Mold, resin molding device, and method for producing resin molded article

Abstract

To provide a mold, a resin molding device, and a method for producing a resin molded article, which hardly cause wrinkles in a release film during resin molding and prevent the release film from being caught in hardened resin.SOLUTION: A mold C is provided with a first mold LM in which an object to be molded Sa is disposed and a second mold UM that is disposed facing the first mold LM and holds a release film F on a facing surface 33 that faces the first mold LM. A cavity MC and excess resin storage cavities 11a and 12 are formed in at least one of the first mold LM and the second mold UM. The second mold UM has: a movable member 14a capable of advancing movement from a cavity inner surface 12b into the excess resin storage cavities 11a and 12 and withdrawing movement of withdrawing from the inside of the excess resin storage cavities 11a and 12; and a protruding part 15a formed on at least a part of the periphery of the movable member 14a and protruding from the cavity inner surface 12b toward the inside of the excess resin storage cavities 11a and 12.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product. [Background technology]

[0002] A substrate or the like on which a semiconductor chip is fixed is generally used as an electronic component by being resin-sealed. Conventionally, a resin molding device equipped with a molding die for resin-sealing a substrate or the like has been known (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a transfer molding device (molding device in Patent Document 1) configured to fill a cavity (product part in Patent Document 1) and a resin reservoir with molten resin by an extrusion plunger, and then to increase the volume of the resin reservoir by lowering an increase plunger. This transfer molding device is configured to move air bubbles in the cavity to the resin reservoir together with the resin when the increase plunger is lowered to cause the resin to flow from the cavity to the resin reservoir. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-009184 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the transfer molding device disclosed in Patent Document 1, no release film is placed between the mold and the resin, but in resin molding devices including transfer molding devices, a release film is generally used to prevent the resin from adhering to the mold. In the case where a release film is placed in the resin reservoir disclosed in Patent Document 1, if the volume of the resin reservoir changes due to the pressure of the resin that flows in or the rise of the booster plunger, the release film placed in that area may slacken and wrinkle. If wrinkles are formed in the release film, the resin will get into the wrinkles, and if the resin hardens as it is, the release film will be bitten by the hardened resin, and there is a risk that the resin (unnecessary resin) that has bitten the release film cannot be properly removed.

[0006] Therefore, there is a demand for a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product that are less likely to cause wrinkles in a release film during resin molding and that do not cause the release film to become caught in the hardened resin. [Means for solving the problem]

[0007] One embodiment of a molding mold according to the present invention comprises a first mold in which an object to be molded is placed, and a second mold arranged opposite the first mold and holding a release film on an opposing surface facing the first mold, wherein at least one of the first mold and the second mold is formed with a cavity for accommodating the object to be molded and into which molten resin material is supplied from a pot, and a surplus resin storage cavity in which surplus of the resin material that flows out of the cavity after being supplied to the cavity is stored, and the second mold has a movable member that is capable of advancing from an inner surface of the surplus resin storage cavity toward the surplus resin storage cavity and retracting from within the surplus resin storage cavity, and a protrusion that is formed on at least a portion of the inner surface of the cavity around the movable member and protrudes from the inner surface of the cavity toward the surplus resin storage cavity.

[0008] One embodiment of the resin molding apparatus of the present invention comprises the molding mold described above, a mold clamping mechanism for clamping and opening the molding mold, an ejection mechanism for ejecting to the outside of the molding mold the resin molded product, which is the molding object after resin molding and which are separated from each other by opening the molding mold after resin molding, and unnecessary resin parts of the resin material, and a control unit for controlling the operation of the apparatus.

[0009] One embodiment of the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus described above, and includes a supplying step of supplying the molding object and the resin material to the molding mold, a mold clamping step of clamping the molding mold using the mold clamping mechanism, and a molding step of resin molding the molding object by supplying the molten resin material from the pot to the cavity, and causing the movable member to move backward toward the inner surface of the cavity due to the pressure of the surplus resin material stored in the surplus resin storage cavity. Effect of the Invention

[0010] According to the embodiments of the present invention, it is possible to provide a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product, in which wrinkles are less likely to occur in a release film during resin molding and the release film is not caught in the hardened resin. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a schematic plan view showing a resin molding apparatus. [Diagram 2] FIG. [Diagram 3] 4A to 4C are cross-sectional views showing a molding process. [Figure 4] 4A to 4C are cross-sectional views showing a molding process. [Diagram 5] 4A to 4C are cross-sectional views showing a molding process. [Figure 6] 4A to 4C are cross-sectional views showing a molding process. [Figure 7] FIG. 4 is a flow diagram showing a mold opening operation in a molding process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, embodiments of the molding die, the resin molding device, and the method for manufacturing a resin molded product according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0013] Substrates (molding objects) with semiconductor chips and the like fixed thereto can be resin-sealed to be used as electronic components. Techniques for resin-sealing molding objects include the transfer method. One transfer method involves placing the molding object on the lower die of a molding die, placing a release film on the upper die of the molding die, supplying a resin tablet of solidified powdered resin to the pot of the molding die, heating and melting it, and supplying the molten resin into the cavity to resin-mold the molding object.

[0014] The resin tablet is formed of a solid resin obtained by compressing powdered resin, and melts when heated to become a liquid molten resin. The resin tablet may be a thermoplastic resin or a thermosetting resin. When heated, the viscosity of the thermosetting resin decreases, and when heated further, the thermosetting resin polymerizes and hardens to become a hardened resin. As described below, when a pre-molded substrate on which a semiconductor chip is fixed is resin-molded and sealed, it is desirable to use a thermosetting resin.

