pin which is inserted into the positioning hole.

7. A mask storage device according to any one of claims 1 to 6, a film formation source that forms a film on a substrate in a state where the mask stored in the mask storage device is moved to a position where the mask is superimposed on the substrate; A film forming apparatus comprising:

8. A mask cassette configured to be supported by a support member disposed in a chamber body of a mask storage device and capable of storing a plurality of masks in multiple stages, comprising: In a state where the support member supports the support member, the support member is configured to be pressed from both side surfaces by a plurality of pressing members for positioning the support member in a first direction parallel to a support surface of the support member, The mask cover is pressed by the pressing member at one of the plurality of positions pressed by the pressing members, so that the mask cover is moved in a second direction parallel to the support surface and perpendicular to the first direction. A mask cassette comprising a guide surface for moving the set itself.

9. 9. The mask cassette according to claim 8, wherein the guide surface is constituted by a pair of inclined surfaces whose distance from each other gradually narrows in the direction of the pressing by the pressing member.

Images