Electronic component packaging system

Abstract

To provide an electronic component packaging system that can maintain and ensure the final mounting quality of electronic components after reflow processing at a specified level or higher.SOLUTION: An electronic component packaging system includes a printer 2, mounting machines 3A and 3B, a reflow machine 4, an inspection machine 5, and a control computer 7, and the control computer 7 stores and modifies solder printing parameters used by the printer 2 and electronic component mounting parameters used by the mounting machines 3A and 3B, and also analyzes the mounting quality of the electronic components on the basis of the inspection data from the inspection machine 5. Furthermore, when a deteriorating trend in the mounting quality is detected, the control computer 7 creates information regarding the modification of the printing parameters and the mounting parameters on the basis of the cause of the deterioration in the mounting quality.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electronic component mounting system that manufactures a mounted board by mounting electronic components on a board by solder bonding. Note that in this specification, "electronic components" are also simply referred to as "components". [Background technology]

[0002] An electronic component mounting system, which manufactures a mounted board by mounting electronic components on a substrate by solder bonding, is composed of a number of electronic component mounting devices, such as a solder printing device, an electronic component mounting device, and a reflow device, which are linked together, and the specific manufacturing conditions of the mounted board are controlled by a control computer that controls the entire electronic component mounting system.

[0003] As a conventional technique related to such electronic component mounting systems, Patent Document 1 discloses a technique for correcting (feeding back) mounting parameters of electronic components by an electronic component mounting device based on inspection data from an inspection device that inspects the mounting state of electronic components on a board after reflow processing. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-43159 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the conventional technology of correcting (feedbacking) the mounting parameters of electronic components by an electronic component mounting device, as described in Patent Document 1 above, was not sufficient in terms of maintaining and ensuring the final mounting quality of electronic components after reflow processing at or above a specified level.

[0006] An object of the present invention is to provide an electronic component mounting system capable of maintaining and ensuring the final mounting quality of electronic components after reflow processing at a predetermined level or higher. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided the following electronic component mounting system. An electronic component mounting system for manufacturing a mounted substrate by mounting electronic components on a substrate by solder bonding, comprising: A solder printing device that prints solder on a substrate to form a plurality of solder parts; an electronic component mounting device that mounts electronic components on a board on which solder parts are formed; a reflow device that heats a board on which electronic components are mounted to perform a reflow process; a mounting board inspection device that inspects the mounting state of electronic components on a board after reflow processing; a control computer that stores and modifies solder printing parameters by the solder printing device and electronic component mounting parameters by the electronic component mounting device, and analyzes the mounting quality of electronic components based on inspection data from the mounted board inspection device, The control computer creates information regarding correction of the printing parameters and the placement parameters based on a cause of the deterioration of the mounting quality when a deterioration trend of the mounting quality is detected. Effect of the Invention

[0008] According to the present invention, in an electronic component mounting system that manufactures a mounted board by mounting electronic components on a board by solder bonding, the final mounting quality of the electronic components after reflow processing can be maintained at a specified level or above. [Brief description of the drawings]

[0009] [Figure 1] 1 is a block diagram showing a configuration of an electronic component mounting system according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] A block diagram of an electronic component mounting system according to one embodiment of the present invention is shown in Fig. 1. The electronic component mounting system 1 shown in Fig. 1 is configured such that an electronic component mounting line is connected by a communication network 6, and the system is entirely controlled by a control computer 7. The electronic component mounting line is made up of devices including a printer 2 as a solder printing device, mounters 3A and 3B as electronic component mounting devices, a reflow machine 4 as a reflow device, and an inspection machine 5 as a mounted board inspection device.

[0011] The printer 2 screen-prints a solder paste onto electrodes for joining electronic components formed on the board, thereby forming multiple solder sections on the electrodes. The mounters 3A and 3B mount electronic components at the electronic component mounting positions on the board where the solder sections have been formed. The reflow machine 4 heats the board on which the electronic components have been mounted, to perform a reflow process. This reflow process melts the solder particles contained in the solder sections, and the electronic components and the board are solder-joined. Note that the specific configurations of the printer 2, mounters 3A and 3B, and reflow machine 4 are well known, so a description thereof will be omitted.

[0012] The inspection machine 5 inspects the mounting state of the electronic components on the board after the reflow process. Specifically, the inspection includes the detection of the mounting position, mounting height, and mounting direction of the electronic components, as well as the printing misalignment, printing area, and printing volume of the solder parts. The configuration of the inspection machine that performs such an inspection is also well known, and can be configured by appropriately combining inspection means such as AOI (Automated Optical Inspection) and CT (Computed Tomography).