[0015] [Configuration of Resin Molding Device] Hereinafter, a transfer type resin molding apparatus 30 will be described as an example. FIG. 1 shows a schematic plan view of the resin molding apparatus 30 in this embodiment. The resin molding apparatus 30 includes a storage module 2, a molding module 3, a supply module 4, a control unit 6, a loader 41, and an unloader 42 (an example of a carrying-out mechanism). The molding module 3 is a part that resin-seals an object to be molded, and has a molding die C that holds a pre-molded substrate Sa (an example of an object to be molded). The molding die C has an upper die UM (an example of a second die) and a lower die LM (an example of a first die). The resin molding apparatus 30 in this embodiment is an apparatus that resin-moldes a pre-molded substrate Sa to which a semiconductor chip 48 (see FIG. 2) or the like is fixed.

[0016] The supply module 4 is for supplying pre-molded substrates Sa and resin tablets T (an example of a resin material) to the molding module 3, and includes a substrate supply mechanism 43 and a resin supply mechanism 45. The substrate supply mechanism 43 stocks pre-molded substrates Sa, and arranges the pre-molded substrates Sa in a state suitable for transportation. A plurality of semiconductor chips 48 are fixed to the pre-molded substrate Sa, aligned in the vertical and / or horizontal directions. The resin supply mechanism 45 stocks resin tablets T, and arranges the resin tablets T in a state suitable for transportation. The pre-molded substrate Sa may have one semiconductor chip 48 fixed thereto.

[0017] The loader 41 is on standby in the supply module 4. The loader 41 receives the pre-molded substrate Sa from the substrate supply mechanism 43 in the supply module 4, and also receives the resin tablet T from the resin supply mechanism 45, and moves from the supply module 4 to the molding module 3 on rails (not shown) arranged on the rear side (upper side in FIG. 1) from the supply module 4 to the molding module 3. Then, the loader 41 delivers the pre-molded substrate Sa and the resin tablet T to the lower mold LM of the molding module 3. Thereafter, the loader 41 moves again on the rails to the supply module 4.

[0018] The molding module 3 resin-seals the pre-molded substrate Sa using a molding die C to mold a molded substrate Sb (an example of a resin molded product). In this embodiment, one molding module 3 is provided, but two or more may be provided. When two or more molding modules are provided, each molding module 3 can be attached or detached independently.

[0019] The accommodating module 2 has a substrate accommodating section 46. The unloader 42 waits in the accommodating module 2, moves along rails (not shown) arranged on the rear side (upper side in FIG. 1) from the accommodating module 2 to the molding module 3, removes the molded substrate Sb from the molding module 3, and then moves along the rails again to the accommodating module 2 to accommodate the molded substrate Sb in the substrate accommodating section 46. In the molded substrate Sb, the semiconductor chip 48 and the like are sealed with a cured resin formed by solidifying molten resin Ta (an example of a resin material, see FIG. 2).

[0020] The control unit 6 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control unit 6 controls the operation of the resin molding apparatus 30 by executing a control program stored in the storage device with the processor. The operation of the resin molding apparatus 30 described below is performed based on an operation command from the control unit 6 unless otherwise specified. In the following description, the operation command from the control unit 6 will be omitted in principle, and the operation command from the control unit 6 will be described as necessary.

[0021] [Configuration of the mold] The molding die C of the molding module 3 will be described in detail below.

[0022] As shown in FIG. 2, the mold C has an upper mold UM in which an upper mold cavity MC (one example of a cavity) is formed, into which the molten resin Ta is supplied by heating the resin tablet T, a lower mold LM in which a pot block 71 is disposed opposite the upper mold UM and forms a resin flow path for supplying the molten resin Ta to the upper mold cavity MC, and a clamping mechanism 5 for clamping the upper mold UM and the lower mold LM. In the mold C of this embodiment, one pre-molded substrate Sa is placed on each side of the pot block 71 of the lower mold LM, and two pre-molded substrates Sa are resin-molded by one resin molding operation, but the present invention is not limited to this configuration, and one pre-molded substrate Sa may be resin-molded by one resin molding operation. The operation of the clamping mechanism 5 is controlled by the control unit 6. The pre-molded substrate Sa is transported between the upper mold UM and the lower mold LM by the loader 41, and then placed on the lower mold LM. In this embodiment, the pre-molded substrate Sa has a rectangular shape, and accordingly, the upper mold cavity MC has a rectangular planar shape as well.

[0023] The lower mold LM is held by a lower mold holder 32, and this lower mold holder 32 is fixed to a movable platen 34 that is raised and lowered by a mold clamping mechanism 5. The mold clamping mechanism 5 in this embodiment may be, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or a hydraulic cylinder and a rod.

[0024] The upper mold UM includes an upper mold base plate 31. A release film F is disposed on a surface 33 (an example of an opposing surface) of the upper mold UM, which is a mold surface facing the lower mold LM. The release film F is supplied by a release film supply mechanism (not shown). The release film F is adsorbed to the surface 33 of the upper mold UM by sucking air with a vacuum pump 37 from a second flow path 31b (an example of a suction hole) and a third flow path 31c (an example of a suction hole) which are suction holes formed in the upper mold UM. Furthermore, the release film F is adsorbed to the surface 33 of the upper mold UM by sucking air with a vacuum pump 37 from a fourth flow path (not shown) which is a suction hole formed on the outer periphery of the upper mold UM. Note that the path for sucking air from the second flow path 31b and the third flow path 31c by the vacuum pump 37 is separate from the path for sucking air from the fourth flow path by the vacuum pump 37. As the material for the release film F, a resin material having properties such as heat resistance, releasability, flexibility, and extensibility is used, and examples of such materials include PTFE (polytetrafluoroethylene), ETFE (ethylene / tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene / hexafluoropropylene copolymer), polypropylene, polystyrene, and polyvinylidene chloride.

[0025] Next, the molten resin supply mechanism 7 will be described. The molten resin supply mechanism 7 includes a pot block 71 in which a pot 71a for accommodating a resin tablet T is formed, and a transfer mechanism 72 having a plunger 72a provided in the pot 71a. The pot 71a is formed of, for example, a cylindrical member 73. The cylindrical member 73 is fitted into a through hole formed in the pot block 71.

[0026] A first protruding portion 71e is formed on the upper end of the pot block 71, protruding above the surface of the lower mold LM. This first protruding portion 71e protrudes so as to be able to press the pot-side end of the pre-molded substrate Sa when the pre-molded substrate Sa is placed on the lower mold LM. Furthermore, a cull portion 71b, a runner 71c, and a first lower gate 71d are formed on the upper surface of the pot block 71, which serve as a resin flow path for introducing the molten resin Ta supplied from the pot 71a into the upper mold cavity MC. When the upper mold UM and the lower mold LM are clamped, a part of the upper surface of the first protruding portion 71e contacts the upper mold UM, and the lower surface of the first protruding portion 71e sandwiches the pre-molded substrate Sa between the surface of the lower mold LM. At this time, the first lower gate 71d constituting the resin supply gate is located inside (closer to the semiconductor chip 48) than the outer edge of the pre-molded substrate Sa on the side closer to the pot block 71. Hereinafter, this method of clamping the pre-molded substrate Sa placed on the lower mold LM between the lower mold LM and the first protruding portion 71e of the pot block 71 to mold the resin, in which the molten resin Ta supplied from the pot 71a passes inside the outer edge of the pre-molded substrate Sa and is supplied to the upper mold cavity MC of the upper mold UM, may be referred to as the edge gate method.

[0027] The transfer mechanism 72 moves the plunger 72a while the upper mold UM and the lower mold LM are clamped, to supply the molten resin Ta from the pot 71a to the upper mold cavity MC. The transfer mechanism 72 includes a plunger 72a for pumping the molten resin Ta, a fixed block 72b to which the plunger 72a is fixed, and a plunger drive mechanism 72c for moving the plunger 72a via the fixed block 72b. The operation of the plunger drive mechanism 72c is controlled by the control unit 6.

[0028] The fixed block 72b has a generally rectangular parallelepiped shape, and a plurality of plungers 72a are fixed in a straight line to one surface (top surface) of the fixed block 72b. The arrangement of the plungers 72a corresponds to the arrangement of the pots 71a, which will be described later. The plungers 72a are fixed to the fixed block 72b by, for example, fixing screws. The fixed block 72b may be provided with a pressure equalizing mechanism using an elastic member or the like to equalize the pressure with which the plungers 72a inject the molten resin Ta.

[0029] The plunger drive mechanism 72c moves the fixed block 72b up and down relative to the lower die LM, thereby moving the plungers 72a up and down collectively with respect to the pots 71a by the same amount of movement. The plunger drive mechanism 72c in this embodiment is provided below the fixed block 72b. As the plunger drive mechanism 72c, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or a hydraulic cylinder and a rod can be used.

[0030] The upper mold UM has an upper mold cavity MC for accommodating the semiconductor chip 48 of the pre-molding substrate Sa and for receiving the molten resin Ta. The upper mold UM also has a concave space 35 and a first upper gate 35a for connecting the cull portion 71b, the runner 71c, and the first lower gate 71d of the pot block 71 to the upper mold cavity MC.

[0031] When the upper mold UM and the lower mold LM are clamped by the clamping mechanism 5, the resin flow path consisting of the cull portion 71b, the runner 71c, the first lower gate 71d, the recessed space 35, and the first upper gate 35a communicates the multiple pots 71a and the upper mold cavity MC. When the upper mold UM and the lower mold LM are clamped, the first lower gate 71d and the first upper gate 35a form a resin supply gate, and the molten resin Ta of the pot 71a is supplied to the upper mold cavity MC through this resin supply gate. As described above, the resin supply gate (the gap between the first lower gate 71d and the first upper gate 35a) is located inside the outer edge of the pre-molded substrate Sa on the side closer to the pot block 71. In this state, the plunger 72a is raised by the plunger drive mechanism 72c to supply the molten resin Ta to the upper mold cavity MC, and the semiconductor chip 48 of the pre-molded substrate Sa is sealed with resin. It is also possible to omit the runner 71c and directly connect the cull portion 71b and the upper die cavity MC via the first lower gate 71d and the first upper gate 35a.

[0032] Next, the surplus resin storage mechanism 10 will be described. The surplus resin storage mechanism 10 is composed of a surplus resin storage block 11, a second surplus resin storage cavity 12 (one example of a surplus resin storage cavity), a movable mechanism 14, and a protruding portion 15a. The surplus resin storage block 11 is disposed in the lower mold LM on the opposite side to the pot block 71 with respect to a location where the pre-molded substrate Sa is placed. The second surplus resin storage cavity 12 is formed in the upper mold UM on the opposite side to the concave space 35 with respect to the upper mold cavity MC. The lower mold LM has an air vent (not shown) formed on the opposite side to the pot block 71 with respect to the surplus resin storage block 11.

[0033] The surplus resin storage block 11 has a first surplus resin storage cavity 11a (one example of a surplus resin storage cavity), a second lower gate 11b, and a second protruding portion 11c. The first surplus resin storage cavity 11a is formed in a portion of the surplus resin storage block 11 that faces the upper mold UM. The second lower gate 11b is formed in an end portion of the second protruding portion 11c that is closest to the pre-molded substrate Sa of the surplus resin storage block 11.

[0034] A second upper gate 12a is formed in the second surplus resin storage cavity 12 closest to the recessed space 35. When the upper mold UM and the lower mold LM are clamped by the clamping mechanism 5, the surplus resin storage block 11 enters the second surplus resin storage cavity 12. As a result, the first surplus resin storage cavity 11a and the second surplus resin storage cavity 12 form an surplus resin storage space 13 (see FIG. 3). The second lower gate 11b and the second upper gate 12a form a resin discharge gate. The resin discharge gate is located inside (closer to the semiconductor chip 48) than the outer edge of the pre-molded substrate Sa, and is an edge gate type gate. At this time, when the upper mold UM and the lower mold LM are clamped, the lower surface of the second protruding portion 11c sandwiches the pre-molded substrate Sa between the surface of the lower mold LM.