[0013] Next, a description will be given of specific functions of the control computer 7. The control computer 7 saves and modifies printing parameters for solder printing by the printer 2 and mounting parameters for electronic components by the mounting machines 3A and 3B, and analyzes the mounting quality of the electronic components based on inspection data from the inspection machine 5. In this embodiment, the printing parameters and mounting parameters are defined in a production program that describes the manufacturing conditions for the mounted board, and the printing parameters and mounting parameters are stored as the production program in the control computer 7. In this embodiment, the control computer 7 analyzes, as mounting quality, at least one of the mounting position, mounting height and mounting direction of the electronic components, and the printing misalignment of the solder joints, and the production process indexes Cp and Cpk related to the printing area and printing volume. Here, the mounting position of the electronic component can be expressed by the XY coordinate position (X position, Y position) of the mounted electronic component, the mounting height can be expressed by the height position (Z position) of the mounted electronic component, and the mounting direction can be expressed by the orientation (angle θ) of the mounted electronic component, all of which are detected by the inspection machine 5. In addition, the printing misalignment of the solder part refers to the printing position misalignment of the solder part with respect to the electrode, the printing area of ​​the solder part refers to the planar area of ​​the solder part, and the printing volume of the solder part refers to the volume of the solder part, and these are also detected by the inspection machine 5. The control computer 7 has a function of analyzing each production process index Cp or Cpk based on the inspection data from the inspection machine 5, which includes the mounting position, mounting height, and mounting direction of the electronic components, as well as the printing misalignment, printing area, and printing volume of the solder joints.

[0014] Furthermore, when a downward trend is observed in the mounting quality, the control computer 7 creates information on the correction of the printing parameters and the placement parameters based on the cause of the decline in the mounting quality. In this embodiment, the control computer 7 analyzes at least one of the production process indexes Cp and Cpk related to the mounting position, mounting height, and mounting direction of the electronic components, as well as the printing misalignment, printing area, and printing volume of the solder parts, as the mounting quality. Therefore, based on the time-series transition of each production process index Cp or Cpk, it is possible to analyze which mounting quality shows a downward trend, and to identify the cause of the decline in the mounting quality based on the mounting quality that shows a downward trend. For example, when a downward trend is observed in the mounting quality related to the mounting position of the electronic components, it is possible to identify that the cause of the decline in the mounting quality is the factor related to the mounting position of the electronic components. In this case, the control computer 7 creates information on the correction of the printing parameters and the placement parameters related to the mounting position of the electronic components.

[0015] In this embodiment, the method by which the control computer 7 creates information on the correction of the printing parameters and the mounting parameters is not particularly limited. For example, for the mounting parameters related to the mounting positions of the electronic components, information on the correction of the mounting parameters can be created based on the total average value of the mounting position misalignment of the electronic components on the entire mounting board. Also, information on the correction of the mounting parameters can be created by focusing on the mounting position misalignment of the electronic components at the high-defective electronic component mounting positions. For example, information on the correction of the mounting parameters can be created based on a mounting position misalignment value obtained by adding a value obtained by multiplying the mounting position misalignment at the high-defective electronic component mounting positions by a predetermined coefficient to the total average value of the mounting position misalignment. In this case, the high-defective electronic component mounting positions are electronic component mounting positions with a high degree of defect in the mounting position misalignment. On the other hand, the electronic component mounting positions where the printing misalignment of the solder joints is highly defective can be set as the high-defective electronic component mounting positions. In this case, information regarding the correction of the printing parameters can be created based on the printing misalignment value obtained by adding the value obtained by multiplying the printing misalignment at the high-defective electronic component mounting positions by a predetermined coefficient to the total average printing misalignment.

[0016] As described above, according to this embodiment, the control computer 7 determines whether or not there is a tendency for the final mounting quality of electronic components after the reflow process to deteriorate based on the inspection data from the inspection machine 5, and if a tendency for the mounting quality to deteriorate is detected, creates information regarding the correction of printing parameters and placement parameters based on the cause of the deterioration in mounting quality, thereby making it possible to maintain and ensure that the final mounting quality of electronic components after the reflow process is at or above a specified level. [Explanation of symbols]

[0017] 1. Electronic component mounting system 2 Printing machine (solder printing device) 3A, 3B Mounting machine (electronic component mounting device) 4 Reflow equipment 5. Inspection machine (mounted board inspection device) 6. Communication Network 7 Control Computer

Claims

1. An electronic component mounting system for manufacturing a mounted substrate by mounting electronic components on a substrate by solder bonding, comprising: A solder printing device that prints solder on a substrate to form a plurality of solder parts; an electronic component mounting device that mounts electronic components on a board on which solder parts are formed; a reflow device that heats a board on which electronic components are mounted to perform a reflow process; a mounting board inspection device that inspects the mounting state of electronic components on a board after reflow processing; a control computer that stores and modifies solder printing parameters by the solder printing device and electronic component mounting parameters by the electronic component mounting device, and analyzes the mounting quality of electronic components based on inspection data from the mounted board inspection device, The control computer creates information regarding correction of the printing parameters and the placement parameters based on a cause of the deterioration of the mounting quality when a deterioration trend of the mounting quality is detected.

2. 2. The electronic component mounting system of claim 1, wherein the control computer analyzes, as the mounting quality, at least one of the mounting position, mounting height and mounting direction of the electronic component, and the production process index Cp or Cpk related to the printing misalignment, printing area and printing volume of the solder part.

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