[0035] The upper mold UM and the lower mold LM are clamped together, and the molten resin Ta in the pot 71a is supplied to the upper mold cavity MC. After the upper mold cavity MC is filled with the molten resin Ta, the molten resin Ta is further supplied to the upper mold cavity MC, and excess resin Tb (an example of a resin material) is discharged from the upper mold cavity MC to the excess resin storage space 13 through a resin discharge gate formed by the second lower gate 11b and the second upper gate 12a. The excess resin Tb refers to the molten resin Ta discharged from the upper mold cavity MC to the excess resin storage space 13 out of the molten resin Ta.

[0036] The movable mechanism 14 is composed of a movable member 14a, a driving unit 14b, and a compression spring 14c. The movable member 14a is composed of a cylindrical portion and a flange portion extending radially outward from one end of the cylindrical portion. The cylindrical portion of the movable member 14a penetrates the upper mold UM and the upper mold base plate 31. The movable member 14a can perform forward and backward movement to protrude into the second surplus resin storage cavity 12 and retreat movement to retreat from the second surplus resin storage cavity 12. In other words, the movable member 14a is configured to be able to perform forward movement, which is movement toward the lower mold LM, and retreat movement, which is movement away from the lower mold LM, with respect to an inner surface 12b (an example of a cavity inner surface) located within the second surplus resin storage cavity 12 among the surface 33 of the upper mold UM. That is, the inner surface 12b is the surface portion within the second surplus resin storage cavity 12 of the upper mold UM. The flange portion of the movable member 14a is located on the upper side (outside) of the upper mold base plate 31. The driving unit 14b is a power source that makes the movable member 14a movable, and is, for example, a servo motor or an air cylinder. The compression spring 14c is connected to the upper mold base plate 31 and the flange portion of the movable member 14a, and applies an elastic force of the spring to the movable member 14a in a direction away from the lower mold LM (a direction in which the movable member 14a moves backward) when the movable member 14a moves forward.

[0037] The protruding portion 15a is a portion protruding from the inner surface 12b of the second excess resin storage cavity 12 toward the lower mold LM. In this embodiment, the protruding portion 15a corresponds to the end of the protruding member 15 having a cylindrical shape on the lower mold LM side. The protruding member 15 has a fixing portion 15b that extends slightly radially outward at the end opposite to the protruding portion 15a. The protruding member 15 is fixed by, for example, pressing the fixing portion 15b into the upper mold UM. At this time, the end facing the lower mold LM protrudes from the inner surface 12b as the protruding portion 15a toward the lower mold LM. The movable member 14a is disposed in the space inside the protruding member 15, and the movable member 14a slides and moves on the inner peripheral surface of the protruding member 15. That is, the protruding member 15 is in contact with the side surface (outer peripheral surface) of the movable member 14a.

[0038] A groove-shaped first flow passage 31a through which air flows is formed on the surface of the upper mold base plate 31 that is in contact with the upper mold UM. The first flow passage 31a is connected to the second flow passage 31b and the third flow passage 31c formed in the upper mold UM. The second flow passage 31b is a through hole that penetrates the upper mold UM from the first flow passage 31a toward the lower mold LM. In this embodiment, the end of the second flow passage 31b opposite to the end connected to the first flow passage 31a is located at least in the recessed space 35 and the upper mold cavity MC. The third flow passage 31c is a gap between the inner circumferential surface of the protruding member 15 and the outer circumferential surface of the movable member 14a, and a gap between the outer circumferential surface of the protruding member 15 and the inner circumferential surface of the upper mold UM. That is, the end of the protruding member 15 on the side of the fixed part 15b is connected to the first flow passage 31a.

[0039] The first flow path 31a is connected to a vacuum pump 37. The vacuum pump 37 has a function of sucking and supplying air. By sucking air in the first flow path 31a, the second flow path 31b, and the third flow path 31c with the vacuum pump 37, the release film F can be adsorbed onto the surface 33 of the upper mold UM.

[0040] [Method for manufacturing resin molded products] Next, a manufacturing method of a resin molded product (molded substrate Sb) will be described with reference to Figures 1 to 7. The manufacturing method of a resin molded product (molded substrate Sb) includes a supplying step of supplying a release film F to the upper mold UM and supplying a pre-molded substrate Sa and a resin tablet T to the lower mold LM, a clamping step of clamping the mold C by the clamping mechanism 5, and a molding step of resin molding the pre-molded substrate Sa by supplying molten resin Ta from the pot 71a to the upper mold cavity MC and moving the movable member 14a backward toward the inner surface 12b of the upper mold cavity MC due to the pressure of the excess resin Tb stored in the excess resin storage space 13.

[0041] The molding process is a process in which the resin molding device 30 resin molds the pre-molded substrate Sa during the period from when the pre-molded substrate Sa is carried into the molding module 3 until when the molded substrate Sb is carried out from the molding module 3. In the molding process in this embodiment, the molten resin Ta is supplied to the upper mold cavity MC, whereby the molten resin Ta is supplied to the upper surface of the pre-molded substrate Sa, molding is performed, and the molded substrate Sb is manufactured. Note that in Figs. 3 to 6, only one side (the left side in Fig. 2) of the molding mold C relative to the molten resin supply mechanism 7 is shown. The configuration of the portion not shown (the right side in Fig. 2) is the same as the configuration of the portion shown.

[0042] As shown in FIG. 1, the loader 41 is heated in advance with the space for storing the resin tablet T insulated, and the mold C is also heated. Then, the pre-molded substrate Sa taken out from the substrate supply mechanism 43 is placed on the loader 41. Also, the resin tablets T aligned by the resin supply mechanism 45 are stored in the storage space for the resin tablet T of the loader 41. Then, the loader 41 transports the pre-molded substrate Sa and the resin tablet T to the molding module 3. The loader 41 places the pre-molded substrate Sa and the resin tablet T on the lower mold LM while being disposed between the upper mold UM and the lower mold LM of the mold C. Then, the loader 41 moves from between the upper mold UM and the lower mold LM to the outside of the mold C and returns to the supply module 4. The resin tablet T is heated by a heater (not shown) built in the lower mold LM by being stored in the pot 71a, and becomes a molten resin Ta. Note that FIG. 2 shows the state after the pre-molded substrate Sa and the resin tablet T are placed on the lower mold LM.

[0043] As shown in Fig. 2, a release film supply mechanism (not shown) supplies a release film F before use between the upper mold UM and the lower mold LM. Then, the vacuum pump 37 is operated to suck air from the first flow path 31a, the second flow path 31b, the third flow path 31c, and the fourth flow path (not shown), thereby adsorbing and fixing the release film F to the surface 33 of the upper mold UM. At this time, that is, in the initial state, the tip 14d of the cylindrical part of the movable member 14a protrudes downward (toward the lower mold LM) beyond the tip (lowest end) of the protrusion 15a. The initial state means a state in which the pressure of the excess resin Tb is not acting on the tip 14d of the movable member 14a.

[0044] Next, the upper mold UM and the lower mold LM are moved relatively close to each other by the mold clamping mechanism 5, the driving force of which is controlled by the control unit 6, to clamp the upper mold UM and the lower mold LM. At this time, the lower mold LM and the pot block 71 are raised by the mold clamping mechanism 5, and when the upper surface of the pot block 71 comes into contact with the upper mold UM, the pot block 71 stops rising. Then, the lower mold LM is further raised by the mold clamping mechanism 5, so that the pot block 71 approaches the lower mold LM, and the lower surface of the first protruding portion 71e comes into contact with the end of the pre-molded substrate Sa on the side closer to the pot block 71. At this time, the lower surface of the second protruding portion 11c of the excess resin storage block 11 comes into contact with the end of the pre-molded substrate Sa on the side farther from the pot block 71 (mold clamping process). As a result, the lower surface of the first protruding portion 71e and the lower surface of the second protruding portion 11c sandwich the pre-molded substrate Sa between the surface of the lower mold LM and the lower surface of the lower mold LM, and the pre-molded substrate Sa is fixed to the lower mold LM.

[0045] Next, the plunger 72a of the transfer mechanism 72, whose driving force is controlled by the control unit 6, rises, and the molten resin Ta obtained by melting the resin tablet T accommodated in the lower mold LM passes through the resin supply gate (the gap between the first upper gate 35a and the first lower gate 71d) and is supplied to the upper mold cavity MC. As described above, the resin supply gate is located on the side of the pre-molded substrate Sa that is closer to the pot block 71 (the side closer to the semiconductor chip 48).

[0046] The plunger 72a rises even after the upper die cavity MC is filled with the molten resin Ta. As a result, the molten resin Ta passes through the resin discharge gate (the gap between the second upper gate 12a and the second lower gate 11b) and is stored (discharged) in the surplus resin storage space 13 formed by the first surplus resin storage cavity 11a and the second surplus resin storage cavity 12, and becomes surplus resin Tb. At this time, air that was present under the semiconductor chip 48 fixed to the pre-molding substrate Sa is discharged into the surplus resin storage space 13 together with the molten resin Ta.

[0047] After the excess resin storage space 13 is filled with the excess resin Tb, the driving force of the driving part 14b of the movable mechanism 14 is appropriately controlled to raise (move backward) the movable member 14a so that the tip 14d of the movable member 14a is flush with the tip of the protruding part 15a. This increases the volume of the excess resin storage space 13, and the excess resin Tb further moves from the upper mold cavity MC to the excess resin storage space 13. At this time, air still remaining under the semiconductor chip 48 and the air contained in the molten resin Ta in the upper mold cavity MC also move from the upper mold cavity MC to the excess resin storage space 13. As a result, there are no voids or unfilled portions in the molded substrate Sb after the molten resin Ta is hardened.

[0048] When the movable member 14a rises in this manner, a part of the release film F also rises together with the movable member 14a. Specifically, the part of the release film F that is attached to the protruding portion 15a does not move, and the part that is in close contact with the tip portion 14d of the movable member 14a comes into close contact with the inner circumferential surface of the protruding member 15. Therefore, even if the movable member 14a moves backward due to the pressure of the excess resin Tb, the tension of the release film F is maintained and it does not slacken, and wrinkles are unlikely to occur.

[0049] In this manner, with the release film F in close contact with the tip 14d of the movable member 14a and the inner peripheral surface of the protruding member 15, the resin containing the molten resin Ta and the excess resin Tb is cured to form the pre-molded substrate Sa (molding process). In this way, the molded substrate Sb is obtained. As described above, since no wrinkles are generated in the release film F, no jamming of the release film F occurs even after the excess resin Tb is cured.

[0050] After the resin has hardened, the upper mold UM and the lower mold LM are moved relatively apart by the mold clamping mechanism 5 to open the upper mold UM and the lower mold LM. At this time, the control unit 6 appropriately controls the driving force of the driving unit 14b of the movable mechanism 14 while taking into consideration the elastic force of the compression spring 14c, and moves the movable member 14a forward toward the lower mold LM in synchronization with the descent of the lower mold LM. Specifically, the lowering speed of the lower mold LM and the forward moving speed of the movable member 14a are made the same. As a result, the mold is opened in a state where the release film F is sandwiched between the movable member 14a and the hardened excess resin Tb. Hereinafter, the hardened excess resin Tb is also referred to as hardened excess resin Tc (an example of a resin material and an unnecessary resin portion).

[0051] While the lower mold LM and the movable member 14a are lowered, air is sprayed from the vacuum pump 37 at least into the third flow path 31c connected to the surplus resin storage space 13 and the second flow path 31b connected to the upper mold cavity MC. The outer periphery of the release film F is sucked and fixed to the upper mold UM by a fourth flow path (not shown) formed on the outer periphery of the upper mold UM, so that the release film is in a state as if it were an inflated balloon. This can reduce the adhesion between the release film F and the cured surplus resin Tc (step #01 in FIG. 7). Then, after spraying air from the vacuum pump 37 to the third flow path 31c for a predetermined time, the vacuum pump 37 sucks the air in the third flow path 31c again to adsorb the release film F to the surface 33 of the upper mold UM (step #02 in FIG. 7). At this time, the lower mold LM and the movable member 14a continue to descend. This can further reduce the adhesion between the release film F and the cured surplus resin Tc. The air may be injected not only into the excess resin storage space 13 and the upper die cavity MC, but also into the recessed space 35.

[0052] After that, the lower mold LM and the movable member 14a are further lowered with the release film F sandwiched therebetween, and as shown in FIG. 5, the tip 14d of the movable member 14a becomes flush with the tip of the protruding portion 15a. After that, the lower mold LM is further lowered, and when the movable member 14a reaches a predetermined position or a limit position of the forward movement, the forward movement (downward movement) of the movable member 14a ends (#03 in FIG. 7). After that, the movable member 14a does not descend, and only the lower mold LM descends (#04 in FIG. 7). At this time, the adhesion between the release film F and the cured excess resin Tc has sufficiently decreased, so the cured excess resin Tc leaves the release film F and descends together with the lower mold LM in a state of being in close contact with the first excess resin storage cavity 11a.

[0053] After the mold opening is completed, an operation (gate breaking operation) is performed to separate the unnecessary resin portion and the hardened excess resin Tc remaining in the cull portion 71b, runner 71c, and first lower gate 71d of the pot block 71 from the molded substrate Sb, and the molded substrate Sb is separated from the unnecessary resin. The gate breaking operation in the edge gate type transfer molding apparatus is publicly known (for example, JP 2020-62857 A), so a detailed description will be omitted.

[0054] Thereafter, as shown in Fig. 6, an unloader 42 is inserted between the upper mold UM and the lower mold LM, and the unnecessary resin, the hardened excess resin Tc, and the molded substrate Sb are removed from the molding mold C (lower mold LM) by the unloader 42. The unnecessary resin and the hardened excess resin Tc that have been removed are disposed of in a required resin storage section (not shown). The molded substrate Sb that has been removed is stored in the substrate storage section 46 of the storage module 2 (see Fig. 1). The package substrate (molded substrate Sb) manufactured by this resin molding device 30 is then cut into individual pieces by a cutting device, with unnecessary portions of the package substrate being removed, and the cut pieces that have been cut into individual pieces are used as electronic components after undergoing quality inspection.

[0055] In this manner, the resin molding apparatus 30 of this embodiment is provided with an excess resin storage mechanism 10, and the upper mold UM is provided with a movable member 14a and a protruding portion 15a. Therefore, even if the release film F is adsorbed to the upper mold UM and the movable member 14a is moved backward by the pressure of the excess resin Tb, the release film F adheres to the inner peripheral surface of the protruding member 15, so that the tension of the release film F is maintained and it does not slacken, and wrinkles are unlikely to occur. Therefore, even after the excess resin Tb is cured, the release film F is not bitten by the excess resin Tb (cured excess resin Tc). As a result, when the mold is opened after the resin molding, the cured excess resin Tc is separated from the release film F and remains on the side of the lower mold LM together with the molded substrate Sb, so that the cured excess resin Tc can be appropriately removed to perform the resin molding.

[0056] [Another embodiment] Hereinafter, an embodiment different from the above embodiment will be described. Note that the same terms and symbols will be used for the same members as those in the above embodiment to facilitate understanding.

[0057] <1> In the above embodiment, the protrusion 15a is formed around the entire circumference of the movable member 14a, but it may be formed around only a part of the circumference of the movable member 14a.

[0058] <2> In the above embodiment, the protruding portion 15a is formed by press-fitting the protruding member 15, but the protruding portion 15a may be directly formed on the upper mold UM. Also, the protruding member 15 may be fixed to the upper mold UM by a method such as welding.

[0059] <3> In the above embodiment, the supply of the molten resin Ta from the pot 71a to the pre-molded substrate Sa is performed by an edge gate method in which the molten resin Ta is supplied to the upper mold cavity MC of the upper mold UM through the inner side of the outer edge of the pre-molded substrate Sa, but this is not limited to the above. For example, the molten resin Ta supplied from the pot 71a may be supplied to the upper mold cavity MC of the upper mold UM through the outer edge of the pre-molded substrate Sa (sometimes called a side gate method). In this case, the discharge of the excess resin Tb from the upper mold cavity MC to the excess resin storage space 13 may be performed by either the edge gate method or the side gate method.

[0060] <4> In the above embodiment, the pot block 71 and the surplus resin storage block 11 are formed in the lower mold LM, but this is not limited to the above. The pot block 71 and the surplus resin storage block 11 may be formed in an intermediate mold separate from the upper mold UM and the lower mold LM, and may be arranged between the upper mold UM and the lower mold LM. In this case, the molding mold C is composed of three molds: the upper mold UM, the intermediate mold, and the lower mold LM.

[0061] <5> In the above embodiment, in the initial state where the pressure of the excess resin Tb is not acting on the movable member 14a, the tip 14d of the columnar part of the movable member 14a protrudes downward (toward the lower mold LM) from the tip (lowest end) of the protruding part 15a, but this is not limited to this. In the initial state, as shown in FIG. 3, the tip 14d of the movable member 14a may be configured to be flush with the tip of the protruding part 15a or to be in a position retreated from the tip of the protruding part 15a. In this case, the protruding amount of the protruding part 15a from the inner surface 12b is equal to or greater than the protruding amount of the movable member 14a from the inner surface 12b when the release film F is held by the upper mold UM. With this configuration, when the movable member 14a moves backward, the release film F stretches and comes into close contact with the inner circumferential surface of the protruding member 15. In addition, the protruding amount of the tip 14d of the columnar part of the movable member 14a in the initial state into the excess resin storage space 13 may be determined depending on the type of the molding object.

[0062] <6> In the above embodiment, the surplus resin storage space 13 is formed by the first surplus resin storage cavity 11a and the second surplus resin storage cavity 12, but this is not limited to this. The surplus resin storage space 13 may be formed by only the first surplus resin storage cavity 11a or only the second surplus resin storage cavity 12.

[0063] <7> The pre-molded substrate Sa resin-molded by the resin molding apparatus 30 in the above embodiment is, for example, a semiconductor substrate (silicon wafer, etc.), a metal substrate (lead frame, etc.), a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate.

[0064] <8> In the above-described embodiment, all of the controls in #01 to #03 in FIG. 7 may be omitted, or the control of the injection of air in #01 in FIG. 7 and the control of the re-adhesion of the release film in #02 may be omitted, or only the control of the descent of the movable member in #01 to #03 in FIG. 7 may be omitted.

[0065] [Summary of the above embodiment] The molding die (C), the resin molding device (30), and the method for producing the resin molded product (Sb) described in the above embodiment will be outlined below.

[0066] (1) The characteristic configuration of the mold (C) according to this embodiment includes a first mold (LM) in which a molding object (Sa) is placed, and a second mold (UM) that is placed opposite the first mold (LM) and holds a release film (F) on an opposing surface (33) that faces the first mold (LM). At least one of the first mold (LM) and the second mold (UM) includes a cavity (MC) that accommodates the molding object (Sa) and receives molten resin material (Ta) from a pot (71a), and an excess resin material (Tb) that is supplied to the cavity (MC) and then flows out of the cavity (MC) and is stored therein. A resin storage cavity (11a, 12) is formed, and the second mold (UM) has a movable member (14a) that can move forward from a cavity inner surface (12b) of the surplus resin storage cavity (12) toward the inside of the surplus resin storage cavity (11a, 12) and move backward from within the surplus resin storage cavity (11a, 12), and a protrusion (15a) that is formed on at least a part of the cavity inner surface (12b) around the movable member (14a) and protrudes from the cavity inner surface (12b) toward the inside of the surplus resin storage cavity (11a, 12).

[0067] The molding die (C) according to this characteristic configuration has a protruding portion (15a) on at least a part of the periphery of the movable member (14a) on the second die (UM). Therefore, even if the release film (F) is adsorbed to the second die (UM) and the movable member (14a) moves backward due to the pressure of the resin material (Tb), the release film (F) adheres to the protruding portion (15a), so the tension of the release film (F) is maintained and it does not slacken, and wrinkles are unlikely to occur. Therefore, even after the excess resin material (Tb) is hardened, the release film (F) is not bitten by the hardened excess resin material (Tc). As a result, when the die is opened after resin molding, the hardened excess resin material (Tc) is separated from the release film (F) and remains on the side of the first die (LM) together with the pre-molding substrate (Sa) after resin molding, so that the hardened excess resin material (Tc) can be appropriately removed to perform resin molding.

[0068] (2) In the molding die (C) described in (1) above, it is preferable that the protrusion (15a) is formed around the entire periphery of the movable member (14a).

[0069] According to this configuration, the protrusion (15a) is formed around the entire periphery of the movable member (14a), so that the tension of the release film (F) is uniform around the entire periphery of the movable member (14a), and partial slack or wrinkles are less likely to occur.

[0070] (3) In the molding die (C) described in (1) or (2) above, it is preferable that the amount of protrusion of the protrusion (15a) from the cavity inner surface (12b) is equal to or greater than the amount of protrusion of the movable member (14a) from the cavity inner surface (12b) when the release film (F) is held by the second die (UM).

[0071] According to this, the slack of the release film (F) is reduced, so that wrinkles are less likely to occur.

[0072] (4) In the molding die (C) described in any one of (1) to (3) above, when the resin material (Ta) is supplied from the pot (71a) to the cavity (MC), it is preferable that the resin material (Ta) passes inside the outer edge of the molding object (Sa).

[0073] This makes it possible to supply the resin material (Ta) only to the necessary locations of the molding object (Sa).

[0074] (5) The characteristic configuration of the resin molding apparatus (30) of this embodiment is that it includes a molding die (C) described in any one of (1) to (4) above, a mold clamping mechanism (5) for clamping and opening the molding die (C), an ejection mechanism (42) for ejecting, from the molding die (C), the resin molded product (Sb), which is the molded object after resin molding and the unnecessary resin portion (Tc) of the resin material, which are separated from each other by opening the molding die (C) after resin molding, and a control unit (6) for controlling the operation of the apparatus.

[0075] In the resin molding device (30) according to this characteristic configuration, the mold (C) described in any one of (1) to (4) above is clamped by the mold clamping mechanism (5) to manufacture the resin molded product (Sb), so that the release film (F) is not caught in the unnecessary resin part (Tc) of the hardened resin material even after the resin material (Tb) is hardened. As a result, when the mold clamping mechanism (5) is opened after the resin molding, the unnecessary resin part (Tc) is separated from the release film (F) and remains on the first mold (LM) side together with the pre-molding substrate (Sa) after the resin molding, so that the unnecessary resin part (Tc) can be appropriately removed and resin molding can be performed. Then, the resin molded product (Sb) and the unnecessary resin part (Tc) of the resin material can be appropriately discharged to the outside of the mold (C) by the discharge mechanism (42).

[0076] (6) In the resin molding apparatus (30) described in (5) above, when the control unit (6) moves the first die (LM) and the second die (UM) relative to each other to open the molding die (C), it is preferable that the control unit (6) moves the movable member (14a) forward and backward into the surplus resin storage cavity (11a, 12) in synchronization with the relative movement.

[0077] According to this, when the first die (LM) and the second die (UM) are moved relative to each other to open the forming die (C), the movable member (14a) is synchronously advanced and moved into the surplus resin storage cavity (11a, 12). This makes it possible to open the die while holding the release film (F) between the movable member (14a) and the unnecessary resin portion (Tc) of the resin material, and there is no risk of the release film (F) being torn.

[0078] (7) In the resin molding apparatus (30) described in (5) or (6) above, when the control unit (6) moves the first die (LM) and the second die (UM) relative to one another to open the molding die (C), it is preferable that the control unit (6) injects air from the suction holes (31b, 31c) of the second die (UM) that suck in air to adsorb and hold the release film (F) toward the cavity (MC) and the surplus resin storage cavity (11a, 12) to separate a part of the release film (F) from the opposing surface (33).

[0079] This makes it possible to reduce the adhesion between the release film (F) and the unnecessary resin portion (Tc) of the resin material when the forming die (C) is opened.

[0080] (8) In the resin molding apparatus (30) described in (7) above, it is preferable that the control unit (6) injects air from the suction holes (31b, 31c) and then sucks in air again to re-adhere the release film (F) to the opposing surface (33) of the second die (UM).

[0081] This makes it possible to further reduce the adhesion between the release film (F) and the unnecessary resin portion (Tc) of the resin material.

[0082] (9) The manufacturing method of a resin molded product (Sb) using the resin molding apparatus (30) described in any one of (5) to (8) above is characterized in that it includes a supplying process of supplying a molding object (Sa) and a resin material (T) to a molding mold (C), a mold clamping process of clamping the molding mold (C) by a mold clamping mechanism (5), and a molding process of resin molding the molding object (Sa) by supplying molten resin material (Ta) from a pot (71a) to a cavity (MC) and causing the movable member (14a) to move backward toward the cavity inner surface (12b) due to the pressure of the surplus resin material (Tb) stored in the surplus resin storage cavity (11a, 12).

[0083] In the manufacturing method of the resin molded product (Sb) having this characteristic, the resin molding apparatus (30) described in any one of (5) to (8) above is used, so that the release film (F) is not caught in the hardened resin material (Tc) even after the resin material (Tb) is hardened. As a result, when the mold clamping mechanism (5) is opened after the resin molding, the hardened resin material (Tc) is separated from the release film (F) and remains on the first mold (LM) side together with the pre-molding substrate (Sa) after the resin molding, so that the hardened resin material (Tc) can be appropriately removed to manufacture the resin molded product (Sb). [Industrial Applicability]

[0084] The present invention can be used in a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product. [Explanation of symbols]

[0085] 5: Clamping mechanism 6: Control section 11: Excess resin storage block 11a: First excess resin storage cavity (excess resin storage cavity) 12: Second excess resin storage cavity (excess resin storage cavity) 12b: Inner surface (inner surface of cavity) 14a: Movable member 15a:Protrusion 31b: Second flow path (suction hole) 31c: Third flow path (suction hole) 33:Surface (opposite surface) 42: Unloader (discharge mechanism) 71a:Pot C: Molding mold F: Release film LM: Lower mold (1st mold) MC: Upper cavity (cavity) Sa: Pre-molding substrate (molding target) Sb: Molded substrate (plastic molded product) T: Resin tablet (resin material) Ta: Molten resin (resin material) Tb: Excess resin (resin material) Tc: Hardened excess resin (resin material, unnecessary resin part) UM: Upper mold (2nd mold)

Claims

1. a first mold in which an object to be molded is placed; A second mold is disposed opposite the first mold and holds a release film on an opposing surface facing the first mold, At least one of the first type and the second type has a cavity that accommodates the molding object therein and to which a molten resin material is supplied from a pot; an excess resin storage cavity in which the excess resin material that is supplied to the cavity and then flows out of the cavity is stored; The second type is a movable member capable of advancing from an inner surface of the surplus resin storage cavity toward the surplus resin storage cavity and retracting from the surplus resin storage cavity; a molding die having a protrusion formed on at least a portion of the cavity inner surface around the movable member and protruding from the cavity inner surface toward the excess resin storage cavity;

2. The mold according to claim 1 , wherein the protrusion is formed over the entire periphery of the movable member.

3. 3. The mold according to claim 1, wherein the amount of protrusion of the protrusion from the inner surface of the cavity is equal to or greater than the amount of protrusion of the movable member from the inner surface of the cavity when the release film is held by the second mold.

4. The molding die according to claim 1 , wherein when the resin material is supplied from the pot to the cavity, the resin material passes inside an outer edge of the object to be molded.

5. The mold according to any one of claims 1 to 4, A mold clamping mechanism for clamping and opening the molding die; a discharge mechanism that discharges, to the outside of the mold, a resin molded product that is the molding target after the resin molding and unnecessary resin parts of the resin material that are separated from each other by opening the mold after the resin molding; A resin molding apparatus comprising: a control unit that controls the operation of the apparatus.

6. The resin molding apparatus according to claim 5, wherein when the control unit moves the first mold and the second mold relative to each other to open the molding die, the control unit moves the movable member forward into the excess resin storage cavity in synchronization with the relative movement.

7. The resin molding apparatus according to claim 5 or 6, wherein when the control unit moves the first mold and the second mold relative to one another to open the molding die, the control unit injects air from a suction hole of the second mold, which sucks in air to adsorb and hold the release film, toward the cavity and the excess resin storage cavity to separate a portion of the release film from the opposing surface.

8. The resin molding apparatus according to claim 7 , wherein the control unit sucks in air again after injecting air from the suction hole, thereby causing the release film to be re-adsorbed to the opposing surface of the second mold.

9. A method for producing a resin molded product using the resin molding apparatus according to any one of claims 5 to 8, a supplying step of supplying the molding object and the resin material to the molding die; a mold clamping step of clamping the molding die by the mold clamping mechanism; a molding process in which the molten resin material is supplied from the pot to the cavity to perform resin molding of the molding object, and the movable member moves backward toward the inner surface of the cavity due to the pressure of the surplus resin material stored in the surplus resin storage cavity.

Images